WO2020078558A1 - Dispositif d'amortissement magnétique pour amortir les vibrations d'un support; support pour porter un objet plan, système de transport pour transporter un support, et methode de transport sans contact d'un support - Google Patents

Dispositif d'amortissement magnétique pour amortir les vibrations d'un support; support pour porter un objet plan, système de transport pour transporter un support, et methode de transport sans contact d'un support Download PDF

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Publication number
WO2020078558A1
WO2020078558A1 PCT/EP2018/078625 EP2018078625W WO2020078558A1 WO 2020078558 A1 WO2020078558 A1 WO 2020078558A1 EP 2018078625 W EP2018078625 W EP 2018078625W WO 2020078558 A1 WO2020078558 A1 WO 2020078558A1
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WO
WIPO (PCT)
Prior art keywords
carrier
magnetic
damping device
damping
magnetic damping
Prior art date
Application number
PCT/EP2018/078625
Other languages
English (en)
Inventor
Christian Wolfgang Ehmann
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020217014365A priority Critical patent/KR102519583B1/ko
Priority to PCT/EP2018/078625 priority patent/WO2020078558A1/fr
Priority to CN201880098437.XA priority patent/CN112867878B/zh
Publication of WO2020078558A1 publication Critical patent/WO2020078558A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F7/00—Vibration-dampers; Shock-absorbers
    • F16F7/10—Vibration-dampers; Shock-absorbers using inertia effect
    • F16F7/104—Vibration-dampers; Shock-absorbers using inertia effect the inertia member being resiliently mounted
    • F16F7/116—Vibration-dampers; Shock-absorbers using inertia effect the inertia member being resiliently mounted on metal springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

Definitions

  • Embodiments of the present disclosure relate to magnetic damping devices for damping vibrations of a carrier, particularly used in a vacuum deposition process. Further embodiments of the present disclosure relate to carriers, e.g. for a substrate or a mask, including a magnetic damping device. Further embodiments of the present disclosure relate to transport systems for transporting a carrier and to methods of contactlessly transporting a carrier.
  • the transport system of the present disclosure is configured to contactlessly hold, position and/or transport a carrier through a vacuum processing system, wherein the carrier may carry a substrate or a mask, particularly in an essentially vertical orientation. More specifically, embodiments of the present disclosure are particularly adapted to enable damping of carrier vibrations in a cross direction substantially perpendicular to the carrier transport direction.
  • substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma-enhanced chemical vapor deposition (PECVD) process, etc.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • the process is performed in a process apparatus or process chamber, where the substrate to be coated is located.
  • a deposition material is provided in the apparatus.
  • a plurality of materials for example, nitrides or carbides thereof, may be used for deposition on a substrate.
  • other processing methods like etching, structuring, annealing, or the like can be conducted in processing chambers.
  • Coated materials may be used in several applications and in several technical fields.
  • an application lies in the field of microelectronics, such as generating semiconductor devices.
  • substrates for displays are often coated by a PVD process.
  • Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with TFT (thin film transistor), color filters or the like.
  • OLED organic light emitting diode
  • TFT thin film transistor
  • the substrate and/or the mask are carried by a respective carrier.
  • the carrier is typically transported through a vacuum system using a transport system.
  • the transport system may be configured for conveying the carrier having the substrate or the mask positioned thereon along one or more transport paths.
  • the functionality of a display device typically depends on the coating thickness of the material, which has to be within a predetermined range. For obtaining high resolution display devices, technical challenges with respect to the deposition of materials need to be mastered. In particular, an accurate and smooth transportation of the substrate carriers and/or mask carriers through a vacuum system is challenging. For instance, vibrations of the carrier can lead to a deterioration of the manufacturing process. In the worst case, carrier vibrations may cause cracking or breaking of the substrate. [0005] Accordingly, there is a continuing demand for providing improved damping devices for damping vibrations of a carrier, improved carriers, improved carrier transportation systems, and methods for transporting a carrier which reduce or overcome at least some problems of the state of the art.
  • a magnetic damping device includes a first assembly including at least one conductive plate element. Additionally, the magnetic damping device includes a magnet assembly having at least one slot extending in a damping direction. The at least one conductive plate element extends into the at least one slot. Further, the magnetic damping device includes a mass element connected to the magnetic assembly and a spring device connecting the mass element with the first assembly.
  • a carrier for carrying a planar object includes a main body for carrying the planar object. Additionally, the carrier includes a magnetic damping device attached to the main body. The magnetic damping device is configured for damping carrier vibrations in a cross direction normal to the planar object.
  • a transport system for transporting a carrier in a transport direction.
  • the transport system includes a carrier for carrying a planar object.
  • the carrier includes a main body for carrying the planar object.
  • the carrier includes a magnetic damping device attached to the main body.
  • the magnetic damping device is configured for damping carrier vibrations in a cross direction normal to the planar object.
