WO2020057482A1 - 基板、显示面板及显示装置 - Google Patents

基板、显示面板及显示装置 Download PDF

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Publication number
WO2020057482A1
WO2020057482A1 PCT/CN2019/106097 CN2019106097W WO2020057482A1 WO 2020057482 A1 WO2020057482 A1 WO 2020057482A1 CN 2019106097 W CN2019106097 W CN 2019106097W WO 2020057482 A1 WO2020057482 A1 WO 2020057482A1
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WO
WIPO (PCT)
Prior art keywords
substrate
connection line
display panel
film layer
fingerprint identification
Prior art date
Application number
PCT/CN2019/106097
Other languages
English (en)
French (fr)
Inventor
黄小霞
纪冰
曾杰
冯彬峰
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/760,054 priority Critical patent/US20210210568A1/en
Publication of WO2020057482A1 publication Critical patent/WO2020057482A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a substrate, a display panel, and a display device.
  • An aspect of the present disclosure provides a substrate including: a base substrate; a film layer on the base substrate, the film layer having an opening; a fingerprint recognition circuit located in the opening; The connection line connected to the fingerprint identification circuit, the connection line is at least partially embedded in the film layer.
  • the film layer includes a plurality of sub-layers, and the connection line is located within one of the plurality of sub-layers.
  • the film layer includes a plurality of sublayers, and the connection line is located between two adjacent sublayers of the plurality of sublayers.
  • the film layer is a heat dissipation film.
  • the heat dissipation film includes an adhesive layer, a buffer layer, a metal layer, and a release film that are sequentially stacked on the base substrate.
  • connection line is located within the buffer layer.
  • connection line is located between the buffer layer and the metal layer.
  • connection line is connected to the fingerprint recognition circuit at two positions of the fingerprint recognition circuit that are symmetrical about a center line of the fingerprint recognition circuit.
  • the orthographic projection of the fingerprint recognition circuit on the base substrate is rectangular, and the connection line is at the fingerprint recognition circuit on at least three sides of the fingerprint recognition circuit connection.
  • a distance between a connection position of the connection line and the fingerprint identification circuit and a position where the connection line extends into the film layer is equal to that of the fingerprint identification circuit. The distance from the center point to the side wall of the opening.
  • the orthographic projection of the opening on the base substrate is rectangular, and the fingerprint recognition circuit is located at the center of the opening.
  • Another aspect of the present disclosure provides a display panel including any one of the substrates described above.
  • the display panel is a liquid crystal display panel
  • the substrate is an array substrate of the liquid crystal display panel
  • a thin film transistor of the liquid crystal display panel is located between the base substrate and the substrate.
  • the film layer and the fingerprint recognition circuit are on opposite surfaces.
  • the display panel is an electroluminescence display panel
  • the substrate is an OLED substrate or a QLED substrate of the electroluminescence display panel
  • a thin film transistor of the electroluminescence display panel The first electrode, the light-emitting functional layer, and the second electrode are located on a surface of the base substrate opposite to the film layer and the fingerprint recognition circuit.
  • Another aspect of the present disclosure provides a display device including any one of the above display panels.
  • the above display device further includes a main board, wherein the connection line is connected to the main board, and the main board is configured to receive a signal transmitted by the connection line to implement fingerprint identification.
  • the motherboard is connected to the connection line through a main control line.
  • FIG. 1 is a schematic structural diagram of a typical display device
  • FIG. 2 is a schematic structural diagram of a substrate provided by an embodiment of the present disclosure
  • FIG. 3 (a) is a schematic structural diagram of a film layer in a substrate according to an embodiment of the present disclosure
  • FIG. 3 (b) is another schematic structural diagram of a film layer in a substrate according to an embodiment of the present disclosure
  • connection line connected to a fingerprint module according to an embodiment of the present disclosure
  • connection line connected to a fingerprint module according to an embodiment of the present disclosure
  • connection line connected to a fingerprint module according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • a fingerprint recognition circuit is usually attached to the back of the display panel.
  • a heat radiation film 20 is bonded to the back of the display panel 10.
  • the heat dissipation film 20 has openings, so that the fingerprint identification circuit 30 is disposed in the openings of the heat dissipation film 20, and the frame sealing adhesive 40 and the edge sealing adhesive 50 are used to adhere and assemble the fingerprint identification circuit 30 and the display panel 10.
  • the frame sealant 40 and the edge sealant 50 are disposed only in the openings of the heat dissipation film 20, and the frame sealant 40 and the edge sealant 50 and the display panel 10 are at a temperature such as a coefficient of thermal expansion, etc.
  • the frame sealant 40 and the edge sealant 50 and the display panel 10 are at a temperature such as a coefficient of thermal expansion, etc.
