WO2020082876A1 - 光学组件、光电模组、深度获取装置及电子设备 - Google Patents

光学组件、光电模组、深度获取装置及电子设备 Download PDF

Info

Publication number
WO2020082876A1
WO2020082876A1 PCT/CN2019/101848 CN2019101848W WO2020082876A1 WO 2020082876 A1 WO2020082876 A1 WO 2020082876A1 CN 2019101848 W CN2019101848 W CN 2019101848W WO 2020082876 A1 WO2020082876 A1 WO 2020082876A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
light
optical element
conductive loop
laser
Prior art date
Application number
PCT/CN2019/101848
Other languages
English (en)
French (fr)
Inventor
陈冠宏
李宗政
林君翰
周祥禾
詹明山
Original Assignee
南昌欧菲生物识别技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201811245305.3A external-priority patent/CN111090175A/zh
Priority claimed from CN201821730257.2U external-priority patent/CN208795947U/zh
Application filed by 南昌欧菲生物识别技术有限公司 filed Critical 南昌欧菲生物识别技术有限公司
Publication of WO2020082876A1 publication Critical patent/WO2020082876A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range

Definitions

  • This application relates to the field of consumer electronics, and more specifically, to an optical component, an optoelectronic module, a depth acquisition device, and electronic equipment.
  • Embodiments of the present application provide an optical component, a photoelectric module, a depth acquisition device, and electronic equipment.
  • the optical component of the embodiment of the present application includes an optical element and a conductive loop, which is used to expand or diffuse laser light; the conductive loop is provided on the optical element, and the conductive loop includes a plurality of conductive lines and connection lines The connection line is used to connect a plurality of the conductive lines. When the optical element is abnormal, the conductive line and / or the connection line is disconnected to disconnect the conductive circuit.
  • the optical component of the present application uses the electrical signal output by the conductive loop to determine whether the optical element is abnormal, and can take timely safety measures when judging that the optical element is abnormal, thereby improving the use safety level of the optical element.
  • the conductive loop is composed of multiple conductive lines and connecting lines, the optical element is judged to be abnormal only when the conductive lines and / or connecting lines are disconnected and the conductive loop is disconnected; When the line is disconnected due to a fault, the conductive loop can still be conducted, and it will not determine that the optical element is abnormal, which will not cause a false fault, that is, the optical element will not be abnormal based on the disconnection of only one conductive line or one connecting line. , And trigger the adoption of security measures to improve the accuracy of anomaly detection.
  • connection line includes a first sub-connection line and a second sub-connection line
  • first sub-connection line is used to connect the conductive lines arranged at a first distance
  • second sub-connection line The connecting line is used to connect the conductive lines arranged at a second distance.
  • the first sub-connection line is used to connect two conductive lines set at a first distance, and the second sub-connection line is connected to a conductive line set at a second distance, so that the probability of the conductive circuit breaking is small, and the occurrence of falseness is reduced.
  • the possibility of failure improves the accuracy of anomaly detection.
  • the optical element includes opposite light entrance surfaces and light exit surfaces, the light entrance surface and the light exit surface are sequentially arranged along the light exit optical path of the laser, and the optical element includes a diffractive micro Structure, the diffractive microstructure is used to expand the laser beam, the diffractive microstructure is provided on the light exit surface, and the conductive loop is provided on the light entrance surface.
  • the diffractive microstructure is a precision structure
  • the diffractive microstructure and the conductive loop are respectively disposed on both sides of the optical element, so as to avoid destroying the diffractive microstructure during the process of the conductive loop covering the diffractive microstructure.
  • the optical element includes opposite light entrance surfaces and light exit surfaces, the light entrance surface and the light exit surface are sequentially arranged along the light exit optical path of the laser, and the optical element includes a diffractive micro Structure, the diffractive microstructure is used to expand the laser beam, the diffractive microstructure is provided on the light incident surface, and the conductive loop is provided on the light exit surface.
  • the conductive loop is arranged on the light-emitting surface, which can avoid the diffractive microstructures arranged on the light-incident surface, avoiding the destruction of the diffractive microstructures in the process of the conductive loop covering the diffractive microstructures.
  • the diffractive microstructure is arranged inside the optoelectronic module, so that the diffractive microstructure is not easily interfered by external water vapor, dust and the like.
  • the optical element is a diffuser, and the optical element includes opposite light entrance surfaces and light exit surfaces, and the light entrance surfaces and the light exit surfaces are sequentially arranged along the light exit optical path of the laser ,
  • the conductive loop is disposed on the light exit surface.
  • the conductive loop can be arranged on the light exit surface, which is convenient for the conductive loop to be connected with an external circuit.
  • the optical element is a diffuser, and the optical element includes opposite light entrance surfaces and light exit surfaces, and the light entrance surfaces and the light exit surfaces are sequentially arranged along the light exit optical path of the laser ,
  • the conductive loop is disposed on the light incident surface.
  • the conductive loop is arranged on the light-incident surface of the diffuser, so that the conductive loop is arranged inside the photoelectric module, so that the conductive loop is not easily interfered by external moisture, dust and the like.
  • the optical element is a diffuser, and the optical element includes opposite light entrance surfaces and light exit surfaces, and the light entrance surfaces and the light exit surfaces are sequentially arranged along the light exit optical path of the laser ,
  • the conductive loop is disposed on the light incident surface and the light exit surface.
  • both the light incident surface and the light emitting surface are provided with a conductive loop
  • the optical component can still pass The electrical signal output by the conductive circuit on the light incident surface is abnormally detected; and when the light incident surface of the optical element is abnormal but does not affect the light exit surface, for example, the optical element ruptures from the light incident surface but does not affect the light exit surface, the optical component Abnormal detection can still be performed through the electrical signal output from the conductive loop on the light exit surface, compared to the fact that only a conductive loop is provided on the light incident surface or the light exit surface, the sensitivity of abnormal detection is higher.
  • the distribution pattern of the conductive loop includes one or more of a meander-shaped distribution pattern, a grid-shaped distribution pattern, and a zigzag-shaped distribution pattern.
  • Conductive loops are provided with reasonable distribution patterns, such as meander-like distribution patterns, grid-like distribution patterns, zigzag-shaped distribution patterns, or a combination of multiple distribution patterns. Scope.
  • the conductive loop includes an input terminal and an output terminal, and the input terminal and the output terminal are respectively electrically connected to an external circuit to form a detection loop.
  • the conductive loop is electrically connected with an external circuit to form a detection loop, and the electrical signal of the detection loop can be used as a basis for abnormal detection of the optical component, thereby improving the safety of the optical component.
  • the optoelectronic module of the embodiment of the present application includes a light source and the optical component described in any of the above embodiments.
  • the light source is used to emit laser light.
  • the optical component is disposed on the light exiting optical path of the light source and used to expand or diffuse the laser beam.
  • the photoelectric module can determine whether the optical element is properly installed in the photoelectric module according to the electrical signal output by the conductive loop, and can determine when the optical element is abnormal , Turn off the light source in time to improve the safety level of the photoelectric module.
  • the optical element is judged to be abnormal only when the conductive line and / or connecting line is disconnected and the conductive loop is disconnected;
  • the conductive loop can still be turned on, without judging the abnormality of the optical element, it will not cause a false fault and turn off the light source, affecting the normal operation of the photoelectric module and improving the accuracy of abnormality detection.
  • the conductive loop includes an input end and an output end, and the input end and the output end are electrically connected to the light source to form a detection loop; when the optical component is abnormal, the detection The circuit is broken.
  • the photoelectric module can determine whether the optical component is abnormal according to the detection circuit, and when the optical component is abnormal, turn off the light source in time to improve the safety level of the photoelectric module.
  • the depth acquisition device includes the photoelectric module and the camera module described in any of the above embodiments.
  • the photoelectric module emits laser light toward the target object.
  • the camera module is used to receive laser light reflected by the target object.
  • the photoelectric module can determine whether the optical element is properly installed in the photoelectric module according to the electrical signal output by the conductive loop, and can determine when the optical element is abnormal , Turn off the light source in time to improve the safety level of the photoelectric module.
  • the optical element is judged to be abnormal only when the conductive line and / or connecting line is disconnected and the conductive loop is disconnected;
  • the conductive loop can still be turned on, without judging the abnormality of the optical element, it will not cause a false fault and turn off the light source, affecting the normal operation of the photoelectric module and improving the accuracy of abnormality detection.
  • An electronic device includes a case and the depth acquisition device described in the above embodiment, and the depth acquisition device is provided on the case.
  • the photoelectric module can determine whether the optical element is installed in the photoelectric module intact according to the electrical signal output by the conductive loop. When the optical element is abnormal, Turn off the light source in time to improve the safety level of the optoelectronic module.
  • the optical element is judged to be abnormal only when the conductive line and / or connecting line is disconnected and the conductive loop is disconnected;
  • the conductive loop can still be turned on, without judging the abnormality of the optical element, it will not cause a false fault and turn off the light source, affecting the normal operation of the photoelectric module and improving the accuracy of abnormality detection.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of this application.
  • FIG. 2 is a schematic structural diagram of a depth acquisition device according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an optoelectronic module according to an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of an optical component according to an embodiment of the present application.
  • FIG 5 is an equivalent circuit diagram of the detection circuit of the photoelectric module according to the embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of an optical component according to another embodiment of this application.
  • FIG. 7 is a schematic structural diagram of a photovoltaic module according to another embodiment of the present application.
  • the first feature “above” or “below” the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly through an intermediary contact.
  • the first feature is “above”, “above” and “above” the second feature may be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontal than the second feature.
  • the electronic device 1000 may be an electronic device capable of acquiring depth, such as a mobile phone, a computer (including a tablet computer, a laptop computer, etc.), a game console, a head-mounted display device, a monitoring device, an access control system, and the like.
  • This application takes the electronic device 1000 as a mobile phone as an example for description.
  • the electronic device 1000 includes a housing 200 and a depth acquisition device 100.
  • the casing 200 can provide protection to the depth acquisition device 100 provided on the casing 200, for example, can isolate water, dust, electromagnetic waves, etc., thereby prolonging the service life of the depth acquisition device 100.
  • a hole corresponding to the depth acquiring device 100 is opened in the housing 200. The light can pass through the hole or into the housing 200.
  • the depth acquisition device 100 can be applied to the fields of face recognition and 3D modeling.
  • the depth acquisition device 100 includes a photoelectric module 10 and a camera module 20.
  • the photoelectric module 10 is used to emit laser light toward a target object, for example, a laser pattern toward a user.
  • the camera module 20 is used to receive laser light reflected by the target object.
  • the depth acquisition device 100 further includes a processor 30.
  • the processor 30 is used for imaging (depth image) according to the laser light received by the camera module 20.
  • the processor 30 is connected to the camera module 20 and the optoelectronic module 10, and the processor 30 is used to process the laser light to obtain a depth image.
  • the depth acquisition device 100 may also be formed with a projection window 40 corresponding to the photoelectric module 10 and a collection window 50 corresponding to the camera module 20.
  • the photoelectric module 10 can project the laser light into the target space through the projection window 40, and the camera module 20 can receive the laser light reflected by the target object through the collection window 50.
  • the depth acquisition device 100 is a structured light depth camera.
  • the photoelectric module 10 of the structured light depth camera can project a speckle pattern or coded structured light pattern.
  • the camera module 20 receives the speckle pattern or To encode the structured light pattern, the processor 30 generates a depth image according to the speckle pattern or the encoded structured light pattern.
