WO2019223451A1 - 激光投射模组、深度相机和电子装置 - Google Patents

激光投射模组、深度相机和电子装置 Download PDF

Info

Publication number
WO2019223451A1
WO2019223451A1 PCT/CN2019/082698 CN2019082698W WO2019223451A1 WO 2019223451 A1 WO2019223451 A1 WO 2019223451A1 CN 2019082698 W CN2019082698 W CN 2019082698W WO 2019223451 A1 WO2019223451 A1 WO 2019223451A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens barrel
detection
projection module
protective cover
laser projection
Prior art date
Application number
PCT/CN2019/082698
Other languages
English (en)
French (fr)
Inventor
张学勇
吕向楠
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201810545855.0A external-priority patent/CN108548498A/zh
Priority claimed from CN201810545879.6A external-priority patent/CN110531562A/zh
Priority claimed from CN201810674273.2A external-priority patent/CN108924295B/zh
Priority claimed from CN201810674275.1A external-priority patent/CN108845428B/zh
Priority claimed from CN201810687921.8A external-priority patent/CN108983432B/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019223451A1 publication Critical patent/WO2019223451A1/zh

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/22Measuring arrangements characterised by the use of optical techniques for measuring depth
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets

Definitions

  • the present application relates to the field of optical and electronic technologies, and more particularly, to a laser projection module, a depth camera, and an electronic device.
  • Laser projection modules need to have diffractive optical elements (DOE) on the laser's emission path.
  • Diffractive optical elements are usually glued directly to the lens barrel of the laser projection module through glue, and the glue is easy to fail, resulting in diffractive optics The component is detached. If the laser projection module also emits laser light after the diffractive optical element is detached from the lens barrel, the laser light is likely to burn the user after being directly emitted without passing through the diffractive optical element.
  • DOE diffractive optical elements
  • Embodiments of the present application provide a laser projection module, a depth camera, and an electronic device.
  • the laser projection module includes a substrate assembly, a lens barrel, a diffractive optical element, a protective cover, and a detection component; the lens barrel is disposed on the substrate component; and the diffractive optical element is disposed in the lens barrel.
  • the protection cover is combined with the lens barrel and covers the diffractive optical element; the detection component is used to detect whether the protection cover is detached from the lens barrel.
  • the depth camera includes the laser projection module and the image acquisition device of the above embodiment.
  • the image acquisition device is configured to collect a laser pattern projected into a target space after the diffractive optical element, and The pattern is used to form a depth image.
  • the electronic device includes a casing and the depth camera according to the foregoing embodiment, and the depth camera is disposed on the casing and used to acquire a depth image.
  • FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • FIG. 2 is a schematic structural diagram of a depth camera according to some embodiments of the present application.
  • FIG. 3 is a schematic perspective view of a laser projection module according to some embodiments of the present application.
  • FIG. 4 is a schematic plan view of a laser projection module according to some embodiments of the present application.
  • FIG. 5 is an exploded perspective view of a laser projection module according to some embodiments of the present application.
  • FIG. 6 is a schematic cross-sectional view of the laser projection module shown in FIG. 4 or FIG. 22 along the VI-VI line.
  • FIG. 7 is a schematic cross-sectional view taken along line VI-VI of the laser projection module shown in FIG. 4 or FIG. 22 according to another embodiment of the present application.
  • FIG. 8 is a schematic cross-sectional view of the laser projection module shown in FIG. 4 or FIG. 22 along the line VIII-VIII.
  • FIG. 9 is an enlarged schematic view of part IX of the laser projection module in FIG. 8.
  • FIG. 10 is an enlarged schematic view of an X portion of the laser projection module shown in any one of FIGS. 5, 23, 29, 43, and 60.
  • FIG. 11 is a schematic perspective view of a protective cover of a laser projection module according to some embodiments of the present application.
  • 12 and 13 are partial structural diagrams of a laser projection module according to some embodiments of the present application.
  • FIG. 14 to 16 are schematic plan views of a laser projection module according to some embodiments of the present application with a protective cover removed.
  • FIG. 17 is a schematic structural diagram of a diffractive optical element and a side wall of a lens barrel according to some embodiments of the present application.
  • FIG. 18 is a schematic plan view of a laser projection module according to some embodiments of the present application with a protective cover removed.
  • FIG. 19 is a schematic structural diagram of a diffractive optical element and a side wall of a lens barrel according to some embodiments of the present application.
  • FIG. 20 is a schematic diagram of the working principle of a detection circuit in some embodiments of the present application.
  • FIG. 21 is a schematic perspective view of a laser projection module according to some embodiments of the present application.
  • FIG. 22 is a schematic plan view of a laser projection module according to some embodiments of the present application.
  • FIG. 23 is a schematic exploded perspective view of a laser projection module according to some embodiments of the present application.
  • 24 to 27 are schematic diagrams of the working principle of the detection circuit in some embodiments of the present application.
  • FIG. 28 is a schematic plan view of a laser projection module according to some embodiments of the present application.
  • FIG. 29 is a schematic exploded perspective view of a laser projection module according to some embodiments of the present application.
  • FIG. 30 is a schematic cross-sectional view of the laser projection module shown in FIG. 28 along the line XXX-XXX.
  • FIG. 31 is a schematic cross-sectional view taken along line XXX-XXX of the laser projection module shown in FIG. 28 according to another embodiment of the present application.
  • FIG. 32 is a schematic cross-sectional view of the laser projection module shown in FIG. 28 along a line XXXII-XXXII.
  • FIG. 33 is an enlarged schematic view of a portion XXXIII of the laser projection module in FIG. 32.
  • 34 and 35 are partial structural diagrams of a laser projection module according to some embodiments of the present application.
  • 36 to 38 are schematic plan views of a laser projection module with a protective cover removed in some embodiments of the present application.
  • 39 is a schematic structural diagram of a diffractive optical element and a side wall of a lens barrel according to some embodiments of the present application.
  • FIG. 40 is a schematic diagram of the working principle of a detection circuit in some embodiments of the present application.
  • 41 is a schematic perspective view of a laser projection module according to some embodiments of the present application.
  • FIG. 42 is a schematic plan view of a laser projection module according to some embodiments of the present application.
  • FIG. 43 is a schematic exploded perspective view of a laser projection module according to some embodiments of the present application.
  • FIG. 44 is a schematic cross-sectional view of the laser projection module shown in FIG. 42 along the XLIV-XLIV line.
  • 45 is a schematic cross-sectional view of another embodiment of the present application, taken along the line XLIV-XLIV of the laser projection module shown in FIG. 42.
  • FIG. 46 is a schematic cross-sectional view of the laser projection module shown in FIG. 42 along the XLVI-XLVI line.
  • FIG. 47 is an enlarged schematic view of a XLVII portion of the laser projection module in FIG. 46.
  • 48 and 49 are partial structural diagrams of a laser projection module according to some embodiments of the present application.
  • 50 to 52 are schematic plan views of a laser projection module with a protective cover removed in some embodiments of the present application.
  • 53 is a schematic structural diagram of a diffractive optical element and a side wall of a lens barrel according to some embodiments of the present application.
  • FIG. 54 is an enlarged schematic diagram of a laser projection module corresponding to the XLVII portion in FIG. 46 according to another embodiment of the present application.
  • FIG. 55 is a schematic cross-sectional view taken along line XLIV-XLIV of the laser projection module shown in FIG. 42 according to still another embodiment of the present application.
  • 56 and 57 are schematic diagrams of an arrangement of a transmitter and a receiver in some embodiments of the present application.
  • FIG. 58 is a schematic perspective view of a laser projection module according to some embodiments of the present application.
  • FIG. 59 is a schematic plan view of a laser projection module according to some embodiments of the present application.
  • FIG. 60 is a schematic exploded perspective view of a laser projection module according to some embodiments of the present application.
  • FIG. 61 is a schematic cross-sectional view of the laser projection module shown in FIG. 59 along the line LXI-LXI.
  • FIG. 62 is a schematic cross-sectional view of the laser projection module shown in FIG. 59 along a line LXII-LXII.
  • FIG. 63 is an enlarged schematic diagram of an LXIII portion of the laser projection module in FIG. 62.
  • FIG. 64 is an enlarged schematic view of an LXIV portion of the laser projection module in FIG. 62.
  • FIG. 65 is an enlarged schematic diagram of a laser projection module corresponding to the LXIII portion in FIG. 62 according to another embodiment of the present application.
  • FIG. 66 is an enlarged schematic diagram of a laser projection module corresponding to an LXIV portion in FIG. 62 according to another embodiment of the present application.
  • 67 and 68 are partial structural diagrams of a laser projection module according to some embodiments of the present application.
  • the first feature "on” or “down” of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact.
  • the first feature is “above”, “above”, and “above” the second feature.
  • the first feature is directly above or obliquely above the second feature, or it only indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature.
  • the first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.
  • the laser projection module 10 of the present application includes a substrate assembly 11, a lens barrel 12, a diffractive optical element 15, a protective cover 16, and a detection assembly 70.
  • the lens barrel 12 is disposed on the substrate assembly 11.
  • a diffractive optical element 15 is provided in the lens barrel 12.
  • the protective cover 16 is combined with the lens barrel 12 and covers the diffractive optical element 15.
  • the detecting component 70 is used to detect whether the protective cover 16 is detached from the lens barrel 12.
  • the protective cover 16 can conduct electricity.
  • the detection component 70 includes a detection circuit 71 formed on the substrate assembly 11 and the lens barrel 12.
  • the protection cover 16 is connected to the detection circuit 71. And can form a detection circuit.
  • the laser projection module 10 includes a substrate assembly 11, a lens barrel 12, a diffractive optical element 15, a conductive protective cover 16, and a detection circuit 71.
  • the lens barrel 12 is disposed on the substrate assembly 11.
  • a diffractive optical element 15 is provided in the lens barrel 12.
  • the protective cover 16 is combined with the lens barrel 12 and covers the diffractive optical element 15.
  • the detection circuit 71 is formed on the substrate assembly 11 and the lens barrel 12, and the protective cover 16 is connected to the detection circuit 71 and can form a detection circuit.
  • the protective cover 16 may be made of a conductive material so that the protective cover 16 can conduct electricity.
  • the conductive materials used to make the protective cover 16 include: steel, aluminum, copper, etc .; or the protective cover 16 is made of a non-conductive material, but protects The cover 16 is provided with a conductive line.
  • the protective cover 16 is combined with the lens barrel 12 and is used to restrict (block) the diffractive optical element 15 within the lens barrel 12.
  • the protective cover 16 is electrically connected to the detection circuit 71 as a load (equivalent to a constant resistance).
  • the protective cover 16 When the protective cover 16 is detached from the lens barrel 12, the protective cover 16 is disconnected from the detection circuit 71, and the detection circuit 71 The detection current 71 changes, and the detection circuit 71 can determine whether the protective cover 16 and the lens barrel 12 fall off according to the current change in the detection circuit 71.
  • the detection circuit 71 can be used to detect whether the diffractive optical element 15 has fallen off the lens barrel 12.
  • the laser projection module 10 in the first embodiment of the present application is provided with a protective cover 16 and shields the diffractive optical element 15, so that the diffractive optical element 15 can be more firmly disposed in the lens barrel 12; at the same time, the laser projection module 10 passes A detection circuit 71 is provided and the protective cover 16 is connected to the detection circuit 71.
  • the detection circuit 71 can determine whether the protective cover 16 and the diffractive optical element 15 are off the lens barrel 12 by detecting whether the protective cover 16 is disconnected from the detection circuit 71.
  • the laser projection module 10 stops working to prevent the laser projection module 10 from emitting a laser to burn the user.
  • an electronic device 1000 includes a housing 200 and a depth camera 100.
  • the electronic device 1000 may be a mobile phone, a tablet computer, a laptop computer, a game console, a headset device, an access control system, a teller machine, etc.
  • the embodiment of the present application is described using the electronic device 1000 as a mobile phone. It can be other, and there is no limitation here.
  • the depth camera 100 is disposed in the case 200 and exposed from the case 200 to obtain a depth image.
  • the case 200 can provide protection to the depth camera 100 from dust, water, and drop.
  • the case 200 is provided with the depth camera 100. Corresponding holes to allow light to pass through the holes or into the housing 200.
  • the depth camera 100 is housed in the housing 200 and can extend from the housing 200. At this time, the housing 200 does not need to have a hole corresponding to the light entering direction of the depth camera 100.
  • the depth camera 100 extends from the inside of the housing 200 to the outside of the housing 200; when the depth camera 100 is not needed, the depth camera 100 is received from outside the housing 200 into the housing 200.
  • the depth camera 100 is housed in the housing 200 and is located below the display screen. At this time, the housing 200 does not need to have a hole corresponding to the light entering direction of the depth camera 100.
  • the depth camera 100 includes a laser projection module 10, an image collector 20 and a processor 30.
  • the depth camera 100 may be formed with a projection window 40 corresponding to the laser projection module 10 and an acquisition window 50 corresponding to the image collector 20.
  • the laser projection module 10 is configured to project a laser pattern onto a target space through a projection window 40 (where the laser pattern is a laser with a specific pattern, and the pattern may be a specific speckle or a stripe, etc.)
  • the window 50 collects a laser pattern modulated by the target, and the laser pattern is used to form a depth image.
  • the laser light projected by the laser projection module 10 is infrared light
  • the image collector 20 is an infrared camera.
  • the processor 30 is connected to both the laser projection module 10 and the image collector 20.
  • the processor 30 is configured to process a laser pattern to obtain a depth image.
  • the processor 30 uses an image matching algorithm to calculate a deviation value between each pixel point in the laser pattern and a corresponding pixel point in the reference pattern, and further obtains a depth image of the laser pattern according to the deviation value.
  • the image matching algorithm may be a Digital Image Correlation (DIC) algorithm. Of course, other image matching algorithms can also be used instead of the DIC algorithm.
  • DIC Digital Image Correlation
  • the laser projection module 10 includes a substrate assembly 11, a lens barrel 12, a light source 13, a collimating element 14, a diffractive optical element 15, a protective cover 16, and a detection circuit 71.
  • the light source 13, the collimating element 14, and the diffractive optical element 15 are sequentially disposed on the optical path of the light source 13. Specifically, the light emitted by the light source 13 passes through the collimating element 14 and the diffractive optical element 15 in this order.
  • the substrate assembly 11 includes a substrate 111 and a circuit board 112 carried on the substrate 111.
  • the substrate 111 is used to carry the lens barrel 12, the light source 13 and the circuit board 112.
  • the material of the substrate 111 may be plastic, such as Polyethylene Terephthalate (PET), Polymethyl Methacrylate (PMMA), Polycarbonate (PC), Polyacryl At least one of polyimide (PI). That is, the substrate 111 may be made of a single plastic material of any one of PET, PMMA, PC, or PI. As such, the substrate 111 is lightweight and has sufficient support strength.
  • the circuit board 112 may be any one of a printed circuit board, a flexible circuit board, and a rigid-flexible board.
  • the circuit board 112 can be provided with a via hole 113, and the via hole 113 can be used to receive the light source 13.
  • One part of the circuit board 112 is covered by the lens barrel 12, and the other part extends out and can be connected with the connector 17.
  • the connector 17 can The laser projection module 10 is connected to a motherboard of the electronic device 1000.
  • the lens barrel 12 is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the lens barrel 12 may be connected to the circuit board 112 of the substrate assembly 11, and the lens barrel 12 and the circuit board 112 may be adhered with an adhesive to improve the airtightness of the receiving cavity 121.
  • the accommodating cavity 121 can be used for accommodating components such as the collimating element 14 and the diffractive optical element 15.
  • the accommodating cavity 121 forms a part of the optical path of the laser projection module 10 at the same time.
  • the lens barrel 12 is made of a non-conductive material, for example, the lens barrel 12 is made of plastic, and the plastic includes any one of PET, PMMA, PC, or PI; or, the lens barrel 12 is made of conductive material but the lens barrel 12 The outer surface of the lens barrel is provided with an insulating layer to make the lens barrel 12 non-conductive.
  • the lens barrel 12 is a cylindrical structure, and the lens barrel 12 includes a sidewall 122 and a limiting protrusion 123.
  • the side wall 122 of the lens barrel is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the lens barrel side wall 122 includes a plurality of lens barrel side walls 1221, each of the lens barrel side walls 1221 is combined with the substrate assembly 11, and the plurality of lens barrel side walls 1221 are sequentially connected in a ring shape and collectively surround the receiving cavity 121.
  • the ends of any two connected lens barrel side walls 1221 form a support angle 1222 together, and four support angles 1222 are formed on the lens barrel 12 of this embodiment.
  • the outer wall of the side wall 122 of the lens barrel may be formed with a positioning and mounting structure to facilitate fixing the position of the laser projection module 10 when the laser projection module 10 is installed in the electronic device 1000.
  • the lens barrel 12 includes a first surface 124 and a second surface 125 opposite to each other. One opening of the receiving cavity 121 is opened on the second surface 125 and the other opening is opened on the first surface 124.
  • the second surface 125 is bonded to the circuit board 112, such as gluing, and the first surface 124 can be used as a bonding surface between the lens barrel 12 and the diffractive optical element 15 or the protective cover 16.
  • the outer wall of the side wall 122 of the lens barrel is provided with an adhesive containing groove 126.
  • the adhesive containing groove 126 may be opened from the first surface 124 and extended toward the second surface 125.
  • the limiting protrusion 123 protrudes inward from the side wall 122 of the lens barrel. Specifically, the limiting protrusion 123 protrudes from the side wall 122 of the lens barrel into the receiving cavity 121.
  • the limiting protrusions 123 may be in a continuous ring shape, or the limiting protrusions 123 include a plurality of limiting protrusions 123 spaced apart from each other.
  • the limiting protrusion 123 forms a light-passing hole 1231.
  • the light-passing hole 1231 can be used as a part of the receiving cavity 121. The laser light passes through the light-passing hole 1231 and penetrates the diffractive optical element 15. In the embodiment shown in FIG.
  • the limiting protrusion 123 is located between the first surface 124 and the second surface 125, and the receiving cavity 121 between the limiting protrusion 123 and the second surface 125 can be used for receiving the standard
  • the receiving cavity 121 between the straight element 14, the limiting protrusion 123 and the first surface 124 can be used for receiving the diffractive optical element 15.
  • the diffractive optical element 15 and the limiting projection 123 abut it can be considered that the diffractive optical element 15 is installed in place, and when the collimating element 14 and the limiting projection 123 abut, it can be considered as collimation Element 14 is installed in place.
  • the limiting protrusion 123 includes a limiting surface 1232. When the diffractive optical element 15 is mounted on the limiting protrusion 123, the limiting surface 1232 is combined with the diffractive optical element 15.
  • the light source 13 is disposed on the substrate assembly 11. Specifically, the light source 13 may be disposed on the circuit board 112 and electrically connected to the circuit board 112, and the light source 13 may also be disposed on the substrate 111 and correspond to the via hole 113. At this time, the light source 13 may be electrically connected to the circuit board 112 by arranging a wire.
  • the light source 13 is used to emit laser light.
  • the laser light may be infrared light.
  • the light source 13 may include a semiconductor substrate and an emission laser disposed on the semiconductor substrate.
  • the semiconductor substrate is disposed on the substrate 111.
  • the emission laser may be vertical. Cavity Surface Emitting Laser (Vertical Cavity Surface Emitting Laser, VCSEL).
  • the semiconductor substrate may be provided with a single emission laser or an array laser composed of a plurality of emission lasers. Specifically, the plurality of emission lasers may be arranged on the semiconductor substrate in the form of a regular or irregular two-dimensional pattern.
  • the collimating element 14 may be an optical lens.
  • the collimating element 14 is used to collimate the laser light emitted by the light source 13.
  • the collimating element 14 is housed in the receiving cavity 121.
  • the direction of the first surface 124 is assembled into the receiving cavity 121.
  • the collimating element 14 includes an optical portion 141 and a mounting portion 142.
  • the mounting portion 142 is used to combine with the lens barrel sidewall 122 and fix the collimating element 14.
  • the optical portion 141 includes Two surfaces on both sides.
  • the diffractive optical element 15 is mounted on the limiting protrusion 123. Specifically, the diffractive optical element 15 is combined with the limiting surface 1232 to be mounted on the limiting protrusion 123.
  • the outer surface of the diffractive optical element 15 includes a top surface 151, a diffractive bottom surface 152, and a side surface 153.
  • the top surface 151 and the diffractive bottom surface 152 are opposite to each other, and the side surface 153 connects the top surface 151 and the diffractive bottom surface 152.
  • a diffractive structure is formed on the diffractive bottom surface 152, and the top surface 151 may be a smooth plane.
  • the diffractive optical element 15 may project the laser light collimated by the collimating element 14 to a laser pattern corresponding to the diffractive structure.
  • the diffractive optical element 15 may be made of glass, or it may be said to be made of a composite plastic such as PET.
  • the protective cover 16 is combined with the lens barrel 12.
  • the protective cover 16 is used to limit the position of the diffractive optical element 15.
  • the protective cover 16 is used to prevent the combination of the diffractive optical element 15 and the lens barrel 12 from failing. Then it comes out of the lens barrel 12.
  • the protective cover 16 is conductive.
  • the protective cover 16 may be made of a conductive material, or a conductive line is provided on the protective cover 16.
  • the protective cover 16 includes a protective top wall 161 and a protective side wall 162.
  • the protective top wall 161 and the limiting protrusion 123 are located on opposite sides of the diffractive optical element 15, respectively, or the diffractive optical element 15 is located between the limiting protrusion 123 and the protective top wall 161.
  • the combination of 15 and the limiting protrusion 123 is invalid. Due to the restricting effect of the protective top wall 161, the diffractive optical element 15 will not come out.
  • the protective top wall 161 is provided with a light through hole 1611, the position of the light through hole 1611 corresponds to the diffractive optical element 15, and the laser light passes through the light through hole 1231, the diffractive optical element 15 and the light through hole 1611, and then passes through the laser projection module 10 Shoot out.
  • the overall shape of the protective top wall 161 is a rounded square, and the light through hole 1611 may be circular, rectangular, oval, trapezoidal, or the like.
  • the protective top wall 161 abuts against the first surface 124. Further, the protective top wall 161 may also be adhered to the first surface 124 by gluing. And so on.
  • the protective sidewall 162 extends from the periphery of the protective top wall 161.
  • the protective cover 16 covers the lens barrel 12.
  • the protective sidewall 162 is fixedly connected to the lens barrel sidewall 122.
  • the protective side wall 162 includes a plurality of protective sub-side walls 1621 that are connected in sequence from end to end. Each protective sub-side wall 1621 is fixedly connected to the side wall 122 of the lens barrel. Each protective sub-side wall 1621 forms a little glue hole 163. .
  • the position of the dispensing hole 163 corresponds to the position of the accommodating groove 126. After the protective cover 16 is placed on the lens barrel 12, the glue can be dispensed from the dispense hole 163 into the accommodating groove 126.
  • each protective sub-side wall 1621 is provided with a single dispensing hole 163.
  • each protective sub-side wall 1621 is provided with multiple dispensing holes 163, such as two, three , Four, etc.
  • two sidewalls 1621 of each protection sub-side are provided with two dispensing holes 163, and the two dispensing holes 163 respectively correspond to the two inner sidewalls 1261 of the accommodating groove 126, which is convenient. The user dispenses to both sides of the accommodating tank 126 at the same time, thereby increasing the dispensing speed.
  • the inner side wall 1261 of the rubber containing groove 126 is inclinedly connected to the inner bottom wall 1262 of the rubber containing groove 126 and the outer wall of the lens barrel side wall 122.
  • the oblique connection refers to the inner side wall 1261 and the inner bottom wall 1262, and the inner side wall 1261 and the mirror.
  • the outer wall of the cylinder side wall 122 is not vertical.
  • the detection circuit 71 is formed on the substrate assembly 11 and the lens barrel 12, and the protective cover 16 is connected to the detection circuit 71 and can form a detection circuit.
  • the detection circuit 71 includes a detection circuit 711 and a positive connection terminal 712 and a negative connection terminal 713 which are electrically connected to the detection circuit 711.
  • the detection circuit 711 is formed on the substrate assembly 11 and the lens barrel 12.
  • the detection circuit 711 includes a first detection sub-circuit 7111 and a second detection sub-circuit 7112.
  • the first detection sub-circuit 7111 is formed on the substrate assembly 11 and the lens barrel 12.
  • connection end 712 is located at one end of the first detection sub-line 7111 and is disposed on the lens barrel 12, and the second detection sub-line 7112 is also formed on the substrate assembly 11 and the lens barrel 12 and is spaced from the first detection sub-line 7112.
  • the negative electrode is connected
  • the end 713 is located at one end of the second detection sub-line 7112 and is disposed on the lens barrel 12.
  • the first detection sub-line 7111 formed on the lens barrel 12 is located on the outer side surface 120 of the lens barrel 12 and is distributed along a support angle 1222 of the lens barrel 12.
  • the positive electrode connection end 712 is provided at the support angle 1222.
  • the first surface 124 is connected to the first detection sub-line 7111, and the positive electrode connection end 712 and the protective cover 16 (protective top wall 161) are welded, connected by a spring, inserted, or bonded with conductive adhesive. Way to electrically connect.
  • the second detection sub-line 7112 formed on the lens barrel 12 is located on the outer side surface 120 of the lens barrel 12 and is distributed along the other support angle 1222 of the lens barrel 12.
  • the negative connection end 713 is disposed on the first surface at the support angle 1222.
  • the negative connection terminal 713 and the protective cover 16 are electrically connected by any one or more of the following methods: welding, spring connection, plug connection, and conductive adhesive bonding. connection.
  • the positive connection end 712 and the negative connection end 713 may be respectively disposed on two support angles 1222 at opposite ends of a side wall 1221 of a lens barrel; or, the positive connection end 712 and the negative connection end 713 may be respectively provided on sides of different lens barrels.
  • the wall 1221 forms two support angles 1222.
  • the protective top wall 161 includes a top wall bottom surface 1612 that is in contact with the first surface 124.
  • the top wall bottom surface 1612 is provided with a first connection end (not shown) corresponding to the positive electrode connection end 712, and A second connection terminal (not shown) corresponding to the negative electrode connection terminal 713.
  • the positive connection end 712 is a pin and the first connection end is a pad
  • the positive connection end 712 and the first connection end can be connected together by welding or conductive adhesive bonding.
  • the protective sidewall 162 is provided with Welding holes (not shown) that pass through the protective sidewall 162 and correspond to both the positive connection end 712 and the first connection end.
  • the user can weld or bond the positive connection end 712 and the first connection end together through the welding holes; when When the positive connection terminal 712 is an elastic piece (spring structure) and the first connection terminal is a contact, the positive connection terminal 712 is in contact with the first connection terminal and is electrically connected to the first connection terminal. At this time, the positive connection terminal 712 is connected to the first connection
  • the terminal is a spring connection; when the positive terminal 712 is a pin and the first terminal is a plug port, the positive terminal 712 and the first terminal can be connected together by plugging.
  • the negative connection terminal 713 and the second connection terminal can be connected by welding, springs, plugs or conductive. Adhesive connection.
  • the protective cover 16 since the protective cover 16 is combined with the lens barrel 12, the protective top wall 161 of the protective cover 16 and the limiting protrusion 123 limit the position of the diffractive optical element 15 together with the diffractive optical element 15. It will not fall off in the direction of light output, avoiding the laser beam being emitted without passing through the diffractive optical element 15, protecting the user and improving safety.
  • the laser projection module 10 is provided with a detection circuit 71 and the protection cover 16 is connected to the detection circuit 71.
  • the detection circuit 71 can determine whether the protection cover 16 and the diffractive optics are determined by detecting whether the protection cover 16 is disconnected from the detection circuit 71. Whether the component 15 is detached from the lens barrel 12.
  • the detection circuit 71 detects that the protective cover 16 is detached from the lens barrel 12, the laser projection module 10 stops working to prevent the laser projection module 10 from emitting a laser to burn the user. Furthermore, the detection circuit 71 located on the lens barrel 12 is formed on the outer side surface 120 of the sidewall 122 of the lens barrel, so that the detection circuit 71 is easily fabricated on the lens barrel 12.
  • the limiting protrusion 123 may also be formed on the top of the lens barrel 12. Specifically, the limiting surface 1232 of the limiting protrusion 123 may be the same as the first When the surfaces 124 are superposed, when the diffractive optical element 15 is mounted on the limiting protrusion 123, the diffractive optical element 15 is combined with the first surface 124. At this time, the protective top wall 161 and the diffractive optical element 15 abut against each other, and the protective top wall 161 and the limiting protrusion 123 sandwich the diffractive optical element 15 together. In this way, the structure of the lens barrel 12 is simple, and the diffractive optical element 15 can be easily mounted on the limiting protrusion 123.
  • the protective cover 16 further includes an elastic first hook 164 protruding inward from the protective side wall 162.
  • the second hook 127 protruding outward from the inner bottom wall 1262 of the rubber container 126.
  • the position of the first hook 164 corresponds to the position of the second hook 127.
  • the first hook 164 and the second hook 127 are in contact with each other and elastically deformed.
  • the first hook 164 and the second hook 127 engage with each other, and will be accompanied by tactile feedback and a “click” sound when they are in place.
  • the protection cover 16 and the lens barrel 12 are more reliably combined, and before the protection cover 16 is bonded to the lens barrel 12 with glue, the first hook 164 and the second hook 127 can be engaged with each other, which can be effectively fixed.
  • the relative position of the protective cover 16 and the lens barrel 12 facilitates the dispensing.
  • a first hook 164 is formed on each protective sub-side wall 1621.
  • a plurality of second hooks 127 are also provided in the plurality of rubber containing grooves 126.
  • the second hooks 127 correspond to the positions of the first hooks 164, and the plurality of first hooks 164 correspond to the corresponding second hooks 127.
  • the combination of the protective cover 16 and the lens barrel 12 is more reliable.
  • the first hook 164 may correspond to the middle position of the protective side wall 1621
  • the second hook 127 may correspond to the middle position of the rubber-containing groove 126.
  • the first hook 164 is located between the at least two dispensing holes 163, more specifically, at least two in each protective sub-side wall 1621
  • the dispensing holes 163 are symmetrically distributed with respect to the first hook 164. In this way, it is convenient for the glue to flow on both sides of the first hook 164 and the second hook 127 respectively, and the amount of glue on both sides is equal, and the adhesive force is relatively uniform.
