CN210170073U - Ultrasonic probe - Google Patents

Abstract

An ultrasonic probe comprises an acoustic window, a matching layer, a piezoelectric layer, a circuit board, a backing block and a probe shell, wherein a first radiating element and a second radiating element are arranged inside the backing block, the first radiating element is parallel to the upper surface of the backing block, and the second radiating element is intersected with the first radiating element. The heat at piezoelectric layer middle part can carry out heat-conduction along first radiating element and second radiating element, further increase heat conduction area, improve heat conduction efficiency for the heat exchange in back lining piece piezoelectric layer middle part is abundant, can in time lead-in the periphery or the rear end of probe fast with the heat, makes this ultrasonic transducer's radiating effect good, can guarantee that the ultrasonic transducer still is in the low temperature state in the long-time use.

Description

Ultrasonic probe

Technical Field

The application relates to medical detection equipment, in particular to an ultrasonic probe.

Background

The working principle of the ultrasonic probe is that the piezoelectric effect is utilized to convert an excitation electric pulse signal of an ultrasonic complete machine into an ultrasonic signal to enter a patient body, and then an ultrasonic echo signal reflected by a tissue is converted into an electric signal, so that the tissue is detected. During the conversion of the electro-acoustic signal, the operating ultrasound probe generates a large amount of heat, resulting in an increase in the temperature of the probe. On the one hand, the heating of the probe may affect the personal safety of the patient, and the regulation clearly stipulates that the temperature of the probe when in contact with the patient cannot exceed a certain temperature. On the other hand, if the probe works at a higher temperature for a long time, the aging of the probe is accelerated, and the service life of the probe is shortened. From the viewpoint of medical examination and diagnosis, it is desired to increase the examination depth of the probe. Improving the excitation voltage of the whole machine to the probe is an effective means for increasing the detection depth of the probe. However, an increase in the excitation voltage causes the probe to generate more heat. Thus, heating of the probe severely impacts patient comfort, probe life and performance.

Some current heat dissipation schemes for ultrasonic probes are to mount heat sinks on the sides or around the ultrasonic probe in an attempt to direct heat to the back end of the probe. The heat generated by the ultrasonic probe is mainly caused by incomplete electroacoustic conversion of the piezoelectric material, and the piezoelectric material is not a good thermal conductor, so that the heat is mainly accumulated in the middle of the probe array element. And the radiating fins on the side or periphery of the probe cannot be close to the center of the heat source sufficiently, and meanwhile, the sectional area of the radiating side plate is too small to perform sufficient heat exchange with the array element of the probe. The problem of probe heating is still not well solved.

Other ultrasound probe heat dissipation schemes regularly insert fins or arrays of fins in the backing material along the normal to the probe. Although the heat radiating fins can be close to the center of the heat source of the probe, the heat radiating fins are thick, so that the acoustics of the probe is greatly influenced, and the thin heat radiating effect is limited. It is difficult to combine probe performance with heat dissipation.

Disclosure of Invention

In one embodiment, the ultrasonic probe is characterized by comprising an acoustic window, a matching layer, a piezoelectric layer, a circuit board, a backing block and a probe shell, wherein the acoustic window, the matching layer, the piezoelectric layer, the circuit board and the backing block are sequentially connected, and the ultrasonic probe further comprises a first heat dissipation element arranged inside the backing block, and the first heat dissipation element is parallel to the upper surface of the backing block.

In one embodiment, the backing mass is internally provided with a plurality of said first heat dissipating elements.

In one embodiment, the backing block further includes a lower surface opposite to the upper surface, and a plurality of the first heat dissipation elements are parallel to each other and sequentially arranged in a direction from the upper surface to the lower surface, wherein a pitch between the first heat dissipation elements adjacent to the lower surface is larger than a pitch between the first heat dissipation elements adjacent to the upper surface.

In one embodiment, the first heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the first heat dissipating element is no greater than 500 microns, or the thickness of the first heat dissipating element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the first heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the first heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the backing block is further provided with a second heat dissipation element inside, and the second heat dissipation element intersects with the first heat dissipation element.

In one embodiment, the second heat dissipation element is perpendicular to the first heat dissipation element.

In one embodiment, the backing block is internally provided with a plurality of the second heat dissipating elements.

In one embodiment, a plurality of the second heat dissipation elements are parallel to each other.

