CN209474649U - A kind of ultrasonic probe and ultrasonic plane array probe - Google Patents
A kind of ultrasonic probe and ultrasonic plane array probe Download PDFInfo
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- CN209474649U CN209474649U CN201821615554.2U CN201821615554U CN209474649U CN 209474649 U CN209474649 U CN 209474649U CN 201821615554 U CN201821615554 U CN 201821615554U CN 209474649 U CN209474649 U CN 209474649U
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Abstract
A kind of ultrasonic probe and ultrasonic plane array probe, ultrasonic probe includes piezoelectric layer and backing block, the first radiating block is equipped between piezoelectric layer and backing block, due to being equipped with the first radiating block between piezoelectric layer and backing block, first radiating block is bonded over the piezoelectric layer, and contact area is big, and the first radiating block and the heat exchange of piezoelectric layer middle part and surrounding are abundant, so that the good heat dissipation effect of this ultrasonic probe, can guarantee in ultrasonic probe long-time use process still in low-temperature condition.
Description
Technical field
This application involves medical treatment detection devices, and in particular to a kind of ultrasonic probe and a kind of ultrasonic plane array probe.
Background technique
Ultrasonic probe is the important component of ultrasonic diagnostic imaging equipment, it is main include stack gradually sound window together,
It further include the circuit board of connection signal and ground connection with layer, piezoelectric layer and backing block.The working principle of ultrasonic probe is to utilize piezoelectricity
The excitation electric impulse signal of ultrasonic complete machine is converted to ultrasonic signal and enters patient's body by effect, then by the ultrasound of Tissue reflectance
Echo-signal is converted to electric signal, to realize the detection to tissue.It is super in work in the conversion process of electro-acoustic signal
Sonic probe can generate a large amount of heat, lead to the rising of probe temperature.On the one hand probe fever may influence whether the people of patient
Body safety, regulation have clear stipulaties probe with temperature when patient contact no more than specific temperature.If on the other hand probe length
Phase works in higher temperature, can accelerate the aging of probe, shortens probe service life.And from the angle of medicine checkout and diagnosis
Degree but wants to the detection depth for improving probe.Improving complete machine is to increase probe detection depth to the driving voltage of probe
Effective means.But, the raising of driving voltage can make probe generate bigger heat.Therefore, probe fever seriously affects
Patient comfort, probe service life and performance.
The heat sink conception of current some ultrasonic probes is that attempt in the side of ultrasonic probe or surrounding assembly cooling fin will be hot
Measure guide probe rear end.Due to ultrasonic probe fever main cause be piezoelectric material mechanical energy (acoustical signal)-electric energy conversion it is endless
Caused by complete, and the good conductor of piezoelectric material no heat, cause heat mainly to accumulate in the middle position for array element of popping one's head in.And it visits
The cooling fin of head side or surrounding can not be sufficiently close together with source center, while the sectional area of side radiating plate-fin is too small, can not be with spy
Head array element carries out sufficient heat exchange.Probe heating problem is not still well solved.
Summary of the invention
In one embodiment, a kind of ultrasonic probe, including sound window, matching layer, piezoelectric layer and backing block, the sound are provided
Lens, the matching layer, the piezoelectric layer and the backing block are sequentially connected, and the ultrasonic probe further includes the first radiating block,
First radiating block is connected between the piezoelectric layer and backing block, and first radiating block includes base portion and from the base portion
The base portion of the tip of protrusion, first radiating block is connect with the piezoelectric layer, and the tip of first radiating block extends to institute
It states in backing block, the side surface of the tip is bonded with the backing block.
In one embodiment, the material of first radiating block by graphite material or comprising graphite material is made.
In one embodiment, the acoustic impedance of first radiating block is identical as the acoustic impedance of the backing block, described first
Acoustic resistance of the difference of the acoustic impedance of radiating block and the acoustic impedance of the backing block less than 1,000,000 Rayleighs or first radiating block
The difference of anti-and the backing block acoustic impedance is less than 0.2 million Rayleighs.
In one embodiment, the tip includes at least two side inclination and phase each other relative to the backing block
The side surface of friendship.
In one embodiment, first radiating block includes multiple tips, and the multiple tip is along a side
Array is arranged in arrangement or along multiple directions.
In one embodiment, at least partly side surface of the tip is equipped with the first heat dissipation film.
In one embodiment, the thermal coefficient of first heat dissipation film is greater than the thermal coefficient of first radiating block.
