WO2020114330A1 - 一种射线在闪烁晶体中的击中点定位方法及其系统 - Google Patents

一种射线在闪烁晶体中的击中点定位方法及其系统 Download PDF

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Publication number
WO2020114330A1
WO2020114330A1 PCT/CN2019/122005 CN2019122005W WO2020114330A1 WO 2020114330 A1 WO2020114330 A1 WO 2020114330A1 CN 2019122005 W CN2019122005 W CN 2019122005W WO 2020114330 A1 WO2020114330 A1 WO 2020114330A1
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hit
hit point
detector module
detector
module
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French (fr)
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杨永峰
章先鸣
桑子儒
梁栋
刘新
郑海荣
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Shenzhen Institute of Advanced Technology of CAS
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Shenzhen Institute of Advanced Technology of CAS
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/202—Measuring radiation intensity with scintillation detectors the detector being a crystal

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  • the invention relates to the technical field of nuclear detectors, in particular, to a method and a system for locating the hitting point of rays in a scintillation crystal.
  • PET Positron Emission Tomography
  • PET contains dozens or hundreds of PET detector modules.
  • the PET detector modules mainly include scintillation crystals and light detectors.
  • the PET detector modules are close to each other and are surrounded by a flat plate shape or a cylindrical shape.
  • the working principle of PET is to inject drugs containing positron radionuclide into the human body.
  • the positron radionuclide is annihilated, two gamma rays with an energy of 511keV at an angle around 180° are generated.
  • the gamma ray and the PET detector module The scintillation crystals in the interaction generate a large number of scintillation photons, and the photodetector can detect the intensity distribution of the scintillation photons. From the distribution of the scintillation photons, the position of the rays, that is, the position of the hit point can be calculated.
  • accurate positioning of the lesion area requires accurate positioning of the response line, that is, accurate positioning of the hit point of the radiation in the detector.
  • the ray hits the edge area of a certain PET detector module, only part of the scintillation photons may be received by the PET detector module, while the other part is collected by the module adjacent to the PET detector module. Incomplete collection may lead to inaccurate positioning of the hit point.
  • a semi-continuous crystal is a crystal composed of several continuous crystal flakes, where the flakes are continuous along the axial direction of the PET scanner and cut along the radial direction of the PET scanner, that is, composed of several flakes.
  • the first object of the present invention is to provide a method for locating the hit point of rays in a scintillation crystal to solve the problem that the hit point of the crystal edge is not accurately positioned in the prior art.
  • the second object of the present invention is to provide an electronic system for determining the position of a hit point, so as to solve the problem of insufficiently accurate positioning of the hit point of the crystal edge in the prior art.
  • the third object of the present invention is to provide a readable and writable storage medium to solve the problem that the position of the hit point generated in the prior art may be inaccurate.
  • an embodiment of the present invention provides a method for locating a hit point of rays in a scintillation crystal, which is applied to a nuclear technology imaging system.
  • the nuclear technology imaging system includes a plurality of detector modules, each of the detectors The modules all include scintillation crystals.
  • the method of locating the hit point of the rays in the scintillation crystals includes the following steps:
  • the position of the reference hit point is taken as the position of the hit point.
  • the hit detector module and each signal generated from each detector module are used to hit the hit point by a preset algorithm re-locate.
  • an embodiment of the present invention also provides an electronic system for determining the position of a hit point, which is applied to a nuclear technology imaging system.
  • the nuclear technology imaging system includes a plurality of detector modules, each of the detectors The modules all include scintillation crystals.
  • the electronic system for determining the location of the hit point includes:
  • the hit detector module determination unit is used to determine the hit detector module according to the total amplitude of the signals received by each of the detector modules separately;
  • a position calculation unit configured to calculate the position of the reference hit point through a preset algorithm according to the signal received by the hit detector module;
  • the hit point determination unit is configured to use the position of the reference hit point as the position of the hit point when the position of the reference hit point is located in the internal area of the hit detector module.
  • the hit point determination unit is also used to use the hit detector module and each signal generated from each of the detector modules when the position of the reference hit point is located in the edge area of the hit detector module, by The set algorithm repositions the hit point.
  • an embodiment of the present invention further provides a readable and writable storage medium on which an operating program is stored, and the above method is implemented when the operating program is executed by a processor.
  • the present invention has the following beneficial effects:
  • the invention provides a method and a system for locating a hit point of a ray in a scintillation crystal, in which the hit detector module is determined by the total amplitude of the signals received by each of the detector modules separately, and then according to the The signal received by the hit detector module calculates the position of the reference hit point through a preset algorithm, and when the position of the reference hit point is located in the internal area of the hit detector module, the reference hit The position of the midpoint is taken as the position of the hit point.
  • all detector modules are installed according to the position of the reference hit point to determine all adjacent detector modules that are close to the reference hit point; sequentially compare the total signal amplitude of all the adjacent detector modules with a preset signal amplitude threshold, and compare the total signal amplitude to the pre-set signal amplitude
  • the adjacent detector module of the set signal amplitude threshold is determined as the slave detector module.
  • the hit detector module and the signals generated from the detector modules are used to reposition the hit point through a preset algorithm.
