WO2020118487A1 - 一种微流控芯片的微结构模芯及其制造方法 - Google Patents

一种微流控芯片的微结构模芯及其制造方法 Download PDF

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Publication number
WO2020118487A1
WO2020118487A1 PCT/CN2018/120074 CN2018120074W WO2020118487A1 WO 2020118487 A1 WO2020118487 A1 WO 2020118487A1 CN 2018120074 W CN2018120074 W CN 2018120074W WO 2020118487 A1 WO2020118487 A1 WO 2020118487A1
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Prior art keywords
micro
microfluidic chip
array structure
manufacturing
mold core
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PCT/CN2018/120074
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English (en)
French (fr)
Inventor
鲁艳军
陈福民
伍晓宇
周超兰
彭启洋
章嘉涛
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Shenzhen University
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Shenzhen University
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Priority to US16/634,100 priority Critical patent/US11305277B2/en
Priority to PCT/CN2018/120074 priority patent/WO2020118487A1/zh
Priority to CN201880036088.9A priority patent/CN110719826B/zh
Publication of WO2020118487A1 publication Critical patent/WO2020118487A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
    • B23P23/04—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass for both machining and other metal-working operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/12—Specific details about manufacturing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0883—Serpentine channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles

Definitions

  • This solution belongs to the technical field of microfluidic chips, and more specifically, it relates to a microstructure mold core of a microfluidic chip and a manufacturing method thereof.
  • microfluidic chips are an important research field for the development of microanalytical testing systems.
  • Microfluidic chips have the advantages of miniaturization, integration, and low reagent consumption. The advantages of good selectivity, fast analysis speed and low cost.
  • a microfluidic channel corresponding to the demand is set on the surface of the microfluidic chip, and a corresponding reagent is added at the designated microfluidic channel opening, and the reagent enters the designated position through the microfluidic channel to react.
  • microfluidic chip has few flow channels, the structure of the common microfluidic chip is simple, and the roughness inside the flow channel is large, which will affect the reagent fluidity, and it is not suitable for more complex reagent detection, making microfluidic The chip cannot be better utilized.
  • the surface quality of the flow channel of the microfluidic chip and the utilization rate of the microfluidic chip can be increased.
  • the micro-structured flow channels provided on the surface of the microfluidic chip are usually manufactured by electrochemical etching processes such as laser beam processing and hot stamping technology.
  • electrochemical etching processes such as laser beam processing and hot stamping technology.
  • these processing processes cannot produce high shape accuracy and high surface quality
  • the chip of the micro-groove array structure cannot guarantee the shape and size accuracy of the microstructure of the chip and the utilization rate of the chip.
  • the purpose of this solution is to provide a micro-structured die core of a micro-fluidic chip and a manufacturing method thereof, to solve the problems in the prior art that due to the use of laser processing, electrochemical etching processing, etc.
  • the technical solution adopted in this solution is to provide a method for manufacturing a microfluidic chip, including the following steps:
  • the micro milling cutter rough-mills the surface of the mold core to form a micro-protrusion array structure with a specific shape according to a preset first machining trajectory;
  • the micro-grinding head performs milling and grinding on the surface of the micro-protrusion array structure rough-formed according to a preset second processing trajectory to finish the required micro-protrusion array structure, and the micro-protrusion micro-protrusion is formed
  • the size of the array structure is larger than that of the micro-protrusion array structure formed by finishing;
  • the mold core is installed on an injection molding machine, and polymer particle materials are added to perform micro-injection molding to form a microfluidic chip, and the surface of the microfluidic chip has a micro-groove array structure.
  • This solution also provides another method for manufacturing a microfluidic chip, including the following steps:
  • the micro milling cutter rough-mills the surface of the mold core to form a micro-protrusion array structure with a specific shape according to a preset first machining trajectory;
  • the micro-grinding head performs milling and grinding on the surface of the micro-protrusion array structure rough-formed according to a preset second processing trajectory to finish the required micro-protrusion array structure, and the micro-protrusion micro-protrusion is formed
  • the size of the array structure is larger than that of the micro-protrusion array structure formed by finishing;
  • the mold core is installed on a hot press, and a polymer bulk material is added to perform hot press molding to form a microfluidic chip, and the surface of the microfluidic chip has a micro-groove array structure.
  • the spindle speed of the five-axis machining center is 5,000 to 20,000 rpm
  • the feed depth of the micro-milling cutter is 0.1 to 50 microns
  • the feed speed of the micro-milling cutter is 10 to 1000 mm/ Minute.
  • micro-groove array structure includes a plurality of sequentially connected micro-channels, and the groove depth of each of the micro-channels is 10-800 microns.
  • each of the micro channels includes a first channel, a second channel, and a transition channel connected between the first channel and the second channel, the first channel and The trench spacing between the second channels is 10 to 500 microns.
  • the material of the mold core is ceramic, diamond, mold steel or cemented carbide.
  • the material of the microfluidic chip is one of polyamide, polyethylene terephthalate, polydimethylsiloxane, polymethyl methacrylate, polypropylene or polycarbonate Or a mixture of two or more.
  • first channel, the second channel, and the transition channel all include:
  • a second side opposite the first side;
  • both ends are respectively connected to the first side and the second side;
  • the first side, the bottom and the second side form a V-shape, U-shape or rectangle.
  • the solution also provides a micro-structured die core of a microfluidic chip, which includes a die core body, a surface of the die core body is provided with a micro-protrusion array structure, and the micro-protrusion array structure is formed by a micro-milling cutter.
  • the surface of the mold core body is rough-machined to form a micro-protrusion array structure with a specific shape, and the surface of the micro-protrusion array structure rough-machined is milled and finished using a fine grinding head.
  • the micro-protrusion array structure includes a plurality of micro-protrusions connected in sequence, and each of the micro-protrusions includes a first connection section, a second connection section, and a connection between the first connection section and the second connection section Transition.
