WO2020063429A1

WO2020063429A1 - Air inlet apparatus for atomic layer deposition process and atomic layer deposition device

Info

Publication number: WO2020063429A1
Application number: PCT/CN2019/106581
Authority: WO
Inventors: 魏景峰; 荣延栋; 傅新宇
Original assignee: 北京北方华创微电子装备有限公司
Priority date: 2018-09-29
Filing date: 2019-09-19
Publication date: 2020-04-02
Also published as: SG11202102152WA; TW202012694A; KR20210033538A; KR102450731B1; JP2021535962A; JP7124213B2; TWI733196B

Abstract

Disclosed in embodiments of the present invention are an air inlet apparatus for an atomic layer deposition process and an atomic layer deposition device. The air inlet apparatus comprises an air inlet body. At least two cavities, air inlet channels, and at least two air distribution channels are provided in the air inlet body, wherein the at least two cavities are isolated from each other, each cavity has an air inlet, and the air inlet is connected to a precursor pipeline, each air distribution channel is used for communicating the cavities with the air inlet channels in one-to-one correspondence, and the air inlet channel is communicated with a process chamber. The technical solutions of the air inlet apparatus for an atomic layer deposition process and the atomic layer deposition device provided by the present invention can avoid different precursors from mixing to carry out the chemical reaction due to share of a buffer chamber, so that sediment particles formed by reacting in the air inlet apparatus can be effectively reduced, failure of the air inlet apparatus is avoided, the preliminary air distribution effect can be improved, and the maintenance period is prolonged.

Description

Air inlet device and atomic layer deposition equipment for atomic layer deposition process

Technical field

The invention relates to the technical field of semiconductor manufacturing, and in particular, to an air intake device and an atomic layer deposition device used in an atomic layer deposition process.

Background technique

Atomic Layer Deposition (hereinafter referred to as ALD) technology is a method that can deposit substances on the surface of a substrate layer by layer in the form of a single atomic film. The growth process has a periodicity, and a preparation cycle generally includes two self-limiting reactions. (Self-limitreaction). Under a certain temperature condition, a first reaction precursor (Precursor) is first introduced into the reaction chamber, and molecules of the precursor will adsorb (mainly by chemical adsorption) to form active agents (Species) on the substrate surface; When the adsorption of the precursor is saturated, the chemisorption reaction ends, and the self-limiting control of the reaction of the first precursor with the substrate surface is achieved (the first self-limiting reaction); then, the reaction is removed by a certain method (Purge) The first precursor remaining in the chamber (also generally includes a by-product of the reaction of the first precursor with the surface of the substrate), and passed into the second reaction precursor; the second precursor and the substrate already adsorbed on the substrate The surface active agent (the first precursor) undergoes a chemical reaction to form a single molecular layer of the thin film to be prepared on the surface of the substrate, and releases a gaseous by-product.

As shown in Figure 1, taking the two precursors as SiH ₄ and WF ₆ as an example, SiH ₄ and WF ₆ are alternately passed into the cavity under the control of a quick-change valve installed on the respective pipeline, and, Gas flow controllers (Mass Flow Controllers, MFC for short) are also provided on the respective pipelines of SiH ₄ and WF ₆ to control the gas flow into the cavity. In addition, a shower head is arranged on the upper part of the cavity to play a role of uniform gas. For the above two precursors of the ALD process, once they meet, chemical reactions will occur immediately. Therefore, it is necessary to alternately enter the cavity in the form of pulses, and before reaching the substrate surface, it is necessary to isolate the two precursors as much as possible to prevent the two from reaching the A reaction occurs before the substrate.

In addition, an air inlet device, such as a buffer chamber, is usually provided on the side of the air inlet end of the uniform flow disk, but the existing air inlet device does not consider the separation of the two precursors. And it is easy to retain the precursors in the previous cycle in the air intake device, which causes the two precursors to react in the air intake device to form sediment particles after the accumulation of several cycles. These sediment particles can easily block the air intake holes. As a result, the air intake device fails, and a series of problems such as the failure to achieve the initial air homogenization effect and the shortening of the maintenance period may also occur.

Summary of the Invention

In view of this, embodiments of the present invention provide an air intake device and an atomic layer deposition device for an atomic layer deposition process.

