CN110960258A

CN110960258A - Ultrasonic probe

Info

Publication number: CN110960258A
Application number: CN201811162733.XA
Authority: CN
Inventors: 王金池; 吴飞; 张�浩; 郑洲
Original assignee: Shenzhen Mindray Bio Medical Electronics Co Ltd; Shenzhen Mindray Scientific Co Ltd
Current assignee: Shenzhen Mindray Bio Medical Electronics Co Ltd; Shenzhen Mindray Scientific Co Ltd
Priority date: 2018-09-30
Filing date: 2018-09-30
Publication date: 2020-04-07

Abstract

An ultrasonic probe comprises an acoustic window, a matching layer, a piezoelectric layer, a backing block and a probe shell which are connected in sequence, wherein a first heat dissipation element is arranged in the backing block, the first heat dissipation element comprises a first end and a second end, the first end is adjacent to or extends to the upper surface of the backing block, the second end extends to the lower surface or the first side surface of the backing block, and the extending direction of the first heat dissipation element from the first end to the second end forms a first included angle with the thickness direction of the backing block from the upper surface of the backing block to the lower surface of the backing block. The reflection stroke of the sound wave in the backing block is increased, the waste sound wave radiated by the piezoelectric layer can be better absorbed by the backing block, the heat conduction area is increased, the heat conduction efficiency is improved, the heat exchange between the backing block and the middle part of the piezoelectric layer is sufficient, the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be guaranteed to be still in a low-temperature state in the long-time use process.

Description

Ultrasonic probe

Technical Field

The application relates to medical detection equipment, in particular to an ultrasonic probe.

Background

The ultrasonic probe 1 has the working principle that the piezoelectric effect is utilized to convert the excitation electric pulse signal of the ultrasonic complete machine into an ultrasonic signal to enter the body of a patient, and then the ultrasonic echo signal reflected by the tissue is converted into an electric signal, so that the detection of the tissue is realized. During the conversion of the electro-acoustic signal, the operating ultrasound probe generates a large amount of heat, resulting in an increase in the temperature of the probe. On the one hand, the heating of the probe may affect the personal safety of the patient, and the regulation clearly stipulates that the temperature of the probe when in contact with the patient cannot exceed a certain temperature. On the other hand, if the probe works at a higher temperature for a long time, the aging of the probe is accelerated, and the service life of the probe is shortened. From the viewpoint of medical examination and diagnosis, it is desired to increase the examination depth of the probe. Improving the excitation voltage of the whole machine to the probe is an effective means for increasing the detection depth of the probe. However, an increase in the excitation voltage causes the probe to generate more heat. Thus, heating of the probe severely impacts patient comfort, probe life and performance.

Some current heat dissipation schemes for ultrasonic probes are to mount heat sinks on the sides or around the ultrasonic probe in an attempt to direct heat to the back end of the probe. The heat generated by the ultrasonic probe is mainly caused by incomplete electroacoustic conversion of the piezoelectric material, and the piezoelectric material is not a good thermal conductor, so that the heat is mainly accumulated in the middle of the probe array element. And the radiating fins on the side or periphery of the probe cannot be close to the center of the heat source sufficiently, and meanwhile, the sectional area of the radiating side plate is too small to perform sufficient heat exchange with the array element of the probe. The problem of probe heating is still not well solved.

Other ultrasound probe heat dissipation schemes regularly insert fins or arrays of fins in the backing material along the normal to the probe. Although the heat radiating fins can be close to the center of the heat source of the probe, the heat radiating fins are thick, so that the acoustics of the probe is greatly influenced, and the thin heat radiating effect is limited. It is difficult to combine probe performance with heat dissipation.

Disclosure of Invention

In one embodiment, an ultrasonic probe is provided, which includes an acoustic window, a matching layer, a piezoelectric layer, a backing block, and a probe housing, the acoustic window, the matching layer, the piezoelectric layer, the backing block, and the probe housing are sequentially connected, and the ultrasonic probe further includes a first heat dissipation element disposed in the backing block, the first heat dissipation element including a first end adjacent to or extending to an upper surface of the backing block and a second end extending to a lower surface or a first side surface of the backing block, wherein an extending direction of the first heat dissipation element from the first end to the second end forms a first included angle with a thickness direction of the backing block from the upper surface of the backing block to the lower surface of the backing block.

In one embodiment, the backing block is internally provided with a plurality of the first heat dissipation elements.

In one embodiment, the plurality of first heat dissipation elements are parallel to each other and arranged in a first direction perpendicular to a thickness direction of the backing block.

In one embodiment, the first heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the first heat dissipating element is no greater than 500 microns, or the thickness of the first heat dissipating element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the first heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the first heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the backing block is further provided with a second heat dissipation element inside, the second heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the second side surface of the backing block, and the extending direction of the second heat dissipation element from the first end of the second heat dissipation element to the second end of the second heat dissipation element forms a second included angle with the thickness direction of the backing block.