  • first connecting segment is a straight segment
  • second connecting segment is a straight segment
  • transition segment is an arc segment or a straight segment
  • the heights of the first connection section, the second connection section and the transition section are all 10-800 microns, and the widths of the first connection section, the second connection section and the transition section Both are 10 to 500 microns, and the distance between the first connection segment and the second connection segment is 10 to 500 microns.
  • first connection section, the second connection section and the transition section all include:
  • a fourth side opposite to the third side;
  • both ends are respectively connected to the third side surface and the fourth side surface;
  • the third side surface, the top surface and the fourth side surface form a V-shape, a U-shape or a rectangle.
  • the manufacturing method of the microfluidic chip of this solution uses the surface of the core by using a micro-milling cutter Mill the micro-protrusion array structure with a specific shape, and then use the micro-grinding head to mill the surface of the micro-protrusion array structure formed by rough machining to finish the high-precision micro-protrusion array structure.
  • the finished mold The core is installed on the injection molding machine to add polymer particulate materials for micro-injection molding processing, and high-efficiency injection molding produces high-quality microfluidic chips with a micro-groove array structure, or the processed mold core is installed on a hot press to join the polymerization
  • the bulk material is hot-pressed to form a high-quality micro-structured microfluidic chip, which has a controllable shape, which effectively improves the utilization rate of the surface of the microfluidic chip and solves the problem of using laser beams in the prior art.
  • Processing and other electrochemical etching processes to make the microstructure of the microfluidic chip lead to the problem that the shape and dimensional accuracy of the microstructure processing and the processing quality cannot be guaranteed; and the mass production and manufacturing of the microfluidic chip can be realized, which greatly Reduced manufacturing costs.
  • FIG. 3 is a schematic diagram of processing a microstructure mold core used in a microfluidic chip provided by an embodiment of the solution;
  • FIG. 4 is a plan view of a microstructure core provided by an embodiment of the solution.
  • FIG. 5 is a cross-sectional structural view taken along line A-A in FIG. 4;
  • FIG. 6 is a partially enlarged schematic view at B in FIG. 5;
  • FIG. 7 is a schematic diagram of a three-dimensional structure of a microfluidic chip provided by an embodiment of the solution.
  • Figure 8 is a top view of Figure 7;
  • FIG. 9 is a cross-sectional structural view taken along line C-C in FIG. 8;
  • FIG. 10 is a partially enlarged schematic view at D in FIG. 9;
  • FIG. 11 is a top view of another microstructure core provided by an embodiment of the solution.
  • FIG. 12 is a cross-sectional structural view taken along line E-E in FIG. 11;
  • FIG. 13 is a plan view of another microfluidic chip provided by an embodiment of the solution.
  • FIG. 14 is a cross-sectional structural view taken along line F-F in FIG. 13.
  • 20-fine grinding head 30-die core; 31-die core body; 32-micro-protrusion array structure; 33-micro-protrusion 331-first connection section; 3331-third side; 3312-fourth side; 3313 -Top surface; 332-second connection section; 333-transition section; 40-microfluidic chip; 41-microgroove array structure; 42-microchannel; 421-first channel; 4211-first side; 4212-second side; 4213-bottom; 422-second channel; 423-transition channel.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • a method for manufacturing a microfluidic chip includes steps S100, S200, S300, and S400:
  • the micro-milling cutter rough-mills the surface of the mold core according to a preset first machining trajectory to form a micro-protrusion array structure with a specific shape.
  • the micro-milling cutter is milled according to a preset first processing trajectory to obtain a micro-protrusion array structure of a desired shape.
  • the fine grinding head performs milling and milling on the surface of the micro-protrusion array structure rough-formed according to a preset second processing trajectory to form the desired micro-protrusion array structure, and the micro-protrusion array rough-formed
  • the size of the structure is larger than that of the micro-protrusion array structure formed by finishing.
  • the fine grinding head is milled and milled by a preset second processing trajectory, and the second processing trajectory is the same as the first processing rail, and then a high-precision micro-protrusion array structure of a desired shape is processed.
  • a high-quality microfluidic chip with a micro-groove array structure can be processed by injection molding
  • the injection molding machine is a micro injection molding machine
  • the polymer is in the form of particles.
  • this solution also provides another method for manufacturing a microfluidic chip, including steps S100, S200, S300, and S500:
  • the micro-milling cutter rough-mills the surface of the mold core according to a preset first machining trajectory to form a micro-protrusion array structure with a specific shape.
  • the fine grinding head performs milling and milling on the surface of the micro-protrusion array structure rough-formed according to a preset second processing trajectory to form the desired micro-protrusion array structure, and the micro-protrusion array rough-formed
  • the size of the structure is larger than that of the micro-protrusion array structure formed by finishing.
  • a high-quality microfluidic chip with a micro-groove array structure can be processed by hot-press forming.
  • the hot-press is a plastic hot-press and the polymer is in a block shape.
  • the manufacturing method of the microfluidic chip provided by this solution is formed by using a micro-milling cutter to rough-mill the surface of the mold core 30 to form a specific shape.
  • Micro-protrusion array structure and then use the fine grinding head 20 to perform milling and finishing on the surface of the micro-protrusion array structure formed by rough machining, so as to process the high-precision micro-protrusion array structure 311 on the surface of the mold core 30, and finally Install the processed mold core 30 on the injection molding machine and add polymer particulate materials for micro-injection molding processing, and efficiently inject into a high-quality microfluidic chip 40 with a micro-groove array structure 41, or the processed mold
  • the core 30 is installed on a hot press to add a polymer block material for hot press forming, and hot press forming a microfluidic chip 40 of high quality microstructure, the shape of which is controllable, which effectively improves the use of the surface of the microfluidic chip 40 It solves the problem that the current technology can
  • the spindle speed of the five-axis machining center is 5000 ⁇ 20000 rpm
  • the feed depth of the micro-milling cutter is 0.1-50 microns
  • the feed speed of the micro-milling cutter is 10 ⁇ 1000 mm/min.