  • the protective sidewall 162 is provided with an escape hole 165 at a position corresponding to the first hook 164.
  • the avoidance hole 165 provides the elastic deformation of the first hook 164.
  • the deformation space, that is, the first hook 164 is elastically deformed and extends into the avoidance hole 165.
  • the first hook 164 and the second hook 127 collide, the first hook 164 elastically deforms outward, and the first hook 164 extends into the avoidance hole 165 to avoid movement interference with the protective side wall 162. It is also convenient for the user to observe the cooperation between the first hook 164 and the second hook 127 through the avoidance hole 165, for example, to determine whether all the first hooks 164 are engaged with the corresponding second hooks 127.
  • the second hook 127 is formed with a guide bevel 1271.
  • the guide bevel 1271 moves away from the protective cover 16 in the direction of the lens barrel 12.
  • the inner bottom wall 1262 and the protective cover 16 are disposed on the lens barrel 12.
  • the first hook 164 abuts the guiding inclined surface 1271. Because the guide inclined surface 1271 is inclined with respect to the inner bottom wall 1262, during the cooperation between the first hook 164 and the second hook 127, the resistance force of the second hook 127 received by the first hook 164 slowly and continuously increases. Large, the amount of deformation of the first hook 164 is also continuously increased, and the first hook 164 and the second hook 127 are easily engaged.
  • a first positioning portion 128 is formed on the lens barrel 12, and a second positioning portion 154 is formed on the outer surface of the diffractive optical element 15. And only when the diffractive bottom surface 152 of the diffractive optical element 15 is combined with the limiting protrusion 123, the first positioning portion 128 cooperates with the second positioning portion 154. It can be understood that the structure of the diffractive bottom surface 152 and the top surface 151 of the diffractive optical element 15 is different, and the effects of the diffractive bottom surface 152 and the top surface 151 on the laser are different.
  • the diffractive optical element 15 In use, if the diffractive optical element 15 is installed in reverse (top surface 151) In combination with the limiting protrusion 123), the diffractive optical element 15 will not be able to diffract the required laser pattern, and may even cause the laser to be concentratedly emitted, which may easily burn the user.
  • the first positioning portion 128 and the second positioning portion 154 in this embodiment can be properly matched only when the diffractive bottom surface 152 is combined with the limiting protrusion 123, and when the fitting relationship between the diffractive optical element 15 and the lens barrel 12 is not the diffractive bottom surface 152 and When the limiting surface 1232 of the limiting protrusion 123 is combined, neither the first positioning portion 128 nor the second positioning portion 154 can be properly matched and it is easy for the user to notice. This prevents the erroneous mounting of the diffractive optical element 15.
  • the first positioning portion 128 includes a first chamfer 1281, and the first chamfer 1281 is formed on the limiting protrusion 123 and the side wall of the lens barrel. Where the 122 intersects, specifically, the first chamfer 1281 is formed at the intersection of the limiting surface 1232 and the sidewall 122 of the lens barrel.
  • the second positioning portion 154 includes a second chamfer 1541 formed at the intersection of the diffractive bottom surface 152 and the side surface 153 of the diffractive optical element 15. The inclination angles of the first chamfer 1281 and the second chamfer 1541 can be equal.
  • the top surface 151 will collide with the second chamfer 1541, resulting in the diffractive optical element 15 being damaged.
  • the second chamfer 1541 is raised, and the user can easily perceive that the diffractive optical element 15 is reversed. Therefore, the first chamfer 1281 and the second chamfer 1541 can prevent the diffractive optical element 15 from being reversed.
  • the first positioning portion 128 includes a limiting surface recess 1282 formed on the limiting surface 1232
  • the second positioning portion 154 includes a protrusion protruding from the diffractive bottom surface 152.
  • the bottom surface bump 1542 when the diffractive bottom surface 152 is combined with the limit protrusion 123, the bottom surface bump 1542 projects into the limit surface depression 1282.
  • the bottom surface bump 1542 corresponds to the position of the limit surface depression 1282, and the number of the bottom surface bump 1542 and the limit surface depression 1282 are equal.
  • the shape of the bottom surface bump 1542 can be cylindrical, circular truncated, prismatic, etc., It can be understood that if the user mounts the diffractive optical element 15 upside down, the diffractive bottom surface 152 faces upward and the bottom convex block 1542 makes the diffractive optical element 15 uneven after installation, and the user easily perceives that the diffractive optical element 15 is reversed, so the bottom convex block 1542 is installed.
  • the recess 1282 with the limiting surface can prevent the diffractive optical element 15 from being mounted reversely.
  • the first positioning portion 128 includes a limiting surface projection 1283 protruding from the limiting surface 1232
  • the second positioning portion 154 includes a diffractive bottom surface 152.
  • the bottom surface depression 1543 is formed.
  • the diffractive bottom surface 152 is combined with the limiting protrusion 123
  • the limiting surface protrusion 1283 extends into the bottom surface depression 1543.
  • the position-limiting surface bumps 1283 correspond to the positions of the bottom-surface depressions 1543, and the number of the position-limiting surface bumps 1283 and the bottom-surface depressions 1543 are equal.
  • the shape of the position-limiting surface bumps 1283 can be cylindrical, circular truncated, or prismatic.
  • the limiting surface bump 1283 will offset the diffractive bottom surface 152, which causes the diffractive optical element 15 to be elevated by the limiting surface bump 1283, and the user can easily perceive the diffractive optical element. 15 is reversed, so the limiting surface bumps 1283 and the bottom recess 1543 can prevent the diffractive optical element 15 from being reversed.
  • the first positioning portion 128 includes a lens barrel recess 1284 formed on the side wall 122 of the lens barrel, and the second positioning portion 154 includes a protrusion outward from the side surface 153 of the diffractive optical element 15.
  • the side bump 1544 when the diffractive bottom surface 152 is combined with the limiting protrusion 123, the side bump 1544 projects into the lens barrel depression 1284.
  • the side bumps 1544 correspond to the positions of the lens barrel depressions 1284, and the number of the side bumps 1544 and the lens barrel depressions 1284 are equal.
  • the shape of the side bumps 1544 cut by a plane parallel to the diffractive bottom surface 152 may be rectangular or semicircular , Triangle, trapezoid, or circle. It can be understood that if the user mounts the diffractive optical element 15 upside down, the side projection 1544 will abut against the side wall 122 of the lens barrel, resulting in that the diffractive optical element 15 cannot be mounted on the limiting protrusion 123, and the user can easily perceive that the diffractive optical element 15 is damaged. Mounting is reversed, so the side bumps 1544 and the lens barrel recesses 1284 can prevent the diffractive optical element 15 from being reversed.
  • the side surface 153 includes a plurality of sub-side surfaces 1531 connected in sequence from end to end, and the number of the lens barrel depression 1284 and the side projections 1544 are single.
  • the side bump 1544 is formed at a position other than the middle position of the sub-side surface 1531.
  • the side bumps 1544 can be opened at other positions than the middle position of the sub-side 1531, preventing the user from installing the side bumps 1544 when the diffractive optical element 15 is reversed.
  • the number of lens barrel depressions 1284 and the side bumps 1544 are equal and multiple, and the shape of each side bump 1544 is corresponding to the corresponding lens barrel depression. 1284 has the same shape, and different side bumps 1544 have different shapes.
  • the same shape of the side projection 1544 as the lens barrel depression 1284 means that the outer contour of the side projection 1544 is the same as the hollow shape of the lens barrel depression 1284.
  • the side bumps 1544 and the lens barrel recess 1284 that do not correspond to each other cannot be completely matched due to different shapes, and the user can easily detect whether the diffractive optical element 15 is correctly installed.
  • the side surface 153 includes a plurality of sub-side surfaces 1531 connected in sequence from end to end.
  • the number of lens barrel depressions 1284 and the side projections 1544 are equal and multiple.
  • the plurality of side bumps 1544 are not symmetrical about an intermediate position of any one of the sub-side faces 1531.
  • the diffractive optical element 15 has a square shape as a whole, and the side surface 153 includes four sub-side surfaces 1531.
  • the number of side projections 1544 is two and both are located on one sub-side surface 1531. 1544 is not symmetrical about the middle position of any one sub-side 1531.
  • the number of side bumps 1544 on a certain sub-side surface 1531 may also be one, and the side bumps 1544 are also distributed on other sub-side surfaces 1531, but multiple side bumps 1544 are not related to the middle position of any one of the sub-side surfaces 1531. symmetry. In this way, when the user wants to turn the diffractive optical element 15 for installation, at least one of the side bumps 1544 will abut against the side wall 122 of the lens barrel, and the user easily perceives that the diffractive optical element 15 is reversed.
  • the number of the lens barrel depressions 1284 and the side projections 1544 are equal and multiple, and the plurality of side projections 1544 are not equally spaced. Specifically, when the number of side bumps 1544 is two, the included angle between the two side bumps 1544 and the center of the diffractive optical element 15 is not one hundred and eighty degrees; when the number of side bumps 1544 is When there are three, the included angles between the two adjacent side convex blocks 1544 and the center of the diffractive optical element 15 are not all 120 degrees. In this way, when the user wants to turn the diffractive optical element 15 for installation, at least one of the side bumps 1544 will abut against the side wall 122 of the lens barrel, and the user easily perceives that the diffractive optical element 15 is reversed.
  • the size of the side bump 1544 is gradually reduced, and the size of the lens barrel depression 1284 is gradually reduced. Further, the maximum size of the side projection 1544 is larger than the minimum size of the lens barrel depression 1284.
  • the side projection 1544 cannot fully extend into the lens barrel depression 1284, and the side projection 1544 will When the diffractive optical element 15 is set high, the user can easily perceive that the diffractive optical element 15 is reversed.
  • the first positioning portion 128 includes a lens barrel projection 1285 protruding from the sidewall 122 of the lens barrel
  • the second positioning portion 154 includes a The side depression 1545, when the diffractive bottom surface 152 is combined with the limiting protrusion 123, the lens barrel projection 1285 extends into the side depression 1545.
  • the position of the lens barrel projection 1285 corresponds to the position of the side depression 1545, and the number of the lens barrel projection 1285 and the side depression 1545 are equal.
  • the shape of the lens barrel projection 1285 cut by a plane parallel to the diffractive bottom surface 152 can be rectangular or semicircular One or more of shape, triangle, trapezoid, and circle.
  • the lens barrel bump 1285 will offset the diffractive optical element 15 and the diffractive optical element 15 cannot be mounted on the limiting protrusion 123, and the user easily perceives that the diffractive optical element 15 is damaged. Reverse installation, so the lens barrel convex 1285 and the side recess 1545 can prevent the diffractive optical element 15 from being reversed.
  • the size of the side depression 1545 gradually increases, and the size of the lens barrel projection 1285 gradually increases. Further, the maximum size of the lens barrel projection 1285 is larger than the minimum size of the side depression 1545.
  • the lens barrel projection 1285 cannot fully extend into the lens barrel depression 1284, and the lens barrel projection 1285 will raise the diffractive optical element 15 high, and the user can easily perceive that the diffractive optical element 15 is reversed.
  • the positive connection end 712 and the negative connection end 713 may also be disposed on the outer side 120 at the support angle 1222.
  • the first connection end and the second connection end may be disposed at The inner side surface 1622 of the protective side wall 162, the end of the protective side wall 162 far from the protective top wall 161, or the outer side surface 1623 of the protective side wall 162.
  • the negative electrode connection end 713 is disposed on the outer surface 120
  • the second connection end is disposed on the inner surface 1622 of the side wall.
  • the negative connection end 713 and the second connection end can be connected by welding or conductive adhesive bonding (as shown in FIG. 7).
  • the negative electrode connection end 713 When the negative electrode connection end 713 is disposed at a position corresponding to the end of the protective side wall 162, the second connection end is disposed at an end of the protective side wall 162 away from the protective top wall 161, at this time, the negative electrode connection end 713 and The second connection end can be connected by welding, conductive adhesive bonding or plug-in connection.
  • the negative electrode connection end 713 is an elastic sheet structure, the second connection end can be disposed on the outer surface 1623 of the side wall.
  • the laser projection module 10 further includes a processing chip 60.
  • the processing chip 60 is connected to the detection circuit 71 and forms a detection circuit with the protective cover 16.
  • the processing chip 60 can detect whether the protective cover 16 is connected in the detection circuit 71, and thereby determine whether the protective cover 16 (diffractive optical element 15) is detached from the lens barrel 12.
  • the signal collected by the processing chip 60 when the protective cover 16 is connected to the detection circuit 71 is different from the signal collected when the protective cover 16 is disconnected from the detection circuit 71.
  • the processing chip 60 may be based on the collected signal The change determines whether or not the protective cover 16 (diffractive optical element 15) is detached from the lens barrel 12.
  • the processing chip 60 may be disposed on a main board of the electronic device 1000, and the processing chip 60 may be connected to the detection circuit 71 through a connector 17.
  • the processor 30 in the depth camera 100 can be used as the processing chip 60 in this embodiment, that is, the processor 30 can be used to process a laser pattern to obtain a depth image and to detect and protect Whether the cover 16 is connected to the detection circuit 71.
  • the laser projection module 10 does not need to additionally provide a processing chip 60.
  • the surface of the protective cover 16 is provided with an insulating layer.
  • the insulating layer covers the surface of the protective cover 16 and exposes a connection portion (for example, a first connection) on the protective cover 16 that is electrically connected to the detection circuit 71. Terminal and the second connection terminal) so that the protective cover 16 can be electrically connected as a conductive element in the detection circuit 71.
  • the insulating layer is used to isolate the protective cover 16 from being electrically connected to other electronic components (for example, the housing 200). More specifically, the insulating layer can isolate other electronic components from being electrically connected to the detection circuit 71 through the protective cover 16 to affect other electronic components. Use of components.
  • the protective cover 16 can conduct electricity.
  • the detection assembly 70 includes a detection circuit 71 formed on the substrate assembly 11 and the lens barrel 12.
  • the detection circuit 71 includes a temperature sensor 714 and detection.
  • the circuit 711 and the temperature sensor 714 are disposed on the substrate assembly 11.
  • the detection circuit 711 is disposed on the substrate assembly 11 and the lens barrel 12.
  • the detection circuit 711 is electrically connected to the temperature sensor 714 and the protective cover 16.
  • the detection circuit 711 is connected to the temperature sensor 714 to For detecting the temperature of the laser projection module 10, the detection circuit 711 is connected to the protection cover 16 for detecting whether the protection cover 16 is disconnected from the detection line 711.
  • the laser projection module 10 includes a substrate assembly 11, a lens barrel 12, a diffractive optical element 15, a conductive protective cover 16, and a detection circuit 71.
  • the lens barrel 12 is disposed on the substrate assembly 11.
  • a diffractive optical element 15 is provided in the lens barrel 12.
  • the protective cover 16 is combined with the lens barrel 12 and covers the diffractive optical element 15.
  • the detection circuit 71 is formed on the substrate assembly 11 and the lens barrel 12.
  • the detection circuit 71 includes a temperature sensor 714 and a detection circuit 711.
  • the temperature sensor 714 is disposed on the substrate assembly 11 and the detection circuit 711 is disposed on the substrate assembly 11 and the lens barrel 12.
  • the detection line 711 is electrically connected to the temperature sensor 714 and the protective cover 16, the detection line 711 is connected to the temperature sensor 714 for detecting the temperature of the laser projection module 10, and the detection line 711 is connected to the protection cover 16 for detecting whether the protection cover 16 is Disconnected from the detection line 711.
  • the protective cover 16 may be made of a conductive material so that the protective cover 16 can conduct electricity.
  • the conductive materials used to make the protective cover 16 include: steel, aluminum, copper, etc .; or the protective cover 16 is made of a non-conductive material, but protects
  • the cover 16 is provided with a conductive line.
  • the protective cover 16 is combined with the lens barrel 12 and is used to restrict (block) the diffractive optical element 15 within the lens barrel 12.
  • the protective cover 16 is electrically connected to the detection circuit 71 as a load (corresponding to a constant resistance). Specifically, the protective cover 16 may be connected in series with the temperature sensor 714 into the detection line 711 (as shown in FIG.
  • the protective cover 16 may also be connected in parallel with the temperature sensor 714 in the detection line 711 ( (As shown in Figure 25).
  • the protective cover 16 is detached from the lens barrel 12, the protective cover 16 is disconnected from the detection circuit 71, and the current in the detection circuit 71 changes.
  • the detection circuit 71 can determine the protection cover 16 and the mirror according to the current change in the detection circuit 71. Whether the tube 12 is falling off.
  • the protective cover 16 is connected in series with the temperature sensor 714 in the detection line 711, because the protection cover 16 is equivalent to a fixed value resistor, the current change in the detection line 711 is caused by the temperature sensor 714, that is, according to the detection The current change in the line 711 can determine the temperature change detected by the temperature sensor 714. After the protective cover 16 is disconnected from the detection circuit 71, the temperature sensor 714 is also disconnected from the detection line 711. At this time, the detection line 711 cannot The temperature change of the laser projection module 10 is detected by the temperature sensor 714.
  • the protective cover 16 and the temperature sensor 714 are connected in parallel to the detection line 711, since the protective cover 16 is equivalent to a fixed value resistor, the current change in the detection line 711 is caused by the temperature sensor 714, that is, according to The current change in the detection line 711 can determine the temperature change detected by the temperature sensor 714.
  • the temperature sensor 714 is also connected to the detection line 711. At this time, the detection line 711 passes the temperature The sensor 714 can detect a temperature change of the laser projection module 10.
  • the detection circuit 71 can be used to detect whether the diffractive optical element 15 has fallen off the lens barrel 12.
  • the detection circuit 71 detects that the protective cover 16 (diffractive optical element 15) is detached from the lens barrel 12, the laser projection module 10 stops working, so that the laser projection module 10 does not emit laser light.
  • the laser projection module 10 of this embodiment is provided with a protective cover 16 and shields the diffractive optical element 15, so that the diffractive optical element 15 can be more firmly installed in the lens barrel 12; at the same time, the laser projection module 10 is provided with a detection circuit 71
  • the protection cover 16 is connected to the detection circuit 71.
  • the detection circuit 71 can determine whether the protection cover 16 and the diffractive optical element 15 are detached from the lens barrel 12 by detecting whether the protection cover 16 is disconnected from the detection circuit 71.
  • the detection circuit 71 detects that the protective cover 16 is detached from the lens barrel 12, the laser projection module 10 stops working to prevent the laser projection module 10 from emitting a laser to burn the user.
  • the detection circuit 71 can be used to detect whether the protective cover 16 is in contact with the protective cover 16.
  • the disconnection of the detection circuit 71 can also detect the temperature of the laser projection module 10, thereby reducing the distribution of the detection lines 711 on the substrate assembly 11.
  • the difference between this embodiment and the first embodiment is only the detection circuit 71.
  • the detection circuit 71 in this embodiment is different from the detection circuit 71 in the first embodiment in that the detection circuit 71 in this embodiment further includes a temperature sensor 714.
  • the detection circuit 71 includes a temperature sensor 714, a detection circuit 711, and a positive connection terminal 712 and a negative connection terminal 713 electrically connected to the detection circuit 711.
  • the temperature sensor 714 is disposed on the substrate assembly 11.
  • the temperature sensor 714 may be disposed on the substrate assembly 11 and located in the accommodation cavity 121; or, the temperature sensor 714 is disposed on the substrate assembly 11 and located outside the accommodation cavity 121.
  • the detection circuit 711 is formed on the substrate assembly 11 and the lens barrel 12, and the detection circuit 711 is electrically connected to the temperature sensor 714 and the protective cover 16.
  • the protective cover 16 and the temperature sensor 714 of this embodiment are connected in parallel to the detection line 711.
  • the detection line 711 includes a first detection sub-line 7111, a second detection sub-line 7112, and a third detection sub-line. 7113 and the fourth detection sub-line 7114.
  • the first detection sub-line 7111 is formed on the substrate assembly 11 and the lens barrel 12.
  • the positive connection end 712 is located at one end of the first detection sub-line 7111 and is disposed on the lens barrel 12.
  • the second detection sub-line 7112 is also formed on the substrate assembly 11.
  • the lens barrel 12 are arranged at a distance from the first detection sub-line 7112, the negative connection end 713 is located at one end of the second detection sub-line 7112 and is disposed on the lens barrel 12, the first detection sub-line 7111 and the second detection sub-line 7112
  • the positive detection terminal 712 and the negative connection terminal 713 are respectively electrically connected to the protective cover 16 to form a first detection circuit.
  • the first detection circuit is used to detect whether the protective cover 16 is disconnected from the detection circuit 711.
  • Both the third detection sub-line 7113 and the fourth detection sub-line 7114 are connected to the temperature sensor 714 to form a second detection loop.
  • the second detection circuit is used to detect the temperature of the laser projection module 10.
  • the current change in the detection line 711 is caused by the temperature sensor 714, that is, the temperature sensor 714 can be determined based on the current change in the second detection circuit (detection line 711).
  • the temperature sensor 714 is also connected to the second detection circuit (detection line 711). At this time, the second detection circuit can detect the laser projection through the temperature sensor 714 The temperature of the module 10 changes.
  • the detection circuit 18 of this embodiment can be used to detect whether the protective cover 16 is disconnected from the detection circuit 18 and to detect the temperature of the laser projection module 10, thereby reducing the distribution of the detection circuit 181 on the substrate assembly 11.
  • the temperature sensor 714 is connected in parallel with the protective cover 16.
  • the protective cover 16 is connected to the detection circuit 711 and can form a first detection circuit.
  • the temperature sensor 714 is connected to the detection A second detection loop can be formed in the line 714.
  • the detection circuit 711 includes a plurality of detection periods, and each detection period includes a protective cover detection period and a temperature detection period.
  • the detection line 711 is electrically connected to the protection cover 16 and disconnected from the temperature sensor 714, and the detection circuit 711 is used to detect whether the protection cover 16 is disconnected from the detection line 711.
  • the detection circuit 711 is electrically connected to the temperature sensor 714 and disconnected from the protective cover 16.
  • the detection circuit 711 is used to detect the temperature of the laser projection module 10.
  • the protective cover 16 is connected to the first detection sub-line 7111 and the second detection sub-line 7112 and forms a first detection loop.
  • the first detection sub-line 7111 is further provided with a first control switch 7115, and the detection line 711 and the first A control switch 7115 is connected for controlling the opening or closing of the first detection circuit through the first control switch 7115.
  • the temperature sensor 714 is connected to the third detection sub-line 7113 and the fourth detection sub-line 7114 and forms a second detection loop.
  • the third detection sub-line 7113 is also provided with a second control switch 7116, and the detection line 711 and the second control switch 7116 is connected for controlling the opening or closing of the second detection circuit through the second control switch 7116.
  • the first control switch 7115 controls the communication of the first detection circuit, and the third control switch 7116 controls the disconnection of the second detection circuit.
  • the detection line 711 is used to detect whether the protection cover 16 and the detection line 711 are broken. Open the connection.
  • the first control switch 7115 controls the first detection circuit to be disconnected, and the third control switch 7116 controls the second detection circuit to be connected.
  • the detection circuit 711 is used to detect the temperature of the laser projection module 10.
  • the second control switch 7116 may not be provided on the third detection sub-line 7113.
  • the first control switch 7115 controls the communication of the first detection circuit and the second detection circuit is also connected. The detection circuit 711 is used to detect whether the protective cover 16 is disconnected from the detection circuit 711.
  • the detection circuit 711 When the detection circuit 71 of this embodiment is used to detect the temperature of the laser projection module 10, the detection circuit 711 is electrically connected to the temperature sensor 714 and disconnected from the protective cover 16, thereby adding a first to the second detection circuit.
  • the detection circuit has little influence on the temperature detection of the laser projection module 10 by the temperature sensor 714, and can further maintain the temperature accuracy of the temperature projection of the laser projection module 10 by the temperature sensor 714.
  • the laser projection module 10 further includes a processing chip 60.
  • the processing chip 60 is connected to the detection circuit 71 and forms a detection circuit with the protective cover 16.
  • the processing chip 60 can detect whether the protective cover 16 is connected in the detection circuit 71, and thereby determine whether the protective cover 16 (diffractive optical element 15) is detached from the lens barrel 12.
  • the signal collected by the processing chip 60 when the protective cover 16 is connected to the detection circuit 71 is different from the signal collected when the protective cover 16 is disconnected from the detection circuit 71.
  • the processing chip 60 may be based on the collected signal The change determines whether or not the protective cover 16 (diffractive optical element 15) is detached from the lens barrel 12.
  • the processing chip 60 may be disposed on the main board of the electronic device 1000, and the processing chip 60 may be connected to the detection circuit 71 through the connector 17.
  • the processor 30 in the depth camera 100 can be used as the processing chip 60 in this embodiment, that is, the processor 30 can be used to process a laser pattern to obtain a depth image and to detect and protect Whether the cover 16 is connected to the detection circuit 71.
  • the laser projection module 10 does not need to additionally provide a processing chip 60.
  • the detection assembly 70 includes a first electrode plate 191, a second electrode plate 192, and a detection circuit 73.
  • the first electrode plate 191 is disposed on the lens barrel 12.
  • the second electrode plate 192 is disposed on the protective cover 16 and is spaced apart from the first electrode plate 191.
  • the second electrode plate 192 and the first electrode plate 191 together form a detection capacitor 19; the first electrode plate 191 and the second electrode plate 192 It is connected to the detection circuit 73 and can form a detection circuit.
  • the laser projection module 10 includes a substrate assembly 11, a lens barrel 12, a diffractive optical element 15, a protective cover 16, a first electrode plate 191, a second electrode plate 192, and a detection circuit 73.
  • the lens barrel 12 is disposed on the substrate assembly 11.
  • a diffractive optical element 15 is provided in the lens barrel 12.
  • the protective cover 16 is combined with the lens barrel 12 and covers the diffractive optical element 15.
  • the first electrode plate 191 is disposed on the lens barrel 12.
  • the second electrode plate 192 is disposed on the protective cover 16.
  • the second electrode plate 192 is disposed on the protective cover 16 and is opposed to the first electrode plate 191.
  • the second electrode plate 192 and the first electrode plate 191 together form a detection capacitor 19.
  • the first electrode plate 191 and the second electrode plate 192 are connected to the detection circuit 73 and can form a detection circuit.
  • the first electrode plate 191 and the second electrode plate 192 are made of a conductive material.
  • the material of the first electrode plate 191 and the second electrode plate 192 may include nickel, palladium, silver, tantalum, a carbon material, a metal oxide, Conductive polymers.
  • the protective cover 16 may be made of a conductive material. In this case, the protective cover 16 may serve as the second electrode plate 192.
  • the protective cover 16 is combined with the lens barrel 12 and is used to restrict (block) the diffractive optical element 15 within the lens barrel 12.
  • the current in the detection circuit 73 changes, and the detection circuit 73 can determine whether the protective cover 16 and the lens barrel 12 fall off according to the current change in the detection circuit 73.
  • the protective cover 16 is used to confine the diffractive optical element 15 within the lens barrel 12, when the protective cover 16 is detached from the lens barrel 12, the diffractive optical element 15 will also be largely removed from the lens barrel 12. If the diffractive optical element 15 falls off, the light projected by the laser projection module 10 will form a strong zero-order light beam. If the user happens to be performing face recognition, the user's eyes will be damaged.
  • the detection capacitor 19 and the detection circuit 73 detect that the protective cover 16 is detached from the lens barrel 12, it is determined that the diffractive optical element 15 is also detached (in other words, by detecting that the protective cover 16 is detached from the lens barrel 12, it is indirectly obtained The diffractive optical element 15 also falls off).
  • the laser projection module 10 is controlled to stop working, so that the laser projection module 10 stops emitting laser light. Compared with the direct detection of the detachment of the diffractive optical element 15, the laser projection module 10 stops emitting laser light. In other words, the security guarantee is advanced, that is, the security level for protecting users from using the laser projection module 10 is increased.
  • the laser projection module 10 is provided with a protective cover 16 and shields the diffractive optical element 15, so that the diffractive optical element 15 can be more firmly installed in the lens barrel 12; at the same time, the laser projection module 10 is provided with a detection circuit 73 and the detection capacitor 19 connected to the detection circuit 73.
  • the detection circuit 73 can determine whether the protective cover 16 (diffractive optical element 15) is detached from the lens barrel 12 by detecting whether the electrical signal on the detection capacitor 19 has changed.
  • the laser projection module 10 stops working to prevent the laser projection module 10 from emitting a laser to burn the user, thereby improving the user's safety level when using the laser projection module 10.
  • the laser projection module 10 includes a substrate assembly 11, a lens barrel 12, a light source 13, a collimating element 14, a diffractive optical element 15, a protective cover 16, a detection circuit 73, The first electrode plate 191 and the second electrode plate 192.
  • the light source 13, the collimating element 14, and the diffractive optical element 15 are sequentially disposed on the optical path of the light source 13. Specifically, the light emitted by the light source 13 passes through the collimating element 14 and the diffractive optical element 15 in this order.
  • the substrate assembly 11 includes a substrate 111 and a circuit board 112 carried on the substrate 111.
  • the substrate 111 is used to carry the lens barrel 12, the light source 13 and the circuit board 112.
  • the material of the substrate 111 may be plastic, such as Polyethylene Terephthalate (PET), Polymethyl Methacrylate (PMMA), Polycarbonate (PC), Polyacryl At least one of polyimide (PI). That is, the substrate 111 may be made of a single plastic material of any one of PET, PMMA, PC, or PI. As such, the substrate 111 is lightweight and has sufficient support strength.
  • the circuit board 112 may be any one of a printed circuit board, a flexible circuit board, and a rigid-flexible board.
  • the circuit board 112 can be provided with a via hole 113, and the via hole 113 can be used to receive the light source 13.
  • One part of the circuit board 112 is covered by the lens barrel 12, and the other part extends out and can be connected with the connector 17.
  • the connector 17 can The laser projection module 10 is connected to a motherboard of the electronic device 1000.