  • the magnetic damping device is arranged within a reception of the main body of the carrier.
  • the magnetic levitation system includes at least one magnetic bearing to contactlessly hold the carrier at the bearing.
  • the transport system includes a drive unit for moving the carrier in the transport direction.
  • a method of contactlessly transporting a carrier includes exerting a magnetic force on the carrier in a holding direction opposite to a gravitational force to contactlessly hold the carrier. Additionally, the method includes moving the carrier in a transport direction. Further, the method includes damping carrier vibrations in a cross direction substantially perpendicular to the transport direction. Damping carrier vibrations includes passively dissipating energy of the carrier vibrations by using a magnetic damping device fixed to the carrier.
  • the carrier is a carrier according to any embodiments described herein.
  • a method of producing a coated substrate particularly for producing an opto-electronic device, is provided.
  • the method includes using a magnetic damping device according to according to any embodiments described herein for damping vibrations of a carrier.
  • Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing the described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus. BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1A shows a schematic front view of a magnetic damping device according to embodiments described herein;
  • FIG. 1B shows a cross-sectional view of the magnetic damping device in the A-A plane as indicated in FIG. 1A;
  • FIG. 2 shows a schematic side view of a magnetic damping device according to embodiments described herein;
  • FIG. 3 shows a schematic front view of a magnetic damping device according to further embodiments described herein;
  • FIG. 4A shows a schematic front view of a carrier according to embodiments described herein;
  • FIG. 4B shows a schematic cross sectional view of a carrier according to embodiments described herein
  • FIG. 4C shows a schematic front view of a carrier according to embodiments further described herein;
  • FIG. 5A and 5B show a schematic views of a transport system according to embodiments described herein.
  • FIG. 6 shows a flowchart for illustrating a method of contactlessly transporting a carrier according to embodiments described herein.
  • a magnetic damping device 100 for damping vibrations of a carrier according to the present disclosure is described.
  • coordinate systems are shown in the figures indicating the damping direction 101, the transport direction 102 and the vertical direction 103.
  • the magnetic damping device 100 includes a first assembly 110 including at least one conductive plate element 111.
  • the first assembly 110 can include a fixation assembly for fixing the magnetic damping device 100 to the carrier.
  • the fixation assembly may include a mounting element 112 configured to be mounted to the carrier.
  • the mounting element 112 may include holes 113 for receiving fixing elements, such as bolts or screws.
  • the at least one conductive plate element is made of an electrically conductive material.
  • the magnetic damping device 100 includes a magnet assembly 120 having at least one slot 123.
  • the at least one slot 123 extends in a damping direction 101.
  • the magnetic damping device 100 is configured for providing a magnetic field across the at least one slot, i.e. the magnetic field is provided in a cross direction to the damping direction, as exemplarily described with reference to FIG. 1B.
  • the damping direction corresponds to a vibration direction of the carrier which is to be damped by the magnetic damping device 100.
  • the at least one conductive plate element 111 of the first assembly 110 extends into the at least one slot 123 of the magnet assembly 120.
  • the magnet assembly 120 can have a U-shape. Accordingly, it is to be understood that when the at least one conductive plate element 111 extending into the at least one slot 123 moves relative to the magnetic assembly 120, an eddy current in the at least one conductive plate element 111 is induced. The eddy current induced in the at least one conductive plate element creates an opposing magnetic field resulting in a damping of the movement.
  • the magnetic damping device 100 includes a mass element 130 connected to the magnetic assembly 120. Additionally, the magnetic damping device 100 includes a spring device 140. As exemplarily shown in FIG. 1A, the spring device 140 connects the mass element 130 with the first assembly 110. Accordingly, it is to be understood that the magnetic damping device as described herein provides for a spring-mass-damper system, wherein the spring device 140 represents the spring, the mass element 130 represents the mass, and the at least one conductive plate element 111 extending into the at least one slot 123 of the magnet assembly 120 represents the damper of the spring-mass- damper system.
  • embodiments of the magnetic damping device are particularly well suited for damping vibrations of carriers, e.g. substrate carriers or mask carriers, used in vacuum environments.
  • carriers e.g. substrate carriers or mask carriers
  • the magnetic damping device as described herein is configured for providing damping based on the physical principle of eddy-current losses, a contactless and frictionless damping device is provided such that particle generation occurring in conventional damping devices can be eliminated.
  • the magnetic damping device as described herein has the advantage that energy of carrier vibrations can be dissipated passively, i.e. without providing an extra power supply.
  • the magnetic damping device of the present disclosure is particularly well suited for being used in vacuum environments, because there is no need for an atmospheric box for electric or electronic devices.
  • embodiments of the magnetic damping device as described herein have the advantage that the damping properties remain essentially stable up to a temperature of 220°C.
  • the damping properties of other damping materials strongly change with changing temperature.