  • the present invention adopts different positioning methods for the events acting on the edge area and the inner area of the detector module, when the rays act on the edge area of the detector, the signals hitting the detector and the signals generated from the detector are used for positioning at the same time. Therefore, more complete light distribution information can be obtained, thereby improving the positioning accuracy when the rays hit the edge area of the detector, and as a whole, the positioning accuracy of the hit point is higher.
  • FIG. 1 shows a flowchart of a method for determining a hit point of a ray in a scintillation crystal provided by an embodiment of the present invention.
  • FIG. 2 shows a signal amplitude distribution diagram of rays on a scintillation crystal provided by an embodiment of the present invention.
  • FIG. 3 shows a schematic structural diagram of a PET detector based on a cut crystal array provided by an embodiment of the present invention.
  • FIG. 4 shows a schematic structural view of a PET detector based on semi-continuous crystals provided by an embodiment of the present invention.
  • FIG. 5 shows a flowchart of sub-steps of step S105 in FIG. 1 provided by an embodiment of the present invention.
  • FIG. 6 shows a schematic block diagram of an electronic system for determining the position of a hit point provided by an embodiment of the present invention.
  • FIG. 7 shows a schematic diagram of sub-modules of a hit point determination unit provided by an embodiment of the present invention.
  • Icons 11-scintillation crystal; 12-coupling; 13-light guide; 14-light detector; 100-electronic system for determining the position of the hit point; 110-hit detector module determination unit; 120-position calculation unit 130-judgment unit; 140-hit point determination unit; 141-determined module from detector module; 142-hit point determination module.
  • an embodiment of the present invention provides a method for locating a hit point of rays in a scintillation crystal, which is applied to a nuclear technology imaging system.
  • the nuclear technology imaging system includes multiple detector modules, where the detector module refers to The smallest unit that can detect and locate incident rays independently, and each detector module contains a scintillation crystal 11 and a light detector 14, and generally also includes a light guide 13.
  • the material of the scintillation crystal 11 is not limited, and it can be any organic or inorganic scintillation crystal, such as lutetium silicate crystal;
  • the macrostructure of the scintillation crystal 11 is not limited, it can be a continuous crystal, a cut crystal array , Semi-continuous crystal and any other crystal macro structure that can achieve gamma-ray detection;
  • the type of photodetector 14 is also not limited, such as silicon photomultiplier tubes (SiPM, Silicon Photomultipliers, or MPPCs Multi-Pixel Photon Counters);
  • SiPM Silicon Photomultipliers
  • MPPCs Multi-Pixel Photon Counters Usually contains more than or equal to the number of readout units, each readout unit can independently output signals, the readout unit is also called a pixel.
  • the method of locating the hit point of the ray in the scintillation crystal includes:
  • step S11 the hit detector module is determined according to the total amplitude of the signals received by each of the detector modules.
  • the hit detector module is a module that interacts with gamma rays with an energy of 511 keV.
  • the number of scintillation photons produced by the gamma ray in the detector module is also different; in addition, ray detection is a random process that includes statistical fluctuations, so 511keV gamma rays hit a detector module The total amplitude of the generated signal varies within a range.
  • the method for determining the hitting of the detector module is to compare the total amplitude of the signal received by each of the detector modules with a preset amplitude range, and the total amplitude of the signal falls within the preset amplitude range
  • the internal detector module is used as a hit detector; for example, the preset amplitude range may be 350-650 keV, or other suitable ranges may be selected according to the actual situation, which is not limited in this embodiment.
  • the number of radionuclide decay per unit time may be greater than one, it may occur that more than one 511keV gamma ray per unit time interacts with the detector module and generates a signal, so the detector module is hit
  • the number can be more than one, for example, the number of hitting detector modules is two.
  • step S12 the position of the reference hit point is calculated by a preset algorithm according to the signal received by the hit detector module.
  • the position of the reference hit point can be calculated according to the signal received by the hit detector module and a preset algorithm.
  • the preset algorithm described in this embodiment includes, but is not limited to, the method of the barycenter method, the weighted barycenter method, the least square method, the maximum likelihood method, and the neural network.
  • Each detector module includes multiple pixels, and the multiple pixels are arranged adjacent to the array.
  • n represents the number of pixels of the photodetector 14
  • a i represents the signal amplitude of the i-th pixel
  • C i represents the i-th pixel in the x direction
  • n represents the number of pixels of the photodetector 14
  • a i represents the signal amplitude of the i th pixel
  • d i represents the i th pixel in the y direction
  • the position coordinate of y represents the position coordinate of the reference hit point in the y direction of the horizontal plane.
  • the (x, y) coordinates can be determined according to the signal amplitude of each pixel, that is, the position of the reference hit point in the horizontal plane is determined.
  • step S13 it is determined whether the position of the reference hit point is in the internal area of the hit detector module, if yes, step S14 is performed, and if not, step S15 is performed.
  • each detector module is divided into an internal area and an edge area, where the edge area refers to the area within the horizontal plane where the distance between the scintillation crystal 11 and its boundary is less than the threshold, and the internal area is the scintillation crystal 11 except the edge
  • the threshold may be set to 10mm, that is, the edge area is the horizontal or x-y distance from the scintillation crystal
  • the boundary of 11 is less than the crystal area of 10 mm.
  • FIG. 2 where a in FIG. 2 is an illustration of the prior art using only the signal of a single detector module to determine the hit point.
