WO2020098876A2 - Dispositif de découpage au laser pour fils et procédé de découpage au laser de fils au moyen d'un tel dispositif - Google Patents

Dispositif de découpage au laser pour fils et procédé de découpage au laser de fils au moyen d'un tel dispositif Download PDF

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Publication number
WO2020098876A2
WO2020098876A2 PCT/DE2019/100966 DE2019100966W WO2020098876A2 WO 2020098876 A2 WO2020098876 A2 WO 2020098876A2 DE 2019100966 W DE2019100966 W DE 2019100966W WO 2020098876 A2 WO2020098876 A2 WO 2020098876A2
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WO
WIPO (PCT)
Prior art keywords
laser
laser beam
line
layer
designed
Prior art date
Application number
PCT/DE2019/100966
Other languages
German (de)
English (en)
Other versions
WO2020098876A3 (fr
Inventor
Herbert Mannherz
Tobias Mißlinger
Original Assignee
Md Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Md Elektronik Gmbh filed Critical Md Elektronik Gmbh
Publication of WO2020098876A2 publication Critical patent/WO2020098876A2/fr
Publication of WO2020098876A3 publication Critical patent/WO2020098876A3/fr

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1275—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by applying heat
    • H02G1/128—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by applying heat using radiant energy, e.g. a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/32—Wires
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1297—Removing armouring from cables