In one embodiment, first heat dissipation film is metal foil or soft graphite film.
In one embodiment, first heat dissipation film with a thickness of no more than 500 microns or first heat dissipation film
With a thickness of no more than 25 microns.
In one embodiment, the acoustic impedance of first heat dissipation film and the acoustic impedance of the backing block are equal or described
The difference of the acoustic impedance of first heat dissipation film and the acoustic impedance of the backing block is less than 1,000,000 Rayleighs.
In one embodiment, which further includes the second radiating block, and second radiating block is connected to the backing
On the another side of relatively described first radiating block of block.
In one embodiment, the top of the tip is neighbouring or contacts second radiating block.
In one embodiment, second radiating block is metal block or graphite block.
In one embodiment, second radiating block is aluminium block.
In one embodiment, which further includes the second heat dissipation film, and second heat dissipation film is arranged in the piezoelectricity
Between layer and first radiating block.
In one embodiment, the thermal coefficient of second heat dissipation film is greater than the thermal coefficient of first radiating block.
In one embodiment, second heat dissipation film is metal foil or soft graphite film.
In one embodiment, second heat dissipation film with a thickness of no more than 500 microns or second heat dissipation film
With a thickness of no more than 25 microns.
In one embodiment, the acoustic impedance of second heat dissipation film and the acoustic impedance of the backing block are equal or described
The difference of the acoustic impedance of second heat dissipation film and the acoustic impedance of the backing block is less than 1,000,000 Rayleighs.
In one embodiment, which further includes side radiating plate-fin, and the side radiating plate-fin is at least partly covered on described
On at least one side of first radiating block and/or backing block.
In one embodiment, the side radiating plate-fin is metal plate or graphite plate.
In one embodiment, the side radiating plate-fin is an integral structure with first radiating block.
In one embodiment, which further includes third heat dissipation film, and the third heat dissipation film is arranged in the heat dissipation
Between side plate and first radiating block and/or the backing block.
In one embodiment, which further includes side radiating plate-fin, and the side radiating plate-fin, which extends, at least partly covers institute
State the side of the second radiating block.
In one embodiment, second radiating block is an integral structure with the side radiating plate-fin.
In one embodiment, which further includes the 4th heat dissipation film, and the 4th heat dissipation film is arranged described second
Between radiating block and the backing block.
In one embodiment, a kind of ultrasonic probe, including acoustic lens, matching layer, piezoelectric layer and backing block are provided, it is described
Acoustic lens, the matching layer, the piezoelectric layer and the backing block are sequentially connected, and the ultrasonic probe further includes the first heat dissipation
Block, first radiating block are connected between the piezoelectric layer and backing block.
In one embodiment, a kind of ultrasonic plane array probe, including acoustic lens, matching layer, piezoelectric layer and backing block are provided,
The acoustic lens, the matching layer, the piezoelectric layer and the backing block are sequentially connected, and the piezoelectric layer includes being arranged in two dimension
Multiple array elements of array, the ultrasonic probe further include the first radiating block, first radiating block be connected to the piezoelectric layer and
Between backing block, first radiating block include base portion and from the base portion protrude tip, the base portion of first radiating block
It is connect with the piezoelectric layer, the tip of first radiating block extends in the backing block, the side surface of the tip and institute
State the fitting of backing block.
According to above-described embodiment ultrasonic probe, due between piezoelectric layer and backing block be equipped with the first radiating block, first
Radiating block is bonded over the piezoelectric layer, and contact area is big, and the first radiating block and the heat exchange of piezoelectric layer middle part and surrounding are abundant, so that
The good heat dissipation effect of this ultrasonic probe can guarantee in ultrasonic probe long-time use process still in low-temperature condition.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Fig. 2 is a kind of structural schematic diagram of the first radiating block in embodiment；
Fig. 3 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Fig. 4 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Fig. 5 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Fig. 6 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Fig. 7 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Fig. 8 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Fig. 9 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 10 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 11 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 12 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 13 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 14 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 15 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 16 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 17 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 18 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 19 is a kind of structural schematic diagram of ultrasonic probe in embodiment；
Figure 20 is a kind of structural schematic diagram of ultrasonic probe in embodiment.