  • the feed depth of the fine grinding head 20 is 0.1 to 50 microns, and the feed speed of the fine grinding head 20 is 100 to 1000 mm/min.
  • the size of the rough-processed micro-protrusion array structure is 1.05 ⁇ 1.2 of the size of the fine-processed micro-protrusion array structure 32 Times.
  • it can be 1.05 times, 1.10 times or 1.2 times.
  • the processed micro-protrusion array structure 32 can have good accuracy, At the same time, it can also improve processing efficiency.
  • step S100 further includes step S110: selecting a desired size according to the size of the microgroove array structure 41 of the microfluidic chip 40 Of the core.
  • step S110 the shape and size of the micro-groove array structure 41 of the corresponding microfluidic chip 40 are usually designed according to the reagent inspection scheme, different reagent inspection schemes, the micro-groove array structure of the microfluidic chip 41 has different shapes and sizes.
  • the method before step S100, further includes the step of: designing the first machining processing trajectory of the micro milling cutter and the micro grinding head on the software for simulation processing With the second machining trajectory, and generate G code to import into the five-axis machining center.
  • the micro-groove array structure 41 includes a plurality of micro-channels 42 connected in sequence, each micro
  • the trench depth H1 of the channel 42 is 10-800 microns, for example, H1 is 10 microns, 200 microns, and 800 microns.
  • the trench width L1 of the micro-channel 42 is 10-500 microns, for example, L1 is 10 microns, 200 microns, and 500 microns.
  • each microchannel 42 includes a first channel 421, a second channel 422, and a The transition channel 423 between the first channel 421 and the second channel 422, and the trench interval K1 between the first channel 421 and the second channel 422 is 10 to 500 microns.
  • the first channel 421 and the second channel 422 are both straight channels and the transition channel 423 It is an arc-shaped channel, that is, the first channel 421 and the second channel 422 are connected by an arc-shaped transition, and the transition is naturally smooth.
  • the transition channel 423 has a circular arc shape.
  • the radius R1 of the transition channel 423 is 10 to 500 microns, for example, 10 microns, 100 microns, 200 microns, 500 microns, etc.
  • the transition channel 423 may also be a linear channel, that is, the first channel 421 and the second channel 422 are connected through a right-angle transition.
  • the material of the mold core 30 is ceramic, diamond, mold steel, or cemented carbide.
  • the material of the microfluidic chip 40 is polyamide, polyethylene terephthalate, polydimethylsiloxane , Polymethyl methacrylate, polypropylene or polycarbonate, one or a mixture of two or more.
  • Each of the channels 423 includes a first side 4211, a second side 4212, and a bottom 4213.
  • the second side 4212 is opposite to the first side 4211, and both ends of the bottom 4213 are connected to the first side 4211 and the second side 4212, respectively.
  • the first side surface 4211, the bottom surface 4213, and the second side surface 4212 form a rectangular shape. Of course, in other implementations, they may be V-shaped or U-shaped.
  • this solution also provides a micro-structured mold core of a microfluidic chip, which includes a mold core body 31.
  • the surface of the mold core body 31 is provided with a micro-protrusion array structure 32.
  • the array structure 32 is rough-milled on the surface of the core body 31 by a micro-milling cutter to form a micro-protrusion array structure with a specific shape, and the surface of the micro-protrusion array structure rough-machined is milled using a fine grinding head 20
  • the micro-protrusion array structure 32 includes a plurality of micro-protrusions 33 connected in sequence, each micro-protrusion 33 includes a first connection section 331, a second connection section 332, and a connection between the first connection section 331 and The transition section 333 between the second connection section 332.
  • the microstructure core of the microfluidic chip provided by this solution is formed by rough milling the surface of the core body 31 by using a micromilling cutter
  • the micro-protrusion array structure with a specific shape and then the fine grinding head 20 is used for milling and finishing on the surface of the micro-protrusion array structure formed by rough machining, thereby processing a high-precision micro-protrusion on the surface of the core body 31 Array structure 32, and finally install the processed mold core body 31 on the injection molding machine to add polymer particulate material for micro-injection molding processing, high-efficiency injection molding of high-quality microfluidic chip 40 with micro-groove array structure 41,
  • the processed core body 31 is installed on a hot press, and a polymer block material is added to perform hot press molding.
  • the hot press forms a high-quality microfluidic chip 40 with a micro-groove array structure 41, the shape of which can be Control, which effectively improves the utilization rate of the surface of the microfluidic chip 40, and solves the problem that the prior art uses laser beam processing and other electrochemical etching processes to make the microstructure of the microfluidic chip, which cannot guarantee the shape and shape of the microstructure processing. Dimensional accuracy and processing quality issues; and can achieve mass production and manufacturing of microfluidic chips, greatly reducing production and manufacturing costs.
  • the first connection section 331 is a straight section
  • the second connection section 332 is a straight section
  • the transition section 333 It is an arc segment, that is, the first connection segment 331 and the second connection segment 332 are connected by an arc transition, and the transition is naturally smooth.
  • the transition section 333 has a circular arc shape.
  • the radius R2 of the transition section 333 is 10-500 microns, for example, 10 microns, 100 microns, 200 microns, 500 microns, etc.
  • the transition section 333 may also be a straight section, that is, the first connection section 331 and The second connection section 332 is connected by a right-angle transition.
  • the first connection section 331, the second connection section 332, and the transition section 333 The height H2 is 10 ⁇ 800 microns, for example, H2 is 10 microns, 200 microns, 500 microns, 800 microns.
  • the width L2 of the first connection section 331, the second connection section 332, and the transition section 333 are all 10-500 microns, for example, L2 is 10 microns, 100 microns, 300 microns, 500 microns.
  • the distance K2 between the first connection segment 331 and the second connection segment 332 is 10-500 microns, for example, K2 is 10 microns, 100 microns, 300 microns, 500 microns.
  • the first connection section 331, the second connection section 332 and the transition section 333 all include: a third side 3311, a fourth side surface 3312, and a top surface 3313.
