WO2020062272A1 - Sonde échographique et sonde échographique réseau - Google Patents

Sonde échographique et sonde échographique réseau Download PDF

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Publication number
WO2020062272A1
WO2020062272A1 PCT/CN2018/109173 CN2018109173W WO2020062272A1 WO 2020062272 A1 WO2020062272 A1 WO 2020062272A1 CN 2018109173 W CN2018109173 W CN 2018109173W WO 2020062272 A1 WO2020062272 A1 WO 2020062272A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
backing block
ultrasonic probe
probe according
layer
Prior art date
Application number
PCT/CN2018/109173
Other languages
English (en)
Chinese (zh)
Inventor
王金池
吴飞
朱磊
张�浩
郑洲
Original Assignee
深圳迈瑞生物医疗电子股份有限公司
深圳迈瑞科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳迈瑞生物医疗电子股份有限公司, 深圳迈瑞科技有限公司 filed Critical 深圳迈瑞生物医疗电子股份有限公司
Priority to PCT/CN2018/109173 priority Critical patent/WO2020062272A1/fr
Publication of WO2020062272A1 publication Critical patent/WO2020062272A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves

Definitions

  • the present application relates to medical detection equipment, in particular to an ultrasonic probe and an area array ultrasonic probe.
  • Ultrasound probes are important components of ultrasound diagnostic imaging equipment. They mainly include sound windows, matching layers, piezoelectric layers, and backing blocks, as well as circuit boards that connect signals to ground.
  • the working principle of the ultrasound probe is to use the piezoelectric effect to convert the excitation electric pulse signal of the entire ultrasound machine into an ultrasound signal and enter the patient's body, and then convert the ultrasound echo signal reflected by the tissue into an electrical signal, thereby realizing the detection of the tissue.
  • the working ultrasonic probe will generate a large amount of heat, which will cause the temperature of the probe to rise. On the one hand, probe heat may affect the patient's personal safety.
  • the probe works in high temperature for a long time, it will accelerate the aging of the probe and shorten the life of the probe. From the perspective of medical detection and diagnosis, it is hoped that the detection depth of the probe can be improved.
  • Increasing the excitation voltage of the probe to the whole machine is an effective way to increase the depth of probe detection. However, increasing the excitation voltage will cause the probe to generate more heat. Therefore, probe fever seriously affects patient comfort, probe life, and performance.
  • the main reason for the heating of the ultrasonic probe is the incomplete conversion of the acoustic energy and electrical energy of the piezoelectric material, and the piezoelectric material is not a good conductor of heat, causing the heat to accumulate mainly in the middle position of the probe array element, and the heat in the middle of the probe is the largest.
  • the heat on both sides is small, and the heat source of the probe is not evenly distributed.
  • the existing heat dissipation schemes of ultrasonic probes have failed to solve the problem of probe heating.
  • an ultrasonic probe which includes a sound window, a matching layer, a piezoelectric layer, a backing block, and a heat dissipation base connected together in sequence, wherein at least a portion of the heat dissipation base extends to the backing. Inside the block and fits with the backing block.
  • the heat dissipation base is made of a metal or a graphite material.
  • the heat dissipating base includes a protruding tip, and the tip of the heat dissipating base extends into the backing block and fits with the backing block.
  • the heat dissipation base further includes a base portion, and the tip portion protrudes from the base portion.
  • the base portion includes a flat plate portion, and the pointed portion protrudes from a plate surface of the flat plate portion.
  • the tip includes at least two side surfaces that are inclined relative to the sides of the backing block and intersect each other.
  • the heat dissipating base includes a plurality of the pointed portions, and the plurality of pointed portions are arranged in a lateral direction and / or a longitudinal direction.
  • an FPC is further included, and the FPC is disposed between the piezoelectric layer and the backing block.
  • the tip of the tip is adjacent to or in contact with the piezoelectric layer.
  • the tip of the tip is adjacent to or in contact with the FPC.
  • a heat dissipation layer is provided between the piezoelectric layer and the backing block, and a top end of the tip portion is adjacent to or in contact with the heat dissipation layer.
  • a heat dissipation layer is provided between the FPC and the backing block, and a top end of the pointed portion is adjacent to or in contact with the heat dissipation layer.
  • a heat dissipation layer is provided between the piezoelectric layer and the FPC.
  • a heat dissipation layer is provided on a surface of the heat dissipation base which is in contact with the backing block.
  • a heat dissipation layer is provided on at least one surface of the backing block.
  • the heat dissipation layer is a heat dissipation film.
  • the heat dissipation film is a flexible graphite film.
  • the thickness of the thermal layer is not greater than 500 microns, or the thickness of the heat dissipation layer is not greater than 25 microns, or the thickness of the heat dissipation layer may be 17 to 25 microns.
  • the heat dissipation base further includes a side wall, and the side wall extends from the base to the backing block and is abutted with a side surface of the backing block.
  • the acoustic impedance of the heat dissipation base is the same as the acoustic impedance of the backing block, and the difference between the acoustic impedance of the heat dissipation base and the acoustic impedance of the backing block is less than 1 trillion Rayleigh, or The difference between the acoustic impedance of the seat and the acoustic impedance of the backing block is less than 0.2 trillion Rayleigh.
