WO2020103241A1 - 一种oled显示器 - Google Patents

一种oled显示器

Info

Publication number
WO2020103241A1
WO2020103241A1 PCT/CN2018/121362 CN2018121362W WO2020103241A1 WO 2020103241 A1 WO2020103241 A1 WO 2020103241A1 CN 2018121362 W CN2018121362 W CN 2018121362W WO 2020103241 A1 WO2020103241 A1 WO 2020103241A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
connection end
oled display
base
extension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/121362
Other languages
English (en)
French (fr)
Inventor
唐岳军
李雪云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/619,087 priority Critical patent/US11049928B2/en
Publication of WO2020103241A1 publication Critical patent/WO2020103241A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of display technology, in particular to an OLED display.
  • organic light emitting diode organic light emitting diode
  • OLED organic light emitting diode
  • LCD Liquid Crystal Display
  • OLED displays have self-luminous characteristics and do not use a separate light source, so they can be manufactured thinner and lighter than display devices using a single light source, and are relatively easy to achieve flexibility and foldability The displayed characteristics.
  • the transmission signal When the display signal is transmitted from the binding terminal to various parts of the display, due to the large area of the display, the transmission signal will have attenuation, delay and unevenness, which will cause the deterioration of the display screen quality.
  • An OLED display including:
  • a light-emitting layer provided on the substrate
  • An encapsulation layer provided on the light-emitting layer
  • At least one binding terminal and a first connection terminal are provided on the back of the base, and a signal trace electrically connecting it to the first connection terminal is provided on the binding terminal;
  • An extension substrate is provided at the edge, and a second connection end is provided on the extension substrate, the first connection end and the second connection end are electrically connected by a flexible circuit board; the back of the base or the extension substrate The drive circuit and connection wiring are provided on it.
  • the first connection end is disposed on a back surface of the substrate at a position close to the second connection end.
  • the extension substrate is made of a flexible base material, the extension substrate is bent toward the back of the base to form a bent portion, and the second before the extension substrate is bent
  • the connection end is located on the side opposite to the side of the substrate where the first connection end is located.
  • a gap is provided between the bent portion and the substrate, and the gap is filled with adhesive glue.
  • the extension substrate is parallel to the base, the second connection end is disposed on the front surface of the extension substrate, and at least part of the first connection end is located at an edge position of the base Office.
  • the binding terminal is disposed at a position near the first connection end on the back surface of the base, or the binding terminal is disposed at the middle of the base.
  • a protective layer covering the signal trace is provided on the back of the substrate.
  • the base includes a first substrate and a second substrate provided on the first substrate, the extension substrate is integrally formed with the second substrate, and the second The substrate is made of a flexible substrate.
  • An OLED display including:
  • a light-emitting layer provided on the substrate
  • An encapsulation layer provided on the light-emitting layer
  • At least one binding terminal and a first connection terminal are provided on the back of the base, and a signal trace electrically connecting it to the first connection terminal is provided on the binding terminal;
  • An extension substrate is provided at the edge, and a second connection end is provided on the extension substrate, and the first connection end and the second connection end are electrically connected by a flexible circuit board.
  • the first connection end is disposed on a back surface of the substrate at a position close to the second connection end.
  • the extension substrate is made of a flexible base material, the extension substrate is bent toward the back of the base to form a bent portion, and the second before the extension substrate is bent
  • the connection end is located on the side opposite to the side of the substrate where the first connection end is located.
  • a gap is provided between the bent portion and the substrate, and the gap is filled with adhesive glue.
  • the extension substrate is parallel to the base, the second connection end is disposed on the front surface of the extension substrate, and at least part of the first connection end is located at an edge position of the base Office.
  • the extension substrate is provided with a driving circuit and a connecting trace.
  • a driving circuit and connection traces are provided on the back of the substrate.
  • the binding terminal is disposed at a position near the first connection end on the back surface of the base, or the binding terminal is disposed at the middle of the base.
  • a protective layer covering the signal trace is provided on the back of the substrate.
  • the base includes a first substrate and a second substrate provided on the first substrate, the extension substrate is integrally formed with the second substrate, and the second The substrate is made of a flexible substrate.
  • the back of the substrate has enough surface space to allow low-resistance wiring.
  • the display signal is transmitted through the first and second connection terminals, reducing the attenuation of the transmission signal. Delay and unevenness, thereby improving picture quality.