  • the fourth side surface 3312 is disposed opposite to the third side surface 3311. Both ends of the top surface 3313 are connected to the third side surface 3311 and the fourth side surface 3312, respectively.
  • the third side surface 3311, the top surface 3313, and the fourth side surface 3312 form a rectangle.
  • it may also be V-shaped or U-shaped, according to the micro-groove array structure 41 of the microfluidic chip 40 According to the actual required shape, the micro-protrusion array structure 32 with different shapes is designed and processed.
  • the core body 31 is a mold steel part or a cemented carbide part, and its structural strength is large.
  • the micromilling cutter is a tungsten steel milling cutter, which can effectively increase the service life of the micromilling cutter.
  • the microgrinding head 20 is a diamond microgrinding head.
  • the microgrinding head made of diamond sintering has a large structural strength. To prevent the micro-grinding head from being easily worn, and thus improve the service life of the micro-grinding head.

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Abstract

一种微流控芯片（40）的微结构模芯（30）及其制造方法，包括步骤：将模芯（30）安装在五轴加工中心的工作台上，并将微铣刀以及微细磨头（20）安装于五轴加工中心的刀架上；微铣刀按预设的第一加工轨迹在模芯（30）的表面粗加工铣削成形出具有特定形状的微凸起阵列结构（32）；微细磨头（20）按预设的第二加工轨迹在粗加工成形的微凸起阵列结构（32）的表面进行铣磨精加工出所需的微凸起阵列结构（32）；将模芯（30）安装在注塑机上，并加入聚合物颗粒材料进行微注塑成型出微流控芯片（40）；或将模芯（30）安装在热压机上，并加入聚合物块状材料进行热压成型出微流控芯片（40）；该制造方法制成的微流控芯片（40）形状可控，且能够实现批量化生产与制造，降低了生产制造成本。

Description

一种微流控芯片的微结构模芯及其制造方法 技术领域
本方案属于微流控芯片技术领域，更具体地说，是涉及一种微流控芯片的微结构模芯及其制造方法。
 背景技术
目前，为了满足分析检测设备微型化、集成化和便携化的需求，其中微流控芯片是微分析检测系统开发的重要研究领域，微流控芯片具有微型化、集成化、试剂消耗量小、选择性好、分析速度快、成本低的优点。通常在微流控芯片的表面设置相应需求的微流道，在指定的微流道口添加对应的试剂，试剂通过微流道进入指定的位置发生反应。传统的微流控芯片流道少，常见的微流控芯片的结构简单，而且流道内部的粗糙度较大，会影响试剂流动性，而且不适宜于较为复杂的试剂检测，使得微流控芯片不能得到更好的利用。
为了解决这个问题，市场上通过改进微流控芯片的加工成形的工艺，从而可增加微流控芯片的流道的表面质量和微流控芯片的利用率。传统技术上，在微流控芯片的表面设置微结构流道通常是通过激光束加工、热压印技术等电化学刻蚀加工工艺制作，然而这些加工工艺无法加工出高形状精度和高表面质量的微凹槽阵列结构的芯片，无法保证芯片的微结构的形状尺寸精度以及芯片的利用率。
 技术问题
本方案的目的在于提供一种微流控芯片的微结构模芯及其制造方法，以解决现有技术中由于采用激光加工、电化学刻蚀加工等工艺存在无法保证微流控芯片中的微结构的形状精度及表面质量，以及微流控芯片的利用率低的技术问题。
 技术解决方案
为实现上述目的，本方案采用的技术方案是：提供一种微流控芯片的制造方法，包括以下步骤：
将模芯安装在五轴加工中心的工作台上，并将微铣刀以及微细磨头安装于所述五轴加工中心的刀架上；
微铣刀按预设的第一加工轨迹在所述模芯的表面粗加工铣削成形出具有特定形状的微凸起阵列结构；
微细磨头按预设的第二加工轨迹在粗加工成形的所述微凸起阵列结构的表面进行铣磨精加工出所需的微凸起阵列结构，且粗加工成形的所述微凸起阵列结构的尺寸大于精加工成形的所述微凸起阵列结构的尺寸；
将所述模芯安装在注塑机上，并加入聚合物颗粒材料进行微注塑成型出微流控芯片，且所述微流控芯片的表面具有微凹槽阵列结构。
本方案还提供另一种微流控芯片的制造方法，包括以下步骤：
将模芯安装在五轴加工中心的工作台上，并将微铣刀以及微细磨头安装于所述五轴加工中心的刀架上；
微铣刀按预设的第一加工轨迹在所述模芯的表面粗加工铣削成形出具有特定形状的微凸起阵列结构；
微细磨头按预设的第二加工轨迹在粗加工成形的所述微凸起阵列结构的表面进行铣磨精加工出所需的微凸起阵列结构，且粗加工成形的所述微凸起阵列结构的尺寸大于精加工成形的所述微凸起阵列结构的尺寸；
将所述模芯安装在热压机上，并加入聚合物块状材料进行热压成型出微流控芯片，且所述微流控芯片的表面具有微凹槽阵列结构。
进一步地，所述五轴加工中心的主轴转速为5000～20000转/分，所述微铣刀的进给深度为0.1～50微米，所述微铣刀的进给速度为10～1000毫米/分。
进一步地，所述微凹槽阵列结构包括多个依次连接的微沟道，各所述微沟道的沟槽深度为10～800微米。
进一步地，各所述微沟道包括第一沟道、第二沟道、以及连接在所述第一沟道与所述第二沟道之间的过渡沟道，所述第一沟道与所述第二沟道之间的沟槽间隔为10～500微米。
进一步地，所述模芯的材质为陶瓷、金刚石、模具钢或者硬质合金。
进一步地，所述微流控芯片的材质为聚酰胺、聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚甲基丙烯酸甲酯、聚丙烯或者聚碳酸酯中的一种或者两种以上的混合物。