  • There is a large difference in the characteristics of the class so indentations are easily generated at the positions of the display panel 10 and the fingerprint recognition circuit 30, which causes the display of the display panel 10 to be uneven and affects the display
  • an embodiment of the present disclosure provides a substrate.
  • the substrate includes a base substrate 60 and a film layer 70 on the base substrate 60.
  • the film layer 70 has openings.
  • the substrate further includes a fingerprint identification circuit 30 located in the opening of the film layer 70, wherein the connection line 80 connected to the fingerprint identification circuit 30 is at least partially located in the film layer 70.
  • the type of the film layer 70 on the base substrate 60 is not limited, and may be any film layer provided according to a function to be realized.
  • the film layer 70 may be a protective film configured to protect a substrate, or a heat dissipation film configured to dissipate heat.
  • the film layer 70 may include one or more sub-layers.
  • the connection lines 80 connected to the fingerprint identification circuit 30 may be located in any one of the sub-layers of the film layer 70, or may be located between two adjacent sub-layers of the film layer 70.
  • the shape and size of the openings of the film layer 70 are not limited, and the fingerprint identification circuit 30 can be disposed in the openings of the film layer 70.
  • the positions of the openings in the film layer 70 can be located according to the position of the fingerprint recognition circuit 30 on the base substrate 60, and the position of the fingerprint recognition circuit 30 on the base substrate 60 can be set according to user requirements .
  • connection line 80 connected to the fingerprint recognition circuit 30 may be a rigid or flexible electrical connection structure, such as FPC (Flexible Printed Circuit, Flexible Circuit Board), FFC (Flexible Flat Cable, Flexible Flat Cable), or PCB (Printed Circuit Board, Printed circuit board) and so on.
  • FPC Flexible Printed Circuit, Flexible Circuit Board
  • FFC Flexible Flat Cable
  • PCB Printed Circuit Board, Printed circuit board
  • the structure of the fingerprint recognition circuit 30 is not limited, and it is subject to the realization of the fingerprint recognition function.
  • the fingerprint recognition circuit 30 may be a capacitive fingerprint recognition module or an optical fingerprint recognition module.
  • the capacitive fingerprint recognition module may include a driving electrode and a sensing electrode
  • the optical fingerprint recognition module may include a light source, a prism, and an image sensor.
  • the connection line 80 connected to the fingerprint identification circuit 30 is located in the film layer 70, the fingerprint identification circuit 30 can be fixed in the opening of the film layer 70. Further, since the film layer 70 is fixedly disposed on the base substrate 60, the fingerprint identification circuit 30 and the base substrate 60 can be brought into close contact with each other. Compared with the scheme shown in FIG. 1 in which the fingerprint recognition circuit 30 is bonded to the substrate 60 through the frame sealing adhesive 40 and the edge sealing adhesive 50, the frame sealing adhesive 40 and the edge sealing adhesive 50 are not used.
  • the substrate provided in the embodiment of the present disclosure is applied to the display panel 10, the indentation at the positions of the display panel 10 and the fingerprint recognition circuit 30 caused by the use of the frame sealant 40 and the edge sealant 50 can be avoided to affect the display effect The problem.
  • connection line connected to the fingerprint recognition circuit 30 is usually disposed above the film layer 70. Since other structures such as a motherboard or a control line may be provided above the film layer 70, in order to avoid other structures and connection lines from interacting with each other, it is usually necessary to bypass other connection structures. In this way, the difficulty of designing and manufacturing the substrate is increased. In contrast, in the above-mentioned embodiment of the present disclosure, since the connection line 80 is located within the film layer 70, problems such as an increase in design and process difficulty caused by the connection line 80 located above the film layer 70 are avoided.
  • the film layer 70 is a heat dissipation film.
  • heat-radiating film refers to any film layer having a heat-radiating function, which may be a single-layer or multi-layer structure, and may have functions other than heat-radiating as required.
  • the structure of the heat-dissipating film is not limited, and the heat-dissipating film may include a single layer or a plurality of sub-layers to achieve a variety of different functions.
  • connection line 80 may be located in any of the sub-layers.
  • the connecting line 80 may be located between any two adjacent sub-layers.
  • the heat dissipation film includes an adhesive layer 701, a buffer layer 702, a metal layer 703, and a release film 704, and the connection line 80 is located in the buffer layer 702.
  • the connection line 80 is located between the buffer layer 702 and the metal layer 703.
  • the buffer layer 702 can be made first, then the connection line 80 can be made on the buffer layer 702, and the metal layer 703 can be made on the connection line 80.
  • the connection line 80 may be a connection structure having an insulating encapsulation layer.
  • connection line 80 by arranging the connection line 80 between two adjacent sub-layers of the heat radiation film, on the one hand, the connection line 80 can be firmly fixed in the heat radiation film, and on the other hand, the heat radiation film Any one of the sub-layers can be manufactured at one time, thereby improving the efficiency of manufacturing a heat dissipation film.