According to an aspect of an embodiment of the present invention, an air intake device for an atomic layer deposition process is provided, which includes an air intake body, and at least two cavities, an air intake channel, and at least two are provided in the air intake body. Uniform air channel, where,

At least two of the cavities are isolated from each other, each of the cavities has an air inlet, and the air inlet is used to connect with the precursor pipeline;

Each of the air uniform channels is used to communicate each of the cavities with the air inlet channels one-to-one correspondingly;

The air inlet passage is used to communicate with a process chamber.

Optionally, the air intake body includes a first air intake block and a second air intake block; a first central through hole is provided in the first air intake block, and a second air intake block is provided in the first air intake block; There is a second central through hole, where,

At least a part of the first air inlet block is inserted in the second central through hole, and the first central through hole is used as the air inlet passage;

At least two annular gaps are formed between an inner wall of the second central through hole and an outer side wall of the first air inlet block, and are arranged at intervals along the axial direction of the first central through hole; the annular gap Used as the cavity;

The first air inlet block is further provided with at least two groups of air inlet holes, and the air inlet hole groups are used as the air distribution channels, and include at least one air inlet hole for connecting the air inlet hole with the air inlet hole. The annular gap corresponding to the group is in communication with the first central through hole.

Optionally, an annular groove is provided on an inner wall of the second central through hole, and the annular groove and the outer side wall of the first air intake block form the annular gap; or,

An annular groove is provided on an outer side wall of the first air intake block, and the annular groove and an inner wall of the second central through hole form the annular gap; or,

A first annular groove is provided on an inner wall of the second central through hole, and a second annular groove is correspondingly provided on an outer side wall of the first air intake block. The first annular groove and the first Two annular grooves constitute the annular gap.

Optionally, there are multiple air intake holes in each group of the air intake hole groups, and they are evenly distributed around the axis of the first central through hole.

Optionally, the hole diameter of each of the air inlet holes is less than 4 mm.

Optionally, an annular sealing element is provided between the inner wall of the second central through hole and the outer side wall of the first air intake block and between each adjacent two of the annular gaps. The two adjacent annular gaps are hermetically isolated.

Optionally, the annular sealing element includes a fluorine rubber sealing ring or an engineering plastic sealing ring.

Optionally, a connection flange is provided on an outer side wall of the first air inlet block, the connection flange is fixedly connected to the second air inlet block, and a first connection end face of the connection flange overlaps It is placed on the second connection end face where the air inlet end of the second central through hole of the second air inlet block is located, and a sealing structure is provided between the first connection end face and the second connection end face. .

Optionally, the sealing structure includes a sealing ring or a vacuum flange.

Optionally, the second central through hole is a stepped hole, and the stepped hole includes a first stepped hole section and a second stepped hole section which are sequentially arranged along the air intake direction, and the diameter of the first stepped hole section is larger than that of the stepped hole. The diameter of the second stepped hole segment, at least a part of the first air inlet block is inserted in the first stepped hole segment; the first central through hole and the second stepped hole segment together constitute the Intake channel.

Optionally, the first central through hole is coaxially disposed with the second stepped hole segment, and the apertures are the same.

Optionally, an inclined chamfer is provided at an end where the first air inlet block of the second central through hole is inserted.

According to another aspect of the embodiments of the present invention, an atomic layer deposition apparatus is further provided, including:

Uniform flow nozzle, set in the process chamber;

At least two precursor pipelines, and different said precursor pipelines are used to transport different precursors; and

The above-mentioned air inlet device provided by the present invention, wherein each of the cavities has an air inlet, and the air inlet is used to be connected with a corresponding pipeline of the precursor; the air inlet channel passes through the uniform A flow nozzle is in communication with the process chamber.

The air inlet device for the atomic layer deposition process provided by the present invention can isolate each cavity connected to different precursor pipelines from each other, so that each cavity can be used as a special buffer cavity of a precursor, thereby It can avoid the occurrence of chemical reactions caused by the mixing of different precursors due to the shared buffer cavity, which can effectively reduce the sediment particles formed by the reaction in the air intake device, avoid the failure of the air intake device, and at the same time, improve the preliminary air homogenization effect and extend the maintenance period .

The atomic layer deposition equipment provided by the present invention, by using the above-mentioned air intake device provided by the present invention, can avoid the occurrence of chemical reactions caused by the mixing of different precursors due to the shared buffer cavity, and can effectively reduce the deposition formed by the reaction in the air intake device Particles to avoid the failure of the air intake device, and at the same time, it can improve the preliminary air homogenization effect and extend the maintenance period.