  • the incident rays interact in the detector and emit a large number of scintillation photons at a 4 ⁇ solid angle
  • most of the scintillation photons emitted toward the right of the hit point are reflected back to the crystal at the crystal boundary because the reference hit point is located in the edge region In the middle, the light distribution is distorted; a small part escapes into the adjacent detector, and only a small part is not reflected and is normally collected by the photodetector 14. It can be understood that at this time, only a part of the light distribution information can be detected by a single detector module.
  • the reflected flickering photons cause the center of gravity of the photon distribution to be to the left of the actual hit point, thereby causing errors in positioning.
  • 2 b is a positioning method provided by an embodiment.
  • a coupling member 12 is provided between the detector modules to reduce the reflection of scintillation photons at the crystal boundary.
  • the material of the coupling member 12 is not limited, such as air or silicone oil.
  • step S14 the position of the reference hit point is used as the position of the hit point.
  • the impact detector module can accurately calculate the location of the impact point.
  • step S15 the hit detector module and the signals generated from the detector modules are used to reposition the hit point by a preset algorithm.
  • a single detector module can only detect part of the light distribution information. At this time, the hit point and the signal from the detector module are used to reposition the hit point In order to more accurately locate the hit point, and thus improve the spatial resolution of the imaging system.
  • step S15 includes:
  • the slave detector module is determined according to the position of the reference hit point, the installation position of all detector modules, the total amplitude of the signal received by each detector module and a preset signal amplitude threshold.
  • the detector module refers to the detector module that immediately hits the detector module and also collects the signal of the ray, and the signal is larger.
  • the sub-step S151 includes:
  • sub-step S1511 adjacent detector modules near the reference hit point are determined according to the installation positions of all the detector modules.
  • the slave detector module Since the signal is concentrated near the hit point of the ray, the slave detector module needs to select the detector module adjacent to the reference hit point.
  • all the detector modules are arranged in an adjacent manner, that is, most detector modules are provided with detector modules around them. Understandably, when the position of the reference hit point is determined, it can be determined Refer to which side of the detector module is closer to the hit point, and then find the detector module adjacent to the side according to the installation positions of all the detector modules. Among them, when the reference hit point is located in the corner of the crystal, there may be three adjacent detector modules; when it is located in the middle of a certain boundary of the crystal, there may be only one adjacent detector module, so the adjacent detector module may be One or more.
  • Sub-step S1512 sequentially comparing the total signal amplitude of each detector module in the adjacent detector modules with a preset signal amplitude threshold, and comparing detector modules larger than the preset signal amplitude threshold Determine the slave detector module.
  • the total signal amplitude of each adjacent detector module may be less than the threshold, that is, the number of slave detector modules may be zero, for example, The number of adjacent detector modules is 3, when the number of slave detector modules is 0; of course, the number of slave detector modules may also be multiple, which is not limited in this embodiment.
  • Step S15 also includes:
  • Sub-step S152 through the preset algorithm, re-position the hit point with the signals generated by the hit detector module and the respective detector modules.
  • the hit point is relocated using the signals generated from the detector module and the hit detector module respectively.
  • the preset algorithm is the same as the algorithm described in step S102, which includes But it is not limited to barycenter method, weighted barycenter method, least square method, maximum likelihood method and improved methods based on these methods.
  • the calculation process in order to improve the signal-to-noise ratio of the signal, only part of the signal from the detector module may be used, for example, the signal closest to the pixel that hits the detector; or all the signals from the detector may be used for positioning.
  • the method can be used in any detector area array or nuclear technology imaging system based on scintillation crystal 11, containing multiple detector modules, such as X/gamma ray camera, computed tomography, positron tomography Imaging scanners, etc.
  • this method can be implemented in a PET detector based on a cut crystal array, used to solve the unclear resolution of the edge crystal strips of the cut crystal array in the prior art
  • the problem is that the cut crystal array is composed of multiple identical cuboid crystal strips, and the crystal strips are arranged neatly in rows and columns.
  • the method can also be used in PET detectors based on continuous crystals to solve the problem of poor resolution of edge positions of continuous crystals in the prior art, where the continuous crystals are uncut internal crystals.
  • this method can also be used in a PET detector based on semi-continuous crystals to solve the problem of poor position resolution of the semi-continuous crystals at the edge area of the crystal along its continuous direction in the prior art.
  • a semi-continuous crystal is a crystal composed of several continuous crystal flakes, where the flakes are continuous along the axial direction of the PET scanner and cut along the radial direction of the PET scanner, that is, composed of several flakes.
  • an embodiment of the present invention also provides an electronic system for determining the position of a hit point, which is applied to a nuclear technology imaging system.
  • the nuclear technology imaging system has multiple detector modules, where the detector module refers to independent detection. The smallest unit of incident rays is located, and each detector module includes a scintillation crystal 11 and a light detector 14.
  • the electronic system 100 for determining the position of the hit point includes:
  • the hit detector module determination unit 110 is used to determine the hit detector module according to the total amplitude of the signals received by each of the detector modules.
  • step S11 may be performed by hitting the detector module determination unit 110.
  • the position calculation unit 120 is configured to calculate the position of the reference hit point through a preset algorithm according to the signal received by the hit detector module.
  • step S12 can be performed by the position calculation unit 120.
  • the judging unit 130 is used for judging whether the position of the reference hitting point is in the internal area of the hitting detector module.
  • step S13 can be performed by the judgment unit 130.