  • Embodiment 1 is a schematic structural diagram of an OLED display after an extension substrate is bent in Embodiment 1 of the present invention
  • FIG. 2 is a schematic diagram of the back surface of the base after the extension substrate is bent in Embodiment 1 of the present invention
  • FIG. 3 is a schematic diagram of the front surface of the base when the extension substrate is not bent in Embodiment 1 of the present invention
  • FIGS. 4 to 5 are schematic diagrams of the back surface of the base when the extension substrate is not bent in Embodiment 1 of the present invention.
  • FIG. 6 is a schematic structural diagram of an OLED display when an extension substrate is not bent in Embodiment 1 of the present invention.
  • FIG. 7 is a schematic structural diagram of an OLED display in Embodiment 2 of the present invention.
  • FIG. 8 is a schematic diagram of the back surface of the base when the extension substrate is not bent in Embodiment 5 of the present invention.
  • FIG. 9 is a schematic structural diagram of an OLED display in Embodiment 6 of the present invention.
  • Base 11, first substrate; 12, second substrate; 13, extended substrate; 20, light emitting layer; 30, encapsulation layer; 40, first connection end; 50, second connection end; 60, bonding terminal ; 70, flexible circuit board; 80, signal wiring; 90, adhesive glue; 101, protective layer; 102, frame.
  • the present invention is directed to the existing OLED display.
  • the display signal is transmitted from the binding terminal to various parts of the display, due to the large display area, the transmission signal will produce attenuation, delay and unevenness. problem.
  • the present invention can solve the above problems.
  • OLED display the OLED display is a top-emitting OLED display.
  • the OLED display includes a substrate 10, a light-emitting layer 20 provided on the substrate 10, and an encapsulation layer 30 provided on the light-emitting layer 20.
  • the substrate 10 is provided with metal traces and circuits required for displaying signals of the OLED display;
  • the light-emitting layer 20 includes a plurality of light-emitting devices, and the light-emitting layer 20 emits light to reach the human eye through the encapsulation layer 30, and the substrate 10
  • the side close to the encapsulation layer 30 is the front surface of the substrate 10; the encapsulation layer 30 may be a cover plate package or a film package.
  • At least one binding terminal 60 and a first connection terminal 40 are provided on the back of the substrate 10, and a signal trace 80 electrically connecting it to the first connection terminal 40 is provided on the binding terminal 60 ;
  • the edge of the base 10 is provided with an extension substrate 13, the extension substrate 13 is provided with a second connection end 50, the first connection end 40 and the second connection end 50 through a flexible circuit board 70 electrically connection.
  • the binding terminal 60 is provided on the back surface of the substrate 10, and the back surface of the substrate 10 has sufficient surface space, and low resistance wiring can be provided to reduce the attenuation, delay, and unevenness of the transmission signal, thereby improving the picture quality.
  • the first connection end 40 is disposed on the back of the substrate 10 at a position close to the second connection end 50.
  • the display signal is transmitted nearby through the flexible circuit board 70, and the attenuation, delay, and unevenness of the transmitted signal are reduced.
  • the extension substrate 13 is integrally formed with the base 10, and the base 10 is made of a flexible base material, and the extension substrate 13 is bent toward the back of the base 10 to form a bent portion. A gap is provided between the bent portion and the substrate, and the gap is filled with adhesive glue 90.
  • the adhesive glue 90 improves the connection strength between the bent portion and the substrate 10 to prevent the bending portion from being displaced and causing the connection between the first connection end 40 and the second connection end 50 to be disconnected.
  • FIG. 3 is a schematic diagram of the front surface of the base 10 when the extension substrate 13 is not bent
  • FIG. 4 is a schematic diagram of the back surface of the base 10 when the extension substrate 13 is not bent
  • the OLED display further includes a bezel 102 located on the peripheral side of the encapsulation layer 30.
  • the extension substrate 13 is reserved. After the packaging process is completed to form the packaging layer 30, the extension substrate 13 is bent toward the back of the base 10, and the first connection end 40 and the second connection end 50 are electrically connected through the flexible circuit board 70, the first connection end 40 A signal trace 80 connected to the binding terminal 60 is provided thereon, and the binding terminal 60 is electrically connected to the driving chip.
  • connection of the flexible circuit board 70 to the first connection end 40 and the second connection end 50 includes, but is not limited to, bonding using anisotropic conductive adhesive film (ACF) adhesive.
