WO2020062258A1 - Sonde ultrasonore - Google Patents

Sonde ultrasonore Download PDF

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Publication number
WO2020062258A1
WO2020062258A1 PCT/CN2018/109130 CN2018109130W WO2020062258A1 WO 2020062258 A1 WO2020062258 A1 WO 2020062258A1 CN 2018109130 W CN2018109130 W CN 2018109130W WO 2020062258 A1 WO2020062258 A1 WO 2020062258A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
ultrasonic probe
block
conductive film
heat
Prior art date
Application number
PCT/CN2018/109130
Other languages
English (en)
Chinese (zh)
Inventor
王金池
吴飞
张�浩
郑洲
Original Assignee
深圳迈瑞生物医疗电子股份有限公司
深圳迈瑞科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳迈瑞生物医疗电子股份有限公司, 深圳迈瑞科技有限公司 filed Critical 深圳迈瑞生物医疗电子股份有限公司
Priority to PCT/CN2018/109130 priority Critical patent/WO2020062258A1/fr
Publication of WO2020062258A1 publication Critical patent/WO2020062258A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves

Definitions

  • the present application relates to medical detection equipment, and in particular, to an ultrasound probe.
  • Ultrasound probes are important components of ultrasound diagnostic imaging equipment. They mainly include sound windows, matching layers, piezoelectric layers, and backing blocks, as well as circuit boards that connect signals to ground.
  • the working principle of the ultrasound probe is to use the piezoelectric effect to convert the excitation electric pulse signal of the entire ultrasound machine into an ultrasound signal and enter the patient's body, and then convert the ultrasound echo signal reflected by the tissue into an electrical signal, thereby realizing the detection of the tissue.
  • the working ultrasonic probe will generate a large amount of heat, which will cause the temperature of the probe to rise. On the one hand, probe heat may affect the patient's personal safety.
  • the probe works in high temperature for a long time, it will accelerate the aging of the probe and shorten the life of the probe. From the perspective of medical detection and diagnosis, it is hoped that the detection depth of the probe can be improved.
  • Increasing the excitation voltage of the probe to the whole machine is an effective way to increase the depth of probe detection. However, increasing the excitation voltage will cause the probe to generate more heat. Therefore, probe fever seriously affects patient comfort, probe life, and performance.
  • the main reason for the heating of the ultrasonic probe is the incomplete conversion of the acoustic energy and electrical energy of the piezoelectric material, and the piezoelectric material is not a good conductor of heat, causing the heat to accumulate mainly in the middle position of the probe array element, and the heat in the middle of the probe is the largest.
  • the heat on both sides is small, and the heat source of the probe is not evenly distributed.
  • the existing heat dissipation schemes of ultrasonic probes have failed to solve the above problems well.
  • An embodiment provides an ultrasonic probe, which includes an acoustic window, a matching layer, a piezoelectric layer, and a backing block which are pasted together in sequence, and further includes a thermal conductive film, which is attached between the acoustic window and the matching layer or is disposed between Inside the sound window, and the thermally conductive film extends out of the sound window in the direction of the backing block.
  • the thermally conductive film passes through the acoustic window, and the thermally conductive film exits from one or more sides of the acoustic window.
  • the thermally conductive film is a flexible graphite film or a metal foil.
  • the thickness of the thermal conductive film is not greater than 50 microns.
  • the ultrasound probe further includes a thermally conductive side plate, which is adhered to one or more sides formed by the matching layer, the piezoelectric layer, and the backing block.
  • the thermal conductive film is attached between the thermal conductive side plate and a side surface formed by the matching layer, the piezoelectric layer, and the backing block.
  • the thermally conductive film is attached to the outer surface of the thermally conductive side plate.
  • the thermally conductive side plate is a metal plate or a graphite plate.
  • the thermally conductive side plate is an aluminum plate.
  • the ultrasound probe further includes a thermally conductive block, which is adhered to the back surface of the backing block opposite to the piezoelectric layer, and the side of the thermally conductive block is in contact with the thermally conductive film.
  • the thermally conductive block is attached to the back surface of the backing block opposite to the piezoelectric layer, and the side of the thermally conductive block is in contact with the thermally conductive side plate.