  • the acoustic impedance of the heat dissipation layer is the same as the acoustic impedance of the backing block, and the difference between the acoustic impedance of the heat dissipation layer and the acoustic impedance of the backing block is less than 1 trillion Rayleigh, or the acoustic impedance of the heat dissipation layer The difference between the impedance and the acoustic impedance of the backing block is less than 0.2 trillion Rayleigh.
  • a surface array ultrasound probe which includes an acoustic window, a matching layer, a piezoelectric layer, a backing block, and a heat dissipation base connected in sequence.
  • the piezoelectric layer includes a plurality of arrays arranged in a two-dimensional array. Array elements, wherein at least a part of the heat dissipation base extends into the backing block and is in conformity with the backing block.
  • a heat dissipation base is added to the bottom of the backing block, and at least a part of the heat dissipation base extends into the backing block and is attached to the backing block.
  • FIG. 1 is a schematic structural diagram of a heat dissipation base in an embodiment
  • FIG. 2-1 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 2-2 is a schematic structural diagram of an ultrasound probe in an embodiment
  • Figure 2-3 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 3 is a schematic structural diagram of a heat dissipation base having a heat dissipation layer in an embodiment
  • FIG. 4-1 is a schematic structural diagram of an ultrasound probe in an embodiment
  • 4-2 is a schematic structural diagram of an ultrasound probe in an embodiment
  • 4-3 is a schematic structural diagram of an ultrasonic probe in an embodiment
  • FIG. 5-1 is a schematic structural diagram of an ultrasound probe in an embodiment
  • 5-2 is a schematic structural diagram of an ultrasound probe in an embodiment
  • 5-3 is a schematic structural diagram of an ultrasound probe in an embodiment
  • 6-1 is a schematic structural diagram of an ultrasound probe in an embodiment
  • 6-2 is a schematic structural diagram of an ultrasound probe in an embodiment
  • FIG. 6-3 is a schematic structural diagram of an ultrasound probe in an embodiment.
  • the ultrasound probe provided in this embodiment is an important component of an ultrasound diagnostic imaging device.
  • a heat dissipation base is provided at the rear end of the ultrasound probe, and at least a part of the heat dissipation base extends into the backing block and communicates with the backing block. Backing blocks fit. In this way, the heat generated by the work in the piezoelectric layer can be effectively conducted to the back end of the probe and dissipated, so that the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be used normally for a long time.
  • the ultrasonic probe 1 of this embodiment mainly includes an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5 and The heat dissipation base 6, and at least a part of the heat dissipation base 6 extends into the backing block 5 and is in contact with the backing block 5.
  • the shape, size, etc. of the sound window can be designed according to actual conditions.
  • the acoustic window can also play a role of focusing ultrasound waves, which can be called an acoustic lens at this time.
  • the ultrasound probe 1 further includes an FPC, which is disposed between the piezoelectric layer and the backing block.
  • the ultrasound probe 1 may be an area array ultrasound probe, and the piezoelectric layer may include a plurality of array elements arranged in a two-dimensional array.
  • the heat dissipation base can be made of metal or graphite material, such as a metal or graphite material with high thermal conductivity, so it has good thermal conductivity. It can transfer and dissipate the thermal energy generated inside the ultrasound probe to the back end, which can improve heat dissipation efficiency. .
  • the cooling base can also play a role of stable support.
  • the acoustic impedance of the heat dissipation base is the same as the acoustic impedance of the backing block. In another embodiment, the difference between the acoustic impedance of the heat dissipation base and the acoustic impedance of the backing block is less than 1 trillion Rayleigh. In this way, by making the acoustic impedance of the heat dissipation base the same as or similar to the acoustic impedance of the backing block, the influence of the heat dissipation base on the acoustic performance of the probe can be effectively reduced.
  • the difference between the acoustic impedance of the heat-dissipating base and the acoustic impedance of the backing block may be less than 0.2 trillion Rayleigh, so as to more effectively reduce the influence of the heat-dissipating base on the acoustic performance of the probe.
  • the heat dissipation base 6 may include a protruding tip portion, and the tip portion of the heat dissipation base extends into the backing block 5 and fits the backing block 5.
  • the tip portion may include at least two side surfaces that are inclined with respect to the sides of the backing block 5 and intersect each other, and the side surfaces may conform to the backing block 5.
  • each of the tips shown in the left and middle figures in FIG. 1 includes two side surfaces that are inclined with respect to the sides of the backing block 5 and intersect each other.
  • the tip includes four side surfaces that are inclined with respect to the sides of the backing block 5 and intersect each other.
  • the side surface may be a flat surface or a curved surface.
  • the tip of the tip can be as close as possible to the piezoelectric layer 4 or directly contact the piezoelectric layer 4, or the tip of the tip can be as close as possible to the FPC or directly contact the FPC, or the tip of the tip can be placed as close as possible or directly to the
  • the heat dissipation layer between the piezoelectric layer 4 and the backing block 5, or the top of the tip can be as close as possible or directly contact the heat dissipation layer provided between the FPC and the backing block 5, so as to better generate the inside of the probe 1