In one embodiment, the second heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the second heat dissipating element is no greater than 500 microns, or the thickness of the second heat dissipating element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the second heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the second heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

In one embodiment, the backing block includes at least one side surface, the first heat dissipation element extends out of the backing block at least one side surface, and a heat dissipation side plate is attached to the backing block side surface and is in contact with the first heat dissipation element.

In one embodiment, the backing block further comprises at least one side surface, and a third heat dissipation element is attached to the side surface of the backing block, and is integrally formed with or connected to the first heat dissipation element.

In one embodiment, the third heat dissipation element is attached with a heat dissipation side plate.

In one embodiment, the ultrasonic probe further comprises a fourth heat dissipation element attached to the upper surface of the backing block.

In one embodiment, the backing block comprises at least one side surface, the first heat dissipation element and/or the fourth heat dissipation element extends out of the backing block from at least one side surface, and the backing block is attached with a heat dissipation side plate which is in contact with the first heat dissipation element and/or the fourth heat dissipation element.

In one embodiment, the backing block further comprises at least one side surface, and a third heat dissipation element is attached to the side surface of the backing block, and is integrally formed with or connected to the first heat dissipation element and/or the fourth heat dissipation element.

In one embodiment, the third heat dissipation element is attached with a heat dissipation side plate.

In one embodiment, the heat dissipation side plate is a metal plate or a graphite plate.

In one embodiment, the heat-dissipating side plate has a thickness of 0.1 mm to 3 mm.

In one embodiment, the third heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the fourth heat-dissipating component is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the fourth heat dissipation element is no greater than 500 microns, or the thickness of the fourth heat dissipation element is no greater than 25 microns.

In one embodiment, the acoustic impedance of the fourth heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the fourth heat dissipating element differs from the acoustic impedance of the backing block by less than 1 mrayle.

The ultrasonic probe according to the above embodiment, wherein the backing block is provided inside with a first heat dissipating element and a second heat dissipating element, the first heat dissipating element is provided inside the backing block, the first heat dissipating element is parallel to the upper surface of the backing block, and the second heat dissipating element intersects the first heat dissipating element. The heat at piezoelectric layer middle part can carry out heat-conduction along first radiating element and second radiating element, further increase heat conduction area, improve heat conduction efficiency for the heat exchange in back lining piece piezoelectric layer middle part is abundant, can in time lead-in the periphery or the rear end of probe fast with the heat, makes this ultrasonic transducer's radiating effect good, can guarantee that the ultrasonic transducer still is in the low temperature state in the long-time use.

Drawings

FIG. 1 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 2 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 3 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 4 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 5 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 6 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 7 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 8 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 9 is a schematic diagram of an ultrasound probe in one embodiment;

FIG. 10 is a schematic structural diagram of an ultrasonic probe in the embodiment;

FIG. 11 is a schematic structural diagram of an ultrasonic probe in an embodiment;

Detailed Description

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

In one embodiment, an ultrasound probe is provided, as shown in fig. 1, an ultrasound probe 1 of this embodiment mainly includes an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5, a circuit board 11, and a probe housing 6 (the probe housing 6 is not labeled in the figure), where the matching layer 3 is connected to the acoustic window 2, the piezoelectric layer 4 is connected to the matching layer 3, the circuit board 11 is connected to the piezoelectric layer 4, and the backing block 5 is connected to the circuit board 11, where the acoustic window 2 may be designed as a planar structure or as a structure having an ultrasonic wave focusing function, such as a convex structure, and an acoustic window of the convex structure may be referred to as an acoustic lens. The backing block 5 includes an upper surface 51, a lower surface 52, a first side surface 53, a second side surface 54, a third side surface 55 and a fourth side surface 56, wherein the upper surface 51 is defined as the side of the backing block 5 attached to the piezoelectric layer 4, and the other four side surfaces are shown in fig. 1, and the probe housing 6 at least partially houses the acoustic window 2, the matching layer 3, the piezoelectric layer 4 and the backing block 5. As shown in fig. 2, a first heat radiating member 7 is provided inside the backing block 5, and the first heat radiating member 7 is parallel to the upper surface of the backing block 5.

In one embodiment, as shown in fig. 3, the backing block 5 is provided with a plurality of first heat dissipation elements 7 inside, and the plurality of first heat dissipation elements 7 are parallel to the upper surface of the backing block 5.