Additional aspects and advantages of the embodiments of the present invention will be given in the following description, which will become apparent from the following description or be learned through the practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description These are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without paying creative labor:

FIG. 1 is a schematic diagram of an intake structure of an existing atomic layer deposition device;

2 is a schematic structural diagram of an air intake device for an atomic layer deposition process according to an embodiment of the present invention;

3 is a cross-sectional view taken along line A-A of FIG. 2;

4 is a cross-sectional view of a first air intake block used in an embodiment of the present invention;

5 is a cross-sectional view of a second air intake block used in an embodiment of the present invention;

Fig. 6 is a sectional view taken along line B-B of Fig. 2;

7 is a cross-sectional view taken along the line C-C of FIG. 3;

8 is a schematic diagram of a sealing structure used in an embodiment of the present invention;

FIG. 9 is another schematic diagram of a sealing structure used in an embodiment of the present invention.

detailed description

The invention is described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are described. In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. The technical solution of the present invention will be described in various aspects with reference to the drawings and embodiments.

For the convenience of description, the "left", "right", "up", and "down" referred to in the following are consistent with the left, right, up, and down directions of the drawing itself. The terms "first" and "second" in the following are only used to describe the differences and have no other special meanings.

An embodiment of the present invention provides an air intake device for an atomic layer deposition process. The air intake device includes an air intake body. The air intake body is provided with at least two cavities, an air intake channel, and at least two air uniform channels. , At least two cavities are isolated from each other, each cavity has an air inlet, which is used to connect with the precursor pipeline; each air uniform channel is used for one-to-one correspondence between each cavity and the cavity The air inlet channel is used to communicate with the process chamber. Specifically, the air inlet channel is connected to a uniform flow nozzle (also known as a uniform flow disk) on the top of the process chamber, and is used to connect the precursor through the uniform flow nozzle Conveying reaches the surface of the semiconductor substrate.

In the process of conveying a variety of different precursors by the air intake device, the multiple different precursors respectively enter the cavity through the air inlets of different cavities according to a certain process sequence. The cavity is used as a buffer cavity to play a preliminary role. The role of air homogenization; after that, the precursors in the cavity enter the air inlet channel through the air homogenization channel communicating with the cavity, and enter the process chamber through the air inlet channel.

Therefore, by isolating different cavities from each other, each cavity can be used as a dedicated buffer cavity of a precursor by connecting the air inlet of each cavity to a different precursor pipeline, thereby avoiding Due to the common buffer cavity, different precursors are mixed and chemically reacted, which can effectively reduce the sediment particles formed by the reaction in the air intake device, avoid the failure of the air intake device, and at the same time, it can improve the preliminary air homogenization effect and extend the maintenance period.

The following uses two different precursors as examples to describe in detail the air intake device provided in this embodiment. Please refer to FIGS. 2 to 7 together. The air intake body includes a first air intake block 1 and a second air intake block 2. Optionally, the material of the first air inlet block 1 is aluminum alloy or stainless steel, and the material of the second air inlet block 2 is aluminum alloy or stainless steel. A first central through hole 20 is provided in the first air intake block 1, and a second central through hole is provided in the second air intake block 2, wherein at least a part of the first air intake block 1 is inserted in the second Inside the central through hole, and the first central through hole 20 is used as the above-mentioned air inlet passage for communicating with the process chamber.

Two annular gaps are formed between the inner wall of the second central through hole and the outer side wall of the first air inlet block 1, and are arranged along the axial direction of the first central through hole 20, specifically, the first annular gap 5 and the Below it are second annular gaps 6; each annular gap serves as the aforementioned cavity.

The aforementioned annular gap can be implemented in various ways. For example, two annular grooves 17 are provided on the outer side wall 18 of the first air intake block 1 along the axial interval, and the two and the inner wall of the second central through hole form the first annular gap 5 and the second annular gap, respectively. 6. Of course, in practical applications, an annular groove may also be provided on the inner wall of the second central through hole, and the annular groove forms an annular gap with the outer side wall 18 of the first air inlet block 1; A first annular groove is provided on the inner wall of the through hole, and a second annular groove is correspondingly provided on the outer side wall 18 of the first air inlet block 1. The first annular groove and the second annular groove constitute the aforementioned annular gap.

