WO2020113387A1 - 无线通信组件、遥控器及飞行器 - Google Patents

无线通信组件、遥控器及飞行器 Download PDF

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Publication number
WO2020113387A1
WO2020113387A1 PCT/CN2018/118997 CN2018118997W WO2020113387A1 WO 2020113387 A1 WO2020113387 A1 WO 2020113387A1 CN 2018118997 W CN2018118997 W CN 2018118997W WO 2020113387 A1 WO2020113387 A1 WO 2020113387A1
Authority
WO
WIPO (PCT)
Prior art keywords
radio frequency
circuit board
daughter card
wireless communication
main board
Prior art date
Application number
PCT/CN2018/118997
Other languages
English (en)
French (fr)
Inventor
高诗经
袁海滨
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2018/118997 priority Critical patent/WO2020113387A1/zh
Priority to CN201880039270.XA priority patent/CN110999562B/zh
Publication of WO2020113387A1 publication Critical patent/WO2020113387A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64C—AEROPLANES; HELICOPTERS
    • B64C39/00—Aircraft not otherwise provided for
    • B64C39/02—Aircraft not otherwise provided for characterised by special use
    • B64C39/024—Aircraft not otherwise provided for characterised by special use of the remote controlled vehicle type, i.e. RPV
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U2201/00—UAVs characterised by their flight controls
    • B64U2201/20—Remote controls

Definitions

  • This application relates to the technical field of electrical equipment, in particular to a wireless communication component, a remote controller and an aircraft.
  • police will customize the police frequency band, usually using a three-band antenna.
  • the receiving and sending frequencies of the three-band antenna include 840MHz, 1.4GHz and 2.4GHz.
  • Ordinary customers usually use two-band antennas, which include 2.4GHz and 5.8GHz transceiver frequencies. Therefore, in order to meet the different RF requirements of different users, different hardware products have to be designed. Different hardware products often result in different structural layouts and heat dissipation schemes, so more human and material resources need to be invested.
  • the present application provides a wireless communication component, a remote control, and an aircraft.
  • the wireless communication component is replaceable and shares a heat dissipation solution with the remote control and the aircraft.
  • the present application provides a wireless communication component, including:
  • the main board includes a baseband circuit board and a baseband processing unit provided on the baseband circuit board;
  • the radio frequency daughter card includes a radio frequency circuit board and a radio frequency device provided on the radio frequency circuit board for processing radio frequency signals; the radio frequency daughter card and the main board are layered and detachably installed on the main board;
  • the communication connection line both ends are respectively electrically connected with the main board and the radio frequency daughter card;
  • a radiator of the main board used for cooling the main board
  • the surface area of the radio frequency daughter card can be at least partially attached to at least a partial area of the thermally conductive sheet, wherein other areas of the thermally conductive sheet can also be at least partially attached to at least a partial area of the main board, so that The heat of the radio frequency daughter card can be conducted to the main board via the thermal conductive sheet, and the heat can be dissipated by the heat sink of the main board.
  • the present application also provides another wireless communication component, including:
  • the main board includes a baseband circuit board and a baseband processing unit provided on the baseband circuit board;
  • the radio frequency daughter card includes a radio frequency circuit board and a radio frequency device provided on the radio frequency circuit board for processing radio frequency signals; and is detachably installed on the main board;
  • the communication connection line both ends are respectively electrically connected with the main board and the radio frequency daughter card;
  • Heat sink installed on the radio frequency daughter card
  • a radiator of the main board used for cooling the main board
  • the surface area of the radio frequency daughter card is in thermal contact with the heat sink, so that the heat of the radio frequency daughter card can be conducted to the motherboard heat sink component via the heat sink, and the motherboard heat sink component is used for heat dissipation .
  • the present application also provides a remote controller, including:
  • a wireless communication component is provided in the housing, wherein the wireless communication component includes:
  • the main board includes a baseband circuit board and a baseband processing unit provided on the baseband circuit board;
  • the radio frequency daughter card includes a radio frequency circuit board and a radio frequency device provided on the radio frequency circuit board for processing radio frequency signals; the radio frequency daughter card and the main board are layered and detachably installed on the main board;
  • the communication connection line both ends are respectively electrically connected with the main board and the radio frequency daughter card;
  • a radiator of the main board used for cooling the main board
  • the surface area of the radio frequency daughter card can be at least partially attached to at least a partial area of the thermally conductive sheet, wherein other areas of the thermally conductive sheet can also be at least partially attached to at least a partial area of the main board, so that The heat of the radio frequency daughter card can be conducted to the main board via the thermal conductive sheet, and the heat can be dissipated by the heat sink of the main board.
  • the present application also provides an aircraft, including:
  • a wireless communication component is installed in the body, wherein the wireless communication component includes:
  • the main board includes a baseband circuit board and a baseband processing unit provided on the baseband circuit board;
  • the radio frequency daughter card includes a radio frequency circuit board and a radio frequency device provided on the radio frequency circuit board for processing radio frequency signals; and is detachably installed on the main board;
  • the communication connection line both ends are respectively electrically connected with the main board and the radio frequency daughter card;
  • Heat sink installed on the radio frequency daughter card
  • a radiator of the main board used for cooling the main board
  • the surface area of the radio frequency daughter card is in thermal contact with the heat sink, so that the heat of the radio frequency daughter card can be conducted to the motherboard heat sink component via the heat sink, and the motherboard heat sink component is used for heat dissipation .
  • An embodiment of the present application provides a wireless communication component, a remote controller, and an aircraft, wherein the wireless communication component includes a radio frequency daughter card and a main board, and the radio frequency daughter card is detachably installed on the main board and passes through a heat conductive sheet or a heat sink.
  • the heat sink of the motherboard completes the heat dissipation of the RF daughter card. Therefore, by replacing the RF daughter card, the same hardware product can be customized to meet different RF segment requirements. At the same time, the RF daughter card and the motherboard share heat dissipation, which simplifies the product design layout and further reduces the product R&D investment cost.
  • FIG. 1 is a schematic plan view of a wireless communication component provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a radio frequency daughter card provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a radio frequency daughter card provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a first shield cover provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a second shield cover provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a graphite sheet provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a motherboard provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an explosion structure of a wireless communication component provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a protection member provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another wireless communication component provided by an embodiment of the present application.
  • FIG. 11 is another schematic structural diagram of a motherboard provided by an embodiment of the present application.
  • FIG. 12 is another schematic structural diagram of a radio frequency daughter card provided by an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a remote controller provided by an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of an aircraft provided by an embodiment of the present application.
  • Wireless communication component 10. Motherboard; 11. Baseband circuit board; 110, through-hole portion; 111, baseband processing unit; 112, image processing unit; 12, motherboard heat sink; 121, first heat dissipation structure; 122, first Two heat dissipation structure; 123, fan; 13, protective cover; 14, protective shell; 141, card slot; 142, tuyere; 15, connection port; 151, USB port; 152, HDMI port; 153, CAN port; 154:, MICRO_USB port; 155, SDI port; 16, support frame;
  • 200 remote control; 201, housing; 20, radio frequency daughter card; 21, radio frequency circuit board; 210, fixed structure; 2100, positioning hole; 211, first setting area; 212, second setting area; 22, shielding cover 220, vent hole; 221, first shielding cover; 2210, heat sink; 2211, fixed seat; 2212, housing cover; 222, second shielding cover; 2220, cover body;
  • thermo conductive sheet 41, graphite sheet; 411, insulating layer; 412, graphite layer; 413, copper foil layer; 400, mounting hole;
  • a component when referred to as being “fixed” to another component, it can be directly on the other component or there can also be a centered component.
  • a component When a component is considered to be “connected” to another component, it can be directly connected to another component or there can be centered components at the same time.
  • an element When an element is referred to as “electrically connecting” another element, it can be directly on another component or there can be a centered element.
  • an element is considered to be “electrically connected” to another element, it may be a contact connection, for example, a wire connection, or a contactless connection, for example, a contactless coupling.
  • all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention.
  • An embodiment of the present disclosure provides a circuit board component, such as a wireless communication component, a power management component, and an image processing component, which is suitable for electronic devices, such as a remote controller, an unmanned aerial vehicle, etc.
  • the wireless communication component can communicate with the electronic device.
  • the circuit board assembly includes a main board, a radio frequency daughter card, a thermally conductive sheet, a heat sink of the main board, and a communication cable.
  • the radio frequency daughter card is stacked on the main board, the heat conducting sheet is laid flat on the main board and the radio frequency daughter card, part of the heat conducting sheet contacts the main board, and other parts of the heat conducting sheet contact the radio frequency daughter card, thereby the radio frequency daughter card.
  • the heat can be conducted to the motherboard through the heat conduction sheet and dissipated by the radiator of the motherboard.
  • the circuit board assembly includes a main board, a radio frequency daughter card, a heat sink, a heat sink of the main board, and a communication cable.
  • the radio frequency daughter card is stacked on the main board, and the side of the radio frequency daughter card is provided with a heat sink, and a part of the heat sink is in contact with the main board, so that the heat of the radio frequency daughter card can be conducted to the main board through the heat conducting sheet and dissipate heat through the main board
  • the device dissipates heat.
  • the circuit board assembly includes a main board, a radio frequency daughter card, and a communication cable.
  • the main board is provided with a connection port and an installation area for installing a radio frequency daughter card, so that the radio frequency daughter card is detachably installed on the main board.
  • the installation area is set in an area away from the connection port of the main board, thereby reducing electromagnetic interference. Both ends of the communication cable are electrically connected to the main board and the radio frequency daughter card to achieve communication.
  • FIG. 1 is a schematic plan view of a wireless communication component provided by an embodiment of the present application.
  • the wireless communication component is installed in the electronic device, and is used for the electronic devices to complete wireless communication with each other.
  • the electronic device may specifically be a remote controller, etc.
  • the remote controller communicates with the aircraft to control the flight of the aircraft.
  • the wireless communication component 100 includes a main board 10, a radio frequency daughter card 20, a communication cable 30 and a thermal conductive sheet 40.
  • the main board 10 includes a baseband circuit board 11 and a baseband processing unit 111 provided on the baseband circuit board 11.
  • the baseband circuit board 11 is a printed circuit board.
  • the baseband processing unit 111 includes a baseband chip for completing signal processing and electronic components of related circuits.
  • the main board 10 may of course include other circuit units, such as image processing for image processing Unit 112.
  • the radio frequency daughter card 20 includes a radio frequency circuit board 21 and a radio frequency device provided on the radio frequency circuit board 21.