  • the hit point determination unit 140 is configured to use the position of the reference hit point as the position of the hit point.
  • step S14 may be performed by hitting point determination unit 140.
  • the hit point determination unit 140 is also used to reposition the hit point by a preset algorithm using the hit detector module and signals generated from the detector modules, respectively.
  • step S15 can be performed by the hit point determination unit 140.
  • the hit point determination unit 140 includes:
  • the determination module 141 from the detector module is used to determine the position according to the position of the reference hit point, the installation positions of all detector modules, the total amplitude of the signal received by each detector module and a preset signal amplitude threshold From the detector module.
  • sub-step S151 can be performed by determining the module 141 from the detector module.
  • the sub-detector module determination module 141 is used to determine the adjacent detector modules near the reference hit point according to the installation positions of all the detector modules, and sequentially turn the adjacent detector modules into The total signal amplitude of each detector module is compared with a preset signal amplitude threshold, and a detector module greater than the preset signal amplitude threshold is determined as a slave detector module.
  • the hit point determination module 142 is used for repositioning the hit point using the hit detector module and the signals from the detector module through the preset algorithm.
  • sub-step S152 can be performed by the hit point determination module 142.
  • the embodiment of the present invention also discloses a readable and writable storage medium.
  • the running program is executed by the processor, the method for locating the hit point of the ray in the scintillation crystal 11 disclosed in the foregoing embodiment of the present invention is implemented.
  • the present invention provides a method and system for locating the hit point of rays in a scintillation crystal, wherein the hit detector module is determined by the total amplitude of the signals received by each of the detector modules , And then calculate the position of the reference hit point according to the signal received by the hit detector module through a preset algorithm, and then when the position of the reference hit point is located in the internal area of the hit detector module , Taking the position of the reference hit point as the position of the hit point, and when the position of the reference hit point is located in the edge area of the hit detector module, use the hit detector module and the slave detector The signals generated by the modules are used to reposition the hit point through a preset algorithm.
