JP6740353B2 - 磁気浮上システム、磁気浮上システム用のキャリア、及び、磁気浮上システムを動作させる方法 - Google Patents
磁気浮上システム、磁気浮上システム用のキャリア、及び、磁気浮上システムを動作させる方法 Download PDFInfo
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
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Description
Claims (14)
- 真空システムを通してキャリアを搬送するよう構成された、磁気浮上システムであって、
基部構造体(110)と、
前記基部構造体(110)に対して移動可能なキャリア(120)と、
能動的に制御可能であるアクチュエータ(113)を備え、前記基部構造体(110)のところで前記キャリア(120)を非接触保持するよう構成された少なくとも1つの能動磁気軸受(112)と、を備え、
前記キャリア(120)が、前記基部構造体(110)と相互作用するよう構成された第1キャリア部(121)、及び、物体(10)を運ぶよう構成された第2キャリア部(122)を備え、前記第1キャリア部(121)と前記第2キャリア部(122)とは、可撓接続部(125)を介して互いに接続されており、
前記可撓接続部(125)が、ブリッジ構成要素(130)、前記ブリッジ構成要素と前記第1キャリア部(121)との間で作用する第1弾性構成要素(131)、及び、前記ブリッジ構成要素と前記第2キャリア部(122)との間で作用する第2弾性構成要素(132)を備える、磁気浮上システム。 - 前記可撓接続部(125)が、可撓性材料、特に弾性材料(126)を含む、請求項1に記載の磁気浮上システム。
- 前記第1キャリア部(121)が、部分的又は全体的に、前記第2キャリア部(122)の上方に配置されているキャリアヘッドである、請求項1又は2に記載の磁気浮上システム。
- 前記アクチュエータ(113)が前記基部構造体(110)に配置され、対応磁気部品(118)が前記第1キャリア部(121)に配置され、前記アクチュエータ(113)は、前記基部構造体(110)と前記キャリア(120)との間に所定の距離を維持するよう制御可能である、請求項1から3のいずれか一項に記載の磁気浮上システム。
- 前記可撓接続部(125)が、前記少なくとも1つの能動磁気軸受(112)が前記基部構造体(110)と前記キャリア(120)との間の距離を制御する方向と一致する第1方向(V)に、弾性変形可能である、請求項1から4のいずれか一項に記載の磁気浮上システム。
- 前記可撓接続部(125)が、前記第1キャリア部と前記第2キャリア部との間に間隙(124)が設けられるように、前記第1キャリア部(121)の下方に前記第2キャリア部(122)を保持する、請求項1から5のいずれか一項に記載の磁気浮上システム。
- 前記可撓接続部(125)が、第1ブリッジ構成要素(133)及び第2ブリッジ構成要素(134)を備え、前記第1キャリア部及び前記第2キャリア部が、前記第1ブリッジ構成要素(133)と前記第2ブリッジ構成要素(134)との間にクランプされる、請求項1から6のいずれか一項に記載の磁気浮上システム。
- 前記ブリッジ構成要素(130)が前記第1キャリア部(121)の第1開口、及び、前記第2キャリア部(122)の第2開口と係合し、前記第1弾性構成要素(131)が前記第1開口に配置され、前記第2弾性構成要素(132)が前記第2開口に配置され、特に、前記第1弾性構成要素(131)及び前記第2弾性構成要素(132)が弾性リングである、請求項1に記載の磁気浮上システム。
- 前記第2キャリア部(122)が、前記第2キャリア部(122)の保持部分(11)に前記物体(10)を保持するよう構成された装着デバイス(15)を備え、特に、前記装着デバイス(15)が静電チャック又は磁気チャックを含む、請求項1から8のいずれか一項に記載の磁気浮上システム。
- 前記キャリア(120)が、実質的に垂直な向きで基板又はマスクを保持するよう構成された、基板キャリア又はマスクキャリアである、請求項1から9のいずれか一項に記載の磁気浮上システム。
- 請求項1から10のいずれか一項に記載の前記磁気浮上システム用のキャリア(120)であって、
真空システムを通して前記キャリア(120)を搬送するよう構成されている前記磁気浮上システムの基部構造体(110)と相互作用するよう構成された、第1キャリア部(121)、及び、
物体(10)を運ぶよう構成された、第2キャリア部(122)を備え、前記第1キャリア部(121)と前記第2キャリア部(122)とは、可撓接続部(125)を介して互いに接続される、キャリア(120)。 - 磁気浮上システムを動作させる方法であって、
可撓接続部(125)を介して互いに接続された第1キャリア部(121)と第2キャリア部(122)とを備えるキャリアを提供することと、
前記第2キャリア部(122)に物体(10)を配置することと、
能動的に制御可能であるアクチュエータ(113)を備える少なくとも1つの能動磁気軸受(112)を用いて、基部構造体(110)のところで前記キャリアを非接触保持することであって、前記第1キャリア部(121)が前記基部構造体(110)と相互作用する、非接触保持することと、
前記キャリアを、前記基部構造体のところで保持しつつ、真空チャンバを通して搬送することと、を含み、
前記可撓接続部(125)が、ブリッジ構成要素(130)、前記ブリッジ構成要素と前記第1キャリア部(121)との間で作用する第1弾性構成要素(131)、及び、前記ブリッジ構成要素と前記第2キャリア部(122)との間で作用する第2弾性構成要素(132)を備える、方法。 - 前記可撓接続部(125)が第1方向(V)に、特に実質的に垂直な方向に、可撓性であり、前記少なくとも1つの能動磁気軸受(112)が、前記第1方向(V)において前記基部構造体と前記キャリアとの間の距離を制御する、請求項12に記載の方法。
- 堆積エリア内に前記キャリアを位置付けることと、
前記キャリアによって運ばれる前記物体(10)に、コーティング材を堆積させることと、を更に含む、請求項12又は13に記載の方法。
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PCT/EP2017/068514 WO2019015783A1 (en) | 2017-07-21 | 2017-07-21 | MAGNETIC LEVITATION SYSTEM, MAGNETIC LEVITATION SYSTEM HOLDER AND METHOD FOR IMPLEMENTING MAGNETIC LEVITATION SYSTEM |