  • the depth acquisition device 100 is a time-of-flight (TOF) depth camera.
  • TOF time-of-flight
  • the photoelectric module 10 of the time-of-flight depth camera can emit laser light toward the target object, and the camera module 20 receives the laser light reflected by the target object.
  • the processor 30 calculates the target object and the time difference between the transmitted laser light and the received reflected laser light. Time-of-flight distance between depth cameras to obtain depth information of target objects.
  • the photoelectric module 10 includes a substrate 11, a lens barrel 12, a light source 13 and an optical component 14.
  • the substrate 11 may be used to carry the light source 13.
  • the substrate 11 may be at least one of a flexible circuit board, a rigid circuit board, or a rigid-flex circuit board.
  • the substrate 11 includes a first surface 111 and a second surface 112 opposite to each other.
  • the first surface 111 may be combined with the lens barrel 12 and the light source 13, and the second surface 112 may be combined with an external circuit, for example, with the motherboard of the electronic device 1000.
  • the material of the substrate 11 may be plastic, so that the substrate 11 is light in weight and has sufficient supporting strength.
  • the material of the substrate 11 may be ceramic, so that the substrate 11 can dissipate heat to the light source 13 better.
  • the lens barrel 12 is provided on the substrate 11.
  • the connection modes of the lens barrel 12 and the substrate 11 include screwing, gluing, and snapping.
  • the lens barrel 12 and the substrate 11 jointly form a receiving space 121.
  • Both the light source 13 and the optical component 14 are accommodated in the accommodating space 121, and the lens barrel 12 protects the light source 13 and the optical component 14.
  • the lens barrel 12 includes a side wall 122 and a top wall 123.
  • the top wall 123 may be combined with the optical assembly 14.
  • the light source 13 is used to emit laser light.
  • the light source 13 is provided on the substrate 11.
  • the light source 13 may be carried on the first surface 111 of the substrate 11.
  • the light source 13 includes a light emitting surface 131 away from the first surface 111, and laser light is emitted from the light emitting surface 131.
  • the light source 13 may be a vertical cavity surface emitter (Vertical-Cavity Surface-Emitting Laser, VCSEL).
  • the vertical cavity surface emitter includes a semiconductor substrate and a light-emitting element provided on the substrate.
  • the substrate is provided with an array laser composed of a plurality of light-emitting elements. Specifically, the plurality of light-emitting elements may be in a regular or irregular two-dimensional pattern.
  • the forms are arranged on the substrate. If a vertical cavity surface emitter is used as the light source 13, the irrelevance of the laser light projected on the target object will be higher, which is beneficial to obtain a high-precision depth image.
  • the optical assembly 14 may be disposed on the lens barrel 12 and opposed to the light emitting surface 131 of the light source 13. Specifically, the optical assembly 14 may be fixed on the lens barrel 12 by connection methods such as snapping, gluing, and the like, and housed in the receiving space 121.
  • the optical component 14 includes an optical element 141 and a conductive loop 142.
  • the optical element 141 is used to expand or diffuse laser light, for example, laser light emitted from the light source 13.
  • the optical element 141 includes opposite light entrance surfaces 1411 and light exit surfaces 1412.
  • the light entrance surface 141 and the light exit surface 142 are provided in this order along the light exit optical path of the laser.
  • the light incident surface 141 faces the light emitting surface 131 of the light source 13.
  • the conductive circuit 142 is disposed on the optical element 141.
  • the conductive loop 142 is connected to an external circuit (for example, to the motherboard of the electronic device 1000) to form a complete loop.
  • An electrical signal is input from one end of the conductive loop 142. After the electrical signal passes through the conductive loop 142 with resistance, the size of the electrical signal changes, for example, the current becomes smaller. Therefore, whether the optical element 141 is intact can be determined according to the magnitude of the output electrical signal. Specifically, when the optical element 141 is in a good state and the resistance of the conductive loop 142 is small, the output electrical signal is strong, such as a large current. When the optical element 141 is abnormal, for example, broken, the conductive loop 142 will also be broken.
  • the resistance of the conductive loop 142 is large, and the output electrical signal is weak, such as a small current.
  • the photoelectric module 10 can detect whether the optical element 141 is intactly mounted on the lens barrel 12 by judging the electrical signal output by the conductive loop 142.
  • the photoelectric module 10 takes safety measures in time, for example, turning off the light source 13 to prevent the laser beam emitted by the light source 13 from expanding or spreading on the incomplete optical element 141 Just launch it, burn the user's eyes, and improve the safety level of the optical element 141.
  • the conductive loop 142 includes a plurality of conductive lines 1421 and connection lines 1422.
  • the connection line 1422 is used to connect a plurality of conductive lines 1421.
  • the optical element 141 is abnormal, the conductive line 1421 and / or the connecting line 1422 is disconnected, so that the conductive loop 142 is disconnected.
  • a plurality of conductive lines 1421 and connection lines 1422 cover the surface of the optical element 141.
  • the multiple conductive lines 1421 are connected through the connecting line 1422.
  • the two conductive lines 1421 may be connected through only one connecting line 1422, or may be connected through multiple connecting lines 1422.
  • the conductive lines 1421 spaced apart by the first distance are disconnected together, thereby causing the conductive loop 142 to break open.
  • a connection line 1422 is disconnected so that the conductive loop 142 is disconnected.
  • the conductive line 1421 and the connecting line 1422 may also be disconnected at the same time, thereby disconnecting the conductive loop 142.
  • the disconnection of the conductive loop 142 makes the total resistance of the conductive loop 142 larger, and the output electrical signal is weaker, for example, the current is smaller.
  • one of the conductive lines 1421 or one of the connecting lines 1422 is disconnected due to a fault, for example, one of the conductive lines 1421 or one of the connecting lines 1422 is detached or of poor quality and cannot be conducted.
  • the other conductive lines 1421 provided at a first distance apart With the other connection lines 1422 intact, the conductive loop 142 can still conduct, and current can still flow through the entire surface of the optical element 141.
  • the conductive loop 142 can continue to determine whether the optical element 141 is intact. Therefore, the optoelectronic module 10 does not judge the optical element 141 abnormally only based on the disconnection of one conductive line 1421 or one connecting line 1422, and triggers the adoption of safety measures to avoid causing false faults and triggering the optoelectronic module 10 to take safety measures. For example, turning off the light source 13 makes the photoelectric module 10 unable to project laser light.
  • the conductive loop 142 may be any one of indium tin oxide (ITO), nano silver wire, and metal silver wire. Indium tin oxide, nano silver wire, and metal silver wire all have good light transmittance and conductive properties, which can realize the output of electrical signals after being energized, and at the same time will not block the light path of the optical element 141.
  • ITO indium tin oxide
  • nano silver wire, and metal silver wire all have good light transmittance and conductive properties, which can realize the output of electrical signals after being energized, and at
  • the optical component 14 of the present application uses the electrical signal output by the conductive circuit 142 to determine whether the optical element 141 is abnormal, and can take timely safety measures when determining that the optical element 141 is abnormal, thereby improving the safety level of the optical element 141.
  • the conductive circuit 142 is composed of a plurality of conductive circuits 1421 and the connecting circuit 1422, the optical element 141 is judged to be abnormal only when the conductive circuit 1421 and / or the connecting circuit 1422 is disconnected and the conductive circuit 142 is disconnected.
  • the conductive loop 142 can still be conducted, and the optical element 141 will not be judged to be abnormal, which will not cause a false fault, that is, it will not be based on only one conductive line 1421. Or the disconnection of a connecting line 1422 determines that the optical element 141 is abnormal, and triggers the adoption of safety measures to improve the accuracy of abnormality detection.
  • the conductive circuit 142 of the present application is not limited to be applied to the optical element 141 of the photovoltaic module 10, but can also be applied to other devices that are prone to abnormalities or cracks, such as optical devices. Taking a lens lens as an example, the conductive circuit 142 is provided on the surface of the lens to detect whether the lens is abnormal, thereby ensuring that the optical effect of the lens is better.
  • the photoelectric module 10 can determine the optical element 141 according to the electrical signal output by the conductive loop 142 If it is installed in the photoelectric module 10 intact, the light source 13 can be turned off in time when it is judged that the optical element 141 is abnormal, which improves the use safety level of the photoelectric module 10.
  • the conductive circuit 142 is composed of a plurality of conductive circuits 1421 and the connecting circuit 1422, the optical element 141 is judged to be abnormal only when the conductive circuit 1421 and / or the connecting circuit 1422 are disconnected and the conductive circuit 142 is disconnected.
  • the conductive loop 142 can still be turned on, and the optical element 141 is not judged to be abnormal, and the light source 13 will not be turned off due to a false fault, affecting the photoelectric module 10
  • the normal work of the system improves the accuracy of anomaly detection.
  • the conductive loop 142 includes an input terminal 1423 and an output terminal 1424.
  • the input terminal 1423 and the output terminal 1424 are respectively electrically connected to external circuits to form a detection loop.
  • the input end 1423 and the output end 1424 of the conductive loop 142 may be sequentially arranged on the same side of the optical element 141 (as shown in FIG. 4), or may be arranged on different sides of the optical element 141, for example, the input end 1423 is provided on the optical element as in FIG. On the left side of 141, the output end 1424 is provided on the right side of the optical element 141.
  • the conductive circuit 142 is electrically connected to an external circuit (for example, the main board of the electronic device 1000 in FIG. 1) through the input terminal 1423 and the output terminal 1424 respectively.
  • the lens barrel 12 is further provided with a conductive member 15, and the conductive loop 142 is electrically connected to an external circuit through the conductive member 15.
  • the conductive member 15 may be provided on the outer surface of the lens barrel 12, such as the outer surface 1221 of the side wall 122 and the outer surface 1231 of the top wall 123, or may be provided on the inner surface of the lens barrel 12.
  • the input terminal 1423 and the output terminal 1424 may be electrically connected to the conductive member 15 through a conductive material (for example, conductive adhesive), and the conductive member 15 is electrically connected to an external circuit, thereby forming a detection circuit composed of the conductive circuit 142, the conductive member 15, and the external circuit. Under normal circumstances, the resistance value of the detection circuit is small, and the electrical signal output from the detection circuit is large.
  • the conductive member 15 is a conductive layer.
  • the conductive layer is made of metal.
  • the conductive layer may cover the surface of the lens barrel 12 by electroplating.
  • the conductive layer can improve the accuracy of the detection circuit detection, on the other hand, because the metal has a shielding effect, the conductive layer covering the lens barrel 12 can effectively reduce the interference of external electromagnetic waves on the light source 13, that is, the conductive member 15 has electromagnetic The role of shielding.
  • the conductive loop 142 includes an input end 1423 and an output end 1424.
  • the input end 1423 and the output end 1424 are electrically connected to the light source 13 to form a detection loop.
  • the detection circuit is disconnected.
  • the photoelectric module 10 further includes a substrate circuit 16.
  • the substrate circuit 16 is distributed in multiple layers between the first surface 111 and the second surface 112 of the substrate 11.
  • the substrate circuit 16 is exposed from the first surface 111 for electrical connection with the light source 13 and the conductive member 15, and the substrate circuit 16 is exposed from the second surface 112 for connection with an external circuit.
  • the light source 13 is connected to the substrate circuit 16 on the first surface 111 by wire bonding.
  • a pad is formed on the second surface 112, and the substrate circuit 16 can be connected to an external circuit (such as the motherboard of the electronic device 1000) through the pad.
  • One end of the conductive loop 142 (the left end shown in FIG.
  • the 4 may be the input end 1423 or the output end 1424) is electrically connected to one end of the left conductive member 15 and the other end of the left conductive member 15 is electrically connected to the substrate circuit 16
  • the light source 13 is connected to the substrate circuit 16, and the substrate circuit 16 is also connected to one end of the conductive member 15 on the right side, and the other end of the conductive member 15 on the right side and the other end of the conductive loop 142 (the right end shown in FIG. 5 can be
  • the input terminal 1423 or the output terminal 1424) are electrically connected to form a detection circuit of the conductive circuit 142, the conductive member 15, the substrate circuit 16, and the light source 13 (as shown in FIG. 5).
