WO2020113676A1 - 蒸镀坩埚 - Google Patents

蒸镀坩埚 Download PDF

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Publication number
WO2020113676A1
WO2020113676A1 PCT/CN2018/121851 CN2018121851W WO2020113676A1 WO 2020113676 A1 WO2020113676 A1 WO 2020113676A1 CN 2018121851 W CN2018121851 W CN 2018121851W WO 2020113676 A1 WO2020113676 A1 WO 2020113676A1
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Prior art keywords
crucible
evaporation
heat
crucible body
channels
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PCT/CN2018/121851
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English (en)
French (fr)
Inventor
匡友元
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US16/340,386 priority Critical patent/US20200181759A1/en
Publication of WO2020113676A1 publication Critical patent/WO2020113676A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source

Definitions

  • the invention relates to the field of display technology manufacturing, in particular to an evaporation crucible.
  • OLED is a promising flat panel display technology, which has very excellent display performance, especially self-luminous, simple structure, ultra-thin, fast response, wide viewing angle, low power consumption and flexible display, etc.
  • dream display coupled with its investment in production equipment is much smaller than TFT-LCD, it has been favored by major display manufacturers and has become the main force of the third generation of display devices in the field of display technology.
  • OLED is already on the eve of mass production. With the deepening of research and the continuous emergence of new technologies, OLED display devices will surely have a breakthrough development.
  • the equipment used to generate steam is called the evaporation source.
  • the point source usually uses a cylindrical crucible and the heating wire is integrated heating.
  • the evaporation is performed in a vacuum evaporation chamber
  • the OLED material is placed in the crucible 10
  • the heating coil 20 surrounds the outer wall of the crucible 10 to heat the OLED material in the crucible 10.
  • the OLED material vaporizes and vaporized molecules exit the crucible cover 30
  • the air holes 35 fly out and are deposited on the substrate to form a solid film.
  • the temperature of the crucible cover 30 will be lower, and the vaporized molecules of the material will be deposited on the crucible cover 30 and continue to grow, causing the crucible vent holes 35 to block (plugging).
  • Overheating can cause the material to crack and become unusable.
  • the temperature difference between the upper and lower stages will cause the bottom temperature of the crucible 10 to be lower.
  • the temperature of the crucible 10 has exceeded the cracking temperature of the material, which leads to the degradation of the performance of the device.
  • the material at the bottom of 10 is directly wasted; and the OLED organic material is a thermal non-thermal good conductor, which has low heat transfer efficiency, and the long propagation path affects the heat transfer efficiency.
  • the heat transfer As shown in FIG. 2, the loss at the center of the crucible 10 is often insufficiently heated and cannot be completely vaporized and left in the crucible 10.
  • the purpose of the present invention is to provide an evaporation crucible, which can effectively reduce the lateral temperature difference of the internal evaporation material, reduce the risk of material cracking, improve the stability of the evaporation rate, and thus improve the quality of the OLED panel.
  • the present invention provides an evaporation crucible, which includes a crucible body and a heat conduction device provided inside the crucible body;
  • the crucible body includes a crucible bottom and a side wall connected to the crucible bottom;
  • the heat-conducting device is fixedly connected to the side wall, and the heat-conducting device has a honeycomb shape, and has a plurality of channels for accommodating the evaporation material extending in parallel along the axial direction of the crucible body.
  • the heat conducting device has a hollow structure with one or more layers penetrating the multiple channels;
  • the hollow structure serves as a buffer layer to contain the evaporation material and make all the channels communicate here.
  • the number of the channels is two or more.
  • the channels on the two adjacent heat-conducting devices are correspondingly arranged one by one.
  • the material of the crucible body is silver, titanium, aluminum or stainless steel.
  • the material of the heat conduction device is silver, titanium, aluminum or stainless steel.
  • the material of the heat conduction device is the same as the material of the crucible body.
  • the crucible body and the heat conduction device are obtained by mechanically removing material from a metal rod.
  • the inner surface of the side wall is inclined relative to the bottom of the crucible
  • the heat-conducting device has an outer surface that completely fits the inner surface of the side wall, and the heat-conducting device is connected to the inner surface of the side wall by its own gravity.
  • the evaporation crucible further includes an upper cover portion provided above the crucible body, and a gas outlet hole is provided in the center of the upper cover portion.
  • the evaporation crucible further includes a heating coil sleeved outside the crucible body for heating the evaporation material.