进一步地，所述第一沟道、所述第二沟道、以及所述过渡沟道均包括：
第一侧面，
第二侧面，与所述第一侧面相对设置；以及，
底面，两端分别与所述第一侧面、所述第二侧面连接；
所述第一侧面、所述底面以及所述第二侧面围构形成V形、U形或者矩形。
本方案还提供了一种微流控芯片的微结构模芯，包括模芯本体，所述模芯本体的表面设置有微凸起阵列结构，所述微凸起阵列结构由微铣刀在所述模芯本体的表面粗加工铣削成形出具有特定形状的微凸起阵列结构，并利用微细磨头将粗加工成形的所述微凸起阵列结构的表面进行铣磨精加工而成，所述微凸起阵列结构包括多个依次连接的微凸起，各所述微凸起包括第一连接段、第二连接段、以及连接在所述第一连接段与所述第二连接段之间的过渡段。
进一步地，所述第一连接段为直线段，所述第二连接段为直线段，所述过渡段为弧形段或者直线段。
进一步地，所述第一连接段、所述第二连接段以及所述过渡段的高度均为10～800微米，所述第一连接段、所述第二连接段以及所述过渡段的宽度均为10～500微米，所述第一连接段与所述第二连接段之间的间距为10～500微米。
进一步地，所述第一连接段、所述第二连接段以及所述过渡段均包括：
第三侧面，
第四侧面，与所述第三侧面相对设置；以及，
顶面，两端分别与所述第三侧面、所述第四侧面连接；
所述第三侧面、所述顶面以及所述第四侧面围构形成V形、U形或者矩形。
 有益效果
本方案提供的微流控芯片的微结构模芯及其制造方法的有益效果在于：与现有技术相比，本方案微流控芯片的制造方法，通过利用利用微铣刀在模芯的表面铣削出具有特定形状的微凸起阵列结构，再利用微细磨头在粗加工成形的微凸起阵列结构的表面进行铣磨精加工出高精度的微凸起阵列结构，最后将加工完成的模芯安装在注塑机上加入聚合物颗粒材料进行微注塑成型加工，高效注塑成型出高质量的具有微凹槽阵列结构的微流控芯片，或者将加工完成的模芯安装在热压机上加入聚合物块状材料进行热压成型加工，热压成型出高质量微结构的微流控芯片，其形状可控，有效提高了微流控芯片表面的利用率，解决了现有技术由于采用激光束加工等电化学刻蚀加工工艺来制作微流控芯片的微结构导致无法保证微结构加工的形状和尺寸精度以及加工质量的问题；且能够实现微流控芯片的批量化生产与制造，极大地降低了生产制造成本。
 附图说明
为了更清楚地说明本方案实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本方案的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本方案实施例提供的一种微流控芯片的制造方法的流程图；
图2为本方案实施例提供的另一种微流控芯片的制造方法的流程图；
图3为本方案实施例提供的微流控芯片所采用的微结构模芯的加工示意图；
图4为本方案实施例提供的一个微结构模芯的俯视图；
图5为沿图4中A-A线的剖视结构图；
图6为图5中B处的局部放大示意图；
图7为本方案实施例提供的一个微流控芯片的立体结构示意图；
图8为图7的俯视图；
图9为沿图8中C-C线的剖视结构图；
图10为图9中D处的局部放大示意图；
图11为本方案实施例提供的另一个微结构模芯的俯视图；
图12为沿图11中E-E线的剖视结构图；
图13为本方案实施例提供的另一个微流控芯片的俯视图；
图14为沿图13中F-F线的剖视结构图。
其中，图中各附图标记：
20-微细磨头；30-模芯；31-模芯本体；32-微凸起阵列结构；33-微凸起331-第一连接段；3311-第三侧面；3312-第四侧面；3313-顶面；332-第二连接段；333-过渡段；40-微流控芯片；41-微凹槽阵列结构；42-微沟道；421-第一沟道；4211-第一侧面；4212-第二侧面；4213-底面；422-第二沟道；423-过渡沟道。
 本发明的实施方式
为了使本方案所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本方案进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本方案，并不用于限定本方案。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本方案和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本方案的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本方案的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
请参阅图1，现对本方案提供的微流控芯片的制造方法进行说明。一种微流控芯片的制造方法，包括步骤S100、S200、S300、S400：
S100、将模芯安装在五轴加工中心的工作台上，并将微铣刀以及微细磨头安装于五轴加工中心的刀架上。
S200、微铣刀按预设的第一加工轨迹在模芯的表面粗加工铣削成形出具有特定形状的微凸起阵列结构。
其中，微铣刀通过按预设的第一加工轨迹铣削，加工得到所需形状的微凸起阵列结构。
S300、微细磨头按预设的第二加工轨迹在粗加工成形的微凸起阵列结构的表面进行铣磨精加工成形出所需的微凸起阵列结构，且粗加工成形的微凸起阵列结构的尺寸大于精加工成形的微凸起阵列结构的尺寸。
其中，微细磨头通过预设的第二加工轨迹铣磨加工，第二加工轨迹与第一加工轨相同，进而加工得到所需形状的高精度的微凸起阵列结构。
S400、将模芯安装在注塑机上，并加入聚合物颗粒材料进行微注塑成型出微流控芯片，且微流控芯片的表面具有微凹槽阵列结构。
其中，步骤S400中，通过注塑成型，可加工出高质量的具有微凹槽阵列结构的微流控芯片，注塑机为微型注塑机，聚合物为颗粒状。
请参阅图2，本方案还提供了另一种微流控芯片的制造方法，包括步骤S100、S200、S300、S500：
S100、将模芯安装在五轴加工中心的工作台上，并将微铣刀以及微细磨头安装于五轴加工中心的刀架上。
S200、微铣刀按预设的第一加工轨迹在模芯的表面粗加工铣削成形出具有特定形状的微凸起阵列结构。
S300、微细磨头按预设的第二加工轨迹在粗加工成形的微凸起阵列结构的表面进行铣磨精加工成形出所需的微凸起阵列结构，且粗加工成形的微凸起阵列结构的尺寸大于精加工成形的微凸起阵列结构的尺寸。
S500、将模芯安装在热压机上，并加入聚合物块状材料进行热压成型出微流控芯片，且微流控芯片的表面具有微凹槽阵列结构。
其中，步骤S500中，通过热压成型，可加工出高质量的具有微凹槽阵列结构的微流控芯片，优选的，热压机为塑料热压机，聚合物为块状。