  • the photoelectric module 10 When the optical element 141 of the optical component 14 is broken, the conductive circuit 142 is disconnected, and the detection circuit is disconnected. At this time, the photoelectric module 10 turns off the light source 13. When the optical component 14 falls off or shifts from the photoelectric module 10, the detection circuit is also disconnected, and at this time, the photoelectric module 10 also turns off the light source 13. In this way, by connecting the light source 13 to the detection circuit, the photoelectric module 10 can determine whether the optical component 14 is abnormal according to the detection circuit, and when the optical component 14 is abnormal, turn off the light source 13 in time to improve the safety level of the photoelectric module 10.
  • the connecting circuit 1422 includes a first sub-connecting circuit 14221 and a second sub-connecting circuit 14222.
  • the first sub-connecting circuit 14221 is used to connect the conductive circuit 1421 at a first distance.
  • the second sub-connection line 14222 is used to connect the conductive lines 1421 arranged at a second distance.
  • connection line 1422 may be connected to the conductive line 1421 arranged at a first distance, or may be connected to the conductive line 1421 arranged at a second distance.
  • the conductive lines 1421 arranged at a first distance may be connected by one or more first sub-connection lines 14221, and the conductive lines 1421 arranged at a second distance may be connected by one or more second sub-connection lines 14222. Taking FIG.
  • every two conductive lines 1421 arranged at a first distance are a group, for example, the first conductive line 1421 from the left and the second conductive line 1421 from the left are the first group, and the third from the left A conductive line 1421 and a fourth conductive line 1421 from the left are the second group, a fifth conductive line 1421 from the left and the sixth conductive line 1421 from the left are the third group, a seventh conductive line 1421 from the left and the left
  • the eighth conductive circuit 1421 is the fourth group, forming a total of four groups of conductive circuits 1421 arranged at a first distance.
  • Four sets of conductive lines 1421 arranged at a first distance are arranged side by side on the surface of the optical element 141.
  • the conductive lines 1421 in the adjacent two groups are arranged at a second distance, for example, the second conductive line 1421 in the first group from the left and the first conductive line 1421 in the second group from the left are at a second distance Settings.
  • Each group of conductive lines 1421 arranged at a first distance is connected by a plurality of first sub-connection lines 14221.
  • Four sets of conductive lines 1421 arranged at a first distance are connected through a plurality of second sub-connection lines 14222.
  • the branch can still be conducted, ensuring that the set of conductive lines 1421 separated by the first distance can still output electrical signals.
  • the conductive loop 142 can still be conductive.
  • a branch of the first group of conductive lines 1421 separated by a first distance from the left, and a branch of a second group of conductive lines 1421 separated by a first distance from the left are disconnected, but, since the first from the left
  • the other branch of the conductive line 1421 set at a first distance from each other and the second branch of the conductive line 1421 set at a first distance from the left can be turned on, and the third group from the left is the first
  • the branch of the conductive line 1421 located at a distance and the branch of the conductive line 1421 arranged at a first distance from the fourth group from the left can also be conducted, therefore, the electrical signal can still flow through the entire surface of the optical element 141, the conductive loop 142 can still continue to detect whether the optical element 141 is intact.
  • the first sub-connection line 14221 is used to connect two conductive lines 1421 arranged at a first distance, and the second sub-connection line 14222 is connected to a conductive line 1421 arranged at a second distance, so that the probability of the conductive loop 142 being broken Smaller, reduces the possibility of false faults, and improves the accuracy of anomaly detection.
  • every three conductive lines 1421 arranged at a first distance are a group, forming a total of four sets of conductive lines 1421 arranged at a first distance, and four sets of conductive lines 1421 arranged at a first distance are arranged side by side in the optical On the surface of the element 141.
  • Each group of conductive lines 1421 arranged at a first distance is connected by a plurality of first sub-connection lines 14221.
  • Four sets of conductive lines 1421 arranged at a first distance are connected through a plurality of second sub-connection lines 14222.
  • a group of conductive lines 1421 arranged at a first distance when one of the branches is broken, that is, one of the conductive lines 1421 or a connecting line 1422 is disconnected, the remaining two of the group of conductive lines 1421 arranged at the first distance Each branch can still be connected, ensuring that the set of conductive lines 1421 separated by a first distance can still output electrical signals.
  • the conductive loop 142 can still be conducted.
  • a branch of the first group of conductive lines 1421 separated by a first distance from the left, and a branch of a second group of conductive lines 1421 separated by a first distance from the left are disconnected, but, since the first from the left
  • the remaining two branches of the conductive line 1421 set at a first distance from each other, and the remaining two branches of the conductive line 1421 set at a first distance from the left can be turned on, and a third group from the left
  • the branch of the conductive line 1421 arranged at the first distance and the branch of the fourth group of conductive lines 1421 arranged at the first distance from the left can also be conducted, so that the electrical signal can still flow through the entire surface of the optical element 141,
  • the conductive loop 142 can still continue to detect whether the optical element 141 is intact.
  • each group is provided with two conductive lines 1421 arranged at a first distance in the embodiment of FIG. 4, the way in which each group is provided with three conductive lines 1421 arranged at a first distance in the embodiment of FIG.
  • the conductive circuit 142 is less likely to break, which further reduces the possibility of false faults and further improves the accuracy of anomaly detection.
  • the number of conductive lines 1421, first sub-connection lines 14221, and second sub-connection lines 14222 are not limited to two, three, and may be four, five, or more than five.
  • the more complicated the connection between the conductive lines 1421 provided at a first distance and the conductive lines 1421 provided at a second distance the less likely the conductive circuit 142 is to open, and the possibility of spurious failure Lower.
  • the distribution pattern of the conductive loop 142 includes one or more of a meander-like distribution pattern, a grid-like distribution pattern, and a zigzag-shaped distribution pattern.
  • the distribution pattern of the conductive loop 142 is composed of the patterns of the conductive line 1421 and the connecting line 1422, wherein the distribution pattern may be a meandering pattern , Grid-like distribution pattern, or zigzag-shaped distribution pattern.
  • the distribution pattern of the conductive loop 142 may also be a combination of various distribution patterns, such as a combination of a meander-shaped distribution pattern and a zigzag distribution pattern, a combination of a grid-shaped distribution pattern and a zigzag distribution pattern, and so on.
  • the distribution pattern of the conductive loop 142 is not limited to the above-listed forms, but can also be other forms, such as a straight-line distribution, the input end 1423 is disposed on the left side of the optical element 141, and the output end 1424 is disposed on the right side of the optical element 141 In the middle, the conductive lines 1421 are linearly distributed.
  • a reasonable distribution pattern such as a meander-like distribution pattern, a grid-like distribution pattern, a zigzag distribution pattern, or a combination of multiple distribution patterns
  • the conductive loop 142 covers a larger area on the optical element 141 and expands the conductive loop 142 The scope of detection.
  • the optical element 141 is a diffractive optical element (Diffractive Optical Elements, DOE) 143.
  • the diffractive optical element 143 is provided with a diffractive microstructure 1431.
  • the diffractive microstructure 1431 is used to expand the laser beam to form a laser pattern. Because the diffractive microstructure 1431 is based on the principle of light diffraction, using computer-aided design, and through the semiconductor chip manufacturing process, a stepped or continuous relief structure (generally a grating structure) produced on the substrate or the surface of traditional optical devices by etching.
  • the diffractive optical element 143 is a type of optical element having coaxial reproduction and extremely high diffraction efficiency.
  • the laser light produces different optical path differences when passing through the diffractive microstructure 1431, satisfying the Bragg diffraction conditions.
  • the divergence angle of the laser and the shape of the light spot can be controlled to realize the function of the laser to form a specific pattern.
  • the diffractive microstructure 1431 is disposed on the light exit surface 1412, and the conductive loop 142 is disposed on the light entrance surface 1411.
  • the diffractive microstructure 1431 is a precise structure, the diffractive microstructure 1431 and the conductive loop 142 are disposed on both sides of the optical element 141, respectively, to avoid destroying the diffractive microstructure 1431 during the process of the conductive loop 142 covering the diffractive microstructure 1431.
  • the diffractive microstructure 1431 is disposed on the light incident surface 1411, and the conductive circuit 142 is disposed on the light exit surface 1412.
  • the conductive loop 142 is disposed on the light exit surface 1412, which can avoid the diffractive microstructure 1431 disposed on the light incident surface 1411, and avoids damaging the diffractive microstructure 1431 during the process of the conductive loop 142 covering the diffractive microstructure 1431.
  • the diffractive microstructure 1431 is disposed inside the photovoltaic module 10, so that the diffractive microstructure 1431 is not easily interfered by external moisture, dust, and the like.
  • the diffractive optical element 143 includes a diffractive area 1432 corresponding to the diffractive microstructure 1431 and a mounting area 1433 surrounding the diffractive area 1432.
  • the mounting area 1433 is used to mount the diffractive optical element 143.
  • the conductive loop 142 corresponds to the diffraction area 1432. Specifically, when the diffraction area 1432 is located on the light incident surface 1411 and the conductive loop 142 is located on the light exit surface 1412, the area covered by the conductive loop 142 corresponds to the diffraction area 1432.
  • the conductive circuit 142 can prevent the laser light emitted by the light source 13 from being projected without diffractive microstructures 1431 when the optical element 141 of the corresponding diffractive region 1432 is abnormal, which may cause burns to the user.
  • the conductive loop 142 corresponds to the diffraction area 1432 and the mounting area 1433 (see FIG. 3).
  • the optical element 141 is abnormal, such as when the photoelectric module 10 is impacted by an external force
  • the mounting area 1433 located at the peripheral edge of the optical element 141 is easily broken or displaced.
  • the area covered by the conductive loop 142 corresponds to both the mounting area 1433 and the diffraction area 1432. In this way, when the optical element 141 of the mounting area 1433 is prevented from being abnormal, the conductive loop 142 located in the diffraction area 1432 can still be conducted.
  • the photoelectric module 10 when the depth acquisition device 100 is a structured light depth camera, the photoelectric module 10 further includes a collimating element 17.
  • the collimating element 17 and the diffractive optical element 143 are sequentially provided on the optical path of the light source 13.
  • the collimating element 17 is used to collimate the laser light emitted by the light source 13, and the diffractive optical element 143 is used to diffract the laser light collimated by the collimating element 17.
  • the collimating element 17 is provided on the lens barrel 12.
  • the combination of the collimating element 17 and the lens barrel 12 includes snapping, gluing, and the like.
  • the collimating element 17 is a lens, which may be a single lens, and the lens is a convex lens or a concave lens; or the collimating element 17 is a plurality of lenses, which may all be convex lenses or concave lenses, or partly convex lenses, partly concave lenses.
  • the optical element 141 is a Diffuser 144.
  • the diffuser 144 is provided on the optical path of the light source 13 and can diffuse the laser light emitted by the light source 13.
  • the diffuser 144 includes opposite light entrance surfaces 1411 and light exit surfaces 1412.
  • the light incident surface 1411 and the light exit surface 1412 are provided in this order along the light exit optical path of the laser.
  • the conductive loop 142 may be disposed on the light exit surface 1412 to facilitate the connection of the conductive loop 142 with an external circuit.
  • the conductive circuit 142 may also be disposed on the light incident surface 1411, so that the conductive circuit 142 is disposed inside the photovoltaic module 10, so that the conductive circuit 142 is not easily interfered by external moisture, dust, and the like.
  • the light-incident surface 1411 and the light-emitting surface 1412 may also be provided with conductive loops 142.
  • both the light incident surface 1411 and the light exit surface 1412 are provided with a conductive loop 142, when the light exit surface 1412 of the optical element 141 is abnormal but does not affect the light incident surface 1411, for example, the optical element 141 ruptures from the light exit surface 1412 but does not affect On the light surface 1411, the optical component 14 can still detect abnormality through the electrical signal output from the conductive circuit 142 on the light incident surface 1411; and when the light incident surface 1411 of the optical element 141 is abnormal but does not affect the light exit surface 1412, such as an optical element 141 ruptures from the light incident surface 1411 but does not affect the light exit surface 1412.
  • the optical component 14 can still detect anomalies through the electrical signal output by the conductive circuit 142 on the light exit surface 1412, as compared to the light incident surface 1411 or the light exit surface 1412 As far as the conductive loop 142 is provided, the sensitivity of abnormality detection is higher.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined as “first” and “second” may include at least one feature either explicitly or implicitly.
  • the meaning of “plurality” is at least two, for example, two or three, unless otherwise specifically limited.