  • the magnetic damping device of the present disclosure is particularly well suited for damping low frequencies, e.g. frequencies f of f ⁇ 10 Hz.
  • a“magnetic damping device” can be understood as a device being configured for damping vibrations or oscillating movements based on the physical principle of eddy current losses caused by a moving conductor in a magnetic field.
  • magnetic damping is a form of damping that occurs when a magnetic field (i.e. a magnet) travels some distance through or past an electrical conductor (or vice versa). More specifically, when a magnetic field moves through a conductor (or vice versa), the movement induces an eddy current in the conductor. The flow of electrons of the eddy current in the conductor creates an opposing magnetic field which results in damping of the movement.
  • a“fixation assembly” for fixing the magnetic damping device to a carrier can be understood as a mechanical assembly configured for being fixed to a carrier as described herein.
  • the fixation assembly typically includes a mounting element configured to be mounted to the carrier, e.g. by bolts, screws or other fixing elements.
  • the fixation assembly is configured for providing a rigid fixation of the fixation assembly to a carrier as described herein.
  • the fixation assembly can be provided on the first assembly 110 as exemplarily shown in FIG. 1A.
  • the first assembly including the at least one conductive plate element 111 can be rigidly fixed to a carrier while the magnetic assembly 120 and the mass element 130 are movable relative to the first assembly.
  • the fixation assembly may be provided on the mass element 130.
  • the mass element 130 may be rigidly fixed to a carrier while the first assembly including the at least one conductive plate element 111 is movable relative to the mass element 130.
  • a“conductive plate element” can be understood as a flat, plate-like element being made of an electrically conductive material.
  • a“magnet assembly” can be understood as an assembly configured for providing a magnetic field.
  • the magnet assembly typically includes at least one slot in which the magnetic field is provided.
  • the at least one slot is laterally limited by side elements of the magnet assembly.
  • the embodiment of FIG. 1A shows a first side element 121 and a second side element 122 between which the at least one slot 123 of the magnet assembly 120 is provided.
  • the term“at least one slot” is to be understood as referring to one or more slots. Accordingly, in other words, the magnet assembly typically includes one or more slots. Further, it is to be understood that each slot is laterally limited by side elements.
  • the side elements include one or more magnets or magnetic elements for providing the magnetic field in the one or more slots, as exemplarily described in more detail with reference to FIG. 1B.
  • the magnet assembly is configured for providing a changing magnetic field in the damping direction. More specifically, as exemplarily described with reference to FIG. 1B, the magnet assembly can be configured such that alternating magnetic fields with opposite field directions in a cross direction to the damping direction are provided along the damping direction.
  • a“mass element” can be understood as an element configured for providing a tilger-mass for the magnetic damping device as described herein being configured as spring-mass-damper system. Accordingly, the“mass element” as described herein can be understood as the element configured for providing the mass in the spring-mass-damper system.
  • the mass element may be a substantially solid element, e.g. a solid block, having a tilger mass m t of 0.5 kg ⁇ m t ⁇ 5.0 kg.
  • a“spring device” can be understood as a device having one or more elastic elements.
  • the spring device may include one or more leaf springs.
  • a leaf spring may also be referred to as a flat spring.
  • the spring device, particularly the one or more leaf springs are made of spring steel.
  • the at least one conductive plate element 111 of the first assembly 110 is contactlessly arranged in the at least one slot 123 of the magnet assembly 120. Accordingly, a contactless relative movement of the at least one conductive plate element 111 with respect to the magnet assembly can be provided.
  • the at least one conductive plate element 111 of the first assembly 110 is contactlessly arranged in the at least one slot 123 of the magnet assembly 120 to allow for a contactless relative movement in the damping direction 101.
  • the damping direction 101 is substantially perpendicular to a main direction of magnetic field lines of the magnetic field provided inside the at least one slot.
  • a “substantially perpendicular” direction or orientation may be understood as a direction or orientation having a deviation angle D v from the exact perpendicularity of D v £ ⁇ 20°, particularly D v £ ⁇ 10°, more particularly D v £ ⁇ 5°.
  • the at least one conductive plate element 111 has a fixed end outside the at least one slot 123 and a free end inside the at least one slot.
  • the at least one conductive plate element 111 may be a separate element connected to the first assembly 110.
  • the at least one conductive plate element 111 may be an integral part of the first assembly 110.
  • the mounting element 112 may be a separate element connected to the first assembly or be an integral part of the first assembly 110.
  • the mounting element 112 may be an elongated element, e.g. a mounting bar, with a main extension being substantially perpendicular to the damping direction 101.
  • the main extension of the mounting element 112 can be in a transport direction 102 of a carrier to which the magnetic damping device can be mounted.
  • the at least one slot 123 is provided between a first side element 121 and a second side element 122 of the magnet assembly 120.
  • the first side element 121 may be substantially parallel to the second side element 122.