Definitions

  • the invention relates to a laser cutting device for lines and a method for laser cutting lines with such
  • the laser cutting device according to the invention is particularly suitable for making uniform circumferential cuts on shielded lines or glass fibers.
  • a material removal in terms of area, e.g. of a film within the layer structure of the line is possible.
  • the several inner conductors are exposed, but also the outer conductors, which are, for example, shield wires and / or shield foils, must be exposed accordingly and arranged in such a way that a line end prepared in this way can be provided with a plug connector.
  • Another curved mirror is arranged in the beam path of the laser after the cable and focuses the laser beam on the opposite side of the cable.
  • the cable is movably arranged on a carriage. The movement of the carriage moves the laser beam on the peripheral wall of the cable to be cut. A first portion of the peripheral wall can be cut by the first mirror and a second portion of the peripheral wall can be cut by the second mirror.
  • a disadvantage of US Pat. No. 4,776,135 A is that the cuts are uneven and the laser process takes a long time due to the speed of the carriage.
  • a laser cutting device is known from the subsequently published DE 2018 128 922.7, in which a large number of individual mirrors are used, which are arranged offset around the shielded line to be cut.
  • a laser beam deflection device is controlled in such a way that the laser beam is always directed alternately at one of the individual mirrors and is reflected by the respective individual mirror onto the shielded line, as a result of which the shielded line is cut along its circumference.
  • a laser cutting device which uses folding mirrors to deflect the laser beam accordingly.
  • the laser beam is thereby directed onto the line to be processed.
  • WO 2017/037691 A1 Another disadvantage of WO 2017/037691 A1 is that the processing of the lines shown there, in which several steps are necessary, takes a long time. It is the object of the invention to create a laser cutting device for lines and a method for laser cutting lines, with the aid of which the processing costs of the lines are kept as low as possible.
  • the object is achieved according to the invention by a laser cutting device for lines according to claim 1 and by a method for laser cutting by claim 26.
  • Claims 2 to 25 explain the invention
  • Further developments of the laser cutting device and claims 27 to 29 explain a further development of the method for laser cutting according to the invention.
  • the laser cutting device according to the invention is suitable for cutting lines with several layers. These lines can be, for example, glass fibers, different layers being formed by different plastics. However, it can also be shielded lines in which the individual layers are formed by plastics or by metals (for example shielding wires, shielding foils), which are preferably in the
  • the laser cutting device comprises a first one
  • Laser device and second laser device which are controlled in particular jointly and independently of a control device (in particular switched on and off).
  • “Together” means that the control device is both the first laser device and the second
  • Controls laser device functions as a common control device. “Independent” means that the first laser device can be operated independently of the second laser device (and vice versa). This applies in particular to the switch-on times as well as the switch-off times.
  • the alignment and / or focusing of the first laser beam can also take place independently of the alignment and / or focusing of the second laser beam.
  • the first laser device is designed to generate and emit a first laser beam which has a first wavelength, the first laser beam being designed to transmit a first layer (or layers of materials from a first material group)
  • the second laser device is in particular designed to generate and send out a second laser beam which has a second wavelength, the second laser beam being designed to process a second layer (or layers of materials from a second material group) of the line.
  • the first layer and the second layer consist of different materials (ie the materials of the first material group differ from the materials of the second material group).
  • the wavelength of the first laser beam can therefore also differ from the wavelength of the second laser beam.
  • the wording "first layer” and "second layer” does not necessarily mean that the first layer is an outer layer of the line and the second layer is an underlying layer of the line represents.
  • the layers can also be surrounded by further layers.
  • a housing arrangement is provided which delimits a cable receiving space.
  • the housing arrangement is open on a first end face, as a result of which a cable insertion opening is formed, through which the cable receiving space is accessible from outside the housing arrangement.
  • a cable receiving space is formed, which is penetrated by a central axis.
  • the cutting space is preferably not further delimited from the cable receiving space, but only represents part of the cable receiving space.
  • the cutting space comprises a smaller volume than the actual cable receiving space.
  • the first laser device and the second laser device are arranged and aligned on or in the housing arrangement in such a way that the first laser beam and the second laser beam enter the cutting space of the cable receiving space, so that the line in the cutting space is passed through the first laser beam and (possibly simultaneously) can be processed by the second laser beam.
  • the line can be processed by two laser beams, each with a different wavelength.
  • the necessary layers can all be cut so that the line only has to be inserted once into a laser cutting device.
  • the further insertion of the line into another laser cutting device in order to be able to cut through another layer is not necessary.
  • the exact detection at which position of the line the previous cut has been made is also omitted because the line preferably remains stationary.
  • the laser cutting device is used in particular for the laser cutting of shield wires and / or shield foils of a shielded line.
  • Shield wires consist in particular of a metal mesh
  • shield foils consist in particular of a plastic which is vapor-coated with a metal, for example aluminum, with a layer thickness of preferably 10 to 20 ⁇ m.
  • the shielding film in particular comprises a PET film.
  • the first laser beam can have different wavelengths.
  • a gas laser is preferably used, preferably a CO2 laser, which has a wavelength of approximately 10,600 nm.
  • the first laser beam is used to process Plastic.
  • the second laser beam can also have different wavelengths.
  • a solid-state laser is preferably used. These include, for example, fiber lasers, disk lasers or UKP lasers (ultrashort pulse lasers), which have a wavelength in the infrared range, for example. It is used to process metal, e.g. for cutting shield wires. If a glass fiber is to be processed, then both laser devices are suitable for cutting plastics.
  • the wording "edit” includes the possibility that a layer of the line is cut and / or removed.
  • the cutting room represents only a sub-room of the cable receiving room.
  • the laser devices are arranged and aligned in such a way that both laser beams can hit and process the line in the cutting room.
  • a transport and holding device In order to be able to cut the line along its predominant circumference or its entire circumference, if possible, it is possible for a transport and holding device to hold and rotate the line, so that the stationary laser devices can cut the line accordingly.
  • the control device still controls the transport and holding device in such a way that it shifts the line slightly along the central axis, that is, further in the direction of the cable insertion opening or further away from the cable insertion opening, so that the corresponding one to be processed Layer can be removed in sections (line-like).
  • a rotating device which is designed to rotate the first and second laser devices in the circumferential direction around the central axis, so that the line can be processed accordingly and an incision or removal which is linear in the circumferential direction takes place .
  • the line it would be possible again for the line to be displaceable along the central axis, so that the corresponding layer to be processed can be removed in areas (areal).
  • the first and the second laser device each comprise a laser beam deflection device which is designed to transmit the respective laser beam to be deflected such that a point of incidence of the respective laser beam on the line can be moved in a YZ plane, the central axis running along the X axis and being perpendicular to the YZ plane.