  • the lens barrel 12 is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the lens barrel 12 may be connected to the circuit board 112 of the substrate assembly 11, and the lens barrel 12 and the circuit board 112 may be adhered with an adhesive to improve the airtightness of the receiving cavity 121.
  • the accommodating cavity 121 can be used for accommodating components such as the collimating element 14 and the diffractive optical element 15.
  • the accommodating cavity 121 forms a part of the optical path of the laser projection module 10 at the same time.
  • the lens barrel 12 is made of a non-conductive material, for example, the lens barrel 12 is made of plastic, and the plastic includes any one of PET, PMMA, PC, or PI; or, the lens barrel 12 is made of conductive material but the lens barrel 12 The outer surface of the lens barrel is provided with an insulating layer to make the lens barrel 12 non-conductive.
  • the lens barrel 12 is a cylindrical structure, and the lens barrel 12 includes a sidewall 122 and a limiting protrusion 123.
  • the side wall 122 of the lens barrel is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the lens barrel side wall 122 includes a plurality of lens barrel side walls 1221, each of the lens barrel side walls 1221 is combined with the substrate assembly 11, and the plurality of lens barrel side walls 1221 are sequentially connected in a ring shape and collectively surround the receiving cavity 121.
  • the ends of any two connected lens barrel side walls 1221 form a support angle 1222 together, and four support angles 1222 are formed on the lens barrel 12 of this embodiment.
  • the outer wall of the side wall 122 of the lens barrel may be formed with a positioning and mounting structure to facilitate fixing the position of the laser projection module 10 when the laser projection module 10 is installed in the electronic device 1000.
  • the lens barrel 12 (or the lens barrel side wall 122) includes a first surface 124, a second surface 125, and a lens barrel side 129.
  • the first surface 124 and the second surface 125 are located on opposite sides of the lens barrel 12, and the lens barrel side 129
  • the first surface 124 and the second surface 125 are connected and the side surface 129 of the lens barrel also surrounds the first surface 124.
  • One opening of the receiving cavity 121 is opened on the second surface 125 and the other opening is opened on the first surface 124.
  • the second surface 125 is bonded to the circuit board 112, such as gluing.
  • the first surface 124 can be used as a bonding surface between the lens barrel 12 and the diffractive optical element 15, or as a bonding surface between the lens barrel 12 and the protective cover 16.
  • the outer wall of the side wall 122 of the lens barrel is provided with an adhesive containing groove 126.
  • the adhesive containing groove 126 may be opened from the first surface 124 and extended toward the second surface 125.
  • the limiting protrusion 123 protrudes inward from the side wall 122 of the lens barrel. Specifically, the limiting protrusion 123 protrudes from the side wall 122 of the lens barrel into the receiving cavity 121.
  • the limiting protrusions 123 may be in a continuous ring shape, or the limiting protrusions 123 include a plurality of limiting protrusions 123 spaced apart from each other.
  • the limiting protrusion 123 forms a light-passing hole 1231.
  • the light-passing hole 1231 can be used as a part of the receiving cavity 121. The laser light passes through the light-passing hole 1231 and penetrates the diffractive optical element 15. In the embodiment shown in FIG.
  • the limiting protrusion 123 is located between the first surface 124 and the second surface 125, and the receiving cavity 121 between the limiting protrusion 123 and the second surface 125 can be used for receiving the standard
  • the receiving cavity 121 between the straight element 14, the limiting protrusion 123 and the first surface 124 can be used for receiving the diffractive optical element 15.
  • the limiting protrusion 123 includes a limiting surface 1232. When the diffractive optical element 15 is mounted on the limiting protrusion 123, the limiting surface 1232 is combined with the diffractive optical element 15.
  • the light source 13 is disposed on the substrate assembly 11. Specifically, the light source 13 may be disposed on the circuit board 112 and electrically connected to the circuit board 112, and the light source 13 may also be disposed on the substrate 111 and correspond to the via hole 113. At this time, the light source 13 may be electrically connected to the circuit board 112 by arranging a wire.
  • the light source 13 is used to emit laser light.
  • the laser light may be infrared light.
  • the light source 13 may include a semiconductor substrate and an emission laser disposed on the semiconductor substrate.
  • the semiconductor substrate is disposed on the substrate 111.
  • the emission laser may be vertical. Cavity Surface Emitting Laser (Vertical Cavity Surface Emitting Laser, VCSEL).
  • the semiconductor substrate may be provided with a single emission laser or an array laser composed of a plurality of emission lasers. Specifically, the plurality of emission lasers may be arranged on the semiconductor substrate in the form of a regular or irregular two-dimensional pattern.
  • the collimating element 14 may be an optical lens.
  • the collimating element 14 is used to collimate the laser light emitted by the light source 13.
  • the collimating element 14 is housed in the receiving cavity 121, and the collimating element 14 may be directed along the second surface 125.
  • the direction of the first surface 124 is assembled into the receiving cavity 121.
  • the collimating element 14 includes an optical portion 141 and a mounting portion 142.
  • the mounting portion 142 is used to combine with the lens barrel sidewall 122 and fix the collimating element 14.
  • the optical portion 141 includes Two surfaces on both sides.
  • the diffractive optical element 15 is mounted on the limiting protrusion 123. Specifically, the diffractive optical element 15 is combined with the limiting surface 1232 to be mounted on the limiting protrusion 123.
  • the outer surface of the diffractive optical element 15 includes a top surface 151, a diffractive bottom surface 152, and a side surface 153.
  • the top surface 151 and the diffractive bottom surface 152 are opposite to each other, and the side surface 153 connects the top surface 151 and the diffractive bottom surface 152.
  • a diffractive structure is formed on the diffractive bottom surface 152, and the top surface 151 may be a smooth plane.
  • the diffractive optical element 15 may project the laser light collimated by the collimating element 14 to a laser pattern corresponding to the diffractive structure.
  • the diffractive optical element 15 may be made of glass, or it may be said to be made of a composite plastic such as PET.
  • the protective cover 16 is combined with the lens barrel 12.
  • the protective cover 16 is used to limit the position of the diffractive optical element 15. Specifically, the protective cover 16 is used to prevent the combination of the diffractive optical element 15 and the lens barrel 12 from failing. Then it comes out of the lens barrel 12.
  • the protective cover 16 is made of a non-conductive material, or the protective cover 16 is made of a conductive material and the surface of the protective cover 16 is provided with an insulating layer.
  • the protective cover 16 includes a protective top wall 161 and a protective side wall 162.
  • the protective top wall 161 and the limiting protrusion 123 are located on opposite sides of the diffractive optical element 15, respectively, or the diffractive optical element 15 is located between the limiting protrusion 123 and the protective top wall 161.
  • the combination of 15 and the limiting protrusion 123 is invalid. Due to the restricting effect of the protective top wall 161, the diffractive optical element 15 will not come out.
  • the protective top wall 161 is provided with a light through hole 1611, the position of the light through hole 1611 corresponds to the diffractive optical element 15, and the laser light passes through the light through hole 1231, the diffractive optical element 15 and the light through hole 1611, and then passes through the laser projection module 10 Shoot out.
  • the overall shape of the protective top wall 161 is a rounded square, and the light through hole 1611 may be circular, rectangular, oval, trapezoidal, or the like.
  • the protective top wall 161 abuts against the first surface 124. Further, the protective top wall 161 may also be adhered to the first surface 124 by gluing. And so on.
  • the protective sidewall 162 extends from the peripheral edge of the protective top wall 161, the protective cover 16 covers the lens barrel 12, and the protective sidewall 162 and the lens barrel sidewall 122 are fixedly connected.
  • the protective side wall 162 includes a plurality of protective sub-side walls 1621 that are connected in sequence from end to end. Each protective sub-side wall 1621 is fixedly connected to the side wall 122 of the lens barrel. Each protective sub-side wall 1621 forms a little glue hole 163. .
  • the position of the dispensing hole 163 corresponds to the position of the accommodating groove 126. After the protective cover 16 is placed on the lens barrel 12, the glue can be dispensed from the dispense hole 163 into the accommodating groove 126.
  • each protective sub-side wall 1621 is provided with a single dispensing hole 163.
  • each protective sub-side wall 1621 is provided with multiple dispensing holes 163, such as two, three , Four, etc.
  • two sidewalls 1621 of each protection sub-side are provided with two dispensing holes 163, and the two dispensing holes 163 respectively correspond to the two inner sidewalls 1261 of the accommodating groove 126, which is convenient. The user dispenses to both sides of the accommodating tank 126 at the same time, thereby increasing the dispensing speed.
  • the inner side wall 1261 of the rubber containing groove 126 is inclinedly connected to the inner bottom wall 1262 of the rubber containing groove 126 and the outer wall of the lens barrel side wall 122.
  • the oblique connection refers to the inner side wall 1261 and the inner bottom wall 1262, and the inner side wall 1261 and the mirror.
  • the outer wall of the cylinder side wall 122 is not vertical.
  • the first electrode plate 191 is disposed on the lens barrel 12. Specifically, the first electrode plate 191 may be provided on the first surface 124 and does not block the opening of the receiving cavity 121 provided on the first surface 124. At this time, a receiving groove may be provided on the first surface 124, and the first electrode plate 191 is set in the containing tank.
  • the first electrode plate 191 is ring-shaped or fan-shaped.
  • the first electrode plate 191 is made of a conductive material.
  • the material of the first electrode plate 191 may include nickel, palladium, silver, tantalum, a carbon material, and a metal oxide. ,Conductive polymers.
  • the second electrode plate 192 is disposed on the protective cover 16 and is spaced apart from the first electrode plate 191.
  • the second electrode plate 192 and the first electrode plate 191 together form a detection capacitor 19.
  • the second electrode plate 192 may be provided on the protective top wall 161 (which may be provided on the inner surface of the protective top wall 161 or the outer surface of the protective top wall 161) and does not block the receiving cavity 121 from being opened on the first surface 124. The opening does not block the light through hole 1611.
  • a receiving groove may be formed on the protective top wall 161, and the first electrode plate 191 is disposed in the receiving groove.
  • the shape of the second electrode plate 192 matches the shape of the first electrode plate 191 and has a ring shape (for example, a circular ring shape, a square ring shape) or a fan ring shape.
  • the second electrode plate 192 is made of a conductive material.
  • the material of the two electrode plates 192 may include nickel, palladium, silver, tantalum, carbon materials, metal oxides, and conductive polymers.
  • the first electrode plate 191 may also be disposed on the side surface 129 of the lens barrel.
  • the first electrode plate 192 is a cylindrical or arc-shaped sheet structure
  • the second electrode plate 192 is disposed on the protective side wall 162 (may be provided on the inner surface of the protective side wall 162 or the outer surface of the protective side wall 162).
  • the shape of the second electrode plate 192 matches the shape of the first electrode plate 191 and is cylindrical. Shape or arc-shaped sheet.
  • the detection circuit 73 is formed on the substrate assembly 11 and the lens barrel 12.
  • the first electrode plate 191 and the second electrode plate 192 are connected to the detection circuit 73 and can form a detection circuit.
  • the detection circuit 73 includes a detection line 731, a resistance element 732, and a detection device 733.
  • the detection circuit 731 is formed on the substrate assembly 11 and the lens barrel 12.
  • the detection circuit 731 includes a first detection sub-circuit 7311 and a second detection sub-circuit 7312.
  • the first detection sub-circuit 7311 is formed on the substrate assembly 11 and the lens barrel 12 and communicates with the lens assembly 12.
  • the first electrode plate 191 is connected.
  • the second detection sub-line 7312 is also formed on the substrate assembly 11 and the lens barrel 12 and is connected to the second electrode plate 733.
  • the second detection sub-line 7312 is spaced from the first detection sub-line 7312.
  • the resistance element 732 is connected in the detection line 731 and connected in series with the detection capacitor 19.
  • the resistance element 732 may be a resistor.
  • the detection device 733 is connected to the detection line 731. When the detection device 733 is a voltmeter, the detection device 733 is connected in parallel with the resistance element 732 and is used to detect the voltage across the resistance element 732. When the detection device 733 is an ammeter, the detection device 733 and the resistance The element 732 is connected in series and is used to detect a current flowing through the resistive element 732.
  • the detection circuit 73 can determine whether the protective cover 16 and the lens barrel 12 fall off according to a change in the electrical signal (current) in the detection circuit 73.
  • the first detection sub-line 7311 formed on the lens barrel 12 is located on the lens barrel side 129 of the lens barrel 12 and is distributed along a support angle 1222 of the lens barrel 12.
  • the first detection sub-line 7311 and the first The electrode plate 191 can be electrically connected by any one or more of soldering, spring connection, plug connection, and conductive adhesive bonding.
  • the second detection sub-line 7312 formed on the lens barrel 12 is located on the side surface 129 of the lens barrel 12 and is distributed along another support angle 1222 of the lens barrel 12.
  • the second detection sub-line 7312 can also be provided on the protective cover 16. And is connected to the second electrode plate 192.
  • the second detection sub-circuit 7312 and the second electrode plate 192 can be electrically connected by any one or more of welding, spring connection, plug connection, and conductive adhesive bonding. connection.
  • the first detection sub-line 7311 and the second detection sub-line 7312 formed on the lens barrel 12 may be respectively disposed at two support angles 1222 at opposite ends of a side wall 1221 of a lens barrel; or, The first detection sub-line 7311 and the second detection sub-line 7312 may be respectively disposed on two support angles 1222 formed by different side walls 1221 of the lens barrel.
  • the protective cover 16 since the protective cover 16 is combined with the lens barrel 12, the protective top wall 161 of the protective cover 16 and the limiting protrusion 123 limit the position of the diffractive optical element 15 together with the diffractive optical element 15. It will not fall off in the direction of light output, avoiding the laser beam being emitted without passing through the diffractive optical element 15, protecting the user and improving safety.
  • the laser projection module 10 is provided with a detection circuit 73 and a detection capacitor 19 connected to the detection circuit 73.
  • the detection circuit 73 can determine whether the protective cover 16 (diffractive optical element) is determined by detecting whether the electrical signal on the detection capacitor 19 has changed.
  • the laser projection module 10 stops working to prevent the laser projection module 10 from emitting a laser to burn the user and improve the user's use of the laser The security level of the projection module 10.
  • the laser projection module 10 further includes a processing chip 60.
  • the processing chip 60 is connected to the detection circuit 73 and forms a detection circuit with the detection capacitor 19.
  • the processing chip 60 can detect whether the electrical signal on the detection capacitor 19 has changed (or, in other words, the processing chip 60 can detect whether a signal is transmitted to the processing chip 60 according to the detection capacitor 19) to determine whether the protective cover 16 (diffractive optical element 15) is Dropped from the lens barrel 12.
  • the detection capacitor 19 when the protective cover 16 is fixed on the lens barrel 12, the detection capacitor 19 will not have an electrical signal (current) flowing into the processing chip 60; when the protective cover 16 is detached from the lens barrel 12, the detection capacitor 19 discharges and causes The current flows into the processing chip 60, and the processing chip 60 can determine whether the protective cover 16 (the diffractive optical element 15) is detached from the lens barrel 12 according to the collected signal change.
  • the processing chip 60 may be disposed on a main board of the electronic device 1000, and the processing chip 60 may be connected to the detection circuit 73 through a connector 17.
  • the processor 30 in the depth camera 100 can be used as the processing chip 60 in this embodiment, that is, the processor 30 can be used to process a laser pattern to obtain a depth image and to detect and protect Whether the cover 16 is connected to the detection circuit 73. At this time, the laser projection module 10 does not need to additionally provide a processing chip 60.
  • the protective cover 16 includes a protective top wall 161 and a protective side wall 162 extending from a peripheral edge of the protective top wall 161.
  • the protective side wall 162 is combined with the lens barrel 12, and the protective top wall 161 blocks the diffractive optical element.
  • the detection assembly 70 includes a transmitter 74 and a receiver 75. At least one of the transmitter 74 and the receiver 75 is disposed on the protective side wall 162, and the other is disposed on the substrate assembly 11.
  • the transmitter 74 and the receiver 75 are opposite to each other. Set to form the detection line.
  • the laser projection module 10 includes a substrate assembly 11, a lens barrel 12, a diffractive optical element 15, a protective cover 16, and a detection assembly 70.
  • the lens barrel 12 is disposed on the substrate assembly 11.
  • a diffractive optical element 15 is provided in the lens barrel 12.
  • the protective cover 16 is sleeved on the lens barrel 12.
  • the protective cover 16 includes a protective top wall 161 and a protective side wall 162 extending from a peripheral edge of the protective top wall 161.
  • the protective side wall 162 is combined with the lens barrel 12 to protect the top wall 161 and limit it.
  • the detection assembly 70 includes a transmitter 74 and a receiver 75. At least one of the transmitter 74 and the receiver 75 is disposed on the protective side wall 162, and the other is disposed on the substrate assembly 11.
  • the transmitter 74 and the receiver 75 are oppositely disposed to Form a detection line.
  • the protective cover 16 is combined with the lens barrel 12 and is used to restrict (block) the diffractive optical element 15 within the lens barrel 12.
  • the detecting component 70 is used to detect whether the protective cover 16 has come off.
  • At least one of the transmitter 74 and the receiver 75 of the detection module 70 is disposed on the protection side wall 162 and the other is disposed on the substrate assembly 11.
  • the connection manner between the detection module 70 and the protection side wall 162 and the detection module 70 and the substrate The connection methods of the components 11 include welding, gluing, screwing, or engaging.
  • the transmitter 74 is configured to transmit a detection signal
  • the receiver 75 is configured to receive a detection signal transmitted by the transmitter 74.
  • the detection signal may be a light signal, such as infrared light; the detection signal may also be an ultrasonic signal.
  • the transmitter 74 is an infrared light emitting diode (LED) and the receiver 75 is an infrared light receiver.
  • the transmitter 74 and the receiver 75 are oppositely disposed.
  • the detection component 70 When the detection component 70 is operating, the transmitter 74 transmits a detection signal to the receiver 75.
  • the strength of the detection signal received by the receiver 75 is within a predetermined range, the current relative positions of the transmitter 74 and the receiver 75 can be determined No major changes have occurred. For example, when the predetermined signal range is [20cd, 50cd] and the intensity of the detection signal is any of 25cd, 30cd, and 48cd, it is determined that the relative position of the protective cover 16 and the substrate assembly 11 does not occur.
  • the protective cover 16 can still restrict the position of the diffractive optical element 15 well, and the diffractive optical element 15 is still maintained at the original position.
  • the predetermined signal range is [20cd, 50cd]
  • the intensity of the detection signal is less than 20cd or greater than 50cd, such as 0cd, 10cd
  • the protective cover 16 falls off from the lens barrel 12 or is severely tilted. It is also possible that the diffractive optical element 15 restricted by the protection cover 16 may fall off. Once the diffractive optical element 15 falls off, the light projected by the laser projection module 10 will form a strong zero-order light beam. If the user happens to be doing face recognition, the user's eyes will be damaged. Therefore, when the detecting component 70 detects that the protective cover 16 is detached from the lens barrel 12, it is determined that the diffractive optical element 15 is also detached (in other words, the diffractive optical element 15 is indirectly obtained by detecting that the protective cover 16 is detached from the lens barrel 12.
  • the laser projection module 10 stops emitting laser light.
  • the laser projection module 10 stops emitting laser light, it is safer
  • the guarantee is advanced, that is, the security level of protecting the user from using the laser projection module 10 is increased.
  • the protective cover 16 is provided and the position of the diffractive optical element 15 is restricted, so that the diffractive optical element 15 can be more firmly disposed in the lens barrel 12; at the same time, the laser projection module 10
  • the protective cover 16 is provided with one of the transmitter 74 and the receiver 75, and the other one of the transmitter 74 and the receiver 75 is provided on the substrate assembly 11.
  • the transmitter 74 and the receiver 75 are opposed to form a detection line, so that the protective cover can be determined.
  • the laser projection module 10 includes a substrate assembly 11, a lens barrel 12, a light source 13, a collimating element 14, a diffractive optical element 15, a protective cover 16, and a detecting element 70.
  • the light source 13, the collimating element 14, and the diffractive optical element 15 are sequentially disposed on the optical path of the light source 13, specifically, the light emitted by the light source 13 passes through the collimating element 14 and the diffractive optical element 15 in this order.
  • the substrate assembly 11 includes a substrate 111 and a circuit board 112 carried on the substrate 111.
  • the substrate 111 is used to carry the lens barrel 12, the light source 13 and the circuit board 112.
  • the material of the substrate 111 may be plastic, such as at least one of polyethylene terephthalate, polymethyl methacrylate, polycarbonate, and polyimide. That is, the substrate 111 may be made of a single plastic material of any one of PET, PMMA, PC, or PI. As such, the substrate 111 is lightweight and has sufficient support strength.
  • the circuit board 112 may be any one of a printed circuit board, a flexible circuit board, and a rigid-flexible board.
  • the circuit board 112 can be provided with a via hole 113, and the via hole 113 can be used to receive the light source 13.
  • One part of the circuit board 112 is covered by the lens barrel 12, and the other part extends out and can be connected with the connector 17.
  • the connector 17 can The laser projection module 10 is connected to a motherboard of the electronic device 1000.
  • the lens barrel 12 is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the lens barrel 12 may be connected to the circuit board 112 of the substrate assembly 11, and the lens barrel 12 and the circuit board 112 may be adhered with an adhesive to improve the airtightness of the receiving cavity 121.
  • the accommodating cavity 121 can be used for accommodating components such as the collimating element 14 and the diffractive optical element 15.
  • the accommodating cavity 121 forms a part of the optical path of the laser projection module 10 at the same time.
  • the lens barrel 12 is made of a non-conductive material, for example, the lens barrel 12 is made of plastic, and the plastic includes any one of PET, PMMA, PC, or PI; or, the lens barrel 12 is made of conductive material but the lens barrel 12 An outer surface is provided with an insulating layer to make the lens barrel 12 non-conductive.
  • the lens barrel 12 includes a lens barrel sidewall 122 and a limiting protrusion 123.
  • the side wall 122 of the lens barrel is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the lens barrel side wall 122 includes a plurality of lens barrel side walls 1221. Each of the lens barrel side walls 1221 is combined with the substrate assembly 11.
  • the plurality of lens barrel side walls 1221 are sequentially connected in a ring shape and collectively surround the receiving cavity 121.
  • the ends of any two connected lens barrel side walls 1221 form a support angle 1222 together, and four support angles 1222 are formed on the lens barrel 12 of this embodiment.
  • the outer wall of the side wall 122 of the lens barrel may be formed with a positioning and mounting structure to facilitate fixing the position of the laser projection module 10 when the laser projection module 10 is installed in the electronic device 1000 in the embodiment of FIG. 1.
  • the lens barrel 12 further includes a first surface 124 and a second surface 125 opposite to each other.
  • One opening of the receiving cavity 121 is opened on the second surface 125 and the other opening is opened on the first surface 124.
  • the second surface 125 is bonded to the circuit board 112, such as gluing, and the first surface 124 can be used as a connection surface between the lens barrel 12 and the diffractive optical element 15 or as a connection surface between the lens barrel 12 and the protective cover 16 and the like.
  • the outer wall of the side wall 122 of the lens barrel is provided with an adhesive containing groove 126.
  • the adhesive containing groove 126 can be opened from the first surface 124 and extended toward the second surface 125.
  • the limiting protrusion 123 protrudes inward from the side wall 122 of the lens barrel. Specifically, the limiting protrusion 123 protrudes from the side wall 122 of the lens barrel into the receiving cavity 121.
  • the limiting protrusions 123 may be in a continuous ring shape, or the limiting protrusions 123 include a plurality of limiting protrusions 123 spaced apart from each other.
  • the limiting protrusion 123 forms a light-passing hole 1231.
  • the light-passing hole 1231 can be used as a part of the receiving cavity 121. The laser light passes through the light-passing hole 1231 and penetrates the diffractive optical element 15. In the embodiment shown in FIG.
  • the limiting protrusion 123 is located between the first surface 124 and the second surface 125, and the receiving cavity 121 between the limiting protrusion 123 and the second surface 125 can be used for receiving the standard
  • the receiving cavity 121 between the straight element 14, the limiting protrusion 123 and the first surface 124 can be used for receiving the diffractive optical element 15.
  • the limiting protrusion 123 includes a limiting surface 1232. When the diffractive optical element 15 is mounted on the limiting protrusion 123, the limiting surface 1232 is combined with the diffractive optical element 15.
  • the light source 13 is disposed on the substrate assembly 11. Specifically, the light source 13 may be disposed on the circuit board 112 and electrically connected to the circuit board 112, and the light source 13 may also be disposed on the substrate 111 and correspond to the via hole 113. At this time, the light source 13 may be electrically connected to the circuit board 112 by arranging a wire.
  • the light source 13 is used to emit laser light.
  • the laser light may be infrared light.
  • the light source 13 may include a semiconductor substrate and an emission laser disposed on the semiconductor substrate.
  • the semiconductor substrate is disposed on the substrate 111.
  • the emission laser may be vertical. Cavity surface emitting laser.
  • the semiconductor substrate may be provided with a single emission laser or an array laser composed of a plurality of emission lasers. Specifically, the plurality of emission lasers may be arranged on the semiconductor substrate in the form of a regular or irregular two-dimensional pattern.
  • the collimating element 14 may be an optical lens.
  • the collimating element 14 is used to collimate the laser light emitted by the light source 13.
  • the collimating element 14 is housed in the receiving cavity 121, and the collimating element 14 may be directed along the second surface 125.
  • the direction of the first surface 124 is assembled into the receiving cavity 121.
  • the collimating element 14 includes an optical portion 141 and a mounting portion 142.
  • the mounting portion 142 is used to combine with the lens barrel sidewall 122 and fix the collimating element 14.
  • the optical portion 141 includes Two surfaces on both sides.
  • the diffractive optical element 15 is mounted on the limiting protrusion 123. Specifically, the diffractive optical element 15 is combined with the limiting surface 1232 to be mounted on the limiting protrusion 123.
  • the outer surface of the diffractive optical element 15 includes a top surface 151, a diffractive bottom surface 152, and a side surface 153.
  • the top surface 151 and the diffractive bottom surface 152 are opposite to each other, and the side surface 153 connects the top surface 151 and the diffractive bottom surface 152.
  • a diffractive structure is formed on the diffractive bottom surface 152, and the top surface 151 may be a smooth plane.
  • the diffractive optical element 15 may project the laser light collimated by the collimating element 14 to a laser pattern corresponding to the diffractive structure.
  • the diffractive optical element 15 may be made of glass, or it may be said to be made of a composite plastic such as PET.
  • the protective cover 16 is combined with the lens barrel 12.
  • the protective cover 16 is used to limit the position of the diffractive optical element 15.
  • the protective cover 16 is used to prevent the combination of the diffractive optical element 15 and the lens barrel 12 from failing. Then it comes out of the lens barrel 12.
  • the protective cover 16 may be made of an opaque material, such as nano-silver wire, metallic silver wire, copper sheet, and the like.
  • the protective cover 16 partially shields the diffractive optical element 15 instead of completely blocking the diffractive optical element 15.
  • the protective cover 16 is provided with a light transmitting hole, and the diffractive optical element 15 projects a laser pattern outward from the light transmitting hole.
  • the protective cover 16 is also made of a light-transmitting material, such as glass, polymethyl methacrylate, polycarbonate, polyimide, and the like. Since the light-transmitting materials such as glass, PMMA, PC, and PI all have excellent light-transmitting properties, at this time, the protective cover 16 can partially shield the diffractive optical element 15 or completely shield the diffractive optical element 15 so that the diffractive optical element 15 Waterproof and dustproof.
  • a light-transmitting material such as glass, polymethyl methacrylate, polycarbonate, polyimide, and the like. Since the light-transmitting materials such as glass, PMMA, PC, and PI all have excellent light-transmitting properties, at this time, the protective cover 16 can partially shield the diffractive optical element 15 or completely shield the diffractive optical element 15 so that the diffractive optical element 15 Waterproof and dustproof.
  • the protective cover 16 includes a protective top wall 161 and a protective side wall 162.
  • the protective top wall 161 and the limiting protrusion 123 are located on opposite sides of the diffractive optical element 15, respectively, or the diffractive optical element 15 is located between the limiting protrusion 123 and the protective top wall 161.
  • the combination of 15 and the limiting protrusion 123 is invalid. Due to the restricting effect of the protective top wall 161, the diffractive optical element 15 will not come out.
  • the protective top wall 161 is provided with a light through hole 1611, the position of the light through hole 1611 corresponds to the diffractive optical element 15, and the laser light passes through the light through hole 1231, the diffractive optical element 15 and the light through hole 1611, and then passes through the laser projection module 10 Shoot out.
  • the overall shape of the protective top wall 161 is a rounded square, and the light through hole 1611 may be circular, rectangular, oval, trapezoidal, or the like.
  • the protective top wall 161 when the protective cover 16 is combined with the lens barrel 12, the protective top wall 161 abuts against the first surface 124. Further, the protective top wall 161 may also be adhered to the first surface 124 by gluing. And so on.
  • the protective side wall 162 extends from the peripheral edge of the protective top wall 161, the protective cover 16 covers the lens barrel 12, and the protective side wall 162 is fixedly connected to the lens barrel side wall 122.
  • the protective side wall 162 includes a plurality of protective sub-side walls 1621 that are connected in sequence from end to end. Each protective sub-side wall 1621 is fixedly connected to the lens barrel side wall 122. Each protective sub-side wall 1621 is formed with a little glue hole 163. .
  • the position of the dispensing hole 163 corresponds to the position of the accommodating groove 126. After the protective cover 16 is placed on the lens barrel 12, the glue can be dispensed from the dispense hole 163 into the accommodating groove 126.
  • each protective sub-side wall 1621 is provided with a single dispensing hole 163.
  • each protective sub-side wall 1621 is provided with a plurality of dispensing holes 163, such as two, three , Four, etc.
  • each protection sub-side wall 1621 is provided with two dispensing holes 163, and the two dispensing holes 163 respectively correspond to the two inner sidewalls 1261 of the accommodating groove 126, which is convenient. The user dispenses to both sides of the accommodating tank 126 at the same time, thereby increasing the dispensing speed.
  • the inner side wall 1261 of the rubber containing groove 126 is inclinedly connected to the inner bottom wall 1262 of the rubber containing groove 126 and the outer wall of the lens barrel side wall 122.
  • the oblique connection refers to the inner side wall 1261 and the inner bottom wall 1262, and the inner side wall 1261 and the mirror.
  • the outer wall of the cylinder side wall 122 is not vertical.
  • the detecting component 70 is used to detect whether the protective cover 16 has come off.
  • the detection assembly 70 includes a transmitter 74 and a receiver 75. At least one of the transmitter 74 and the receiver 75 is disposed on the protective side wall 162, and the other is disposed on the substrate assembly 11.