  • the structure of the heat-dissipating film may include, as shown in FIGS. 701, a buffer layer 702, a metal layer 703, and a release film 704.
  • the connection line 80 is located in any sub-layer of the heat dissipation film, for example, as shown in FIG. 3 (a), the connection line 80 is located in the buffer layer 702.
  • the adhesive layer 701 is configured to adhere and fix the heat dissipation film on the base substrate 60.
  • the adhesive layer 701 may adopt grid adhesive (Embossing, EMBO for short).
  • the material of the buffer layer 702 is not limited, and may be, for example, foam.
  • the material of the metal layer 703 is not limited, and for example, it may be at least one of a simple metal or an alloy such as copper (Cu), molybdenum (Mo), and aluminum (Al).
  • the heat dissipation film when the heat dissipation film includes an adhesive layer 701, a buffer layer 702, a metal layer 703, and a release film 704 which are sequentially stacked on the base substrate 60, the heat dissipation film can achieve a better heat dissipation effect. .
  • connection line 80 is connected to only one side of the fingerprint recognition circuit 30, although the fingerprint recognition circuit 30 can be fixed in the opening of the film layer 70, the other of the fingerprint recognition circuit 30 The side may be lifted, so that the fingerprint film layer 30 and the base substrate 60 are not fully and fully in close contact with each other.
  • the connecting line 80 is connected to the fingerprint at two positions of the fingerprint identification circuit 30 that are symmetrical about the center line of the fingerprint identification circuit 30.
  • the identification circuit 30 is connected.
  • center line refers to a line that passes through the center of the fingerprint recognition circuit 30 and extends in a direction perpendicular to the substrate 60.
  • Two positions in the fingerprint recognition circuit 30 that are symmetrical with respect to the center line of the fingerprint recognition circuit 30 may be arbitrarily selected according to the shape of the fingerprint recognition circuit 30.
  • two positions symmetrical about the center line of the fingerprint recognition circuit 30 can be located in the fingerprint recognition circuit, respectively.
  • the left and right sides of 30, that is, the connection lines 80 are connected to the fingerprint recognition circuit 30 on the left and right sides of the fingerprint recognition circuit 30.
  • two positions symmetrical about the center line of the fingerprint recognition circuit 30 may be respectively located on the upper and lower sides of the fingerprint recognition circuit 30, that is, the connection line 80 is above and below the fingerprint recognition circuit 30. Both sides are connected to the fingerprint recognition circuit 30.
  • connection line 80 is connected to the fingerprint identification circuit 30 at least at two positions of the fingerprint identification circuit 30 which are symmetrical about the center line of the fingerprint identification circuit 30, the connection line 80 is connected to the fingerprint identification circuit. After 30 is connected, not only the fingerprint identification circuit 30 can be fixed in the opening of the film layer 70, but also the surface of the fingerprint identification circuit 30 that is opposite to the base substrate 60 and the base substrate 60 can be fully adhered completely.
  • connection line 80 is connected to the fingerprint identification circuit 30 at at least three sides of the fingerprint identification circuit 30.
  • the surface of the fingerprint identification circuit 30 opposite to the base substrate 60 is referred to as the bottom surface
  • the surface of the fingerprint identification circuit 30 opposite to the bottom surface is referred to as the top surface
  • the other of the fingerprint identification circuit 30 is referred to as the top surface. Faces are called sides.
  • the fingerprint identification circuit 30 may be connected to one, two or more connection lines 80.
  • the connection line 80 may be connected to the fingerprint identification circuit 30 at at least three sides of the fingerprint identification circuit 30. In this way, it is possible to further ensure that the fingerprint identification circuit 30 is fixed in the opening of the film layer 70, and further ensure that the surface of the fingerprint identification circuit 30 that is opposite to the base substrate 60 and the base substrate 60 are fully and fully in close contact.
  • the distance between the connection position of the connection line 80 and the fingerprint identification circuit 30 and the position where the connection line 80 extends into the film layer 70 is greater than the opening from the center point of the fingerprint identification circuit 30 to the film layer 70
  • the distance between the sidewalls may cause the fingerprint recognition circuit 30 to shake in the opening of the film layer 70.
  • the distance between the connection position of the connection line 80 and the fingerprint identification circuit 30 and the position where the connection line 80 extends into the film layer 70 can be made equal to the center point of the fingerprint identification circuit 30 to the film layer 70 The distance of the side wall of the opening.
  • the distance between the connection position of the connection line 80 and the fingerprint identification circuit 30 and the position where the connection line 80 extends into the film layer 70 is equal to the center point of the fingerprint identification circuit 30 to the film layer
  • the distance of the side wall of the opening of 70 can prevent the fingerprint recognition circuit 30 from shaking in the opening of the film layer 70.
  • the opening in the film layer 70 may be rectangular Holes, and rectangular holes are easier to make than holes of other shapes.