In one embodiment, the backing block is internally provided with a plurality of the second heat dissipating elements.

In one embodiment, the plurality of second heat dissipating elements are parallel to each other and arranged in a first direction perpendicular to a thickness direction of the backing block.

In one embodiment, the first heat dissipation element and the second heat dissipation element are connected to each other.

In one embodiment, the first end of the first heat dissipation element and the first end of the second heat dissipation element are connected to each other.

In one embodiment, the second heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the second heat dissipating element is no greater than 500 microns, or the thickness of the second heat dissipating element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the second heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the second heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the backing block is further provided with a third heat dissipation element inside, the third heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the third side surface of the backing block, and the extending direction of the third heat dissipation element from the first end of the third heat dissipation element to the second end of the third heat dissipation element forms a third included angle with the thickness direction of the backing block.

In one embodiment, the backing block is internally provided with a plurality of the third heat dissipation elements.

In one embodiment, the plurality of third heat dissipation elements are parallel to each other and arranged in a second direction perpendicular to the thickness direction of the backing block.

In one embodiment, the third heat dissipating element is interconnected with the first heat dissipating element and/or the second heat dissipating element.

In one embodiment, the first end of the third heat dissipating element is interconnected with the first end of the first heat dissipating element and/or the first end of the second heat dissipating element.

In one embodiment, the third heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the third heat dissipating element is no greater than 500 micrometers, or the thickness of the third heat dissipating element is no greater than 25 micrometers.

In one embodiment, the acoustic impedance of the third heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the third heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the backing block is further provided with a fourth heat dissipation element inside, the fourth heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the fourth side surface of the backing block, and the extending direction of the fourth heat dissipation element from the first end of the fourth heat dissipation element to the second end of the fourth heat dissipation element forms a fourth included angle with the thickness direction of the backing block.

In one embodiment, the backing mass is internally provided with a plurality of the fourth heat dissipation elements.

In one embodiment, the plurality of fourth heat dissipation elements are parallel to each other and aligned in a second direction perpendicular to the thickness direction of the backing block.

In one embodiment, the fourth heat dissipating element is interconnected with the first heat dissipating element and/or the second heat dissipating element and/or the third heat dissipating element.

In one embodiment, the first end of the fourth heat dissipating element is interconnected with the first end of the first heat dissipating element and/or the first end of the second heat dissipating element and/or the first end of the third heat dissipating element.

In one embodiment, the fourth heat-dissipating component is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the fourth heat dissipation element is no greater than 500 microns, or the thickness of the fourth heat dissipation element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the fourth heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the fourth heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the probe further comprises a fifth heat dissipating element attached to the upper surface of the backing block.

In one embodiment, the probe further comprises a sixth heat dissipating element attached to at least one other surface of the backing block than the upper surface.

In one embodiment, the fifth heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the fifth heat dissipating element is not greater than 500 micrometers, or the thickness of the fifth heat dissipating element is not greater than 25 micrometers.

In one embodiment, the acoustic impedance of the fifth heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the fifth heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the sixth heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the probe further comprises a heat sink attached to at least one surface of the backing block other than the upper surface.

In one embodiment, the heat dissipation block is attached to the lower surface of the backing block.

In one embodiment, the heat dissipation block is a metal block.

In one embodiment, the heat sink block is an aluminum block.

In one embodiment, the heat dissipation device further comprises a seventh heat dissipation element, and the seventh heat dissipation film is attached to at least one surface of the heat dissipation block.

In one embodiment, the seventh heat dissipation element is a metal foil or a flexible graphite film.

According to the ultrasonic probe of the embodiment, the first heat dissipation element is arranged in the backing block and comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the first side surface of the backing block, wherein the extending direction of the first heat dissipation element from the first end to the second end forms a first included angle with the thickness direction of the backing block from the upper surface of the backing block to the lower surface of the backing block, so that the reflection stroke of the sound wave in the backing block is increased, the backing block is favorable for better absorbing useless sound waves radiated by the piezoelectric layer, the heat conduction area is increased, the heat conduction efficiency is improved, the heat exchange between the backing block and the middle part of the piezoelectric layer is sufficient, the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be ensured to be still in a low-temperature state in a long-time use process.