  • the control device is then designed to control the laser beam deflection devices of the respective laser devices in such a way that the respective laser beam can be moved along a partial circumference of the line and the first layer of the line can be cut along at least this partial circumference.
  • This movement of the point of impact of the respective laser beam on the line preferably takes place very quickly.
  • This point of impact can move 2, 3, 4, 5, 6, 7, 8, 9, 10 times or more than 10 times from one end to the other end (of the partial circumference), so that an even energy input into the respective one to be cut Layer takes place.
  • the laser beam deflection device of the respective laser device is preferably also designed to deflect the respective laser beam in such a way that a point of incidence of the respective laser beam can be moved along the X axis, that is to say along the longitudinal axis of the line.
  • the corresponding layer can also be removed in areas (areal). Such area-wise (areal) removal is particularly useful when removing a screen film.
  • the laser beam deflection device of the respective first or second laser device comprises at least a first and a second mirror arrangement, as well as at least a first and a second adjusting device.
  • the adjustment devices are preferably
  • the respective mirror arrangement is arranged in the beam path of the first or second laser beam and is designed to guide the respective laser beam accordingly, so that its point of incidence travels back and forth on the line (in the circumferential direction or additionally in the longitudinal direction).
  • the laser beam is preferably reflected from the first mirror arrangement to the second mirror arrangement and from the second mirror arrangement (or the last mirror arrangement) to the line itself.
  • the laser beam deflection device can also comprise further mirror arrangements. In principle, it would also be possible for the laser beam deflection device of the respective first or second laser device to also comprise a robot arm which guides the laser beam.
  • a pulling device is further provided and arranged within the cable receiving space.
  • the pulling device comprises contacting elements, which in particular have a rough surface.
  • the control device is designed to control the pulling device in such a way that the contacting elements of the pulling device can be brought into contact with an exposed cut layer of the line and that the contacting elements can be moved from the first end face of the housing arrangement so far in the direction of an opposite second end face of the housing arrangement, that a partial deduction of the cut layer of the line takes place.
  • a “partial deduction” is further understood to mean shifting the respective layer by a few millimeters, in particular less than 10 mm, 8 mm, 6 mm, 4 mm.
  • control device is designed to control the at least one of the at least two laser devices in such a way that it cuts or removes the further layer of the line (for example if a film comes to light) that lies above the part that has been pulled off
  • the control device is also designed to control the pulling device in such a way that the contacting elements of the pulling device can be brought into contact with the further exposed layer of the line and that the contacting elements can be moved from the first end face of the housing arrangement in the direction of the opposite second end face of the housing arrangement. so that a partial deduction of the others incised layer of the line takes place.
  • the layers are preferably built up alternately, with a plastic layer usually being followed by a metal layer and a metal layer usually being followed by a plastic layer (in the case of a glass fiber there are (only) different plastic layers).
  • the line is always stationary when the layers are cut and partially removed or removed. By using two laser devices, the cable can therefore be prepared very quickly for further assembly.
  • the laser cutting device comprises a first laser exit opening and a second laser exit opening, the first laser beam emerging through the first laser exit opening and the second laser beam exiting through the second laser exit opening and entering the cable receiving space.
  • the first laser exit opening and the second laser exit opening are either offset from one another in the central axis only in the circumferential direction of the central axis, or are offset from one another both in the peripheral direction of the central axis and additionally along the central axis, or are only offset from one another along the central axis.
  • the respective outlet opening can be arranged directly on the respective laser device or on the housing arrangement. In the former case, the respective laser device delimits or is at least partially arranged in the cable receiving space. In the second case, the laser device is housed outside the housing arrangement and the respective laser beam is guided into the cable receiving space via an opening in the housing arrangement.
  • a third and a fourth laser device are provided. These are in turn preferably controlled jointly and independently of the control device.
  • Other laser devices are also possible. There are preferably two different ones
  • the first group of laser devices emits a laser beam with the first wavelength for cutting the first layer or layers which are formed from the first material or from materials of the first material group.
  • the second group of laser devices emits a laser beam with a wavelength for cutting the second layer or layers made of the second material or materials second material group are formed.
  • the third laser beam has a wavelength that differs from the wavelength of the fourth laser beam. It preferably corresponds to the wavelength of the first laser beam, so that the first layer of the line can also be processed with the third laser beam or layers of the line which consist of materials from the first material group can be processed, whereas the second layer of the line can be processed with the fourth laser beam is editable or layers of the line, which consist of materials of the second material group, are editable.
  • the third laser beam emerges from a third laser exit opening of the third laser device, which is preferably arranged offset by approximately 180 ° about the central axis to the first laser exit opening of the first laser device.
  • the wording "preferably by approx.” also includes deviations of less than 20 °, 15 °, 10 °, 5 °.
  • the same also applies to the fourth laser beam in relation to the second laser beam.
  • the control device is then designed to control the first and third laser devices in such a way that the first and third laser beams hit the line along the central axis without being offset from one another and that the first laser beam processes (e.g. cuts) the line along a first partial circumference and the third laser beam leads along a second part of the circumference.
  • Both partial circumferential areas are arranged largely without overlap with one another.
  • a non-rotating line can be cut on its entire or its predominant circumferential area by means of two laser sources. The same applies to the second and fourth laser devices.
  • the first and the third laser beam are inclined to one another, that is to say that the first laser beam does not run in the imaginary extension of the third laser beam, but rather forms an angle of a few degrees with this imaginary extension. This prevents one laser beam from entering the laser exit opening of the other laser beam and damaged the laser source there.
  • the same can also apply to the second and fourth laser beams or basically to laser beams from different laser devices.
  • the method according to the invention for laser cutting lines with a laser cutting device comprises several method steps.
  • a first process step the line is introduced into the cutting room.
  • the first laser device is activated such that the first laser beam strikes the first layer of the line and cuts this first layer.
  • the first laser beam is guided or the line is rotated accordingly, so that the first laser beam cuts the first layer of the line at least along its partial circumference.
  • the incised first layer is partially removed. The layer underneath then appears.
  • the second laser device is activated in a subsequent method step in such a way that the second laser beam strikes the second layer of the line, which was exposed by the partial deduction of the first layer and also cuts this second layer.
  • this second laser beam is also guided or the line is rotated accordingly such that the second laser beam cuts the second layer of the line at least along its partial circumference. Then, in a further process step, the cut second layer is partially removed.
  • FIGS. 1A and 1B an exemplary structure of a line in the form of a coaxial line and an HSD line;
  • FIG. 2 various steps which explain how a coaxial line is processed and which parts of the respective line are cut in which laser cutting method