  • the fingerprint recognition circuit 30 may be located at the center of the rectangular opening, that is, the distance between any two opposite sides of the fingerprint recognition circuit 30 from the edge of the opening is equal, so as to prevent the fingerprint recognition circuit 30 from shaking in the opening. .
  • An embodiment of the present disclosure further provides a display panel including any of the substrates described above.
  • the display panel provided by the embodiment of the present disclosure may be a liquid crystal display panel (Liquid Crystal Display, LCD for short), or an electroluminescent display panel.
  • the electroluminescence display panel may be an organic electroluminescence display panel (Organic Light-Emitting Display, abbreviated as OLED), or a quantum dot electroluminescence display panel (Quantum Dot Light-Emitting Display, abbreviated as QLED).
  • the display panel when the display panel is a liquid crystal display panel, it typically includes an array substrate, a color filter substrate, and a liquid crystal layer located between the array substrate and the color filter substrate.
  • the substrate provided above may be an array substrate of a liquid crystal display panel.
  • the array substrate further includes a thin film transistor located on a base substrate, wherein the thin film transistor is located on a surface of the base substrate 60 opposite to the film layer 70 and the fingerprint identification circuit 30.
  • the display panel When the display panel is an electroluminescent display panel, it typically includes an OLED substrate (or QLED substrate) and a packaging cover or packaging film layer for packaging the OLED substrate (or QLED substrate).
  • the substrate provided above may be an OLED substrate or a QLED substrate.
  • the substrate provided above is an OLED substrate or a QLED substrate, it further includes a thin film transistor, a first electrode, a light emitting functional layer, a second electrode, and the like on the base substrate 60.
  • the thin film transistor, the first electrode, and a light emitting function The layer and the second electrode are located on the surface of the base substrate 60 opposite to the film layer 70 and the fingerprint identification circuit 30.
  • the substrate in the display panel has the same structure and beneficial effects as the substrate provided in the above embodiment. Since the above embodiment has described the structure and beneficial effects of the substrate in detail, Therefore, I will not repeat them here.
  • An embodiment of the present disclosure also provides a display device including any one of the above display panels.
  • the display device may be any device that displays an image regardless of motion (eg, video) or stationary (eg, still image) and regardless of text or drawing. More specifically, it is contemplated that the embodiments may be implemented in or associated with multiple electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs) , Handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, TV monitor, flat panel monitor, computer monitor, car monitor (e.g., Odometer display, etc.), navigator, cockpit controller and / or display, display of camera view (e.g. display of rear-view camera in a vehicle), electronic photo, electronic billboard or sign, projector, building structure, packaging And aesthetic structures (for example, a display for an image of a piece of jewelry), etc.
  • PDAs personal data assistants
  • Handheld or portable computer GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator,
  • the display panel includes the above substrate, so the display device has the same structure and beneficial effects as the substrate provided by the above embodiment. Since the above embodiment has already performed the structure and beneficial effects of the substrate The detailed description will not be repeated here.
  • the display device further includes a motherboard, and the connection line 80 is also connected to the motherboard.
  • the display device further includes a main board and a main control line 90, and the connection line 80 is connected to the main board through the main control line 90.
  • the motherboard is configured to receive a signal transmitted by the connection line 80 to implement fingerprint identification.
  • FIG. 6 illustrates the display device as a mobile phone as an example, and FIG. 6 only illustrates the connection line 80 and the main control line 90, and the motherboard and other structures are not illustrated.
  • connection line 80 connected to the fingerprint recognition circuit 30 is located in the film layer 70 and extends beyond the edge of the film layer 70, so that the connector is exposed at the edge of the film layer 70, and the connector is folded back to On the opposite surface of the film layer 70, it is further plugged or bound with the motherboard or the main control line 90.
  • connection line 80 is connected to the fingerprint identification circuit 30 and the connection line 80 is also directly connected to the motherboard, or the connection line 80 is connected to the motherboard through the main control line 90, the fingerprint identification circuit 30 can It is connected to the motherboard, and the motherboard can receive the signal transmitted by the connection line 80 to realize the fingerprint identification function.