Drawings

FIG. 1 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 2 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 3 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 4 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 5 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 6 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 7 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 8 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 9 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 10 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 11 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 12 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 13 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 14 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 15 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 16 is a schematic diagram of an ultrasound probe in one embodiment;

Detailed Description

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

In one embodiment, an ultrasound probe is provided, as shown in fig. 1, the ultrasound probe 1 of this embodiment mainly includes an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5 and a probe housing 6 (the probe housing 6 is not shown in the figure), wherein the matching layer 3 is connected to the acoustic window 2, the piezoelectric layer 4 is connected to the matching layer 3, the backing block 5 is connected to the piezoelectric layer 4, wherein the acoustic window 2 can be designed to be a planar structure or a structure having a function of focusing ultrasonic waves, such as a convex structure, the acoustic window of the convex structure can be called an acoustic lens, the backing block 5 includes an upper surface 51, a lower surface 52, a first side surface 53, a second side surface 54, a third side surface 55 and a fourth side surface 56, wherein the surface of the backing block 5 attached to the piezoelectric layer 4 is defined as the upper surface 51, and the other four side surfaces are shown in fig. 1, and the probe housing 6 at least partially houses the acoustic window, Matching layer 3, piezoelectric layer 4 and backing block 5.

As shown in fig. 2 and 3, the inside of the backing block 5 is provided with a first heat dissipation element 7, the first heat dissipation element 7 includes a first end adjacent to or extending to the upper surface of the backing block 5 and a second end extending to the lower surface of the backing block 5, wherein the extending direction of the first heat dissipation element 7 from the first end to the second end forms a first included angle with the thickness direction of the backing block 5 from the upper surface of the backing block 5 to the lower surface of the backing block 5.

The first end of the upper surface of the backing block 5 may be close to the upper surface of the backing block 5 or may be in contact with the upper surface, which is more heat conductive when the first heat dissipation member 7 is in contact with the upper surface.

The direction of extension from the first end of the upper surface of the backing block 5 to the second end of the lower surface of the backing block 5 is the direction of linear extension from the first end to the second end.

The thickness direction of the backing block 5 from the upper surface of the backing block 5 to the lower surface of the backing block 5 is the thickness direction of the backing block 5 perpendicular to the upper and lower surfaces of the backing block 5.

A first angle formed by a direction extending linearly from a first end of the upper surface to a second end of the lower surface of the backing block 5 and a thickness direction of the backing block 5 perpendicular to the upper surface and the lower surface of the backing block 5 is acute.

In one embodiment, as shown in fig. 4, the first heat dissipation element 7 may be arranged in two layers, and the second end of the first heat dissipation element 7 may also be a second end extending to the first side surface of the backing block 5, so as to facilitate the heat in the middle of the piezoelectric layer to be conducted out to the side surface of the backing block as quickly as possible.

In one embodiment, a plurality of first heat dissipation elements 7 are disposed inside the backing block 5, and the relative positions of the first heat dissipation elements 7 may be arbitrarily arranged, may intersect, and may not intersect.

In one embodiment, as shown in fig. 3, the backing block 5 is provided with a plurality of first heat dissipation elements 7 as described above inside, and the first heat dissipation elements 7 are parallel to each other and arranged in a first direction perpendicular to the thickness direction of the backing block 5, the first direction being a perpendicular direction from the first side surface to the second side surface.

The first heat dissipation element 7 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m.k, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the first heat dissipation element may be not greater than 500 micrometers. Still further, in one embodiment, the first heat spreading film may have a thickness of no greater than 25 microns.

The acoustic impedance of the first heat dissipating element 7 may be equal to or similar to the acoustic impedance of the backing mass 5, for example, the acoustic impedance of the first heat dissipating element 7 may be the same as the acoustic impedance of the backing mass 5 or differ by less than 1 mrayl. In this way, the influence of the first heat-radiating element on the acoustic performance of the probe can be reduced.

The embodiment provides an ultrasonic probe, which comprises an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5 and a probe shell 6 which are connected in sequence, wherein a first heat dissipation element 7 is arranged inside the backing block 5, the first heat dissipation element 7 comprises a first end which is adjacent to or extends to the upper surface of the backing block 5 and a second end which extends to the lower surface of the backing block 5, the extending direction of the first heat dissipation element 7 from the first end to the second end and the thickness direction of the backing block 5 from the upper surface of the backing block 5 to the lower surface of the backing block 5 form a first included angle, the reflection stroke of sound waves in the backing block 5 is increased, the backing block 5 is favorable for better absorbing useless sound waves radiated by the piezoelectric layer, meanwhile, the heat conduction area is increased, the heat conduction efficiency is improved, the heat exchange between the backing block 5 and the middle part of the piezoelectric layer 4 is sufficient, the heat can be timely and quickly, the ultrasonic probe has good heat dissipation effect and can be ensured to be still in a low-temperature state in the long-time use process.

In one embodiment, an ultrasound probe is provided, and the ultrasound probe of this embodiment is added with the second heat dissipation element 8 on the basis of the above embodiments.

As shown in fig. 2 and 3, a second heat dissipation element 8 is additionally arranged inside the backing block 5, and the second heat dissipation element 8 comprises a first end adjacent to or extending to the upper surface of the backing block 5 and a second end extending to the lower surface of the backing block 5, wherein the extending direction of the second heat dissipation element from the first end to the second end forms a second included angle with the thickness direction of the backing block 5 from the upper surface of the backing block 5 to the lower surface of the backing block 5.