  • Figure 3 an exemplary structure of a laser device
  • FIGS. 1A and 1B show various exemplary embodiments of a line 1 in the form of a shielded line 1.
  • This line 1 is cut with the laser cutting device 3 described later.
  • FIG. 1A shows a shielded line 1 in the form of a coaxial line.
  • This comprises an outer jacket 1a, which preferably consists of an (elastic) dielectric such as plastic.
  • outer jacket 1a which preferably consists of an (elastic) dielectric such as plastic.
  • shield wires 1 b are arranged, which can also be referred to as a shield wire braid. However, these shield wires 1 b are optional.
  • These shield wires 1 b consist of a metal and are electrically conductive.
  • a shielding foil 1c is preferably located under these shielding wires 1b or the shielding wire mesh.
  • This shielding film 1c is optional, preferably at least the shielding wires 1b or the shielding film 1c being present.
  • This shielding film 1c preferably comprises a dielectric material, in particular a plastic film (for example PET film), onto which a metal has been evaporated or applied in some other way.
  • the layer thickness this metal which can be aluminum, for example, is preferably 10 pm to 20 pm.
  • a dielectric 1d which consists of an electrical insulator, in particular an (elastic) plastic, is arranged below this shielding film 1c.
  • This dielectric 1d surrounds an inner conductor 1e, which is made of an electrically conductive material such as e.g. Copper exists or includes one.
  • an HSD line 1 is shown in FIG. 1B.
  • the structure with respect to the outer sheath 1a, the shield wires 1b and the shielding foil 1c corresponds to that of the coaxial line 1 from FIG. 1A.
  • the shielding foil 1c in FIG. 1B surrounds several dielectrics 1 d, each of these dielectrics 1d comprising an inner conductor 1e, that is to say surrounding it.
  • the HSD line 1 from FIG. 1B therefore comprises a plurality of inner conductors 1e, preferably 2, 3, 4, 5, 6, 8, 10 or more inner conductors 1e, each inner conductor 1e being surrounded by its own dielectric 1d.
  • the dielectrics 1d are then surrounded together by the shielding film 1c.
  • a differential signal such as LVDS (low voltage differential signaling) is used.
  • the aim of this invention is to assemble the (shielded) line 1 as fully automatically as possible, that is to be able to provide it with a plug connector.
  • certain layers must be exposed, in which different parts of a plug connection, not shown, engage and make electrical or optical contact (in the case of glass fibers).
  • FIG. 2 shows a shielded line 1 in the form of a coaxial line 1, as has already been described with regard to its structure in FIG. 1A, to which reference is hereby made.
  • the shielded line 1 is processed, as explained below, that is to say it is prepared for assembly.
  • the individual processing steps run from top to bottom in FIG. 2A.
  • the shielded cable 1 can be labeled (optional). This can be seen here with the example label "XXXX.XX" made.
  • the outer jacket 1a is shown. This preferably consists of a dielectric.
  • the outer casing 1a ie in this case the first layer 1a
  • processing is understood to mean cutting into this first layer 1a.
  • the first layer 1a is cut by means of the first laser device 5a over the whole or over the major part of the circumference (see vertical line)
  • a partial deduction of the first layer 1a takes place (see arrow).
  • the partial deduction takes place only to such an extent and to such an extent that the underlying second layer 1b, which in this case is shield wires 1b, is only exposed in sections and, apart from the exposed section, is still among those now divided remains arranged in both parts of the first layer 1a.
  • Another cut is now made through the second laser device 5b (dotted triangle) in the region of the section exposed by the first partial deduction.
  • the second laser device 5b has a different wavelength and is used to cut metals.
  • a third layer 1c which is the shielding film 1c, now appears below this.
  • this shielding film 1c is coated with a metal at its end (side) accessible from the outside.
  • the second laser device 5b is again used and controlled accordingly.
  • the second laser device 5b is controlled such that an area of the third layer 1c of the line 1 can be removed over the partial circumference and over a partial length (see area between the two vertical lines).
  • the third layer 1c that is to say the shielding film 1c, is thereby evaporated.
  • the inner side of the screen film 1c could also be coated with a metal.
  • the first laser device 5a would again be controlled such that an area of the third layer 1c of the line 1 can be removed over the partial circumference and over a partial length (see area between the two vertical lines).
  • Figure 2 is therefore to edit the Screen foil 1c, depending on its structure, indicates both the use of the first laser device 5a and the use of the second laser device 5b.
  • a fourth layer 1d then appears underneath, which is again a dielectric.
  • This dielectric in turn consists or comprises a plastic, so that the first laser device 5a is again used to cut this fourth layer 1d and is controlled accordingly. After the first laser device 5a has in turn cut the line 1 along its circumference or at least part of the circumference, an in turn takes place
  • the inner conductor 1e now appears below this. This is severed by means of the second laser device 5b. In this case, both the inner conductor 1e and the dielectric 1d lying above it and part of it
  • Shielding foil 1c and also part of the shielding wires 1b and the sheath 1a are accessible from the outside and the shielding line 1 can be assembled subsequently. It can be seen that the line 1 remains stationary during the laser cutting. By using different laser devices 5a, 5b, the different layers 1a to 1e can also be processed accordingly. The line 1 does not have to be fed to any other device than the laser cutting device 3 in order to expose all the layers 1a to 1e accordingly for further assembly.
  • FIG. 3 shows an exemplary structure of a laser device using the example of the first laser device 5a.
  • This first laser device 5a generates a first laser beam 6a by means of a laser source 12. So that the first laser beam 6a can strike different areas of the line 1, a laser beam is
  • the laser beam deflection device 7 is designed to deflect the first laser beam 6a in such a way that a point of incidence 8 (see FIG. 4A) of the first laser beam 6a can be moved on the line 1 at least in a Y-Z plane.
  • this first laser beam 6a can still be moved along the longitudinal axis (X axis) of the line 1.
  • a central axis 9, along which line 1 is arranged runs along the X axis and perpendicular to the YZ plane.
  • the laser beam 6a generated by the laser source 12 strikes the laser beam deflection device 7.
  • the laser beam deflection device 7 of the respective laser device 5a comprises at least a first mirror arrangement 10a and a second mirror arrangement 10b, as well as at least a first adjustment device 11a and a second adjustment device 11b.
  • the mirror arrangements 10a, 10b are arranged in the beam path of the respective laser beam 6a and are designed to reflect the respective laser beam 6a from the first mirror arrangement 10a to the second mirror arrangement 10b and from the second mirror arrangement 10b or last mirror arrangement to the line 1.
  • the first adjustment device 11a designed to twist and / or pivot the first mirror arrangement 10a such that the respective laser beam 5a predominantly or exclusively along
  • the second adjusting device 11b is designed to rotate and / or pivot the second mirror arrangement 10b in such a way that the respective laser beam 6a predominantly or exclusively along
  • the Y axis and the X axis are at an angle of 90 ° to one another and at an angle of 90 ° to the Z axis, the X axis running along the central axis 9.
  • each mirror arrangement 10a, 10b pivots the laser beam 6a in another axis.
  • each mirror arrangement 10a, 10b preferably pivots the laser beam 6a exactly along an axis.
  • a Mirror arrangement 10a, 10b also pivots the respective laser beam 6a in the direction of two axes.
  • the first laser device 5a also includes a telescope device 13.
  • This telescope device 13 is designed to change the focus of the first laser beam 6a, as a result of which lines 1 with different diameters or different layers 1a to 1e of the line 1 can be processed.
  • the telescopic device 13 is preferably arranged between the laser source 12 and the laser beam deflection device 7
  • a control device 4 is also shown, which is designed to control the first laser device 5a.
  • the control device 4 is in (electrical) contact with the laser source 12, the telescope device 13 and the laser beam deflection device 7 for data exchange and can control them accordingly.
  • the control device 4 is designed to appropriately deflect the first laser beam 6a by driving the laser beam deflection device 7 and to focus the first laser beam 6a accordingly by driving the telescope device 13.
