WO2020062272A1

WO2020062272A1 - Ultrasound probe and area array ultrasound probe

Info

Publication number: WO2020062272A1
Application number: PCT/CN2018/109173
Authority: WO
Inventors: 王金池; 吴飞; 朱磊; 张�浩; 郑洲
Original assignee: 深圳迈瑞生物医疗电子股份有限公司; 深圳迈瑞科技有限公司
Priority date: 2018-09-30
Filing date: 2018-09-30
Publication date: 2020-04-02

Abstract

An ultrasound probe (1), comprising a sound window (2), a matching layer (3), a piezoelectric layer (4), a backing block (5), and a heat dissipation base (6) which are sequentially bonded to together, wherein at least part of the heat dissipation base (6) extends into the backing block (5), and is bonded to the backing block (5). In this way, heat produced by working in the probe (1) is effectively conducted to the rear end of the probe (1) and dissipated, so that the heat dissipation effect of the ultrasound probe (1) is good, thereby ensuring the ultrasound probe (1) can be used normally for a long time.

Description

Ultrasound probe and area array ultrasound probe

Technical field

The present application relates to medical detection equipment, in particular to an ultrasonic probe and an area array ultrasonic probe.

Background technique

Ultrasound probes are important components of ultrasound diagnostic imaging equipment. They mainly include sound windows, matching layers, piezoelectric layers, and backing blocks, as well as circuit boards that connect signals to ground. The working principle of the ultrasound probe is to use the piezoelectric effect to convert the excitation electric pulse signal of the entire ultrasound machine into an ultrasound signal and enter the patient's body, and then convert the ultrasound echo signal reflected by the tissue into an electrical signal, thereby realizing the detection of the tissue. During the conversion of electro-acoustic signals, the working ultrasonic probe will generate a large amount of heat, which will cause the temperature of the probe to rise. On the one hand, probe heat may affect the patient's personal safety. On the other hand, if the probe works in high temperature for a long time, it will accelerate the aging of the probe and shorten the life of the probe. From the perspective of medical detection and diagnosis, it is hoped that the detection depth of the probe can be improved. Increasing the excitation voltage of the probe to the whole machine is an effective way to increase the depth of probe detection. However, increasing the excitation voltage will cause the probe to generate more heat. Therefore, probe fever seriously affects patient comfort, probe life, and performance.

Because the main reason for the heating of the ultrasonic probe is the incomplete conversion of the acoustic energy and electrical energy of the piezoelectric material, and the piezoelectric material is not a good conductor of heat, causing the heat to accumulate mainly in the middle position of the probe array element, and the heat in the middle of the probe is the largest. The heat on both sides is small, and the heat source of the probe is not evenly distributed. The existing heat dissipation schemes of ultrasonic probes have failed to solve the problem of probe heating.

Summary of the Invention

In one embodiment, an ultrasonic probe is provided, which includes a sound window, a matching layer, a piezoelectric layer, a backing block, and a heat dissipation base connected together in sequence, wherein at least a portion of the heat dissipation base extends to the backing. Inside the block and fits with the backing block.

In one embodiment, the heat dissipation base is made of a metal or a graphite material.

In one embodiment, the heat dissipating base includes a protruding tip, and the tip of the heat dissipating base extends into the backing block and fits with the backing block.

In one embodiment, the heat dissipation base further includes a base portion, and the tip portion protrudes from the base portion.

In one embodiment, the base portion includes a flat plate portion, and the pointed portion protrudes from a plate surface of the flat plate portion.

In one embodiment, the tip includes at least two side surfaces that are inclined relative to the sides of the backing block and intersect each other.

In one embodiment, the heat dissipating base includes a plurality of the pointed portions, and the plurality of pointed portions are arranged in a lateral direction and / or a longitudinal direction.

In one embodiment, an FPC is further included, and the FPC is disposed between the piezoelectric layer and the backing block.

In one embodiment, the tip of the tip is adjacent to or in contact with the piezoelectric layer.

In one embodiment, the tip of the tip is adjacent to or in contact with the FPC.

In one embodiment, a heat dissipation layer is provided between the piezoelectric layer and the backing block, and a top end of the tip portion is adjacent to or in contact with the heat dissipation layer.