A second angle formed by a direction extending linearly from the first end of the upper surface to the second end of the lower surface of the backing block 5 and a thickness direction of the backing block 5 perpendicular to the upper surface and the lower surface of the backing block 5 is acute.

In one embodiment, as shown in fig. 4, the second end of the second heat dissipating element 8 may also be disposed to extend to the second end of the second side surface of the backing block 5.

In one embodiment, a plurality of second heat dissipation elements 8 as described above are further disposed inside the backing block 5, and the relative positions of the second heat dissipation elements 8 may be arbitrarily arranged, may intersect, or may not intersect.

In one embodiment, as shown in fig. 3, a plurality of second heat dissipation elements 8 as described above are further provided inside the backing block 5, and the second heat dissipation elements 8 are parallel to each other and arranged in a first direction perpendicular to the thickness direction of the backing block 5, the first direction being from the first side surface to the second side surface.

In one embodiment, the first and second

heat dissipating elements

7 and 8 inside the backing block 5 are connected to each other. The first end of the first heat dissipation element 7 may be connected to the first end of the second heat dissipation element 8, the middle portions of the two ends of the first heat dissipation element may be connected to the middle portions of the two ends of the second heat dissipation element, the middle portions of the first end of the first heat dissipation element 7 may be connected to the middle portions of the two ends of the second heat dissipation element 8, or the middle portions of the two ends of the first heat dissipation element 7 may be connected to the first end of the second heat dissipation element 8.

In one embodiment, as shown in fig. 3, the first end of the first heat dissipating element 7 inside the backing block 5 is interconnected with the first end of the second heat dissipating element 8.

The second heat dissipation element 8 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m.k, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the second heat dissipation element 8 may be not more than 500 micrometers. Further, in one embodiment, the thickness of the second heat dissipation element 8 may be no greater than 25 microns.

The acoustic impedance of the second heat dissipating element 8 may be equal to or similar to the acoustic impedance of the backing mass 5, for example, the acoustic impedance of the second heat dissipating element 8 may be the same as the acoustic impedance of the backing mass 5 or differ by less than 1 megarayl. In this way, the influence of the second heat-radiating element on the acoustic performance of the probe can be reduced.

This embodiment provides an ultrasonic probe, backing block 5 adds second radiating element 8 on the basis of above-mentioned embodiment, first radiating element 7 and second radiating element 8 use simultaneously will further increase the reflection stroke of sound wave in backing block 5, be favorable to backing block 5 better absorption piezoelectric layer radiated useless sound wave, further increase heat conduction area simultaneously, make backing block 5 abundant with the heat exchange in piezoelectric layer 4 middle part, can in time lead-in the heat into backing block 5 periphery or rear end fast, make this ultrasonic probe's radiating effect good, can guarantee that ultrasonic probe still is in the low temperature state in the long-time use.

In one embodiment, an ultrasound probe is provided, and the ultrasound probe of this embodiment is added with a third heat dissipation element 9 on the basis of the above embodiments.

As shown in fig. 2 and 3, the inside of the backing block 5 is further provided with a third heat dissipation element 9, the third heat dissipation element 9 includes a first end adjacent to or extending to the upper surface of the backing block 5 and a second end extending to the lower surface of the backing block 5, wherein an extending direction of the third heat dissipation element 9 from the first end to the second end forms a third angle with a thickness direction of the backing block 5 from the upper surface of the backing block 5 to the lower surface of the backing block 5.

The first end of the upper surface of the backing block 5 may be close to the upper surface of the backing block 5 or may be in contact with the upper surface, and the heat conduction efficiency may be higher when the first heat dissipation member is in contact with the upper surface.

The direction of extension from the first end of the upper surface of the backing block 5 to the second end of the lower surface of the backing block 5 refers to the direction of linear extension from the first end to the second end.

The thickness direction of the backing block 5 from the upper surface of the backing block 5 to the lower surface of the backing block 5 refers to the perpendicular direction along the thickness of the backing block 5 from the upper surface to the lower surface of the backing block 5.

A third angle formed by a direction extending linearly from the first end of the upper surface to the second end of the lower surface of the backing block 5 and a direction perpendicular to the thickness of the backing block 5 from the upper surface to the lower surface of the backing block 5 is acute.

In one embodiment, the second end of the third heat radiating member 9 may also be provided to extend to the second end of the third side surface of the backing block 5.

In one embodiment, a plurality of third heat dissipation elements 9 as described above are further disposed inside the backing block 5, and the mutual position relationship of the third heat dissipation elements 9 may be arbitrarily arranged, may intersect, and may not intersect.

In one embodiment, as shown in fig. 3, a plurality of third heat dissipation elements 9 as described above are further provided inside the backing block 5, and the third heat dissipation elements are parallel to each other and arranged in a second direction perpendicular to the thickness direction of the backing block 5, the second direction being a direction from the third side surface to the fourth side surface.