  • An evaporation crucible provided by the present invention includes a crucible body and a heat conduction device provided inside the crucible body.
  • the crucible body includes a crucible bottom and a side wall connected to the crucible bottom.
  • the device is fixedly connected to the side wall, and the heat-conducting device is in a honeycomb shape, and has a plurality of channels for accommodating the evaporation material extending in parallel along the axial direction of the crucible body. Compared with the prior art, the channels are evaporated The heat transfer distance of the material is short, and the heat of the evaporation material comes from the heat conduction device with good thermal conductivity around it.
  • the evaporation material can be fully heated in the channel, which greatly shortens the transverse transfer path of heat in the non-thermal good conductor. Therefore, the lateral temperature difference of the internal vapor deposition material is greatly reduced, the utilization rate of the vapor deposition material is improved, the cracking risk of the vapor deposition material is reduced, the stability of the vapor deposition rate is improved, and the quality of the OLED panel is further improved.
  • Figure 1 is a schematic diagram of the structure of an existing evaporation crucible
  • FIG. 2 is a schematic diagram of the remaining state of the vapor deposition material in the vapor deposition crucible in the existing vapor deposition process
  • FIG. 3 is a schematic cross-sectional structural view of a first embodiment of an evaporation crucible of the present invention
  • FIG. 4 is a schematic cross-sectional structural view of a second embodiment of an evaporation crucible of the present invention.
  • this embodiment includes a crucible body 1 And set on the crucible body 1 Internal heat conduction device 2 ⁇ Set in the crucible body 1 Upper cover part 3 , Nested in the crucible body 1 Heating coil for heating the evaporation material on the outside 4 .
  • the crucible body 1 Including crucible bottom 11 And with the bottom of the crucible 11 Connected side walls 12 , The upper cover 3 Vent in the center 31 .
  • the heat conduction device 2 Fixedly attached to the side wall 12 Above, and the heat conduction device 2 It is in the shape of a honeycomb with multiple parallel lines along the crucible body 1 Axes extending axially for containing evaporation material twenty one .
  • the heating coil 4 The heat emitted by the side wall 12 The outside is transferred to the heat conduction device connected to it 2 , Which is then passed to the channel twenty one Inside the evaporation material, thereby shortening the lateral transfer path of heat in the non-thermal good conductor, thereby reducing the lateral temperature difference of the internal evaporation material.
  • the heat conduction device 2 Material and the crucible body 1 are the same, and they are all good thermal conductor materials with good thermal conductivity.
  • the material may be silver, titanium, aluminum or stainless steel and other thermally good conductor materials.
  • the crucible body 1 And heat conduction device 2 It is obtained by mechanically removing the material from the same metal rod.
  • the crucible body 1 And heat conduction device 2 Made of metal materials, wherein the crucible body 1 Side wall 12 Of the inner surface relative to the bottom of the crucible 11 Inclined setting, the heat conduction device 2 With the side wall 12 The outer surface of the inner surface that completely fits, the heat conduction device 2 Connected to the side wall by its own gravity 12 On the inner surface.
  • the channel twenty one The number is two or more.
  • the picture 4 Is a schematic cross-sectional structural view of a second embodiment of an evaporation crucible of the present invention.
  • the heat conduction device 2 Has one or more layers through the multiple channels twenty one Hollow structure twenty two ;
  • the hollow structure twenty two As a buffer layer to accommodate part of the evaporation material and make all channels twenty one Connected here.
  • the heat of the evaporation material comes from the heat conduction device with good thermal conductivity around 2 , Evaporation material in the channel twenty one
  • the inside can be fully heated, the channel twenty one
  • the heat transfer distance of the inner vapor deposition material is short, which greatly shortens the lateral transfer path of heat in the non-thermal good conductor, greatly reduces the lateral temperature difference of the vapor deposition material, improves the utilization rate of the vapor deposition material, and reduces the vapor deposition
  • the cracking risk of the material improves the stability of the evaporation rate, which in turn improves OLED Panel quality.
  • the present invention provides an evaporation crucible, including a crucible body and a heat conduction device disposed inside the crucible body, the crucible body includes a crucible bottom and a side wall connected to the crucible bottom, the heat conduction device It is fixedly connected to the side wall, and the heat conduction device is in a honeycomb shape, and has a plurality of channels for accommodating the evaporation material extending in parallel along the axial direction of the crucible body.
  • the evaporation material in the channel The heat transfer distance of the heat is short, and the heat of the evaporation material comes from the heat conduction device with good thermal conductivity around the evaporation material.