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  • Human Computer Interaction (AREA)
  • Theoretical Computer Science (AREA)
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  • Crystallography & Structural Chemistry (AREA)
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Abstract

提供了一种基板，包括衬底基板；位于衬底基板上的膜层，膜层具有开孔；位于开孔中的指纹识别电路；以及与指纹识别电路相连的连接线，连接线至少部分地嵌入在所述膜层内。还提供了包括基板的显示面板和显示装置。

Description

基板、显示面板及显示装置
相关申请
本申请要求享有2018年9月21日提交的中国专利申请No.201811110553.7的优先权，其全部公开内容通过引用并入本文。
技术领域
本公开涉及显示技术领域，尤其涉及一种基板、显示面板及显示装置。
背景技术
随着科学技术的快速发展，各种终端设备已成为生活中的必需品，而用户对终端设备的要求也越来越高。对于安全性而言，指纹因具有个体唯一性特征，而被广泛应用在各种终端设备中，以增加用户体验以及安全性。
发明内容
本公开的一方面提供了一种基板，包括：衬底基板；位于所述衬底基板上的膜层，所述膜层具有开孔；位于所述开孔中的指纹识别电路；以及与所述指纹识别电路相连的连接线，所述连接线至少部分地嵌入在所述膜层内。
根据本公开的一些示例性实施例，所述膜层包括多个子层，并且所述连接线位于所述多个子层之一内。
根据本公开的一些示例性实施例，所述膜层包括多个子层，并且所述连接线位于所述多个子层中的相邻的两个子层之间。
根据本公开的一些示例性实施例，所述膜层为散热膜。
根据本公开的一些示例性实施例，所述散热膜包括依次层叠设置在所述衬底基板上的胶层、缓冲层、金属层以及离型膜。
根据本公开的一些示例性实施例，所述连接线位于所述缓冲层内。
根据本公开的一些示例性实施例，所述连接线位于所述缓冲层与所述金属层之间。
根据本公开的一些示例性实施例，所述连接线在所述指纹识别电 路的关于所述指纹识别电路的中心线对称的两个位置处与所述指纹识别电路连接。
根据本公开的一些示例性实施例，所述指纹识别电路在所述衬底基板上的正投影为矩形，并且所述连接线在所述指纹识别电路的至少三个侧面处于所述指纹识别电路连接。
根据本公开的一些示例性实施例，在所述连接线与所述指纹识别电路的连接位置与所述连接线伸入到所述膜层内的位置之间的距离等于所述指纹识别电路的中心点到所述开孔的侧壁的距离。
根据本公开的一些示例性实施例，所述开孔在所述衬底基板上的正投影为矩形，并且所述指纹识别电路位于所述开孔的中心处。
本公开的另一方面提供了一种显示面板，包括上述任一种基板。
根据本公开的一些示例性实施例，所述显示面板为液晶显示面板，所述基板是所述液晶显示面板的阵列基板，并且所述液晶显示面板的薄膜晶体管位于所述衬底基板的与所述膜层和所述指纹识别电路相对的表面上。
根据本公开的一些示例性实施例，所述显示面板为电致发光显示面板，所述基板是所述电致发光显示面板的OLED基板或QLED基板，并且所述电致发光显示面板的薄膜晶体管、第一电极、发光功能层、第二电极位于所述衬底基板的与所述膜层和所述指纹识别电路相对的表面上。
本公开的另一方面提供了一种显示装置，包括上述任一种显示面板。
根据本公开的一些示例性实施例，上述显示装置还包括主板，其中，所述连接线与所述主板相连，并且所述主板配置成接收所述连接线传输的信号以实现指纹识别。
根据本公开的一些示例性实施例，所述主板通过主控制线与所述连接线相连。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在 不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为一种典型的显示装置的结构示意图；
图2为本公开实施例提供的一种基板的结构示意图；
图3(a)为本公开实施例提供的一种基板中的膜层的结构示意图；
图3(b)为本公开实施例提供的一种基板中的膜层的另一结构示意图；
图4(a)为本公开实施例提供的一种连接线与指纹模组相连的结构示意图；
图4(b)为本公开实施例提供的一种连接线与指纹模组相连的另一结构示意图；
图5为本公开实施例提供的一种连接线与指纹模组相连的结构示意图；以及
图6为本公开实施例提供的一种显示装置的结构示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本公开的一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