In one embodiment, the third heat dissipation element 9 and the first heat dissipation element 7 inside the backing block 5 are connected to each other, the third heat dissipation element 9 and the second heat dissipation element 8 inside the backing block 5 are connected to each other, and the third heat dissipation element 9 and the first heat dissipation element 7 and the second heat dissipation element 8 are connected to each other simultaneously inside the backing block 5.

In one embodiment, the first end of the third heat dissipation element 9 inside the backing block 5 may be connected to the first end of the first heat dissipation element 7, the first end of the third heat dissipation element 9 inside the backing block 5 may be connected to the first end of the second heat dissipation element 8, and the first end of the third heat dissipation element 9 inside the backing block 5 may be connected to both the first end of the first heat dissipation element 7 and the first end of the second heat dissipation element 8.

The third heat dissipation element 9 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the third heat dissipation element 9 may be not more than 500 micrometers. Further, in one embodiment, the thickness of the third heat dissipation element 8 may be no greater than 25 micrometers.

The acoustic impedance of the third heat dissipating element 9 may be equal to or similar to the acoustic impedance of the backing mass 5, for example, the acoustic impedance of the third heat dissipating element 9 may be the same as the acoustic impedance of the backing mass 5 or may differ by less than 1 mrayl. In this way, the influence of the third heat-radiating element on the acoustic performance of the probe can be reduced.

The embodiment provides an ultrasonic probe, on the basis of the above embodiment, the third heat dissipation element 9 is additionally arranged inside the backing block 5, and the use of the first heat dissipation element 7, the second heat dissipation element 8 and the third heat dissipation element 9 can further increase the reflection stroke of sound waves in the backing block 5, which is beneficial to the backing block 5 to better absorb useless sound waves radiated by the piezoelectric layer, and further increase the heat conduction area, so that the heat exchange between the backing block 5 and the middle part of the piezoelectric layer 4 is sufficient, heat can be timely and quickly conducted into the periphery or the rear end of the backing block 5, so that the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be ensured to be still in a low-temperature state in the long-time use process.

In one embodiment, an ultrasound probe is provided, and the ultrasound probe of this embodiment is added with the fourth heat dissipation element 10 on the basis of the above embodiments.

As shown in fig. 2 and 3, the inside of the backing block 5 is further provided with a fourth heat dissipation element, and the fourth heat dissipation element 10 includes a first end adjacent to or extending to the upper surface of the backing block 5 and a second end extending to the lower surface of the backing block 5, wherein the extending direction of the fourth heat dissipation element 10 from the first end to the second end forms a fourth angle with the thickness direction of the backing block 5 from the upper surface of the backing block 5 to the lower surface of the backing block 5.

The first end of the upper surface of the backing block 5 may be close to the upper surface of the backing block 5 or may be in contact with the upper surface, and the heat conduction efficiency is higher when the first heat dissipation member 7 is in contact with the upper surface.

A fourth angle formed by a direction in which the first end of the upper surface of the backing block 5 extends straight to the second end of the lower surface and a direction perpendicular to the thickness of the backing block 5 from the upper surface to the lower surface of the backing block 5 is acute.

In one embodiment, the second end of the fourth heat dissipation element 10 may also be arranged to extend to the second end of the fourth side surface of the backing mass 5.

In one embodiment, a plurality of the fourth heat dissipation elements 10 as described above are further disposed inside the backing block 5, and the mutual position relationship of the fourth heat dissipation elements 10 may be arbitrarily arranged, may intersect, and may not intersect.

In one embodiment, as shown in fig. 3, a plurality of the fourth heat dissipation elements 10 are further disposed inside the backing block 5, and the fourth heat dissipation elements 10 are parallel to each other and are arranged along a second direction perpendicular to the thickness direction of the backing block 5.

In one embodiment, the fourth heat dissipation element 10 inside the backing block 5 is connected to any one of the first heat dissipation element 7, the second heat dissipation element 8 and the third heat dissipation element 9, the fourth heat dissipation element 10 is connected to any two of the first heat dissipation element 7, the second heat dissipation element 8 and the third heat dissipation element 9, and the fourth heat dissipation element 10 is connected to the first heat dissipation element 7, the second heat dissipation element 8 and the third heat dissipation element 9 simultaneously.

In one embodiment, the first end of the fourth heat dissipation element 10 inside the backing block 5 is connected to any one of the first end of the first heat dissipation element 7, the first end of the second heat dissipation element 8, and the first end of the third heat dissipation element 9, the first end of the fourth heat dissipation element 10 is connected to any two of the first end of the first heat dissipation element 7, the first end of the second heat dissipation element 8, and the first end of the third heat dissipation element 9, and the first end of the fourth heat dissipation element 10 is connected to the first end of the first heat dissipation element 7, the first end of the second heat dissipation element 8, and the first end of the third heat dissipation element 9 simultaneously. As shown in fig. 3, the first end of the fourth heat dissipation element is connected to the first end of the third heat dissipation element.