  • the transmitter 74 and the receiver 75 are oppositely disposed to Form a detection line. When the transmitter 74 or the receiver 75 deviates from the detection line, the receiver 75 cannot receive the detection signal transmitted by the transmitter 74 or the received detection signal exceeds a predetermined signal range, indicating that the relative position of the protective cover 16 and the substrate assembly 11 is A large change occurs, thereby confirming that the protective cover 16 (diffractive optical element 15) has come off.
  • the transmitter 74 may continuously transmit a detection signal to the receiver 75, and the receiver 75 continuously receives the detection signal. In another example, the transmitter 74 may transmit the detection signal to the receiver 75 at predetermined time intervals, and the receiver 75 continuously receives the detection signal.
  • the protective cover 16 since the protective cover 16 is combined with the lens barrel 12, the protective top wall 161 of the protective cover 16 and the limiting protrusion 123 limit the position of the diffractive optical element 15.
  • the diffractive optical element 15 does not fall off in the direction of light emission, and the laser light is prevented from being emitted without passing through the diffractive optical element 15 to protect the user and improve safety.
  • the laser projection module 10 is provided with one of the transmitter 74 and the receiver 75 on the protective cover 16, and the other of the transmitter 74 and the receiver 75 on the substrate assembly 11. The transmitter 74 and the receiver 75 are relatively opposed to each other.
  • the detection circuit is formed to determine whether the protective cover 16 (diffractive optical element 15) is detached.
  • the laser projection module 10 stops working to avoid the laser emitted by the laser projection module 10. The user is burned and the security level of protecting the user from using the laser projection module 10 is improved.
  • the lens barrel 12 includes a lens barrel sidewall 122, and the lens barrel sidewall 122 is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the substrate assembly 11 includes a circuit board 112, and the side wall 122 of the lens barrel is combined with the circuit board 112.
  • the transmitter 74 is disposed on the protective sidewall 162, the receiver 75 is disposed on the circuit board 112; and / or, the receiver 75 is disposed on the protective sidewall 162, and the transmitter 74 is disposed on the circuit board 112.
  • the protective sidewall 162 includes opposite sidewall inner surfaces 1622 and sidewall outer surfaces 1623. At least one of the transmitter 74 and the receiver 75 is disposed on the sidewall outer surface 1623, and the other is disposed on the circuit. Board 112. Specifically, when the number of the transmitter 74 and the receiver 75 is one, the transmitter 74 is disposed on the outer surface of the side wall 1623 and the receiver 75 is disposed on the circuit board 112; or the receiver 75 is disposed on the outer surface of the side wall At 1623, the transmitter 74 is disposed on the circuit board 112.
  • each transmitter 74 is disposed on the outer surface 1623 of the side wall
  • multiple receivers 75 are disposed on the circuit board 112
  • each of the transmitters 74 is Corresponds to one receiver 75, and each receiver 75 corresponds to one transmitter 74; or, multiple receivers 75 are provided on the side wall outer surface 1623, and multiple transmitters 74 are provided on the circuit board 112
  • Each receiver 75 corresponds to a transmitter 74, and each receiver 75 corresponds to a transmitter 74.
  • each transmitter 74 corresponds to a receiver 75
  • each receiver 75 corresponds to a transmitter 74.
  • a plurality means two or more.
  • the first positioning portion 128 includes a lens barrel projection 1285 protruding from the sidewall 122 of the lens barrel
  • the second positioning portion 154 includes a side recess 1545 formed on the side surface 153.
  • the lens barrel projection 1285 extends into the side depression 1545.
  • the position of the lens barrel projection 1285 corresponds to the position of the side depression 1545, and the number of the lens barrel projection 1285 and the side depression 1545 are equal.
  • the shape of the lens barrel projection 1285 cut by a plane parallel to the diffractive bottom surface 152 can be rectangular or semicircular One or more of shape, triangle, trapezoid, and circle.
  • the lens barrel bump 1285 will offset the diffractive optical element 15 and the diffractive optical element 15 cannot be mounted on the limiting protrusion 123, and the user easily perceives that the diffractive optical element 15 is damaged. Reverse installation, so the lens barrel convex 1285 and the side recess 1545 can prevent the diffractive optical element 15 from being reversed.
  • the size of the side depression 1545 gradually increases, and the size of the lens barrel projection 1285 gradually increases. Further, the maximum size of the lens barrel projection 1285 is larger than the minimum size of the side depression 1545.
  • the lens barrel projection 1285 cannot fully extend into the lens barrel depression 1284, and the lens barrel projection 1285 will raise the diffractive optical element 15 high, and the user can easily perceive that the diffractive optical element 15 is reversed.
  • the lens barrel 12 includes a lens barrel sidewall 122.
  • the lens barrel sidewall 122 is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the substrate assembly 11 includes a circuit board 112, and the side wall 122 of the lens barrel is combined with the circuit board 112.
  • the protective sidewall 162 defines a receiving slot 1624.
  • the substrate assembly 11 includes a circuit board 112.
  • the lens barrel sidewall 122 is combined with the circuit board 112.
  • the transmitter 74 is disposed in the receiving slot 1624, and the receiver 75 is disposed on the circuit board 112; and / or, the receiver 75 is disposed in the receiving slot 1624, and the transmitter 74 is disposed on the circuit board.
  • a receiving groove 1624 is defined on the outer surface 1623 of the side wall. At least one of the transmitter 74 and the receiver 75 is disposed on the receiving groove 1624 and the other is disposed on the circuit board 112. When the number of the transmitter 74 and the receiver 75 is one, the transmitter 74 is disposed in the receiving slot 1624, and the receiver 75 is disposed on the circuit board 112; or, the receiver 75 is disposed in the receiving slot 1624, and the transmitter 74 It is disposed on the circuit board 112.
  • each transmitter 74 and the receivers 75 When the number of the transmitters 74 and the receivers 75 is multiple, multiple transmitters 74 are disposed in the receiving slot 1624, multiple receivers 75 are disposed on the circuit board 112, and each of the transmitters 74 and one The receiver 75 corresponds, and each receiver 75 corresponds to a transmitter 74; or, multiple receivers 75 are disposed in the receiving slot 1624, and multiple transmitters 74 are disposed on the circuit board 112, each receiving The transmitters 75 each correspond to one transmitter 74, and each receiver 75 corresponds to one transmitter 74.
  • each transmitter 74 corresponds to a receiver 75
  • each receiver 75 corresponds to a transmitter 74.
  • the transmitter 74 or the receiver 75 is combined with the receiving slot 1624 by glue, so that the transmitter 74 or the receiver 75 is more firmly coupled with the receiving slot 1624.
  • the lens barrel 12 includes a lens barrel side wall 122, which is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11 to protect the sidewall.
  • the bottom surface 1625 of the side wall of 162 is provided with a receiving groove 1626, and the side wall 122 of the lens barrel is provided with a through hole 129.
  • the lens barrel 12 further includes a first surface 124 and a second surface 125 opposite to each other, and the second surface 125 and the substrate assembly 11 In combination, the bottom surface 1625 of the sidewall is opposite to the first surface 124, and the through hole 129 penetrates the first surface 124 and the second surface 125 and is opposite to the accommodation groove 1626.
  • the transmitter 74 is disposed in the accommodation slot 1626, the receiver 75 is disposed on the circuit board 112 and received in the through hole 129; and / or, the receiver 75 is disposed in the accommodation slot 1626, and the transmitter 74 is disposed in the circuit board 112 is received in the through hole 129.
  • the protective sidewall 162 includes a sidewall bottom surface 1625 connecting the sidewall inner surface 1622 and the sidewall outer surface 1623. As shown in FIG. 55, in the present embodiment, the side wall bottom surface 1625 is opposed to and spaced from the first surface 124. A receiving groove 1626 corresponding to the size of the transmitter 74 or the receiver 75 is defined in the bottom surface 1625 of the sidewall. A side wall 122 of the lens barrel is provided with a through hole 129 corresponding to the accommodation groove 1626. In the embodiment of FIG. 55, the through-hole 129 is provided at the junction of the two side walls 1221 of the lens barrel. In other embodiments, the through-hole 129 can also be directly provided in the side wall 1221 of the lens barrel.
  • the transmitter 74 is disposed in the accommodation slot 1626, and the receiver 75 is disposed on the circuit board 112 and accommodated in the through hole 129; or, the receiver 75 is disposed on In the accommodating slot 1626, the transmitter 74 is disposed on the circuit board 112 and is received in the through hole 129.
  • the number of the transmitters 74 and the receivers 75 is multiple, the number of the through holes 129 is also multiple.
  • the multiple transmitters 74 are disposed in the accommodation slots 1626, and the multiple receivers 75 are disposed on the circuit board.
  • each transmitter 74 corresponds to a receiver 75
  • each receiver 75 corresponds to a transmitter 74; or, multiple receivers 75 are provided
  • a plurality of transmitters 74 are disposed on the circuit board 112 and are received in a corresponding plurality of through holes 129.
  • Each receiver 75 corresponds to a transmitter 74
  • each receiver 75 Each corresponds to one transmitter 74.
  • the number of the transmitters 74 and the receivers 75 are multiple, a part of the transmitters 74 are disposed in the accommodation slots 1626, and another part of the transmitters 74 are disposed on the circuit board 112 and received in the corresponding plurality of through holes 129.
  • a part of the receiver 75 is disposed on the circuit board 112 and accommodated in the through hole 129, and another part of the receiver 75 is disposed in the accommodation slot 1626.
  • Each transmitter 74 corresponds to a receiver 75, and each receiver 75 corresponds to one transmitter 74.
  • the transmitter 74 or the receiver 75 When assembling the protective cover 16 and the lens barrel 12, the transmitter 74 or the receiver 75 may be installed in the accommodating groove 1626, and then the protective cover 16 is placed on the side wall 122 of the lens barrel.
  • the transmitter 74 or the receiver 75 When assembling the lens barrel 12 and the substrate assembly 11, the transmitter 74 or the receiver 75 may be vertically arranged on the circuit board 112, and then the through-hole 129 of the lens barrel 12 is aligned with the transmitter 74 or the receiver 75.
  • the transmitter 74 or the receiver 75 is housed in the through hole 129.
  • the transmitter 74 or the receiver 75 is combined with the accommodating slot 1626 by glue, so that the transmitter 74 or the receiver 75 is more firmly coupled with the accommodating slot 1626.
  • the top surface 1223 see FIG.
  • the side wall 122 of the lens barrel is in contact with the bottom surface 1625 of the side wall, and the transmitter 74 or receiver 75 installed in the accommodation groove 1626 is in contact with the top surface 1223 to avoid The transmitter 74 or the receiver 75 falls from the accommodation slot 1626.
  • the number of the detection components 70 is multiple, and the multiple detection lines of the multiple detection components 70 are parallel; or, the multiple detection lines of the multiple detection components 70 intersect.
  • a plurality of detection components 70 are provided on each protective sub-side wall 1621 to improve detection accuracy.
  • each transmitter 74 corresponds to a receiver 75
  • each receiver The transmitters 75 each correspond to one transmitter 74.
  • the detection lines of the other plurality of detection components 70 arranged in an array are similar to the above-mentioned detection lines, and are not repeated here.
  • the transmitter 74 is sequentially arranged on the protection sub-side wall 1621, and the receiver 75 is sequentially arranged on the circuit board 112 corresponding to the transmitter 74, and a plurality of detection lines formed are mutually parallel.
  • a plurality of transmitters 74 may be disposed at the top corner positions of the protective cover 16, and a plurality of receivers 75 are correspondingly disposed on the circuit board 112 at another top corner opposite to the top corner, and a plurality of detection lines are formed. intersect.
  • the same laser projection module 10 may be provided with a set of detection components 70 whose detection lines are parallel to each other, a set of detection components 70 where the detection lines intersect, and then control the two sets of detection components 70 to emit at predetermined time intervals. And receiving the detection signal to avoid detection interference caused by the two sets of detection components 70.
  • the plurality of detection components 70 include at least two detection components 70 respectively disposed on two opposite protective side walls 1621.
  • the protection sidewall 162 includes a plurality of protection sub-walls 1621.
  • the number of the protection sub-side walls 1621 is four.
  • the plurality of detection components 70 may be distributed only on two protective sub-side walls 1621 disposed opposite to each other, such as the left and right protective sub-side walls 1621 and the front and rear protective sub-side walls 1621.
  • a plurality of detection components 70 can also be distributed on the four protective sub-side walls 1621, that is, the front and rear, left and right protective sub-side walls 1621 are provided with detection components 70.
  • the protective cover 16 rotates (eversion) around a certain side wall 122 of the lens barrel, one of the protective side walls 1621 is detached from the side wall 122 of the lens barrel, and the rotation distance between the two is large.
  • the receiver 75 of the detection assembly 70 receives the detection transmitted by the corresponding transmitter 74 The signal is still strong and may still be within the predetermined detection signal range.
  • the detection component 70 on a certain protection sub-side wall 1621 determines whether the protection cover 16 is detached, and the determination accuracy is relatively low.
  • the detection accuracy of the detection component 16 can be improved.
  • the laser projection module 10 further includes a processing chip 60.
  • the processing chip 60 is connected to the receiver 75.
  • the processing chip 60 can determine that the protective cover 16 is detached when the receiver 75 cannot receive the detection signal transmitted by the transmitter 74 or the received detection signal exceeds a predetermined signal range. Specifically, the processing chip 60 determines the relative position of the protective cover 16 and the substrate assembly 11 according to the strength of the detection signal received by the receiver 75.
  • the processing chip 60 may be disposed on the main board of the electronic device 1000, and the processing chip 60 may be connected to the receiver 75 through the connector 17.
  • the processor 30 in the depth camera 100 can be used as the processing chip 60 in this embodiment, that is, the processor 30 can be used to process a laser pattern to obtain a depth image and to detect and protect Whether the cover 16 is connected to the detection circuit 70 of the detection circuit 18. At this time, the laser projection module 10 does not need to additionally provide a processing chip 60.
  • the lens barrel 12 includes a lens barrel side wall 162, the lens barrel side wall 162 and the substrate assembly 11 together form a receiving cavity 121, and the lens barrel side wall 162 is formed with a first surface 124 and a second surface opposite to each other.
  • the surface 125 and the second surface 125 are combined with the substrate assembly 11; the diffractive optical element 15 is contained in the receiving cavity 121; the protective cover 16 is provided with a light through hole 1611 aligned with the diffractive optical element 15; the protective cover 16 is combined with the lens barrel 12
  • the detection assembly 70 includes a transmitter 74 and a receiver 75.
  • One of the transmitter 74 and the receiver 75 is disposed on the inner wall of the light-passing hole 1611, and the other is disposed on the inner wall of the light-passing hole 1611.
  • the transmitter 74 and the receiver 75 are oppositely disposed to form a detection circuit.
  • the laser projection module 10 includes a substrate assembly 11, a lens barrel 12, a light source 13, a collimating element 14, a diffractive optical element 15, a protective cover 16, and a detecting element 70.
  • the light source 13, the collimating element 14, and the diffractive optical element 15 are sequentially disposed on the optical path of the light source 13. Specifically, the light emitted by the light source 13 passes through the collimating element 14 and the diffractive optical element 15 in this order.
  • the substrate assembly 11 includes a substrate 111 and a circuit board 112 carried on the substrate 111.
  • the substrate 111 is used to carry the lens barrel 12, the light source 13, and the circuit board 112.
  • the material of the substrate 111 may be plastic, such as at least one of polyethylene terephthalate, polymethyl methacrylate, polycarbonate, and polyimide. That is, the substrate 111 may be made of a single plastic material of any one of PET, PMMA, PC, or PI. As such, the substrate 111 is lightweight and has sufficient support strength.
  • the circuit board 112 may be any one of a printed circuit board, a flexible circuit board, and a rigid-flexible board.
  • the circuit board 112 can be provided with a via hole 113, and the via hole 113 can be used to receive the light source 13.
  • One part of the circuit board 112 is covered by the lens barrel 12, and the other part extends out and can be connected with the connector 17.
  • the connector 17 can The laser projection module 10 is connected to a motherboard of the electronic device 1000.
  • the lens barrel 12 is disposed on the substrate assembly 11 and forms a receiving cavity 121 together with the substrate assembly 11.
  • the lens barrel 12 may be connected to the circuit board 112 of the substrate assembly 11, and the lens barrel 12 and the circuit board 112 may be adhered with an adhesive to improve the airtightness of the receiving cavity 121.
  • the accommodating cavity 121 can be used for accommodating components such as the collimating element 14 and the diffractive optical element 15.
  • the accommodating cavity 121 forms a part of the optical path of the laser projection module 10 at the same time.
  • the lens barrel 12 has a hollow cylindrical shape.
  • the lens barrel 12 includes a lens barrel sidewall 122 and a limiting protrusion 123.
  • the side wall 122 of the lens barrel and the substrate assembly 11 together form a receiving cavity 121, and the outer wall of the side wall 122 of the lens barrel may be formed with a positioning and mounting structure to facilitate fixing the laser projection mold when the laser projection module 10 is installed in the electronic device 1000.
  • Position of group 10. The side wall 122 of the lens barrel is formed with a first surface 124 and a second surface 125 opposite to each other. One opening of the receiving cavity 121 is opened on the second surface 125 and the other opening is opened on the first surface 124.
  • the second surface 125 is bonded to the circuit board 112, such as gluing.
  • the first surface 124 can be used as a bonding surface between the lens barrel 12 and the diffractive optical element 15, or the lens barrel 12 and the protective cover 16.
  • the outer wall of the side wall 122 of the lens barrel is provided with an adhesive containing groove 126.
  • the adhesive containing groove 126 may be opened from the first surface 124 and extended toward the second surface 125.
  • the limiting protrusion 123 protrudes inwardly from the side wall 122 of the lens barrel. Specifically, the limiting protrusion 123 protrudes from the side wall 122 of the lens barrel into the receiving cavity 121.
  • the limiting protrusions 123 may be in a continuous ring shape, or the limiting protrusions 123 include a plurality of limiting protrusions 123 spaced apart from each other.
  • the limiting protrusion 123 forms a light-passing hole 1231.
  • the light-passing hole 1231 can be used as a part of the receiving cavity 121. The laser light passes through the light-passing hole 1231 and penetrates the diffractive optical element 15. In the embodiment shown in FIG.
  • the limiting protrusion 123 is located between the first surface 124 and the second surface 125, and the receiving cavity 121 between the limiting protrusion 123 and the second surface 125 can be used for receiving the standard
  • the receiving cavity 121 between the straight element 14, the limiting protrusion 123 and the first surface 124 can be used for receiving the diffractive optical element 15.
  • the limiting protrusion 123 includes a limiting surface 1232. When the diffractive optical element 15 is mounted on the limiting protrusion 123, the limiting surface 1232 is combined with the diffractive optical element 15.
  • the light source 13 is disposed on the substrate assembly 11. Specifically, the light source 13 may be disposed on the circuit board 112 and electrically connected to the circuit board 112, and the light source 13 may also be disposed on the substrate 111 and communicate with the via hole. Corresponding to 113, at this time, the light source 13 can be electrically connected to the circuit board 112 by arranging wires.
  • the light source 13 is used to emit laser light.
  • the laser light may be infrared light.
  • the light source 13 may include a semiconductor substrate and an emission laser disposed on the semiconductor substrate.
  • the semiconductor substrate is disposed on the substrate 111.
  • the emission laser may be vertical. Cavity surface emitting laser.
  • the semiconductor substrate may be provided with a single emission laser or an array laser composed of a plurality of emission lasers. Specifically, the plurality of emission lasers may be arranged on the semiconductor substrate in the form of a regular or irregular two-dimensional pattern.
  • the collimating element 14 may be an optical lens.
  • the collimating element 14 is used to collimate the laser light emitted by the light source 13.
  • the collimating element 14 is housed in the receiving cavity 121.
  • the collimating element 14 may be along the first
  • the two surfaces 125 are assembled in the receiving cavity 121 in a direction of the first surface 124.
  • the collimating element 14 includes an optical portion 141 and a mounting portion 142.
  • the mounting portion 142 is used to combine with the lens barrel sidewall 122 and fix the collimating element 14.
  • the optical portion 141 includes Two surfaces on both sides.
  • the diffractive optical element 15 is mounted on the limiting protrusion 123. Specifically, the diffractive optical element 15 is combined with the limiting surface 1232 to be mounted on the limiting protrusion 123.
  • the outer surface of the diffractive optical element 15 includes a top surface 151, a bottom surface 152, and a side surface 153.
  • the top surface 151 and the bottom surface 152 are opposite to each other, and the side surface 153 connects the top surface 151 and the bottom surface 152.
  • the bottom surface 152 is combined with the limiting surface 1232.
  • a diffractive structure is formed on the bottom surface 152, and the top surface 151 may be a smooth plane.
  • the diffractive optical element 15 may project the laser light collimated by the collimating element 14 to a laser pattern corresponding to the diffractive structure.
  • the diffractive optical element 15 may be made of glass, or it may be said to be made of a composite plastic such as PET.
  • the protective cover 16 is combined with the lens barrel 12.
  • the protective cover 16 is used to limit the position of the diffractive optical element 15. Specifically, the protective cover 16 is used to prevent the combination of the diffractive optical element 15 and the lens barrel 12 from failing. Then it comes out of the containing cavity 121 of the lens barrel 12.
  • the protective cover 16 includes a protective top wall 161 and a protective side wall 162.
  • the protective top wall 161 covers part of the diffractive optical element 15, and the protective top wall 161 and the limiting projection 123 are respectively located on opposite sides of the diffractive optical element 15, or the diffractive optical element 15 is located on the limiting projection 123 and the protective top. In this way, even if the combination of the diffractive optical element 15 and the limiting protrusion 123 fails, the diffractive optical element 15 will not come out of the receiving cavity 121 due to the restricting effect of the protective top wall 161.
  • the protective top wall 161 is provided with a light through hole 1611. The position of the light through hole 1611 is aligned with the diffractive optical element 15.
  • the laser light passes through the light through hole 1231, the diffractive optical element 15 and the light through hole 1611, and then passes through the laser projection module 10. Shot out.
  • the overall shape of the protective top wall 161 is a rounded square, and the light through hole 1611 may be circular, rectangular, oval, trapezoidal, or the like.
  • the protective top wall 161 when the protective cover 16 is combined with the lens barrel 12, the protective top wall 161 abuts against the first surface 124. Further, the protective top wall 161 may also be adhered to the first surface 124 by gluing. And so on.
  • the protective side wall 162 extends from the peripheral edge of the protective top wall 161.
  • the protective side wall 162 is combined with the lens barrel 12.
  • the protective cover 16 is disposed on the lens barrel 12, and the protective side wall 162 and the lens barrel side wall 122 are fixedly connected.
  • the protective side wall 162 includes a plurality of protective sub-side walls 1621 that are connected in sequence from end to end. Each protective sub-side wall 1621 is fixedly connected to the side wall 122 of the lens barrel. Each protective sub-side wall 1621 forms a little glue hole 163. .
  • the position of the dispensing hole 163 corresponds to the position of the accommodating groove 126.
  • each protective sub-side wall 1621 is provided with a single dispensing hole 163.
  • each protective sub-side wall 1621 is provided with multiple dispensing holes 163, such as two, three , Four, etc. In the embodiment of the present application, please refer to FIG. 10 and FIG. 11.
  • Each protection sub-side wall 1621 is provided with two dispensing holes 163. The two dispensing holes 163 are respectively connected to the two inner sidewalls 1261 of the container 126.
  • the inner side wall 1261 of the rubber containing groove 126 is inclinedly connected to the inner bottom wall 1262 of the rubber containing groove 126 and the outer wall of the lens barrel side wall 122.
  • the oblique connection refers to the inner side wall 1261 and the inner bottom wall 1262, and the inner side wall 1261 and the mirror.
  • the outer wall of the cylinder side wall 122 is not vertical.
  • the detection assembly 70 includes a transmitter 74 and a receiver 75.
  • One of the transmitter 74 and the receiver 75 is installed on the inner wall of the light-passing hole 1611, and the other is installed on the first surface 124.
  • the transmitter 74 and the receiver 75 are oppositely disposed to form a detection line.
  • the transmitter 74 may be installed on the inner wall of the light through hole 1611, and the receiver 75 may be installed on the first surface 124; or the receiver 75 may be installed on the inner wall of the light through hole 1611, and the transmitter 74 may be installed on the first wall Face 124.
  • the detection assembly 70 is exemplarily described by taking the transmitter 74 mounted on the first surface 124 and the receiver 75 mounted on the inner wall of the light through hole 1611 as an example.
  • the transmitter 74 is disposed opposite to the receiver 75.
  • the transmitter 74 is used to transmit a detection signal S in a specific direction.
  • the detection signal S transmitted by the transmitter 74 is received by the receiver 75 and received.
  • the detector 75 receives the detection signal S, it sends out different electrical signals according to the strength of the detection signal S.
  • the electrical signal can be received by the processing chip 60 (shown in FIG.
  • the processing chip 60 is connected to the receiver 75, and the processing chip 60 can be disposed on the substrate assembly 11.
  • the processing chip 60 obtains the intensity of the detection signal S received by the receiver 75 by processing the electrical signal.
  • the functions of the processing chip 60 can also be implemented by the processor 30 described above, or the processor 30 can also be used as the processing chip 60.
  • the protective cover 16 and the lens barrel 12 can be considered After being separated, the protective cover 16 drives the transmitter 74 to move relative to the receiver 75, so that the positions of the transmitter 74 and the receiver 75 are no longer opposite to each other, and it is indirectly obtained that the diffractive optical element 15 has fallen off the receiving cavity 121. After the diffractive optical element 15 is detached, the laser light projected by the laser projection module 10 will form a strong zero-order light beam. If the user happens to be doing face recognition, it will hurt the user's eyes.
  • the protective cover 16 drives the transmitter 74 to move relative to the receiver 75, so that the positions of the transmitter 74 and the receiver 75 are also relative.
  • the change has occurred, and it is indirectly concluded that the diffractive optical element 15 may have also been shifted.
  • the diffractive optical element 15 is shifted, once the installation position of the diffractive optical element 15 is changed, the laser projection module 10 may emit a strong zero-order light beam. Secondly, the diffractive optical element 15 is likely to continue. Shedding during use.
  • the processing chip 60 may determine that the protective cover 16 is detached when the receiver 75 cannot receive the detection signal S, or when the strength of the detection signal S received by the receiver 75 is not within a predetermined range. At this time, the processing chip 60 can control the light source 13 to stop emitting laser light, so that the laser projection module 10 stops working. Compared with the case where the light source 13 stops emitting laser light after the detachment of the diffractive optical element 15 is directly detected, this embodiment will The security guarantee is advanced in advance, and the security level of the laser projection module 10 used by the user is improved.
  • the transmitter 74 may be a sound wave transmitter and is used to transmit detection sound waves.
  • the receiver 75 may be a sound wave receiver and used to receive detection sound waves transmitted by the transmitter 74, and the detection sound waves may be ultrasonic waves.
  • the transmitter 74 may also be a light transmitter and is used to emit detection light.
  • the receiver 75 may be a light receiver and used to receive the detection light emitted by the transmitter 74, and the detection light may be a laser.
  • the transmitter 74 may be adhered to the first surface 124, and the receiver 75 may be adhered to the inner wall of the light through hole 1611.
  • the detection component 70 can detect when the light source is not emitting light to avoid the detection signal from interfering with the laser pattern projected by the laser projection module 10.
  • the detection component 70 can also be Detect in real time.
  • the detection component 70 may also perform detection at a predetermined time, for example, every other day.
  • the detection component 70 may also perform detection after each predetermined period of time when the light source 13 emits light, for example, the light source 13 performs detection after every 30 minutes of cumulative light emission.
  • the laser light emitted by the light source needs to pass through a diffractive optical element before being emitted outward.
  • the diffractive optical element is usually installed in the lens barrel of the structured light projector. However, in use, the diffractive optical element is easily detached from the lens barrel, and when the user turns on the light source without knowing that the diffractive optical element has been detached, the light source may directly harm the user after being emitted directly.
  • the protective cover 16 can be used to prevent the diffractive optical element 15 from coming out of the receiving cavity 121, and at the same time, one of the transmitter 74 and the receiver 75 of the detection module 70 is disposed in the light-passing hole. On the inner wall of 1611, the other is disposed on the first surface 124. The transmitter 74 and the receiver 75 face each other to form a detection circuit. The user can detect whether the protective cover 16 has fallen off through the detection circuit and further know whether the diffractive optical element 15 is When the protection cover 16 is detected to fall off, the laser projection module 10 may be turned off to prevent the laser light from being directly emitted without diffractive optical element 15 and thereby injuring the user.
  • the number of the detection components 70 is plural, each detection component 70 forms a detection line, and a plurality of detection lines of the plurality of detection components 70 intersect.
  • the receiver 75 can still receive the protective cover 16 even though the position of the protective cover 16 has deviated from the normal position.
  • the detection signal and the intensity of the detection signal are within a predetermined range, so that the case where the protective cover 16 may fall off cannot be detected very accurately.
  • the plurality of detection components 70 can accurately detect whether the protective cover 16 is turned over.
  • the number of the detection components 70 is two, and the two detection lines of the two detection components 70 intersect.
  • a receiving groove 1241 is defined in the first surface 124, and the receiving groove 1241 can be used for installing the transmitter 74 or the receiver 75.
  • the transmitter 74 may be fixed in the accommodating groove 1241 and exposed from the accommodating groove 1241, and the receiver 75 may be disposed on the inner wall of the light-passing hole 1611; or the receiver 75 may be fixed in the accommodating groove 1241 and accommodating from it
  • the groove 1241 is exposed, and the emitter 74 is disposed on the inner wall of the light-passing hole 1611.
  • the transmitter 74 is fixed in the receiving groove 1241 and is exposed from the receiving groove 1241, so that the transmitter 74 can be firmly combined with the lens barrel 12.
  • an inner wall of the light through hole 1611 is provided with a receiving groove 166.
  • the receiving groove 166 may be used for installing the receiver 75 or the transmitter 74.
  • the receiver 75 may be fixed in the receiving groove 166 and exposed from the receiving groove 166, and the transmitter 74 is disposed on the first surface 124; or the transmitter 74 is fixed in the receiving groove 166 and exposed from the receiving groove 166
  • the receiver 75 is disposed on the first surface 124.
  • the receiver 75 is fixed in the receiving groove 166 and exposed from the receiving groove 166, so that the receiver 75 can be more firmly combined with the protective top wall 161.
  • the first surface 124 is provided with a receiving groove 1241
  • the inner wall of the light through hole 1611 is provided with a receiving groove 166.
  • One of the transmitter 74 and the receiver 75 is fixed in the receiving groove 1241. And exposed from the receiving groove 1241, and the other is fixed in the receiving groove 166 and exposed from the receiving groove 166, so that the receiver 75 and the transmitter 74 can be fixed relatively stably.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, for example, two, three, unless it is specifically and specifically defined otherwise.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Lens Barrels (AREA)
  • Semiconductor Lasers (AREA)