In one embodiment, as shown in fig. 3, the backing block 5 is internally provided with a plurality of first heat dissipation elements 7, the backing block 5 comprises an upper surface 51 and a lower surface 52, the plurality of first heat dissipation elements 7 are parallel to each other and are sequentially arranged along a direction from the upper surface 51 to the lower surface 52 of the backing block, wherein the spacing between the first heat dissipation elements 7 adjacent to the lower surface 52 of the backing block is larger than the spacing between the first heat dissipation elements 7 adjacent to the upper surface of the backing block. In the vertical direction from the upper surface 51 to the lower surface 52 of the backing block, the closer to the piezoelectric layer 4, the larger the heat, the smaller the distance between the arranged first heat dissipation elements, which is beneficial to conducting the heat concentrated in the middle of the piezoelectric layer to the periphery or the rear end of the backing block as soon as possible, thereby ensuring the excellent heat dissipation effect, reducing the volume of the backing block and being beneficial to saving the cost of the probe.

In one embodiment, the first heat dissipation element 7 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding that of metal foils such as copper and aluminum. The thickness of the first heat dissipation element 7 is not more than 500 micrometers, and further, in one embodiment, the thickness of the first heat dissipation element 7 is not more than 25 micrometers.

In one embodiment, the impedance of the first heat dissipating element 7 may be equal to or similar to the acoustic impedance of the backing mass 5, for example, the acoustic impedance of the first heat dissipating element 7 may be the same as the acoustic impedance of the backing mass 5 or differ by less than 1 mrayl. In this way, the influence of the first heat-radiating element 7 on the acoustic performance of the probe can be further reduced.

The embodiment provides an ultrasonic probe, the inside of backing block 5 is provided with first radiating elements 7, a plurality of first radiating elements 7 are parallel to each other and are arranged in sequence along the direction from backing block upper surface 51 to lower surface 52, wherein the distance between the first radiating elements 7 adjacent to backing block lower surface 52 is greater than the distance between the first radiating elements 7 adjacent to backing block upper surface 51, which is beneficial to conducting the heat concentrated in the middle of piezoelectric layer 4 to the periphery or rear end of backing block 5 as soon as possible, and improving the heat conduction efficiency, so that the ultrasonic probe has good radiating effect, and can ensure that the ultrasonic probe is still in a low-temperature state in the long-time use process.

In one embodiment, an ultrasonic probe is provided, and based on the above embodiment, as shown in fig. 4, a second heat dissipation element 8 is additionally arranged inside the backing block 5, and the second heat dissipation element 8 intersects with the first heat dissipation element 7. The first heat dissipation element 7 may be parallel to the backing block upper surface 51. The second heat dissipation element 8 may intersect the first heat dissipation element 7 perpendicularly or may intersect the first heat dissipation element 7 non-perpendicularly.

In one embodiment, the inside of the backing block 5 is provided with a second heat dissipation element 8 perpendicularly intersecting the first heat dissipation element 7, the first heat dissipation element 7 is parallel to the upper surface 51 of the backing block, the second heat dissipation element 8 can intersect the first heat dissipation element 7 at any angle with the first side surface 53 of the backing block, and the second heat dissipation element 8 can also perpendicularly intersect the first heat dissipation element 7 at any angle with the third side surface 55. As shown in fig. 4, the second heat dissipation element 8 is parallel to the backing block first side surface 53 and perpendicular to the first heat dissipation element 7; as shown in fig. 5, the second heat dissipating element 9 is parallel to the third side surface 55 of the backing block and perpendicular to the first heat dissipating element 7. The first heat dissipation element 7 is parallel to the piezoelectric layer, the second heat dissipation element 8 is perpendicular to the piezoelectric layer, the first heat dissipation element 7 is intersected with the second heat dissipation element 8, so that the heat concentrated in the middle of the piezoelectric layer can be guided out along two directions parallel to the piezoelectric layer and perpendicular to the piezoelectric layer, the heat dissipation area is further increased, the heat dissipation efficiency is improved,

in one embodiment, a plurality of second heat dissipation elements 8 are disposed inside the backing block 5, the plurality of second heat dissipation elements 8 can intersect the first heat dissipation element 7 at any angle, and the second heat dissipation elements 8 intersect the first heat dissipation element 7 perpendicularly, as shown in fig. 4 and 5.