本方案提供的微流控芯片的制造方法，与现有技术相比，本方案微流控芯片的制造方法，通过利用利用微铣刀在模芯30的表面粗加工铣削成形出具有特定形状的微凸起阵列结构，再利用微细磨头20在粗加工成形的微凸起阵列结构的表面进行铣磨精加工，以在模芯30的表面加工出高精度的微凸起阵列结构311，最后将加工完成的模芯30安装在注塑机上加入聚合物颗粒材料进行微注塑成型加工，高效注塑成型出高质量的具有微凹槽阵列结构41的微流控芯片40，或者将加工完成的模芯30安装在热压机上加入聚合物块状材料进行热压成型加工，热压成型出高质量微结构的微流控芯片40，其形状可控，有效提高了微流控芯片40表面的利用率，解决了现有技术由于采用激光束加工等电化学刻蚀加工工艺来制作微流控芯片的微结构导致无法保证微结构加工的形状和尺寸精度以及加工质量的问题；且能够实现微流控芯片的批量化生产与制造，极大地降低了生产制造成本。
进一步地，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，五轴加工中心的主轴转速为5000~20000转/分，微铣刀的进给深度为0.1~50微米，微铣刀的进给速度为10~1000毫米/分。微细磨头20的进给深度为0.1~50微米，微细磨头20的进给速度为100~1000毫米/分。
进一步地，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，粗加工成形的微凸起阵列结构的尺寸为精加工成形的微凸起阵列结构32的尺寸的1.05~1.2倍。例如可以为1.05倍、1.10倍或者1.2倍。通过将粗加工成形的微凸起阵列结构的尺寸设置为精加工成形的微凸起阵列结构32的尺寸的1.05~1.2倍，使得加工后的微凸起阵列结构32既可以具有良好的精度，同时也可以提高加工效率。
进一步地，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，步骤S100之前还包括步骤S110：根据微流控芯片40的微凹槽阵列结构41的尺寸，选择所需尺寸的模芯。
其中，步骤S110中，通常根据试剂检验的方案，设计相应的微流控芯片40的微凹槽阵列结构41的形状和尺寸，不同的试剂检验的方案，微流控芯片的微凹槽阵列结构41的形状和尺寸大小不同。
进一步地，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，步骤S100之前还包括步骤：在模拟加工的软件上，设计微铣刀和微细磨头的第一加工加工轨迹与第二加工轨迹，并生成G代码导入到五轴加工中心。
进一步地，如图7至图9所示，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，微凹槽阵列结构41包括多个依次连接的微沟道42，各微沟道42的沟槽深度H1为10~800微米，例如H1为10微米、200微米、800微米。微沟道42的沟槽宽度L1为10~500微米，例如L1为10微米、200微米、500微米。
进一步地，如图8所示，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，各微沟道42包括第一沟道421、第二沟道422、以及连接在第一沟道421与第二沟道422之间的过渡沟道423，第一沟道421与第二沟道422之间的沟槽间隔K1为10～500微米。
进一步地，请参阅图4，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，第一沟道421、第二沟道422均为直沟道，过渡沟道423为弧形沟道，即第一沟道421与第二沟道422通过弧形过渡连接，过渡自然顺畅。具体的，该过渡沟道423为圆弧形。过渡沟道423的半径R1为10～500微米，例如可以为10微米、100微米、200微米、500微米等。
进一步地，请一并参阅图13至图14，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，过渡沟道423还可以为直线沟道，即第一沟道421与第二沟道422通过直角过渡连接。
进一步地，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，步骤S100中，模芯30的材质为陶瓷、金刚石、模具钢或者硬质合金。
进一步地，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，微流控芯片40的材质为聚酰胺、聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚甲基丙烯酸甲酯、聚丙烯或者聚碳酸酯中的一种或者两种以上的混合物。
进一步地，如图9至图10所示，作为本方案提供的微流控芯片的制造方法的一种具体实施方式，在本实施中，第一沟道421、第二沟道422、以及过渡沟道423均包括：第一侧面4211、第二侧面4212以及底面4213，第二侧面4212与第一侧面4211相对设置，底面4213两端分别与第一侧面4211、第二侧面4212连接。第一侧面4211、底面4213以及第二侧面4212围构形成矩形，当然，在其他实施中，还可以为V形、或者U形。
请参照图3至图5所示，本方案还提供了一种微流控芯片的微结构模芯，包括模芯本体31，模芯本体31的表面设置有微凸起阵列结构32，微凸起阵列结构32由微铣刀在模芯本体31的表面粗加工铣削成形出具有特定形状的微凸起阵列结构，并利用微细磨头20将粗加工成形的微凸起阵列结构的表面进行铣磨精加工而成，微凸起阵列结构32包括多个依次连接的微凸起33，各微凸起33包括第一连接段331、第二连接段332、以及连接在第一连接段331与第二连接段332之间的过渡段333。
本方案提供的微流控芯片的微结构模芯，与现有技术相比，本方案微流控芯片的微结构模芯，通过利用微铣刀在模芯本体31的表面粗加工铣削成形出具有特定形状的微凸起阵列结构，再利用微细磨头20在粗加工成形的微凸起阵列结构的表面进行铣磨精加工，从而在模芯本体31的表面加工出高精度的微凸起阵列结构32，最后将加工完成的模芯本体31安装在注塑机上加入聚合物颗粒材料进行微注塑成型加工，高效注塑成型出高质量的具有微凹槽阵列结构41的微流控芯片40，或者将加工完成的模芯本体31安装在热压机上加入聚合物块状材料进行热压成型加工，热压成型出高质量的具有微凹槽阵列结构41的微流控芯片40，其形状可控，有效提高了微流控芯片40表面的利用率，解决了现有技术由于采用激光束加工等电化学刻蚀加工工艺来制作微流控芯片的微结构导致无法保证微结构加工的形状和尺寸精度以及加工质量的问题；且能够实现微流控芯片的批量化生产与制造，极大地降低了生产制造成本。
进一步地，请参阅图4，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，第一连接段331为直线段，第二连接段332为直线段，过渡段333为弧形段，即第一连接段331与第二连接段332通过弧形过渡连接，过渡自然顺畅。具体的，该过渡段333为圆弧形。过渡段333的半径R2为10～500微米，例如可以为10微米、100微米、200微米、500微米等。