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Semiconductor Lasers (AREA)

Abstract

一种光学组件、光电模组、深度获取装置及电子设备。光学组件（14）包括光学元件（141）和导电回路（142），光学元件（141）用于扩束或扩散激光。导电回路（142）设置在光学元件（141）上。导电回路（142）包括多个导电线路（1421）以及连接线路（1422），连接线路（1421）用于连接多个导电线路（1422）。

Description

光学组件、光电模组、深度获取装置及电子设备
优先权信息
本申请请求2018年10月24日向中国国家知识产权局提交的、专利申请号为201811245305.3的专利申请，及申请号为201821730257.2的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及消费性电子领域，更具体而言，涉及一种光学组件、光电模组、深度获取装置及电子设备。
背景技术
由于现有的光学元件多为精密结构，在遭到外力冲击时容易出现破裂、脱落、移位等异常。假如无法判断光学元件异常而继续使用异常的光学元件，当光学元件对应的光源发出的光能量较高时，例如为激光时，未经光学元件作用的光直接发出去后容易灼伤用户(例如灼伤用户的眼睛)，存在较大的安全隐患。
发明内容
本申请实施方式提供一种光学组件、光电模组、深度获取装置及电子设备。
本申请实施方式的光学组件包括光学元件和导电回路，所述光学元件用于扩束或扩散激光；所述导电回路设置在所述光学元件上，所述导电回路包括多个导电线路以及连接线路，所述连接线路用于连接多个所述导电线路，在所述光学元件异常时，所述导电线路和/或所述连接线路断开而使得所述导电回路断开。
本申请的光学组件利用导电回路输出的电信号判断光学元件是否异常，可以在判断光学元件出现异常时，及时采取安全措施，提高了光学元件的使用安全级别。另外，由于导电回路是由多个导电线路以及连接线路组成，只有在导电线路和/或连接线路断开而使得导电回路断开时，才判断光学元件异常；而在其中一个导电线路或一个连接线路由于故障而断开时，导电回路仍可以导通，不会判断光学元件异常，就不会造成假性故障，即不会仅根据一个导电线路或一个连接线路的断开就判断光学元件异常，而触发采取安全措施，提高了异常检测的准确性。
在某些实施方式中，所述连接线路包括第一子连接线路及第二子连接线路，所述第一子连接线路用于连接间隔第一距离设置的所述导电线路，所述第二子连接线路用于连接间 隔第二距离设置的所述导电线路。
利用第一子连接线路连接两个间隔第一距离设置的导电线路，并利用第二子连接线路连接间隔第二距离设置的导电线路，使导电回路出现断路的几率较小，降低了出现假性故障的可能性，提高了异常检测的准确性。
在某些实施方式中，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述光学元件包括衍射微结构，所述衍射微结构用于扩束所述激光，所述衍射微结构设置在所述出光面上，所述导电回路设置在所述入光面上。
由于衍射微结构为精密结构，衍射微结构和导电回路分别设置在光学元件的两侧，避免了在导电回路覆盖在衍射微结构的工艺过程中，破坏衍射微结构。
在某些实施方式中，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述光学元件包括衍射微结构，所述衍射微结构用于扩束所述激光，所述衍射微结构设置在所述入光面上，所述导电回路设置在所述出光面上。
导电回路设置在出光面上，可以避开设置在入光面上的衍射微结构，避免了在导电回路覆盖在衍射微结构的工艺过程中，破坏衍射微结构。此外，衍射微结构设置在光电模组的内部，使得衍射微结构不容易受到外界的水汽、灰尘等干扰。
在某些实施方式中，所述光学元件为扩散器，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述导电回路设置在所述出光面上。
导电回路可以设置在出光面上，便于导电回路与外部电路连接。
在某些实施方式中，所述光学元件为扩散器，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述导电回路设置在所述入光面上。
导电回路设置在扩散器的入光面上，使得导电回路设置在光电模组的内部，从而导电回路不容易受到外界的水汽、灰尘等干扰。
在某些实施方式中，所述光学元件为扩散器，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述导电回路设置在所述入光面和所述出光面上。
由于入光面和出光面上均设置有导电回路，当光学元件的出光面异常却没有影响到入光面时，例如光学元件自出光面破裂却没有影响到入光面，光学组件仍能通过入光面上的导电回路输出的电信号进行异常检测；而当光学元件的入光面异常却没有影响到出光面时， 例如，光学元件自入光面破裂却没有影响到出光面，光学组件仍能通过出光面上的导电回路输出的电信号进行异常检测，相较于仅在入光面或出光面上设置有导电回路而言，异常检测的灵敏度更高。
在某些实施方式中，所述导电回路的分布图案包括蜿蜒状分布图案、栅状分布图案、回字形分布图案中的一种或多种。
导电回路通过设置合理的分布图案，例如蜿蜒状分布图案、栅状分布图案、回字形分布图案或多种分布图案的组合，导电回路覆盖在光学元件上的面积更大，扩大了导电回路检测的范围。
在某些实施方式中，所述导电回路包括输入端和输出端，所述输入端和所述输出端分别与外部电路电连接以形成检测回路。
导电回路与外部电路电连接以形成检测回路，检测回路的电信号可以用于作为光学组件的异常检测的依据，提高光学组件使用的安全性。
本申请实施方式的光电模组包括光源和上述任一实施方式所述的光学组件。所述光源用于发射激光。所述光学组件设置在所述光源的出光光路上并用于将所述激光扩束或扩散。
本申请的光电模组中，由于光学元件上设置有导电回路，因此光电模组可以根据导电回路输出的电信号判断光学元件是否完好地安装在光电模组内，可以在判断光学元件出现异常时，及时关闭光源，提高了光电模组的使用安全级别。此外，由于导电回路是由多个导电线路以及连接线路组成，只有在导电线路和/或连接线路断开而使得导电回路断开时，才判断光学元件异常；而在其中一个导电线路或一个连接线路由于故障而断开时，导电回路仍可以导通，不会判断光学元件异常，就不会造成假性故障而关闭光源，影响光电模组的正常工作，提高了异常检测的准确性。
在某些实施方式中，所述导电回路包括输入端和输出端，所述输入端及所述输出端分别与所述光源电连接以形成检测回路；在所述光学组件异常时，所述检测回路断开。
将光源接入检测回路中，光电模组能够根据检测回路判断光学组件是否异常，并在光学组件异常时，及时关闭光源，提高光电模组的使用安全级别。
本申请实施方式的深度获取装置包括上述任一实施方式所述的光电模组和相机模组。所述光电模组用于朝目标物体发射激光。所述相机模组用于接收经所述目标物体反射后的激光。
本申请的深度获取装置中，由于光学元件上设置有导电回路，因此光电模组可以根据导电回路输出的电信号判断光学元件是否完好地安装在光电模组内，可以在判断光学元件出现异常时，及时关闭光源，提高了光电模组的使用安全级别。此外，由于导电回路是由多个导电线路以及连接线路组成，只有在导电线路和/或连接线路断开而使得导电回路断开 时，才判断光学元件异常；而在其中一个导电线路或一个连接线路由于故障而断开时，导电回路仍可以导通，不会判断光学元件异常，就不会造成假性故障而关闭光源，影响光电模组的正常工作，提高了异常检测的准确性。
本申请实施方式的电子设备包括壳体和上述实施方式所述的深度获取装置，所述深度获取装置设置在所述壳体上。
本申请的电子设备中，由于光学元件上设置有导电回路，因此光电模组可以根据导电回路输出的电信号判断光学元件是否完好地安装在光电模组内，可以在判断光学元件出现异常时，及时关闭光源，提高了光电模组的使用安全级别。此外，由于导电回路是由多个导电线路以及连接线路组成，只有在导电线路和/或连接线路断开而使得导电回路断开时，才判断光学元件异常；而在其中一个导电线路或一个连接线路由于故障而断开时，导电回路仍可以导通，不会判断光学元件异常，就不会造成假性故障而关闭光源，影响光电模组的正常工作，提高了异常检测的准确性。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1为本申请实施方式的电子设备的结构示意图；
图2为本申请实施方式的深度获取装置的结构示意图；
图3为本申请实施方式的光电模组的结构示意图；
图4为本申请实施方式的光学组件的结构示意图；
图5为本申请实施方式的光电模组的检测回路的等效电路图；
图6为本申请另一实施方式的光学组件的结构示意图；和
图7为本申请另一实施方式的光电模组的结构示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本申请的实施方式是示例性的，仅用于解释本申请的实施方式，而不能理解为对本申请的限制。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以 是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
请参阅图1，本申请实施方式的电子设备1000可以是能够获取深度的电子装置，例如手机、电脑(包括平板电脑、手提电脑等)、游戏机、头显设备、监控设备、门禁系统等。本申请以电子设备1000是手机为例进行说明。具体地，电子设备1000包括壳体200和深度获取装置100。壳体200可以给设置在壳体200上的深度获取装置100提供保护，例如可以隔离水、灰尘、电磁波等，从而延长深度获取装置100的使用寿命。在一个例子中，壳体200上开设有与深度获取装置100对应的孔。光线可以从孔中穿出或穿入壳体200。