  • the evaporation material can be fully heated in the channel, which greatly shortens the transverse transmission path of heat in the non-thermal good conductor, thus The lateral temperature difference of the internal vapor deposition material is greatly reduced, the utilization rate of the vapor deposition material is improved, the cracking risk of the vapor deposition material is reduced, and the stability of the vapor deposition rate is improved, which in turn improves OLED Panel quality.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

一种蒸镀坩埚，包括坩埚本体(1)及设于坩埚本体(1)内部的导热装置(2)，所述坩埚本体(1)包括坩埚底(11)及与所述坩埚底(11)相连的侧壁(12)，所述导热装置(2)固定连接在侧壁(12)上，且所述导热装置(2)呈蜂窝状，具有多条并列沿所述坩埚本体(1)轴向延伸的用于容纳蒸镀材料的通道(21)。该坩埚通道(21)内蒸镀材料的热量横向传递距离短，且蒸镀材料受热的热量来源于四周热传导性好的导热装置(2)，蒸镀材料在通道(21)内可以充分受热，大幅缩短了热量在非热良导体中的横向传递路径，从而大幅缩小了内部蒸镀材料的横向温差，提高了蒸镀材料的利用率，降低了蒸镀材料的裂解风险，提高了蒸镀速率的稳定性，进而提高了OLED面板品质。

Description

蒸镀坩埚 技术领域
本发明涉及显示技术制造领域，尤其涉及一种蒸镀坩埚。
 背景技术
OLED是一种极具发展前景的平板显示技术，它具有十分优异的显示性能，特别是自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，再加上其生产设备投资远小于TFT-LCD，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。目前OLED已处于大规模量产的前夜，随着研究的进一步深入，新技术的不断涌现，OLED显示器件必将有一个突破性的发展。
OLED有机材料的薄膜制备有两种工艺路线。对于高分子OLED材料，采用溶液成膜方式，这种工艺目前还处于试验研究阶段。对于小分子OLED材料，目前普遍采用真空热蒸镀的成膜方式，这种工艺路线被平板显示行业的大多数工厂采用。真空热蒸镀技术是在低于5×10 -5Pa的真空环境下，通过加热的方式使有机小分子材料升华或者熔融气化成蒸气状态，高速运动的气态分子到达玻璃基板并在基板上沉积固化，再变回为OLED材料的固体薄膜。
在蒸镀工艺中，用于产生蒸汽的设备叫做蒸发源，其中点蒸发源（point source）通常采用圆柱形坩埚且加热丝为一体式加热，如图1所示，在真空蒸镀腔中蒸镀时，OLED材料放置于坩埚10中，加热线圈20环绕在坩埚10外壁以对坩埚10内的OLED材料进行加热，当加热到蒸镀温度时，OLED材料汽化，汽化分子从坩埚盖30的出气孔35飞出沉积到基板上形成固态薄膜。如果温度控制不当则会导致坩埚盖30的温度较低，材料的汽化分子会在坩埚盖30上沉积并不断长大，导致坩埚出气孔35堵塞（堵孔），而对于OLED有机材料来说，过热则会导致材料裂解无法使用。
受制于上述加热方式，坩埚10在受热过程中，不仅存在上下段的纵向温差，也存在左右横向温差。上下温差会导致坩埚10底部温度较低，当材料的汽化分子经过坩埚10顶部时，此时坩埚10温度已经超出材料的裂解温度，从而导致器件性能降低，为杜绝此种现象发生通常会将坩埚10底部的材料直接浪费；且OLED有机材料是热的非热良导体，对热量传递效率较低，较长的传播路径影响热量传递效率，在坩埚10底部材料（非热良导体）对热量传递的损失较大，如图2所示，常常会导致坩埚10底部中心材料受热不够，不能完全蒸镀出去而被剩余在坩埚10内。