  • the thermally conductive block is a metal block or a graphite block.
  • the thermally conductive block is an aluminum block.
  • the heat conducting block and the heat conducting side plate are an integrated structure.
  • the thermally conductive film since the thermally conductive film is attached between the acoustic window and the matching layer or penetrates in the acoustic window, and the thermally conductive film extends out of the acoustic window in the direction of the backing block, the thermally conductive film can hold the inside of the ultrasonic probe.
  • the heat energy is transferred to the heat dissipation mechanism at the back end, which improves the heat dissipation effect and effectively solves the heating problem of the ultrasonic probe.
  • FIG. 1 is a schematic structural diagram of an ultrasonic probe with a thermally conductive film in an embodiment
  • FIG. 2 is a schematic structural diagram of an ultrasonic probe with a thermally conductive film in an embodiment
  • FIG. 3 is a schematic structural diagram of an ultrasonic probe having a thermally conductive film and a thermally conductive side plate in one embodiment
  • FIG. 4 is a schematic structural diagram of an ultrasonic probe having a thermally conductive film and a thermally conductive side plate in an embodiment
  • FIG. 5 is a schematic structural diagram of an ultrasonic probe having a thermally conductive film and a thermally conductive block in one embodiment
  • FIG. 6 is a schematic structural diagram of an ultrasonic probe having a thermally conductive film and a thermally conductive block in one embodiment
  • FIG. 7 is a schematic structural diagram of an ultrasonic probe having a thermally conductive film, a thermally conductive side plate, and a thermally conductive block in one embodiment
  • FIG. 8 is a schematic structural diagram of an ultrasonic probe having a thermally conductive film, a thermally conductive side plate, and a thermally conductive block in an embodiment.
  • the ultrasound probe provided in this embodiment is an important part of an ultrasound diagnostic imaging device.
  • the ultrasound probe is provided with a thermally conductive film inside.
  • the thermally conductive film fits between the acoustic window and the matching layer or is inserted in the acoustic window.
  • the thermally conductive film is flexible.
  • the graphite film and the flexible graphite film have the characteristics of high thermal conductivity, so that the thermal conductive film can transfer the thermal energy inside the ultrasonic probe to the heat dissipation mechanism at the back end, which improves the heat dissipation effect.
  • an ultrasonic probe is provided, and the ultrasonic probe mainly achieves the effect of speeding up heat dissipation through a thermally conductive film.
  • the ultrasonic probe of this embodiment mainly includes an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5, and a thermally conductive film 6.
  • the periphery of the acoustic window 2 has sides extending away from the detection end.
  • a groove is formed at the rear end of the sound window 2, and the matching layer 3, the piezoelectric layer 4, and the backing block 5 are sequentially attached to the groove at the rear end of the sound window 2.
  • the thermal conductive film 6 is attached between the acoustic window 2 and the matching layer 3, and the thermal conductive film 6 extends out of the acoustic window 2 toward the backing block 5.
  • the thermal conductive film 6 can be extended to be connected to a heat dissipation mechanism located at the rear of the ultrasonic probe, The thermal energy inside the ultrasonic probe is transferred to a heat dissipation mechanism to improve heat dissipation efficiency.
  • the thermally conductive film 6 extends along two opposite sides formed by the matching layer 3, the piezoelectric layer 4, and the backing block 5, and the thermally conductive film 6 is in contact with the matching layer 3, the piezoelectric layer 4, and the backing block 5.
  • the two opposite sides formed are compounded together.
  • the thermally conductive film 6 can simultaneously transfer heat from the sides of the matching layer 3, the piezoelectric layer 4 and the backing block 5 to the heat dissipation mechanism.
  • the thermally conductive film 6 is preferably a flexible graphite film with a high thermal conductivity, and a metal foil with a high thermal conductivity can also be used.
  • Flexible graphite film has super high thermal conductivity in the X and Y directions (plane direction), which is 1500 ⁇ 1800W / m • K, while the thermal conductivity in the Z direction (thickness direction) is only 15 W / m • K.
  • the graphite film can guide the heat to the rear end of the ultrasonic probe along the plane of the flexible graphite film, and at the same time, it can block the conduction of the heat insulation amount in the Z direction, and can play a good thermal conductivity effect.