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JP2019527923A JP2019527923A (ja) | 2019-10-03 |
JP6740353B2 true JP6740353B2 (ja) | 2020-08-12 |
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KR (1) | KR102174195B1 (ja) |
CN (1) | CN109643680B (ja) |
TW (1) | TW201921563A (ja) |
WO (1) | WO2019015783A1 (ja) |
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CN113574650A (zh) * | 2019-03-01 | 2021-10-29 | 应用材料公司 | 磁悬浮系统、用于磁悬浮系统的载体和操作磁悬浮系统的方法 |
WO2020192911A1 (en) * | 2019-03-27 | 2020-10-01 | Applied Materials, Inc. | Magnetic levitation system and method of measuring a distance between at least one electromagnetic actuator and a ferromagnetic element |
CN113710828A (zh) * | 2019-04-29 | 2021-11-26 | 应用材料公司 | 磁悬浮系统、磁悬浮系统的基座和载体以及悬浮载体的方法 |
WO2020228939A1 (en) * | 2019-05-13 | 2020-11-19 | Applied Materials, Inc. | Magnetic levitation system, base structure of a magnetic levitation system, and method of transporting a carrier |
CN112744596B (zh) * | 2019-10-31 | 2022-06-07 | 联策科技股份有限公司 | 基板输送装置 |
TWI722959B (zh) * | 2020-08-20 | 2021-03-21 | 欣興電子股份有限公司 | 晶片封裝結構 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH01168038A (ja) * | 1987-12-24 | 1989-07-03 | Toshiba Corp | 磁気浮上式案内装置 |
JPH04121936U (ja) * | 1991-04-17 | 1992-10-30 | 三菱重工業株式会社 | 交流磁気浮上搬送装置 |
JP3635342B2 (ja) * | 1993-05-11 | 2005-04-06 | 毅 水野 | 磁気浮上装置 |
JP3797568B2 (ja) * | 1996-03-28 | 2006-07-19 | エイチ・エス・エス・ティ開発株式会社 | リニアモーターカー用軌道 |
JPH11354617A (ja) * | 1998-06-10 | 1999-12-24 | Sumiere Sez Kk | 基板処理装置および基板処理方法 |
JP2003309164A (ja) * | 2002-04-17 | 2003-10-31 | Mitsubishi Heavy Ind Ltd | 搬送装置 |
JP4273845B2 (ja) * | 2003-06-06 | 2009-06-03 | 株式会社Ihi | 搬送装置 |
JP4429825B2 (ja) * | 2004-06-30 | 2010-03-10 | 東京エレクトロン株式会社 | 基板処理装置 |
KR20080046761A (ko) * | 2006-11-23 | 2008-05-28 | 엘지디스플레이 주식회사 | 기판이송장치 및 이를 구비하는 박막 형성 장치 |
JP2012001283A (ja) * | 2008-09-05 | 2012-01-05 | Canon Anelva Corp | 基板搬送装置及び真空処理装置 |
EP2450758B1 (fr) * | 2010-11-09 | 2017-01-04 | Montres Breguet SA | Pivot magnétique et pivot électrostatique |
KR102200021B1 (ko) * | 2013-12-02 | 2021-01-07 | 엘지디스플레이 주식회사 | 자기부상반송장치 및 이의 동작방법 |
CN108138314A (zh) * | 2015-09-21 | 2018-06-08 | 应用材料公司 | 基板载体、以及溅射沉积设备和其使用方法 |
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- 2017-07-21 CN CN201780043005.4A patent/CN109643680B/zh active Active
- 2017-07-21 WO PCT/EP2017/068514 patent/WO2019015783A1/en active Application Filing
- 2017-07-21 KR KR1020187021017A patent/KR102174195B1/ko active IP Right Grant
- 2017-07-21 JP JP2018535108A patent/JP6740353B2/ja active Active
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CN109643680B (zh) | 2023-03-28 |
CN109643680A (zh) | 2019-04-16 |
KR20190010525A (ko) | 2019-01-30 |
WO2019015783A1 (en) | 2019-01-24 |
KR102174195B1 (ko) | 2020-11-04 |
JP2019527923A (ja) | 2019-10-03 |
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