The fourth heat dissipation element 10 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m.k, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the fourth heat dissipation element 10 may be not more than 500 micrometers. Still further, in one embodiment, the thickness of the fourth heat dissipation element 10 may be no greater than 25 microns.

The acoustic impedance of the fourth heat dissipating element 10 may be equal to or similar to the acoustic impedance of the backing mass 5, for example, the acoustic impedance of the fourth heat dissipating element 10 may be the same as the acoustic impedance of the backing mass 5 or may differ by less than 1 megarayl. In this way, the influence of the fourth heat dissipation element 10 on the acoustic performance of the probe can be reduced.

The embodiment provides an ultrasonic probe, on the basis of the above embodiment, the fourth heat dissipation element 10 is additionally arranged inside the backing block 5, and the use of the first heat dissipation element 7, the second heat dissipation element 8, the third heat dissipation element 9 and the fourth heat dissipation element 10 can further increase the reflection stroke of sound waves in the backing block 5, which is beneficial to the backing block 5 to better absorb useless sound waves radiated by the piezoelectric layer, and further increase the heat conduction area, so that the heat exchange between the backing block 5 and the middle part of the piezoelectric layer is sufficient, and heat can be timely and quickly introduced into the periphery or the rear end of the backing block 5, so that the heat dissipation effect of the ultrasonic probe is good, and the ultrasonic probe can be ensured to be still in a low-temperature state in the long-time use process.

The present embodiment provides an ultrasound probe, and the ultrasound probe of the present embodiment adds the fifth heat dissipation element 11 on the basis of the above-described embodiments.

As shown in fig. 5, the fifth heat dissipation element 11 is attached to the upper surface of the backing block 5, and the fifth heat dissipation element 11 is disposed between the piezoelectric layer 4 and the backing block 5.

The fifth heat dissipation element 11 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the fifth heat dissipation element 11 may be not greater than 500 micrometers. Further, in one embodiment, the thickness of the fifth heat dissipation element 11 may be not greater than 25 μm.

The acoustic impedance of the fifth heat dissipating element 11 may be equal to or similar to the acoustic impedance of the backing mass 5, for example, the acoustic impedance of the fifth heat dissipating element 11 may be the same as the acoustic impedance of the backing mass 5 or differ by less than 1 mrayl. In this way, the influence of the fifth heat dissipating element 11 on the acoustic performance of the probe can be reduced.

In the ultrasonic probe of the present embodiment, on the basis of the above embodiment, the fifth heat dissipation element 11 is additionally disposed on the backing block 5, the fifth heat dissipation element 11 is disposed between the piezoelectric layer 4 and the backing block 5, and the heat concentrated in the middle of the piezoelectric layer 4 is rapidly transferred to the backing block and the heat dissipation elements in the backing block through the fifth heat dissipation element 11, so as to increase the heat conduction area, improve the heat conduction efficiency, and further improve the heat dissipation effect.

The present embodiment provides an ultrasonic probe, in which a sixth heat dissipation element 12 is added on the basis of the above embodiments.

The sixth heat dissipating element 12 is attached to at least one surface of the backing block 5 other than the upper surface. As shown in fig. 6, the sixth heat dissipation element 12 is attached to the lower surface 52 of the backing block 5; as shown in fig. 10, the sixth heat dissipating element 12 is attached to the first side surface 53 and the second side surface 54 of the backing block 5; as shown in fig. 11, the sixth heat dissipating element 12 is attached to the lower surface 52, the first side surface 53, and the second side surface 54 of the backing block 5; as shown in fig. 12, the sixth heat dissipating member 12 is attached to the lower surface 52, the first side surface 53, the second side surface 54, and the third side surface 55 of the backing block 5.

The sixth heat dissipation element 12 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, such as a flexible graphite film with high thermal conductivity, the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum.

The sixth heat dissipating element 12 is attached to at least one surface of the backing block 5 other than the upper surface. The sixth heat dissipation element 12 is attached to the other surface of the backing block except the upper surface, and the attachment position of the sixth heat dissipation element has little influence on the acoustic performance of the probe.

In the ultrasonic probe of the present embodiment, on the basis of the above embodiment, the sixth heat dissipation element 12 is additionally disposed on the backing block 5, the sixth heat dissipation element 12 is attached to the other surfaces of the backing block except the upper surface, and the heat concentrated in the middle of the piezoelectric layer 4 is rapidly transferred to the side surface of the backing block 5 through the sixth heat dissipation element 12, so that the heat conduction area is increased, the heat conduction efficiency is improved, and the heat dissipation effect is further improved.