Specific embodiment
Ultrasonic probe in embodiments of the present invention is the important component of ultrasonic diagnostic imaging equipment, the piezoelectricity of ultrasonic probe
The first radiating block is equipped between layer and backing block, the first radiating block extends to the middle part of piezoelectric layer, the first radiating block and piezoelectric layer
The heat exchange of middle part and surrounding is abundant, improves heat dissipation effect, and the first radiating block by graphite material or can include graphite material
The material of material is made, and graphite material has many advantages, such as structural strength, temperature stability and higher thermal coefficient, and graphite produces
Category type is abundant, and from porous graphite to leaching tungsten graphite, the acoustic impedance of graphite can change in a wider scope, therefore may be designed to
It is same or similar with the acoustic impedance of backing block, facilitate acoustics design, to not influence the detection performance of ultrasonic probe.
In one embodiment, a kind of ultrasonic probe is provided, as shown in Figure 1, the ultrasonic probe 1 of the present embodiment may include
There are sound window 2, matching layer 3, piezoelectric layer 4, backing block 5, sound window 2, matching layer 3, piezoelectric layer 4, backing block 5 can be sequentially connected,
Middle sound window can be designed as planar structure, may be designed in the structure for focusing ultrasonic wave energy, such as convex configuration, institute
The sound window for stating convex configuration can be referred to as acoustic lens.The ultrasonic probe 1 further includes the first radiating block 6, the connection of the first radiating block 6
Between piezoelectric layer 4 and backing block 5.In one embodiment, the first radiating block 6, which can be covered with, is fitted in piezoelectric layer 4 and backing block 5
Between.
In one embodiment, ultrasonic probe 1 can be ultrasonic plane array probe, and piezoelectric layer therein may include being arranged in two
Tie up multiple array elements of array.
Herein, two described elements " connection ", can be and be directly connected to, be also possible to be indirectly connected with, i.e. the two
Between can be with the presence of other one or more intermediary elements.
First radiating block 6 can the material by graphite material or comprising graphite material be made.Graphite material has structure
The advantages that intensity, temperature stability and higher thermal coefficient, also has so that the first radiating block 6 is the effect for having heat dissipation to conduct
There is stable structural support ability.
In one embodiment, the acoustic impedance of the first radiating block can be identical as the acoustic impedance of backing block.Another embodiment
In, the acoustic impedance of the first radiating block is close with the acoustic impedance of backing block, such as both difference less than 1,000,000 Rayleighs.In this way, passing through
So that the acoustic impedance of the first radiating block is same or similar with the acoustic impedance of backing block, the first radiating block can be effectively reduced to spy
The influence of the acoustical behavior of head.
In one embodiment, the acoustic impedance of the first radiating block and the difference of the acoustic impedance of backing block can be auspicious less than 0.2 million
Benefit, to more effectively reduce influence of first radiating block to the acoustical behavior of probe.
In one embodiment, the first radiating block 6 be can be with certain thickness slab construction.In another embodiment,
First radiating block 6 may include base portion and from the plate face of base portion protrude tip, the tip may include at least two relative to
The side surface that the side of the backing block tilts and intersects with each other, as shown in Figure 2.Herein, this tip configuration is referred to as
For Wedge structure.
First radiating block 6 may include multiple this tips.Multiple tip can arrange in one direction or along more
A direction is arranged in array.
Specifically, 6-1 indicates that the first of slab construction dissipates as shown in Fig. 2, the first radiating block 6 tool is there are four types of specific structure
Heat block, 6-2 indicate first radiating block with a Wedge structure, and 6-3 indicates tool, and there are three the of Wedge structure laterally side by side
One radiating block, 6-4 indicate first radiating block with the Wedge structure of 3 × 5 arrays.For the convenience of description, by parallel oblique in Fig. 1
The direction definition in scribing line face is longitudinal direction, and the direction definition perpendicular to oblique scribing line face is laterally.
For first radiating block 6 of the present embodiment other than above-mentioned four kinds of structures, the first radiating block 6 can also be for other quantity
And the Wedge structure of different distributions mode, such as the Wedge structure with 5 genesis analysis, or with 4 cross direction profiles
Wedge structure.The wedge length of first radiating block 6 can also design as needed.
As shown in figure 3, the setting of the first radiating block 6 is between piezoelectric layer 4 and backing block 5.As shown in Figures 4 to 6, first
The base portion of radiating block 6 is bonded with piezoelectric layer 4, and the tip of the first radiating block 6 extends to the inside of backing block 5, the first radiating block 6
The side surface of tip is bonded with backing block 5, and the top of the tip of the first radiating block 6 does not penetrate backing block 5.Here, first
It can be sharp at the top of the tip of radiating block 6, be also possible to plane or cambered surface.