  • ACF anisotropic conductive adhesive film
  • a second connection terminal 50 is provided on the front surface of the extension substrate 13 and a first connection terminal 40 is provided on a predetermined position on the back surface of the base 10; wherein, the second connection terminal 50 can be connected to one or more layers of metal on the base 10 Lines are formed with the same process and materials to reduce production processes and production costs.
  • the first connection end 40, the signal trace 80, and the binding terminal 60 may be formed after the substrate 10 is formed or prepared, and before the metal trace and the light-emitting layer 20 are fabricated; After the OLED display is packaged, the first connection end 40, the signal trace 80, and the binding terminal 60 are formed on the back of the substrate 10 by turning over the OLED display.
  • FIGS. 3 and 4 only illustrate the case where the extension substrate 13 and the second connection end 50 are provided on all four sides of the base 10; by providing the extension substrate 13 and The second connection terminal 50 can transmit the display signal nearby, reducing the attenuation, delay and unevenness of the transmitted signal.
  • extension substrate 13 and the second connection end 50 may be provided only on any one side, two sides, or three sides of the base 10.
  • the edge position of the base 10 is subjected to special-shaped cutting or edging.
  • one binding terminal 60 or at least two binding terminals 60 may be provided on the back of the substrate 10; the first connection terminal 40 may be connected to the binding terminal 60 Corresponding to the parallel electrical connection, all the first connection ends 40 may be electrically connected to one binding terminal 60.
  • FIG. 4 only illustrates that the binding terminal 60 is disposed on the back of the substrate 10 at a position close to the corresponding first connection end 40; it can be understood that in specific implementation, The binding terminal 60 may also be disposed at the middle of the base 10.
  • the second connection end 50 is located on the side opposite to the side of the substrate where the first connection end 40 is located, and the first connection end 40 is located at the edge of the extension substrate 13 so that the first connection end 40 and the second connection end 50 are electrically connected after the extension substrate 13 is bent to form a bent portion.
  • An OLED display differs from Embodiment 1 only in the structure of the extension substrate 13.
  • the extension substrate 13 is parallel to the base 10
  • the second connection end 50 is disposed on the front surface of the extension substrate 13, and at least a portion of the first connection end 40 is located at an edge position of the base 10 Office.
  • An OLED display differs from the first embodiment only in that the extension substrate 13 is further provided with a driving circuit and connection wiring.
  • the driving circuit may be an electrostatic protection (ESD) circuit, a gate driving circuit, etc.
  • ESD electrostatic protection
  • the driving circuit is electrically connected to the bonding terminal 60 through a connecting wire, which is beneficial to narrowing the frame of the OLED display.
  • An OLED display is different from the third embodiment only in that the driving circuit and the connection wiring are arranged at different positions.
  • the driving circuit and the connecting trace are provided on the back of the substrate 10.
  • An OLED display differs from Embodiment 3 only in that a protective layer 101 covering the signal trace 80 is further provided on the back of the substrate 10.
  • the illustrated protective layer 101 covers the signal trace 80, and the first connection end 40 and the binding terminal 60 are exposed to protect the signal trace 80.
  • the protective layer 101 may be a single-layer inorganic layer, such as an inorganic layer formed of SiNx (silicon nitride) or SiOx (silicon oxide); the protective layer 101 may also be a single-layer organic layer, such as PI (polyimide), An organic layer formed of PC (polycarbonate), PES (polyethersulfone), or PET (polyethylene terephthalate); the protective layer 101 may also be a multilayer stack structure of an inorganic layer and an organic layer.
  • PI polyimide
  • PC polycarbonate
  • PES polyethersulfone
  • PET polyethylene terephthalate
  • An OLED display differs from Embodiment 1 only in the structure of the substrate 10.
  • the base 10 includes a first substrate 11 and a second substrate 12 disposed on the first substrate 11, and the extension substrate 13 is integrally formed with the second substrate 12.
  • the first substrate 11 is made of glass or transparent metal
  • the second substrate 12 is made of flexible substrate, such as PI (polyimide), PC (polycarbonate), PES (polyethersulfone) ), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PAR (polyaryl compound) or FRP (glass fiber reinforced plastic) and other materials.