There are also two sets of air intake groups provided in the first air intake block 1. The air intake hole group is used as the above-mentioned air uniform passage, and includes at least one air intake hole, which is used to adjust the annular gap corresponding to the air intake hole group in which it is located. It is in communication with the first central through hole 20. In this embodiment, the two groups of air inlet holes are a first air inlet hole group and a second air inlet hole group. As shown in FIG. 7, the air inlet holes 7 in the first air hole group are multiple. And are uniformly distributed around the axis of the first central through-hole 20; similarly, there are a plurality of intake holes 8 in the second intake-hole group and are evenly distributed around the axis of the first central through-hole 20. In this way, the precursors in the annular gap can be made to enter the first central through hole 20 from each air inlet hole uniformly, so that a good air uniformity effect can be achieved.

Optionally, there are at least 3 air holes in each air hole group, for example, 6 air holes, etc. In this way, the uniform air effect can be further ensured.

Optionally, the hole diameter of each air inlet is less than 4mm. In this way, it is possible to prevent precursors in the annular gap from flowing out of the intake hole quickly because the intake hole is too large, so that the annular gap cannot achieve a good cushioning effect and affect the uniform air effect.

It should be noted that, in this embodiment, each air intake hole is horizontally disposed along the radial direction of the first central through hole 20, but the present invention is not limited to this. In practical applications, each air intake hole An angle may be formed with the radial direction of the first central through hole 20, and / or an angle may be formed with the radial cross section of the first central through hole 20. By designing the included angle, the flow direction of the gas flowing out of the air inlet can be changed to achieve the ideal air-homing effect. The included angle can be set according to specific needs, and the inclination direction of the air inlet hole with respect to the radial or radial section.

In this embodiment, as shown in FIG. 5, two air inlets are provided in the second air inlet block 2, which are a first air inlet 9 and a second air inlet 10, respectively. The hole wall of the second central through hole is in communication with the first annular gap 5 and the second annular gap 6, respectively; the air inlet ends of the two are located on the outer side wall of the second air inlet block 2 and are used for different front drive Material pipeline connection. As shown in FIG. 6, each of the first air inlet 9 and the second air inlet 10 is two, and the two first air inlets 9 (or the two second air inlets 10) are open relative to the first center. The axis of the hole 20 is arranged symmetrically, and two first air inlets 9 (or two second air inlets 10) are used to pass in precursors and diluent gases, respectively. Since the ALD process requires constant pressure, During the switching process, the total amount of intake air can be adjusted by diluting the gas, thereby ensuring constant pressure conditions inside the chamber and ensuring process stability. However, the present invention is not limited to this. In practical applications, the first air inlet 9 (or the second air inlet 10) may also be one or three or more.

In one embodiment, between the inner wall of the second central through hole and the outer side wall 18 of the first air inlet block 1, and located in each adjacent two annular gaps (ie, the first annular gap 5 and the second annular gap) An annular sealing element 3 is provided between the gaps 6) to seal and isolate two adjacent annular gaps. In addition, in this embodiment, an annular sealing element 3 is also provided below the second annular gap 6 to seal the gap between the first air inlet block 1 and the second central through hole at the lower portion of the second annular gap 6. . Optionally, the annular sealing element 3 may include a fluorine rubber sealing ring or an engineering plastic sealing ring, and the engineering plastic sealing ring is, for example, PTFE, PA, PFA, PU, or the like.

In one embodiment, the second central through hole is a stepped hole, and the stepped hole includes a first stepped hole section 21 and a second stepped hole section 22 which are sequentially arranged along the air intake direction. For the diameter of the two stepped hole sections 22, at least a part of the first air inlet block 1 is inserted into the first stepped hole section 21. The first central through-hole 20 and the second stepped hole section 22 together constitute an intake passage vertically disposed at the center.

Optionally, the first central through hole 20 and the second stepped hole section 22 are coaxially arranged and have the same aperture. In this way, the stability of the air flow can be guaranteed.