In one embodiment, the first heat dissipation film is also provided on at least partly side surface of the tip of the first radiating block 6
(not shown), i.e. first heat dissipation film can be set between the first radiating block 6 and backing block 5.First heat dissipation film can
To connect or be thermally coupled to be set in probe outside backing block and/or on other heat dissipation elements of probe rear end.In this way, the
One heat dissipation film, which can transfer out the heat inside backing block, to be come, to preferably distribute backing block and piezoelectric layer central area
Heat enhances heat dissipation effect.
First heat dissipation film can be the gold of the higher high thermal conductivity coefficient of thermal coefficient of the first radiating block of thermal conductivity ratio 6
Belong to the soft graphite film of foil or high thermal conductivity coefficient.For example, the first heat dissipation film can be the soft graphite film of high thermal conductivity coefficient, height is led
The thermal coefficient of the soft graphite film of hot coefficient is 1500~1800W/mK, and the thermal coefficient of the metal foils such as Yuan Chaotong, aluminium can
Preferably to conduct heat.
The thickness of first heat dissipation film can be than relatively thin, to reduce its influence to probe acoustical behavior.First heat dissipation film
Thickness is thinner, and the influence to probe acoustical behavior is smaller, but its thermal capacity is smaller simultaneously, can only store less heat, meeting
Influence heat dissipation performance.In some embodiments of the present invention, the first heat dissipation film is arranged on the first radiating block 6, and the first radiating block 6
With biggish thermal capacity, the first more heat dissipation film can be stored and be conducted through the heat come, therefore, the first heat dissipation film and first
Radiating block 6 cooperates, and can minimize the thickness of the first heat dissipation film to minimize the shadow to probe acoustical behavior
Ring, be capable of providing enough thermal capacity also to providing good heat dissipation performance, realize well to probe acoustical behavior and
Heat dissipation performance is taken into account.For example, the thickness of the first heat dissipation film can be for no more than 500 microns in one embodiment.Further
Ground, in one embodiment, the thickness of the first heat dissipation film can be for no more than 25 microns.
In one embodiment, the acoustic impedance of the first heat dissipation film can be equal or close with the acoustic impedance of backing block, for example,
The acoustic impedance of first heat dissipation film can or the two difference identical as the acoustic impedance of backing block less than 1,000,000 Rayleighs.In this way, can be into
One step reduces influence of first heat dissipation film to probe acoustical behavior.
The ultrasonic probe of the present embodiment can also include side radiating plate-fin 7, and side radiating plate-fin 7 has one or more, heat radiation side
Plate 7 at least partly fits at least one side of the first radiating block 6 and backing block 5.
As shown in Figures 3 to 6, side radiating plate-fin 7 has two pieces, is symmetrically fitted in two of the first radiating block 6 and backing block 5
On transverse side, side radiating plate-fin 7 is metal plate or graphite plate with high thermal conductivity coefficient, such as aluminium sheet.The setting of side radiating plate-fin 7
Heat dissipation area is increased, so that the thermal energy that the first radiating block 6 absorbs passes to side radiating plate-fin 7, side radiating plate-fin 7 can radiate with rear end
Mechanism connection, transfers thermal energy to rear end cooling mechanism, and contact with external environment, improves radiating efficiency.
In embodiment, side radiating plate-fin 7 is an integral structure with the first radiating block 6, can be graphite material, and first
The thermal energy absorbed on radiating block 6 can more quickly pass to side radiating plate-fin 7 and distribute, and have better heat dissipation effect.
Ultrasonic probe provided in this embodiment has certain thickness the due to being equipped between piezoelectric layer 4 and backing block 5
One radiating block 6, the first radiating block 6 fit over middle part and the surrounding of piezoelectric layer 4, can with the middle part of piezoelectric layer 4 and surrounding into
Row heat exchange, the heat that piezoelectric layer 4 is generated are quick by the side radiating plate-fin 7 of the side of the first radiating block 6 and backing block 5 fitting
Ground is transmitted to the rear end cooling mechanism being connected with the external world, is faster dispersed into air, avoids heat before ultrasonic probe
The continuous accumulation at end increases, so that the good heat dissipation effect of the ultrasonic probe of the present embodiment, can guarantee that ultrasonic probe makes for a long time
With in the process still in low-temperature condition.