  • the radio frequency daughter card 20 is used to process radio frequency signals.
  • the radio frequency daughter card 20 and the motherboard 10 are stacked and detachably installed on the motherboard 10 to facilitate the replacement of the radio frequency daughter card 10 with different frequency bands, so that the same electronic device can be customized with different frequency bands without changing the hardware layout Electronics.
  • the radio frequency daughter card 20 includes a two-band radio frequency daughter card or a three-band radio frequency daughter card.
  • the transceiver frequency of the two-band radio frequency daughter card includes 2.4GHz and 5.8GHz; the transceiver frequency of the three-band radio frequency daughter card includes 840MHz, 1.4GHz and 2.4GHz.
  • the stacking of the RF sub-card 20 and the main board 10 means that the RF circuit board 21 of the RF sub-card 20 is installed on the baseband circuit board 11 of the main board 10 to realize the stacking of the RF sub-card 20 and the main board 10, thereby reducing the two The thickness between.
  • the communication connection line 30 is electrically connected to the motherboard 10 and the radio frequency daughter card 20 at both ends, and is used to implement communication between the motherboard 10 and the radio frequency daughter card 20.
  • the communication cable 30 is electrically connected to the main board 10 and the radio frequency daughter card 20, and may include: at least one end of the communication cable 30 is provided with a connector for detachable connection with the main board 10 or the radio frequency daughter card 20; or, the main board 10 and the radio frequency daughter card 20 are provided with connectors, and the communication cable 30 is connected to the connector to realize the communication between the main board 10 and the radio frequency daughter card 20; or alternatively, the main board 10 and the radio frequency daughter card 20 are provided with a connector At one end of the communication cable 30 is provided with a connector, thereby achieving communication between the main board 10 and the radio frequency daughter card 20.
  • the thermal conductive sheet 40 is tiled on the main board 10 and the radio frequency daughter card 20 to realize thermally conductive connection between the thermal conductive sheet 40 and the radio frequency daughter card 20 and the main board 10.
  • the thermally conductive connection includes direct contact connection or indirect contact connection,
  • the motherboard heat sink 12 is used to dissipate heat to the motherboard 10, specifically to dissipate heat to the electronic components on the motherboard 10.
  • the heat sink 12 of the main board may be provided on the main board 10, or may be provided at another location, such as a housing of an electronic device, so as to dissipate heat from the main board 10.
  • the surface area of the radio frequency daughter card 20 can be at least partially attached to at least a partial area of the thermal conductive sheet 40, and the other areas of the thermal conductive sheet 40 can also be at least partially adhered to at least a partial area of the motherboard 10, so that the radio frequency daughter card 20
  • the heat can be conducted to the motherboard 10 via the thermal conductive sheet 40 and be dissipated by the motherboard heat sink 12.
  • the radio frequency daughter card 10 and the motherboard 20 share the motherboard heat sink 12 for heat dissipation.
  • FIG. 2 and FIG. 3 are schematic structural diagrams of a radio frequency daughter card provided by an embodiment of the present application.
  • the radio frequency daughter card is used to be detachably installed on the main board to form a wireless communication component, so that the communication component can customize different radio frequency bands for different users, thereby meeting user needs.
  • the radio frequency daughter card 20 includes a radio frequency circuit board 21, a radio frequency device and a fixed structure provided on the radio frequency circuit board 21.
  • the radio frequency daughter card 20 is used for processing radio frequency signals; the fixed structure is provided on the radio frequency circuit board 21 for detachably installing the radio frequency circuit board on the main board.
  • the fixing structure includes at least one of the following: a mounting hole, a buckle, and a slot.
  • the fixing structure is specifically a mounting hole 400, and the RF daughter card 20 is detachably mounted on the main board 10 through the mounting hole 400 using screws, and a stacked arrangement is implemented to reduce the space.
  • the number of mounting holes 400 is three, two mounting holes 400 are provided at one end of the radio frequency circuit board 21, and the other mounting hole 400 is provided at the other end of the radio frequency circuit board 21.
  • other numbers of mounting holes can also be provided.
  • the radio frequency daughter card 20 further includes a connector 31.
  • the connector 31 is a connector for electrically connecting with the communication cable 30.
  • the connecting member 31 is disposed between the two mounting holes 400, so that the protective member is installed to protect the communication connection line 30.
  • the radio frequency circuit board 21 includes a first setting area 211 and a second setting area 212.
  • the first setting area 211 is used to set some electronic components of the radio frequency daughter card 20, for example, to realize radio frequency-related electronic components;
  • the second setting area 212 is spaced apart from the first setting area 211, and the interval setting is specific It is a predetermined distance apart to prevent mutual interference with each other, thereby improving signal quality.
  • the second setting area 212 is used to set a part of the electronic components of the radio frequency daughter card 20, and the part of the electronic components are related components that implement the clock function.
  • the calorific value of the electronic components in the first installation area 211 is greater than the calorific value of the electronic components in the second installation area 212.
  • the surface area of the first setting area 211 of the radio frequency daughter card 20 can be at least partially attached to at least a portion of the thermal conductive sheet 40 to preferentially dissipate heat for components that generate a large amount of heat.
  • the radio frequency daughter card 20 further includes a shielding cover 22 that is disposed on the radio frequency circuit board 21 and is used to shield the electronic components of the radio frequency daughter card 20 to prevent interference signals.
  • the shield 22 includes a first shield 221 and a second shield 222.
  • the first shield 221 is disposed in the first setting area 211 for covering the first setting area 211 Electronic components; the second shield 222 is disposed in the second setting area 212, and is used to cover the electronic components in the second setting area 212. This realizes that the electronic components of the radio frequency daughter card 20 will not be interfered with each other.
  • the shield 22 may further include other shields, such as a third shield 223, which is disposed on the other side of the radio frequency circuit board 21.
  • the other side of the RF circuit board 21 may also have the same structure as the side including the first shield 221 and the second shield 222, that is, the structure of the two sides of the RF daughter card 20 is the same, but the electronic components provided are different. .
  • the first shield cover 221 can be at least partially attached to at least a part of the surface of the thermal conductive sheet 40 to achieve heat dissipation for the electronic components soldered in the first installation area 211.
  • the first shield cover 221 includes a fixing seat 2211 and a housing cover 2212.
  • the fixing seat 2211 is disposed on the circuit board corresponding to the first setting area 211, specifically soldered on the circuit board;
  • the housing cover 2212 is installed on the fixing seat 2211 to cover the electronic components in the first setting area 211. This facilitates the installation of the shield and achieves anti-interference.
  • the housing cover 2212 is installed on the fixing base 2211 in a snap-fit manner to facilitate disassembly and maintenance, and of course, other methods may also be used.
  • At least one heat dissipation groove 2210 is provided on the first shield 221, and the heat dissipation groove is a stamped groove, and the position where the first shield 221 is disposed corresponds to the heating element on the RF circuit board 21.
  • the bottom of the heat sink 2210 is closer to the heating element, so that the heat conduction is better.
  • the inside of the first shielding case and the heating element on the radio frequency circuit board 21 are filled with thermally conductive adhesive. Since the thermally conductive adhesive between the bottom of the heat sink 2210 and the heating device is relatively thin, the thermal conductivity is better.
  • the second shielding cover 222 is a cover body, and the cover body is welded on the circuit board corresponding to the second setting area 212.
  • the cover body is welded on the circuit board, multiple second setting areas 212 are sealed, In order to completely prevent the electronic components provided with the second shield 222 from interfering with the electronic components in the first shield 221.
  • the shielding case 22 is provided with a vent hole 220, which is used to balance the internal and external air pressure of the shielding case.
  • the second shielding cover 222 is provided with a vent 220.
  • the vent 220 is used to balance the inside and outside Air pressure.
  • the thermal conductive sheet 40 includes one or several combinations of copper foil sheet, aluminum foil sheet, alloy sheet or graphite sheet, etc., used to conduct the heat of the radio frequency daughter card 20 to the main board 10 and dissipate heat by means of the main board heat sink device 12.
  • the thermal conductive sheet 40 includes a graphite sheet 41.
  • the graphite sheet 41 includes an insulating layer 411, a graphite layer 412, and a copper foil layer 413 that are stacked, and the graphite layer 412 is located between the insulating layer 411 and the copper foil layer 413.
  • the graphite sheet 41 is pasted on at least part of the first surface area of the radio frequency daughter card 20, specifically, the copper foil layer 413 of the graphite sheet 41 is pasted on at least part of the first surface area of the radio frequency daughter card 20. Specifically, the graphite sheet 41 is pasted on at least a part of the first surface area of the radio frequency daughter card 20 through a conductive adhesive.
  • the conductive adhesive is a high-temperature conductive adhesive.
  • FIG. 7 is a schematic structural diagram of a motherboard provided by an embodiment of the present application.
  • the motherboard 10 includes a baseband circuit board 11 and a baseband processing unit 111 and an image processing unit 112 provided on the baseband circuit board 11.
  • the baseband circuit board 11 is a printed circuit board, and the baseband processing unit 111 includes a baseband chip for completing signal processing and electronic components of related circuits.
  • the main board 10 further includes a protective cover 13 that is disposed on the baseband circuit board 11 to cover the electronic components of the baseband processing unit 111.
  • the number of the protective cover 13 may be plural, which is used to mask the baseband processing unit 111 and other processing units, for example, to mask the electronic components in the image processing unit 112.
  • the motherboard heat sink 12 is provided on the protective cover 13.
  • the motherboard heat sink 12 specifically includes heat dissipation fins. According to the amount of heat generated by the electronic components in the protective cover 13, different numbers of heat dissipation fins are provided. For example, the heat dissipation fins on the protective cover 13 corresponding to the image processing unit 112 are provided more than the heat dissipation fins on the protective cover 13 corresponding to the baseband processing unit 111.
  • the motherboard heat sink 12 further includes a fan 123, the air outlet of the fan 123 is opposed to the heat dissipation fins to speed up the heat dissipation of the heat dissipation fins; specifically, the fan 123 is an axial fan.
  • the wireless communication assembly 100 further includes a protective case 14, and the main board 10 is detachably installed in the protective case 14, and the protective case 14 is used to be installed in an electronic device.
  • the protective case 14 is provided with a card slot 141, and the protective case 14 is further provided with an air vent 142.
  • the main board 10 is installed in the protective case 14 through the card slot 141.
  • the air inlet of the fan 123 is opposite to the air vent 142.
  • the main board 10 further includes a connection port 15.
  • the connection port 15 is provided on the baseband circuit board 11 for electrically connecting with external devices.
  • the connection port 15 is located close to the graphics processing unit 112.