请参阅图2，本申请实施方式的深度获取装置100可应用于人脸识别、3D建模等领域。深度获取装置100包括光电模组10和相机模组20。光电模组10用于朝目标物体发射激光，例如朝用户发射激光图案。相机模组20用于接收经目标物体反射后的激光。深度获取装置100还包括处理器30。处理器30用于根据相机模组20接收的激光以成像(深度图像)。具体地，处理器30与相机模组20及光电模组10均连接，处理器30用于处理上述激光以获得深度图像。深度获取装置100上还可以形成有与光电模组10对应的投射窗口40和与相机模组20对应的采集窗口50。光电模组10可以通过投射窗口40向目标空间投射激光，相机模组20可以通过采集窗口50接收经过目标物体反射后的激光。在一个例子中，深度获取装置100为结构光深度相机，结构光深度相机的光电模组10能够投射散斑图案或者编码结构光图案，相机模组20接收经目标物体调制后的散斑图案或者编码结构光图案，处理器30根据散斑图案或者编码结构光图案生成深度图像。在另一个例子中，深度获取装置100为飞行时间(Time of flight，TOF)深度相机。飞行时间深度相机的光电模组10能够朝目标物体发射激光，并由相机模组20接收经目标物体反射后的激光，处理器30根据发射激光与接收反射激光之间的时间差来计算目标物体与飞行时间深度相机之间的距离，从而获得目标物体的深度信息。
请参阅图3，本申请实施方式的光电模组10包括基板11、镜筒12、光源13和光学组件14。
基板11可以用于承载光源13。基板11可以是柔性电路板、硬质电路板或软硬结合电路板中的至少一种。基板11包括相背的第一面111和第二面112。第一面111可以与镜筒12和光源13结合，第二面112可以与外部电路结合，例如与电子设备1000的主板结合。在一个例子中，基板11的材料可以是塑料，如此，基板11质量较轻且具有足够的支撑强度。在另一个例子中，基板11的材料可以是陶瓷，如此，基板11能够较好地对光源13散 热。
镜筒12设置在基板11上。镜筒12与基板11的连接方式包括螺合、胶合、卡合等。镜筒12与基板11共同形成收容空间121。光源13和光学组件14均收容在收容空间121内，镜筒12对光源13以及光学组件14形成保护作用。在一个例子中，镜筒12包括侧壁122及顶壁123。顶壁123可以与光学组件14结合。
光源13用于发射激光。光源13设置在基板11上。在一个例子中，光源13可以承载在基板11的第一面111上。光源13包括远离第一面111的发光面131，激光从发光面131发出。光源13可以为垂直腔面发射器(Vertical-Cavity Surface-Emitting Laser，VCSEL)。垂直腔面发射器包括半导体衬底及设置在衬底上的发光元件，衬底设置由多个发光元件组成的阵列激光器，具体地，多个发光元件可以以规则或者不规则的二维图案的形式排布在衬底上。采用垂直腔面发射器作为光源13，则投射至目标物体的激光的不相关性会更高，有利于获取高精度的深度图像。
光学组件14可以设置在镜筒12上并与光源13的发光面131相对，具体地，光学组件14可以通过卡合、胶合等连接方式固定在镜筒12上，并收容在收容空间121内。光学组件14包括光学元件141和导电回路142。
光学元件141用于扩束或扩散激光，例如从光源13发射的激光。光学元件141包括相背的入光面1411和出光面1412。入光面141和出光面142沿着激光的出光光路依次设置。入光面141与光源13的发光面131相对。
请结合图4，导电回路142设置在光学元件141上。导电回路142与外部电路(例如与电子设备1000的主板)连接以形成完整的回路。从导电回路142的一端输入电信号，电信号在经过具有电阻的导电回路142后，电信号的大小发生改变，例如电流变小，因此依据输出电信号的大小可以判断光学元件141是否完好。具体地，当光学元件141为完好状态时，导电回路142的电阻较小，则输出的电信号较强，比如电流较大。当光学元件141异常时，例如破裂，导电回路142也会破裂，此时导电回路142的电阻较大，则输出的电信号较弱，比如电流较小。此外，当光学元件141从镜筒12上脱落或者发生移位时，导电回路142与外部电路形成的回路也会断开，则导电回路142输出的电信号也较弱，比如电流也较小或者为零。因此，光电模组10通过判断导电回路142输出的电信号，可以检测到光学元件141是否完好地安装在镜筒12上。当检测到光学元件141没有完好地安装在镜筒12上时，光电模组10及时采取安全措施，例如关闭光源13，以防光源13发射的激光在未经完好的光学元件141扩束或扩散就发射出去，灼伤用户的眼睛，提高光学元件141的使用安全级别。
进一步地，导电回路142包括多个导电线路1421以及连接线路1422。连接线路1422 用于连接多个导电线路1421。在光学元件141异常时，导电线路1421和/或连接线路1422断开而使得导电回路142断开。
具体地，多个导电线路1421以及连接线路1422覆盖在光学元件141的表面上。其中，多个导电线路1421通过连接线路1422连接，例如，两个导电线路1421可以仅通过一个连接线路1422连接，还可以通过多个连接线路1422连接。在一个例子中，由于间隔第一距离设置的导电线路1421之间的距离很小，因此在光学元件141异常处，间隔第一距离设置的导电线路1421会一起断开，从而使得导电回路142断开。在另一个例子中，在光学元件141异常处，一个连接线路1422断开就使得导电回路142断开。当然，在光学元件141异常处，导电线路1421和连接线路1422也可以同时断开，从而使得导电回路142断开。导电回路142的断开使得导电回路142的总电阻较大，输出的电信号较弱，比如电流较小。而当其中一个导电线路1421或一个连接线路1422由于故障而断开时，例如一个导电线路1421或一个连接线路1422出现脱落或者品质不良而无法导通，由于间隔第一距离设置的其他导电线路1421及其他连接线路1422为完好状态，导电回路142仍可以导通，电流仍可以流经整个光学元件141的表面，此时导电回路142仍可以继续判断光学元件141是否完好。因此，光电模组10不会仅根据一个导电线路1421或一个连接线路1422的断开就判断光学元件141异常，而触发采取安全措施，避免造成假性故障而触发光电模组10采取安全措施，例如关闭光源13，使得光电模组10无法投射激光。在本实施例中，导电回路142可以为氧化铟锡(Indium tin oxide，ITO)、纳米银丝、金属银线中的任意一种。氧化铟锡、纳米银丝、金属银线均具有良好的透光率及导电性能，可实现通电后的电信号输出，同时不会对光学元件141的出光光路产生遮挡。
本申请的光学组件14利用导电回路142输出的电信号判断光学元件141是否异常，可以在判断光学元件141出现异常时，及时采取安全措施，提高了光学元件141的使用安全级别。另外，由于导电回路142是由多个导电线路1421以及连接线路1422组成，只有在导电线路1421和/或连接线路1422断开而使得导电回路142断开时，才判断光学元件141异常；而在其中一个导电线路1421或一个连接线路1422由于故障而断开时，导电回路142仍可以导通，不会判断光学元件141异常，就不会造成假性故障，即不会仅根据一个导电线路1421或一个连接线路1422的断开就判断光学元件141异常，而触发采取安全措施，提高了异常检测的准确性。需要说明的是，本申请的导电回路142不限于应用在光电模组10的光学元件141中，还可以应用在其他容易异常或者出现裂痕的器件上，例如光学器件。以镜头镜片为例，导电回路142设置在镜片的表面上以检测镜片是否异常，从而保证镜片的光学效果较好。
综上，本申请的电子设备1000、深度获取装置100、光电模组10中，由于光学元件 141上设置有导电回路142，因此光电模组10可以根据导电回路142输出的电信号判断光学元件141是否完好地安装在光电模组10内，可以在判断光学元件141出现异常时，及时关闭光源13，提高了光电模组10的使用安全级别。此外，由于导电回路142是由多个导电线路1421以及连接线路1422组成，只有在导电线路1421和/或连接线路1422断开而使得导电回路142断开时，才判断光学元件141异常；而在其中一个导电线路1421或一个连接线路1422由于故障而断开时，导电回路142仍可以导通，不会判断光学元件141异常，就不会造成假性故障而关闭光源13，影响光电模组10的正常工作，提高了异常检测的准确性。
请参阅图4，在某些实施方式中，导电回路142包括输入端1423和输出端1424。输入端1423和输出端1424分别与外部电路电连接以形成检测回路。
导电回路142的输入端1423和输出端1424可以依次设置在光学元件141的同侧(如图4)，也可以设置在光学元件141的不同侧，例如输入端1423设置在如图4的光学元件141的左侧，输出端1424设置在光学元件141的右侧。导电回路142分别通过输入端1423和输出端1424分别与外部电路(例如图1中的电子设备1000的主板)电连接。请结合图3，在一个例子中，镜筒12上还设置有导电件15，导电回路142通过导电件15与外部电路电连接。具体地，导电件15可以设置在镜筒12的外表面，例如侧壁122的外表面1221以及顶壁123的外表面1231，也可以设置在镜筒12的内表面。输入端1423和输出端1424可以分别通过导电材料(例如导电胶)与导电件15电连接，导电件15与外部电路电连接，从而形成导电回路142、导电件15、外部电路组成的检测回路。在正常情况下，检测回路的电阻值较小，检测回路输出的电信号较大。当检测回路的任意一处位置出现断路时，例如当光学组件14从镜筒12上脱落或者发生移位，会造成导电件15与光学组件14的连接位置出现断路时，检测回路的电阻无穷大，使得检测回路输出的电信号均较小。如此，检测回路的电信号可以用于作为光学组件14的异常检测的依据，提高光学组件14使用的安全性。在一个例子中，导电件15为导电层。导电层由金属制成。导电层可以通过电镀的方式覆盖在镜筒12的表面上。如此，一方面，导电层能提高检测回路检测的准确性，另一方面，由于金属具有屏蔽作用，导电层覆盖镜筒12上可以有效降低外界电磁波对光源13造成干扰，即导电件15具有电磁屏蔽的作用。