In one embodiment, a heat dissipation layer is provided between the FPC and the backing block, and a top end of the pointed portion is adjacent to or in contact with the heat dissipation layer.

In one embodiment, a heat dissipation layer is provided between the piezoelectric layer and the FPC.

In one embodiment, a heat dissipation layer is provided on a surface of the heat dissipation base which is in contact with the backing block.

In one embodiment, a heat dissipation layer is provided on at least one surface of the backing block.

In one embodiment, the heat dissipation layer is a heat dissipation film.

In one embodiment, the heat dissipation film is a flexible graphite film.

In one embodiment, the thickness of the thermal layer is not greater than 500 microns, or the thickness of the heat dissipation layer is not greater than 25 microns, or the thickness of the heat dissipation layer may be 17 to 25 microns.

In one embodiment, the heat dissipation base further includes a side wall, and the side wall extends from the base to the backing block and is abutted with a side surface of the backing block.

In one embodiment, there are one or more side walls.

In one embodiment, the acoustic impedance of the heat dissipation base is the same as the acoustic impedance of the backing block, and the difference between the acoustic impedance of the heat dissipation base and the acoustic impedance of the backing block is less than 1 trillion Rayleigh, or The difference between the acoustic impedance of the seat and the acoustic impedance of the backing block is less than 0.2 trillion Rayleigh.

In one embodiment, the acoustic impedance of the heat dissipation layer is the same as the acoustic impedance of the backing block, and the difference between the acoustic impedance of the heat dissipation layer and the acoustic impedance of the backing block is less than 1 trillion Rayleigh, or the acoustic impedance of the heat dissipation layer The difference between the impedance and the acoustic impedance of the backing block is less than 0.2 trillion Rayleigh.

In one embodiment, a surface array ultrasound probe is provided, which includes an acoustic window, a matching layer, a piezoelectric layer, a backing block, and a heat dissipation base connected in sequence. The piezoelectric layer includes a plurality of arrays arranged in a two-dimensional array. Array elements, wherein at least a part of the heat dissipation base extends into the backing block and is in conformity with the backing block.

According to the ultrasonic probe according to the above embodiment, a heat dissipation base is added to the bottom of the backing block, and at least a part of the heat dissipation base extends into the backing block and is attached to the backing block. In this way, the heat generated by the work in the probe can be effectively conducted to the back end of the probe and dissipated, so that the heat radiation effect of the ultrasonic probe is good, and the ultrasonic probe can be used normally for a long time.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of a heat dissipation base in an embodiment; FIG.

FIG. 2-1 is a schematic structural diagram of an ultrasound probe in an embodiment; FIG.

2-2 is a schematic structural diagram of an ultrasound probe in an embodiment;

Figure 2-3 is a schematic structural diagram of an ultrasound probe in an embodiment;

3 is a schematic structural diagram of a heat dissipation base having a heat dissipation layer in an embodiment;

FIG. 4-1 is a schematic structural diagram of an ultrasound probe in an embodiment; FIG.

4-2 is a schematic structural diagram of an ultrasound probe in an embodiment;

4-3 is a schematic structural diagram of an ultrasonic probe in an embodiment;

FIG. 5-1 is a schematic structural diagram of an ultrasound probe in an embodiment; FIG.

5-2 is a schematic structural diagram of an ultrasound probe in an embodiment;

5-3 is a schematic structural diagram of an ultrasound probe in an embodiment;

6-1 is a schematic structural diagram of an ultrasound probe in an embodiment;

6-2 is a schematic structural diagram of an ultrasound probe in an embodiment;

FIG. 6-3 is a schematic structural diagram of an ultrasound probe in an embodiment.

detailed description

In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. At the same time, since known functions and constructions will be obscurely described in unnecessary detail, they will not be described in detail. In addition, the terms "connected" and "connected" in this application include direct and indirect connections (connected) unless otherwise specified.

The ultrasound probe provided in this embodiment is an important component of an ultrasound diagnostic imaging device. A heat dissipation base is provided at the rear end of the ultrasound probe, and at least a part of the heat dissipation base extends into the backing block and communicates with the backing block. Backing blocks fit. In this way, the heat generated by the work in the piezoelectric layer can be effectively conducted to the back end of the probe and dissipated, so that the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be used normally for a long time.