In one embodiment, as shown in FIG. 5, an inclined chamfer 11 is provided at an end where the first air inlet block 1 of the second central through hole is inserted, that is, the upper port of the first stepped hole section 21. With the chamfer 11, the opening size at the upper end of the first stepped hole section 21 can be enlarged, so that the ring-shaped sealing element 3 can be prevented from being scratched or damaged during the process of inserting the first air inlet block 1 into the first stepped hole section 21, And it is convenient for the first air intake block 1 to be smoothly inserted into the second air intake block 2.

In one embodiment, as shown in FIGS. 4 and 5, a connection flange 16 is provided on an outer side wall of the first air inlet block 1, and the connection flange 16 is fixedly connected to the second air inlet block 2 and is connected to The first connection end face 162 of the flange 16 is stacked on the second connection end face 211 where the air inlet end of the second central through hole of the second air inlet block 2 is located, and the first connection end face 162 and the second connection end face 211 A sealing structure 4 is provided therebetween. Specifically, a screw countersunk hole 161 is provided in the connection flange 16, and a threaded hole 19 is correspondingly provided on the second connection end face 211 of the second air inlet block 2. The screw is installed in the screw countersunk hole 161. And the corresponding screw hole 19 to realize the fixed connection between the connection flange 16 and the second air inlet block 2.

In practical applications, the above-mentioned sealing structure 4 includes a sealing ring or a vacuum flange. The sealing ring is, for example, an O-ring, and the vacuum flange is, for example, a KF / ISO vacuum flange or a CF vacuum flange. Specifically, as shown in FIG. 8, for the ISO vacuum flange, it includes a centering ring 12 and a hook screw 13. As shown in FIG. 9, for the CF vacuum flange, it includes a metal seal ring 14 such as a copper seal (Copper Seal) and the like.

In summary, the air intake device for the atomic layer deposition process provided by the embodiment of the present invention can isolate each cavity as a precursor by isolating different cavities communicating with different precursor pipelines from each other. Dedicated buffer cavity of the material, which can avoid the chemical reaction of different precursors due to the shared buffer cavity, which can effectively reduce the sediment particles formed by the reaction in the air intake device, avoid the failure of the air intake device, and improve the preliminary Uniform air effect to extend the maintenance period.

In one embodiment, according to another aspect of the embodiments of the present invention, an atomic layer deposition device is provided, which includes: a uniform flow nozzle set in a process chamber; at least two precursor pipes, and different precursor pipes The channels are used to transport different precursors; and the air intake device in any of the above embodiments, wherein the air inlets of different cavities are connected to different precursor pipelines; the air intake channels are connected to the process chamber through a uniform flow nozzle Room connected.

The air inlet device and the atomic layer deposition device for the atomic layer deposition process provided by the embodiment of the present invention are applicable to various ALD process equipment, such as ALDL, TiN, TaN, Al ₂ O _3, etc., and are also applicable to Thermal ALD and PEALD. .

The atomic layer deposition equipment provided by the embodiment of the present invention can avoid the occurrence of chemical reactions due to the mixing of different precursors due to the sharing of the buffer cavity by using the above-mentioned air intake device provided by the embodiment of the present invention, thereby effectively reducing the number of The sediment particles formed by the reaction can avoid the failure of the air intake device, and at the same time, it can improve the preliminary air homogenization effect and extend the maintenance period.

Unless otherwise stated in any of the technical solutions disclosed in the present invention, if it discloses a numerical range, the disclosed numerical ranges are all preferred numerical ranges. Any person skilled in the art should understand that the preferred numerical ranges are merely Among the many values that can be implemented, the technical effect is obvious or representative. Because there are many values and cannot be exhausted, only some values are disclosed in the present invention to illustrate the technical solution of the present invention, and the values listed above should not limit the scope of protection of the invention.

At the same time, if the above-mentioned present invention discloses or relates to parts or structural parts that are fixedly connected to each other, unless otherwise stated, a fixed connection can be understood as: a detachably fixed connection (such as a bolt or screw connection), or It is understood as: non-removable fixed connection (such as riveting, welding), of course, the fixed connection to each other can also be replaced by an integrated structure (such as manufactured by integral molding using a casting process) (except that an integral molding process cannot obviously be used).

In addition, the terms used to indicate the positional relationship or shape applied in any of the above technical solutions disclosed in the present invention include, unless otherwise stated, their meanings including states, shapes, or shapes that are similar, similar, or close to each other. Any component provided by the present invention can be assembled from a plurality of separate components, or it can be a separate component manufactured by an integral molding process.