  • the thickness of the thermal conductive film 6 should be no more than 50 microns, further the thickness may be no greater than 25 microns, and further preferably the thickness is 17-25 microns.
  • the thermal conductive film 6 can be made of a ready-made foil and glued between the sound window 2 and the matching layer 3, or a thermal conductive film can be directly formed on the inner surface of the groove of the sound window 2 by using electroplating, PVD and other process methods.
  • the matching layer 3 can be prepared first, and the heat conductive film 6 can be attached to the matching layer 3, and then the acoustic window 2 can be attached to the heat conductive film 6; or the acoustic window 2 can be prepared first, and the heat conductive film 6 can be attached.
  • a matching layer 3 bonded to the thermally conductive film 6 is further prepared.
  • the thermally conductive film 6 is located inside the ultrasound probe and extends out of the ultrasound probe, and can transfer the heat inside the ultrasound probe to the heat dissipation mechanism at the back of the ultrasound probe, which improves the heat dissipation efficiency and enables the ultrasound probe to be used for a long time. Normal use.
  • the shape, size, etc. of the sound window can be designed according to actual conditions.
  • the acoustic window can also play a role of focusing ultrasound waves, which can be called an acoustic lens at this time.
  • an ultrasonic probe is provided.
  • the difference between the ultrasonic probe of this embodiment and the above-mentioned embodiment lies in the position of the thermal conductive film 6.
  • the thermal conductive film 6 of this embodiment is inserted into the acoustic window 2, and the thermal conductive film 6 is penetrated from both sides of the acoustic window 2 toward the backing block 5.
  • the extended thermal conductive film 6 is used for It is connected with a heat dissipation mechanism located at the back of the ultrasound probe, and transfers the heat energy inside the ultrasound probe to the heat dissipation mechanism to improve the heat dissipation efficiency.
  • the acoustic window 2 is divided into an outer layer and an inner layer, and the heat conducting film 6 is attached between the outer layer and the inner layer of the acoustic window 2.
  • the two sides of the heat conducting film 6 are compounded with the outer and inner layers of the acoustic window 2 respectively. together.
  • the preparation method of the sound window 2 is as follows: firstly, the inner layer of the sound window 2 is made by a mold; then, the heat conductive film 6 is attached to the upper surface of the inner layer; finally, the outer layer is prepared on the inner layer attached with the heat conductive film 6 by a mold Layer, and the outer layer is bonded to the thermally conductive film 6.
  • an outer layer may be prepared first, then the thermal conductive film 6 is bonded, and finally an inner layer is prepared.
  • the thermally conductive film 6 is inserted into the sound window 2, and the thermal energy inside the ultrasonic probe can also be transferred to the heat dissipation mechanism, which improves the heat dissipation efficiency.
  • the thermally conductive film 6 can also pass through one side, three sides, or four sides of the sound window 2 to meet the implementation requirements.
  • an ultrasonic probe is provided.
  • the ultrasonic probe of this embodiment is added with a thermally conductive side plate on the basis of the foregoing embodiment.
  • the thermally conductive side plate has one or more thermally conductive side plates.
  • the piezoelectric layer and the backing block are formed on one or more sides, and the thermally conductive side plate extends toward the rear end (away from the sound window 2) for contacting the thermally conductive film 6 and assisting the thermally conductive film 6 to transfer heat to improve Thermal efficiency.
  • the ultrasonic probe of this embodiment further includes a thermally conductive side plate 7.
  • the thermally conductive side plate 7 has two pieces, which are attached to two opposite layers formed by the matching layer 3, the piezoelectric layer 4, and the backing block 5.
  • the thermal conductive film 6 is attached between the thermal conductive side plate 7 and the side formed by the matching layer 3, the piezoelectric layer 4 and the backing block 5.
  • the thermal conductive side plate 7 and the thermal conductive film 6 extend to the rear end together for heat dissipation. Institutional connection.
  • the thermally conductive side plate 7 is a metal plate or a graphite plate, preferably an aluminum plate.