  • the control device 4 is designed to switch the laser source 12 and thus the first laser device 5a on and off.
  • first laser exit opening 15a through which the first laser beam 6a leaves the first laser device 5a.
  • Laser exit opening 15a can, as shown in FIG. 3, be closed by a corresponding protective glass in order to avoid particles that are caused by the
  • This protective glass should be transparent to the wavelength range of the respective laser beam 6a. Transparency is understood in particular to mean that more than 95%, 96%, 97%, 98% or more than 99% of the power of the respective laser beam 6a is transmitted through the protective glass.
  • Figure 4A shows a first embodiment of the invention
  • Laser cutting device 3 Shown is the first laser device 5a, which was described in FIG. 3. This generates the first laser beam 6a. Also shown is a second laser device 5b which is designed to generate a second laser beam 6b. The structure of the second laser device 5b corresponds the structure of the first laser device 5a described above.
  • the common control device 4 controls both the first and the second laser device 5a, 5b independently of one another.
  • the first laser beam 5a has a wavelength that differs from the wavelength of the second laser beam 5b.
  • the first laser beam 5a is designed to process a first layer 1a of the line 1 (which consists of a first material) or to process layers 1a, 1d of a first material group of the line 1.
  • the second laser beam 6b is designed to process a second layer 1b of the line 1, which consists of or comprises a second material different from the first material.
  • the second laser beam 6b serves to process layers 1b, 1c, 1e of the line 1, which consist of materials from a second group of materials.
  • the materials of the first and second material groups differ from each other.
  • the first material or materials of the first material group is plastic and the second material or materials of the second material group is in particular a metal or metal braid.
  • the first layer 1a which is the jacket 1a of the line 1
  • the second layer 1b which is located below and has now come to light, and which is shielded wire, is being processed by the second laser beam 6b. In this case, the second layer 1b is cut.
  • a housing arrangement 20 is also provided, which delimits and encloses a cable receiving space 21.
  • the housing arrangement 20 is opened on a first end face 22, as a result of which a cable insertion opening 23 is formed. At least through this cable insertion opening 23, the cable receiving space 21 is accessible from outside the housing arrangement 20.
  • the line 1 to be processed is inserted through this cable insertion opening 23 into the cable receiving space 21.
  • In the cable receiving space 21 is a
  • Cutting space 25 is formed, which is penetrated by a central axis 9, which in this case coincides with the longitudinal axis of the line 1.
  • the first laser device 5a and the second laser device 5b are arranged and aligned on or in the housing arrangement 20 such that the first laser beam 6a and the second laser beam 6b are in the cutting space 25 of the cable receiving space 21 meet, whereby the line 1 in the cutting room 25 can be processed by the first laser beam 6a and the second laser beam 6b.
  • the first and second laser devices 5a, 5b are preferably arranged on the same side of the housing arrangement 20, for example on the side of the housing arrangement 20 on which the cable 1 to be processed is inserted into the cutting space 25 through the cable insertion opening 23.
  • the first and the second laser devices 5a, 5b do not necessarily have to use the laser beam described.
  • a transport and holding device 30 is provided in FIG. 4A, which is designed, among other things, to hold the line 1 and optionally to rotate it.
  • the control device 4 is in turn designed to control the transport and holding device 30 in such a way that it introduces the line 1 via the cable insertion opening 23 into the cable receiving space 21.
  • Such a transport and holding device 30 is also provided in other embodiments in the same way.
  • the control device 4 is designed to address the first and / or second laser device 5a, 5b and, in response to the response in time (in particular with or without a time offset), to actuate the transport and holding device 30 in such a way that it adjusts the line 1 by one Rotates the longitudinal axis of the line 1 (which in this case is the central axis 9), so that the respective layer 1a to 1e of the line 1 can be cut along its circumference by the first or second laser beam 6a, 6b.
  • the control device 4 is designed to address the first and / or second laser device 5a, 5b and, in response to the response in time (in particular with or without a time offset), to actuate the transport and holding device 30 in such a way that it adjusts the line 1 by one Rotates the longitudinal axis of the line 1 (which in this case is the central axis 9), so that the respective layer 1a to 1e of the line 1 can be cut along its circumference by the first or second laser beam 6a, 6b.
  • Control device 4 can also control the transport and holding device 30 accordingly, in order to then address the first and / or second laser device 5a, 5b accordingly in time.
  • the control device 4 can also control the transport and holding device 30 in such a way that the transport and holding device 30 shifts the line 1 along the central axis 9 in order to thereby remove a layer 1a to 1e, for example a shielding film 1c.
  • the line 1 is preferably rotated so quickly (more than approximately 1 to approximately 5 revolutions per second) that a uniform energy input by the respective laser beam 6a, 6b is possible.
  • a rotating device is provided, the first laser device 5a and the second laser device 5b being arranged on the rotating device.
  • the control device 4 is then designed to control the rotary device such that it rotates the first laser device 5a and the second laser device 5b in the circumferential direction around the central axis 9, so that the respective layer 1a to 1e of the line 1 along its circumference through the first Laser beam 6a or the second laser beam 6b can be cut and / or removed.
  • a basic illustration is shown in FIG. 5.
  • the transport and holding device 30 also comprises a receiving part 100, within the center bore of which the line 1 to be machined is received in alignment with the central axis 9, the receiving part having a flange-like widening 31, this widening 31 during the laser cutting at the cable insertion opening 23 or the first end face 22 abuts and the cable insertion opening 23 closes airtight and / or dustproof and / or lightproof.
  • a sealing element 32 for example in the form of an O-ring (for example made of a rubber), can also be arranged between the widening 31 and the first end face 22 of the housing arrangement 20. This also serves to dampen any abutment movement of the widening 31 on the first end face 22.
  • a nozzle device 40 is also shown in FIG. 4A. This is arranged in the cable receiving space 21.
  • the nozzle device 40 comprises at least one nozzle 41 and is designed to blow air and process gas into the cutting space 25 from this. A corresponding one is not shown
  • Suction device which has one or more suction openings, the suction device being designed to suck in the air or the process gas supplied by the nozzle device 40 and the emissions resulting from the laser cutting process and / or the cut off parts of the line 1.
  • the air pressure in the cable receiving space 21 is preferably lower compared to the air pressure outside the housing arrangement 20. This prevents emissions from escaping from the cable receiving space 21.
  • the at least one nozzle 41 of the nozzle device 40 has one
  • Main nozzle outlet opening 42 and a plurality of secondary nozzle outlet openings 43 the main nozzle outlet opening 42 being arranged such that air or the process gas flows out into the cutting space 25 and the plurality of secondary nozzle outlet openings 43 being arranged such that air or the process gas is directed onto an inner wall of the housing arrangement 20 and the respective protective glass 15a, 15b of the corresponding laser device 5a, 5b flows.
  • a pulling device 50 is also provided and arranged within the cable receiving space 21.
  • the pulling device 50 comprises contacting elements 51.
  • the control device 4 is additionally designed to control the pulling device 50 in such a way that the contacting elements 51 of the pulling device 50 can be brought into contact with an exposed cut layer 1a to 1d of the line 1 and that the contacting elements 51 can be moved from the
  • the first end face 22 of the housing arrangement 20 can be moved in the direction of an opposite second end face 24 of the housing arrangement 20, as a result of which the cut layers 1a to 1d of the line 1 are partially drawn off.