An ultrasonic probe is provided in this embodiment. As shown in FIGS. 2-1 to 2-3, the ultrasonic probe 1 of this embodiment mainly includes an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5 and The heat dissipation base 6, and at least a part of the heat dissipation base 6 extends into the backing block 5 and is in contact with the backing block 5.

In one embodiment, the shape, size, etc. of the sound window can be designed according to actual conditions. In some embodiments, the acoustic window can also play a role of focusing ultrasound waves, which can be called an acoustic lens at this time.

In one embodiment, the ultrasound probe 1 further includes an FPC, which is disposed between the piezoelectric layer and the backing block.

In one embodiment, the ultrasound probe 1 may be an area array ultrasound probe, and the piezoelectric layer may include a plurality of array elements arranged in a two-dimensional array.

The heat dissipation base can be made of metal or graphite material, such as a metal or graphite material with high thermal conductivity, so it has good thermal conductivity. It can transfer and dissipate the thermal energy generated inside the ultrasound probe to the back end, which can improve heat dissipation efficiency. . In addition, the cooling base can also play a role of stable support.

In one embodiment, the acoustic impedance of the heat dissipation base is the same as the acoustic impedance of the backing block. In another embodiment, the difference between the acoustic impedance of the heat dissipation base and the acoustic impedance of the backing block is less than 1 trillion Rayleigh. In this way, by making the acoustic impedance of the heat dissipation base the same as or similar to the acoustic impedance of the backing block, the influence of the heat dissipation base on the acoustic performance of the probe can be effectively reduced.

In one embodiment, the difference between the acoustic impedance of the heat-dissipating base and the acoustic impedance of the backing block may be less than 0.2 trillion Rayleigh, so as to more effectively reduce the influence of the heat-dissipating base on the acoustic performance of the probe.

Similarly, as shown in FIGS. 2-1 to 2-3, the heat dissipation base 6 may include a protruding tip portion, and the tip portion of the heat dissipation base extends into the backing block 5 and fits the backing block 5. For example, the tip portion may include at least two side surfaces that are inclined with respect to the sides of the backing block 5 and intersect each other, and the side surfaces may conform to the backing block 5. For example, each of the tips shown in the left and middle figures in FIG. 1 includes two side surfaces that are inclined with respect to the sides of the backing block 5 and intersect each other. The tip includes four side surfaces that are inclined with respect to the sides of the backing block 5 and intersect each other. Here, the side surface may be a flat surface or a curved surface.

The tip of the tip can be as close as possible to the piezoelectric layer 4 or directly contact the piezoelectric layer 4, or the tip of the tip can be as close as possible to the FPC or directly contact the FPC, or the tip of the tip can be placed as close as possible or directly to the The heat dissipation layer between the piezoelectric layer 4 and the backing block 5, or the top of the tip can be as close as possible or directly contact the heat dissipation layer provided between the FPC and the backing block 5, so as to better generate the inside of the probe 1 The heat is transferred out. The tip of the tip can be sharp, flat, or curved.

As shown in FIG. 1, the heat dissipation base 6 may include a plurality of pointed portions. The plurality of tips may be arranged in a single direction (for example, horizontal or vertical), or may be arranged in an array in multiple directions (for example, horizontal and vertical). The horizontal and vertical directions here can be the width direction and the length direction of the backing block 5, respectively. The direction in which the acoustic window 2, the matching layer 3, the piezoelectric layer 4, and the backing block 5 are arranged can be defined as the backing block 5. The thickness direction is perpendicular to the aforementioned width direction and length direction.

The size of the tip can also be designed as required. In addition, the heat dissipation base may further include a base portion, and the tip portion protrudes from the base portion. The base portion may include a flat plate portion, and the tip portion protrudes from the plate surface of the flat plate portion.

In one embodiment, as shown in FIG. 3, a surface of the heat dissipation base 6 that is in contact with the backing block 5 may further be provided with a heat dissipation layer 7. The heat dissipation layer 7 may be a flexible graphite film. Among them, the flexible graphite film has an extremely high thermal conductivity of 1500 to 1800 W / m · K, which is much higher than that of metal foils such as copper and aluminum, and can better conduct heat. In addition, the heat-dissipating layer can also be made of other materials with ultra-high thermal conductivity.