  • connection port 15 includes a USB port 151, an HDMI port 152, a CAN port 153, a MICRO_USB port 154, and an SDI port 155.
  • the main board 10 is provided with an installation area for installing the radio frequency daughter card 20, and the installation area is provided in an area away from the connection port 15 of the main board 10. In order to avoid signal interference of the connection port 15, the quality of the radio frequency signal is improved.
  • a through hole portion 110 is opened in the installation area, and the shape of the through hole portion 110 matches the shape of the radio frequency daughter card 10 to accommodate the radio frequency daughter card 10, specifically the radio frequency daughter card 10 Part of the electronic components, which in turn saves space, making the wireless communication components more thin and light.
  • the communication connection wire 30 includes a flexible circuit board or a flexible flat cable, wherein the flexible circuit board is a flexible printed circuit (FPC) line, and both ends of the flexible circuit board (FPC) line include contact terminals for setting on the main board 10 and/or
  • the upper connecting piece 31 of the radio frequency daughter card 20 is electrically connected, specifically, the detachable connection is realized by means of a plug connection.
  • the connecting member 31 is a connector.
  • the wireless communication component 100 further includes a protection member 32.
  • the protection member 32 is disposed on the main board 10 and/or the radio frequency daughter card 20, and is used to protect the communication cable 30 and the connection member 31.
  • the protection member 32 is provided with a through-hole 320, and the shape of the through-hole 320 matches the shape of the connecting member 31, for example, all have a rectangular parallelepiped structure. Furthermore, the protection of the communication cable 30 and the connector 31 is achieved. Specifically, the protection member 32 is a tabletting member.
  • the radio frequency daughter card is detachably installed on the main board, and the heat of the radio frequency daughter card is conducted to the main board through the thermal conductive sheet, and the heat dissipation of the radio frequency daughter card is completed by means of the heat sink of the main board. Therefore, by replacing the RF daughter card, the same hardware product can be customized to meet different RF segment requirements. At the same time, the RF daughter card and the motherboard share a heat sink, which simplifies the product design layout and further reduces the product R&D investment cost.
  • FIG. 10 is a schematic structural diagram of a wireless communication component provided by another embodiment of the present application
  • FIG. 11 is a structural schematic diagram of a motherboard provided by an embodiment of the present application
  • FIG. 12 is provided by an embodiment of the present application.
  • the wireless communication component is installed in an electronic device, and is used for the electronic devices to complete wireless communication with each other.
  • the electronic device may specifically be an aircraft, etc.
  • the aircraft establishes communication with a remote controller and flies under the control of the remote controller.
  • the aircraft includes a drone, which can be a rotor-type drone, such as a four-rotor drone, a six-rotor drone, an eight-rotor drone, or a fixed-wing drone.
  • a rotor-type drone such as a four-rotor drone, a six-rotor drone, an eight-rotor drone, or a fixed-wing drone.
  • the wireless communication component 100 includes a main board 10, a radio frequency daughter card 20, a communication cable 30 and a heat sink 40.
  • the main board 10 includes a baseband circuit board 11 and a baseband processing unit 111 provided on the baseband circuit board 11.
  • the baseband circuit board 11 is a printed circuit board, and the baseband processing unit includes a baseband chip for completing signal processing and electronic components of related circuits.
  • the baseband circuit board 11 may also include other circuit processing units.
  • the radio frequency daughter card 20 in this embodiment adopts the radio frequency daughter card provided in FIG. 2 and FIG. 3 described above, and the structure is completely the same.
  • the radio frequency daughter card 20 includes a radio frequency circuit board 21 and a radio frequency circuit board 21 provided on the radio frequency circuit board 21
  • the radio frequency device and the radio frequency daughter card 20 are used to process radio frequency signals.
  • the radio frequency daughter card is detachably installed on the main board 10, for example, through the installation hole to facilitate the replacement of the radio frequency daughter card 10 with different frequency bands, thereby achieving the same electronic device without changing the hardware layout, can be customized with different Electronic products in the frequency band.
  • the radio frequency daughter card 20 includes a two-band radio frequency daughter card or a three-band radio frequency daughter card.
  • the transceiver frequency of the two-band radio frequency daughter card includes 2.4GHz and 5.8GHz; the transceiver frequency of the three-band radio frequency daughter card includes 840MHz, 1.4GHz and 2.4GHz.
  • the communication connection line 30 is electrically connected to the motherboard 10 and the radio frequency daughter card 20 at both ends, and is used to implement communication between the motherboard 10 and the radio frequency daughter card 20.
  • the communication connection line 30 may use a flexible printed circuit (Flexible Printed Circuit, FPC) or a flexible cable.
  • FPC Flexible Printed Circuit
  • the communication connection line 30 is electrically connected to the main board 10 and the radio frequency daughter card 20, and may include: at least one end of the communication connection line 30 is provided with a connector for detachable connection with the main board 10 or the radio frequency daughter card 20; or, the main board 10 and The radio frequency daughter card 20 is provided with a connector, and the communication cable 30 is connected to the connector to achieve communication between the main board 10 and the radio frequency daughter card 20; or alternatively, the main board 10 and the radio frequency daughter card 20 are provided with a connector on one of them to communicate A connector is provided at one end of the connecting line 30 to further realize communication between the main board 10 and the radio frequency daughter card 20.
  • the heat sink 50 is mounted on the radio frequency daughter card 20 and is at least partially thermally conductively connected to the surface area of the radio frequency daughter card 20.
  • the thermally conductive connection includes direct contact connection or indirect contact connection.
  • the motherboard heat sink 12 is used to dissipate heat to the motherboard 10, specifically to dissipate heat to the electronic components on the motherboard 10.
  • the heat sink 12 of the main board may be provided on the main board 10, or may be provided at another location, such as a housing of an electronic device, so as to dissipate heat from the main board 10.
  • the surface area of the radio frequency daughter card 20 is in thermal contact with the heat sink 50, so that the heat of the radio frequency daughter card 20 can be conducted to the motherboard heat sink 12 via the heat sink 50 and dissipated by the motherboard heat sink 12.
  • the radio frequency daughter card 10 is detachably installed on the motherboard 20 and shares the motherboard heat sink 12 with the motherboard 20 for heat dissipation.
  • the heat sink 50 includes a first heat sink 51 and a second heat sink 52; the two sides of the RF daughter card 20 can be attached to the first heat sink 51 and the second heat sink, respectively 52. Furthermore, the first heat sink 51 and the second heat sink 52 dissipate heat to the radio frequency daughter card 20.
  • first heat sink 51 and the second heat sink 52 are installed on both sides of the radio frequency circuit board of the radio frequency daughter card 20 through the mounting holes 400. Both the first heat sink 51 and the second heat sink 52 are heat dissipation fins.
  • the RF circuit board 21 of the RF daughter card 20 is provided with positioning holes 2100, the first heat sink 51 and the second heat sink 52 are provided with positioning posts 501, and the positioning hole 2100 on the RF circuit board 21 Used in conjunction with the positioning post 501 to pre-fix the RF circuit board 21.
  • the RF circuit board 21 is provided with positioning posts, the first heat sink 51 and the second heat sink 52 are provided with positioning holes, and the positioning posts are used in conjunction with the positioning holes to pre-fix the RF circuit board 21; or, the radio frequency
  • the circuit board 21, the first heat sink 51 and the second heat sink 52 are respectively provided with positioning holes and positioning posts, which can be used in conjunction with the positioning posts to pre-fix the radio frequency circuit board 21.
  • the main board 10 further includes a protective cover 13 that is disposed on the baseband circuit board 11 to cover the electronic components of the baseband processing unit.
  • the wireless communication assembly 100 further includes a support frame 16 for supporting the motherboard 10; wherein the motherboard heat sink component 12 is disposed on the support frame 16.
  • the support frame 16 includes a fixing post 161, and a mounting hole is provided on the baseband circuit board 11, and the main board 10 is installed on the support frame 16 through the cooperation of the fixing post 161 and the mounting hole.
  • the motherboard heat sink 12 includes a first heat dissipation structure 121 and a second heat dissipation structure 122.
  • the first heat dissipation structure 121 and the second heat dissipation structure 122 are both disposed on the support frame 16, and the first heat dissipation structure 121 and the second heat dissipation structure 122 are both heat dissipation fins.
  • the second heat dissipation structure 122 thermally contacts the electronic components of the main board 10 and faces the heat sink 50 so that the heat of the RF daughter card 20 is transferred to the heat sink 12 of the main board, thereby achieving common heat dissipation.
  • the shield 22 of the RF daughter card 20 is provided with at least one heat dissipation groove 2210.
  • the heat dissipation groove 2210 is a stamped groove, and the position of the shield 22 is corresponding to the heating element on the RF circuit board 21, so that heat dissipation The bottom of the groove 2210 is closer to the heating element, making the heat conduction better.
  • the first heat sink 51 and the second heat sink 52 are each provided with a convex block 502, and the first heat sink 51 and the second heat sink 52 are installed on the radio frequency When the daughter card 20 is on, the protruding block 502 is in contact with the bottom of the heat sink 2210, thereby improving the heat dissipation effect.
  • the radio frequency daughter card is detachably installed on the main board, and the heat of the radio frequency daughter card is conducted to the main board through the heat sink, and the heat dissipation of the radio frequency daughter card is completed by means of the motherboard heat sink. Therefore, by replacing the RF daughter card, the same hardware product can be customized to meet different RF segment requirements. At the same time, the RF daughter card and the motherboard share the heat dissipation solution, which simplifies the product design layout and further reduces the product R&D investment cost.
  • FIG. 13 is a schematic structural diagram of a remote controller according to an embodiment of the present application.
  • the remote controller establishes a wireless communication connection with the aircraft, in particular, establishes a communication connection through a wireless communication component, and is used to control the aircraft to fly.
  • the remote controller 200 includes a housing 201 and a wireless communication component provided in the housing 201; wherein, the wireless communication component is any kind of wireless provided by the embodiments corresponding to the above-mentioned FIG. 1 to FIG. 8 Communication components.
  • FIG. 14 is a schematic structural diagram of an aircraft according to an embodiment of the present application.
  • the aircraft establishes a communication connection with a remote controller, specifically, establishes a communication connection through a wireless communication component to fly under the control of the remote controller.
  • the aircraft includes a drone, which can be a rotor-type drone, such as a four-rotor drone, a six-rotor drone, an eight-rotor drone, or a fixed-wing drone.
  • the aircraft 300 includes a fuselage 301 and a wireless communication component provided in the fuselage 301; wherein the wireless communication component is any one of the wireless communication components provided in the embodiments corresponding to FIG. 10 to FIG. 12 described above.