In one embodiment, the plurality of second heat dissipation elements 8 inside the backing block 5 are parallel to each other. As shown in fig. 4, the second heat dissipation elements 8 are parallel to each other, and the second heat dissipation elements 8 are parallel to the first side surface 53 of the backing block 5; as shown in fig. 5, the second heat dissipating elements are parallel to each other, and the second heat dissipating elements are parallel to the third side surface 55 of the backing block 5.

In one embodiment, the second heat dissipation element 8 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding that of metal foils such as copper and aluminum. The thickness of the second heat dissipation element 8 is not greater than 500 micrometers, and further, in one embodiment, the thickness of the second heat dissipation element 8 is not greater than 25 micrometers.

In one embodiment, the impedance of the second heat dissipating element 8 may be equal to or similar to the acoustic impedance of the backing mass, e.g., the acoustic impedance of the second heat dissipating element 8 may be the same as the acoustic impedance of the backing mass 5 or differ by less than 1 mrayl. In this way, the influence of the second heat-radiating element 8 on the acoustic performance of the probe can be further reduced.

In the present embodiment, a second heat dissipation element 8 is added inside the backing block 5, and the second heat dissipation element 8 intersects with the first heat dissipation element 7. The heat in the middle part of the piezoelectric layer 4 can be conducted along the first heat radiating element 7 and the second heat radiating element 8, the heat conduction area is further increased, the heat conduction efficiency is improved, the heat exchange between the backing block 5 and the middle part of the piezoelectric layer 4 is sufficient, the heat can be timely and quickly conducted into the periphery or the rear end of the probe, the heat radiation effect of the ultrasonic probe is good, and the ultrasonic probe can be guaranteed to be still in a low-temperature state in a long-time use process.

In one embodiment, based on the above embodiment, the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, and a fourth side surface 56, the first heat dissipation member 7 extends out of at least one side surface of the backing block, the side surface of the backing block 5 is attached with the heat dissipation side plate 9, and the heat dissipation side plate 9 is in contact with the first heat dissipation member 7. The heat dissipation side plate 9 can be attached to the side surface of the backing block and can also extend to the rear end of the probe, the front sections of the probe sound-removing lens 2, the matching layer 3, the piezoelectric layer 4 and the backing block 5 are arranged at the rear end of the probe, the rest parts of the probe are the rear end of the probe 1, and the first heat dissipation element 7 is connected with a heat dissipation mechanism at the rear end of the probe 1 through heat conduction glue. The heat radiating side plate 9 is advantageous for conducting the heat of the first heat radiating element 7 to the periphery of the backing block 5 or the rear end of the probe.

In one embodiment, as shown in fig. 2 and 3, the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, and a fourth side surface 56, and the third heat dissipation element 10 is attached to the side surface of the backing block 5, wherein the third heat dissipation element 10 and the first heat dissipation element 7 may be integrally formed, and the third heat dissipation element 10 may also be connected to the first heat dissipation element 7. The third heat dissipation element 10 can be attached to the side surface of the backing block 5 and can also extend to the rear end of the probe, and the side plate of the third heat dissipation element 10 is beneficial to guiding the heat of the first heat dissipation element 7 out of the periphery of the backing block 5 or the rear end of the probe.

In one embodiment, on the basis of the above embodiment, the heat dissipation side plate 9 is attached to the third heat dissipation element 10, and the heat dissipation side plate can be attached to the third heat dissipation element 10 and can extend to the rear end of the probe, so as to further improve the heat dissipation efficiency, and guide the heat of the first heat dissipation element 7 to the periphery of the backing block 5 or the rear end of the probe.

In one embodiment, on the basis of the above embodiment, the ultrasonic probe further comprises a fourth heat dissipation element 11, and the fourth heat dissipation element 11 is attached to the upper surface 51 of the backing block.

In one embodiment, the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, and a fourth side surface 56, the first heat dissipation element 7 and/or the fourth heat dissipation element 11 extends out of at least one side surface of the backing block 5, the side surface of the backing block 5 is attached with a heat dissipation side plate 9, and the heat dissipation side plate 9 is in contact with the first heat dissipation element 7. The heat dissipation side plate 9 may be attached to the side surface of the backing block 5, or may extend to the rear end of the probe, and is favorable for guiding the heat of the first heat dissipation element 7 and/or the heat to the periphery or the rear end of the backing block 5.