  • the heat is transferred out.
  • the tip of the tip can be sharp, flat, or curved.
  • the heat dissipation base 6 may include a plurality of pointed portions.
  • the plurality of tips may be arranged in a single direction (for example, horizontal or vertical), or may be arranged in an array in multiple directions (for example, horizontal and vertical).
  • the horizontal and vertical directions here can be the width direction and the length direction of the backing block 5, respectively.
  • the direction in which the acoustic window 2, the matching layer 3, the piezoelectric layer 4, and the backing block 5 are arranged can be defined as the backing block 5.
  • the thickness direction is perpendicular to the aforementioned width direction and length direction.
  • the heat dissipation base may further include a base portion, and the tip portion protrudes from the base portion.
  • the base portion may include a flat plate portion, and the tip portion protrudes from the plate surface of the flat plate portion.
  • a surface of the heat dissipation base 6 that is in contact with the backing block 5 may further be provided with a heat dissipation layer 7.
  • the heat dissipation layer 7 may be a flexible graphite film.
  • the flexible graphite film has an extremely high thermal conductivity of 1500 to 1800 W / m ⁇ K, which is much higher than that of metal foils such as copper and aluminum, and can better conduct heat.
  • the heat-dissipating layer can also be made of other materials with ultra-high thermal conductivity.
  • the thickness of the heat dissipation layer can be relatively thin to reduce its impact on the acoustic performance of the probe.
  • the thinner the thickness of the heat dissipation layer the smaller its impact on the acoustic performance of the probe, but at the same time the smaller its thermal capacity, it can only store less heat, which will affect the heat dissipation performance.
  • the heat dissipation layer is disposed on the heat dissipation base, and the heat dissipation base has a large heat capacity and can store more heat conducted by the heat dissipation layer.
  • the heat dissipation layer 7 and the heat dissipation base 6 cooperate with each other, that is, the thickness of the heat dissipation layer can be minimized so as to minimize the influence on the acoustic performance of the probe, and sufficient heat capacity can be provided to provide good heat dissipation performance. Both the acoustic performance and heat dissipation performance of the probe are considered.
  • the thickness of the heat dissipation layer 7 may be not more than 500 microns. Further, in one embodiment, the thickness of the heat dissipation layer 7 may be not more than 25 microns. Furthermore, in one embodiment, the thickness of the heat dissipation layer 7 may be 17 to 25 micrometers.
  • a heat dissipation layer 8 may also be provided on at least one surface of the backing block 6.
  • the upper surface of the backing block 5 that is, the surface to be bonded to the piezoelectric layer 4 or the surface to be bonded to the FPC may be used. (Shown) and the other two opposite sides are provided with a heat dissipation layer 8.
  • the heat dissipation layer 8 can also be disposed on the upper surface of the backing block 5 and / or the other four sides opposite to each other, or other arrangements can be selected.
  • the heat dissipation layer 8 may be the flexible graphite film in the above embodiments, or other materials having a super high thermal conductivity. In this way, the heat distribution generated by the piezoelectric layer of the ultrasonic probe can be more uniform, and the heat dissipation effect is better.
  • a heat dissipation layer may be further provided between the FPC and the backing block, and a top end of the pointed portion is adjacent to or in contact with the heat dissipation layer.
  • a heat dissipation layer may be further provided between the piezoelectric layer and the FPC.
  • the heat dissipation layer may be the flexible graphite film in the above embodiments, or other materials with ultra-high thermal conductivity, which can better conduct heat.
  • the acoustic impedance of the heat dissipation layer may be equal to or similar to the acoustic impedance of the backing block.
  • the acoustic impedance of the heat dissipation layer may be the same as the acoustic impedance of the backing block, or the difference between the two is less than 1 trillion Rayleigh, The difference between the two is less than 0.2 trillion Rayleigh. In this way, the influence of the heat dissipation layer on the acoustic performance of the probe can be further reduced.
  • the heat dissipation base 6 may further include one or more side walls. As shown in FIGS. 5-1 to 5-3, the heat dissipation base 6 includes two opposite side walls, the side walls extending from the base to the backing block 5 and side surfaces of the backing block 5 fit. In one embodiment, the side wall of the heat dissipation base may also extend from a flat plate portion to the backing block 5 and fit on the side of the backing block 5. In addition, the number of the side walls of the heat dissipation base can also be one, three, or four, which can be designed as required.
  • a heat dissipation layer 7 is provided on a surface of the heat dissipation base 6 that is in contact with the backing block 5. At the same time, it is provided on the upper surface of the backing block 5 (that is, the surface that is bonded to the piezoelectric layer 4 or the surface that is bonded to the FPC, which is not shown in the FPC) and two other opposite sides.
  • Thermal layer 8 The heat dissipation layers 7 and 8 may be flexible graphite films, or other materials with ultra-high thermal conductivity.
  • the heat dissipating base 6 also includes two opposite side walls, the side walls extending from the base (or flat plate portion) toward the backing block 5 and conforming to two opposite sides of the backing block 5 provided with a heat dissipation layer.
  • other combinations can be used to achieve the desired heat dissipation effect.