对于全面屏显示装置，通常需要将指纹识别电路贴在显示面板的背面。如图1所示，显示面板10的背面贴合有散热膜20。散热膜20中具有开孔，从而将指纹识别电路30设置在散热膜20的开孔内，并利用封框胶40和封边胶50来贴合装配指纹识别电路30与显示面板10。然而，在这样的配置中，由于封框胶40和封边胶50仅被设置在散热膜20的开孔内，且封框胶40和封边胶50与显示面板10在诸如热膨胀系数等之类的特性方面具有较大差异，因而在显示面板10与指纹识别电路30的位置处极易产生压痕，进而导致显示面板10的显示不均一，影响显示效果。
有鉴于此，本公开实施例提供了一种基板，如图2所示，包括衬底基板60和位于衬底基板60上的膜层70，膜层70具有开孔。基板还包括位于膜层70的开孔中的指纹识别电路30，其中，与指纹识别电路 30相连的连接线80至少部分地位于膜层70内。
在此，对于衬底基板60上的膜层70的类型不进行限定，其可以是根据需要实现的功能而设置的任何膜层。例如，膜层70可以是配置成保护基板的保护膜，也可以是配置成散热的散热膜等。
在此基础上，膜层70可以包括一个或多个子层。当膜层70包括多个子层时，与指纹识别电路30相连的连接线80可以位于膜层70的任一子层内，或者也可以位于膜层70的相邻两个子层之间。
在此，对于膜层70的开孔的形状和大小不进行限定，以能将指纹识别电路30设置在膜层70的开孔中为准。此外，可以根据指纹识别电路30在衬底基板60上的设置位置来定位膜层70中的开孔的位置，而指纹识别电路30在衬底基板60上的设置位置可以根据用户要求进行相应设置。
与指纹识别电路30连接的连接线80可以是刚性或柔性的电连接结构，诸如FPC(Flexible Printed Circuit，柔性电路板)、FFC(Flexible Flat Cable，柔性扁平线缆)或PCB(Printed circuit board，印刷电路板)等。
在此，对于指纹识别电路30的结构不进行限定，以能实现指纹识别功能为准。例如，指纹识别电路30可以是电容式指纹识别模组，也可以是光学指纹识别模组。具体地，电容式指纹识别模组可以包括驱动电极以及感应电极等，而光学指纹识别模组可以包括光源、棱镜以及图像传感器等。
在本公开的实施例所提供的上述基板中，由于与指纹识别电路30相连的连接线80位于膜层70内，因而可以将指纹识别电路30固定在膜层70的开孔中。进一步地，由于膜层70固定设置在衬底基板60上，进而可以使指纹识别电路30与衬底基板60贴合接触。与如图1所示的其中指纹识别电路30通过封框胶40和封边胶50贴合在衬底基板60上的方案相比，由于不使用封框胶40和封边胶50，因而当本公开实施例提供的基板应用于显示面板10中时，可以避免因使用封框胶40和封边胶50而导致的在显示面板10与指纹识别电路30的位置处产生压痕进而影响显示效果的问题。
在此基础上，在如图1所示的方案中，与指纹识别电路30相连的连接线通常被设置在膜层70的上方。由于膜层70的上方还可能设置 有诸如主板或控制线等之类的其它结构，因此为了避免其它结构和连接线相互影响，通常需要使其它结构绕过连接线。这样一来，增加了基板的设计和制作工艺难度。相比之下，在本公开的上述实施例中，由于连接线80位于膜层70内，因而避免了由于连接线80位于膜层70上方而造成的设计和工艺难度提高等问题。
在示例性实施例中，膜层70为散热膜。如本公开中所使用的，术语“散热膜”是指任何具有散热功能的膜层，其可以为单层或多层结构，并且可以根据需要而具有除散热之外的其它功能。通过在显示面板上设置散热膜，可以降低显示面板的温度，缓解显示面板发热的问题。在此基础上，对于散热膜的结构不进行限定，散热膜可以包括单层，也可以包括多个子层，以实现多种不同的功能。
当散热膜包括多个子层时，示例性地，连接线80可以位于任一子层内。可替换地，连接线80可以位于任何相邻的两个子层之间。
在示例性实施例中，如图3(a)所示，散热膜包括胶层701、缓冲层702、金属层703以及离型膜704，并且连接线80位于缓冲层702内。在可替换的实施例中，如图3(b)所示，连接线80位于缓冲层702和金属层703之间。当连接线80位于缓冲层702和金属层703之间时，在制作过程中，可以先制作缓冲层702，然后在缓冲层702上制作连接线80，并且在连接线80上制作金属层703。在此情况下，连接线80可以是具有绝缘封装层的连接结构。
在本公开的上述实施例中，通过将连接线80设置在散热膜的相邻两个子层之间，一方面，可以将连接线80牢固地固定在散热膜内，并且另一方面，散热膜中的任一子层都可以一次性制作完成，从而提高制作散热膜的效率。
在本公开的实施例中，当散热膜包括多个子层时，散热膜的结构可以如图3(a)和图3(b)所示，包括依次层叠设置在衬底基板60上的胶层701、缓冲层702、金属层703以及离型膜704。在连接线80位于散热膜的任一子层内的情况下，示例性地，如图3(a)所示，连接线80位于缓冲层702内。