  • radio frequency daughter card 20 in the remote controller 200 and the aircraft 300 can be used interchangeably, that is, the radio frequency daughter card 20 in the remote controller 200 can be installed on the aircraft 300 for use.

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Abstract

无线通信组件、遥控器及飞行器，包括主板(10)、射频子卡(20)、通信连接线(30)、导热片(40)和主板散热器件(12)。射频子卡(20)可拆卸地安装在主板(10)上，射频子卡(20)设有导热片(40)，导热片(40)与主板(10)相接触，射频子卡(20)的热量由导热片(40)传导至主板(10)，借助主板散热器件(12)散热。

Description

无线通信组件、遥控器及飞行器 技术领域
本申请涉及电气设备技术领域，尤其涉及一种无线通信组件、遥控器及飞行器。
背景技术
在通信设备行业中，存在一些特殊用户，这些用户往往有各种定制化射频的需求，比如：警察会定制警用频段，通常使用三频天线，三频天线的收发频率包括840MHz、1.4GHz和2.4GHz。而普通客户通常是使用二频天线，二频天线的收发频率包括2.4GHz和5.8GHz。因此，为了满足不同的用户对射频的不同要求，就要设计不同的硬件产品，不同的硬件产品往往导致结构布局和散热方案的不同，因此需要投入更多的人力和物力。
发明内容
有鉴于此，本申请提供了一种无线通信组件、遥控器及飞行器，该无线通信组件可更换，并且与遥控器和飞行器共用散热方案。
第一方面，本申请提供了一种无线通信组件，包括：
主板，包括基带电路板以及设于所述基带电路板上的基带处理单元；
射频子卡，包括射频电路板以及设于所述射频电路板上的射频器件，用于处理射频信号；所述射频子卡与所述主板层叠设置，且可拆卸地安装在所述主板上；
通信连接线，两端分别与所述主板以及所述射频子卡电连接；
导热片，平铺在所述主板以及所述射频子卡上；以及
主板散热器件，用于给所述主板散热；
其中，所述射频子卡的表面区域能够至少部分贴合于所述导热片的至少部分区域，其中所述导热片的其他区域还能够至少部分贴合于所述主板的至少部分区域，从而所述射频子卡的热量能够经由所述导热片传导至所述主板，并借助所述主板散热器件进行散热。
第二方面，本申请还提供了另一种无线通信组件，包括：
主板，包括基带电路板以及设于所述基带电路板上的基带处理单元；
射频子卡，包括射频电路板以及设于所述射频电路板上的射频器件，用于处理射频信号；且可拆卸地安装在所述主板上；
通信连接线，两端分别与所述主板以及所述射频子卡电连接；
散热片，安装在所述射频子卡上；以及
主板散热器件，用于给所述主板散热；
其中，所述射频子卡的表面区域与所述散热片导热性接触，使得所述射频子卡的热量能够经由所述散热片传导至所述主板散热器件，并借助所述主板散热器件进行散热。
第三方面，本申请还提供了一种遥控器，包括：
壳体；
无线通信组件，设置所述壳体内，其中所述无线通信组件包括：
主板，包括基带电路板以及设于所述基带电路板上的基带处理单元；
射频子卡，包括射频电路板以及设于所述射频电路板上的射频器件，用于处理射频信号；所述射频子卡与所述主板层叠设置，且可拆卸地安装在所述主板上；
通信连接线，两端分别与所述主板以及所述射频子卡电连接；
导热片，平铺在所述主板以及所述射频子卡上；以及
主板散热器件，用于给所述主板散热；
其中，所述射频子卡的表面区域能够至少部分贴合于所述导热片的至少部分区域，其中所述导热片的其他区域还能够至少部分贴合于所述主板的至少部分区域，从而所述射频子卡的热量能够经由所述导热片传导至所述主板，并借助所述主板散热器件进行散热。
第四方面，本申请还提供了一种飞行器，包括：
机身；
无线通信组件，安装在所述机身内，其中所述无线通信组件包括:
主板，包括基带电路板以及设于所述基带电路板上的基带处理单元；
射频子卡，包括射频电路板以及设于所述射频电路板上的射频器件，用于处理射频信号；且可拆卸地安装在所述主板上；
通信连接线，两端分别与所述主板以及所述射频子卡电连接；
散热片，安装在所述射频子卡上；以及
主板散热器件，用于给所述主板散热；
其中，所述射频子卡的表面区域与所述散热片导热性接触，使得所述射频子卡的热量能够经由所述散热片传导至所述主板散热器件，并借助所述主板散热器件进行散热。
本申请实施例提供了一种无线通信组件、遥控器及飞行器，其中所述无线通信组件包括射频子卡和主板，射频子卡可拆卸地安装在主板上，并通过导热片或散热片，借助主板散热器件完成对射频子卡的散热。由此，通过更换射频子卡实现了相同的硬件产品定制不同的射频段需求，同时射频子卡和主板共用散热，简化了产品设计布局，进而降低产品的研发投入成本。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本申请。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一实施例提供的无线通信组件的平面结构示意图；
图2是本申请一实施例提供的射频子卡的结构示意图；
图3是本申请一实施例提供的射频子卡的结构示意图；
图4是本申请一实施例提供的第一屏蔽罩的结构示意图；
图5是本申请一实施例提供的第二屏蔽罩的结构示意图；
图6是本申请一实施例提供的石墨片的结构示意图；
图7是本申请一实施例提供的主板的结构示意图；
图8是本申请一实施例提供的无线通信组件的爆炸结构示意图；
图9是本申请一实施例提供的保护件的结构示意图；
图10是本申请一实施例提供的另一种无线通信组件的结构示意图；
图11是本申请一实施例提供的主板的另一结构示意图；
图12是本申请一实施例提供的射频子卡的另一结构示意图；
图13是本申请一实施例提供的遥控器的结构示意图；
图14是本申请一实施例提供的飞行器的结构示意图；
主要元件及符号说明：
100、无线通信组件；10、主板；11、基带电路板；110、通孔部；111、基带处理单元；112、图像处理单元；12、主板散热器件；121、第一散热结构；122、第二散热结构；123、风扇；13、保护罩；14、保护壳；141、卡槽；142、风口；15、连接端口；151、USB端口；152、HDMI端口；153、CAN端口；154:、MICRO_USB端口；155、SDI端口；16、支撑架；
200、遥控器；201、壳体；20、射频子卡；21、射频电路板；210、固定结构；2100、定位孔；211、第一设置区；212、第二设置区；22、屏蔽罩；220、通气孔；221、第一屏蔽罩；2210、散热槽；2211、固定座；2212、壳体罩；222、第二屏蔽罩；2220、罩体；
300、飞行器；301、机身；30、通信连接线；31、连接件；32、保护件；320、通孔；
40、导热片；41、石墨片；411、绝缘层；412、石墨层；413、铜箔层；400、安装孔；
50、散热片；51、第一散热片；52、第二散热片；501、定位柱；502、凸起块。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
还应当理解，在此本申请说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本申请。如在本申请说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个” 及“该”意在包括复数形式。
还应当进一步理解，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。当一个元件被称为“电连接”另一个元件，它可以直接在另一个组件上或者也可以存在居中的元件。当一个元件被认为是“电连接”另一个元件，它可以是接触连接，例如，可以是导线连接的方式，也可以是非接触式连接，例如，可以是非接触式耦合的方式。除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。
本公开实施例提供一种电路板组件，如无线通信组件、电源管理组件、图像处理组件，适用于电子设备，如遥控器、无人飞行器等，该无线通信组件可以与电子设备进行通信。
在一个实施例中，该电路板组件包括主板、射频子卡、导热片、主板散热器件以及通信连接线。所述射频子卡与所述主板层叠设置，导热片平铺在主板以及射频子卡上，导热片的部分区域与主板相接触，导热片的其他部分区域与射频子卡相接触，从而射频子卡的热量能够经由导热片传导至主板，并借助主板散热器件进行散热。
在一个实施例中，该电路板组件包括主板、射频子卡、散热片、主板散热器件以及通信连接线。所述射频子卡与所述主板层叠设置，射频子卡的侧面设有散热片，散热片的部分区域与主板相接触，从而射频子卡的热量能够经由导热片传导至主板，并借助主板散热器件进行散热。
在一个实施例中，该电路板组件包括主板、射频子卡以及通信连接线。主板上设有连接端口，还设有用于安装射频子卡的安装区，从而射频子卡可拆卸地安装在所述主板上。安装区设置在远离所述主板的连接端口的区域内，从而减小电磁干扰。通信连接线的两端分别与主板以及射频子卡电连接，以实现通信。
下面，以无线通信组件为例，对本申请实施例进行示例性说明。请参阅图 1，图1是本申请一实施例提供的无线通信组件的平面结构示意图。其中，该无线通信组件安装在电子设备中，用于电子设备彼此之间完成无线通信，该电子设备具体可以是遥控器等，该遥控器与飞行器通信以控制飞行器飞行。
如图1所示，无线通信组件100包括主板10、射频子卡20、通信连接线30和导热片40。主板10包括基带电路板11以及设于基带电路板11上的基带处理单元111。该基带电路板11为印刷式电路板，基带处理单元111包括用于完成信号处理的基带芯片以及相关电路的电子元器件，主板10当然还可包括其他电路单元，比如用于图像处理的图像处理单元112。
射频子卡20包括射频电路板21以及设于射频电路板21上的射频器件，射频子卡20用于处理射频信号。其中，射频子卡20与主板10层叠设置，且可拆卸地安装在主板10上，以方便更换具有不同频段的射频子卡10，实现同一电子设备无需改变硬件布局，即可定制化具有不同频段的电子产品。