  • PI polyimide
  • PC polycarbonate
  • PES polyethersulfone
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PAR polyaryl compound
  • FRP glass fiber reinforced plastic
  • the binding terminal 60 is provided on the back surface of the base 10, the back surface of the base 10 has sufficient surface space, and a low-resistance wiring can be provided while passing the first connection terminal 40 and the second connection terminal 50 Transmit the display signal nearby to reduce the attenuation, delay and unevenness of the transmitted signal, thereby improving the picture quality.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED显示器，包括基底（10）、发光层（20）以及封装层（30）；其中，所述基底（10）的背面上设置有至少一个绑定端子（60）和第一连接端（40），所述绑定端子（60）上设置有将其与所述第一连接端（40）电性连接的信号走线（80）；所述基底（10）的边缘设置有延伸基板（13），所述延伸基板（13）上设置有第二连接端（50），所述第一连接端（40）与所述第二连接端（50）通过一柔性电路板（70）电性连接。

Description

一种OLED显示器 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED显示器。
 背景技术
目前，有机发光二极管 (organic light emitting diode, OLED) 显示器作为用于显示图像的显示设备已备受关注。与液晶显示器( Liquid Crystal Display ，LCD)设备不同，OLED显示器具有自发光特性，并且不采用单独的光源,因此可以被制造的比采用单独光源的显示设备薄和轻，相对容易实现柔性、可折叠显示的特性。
然而在大型OLED显示器中，显示信号从绑定端子传输至显示器各部位时，由于显示器面积较大，传输信号时会产生衰减、延迟和不均等不良现象，从而导致显示画面品质下降。
 技术问题
显示信号从绑定端子传输至显示器各部位时，由于显示器面积较大，传输信号时会产生衰减、延迟和不均等不良现象，从而导致显示画面品质下降。
 技术解决方案
一种OLED显示器，包括：
基底；
设置在所述基底上的发光层；
设置在所述发光层上的封装层；以及
位于所述封装层周侧的边框；
其中，所述基底的背面上设置有至少一个绑定端子和第一连接端，所述绑定端子上设置有将其与所述第一连接端电性连接的信号走线；所述基底的边缘设置有延伸基板，所述延伸基板上设置有第二连接端，所述第一连接端与所述第二连接端通过一柔性电路板电性连接；所述基底的背面或所述延伸基板上设置有驱动电路以及连接走线。
在本申请所提供的实施例中，所述第一连接端设置于所述基底的背面上靠近所述第二连接端的位置处。
在本申请所提供的实施例中，所述延伸基板由柔性基材制成，所述延伸基板向所述基底的背面弯折以形成弯折部，所述延伸基板弯折前所述第二连接端位于所述第一连接端所在所述基板一侧的相对侧。
在本申请所提供的实施例中，所述弯折部与所述基板之间设置有间隙，所述间隙中填充有粘附胶。
在本申请所提供的实施例中，所述延伸基板平行于所述基底，所述第二连接端设置于所述延伸基板的正面，所述第一连接端的至少部分位于所述基底的边缘位置处。
在本申请所提供的实施例中，所述绑定端子设置于所述基底的背面上靠近所述第一连接端的位置处，或所述绑定端子设置于所述基底的中部处。
在本申请所提供的实施例中，所述基底的背面上设置有覆盖所述信号走线的保护层。
在本申请所提供的实施例中，所述基底包括第一基板和设置在所述第一基板上的第二基板，所述延伸基板与所述第二基板一体成型，并且，所述第二基板由柔性基材制成。