  • a“substantially parallel” direction or orientation may be understood as a direction or orientation having a deviation angle Dy from exact parallelism of Dy ⁇ ⁇ 15°, particularly Dy ⁇ ⁇ 10°, more particularly Dy ⁇ ⁇ 5°.
  • the first side element 121 includes one or more first magnetic elements 124.
  • the one or more first magnetic elements 124 may be arranged in a row along the damping direction 101.
  • the one or more first magnetic elements 124 include magnetic elements of different polarity.
  • north pole N magnetic elements are schematically indicted by hatching pattern elements.
  • South pole S magnetic elements are schematically shown as blank elements.
  • typically the one or more first magnetic elements 124 include magnetic elements of alternating polarity, e.g. S-N-S-N-S, arranged in a row along the damping direction 101.
  • the second side element 122 typically includes one or more second magnetic elements 125.
  • the one or more second magnetic elements 125 may be arranged in a row along the damping direction 101.
  • the one or more second magnetic elements 125 include magnetic elements of different polarity.
  • typically the one or more second magnetic elements 125 include magnetic elements of alternating polarity, e.g. N-S-N-S-N, arranged in a row along the damping direction 101.
  • the magnet assembly 120 is configured for providing a changing magnetic field in the damping direction 101.
  • the magnet assembly 120 can be configured such that alternating magnetic fields with opposite field directions in a cross direction to the damping direction are provided along the damping direction
  • the spring device 140 includes at least one leaf spring having a first end 141 connected to the mass element 130 and a second end 142 connected to the first assembly 110.
  • the spring device 140 may include a plurality of leaf springs each having a first end 141 connected to the mass element 130 and a second end 142 connected to the first assembly 110.
  • typically a gap 145 is provided between the spring device 140, particularly the leaf springs, and the magnet assembly 120.
  • a first group of leaf springs of the plurality of leaf springs can be provided at a first side 1 of the magnetic damping device and that a second group of leaf springs of the plurality of leaf springs can be provided at an opposite second side 2 of the magnetic damping device.
  • the spring device 140 is arranged and configured for providing a force in the damping direction 101.
  • the spring device 140 provides a force, counteracting the movement of the mass element 130.
  • the mass element 130 oscillates relative to the first assembly 110 around an equilibrium position.
  • the magnet assembly 120 is rigidly connected to the mass element 130.
  • the magnet assembly 120 follows the movement of the mass element 130, e.g. the oscillations, resulting in relative movements of the magnet assembly 120 with respect to the at least one conductive plate element 111, further resulting in magnetic damping of the oscillations due to eddy current losses.
  • the overall tilger-mass of the magnetic damping device can be regarded as the sum of the mass provided by the mass element 130 and the mass provided by the magnet assembly 120.
  • the behavior of the magnetic damping device as described herein may be adjusted by selecting the mass of the mass element 130, the spring properties of the spring device (e.g. thickness and material of the leaf springs). Further, the behavior of the magnetic damping device may also be adjusted by selecting the magnetic field strength provided in the at least one slot 123 of the magnet assembly 120. Moreover, in contrast to conventional damping devices, beneficially in the magnetic damping device as described herein an adjustment of the spring properties (e.g. the stiffness of the leaf springs) can be carried out without affecting the damping properties of the damper (e.g. provided by the magnet assembly and the eddy currents induced in the conductive plate element).
  • the spring properties e.g. the stiffness of the leaf springs
  • the spring properties of the magnetic damping device of the present disclosure are independent from the damping properties of the magnetic damping device.
  • design concepts of conventional damping devices in which the spring behavior is not independent from the damping behavior of the damper are difficult to adjust for damping in the low-frequency range (f ⁇ 80Hz, particularly f ⁇ 40Hz, more particularly f ⁇ lOHz) because damping also comes with stiffness.
  • the overall damping behavior of the magnetic damping device as described herein can easily be tailored for providing an optimum damping, e.g. for different carriers, particularly in the low-frequency range (f ⁇ 80Hz, particularly f ⁇ 40Hz, more particularly f ⁇ 10Hz).
  • the mass element 130 can be a block element having a tilger-mass.
  • the tilger mass m t can be 0.5 kg ⁇ m t ⁇ 5.0 kg.
  • the thickness T of the leaf springs may be 0.2 ⁇ mm T ⁇ 2.0 mm, particularly 0.5 ⁇ mm T ⁇ 1.5 mm.
  • the magnetic damping device includes at least one stop element 150 for providing a mechanical stop in the damping direction 101.
  • the at least one stop element 150 can be a plate element being rigidly connected to the mass element 130 at one end and having a free end at the opposing other end of the at least one stop element 150.