In one embodiment, the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, and a fourth side surface 56, and the side surface of the backing block 5 is attached with a third heat dissipation member 10, wherein the third heat dissipation member 10 and the first heat dissipation member 7 and/or the fourth heat dissipation member 11 may be integrally formed, and the third heat dissipation member 10 may also be connected with the first heat dissipation member 7 and/or the fourth heat dissipation member 11. As shown in fig. 6 and 7, the third heat dissipation element 10 is integrally formed with or connected to the fourth heat dissipation element 11; as shown in fig. 8 and 9, the third heat dissipation element 10 is integrally formed with or connected to the first heat dissipation element 7 and the fourth heat dissipation element 11. The third heat dissipation element 10 can be attached to the side surface of the backing block 5 and can also extend to the rear end of the probe, and the third heat dissipation element 10 side plate is beneficial to guiding the heat of the first heat dissipation element 7 and/or the fourth heat dissipation element 11 out to the periphery of the backing block 5 or the rear end of the probe.

In one embodiment, as shown in fig. 10 and 11, on the basis of the above embodiments, the heat-dissipating side plate 9 is attached to the third heat-dissipating element 10, and the heat-dissipating side plate 9 may be attached to the third heat-dissipating element 10 and may extend to the rear end of the probe, so as to further improve the heat-dissipating efficiency, and guide the heat of the first heat-dissipating element 7 and/or the fourth heat-dissipating element 11 to the periphery of the backing block 5 or the rear end of the probe.

In one embodiment, the heat dissipation side plate is a metal plate or a graphite plate.

In one embodiment, the heat-dissipating side plate has a thickness of 0.1 mm to 3 mm.

In one embodiment, the third heat dissipation element 10 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding that of metal foils such as copper and aluminum. The thickness of the third heat dissipation element 10 is not greater than 500 micrometers, and further, in one embodiment, the thickness of the third heat dissipation element 10 is not greater than 25 micrometers.

In one embodiment, the fourth heat dissipation element 11 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W/m · K, far exceeding the thermal conductivity of metal foils such as copper and aluminum. The thickness of the fourth heat dissipation element 11 is not greater than 500 micrometers, and further, in one embodiment, the thickness of the fourth heat dissipation element 11 is not greater than 25 micrometers.

In one embodiment, the impedances of the fourth heat dissipating elements 11 are each equal to or similar to the acoustic impedance of the backing mass, e.g., the acoustic impedance of the fourth heat dissipating elements 11 may be the same as the acoustic impedance of the backing mass 5 or differ by less than 1 mrayl. In this way, the influence of the fourth heat dissipation element 11 on the acoustic performance of the probe can be further reduced.

The embodiment provides an ultrasonic probe, wherein a third heat dissipation element 10 and/or a heat dissipation side plate 9 is attached to at least one side surface of the backing block 5, so that heat in the middle of the piezoelectric layer 4 can be quickly conducted to the periphery of the backing block 5 or the rear end of the probe, and the heat conduction efficiency is further improved.

Claims (31)

1. An ultrasound probe, comprising:

an acoustic window;

a matching layer connected to the acoustic window;

a piezoelectric layer connected to the matching layer;

a circuit board connected to the piezoelectric layer;

a backing block comprising an upper surface, the upper surface of the backing block connected to the circuit board;

a probe housing at least partially housing the acoustic window, the matching layer, the piezoelectric layer, and a backing block;

the back pad block is internally provided with a first heat dissipation element and a second heat dissipation element, the first heat dissipation element is parallel to the upper surface of the back pad block, and the second heat dissipation element is intersected with the first heat dissipation element.

2. The ultrasound probe of claim 1, wherein the second heat spreading element is perpendicular to the first heat spreading element.

3. The ultrasound probe of claim 1, wherein a plurality of the first heat dissipating elements are disposed within the backing block.

4. The ultrasound probe of any of claims 1 to 3, wherein the backing block further comprises a lower surface opposite the upper surface, a plurality of the first heat dissipating elements being parallel to each other and arranged in sequence in a direction from the upper surface to the lower surface, wherein a spacing between the first heat dissipating elements adjacent to the lower surface is greater than a spacing between the first heat dissipating elements adjacent to the upper surface.

5. The ultrasound probe of claim 1, wherein a plurality of the second heat dissipating elements are disposed within the backing block.

6. The ultrasound probe of claim 5, wherein a plurality of the second heat dissipating elements are parallel to each other.

7. The ultrasound probe of claim 1, wherein the backing block includes at least one side surface, the first heatsink element extends beyond the at least one side surface of the backing block, and a heatsink side plate is attached to the backing block side surface, the heatsink side plate contacting the first heatsink element.