The present embodiment provides an ultrasound probe, and the ultrasound probe of the present embodiment adds the heat dissipation block 13 on the basis of the above-described embodiments.

The heat dissipation block 13 is attached to at least one surface of the backing block 5 other than the upper surface.

As shown in fig. 6, 7, 8 and 9, the heat dissipation block 13 is attached to the lower surface 52 of the backing block 5; as shown in fig. 13 and 14, the heat dissipation block 13 is attached to the lower surface 52 and the first and second side surfaces 53 and 54 of the backing block 5; as shown in fig. 15, the heat dissipation block 13 is attached to five surfaces of the backing block 5 except the upper surface.

The radiating block 13 is a metal block or a graphite block with high heat conductivity and large specific heat capacity, and the radiating block 13 is preferably an aluminum block.

In the ultrasonic probe provided by the embodiment, the heat dissipation block 13 is additionally arranged on the backing block 5 on the basis of the above embodiment, the heat dissipation block 13 is attached to the other five surfaces of the backing block 5 except the upper surface, so that the heat dissipation effect is further improved, the heat dissipation block 13 can be connected with the heat dissipation structure at the rear end of the backing block 5, and then the heat dissipation block is attached to other components of the ultrasonic probe to form the ultrasonic probe with a good heat dissipation effect, so that the heat capacity of the heat dissipation structure can be increased, and the heat dissipation effect is prevented from being influenced by temperature jump.

The present embodiment provides an ultrasound probe, and the ultrasound probe of the present embodiment adds a seventh heat dissipation element 14 on the basis of the above-described embodiments.

The seventh heat dissipating element 14 is attached to at least one surface of the heat dissipating block 13.

As shown in fig. 10 and 11, the heat dissipating block 13 is attached to the lower surface 52 of the backing block 5, and the seventh heat dissipating element 14 is attached to the first side surface 131 and the second side surface 132 of the heat dissipating block 13, wherein the surface of the heat dissipating block 13 attached to the lower surface 52 of the backing block is the upper surface 131 of the heat dissipating block 13, the surface opposite to the backing block is the lower surface 132, and the first side surface 133 and the second side surface 134 of the heat dissipating block 13 are shown in fig. 10.

As shown in fig. 16, the heat dissipating blocks 13 are attached to the lower surface 52 and the first and second side surfaces 53 and 54 of the backing block 5, and a seventh heat dissipating member is attached to each of the heat dissipating blocks on the side surface thereof opposite to the backing block.

The seventh heat dissipation element 14 is a metal foil with a high thermal conductivity or a flexible graphite film with a high thermal conductivity, preferably a flexible graphite film with a high thermal conductivity, the thermal conductivity of the flexible graphite film with a high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum.

In the ultrasonic probe provided by the embodiment, the seventh heat dissipation element 14 is added on the basis of the above embodiment, so that the heat conduction efficiency is further improved, the heat dissipation block 13 can be connected with the heat dissipation and structure at the rear end of the backing block 5, the heat capacity of the heat dissipation mechanism can be increased, and the heat dissipation effect is prevented from being influenced by sudden temperature change.

Claims

1. An ultrasound probe, comprising:

an acoustic window;

a matching layer connected to the acoustic window;

a piezoelectric layer connected to the matching layer;

a backing block comprising an upper surface, a lower surface, a first side surface, a second side surface, a third side surface, and a fourth side surface, the upper surface of the backing block being connected to the piezoelectric layer;

a probe housing at least partially housing the acoustic window, the matching layer, the piezoelectric layer, and a backing block;

wherein the backing block is internally provided with a first heat dissipation element, the first heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the first side surface of the backing block, and the extending direction of the first heat dissipation element from the first end to the second end forms a first included angle with the thickness direction of the backing block from the upper surface of the backing block to the lower surface of the backing block.

2. The ultrasound probe of claim 1, wherein a plurality of the first heat dissipating elements are disposed within the backing block.

3. The ultrasound probe of claim 2, wherein the plurality of first heat dissipating elements are parallel to each other and aligned in a first direction perpendicular to a thickness direction of the backing block.

4. The ultrasound probe of any of claims 1 to 3, wherein the first heat spreading element is a metal foil or a flexible graphite film.

5. The ultrasound probe of any of claims 1 to 3, wherein: the thickness of the first heat dissipation element is not more than 500 micrometers, or the thickness of the first heat dissipation element is not more than 25 micrometers.

6. The ultrasound probe of any of claims 1 to 3, wherein: the acoustic impedance of the first heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the first heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

7. The ultrasound probe of any of claims 1 to 6, wherein: the backing block is internally provided with a second heat dissipation element, the second heat dissipation element comprises a first end and a second end, the first end is adjacent to or extends to the upper surface of the backing block, the second end extends to the lower surface or the second side surface of the backing block, and the extending direction of the second heat dissipation element from the first end of the second heat dissipation element to the second end of the second heat dissipation element forms a second included angle with the thickness direction of the backing block.