  • the at least one conductive plate element 111 includes a plurality of parallel arranged conductive plate elements 111P. Additionally, the at least one slot 123 includes a plurality of parallel arranged slots 123P. With exemplary reference to FIG. 3, it is to be understood that the plurality of parallel arranged conductive plate elements 111P extend into the corresponding plurality of parallel arranged slots. Accordingly, the plurality of parallel arranged conductive plate elements 111P may be arranged in a comb-like structure extending into the corresponding plurality of parallel arranged slots. [0042] It is to be understood that the features as described with reference to FIGS. 1 and 2 can, mutatis mutandis , be applied to the exemplary embodiment shown in FIG. 3.
  • a“carrier for carrying a planar object” can be understood as a carrier configured for holding a planar object, e.g. a substrate or mask.
  • the carrier for carrying a planar object can be a substrate carrier for carrying a substrate, particularly a large area substrate.
  • the carrier for carrying a planar object can be a mask carrier for carrying a mask e.g. an edge exclusion mask or a shadow mask.
  • embodiments of the carrier as described herein are configured for vacuum conditions.
  • the term“substrate” may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate.
  • the present disclosure is not limited thereto, and the term“substrate” may also embrace flexible substrates such as a web or a foil.
  • the term“substantially inflexible” is understood to distinguish over “flexible”.
  • a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.
  • the substrate may be made of any material suitable for material deposition.
  • the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.
  • a large area substrate refers to a substrate having a main surface with an area of 0.5 m 2 or larger, particularly of 1 m 2 or larger.
  • a large area substrate can be GEN 4.5, which corresponds to about 0.67 m 2 of substrate (0.73x0.92m), GEN 5, which corresponds to about 1.4 m 2 of substrate (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 of substrate (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m 2 of substrate (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 of substrate (2.85 m x 3.05 m).
  • the substrate thickness can be from 0.1 to 1.8 mm, particularly about 0.9 mm or below, such as 0.7 mm or 0.5 mm.
  • the carrier 200 includes a main body 210 for carrying the planar object.
  • a“main body for carrying the planar object” is to be understood as a carrier body including a frame or a plate which is configured for holding a planar object as described herein, e.g. a substrate or a mask.
  • the carrier includes a magnetic damping device 100 attached to the main body 210.
  • the magnetic damping device 100 is configured for damping carrier vibrations in a cross direction normal to the planar object.
  • the magnetic damping device 100 is configured and arranged for damping carrier vibrations in a cross direction to the transport direction 102.
  • Carrier vibrations may particularly occur due to changes of carrier transportation speeds, especially when a movement of the carrier is stopped.
  • the magnetic damping device of the carrier 200 can be a magnetic damping device 100 according to any embodiments described herein.
  • the carrier can include a reception 215 configured for receiving the magnetic damping device 100.
  • the magnetic damping device 100 can be arranged within the reception 215 provided in the main body of the carrier 200.
  • the reception 215 with the magnetic damping device 100 may be provided at a lower portion of the carrier 200, as exemplarily shown in FIGS. 4A and 4B.
  • the reception with the magnetic damping device may be provided at an upper portion of the carrier, e.g. as exemplarily shown in Fig. 4C.
  • the magnetic damping device 100 is fixed to an upper interior surface 216 of the reception 215.
  • the magnetic damping device 100 is rigidly fixed to the upper interior surface of the reception 215 by a fixation assembly as described herein.
  • the carrier 200 may further include a first guiding device 211, schematically illustrated as a top bar, and a second guiding device 212, schematically illustrated as a bottom bar.
  • a“guiding device” may be understood as a device configured for guiding a carrier as described herein along a transportation path of a processing apparatus, e.g. an inline processing apparatus.
  • the transportation path can be a linear transportation path along which one or more deposition sources may be arranged.
  • the first guiding device 211 and/or the second guiding device 212 may be magnetic guiding devices for contactless interacting with a transport system for transporting the carrier, as exemplarily described with reference to FIG. 5A.
  • the carrier 200 may be provided with a plurality of magnetic damping devices.
  • a carrier with four magnetic damping devices is shown in FIG. 4C.
  • the carrier 200 may include two or more magnetic damping devices (e.g. a first magnetic damping device 100A and a second magnetic damping device 100B) at an upper portion of the carrier, e.g. in proximity to the first guiding device 211.
  • the carrier 200 may include two or more magnetic damping devices (e.g.
  • the two or more magnetic damping devices may include one or more magnetic damping devices having a different configuration (e.g. with respect to damping frequency, tilger mass, or spring properties) than the remaining other magnetic damping devices of the two or more magnetic damping devices.
  • a carrier can be provided which beneficially is configured for damping different frequencies.
  • the first magnetic damping device 100 A may be configured for damping a different frequency than the second magnetic damping device 100B.
  • third magnetic damping device 100C may be configured for damping a different frequency than the fourth magnetic damping device 100D.
  • each of the two or more magnetic damping devices i.e. the first magnetic damping device 100A and/or the second magnetic damping device 100B and/or third magnetic damping device 100C and/or the fourth magnetic damping device 100D can be configured for damping different frequencies.