8. The ultrasound probe of claim 1, wherein the backing block further comprises at least one side surface to which is attached a third heat dissipating element that is integrally formed with or connected to the first heat dissipating element.

9. The ultrasound probe of claim 8, wherein the third heat dissipating element is attached to a heat dissipating side plate.

10. The ultrasound probe of claim 1, further comprising a fourth heat dissipating element attached to an upper surface of the backing block.

11. The ultrasound probe of claim 10, wherein the backing block includes at least one side surface, the first and/or fourth heat dissipating elements extending beyond the backing block at least one of the side surfaces, the backing block side surface being conformed to a heat dissipating side plate, the heat dissipating side plate being in contact with the first and/or fourth heat dissipating elements.

12. The ultrasound probe of claim 10, wherein the backing block further comprises at least one side surface, the side surface of the backing block being conformed to a third heat dissipating element, the third heat dissipating element being integrally formed with or connected to the first heat dissipating element and/or the fourth heat dissipating element.

13. The ultrasound probe of claim 12, wherein the third heat dissipating element is attached to a heat dissipating side plate.

14. The ultrasound probe of claim 7, 9, 11 or 13, wherein the heat-dissipating side plate is a metal plate or a graphite plate.

15. The ultrasound probe of claim 14, wherein the heat sink side plate thickness is between 0.1 mm and 3 mm.

16. The ultrasound probe of claim 1, wherein the first and second heat spreading elements are metal foils or flexible graphite films.

17. The ultrasound probe of claim 1, wherein: the first and second heat dissipation elements have a thickness of no greater than 500 microns, or the first and second heat dissipation elements have a thickness of no greater than 25 microns.

18. The ultrasound probe of claim 1, wherein: the acoustic impedances of the first and second heat dissipating elements are equal to the acoustic impedance of the backing block, or the difference between the acoustic impedances of the first and second heat dissipating elements and the acoustic impedance of the backing block is less than 1 megarayl.

19. The ultrasound probe of claim 8, 9, 12 or 13, wherein the third heat spreading element is a metal foil or a flexible graphite film.

20. The ultrasound probe of claim 10, wherein the fourth heat dissipating element is a metal foil or a flexible graphite film.

21. The ultrasound probe of claim 10, wherein: the thickness of the fourth heat dissipation element is no greater than 500 micrometers, or the thickness of the fourth heat dissipation element is no greater than 25 micrometers.

22. The ultrasound probe of claim 10, wherein: the acoustic impedance of the fourth heat dissipating element is equal to the acoustic impedance of the backing block or the acoustic impedance of the fourth heat dissipating element differs from the acoustic impedance of the backing block by less than 1 megarayl.

23. An ultrasound probe, comprising:

an acoustic window;

a matching layer connected to the acoustic window;

a piezoelectric layer connected to the matching layer;

a circuit board connected to the piezoelectric layer;

a backing block comprising an upper surface, the upper surface of the backing block connected to the circuit board;

a probe housing at least partially housing the acoustic window, the matching layer, the piezoelectric layer, and a backing block;

wherein, the inside of the backing block is provided with a first heat dissipation element which is parallel to the upper surface of the backing block.

24. The ultrasound probe of claim 23, wherein a plurality of the first heat dissipating elements are disposed within the backing block.

25. The ultrasound probe of claim 23 or 24, wherein the backing block further comprises a lower surface opposite the upper surface, a plurality of the first heat dissipating elements being parallel to each other and arranged sequentially in a direction from the upper surface to the lower surface, wherein a spacing between the first heat dissipating elements adjacent to the lower surface is greater than a spacing between the first heat dissipating elements adjacent to the upper surface.

26. The ultrasound probe of claim 23, wherein the first heat spreading element is a metal foil or a flexible graphite film.

27. The ultrasound probe of claim 23, wherein the backing block is further provided with a second heat dissipating element therein, the second heat dissipating element intersecting the first heat dissipating element.

28. The ultrasound probe of claim 27, wherein the second heat spreading element is perpendicular to the first heat spreading element.

29. The ultrasound probe of claim 27 or 28, wherein a plurality of the second heat dissipating elements are provided inside the backing block.

30. The ultrasound probe of claim 29, wherein a plurality of the second heat dissipating elements are parallel to each other.

31. The ultrasound probe of claim 27, wherein the second heat spreading element is a metal foil or a flexible graphite film.

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