  • the method and system for locating the hitting point of the ray in the scintillation crystal provided by the present invention can determine the position of the hitting point inside or at the edge of the hitting detector module according to the position of the hitting point after determining the concentrated detector module, and When the position of the reference hit point is at the middle position of the hit detector, it is regarded as the position of the hit point, and when it is at the edge position of the hit detector, the centralized detector and the slave detector module can be used to Hit the point to reposition. By judging the position of the reference hit point, the position of the hit point can be determined by situation, so that the positioning accuracy of the hit point is higher.

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Abstract

一种射线在闪烁晶体中的击中点定位方法及其系统，方法包括以下步骤：依据每个探测器模块分别接收到的信号总幅度确定击中探测器模块（S11），依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置（S12），判断所述参考击中点的位置是否在所述击中探测器模块的内部区域（S13），当所述参考击中点的位置位于所述击中探测器模块的内部区域时，将所述参考击中点的位置作为击中点的位置（S14），当所述参考击中点的位置位于所述击中探测器模块的边缘区域时，利用击中探测器模块以及从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位（S15）。

Description

一种射线在闪烁晶体中的击中点定位方法及其系统 技术领域
本发明涉及核探测器技术领域，具体而言，涉及一种射线在闪烁晶体中的击中点定位方法及其系统。
背景技术
目前，正电子发射断层成像(Positron Emission Tomography，简称PET)能够定量和无创地测量由正电子发射核素标记的生物分子在生物体内随时间的变化情况，被广泛用于肿瘤、心血管疾病和神经疾病等的早期诊断。
PET包含几十个或几百个PET探测器模块，PET探测器模块主要包含闪烁晶体和光探测器，PET探测器模块间彼此紧靠，围绕成平板形状或圆柱形状。
PET的工作原理为向人体注射含有正电子放射性核素标记的药物，正电子放射性核素湮灭时产生两个能量为511keV夹角在180°附近的伽马射线，伽马射线与PET探测器模块中的闪烁晶体发生相互作用，产生大量闪烁光子，光探测器能探测到闪烁光子的强度分布，通过闪烁光子的分布可计算射线的作用位置，即击中点的位置。画线连接两个伽马射线的击中点可以得到一条响应线，代表正电子发射核素位于这条线上；通过大量响应线最终能确定正电子核素的具体位置，进而定位病灶区域。
因此，准确定位病灶区域要求准确定位响应线，即准确定位射线在探测器中的击中点。通常，根据探测器模块的信号总幅度确定击中点位于哪一个PET探测器模块，然后只使用该探测器模块所产生的信号来计算射线的击中点。但是，当射线击中某一个PET探测器模块的边缘区域时，闪烁光子可能只有一部分被该PET探测器模块接收到，而另一部分则被该PET探测器模块相邻的 模块所采集，闪烁光子收集不完全可能导致击中点的定位不准确。
更具体的，对于基于切割晶体阵列的PET探测器，现有技术中存在切割晶体阵列的边缘晶条分辨不清楚的问题，其中切割晶体阵列由多个相同的长方体晶条组成，晶条之间按行列整齐排列。对于基于连续晶体的PET探测器，现有技术中存在连续晶体边缘位置分辨率变差的问题，其中连续晶体是内部未经切割的整块晶体。对于基于半连续晶体的PET探测器，现有技术中存在半连续晶体沿其连续方向的晶体边缘区域处位置分辨率差的问题。半连续晶体是由若干个连续晶体薄片组成的晶体，其中薄片沿PET扫描仪的轴向方向是连续的，沿PET扫描仪的径向方向是切割的，即由若干个薄片组成。
有鉴于此，如何解决上述问题，是本领域技术人员关注的重点。
发明内容
本发明的第一目的在于提供一种射线在闪烁晶体中的击中点定位方法，以解决现有技术中在晶体边缘击中点定位不够准确的问题。
本发明的第二目的在于提供一种用于确定击中点位置的电子系统，以解决现有技术中在晶体边缘击中点定位不够准确的问题。
本发明的第三目的在于提供一种可读写存储介质，以解决现有技术中生成的击中点的位置可能不准确的问题。
为了实现上述目的，本发明实施例采用的技术方案如下：
第一方面，本发明实施例提供了一种射线在闪烁晶体中的击中点定位方法，应用于核技术成像系统，所述核技术成像系统包括多个探测器模块，每个所述探测器模块均包括闪烁晶体，所述射线在闪烁晶体中的击中点定位方法包括以下步骤：
依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块；
依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置；
当所述参考击中点的位置位于所述击中探测器模块的内部区域时，将所述参考击中点的位置作为击中点的位置。
当所述参考击中点的位置位于所述击中探测器模块的边缘区域时，利用击中探测器模块以及每个从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位。
第二方面，本发明实施例还提供了一种用于确定击中点位置的电子系统，应用于核技术成像系统，所述核技术成像系统包括多个探测器模块，每个所述探测器模块均包括闪烁晶体，所述用于确定击中点位置的电子系统包括：
击中探测器模块确定单元，用于依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块；
位置计算单元，用于依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置；