The above embodiments are only used to illustrate the technical solution of the present invention and are not limited thereto. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that specific embodiments of the present invention can still be performed. Modifications or equivalent replacements of some technical features; without departing from the spirit of the technical solution of the present invention, they should all be included in the scope of the technical solution claimed by the present invention.

The description of the present invention has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better explain the principles and practical applications of the invention, and to enable others of ordinary skill in the art to understand the invention to design various embodiments with various modifications as are suited to particular uses.

Claims

An air intake device for an atomic layer deposition process is characterized in that it includes an air intake body in which at least two cavities, an air intake channel and at least two air uniform channels are arranged, wherein,

At least two of the cavities are isolated from each other, each of the cavities has an air inlet, and the air inlet is used to connect with the precursor pipeline;

Each of the air uniform channels is used to communicate each of the cavities with the air inlet channels one-to-one correspondingly;

The air inlet passage is used to communicate with a process chamber.
The air intake device according to claim 1, wherein the air intake body comprises a first air intake block and a second air intake block; a first central through hole is provided in the first air intake block, A second central through hole is provided in the second air inlet block, wherein:

At least a part of the first air inlet block is inserted in the second central through hole, and the first central through hole is used as the air inlet passage;

At least two annular gaps are formed between an inner wall of the second central through hole and an outer side wall of the first air inlet block, and are arranged at intervals along the axial direction of the first central through hole; the annular gap Used as the cavity;

The first air inlet block is further provided with at least two groups of air inlet holes, and the air inlet hole groups are used as the air distribution channels, and include at least one air inlet hole for connecting the air inlet hole with the air inlet hole. The annular gap corresponding to the group is in communication with the first central through hole.
The air intake device according to claim 2, wherein an annular groove is provided on an inner wall of the second central through hole, and the annular groove and an outer side wall of the first intake block form the annular groove. Clearance; or,

An annular groove is provided on an outer side wall of the first air intake block, and the annular groove and an inner wall of the second center through hole form the annular gap; or,

A first annular groove is provided on an inner wall of the second central through hole, and a second annular groove is correspondingly provided on an outer side wall of the first air intake block. The first annular groove and the first Two annular grooves constitute the annular gap.
The air intake device according to claim 2, wherein there are a plurality of air intake holes in each group of the air intake hole groups, and they are evenly distributed around an axis of the first central through hole.
The air intake device according to claim 2, wherein a diameter of each of the air intake holes is less than 4 mm.
The air intake device according to claim 2, characterized in that between an inner wall of the second central through hole and an outer wall of the first air intake block, and located between two adjacent two of the rings An annular sealing element is provided between the gaps to seal and isolate two adjacent annular gaps.
The air intake device according to claim 6, wherein the annular sealing element comprises a fluorine rubber sealing ring or an engineering plastic sealing ring.
The air intake device according to claim 2, wherein a connection flange is provided on an outer side wall of the first air intake block, the connection flange is fixedly connected to the second air intake block, and The first connection end surface of the connection flange is superposed on the second connection end surface where the air inlet end of the second central through hole of the second air inlet block is located, and the first connection end surface and the A sealing structure is provided between the second connection end faces.
The air intake device according to claim 8, wherein the sealing structure comprises a sealing ring or a vacuum flange.
The air intake device according to claim 2, wherein the second central through hole is a stepped hole, and the stepped hole includes a first stepped hole section and a second stepped hole section which are sequentially arranged along the air intake direction, The diameter of the first stepped hole segment is larger than the diameter of the second stepped hole segment, and at least a part of the first air inlet block is inserted in the first stepped hole segment; the first central through hole and The second stepped hole sections collectively constitute the intake passage.
The air intake device according to claim 10, wherein the first central through hole and the second stepped hole section are coaxially arranged and have the same hole diameter.
The air intake device according to claim 2, wherein an inclined chamfer is provided at an end of the second air inlet block through which the first air intake block is inserted.
An atomic layer deposition device, comprising:

Uniform flow nozzle, set in the process chamber;

At least two precursor pipelines, and different said precursor pipelines are used to transport different precursors; and

The air intake device according to any one of claims 1 to 12, wherein each of the cavities has an air inlet, and the air inlet is used to connect with a corresponding pipeline of the precursor; the air inlet An air channel communicates with the process chamber through the uniform flow nozzle.