具体地，胶层701配置成将散热膜贴合固定在衬底基板60上。胶层701可以采用网格胶(Embossing，简称EMBO)。对于缓冲层702的材料不进行限定，例如可以为泡沫棉(foam)等。在此基础上，对 于金属层703的材料不进行限定，例如可以为铜(Cu)、钼(Mo)、铝(Al)等金属单质或合金中的至少一种。
在本公开的上述实施例中，当散热膜包括依次层叠设置在衬底基板60上的胶层701、缓冲层702、金属层703以及离型膜704时，散热膜可以达到较好的散热效果。
在图2所示的实施例中，若连接线80仅与指纹识别电路30的一侧连接，虽然指纹识别电路30可以被固定在膜层70的开孔中，但是指纹识别电路30的另一侧可能会翘起，使得指纹膜层30没有和衬底基板60充分完全地贴合接触。
基于上述，示例性地，如图2、图3(a)以及图3(b)所示，连接线80在指纹识别电路30的关于指纹识别电路30的中心线对称的两个位置处与指纹识别电路30连接。如本公开中所使用的，术语“中心线”是指穿过指纹识别电路30的中心，且沿垂直于衬底基板60的方向延伸的线。
指纹识别电路30中的关于指纹识别电路30的中心线对称的两个位置可以根据指纹识别电路30的形状任意选择。以指纹识别电路30在衬底基板60上的正投影为矩形为例，如图4(a)中的俯视图所示，关于指纹识别电路30的中心线对称的两个位置可以分别位于指纹识别电路30的左右两侧，即连接线80在指纹识别电路30的左右两侧与指纹识别电路30连接。可替换地，如图4(b)所示，关于指纹识别电路30的中心线对称的两个位置也可以分别位于指纹识别电路30的上下两侧，即连接线80在指纹识别电路30的上下两侧与指纹识别电路30连接。
在本公开的上述实施例中，由于连接线80至少在指纹识别电路30的关于指纹识别电路30的中心线对称的两个位置处与指纹识别电路30连接，因而在连接线80与指纹识别电路30连接后，不仅可以将指纹识别电路30固定在膜层70的开孔中，而且可以确保指纹识别电路30的与衬底基板60相对的面与衬底基板60充分完全地贴合接触。
当指纹识别电路30在衬底基板60上的正投影为矩形时，示例性地，如图5所示，连接线80在指纹识别电路30的至少三个侧面处与指纹识别电路30连接。
如本公开中所使用的，将指纹识别电路30的与衬底基板60相对 的面称为底面，将与指纹识别电路30的底面相对的面称为顶面，并且将指纹识别电路30的其它面称为侧面。
需要说明的是，在指纹识别电路30的任一侧面处，指纹识别电路30可以与一条、两条或两条以上连接线80相连。
在本公开的上述实施例中，当指纹识别电路30在衬底基板60上的正投影为矩形时，连接线80可以在指纹识别电路30的至少三个侧面处与指纹识别电路30相连。这样一来，可以进一步确保指纹识别电路30固定在膜层70的开孔中，且进一步保证指纹识别电路30的与衬底基板60相对的面与衬底基板60充分完全地贴合接触。
在具体实施时，若在连接线80与指纹识别电路30的连接位置与连接线80伸入到膜层70内的位置之间的距离大于指纹识别电路30的中心点到膜层70的开孔侧壁的距离，则指纹识别电路30可能会在膜层70的开孔中晃动。基于此，示例性地，可以使得在连接线80与指纹识别电路30的连接位置与连接线80伸入到膜层70内的位置之间的距离等于指纹识别电路30的中心点到膜层70的开孔侧壁的距离。
在本公开的上述实施例中，由于在连接线80与指纹识别电路30的连接位置与连接线80伸入到膜层70内的位置之间的距离等于指纹识别电路30的中心点到膜层70的开孔侧壁的距离，因而可以防止指纹识别电路30在膜层70的开孔内晃动。
可选地，由于指纹识别电路30在衬底基板60上的正投影一般为矩形，为了使指纹识别电路30可以设置在膜层70的开孔中，可以使膜层70中的开孔为矩形开孔，且矩形开孔相对于其它形状的开孔更容易制作。进一步可选地，指纹识别电路30可以位于该矩形开孔的中心处，即指纹识别电路30的任何两个相对侧面距离开孔的边缘的距离相等，以便防止指纹识别电路30在开孔中晃动。
本公开实施例还提供了一种显示面板，包括上述任一种基板。
本公开实施例提供的显示面板可以是液晶显示面板(Liquid Crystal Display，简称LCD)，也可以是电致发光显示面板。此处，电致发光显示面板可以是有机电致发光显示面板(Organic Light-Emitting Display，简称OLED)，也可以是量子点电致发光显示面板(Quantum Dot Light-Emitting Display，简称QLED)。
需要说明的是，当显示面板为液晶显示面板时，其典型地包括阵 列基板、彩膜基板以及位于阵列基板和彩膜基板之间的液晶层。在此情况下，上述提供的基板可以是液晶显示面板的阵列基板。当上述提供的基板为阵列基板时，该阵列基板还包括位于衬底基板上的薄膜晶体管，其中，薄膜晶体管位于衬底基板60的与膜层70和指纹识别电路30相对的表面上。