进一步地，请一并参阅图11至图12，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，过渡段333还可以为直线段，即第一连接段331与第二连接段332通过直角过渡连接。
进一步地，请一并参阅图4至图5，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，第一连接段331、第二连接段332以及过渡段333的高度H2均为10~800微米，例如H2为10微米、200微米、500微米、800微米。第一连接段331、第二连接段332以及过渡段333的宽度L2均为10～500微米，例如L2为10微米、100微米、300微米、500微米。第一连接段331与第二连接段332之间的间距K2为10～500微米，例如，K2为10微米、100微米、300微米、500微米。
进一步地，请参阅图6，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，第一连接段331、第二连接段332以及过渡段333均包括：第三侧面3311、第四侧面3312以及顶面3313，第四侧面3312与第三侧面3311相对设置。顶面3313两端分别与第三侧面3311、第四侧面3312连接。第三侧面3311、顶面3313以及第四侧面3312围构形成矩形，当然，在其他实施中，还可以为V形、或者U形，可根据微流控芯片40的微凹槽阵列结构41的实际所需的形状，设计加工出不同形状的微凸起阵列结构32。
进一步地，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，模芯本体31为模具钢件或者硬质合金件，其结构强度较大。
进一步地，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，微铣刀为钨钢铣刀，可以有效提高微铣刀的使用寿命。
进一步地，作为本方案提供的微流控芯片的微结构模芯的一种具体实施方式，微细磨头20为金刚石微细磨头，通过采用金刚石烧结制成的微细磨头，其结构强度大，避免微细磨头被轻易磨损，进而提高微细磨头的使用寿命。
以上所述仅为本方案的较佳实施例而已，并不用以限制本方案，凡在本方案的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本方案的保护范围之内。

Claims (12)

  1. 一种微流控芯片的制造方法，其特征在于：包括以下步骤：
    将模芯安装在五轴加工中心的工作台上，并将微铣刀以及微细磨头安装于所述五轴加工中心的刀架上；
    微铣刀按预设的第一加工轨迹在所述模芯的表面粗加工铣削成形出具有特定形状的微凸起阵列结构；
    微细磨头按预设的第二加工轨迹在粗加工成形的所述微凸起阵列结构的表面进行铣磨精加工成形出所需的微凸起阵列结构，且粗加工成形的所述微凸起阵列结构的尺寸大于精加工成形的所述微凸起阵列结构的尺寸；
    将所述模芯安装在注塑机上，并加入聚合物颗粒材料进行微注塑成型出微流控芯片，且所述微流控芯片的表面具有微凹槽阵列结构。
  2. 一种微流控芯片的制造方法，其特征在于：包括以下步骤：
    将模芯安装在五轴加工中心的工作台上，并将微铣刀以及微细磨头安装于所述五轴加工中心的刀架上；
    微铣刀按预设的第一加工轨迹在所述模芯的表面粗加工铣削成形出具有特定形状的微凸起阵列结构；
    微细磨头按预设的第二加工轨迹在粗加工成形的所述微凸起阵列结构的表面进行铣磨精加工成形出所需的微凸起阵列结构，且粗加工成形的所述微凸起阵列结构的尺寸大于精加工成形的所述微凸起阵列结构的尺寸；
    将所述模芯安装在热压机上，并加入聚合物块状材料进行热压成型出微流控芯片，且所述微流控芯片的表面具有微凹槽阵列结构。
  3. 如权利要求1或者2任一项所述的微流控芯片的制造方法，其特征在于：所述五轴加工中心的主轴转速为5000~20000转/分，所述微铣刀的进给深度为0.1~50微米，所述微铣刀的进给速度为10~1000毫米/分。
  4. 如权利要求1或2任一项所述的微流控芯片的制造方法，其特征在于：所述微凹槽阵列结构包括多个依次连接的微沟道，各所述微沟道的沟槽深度为10~800微米。
  5. 如权利要求4所述的微流控芯片的制造方法，其特征在于：各所述微沟道包括第一沟道、第二沟道、以及连接在所述第一沟道与所述第二沟道之间的过渡沟道，所述第一沟道与所述第二沟道之间的沟槽间隔为10～500微米。
  6. 如权利要求1或2任一项所述的微流控芯片的制造方法，其特征在于：所述模芯的材质为陶瓷、金刚石、模具钢或者硬质合金。
  7. 如权利要求1或2任一项所述的微流控芯片的制造方法，其特征在于：所述微流控芯片的材质为聚酰胺、聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚甲基丙烯酸甲酯、聚丙烯或者聚碳酸酯中的一种或者两种以上的混合物。
  8. 如权利要求1或2任一项所述的微流控芯片的制造方法，其特征在于：所述第一沟道、所述第二沟道、以及所述过渡沟道均包括：
    第一侧面，
    第二侧面，与所述第一侧面相对设置；以及，
    底面，两端分别与所述第一侧面、所述第二侧面连接；
    所述第一侧面、所述底面以及所述第二侧面围构形成V形、U形或者矩形。
  9. 微流控芯片的微结构模芯，包括模芯本体，其特征在于：所述模芯本体的表面设置有微凸起阵列结构，所述微凸起阵列结构由微铣刀在所述模芯本体的表面粗加工铣削成形出具有特定形状的微凸起阵列结构，并利用微细磨头将粗加工成形的所述微凸起阵列结构的表面进行铣磨精加工而成，所述微凸起阵列结构包括多个依次连接的微凸起，各所述微凸起包括第一连接段、第二连接段、以及连接在所述第一连接段与所述第二连接段之间的过渡段。
  10. 如权利要求9所述的微流控芯片的微结构模芯，其特征在于：所述第一连接段为直线段，所述第二连接段为直线段，所述过渡段为弧形段或者直线段。
  11. 如权利要求9所述的微流控芯片的微结构模芯，其特征在于：所述第一连接段、所述第二连接段以及所述过渡段的高度均为10~800微米，所述第一连接段、所述第二连接段以及所述过渡段的宽度均为10～500微米，所述第一连接段与所述第二连接段之间的间距为10～500微米。
  12. 如权利要求9所述的微流控芯片的微结构模芯，其特征在于：所述第一连接段、所述第二连接段以及所述过渡段均包括：
    第三侧面，
    第四侧面，与所述第三侧面相对设置；以及，
    顶面，两端分别与所述第三侧面、所述第四侧面连接；
    所述第三侧面、所述顶面以及所述第四侧面围构形成V形、U形或者矩形。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117046534A (zh) * 2023-09-13 2023-11-14 哈尔滨工业大学 一种微流控芯片的制作装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112092277B (zh) * 2020-08-05 2022-02-25 江苏佳境生态工程技术有限公司 透水塑胶道路面层颗粒制造工艺