 技术问题
本发明的目的在于提供一种蒸镀坩埚，可有效缩小内部蒸镀材料的横向温差，降低材料裂解风险，提高蒸镀速率的稳定性，进而提高OLED面板品质。
 技术解决方案
为实现上述目的，本发明提供一种蒸镀坩埚，包括坩埚本体及设于坩埚本体内部的导热装置；
所述坩埚本体包括坩埚底及与所述坩埚底相连的侧壁；
所述导热装置固定连接在侧壁上，且所述导热装置呈蜂窝状，具有多条并列沿所述坩埚本体轴向延伸的用于容纳蒸镀材料的通道。
所述导热装置具有一层或多层贯穿所述多条通道的镂空结构；
所述镂空结构作为缓冲层用于容纳蒸镀材料并使得所有通道在此处相连通。
所述通道的数量为两条或两条以上。
相邻两导热装置上的通道一一对应设置。
所述坩埚本体的材料为银、钛、铝或不锈钢。
所述导热装置的材料为银、钛、铝或不锈钢。
所述导热装置的材料与所述坩埚本体的材料相同。
所述坩埚本体及导热装置由一金属棒经机械加工去除材料得到。
所述侧壁的内表面相对于坩埚底倾斜设置；
所述导热装置具有与所述侧壁内表面完全贴合的外侧表面，所述导热装置通过自身重力卡合连接在所述侧壁的内表面上。
所述蒸镀坩埚还包括设于所述坩埚本体上方的上盖部，所述上盖部的中心设有出气孔。
所述蒸镀坩埚还包括套设在所述坩埚本体外侧用于对蒸镀材料进行加热的加热线圈。
 有益效果
本发明的有益效果：本发明提供的一种蒸镀坩埚，包括坩埚本体及设于坩埚本体内部的导热装置，所述坩埚本体包括坩埚底及与所述坩埚底相连的侧壁，所述导热装置固定连接在侧壁上，且所述导热装置呈蜂窝状，具有多条并列沿所述坩埚本体轴向延伸的用于容纳蒸镀材料的通道，相比于现有技术，通道内蒸镀材料的热量横向传递距离短，且蒸镀材料受热的热量来源于四周热传导性好的导热装置，蒸镀材料在通道内可以充分受热，大幅缩短了热量在非热良导体中的横向传递路径，从而大幅缩小了内部蒸镀材料的横向温差，提高了蒸镀材料的利用率，降低了蒸镀材料的裂解风险，提高了蒸镀速率的稳定性，进而提高了OLED面板品质。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
 附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有一蒸镀坩埚的结构示意图；
图2为现有蒸镀制程中蒸镀坩埚内蒸镀材料的剩余状态示意图；
图3为本发明蒸镀坩埚第一实施例的剖视结构示意图；
图4为本发明蒸镀坩埚第二实施例的剖视结构示意图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图 3 ，为本发明蒸镀坩埚第一实施例的剖视结构示意图，本实施例包括坩埚本体 1 及设于坩埚本体 1 内部的导热装置 2 、设于所述坩埚本体 1 上方的上盖部 3 、套设在所述坩埚本体 1 外侧用于对蒸镀材料进行加热的加热线圈 4 。
所述坩埚本体 1 包括坩埚底 11 及与所述坩埚底 11 相连的侧壁 12 ，所述上盖部 3 的中心设有出气孔 31 。
所述导热装置 2 固定连接在侧壁 12 上，且所述导热装置 2 呈蜂窝状，具有多条并列沿所述坩埚本体 1 轴向延伸的用于容纳蒸镀材料的通道 21 。
蒸镀时，所述加热线圈 4 发出的热量由侧壁 12 外侧传递给与其相连的导热装置 2 ，进而传递给通道 21 内的蒸镀材料，从而缩短了热量在非热良导体中的横向传递路径，进而缩小了内部蒸镀材料的横向温差。
具体地，所述导热装置 2 的材料与所述坩埚本体 1 的材料相同，均为热传导性好的热良导体材料。
进一步地，所述导热装置 2 的材料可以为银、钛、铝或不锈钢等热良导体材料。
具体地，所述坩埚本体 1 及导热装置 2 由同一金属棒经机械加工去除材料得到。
或者，述坩埚本体 1 及导热装置 2 由金属材料分别制成，其中，所述坩埚本体 1 的侧壁 12 的内表面相对于坩埚底 11 倾斜设置，所述导热装置 2 具有与所述侧壁 12 内表面完全贴合的外侧表面，所述导热装置 2 通过自身重力卡合连接在所述侧壁 12 的内表面上。