击中点确定单元，用于当所述参考击中点的位置位于所述击中探测器模块的内部区域时，将所述参考击中点的位置作为击中点的位置。
击中点确定单元还用于当所述参考击中点的位置位于所述击中探测器模块的边缘区域时，利用击中探测器模块以及每个从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位。
第三方面，本发明实施例还提供了一种可读写存储介质，其上存储有运行程序，该运行程序被处理器执行时实现上述方法。
相对现有技术，本发明具有以下有益效果：
本发明提供了一种射线在闪烁晶体中的击中点定位方法及其系统，其中，通过依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块，然后依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置，当所述参考击中点的位置位于所述击中探测器模块的内部区域时，将所述参考击中点的位置作为击中点的位置，当所述参考击中点的位置位于所述击中探测器模块的边缘区域时，依据所述参考击中点的位置，所有探测器模块的安装位置，确定所有靠近所述参考击中点的相邻探测器模块；依次将所有所述相邻探测器模块的信号总幅度与预设定的信号幅度阈值进行比较，将信号总幅度大于所述预设定的信号幅度阈值的相邻探测器模块确定为从探测器模块。利用击中探测器模块以及从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位。由于本发明对作用在探测器模块边缘区域和内部区域的事件分别采用不同的定位方法，当射线作用在探测器边缘区域时，同时利用击中探测器和从探测器各自产生的信号进行定位，从而能获得更完整的光分布信息，从而提高了射线击中探测器边缘区域时的定位精度，进而整体上使得击中点的定位精度更高。
附图说明
图1示出了本发明实施例提供的射线在闪烁晶体中的击中点确定方法的流程图。
图2示出了本发明实施例提供的射线在闪烁晶体上的信号幅度分布图。
图3示出了本发明实施例提供的基于切割晶体阵列的PET探测器的结构示意图。
图4示出了本发明实施例提供的基于半连续晶体的PET探测器的结构示 意图。
图5示出了本发明实施例提供的图1中步骤S105的子步骤的流程图。
图6示出了本发明实施例提供的用于确定击中点位置的电子系统的模块示意图。
图7示出了本发明实施例提供的击中点确定单元的子模块示意图。
图标：11-闪烁晶体；12-耦合件；13-光导；14-光探测器；100-用于确定击中点位置的电子系统；110-击中探测器模块确定单元；120-位置计算单元；130-判断单元；140-击中点确定单元；141-从探测器模块确定模块；142-击中点确定模块。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
请参照图1，本发明实施例提供了一种射线在闪烁晶体中的击中点定位方法，应用于核技术成像系统，该核技术成像系统含有多个探测器模块，其中，探测器模块指可以独立探测并定位入射射线的最小单元，且每个探测器模块均含有闪烁晶体11与光探测器14，一般还包含光导13。在本实施例中，对于闪烁晶体11的材料不作限定，可以是任何一种有机或无机闪烁晶体，例如硅酸镥晶体；对于闪烁晶体11的宏观结构不作限定，可以是连续晶体，切割晶体阵列，半连续晶体等任何一种能实现伽马射线探测的晶体宏观结构；光探测器14的种类也不作限定，例如硅光电倍增管(SiPM,Silicon Photomultipliers,or MPPCs Multi-Pixel Photon Counters)；其通常包含大于等于1个的读出单元数 目，每个读出单元均可以独立输出信号，读出单元也称为像素。该射线在闪烁晶体中的击中点定位方法包括：
步骤S11，依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块。
在本实施例中，击中探测器模块为与能量为511keV的伽马射线发生相互作用的模块。根据相互作用种类的不同，伽马射线在探测器模块中产生的闪烁光子数目也不同；另外，射线探测是一个随机过程，其中包含统计涨落，所以511keV伽马射线击中某个探测器模块所产生的信号总幅度在一个范围内变化。本实施例确定击中探测器模块的方法为将每个所述探测器模块接收到的信号总幅度与预设定的幅度范围进行比较，将信号总幅度落在所述预设定的幅度范围内的探测器模块作为击中探测器；例如，预设定的幅度范围可以是350-650keV，也可以根据实际情况选择其他合适的范围，本实施例对此并不做任何限定。
在本实施例中，由于单位时间内放射性核素的衰变个数可能大于一个，因此可能出现单位时间内不止一个511keV伽马射线与探测器模块发生相互作用并产生信号，因此击中探测器模块的数量可以不止一个，例如，击中探测器模块的数量为两个。
步骤S12，依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置。
在确定了击中探测器模块后，可依据该击中探测器模块接收到的信号与预设定的算法计算参考击中点的位置。
其中，本实施例所述的预设定的算法包括但不限于重心法，加权重心法，最小二乘法，最大似然法，神经网络等方法。
下面以重心法为例进行说明，每个探测器模块均包括多个像素，且多个像素按阵列相邻排布，首先，依据公式
Figure PCTCN2019122005-appb-000001
确定所述参考击中点在水平面x方向上的位置，其中，n表示光探测器14的像素个数，A i表示第i个像素的信号幅度，C i表示第i个像素在x方向上的位置坐标，x表示参考击中点在水平面x方向上的位置坐标。然后，依据公式
Figure PCTCN2019122005-appb-000002
确定所述参考击中点在水平面y方向上的位置，其中，n表示光探测器14的像素个数，A i表示第i个像素的信号幅度，d i表示第i个像素在y方向上的位置坐标，y表示参考击中点在水平面y方向上的位置坐标。依据每个像素的信号幅度可确定(x,y)坐标，即确定所述参考击中点在水平面中的位置。
步骤S13，判断所述参考击中点的位置是否在所述击中探测器模块的内部区域，如果是，则执行步骤S14，如果否，则执行步骤S15。
在本实施例中，每个探测器模块均分为内部区域与边缘区域，其中，边缘区域指在水平面内，闪烁晶体11中距离其边界小于阈值的区域，内部区域为闪烁晶体11中除边缘区域以外的区域，且水平面与光探测器14的法线垂直，例如，对于一个50mm×50mm×10mm的闪烁晶体11，阈值可能设置为10mm，即边缘区域为水平面x或y方向上距离闪烁晶体11的边界小于10mm的晶体区域。