  • the carrier 200 may include a first magnetic damping device 100 A rigidly fixed to an upper interior surface of a first reception 215A, e.g. provided at an upper left corner of the carrier 200, by a first fixation assembly 110A. Additionally or alternatively, the carrier 200 may include a second magnetic damping device 100B rigidly fixed to an upper interior surface of a second reception 215B, e.g. provided at an upper right comer of the carrier 200, by a second fixation assembly 110B. Additionally or alternatively, the carrier 200 may include a third magnetic damping device 100C rigidly fixed to an upper interior surface of a third reception 215C, e.g.
  • the carrier 200 may include a fourth magnetic damping device 100D rigidly fixed to an upper interior surface of a fourth reception 215D, e.g. provided at a lower left corner of the carrier 200, by a fourth fixation assembly 110D.
  • the transport system 300 includes a carrier 200 according to any embodiments described herein. Additionally, the transport system 300 includes at least one magnetic bearing 310 hold the carrier at the bearing.
  • the holding direction corresponds to the vertical direction 103.
  • the at least one magnetic bearing can be configured to exert a magnetic force on the carrier in a holding direction opposite to a gravitational force to contactlessly hold the carrier at the bearing.
  • the at least one magnetic bearing can be configured to provide a lateral side guiding, e.g. substantially in a cross direction to the gravitational force.
  • the transport system 300 includes a drive unit 320 for moving the carrier in the transport direction 102.
  • the term“transport direction” can be understood as the direction in which the carrier is transported along a transport path.
  • the transport direction can be an essentially horizontal direction.
  • the transport system can be a magnetic levitation system.
  • a“magnetic levitation system” can be understood as a system configured for holding an object, e.g. a carrier, in a contactless manner by using magnetic force.
  • the term“levitating” or“levitation” refers to a state of an object, e.g. a carrier carrying a substrate or a mask, wherein the object floats without mechanical contact or support.
  • moving or transporting an object refers to providing a driving force, e.g.
  • a force in a direction different from the levitation force wherein the object is moved from one position to another, different position, for example a different position along the transport direction.
  • a carrier carrying a substrate or a mask can be levitated, i.e. by a force counteracting gravity, and can be moved in a direction different from a direction parallel to gravity while being levitated.
  • the term“contactless” can be understood in the sense that a weight, e.g. the weight of a carrier, particularly the weight of a carrier carrying a substrate or a mask, is not held by a mechanical contact or mechanical forces, but is held by a magnetic force.
  • the term“contactless” as used throughout the description can be understood in that a carrier is held in a levitating or floating state using magnetic forces instead of mechanical forces, i.e. contact forces.
  • a“magnetic bearing” can be understood as a bearing configured for holding or supporting an object, e.g. a carrier as described herein, in a contactless manner, i.e. without physical contact.
  • the at least one magnetic bearing 310 as described herein may be configured to generate a magnetic force acting on the carrier 200, particularly in an essentially vertical direction 103, such that the carrier is contactlessly held at a predetermined distance from the magnetic bearing, as exemplarily shown in FIG. 5A.
  • a vertical direction is considered as a direction substantially parallel to the direction along which the force of gravity extends.
  • a vertical direction may deviate from exact verticality (the latter being defined by the gravitational force) by an angle of, e.g., up to 15 degrees.
  • the at least one magnetic bearing 310 includes one or more first actuators for contactlessly holding the carrier.
  • a“first actuator” of the at least one magnetic bearing can be understood as an active and controllable element of the magnetic bearings.
  • the one or more first actuators may include a controllable magnet such as an electromagnet.
  • the magnetic field of the one or more first actuators may be actively controllable for maintaining and / or adjusting the distance between the magnetic bearing and the carrier.
  • a“first actuator” of the at least one magnetic bearing can be understood as an element with a controllable and adjustable magnetic field to provide a magnetic levitation force acting on the carrier.
  • the one or more first actuators of the at least one magnetic bearing 310 are configured for contactlessly holding the carrier.
  • the first guiding device 211 of the carrier may include one or more first magnetic counterparts 241.
  • the one or more first magnetic counterparts 241 may magnetically interact with the one or more first actuators of the at least one magnetic bearing 310.
  • the one or more first magnetic counterparts 241 can be passive magnetic elements.
  • the one or more first magnetic counterparts may be made of a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.
  • the drive unit 320 includes one or more second actuators configured for contactlessly moving the carrier 200 in the transport direction 102.
  • a “drive unit” can be understood as a unit configured for moving an object, e.g. a carrier as described herein, in a contactless manner in the transport direction.
  • the drive unit as described herein may be configured to generate a magnetic force acting on the carrier in the transport direction.
  • the drive unit can be a linear motor.
  • the linear motor can be an iron-core linear motor.