Abstract

一种激光投射模组(10)和包括它的深度相机(100)、电子装置(1000),激光投射模组(10)包括基板组件(11)、镜筒(12)、衍射光学元件(15)、保护盖(16)和检测组件(70)。镜筒(12)设置在基板组件(11)上,衍射光学元件(15)设置在镜筒(12)内,保护盖(16)与镜筒(12)结合并遮挡衍射光学元件(15),检测组件(70)用于检测保护盖(16)是否从镜筒(12)上脱落。

Description

激光投射模组、深度相机和电子装置
优先权信息
本申请请求2018年05月25日向中国国家知识产权局提交的、专利号为201810545855.0以及201810545879.6的专利的优先权和权益;还请求2018年06月27日向中国国家知识产权局提交的、专利号为201810674273.2以及201810674275.1的专利的优先权和权益;以及请求2018年06月28日向中国国家知识产权局提交的、专利号为201810687921.8的专利的优先权和权益;本申请通过参照将上述专利的全文并入此处。
技术领域
本申请涉及光学及电子技术领域,更具体而言,涉及一种激光投射模组、深度相机和电子装置。
背景技术
激光投射模组需要在激光的发射光路上设置衍射光学元件(diffractive optical elements,DOE),而衍射光学元件通常通过胶水直接粘在激光投射模组的镜筒上,而胶水容易失效,导致衍射光学元件脱落,如果在衍射光学元件从镜筒上脱落后激光投射模组还发射激光,则激光不经过衍射光学元件直接发射出去后容易灼伤用户。
发明内容
本申请实施方式提供一种激光投射模组、深度相机和电子装置。
本申请实施方式的激光投射模组包括基板组件、镜筒、衍射光学元件、保护盖和检测组件;所述镜筒设置在所述基板组件上;所述衍射光学元件设置在所述镜筒内;所述保护盖与所述镜筒结合并遮挡所述衍射光学元件;所述检测组件用于检测所述保护盖是否从所述镜筒上脱落。
本申请实施方式的深度相机包括上述实施方式的所述的激光投射模组和图像采集器,所述图像采集器用于采集经所述衍射光学元件后向目标空间中投射的激光图案,所述激光图案用于形成深度图像。
本申请实施方式的电子装置包括壳体和上述实施方式所述的深度相机,所述深度相机设置在所述壳体上并用于获取深度图像。
本申请的实施方式的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实施方式的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:
图1是本申请某些实施方式的电子装置的结构示意图。
图2是本申请某些实施方式的深度相机的结构示意图。
图3是本申请某些实施方式的激光投射模组的立体示意图。
图4是本申请某些实施方式的激光投射模组的平面示意图。
图5是本申请某些实施方式的激光投射模组的立体分解示意图。
图6是图4或图22所示的激光投射模组沿VI-VI线的截面示意图。
图7是本申请另一实施方式的沿与图4或图22所示的激光投射模组VI-VI线的截面示意图。
图8是图4或图22所示的激光投射模组沿VIII-VIII线的截面示意图。
图9是图8中的激光投射模组的IX部分的放大示意图。
图10是图5、图23、图29、图43和图60中的任意一个所示的激光投射模组的X部分的放大示意图。
图11是本申请某些实施方式的激光投射模组的保护盖的立体示意图。
图12和图13是本申请某些实施方式的激光投射模组的部分结构示意图。
图14至图16是本申请某些实施方式的激光投射模组去掉保护盖后的平面示意图。
图17是本申请某些实施方式的衍射光学元件和镜筒侧壁的结构示意图。
图18是本申请某些实施方式的激光投射模组去掉保护盖后的平面示意图。
图19是本申请某些实施方式的衍射光学元件和镜筒侧壁的结构示意图。
图20是本申请某些实施方式的检测电路的工作原理示意图。
图21是本申请某些实施方式的激光投射模组的立体示意图。
图22是本申请某些实施方式的激光投射模组的平面示意图。
图23是本申请某些实施方式的激光投射模组的立体分解示意图。
图24至图27是本申请某些实施方式的检测电路的工作原理示意图。
图28是本申请某些实施方式的激光投射模组的平面示意图。
图29是本申请某些实施方式的激光投射模组的立体分解示意图。
图30是图28所示的激光投射模组沿XXX-XXX线的截面示意图。
图31是本申请另一实施方式的沿与图28所示的激光投射模组XXX-XXX线的截面示意图。
图32是图28所示的激光投射模组沿XXXII-XXXII线的截面示意图。
图33是图32中的激光投射模组的XXXIII部分的放大示意图。
图34和图35是本申请某些实施方式的激光投射模组的部分结构示意图。
图36至图38是本申请某些实施方式的激光投射模组去掉保护盖后的平面示意图。
图39是本申请某些实施方式的衍射光学元件和镜筒侧壁的结构示意图。
图40是本申请某些实施方式的检测电路的工作原理示意图。
图41是本申请某些实施方式的激光投射模组的立体示意图。
图42是本申请某些实施方式的激光投射模组的平面示意图。
图43是本申请某些实施方式的激光投射模组的立体分解示意图。
图44是图42所示的激光投射模组沿XLIV-XLIV线的截面示意图。
图45是本申请另一实施方式的沿与图42所示的激光投射模组XLIV-XLIV线的截面示意图。
图46是图42所示的激光投射模组沿XLVI-XLVI线的截面示意图。
图47是图46中的激光投射模组的XLVII部分的放大示意图。
图48和图49是本申请某些实施方式的激光投射模组的部分结构示意图。
图50至图52是本申请某些实施方式的激光投射模组去掉保护盖后的平面示意图。
图53是本申请某些实施方式的衍射光学元件和镜筒侧壁的结构示意图。
图54是本申请另一实施方式的激光投射模组与图46中的XLVII部分对应处的放大示意图。
图55是本申请又一实施方式的沿与图42所示的激光投射模组XLIV-XLIV线的截面示意图。
图56和图57是本申请某些实施方式的发射器和接收器的排列示意图。
图58是本申请某些实施方式的激光投射模组的立体示意图。
图59是本申请某些实施方式的激光投射模组的平面示意图。
图60是本申请某些实施方式的激光投射模组的立体分解示意图。
图61是图59所示的激光投射模组沿LXI-LXI线的截面示意图。
图62是图59所示的激光投射模组沿LXII-LXII线的截面示意图。
图63是图62中的激光投射模组的LXIII部分的放大示意图。
图64是图62中的激光投射模组的LXIV部分的放大示意图。
图65是本申请另一实施方式的激光投射模组与图62中的LXIII部分对应处的放大示意图。
图66是本申请另一实施方式的激光投射模组与图62中的LXIV部分对应处的放大示意图。
图67和图68是本申请某些实施方式的激光投射模组的部分结构示意图。
具体实施方式
以下结合附图对本申请的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外,下面结合附图描述的本申请的实施方式是示例性的,仅用于解释本申请的实施方式,而不能理解为对本申请的限制。
在本申请中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。
请参阅图3及图20,本申请的激光投射模组10包括基板组件11、镜筒12、衍射光学元件15、保护盖16和检测组件70。镜筒12设置在基板组件11上。衍射光学元件15设置在镜筒12内。保护盖16与镜筒12结合并遮挡衍射光学元件15。检测组件70用于检测保护盖16是否从镜筒12上脱落。
请参阅图3及图20,本申请第一实施例中,保护盖16能够导电,检测组件70包括形成在基板组件11及镜筒12上的检测电路71,保护盖16连接在检测电路71中并能够形成检测回路。也就是说,激光投射模组10包括基板组件11、镜筒12、衍射光学元件15、导电的保护盖16和检测电路71。镜筒12设置在基板组件11上。衍射光学元件15设置在镜筒12内。保护盖16与镜筒12结合并遮挡衍射光学 元件15。检测电路71形成在基板组件11及镜筒12上,保护盖16连接在检测电路71中并能够形成检测回路。
保护盖16可由导电材料制成,从而使保护盖16能够导电,用于制成保护盖16的导电材料包括:钢、铝、铜等;或者,保护盖16由非导电材料制成,但保护盖16上设置有导电线路。保护盖16与镜筒12结合并用于将衍射光学元件15限制(遮挡)在镜筒12内。保护盖16作为一个负载(相当于一个定值电阻)电性连接在检测电路71中,当保护盖16从镜筒12上脱落时,保护盖16与检测电路71断开连接,检测电路71中的电流发生变化,检测电路71能够根据检测电路71中的电流变化确定保护盖16与镜筒12是否脱落。一般地,由于保护盖16用于将衍射光学元件15限制在镜筒12内,因此,当保护盖16从镜筒12上脱落时,衍射光学元件15也会从镜筒12上脱落。因此,检测电路71可用于检测衍射光学元件15是否从镜筒12上脱落。当检测电路71检测到保护盖16(衍射光学元件15)从镜筒12上脱落时,激光投射模组10停止工作,从而激光投射模组10不会发出激光。
本申请第一实施例中的激光投射模组10通过设置保护盖16并遮挡衍射光学元件15,从而使衍射光学元件15能够更加牢固地设置在镜筒12内;同时,激光投射模组10通过设置检测电路71并将保护盖16连接在检测电路71中,检测电路71通过检测保护盖16是否与检测电路71断开连接,从而能够确定保护盖16及衍射光学元件15是否从镜筒12上脱落,当检测电路71检测到保护盖16从镜筒12上脱落时,激光投射模组10停止工作以避免激光投射模组10发出激光灼伤用户。
请参阅图1,本申请实施方式的电子装置1000包括壳体200和深度相机100。电子装置1000可以是手机、平板电脑、手提电脑、游戏机、头显设备、门禁系统、柜员机等,本申请实施例以电子装置1000是手机为例进行说明,可以理解,电子装置1000的具体形式可以是其他,在此不作限制。深度相机100设置在壳体200内并从壳体200暴露以获取深度图像,壳体200可以给深度相机100提供防尘、防水、防摔等的保护,壳体200上开设有与深度相机100对应的孔,以使光线从孔中穿出或穿入壳体200。在其他实施方式中,深度相机100收容在壳体200内并能够从壳体200内伸出,此时,壳体200上不需要开设与深度相机100的进光方向对应的孔。当需要使用深度相机100时,深度相机从壳体200内伸出到壳体200外;当不需要使用深度相机100时,深度相机100从壳体200外收容至壳体200内。在又一实施方式中,深度相机100收容在壳体200内并位于显示屏的下方,此时,壳体200上也不需要开设与深度相机100的进光方向对应的孔。
请参阅图2,深度相机100包括激光投射模组10、图像采集器20和处理器30。深度相机100上可以形成有与激光投射模组10对应的投射窗口40,和与图像采集器20对应的采集窗口50。激光投射模组10用于通过投射窗口40向目标空间投射激光图案(其中,激光图案为带有特定图案的激光,图案可以是特定的散斑或条纹等),图像采集器20用于通过采集窗口50采集被标的物调制后的激光图案,激光图案用于形成深度图像。在一个例子中,激光投射模组10投射的激光为红外光,图像采集器20为红外摄像头。处理器30与激光投射模组10及图像采集器20均连接,处理器30用于处理激光图案以获得深度图像。具体地,处理器30采用图像匹配算法计算出该激光图案中各像素点与参考图案中的对应各个像素点的偏离值,再根据该偏离值进一步获得该激光图案的深度图像。其中,图像匹配算法可为数字图像相关(Digital Image Correlation,DIC)算法。当然,也可以采用其它图像匹配算法代替DIC算法。下面将对激光投射模组10的结构作进一步介绍。
请参阅图3至图5,激光投射模组10包括基板组件11、镜筒12、光源13、准直元件14、衍射光学元件15、保护盖16和检测电路71。光源13、准直元件14和衍射光学元件15依次设置在光源13的光路上,具体地,光源13发出的光依次穿过准直元件14和衍射光学元件15。
请参阅图5和图6,基板组件11包括基板111及承载在基板111上的电路板112。基板111用于承载镜筒12、光源13和电路板112。基板111的材料可以是塑料,比如聚对苯二甲酸乙二醇酯(Polyethylene Glycol Terephthalate,PET)、聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)、聚碳酸酯(Polycarbonate,PC)、聚酰亚胺(Polyimide,PI)中的至少一种。也就是说,基板111可以采用PET、PMMA、PC或PI中任意一种的单一塑料材质制成。如此,基板111质量较轻且具有足够的支撑强度。
电路板112可以是印刷电路板、柔性电路板、软硬结合板中的任意一种。电路板112上可以开设有过孔113,过孔113内可以用于容纳光源13,电路板112一部分被镜筒12罩住,另一部分延伸出来并可以与连接器17连接,连接器17可以将激光投射模组10连接到电子装置1000的主板上。
请参阅图5至图9,镜筒12设置在基板组件11上并与基板组件11共同形成收容腔121。具体地,镜筒12可以与基板组件11的电路板112连接,镜筒12与电路板112可以通过粘胶粘接,以提高收容腔121的气密性。当然,镜筒12与基板组件11的具体连接方式可以有其他,例如通过卡合连接。收容腔121可以用于容纳准直元件14、衍射光学元件15等元器件,收容腔121同时形成激光投射模组10的光路的一部分。镜筒12由不导电的材料制成,例如,镜筒12由塑料制成,塑料包括PET、PMMA、 PC或PI中任意一种;或者,镜筒12由导电的材料制成但镜筒12的外表面设置由绝缘层以使镜筒12不导电。
在本申请实施例中,镜筒12为筒状结构,镜筒12包括镜筒侧壁122和限位凸起123。镜筒侧壁122设置在基板组件11上并与基板组件11共同形成收容腔121。镜筒侧壁122包括多个镜筒子侧壁1221,每个镜筒子侧壁1221均与基板组件11结合,多个镜筒子侧壁1221依次相接呈环形并共同环绕收容腔121。任意两个相连接的镜筒子侧壁1221的端部共同形成一个支撑角1222,本实施方式的镜筒12上形成有四个支撑角1222。镜筒侧壁122的外壁可以形成有定位和安装结构,以便于在将激光投射模组10安装在电子装置1000内时固定激光投射模组10的位置。镜筒12包括相背的第一面124和第二面125,其中收容腔121的一个开口开设在第二面125上,另一个开口开设在第一面124上。第二面125与电路板112结合,例如胶合,第一面124可以作为镜筒12与衍射光学元件15或保护盖16等的结合面。请结合图9和图10,镜筒侧壁122的外壁开设有容胶槽126,容胶槽126可以自第一面124开设并向第二面125的方向延伸。
请参阅图8和图9,限位凸起123自镜筒侧壁122向内凸出,具体地,限位凸起123自镜筒侧壁122向收容腔121内突出。限位凸起123可以呈连续的环状,或者限位凸起123包括多个,多个限位凸起123间隔分布。限位凸起123围成过光孔1231,过光孔1231可以作为收容腔121的一部分,激光穿过过光孔1231后穿入衍射光学元件15。在如图6所示的实施例中,限位凸起123位于第一面124与第二面125之间,限位凸起123与第二面125之间的收容腔121可以用于收容准直元件14,限位凸起123与第一面124之间的收容腔121可以用于收容衍射光学元件15。同时,在组装激光投射模组10时,当衍射光学元件15与限位凸起123相抵,可以认为衍射光学元件15安装到位,当准直元件14与限位凸起123相抵,可以认为准直元件14安装到位。限位凸起123包括限位面1232,当衍射光学元件15安装在限位凸起123上时,限位面1232与衍射光学元件15结合。
请参阅图8,光源13设置在基板组件11上,具体地,光源13可以设置在电路板112上并与电路板112电连接,光源13也可以设置在基板111上并与过孔113对应,此时,可以通过布置导线将光源13与电路板112电连接。光源13用于发射激光,激光可以是红外光,在一个例子中,光源13可以包括半导体衬底及设置在半导体衬底上的发射激光器,半导体衬底设置在基板111上,发射激光器可以是垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)。半导体衬底可以设置单个发射激光器,也可以设置由多个发射激光器组成的阵列激光器,具体地,多个发射激光器可以以规则或者不规则的二维图案的形式排布在半导体衬底上。
请参阅图8,准直元件14可以是光学透镜,准直元件14用于准直光源13发射的激光,准直元件14收容在收容腔121内,准直元件14可以沿第二面125指向第一面124的方向组装到收容腔121内。准直元件14包括光学部141和安装部142,安装部142用于与镜筒侧壁122结合并固定准直元件14,在本申请实施例中,光学部141包括位于准直元件14相背两侧的两个曲面。
请参阅图8和图9,衍射光学元件15安装在限位凸起123上,具体地,衍射光学元件15与限位面1232结合以安装在限位凸起123上。衍射光学元件15的外表面包括顶面151、衍射底面152和侧面153。顶面151和衍射底面152相背,侧面153连接顶面151和衍射底面152,当衍射光学元件15安装在限位凸起123上时,衍射底面152与限位面1232结合。本申请实施例中,衍射底面152上形成有衍射结构,顶面151可以是光滑的平面,衍射光学元件15可以将经准直元件14准直后的激光投射出与衍射结构对应的激光图案。衍射光学元件15可以由玻璃制成,也可以说由复合塑料(如PET)制成。
请参阅图8和图9,保护盖16与镜筒12结合,保护盖16用于限制衍射光学元件15的位置,具体地,保护盖16用于防止衍射光学元件15与镜筒12的结合失效后从镜筒12中脱出。保护盖16导电,具体地,保护盖16可由导电材料制成,或者,保护盖16上设置有导电线路。请结合图11,保护盖16包括保护顶壁161和保护侧壁162。
保护顶壁161与限位凸起123分别位于衍射光学元件15的相背的两侧,或者说,衍射光学元件15位于限位凸起123与保护顶壁161之间,如此,即使衍射光学元件15与限位凸起123的结合失效了,由于保护顶壁161的限制作用,衍射光学元件15也不会脱出。保护顶壁161开设有通光孔1611,通光孔1611的位置与衍射光学元件15对应,激光先后穿过过光孔1231、衍射光学元件15和通光孔1611后从激光投射模组10中射出。在本申请实施例中,保护顶壁161的整体形状呈圆角方形,通光孔1611可以呈圆形、矩形、椭圆形、梯形等形状。在如图6所示的实施例中,当保护盖16与镜筒12结合时,保护顶壁161与第一面124相抵,进一步地,保护顶壁161还可以与第一面124通过胶粘等的方式结合。
请参阅图9至图11,保护侧壁162自保护顶壁161的周缘延伸,保护盖16罩设在镜筒12上,保护侧壁162与镜筒侧壁122固定连接。保护侧壁162包括多个首尾依次相接的保护子侧壁1621,每个保护子侧壁1621与镜筒侧壁122均固定连接,每个保护子侧壁1621上均形成有点胶孔163。点胶孔163的 位置与容胶槽126的位置对应,当保护盖16罩设在镜筒12上后,可以从点胶孔163向容胶槽126内点胶,胶水固化后,保护侧壁162与镜筒侧壁122固定连接。在一个例子中,每个保护子侧壁1621上开设有单个点胶孔163,在另一个例子中,每个保护子侧壁1621上开设有多个点胶孔163,例如两个、三个、四个等,在本申请实施例中,每个保护子侧壁1621上开设有两个点胶孔163,两个点胶孔163分别与容胶槽126的两个内侧壁1261对应,便于用户向容胶槽126的两侧同时点胶,提高点胶速度。进一步地,容胶槽126的内侧壁1261倾斜连接容胶槽126的内底壁1262与镜筒侧壁122的外壁,倾斜连接指的是内侧壁1261与内底壁1262,内侧壁1261与镜筒侧壁122的外壁均不垂直,当胶水被注入到内侧壁1261上时,在内侧壁1261的导引作用下,胶水容易向容胶槽126的中间位置流动,加快胶水填充容胶槽126的速度。
检测电路71形成在基板组件11及镜筒12上,保护盖16连接在检测电路71中并能够形成检测回路。具体地,检测电路71包括检测线路711及与检测线路711电性连接的正极连接端712及负极连接端713。检测线路711形成在基板组件11及镜筒12上,检测线路711包括第一检测子线路7111及第二检测子线路7112,第一检测子线路7111形成在基板组件11及镜筒12上,正极连接端712位于第一检测子线路7111的一端并设置在镜筒12上,第二检测子线路7112也形成在基板组件11及镜筒12上并与第一检测子线路7112间隔设置,负极连接端713位于第二检测子线路7112的一端并设置在镜筒12上。
本实施方式中,形成在镜筒12上的第一检测子线路7111位于镜筒12的外侧面120上并沿着镜筒12的一个支撑角1222分布,正极连接端712设置在支撑角1222处的第一面124上并与第一检测子线路7111连接,正极连接端712与保护盖16(保护顶壁161)通过焊接、弹片连接、插接、导电胶粘接中的任意一种或多种方式电性连接。形成在镜筒12上的第二检测子线路7112位于镜筒12的外侧面120上并沿着镜筒12的另一个支撑角1222分布,负极连接端713设置在支撑角1222处的第一面124上并与第二检测子线路7112连接,负极连接端713与保护盖16(保护顶壁161)通过焊接、弹片连接、插接、导电胶粘接中的任意一种或多种方式电性连接。正极连接端712与负极连接端713可以分别设置在一个镜筒子侧壁1221的相对两端的两个支撑角1222上;或者,正极连接端712与负极连接端713可以分别设置在由不同镜筒子侧壁1221形成的两个支撑角1222上。
请结合图6,具体地,保护顶壁161包括与第一面124抵触的顶壁底面1612,顶壁底面1612上设置有与正极连接端712对应的第一连接端(图未示)、及与负极连接端713对应的第二连接端(图未示)。当正极连接端712为引脚、第一连接端为焊盘时,正极连接端712与第一连接端可通过焊接或导电胶粘接的方式连接在一起,此时,保护侧壁162开设有贯穿保护侧壁162并与正极连接端712及第一连接端均对应的焊接孔(图未示),用户可通过焊接孔将正极连接端712及第一连接端焊接或粘接在一起;当正极连接端712为弹片(弹簧结构)、第一连接端为触点时,正极连接端712与第一连接端抵触从而与第一连接端电连接,此时,正极连接端712与第一连接端为弹片连接;当正极连接端712为引脚、第一连接端为插接端口时,正极连接端712与第一连接端可通过插接的方式连接在一起。同理,负极连接端713结构与正极连接端712的结构类似、第二连接端与第一连接端的结构类似时,负极连接端713与第二连接端能够通过焊接、弹片连接、插接或导电胶粘接的方式连接。
综上,本申请实施方式的电子装置1000中,由于保护盖16与镜筒12结合,保护盖16的保护顶壁161与限位凸起123一起限制衍射光学元件15的位置,衍射光学元件15不会沿出光方向脱落,避免激光未经过衍射光学元件15后发射出去,保护用户,提高安全性。同时,激光投射模组10通过设置检测电路71并将保护盖16连接在检测电路71中,检测电路71通过检测保护盖16是否与检测电路71断开连接,从而能够确定保护盖16及衍射光学元件15是否从镜筒12上脱落,当检测电路71检测到保护盖16从镜筒12上脱落时,激光投射模组10停止工作以避免激光投射模组10发出激光灼伤用户。再者,位于镜筒12上的检测电路71形成在镜筒侧壁122的外侧面120上,从而便于检测电路71制作在镜筒12上。
请参阅图7、图31及图45,在某些实施方式中,限位凸起123也可以形成在镜筒12的顶部,具体地,限位凸起123的限位面1232可以与第一面124重合,衍射光学元件15安装在限位凸起123上时,衍射光学元件15与第一面124结合。此时,保护顶壁161与衍射光学元件15相抵,保护顶壁161与限位凸起123共同夹持衍射光学元件15。如此,镜筒12的结构简单,衍射光学元件15容易安装在限位凸起123上。
请参阅图9至图11、图33及图47,在某些实施方式中,保护盖16还包括自保护侧壁162向内凸出的弹性的第一卡勾164,镜筒12还包括自容胶槽126的内底壁1262向外凸出的第二卡勾127,保护盖16罩设在镜筒12上时,第一卡勾164与第二卡勾127咬合以限制保护盖16脱离镜筒12。
具体地,第一卡勾164与第二卡勾127的位置对应,在将保护盖16罩设在镜筒12上的过程中,第 一卡勾164与第二卡勾127相抵并发生弹性形变,当保护盖16安装到位后,第一卡勾164与第二卡勾127互相咬合,且会伴随触感反馈和咬合到位的“嗒”声。如此,保护盖16与镜筒12结合更可靠,且在用胶水将保护盖16与镜筒12粘结前,可以先将第一卡勾164与第二卡勾127互相咬合,能有效地固定保护盖16与镜筒12的相对位置,利于点胶的进行。
请参阅图9至图11、图33及图47,在某些实施方式中,每个保护子侧壁1621上均形成有第一卡勾164。对应的,多个容胶槽126内也均设置有第二卡勾127,第二卡勾127与第一卡勾164的位置对应,多个第一卡勾164与对应的第二卡勾127同时咬合,保护盖16与镜筒12的结合更可靠。具体地,第一卡勾164可以与保护子侧壁1621的中间位置对应,第二卡勾127可以与容胶槽126的中间位置对应。当每个保护子侧壁1621形成有至少两个点胶孔163时,第一卡勾164位于至少两个点胶孔163之间,更具体地,每个保护子侧壁1621上的至少两个点胶孔163相对于第一卡勾164对称分布。如此,便于胶水在第一卡勾164和第二卡勾127的两侧分别流动,且两侧的胶水量相当,粘结力较均匀。
请参阅图9、图11、图33及图47,在某些实施方式中,保护侧壁162在与第一卡勾164对应的位置开设有避让孔165。在保护盖16罩设在镜筒12的过程中,第一卡勾164与第二卡勾127相抵且第一卡勾164发生弹性形变时,避让孔165为第一卡勾164的弹性形变提供形变空间,即,第一卡勾164发生弹性形变且伸入避让孔165。具体地,第一卡勾164与第二卡勾127相抵时,第一卡勾164向外发生弹性形变,第一卡勾164伸入避让孔165以避免与保护侧壁162发生运动干涉,另外,也便于用户通过避让孔165观察第一卡勾164与第二卡勾127的配合情况,例如判断是不是所有的第一卡勾164均与对应的第二卡勾127咬合好了。
请参阅图9、图10、图33及图47,在某些实施方式中,第二卡勾127形成有导引斜面1271,沿保护盖16套入镜筒12的方向,导引斜面1271远离内底壁1262,保护盖16罩设在镜筒12的过程中,第一卡勾164与导引斜面1271相抵。由于导引斜面1271的相对于内底壁1262倾斜,第一卡勾164与第二卡勾127配合的过程中,第一卡勾164受到的第二卡勾127的抵持力缓慢连续地增大,第一卡勾164的形变量也连续地变大,第一卡勾164与第二卡勾127容易卡合。
请参阅图9、图33、图47及图67,在某些实施方式中,镜筒12上形成有第一定位部128,衍射光学元件15的外表面上形成有第二定位部154,当且仅当衍射光学元件15的衍射底面152与限位凸起123结合时,第一定位部128与第二定位部154配合。可以理解,衍射光学元件15的衍射底面152与顶面151的结构不同,衍射底面152与顶面151对激光的作用也不相同,在使用时,如果将衍射光学元件15装反(顶面151与限位凸起123结合),衍射光学元件15将不能衍射出需要的激光图案,甚至还会导致激光集中发射而容易灼伤用户。本实施方式的第一定位部128与第二定位部154仅在衍射底面152与限位凸起123结合时能够正确配合,而当衍射光学元件15与镜筒12的配合关系不是衍射底面152与限位凸起123的限位面1232结合时,第一定位部128与第二定位部154均不能正确配合而用户容易察觉到。如此,防止衍射光学元件15安装错误。
请参阅图9、图33、图47及图68,在某些实施方式中,第一定位部128包括第一倒角1281,第一倒角1281形成在限位凸起123与镜筒侧壁122相交处,具体地,第一倒角1281形成在限位面1232与镜筒侧壁122相交处。第二定位部154包括第二倒角1541,第二倒角1541形成在衍射光学元件15的衍射底面152与侧面153相交处。第一倒角1281与第二倒角1541的倾斜角度可以是相等的,可以理解,如果用户将衍射光学元件15装反,顶面151将与第二倒角1541相抵,导致衍射光学元件15被第二倒角1541垫高,用户容易察觉到衍射光学元件15被装反,故第一倒角1281与第二倒角1541可以避免衍射光学元件15被装反。
请参阅图12、图34及图48,某些实施方式中,第一定位部128包括形成在限位面1232上的限位面凹陷1282,第二定位部154包括自衍射底面152凸出的底面凸块1542,当衍射底面152与限位凸起123结合时,底面凸块1542伸入限位面凹陷1282内。具体地,底面凸块1542与限位面凹陷1282的位置对应,且底面凸块1542与限位面凹陷1282的数量相等,底面凸块1542的形状可以是圆柱状、圆台状、棱柱状等,可以理解,如果用户将衍射光学元件15装反,衍射底面152朝上且底面凸块1542使得衍射光学元件15安装后不平整,用户容易察觉到衍射光学元件15被装反,故底面凸块1542与限位面凹陷1282可以避免衍射光学元件15被装反。
请参阅图13、图35及图49,在某些实施方式中,第一定位部128包括自限位面1232凸出的限位面凸块1283,第二定位部154包括形成在衍射底面152的底面凹陷1543,当衍射底面152与限位凸起123结合时,限位面凸块1283伸入底面凹陷1543内。具体地,限位面凸块1283与底面凹陷1543的位置对应,且限位面凸块1283与底面凹陷1543的数量相等,限位面凸块1283的形状可以是圆柱状、圆台状、棱柱状等,可以理解,如果用户将衍射光学元件15装反,限位面凸块1283将与衍射底面152相抵,导致衍射光学元件15被限位面凸块1283垫高,用户容易察觉到衍射光学元件15被装反,故限位 面凸块1283与底面凹陷1543可以避免衍射光学元件15被装反。
请参阅图14,在某些实施方式中,第一定位部128包括形成在镜筒侧壁122的镜筒凹陷1284,第二定位部154包括自衍射光学元件15的侧面153向外凸出的侧面凸块1544,当衍射底面152与限位凸起123结合时,侧面凸块1544伸入镜筒凹陷1284内。侧面凸块1544与镜筒凹陷1284的位置对应,且侧面凸块1544与镜筒凹陷1284的数量相等,侧面凸块1544被平行于衍射底面152的平面截得的形状可以是矩形、半圆形、三角形、梯形、圆形中的一种或多种。可以理解,如果用户将衍射光学元件15装反,侧面凸块1544将与镜筒侧壁122相抵,导致衍射光学元件15无法安装在限位凸起123上,用户容易察觉到衍射光学元件15被装反,故侧面凸块1544与镜筒凹陷1284可以避免衍射光学元件15被装反。
具体地,请参阅图14、图36及图50,在某些实施方式中,侧面153包括多个首尾依次相接的子侧面1531,镜筒凹陷1284与侧面凸块1544的数量均为单个。侧面凸块1544形成在子侧面1531的中间位置之外的其他位置。也就是说,当侧面凸块1544的数量为一个时,侧面凸块1544可以开设在子侧面1531中间位置之外的其他位置,防止用户将衍射光学元件15装反时,侧面凸块1544依然能够伸入镜筒凹陷1284的情况发生,进一步避免衍射光学元件15装反。
请参阅图15、图37及图51,在某些实施方式中,镜筒凹陷1284与侧面凸块1544的数量相等且均为多个,每个侧面凸块1544的形状与对应的镜筒凹陷1284的形状相同,不同的侧面凸块1544的形状不相同。侧面凸块1544与镜筒凹陷1284的形状相同指的是侧面凸块1544的外轮廓与镜筒凹陷1284的中空的形状相同。本实施例中,由于不同的侧面凸块1544的形状不相同,不相互对应的侧面凸块1544与镜筒凹陷1284由于形状不同而不能完全配合,用户容易察觉衍射光学元件15是否正确安装。
请参阅图16、图38及图52,在某些实施方式中,侧面153包括多个首尾依次相接的子侧面1531,镜筒凹陷1284与侧面凸块1544的数量相等且均为多个,多个侧面凸块1544不关于任意一个子侧面1531的中间位置对称。在如图16所示的实施例中,衍射光学元件15整体呈方形,侧面153包括四个子侧面1531,侧面凸块1544的数量为两个且均位于一个子侧面1531上,两个侧面凸块1544不关于任意一个子侧面1531的中间位置对称。当然,侧面凸块1544在某个子侧面1531上的数量也可以是一个,而侧面凸块1544在其他子侧面1531上也有分布,但是多个侧面凸块1544不关于任意一个子侧面1531的中间位置对称。如此,当用户欲将衍射光学元件15调转安装时,至少一个侧面凸块1544会与镜筒侧壁122相抵,用户容易察觉到衍射光学元件15装反。
请参阅图16、图38及图52,在某些实施方式中,镜筒凹陷1284与侧面凸块1544的数量相等且均为多个,多个侧面凸块1544非等角度间隔分布。具体地,当侧面凸块1544的数量为两个时,两个侧面凸块1544分别与衍射光学元件15的中心的连线的夹角不呈一百八十度;当侧面凸块1544的数量为三个时,相邻的两个侧面凸块1544分别与衍射光学元件15的中心的连线的夹角不全部呈一百二十度。如此,当用户欲将衍射光学元件15调转安装时,至少一个侧面凸块1544会与镜筒侧壁122相抵,用户容易察觉到衍射光学元件15装反。
请参阅图17,在某些实施方式中,沿顶面151至衍射底面152的方向,侧面凸块1544的尺寸逐渐减小,镜筒凹陷1284的尺寸逐渐减小。进一步地,侧面凸块1544的最大尺寸大于镜筒凹陷1284的最小尺寸,当用户欲将衍射光学元件15调转安装时,侧面凸块1544不能完全伸入镜筒凹陷1284内,侧面凸块1544会将衍射光学元件15垫高,用户容易察觉到衍射光学元件15装反。
请参阅图18、图39及图53,在某些实施方式中,第一定位部128包括自镜筒侧壁122凸出的镜筒凸块1285,第二定位部154包括形成在侧面153的侧面凹陷1545,当衍射底面152与限位凸起123结合时,镜筒凸块1285伸入侧面凹陷1545内。镜筒凸块1285与侧面凹陷1545的位置对应,且镜筒凸块1285与侧面凹陷1545的数量相等,镜筒凸块1285被平行于衍射底面152的平面截得的形状可以是矩形、半圆形、三角形、梯形、圆形中的一种或多种。可以理解,如果用户将衍射光学元件15装反,镜筒凸块1285将与衍射光学元件15相抵,导致衍射光学元件15无法安装在限位凸起123上,用户容易察觉到衍射光学元件15被装反,故镜筒凸块1285与侧面凹陷1545可以避免衍射光学元件15被装反。
请参阅图19,在某些实施方式中,沿顶面151至衍射底面152的方向,侧面凹陷1545的尺寸逐渐增大,镜筒凸块1285的尺寸逐渐增大。进一步地,镜筒凸块1285的最大尺寸大于侧面凹陷1545的最小尺寸,当用户欲将衍射光学元件15调转安装时,镜筒凸块1285不能完全伸入镜筒凹陷1284内,镜筒凸块1285会将衍射光学元件15垫高,用户容易察觉到衍射光学元件15装反。