一种OLED显示器，包括：
基底；
设置在所述基底上的发光层；
设置在所述发光层上的封装层；以及
位于所述封装层周侧的边框；
其中，所述基底的背面上设置有至少一个绑定端子和第一连接端，所述绑定端子上设置有将其与所述第一连接端电性连接的信号走线；所述基底的边缘设置有延伸基板，所述延伸基板上设置有第二连接端，所述第一连接端与所述第二连接端通过一柔性电路板电性连接。
在本申请所提供的实施例中，所述第一连接端设置于所述基底的背面上靠近所述第二连接端的位置处。
在本申请所提供的实施例中，所述延伸基板由柔性基材制成，所述延伸基板向所述基底的背面弯折以形成弯折部，所述延伸基板弯折前所述第二连接端位于所述第一连接端所在所述基板一侧的相对侧。
在本申请所提供的实施例中，所述弯折部与所述基板之间设置有间隙，所述间隙中填充有粘附胶。
在本申请所提供的实施例中，所述延伸基板平行于所述基底，所述第二连接端设置于所述延伸基板的正面，所述第一连接端的至少部分位于所述基底的边缘位置处。
在本申请所提供的实施例中，所述延伸基板上设置有驱动电路以及连接走线。
在本申请所提供的实施例中，所述基底的背面设置有驱动电路以及连接走线。
在本申请所提供的实施例中，所述绑定端子设置于所述基底的背面上靠近所述第一连接端的位置处，或所述绑定端子设置于所述基底的中部处。
在本申请所提供的实施例中，所述基底的背面上设置有覆盖所述信号走线的保护层。
在本申请所提供的实施例中，所述基底包括第一基板和设置在所述第一基板上的第二基板，所述延伸基板与所述第二基板一体成型，并且，所述第二基板由柔性基材制成。
 有益效果
将绑定端子设置在基底的背面，基底的背面具有的足够的表面空间，可以设置低电阻走线，同时通过第一连接端和第二连接端就近传输显示信号，减小传输信号的衰减、延迟和不均等，从而提高画面品质。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例一中延伸基板弯折后OLED显示器的结构示意图；
图2为本发明实施例一中延伸基板弯折后基底的背面的示意图；
图3本发明实施例一中延伸基板未弯折时基底的正面的示意图；
图4至图5本发明实施例一中延伸基板未弯折时基底的背面的示意图；
图6为本发明实施例一中延伸基板未弯折时OLED显示器的结构示意图；
图7为本发明实施例二中OLED显示器的结构示意图；
图8为本发明实施例五中延伸基板未弯折时基底的背面的示意图；
图9为本发明实施例六中OLED显示器的结构示意图。
附图标记：
10、基底；11、第一基板；12、第二基板；13、延伸基板；20、发光层；30、封装层；40、第一连接端；50、第二连接端；60、绑定端子；70、柔性电路板；80、信号走线；90、粘附胶；101、保护层；102、边框。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的OLED显示器，显示信号从绑定端子传输至显示器各部位时，由于显示器面积较大，传输信号时会产生衰减、延迟和不均等不良现象，从而导致显示画面品质下降的技术问题。本发明可以解决上述问题。
实施例一：
一种OLED显示器，所述OLED显示器为顶发光OLED显示器。
如图1和图2所示，所述OLED显示器包括基底10、设置在所述基底10上的发光层20以及设置在所述发光层20上的封装层30。
其中，所述基底10上设置OLED显示器显示信号所需的金属走线和电路；所述发光层20包括多个发光器件，发光层20发出光线透过封装层30到达人眼，所述基底10靠近所述封装层30的一侧为基底10的正面；所述封装层30可以为盖板封装，也可以为薄膜封装。
进一步的，所述基底10的背面上设置有至少一个绑定端子60和第一连接端40，所述绑定端子60上设置有将其与第一连接端40电性连接的信号走线80；所述基底10的边缘设置有延伸基板13，所述延伸基板13上设置有第二连接端50，所述第一连接端40与所述第二连接端50通过一柔性电路板70电性连接。
将绑定端子60设置在基底10的背面，基底10的背面具有的足够的表面空间，可以设置低电阻走线，减小传输信号的衰减、延迟和不均等，从而提高画面品质。
具体的，所述第一连接端40设置于所述基底10的背面上靠近所述第二连接端50的位置处。
通过在基底10的边缘位置设置延伸基板13，通过柔性电路板70就近传输显示信号，减小传输信号的衰减、延迟和不均。
具体的，所述延伸基板13与所述基底10一体成型，并且，所述基底10由柔性基材制成，所述延伸基板13向所述基底10的背面弯折以形成弯折部，所述弯折部与所述基板之间设置有间隙，所述间隙中填充有粘附胶90。