具体地，所述通道 21 的数量为两条或两条以上。
需要说明的是，上述第一实施例中，所有通道 21 在导热装置 2 中相互不连通设置，那么当某一通道 21 发生堵塞时，在上盖部 3 的出气孔 31 处蒸镀气体的速率则会发生骤降，从而不利于蒸镀制程稳定；或者，在其中某一通道 21 发生堵塞后，随着加热持续进行，该通道 21 内的蒸镀材料汽化膨胀，当其内部压力超过一定限度时蒸镀气体则会冲开该堵塞的通道 21 ，此时必然会导致最上端出气孔 31 处蒸镀气体的速率暴增，这时同样不利于蒸镀制程稳定。
请参阅图 4 ，为本发明蒸镀坩埚第二实施例的剖视结构示意图，本实施例与上述第一实施例相比，其区别在于，所述导热装置 2 具有一层或多层贯穿所述多条通道 21 的镂空结构 22 ；所述镂空结构 22 作为缓冲层用于容纳部分蒸镀材料并使得所有通道 21 在此处相连通。那么，在蒸镀制程中当其中一通道 21 发生堵塞时，所述镂空结构 22 内的蒸镀气体会弥补由所述通道 21 堵塞所导致的最上端出气孔 31 处蒸镀气体的速率损失，从而保证蒸镀速率的稳定，并随着蒸镀制程的持续进行，随着堵塞的通道 21 被冲开，所述镂空结构 22 内较低的气压会对冲该通道 21 内所释放的压力，从而保证最上端出气孔 31 处蒸镀气体的速率不至于骤升，进而保证蒸镀速率的稳定。其他技术特征均与第一实施例相同，在此不再赘述。
本发明的蒸镀坩埚，蒸镀材料受热的热量来源于四周热传导性好的导热装置 2 ，蒸镀材料在通道 21 内可以充分受热，通道 21 内蒸镀材料的热量横向传递距离短，从而大幅缩短了热量在非热良导体中的横向传递路径，大幅缩小了蒸镀材料的横向温差，提高了蒸镀材料的利用率，降低了蒸镀材料的裂解风险，提高了蒸镀速率的稳定性，进而提高了 OLED 面板品质。
综上所述，本发明提供的一种蒸镀坩埚，包括坩埚本体及设于坩埚本体内部的导热装置，所述坩埚本体包括坩埚底及与所述坩埚底相连的侧壁，所述导热装置固定连接在侧壁上，且所述导热装置呈蜂窝状，具有多条并列沿所述坩埚本体轴向延伸的用于容纳蒸镀材料的通道，相比于现有技术，通道内蒸镀材料的热量横向传递距离短，且蒸镀材料受热的热量来源于四周热传导性好的导热装置，蒸镀材料在通道内可以充分受热，大幅缩短了热量在非热良导体中的横向传递路径，从而大幅缩小了内部蒸镀材料的横向温差，提高了蒸镀材料的利用率，降低了蒸镀材料的裂解风险，提高了蒸镀速率的稳定性，进而提高了 OLED 面板品质。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种蒸镀坩埚，包括坩埚本体及设于坩埚本体内部的导热装置；
    所述坩埚本体包括坩埚底及与所述坩埚底相连的侧壁；
    所述导热装置固定连接在侧壁上，且所述导热装置呈蜂窝状，具有多条并列沿所述坩埚本体轴向延伸的用于容纳蒸镀材料的通道。
  2. 如权利要求1所述的蒸镀坩埚，其中，所述导热装置具有一层或多层贯穿所述多条通道的镂空结构；
    所述镂空结构作为缓冲层用于容纳蒸镀材料并使得所有通道在此处相连通。
  3. 如权利要求1所述的蒸镀坩埚，其中，所述通道的数量为两条或两条以上。
  4. 如权利要求1所述的蒸镀坩埚，其中，所述坩埚本体的材料为银、钛、铝或不锈钢。
  5. 如权利要求1所述的蒸镀坩埚，其中，所述导热装置的材料为银、钛、铝或不锈钢。
  6. 如权利要求1所述的蒸镀坩埚，其中，所述导热装置的材料与所述坩埚本体的材料相同。
  7. 如权利要求1所述的蒸镀坩埚，其中，所述坩埚本体及导热装置由一金属棒经机械加工去除材料得到。
  8. 如权利要求1所述的蒸镀坩埚，其中，所述侧壁的内表面相对于坩埚底倾斜设置；
    所述导热装置具有与所述侧壁内表面完全贴合的外侧表面，所述导热装置通过自身重力卡合连接在所述侧壁的内表面上。
  9. 如权利要求1所述的蒸镀坩埚，还包括设于所述坩埚本体上方的上盖部，所述上盖部的中心设有出气孔。
  10. 如权利要求1所述的蒸镀坩埚，还包括套设在所述坩埚本体外侧用于对蒸镀材料进行加热的加热线圈。
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