  • the linear motor can be an ironless linear motor.
  • An ironless linear motor can be beneficial for avoiding a torsional moment on the carrier caused by vertical forces due to possible interaction of the passive magnetic elements of the carrier and the iron-core of the linear motor.
  • the one or more second actuators of the drive unit 320 can be one or more controllable magnets, e.g. electromagnets. Accordingly, the one or more second actuators may be actively controllable for exerting a moving force on the carrier in the transport direction.
  • the first guiding device 211 of the carrier may include one or more second magnetic counterparts 242.
  • the one or more second magnetic counterparts 242 may magnetically interact with the one or more second actuators of the drive unit 320.
  • the one or more second magnetic counterparts 242 can be passive magnetic elements.
  • the one or more second magnetic counterparts 242 may be made of a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.
  • the transport system 300 may include a contactless guiding arrangement 330, e.g. arranged and configured for contactless guiding of the carrier via magnetic interaction with the second guiding device 212 of the carrier.
  • the contactless guiding arrangement 330 can include one or more passive magnetic bearings.
  • the contactless guiding arrangement 330 and the second guiding device 212 may include passive magnetic elements, particularly arranged and configured for providing a lateral guiding, e.g. in FIG. 5 A a guiding in a cross direction of the transport direction 102, i.e. the damping direction 101. .
  • A“passive magnetic bearing” can be understood as a bearing having passive magnetic elements which are not subject to active control or adjustment, at least not during operation of the apparatus.
  • a passive magnetic bearing may be adapted for generating a magnetic field, e.g. a static magnetic field.
  • a passive magnetic bearing may not be configured for generating an adjustable magnetic field.
  • the magnetic elements of the one or more passive magnetic bearings may be made of a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.
  • a“passive magnetic element” or“passive magnet” as used herein may be understood as a magnet which is not actively controlled, e.g. via a feedback control.
  • a“passive magnetic element” or “passive magnet” may rather provide a side stabilization of the carrier without any feedback control.
  • a“passive magnetic element” or“passive magnet” as described herein may include one or more permanent magnets.
  • a“passive magnetic element” or “passive magnet” may include one or more electromagnets which may not be actively controlled.
  • the at least one magnetic bearing 310 may be configured to provide for a lateral side guiding, i.e. in a cross direction to the transport direction 102.
  • the at least one magnetic bearing 310 may include side guiding magnets 315.
  • the side guiding magnets 315 are passive magnets.
  • corresponding side guiding magnets 225 may be provided on the main body, as exemplarily shown in FIG. 5B.
  • the drive unit 320 for moving the carrier in the transport direction 102 may be provided at a lower side portion of the carrier 200, as exemplarily shown in FIG. 5B.
  • the drive unit 320 can be laterally arranged of a lower end of the carrier when the carrier is in a substantially vertical state as exemplarily shown in FIG. 5B.
  • the transport system may include one or more rollers 222 for supporting and/or guiding and/or transporting the carrier.
  • the one or more rollers 222 may be provided for contacting the bottom of the carrier 200 (shown in FIG. 5B) and/or a side of the carrier 200 (not explicitly shown).
  • the one or more rollers 222 are passive rollers.
  • the one or more rollers 222 can be active rollers. In particular, the active rollers can be used as drive unit.
  • the method includes exerting (represented by block 410 in FIG. 6) a magnetic force on the carrier in a holding direction opposite to a gravitational force to contactlessly hold the carrier. Additionally, the method includes moving (represented by block 420 in FIG. 6) the carrier in a transport direction. Further, the method includes damping (represented by block 430 in FIG. 6) carrier vibrations in a cross direction substantially perpendicular to the transport direction. Damping carrier vibrations includes passively dissipating energy of the carrier vibrations by using a magnetic damping device fixed to the carrier.
  • the method 400 of contactlessly transporting a carrier may include using a carrier 200 according to embodiments described herein, particularly a carrier including a magnetic damping device 100 as described herein.
  • the magnetic damping device as described herein is beneficially configured to be fixed to a carrier such that carrier vibrations in a cross direction substantially perpendicular to a transport direction of the carrier can be damped, particularly by passively dissipating energy of the carrier vibrations.
  • a carrier, a transport system, as well as a method of contactlessly transporting a carrier can be provided which are improved compared to the state of the art, particularly with respect to accurate and smooth transportation.
  • embodiments of the present disclosure are particularly well suited for damping vibrations of carriers, e.g. substrate carriers or mask carriers, used in vacuum environments. Further, embodiments of the present disclosure provide for magnetic damping based on the physical principle of eddy-current losses, such that beneficially contactless and frictionless damping can be provided. Further, the embodiments of the present disclosure have the advantage that the energy of carrier vibrations can be dissipated passively, i.e. without providing an extra power supply. Accordingly, compared to the state of the art, embodiments of the present disclosure are particularly well suited for being used in vacuum environments, because there is no need for an atmospheric box for electric or electronic devices.