请参阅图7,在某些实施方式中,正极连接端712及负极连接端713还可以设置在支撑角1222处的外侧面120上,此时,第一连接端及第二连接端可以设置在保护侧壁162的侧壁内表面1622、保护侧壁162的远离保护顶壁161的一端、或者保护侧壁162的侧壁外表面1623上,具体地,当负极连接端713设置在外表面120上并位于保护盖16内时,第二连接端设置在侧壁内表面1622上,此时,负极连接端 713与第二连接端可通过焊接或导电胶粘接的方式连接(如图7所示);当负极连接端713设置在与保护侧壁162的端部对应的位置上时,第二连接端设置在保护侧壁162的远离保护顶壁161的一端,此时,负极连接端713与第二连接端可通过焊接、导电胶粘接或插接的方式连接;当负极连接端713为弹片结构时,第二连接端可以设置在侧壁外表面1623上。
请参阅图5及图20,在某些实施方式中,激光投射模组10还包括处理芯片60,处理芯片60连接在检测电路71中并与保护盖16形成检测回路。处理芯片60能够检测保护盖16是否连接在检测电路71中,从而确定保护盖16(衍射光学元件15)是否从镜筒12脱落。具体地,处理芯片60在保护盖16连接在检测电路71中时采集到的信号与在保护盖16与检测电路71断开连接时采集到的信号不相同,处理芯片60可以根据采集到的信号变化确定保护盖16(衍射光学元件15)是否从镜筒12脱落。处理芯片60可以设置在电子装置1000的主板上,处理芯片60可通过连接器17与检测电路71连接在一起。在其他实施方式中,深度相机100中的处理器30可以作为本实施方式中的处理芯片60使用,也就是说,处理器30既可以用于处理激光图案以获得深度图像又可以用于检测保护盖16是否连接在检测电路71中,此时,激光投射模组10不需要额外设置处理芯片60。
在某些实施方式中,保护盖16的表面设置有绝缘层,具体地,绝缘层覆盖保护盖16的表面并露出保护盖16上的与检测电路71电连接的连接部位(例如,第一连接端及第二连接端)以使保护盖16能够作为一个导电元件电性连接在检测线路电路71中。绝缘层用于隔绝保护盖16与其他电子元件(例如,壳体200)电性连接,更具体地,绝缘层能够隔绝其他电子元件通过保护盖16电性连接到检测电路71中从而影响其他电子元件的使用。
请参阅图21及图24,本申请第二实施例中,保护盖16能够导电,检测组件70包括形成在基板组件11及镜筒12上的检测电路71,检测电路71包括温度传感器714及检测线路711,温度传感器714设置在基板组件11上,检测线路711设置在基板组件11及镜筒12上,检测线路711电性连接温度传感器714及保护盖16,检测线路711与温度传感器714连接以用于检测激光投射模组10的温度,检测线路711与保护盖16连接以用于检测保护盖16是否与检测线路711断开连接。也就是说,激光投射模组10包括基板组件11、镜筒12、衍射光学元件15、导电的保护盖16和检测电路71。镜筒12设置在基板组件11上。衍射光学元件15设置在镜筒12内。保护盖16与镜筒12结合并遮挡衍射光学元件15。检测电路71形成在基板组件11及镜筒12上,检测电路71包括温度传感器714及检测线路711,温度传感器714设置在基板组件11上,检测线路711设置在基板组件11及镜筒12上,检测线路711电性连接温度传感器714及保护盖16,检测线路711与温度传感器714连接以用于检测激光投射模组10的温度,检测线路711与保护盖16连接以用于检测保护盖16是否与检测线路711断开连接。
保护盖16可由导电材料制成,从而使保护盖16能够导电,用于制成保护盖16的导电材料包括:钢、铝、铜等;或者,保护盖16由非导电材料制成,但保护盖16上设置有导电线路。保护盖16与镜筒12结合并用于将衍射光学元件15限制(遮挡)在镜筒12内。保护盖16作为一个负载(相当于一个定值电阻)电性连接在检测电路71中。具体地,保护盖16可以与温度传感器714串联后一起连接到检测线路711中(如图24所示);或者,保护盖16也可以与温度传感器714以并联的方式连接在检测线路711中(如图25所示)。当保护盖16从镜筒12上脱落时,保护盖16与检测电路71断开连接,检测电路71中的电流发生变化,检测电路71能够根据检测电路71中的电流变化确定保护盖16与镜筒12是否脱落。
若保护盖16与温度传感器714串联后一起连接到检测线路711中,由于保护盖16相当于定值电阻,因此,检测线路711中的电流变化是由温度传感器714引起,也就是说,根据检测线路711中的电流变化能够确定温度传感器714检测到的温度变化;在保护盖16与检测电路71断开连接后,温度传感器714与检测线路711也断开连接,此时,检测线路711不能够通过温度传感器714检测激光投射模组10的温度变化。
若保护盖16与温度传感器714以并联的方式连接到检测线路711中,由于保护盖16相当于定值电阻,因此,检测线路711中的电流变化是由温度传感器714引起,也就是说,根据检测线路711中的电流变化能够确定温度传感器714检测到的温度变化;在保护盖16与检测电路71断开连接后,温度传感器714还连接在检测线路711中,此时,检测线路711通过温度传感器714能够检测激光投射模组10的温度变化。
一般地,由于保护盖16用于将衍射光学元件15限制在镜筒12内,因此,当保护盖16从镜筒12上脱落时,衍射光学元件15也会从镜筒12上脱落。因此,检测电路71可用于检测衍射光学元件15是否从镜筒12上脱落。当检测电路71检测到保护盖16(衍射光学元件15)从镜筒12上脱落时,激光投射模组10停止工作,从而激光投射模组10不会发出激光。
本实施方式的激光投射模组10通过设置保护盖16并遮挡衍射光学元件15,从而使衍射光学元件 15能够更加牢固地设置在镜筒12内;同时,激光投射模组10通过设置检测电路71并将保护盖16连接在检测电路71中,检测电路71通过检测保护盖16是否与检测电路71断开连接,从而能够确定保护盖16及衍射光学元件15是否从镜筒12上脱落,当检测电路71检测到保护盖16从镜筒12上脱落时,激光投射模组10停止工作以避免激光投射模组10发出激光灼伤用户;再者,检测电路71既可以用于检测保护盖16是否与检测电路71断开连接又可以检测激光投射模组10的温度,从而能够减少检测线路711在基板组件11上的分布。
请参阅图4、图7及图22,本实施例与第一实施例的区别仅在于检测电路71的不同。本实施例中的检测电路71与第一实施例中的检测电路71的区别在于:本实施例中的检测电路71还包括温度传感器714。具体地,本实施例中,检测电路71包括温度传感器714、检测线路711、及与检测线路711电性连接的正极连接端712及负极连接端713。温度传感器714设置在基板组件11上,具体地,温度传感器714可以设置在基板组件11上并位于收容腔121内;或者,温度传感器714设置在基板组件11上并位于收容腔121外。检测线路711形成在基板组件11及镜筒12上,检测线路711电性连接温度传感器714及保护盖16。
请结合图25,本实施方式的保护盖16与温度传感器714以并联的方式连接在检测线路711中,检测线路711包括第一检测子线路7111、第二检测子线路7112、第三检测子线路7113及第四检测子线路7114。第一检测子线路7111形成在基板组件11及镜筒12上,正极连接端712位于第一检测子线路7111的一端并设置在镜筒12上,第二检测子线路7112也形成在基板组件11及镜筒12上并与第一检测子线路7112间隔设置,负极连接端713位于第二检测子线路7112的一端并设置在镜筒12上,第一检测子线路7111与第二检测子线路7112分别通过正极连接端712与负极连接端713与保护盖16电性连接以形成第一检测回路。第一检测回路用于检测保护盖16与检测线路711是否断开连接。第三检测子线路7113及第四检测子线路7114均与温度传感器714连接以形成第二检测回路。第二检测回路用于检测激光投射模组10的温度。由于保护盖16相当于定值电阻,因此,检测线路711中的电流变化是由温度传感器714引起,也就是说,根据第二检测回路(检测线路711)中的电流变化能够确定温度传感器714检测到的温度变化;在保护盖16与检测电路71断开连接后,温度传感器714还连接在第二检测回路(检测线路711)中,此时,第二检测回路通过温度传感器714能够检测激光投射模组10的温度变化。
本实施方式的检测电路18既可以用于检测保护盖16是否与检测电路18断开连接又可以检测激光投射模组10的温度,从而能够减少检测线路181在基板组件11上的分布。
请参阅图22、图23及图26,在某些实施方式中,温度传感器714与保护盖16并联,保护盖16连接在检测线路711中并能够形成第一检测回路,温度传感器714连接在检测线路714中并能够形成第二检测回路。检测电路711包括多个检测周期,每个检测周期均包括保护盖检测周期及温度检测周期。在保护盖检测周期内,检测线路711与保护盖16电性连接并与温度传感器714断开连接,检测电路711用于检测保护盖16与检测线路711是否断开连接。在温度检测周期内,检测线路711与温度传感器714电性连接并与保护盖16断开连接,检测电路711用于检测激光投射模组10的温度。
具体地,保护盖16连接在第一检测子线路7111及第二检测子线路7112上并形成第一检测回路,第一检测子线路7111上还设置有第一控制开关7115,检测线路711与第一控制开关7115连接以用于通过第一控制开关7115控制第一检测回路的断开或连通。温度传感器714连接在第三检测子线路7113及第四检测子线路7114上并形成第二检测回路,第三检测子线路7113上还设置有第二控制开关7116,检测线路711与第二控制开关7116连接以用于通过第二控制开关7116控制第二检测回路的断开或连通。在保护盖检测周期内,第一控制开关7115控制第一检测回路连通,第三控制开关7116控制第二检测回路断开,此时,检测线路711用于检测保护盖16与检测线路711是否断开连接。在温度检测周期内,第一控制开关7115控制第一检测回路断开,第三控制开关7116控制第二检测回路连通,此时,检测电路711用于检测激光投射模组10的温度。在其他实施方式中,第三检测子线路7113上可以不设置第二控制开关7116,在保护盖检测周期内,第一控制开关7115控制第一检测回路连通,第二检测回路也连通,此时,检测线路711用于检测保护盖16与检测线路711是否断开连接。
本实施方式的检测电路71用于检测激光投射模组10的温度时,检测线路711与温度传感器714电性连接并与保护盖16断开连接,从而在第二检测回路的基础上增加第一检测回路对温度传感器714检测激光投射模组10的温度影响不大,进而能够保持温度传感器714检测激光投射模组10的温度精度。
请参阅图23及图27,在某些实施方式中,激光投射模组10还包括处理芯片60,处理芯片60连接在检测电路71中并与保护盖16形成检测回路。处理芯片60能够检测保护盖16是否连接在检测电路71中,从而确定保护盖16(衍射光学元件15)是否从镜筒12脱落。具体地,处理芯片60在保护盖16连接在检测电路71中时采集到的信号与在保护盖16与检测电路71断开连接时采集到的信号不相同,处理芯片60可以根据采集到的信号变化确定保护盖16(衍射光学元件15)是否从镜筒12脱落。处理芯 片60可以设置在电子装置1000的主板上,处理芯片60可通过连接器17与检测电路71连接在一起。在其他实施方式中,深度相机100中的处理器30可以作为本实施方式中的处理芯片60使用,也就是说,处理器30既可以用于处理激光图案以获得深度图像又可以用于检测保护盖16是否连接在检测电路71中,此时,激光投射模组10不需要额外设置处理芯片60。
请参阅图3、图29及图40,本申请第三实施例中,检测组件70包括第一电极板191、第二电极板192和检测电路73,第一电极板191设置在镜筒12上;第二电极板192设置在保护盖16上并与第一电极板191间隔相对,第二电极板192与第一电极板191共同组成检测电容19;第一电极板191及第二电极板192连接在检测电路73中并能够形成检测回路。也就是说,激光投射模组10包括基板组件11、镜筒12、衍射光学元件15、保护盖16、第一电极板191、第二电极板192及检测电路73。镜筒12设置在基板组件11上。衍射光学元件15设置在镜筒12内。保护盖16与镜筒12结合并遮挡衍射光学元件15。第一电极板191设置在镜筒12上。第二电极板192设置在保护盖16上。第二电极板192设置在保护盖16上并与第一电极板191间隔相对,第二电极板192与第一电极板191共同组成检测电容19。第一电极板191及第二电极板192连接在检测电路73中并能够形成检测回路。
第一电极板191及第二电极板192由导电材料制成,例如,第一电极板191及第二电极板192的材料可包括镍、钯、银、钽、碳素材料、金属氧化物、导电聚合物。保护盖16可以由导电材料制成,此时,保护盖16可以作为第二电极板192。保护盖16与镜筒12结合并用于将衍射光学元件15限制(遮挡)在镜筒12内。根据公式:C=εS/d,及Q=CU,其中,C为检测电容19的电容大小,ε为第一电极板191与第二电极板192之间的介电常数,S为第一电极板191与第二电极板192之间正对的面积,d为第一电极板191与第二电极板192之间的距离,Q为检测电容19上的电荷量,U为第一电极板191与第二电极板192之间的电压。当保护盖16从镜筒12上脱落时,第一电极板191与第二电极板192之间的距离变大,使检测电容19的电容变小,从而使检测电容19发生放电,此时,检测电路73中的电流发生变化,检测电路73能够根据检测电路73中的电流变化确定保护盖16与镜筒12是否脱落。一般地,由于保护盖16用于将衍射光学元件15限制在镜筒12内,因此,当保护盖16从镜筒12上脱落时,衍射光学元件15很大程度上也会从镜筒12上脱落,一旦衍射光学元件15脱落,则激光投射模组10投射出的光线会形成较强的零级光束,若用户恰好在做人脸识别,则会损伤用户的眼睛。因此,在检测电容19和检测电路73检测到保护盖16从镜筒12上脱落时,则判定衍射光学元件15也脱落(换言之,通过检测到保护盖16从镜筒12上脱落,间接得出衍射光学元件15也脱落),同时控制激光投射模组10停止工作,使激光投射模组10停止发出激光,相较于直接检测到衍射光学元件15脱落后激光投射模组10才停止发出激光而言,将安全保障进行了提前,即,提高了保护用户使用激光投射模组10的安全级别。
本申请实施方式的激光投射模组10通过设置保护盖16并遮挡衍射光学元件15,从而使衍射光学元件15能够更加牢固地设置在镜筒12内;同时,激光投射模组10通过设置检测电路73和连接在检测电路73中的检测电容19,检测电路73通过检测检测电容19上的电信号是否发生变化,从而能够确定保护盖16(衍射光学元件15)是否从镜筒12上脱落,当检测电路73检测到检测电容19上的电信号发生变化时,激光投射模组10停止工作以避免激光投射模组10发出激光灼伤用户,提高用户使用激光投射模组10的安全级别。
请继续参阅图3、图28及图29,具体地,激光投射模组10包括基板组件11、镜筒12、光源13、准直元件14、衍射光学元件15、保护盖16、检测电路73、第一电极板191及第二电极板192。光源13、准直元件14和衍射光学元件15依次设置在光源13的光路上,具体地,光源13发出的光依次穿过准直元件14和衍射光学元件15。
请参阅图5和图6,基板组件11包括基板111及承载在基板111上的电路板112。基板111用于承载镜筒12、光源13和电路板112。基板111的材料可以是塑料,比如聚对苯二甲酸乙二醇酯(Polyethylene Glycol Terephthalate,PET)、聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)、聚碳酸酯(Polycarbonate,PC)、聚酰亚胺(Polyimide,PI)中的至少一种。也就是说,基板111可以采用PET、PMMA、PC或PI中任意一种的单一塑料材质制成。如此,基板111质量较轻且具有足够的支撑强度。
电路板112可以是印刷电路板、柔性电路板、软硬结合板中的任意一种。电路板112上可以开设有过孔113,过孔113内可以用于容纳光源13,电路板112一部分被镜筒12罩住,另一部分延伸出来并可以与连接器17连接,连接器17可以将激光投射模组10连接到电子装置1000的主板上。
请参阅图29至图33,镜筒12设置在基板组件11上并与基板组件11共同形成收容腔121。具体地,镜筒12可以与基板组件11的电路板112连接,镜筒12与电路板112可以通过粘胶粘接,以提高收容腔121的气密性。当然,镜筒12与基板组件11的具体连接方式可以有其他,例如通过卡合连接。收容腔121可以用于容纳准直元件14、衍射光学元件15等元器件,收容腔121同时形成激光投射模组10 的光路的一部分。镜筒12由不导电的材料制成,例如,镜筒12由塑料制成,塑料包括PET、PMMA、PC或PI中任意一种;或者,镜筒12由导电的材料制成但镜筒12的外表面设置由绝缘层以使镜筒12不导电。
在本申请实施例中,镜筒12为筒状结构,镜筒12包括镜筒侧壁122和限位凸起123。镜筒侧壁122设置在基板组件11上并与基板组件11共同形成收容腔121。镜筒侧壁122包括多个镜筒子侧壁1221,每个镜筒子侧壁1221均与基板组件11结合,多个镜筒子侧壁1221依次相接呈环形并共同环绕收容腔121。任意两个相连接的镜筒子侧壁1221的端部共同形成一个支撑角1222,本实施方式的镜筒12上形成有四个支撑角1222。镜筒侧壁122的外壁可以形成有定位和安装结构,以便于在将激光投射模组10安装在电子装置1000内时固定激光投射模组10的位置。镜筒12(或镜筒侧壁122)包括第一面124、第二面125和镜筒侧面129,第一面124和第二面125位于镜筒12的相背两侧,镜筒侧面129连接第一面124和第二面125并且镜筒侧面129还环绕第一面124,其中收容腔121的一个开口开设在第二面125上,另一个开口开设在第一面124上。第二面125与电路板112结合,例如胶合,第一面124可以作为镜筒12与衍射光学元件15的结合面,或作为镜筒12与保护盖16等的结合面。请结合图33和图10,镜筒侧壁122的外壁开设有容胶槽126,容胶槽126可以自第一面124开设并向第二面125的方向延伸。
请参阅图32和图33,限位凸起123自镜筒侧壁122向内凸出,具体地,限位凸起123自镜筒侧壁122向收容腔121内突出。限位凸起123可以呈连续的环状,或者限位凸起123包括多个,多个限位凸起123间隔分布。限位凸起123围成过光孔1231,过光孔1231可以作为收容腔121的一部分,激光穿过过光孔1231后穿入衍射光学元件15。在如图30所示的实施例中,限位凸起123位于第一面124与第二面125之间,限位凸起123与第二面125之间的收容腔121可以用于收容准直元件14,限位凸起123与第一面124之间的收容腔121可以用于收容衍射光学元件15。同时,在组装激光投射模组10时,当衍射光学元件15与限位凸起123相抵,可以认为衍射光学元件15安装到位,当准直元件14与限位凸起123相抵,可以认为准直元件14安装到位。限位凸起123包括限位面1232,当衍射光学元件15安装在限位凸起123上时,限位面1232与衍射光学元件15结合。
请参阅图32,光源13设置在基板组件11上,具体地,光源13可以设置在电路板112上并与电路板112电连接,光源13也可以设置在基板111上并与过孔113对应,此时,可以通过布置导线将光源13与电路板112电连接。光源13用于发射激光,激光可以是红外光,在一个例子中,光源13可以包括半导体衬底及设置在半导体衬底上的发射激光器,半导体衬底设置在基板111上,发射激光器可以是垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)。半导体衬底可以设置单个发射激光器,也可以设置由多个发射激光器组成的阵列激光器,具体地,多个发射激光器可以以规则或者不规则的二维图案的形式排布在半导体衬底上。
请参阅图32,准直元件14可以是光学透镜,准直元件14用于准直光源13发射的激光,准直元件14收容在收容腔121内,准直元件14可以沿第二面125指向第一面124的方向组装到收容腔121内。准直元件14包括光学部141和安装部142,安装部142用于与镜筒侧壁122结合并固定准直元件14,在本申请实施例中,光学部141包括位于准直元件14相背两侧的两个曲面。
请参阅图32和图33,衍射光学元件15安装在限位凸起123上,具体地,衍射光学元件15与限位面1232结合以安装在限位凸起123上。衍射光学元件15的外表面包括顶面151、衍射底面152和侧面153。顶面151和衍射底面152相背,侧面153连接顶面151和衍射底面152,当衍射光学元件15安装在限位凸起123上时,衍射底面152与限位面1232结合。本申请实施例中,衍射底面152上形成有衍射结构,顶面151可以是光滑的平面,衍射光学元件15可以将经准直元件14准直后的激光投射出与衍射结构对应的激光图案。衍射光学元件15可以由玻璃制成,也可以说由复合塑料(如PET)制成。
请参阅图32和图33,保护盖16与镜筒12结合,保护盖16用于限制衍射光学元件15的位置,具体地,保护盖16用于防止衍射光学元件15与镜筒12的结合失效后从镜筒12中脱出。保护盖16由非导电材料制成,或者,保护盖16由导电材料制成并且保护盖16的表面设置有绝缘层。请结合图11,保护盖16包括保护顶壁161和保护侧壁162。
保护顶壁161与限位凸起123分别位于衍射光学元件15的相背的两侧,或者说,衍射光学元件15位于限位凸起123与保护顶壁161之间,如此,即使衍射光学元件15与限位凸起123的结合失效了,由于保护顶壁161的限制作用,衍射光学元件15也不会脱出。保护顶壁161开设有通光孔1611,通光孔1611的位置与衍射光学元件15对应,激光先后穿过过光孔1231、衍射光学元件15和通光孔1611后从激光投射模组10中射出。在本申请实施例中,保护顶壁161的整体形状呈圆角方形,通光孔1611可以呈圆形、矩形、椭圆形、梯形等形状。在如图30所示的实施例中,当保护盖16与镜筒12结合时,保护顶壁161与第一面124相抵,进一步地,保护顶壁161还可以与第一面124通过胶粘等的方式结合。
请参阅图10、图11及至图33,保护侧壁162自保护顶壁161的周缘延伸,保护盖16罩设在镜筒 12上,保护侧壁162与镜筒侧壁122固定连接。保护侧壁162包括多个首尾依次相接的保护子侧壁1621,每个保护子侧壁1621与镜筒侧壁122均固定连接,每个保护子侧壁1621上均形成有点胶孔163。点胶孔163的位置与容胶槽126的位置对应,当保护盖16罩设在镜筒12上后,可以从点胶孔163向容胶槽126内点胶,胶水固化后,保护侧壁162与镜筒侧壁122固定连接。在一个例子中,每个保护子侧壁1621上开设有单个点胶孔163,在另一个例子中,每个保护子侧壁1621上开设有多个点胶孔163,例如两个、三个、四个等,在本申请实施例中,每个保护子侧壁1621上开设有两个点胶孔163,两个点胶孔163分别与容胶槽126的两个内侧壁1261对应,便于用户向容胶槽126的两侧同时点胶,提高点胶速度。进一步地,容胶槽126的内侧壁1261倾斜连接容胶槽126的内底壁1262与镜筒侧壁122的外壁,倾斜连接指的是内侧壁1261与内底壁1262,内侧壁1261与镜筒侧壁122的外壁均不垂直,当胶水被注入到内侧壁1261上时,在内侧壁1261的导引作用下,胶水容易向容胶槽126的中间位置流动,加快胶水填充容胶槽126的速度。
请参阅图29及图30,第一电极板191设置在镜筒12上。具体地,第一电极板191可以设置在第一面124上并不遮挡收容腔121的开设在第一面124上的开口,此时,第一面124上可开设收容槽,第一电极板191设置在收容槽内。第一电极板191呈环状或扇环状,第一电极板191由导电材料制成,例如,第一电极板191的材料可包括镍、钯、银、钽、碳素材料、金属氧化物、导电聚合物。
请参阅图29及图30,第二电极板192设置在保护盖16上并与第一电极板191间隔相对,第二电极板192与第一电极板191共同组成检测电容19。具体地,第二电极板192可以设置在保护顶壁161(可以设置在保护顶壁161的内表面或保护顶壁161的外表面)上并不遮挡收容腔121的开设在第一面124上的开口,也不遮挡通光孔1611,此时,保护顶壁161上可开设容置槽,第一电极板191设置在容置槽内。第二电极板192的形状与第一电极板191的形状相匹配并呈环状(例如:圆环形、方环形)或扇环状,第二电极板192由导电材料制成,例如,第二电极板192的材料可包括镍、钯、银、钽、碳素材料、金属氧化物、导电聚合物。在其他实施方式中,请参阅图31,第一电极板191还可以设置在镜筒侧面129上,此时,第一电极板192呈圆筒状或圆弧形片状结构,第二电极板192设置在保护侧壁162(可以设置在保护侧壁162的内表面或保护侧壁162的外表面)上,第二电极板192的形状与第一电极板191的形状相匹配并呈圆筒状或圆弧形片状。
请结合图29及图40,检测电路73形成在基板组件11及镜筒12上,第一电极板191与第二电极板192连接在检测电路73中并能够形成检测回路。具体地,检测电路73包括检测线路731、电阻元件732及检测器件733。检测线路731形成在基板组件11及镜筒12上,检测线路731包括第一检测子线路7311及第二检测子线路7312,第一检测子线路7311形成在基板组件11及镜筒12上并与第一电极板191连接,第二检测子线路7312也形成在基板组件11及镜筒12上并与第二电极板733连接,第二检测子线路7312与第一检测子线路7312间隔设置。电阻元件732连接在检测线路731中并与检测电容19串联,电阻元件732可以为电阻。检测器件733连接在检测线路731中,当检测器件733为电压表时,检测器件733与电阻元件732并联并用于检测电阻元件732两端的电压;当检测器件733为电流表时,检测器件733与电阻元件732串联并用于检测流经电阻元件732的电流。具体地,当检测器件733检测不到电压或电流时,说明没有电流流经电阻元件732,进而说明检测电容19的电容量没有发生变化,从而推测出保护盖16没有从镜筒12上脱落;当检测器件733能够检测到电压或电流时,说明有电流流经电阻元件732,进而说明检测电容19的电容量发生了变化(电容量变小)并发生放电,从而推测出保护盖16从镜筒12上脱落。因此,检测电路73能够根据检测电路73中的电信号(电流)变化确定保护盖16与镜筒12是否脱落。
本实施方式中,形成在镜筒12上的第一检测子线路7311位于镜筒12的镜筒侧面129上并沿着镜筒12的一个支撑角1222分布,第一检测子线路7311与第一电极板191可通过焊接、弹片连接、插接、导电胶粘接中的任意一种或多种方式电性连接。形成在镜筒12上的第二检测子线路7312位于镜筒12的镜筒侧面129上并沿着镜筒12的另一个支撑角1222分布,第二检测子线路7312还可设置在保护盖16上并与第二电极板192连接,具体地,第二检测子线路7312与第二电极板192可通过焊接、弹片连接、插接、导电胶粘接中的任意一种或多种方式电性连接。形成在镜筒12上的第一检测子线路7311与第二检测子线路7312可以分别设置在一个镜筒子侧壁1221的相对两端的两个支撑角1222上;或者,形成在镜筒12上的第一检测子线路7311与第二检测子线路7312可以分别设置在由不同镜筒子侧壁1221形成的两个支撑角1222上。
综上,本申请实施方式的电子装置1000中,由于保护盖16与镜筒12结合,保护盖16的保护顶壁161与限位凸起123一起限制衍射光学元件15的位置,衍射光学元件15不会沿出光方向脱落,避免激光未经过衍射光学元件15后发射出去,保护用户,提高安全性。同时,激光投射模组10通过设置检测电路73和连接在检测电路73中的检测电容19,检测电路73通过检测检测电容19上的电信号是否发生 变化,从而能够确定保护盖16(衍射光学元件15)是否从镜筒12上脱落,当检测电路73检测到检测电容19上的电信号发生变化时,激光投射模组10停止工作以避免激光投射模组10发出激光灼伤用户,提高用户使用激光投射模组10的安全级别。
请参阅图29及图40,在某些实施方式中,激光投射模组10还包括处理芯片60,处理芯片60连接在检测电路73中并与检测电容19形成检测回路。处理芯片60能够检测检测电容19上的电信号是否发生变化(或者说,处理芯片60能够根据检测电容19是否有信号传输到处理芯片60上),从而确定保护盖16(衍射光学元件15)是否从镜筒12脱落。具体地,当保护盖16固定在镜筒12上时,检测电容19不会有电信号(电流)流入处理芯片60;当保护盖16从镜筒12上脱落时,检测电容19发生放电并使电流流入到处理芯片60上,处理芯片60可以根据采集到的信号变化确定保护盖16(衍射光学元件15)是否从镜筒12脱落。处理芯片60可以设置在电子装置1000的主板上,处理芯片60可通过连接器17与检测电路73连接在一起。在其他实施方式中,深度相机100中的处理器30可以作为本实施方式中的处理芯片60使用,也就是说,处理器30既可以用于处理激光图案以获得深度图像又可以用于检测保护盖16是否连接在检测电路73中,此时,激光投射模组10不需要额外设置处理芯片60。
在本申请第四实施例中,保护盖16包括保护顶壁161和自保护顶壁161的周缘延伸的保护侧壁162,保护侧壁162与镜筒12结合,保护顶壁161遮挡衍射光学元件15;检测组件70包括发射器74和接收器75,发射器74和接收器75中的至少一个设置在保护侧壁162上,另外一个设置在基板组件11上,发射器74和接收器75相对设置以形成检测线路。请参阅图41至图43,也就是说,激光投射模组10包括基板组件11、镜筒12、衍射光学元件15、保护盖16及检测组件70。镜筒12设置在基板组件11上。衍射光学元件15设置在镜筒12内。保护盖16套设在镜筒12上,保护盖16包括保护顶壁161和自保护顶壁161的周缘延伸的保护侧壁162,保护侧壁162与镜筒12结合,保护顶壁161并限制衍射光学元件15的位置。检测组件70包括发射器74和接收器75,发射器74和接收器75中的至少一个设置在保护侧壁162上,另外一个设置在基板组件11上,发射器74和接收器75相对设置以形成检测线路。
保护盖16与镜筒12结合并用于将衍射光学元件15限制(遮挡)在镜筒12内。检测组件70用于检测保护盖16是否脱落。检测组件70的发射器74和接收器75的至少一个设置在保护侧壁162上,另外一个设置在基板组件11上,其中检测组件70与保护侧壁162的连接方式、及检测组件70与基板组件11的连接的方式包括焊接、胶合、螺合、或卡合等。发射器74用于发射检测信号,接收器75用于接收由发射器74发射的检测信号。检测信号可以为光信号,比如红外光;检测信号也可以是超声波信号。在一个例子中,发射器74为红外发光二极管(LED),接收器75为红外光接收器。在本实施例中,发射器74和接收器75相对设置。在检测组件70工作时,发射器74朝接收器75发射检测信号,当接收器75接收到的检测信号的强度在预定范围内时,则可判断当前的发射器74及接收器75的相对位置没有发生较大的改变,例如,预定信号范围为[20cd,50cd],检测信号的强度为25cd,30cd,48cd中的任意一个时,由此确定保护盖16与基板组件11的相对位置没有发生较大的改变,从而确定保护盖16仍较好地与镜筒12结合。因此保护盖16依然能较好地限制衍射光学元件15的位置,衍射光学元件15也仍保持在原位置。当接收器75接收不到检测信号或者接收到的检测信号的强度超出预定信号范围时,例如,预定信号范围为[20cd,50cd],当检测信号的强度小于20cd或大于50cd,比如0cd,10cd,18cd,55cd中的任意一个时,均可判断当前的发射器74及接收器75的相对位置发生较大的改变,由此确定保护盖16与基板组件11的相对位置发生了较大的改变,从而确定保护盖16从镜筒12脱落或者发生严重倾斜。而失去保护盖16限制的衍射光学元件15也有可能发生脱落。一旦衍射光学元件15脱落,则激光投射模组10投射出的光线会形成较强的零级光束,若用户恰好在做人脸识别,则会损伤用户的眼睛。因此,在检测组件70检测到保护盖16从镜筒12上脱落时,则判定衍射光学元件15也脱落(换言之,通过检测到保护盖16从镜筒12上脱落,间接得出衍射光学元件15也脱落),同时控制激光投射模组10停止工作,使激光投射模组10停止发出激光,相较于直接检测到衍射光学元件15脱落后激光投射模组10才停止发出激光而言,将安全保障进行了提前,即,提高了保护用户使用激光投射模组10的安全级别。
本申请实施方式的激光投射模组10通过设置保护盖16并限制衍射光学元件15的位置,从而使衍射光学元件15能够更加牢固地设置在镜筒12内;同时,激光投射模组10通过在保护盖16设置发射器74和接收器75的其中一个,在基板组件11上设置发射器74和接收器75的另外一个,发射器74和接收器75相对以形成检测线路,从而能够确定保护盖16(衍射光学元件15)是否脱落,当检测到保护盖16从镜筒12上脱落时,激光投射模组10停止工作以避免激光投射模组10发出的激光灼伤用户,提高了保护用户使用激光投射模组10的安全级别。
请参阅图41至图43,激光投射模组10包括基板组件11、镜筒12、光源13、准直元件14、衍射光学元件15、保护盖16和检测组件70。光源13、准直元件14和衍射光学元件15依次设置在光源13的 光路上,具体地,光源13发出的光依次穿过准直元件14和衍射光学元件15。
请参阅图43和图44,基板组件11包括基板111及承载在基板111上的电路板112。基板111用于承载镜筒12、光源13和电路板112。基板111的材料可以是塑料,比如聚对苯二甲酸乙二醇酯、聚甲基丙烯酸甲酯、聚碳酸酯、聚酰亚胺中的至少一种。也就是说,基板111可以采用PET、PMMA、PC或PI中任意一种的单一塑料材质制成。如此,基板111质量较轻且具有足够的支撑强度。
电路板112可以是印刷电路板、柔性电路板、软硬结合板中的任意一种。电路板112上可以开设有过孔113,过孔113内可以用于容纳光源13,电路板112一部分被镜筒12罩住,另一部分延伸出来并可以与连接器17连接,连接器17可以将激光投射模组10连接到电子装置1000的主板上。
请参阅图43和图46,镜筒12设置在基板组件11上并与基板组件11共同形成收容腔121。具体地,镜筒12可以与基板组件11的电路板112连接,镜筒12与电路板112可以通过粘胶粘接,以提高收容腔121的气密性。当然,镜筒12与基板组件11的具体连接方式可以有其他,例如通过卡合连接。收容腔121可以用于容纳准直元件14、衍射光学元件15等元器件,收容腔121同时形成激光投射模组10的光路的一部分。镜筒12由不导电的材料制成,例如,镜筒12由塑料制成,塑料包括PET、PMMA、PC或PI中任意一种;或者,镜筒12由导电的材料制成但镜筒12的外表面设置有绝缘层以使镜筒12不导电。