  • the aluminum plate has a higher thermal conductivity and a larger specific heat capacity, and has a better thermal conductivity effect.
  • the thermally conductive film 6 may also be attached to the outer surface of the thermally conductive side plate 7, that is, the thermally conductive side plate 7 is attached between the thermally conductive film 6 and the matching layer 3, the piezoelectric layer 4, and the backing block 5.
  • the heat-conducting side plate 7 also has the effect of assisting heat conduction.
  • an ultrasonic probe is provided.
  • the ultrasonic probe of this embodiment is added with a thermally conductive side plate on the basis of the foregoing embodiment.
  • the thermally conductive side plate has one or more thermally conductive side plates.
  • the piezoelectric layer and the backing block are formed on one or more sides, and the thermally conductive side plate extends toward the rear end for contacting the thermally conductive film 6 to assist the thermally conductive film 6 to transfer thermal energy to improve heat dissipation efficiency.
  • the ultrasonic probe of this embodiment further includes a thermally conductive side plate 7.
  • the thermally conductive side plate 7 has two pieces and is directly attached to two opposite sides formed by the matching layer 3, the piezoelectric layer 4, and the backing block 5.
  • one end of the heat conductive side plate 7 is in contact with the inner surface of the groove of the acoustic window 2 and the other end extends toward the rear end of the ultrasonic probe.
  • the heat conductive side plate 7 and the heat conductive film 6 respectively extend to the rear end and The rear heat dissipation mechanism is connected.
  • the thermally conductive side plate 7 is a metal plate or a graphite plate, preferably an aluminum plate.
  • the aluminum plate has a higher thermal conductivity and a larger specific heat capacity, and has a better thermal conductivity effect.
  • an ultrasonic probe is provided.
  • the ultrasonic probe of this embodiment is added with a thermally conductive block on the basis of the above embodiment.
  • the thermally conductive block is used to effectively prevent the temperature of the thermally conductive film from changing suddenly during the heat dissipation process to affect the heat dissipation effect.
  • the ultrasonic probe of this embodiment includes a thermally conductive block 8, which is attached to an end of the backing block 5 away from the piezoelectric layer 4, and two sides of the thermally conductive block 8 and the thermally conductive film 6. Close together.
  • the thermally conductive block 8 is a metal or graphite block with a high thermal conductivity and a large specific heat capacity, preferably an aluminum block.
  • the thermally conductive block 8 increases the thermal capacity of the thermally conductive film 6 so that the thermally conductive film 6 can avoid the influence of sudden temperature changes.
  • an ultrasonic probe is provided.
  • the ultrasonic probe of this embodiment is added with a heat conduction block on the basis of the above embodiment.
  • the heat conduction block is used to effectively prevent the temperature of the heat conducting film 6 and the heat conducting side plate 7 from changing suddenly during the heat dissipation process. And affect the cooling effect.
  • the ultrasonic probe of this embodiment includes a thermally conductive block 8, which is attached to an end of the backing block 5 away from the piezoelectric layer 4, and two sides of the thermally conductive block 8 are in contact with the thermally conductive film 6. Together, the two sides of the thermally conductive block 8 are sequentially bonded with a thermally conductive film 6 and a thermally conductive side plate 7.
  • the thermal block 8 is a metal block or graphite block with a high thermal conductivity and a large specific heat capacity, preferably an aluminum block.
  • the thermal block 8 increases the heat capacity of the thermal conductive film 6 and the thermal conductive side plate, so that the thermal conductive film 6 and the thermal conductive side plate can avoid temperature. Effect of mutation.
  • the heat conducting film 6 is located outside the heat conducting side plate 7, and both sides of the heat conducting block 8 are directly connected to the heat conducting side plate 7.
  • the heat conducting block 8 and the heat conducting side plate 7 Can be a one-piece structure.
  • the thermally conductive film 6 is located outside the thermally conductive side plate 7, the thermally conductive film 6 is attached to the outer surface of the thermally conductive side plate 7, and both sides of the thermally conductive block 8 are directly connected to the thermally conductive side plate 7.
  • the thermally conductive The block 8 and the thermally conductive side plate 7 may be an integrated structure.