The thickness of the heat dissipation layer can be relatively thin to reduce its impact on the acoustic performance of the probe. The thinner the thickness of the heat dissipation layer, the smaller its impact on the acoustic performance of the probe, but at the same time the smaller its thermal capacity, it can only store less heat, which will affect the heat dissipation performance. In some embodiments of the present invention, the heat dissipation layer is disposed on the heat dissipation base, and the heat dissipation base has a large heat capacity and can store more heat conducted by the heat dissipation layer. Therefore, the heat dissipation layer 7 and the heat dissipation base 6 cooperate with each other, that is, the thickness of the heat dissipation layer can be minimized so as to minimize the influence on the acoustic performance of the probe, and sufficient heat capacity can be provided to provide good heat dissipation performance. Both the acoustic performance and heat dissipation performance of the probe are considered. For example, in one embodiment, the thickness of the heat dissipation layer 7 may be not more than 500 microns. Further, in one embodiment, the thickness of the heat dissipation layer 7 may be not more than 25 microns. Furthermore, in one embodiment, the thickness of the heat dissipation layer 7 may be 17 to 25 micrometers.

In one embodiment, a heat dissipation layer 8 may also be provided on at least one surface of the backing block 6. As shown in FIGS. 4-1 to 4-3, the upper surface of the backing block 5 (that is, the surface to be bonded to the piezoelectric layer 4 or the surface to be bonded to the FPC may be used. (Shown) and the other two opposite sides are provided with a heat dissipation layer 8. At the same time, the heat dissipation layer 8 can also be disposed on the upper surface of the backing block 5 and / or the other four sides opposite to each other, or other arrangements can be selected. The heat dissipation layer 8 may be the flexible graphite film in the above embodiments, or other materials having a super high thermal conductivity. In this way, the heat distribution generated by the piezoelectric layer of the ultrasonic probe can be more uniform, and the heat dissipation effect is better.

In one embodiment, a heat dissipation layer may be further provided between the FPC and the backing block, and a top end of the pointed portion is adjacent to or in contact with the heat dissipation layer. In one embodiment, a heat dissipation layer may be further provided between the piezoelectric layer and the FPC. The heat dissipation layer may be the flexible graphite film in the above embodiments, or other materials with ultra-high thermal conductivity, which can better conduct heat.

In one embodiment, the acoustic impedance of the heat dissipation layer may be equal to or similar to the acoustic impedance of the backing block. For example, the acoustic impedance of the heat dissipation layer may be the same as the acoustic impedance of the backing block, or the difference between the two is less than 1 trillion Rayleigh, The difference between the two is less than 0.2 trillion Rayleigh. In this way, the influence of the heat dissipation layer on the acoustic performance of the probe can be further reduced.

In one embodiment, the heat dissipation base 6 may further include one or more side walls. As shown in FIGS. 5-1 to 5-3, the heat dissipation base 6 includes two opposite side walls, the side walls extending from the base to the backing block 5 and side surfaces of the backing block 5 fit. In one embodiment, the side wall of the heat dissipation base may also extend from a flat plate portion to the backing block 5 and fit on the side of the backing block 5. In addition, the number of the side walls of the heat dissipation base can also be one, three, or four, which can be designed as required.

In one embodiment, the above embodiments can be used in combination freely according to requirements, so as to achieve better heat dissipation effect. As shown in FIGS. 6-1 to 6-3, a heat dissipation layer 7 is provided on a surface of the heat dissipation base 6 that is in contact with the backing block 5. At the same time, it is provided on the upper surface of the backing block 5 (that is, the surface that is bonded to the piezoelectric layer 4 or the surface that is bonded to the FPC, which is not shown in the FPC) and two other opposite sides. Thermal layer 8. The

heat dissipation layers

7 and 8 may be flexible graphite films, or other materials with ultra-high thermal conductivity. In addition, the heat dissipating base 6 also includes two opposite side walls, the side walls extending from the base (or flat plate portion) toward the backing block 5 and conforming to two opposite sides of the backing block 5 provided with a heat dissipation layer. In addition, other combinations can be used to achieve the desired heat dissipation effect.

The above uses specific examples to illustrate the present invention, but is only used to help understand the present invention, and is not intended to limit the present invention. For those of ordinary skill in the art, according to the idea of the present invention, changes can be made to the above specific implementations.