8. The ultrasound probe of claim 7, wherein a plurality of the second heat dissipating elements are disposed within the backing block.

9. The ultrasound probe of claim 8, wherein the plurality of second heat dissipating elements are parallel to each other and aligned in a first direction perpendicular to a thickness direction of the backing block.

10. The ultrasound probe of any of claims 7 to 9, wherein: the first heat dissipation element and the second heat dissipation element are connected with each other.

11. The ultrasound probe of any of claim 10, wherein: the first end of the first heat dissipation element and the first end of the second heat dissipation element are connected with each other.

12. The ultrasound probe of any of claims 7 to 11, wherein the second heat spreading element is a metal foil or a flexible graphite film.

13. The ultrasound probe of any of claims 7 to 11, wherein: the thickness of the second heat dissipation element is not greater than 500 micrometers, or the thickness of the second heat dissipation element is not greater than 25 micrometers.

14. The ultrasound probe of any of claims 7 to 11, wherein: the acoustic impedance of the second heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the second heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

15. The ultrasound probe of any of claims 1 to 14, wherein: the backing block is also internally provided with a third heat dissipation element, the third heat dissipation element comprises a first end adjacent to or extending to the upper surface of the backing block and a second end extending to the lower surface or the third side surface of the backing block, and the extending direction of the third heat dissipation element from the first end of the third heat dissipation element to the second end of the third heat dissipation element forms a third included angle with the thickness direction of the backing block.

16. The ultrasound probe of claim 15, wherein a plurality of the third heat dissipating elements are disposed within the backing block.

17. The ultrasound probe of claim 16, wherein the plurality of third heat dissipating elements are parallel to each other and aligned along a second direction perpendicular to the thickness direction of the backing block.

18. The ultrasound probe of any of claims 15 to 17, wherein: the third heat dissipation element is interconnected with the first heat dissipation element and/or the second heat dissipation element.

19. The ultrasound probe of any of claim 18, wherein: the first end of the third heat dissipation element is interconnected with the first end of the first heat dissipation element and/or the first end of the second heat dissipation element.

20. The ultrasound probe of any of claims 15 to 19, wherein the third heat spreading element is a metal foil or a flexible graphite film.

21. The ultrasound probe of any of claims 15 to 19, wherein: the thickness of the third heat dissipation element is not more than 500 micrometers, or the thickness of the third heat dissipation element is not more than 25 micrometers.

22. The ultrasound probe of any of claims 15 to 19, wherein: the acoustic impedance of the third heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the third heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

23. The ultrasound probe of any of claims 1 to 22, wherein: the back lining block is also internally provided with a fourth heat dissipation element, the fourth heat dissipation element comprises a first end which is adjacent to or extends to the upper surface of the back lining block and a second end which extends to the lower surface or the fourth side surface of the back lining block, and the extending direction of the fourth heat dissipation element from the first end of the fourth heat dissipation element to the second end of the fourth heat dissipation element forms a fourth included angle with the thickness direction of the back lining block.

24. The ultrasound probe of claim 23, wherein a plurality of the fourth heat dissipating elements are disposed within the backing block.

25. The ultrasound probe of claim 24, wherein the fourth plurality of heat dissipation elements are parallel to each other and aligned along a second direction perpendicular to the thickness direction of the backing block.

26. The ultrasound probe of any of claims 23 to 25, wherein: the fourth heat dissipation element is interconnected with the first heat dissipation element and/or the second heat dissipation element and/or the third heat dissipation element.

27. The ultrasound probe of any of claim 26, wherein: the first end of the fourth heat dissipation element is interconnected with the first end of the first heat dissipation element and/or the first end of the second heat dissipation element and/or the first end of the third heat dissipation element.

28. The ultrasound probe of any of claims 23 to 27, wherein the fourth heat dissipation element is a metal foil or a flexible graphite film.

29. The ultrasound probe of any of claims 23 to 27, wherein: the thickness of the fourth heat dissipation element is no greater than 500 micrometers, or the thickness of the fourth heat dissipation element is no greater than 25 micrometers.

30. The ultrasound probe of any of claims 23 to 27, wherein: the acoustic impedance of the fourth heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the fourth heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

31. The ultrasound probe of any of claims 1 to 30, further comprising a fifth heat dissipating element attached to an upper surface of the backing block.

32. The ultrasound probe of any of claims 1 to 31, wherein the probe further comprises a sixth heat dissipating element attached to at least one other surface of the backing block than the upper surface.

33. The ultrasound probe of any one of claims 1 to 32, wherein the probe further comprises a heat slug attached to at least one surface of the backing slug other than the upper surface.

34. The ultrasound probe of claim 33, further comprising a seventh heat dissipating element, wherein the seventh heat dissipating membrane is attached to at least one surface of the heat dissipating block.