WO2020057334A1 - 感光组件制作方法、感光组件、摄像模组及智能终端 - Google Patents

感光组件制作方法、感光组件、摄像模组及智能终端 Download PDF

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Publication number
WO2020057334A1
WO2020057334A1 PCT/CN2019/103013 CN2019103013W WO2020057334A1 WO 2020057334 A1 WO2020057334 A1 WO 2020057334A1 CN 2019103013 W CN2019103013 W CN 2019103013W WO 2020057334 A1 WO2020057334 A1 WO 2020057334A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive
circuit board
holes
photosensitive chip
curved
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PCT/CN2019/103013
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English (en)
French (fr)
Inventor
穆江涛
杨威
金光日
庄士良
Original Assignee
南昌欧菲光电技术有限公司
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Publication of WO2020057334A1 publication Critical patent/WO2020057334A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith

Definitions

  • the present invention relates to the technical field of cameras, and in particular, to a method for manufacturing a photosensitive component, a photosensitive component, a camera module, and a smart terminal.
  • a flat photosensitive chip also called a flat image sensor refers to a photosensitive chip whose photosensitive surface is flat. Due to the difference in the optical path difference between the edge part and the central part of the flat photosensitive chip, light is photosensitive on the plane. The edge position of the chip is prone to distortion, loss of light at the corners, and sharp angle drops, which reduces the pixels imaged by the camera module.
  • a curved photosensitive chip (also referred to as a curved image sensor) refers to a photosensitive chip whose photosensitive surface is a curved surface. Since the photosensitive surface is a curved surface, it is closer to the retina, which is also a curved surface. Therefore, the imaging effect is closer to the human eye and is considered to be the development trend in the future camera field.
  • a curved photosensitive chip is first manufactured separately, and then the molded curved photosensitive chip is mounted on a circuit board, and the manufacturing process is relatively complicated.
  • a method for manufacturing a photosensitive component the steps include:
  • a circuit board is provided.
  • the circuit board includes an upper surface and a lower surface opposite to the upper surface. Through holes are formed on the circuit board to communicate the upper surface and the lower surface, and the number of the through holes is provided. For multiple
  • planar photosensitive chip with a photosensitive surface as a plane, fixing a central region of the planar photosensitive chip on the inside of a pattern surrounded by the plurality of through holes, and a peripheral region of the planar photosensitive chip covering the through hole;
  • a plurality of guide posts are provided, which are respectively opposite to the plurality of through holes, and the plurality of guide posts are respectively passed through the plurality of through holes to jack up the planar photosensitive chip.
  • a photosensitive component includes:
  • the circuit board includes an upper surface and a lower surface opposite to the upper surface, and the circuit board is provided with through holes communicating with the upper surface and the lower surface, and the number of the through holes is multiple;
  • a curved photosensitive chip the photosensitive surface of which is a curved surface, a central region of the curved photosensitive chip is fixed to an inner side of a figure surrounded by the plurality of through holes, and the curved photosensitive chip is electrically connected to the circuit board;
  • the packaging colloid fills a gap between the curved photosensitive chip and the circuit board.
  • a camera module includes:
  • the lens assembly is disposed on a photosensitive path of the photosensitive component.
  • An intelligent terminal includes:
  • the camera module is disposed on the terminal body.
  • FIG. 1 is a schematic structural diagram of a camera module according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of the photosensitive component in FIG. 1;
  • FIG. 2 is a schematic structural diagram of the photosensitive component in FIG. 1;
  • FIG. 3 is a schematic structural diagram of a circuit board in FIG. 2;
  • FIG. 4 is a schematic structural diagram of an adhesive layer provided on the upper surface of the circuit board in FIG. 3;
  • FIG. 5 is a schematic structural diagram of a planar photosensitive chip provided on the adhesive layer in FIG. 4;
  • FIG. 6 is a schematic structural diagram of a connection between the planar photosensitive chip and the circuit board in FIG. 5 through conductive wires;
  • FIG. 7 is a schematic structural diagram of a fixing block provided on the upper surface of the circuit board in FIG. 6;
  • FIG. 8 is a schematic structural diagram of a curved photosensitive chip formed after the peripheral area of the planar photosensitive chip in FIG. 7 is lifted by a jacking device;
  • FIG. 9 is a schematic structural diagram of the gap between the curved photosensitive chip and the circuit board in FIG. 8 after the packaging gel is filled;
  • FIG. 10 is a schematic diagram of a through-hole filling and filling member of the photosensitive component in FIG. 9;
  • FIG. 11 is a schematic structural view of the through hole of the photosensitive component in FIG. 10 after the filling member is filled.
  • a camera module 10 is applied to a smart terminal.