同时，请参阅图2，其中，图2中a图为现有技术仅使用单个探测器模块的信号确定击中点的说明。当入射射线在探测器中发生相互作用，并以4π立体角发射大量闪烁光子时，由于参考击中点位于边缘区域，朝击中点右侧发射的闪烁光子大部分在晶体边界被反射回晶体中间，导致光分布畸变；小部分逃逸到相邻探测器中，仅有很小部分未经反射且被该光探测器14正常收集。可以明白的，此时，单个探测器模块只能探测到一部分的光分布信息，反射的闪 烁光子导致光子分布的重心位于实际击中点的左侧，从而使定位产生误差。图2中b为实施例提供的定位方法，在探测器模块之间设置有耦合件12，用来减弱闪烁光子在晶体边界的反射，耦合件12的材料不作限定，例如空气，或硅油。当参考击中点位于边缘区域时，有一部分闪烁光能逃逸到相邻探测器中并被探测到。联合击中探测器和其相邻(从)探测器的信号能探测到更完整的光分布信息，从而光子分布重心与实际击中点更接近，从而定位击中点的误差较小。
有鉴于此，在本实施例中，需进行参考击中点的位置的判断。
步骤S14，将所述参考击中点的位置作为击中点的位置。
当参考击中点的位置在击中探测器模块的内部区域时，即表示射线的信号已大部分被该击中探测器模块所采集，从探测器含有的光子分布信息较少，可能与噪声水平相当。因此，此时利用该击中探测器模块即可准确计算出击中点的位置。
步骤S15，利用击中探测器模块以及从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位。
当在参考击中点的位置处于边缘区域时，单个探测器模块只能探测到一部分的光分布信息，此时通过击中探测器模块与从探测器模块的信号进行对击中点的重新定位，从而更加准确地定位击中点，进而提升成像系统的空间分辨率。
具体地，请参阅图3，步骤S15包括：
子步骤S151，依据所述参考击中点的位置，所有探测器模块的安装位置，每个探测器模块接收到的信号总幅度以及预设定的信号幅度阈值确定所述从探测器模块。
其中，需要说明的是，在本实施例中，从探测器模块指紧挨击中探测器模 块，同样收集到射线的信号，且信号较大的探测器模块。
其中，子步骤S151包括：
子步骤S1511，依据所述所有探测器模块的安装位置确定靠近所述参考击中点的位置的相邻探测器模块。
由于信号集中于射线的击中点附近，因此从探测器模块需要选择与参考击中点相邻的探测器模块。
本实施例中，所有的探测器模块按相邻的方式排列，即大多数探测器模块的四周均设置有探测器模块，可以理解地，当该参考击中点的位置确定之后，即可确定参考击中点更靠近击中探测器模块的哪一侧，进而根据所有探测器模块的安装位置找到与该侧相邻的探测器模块。其中，当参考击中点位于晶体的角落，可能有三个相邻探测器模块；当位于晶体某个边界的正中间时，可能只有一个相邻探测器模块，因此相邻的探测器模块可以是一个，也可以是多个。
子步骤S1512，依次将所述相邻探测器模块中的每个探测器模块的信号总幅度与预设定的信号幅度阈值进行比较，将大于所述预设定的信号幅度阈值的探测器模块确定为从探测器模块。
如果从探测器信号太小，那么探测器自身噪声相对于信号来说则过大，因此要选择信号较大的相邻探测器模块作为从探测器模块。确定所述预设定的信号幅度阈值需要事先估计探测器模块内的噪声水平。进一步地，在本实施例中，通过依次将相邻探测器模块中的每个探测器模块的信号总幅度与预设定的信号幅度进行比较的方式，例如，当阈值设置为70keV时，信号总幅度大于70keV的相邻探测器模块就是从探测器模块。
由于需要通过比较的方式确定从探测器模块的数量，因此可能出现每个相邻的探测器模块的信号总幅度均小于阈值的情况，即可能出现从探测器模块数 量为零的情况，例如，相邻的探测器模块的数量为3，当从探测器模块的数量为0；当然地，从探测器模块的数量也可以为多个，本实施例对此并不做任何限定。
步骤S15还包括：
子步骤S152，通过所述预设定的算法，用所述击中探测器模块以及所述从探测器模块各自产生的的信号对击中点重新定位。
确定从探测器模块后，利用从探测器模块与击中探测器模块的各自产生的信号对击中点进行重新定位，其中，预设定的算法与步骤S102中所述的算法相同，即包括但不限于重心法，加权重心法，最小二乘法，最大似然法及以这些方法为基础的改进方法。计算过程中，为了提高信号的信噪比，可以仅使用从探测器模块的部分信号，例如最靠近击中探测器的那部分像素的信号；也可以使用从探测器的所有信号进行定位。
此外，本方法可以用于任何基于闪烁晶体11的，含有多个探测器模块的探测器面阵或核技术成像系统，例如X/伽马射线照相机，计算机断层扫描(Computed Tomography)，正电子断层成像扫描仪等。进一步地，对于正电子断层成像扫描仪，请参阅图4，本方法可以用在基于切割晶体阵列的PET探测器来实施，用来解决现有技术中切割晶体阵列的边缘晶条分辨不清楚的问题，其中切割晶体阵列由多个相同的长方体晶条组成，晶条之间按行列整齐排列。本方法还可以用在基于连续晶体的PET探测器中，用来解决现有技术中连续晶体边缘位置分辨率变差的问题，其中连续晶体是内部未经切割的整块晶体。请参阅图5，本方法还可以用在基于半连续晶体的PET探测器中，用来解决现有技术中半连续晶体沿其连续方向的晶体边缘区域处位置分辨率差的问题。半连续晶体是由若干个连续晶体薄片组成的晶体，其中薄片沿PET扫描仪的轴 向方向是连续的，沿PET扫描仪的径向方向是切割的，即由若干个薄片组成。
第二实施例
请参阅图6，本发明实施例还提供了一种确定击中点位置的电子系统，应用于核技术成像系统，该核技术成像系统多个探测器模块，其中，探测器模块指可以独立探测并定位入射线的最小单元，且每个探测器模块均包括闪烁晶体11与光探测器14，该用于确定击中点位置的电子系统100包括：
击中探测器模块确定单元110，用于依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块。
可以理解的，通过击中探测器模块确定单元110可执行步骤S11。
位置计算单元120，用于依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置。
可以理解的，通过位置计算单元120可执行步骤S12。
判断单元130，用于判断所述参考击中点的位置是否在所述击中探测器模块的内部区域。
可以理解的，通过判断单元130可执行步骤S13。
击中点确定单元140，用于将所述参考击中点的位置作为击中点的位置。
可以理解的，通过击中点确定单元140可执行步骤S14。
击中点确定单元140还用于利用击中探测器模块以及从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位。
可以理解的，通过击中点确定单元140可执行步骤S15。
其中，请参阅图7，所述击中点确定单元140包括：
从探测器模块确定模块141，用于依据所述参考击中点的位置，所有探测器模块的安装位置，每个探测器模块接收到的信号总幅度以及预设定的信号幅 度阈值确定所述从探测器模块。
可以理解的，通过从探测器模块确定模块141可执行子步骤S151。