Claims

An ultrasonic probe, characterized in that it comprises a sound window, a matching layer, a piezoelectric layer, a backing block, and a heat dissipation base connected together in sequence, wherein at least a part of the heat dissipation base extends into the backing block. And fit with the backing block.
The ultrasonic probe according to claim 1, wherein the heat dissipation base is made of a metal or a graphite material.
The ultrasonic probe according to claim 1 or 2, wherein the heat dissipation base comprises a protruding tip portion, and the tip portion of the heat dissipation base extends into the backing block and communicates with the backing block. Pads fit.
The ultrasonic probe according to claim 3, wherein the heat sink base further comprises a base portion, and the tip portion protrudes from the base portion.
The ultrasonic probe according to claim 4, wherein the base portion includes a flat plate portion, and the tip portion protrudes from a plate surface of the flat plate portion.
The ultrasonic probe according to any one of claims 3 to 5, wherein the tip portion includes at least two side surfaces that are inclined with respect to the side of the backing block and intersect each other.
The ultrasonic probe according to any one of claims 3 to 6, wherein the heat dissipation base comprises a plurality of the pointed portions, and the plurality of pointed portions are arranged in a lateral direction and / or a longitudinal direction.
The ultrasonic probe according to any one of claims 3 to 7, further comprising an FPC, the FPC being disposed between the piezoelectric layer and the backing block.
The ultrasonic probe according to any one of claims 3 to 7, wherein a top end of the tip portion is adjacent to or in contact with the piezoelectric layer.
The ultrasound probe according to claim 8, wherein a tip of the tip is adjacent to or in contact with the FPC.
The ultrasonic probe according to any one of claims 3 to 7, wherein a heat dissipation layer is provided between the piezoelectric layer and the backing block, and a tip end of the tip portion is adjacent to or in contact with the heat dissipation. Floor.
The ultrasonic probe according to claim 8, wherein a heat dissipation layer is provided between the FPC and the backing block, and a top end of the tip portion is adjacent to or in contact with the heat dissipation layer.
The ultrasonic probe according to claim 8 or 10, wherein a heat dissipation layer is provided between the piezoelectric layer and the FPC.
The ultrasonic probe according to any one of claims 1-13, wherein a surface of the heat dissipation base which is in contact with the backing block is provided with a heat dissipation layer.
The ultrasonic probe according to any one of claims 1 to 14, wherein a heat dissipation layer is provided on at least one surface of the backing block.
The ultrasonic probe according to any one of claims 11 to 15, wherein the heat radiation layer is a heat radiation film.
The ultrasonic probe according to claim 16, wherein the heat dissipation film is a flexible graphite film.
The ultrasonic probe according to any one of claims 11 to 17, wherein the thickness of the thermal layer is not greater than 500 microns, or the thickness of the heat dissipation layer is not greater than 25 microns, or The thickness is 17 to 25 microns.
The ultrasonic probe according to any one of claims 4 to 18, wherein the heat dissipation base further comprises a side wall, and the side wall extends from the base to the backing block and communicates with the backing The sides of the block fit.
The ultrasound probe according to claim 19, wherein there are one or more side walls.
The ultrasonic probe according to any one of claims 1 to 19, wherein the acoustic impedance of the heat dissipation base is the same as the acoustic impedance of the backing block, and the acoustic impedance of the heat dissipation base and the acoustic impedance of the backing block are the same. The difference in impedance is less than 1 trillion Rayleigh, or the difference between the acoustic impedance of the heat sink base and the acoustic impedance of the backing block is less than 0.2 trillion Rayleigh.
The ultrasonic probe according to any one of claims 11-12 and 14-21, wherein the acoustic impedance of the heat dissipation layer is the same as the acoustic impedance of the backing block, and the acoustic impedance of the heat dissipation layer and the backing block are the same. The difference in acoustic impedance between the acoustic impedance is less than 1 trillion Rayleigh, or the difference between the acoustic impedance of the heat dissipation layer and the acoustic impedance of the backing block is less than 0.2 trillion Rayleigh.
A surface array ultrasonic probe is characterized in that it comprises a sound window, a matching layer, a piezoelectric layer, a backing block, and a heat dissipation base which are connected together in order. The piezoelectric layer includes a plurality of arrays arranged in a two-dimensional array. Element, wherein at least a part of the heat dissipation base extends into the backing block and is attached to the backing block.