In one embodiment, a kind of ultrasonic probe is provided, the present embodiment ultrasonic probe is on the basis of the above embodiments
Increase heat dissipation film.
As shown in Fig. 7 to 10, the second heat dissipation film 9 be can be set between piezoelectric layer 4 and the first radiating block 6.Second heat dissipation
Film 9 can also extend out between side radiating plate-fin 7 and the first radiating block 6 and backing block 5, form side radiating plate-fin 7 and first and dissipate
Heat dissipation film between heat block 6 and backing block 5.Herein, claim the heat dissipation between side radiating plate-fin 7 and the first radiating block 6 and backing block 5
Film is third heat dissipation film.The third heat dissipation film be can be and be extended to form as the second heat dissipation film 9 (as shown in embodiment of the Fig. 7 to 10)
And referred to label 9, it is also possible to the individual element separated with the second heat dissipation film 9.
In the present embodiment, second and third heat dissipation film can for high thermal conductivity coefficient metal foil or high thermal conductivity coefficient flexibility
Graphite film, such as the soft graphite film of high thermal conductivity coefficient, the thermal coefficient of the soft graphite film of high thermal conductivity coefficient is 1500~
The thermal coefficient of the metal foils such as 1800W/mK, Yuan Chaotong, aluminium.The thickness of second heat dissipation film 9 can be for no more than 500 microns.More
Further, in one embodiment, the thickness of the first heat dissipation film can be for no more than 25 microns.
The acoustic impedance of second heat dissipation film can be equal or close with the acoustic impedance of backing block, for example, the second heat dissipation film
Acoustic impedance can or the two difference identical as the acoustic impedance of backing block less than 1,000,000 Rayleighs.In this way, can reduce the second heat dissipation film
Influence to probe acoustical behavior.
Ultrasonic probe provided in this embodiment is provided with the on the basis of being equipped with the first radiating block 6 and side radiating plate-fin 7
Two and/or third heat dissipation film, heat dissipation film play heat transfer process, the thermal energy that piezoelectric layer 4 generates quickly is passed into the first heat dissipation
Block 6, backing block 5 and/or side radiating plate-fin 7, to improve heat dissipation effect.
In one embodiment, a kind of ultrasonic probe is provided, the present embodiment ultrasonic probe is on the basis of the above embodiments
Increase the second radiating block 8.Specifically, increasing the second heat dissipation on the basis of being equipped with the first radiating block 6 and side radiating plate-fin 7
Block 8.
As shown in Figure 11 to 14, the second radiating block 8 be fitted in backing block 5 with respect to the first radiating block 6 another side, i.e., second
Radiating block 8 and the first radiating block 6 are fitted in respectively on the opposite two sides of backing block 5.Side radiating plate-fin 7, which extends to, to be at least partly bonded
It is covered on the side of the second radiating block 8.
In one embodiment, the top of the tip of aforementioned first radiating block 6 can be neighbouring or contacts second radiating block
8, so that the heat of backing block and piezoelectric layer center is transmitted to the second radiating block 8, further increase radiating efficiency.
Second radiating block 8 is the metal block or graphite block of high thermal conductivity coefficient and larger specific heat capacity.In one embodiment, second
Radiating block 8 can be aluminium block.
The ultrasonic probe of the present embodiment is equipped with the second radiating block 8 in the rear end of backing block 5, and the second radiating block 8 improves scattered
The thermal efficiency, and the second radiating block 8 can be connect with the cooling mechanism of 5 rear end of backing block, can be increased the thermal capacitance of cooling mechanism, be prevented
Temperature jump influences heat dissipation effect.
In one the present embodiment, a kind of ultrasonic probe is provided, the present embodiment ultrasonic probe is on the basis of above-described embodiment
On increase the 4th heat dissipation film.
As shown in Figure 15 to 18, the second radiating block 8 be fitted in backing block 5 with respect to the first radiating block 6 another side, i.e., second
Radiating block 8 and the first radiating block 6 are fitted in respectively on the opposite two sides of backing block 5.Side radiating plate-fin 7, which extends to, to be fitted over
On the side of two radiating blocks 8.Heat dissipation film 9 is clipped between piezoelectric layer 4 and the first radiating block 6, and the heat dissipation film 9 of two sides is to extension
It extends to and is clipped between side radiating plate-fin 7 and the first radiating block 6 and backing block 5.The setting of 4th heat dissipation film is radiated in backing block 5 and second
Between block 8.