  • embodiments as described herein have the advantage of exhibiting temperature stable damping properties, particularly up to a temperature of 220°C. Moreover, it is to be noted that embodiments of the present disclosure are particularly well suited for damping low frequencies, e.g. frequencies f of f ⁇ 10 Hz.
  • Embodiments described herein provide an improved damping device for damping carrier vibrations, an improved carrier for carrying a planar object, an improved transport system for transporting a carrier, and an improved method of contactlessly transporting a carrier. While various specific embodiments have been disclosed in the foregoing, mutually non-exclusive features of the embodiments described above may be combined with each other.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Vibration Prevention Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne également un dispositif d'amortissement magnétique (100) destiné à amortir les vibrations d'un support. Le dispositif d'amortissement magnétique (100) comprend un premier ensemble (110) comprenant au moins un élément de plaque conductrice (111). De plus, le dispositif d'amortissement magnétique (100) comprend un ensemble d'aimant (120) ayant au moins une fente (123) s'étendant dans une direction d'amortissement (101). Le ou les éléments de plaque conducteur (111) s'étendent au moins dans une fente (123). En outre, le dispositif d'amortissement magnétique (100) comprend un élément de masse (130) connecté à l'ensemble magnétique (120) et un dispositif à ressort (140) reliant l'élément de masse (130) au premier ensemble (110). De plus, l'invention concerne un support pour transporter un objet plan, un système de transport pour transporter un support, et une méthode de transport sans contact d'un support.
PCT/EP2018/078625 2018-10-18 2018-10-18 Dispositif d'amortissement magnétique pour amortir les vibrations d'un support; support pour porter un objet plan, système de transport pour transporter un support, et methode de transport sans contact d'un support WO2020078558A1 (fr)

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KR1020217014365A KR102519583B1 (ko) 2018-10-18 2018-10-18 평면형 대상물을 운반하기 위한 캐리어, 캐리어를 이송하기 위한 이송 시스템, 캐리어를 비접촉식으로 이송하는 방법, 및 코팅된 기판을 생산하는 방법
PCT/EP2018/078625 WO2020078558A1 (fr) 2018-10-18 2018-10-18 Dispositif d'amortissement magnétique pour amortir les vibrations d'un support; support pour porter un objet plan, système de transport pour transporter un support, et methode de transport sans contact d'un support
CN201880098437.XA CN112867878B (zh) 2018-10-18 2018-10-18 用于承载平面物体的载体、用于输送载体的输送系统、用于非接触式地输送载体的方法和用于生产涂布基板的方法

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PCT/EP2018/078625 WO2020078558A1 (fr) 2018-10-18 2018-10-18 Dispositif d'amortissement magnétique pour amortir les vibrations d'un support; support pour porter un objet plan, système de transport pour transporter un support, et methode de transport sans contact d'un support

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WO2022073613A1 (fr) * 2020-10-08 2022-04-14 Applied Materials, Inc. Système de transport de support, support s'y rapportant, appareil de traitement sous vide et procédé de transport d'un support dans une chambre à vide
WO2023118929A1 (fr) * 2021-12-21 2023-06-29 Applied Materials, Inc. Procédé d'inspection de système de transport de porteurs, appareil de traitement sous vide, programme informatique et support de stockage lisible par ordinateur

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WO2018166640A1 (fr) * 2017-03-16 2018-09-20 Applied Materials, Inc. Appareil de maintien, de positionnement et/ou de déplacement d'un objet et procédé de commande d'un appareil de maintien, de positionnement et/ou de déplacement d'un objet

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US20070051576A1 (en) * 2003-07-11 2007-03-08 Ikuo Shimoda Dynamic vibration absorber and dynamic vibration absorbing device using the same
EP1521352A1 (fr) * 2003-10-01 2005-04-06 Hutchinson Dispositif actif d'amortissement de vibrations d'un element vibrant
WO2018166640A1 (fr) * 2017-03-16 2018-09-20 Applied Materials, Inc. Appareil de maintien, de positionnement et/ou de déplacement d'un objet et procédé de commande d'un appareil de maintien, de positionnement et/ou de déplacement d'un objet

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Publication number Priority date Publication date Assignee Title
WO2022073613A1 (fr) * 2020-10-08 2022-04-14 Applied Materials, Inc. Système de transport de support, support s'y rapportant, appareil de traitement sous vide et procédé de transport d'un support dans une chambre à vide
WO2023118929A1 (fr) * 2021-12-21 2023-06-29 Applied Materials, Inc. Procédé d'inspection de système de transport de porteurs, appareil de traitement sous vide, programme informatique et support de stockage lisible par ordinateur

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CN112867878B (zh) 2023-06-13
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CN112867878A (zh) 2021-05-28

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