当显示面板为电致发光显示面板时，其典型地包括OLED基板(或QLED基板)和用于封装OLED基板(或QLED基板)的封装盖板或封装膜层。在此情况下，上述提供的基板可以是OLED基板或QLED基板。当上述提供的基板为OLED基板或QLED基板时，其还包括位于衬底基板60上的薄膜晶体管、第一电极、发光功能层、第二电极等，其中，薄膜晶体管、第一电极、发光功能层、第二电极位于衬底基板60的与膜层70和指纹识别电路30相对的表面上。
在本公开实施例提供的上述显示面板中，显示面板中的基板具有与上述实施例提供的基板相同的结构和有益效果，由于上述实施例已经对基板的结构和有益效果进行了详细的描述，因而此处不再赘述。
本公开实施例还提供一种显示装置，包括上述任一种显示面板。
显示装置可以是显示不论运动(例如，视频)还是固定(例如，静止图像)的且不论文字还是图画的图像的任何装置。更明确地说，预期所述实施例可实施在多种电子装置中或与多种电子装置关联，所述多种电子装置例如(但不限于)移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
在本公开实施例提供的上述显示装置中，显示面板包括上述基板，因此显示装置具有与上述实施例提供的基板相同的结构和有益效果，由于上述实施例已经对基板的结构和有益效果进行了详细的描述，因而此处不再赘述。
示例性地，显示装置还包括主板，并且连接线80还与主板相连。可替换地，如图6所示，显示装置还包括主板和主控制线90，连接线 80通过主控制线90与主板相连。特别地，主板配置成接收连接线80传输的信号以实现指纹识别。
图6以显示装置为手机为例进行示意，并且图6中仅示意出了连接线80和主控制线90，未示意出主板以及其它结构。
在本公开的实施例中，与指纹识别电路30相连的连接线80位于膜层70内，并延伸超出膜层70的边缘，从而在膜层70的边缘露出连接头，该连接头反折到膜层70的相对表面上，进而与主板或主控制线90插接或绑定。
在本公开的上述实施例中，由于连接线80与指纹识别电路30相连，且连接线80还直接与主板相连，或者连接线80通过主控制线90与主板相连，因此，指纹识别电路30可以与主板相连，并且主板可以接收连接线80传输的信号从而实现指纹识别功能。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (17)

  1. 一种基板，包括：
    衬底基板；
    位于所述衬底基板上的膜层，所述膜层具有开孔；
    位于所述开孔中的指纹识别电路；以及
    与所述指纹识别电路相连的连接线，所述连接线至少部分地嵌入在所述膜层内。
  2. 根据权利要求1所述的基板，其中，所述膜层包括多个子层，并且所述连接线位于所述多个子层之一内。
  3. 根据权利要求1所述的基板，其中，所述膜层包括多个子层，并且所述连接线位于所述多个子层中的相邻的两个子层之间。
  4. 根据权利要求1所述的基板，其中，所述膜层为散热膜。
  5. 根据权利要求4所述的基板，其中，所述散热膜包括依次层叠设置在所述衬底基板上的胶层、缓冲层、金属层以及离型膜。
  6. 根据权利要求5所述的基板，其中，所述连接线位于所述缓冲层内。
  7. 根据权利要求5所述的基板，其中，所述连接线位于所述缓冲层与所述金属层之间。
  8. 根据权利要求1所述的基板，其中，所述连接线在所述指纹识别电路的关于所述指纹识别电路的中心线对称的两个位置处与所述指纹识别电路连接。
  9. 根据权利要求8所述的基板，其中，所述指纹识别电路在所述衬底基板上的正投影为矩形，并且所述连接线在所述指纹识别电路的至少三个侧面处于所述指纹识别电路连接。
  10. 根据权利要求1所述的基板，其中，在所述连接线与所述指纹识别电路的连接位置与所述连接线伸入到所述膜层内的位置之间的距离等于所述指纹识别电路的中心点到所述开孔的侧壁的距离。
  11. 根据权利要求9所述的基板，其中，所述开孔在所述衬底基板上的正投影为矩形，并且所述指纹识别电路位于所述开孔的中心处。
  12. 一种显示面板，包括权利要求1-11任一项所述的基板。
  13. 根据权利要求12所述的显示面板，其中，所述显示面板为液 晶显示面板，所述基板是所述液晶显示面板的阵列基板，并且所述液晶显示面板的薄膜晶体管位于所述衬底基板的与所述膜层和所述指纹识别电路相对的表面上。
  14. 根据权利要求12所述的显示面板，其中，所述显示面板为电致发光显示面板，所述基板是所述电致发光显示面板的OLED基板或QLED基板，并且所述电致发光显示面板的薄膜晶体管、第一电极、发光功能层、第二电极位于所述衬底基板的与所述膜层和所述指纹识别电路相对的表面上。
  15. 一种显示装置，包括权利要求12-14任一项所述的显示面板。
  16. 根据权利要求15所述的显示装置，还包括主板，其中，所述连接线与所述主板相连，并且所述主板配置成接收所述连接线传输的信号以实现指纹识别。
  17. 根据权利要求16所述的显示装置，其中，所述主板通过主控制线与所述连接线相连。
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