Abstract

La présente invention concerne une sonde ultrasonore qui comprend une fenêtre acoustique (2), une couche d'adaptation (3), une couche piézoélectrique (4) et un bloc de support (5). La sonde ultrasonore comprend en outre un film thermoconducteur (6) collé entre la fenêtre acoustique (2) et la couche d'adaptation (3) ou disposé à l'intérieur de la fenêtre acoustique (2). Le film thermoconducteur (6) s'étend hors de la fenêtre acoustique (2) dans une direction vers le bloc de support (5). Puisque le film thermoconducteur (6) est collé entre la fenêtre acoustique (2) et la couche d'adaptation (3) ou disposé à l'intérieur de la fenêtre acoustique (2), et s'étend hors de la fenêtre acoustique (2) dans la direction vers le bloc de support (5), le film thermoconducteur (6) peut transférer de la chaleur depuis l'intérieur de la sonde ultrasonore vers un mécanisme de dissipation de chaleur au niveau d'une extrémité arrière, permettant ainsi d'améliorer les performances de dissipation de chaleur, et de résoudre efficacement le problème de génération de chaleur des sondes ultrasonores.
PCT/CN2018/109130 2018-09-30 2018-09-30 Sonde ultrasonore WO2020062258A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/109130 WO2020062258A1 (fr) 2018-09-30 2018-09-30 Sonde ultrasonore

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Application Number Priority Date Filing Date Title
PCT/CN2018/109130 WO2020062258A1 (fr) 2018-09-30 2018-09-30 Sonde ultrasonore

Publications (1)

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WO2020062258A1 true WO2020062258A1 (fr) 2020-04-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11642105B2 (en) 2018-06-12 2023-05-09 Edan Instruments, Inc. Ultrasonic transducer, ultrasonic probe, and ultrasonic detection apparatus

Citations (9)

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Publication number Priority date Publication date Assignee Title
US5792058A (en) * 1993-09-07 1998-08-11 Acuson Corporation Broadband phased array transducer with wide bandwidth, high sensitivity and reduced cross-talk and method for manufacture thereof
US20040002655A1 (en) * 2002-06-27 2004-01-01 Acuson, A Siemens Company System and method for improved transducer thermal design using thermo-electric cooling
CN101103929A (zh) * 2006-07-10 2008-01-16 日本电波工业株式会社 超声波探头
CN101361664A (zh) * 2007-08-03 2009-02-11 迈瑞控股（香港）有限公司 诊断超声换能器
CN102371243A (zh) * 2010-07-09 2012-03-14 通用电气公司 超声换能器的热传递和声匹配层
CN102989654A (zh) * 2011-09-16 2013-03-27 通用电气公司 超声换能器的热传递和声匹配层
US20150011889A1 (en) * 2013-07-08 2015-01-08 Samsung Medison Co., Ltd. Ultrasonic probe and manufacturing method thereof
CN206473341U (zh) * 2016-11-28 2017-09-08 深圳市理邦精密仪器股份有限公司 超声探头
CN107205723A (zh) * 2015-02-06 2017-09-26 皇家飞利浦有限公司 用于超声换能器的热管理的系统、方法和设备

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5792058A (en) * 1993-09-07 1998-08-11 Acuson Corporation Broadband phased array transducer with wide bandwidth, high sensitivity and reduced cross-talk and method for manufacture thereof
US20040002655A1 (en) * 2002-06-27 2004-01-01 Acuson, A Siemens Company System and method for improved transducer thermal design using thermo-electric cooling
CN101103929A (zh) * 2006-07-10 2008-01-16 日本电波工业株式会社 超声波探头
CN101361664A (zh) * 2007-08-03 2009-02-11 迈瑞控股（香港）有限公司 诊断超声换能器
CN102371243A (zh) * 2010-07-09 2012-03-14 通用电气公司 超声换能器的热传递和声匹配层
CN102989654A (zh) * 2011-09-16 2013-03-27 通用电气公司 超声换能器的热传递和声匹配层
US20150011889A1 (en) * 2013-07-08 2015-01-08 Samsung Medison Co., Ltd. Ultrasonic probe and manufacturing method thereof
CN107205723A (zh) * 2015-02-06 2017-09-26 皇家飞利浦有限公司 用于超声换能器的热管理的系统、方法和设备
CN206473341U (zh) * 2016-11-28 2017-09-08 深圳市理邦精密仪器股份有限公司 超声探头

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11642105B2 (en) 2018-06-12 2023-05-09 Edan Instruments, Inc. Ultrasonic transducer, ultrasonic probe, and ultrasonic detection apparatus

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