具体地,镜筒12包括镜筒侧壁122和限位凸起123。镜筒侧壁122设置在基板组件11上并与基板组件11共同形成收容腔121。镜筒侧壁122包括多个镜筒子侧壁1221,每一个镜筒子侧壁1221均与基板组件11结合,多个镜筒子侧壁1221依次相接呈环形并共同环绕收容腔121。任意两个相连接的镜筒子侧壁1221的端部共同形成一个支撑角1222,本实施方式的镜筒12上形成有四个支撑角1222。镜筒侧壁122的外壁可以形成有定位和安装结构,以便于在将激光投射模组10安装在图1实施例中的电子装置1000内时固定激光投射模组10的位置。
请参阅图44,镜筒12还包括相背的第一面124和第二面125,其中收容腔121的一个开口开设在第二面125上,另一个开口开设在第一面124上。第二面125与电路板112结合,例如胶合,第一面124可以作为镜筒12与衍射光学元件15的结合面或作为镜筒12与保护盖16等的结合面。请结合图47和图10,镜筒侧壁122的外壁开设有容胶槽126,容胶槽126可以自第一面124开设并向第二面125的方向延伸。
请参阅图43和图44,限位凸起123自镜筒侧壁122向内凸出,具体地,限位凸起123自镜筒侧壁122向收容腔121内突出。限位凸起123可以呈连续的环状,或者限位凸起123包括多个,多个限位凸起123间隔分布。限位凸起123围成过光孔1231,过光孔1231可以作为收容腔121的一部分,激光穿过过光孔1231后穿入衍射光学元件15。在如图44所示的实施例中,限位凸起123位于第一面124与第二面125之间,限位凸起123与第二面125之间的收容腔121可以用于收容准直元件14,限位凸起123与第一面124之间的收容腔121可以用于收容衍射光学元件15。同时,在组装激光投射模组10时,当衍射光学元件15与限位凸起123相抵,可以认为衍射光学元件15安装到位,当准直元件14与限位凸起123相抵,可以认为准直元件14安装到位。限位凸起123包括限位面1232,当衍射光学元件15安装在限位凸起123上时,限位面1232与衍射光学元件15结合。
请参阅图46,光源13设置在基板组件11上,具体地,光源13可以设置在电路板112上并与电路板112电连接,光源13也可以设置在基板111上并与过孔113对应,此时,可以通过布置导线将光源13与电路板112电连接。光源13用于发射激光,激光可以是红外光,在一个例子中,光源13可以包括半导体衬底及设置在半导体衬底上的发射激光器,半导体衬底设置在基板111上,发射激光器可以是垂直腔面发射激光器。半导体衬底可以设置单个发射激光器,也可以设置由多个发射激光器组成的阵列激光器,具体地,多个发射激光器可以以规则或者不规则的二维图案的形式排布在半导体衬底上。
请参阅图46,准直元件14可以是光学透镜,准直元件14用于准直光源13发射的激光,准直元件14收容在收容腔121内,准直元件14可以沿第二面125指向第一面124的方向组装到收容腔121内。准直元件14包括光学部141和安装部142,安装部142用于与镜筒侧壁122结合并固定准直元件14,在本申请实施例中,光学部141包括位于准直元件14相背两侧的两个曲面。
请参阅图46和图47,衍射光学元件15安装在限位凸起123上,具体地,衍射光学元件15与限位面1232结合以安装在限位凸起123上。衍射光学元件15的外表面包括顶面151、衍射底面152和侧面153。顶面151和衍射底面152相背,侧面153连接顶面151和衍射底面152,当衍射光学元件15安装在限位凸起123上时,衍射底面152与限位面1232结合。本申请实施例中,衍射底面152上形成有衍射结构,顶面151可以是光滑的平面,衍射光学元件15可以将经准直元件14准直后的激光投射出与衍射结构对应的激光图案。衍射光学元件15可以由玻璃制成,也可以说由复合塑料(如PET)制成。
请参阅图46和图47,保护盖16与镜筒12结合,保护盖16用于限制衍射光学元件15的位置,具 体地,保护盖16用于防止衍射光学元件15与镜筒12的结合失效后从镜筒12中脱出。其中,保护盖16可由不透光材料制成,例如纳米银丝、金属银线、铜片等。保护盖16部分遮挡衍射光学元件15,而不是完全遮挡衍射光学元件15,在一个例子中,保护盖16上开设有透光孔,衍射光学元件15从透光孔向外投射激光图案。保护盖16也由透光材料制成,例如玻璃、聚甲基丙烯酸甲酯、聚碳酸酯、聚酰亚胺等。由于玻璃、PMMA、PC、及PI等透光材料均具有优异的透光性能,此时,保护盖16可以部分遮挡衍射光学元件15,也可以完全遮挡衍射光学元件15,以使衍射光学元件15防水防尘。
请结合图11,保护盖16包括保护顶壁161和保护侧壁162。保护顶壁161与限位凸起123分别位于衍射光学元件15的相背的两侧,或者说,衍射光学元件15位于限位凸起123与保护顶壁161之间,如此,即使衍射光学元件15与限位凸起123的结合失效了,由于保护顶壁161的限制作用,衍射光学元件15也不会脱出。保护顶壁161开设有通光孔1611,通光孔1611的位置与衍射光学元件15对应,激光先后穿过过光孔1231、衍射光学元件15和通光孔1611后从激光投射模组10中射出。在本申请实施例中,保护顶壁161的整体形状呈圆角方形,通光孔1611可以呈圆形、矩形、椭圆形、梯形等形状。在如图44所示的实施例中,当保护盖16与镜筒12结合时,保护顶壁161与第一面124相抵,进一步地,保护顶壁161还可以与第一面124通过胶粘等的方式结合。
请参阅图10、图11和图47,保护侧壁162自保护顶壁161的周缘延伸,保护盖16罩设在镜筒12上,保护侧壁162与镜筒侧壁122固定连接。保护侧壁162包括多个首尾依次相接的保护子侧壁1621,每一个保护子侧壁1621与镜筒侧壁122均固定连接,每一个保护子侧壁1621上均形成有点胶孔163。点胶孔163的位置与容胶槽126的位置对应,当保护盖16罩设在镜筒12上后,可以从点胶孔163向容胶槽126内点胶,胶水固化后,保护侧壁162与镜筒侧壁122固定连接。在一个例子中,每一个保护子侧壁1621上开设有单个点胶孔163,在另一个例子中,每一个保护子侧壁1621上开设有多个点胶孔163,例如两个、三个、四个等,在本申请实施例中,每一个保护子侧壁1621上开设有两个点胶孔163,两个点胶孔163分别与容胶槽126的两个内侧壁1261对应,便于用户向容胶槽126的两侧同时点胶,提高点胶速度。进一步地,容胶槽126的内侧壁1261倾斜连接容胶槽126的内底壁1262与镜筒侧壁122的外壁,倾斜连接指的是内侧壁1261与内底壁1262,内侧壁1261与镜筒侧壁122的外壁均不垂直,当胶水被注入到内侧壁1261上时,在内侧壁1261的导引作用下,胶水容易向容胶槽126的中间位置流动,加快胶水填充容胶槽126的速度。
请参阅图41至图43,检测组件70用于检测保护盖16是否脱落。检测组件70包括发射器74和接收器75,发射器74和接收器75中的至少一个设置在保护侧壁162上,另外一个设置在基板组件11上,发射器74和接收器75相对设置以形成检测线路。当发射器74或者接收器75偏离检测线路时,接收器75接收不到由发射器74发射的检测信号或接收到的检测信号超出预定信号范围,均表明保护盖16与基板组件11的相对位置发生较大的改变,以此确定保护盖16(衍射光学元件15)脱落。在一个例子中,发射器74可以持续向接收器75发射检测信号,接收器75持续接收检测信号。在另一个例子中,发射器74可以以预定时间间隔向接收器75发射检测信号,接收器75持续接收检测信号。
综上,本申请实施方式的电子装置1000和深度相机100中,由于保护盖16与镜筒12结合,保护盖16的保护顶壁161与限位凸起123一起限制衍射光学元件15的位置,衍射光学元件15不会沿出光方向脱落,避免激光未经过衍射光学元件15后发射出去,保护用户,提高安全性。同时,激光投射模组10通过在保护盖16设置发射器74和接收器75的其中一个,在基板组件11上设置发射器74和接收器75的另外一个,发射器74和接收器75相对以形成检测线路,从而能够确定保护盖16(衍射光学元件15)是否脱落,当检测到保护盖16从镜筒12上脱落时,激光投射模组10停止工作以避免激光投射模组10发出的激光灼伤用户,提高了保护用户使用激光投射模组10的安全级别。
请参阅图46,在某些实施方式中,镜筒12包括镜筒侧壁122,镜筒侧壁122设置在基板组件11上并与基板组件11共同形成收容腔121。基板组件11包括电路板112,镜筒侧壁122与电路板112结合。发射器74设置在保护侧壁162上,接收器75设置在电路板112上;和/或,接收器75设置在保护侧壁162上,发射器74设置在电路板112上。
请结合图47,保护侧壁162包括相背的侧壁内表面1622和侧壁外表面1623,发射器74和接收器75中的至少一个设置在侧壁外表面1623上,另外一个设置在电路板112上。具体地,当发射器74和接收器75的数量均为一个时,发射器74设置在侧壁外表面1623,接收器75设置在电路板112上;或者,接收器75设置在侧壁外表面1623上,发射器74设置在电路板112上。当发射器74和接收器75的数量均为多个时,多个发射器74均设置在侧壁外表面1623上,多个接收器75均设置在电路板112上,每一个发射器74均与一个接收器75对应,且每一个接收器75均与一个发射器74对应;或者,多个接收器75均设置在侧壁外表面1623上,多个发射器74均设置在电路板112上,每一个接收器75均与一个发射器74对应,且每一个接收器75均与一个发射器74对应。当发射器74和接收器75的数量均为 多个时,一部分发射器74设置在侧壁外表面1623上,另一部分发射器74设置在电路板112上,一部分接收器75设置在电路板112上,另一部分接收器75设置在侧壁外表面1623上,每一个发射器74均与一个接收器75对应,且每一个接收器75均与一个发射器74对应。在本实施例中,多个表示两个或者两个以上。
请参阅图53,在某些实施方式中,第一定位部128包括自镜筒侧壁122凸出的镜筒凸块1285,第二定位部154包括形成在侧面153的侧面凹陷1545,当衍射底面152与限位凸起123结合时,镜筒凸块1285伸入侧面凹陷1545内。镜筒凸块1285与侧面凹陷1545的位置对应,且镜筒凸块1285与侧面凹陷1545的数量相等,镜筒凸块1285被平行于衍射底面152的平面截得的形状可以是矩形、半圆形、三角形、梯形、圆形中的一种或多种。可以理解,如果用户将衍射光学元件15装反,镜筒凸块1285将与衍射光学元件15相抵,导致衍射光学元件15无法安装在限位凸起123上,用户容易察觉到衍射光学元件15被装反,故镜筒凸块1285与侧面凹陷1545可以避免衍射光学元件15被装反。
请参阅图19,在某些实施方式中,沿顶面151至衍射底面152的方向,侧面凹陷1545的尺寸逐渐增大,镜筒凸块1285的尺寸逐渐增大。进一步地,镜筒凸块1285的最大尺寸大于侧面凹陷1545的最小尺寸,当用户欲将衍射光学元件15调转安装时,镜筒凸块1285不能完全伸入镜筒凹陷1284内,镜筒凸块1285会将衍射光学元件15垫高,用户容易察觉到衍射光学元件15装反。
请参阅图46和图54,在某些实施方式中,镜筒12包括镜筒侧壁122,镜筒侧壁122设置在基板组件11上并与基板组件11共同形成收容腔121。基板组件11包括电路板112,镜筒侧壁122与电路板112结合。保护侧壁162开设有收容槽1624,基板组件11包括电路板112,镜筒侧壁122与电路板112结合。发射器74设置在收容槽1624内,接收器75设置在电路板112上;和/或,接收器75设置在收容槽1624内,发射器74设置在电路板上。
具体地,侧壁外表面1623开设有收容槽1624,发射器74和接收器75中的至少一个设置在收容槽1624上,另外一个设置在电路板112上。当发射器74和接收器75的数量均为一个时,发射器74设置在收容槽1624内,接收器75设置在电路板112上;或者,接收器75设置在收容槽1624内,发射器74设置在电路板112上。当发射器74和接收器75的数量均为多个时,多个发射器74均设置在收容槽1624内,多个接收器75均设置在电路板112上,每一个发射器74均与一个接收器75对应,且每一个接收器75均与一个发射器74对应;或者,多个接收器75均设置在收容槽1624内,多个发射器74均设置在电路板112上,每一个接收器75均与一个发射器74对应,且每一个接收器75均与一个发射器74对应。当发射器74和接收器75的数量均为多个时,一部分发射器74设置在收容槽1624内,另一部分发射器74设置在电路板112上,一部分接收器75设置在电路板112上,另一部分接收器75设置在收容槽1624内,每一个发射器74均与一个接收器75对应,且每一个接收器75均与一个发射器74对应。在一个例子中,发射器74或接收器75与收容槽1624通过胶水结合,以使发射器74或接收器75与收容槽1624结合得更加较牢靠。
请参阅图47和图55,在某些实施方式中,镜筒12包括镜筒侧壁122,镜筒侧壁122设置在基板组件11上并与基板组件11共同形成收容腔121,保护侧壁162的侧壁底面1625开设有容置槽1626,镜筒侧壁122开设有贯通孔129,镜筒12还包括相背的第一面124和第二面125,第二面125与基板组件11结合,侧壁底面1625与第一面124相对,贯通孔129贯穿第一面124和第二面125并与容置槽1626相对。发射器74设置在容置槽1626内,接收器75设置在电路板112上并收容在贯通孔129内;和/或,接收器75设置在容置槽1626内,发射器74设置在电路板112上并收容在贯通孔129内。
具体地,保护侧壁162包括连接侧壁内表面1622和侧壁外表面1623的侧壁底面1625。如图55,在本实施例中,侧壁底面1625与第一面124相对并且间隔。侧壁底面1625内开设有与发射器74或接收器75对应大小的容置槽1626。镜筒侧壁122开设有与容置槽1626对应的贯通孔129。在图55的实施例中,贯通孔129设置在两个镜筒子侧壁1221的相接处,在其他实施例中,贯通孔129还可以直接设置在镜筒子侧壁1221内。当发射器74和接收器75的数量均为一个时,发射器74设置在容置槽1626内,接收器75设置在电路板112上并收容在贯通孔129内;或者,接收器75设置在容置槽1626内,发射器74设置在电路板112上并收容在贯通孔129内。当发射器74和接收器75的数量均为多个时,贯通孔129的数量也为多个,多个发射器74均设置在容置槽1626内,多个接收器75均设置在电路板112上并收容在对应的多个贯通孔129内,每一个发射器74均与一个接收器75对应,且每一个接收器75均与一个发射器74对应;或者,多个接收器75均设置在容置槽1626内,多个发射器74均设置在电路板112上并收容在对应的多个贯通孔129内,每一个接收器75均与一个发射器74对应,且每一个接收器75均与一个发射器74对应。当发射器74和接收器75的数量均为多个时,一部分发射器74设置在容置槽1626内,另一部分发射器74设置在电路板112上并收容在对应的多个贯通孔129内,一部分接收器75设置在电路板112上并收容在贯通孔129内,另一部分接收器75设置在容置槽1626内,每 一个发射器74均与一个接收器75对应,且每一个接收器75均与一个发射器74对应。
在组装保护盖16与镜筒12时,可先将发射器74或接收器75安装在容置槽1626内,再将保护盖16罩设在镜筒侧壁122上。在组装镜筒12与基板组件11时,可先将发射器74或接收器75竖直设置在电路板112上,再将镜筒12的贯通孔129对准发射器74或接收器75,以将发射器74或接收器75收容在贯通孔129内。在一个例子中,发射器74或接收器75与容置槽1626通过胶水结合,以使发射器74或接收器75与容置槽1626结合得更加牢靠。在另一个例子中,镜筒侧壁122的顶端面1223(如图55)与侧壁底面1625抵触,安装在容置槽1626内的发射器74或接收器75与顶端面1223抵触,以避免发射器74或接收器75从容置槽1626掉落。
请参阅图56和图57,在某些实施方式中,检测组件70的数量为多个,多个检测组件70的多条检测线路平行;或,多个检测组件70的多条检测线路相交。
在本实施例中,通过在每一个保护子侧壁1621都设置多个检测组件70,以提高检测精度。现以多个检测组件70的发射器74均设置在保护侧壁162上,接收器75均设置在基板组件11上为例,每一个发射器74均与一个接收器75对应,且每一个接收器75均与一个发射器74对应。其他排列分布的多个检测组件70的检测线路与上述的检测线路类似,在此不再赘述。
具体地,请结合图43和图56,发射器74依次排布在保护子侧壁1621上,接收器75依次排布在与发射器74对应的电路板112上,形成的多条检测线路互相平行。如图57,多个发射器74可以设置在保护盖16的顶角位置,多个接收器75对应设置在与该顶角相对的另一个顶角的电路板112上,形成的多条检测线路相交。在一个例子中,同一个激光投射模组10可以设置一组检测线路互相平行的检测组件70,设置一组检测线路相交的检测组件70,然后通过控制这两组检测组件70以预定时间间隔发射和接收检测信号,避免两组检测组件70造成检测干扰。
在某些实施方式中,检测组件70为多个,多个检测组件70至少包括分别设置在相对的两个保护子侧壁1621上的两个检测组件70。
请参阅图43,保护侧壁162包括多个保护子侧壁1621。具体地,在图43的实施例中,保护子侧壁1621的数量为四个。多个检测组件70可以仅分布在设置在相对的两个保护子侧壁1621上,比如左右的两个保护子侧壁1621、前后的两个保护子侧壁1621。当然,多个检测组件70还可以分布在四个保护子侧壁1621上,即前后、左右的保护子侧壁1621均设置有检测组件70。
当保护盖16绕着某一个镜筒侧壁122发生旋转(外翻)时,其中一个保护子侧壁1621脱离镜筒侧壁122,两者之间的旋转距离较大,则检测组件70的接收器75接收到由对应的发射器74发射的检测信号越小,并容易超出预定的检测信号范围,此时能判断保护盖16脱落。而相对的另外一个保护子侧壁1621与镜筒侧壁122仍结合在一起,两者之间的旋转距离较小,则检测组件70的接收器75接收到由对应的发射器74发射的检测信号仍较强,并可能仍在预定的检测信号范围内,此时无法判断保护盖16是否脱落。因此,仅通过某一个保护子侧壁1621上的检测组件70判断保护盖16是否脱落,判断精度比较低。本申请实施例中,通过在相对的两个保护子侧壁1621上设置多个检测组件70,能够提高检测组件16的检测精度。
请参阅图1、图56及图57,在某些实施方式中,激光投射模组10还包括处理芯片60。处理芯片60与接收器75连接。处理芯片60能够在接收器75接收不到由发射器74发射的检测信号或接收到的检测信号超出预定信号范围时确定保护盖16脱落。具体地,处理芯片60根据接收器75接收到的检测信号强度来判断保护盖16与基板组件11的相对位置。处理芯片60可以设置在电子装置1000的主板上,处理芯片60可通过连接器17与接收器75连接在一起。在其他实施方式中,深度相机100中的处理器30可以作为本实施方式中的处理芯片60使用,也就是说,处理器30既可以用于处理激光图案以获得深度图像又可以用于检测保护盖16是否连接在检测电路18检测组件70中,此时,激光投射模组10不需要额外设置处理芯片60。
本申请第五实施例中,镜筒12包括镜筒侧壁162,镜筒侧壁162与基板组件11共同形成收容腔121,镜筒侧壁162形成有相背的第一面124和第二面125,第二面125与基板组件11结合;衍射光学元件15收容在收容腔121内;保护盖16开设有与衍射光学元件15对准的通光孔1611,保护盖16结合在镜筒12上并用于防止衍射光学元件15从收容腔121脱出;检测组件70包括发射器74和接收器75,发射器74和接收器75中的一个设置在通光孔1611的内壁上,另一个设置在第一面124上,发射器74和接收器75相对设置以形成检测线路。
具体地,请参阅图58至图60,激光投射模组10包括基板组件11、镜筒12、光源13、准直元件14、衍射光学元件15、保护盖16和检测组件70。光源13、准直元件14和衍射光学元件15依次设置在光源13的光路上,具体地,光源13发出的光依次穿过准直元件14和衍射光学元件15。
请参阅图60和图61,基板组件11包括基板111及承载在基板111上的电路板112。基板111用于 承载镜筒12、光源13和电路板112。基板111的材料可以是塑料,比如聚对苯二甲酸乙二醇酯、聚甲基丙烯酸甲酯、聚碳酸酯、聚酰亚胺中的至少一种。也就是说,基板111可以采用PET、PMMA、PC或PI中任意一种的单一塑料材质制成。如此,基板111质量较轻且具有足够的支撑强度。
电路板112可以是印刷电路板、柔性电路板、软硬结合板中的任意一种。电路板112上可以开设有过孔113,过孔113内可以用于容纳光源13,电路板112一部分被镜筒12罩住,另一部分延伸出来并可以与连接器17连接,连接器17可以将激光投射模组10连接到电子装置1000的主板上。
请参阅图61和图62,镜筒12设置在基板组件11上并与基板组件11共同形成收容腔121。具体地,镜筒12可以与基板组件11的电路板112连接,镜筒12与电路板112可以通过粘胶粘接,以提高收容腔121的气密性。当然,镜筒12与基板组件11的具体连接方式可以有其他,例如通过卡合连接。收容腔121可以用于容纳准直元件14、衍射光学元件15等元器件,收容腔121同时形成激光投射模组10的光路的一部分。在本申请实施例中,镜筒12呈中空的筒状,镜筒12包括镜筒侧壁122和限位凸起123。
镜筒侧壁122与基板组件11共同形成收容腔121,镜筒侧壁122的外壁可以形成有定位和安装结构,以便于在将激光投射模组10安装在电子装置1000内时固定激光投射模组10的位置。镜筒侧壁122形成有相背的第一面124和第二面125,其中收容腔121的一个开口开设在第二面125上,另一个开口开设在第一面124上。第二面125与电路板112结合,例如胶合,第一面124可以作为镜筒12与衍射光学元件15,或镜筒12与保护盖16的结合面。请结合图63和图10,镜筒侧壁122的外壁开设有容胶槽126,容胶槽126可以自第一面124开设并向第二面125的方向延伸。
请参阅图63至图65,限位凸起123自镜筒侧壁122向内凸出,具体地,限位凸起123自镜筒侧壁122向收容腔121内突出。限位凸起123可以呈连续的环状,或者限位凸起123包括多个,多个限位凸起123间隔分布。限位凸起123围成过光孔1231,过光孔1231可以作为收容腔121的一部分,激光穿过过光孔1231后穿入衍射光学元件15。在如图61所示的实施例中,限位凸起123位于第一面124与第二面125之间,限位凸起123与第二面125之间的收容腔121可以用于收容准直元件14,限位凸起123与第一面124之间的收容腔121可以用于收容衍射光学元件15。同时,在组装激光投射模组10时,当衍射光学元件15与限位凸起123相抵,可以认为衍射光学元件15安装到位,当准直元件14与限位凸起123相抵,可以认为准直元件14安装到位。限位凸起123包括限位面1232,当衍射光学元件15安装在限位凸起123上时,限位面1232与衍射光学元件15结合。
请参阅图61和图62,光源13设置在基板组件11上,具体地,光源13可以设置在电路板112上并与电路板112电连接,光源13也可以设置在基板111上并与过孔113对应,此时,可以通过布置导线将光源13与电路板112电连接。光源13用于发射激光,激光可以是红外光,在一个例子中,光源13可以包括半导体衬底及设置在半导体衬底上的发射激光器,半导体衬底设置在基板111上,发射激光器可以是垂直腔面发射激光器。半导体衬底可以设置单个发射激光器,也可以设置由多个发射激光器组成的阵列激光器,具体地,多个发射激光器可以以规则或者不规则的二维图案的形式排布在半导体衬底上。
请继续参阅图61和图62,准直元件14可以是光学透镜,准直元件14用于准直光源13发射的激光,准直元件14收容在收容腔121内,准直元件14可以沿第二面125指向第一面124的方向组装到收容腔121内。准直元件14包括光学部141和安装部142,安装部142用于与镜筒侧壁122结合并固定准直元件14,在本申请实施例中,光学部141包括位于准直元件14相背两侧的两个曲面。
请参阅图62和图63,衍射光学元件15安装在限位凸起123上,具体地,衍射光学元件15与限位面1232结合以安装在限位凸起123上。衍射光学元件15的外表面包括顶面151、底面152和侧面153。顶面151和底面152相背,侧面153连接顶面151和底面152,当衍射光学元件15安装在限位凸起123上时,底面152与限位面1232结合。本申请实施例中,底面152上形成有衍射结构,顶面151可以是光滑的平面,衍射光学元件15可以将经准直元件14准直后的激光投射出与衍射结构对应的激光图案。衍射光学元件15可以由玻璃制成,也可以说由复合塑料(如PET)制成。
请参阅图62至图64,保护盖16与镜筒12结合,保护盖16用于限制衍射光学元件15的位置,具体地,保护盖16用于防止衍射光学元件15与镜筒12的结合失效后从镜筒12的收容腔121中脱出。请结合图11,保护盖16包括保护顶壁161和保护侧壁162。
保护顶壁161遮挡部分衍射光学元件15,保护顶壁161与限位凸起123分别位于衍射光学元件15的相背的两侧,或者说,衍射光学元件15位于限位凸起123与保护顶壁161之间,如此,即使衍射光学元件15与限位凸起123的结合失效了,由于保护顶壁161的限制作用,衍射光学元件15也不会从收容腔121脱出。保护顶壁161开设有通光孔1611,通光孔1611的位置与衍射光学元件15对准,激光先后穿过过光孔1231、衍射光学元件15和通光孔1611后从激光投射模组10中射出。在本申请实施例中,保护顶壁161的整体形状呈圆角方形,通光孔1611可以呈圆形、矩形、椭圆形、梯形等形状。在如图61所示的实施例中,当保护盖16与镜筒12结合时,保护顶壁161与第一面124相抵,进一步地,保护 顶壁161还可以与第一面124通过胶粘等的方式结合。
保护侧壁162自保护顶壁161的周缘延伸,保护侧壁162与镜筒12结合,具体地,保护盖16罩设在镜筒12上,保护侧壁162与镜筒侧壁122固定连接。保护侧壁162包括多个首尾依次相接的保护子侧壁1621,每个保护子侧壁1621与镜筒侧壁122均固定连接,每个保护子侧壁1621上均形成有点胶孔163。点胶孔163的位置与容胶槽126的位置对应,当保护盖16罩设在镜筒12上后,可以从点胶孔163向容胶槽126内点胶,胶水固化后,保护侧壁162与镜筒侧壁122固定连接。在一个例子中,每个保护子侧壁1621上开设有单个点胶孔163,在另一个例子中,每个保护子侧壁1621上开设有多个点胶孔163,例如两个、三个、四个等。在本申请实施例中,请结合图10和图11,每个保护子侧壁1621上开设有两个点胶孔163,两个点胶孔163分别与容胶槽126的两个内侧壁1261对应,便于用户向容胶槽126的两侧同时点胶,提高点胶速度。进一步地,容胶槽126的内侧壁1261倾斜连接容胶槽126的内底壁1262与镜筒侧壁122的外壁,倾斜连接指的是内侧壁1261与内底壁1262,内侧壁1261与镜筒侧壁122的外壁均不垂直,当胶水被注入到内侧壁1261上时,在内侧壁1261的导引作用下,胶水容易向容胶槽126的中间位置流动,加快胶水填充容胶槽126的速度。
请参阅图58、图59、图63和图64,检测组件70包括发射器74和接收器75。发射器74和接收器75中的一个安装在通光孔1611的内壁上,另一个安装在第一面124上,发射器74和接收器75相对设置以形成检测线路。具体地,可以是发射器74安装在通光孔1611的内壁上,接收器75安装在第一面124上;或者接收器75安装在通光孔1611的内壁上,发射器74安装在第一面124上。
请参阅图63和图64,本申请实施例以发射器74安装在第一面124上,接收器75安装在通光孔1611的内壁上为例对检测组件70进行示例性的说明。发射器74与接收器75相对设置,发射器74用于向特定方向发射检测信号S,当保护盖16未发生偏移或脱落时,发射器74发射的检测信号S被接收器75接收,接收器75接收到检测信号S后,依据检测信号S的强度发出不同的电信号。该电信号可以由激光投射模组10的处理芯片60(如图60所示)接收,处理芯片60与接收器75连接,处理芯片60可以设置在基板组件11上。处理芯片60通过处理该电信号以得到接收器75接收的检测信号S的强度。在一个例子中,处理芯片60的功能也可以由上述的处理器30来实施,或者说,处理器30也可以作为处理芯片60使用。
可以理解,当发射器74发射检测信号S,而接收器75接收不到检测信号S时,即,接收器75接收到的检测信号S的强度为零时,可以认为保护盖16与镜筒12分离,保护盖16带动发射器74相对于接收器75发生运动,使发射器74与接收器75的位置不再相对设置,并间接得出衍射光学元件15已经从收容腔121中脱落。而衍射光学元件15脱落后,激光投射模组10投射出的激光会形成较强的零级光束,若用户恰好在做人脸识别,则会伤害用户的眼睛。
当发射器74发射检测信号S,而接收器75接收到的检测信号S强度不在预定范围内时,例如,预定范围为[20单位,35单位],接收器75接收到的检测信号S强度为5单位、13单位、40单位等值时,可以认为保护盖16已经发生偏移,保护盖16带动发射器74相对于接收器75发生运动,使发射器74与接收器75的位置也由相对发生了变化,并间接得出衍射光学元件15可能也已经发生偏移。而衍射光学元件15发生偏移时,一来衍射光学元件15的安装位置发生的变化,激光投射模组10可能会投出较强的零级光束,二来衍射光学元件15极有可能在继续使用中发生脱落。
因此,处理芯片60可以在接收器75接收不到检测信号S,或在接收器75接收到的检测信号S强度不在预定范围内时确定保护盖16脱落。此时,处理芯片60可控制光源13停止向外发出激光,使激光投射模组10停止工作,相较于直接检测到衍射光学元件15脱落后光源13才停止发出激光而言,本实施方式将安全保障进行了提前,提高了用户使用激光投射模组10的安全级别。
具体地,发射器74可以是声波发射器并用于发射检测声波,此时接收器75可以是声波接收器并用于接收发射器74发射的检测声波,检测声波可以是超声波。发射器74还可以是光发射器并用于发射检测光,此时接收器75可以是光接收器并用于接收发射器74发射的检测光,检测光可以是激光。发射器74可以粘接在第一面124上,接收器75可以粘接在通光孔1611的内壁上。检测组件70可以在光源不发光时进行检测以避免检测信号干扰激光投射模组10向外投射的激光图案,当然,在检测信号不会干扰激光图案时,检测组件70也可以在光源发光的时候实时进行检测。检测组件70也可以隔预定时间进行检测,例如隔1天、2天等。检测组件70也可以是在光源13每发光预定时长后进行一次检测,例如光源13每累计发光30分钟后进行检测。
现有的结构光投射器(激光投射模组)向目标空间中投射结构光时,光源发射的激光需要通过衍射光学元件后再向外发射,衍射光学元件通常安装在结构光投射器的镜筒内,然而,在使用中,衍射光学元件容易从镜筒内脱落,而用户在不知晓衍射光学元件已经脱落的情况下打开光源时,光源直接射出后会对用户造成伤害。
综上,本申请实施方式的电子装置1000中,保护盖16可用于防止衍射光学元件15从收容腔121脱出,同时,检测组件70的发射器74和接收器75中的一个设置在通光孔1611的内壁上,另一个设置在第一面124上,发射器74和接收器75相对以形成检测线路,用户可以通过检测线路检测得知保护盖16是否脱落,并进一步获知衍射光学元件15是否脱落,在检测到保护盖16脱落时,可关闭激光投射模组10,以防止激光未经衍射光学元件15后直接发射出去而伤害用户。
请参阅图58至图60,在某些实施方式中,检测组件70的数量为多个,每个检测组件70形成一条检测线路,多个检测组件70的多条检测线路相交。
具体地,如果检测组件70的数量为一个且检测线路的数量为一条,在保护盖16绕该检测线路发生翻转时,尽管保护盖16的位置已经偏离正常位置,而接收器75依然能够接收到检测信号且检测信号的强度处于预定范围内,导致不能很准确地检测到保护盖16可能发生脱落的情况。当设置多个检测组件70且多条检测线路相交时,只要保护盖16发生翻转,则至少会导致一个检测组件70的接收器75接收不到检测信号或接收到的检测信号的强度处于预定范围外,因此,多个检测组件70能够准确地检测到保护盖16是否发生翻转。在本申请实施例中,检测组件70的数量为两个,两个检测组件70的两条检测线路相交。
请参阅图65,在某些实施方式中,第一面124上开设有容置槽1241,容置槽1241可以用于安装发射器74或接收器75。具体地,发射器74可以固定在容置槽1241内并从容置槽1241露出,且接收器75设置在通光孔1611的内壁上;或者接收器75可以固定在容置槽1241内并从容置槽1241露出,且发射器74设置在通光孔1611的内壁上。在如图65所示的实施例中,发射器74固定在容置槽1241内且从容置槽1241露出,使得发射器74能够较稳固地与镜筒12结合。
请参阅图66,在某些实施方式中,通光孔1611的内壁开设有收容槽166,收容槽166可用于安装接收器75或发射器74。具体地,接收器75可以固定在收容槽166内并从收容槽166内露出,且发射器74设置在第一面124上;或者发射器74固定在收容槽166内并从收容槽166内露出,且接收器75设置在第一面124上。在如图66所示的实施例中,接收器75固定在收容槽166内且从收容槽166露出,使得接收器75能够较稳固地与保护顶壁161结合。
当然,在某些实施方式中,第一面124开设有容置槽1241,同时通光孔1611的内壁开设有收容槽166,发射器74和接收器75中的一个固定在容置槽1241内并从容置槽1241露出,另一个固定在收容槽166内并从收容槽166露出,以使接收器75和发射器74均能被较稳固地固定。
在本说明书的描述中,参考术语“某些实施方式”、“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个所述特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个,除非另有明确具体的限定。
尽管上面已经示出和描述了本申请的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本申请的限制,本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。