US20220306459A1 (en) * 2021-03-25 2022-09-29 Tessy Plastics Corporation Method for forming micro channels in molded components and an associated micro-channel forming tool
CN115946271B (zh) * 2022-12-09 2025-03-28 中国科学院苏州生物医学工程技术研究所 一种集成微流控芯片制备装置
CN115970777B (zh) * 2022-12-26 2024-08-20 清华大学 仿生密封微结构阵列、微流控器件及其制造方法
CN117261089B (zh) * 2023-11-22 2024-02-02 湘潭大学 一种基于双模注塑的微流控芯片制作方法
EP4699775A1 (en) * 2024-08-22 2026-02-25 Sartorius Liquid Handling oy Plastic laboratory consumable with a prescribed wettability characteristic and method of manufacture thereof
CN119840140B (zh) * 2025-03-18 2025-06-27 深圳大学 一种微流控芯片的热压方法及微流控芯片

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101468506A (zh) * 2008-06-18 2009-07-01 中国检验检疫科学研究院 微流控芯片的批量生产方法
CN102123838A (zh) * 2008-08-20 2011-07-13 柯尼卡美能达精密光学株式会社 微通道芯片的制造方法、微通道芯片成型模具及微通道芯片
CN103895143A (zh) * 2014-03-25 2014-07-02 浙江大学 一种集成亚毫米深通道的pdms薄膜制作方法
CN104191548A (zh) * 2014-09-04 2014-12-10 齐鲁工业大学 一种透明胶带雕刻微流控芯片模具的快速制备方法
US20150343442A1 (en) * 2009-10-24 2015-12-03 The Governors Of The University Of Alberta Reversible bonding of microfluidic channels using dry adhesives
CN207521025U (zh) * 2017-11-01 2018-06-22 清华大学 微流控芯片和微流控装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU616724B2 (en) * 1988-01-27 1991-11-07 Hycor Biomedical Patterned plastic optical components
US5055203A (en) 1990-05-22 1991-10-08 Eastman Kodak Company Blood collection device with reduced serum dispensing volume and integral needle
AU2005220150A1 (en) 2004-02-13 2005-09-15 The University Of North Carolina At Chapel Hill Functional materials and novel methods for the fabrication of microfluidic devices
JP4367283B2 (ja) * 2004-08-06 2009-11-18 株式会社日立プラントテクノロジー マイクロ流体チップ
CN101048143A (zh) * 2004-10-27 2007-10-03 麦克内尔-Ppc股份有限公司 具有微起伏表面的剂型及其制造方法和装置
CN2830038Y (zh) * 2005-07-21 2006-10-25 杜元浩 塑料模压压力管模具
CN100480756C (zh) * 2007-12-07 2009-04-22 南京邮电大学 微流控阵列光开关芯片
CN102092669A (zh) * 2009-12-11 2011-06-15 国家纳米技术与工程研究院 微流控芯片表面处理结合热压的封装方法
CN103752356B (zh) * 2013-11-06 2015-08-12 山东省科学院海洋仪器仪表研究所 一种基于微流控芯片技术新型的镉柱还原系统及其加工方法
CN107074530A (zh) * 2014-08-29 2017-08-18 生物辐射实验室股份有限公司 用于微流体的环氧化物模塑和微铣削
CN206334685U (zh) * 2016-12-20 2017-07-18 宁波景和电子科技有限公司 一种微流体芯片

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101468506A (zh) * 2008-06-18 2009-07-01 中国检验检疫科学研究院 微流控芯片的批量生产方法
CN102123838A (zh) * 2008-08-20 2011-07-13 柯尼卡美能达精密光学株式会社 微通道芯片的制造方法、微通道芯片成型模具及微通道芯片
US20150343442A1 (en) * 2009-10-24 2015-12-03 The Governors Of The University Of Alberta Reversible bonding of microfluidic channels using dry adhesives
CN103895143A (zh) * 2014-03-25 2014-07-02 浙江大学 一种集成亚毫米深通道的pdms薄膜制作方法
CN104191548A (zh) * 2014-09-04 2014-12-10 齐鲁工业大学 一种透明胶带雕刻微流控芯片模具的快速制备方法
CN207521025U (zh) * 2017-11-01 2018-06-22 清华大学 微流控芯片和微流控装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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