通过粘附胶90提高弯折部与基底10的连接强度，防止弯折部发生位移导致所述第一连接端40与所述第二连接端50的连接断开。
如图3和图4所示，图3为延伸基板13未弯折时所述基底10的正面的示意图，图4为延伸基板13未弯折时所述基底10的背面的示意图；其中，所述OLED显示器还包括位于所述封装层30周侧的边框102。
在对基底10进行切割以形成标准规格的基底10时，预留出延伸基板13。当完成封装工艺形成封装层30后，将延伸基板13向基底10背面弯折，并通过柔性电路板70将第一连接端40与第二连接端50电性连接，所述第一连接端40上设置有连接至绑定端子60的信号走线80，绑定端子60电性连接至驱动芯片。
需要说明的是，所述柔性电路板70与第一连接端40和第二连接端50的连接包含但不限于使用异方性导电胶膜（ACF）胶进行粘结。
在延伸基板13的正面设置第二连接端50，在基底10的背面的预设位置处设置第一连接端40；其中，第二连接端50可以与基底10上的一层或者多层金属走线同工艺同材料形成，以减少生产工序，降低生产成本。
需要说明的是，所述第一连接端40、信号走线80以及所述绑定端子60可以在所述基底10形成或准备后，于金属走线和发光层20制作之前形成；也可以在OLED显示器完成封装后，通过翻转OLED显示器并在基底10的背面形成第一连接端40、信号走线80以及绑定端子60。
需要说明的是，图3和图4中仅示意了在基底10的四侧均设置有延伸基板13和第二连接端50的情况；通过在基底10的四侧的边缘位置设置延伸基板13和第二连接端50，可以就近传输显示信号，减小传输信号的衰减、延迟和不均等不良现象。
在具体实施中，可以仅在基底10的任意一侧、两侧或三侧设置延伸基板13和第二连接端50。
进一步的，当所述基底10的相邻两侧上均设置有延伸基板13和第二连接端50时，对基底10的边缘位置进行异形切割或者磨边处理。
如图4和图5所示，在所述基底10的背面可以设置一个绑定端子60，也可以设置至少两个绑定端子60；所述第一连接端40可以与所述绑定端子60对应并电性连接，也可以将所有所述第一连接端40均与一个所述绑定端子60电性连接。
需要说明的是，图4中仅示意了所述绑定端子60设置于所述基底10的背面上靠近对应的所述第一连接端40的位置处；可以理解的是，在具体实施中，所述绑定端子60也可以设置于所述基底10的中部处。
进一步的，如图6所示，所述延伸基板13弯折前所述第二连接端50位于所述第一连接端40所在所述基板一侧的相对侧，并且，所述第一连接端40位于所述延伸基板13的边缘位置处，以便于所述延伸基板13弯折形成弯折部后所述第一连接端40与所述第二连接端50电性连接。
实施例二：
一种OLED显示器，如图7所示，其与实施一的不同之处仅在于所述延伸基板13的结构不同。
具体的，所述延伸基板13平行于所述基底10，所述第二连接端50设置于所述延伸基板13的正面，所述第一连接端40的至少部分位于所述基底10的边缘位置处。
实施例三：
一种OLED显示器，其与实施一的不同之处仅在于所述延伸基板13上还设置有驱动电路以及连接走线。
所述驱动电路可以为静电防护(ESD)电路、栅极驱动电路等，所述驱动电路通过连接走线与绑定端子60电性连接，有利于OLED显示器窄边框化。
实施例四：
一种OLED显示器，其与实施三的不同之处仅在于所述驱动电路和连接走线设置的位置不同。
具体的，至少部分所述驱动电路和连接走线设置于所述基底10的背面上。
实施例五：
一种OLED显示器，如图8所示，其与实施三的不同之处仅在于所述基底10的背面上还设置有覆盖所述信号走线80的保护层101。
具体的，所示保护层101覆盖信号走线80，且外露出第一连接端40和绑定端子60，以对信号走线80进行保护。
保护层101可以为单层的无机层，如SiNx（氮化硅）或SiOx（氧化硅）形成的无机层；保护层101也可以为单层的有机层，如PI（聚酰亚胺）、PC（聚碳酸酯）、PES（聚醚砜）或PET（聚对苯二甲酸乙二醇酯）形成的有机层；保护层101还可以为无机层与有机层的多层堆叠结构。
实施例六：
一种OLED显示器，如图9所示，其与实施一的不同之处仅在于所述基底10的结构不同。
具体的，所述基底10包括第一基板11和设置在第一基板11上的第二基板12，所述延伸基板13与所述第二基板12一体成型。