  • the contacting elements 51 are designed as contacting fingers.
  • the contacting elements 51 could also be used as
  • the first laser device 5a has cut the first layer 1a of the line 1 along a circumferential area.
  • the control device 4 has actuated the pulling device 50 in such a way that it grips the cut first layer 1a (casing), that is to say the one right half in FIG. 4A of the first layer 1a cut in two spaced halves in the direction of the extension of the central axis 9 and moves and pulls in the direction of the opposite second end face 24 of the housing arrangement 20.
  • the one below second layer 1 b to the surface, which according to FIG. 1A is shield wires 1 b.
  • the corresponding second laser device 5b generates a second laser beam 6b in order to cut this second layer 1b accordingly.
  • FIG. 4B which shows a further exemplary embodiment of the laser cutting device 3 according to the invention
  • this second layer 1b was also partially pulled off by the same pulling device 50, that is to say it was moved in the direction of the second end face 24 of the housing arrangement 20.
  • a third layer 1c which is a screen film 1c, then appears.
  • This shielding film 1c comprises a metallization layer, which in this case is directed outwards.
  • This third layer 1c is removed by the second laser device 5d, that is to say in particular evaporates.
  • a fourth layer 1d then appears underneath, which is again a dielectric. This fourth layer 1d is cut by the first laser device 5a, the third layer 1c being simultaneously removed by the second laser device 5b.
  • the line 1 or even the respective laser device 5a, 5b is not rotated in this case, but the first and second laser devices 5a, 5b have the laser beam deflection device 7 described with reference to FIG. 3.
  • the control device 4 is designed to control the laser beam deflection device 7 of the first and second laser beam device 5a, 5b in such a way that the first and second laser beam 6a, 6b can be moved along a partial circumference of the line 1 and the respective layer 1a to 1e Line 1 can be cut along the partial circumference of line 1.
  • the laser beam deflection device 7 of the respective laser device 5a, 5b is designed to deflect the respective laser beam 6a, 6b in such a way that the point of incidence 8 of the respective laser beam 6a, 6b can be moved on the line 1 at least in a Y-Z plane.
  • the second laser device 5b is designed to deflect the second laser beam 6b in such a way that a point of incidence 8 of the second laser beam 6b can also be moved along the X axis, the latter being longitudinal to the central axis 9 runs.
  • the removal (evaporation) of the third layer 1c (screen film) in this case can be carried out precisely in this way.
  • the second laser beam travels not only along the X axis, but also along a partial circumference of the respective layer 1a to 1e of the line 1. The same can in principle also apply to the first laser device 5a.
  • the laser beam deflection devices 7 of the first and second laser devices 5a, 5b can be controlled independently of one another by the control device 4.
  • the control device 4 is preferably designed to activate the respective laser device 5a, 5b only if the corresponding laser beam deflection device 7 is set such that a laser beam 6a, 6b also strikes the line 1 to be cut, otherwise it emerges from the respective one Laser device 5a, 5b no laser beam.
  • the first laser device 5a and the second laser device 5b also comprise different housing parts, the respective laser beam deflection device 7 being arranged within the respective housing part.
  • control device 4 is designed to control the laser beam deflection device 7 of the respective laser device 5a, 5b in such a way that the respective laser beam 6a, 6b can be directed onto the line 1 at a specific position along the longitudinal axis and in this position along a circumferential partial circumference of the line 1 is movable, whereby the respective
  • Layer 1a to 1e of line 1 can be cut in this position along its partial circumference.
  • the respective laser beam 6a, 6b can be moved along a partial circumference of the line 1 and along a partial length of the central axis 9, as a result of which a region of the respective layer 1a to 1e of the line 1 can be removed over the partial circumference and over the partial length is.
  • the laser cutting device 3 further comprises a camera system which detects the position of the line 1 relative to, for example, the stationary housing 20, so that the control device 4 can precisely control the respective laser device 5a, 5b.
  • the laser beams 6a, 6b of the respective laser device 5a, 5b strike the respective layer 1a to 1e of the line 1 at an approximately perpendicular angle.
  • an angle between a normal of the YZ plane, the normal passing through the point of impact 8, and the respective laser beam 6a, 6b of the respective laser device 5a, 5b, which strikes the point of impact 8, is less than 30 °, 25 °, 20 °, 15 °, 10 ° or less than 5 °.
  • the first laser exit opening 15a and the second laser exit opening 15b are arranged at a distance from the central axis 9 and only offset from one another along the central axis 9. In principle, it would also be possible for these to be arranged offset from one another exclusively in the circumferential direction to the central axis 9. A mixture of the two variants, according to which the laser exit openings 15a, 15b are offset from one another both in the circumferential direction of the central axis 9 and along the central axis 9, would also be possible.
  • a distance between the two laser exit openings 15a, 15b, measured along the direction of the central axis 9, is preferably less than approximately 10 cm, in particular less than approximately 1 cm.
  • a distance between the first and / or second laser exit opening 15a, 15b to the central axis 9 is preferably also less than approximately 30 cm, in particular less than 1 cm.
  • the first laser exit opening 15a is arranged on the first laser device 5a, the first laser device 5a delimiting the cable receiving space 21. In principle, it could also be arranged generally on the housing arrangement 22, the first laser device 5a in this case (predominantly) being arranged outside the housing arrangement 20. The same would also apply to the second laser exit opening 15b.
  • a third laser device 5c is also provided, which is designed to generate a third laser beam 6c.
  • Another is fourth laser device 5d is provided, which is designed to generate a fourth laser beam 6d.
  • These further laser devices 5c, 5d are also controlled jointly and independently of one another by the control device 4.
  • the third laser beam 6c has a wavelength that differs from the wavelength of the fourth laser beam 6d, the third layer 1a of the line 1 or layers 1d, 1d of the first material or a material of the third laser beam 6c
  • the first material group can be processed and the second layer 1b or layers made of the second material or a material of the second material group of the line 1 can be processed with the fourth laser beam 6d.
  • the third laser exit opening 15c of the third laser device 5c or the third laser beam 6c is preferably arranged about 180 ° around the central axis 9 to the first laser exit opening 15a of the first laser device 5a or the first laser beam 6a.
  • Laser exit opening 15d with respect to the second laser exit opening 15b.
  • the control device 4 is designed for the first and the third
  • the laser device 5a, 5c To control the laser device 5a, 5c in such a way that the first and third laser beams 6a, 6c hit the line 1 without any offset to one another along the central axis 9 and that the first laser beam 6a processes the line 1 along a first partial circumference and the third laser beam 6c the line 1 along a second partial circumference, the two partial circumferences being arranged largely without overlap with one another.
  • each partial circumference preferably extends over approximately 180 ° (but at least by more than approximately 175 °).
  • the first laser beam 6a and the third laser beam 6c preferably run inclined to one another. In particular, they do not run coaxially with one another, so that the first or third laser beam 6a, 6c cannot enter the exit opening 15a, 15c of the respective other third or first laser beam 6c, 6a.
  • the respective distance from the first and third laser exit areas 15a, 15c and the central axis 9 is approximately identical.
  • the wording "approximately" includes deviations between the two distances of less than approx. 1 cm. The same also applies to the distance between the second and fourth laser exit areas 15b, 15d with respect to the central axis 9.
  • FIG. 5 shows an arrangement of the first laser device 5a and the second laser device 5b around the central axis 9.
  • the central axis 9 also runs through the center of the line 1.
  • a rotating device (not shown) is designed to rotate the first and second laser devices 5a, 5b around the line 1, so that the respective layer 1a up to 1d of line 1 can be processed accordingly.