请参阅图4，在某些实施方式中，导电回路142包括输入端1423和输出端1424，输入端1423及输出端1424分别与光源13电连接以形成检测回路。在光学组件14异常时，检测回路断开。
请结合图3，具体地，光电模组10还包括基板线路16。基板线路16在基板11的第一面111及第二面112之间呈多层分布。基板线路16从第一面111暴露以用于与光源13及 导电件15电连接，基板线路16从第二面112暴露以与外部电路连接。光源13通过打线与第一面111上的基板线路16连接。第二面112上形成有焊盘，基板线路16可以通过焊盘与外部电路(例如电子设备1000的主板)连接。导电回路142的一端(图4所示的左端，可以为输入端1423或者输出端1424)与左侧的导电件15的一端电连接，左侧的导电件15的另一端与基板线路16电连接，光源13连接在基板线路16上，基板线路16还与右侧的导电件15的一端连接，右侧的导电件15的另一端与导电回路142的另一端(图5所示的右端，可以为输入端1423或者输出端1424)电连接，最终形成导电回路142、导电件15、基板线路16、光源13的检测回路(如图5所示)。当光学组件14的光学元件141破裂时，导电回路142断开，检测回路断开，此时光电模组10关闭光源13。当光学组件14从光电模组10上脱落或者发生移位时，检测回路也会断开，此时光电模组10也会关闭光源13。如此，将光源13接入检测回路中，光电模组10能够根据检测回路判断光学组件14是否异常，并在光学组件14异常时，及时关闭光源13，提高光电模组10的使用安全级别。
请继续参阅图4，在某些实施方式中，连接线路1422包括第一子连接线路14221及第二子连接线路14222，第一子连接线路14221用于连接间隔第一距离设置的导电线路1421，第二子连接线路14222用于连接间隔第二距离设置的导电线路1421。
具体地，连接线路1422既可以连接间隔第一距离设置的导电线路1421，也可以连接间隔第二距离设置的导电线路1421。其中，间隔第一距离设置的导电线路1421可以通过一个或者多个第一子连接线路14221连接，间隔第二距离设置的导电线路1421可以通过一个或者多个第二子连接线路14222连接。以图4为例，每两个间隔第一距离设置的导电线路1421为一组，例如，左起第一个导电线路1421与左起第二个导电线路1421为第一组，左起第三个导电线路1421与左起第四个导电线路1421为第二组，左起第五个导电线路1421与左起第六个导电线路1421为第三组，左起第七个导电线路1421与左起第八个导电线路1421为第四组，一共形成四组间隔第一距离设置的导电线路1421。四组间隔第一距离设置的导电线路1421并排设置在光学元件141的表面。其中，相邻两组中的导电线路1421为间隔第二距离设置，例如，左起第一组的第二个导电线路1421与左起第二组的第一个导电线路1421为间隔第二距离设置。每组间隔第一距离设置的导电线路1421通过多个第一子连接线路14221连接。四组间隔第一距离设置的导电线路1421再通过多个第二子连接线路14222连接。对于一组间隔第一距离设置的导电线路1421，当其中一个支路出现断路，即其中一个导电线路1421或一个连接线路1422断开时，该组间隔第一距离设置的导电线路1421的另外一个支路仍可以导通，确保了该组间隔第一距离设置的导电线路1421仍可以输出的电信号。对于多组间隔第一距离设置的导电线路1421，当其中一个或者多个支路出现断路时，但是由于其他支路可以导通，导电回路142仍可以导通。例如左起第一组间隔 第一距离设置的导电线路1421的一个支路、以及左起第二组间隔第一距离设置的导电线路1421的一个支路均出现断路，但是，由于左起第一组间隔第一距离设置的导电线路1421的另外一个支路、以及左起第二组间隔第一距离设置的导电线路1421的另外一个支路均可以导通，并且左起第三组间隔第一距离设置的导电线路1421的支路、以及左起第四组间隔第一距离设置的导电线路1421的支路也可以导通，因此，电信号仍可以流经光学元件141的整个表面，导电回路142仍可以继续检测光学元件141是否完好。综上，利用第一子连接线路14221连接两个间隔第一距离设置的导电线路1421，并利用第二子连接线路14222连接间隔第二距离设置的导电线路1421，使导电回路142出现断路的几率较小，降低了出现假性故障的可能性，提高了异常检测的准确性。
再如图6，每三个间隔第一距离设置的导电线路1421为一组，共形成四组间隔第一距离设置的导电线路1421，四组间隔第一距离设置的导电线路1421并排设置在光学元件141的表面上。每组间隔第一距离设置的导电线路1421通过多个第一子连接线路14221连接。四组间隔第一距离设置的导电线路1421再通过多个第二子连接线路14222连接。对于一组间隔第一距离设置的导电线路1421，当其中一个支路出现断路，即其中一个导电线路1421或一个连接线路1422断开时，该组间隔第一距离设置的导电线路1421的其余两个支路仍可以导通，确保了该组间隔第一距离设置的导电线路1421仍可以输出的电信号。对于多组间隔第一距离设置的导电线路1421，当其中一个支路或者多个支路出现断路时，但是由于其他支路可以导通，导电回路142仍可以导通。例如左起第一组间隔第一距离设置的导电线路1421的一个支路、以及左起第二组间隔第一距离设置的导电线路1421的一个支路均出现断路，但是，由于左起第一组间隔第一距离设置的导电线路1421的其余两个支路、以及左起第二组间隔第一距离设置的导电线路1421的其余两个支路均可以导通，并且左起第三组间隔第一距离设置的导电线路1421的支路、以及左起第四组间隔第一距离设置的导电线路1421的支路也可以导通，因此，电信号仍可以流经光学元件141的整个表面，导电回路142仍可以继续检测光学元件141是否完好。综上，相较于图4实施例中每组设置两个间隔第一距离设置的导电线路1421的方式，图6实施例中每组设置三个间隔第一距离设置的导电线路1421的方式使导电回路142出现断路的几率更小，进一步降低了出现假性故障的可能性，也进一步提高了异常检测的准确性。
需要说明的是，导电线路1421、第一子连接线路14221、以及第二子连接线路14222的数量不限于两个，三个，还可以为四个、五个或者五个以上。并且，间隔第一距离设置的导电线路1421之间的连接、以及间隔第二距离设置的导电线路1421之间的连接越复杂，导电回路142出现断路的几率越小，出现假性故障的可能性越低。
在某些实施方式中，导电回路142的分布图案包括蜿蜒状分布图案、栅状分布图案、 回字形分布图案中的一种或多种。
当导电回路142包括间隔第一距离设置的导电线路1421及连接线路1422时，导电回路142的分布图案由导电线路1421及连接线路1422的图案共同组成，其中，分布图案可以为蜿蜒状分布图案、栅状分布图案，或者为回字形分布图案。导电回路142的分布图案还可以为多种分布图案的组合，例如蜿蜒状分布图案与回字形分布图案的组合、栅状分布图案与回字形分布图案的组合等。当然，导电回路142的分布图案不限于上述列举的形式，还可以为其他形式，例如直线段状分布，输入端1423设置在光学元件141的左侧，输出端1424设置在光学元件141的右侧，中间的导电线路1421呈直线分布。通过设置合理的分布图案，例如蜿蜒状分布图案、栅状分布图案、回字形分布图案或多种分布图案的组合，导电回路142覆盖在光学元件141上的面积更大，扩大了导电回路142检测的范围。
请参阅图3，在某些实施方式中，当深度获取装置100为结构光深度相机时，光学元件141为衍射光学元件(Diffractive Optical Elements，DOE)143。衍射光学元件143上设置有衍射微结构1431，衍射微结构1431用于扩束激光以形成激光图案。由于衍射微结构1431是基于光的衍射原理，利用计算机辅助设计，并通过半导体芯片制造工艺，在基片上或传统光学器件表面刻蚀产生的台阶型或连续浮雕结构(一般为光栅结构)。因此，衍射光学元件143是具有同轴再现和极高衍射效率的一类光学元件。在本实施例中，激光在通过衍射微结构1431时产生不同的光程差，满足布拉格衍射条件。另外，设计不同的衍射微结构1431，还能控制激光的发散角和形成光斑的形貌，以实现激光形成特定图案的功能。在一个例子中，衍射微结构1431设置在出光面1412上，导电回路142设置在入光面1411上。由于衍射微结构1431为精密结构，衍射微结构1431和导电回路142分别设置在光学元件141的两侧，避免了在导电回路142覆盖在衍射微结构1431的工艺过程中，破坏衍射微结构1431。在另一个例子中，衍射微结构1431设置在入光面1411上，导电回路142设置在出光面1412上。导电回路142设置在出光面1412上，可以避开设置在入光面1411上的衍射微结构1431，避免了在导电回路142覆盖在衍射微结构1431的工艺过程中，破坏衍射微结构1431。此外，衍射微结构1431设置在光电模组10的内部，使得衍射微结构1431不容易受到外界的水汽、灰尘等干扰。