在一实施例中，射频子卡20包括二频射频子卡或三频射频子卡。其中，二频射频子卡的收发频率包括2.4GHz和5.8GHz；三频射频子卡的收发频率包括840MHz、1.4GHz和2.4GHz。
其中，射频子卡20与主板10层叠设置，是指射频子卡20的射频电路板21安装在主板10的基带电路板11上，实现射频子卡20和主板10的层叠设置，进而缩小两者之间的厚度。
通信连接线30，两端分别与主板10以及射频子卡20电连接，用于实现主板10和射频子卡20之间通信。
其中，通信连接线30与主板10以及射频子卡20电连接，可包括：通信连接线30中的至少一端设有连接器，用于与主板10或射频子卡20可拆卸连接；或者，主板10和射频子卡20上设有连接器，通信连接线30连接在连接器上以实现主板10以及射频子卡20的通信；再或者，主板10和射频子卡20其一上设有连接器，通信连接线30的一端设有连接器，进而实现主板10以及射频子卡20的通信。
导热片40平铺在主板10以及射频子卡20上，以实现导热片40与射频子卡20以及主板10之间导热性连接。该导热性连接包括直接接触连接，或者间接接触连接，
主板散热器件12用于给主板10散热，具体是用于给主板10上的电子元器 件散热。该主板散热器件12可以设在主板10上，也可以设在其他位置，比如设在电子设备的壳体上，实现对主板10散热即可。
其中，射频子卡20的表面区域能够至少部分贴合于导热片40的至少部分区域，其中导热片40的其他区域还能够至少部分贴合于主板10的至少部分区域，从而射频子卡20的热量能够经由导热片40传导至主板10，并借助主板散热器件12进行散热。由此，实现射频子卡10和主板20共用主板散热器件12进行散热。
如图2和图3所示，图2和图3是本申请一实施例提供的射频子卡的结构示意图。其中该射频子卡用于可拆卸地安装在主板上以组成无线通信组件，使得通信组件可针对不同的用户定制不同的射频频段，进而满足用户的需求。
射频子卡20包括射频电路板21以及设于射频电路板21上的射频器件和固定结构。射频子卡20用于处理射频信号；固定结构设置在射频电路板21用于将所述射频电路板可拆卸地安装在所述主板上。其中，所述固定结构包括以下至少一种：安装孔、卡扣、卡槽。
比如，如图2所示，固定结构具体为安装孔400，使用螺钉通过该安装孔400将射频子卡20可拆卸地安装在主板10，并实现层叠设置以缩小空间。在本实施例中，安装孔400的数量为三个，两个安装孔400设置在射频电路板21的一端，另一个安装孔400设置在射频电路板21的另一端。当然，也可以设置其他数量的安装孔。
具体地，如图3所示，射频子卡20还包括连接件31，该连接件31为连接器，用于与通信连接线30电性连接。其中，连接件31设置在两个安装孔400之间，以便安装保护件对通信连接线30进行保护。
在一实施例中，如图2所示，射频电路板21包括第一设置区211和第二设置区212。其中，第一设置区211用于设置射频子卡20的部分电子元器件，比如，用于实现射频相关的电子元器件；第二设置区212与第一设置区211间隔设置，该间隔设置具体是间隔预设距离以防止彼此相互干扰，进而提高信号质量，第二设置区212用于设置射频子卡20的部分电子元器件，该部分电子元器件为实现时钟功能的相关元器件。
在一实施例中，第一设置区211中的电子元器件的发热量大于第二设置区212中的电子元器件的发热量。其中，射频子卡20的第一设置区211的表面区 域能够至少部分贴合于导热片40的至少部分区域，以优先为发热量较大的元器件进行散热。
其中，射频子卡20还包括屏蔽罩22，该屏蔽罩22设置在射频电路板21上，用于遮罩射频子卡20的电子元器件，以防止干扰信号。
在一实施例中，如图3所示，屏蔽罩22包括：第一屏蔽罩221和第二屏蔽罩222，第一屏蔽罩221设置在第一设置区211用于遮罩第一设置区211的电子元器件；第二屏蔽罩222设置在第二设置区212，用于遮罩第二设置区212的电子元器件。由此实现了，射频子卡20的电子元器件彼此不会被干扰。
其中，屏蔽罩22还可包括其他屏蔽罩，比如第三屏蔽罩223，设置在射频电路板21的另一侧面。当然射频电路板21的另一侧面也可以采用与包括第一屏蔽罩221和第二屏蔽罩222的一侧面相同的结构，即射频子卡20的两面结构相同，只是设置的电子元器件不同而已。
具体地，第一屏蔽罩221能够至少部分贴合于导热片40表面的至少部分区域，以实现对焊接在第一设置区211内电子元器件进行散热。
在一实施例中，如图4所示，第一屏蔽罩221包括固定座2211和壳体罩2212。其中，固定座2211设置在第一设置区211对应的电路板上，具体是焊接在电路板上；壳体罩2212安装在固定座2211上以遮罩第一设置区211的电子元器件。由此实现方便屏蔽罩的安装，并实现了抗干扰。
具体地，壳体罩2212以卡扣的方式安装在固定座2211，以方便拆卸检修，当然也可以采用其他方式。
在一实施例中，第一屏蔽罩221上设置有至少一个散热槽2210，该散热槽为冲压凹槽，其在第一屏蔽罩221的设置位置与射频电路板21上的发热元件相对应，使得散热槽2210的槽底更接近发热元件，使得导热更好。
其中，在第一屏蔽罩的内侧与射频电路板21上的发热元件之间填充有导热胶，由于散热槽2210的槽底与发热器件之间的导热胶相对较薄，因此导热性更好。
在一实施例中，第二屏蔽罩222为罩体，该罩体焊接在第二设置区212对应的电路板上，当罩体焊接在电路板上时实现多第二设置区212的密封，以彻底避免设置第二屏蔽罩222的电子元器件干扰到第一屏蔽罩221内的电子元器件。
其中，屏蔽罩22上设有通气孔220，通气孔220用于平衡所述屏蔽罩的内外气压。比如，如图5所示，第二屏蔽罩222上设有通气孔220，在射频子卡20工作时，第二屏蔽罩222会产生热量造成罩体内压强较大，通气孔220用于平衡内外气压。
其中，导热片40包括铜箔片、铝箔片、合金片或石墨片的一种或几种组合等，用于将射频子卡20的热量传导至主板10上，借助主板散热器件12进行散热。
在一实施例中，如图6所示，导热片40包括石墨片41。石墨片41包括层叠设置的绝缘层411、石墨层412和铜箔层413，石墨层412位于绝缘层411和铜箔层413之间。
其中，石墨片41粘贴在射频子卡20的第一表面区域的至少部分区域上，具体是石墨片41的铜箔层413粘贴在射频子卡20的第一表面区域的至少部分区域上。具体地，石墨片41通过导电背胶粘贴在射频子卡20的第一表面区域的至少部分区域上。导电背胶为高温导电背胶。
如图7所示，图7是本申请一实施例提供的主板的结构示意图。该主板应用无线通信组件中，主板10包括基带电路板11以及设于基带电路板11上的基带处理单元111和图像处理单元112。
其中，基带电路板11为印刷式电路板，基带处理单元111包括用于完成信号处理的基带芯片以及相关电路的电子元器件。主板10还包括保护罩13，保护罩13设置在基带电路板11上，以遮罩基带处理单元111的电子元器件。当然，保护罩13数量可以多个，用于遮罩基带处理单元111和其他处理单元，比如，用于遮罩图像处理单元112中的电子元器件。
其中，主板散热器件12设置保护罩13上。主板散热器件12具体包括散热鳍片。根据保护罩13内的电子元器件的发热量大小，设置不同数量的散热鳍片。比如，设置图像处理单元112对应的保护罩13上的散热鳍片多于设置基带处理单元111对应的保护罩13上的散热鳍片。
在一实施例中，主板散热器件12还包括风扇123，风扇123的出风口与散热鳍片相对以加快散热鳍片的散热；具体地，风扇123为轴流风扇。
如图8所示，无线通信组件100还包括保护壳14，主板10可拆卸地安装在保护壳14内，保护壳14用于安装在电子设备中。其中，保护壳14内设有卡 槽141，保护壳14上还设有风口142，主板10通过卡槽141安装在保护壳14内，风扇123的进风口与风口142相对。
其中，如图7所示，主板10还包括连接端口15，连接端口15设置基带电路板11上，用于与外部设备电连接。其中，连接端口15靠近图形处理单元112设置。
具体地，如图7所示，连接端口15包括USB端口151、HDMI端口152、CAN端口153、MICRO_USB端口154和SDI端口155。
在一实施例中，主板10设有用于安装射频子卡20的安装区，所述安装区设置在远离主板10的连接端口15的区域内。以避免连接端口15的信号干扰，由此提高射频信号的质量。
具体地，如图7所示，所述安装区内开设有通孔部110，通孔部110的形状与射频子卡10的形状相匹配以收纳射频子卡10，具体是收纳射频子卡10的部分电子元器件，进而节省空间，使得无线通信组件更为轻薄化。
具体地，通信连接线30包括柔性电路板或软排线，其中，柔性电路板为柔性电路板(Flexible Printed Circuit，FPC)线，其两端包括接触端子，用于设置在主板10和/或射频子卡20的上连接件31电性连接，具体地是才采用插拔连接的方式实现可拆卸连接。其中，连接件31为连接器。
在一实施例中，如图7所示，无线通信组件100还包括保护件32，保护件32设置主板10和/或射频子卡20上，用于保护通信连接线30和连接件31。
在一实施例中，如图9所示，保护件32上设有通孔320，通孔320的形状与连接件31的形状相匹配，比如均为长方体结构。进而实现保护通信连接线30和连接件31。具体地，保护件32为压片件。
上述实施例的无线通信组件，其射频子卡可拆卸地安装在主板上，通过导热片将射频子卡的热量传导至主板，并借助主板散热器件完成对射频子卡的散热。由此通过更换射频子卡实现了相同的硬件产品定制不同的射频段需求，同时射频子卡和主板共用散热器件，简化了产品设计布局，进而降低产品的研发投入成本。
请参阅图10至图12，图10是本申请另一实施例提供的无线通信组件的结构示意图；图11是本申请一实施例提供的主板的结构示意图；图12是本申请一实施例提供的射频子卡的结构示意图。其中，该无线通信组件安装在电子设 备中，用于电子设备彼此之间完成无线通信，该电子设备具体可以是飞行器等，该飞行器与遥控器建立通信，并在遥控器的控制作用下飞行。
其中，飞行器包括无人机，该无人机可以使旋翼型无人机，例如四旋翼无人机、六旋翼无人机、八旋翼无人机，也可以是固定翼无人机。
如图10所示，无线通信组件100包括主板10、射频子卡20、通信连接线30和散热片40。主板10包括基带电路板11以及设于基带电路板11上的基带处理单元111。