Claims (39)

  1. 一种激光投射模组,其特征在于,包括:
    基板组件;
    设置在所述基板组件上的镜筒;
    衍射光学元件,所述衍射光学元件设置在所述镜筒内;
    保护盖,所述保护盖与所述镜筒结合并遮挡所述衍射光学元件;和
    检测组件,所述检测组件用于检测所述保护盖是否从所述镜筒上脱落。
  2. 根据权利要求1所述的激光投射模组,其特征在于,所述保护盖能够导电,所述检测组件包括形成在所述基板组件及所述镜筒上的检测电路,所述保护盖连接在所述检测电路中并能够形成检测回路。
  3. 根据权利要求1所述的激光投射模组,其特征在于,所述保护盖能够导电,所述检测组件包括形成在所述基板组件及所述镜筒上的检测电路,所述检测电路包括温度传感器及检测线路,所述温度传感器设置在所述基板组件上,所述检测线路设置在所述基板组件及所述镜筒上,所述检测线路电性连接所述温度传感器及所述保护盖,所述检测线路与所述温度传感器连接以用于检测所述激光投射模组的温度,所述检测线路与所述保护盖连接以用于检测所述保护盖是否与所述检测线路断开连接。
  4. 根据权利要求1所述的激光投射模组,其特征在于,所述检测组件包括第一电极板、第二电极板和检测电路,所述第一电极板设置在所述镜筒上;所述第二电极板设置在所述保护盖上并与所述第一电极板间隔相对,所述第二电极板与所述第一电极板共同组成检测电容;所述第一电极板及所述第二电极板连接在所述检测电路中并能够形成检测回路。
  5. 根据权利要求1所述的激光投射模组,其特征在于,所述保护盖包括保护顶壁和自所述保护顶壁的周缘延伸的保护侧壁,所述保护侧壁与所述镜筒结合,所述保护顶壁遮挡所述衍射光学元件;所述检测组件包括发射器和接收器,所述发射器和所述接收器中的至少一个设置在所述保护侧壁上,另外一个设置在所述基板组件上,所述发射器和所述接收器相对设置以形成检测线路。
  6. 根据权利要求1所述的激光投射模组,其特征在于,所述镜筒包括镜筒侧壁,所述镜筒侧壁与所述基板组件共同形成收容腔,所述镜筒侧壁形成有相背的第一面和第二面,所述第二面与所述基板组件结合;所述衍射光学元件收容在所述收容腔内;所述保护盖开设有与所述衍射光学元件对准的通光孔,所述保护盖结合在所述镜筒上并用于防止所述衍射光学元件从所述收容腔脱出;所述检测组件包括发射器和接收器,所述发射器和所述接收器中的一个设置在所述通光孔的内壁上,另一个设置在所述第一面上,所述发射器和所述接收器相对设置以形成检测线路。
  7. 根据权利要求3所述的激光投射模组,其特征在于,所述温度传感器与所述保护盖串联并连接在所述检测线路中以形成检测回路;或
    所述温度传感器与所述保护盖并联,所述保护盖连接在所述检测线路中并能够形成第一检测回路,所述温度传感器连接在所述检测线路中并能够形成第二检测回路。
  8. 根据权利要求3所述的激光投射模组,其特征在于,所述温度传感器与所述保护盖并联,所述保护盖连接在所述检测线路中并能够形成第一检测回路,所述温度传感器连接在所述检测线路中并能够形成第二检测回路,所述检测电路包括多个检测周期,每个所述检测周期均包括保护盖检测周期及温度检测周期;
    在所述保护盖检测周期内,所述检测线路与所述保护盖电性连接并与所述温度传感器断开连接,所述检测电路用于检测所述保护盖与所述检测线路是否断开连接;
    在所述温度检测周期内,所述检测线路与所述温度传感器电性连接并与所述保护盖断开连接,所述检测电路用于检测所述激光投射模组的温度。
  9. 根据权利要求2、3、7和8中的任意一项所述的激光投射模组,其特征在于,所述激光投射模组还包括处理芯片,所述处理芯片连接在所述检测电路中并与所述保护盖形成所述检测回路。
  10. 根据权利要求2或3所述的激光投射模组,其特征在于,位于所述镜筒上的所述检测电路形成在所述镜筒侧壁的外侧面上。
  11. 根据权利要求2或3所述的激光投射模组,其特征在于,所述检测电路包括正极连接端及负极连接端,所述正极连接端及所述负极连接端间隔设置在所述镜筒上,所述正极连接端与所述负极连接端均与所述保护盖电性连接。
  12. 根据权利要求11所述的激光投射模组,其特征在于,所述镜筒包括镜筒侧壁,所述镜筒侧壁设置在所述基板组件上并与所述基板组件共同形成收容腔,所述镜筒侧壁包括多个镜筒子侧壁,每个所述镜筒子侧壁均与所述基板组件结合,多个所述镜筒子侧壁依次相接呈环形并共同环绕所述收容腔,任意两个相连接的所述镜筒子侧壁的端部共同形成一个支撑角,所述正极连接端及所述负极连接端分别设置在两个所述支撑角上。
  13. 根据权利要求2或3所述的激光投射模组,其特征在于,所述检测电路与所述保护盖通过焊接、弹片连接、插接、导电胶粘接中的任意一种或多种方式电性连接。
  14. 根据权利要求2或3所述的激光投射模组,其特征在于,所述保护盖的表面设置有绝缘层。
  15. 根据权利要求1所述的激光投射模组,其特征在于,所述镜筒包括镜筒侧壁,所述镜筒侧壁设置在所述基板组件上并与所述基板组件共同形成收容腔,所述镜筒包括自所述镜筒侧壁向内凸出的限位凸起;所述激光投射模组还包括:
    光源,所述光源设置在所述基板组件上并用于向所述收容腔发射激光;及
    准直元件,所述准直元件收容在所述收容腔内;
    所述衍射光学元件安装在所述限位凸起上,所述光源、所述准直元件和所述衍射光学元件依次设置在所述光源的光路上;
    所述保护盖包括保护顶壁,所述保护顶壁开设有通光孔,所述通光孔与所述衍射光学元件对应,所述衍射光学元件位于所述限位凸起与所述保护顶壁之间。
  16. 根据权利要求15所述的激光投射模组,其特征在于,所述保护盖还包括自所述保护顶壁的周缘延伸的保护侧壁,所述保护盖罩设在所述镜筒上,所述保护侧壁与所述镜筒侧壁固定连接。
  17. 根据权利要求4所述的激光投射模组,其特征在于,所述镜筒包括靠近镜筒侧壁,所述镜筒侧壁包括位于靠近所述保护盖一侧的第一面及环绕所述第一面的镜筒侧面,所述保护盖包括与所述第一面相对的保护顶壁及自所述保护顶壁的周缘延伸的保护侧壁,所述第一电极板设置在所述第一面上,所述第二电极板设置在所述保护顶壁上。
  18. 根据权利要求17所述的激光投射模组,其特征在于,所述第一电极板呈环状或扇环状,所述第二电极板呈环状或扇环状。
  19. 根据权利要求4所述的激光投射模组,其特征在于,所述镜筒包括靠近镜筒侧壁,所述镜筒侧壁包括位于靠近所述保护盖一侧的第一面及环绕所述第一面的镜筒侧面,所述保护盖包括与所述第一面相对的保护顶壁及自所述保护顶壁的周缘延伸的保护侧壁,所述第一电极板设置在所述镜筒侧面上,所述第二电极板设置在所述保护侧壁上。
  20. 根据权利要求19所述的激光投射模组,其特征在于,所述第一电极板呈圆筒状或圆弧形片状;所述第二电极板呈圆筒状或圆弧形片状。
  21. 根据权利要求4、17-20任意一项所述的激光投射模组,其特征在于,所述检测电路包括电阻元件及检测器件,所述电阻元件与所述检测电容串联,所述检测器件与所述电阻元件并联或串联。
  22. 根据权利要求4、17-20任意一项所述的激光投射模组,其特征在于,所述激光投射模组还包括处理芯片,所述处理芯片连接在所述检测电路中并与所述检测电容形成所述检测回路。
  23. 根据权利要求5所述的激光投射模组,其特征在于,所述激光投射模组还包括处理芯片,所述处理芯片与所述接收器连接,所述处理芯片用于在所述接收器接收不到由所述发射器发射的检测信号或接收到的检测信号超出预定信号范围时确定所述保护盖脱落。
  24. 根据权利要求23所述的激光投射模组,其特征在于,所述镜筒包括镜筒侧壁,所述镜筒侧壁设置在所述基板组件上并与所述基板组件共同形成收容腔,所述基板组件包括电路板,所述镜筒侧壁与所述电路板结合;
    所述发射器设置在所述保护侧壁上,所述接收器设置在所述电路板上;和/或
    所述接收器设置在所述保护侧壁上,所述发射器设置在所述电路板上。
  25. 根据权利要求23所述的激光投射模组,其特征在于,所述镜筒包括镜筒侧壁,所述镜筒侧壁设置在所述基板组件上并与所述基板组件共同形成收容腔,所述保护侧壁的侧壁底面开设有容置槽,所述镜筒侧壁开设有贯通孔,所述镜筒还包括相背的第一面和第二面,所述第二面与所述基板组件结合,所述底面与所述第一面相对,所述贯通孔贯穿所述第一面和所述第二面并与所述容置槽相对;
    所述发射器设置在所述容置槽内,所述接收器设置在所述电路板上并收容在所述贯通孔内;和/或
    所述接收器设置在所述容置槽内,所述发射器设置在所述电路板上并收容在所述贯通孔内。
  26. 根据权利要求23所述的激光投射模组,其特征在于,所述检测组件的数量为多个,多个所述检测组件的多条所述检测线路平行;或
    多个所述检测组件的多条所述检测线路相交。
  27. 根据权利要求5所述的激光投射模组,其特征在于,所述镜筒包括镜筒侧壁,所述镜筒侧壁设置在所述基板组件上并与所述基板组件共同形成收容腔,所述镜筒包括自所述镜筒侧壁向内凸出的限位凸起,所述激光投射模组还包括:
    光源,所述光源设置在所述基板组件上并用于向所述收容腔发射激光;及
    准直元件,所述准直元件收容在所述收容腔内;
    所述衍射光学元件安装在所述限位凸起上,所述光源、所述准直元件和所述衍射光学元件依次设置在所述光源的光路上;
    所述保护顶壁开设有通光孔,所述通光孔与所述衍射光学元件对应,所述衍射光学元件位于所述限位凸起与所述保护顶壁之间,所述保护侧壁与所述镜筒侧壁固定连接。
  28. 根据权利要求6所述的激光投射模组,其特征在于,所述激光投射模组还包括处理芯片,所述处理芯片与所述接收器连接,所述处理芯片用于在所述接收器接收不到由所述发射器发射的检测信号,或接收到的检测信号强度不在预定范围内时确定所述保护盖脱落。
  29. 根据权利要求28所述的激光投射模组,其特征在于,所述检测组件的数量为多个,每个所述检测组件形成一条检测线路,多个所述检测组件的多条检测线路相交。
  30. 根据权利要求28所述的激光投射模组,其特征在于,所述第一面开设有容置槽,
    所述发射器固定在所述容置槽内并从所述容置槽露出,所述接收器设置在所述通光孔的内壁上;和/或
    所述接收器固定在所述容置槽内并从所述容置槽露出,所述发射器设置在所述通光孔的内壁上。
  31. 根据权利要求28所述的激光投射模组,其特征在于,所述通光孔的内壁开设有收容槽,
    所述接收器固定在所述收容槽内并从所述收容槽内露出,所述发射器设置在所述第一面上;和/或
    所述发射器固定在所述收容槽内并从所述收容槽内露出,所述接收器设置在所述第一面上。
  32. 根据权利要求6所述的激光投射模组,其特征在于,所述镜筒还包括自所述镜筒侧壁向内凸出的限位凸起,所述激光投射模组还包括:
    光源,所述光源设置在所述基板组件上并用于向所述收容腔发射激光;和
    准直元件,所述准直元件收容在所述收容腔内;
    所述衍射光学元件安装在所述限位凸起上,所述光源、所述准直元件和所述衍射光学元件依次设置在所述光源的光路上;所述保护盖包括保护顶壁和自所述保护顶壁的周缘延伸的保护侧壁,所述保护侧壁与所述镜筒结合,所述保护顶壁开设有所述通光孔,所述保护顶壁遮挡部分所述衍射光学元件。
  33. 根据权利要求16、27和32中的任意一项所述的激光投射模组,其特征在于,所述镜筒侧壁的外壁开设有容胶槽,所述保护侧壁与所述容胶槽对应的位置开设有点胶孔,以允许胶水通过所述点胶孔进入所述容胶槽。
  34. 根据权利要求33所述的激光投射模组,其特征在于,所述保护盖还包括自所述保护侧壁向内凸出的弹性的第一卡勾,所述镜筒还包括自所述容胶槽的内底壁向外凸出的第二卡勾,所述保护盖罩设在所述镜筒上时,所述第一卡勾与所述第二卡勾卡合。
  35. 根据权利要求34所述的激光投射模组,其特征在于,所述保护侧壁在与所述第一卡勾对应的位置开设有避让孔,所述避让孔用于在所述保护盖罩设在所述镜筒的过程中,所述第一卡勾与所述第二卡勾相抵且所述第一卡勾发生弹性形变时提供形变空间。
  36. 根据权利要求34所述的激光投射模组,其特征在于,所述第二卡勾形成有导引斜面,沿所述保护盖套入所述镜筒的方向,所述导引斜面逐渐远离所述内底壁,所述保护盖罩设在所述镜筒的过程中,所述第一卡勾与所述导引斜面相抵。
  37. 一种深度相机,其特征在于,包括:
    权利要求1-36任意一项所述的激光投射模组;和
    图像采集器,所述图像采集器用于采集经所述衍射光学元件后向目标空间中投射的激光图案,所述激光图案用于形成深度图像。
  38. 根据权利要求37所述的深度相机,其特征在于,所述深度相机还包括分别与所述激光投射模组和所述图像采集器连接的处理器,所述处理器用于处理所述激光图案以获得所述深度图像。
  39. 一种电子装置,其特征在于,包括:
    壳体;和
    权利要求37或38所述的深度相机,所述深度相机设置在所述壳体上并用于获取深度图像。
PCT/CN2019/082698 2018-05-25 2019-04-15 激光投射模组、深度相机和电子装置 WO2019223451A1 (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
CN201810545855.0A CN108548498A (zh) 2018-05-25 2018-05-25 激光投射模组、深度相机和电子装置
CN201810545879.6A CN110531562A (zh) 2018-05-25 2018-05-25 激光投射模组、深度相机和电子装置
CN201810545855.0 2018-05-25
CN201810545879.6 2018-05-25
CN201810674273.2A CN108924295B (zh) 2018-06-27 2018-06-27 光电模组、深度相机和终端
CN201810674275.1 2018-06-27
CN201810674275.1A CN108845428B (zh) 2018-06-27 2018-06-27 激光投射模组、深度相机和电子装置
CN201810674273.2 2018-06-27
CN201810687921.8A CN108983432B (zh) 2018-06-28 2018-06-28 激光投射器、深度获取装置和终端
CN201810687921.8 2018-06-28

Publications (1)

Publication Number Publication Date
WO2019223451A1 true WO2019223451A1 (zh) 2019-11-28

Family

ID=68616547

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/082698 WO2019223451A1 (zh) 2018-05-25 2019-04-15 激光投射模组、深度相机和电子装置

Country Status (1)

Country Link
WO (1) WO2019223451A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3116382A1 (fr) * 2020-11-16 2022-05-20 Stmicroelectronics (Grenoble 2) Sas Boîtier pour circuit intégré et procédé de fabrication

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105502141A (zh) * 2016-02-18 2016-04-20 北京祥华亿能科技有限公司 自动扶梯安全系统
CN107608167A (zh) * 2017-10-11 2018-01-19 深圳奥比中光科技有限公司 激光投影装置及其安全控制方法
CN107870186A (zh) * 2017-12-18 2018-04-03 深圳奥比中光科技有限公司 一种含安全监测功能的光学模组
CN207382424U (zh) * 2017-11-01 2018-05-18 浙江舜宇智能光学技术有限公司 Tof摄像模组以及电子设备
CN108548498A (zh) * 2018-05-25 2018-09-18 Oppo广东移动通信有限公司 激光投射模组、深度相机和电子装置
CN108845428A (zh) * 2018-06-27 2018-11-20 Oppo广东移动通信有限公司 激光投射模组、深度相机和电子装置
CN108924295A (zh) * 2018-06-27 2018-11-30 Oppo广东移动通信有限公司 光电模组、深度相机和终端
CN108983432A (zh) * 2018-06-28 2018-12-11 Oppo广东移动通信有限公司 激光投射器、深度获取装置和终端

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105502141A (zh) * 2016-02-18 2016-04-20 北京祥华亿能科技有限公司 自动扶梯安全系统
CN107608167A (zh) * 2017-10-11 2018-01-19 深圳奥比中光科技有限公司 激光投影装置及其安全控制方法
CN207382424U (zh) * 2017-11-01 2018-05-18 浙江舜宇智能光学技术有限公司 Tof摄像模组以及电子设备
CN107870186A (zh) * 2017-12-18 2018-04-03 深圳奥比中光科技有限公司 一种含安全监测功能的光学模组
CN108548498A (zh) * 2018-05-25 2018-09-18 Oppo广东移动通信有限公司 激光投射模组、深度相机和电子装置
CN108845428A (zh) * 2018-06-27 2018-11-20 Oppo广东移动通信有限公司 激光投射模组、深度相机和电子装置
CN108924295A (zh) * 2018-06-27 2018-11-30 Oppo广东移动通信有限公司 光电模组、深度相机和终端
CN108983432A (zh) * 2018-06-28 2018-12-11 Oppo广东移动通信有限公司 激光投射器、深度获取装置和终端

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3116382A1 (fr) * 2020-11-16 2022-05-20 Stmicroelectronics (Grenoble 2) Sas Boîtier pour circuit intégré et procédé de fabrication
US11984373B2 (en) 2020-11-16 2024-05-14 Stmicroelectronics (Grenoble 2) Sas Package for integrated circuit and manufacturing method

Similar Documents

Publication Publication Date Title
WO2020038060A1 (zh) 激光投射模组及其控制方法、图像获取设备和电子装置
WO2020125388A1 (zh) 飞行时间模组及电子设备
CN108924295B (zh) 光电模组、深度相机和终端
CN109212763B (zh) 光发射模组及其损坏的检测方法、深度获取装置和电子设备
CN111399156B (zh) 激光投射器、图像获取装置和电子设备
WO2020038067A1 (zh) 激光投射模组及控制方法、深度图像获取设备和电子装置
EP3855710A1 (en) Lens, active light-emitting module and terminal
CN108390969B (zh) 支架、输入输出组件和终端
TWI697729B (zh) 鐳射投射模組、深度相機和電子裝置
CN108388072B (zh) 激光投射模组、深度相机和电子装置
WO2020038066A1 (zh) 光投射器及其破裂的检测方法、深度相机和电子装置
CN108390971B (zh) 支架、输入输出组件和终端
CN108390970B (zh) 支架、输入输出组件和终端
CN108845428B (zh) 激光投射模组、深度相机和电子装置
WO2020052289A1 (zh) 深度获取模组及电子装置
TW201937243A (zh) 鐳射投射模組、深度相機及電子裝置
CN108507761B (zh) 激光投射模组及其检测方法与装置、深度相机和电子装置
CN210923959U (zh) 飞行时间投射器、飞行时间深度模组和电子设备
US11307431B2 (en) Laser projection modules and methods for detecting fracture thereof, depth cameras and electronic devices
WO2019223451A1 (zh) 激光投射模组、深度相机和电子装置
WO2020052288A1 (zh) 深度采集模组及移动终端
EP3609168A1 (en) Support, input/output assembly and terminal
CN108490572B (zh) 激光投射模组、深度相机及电子装置
CN108600437B (zh) 支架组件、输入输出组件和电子装置
CN108548498A (zh) 激光投射模组、深度相机和电子装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19806805

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19806805

Country of ref document: EP

Kind code of ref document: A1