  • the laser devices 5a, 5b are connected to one another and can therefore be coupled as a unit and synchronized around the central axis 9. 5, a first position of the unit is shown with a continuous line and a second position of the unit, offset by 180 ° with respect to the first position, is shown with dotted lines.
  • FIG. 6 shows an arrangement of the first to fourth laser devices 5a, 5b, 5c, 5d according to FIG. 4B.
  • the first laser beam 6a can process the line 1 in a circumferential range of approximately 180 °.
  • the same also applies to the third laser beam 6c, so that the corresponding layer 1a to 1e can be completely cut by both laser beams 6a, 6b, which operate at the same wavelength.
  • the laser exit openings 15a and 15c of the first and third laser devices 5a, 5c are preferably arranged mirror-symmetrically to the central axis 9. The same also applies to the second and fourth laser devices 5b and 5d.
  • FIG. 7 the cutting space 25 is again highlighted separately by the diamond in the middle.
  • the areas of the respective first to fourth laser devices 5a to 5d in which the respective laser beam 6a to 6d can be pivoted are shown in dashed and dotted lines.
  • the cutting space 25 is the common intersection of all laser beams 6a to 6d, ie the space that all laser beams 6a to 6d can reach together.
  • FIG. 8 also shows the use of a fifth and a sixth laser device 5e, 5f.
  • the fifth laser device 5e is designed to generate a fifth laser beam 6e.
  • the sixth laser device 5f is designed to generate a sixth laser beam 6f.
  • the control device 4 is in turn designed to control the fifth and the sixth laser devices 5e, 5f, preferably together and independently of one another. All laser devices 5a to 5f can each have a corresponding laser beam deflection device 7 and / or a telescopic device 13.
  • the fifth laser beam 6e has a wavelength that differs from the wavelength of the sixth laser beam 6f.
  • the first, third and fifth laser exit openings 15a, 15c, 15e of the respective laser device 5a, 5c, 5e are each offset from one another by approximately approximately 120 ° about the central axis 9.
  • the wording "approximately” includes deviations of less than 20 °, 15 °, 10 ° or less than 5 °. The same also applies to the second, fourth and sixth laser exit openings 15b, 15d and 15f.
  • the control device 4 is designed to control the first, third and fifth laser devices 5a, 5c and 5e in such a way that the first, third and fifth laser beams 6a, 6c and 6e strike the line 1 in the direction of the central axis 9 without an offset from one another and that the first laser beam 6a processes the line 1 along a first partial circumference and the third laser beam 6c processes the line 1 along a second partial circumference and the fifth laser beam 6e processes the line 1 along a third partial circumference, all three partial circumferences being arranged largely without overlap with one another.
  • the first, third and fifth laser devices 5a, 5c and 5e are preferably in operation simultaneously.
  • FIGS. 9A to 9C show various flow diagrams which explain a method according to the invention for laser cutting lines 1 in more detail.
  • the line 1 is introduced into the cutting room 25 in a first method step Si.
  • the second method step S2 is then carried out.
  • the first laser device 5a is activated such that the first laser beam 6a strikes the first layer 1a of the line 1 and cuts this first layer 1a.
  • the third method step S3 is carried out, in which the first laser beam 6a is guided in such a way that the first laser beam 6a intersects the first layer of the line 1 at least along its partial circumference.
  • line 1 could also be rotated.
  • the fourth method step S4 is then carried out, in which the incised first layer 1a is partially removed.
  • a second laser device 5b is activated in such a way that the second laser beam 6b strikes the second layer 1b of the line 1, which was exposed by the partial deduction of the first layer 1a. This second layer 1b is now cut by the second laser beam 6b.
  • step S 6 the second laser beam 6b is guided such that the second laser beam 6b intersects the second layer 1 b of the line 1 at least along its partial circumference.
  • line 1 could also be rotated.
  • the second cut layer 1b is also partially removed.
  • an eighth method step Ss the first laser device 5a or again the second laser device 5b is actuated in such a way that the first and second laser beams 6a, 6b are directed onto the third layer 1c of line 1 meets, which was exposed by the partial deduction of the second layer 1b.
  • This third layer 1c is then cut by the corresponding laser beam 6a, 6b.
  • the corresponding first or second laser beam 6a, 6b is guided such that the respective laser beam 6a, 6b intersects the third layer 1c of the line 1 at least along its partial circumference or this third layer 1c along its partial circumference and along a partial length removes.
  • line 1 could also be rotated again here and moved along the central axis.
  • the second method step S2 includes a further method step S2 a , in which a third laser device 5c is controlled such that the third laser beam 6c strikes the first layer 1a of the line 1 and also cuts this first layer 1a .
  • the third method step S3 would then include a further method step S ßa , in which the third laser beam 6c is also guided, so that the third laser beam 6c also cuts the first layer 1a of the line 1 at least along a partial circumference.
  • laser devices 5a, 5c, and 5b, 5d of different wavelengths can also be operated simultaneously.
  • the line 1 is preferably processed simultaneously at different points along its longitudinal axis.
  • step S 6d meets the second layer 1b of the line 1, which was exposed by the corresponding partial deduction of the first layer 1a and also cuts this second layer 1b.
  • the step S 6 in this case could also include yet another step S 6, the fourth laser beam is performed such 6d in this further process step S 6 that the fourth Laser beam 6d intersects the second layer 1b of the line 1 at least along its partial circumference.
  • laser devices 5a, 5c, 5e and 5b, 5d, 5f which have the same wavelength, are in operation at the same time. These then cut line 1 at the same time. However, line 1 is cut at different points at the same time. In principle, laser devices 5a, 5c, 5e and 5b, 5d, 5f of different wavelengths can also be operated simultaneously. The line 1 is preferably processed simultaneously at different points along its longitudinal axis.
  • a corresponding cut line 1 is also protected, as can be produced by the method steps shown here.
  • Laser cutting device 3 for shielded lines 1 comprises the following feature:
  • the line 1 is arranged in the cutting room 25, wherein a longitudinal axis of the line 1 coincides with the central axis 9.
  • Laser cutting device 3 for shielded lines 1 comprises the following feature:
  • the control device 4 is designed to switch on the first and / or second laser device 5a, 5b only when the respective laser beam deflection device 7 of the respective laser device 5a, 5b is oriented such that the respective laser beam 6a, 6b is directed onto the line 1 meets.
  • Another exemplary embodiment of the laser cutting device 3 according to the invention for shielded lines 1 comprises the following feature:
  • the first and / or third and / or fifth laser device 5a, 5c, 5e is a gas laser such as a CO2 laser; and or
  • the second and / or fourth and / or sixth laser device 5b, 5d, 5f is solid-state laser such as a fiber laser, disk laser or UKP laser (ultra-short pulse laser).
  • Another exemplary embodiment of the laser cutting device 3 according to the invention for shielded lines 1 comprises the following feature:
  • the first material group includes the following materials:
  • shielding foils which comprise metal portions which are applied to only one side of a plastic film, the metal portions being applied exclusively to that side of the plastic film which points in the direction of the center of the line 1;
  • the second material group includes the following materials:
  • a) metal e.g. Wire mesh
  • Screening foils which comprise metal portions which are applied to only one side of a plastic film, the metal portions being applied exclusively to that side of the plastic film which points in the direction of an outside of the line 1.
  • a particular exemplary embodiment of the laser cutting device 3 according to the invention for shielded lines 1 comprises the following feature:
  • the laser source 12 of the respective laser device 5a, 5b, 5c, 5d, 5e, 5f is a pulsed laser source or a continuous beam laser source.
  • the invention is not restricted to the exemplary embodiments described. In the context of the invention, all of the described and / or drawn features can be combined with one another as desired.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)