如图11所示，基带电路板11为印刷式电路板，基带处理单元包括用于完成信号处理的基带芯片以及相关电路的电子元器件。当然，基带电路板11上还可以包括其他电路处理单元。
需要说明的是，本实施例中的射频子卡20采用上述图2和图3提供的射频子卡，其结构完全相同，射频子卡20包括射频电路板21以及设于射频电路板21上的射频器件，射频子卡20用于处理射频信号。
其中，射频子卡可拆卸地安装在主板10上，比如通过安装孔进行安装，以方便更换具有不同频段的射频子卡10，进而实现了同一电子设备无需改变硬件布局，即可定制化具有不同频段的电子产品。
其中，射频子卡20包括二频射频子卡或三频射频子卡。二频射频子卡的收发频率包括2.4GHz和5.8GHz；三频射频子卡的收发频率包括840MHz、1.4GHz和2.4GHz。
通信连接线30，两端分别与主板10以及射频子卡20电连接，用于实现主板10和射频子卡20之间通信。通信连接线30可以采用柔性电路板(Flexible Printed Circuit，FPC)或软排线。
通信连接线30与主板10以及射频子卡20电连接，可包括：通信连接线30中的至少一端设有连接器，用于与主板10或射频子卡20可拆卸连接；或者，主板10和射频子卡20上设有连接器，通信连接线30连接在连接器上以实现主板10以及射频子卡20的通信；再或者，主板10和射频子卡20其一上设有连接器，通信连接线30的一端设有连接器，进而实现主板10以及射频子卡20的通信。
散热片50安装在射频子卡20上，并与射频子卡20的表面区域中的至少部分导热性连接，该导热性连接包括直接接触连接，或者间接接触连接。
主板散热器件12用于给主板10散热，具体是用于给主板10上的电子元器件散热。该主板散热器件12可以设在主板10上，也可以设在其他位置，比如设在电子设备的壳体上，实现对主板10散热即可。
其中，射频子卡20的表面区域与散热片50导热性接触，使得射频子卡20的热量能够经由散热片50传导至主板散热器件12，并借助主板散热器件12进行散热。由此，实现射频子卡10可拆卸地安装在主板20上，并与主板20共用主板散热器件12进行散热。
在一实施例中，如图12所示，其中散热片50包括第一散热片51和第二散热片52；射频子卡20的两侧面能够分别贴合第一散热片51和第二散热片52。进而由第一散热片51和第二散热片52对射频子卡20进行散热。
具体地，第一散热片51和第二散热片52是通过安装孔400安装在射频子卡20的射频电路板两侧面上。第一散热片51和第二散热片52均为散热鳍片。
在一实施例中，射频子卡20的射频电路板21上设有定位孔2100，第一散热片51和第二散热片52上均设有定位柱501，射频电路板21上的定位孔2100和定位柱501配合使用以预固定射频电路板21。或者，射频电路板21上设有定位柱，第一散热片51和第二散热片52设有定位孔，所述定位柱和所述定位孔配合使用以预固定射频电路板21；或者，射频电路板21、第一散热片51和第二散热片52都分别设有定位孔和定位柱，所述定位孔能够与定位柱配合使用以预固定射频电路板21。
如图11所示，主板10还包括保护罩13，保护罩13设置在基带电路板11上，以遮罩所述基带处理单元的电子元器件。
在一实施例中，如图11所示，无线通信组件100还包括支撑架16，支撑架16用于承载主板10；其中，主板散热器件12设置在支撑架16上。
具体地，支撑架16包括固定柱161，基带电路板11上设有安装孔，通过固定柱161与安装孔的配合将主板10安装在支撑架16上。
在一实施例中，如图11所示，主板散热器件12包括第一散热结构121和第二散热结构122。第一散热结构121和第二散热结构122均设置在支撑架16上，第一散热结构121和第二散热结构122均为散热鳍片。其中，第二散热结构122与主板10的电子元器件导热性接触，并与散热片50相对以便射频子卡20上的热量传导至主板散热器件12上，进而实现共用散热。
其中，射频子卡20的屏蔽罩22上设置有至少一个散热槽2210，该散热槽2210为冲压凹槽，其在屏蔽罩22的设置位置与射频电路板21上的发热元件相对应，使得散热槽2210的槽底更接近发热元件，使得导热更好。为了进一步地提高散热效果，在本实施例中，在第一散热片51和第二散热片52中均设置有凸起块502，在在第一散热片51和第二散热片52安装在射频子卡20上时凸起块502与散热槽2210的槽底抵接，进而提高散热效果。
上述实施例的无线通信组件，其射频子卡可拆卸地安装在主板上，通过散热片将射频子卡的热量传导至主板，并借助主板散热器件完成对射频子卡的散热。由此通过更换射频子卡实现了相同的硬件产品定制不同的射频段需求，同时射频子卡和主板共用散热方案，简化了产品设计布局，进而降低产品的研发投入成本。
请参阅图13，图13是本申请一实施例提供的遥控器的结构示意图。该遥控器与飞行器建立无线通信连接，具体是通过无线通信组件建立通信连接，用于控制该飞行器飞行。其中，如图13所示，遥控器200包括壳体201和设置在壳体201内的无线通信组件；其中，该无线通信组件为上述图1至图8对应的实施例提供的任意一种无线通信组件。
请参阅图14，图14是本申请一实施例提供的飞行器的结构示意图。该飞行器与遥控器建立通信连接，具体是通过无线通信组件建立通信连接，以在该遥控器的控制下进行飞行。其中，飞行器包括无人机，该无人机可以使旋翼型无人机，例如四旋翼无人机、六旋翼无人机、八旋翼无人机，也可以是固定翼无人机。
如图14所示，飞行器300包括机身301和设置机身301内的无线通信组件；其中，该无线通信组件为上述图10至图12对应的实施例提供的任意一种无线通信组件。
需要说明的是，遥控器200和飞行器300中的射频子卡20是可以互换使用的，即可将遥控器200中的射频子卡20安装在飞行器300上使用。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (134)

  1. 一种无线通信组件，其特征在于，包括：
    主板，包括基带电路板以及设于所述基带电路板上的基带处理单元；
    射频子卡，包括射频电路板以及设于所述射频电路板上的射频器件，用于处理射频信号；所述射频子卡与所述主板层叠设置，且可拆卸地安装在所述主板上；
    通信连接线，两端分别与所述主板以及所述射频子卡电连接；
    导热片，平铺在所述主板以及所述射频子卡上；以及
    主板散热器件，用于给所述主板散热；
    其中，所述射频子卡的表面区域能够至少部分贴合于所述导热片的至少部分区域，其中所述导热片的其他区域还能够至少部分贴合于所述主板的至少部分区域，从而所述射频子卡的热量能够经由所述导热片传导至所述主板，并借助所述主板散热器件进行散热。
  2. 根据权利要求1所述的无线通信组件，其特征在于，所述射频子卡包括二频射频子卡或三频射频子卡。
  3. 根据权利要求1或2所述的无线通信组件，其特征在于，所述射频子卡还包括：
    固定结构，设置在所述射频电路板，用于将所述射频电路板可拆卸地安装在所述主板上。
  4. 根据权利要求3所述的无线通信组件，其特征在于，所述固定结构包括以下至少一种：安装孔、卡扣、卡槽。
  5. 根据权利要求1所述的无线通信组件，其特征在于，所述射频电路板包括：
    第一设置区，用于设置所述射频子卡的部分电子元器件；
    第二设置区，与所述第一设置区间隔设置，用于设置所述射频子卡的部分电子元器件。
  6. 根据权利要求5所述的无线通信组件，其特征在于，所述第一设置区中的电子元器件的发热量大于所述第二设置区中的电子元器件的发热量。
  7. 根据权利要求5所述的无线通信组件，其特征在于，所述第一设置区中的电子元器件为实现射频功能的相关元器件，和/或，所述第二设置区中的电子元器件为实现时钟功能的相关元器件。
  8. 根据权利要求5至7任一项所述的无线通信组件，其特征在于，所述射频子卡还包括：
    屏蔽罩，设置在所述射频电路板上，用于遮罩所述射频子卡的电子元器件。
  9. 根据权利要求8所述的无线通信组件，其特征在于，所述屏蔽罩包括：
    第一屏蔽罩，设置在所述第一设置区，用于遮罩所述第一设置区的电子元器件；
    第二屏蔽罩，设置在所述第二设置区，用于遮罩所述第二设置区的电子元器件。
  10. 根据权利要求9所述的无线通信组件，其特征在于，所述第一屏蔽罩能够至少部分贴合于所述导热片表面的至少部分区域。
  11. 根据权利要求9或10所述的无线通信组件，其特征在于，所述第一屏蔽罩包括：
    固定座，设置在所述第一设置区对应的电路板上；
    壳体罩，安装在所述固定座上以遮罩所述第一设置区的电子元器件。
  12. 根据权利要求11所述的无线通信组件，其特征在于，所述固定座焊接在所述第一设置区对应的电路板上。
  13. 根据权利要求11所述的无线通信组件，其特征在于，所述壳体罩以卡扣的方式安装在所述固定座上。
  14. 根据权利要求9所述的无线通信组件，其特征在于，所述第二屏蔽罩为罩体，所述罩体焊接在所述第二设置区对应的电路板上。
  15. 根据权利要求8所述的无线通信组件，其特征在于，所述屏蔽罩上设有通气孔，所述通气孔用于平衡所述屏蔽罩的内外气压。
  16. 根据权利要求1所述的无线通信组件，其特征在于，所述导热片包括石墨片。
  17. 根据权利要求16所述的无线通信组件，其特征在于，所述石墨片包括层叠设置的绝缘层、石墨层和铜箔层，所述石墨层位于所述绝缘层和铜箔层之间。
  18. 根据权利要求16所述的无线通信组件，其特征在于，所述石墨片粘贴在所述射频子卡的第一表面区域的至少部分区域上。
  19. 根据权利要求18所述的无线通信组件，其特征在于，所述石墨片通过导电背胶粘贴在所述射频子卡的第一表面区域的至少部分区域上。
  20. 根据权利要求1所述的无线通信组件，其特征在于，所述主板还包括：
    保护罩，设置在所述基带电路板上，以遮罩所述基带处理单元的电子元器件。
  21. 根据权利要求20所述的无线通信组件，其特征在于，所述主板散热器件设置所述保护罩上。
  22. 根据权利要求21所述的无线通信组件，其特征在于，所述主板散热器件包括散热鳍片。
  23. 根据权利要求22所述的无线通信组件，其特征在于，所述主板散热器件还包括风扇，所述风扇的出风口与所述散热鳍片相对以加快散热鳍片的散热。
  24. 根据权利要求23所述的无线通信组件，其特征在于，所述风扇为轴流风扇。
  25. 根据权利要求23或24所述的无线通信组件，其特征在于，还包括保护壳，所述主板可拆卸地安装在所述保护壳内。