4th heat dissipation film can be the metal foil of high thermal conductivity coefficient or the soft graphite film of high thermal conductivity coefficient, such as high thermal conductivity
The soft graphite film of coefficient, the thermal coefficient of the soft graphite film of high thermal conductivity coefficient are 1500~1800W/mK, Yuan Chaotong, aluminium
Etc. metal foils thermal coefficient.
Ultrasonic probe provided in this embodiment increases on the basis of being equipped with the first radiating block 6 and side radiating plate-fin 7
Four heat dissipation films, the 4th heat dissipation film improve heat conduction efficiency, and the second radiating block 8 can be connect with the cooling mechanism of 5 rear end of backing block,
The thermal capacitance that cooling mechanism can be increased prevents temperature jump from influencing heat dissipation effect.
Use above specific case is illustrated the present invention, is merely used to help understand the present invention, not to limit
The system present invention.For those of ordinary skill in the art, according to the thought of the present invention, above-mentioned specific embodiment can be carried out
Variation.
Claims (28)
1. a kind of ultrasonic probe, which is characterized in that including acoustic lens, matching layer, piezoelectric layer and backing block, the acoustic lens, institute
Matching layer, the piezoelectric layer and the backing block to be stated to be sequentially connected, the ultrasonic probe further includes the first radiating block, and described first
Radiating block is connected between the piezoelectric layer and backing block, and first radiating block includes base portion and the point from base portion protrusion
The base portion in portion, first radiating block is connect with the piezoelectric layer, and the tip of first radiating block extends to the backing block
Interior, the side surface of the tip is bonded with the backing block.
2. ultrasonic probe as described in claim 1, which is characterized in that first radiating block is by graphite material or includes stone
The material of ink material is made.
3. ultrasonic probe as described in claim 1, it is characterised in that: the acoustic impedance of first radiating block and the backing block
Identical, described first radiating block of acoustic impedance acoustic impedance and the backing block acoustic impedance difference less than 1,000,000 Rayleighs or
The difference of the acoustic impedance of first radiating block and the acoustic impedance of the backing block is less than 0.2 million Rayleighs.
4. ultrasonic probe as described in claim 1, which is characterized in that the tip includes at least two relative to the backing
The side surface that the side of block tilts and intersects with each other.
5. ultrasonic probe as described in claim 1, which is characterized in that first radiating block includes multiple tips, and
And the multiple tip arranges in one direction or is arranged in array along multiple directions.
6. ultrasonic probe as described in claim 1, which is characterized in that at least partly side surface of the tip is equipped with first
Heat dissipation film.
7. ultrasonic probe as claimed in claim 6, which is characterized in that the thermal coefficient of first heat dissipation film is greater than described the
The thermal coefficient of one radiating block.
8. ultrasonic probe as claimed in claim 6, which is characterized in that first heat dissipation film is metal foil or soft graphite
Film.
9. ultrasonic probe as claimed in claim 6, it is characterised in that: first heat dissipation film with a thickness of no more than 500 micro-
Rice or first heat dissipation film with a thickness of be not more than 25 microns.
10. ultrasonic probe as claimed in claim 6, it is characterised in that: the acoustic impedance of first heat dissipation film and the backing
The acoustic impedance of block is equal or the difference of the acoustic impedance and the acoustic impedance of the backing block of first heat dissipation film is auspicious less than 1,000,000
Benefit.
11. the ultrasonic probe as described in any one of claims 1 to 10, which is characterized in that further include the second radiating block, institute
The second radiating block is stated to be connected on the another side of relatively described first radiating block of the backing block.
12. ultrasonic probe as claimed in claim 11, which is characterized in that the top of the tip it is neighbouring or contact described second
Radiating block.
13. ultrasonic probe as claimed in claim 11, which is characterized in that second radiating block is metal block or graphite block.
14. ultrasonic probe as claimed in claim 13, which is characterized in that second radiating block is aluminium block.
15. the ultrasonic probe as described in any one of claims 1 to 10, which is characterized in that further include the second heat dissipation film, institute
The second heat dissipation film is stated to be arranged between the piezoelectric layer and first radiating block.
16. ultrasonic probe as claimed in claim 15, which is characterized in that the thermal coefficient of second heat dissipation film is greater than described
The thermal coefficient of first radiating block.