Abstract

L'invention concerne un dispositif de découpage au laser (3) qui comprend un premier dispositif laser (5a) et un deuxième dispositif laser (5b) qui peuvent être commandés par un système de commande (4). Les faisceaux lasers (6a, 6b) peuvent présenter une longueur d'onde différente. Les deux faisceaux lasers (6a, 6b) peuvent traiter différentes couches (1a, 1b, 1c, 1d, 1e) du fil (1) constituées de différents matériaux. Un ensemble boîtier (20) délimite un espace de réception de câble (21). L'ensemble boîtier (20) est ouvert sur un premier côté frontal (22) de sorte qu'une ouverture d'insertion de câble (23) est formée. Un espace de coupe (25) traversé par un axe central (9) est formé dans l'espace de réception de câble (21). Le premier dispositif laser (5a) et le deuxième dispositif laser (5b) sont disposés et orientés sur l'ensemble boîtier (20) ou dans celui-ci de telle sorte que le premier faisceau laser (6a) et le deuxième faisceau laser (6b) soient émis dans l'espace de coupe (25) de l'espace de réception de câble (21), de sorte que le fil (1) puisse être traité dans l'espace de coupe (25) par le premier faisceau laser (6a) et le deuxième faisceau laser (6b).
PCT/DE2019/100966 2018-11-16 2019-11-11 Dispositif de découpage au laser pour fils et procédé de découpage au laser de fils au moyen d'un tel dispositif WO2020098876A2 (fr)

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DE102018132490.1A DE102018132490A1 (de) 2018-11-16 2018-12-17 Laserschneidevorrichtung für Leitungen und Verfahren zum Laserschneiden von Leitungen mit einer Laserschneidevorrichtung

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Cited By (1)

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DE102021212404A1 (de) 2020-11-04 2022-05-05 Heraeus Deutschland GmbH & Co. KG Verfahren zum herstellen eines ablatierten drahts

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DE102020134396A1 (de) 2020-12-21 2022-06-23 Md Elektronik Gmbh Verfahren und Vorrichtung zum Schneiden und/oder Abtragen von Schichten eines Kabels

Citations (2)

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US4761535A (en) 1987-10-13 1988-08-02 Laser Machining, Inc. Laser wire stripper
WO2017037691A1 (fr) 2015-09-01 2017-03-09 Frisimos Ltd Procédé et système permettant de retirer un blindage tressé d'un câble électrique

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FR2992784B1 (fr) * 2012-06-29 2015-08-07 Laselec Dispositif de denudage de cables electriques utilisant des diodes laser violettes ou bleues
CN204116671U (zh) * 2014-10-22 2015-01-21 苏州曙天激光有限公司 双光耦合式双头激光剥线机
DE102018128922A1 (de) 2018-11-16 2020-05-20 Md Elektronik Gmbh Laserschneidevorrichtung für geschirmte Leitungen und Verfahren zum Laserschneiden von geschirmten Leitungen mit einer solchen Laserschneidevorrichtung

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Publication number Priority date Publication date Assignee Title
US4761535A (en) 1987-10-13 1988-08-02 Laser Machining, Inc. Laser wire stripper
WO2017037691A1 (fr) 2015-09-01 2017-03-09 Frisimos Ltd Procédé et système permettant de retirer un blindage tressé d'un câble électrique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021212404A1 (de) 2020-11-04 2022-05-05 Heraeus Deutschland GmbH & Co. KG Verfahren zum herstellen eines ablatierten drahts

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