  26. 根据权利要求25所述的无线通信组件，其特征在于，所述保护壳设有卡槽，所述主板通过所述卡槽安装在所述保护壳内。
  27. 根据权利要求25所述的无线通信组件，其特征在于，所述保护壳上开设有风口，所述风口与所述风扇的进风口相对。
  28. 根据权利要求20所述的无线通信组件，其特征在于，所述主板还包括：
    图像处理单元，设于所述基带电路板上，其中所述图形处理单元和基带处理单元设置在所述基带电路板的不同区域。
  29. 根据权利要求28所述的无线通信组件，其特征在于，所述保护罩的数量为至少两个，设置在所述基带电路板上，分别用于遮罩所述基带处理单元的电子元器件和所述图形处理单元的电子元器件。
  30. 根据权利要求28所述的无线通信组件，其特征在于，所述主板包括：
    连接端口，设置所述基带电路板上，用于与外部设备电连接；其中，所述连接端口靠近所述图形处理单元设置。
  31. 根据权利要求30所述的无线通信组件，其特征在于，所述连接端口包括USB端口、HDMI端口、CAN端口、MICRO_USB端口和SDI端口。
  32. 根据权利要求1所述的无线通信组件，其特征在于，所述主板设有用于安装所述射频子卡的安装区，所述安装区设置在远离所述主板的连接端口的区域内。
  33. 根据权利要求32所述的无线通信组件，其特征在于，所述安装区内开设有通孔部，所述通孔部的形状与所述射频子卡的形状相匹配以收纳所述射频子卡。
  34. 根据权利要求1所述的无线通信组件，其特征在于，所述通信连接线包括柔性电路板或软排线。
  35. 根据权利要求1所述的无线通信组件，其特征在于，还包括：
    连接件，设置在所述射频电路板上，用于实现所述射频子卡与所述主板的电性连接。
  36. 根据权利要求1所述的无线通信组件，其特征在于，还包括：
    保护件，设置所述主板或射频子卡上，用于保护所述通信连接线的连接器。
  37. 根据权利要求35所述的无线通信组件，其特征在于，所述保护件上设有通孔，所述通孔的形状与所述连接件的形状相匹配。
  38. 根据权利要求35或36所述的无线通信组件，其特征在于，所述保护件为压片件。
  39. 一种无线通信组件，其特征在于，包括：
    主板，包括基带电路板以及设于所述基带电路板上的基带处理单元；
    射频子卡，包括射频电路板以及设于所述射频电路板上的射频器件，用于处理射频信号；且可拆卸地安装在所述主板上；
    通信连接线，两端分别与所述主板以及所述射频子卡电连接；
    散热片，安装在所述射频子卡上；以及
    主板散热器件，用于给所述主板散热；
    其中，所述射频子卡的表面区域与所述散热片导热性接触，使得所述射频子卡的热量能够经由所述散热片传导至所述主板散热器件，并借助所述主板散热器件进行散热。
  40. 根据权利要求38所述的无线通信组件，其特征在于，所述散热片包括 第一散热片和第二散热片；所述射频子卡的两侧面能够分别贴合所述第一散热片和第二散热片。
  41. 根据权利要求39所述的无线通信组件，其特征在于，所述第一散热片和第二散热片通过安装孔安装在所述电路板的两侧面上。
  42. 根据权利要求39或40所述的无线通信组件，其特征在于，所述第一散热片和第二散热片均为散热鳍片。
  43. 根据权利要求41所述的无线通信组件，其特征在于，所述射频电路板上设有定位孔，所述第一散热片和第二散热片设有定位柱，所述定位孔和所述定位柱配合使用以预固定所述射频电路板；
    或者，所述射频电路板上设有定位柱，所述第一散热片和第二散热片设有定位孔，所述定位柱和所述定位孔配合使用以预固定所述射频电路板；
    或者，所述射频电路板、所述第一散热片和第二散热片都分别设有定位孔和定位柱，所述定位孔能够与定位柱配合使用以预固定所述射频电路板。
  44. 根据权利要求38所述的无线通信组件，其特征在于，所述射频子卡包括二频射频子卡或三频射频子卡。
  45. 根据权利要求38所述的无线通信组件，其特征在于，所述射频子卡还包括：
    固定结构，设置在所述射频电路板，用于将所述射频电路板可拆卸地安装在所述主板上。
  46. 根据权利要求44所述的无线通信组件，其特征在于，所述固定结构包括以下至少一种：安装孔、卡扣、卡槽。
  47. 根据权利要求38所述的无线通信组件，其特征在于，所述射频电路板包括：
    第一设置区，用于设置所述射频子卡的部分电子元器件；
    第二设置区，与所述第一设置区间隔设置，用于设置所述射频子卡的部分电子元器件。
  48. 根据权利要求46所述的无线通信组件，其特征在于，所述第一设置区中的电子元器件的发热量大于所述第二设置区中的电子元器件的发热量。
  49. 根据权利要求46所述的无线通信组件，其特征在于，所述第一设置区中的电子元器件为实现射频功能的相关元器件，和/或，所述第二设置区中的电 子元器件为实现时钟功能的相关元器件。
  50. 根据权利要求46至48任一项所述的无线通信组件，其特征在于，所述射频子卡还包括：
    屏蔽罩，设置在所述射频电路板上，用于遮罩所述射频子卡的电子元器件。
  51. 根据权利要求49所述的无线通信组件，其特征在于，所述屏蔽罩包括：
    第一屏蔽罩，设置在所述第一设置区，用于遮罩所述第一设置区的电子元器件；
    第二屏蔽罩，设置在所述第二设置区，用于遮罩所述第二设置区的电子元器件。
  52. 根据权利要求50所述的无线通信组件，其特征在于，所述第一屏蔽罩能够至少部分贴合于所述散热片表面的至少部分区域。
  53. 根据权利要求50或51所述的无线通信组件，其特征在于，所述第一屏蔽罩包括：
    固定座，设置在所述第一设置区对应的电路板上；
    壳体罩，安装在所述固定座上以遮罩所述第一设置区的电子元器件。
  54. 根据权利要求52所述的无线通信组件，其特征在于，所述固定座焊接在所述第一设置区对应的电路板上。
  55. 根据权利要求52所述的无线通信组件，其特征在于，所述壳体罩以卡扣的方式安装在所述固定座上。
  56. 根据权利要求50所述的无线通信组件，其特征在于，所述第二屏蔽罩为罩体，所述罩体焊接在所述第二设置区对应的电路板上。
  57. 根据权利要求55所述的无线通信组件，其特征在于，所述屏蔽罩上设有通气孔，所述通气孔用于平衡所述屏蔽罩的内外气压。
  58. 根据权利要求38所述的无线通信组件，其特征在于，所述主板还包括：
    保护罩，设置在所述基带电路板上，以遮罩所述基带处理单元的电子元器件。
  59. 根据权利要求57所述的无线通信组件，其特征在于，还包括：
    支撑架，用于承载所述主板；所述主板散热器件设置在所述支撑架上。
  60. 根据权利要求58所述的无线通信组件，其特征在于，所述主板散热器件包括第一散热结构和第二散热结构。
  61. 根据权利要求59所述的无线通信组件，其特征在于，所述第一散热结构和所述第二散热结构均设置在所述支撑架上，所述第二散热结构与所述主板的电子元器件导热性接触。
  62. 根据权利要求59或60所述的无线通信组件，其特征在于，所述第一散热结构和第二散热结构均为散热鳍片。
  63. 根据权利要求38所述的无线通信组件，其特征在于，所述通信连接线包括柔性电路板或软排线。
  64. 根据权利要求38所述的无线通信组件，其特征在于，还包括：
    连接件，设置在所述射频电路板上，用于实现所述射频子卡与所述主板的电性连接。
  65. 根据权利要求38所述的无线通信组件，其特征在于，还包括：
    保护件，设置所述主板或射频子卡上，用于保护所述通信连接线的连接器。
  66. 根据权利要求64所述的无线通信组件，其特征在于，所述保护件上设有通孔，所述通孔的形状与所述连接件的形状相匹配。
  67. 根据权利要求64或65所述的无线通信组件，其特征在于，所述保护件为压片件。
  68. 一种遥控器，其特征在于，包括：
    壳体；
    无线通信组件，设置所述壳体内，其中所述无线通信组件包括：
    主板，包括基带电路板以及设于所述基带电路板上的基带处理单元；
    射频子卡，包括射频电路板以及设于所述射频电路板上的射频器件，用于处理射频信号；所述射频子卡与所述主板层叠设置，且可拆卸地安装在所述主板上；
    通信连接线，两端分别与所述主板以及所述射频子卡电连接；
    导热片，平铺在所述主板以及所述射频子卡上；以及
    主板散热器件，用于给所述主板散热；
    其中，所述射频子卡的表面区域能够至少部分贴合于所述导热片的至少部分区域，其中所述导热片的其他区域还能够至少部分贴合于所述主板的至少部分区域，从而所述射频子卡的热量能够经由所述导热片传导至所述主板，并借助所述主板散热器件进行散热。
  69. 根据权利要求67所述的遥控器，其特征在于，所述射频子卡包括二频射频子卡或三频射频子卡。
  70. 根据权利要求67或68所述的遥控器，其特征在于，所述射频子卡还包括：
    固定结构，设置在所述射频电路板，用于将所述射频电路板可拆卸地安装在所述主板上。
  71. 根据权利要求69所述的遥控器，其特征在于，所述固定结构包括以下至少一种：安装孔、卡扣、卡槽。
  72. 根据权利要求67所述的遥控器，其特征在于，所述射频电路板包括：
    第一设置区，用于设置所述射频子卡的部分电子元器件；
    第二设置区，与所述第一设置区间隔设置，用于设置所述射频子卡的部分电子元器件。
  73. 根据权利要求71所述的遥控器，其特征在于，所述第一设置区中的电子元器件的发热量大于所述第二设置区中的电子元器件的发热量。
  74. 根据权利要求71所述的遥控器，其特征在于，所述第一设置区中的电子元器件为实现射频功能的相关元器件，和/或，所述第二设置区中的电子元器件为实现时钟功能的相关元器件。
  75. 根据权利要求71至73任一项所述的遥控器，其特征在于，所述射频子卡还包括：
    屏蔽罩，设置在所述射频电路板上，用于遮罩所述射频子卡的电子元器件。
  76. 根据权利要求74所述的遥控器，其特征在于，所述屏蔽罩包括：
    第一屏蔽罩，设置在所述第一设置区，用于遮罩所述第一设置区的电子元器件；
    第二屏蔽罩，设置在所述第二设置区，用于遮罩所述第二设置区的电子元器件。
  77. 根据权利要求75所述的遥控器，其特征在于，所述第一屏蔽罩能够至少部分贴合于所述导热片表面的至少部分区域。