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  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
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  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Engineering & Computer Science (AREA)
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  • Heart & Thoracic Surgery (AREA)
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Abstract

L'invention concerne une sonde échographique (1) comprenant une fenêtre sonore (2), une couche d'adaptation (3), une couche piézoélectrique (4), un bloc de support (5) et une base de dissipation de chaleur (6) qui sont reliés les uns aux autres de façon séquentielle, au moins une partie de la base de dissipation de chaleur (6) s'étendant dans le bloc de support (5) et étant liée au bloc de support (5). Ainsi, la chaleur produite par le fonctionnement de la sonde (1) est conduite efficacement vers l'extrémité arrière de la sonde (1) et dissipée, de sorte que l'effet de dissipation de chaleur de la sonde échographique (1) soit bon, ce qui garantit que ladite sonde (1) puisse être utilisée normalement pendant une longue durée.
PCT/CN2018/109173 2018-09-30 2018-09-30 Sonde échographique et sonde échographique réseau WO2020062272A1 (fr)

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PCT/CN2018/109173 WO2020062272A1 (fr) 2018-09-30 2018-09-30 Sonde échographique et sonde échographique réseau

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PCT/CN2018/109173 WO2020062272A1 (fr) 2018-09-30 2018-09-30 Sonde échographique et sonde échographique réseau

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11642105B2 (en) 2018-06-12 2023-05-09 Edan Instruments, Inc. Ultrasonic transducer, ultrasonic probe, and ultrasonic detection apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1859871A (zh) * 2003-09-30 2006-11-08 松下电器产业株式会社 超声波探头
JP2006325954A (ja) * 2005-05-26 2006-12-07 Toshiba Corp 超音波プローブ及び超音波診断装置
CN101103929A (zh) * 2006-07-10 2008-01-16 日本电波工业株式会社 超声波探头
CN102098965A (zh) * 2008-07-22 2011-06-15 人体扫描有限公司 具有热沉的超声波探头
CN206473341U (zh) * 2016-11-28 2017-09-08 深圳市理邦精密仪器股份有限公司 超声探头
CN206924084U (zh) * 2016-11-28 2018-01-26 深圳市理邦精密仪器股份有限公司 超声探头

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1859871A (zh) * 2003-09-30 2006-11-08 松下电器产业株式会社 超声波探头
JP2006325954A (ja) * 2005-05-26 2006-12-07 Toshiba Corp 超音波プローブ及び超音波診断装置
CN101103929A (zh) * 2006-07-10 2008-01-16 日本电波工业株式会社 超声波探头
CN102098965A (zh) * 2008-07-22 2011-06-15 人体扫描有限公司 具有热沉的超声波探头
CN206473341U (zh) * 2016-11-28 2017-09-08 深圳市理邦精密仪器股份有限公司 超声探头
CN206924084U (zh) * 2016-11-28 2018-01-26 深圳市理邦精密仪器股份有限公司 超声探头

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11642105B2 (en) 2018-06-12 2023-05-09 Edan Instruments, Inc. Ultrasonic transducer, ultrasonic probe, and ultrasonic detection apparatus

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