具体地，从探测器模块确定模块141用于依据所述所有探测器模块的安装位置确定靠近所述参考击中点的位置的相邻探测器模块，并依次将所述相邻探测器模块中的每个探测器模块的信号总幅度与预设定的信号幅度阈值进行比较，将大于所述预设定的信号幅度阈值的探测器模块确定为从探测器模块。
击中点确定模块142，用于通过所述预设定的算法，利用所述击中探测器模块以及所述从探测器模块的信号，对击中点重新定位。
可以理解的，通过击中点确定模块142可执行子步骤S152。
第三实施例
本发明实施例还揭示了一种可读写存储介质，该运行程序被处理器执行时实现本发明前述实施例揭示的射线在闪烁晶体11中的击中点定位方法。
综上所述，本发明提供了一种射线在闪烁晶体中的击中点定位方法及其系统，其中，通过依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块，然后依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置，再当所述参考击中点的位置位于所述击中探测器模块的内部区域时，将所述参考击中点的位置作为击中点的位置，并且当所述参考击中点的位置位于所述击中探测器模块的边缘区域时，利用击中探测器模块以及从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位。由于本发明提供的射线在闪烁晶体中的击中点定位方法及其系统能够在确定集中探测器模块后，依据参考击中点的位置判断该位置在击中探测器模块的内部或者边缘，同时在参考击中点的位置处于击中探测器的中间位置时，将其作为击中点的位置，并在其处于击中探测器的边缘位置时，能够利用集中探测器和从探测 器模块对击中点进行重新定位。通过判断参考击中点的位置，能够实现分情况的确定击中点的位置，使得击中点的定位精度更高。
需要说明的是，在本文中，诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种射线在闪烁晶体中的击中点定位方法，应用于核技术成像系统，其特征在于，所述核技术成像系统包括多个探测器模块，每个所述探测器模块均包括闪烁晶体，所述射线在闪烁晶体中的击中点定位方法包括以下步骤：
    依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块；
    依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置；
    当所述参考击中点的位置位于所述击中探测器模块的内部区域时，将所述参考击中点的位置作为击中点的位置；
    当所述参考击中点的位置位于所述击中探测器模块的边缘区域时，利用击中探测器模块以及每个从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位。
  2. 如权利要求1所述的射线在闪烁晶体中的击中点定位方法，其特征在于，所述利用击中探测器模块以及每个从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位的步骤包括：
    依据所述参考击中点的位置，所有探测器模块的安装位置，每个探测器模块接收到的信号总幅度以及预设定的信号幅度阈值确定所述从探测器模块；
    通过所述预设定的算法，用所述击中探测器模块以及所述从探测器模块各自产生的信号对击中点重新定位。
  3. 如权利要求2所述的射线在闪烁晶体中的击中点定位方法，其特征在于，所述依据所述参考击中点的位置，所有探测器模块的安装位置，每个探测器模块接收到的信号总幅度以及预设定的信号幅度阈值确定所述从探测器模块的步 骤包括：
    依据所述所有探测器模块的安装位置确定靠近所述参考击中点的位置的相邻探测器模块；
    依次将所述相邻探测器模块中的每个探测器模块的信号总幅度与预设定的信号幅度阈值进行比较，将大于所述预设定的信号幅度阈值的探测器模块确定为从探测器模块。
  4. 如权利要求1所述的射线在闪烁晶体中的击中点定位方法，其特征在于，所述依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块的步骤包括：
    将每个所述探测器模块接收到的信号总幅度与预设定的幅度范围进行比较，并将信号总幅度落在所述预设定的幅度范围内的探测器模块作为击中探测器。
  5. 如权利要求1所述的射线在闪烁晶体中的击中点定位方法，其特征在于，所述边缘区域指在水平面内，闪烁晶体中距离其边界小于阈值的区域，所述水平面与光探测器的法线垂直，所述内部区域为所述闪烁晶体中除所述边缘区域以外的区域。
  6. 如权利要求1所述的射线在闪烁晶体中的击中点定位方法，其特征在于，所述探测器模块还包括光探测器，所述光探测器的读出单元数目大于或等于1个，且每个读出单元均可独立输出信号。
  7. 一种用于确定击中点位置的电子系统，应用于核技术成像系统，其特征在于，所述核技术成像系统包括多个探测器模块，每个所述探测器模块均包括闪烁晶体，所述用于确定击中点位置的电子系统包括：
    击中探测器模块确定单元，用于依据每个所述探测器模块分别接收到的信号总幅度确定击中探测器模块；
    位置计算单元，用于依据所述击中探测器模块接收到的信号通过预设定的算法计算参考击中点的位置；
    击中点确定单元，用于当所述参考击中点的位置位于所述击中探测器模块的内部区域时，将所述参考击中点的位置作为击中点的位置；
    击中点确定单元还用于当所述参考击中点的位置位于所述击中探测器模块的边缘区域时，利用击中探测器模块以及每个从探测器模块各自产生的信号，通过预设定的算法对击中点重新定位。
  8. 如权利要求7所述的用于确定击中点位置的电子系统，其特征在于，所述击中点确定单元包括：
    从探测器模块确定模块，用于当所述参考击中点的位置在预设定的边缘位置时，依据所述参考击中点的位置，所有探测器模块的安装位置，每个探测器模块接收到的信号总幅度以及预设定的信号幅度阈值确定所述从探测器模块；
    击中点确定模块，用于通过所述预设定的算法，利用所述击中探测器模块以及每个所述从探测器模块各自产生的信号，对击中点重新定位。
  9. 如权利要求8所述的用于确定击中点位置的电子系统，其特征在于，所述从探测器模块确定模块用于依据所述所有探测器模块的安装位置确定靠近所述参考击中点的位置的相邻探测器模块，并依次将所述相邻探测器模块中的每个探测器模块的信号总幅度与预设定的信号幅度阈值进行比较，将大于所述预设定的信号幅度阈值的探测器模块确定为从探测器模块。
  10. 一种可读写存储介质，其上存储有运行程序，其特征在于，该运行程序被处理器执行时实现如权利要求1-6任一项所述的方法。
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