  78. 根据权利要求75或76所述的遥控器，其特征在于，所述第一屏蔽罩包括：
    固定座，设置在所述第一设置区对应的电路板上；
    壳体罩，安装在所述固定座上以遮罩所述第一设置区的电子元器件。
  79. 根据权利要求77所述的遥控器，其特征在于，所述固定座焊接在所述第一设置区对应的电路板上。
  80. 根据权利要求77所述的遥控器，其特征在于，所述壳体罩以卡扣的方式安装在所述固定座上。
  81. 根据权利要求75所述的遥控器，其特征在于，所述第二屏蔽罩为罩体，所述罩体焊接在所述第二设置区对应的电路板上。
  82. 根据权利要求74所述的遥控器，其特征在于，所述屏蔽罩上设有通气孔，所述通气孔用于平衡所述屏蔽罩的内外气压。
  83. 根据权利要求67所述的遥控器，其特征在于，所述导热片包括石墨片。
  84. 根据权利要求82所述的遥控器，其特征在于，所述石墨片包括层叠设置的绝缘层、石墨层和铜箔层，所述石墨层位于所述绝缘层和铜箔层之间。
  85. 根据权利要求82所述的遥控器，其特征在于，所述石墨片粘贴在所述射频子卡的第一表面区域的至少部分区域上。
  86. 根据权利要求84所述的遥控器，其特征在于，所述石墨片通过导电背胶粘贴在所述射频子卡的第一表面区域的至少部分区域上。
  87. 根据权利要求67所述的遥控器，其特征在于，所述主板还包括：
    保护罩，设置在所述基带电路板上，以遮罩所述基带处理单元的电子元器件。
  88. 根据权利要求86所述的遥控器，其特征在于，所述主板散热器件设置所述保护罩上。
  89. 根据权利要求87所述的遥控器，其特征在于，所述主板散热器件包括散热鳍片。
  90. 根据权利要求88所述的遥控器，其特征在于，所述主板散热器件还包括风扇，所述风扇的出风口与所述散热鳍片相对以加快散热鳍片的散热。
  91. 根据权利要求89所述的遥控器，其特征在于，所述风扇为轴流风扇。
  92. 根据权利要求89或90所述的遥控器，其特征在于，还包括保护壳，所述主板可拆卸地安装在所述保护壳内。
  93. 根据权利要求91所述的遥控器，其特征在于，所述保护壳设有卡槽，所述主板通过所述卡槽安装在所述保护壳内。
  94. 根据权利要求91所述的遥控器，其特征在于，所述保护壳上开设有风口，所述风口与所述风扇的进风口相对。
  95. 根据权利要求86所述的遥控器，其特征在于，所述主板还包括：
    图像处理单元，设于所述基带电路板上，其中所述图形处理单元和基带处理单元设置在所述基带电路板的不同区域。
  96. 根据权利要求94所述的遥控器，其特征在于，所述保护罩的数量为至少两个，设置在所述基带电路板上，分别用于遮罩所述基带处理单元的电子元器件和所述图形处理单元的电子元器件。
  97. 根据权利要求94所述的遥控器，其特征在于，所述主板包括：
    连接端口，设置所述基带电路板上，用于与外部设备电连接；其中，所述连接端口靠近所述图形处理单元设置。
  98. 根据权利要求96所述的遥控器，其特征在于，所述连接端口包括USB端口、HDMI端口、CAN端口、MICRO_USB端口和SDI端口。
  99. 根据权利要求67所述的遥控器，其特征在于，所述主板设有用于安装所述射频子卡的安装区，所述安装区设置在远离所述主板的连接端口的区域内。
  100. 根据权利要求98所述的遥控器，其特征在于，所述安装区内开设有通孔部，所述通孔部的形状与所述射频子卡的形状相匹配以收纳所述射频子卡。
  101. 根据权利要求67所述的遥控器，其特征在于，所述通信连接线包括柔性电路板或软排线。
  102. 根据权利要求67所述的遥控器，其特征在于，还包括：
    连接件，设置在所述射频电路板上，用于实现所述射频子卡与所述主板的电性连接。
  103. 根据权利要求67所述的遥控器，其特征在于，还包括：
    保护件，设置所述主板或射频子卡上，用于保护所述通信连接线的连接器。
  104. 根据权利要求102所述的遥控器，其特征在于，所述保护件上设有通孔，所述通孔的形状与所述连接件的形状相匹配。
  105. 根据权利要求102或103所述的遥控器，其特征在于，所述保护件为压片件。
  106. 一种飞行器，其特征在于，包括:
    机身；
    无线通信组件，安装在所述机身内，其中所述无线通信组件包括：
    主板，包括基带电路板以及设于所述基带电路板上的基带处理单元；
    射频子卡，包括射频电路板以及设于所述射频电路板上的射频器件，用于处理射频信号；且可拆卸地安装在所述主板上；
    通信连接线，两端分别与所述主板以及所述射频子卡电连接；
    散热片，安装在所述射频子卡上；以及
    主板散热器件，用于给所述主板散热；
    其中，所述射频子卡的表面区域与所述散热片导热性接触，使得所述射频子卡的热量能够经由所述散热片传导至所述主板散热器件，并借助所述主板散热器件进行散热。
  107. 根据权利要求105所述的飞行器，其特征在于，所述散热片包括第一散热片和第二散热片；所述射频子卡的两侧面能够分别贴合所述第一散热片和第二散热片。
  108. 根据权利要求106所述的飞行器，其特征在于，所述第一散热片和第二散热片通过安装孔安装在所述电路板的两侧面上。
  109. 根据权利要求106或107所述的飞行器，其特征在于，所述第一散热片和第二散热片均为散热鳍片。
  110. 根据权利要求108所述的飞行器，其特征在于，所述射频电路板上设有定位孔，所述第一散热片和第二散热片设有定位柱，所述定位孔和所述定位柱配合使用以预固定所述射频电路板；
    或者，所述射频电路板上设有定位柱，所述第一散热片和第二散热片设有定位孔，所述定位柱和所述定位孔配合使用以预固定所述射频电路板；
    或者，所述射频电路板、所述第一散热片和第二散热片都分别设有定位孔和定位柱，所述定位孔能够与定位柱配合使用以预固定所述射频电路板。
  111. 根据权利要求105所述的飞行器，其特征在于，所述射频子卡包括二频射频子卡或三频射频子卡。
  112. 根据权利要求105所述的飞行器，其特征在于，所述射频子卡还包括：
    固定结构，设置在所述射频电路板，用于将所述射频电路板可拆卸地安装在所述主板上。
  113. 根据权利要求111所述的飞行器，其特征在于，所述固定结构包括以 下至少一种：安装孔、卡扣、卡槽。
  114. 根据权利要求105所述的飞行器，其特征在于，所述射频电路板包括：
    第一设置区，用于设置所述射频子卡的部分电子元器件；
    第二设置区，与所述第一设置区间隔设置，用于设置所述射频子卡的部分电子元器件。
  115. 根据权利要求113所述的飞行器，其特征在于，所述第一设置区中的电子元器件的发热量大于所述第二设置区中的电子元器件的发热量。
  116. 根据权利要求113所述的飞行器，其特征在于，所述第一设置区中的电子元器件为实现射频功能的相关元器件，和/或，所述第二设置区中的电子元器件为实现时钟功能的相关元器件。
  117. 根据权利要求113至115任一项所述的飞行器，其特征在于，所述射频子卡还包括：
    屏蔽罩，设置在所述射频电路板上，用于遮罩所述射频子卡的电子元器件。
  118. 根据权利要求116所述的飞行器，其特征在于，所述屏蔽罩包括：
    第一屏蔽罩，设置在所述第一设置区，用于遮罩所述第一设置区的电子元器件；
    第二屏蔽罩，设置在所述第二设置区，用于遮罩所述第二设置区的电子元器件。
  119. 根据权利要求117所述的飞行器，其特征在于，所述第一屏蔽罩能够至少部分贴合于所述散热片表面的至少部分区域。
  120. 根据权利要求117或118所述的飞行器，其特征在于，所述第一屏蔽罩包括：
    固定座，设置在所述第一设置区对应的电路板上；
    壳体罩，安装在所述固定座上以遮罩所述第一设置区的电子元器件。
  121. 根据权利要求119所述的飞行器，其特征在于，所述固定座焊接在所述第一设置区对应的电路板上。
  122. 根据权利要求119所述的飞行器，其特征在于，所述壳体罩以卡扣的方式安装在所述固定座上。
  123. 根据权利要求117所述的飞行器，其特征在于，所述第二屏蔽罩为罩体，所述罩体焊接在所述第二设置区对应的电路板上。
  124. 根据权利要求122所述的飞行器，其特征在于，所述屏蔽罩上设有通气孔，所述通气孔用于平衡所述屏蔽罩的内外气压。
  125. 根据权利要求105所述的飞行器，其特征在于，所述主板还包括：
    保护罩，设置在所述基带电路板上，以遮罩所述基带处理单元的电子元器件。
  126. 根据权利要求124所述的飞行器，其特征在于，还包括：
    支撑架，用于承载所述主板；所述主板散热器件设置在所述支撑架上。
  127. 根据权利要求125所述的飞行器，其特征在于，所述主板散热器件包括第一散热结构和第二散热结构。
  128. 根据权利要求126所述的飞行器，其特征在于，所述第一散热结构和所述第二散热结构均设置在所述支撑架上，所述第二散热结构与所述主板的电子元器件导热性接触。
  129. 根据权利要求126或127所述的飞行器，其特征在于，所述第一散热结构和第二散热结构均为散热鳍片。
  130. 根据权利要求105所述的飞行器，其特征在于，所述通信连接线包括柔性电路板或软排线。
  131. 根据权利要求105所述的飞行器，其特征在于，还包括：
    连接件，设置在所述射频电路板上，用于实现所述射频子卡与所述主板的电性连接。
  132. 根据权利要求105所述的飞行器，其特征在于，还包括：
    保护件，设置所述主板或射频子卡上，用于保护所述通信连接线的连接器。
  133. 根据权利要求131所述的飞行器，其特征在于，所述保护件上设有通孔，所述通孔的形状与所述连接件的形状相匹配。
  134. 根据权利要求131或132所述的飞行器，其特征在于，所述保护件为压片件。
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CN113710047A (zh) * 2021-01-28 2021-11-26 深圳市途安达科技有限公司 一种电子钥匙
CN113710047B (zh) * 2021-01-28 2023-09-29 深圳市途安达科技有限公司 一种电子钥匙

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