其中，所述第一基板11由玻璃或透明金属制成；所述第二基板12由柔性基材制成，如PI（聚酰亚胺）、PC(聚碳酸酯)、PES（聚醚砜）、PET（聚对苯二甲酸乙二醇酯）、PEN(聚萘二甲酸乙二醇酯)、PAR(多芳基化合物) 或FRP(玻璃纤维增强塑料)等材料形成。
本发明的有益效果为：将绑定端子60设置在基底10的背面，基底10的背面具有的足够的表面空间，可以设置低电阻走线，同时通过第一连接端40和第二连接端50就近传输显示信号，减小传输信号的衰减、延迟和不均等，从而提高画面品质。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种OLED显示器，其中，所述OLED显示器包括：
    基底；
    设置在所述基底上的发光层；
    设置在所述发光层上的封装层；以及
    位于所述封装层周侧的边框；
    其中，所述基底的背面上设置有至少一个绑定端子和第一连接端，所述绑定端子上设置有将其与所述第一连接端电性连接的信号走线；所述基底的边缘设置有延伸基板，所述延伸基板上设置有第二连接端，所述第一连接端与所述第二连接端通过一柔性电路板电性连接；所述基底的背面或所述延伸基板上设置有驱动电路以及连接走线。
  2. 根据权利要求1所述的OLED显示器，其中，所述第一连接端设置于所述基底的背面上靠近所述第二连接端的位置处。
  3. 根据权利要求2所述的OLED显示器，其中，所述延伸基板由柔性基材制成，所述延伸基板向所述基底的背面弯折以形成弯折部，所述延伸基板弯折前所述第二连接端位于所述第一连接端所在所述基板一侧的相对侧。
  4. 根据权利要求3所述的OLED显示器，其中，所述弯折部与所述基板之间设置有间隙，所述间隙中填充有粘附胶。
  5. 根据权利要求2所述的OLED显示器，其中，所述延伸基板平行于所述基底，所述第二连接端设置于所述延伸基板的正面，所述第一连接端的至少部分位于所述基底的边缘位置处。
  6. 根据权利要求1所述的OLED显示器，其中，所述绑定端子设置于所述基底的背面上靠近所述第一连接端的位置处，或所述绑定端子设置于所述基底的中部处。
  7. 根据权利要求1所述的OLED显示器，其中，所述基底的背面上设置有覆盖所述信号走线的保护层。
  8. 根据权利要求1所述的OLED显示器，其中，所述基底包括第一基板和设置在所述第一基板上的第二基板，所述延伸基板与所述第二基板一体成型，并且，所述第二基板由柔性基材制成。
  9. 一种OLED显示器，其中，所述OLED显示器包括：
    基底；
    设置在所述基底上的发光层；
    设置在所述发光层上的封装层；以及
    位于所述封装层周侧的边框；
    其中，所述基底的背面上设置有至少一个绑定端子和第一连接端，所述绑定端子上设置有将其与所述第一连接端电性连接的信号走线；所述基底的边缘设置有延伸基板，所述延伸基板上设置有第二连接端，所述第一连接端与所述第二连接端通过一柔性电路板电性连接。
  10. 根据权利要求9所述的OLED显示器，其中，所述第一连接端设置于所述基底的背面上靠近所述第二连接端的位置处。
  11. 根据权利要求10所述的OLED显示器，其中，所述延伸基板由柔性基材制成，所述延伸基板向所述基底的背面弯折以形成弯折部，所述延伸基板弯折前所述第二连接端位于所述第一连接端所在所述基板一侧的相对侧。
  12. 根据权利要求11所述的OLED显示器，其中，所述弯折部与所述基板之间设置有间隙，所述间隙中填充有粘附胶。
  13. 根据权利要求10所述的OLED显示器，其中，所述延伸基板平行于所述基底，所述第二连接端设置于所述延伸基板的正面，所述第一连接端的至少部分位于所述基底的边缘位置处。
  14. 根据权利要求9所述的OLED显示器，其中，所述延伸基板上设置有驱动电路以及连接走线。
  15. 根据权利要求9所述的OLED显示器，其中，所述基底的背面设置有驱动电路以及连接走线。
  16. 根据权利要求9所述的OLED显示器，其中，所述绑定端子设置于所述基底的背面上靠近所述第一连接端的位置处，或所述绑定端子设置于所述基底的中部处。
  17. 根据权利要求9所述的OLED显示器，其中，所述基底的背面上设置有覆盖所述信号走线的保护层。
  18. 根据权利要求9所述的OLED显示器，其中，所述基底包括第一基板和设置在所述第一基板上的第二基板，所述延伸基板与所述第二基板一体成型，并且，所述第二基板由柔性基材制成。
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