请继续参阅图3，在某些实施方式中，衍射光学元件143包括与衍射微结构1431对应的衍射区域1432及围绕衍射区域1432的安装区域1433。安装区域1433用于安装衍射光学元件143。在一个例子中，导电回路142与衍射区域1432对应。具体地，当衍射区域1432位于入光面1411上，导电回路142位于出光面1412上时，导电回路142覆盖的区域与衍射区域1432对应。如此，导电回路142可以在对应的衍射区域1432的光学元件141异常时，以防止光源13发射的激光未经衍射微结构1431就投射出去，灼伤用户。在另一个例 子中，导电回路142与衍射区域1432及安装区域1433均对应(如图3)。例如当光学元件141异常时，比如光电模组10受到外力撞击的情况下，位于光学元件141周缘位置的安装区域1433容易破裂或者发生移位。导电回路142覆盖的面积与安装区域1433以及衍射区域1432均对应，如此，防止安装区域1433的光学元件141异常时，位于衍射区域1432的导电回路142仍可以导通。
请参阅图3，在某些实施方式中，当深度获取装置100为结构光深度相机时，光电模组10还包括准直元件17。准直元件17以及衍射光学元件143依次设置在光源13的光路上。准直元件17用于准直光源13发射的激光，衍射光学元件143用于衍射经准直元件17准直后的激光。准直元件17设置在镜筒12上。准直元件17与镜筒12的结合方式包括卡合、胶合等。准直元件17为透镜，可以为单独的透镜，该透镜为凸透镜或凹透镜；或者准直元件17为多枚透镜，多枚透镜可均为凸透镜或凹透镜，或部分为凸透镜，部分为凹透镜。
请参阅图7，在某些实施方式中，当深度获取装置100为飞行时间深度相机时，光学元件141为扩散器(Diffuser)144。扩散器144设置在光源13的光路上，并能够扩散光源13发射的激光。扩散器144包括相背的入光面1411和出光面1412。入光面1411和出光面1412沿着激光的出光光路依次设置。在一个例子中，导电回路142可以设置在出光面1412上，便于导电回路142与外部电路连接。在另一个例子中，导电回路142也可以设置在入光面1411上，使得导电回路142设置在光电模组10的内部，从而导电回路142不容易受到外界的水汽、灰尘等干扰。在又一个例子中，入光面1411和出光面1412还可以均设置有导电回路142。由于入光面1411和出光面1412上均设置有导电回路142，当光学元件141的出光面1412异常却没有影响到入光面1411时，例如光学元件141自出光面1412破裂却没有影响到入光面1411，光学组件14仍能通过入光面1411上的导电回路142输出的电信号进行异常检测；而当光学元件141的入光面1411异常却没有影响到出光面1412时，例如光学元件141自入光面1411破裂却没有影响到出光面1412，光学组件14仍能通过出光面1412上的导电回路142输出的电信号进行异常检测，相较于仅在入光面1411或出光面1412上设置有导电回路142而言，异常检测的灵敏度更高。
在本说明书的描述中，参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性 或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个，除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种光学组件，其特征在于，包括：
    光学元件，所述光学元件用于扩束或扩散激光；和
    导电回路，所述导电回路设置在所述光学元件上，所述导电回路包括多个导电线路以及连接线路，所述连接线路用于连接多个所述导电线路，在所述光学元件异常时，所述导电线路和/或所述连接线路断开而使得所述导电回路断开。
  2. 根据权利要求1所述的光学组件，其特征在于，所述连接线路包括第一子连接线路及第二子连接线路，所述第一子连接线路用于连接间隔第一距离设置的所述导电线路，所述第二子连接线路用于连接间隔第二距离设置的所述导电线路。
  3. 根据权利要求1所述的光学组件，其特征在于，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述光学元件包括衍射微结构，所述衍射微结构用于扩束所述激光，所述衍射微结构设置在所述入光面上，所述导电回路设置在所述出光面上；或
    所述衍射微结构设置在所述出光面上，所述导电回路设置在所述入光面上。
  4. 根据权利要求1所述的光学组件，其特征在于，所述光学元件为扩散器，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述导电回路设置在所述入光面上；和/或
    所述导电回路设置在所述出光面上。
  5. 根据权利要求1所述的光学组件，其特征在于，所述导电回路的分布图案包括蜿蜒状分布图案、栅状分布图案、回字形分布图案中的一种或多种。
  6. 根据权利要求1所述的光学组件，其特征在于，所述导电回路包括输入端和输出端，所述输入端和所述输出端分别与外部电路电连接以形成检测回路。
  7. 一种光电模组，其特征在于，包括：
    光源，所述光源用于发射激光；和
    光学组件，所述光学组件设置在所述光源的出光光路上并用于将所述激光扩束或扩散；
    所述光学组件包括：
    光学元件，所述光学元件用于扩束或扩散激光；和
    导电回路，所述导电回路设置在所述光学元件上，所述导电回路包括多个导电线路以及连接线路，所述连接线路用于连接多个所述导电线路，在所述光学元件异常时，所述导电线路和/或所述连接线路断开而使得所述导电回路断开。
  8. 根据权利要求7所述的光电模组，其特征在于，所述连接线路包括第一子连接线路及第二子连接线路，所述第一子连接线路用于连接间隔第一距离设置的所述导电线路，所述第二子连接线路用于连接间隔第二距离设置的所述导电线路。
  9. 根据权利要求7所述的光电模组，其特征在于，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述光学元件包括衍射微结构，所述衍射微结构用于扩束所述激光，所述衍射微结构设置在所述入光面上，所述导电回路设置在所述出光面上；或
    所述衍射微结构设置在所述出光面上，所述导电回路设置在所述入光面上。
  10. 根据权利要求7所述的光电模组，其特征在于，所述光学元件为扩散器，所述光学元件包括相背的入光面和出光面，所述入光面和所述出光面沿着所述激光的出光光路依次设置，所述导电回路设置在所述入光面上；和/或
    所述导电回路设置在所述出光面上。
  11. 根据权利要求7所述的光电模组，其特征在于，所述导电回路的分布图案包括蜿蜒状分布图案、栅状分布图案、回字形分布图案中的一种或多种。
  12. 根据权利要求7所述的光电模组，其特征在于，所述导电回路包括输入端和输出端，所述输入端和所述输出端分别与外部电路电连接以形成检测回路。
  13. 根据权利要求7至12任意一项所述的光电模组，其特征在于，所述导电回路包括输入端和输出端，所述输入端及所述输出端分别与所述光源电连接以形成检测回路；
    在所述光学组件异常时，所述检测回路断开。
  14. 根据权利要求7至12任意一项所述的光电模组，其特征在于，所述导电回路包括输入端和输出端，所述输入端及所述输出端分别与外部电路电连接以形成检测回路；
    在所述光学组件异常时，所述检测回路断开。
  15. 根据权利要求7至12任意一项所述的光电模组，其特征在于，所述光电模组还包括：
    基板；及
    镜筒，所述镜筒设置在所述基板上，所述镜筒与所述基板共同形成收容空间，所述光源及所述光学组件均收容在所述收容空间内。
  16. 一种深度获取装置，其特征在于，包括：
    权利要求7至15任意一项所述的光电模组，所述光电模组用于朝目标物体发射激光；和
    相机模组，所述相机模组用于接收经所述目标物体反射后的激光。
  17. 根据权利要求16所述的深度获取装置，其特征在于，所述深度获取装置为飞行时间深度相机或结构光深度相机。
  18. 根据权利要求16所述的深度获取装置，其特征在于，所述深度获取装置还包括处理器，所述处理器与所述光电模组、所述处理器与所述相机模组均连接，所述处理器用于处理所述相机模组接收的激光以成像。
  19. 根据权利要求16所述的深度获取装置，其特征在于，所述深度获取装置形成有投射窗口及采集窗口，所述光电模组通过所述投射窗口向目标空间投射激光，所述相机模组通过所述采集窗口接收经目标物体反射后的激光。
  20. 一种电子设备，其特征在于，包括：
    壳体；和
    权利要求16至19任意一项所述的深度获取装置，所述深度获取装置设置在所述壳体上。
PCT/CN2019/101848 2018-10-24 2019-08-21 光学组件、光电模组、深度获取装置及电子设备 WO2020082876A1 (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201811245305.3 2018-10-24
CN201811245305.3A CN111090175A (zh) 2018-10-24 2018-10-24 光学组件、光电模组、深度获取装置及电子设备
CN201821730257.2U CN208795947U (zh) 2018-10-24 2018-10-24 光学组件、光电模组、深度获取装置及电子设备
CN201821730257.2 2018-10-24