17. ultrasonic probe as claimed in claim 15, which is characterized in that second heat dissipation film is metal foil or soft graphite
Film.
18. ultrasonic probe as claimed in claim 15, it is characterised in that: second heat dissipation film it is micro- with a thickness of 10 to 500
Rice or second heat dissipation film with a thickness of 17 to 25 microns.
19. ultrasonic probe as claimed in claim 15, it is characterised in that: the acoustic impedance of second heat dissipation film and the backing
The acoustic impedance of block is equal or the difference of the acoustic impedance and the acoustic impedance of the backing block of second heat dissipation film is auspicious less than 1,000,000
Benefit.
20. the ultrasonic probe as described in any one of claims 1 to 10, which is characterized in that it further include side radiating plate-fin, it is described to dissipate
Hot side plate is at least partly covered at least one side of first radiating block and/or backing block.
21. ultrasonic probe as claimed in claim 20, which is characterized in that the side radiating plate-fin is metal plate or graphite plate.
22. ultrasonic probe as claimed in claim 20, which is characterized in that the side radiating plate-fin is one with first radiating block
Body formula structure.
23. ultrasonic probe as claimed in claim 20, which is characterized in that it further include third heat dissipation film, the third heat dissipation film
It is arranged between the side radiating plate-fin and first radiating block and/or the backing block.
24. ultrasonic probe as claimed in claim 11, which is characterized in that further include side radiating plate-fin, the side radiating plate-fin extends
At least partly cover the side of second radiating block.
25. ultrasonic probe as claimed in claim 24, which is characterized in that second radiating block is one with the side radiating plate-fin
Body formula structure.
26. ultrasonic probe as claimed in claim 11, which is characterized in that it further include the 4th heat dissipation film, the 4th heat dissipation film
It is arranged between second radiating block and the backing block.
27. a kind of ultrasonic probe, which is characterized in that including acoustic lens, matching layer, piezoelectric layer and backing block, the acoustic lens, institute
Matching layer, the piezoelectric layer and the backing block to be stated to be sequentially connected, the ultrasonic probe further includes the first radiating block, and described first
Radiating block is connected between the piezoelectric layer and backing block.
28. a kind of ultrasonic plane array probe, which is characterized in that including acoustic lens, matching layer, piezoelectric layer and backing block, the sound is saturating
Mirror, the matching layer, the piezoelectric layer and the backing block are sequentially connected, and the piezoelectric layer includes be arranged in two-dimensional array more
A array element, the ultrasonic probe further include the first radiating block, first radiating block be connected to the piezoelectric layer and backing block it
Between, first radiating block includes base portion and from the tip that the base portion protrudes, the base portion of first radiating block and the pressure
Electric layer connection, the tip of first radiating block extend in the backing block, the side surface of the tip and the backing block
Fitting.
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| CN201821615554.2U CN209474649U (en) | 2018-09-30 | 2018-09-30 | A kind of ultrasonic probe and ultrasonic plane array probe |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113116375A (en) * | 2019-12-30 | 2021-07-16 | 无锡祥生医疗科技股份有限公司 | Area array transducer |
| US11642105B2 (en) | 2018-06-12 | 2023-05-09 | Edan Instruments, Inc. | Ultrasonic transducer, ultrasonic probe, and ultrasonic detection apparatus |
| TWI812116B (en) * | 2022-03-25 | 2023-08-11 | 佳世達科技股份有限公司 | Ultrasonic probe and method for measuring curvature information thereof |
-
2018
- 2018-09-30 CN CN201821615554.2U patent/CN209474649U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11642105B2 (en) | 2018-06-12 | 2023-05-09 | Edan Instruments, Inc. | Ultrasonic transducer, ultrasonic probe, and ultrasonic detection apparatus |
| CN113116375A (en) * | 2019-12-30 | 2021-07-16 | 无锡祥生医疗科技股份有限公司 | Area array transducer |
| TWI812116B (en) * | 2022-03-25 | 2023-08-11 | 佳世達科技股份有限公司 | Ultrasonic probe and method for measuring curvature information thereof |
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Assignee: Shenzhen Mindray Animal Medical Technology Co.,Ltd. Assignor: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS Co.,Ltd. Contract record no.: X2022440020009 Denomination of utility model: An ultrasonic probe and area array ultrasonic probe Granted publication date: 20191011 License type: Common License Record date: 20220804 |