Publications (1)

Publication Number Publication Date
WO2020082876A1 true WO2020082876A1 (zh) 2020-04-30

Family

ID=70330937

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/101848 WO2020082876A1 (zh) 2018-10-24 2019-08-21 光学组件、光电模组、深度获取装置及电子设备

Country Status (1)

Country Link
WO (1) WO2020082876A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020124008A1 (de) 2020-09-15 2022-03-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung eines packages und optoelektronische vorrichtung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101958110A (zh) * 2009-03-27 2011-01-26 Prysm公司 显示系统中的屏幕破损检测
CN107870186A (zh) * 2017-12-18 2018-04-03 深圳奥比中光科技有限公司 一种含安全监测功能的光学模组
CN108322729A (zh) * 2018-02-27 2018-07-24 广东欧珀移动通信有限公司 激光投射模组的控制方法、控制装置和电子装置
CN108598849A (zh) * 2018-03-20 2018-09-28 维沃移动通信有限公司 一种扩散片、激光器及移动设备
CN208795947U (zh) * 2018-10-24 2019-04-26 南昌欧菲生物识别技术有限公司 光学组件、光电模组、深度获取装置及电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101958110A (zh) * 2009-03-27 2011-01-26 Prysm公司 显示系统中的屏幕破损检测
CN107870186A (zh) * 2017-12-18 2018-04-03 深圳奥比中光科技有限公司 一种含安全监测功能的光学模组
CN108322729A (zh) * 2018-02-27 2018-07-24 广东欧珀移动通信有限公司 激光投射模组的控制方法、控制装置和电子装置
CN108598849A (zh) * 2018-03-20 2018-09-28 维沃移动通信有限公司 一种扩散片、激光器及移动设备
CN208795947U (zh) * 2018-10-24 2019-04-26 南昌欧菲生物识别技术有限公司 光学组件、光电模组、深度获取装置及电子设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020124008A1 (de) 2020-09-15 2022-03-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung eines packages und optoelektronische vorrichtung

Similar Documents

Publication Publication Date Title
CN107783361B (zh) 含有光束监测单元的光学投影装置
EP3259643B1 (en) Integrated optical modules with enhanced reliability and integrity
TWI697729B (zh) 鐳射投射模組、深度相機和電子裝置
CN108388072B (zh) 激光投射模组、深度相机和电子装置
WO2020038066A1 (zh) 光投射器及其破裂的检测方法、深度相机和电子装置
TWI771569B (zh) 鐳射投射模組、深度相機及電子裝置
TWI708451B (zh) 雷射投射器的控制系統、終端和雷射投射器的控制方法
TWI696000B (zh) 鐳射投射模組及其破裂的檢測方法、深度相機和電子裝置
TWI703396B (zh) 承載結構及其形成方法及光學投影模組
WO2020082876A1 (zh) 光学组件、光电模组、深度获取装置及电子设备
JP2014190823A (ja) 情報取得装置および物体検出装置
US20220236381A1 (en) Light emitting module combining enhanced safety features and thermal management
WO2023173885A1 (zh) 光学组件、光发射模组、深度相机及电子设备
CN208795947U (zh) 光学组件、光电模组、深度获取装置及电子设备
WO2023071650A1 (zh) 深度相机、制造光发射模组的方法和终端
CN111090175A (zh) 光学组件、光电模组、深度获取装置及电子设备
CN208653771U (zh) 投影模组、光电装置和电子设备
TWI694296B (zh) 光學投射裝置
US11017124B2 (en) Secure crypto module including optical security pathway
WO2020253686A1 (zh) 激光投射模组、深度相机和电子装置
WO2019223451A1 (zh) 激光投射模组、深度相机和电子装置
CN112393691B (zh) 光发射模组、深度相机及电子设备
WO2021026829A1 (zh) 光发射模组、光接收模组、深度相机和电子设备
CN110441920A (zh) 激光投射模组、深度相机及电子装置
JP2014085280A (ja) 情報取得装置および物体検出装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19876265

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19876265

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 19876265

Country of ref document: EP

Kind code of ref document: A1