  • the smart terminal includes a terminal body and a camera module 10 provided on the terminal body.
  • the smart terminal is a smart phone, a notebook computer, a tablet computer, a mobile phone, a video phone, a digital still camera, an e-book reader, a portable multimedia player (PMP), a mobile medical device, Wearable devices and other smart terminals.
  • PMP portable multimedia player
  • the camera module 10 includes a photosensitive component 10a and a lens component 10b.
  • the lens assembly 10b is disposed on the photosensitive path of the photosensitive assembly 10a. The light on the object side passes through the lens assembly 10b and reaches the photosensitive assembly 10a, thereby achieving imaging.
  • the photosensitive component 10 a of the present invention includes a circuit board 100, an adhesive layer 200 (which may be omitted), a curved photosensitive chip 300, and a packaging gel 400.
  • the circuit board 100 is used to carry a curved photosensitive chip 300 and other components.
  • the circuit board 100 may be a PCB (Printed Circuit Board), a soft-hard board, or a reinforced FPC (Flexible Printed Circuit).
  • the soft-hard board includes Laminated PCBs and FPCs.
  • the reinforced flexible circuit boards include FPCs and reinforcements.
  • the reinforcements can be sheets with good heat dissipation properties such as steel sheets.
  • the circuit board 100 includes an upper surface 110 and a lower surface 120 opposite to the upper surface 110.
  • the circuit board 100 is provided with through-holes 101 connecting the upper surface 110 and the lower surface 120.
  • the number of the through-holes 101 is multiple.
  • the adhesive layer 200 is disposed on the upper surface 110, and the adhesive layer 200 is located on the inner side of the pattern surrounded by the plurality of through holes 101.
  • the adhesive layer 200 is provided in a center region of a pattern formed by surrounding a plurality of through holes 101. More specifically, in this embodiment, the central axis of the figure enclosed by the plurality of through holes 101 coincides with the central axis of the circuit board 100, and the adhesive layer 200 is provided in the central region of the circuit board 100.
  • the pattern formed by enclosing the plurality of through holes 101 may be, but is not limited to, a circle, a rectangle, a polygon, and the like.
  • the curved photosensitive chip 300 is also called a curved image sensor. It is a device that converts light signals into electrical signals and the photosensitive surface is curved.
  • the curved photosensitive chip 300 can be a CCD (Charge-coupled Device) or CMOS (Charge Coupled Device) photosensitive chip.
  • a central region of the curved photosensitive chip 300 is connected to the adhesive layer 200, and the curved photosensitive chip 300 is electrically connected to the circuit board 100.
  • the curved photosensitive chip 300 when the curved photosensitive chip 300 can be fixed on the upper surface 110 of the circuit board 100 by other methods (for example, a central area of the curved photosensitive chip and an upper surface of the circuit board are provided with a card that cooperates with each other).
  • the buckle and the slot can be fixedly connected to the curved photosensitive chip and the circuit board through the cooperation of the buckle and the slot, or the central area of the curved photosensitive chip is magnetically fixed to the upper surface of the circuit board.
  • the adhesive layer 200 can be omitted. .
  • the encapsulant 400 fills a gap between the curved photosensitive chip 300 and the circuit board 100.
  • the curved photosensitive chip 300 can be firmly fixed on the circuit board 100, the molding effect of the curved photosensitive chip 300 can be maintained, and the overall structural strength of the photosensitive element 10a can be increased.
  • a support post fixed on the upper surface 110 of the circuit board 100 may be used instead of the encapsulant 400. Specifically, one end of the support post abuts a surface of the curved photosensitive chip 300 near the circuit board 100, and another One end is fixed to the upper surface 110 of the circuit board 100. At this time, the support post and the through-hole 101 are offset and disposed independently of each other.
  • the circuit board 100 is provided with a through hole 101, and the guide post 21 penetrating through the through hole 101 can face the planar photosensitive chip 300 a (the planar photosensitive chip 300 a is also called a planar image sensor, It is a device that converts optical signals into electrical signals and has a photosensitive surface that is flat.) Applying force causes the planar photosensitive chip 300a to bend, and further forms a curved photosensitive chip 300 under the curing effect of the packaging gel 400.
  • the planar photosensitive chip 300a is a raw material to make a curved photosensitive chip 300.
  • the curved photosensitive chip 300 for imaging is closer to the retina which is also curved, and the imaging effect is better than that of the planar photosensitive chip 300a.
  • the planar photosensitive chip 300a in the embodiment of the present application may be a flexible planar photosensitive chip or a rigid planar photosensitive chip, which is not limited in this application.
  • the projection of the curved photosensitive chip 300 on the upper surface 110 of the circuit board 100 is rectangular and covers the through hole 101, which is located on the upper surface 110 of the curved photosensitive chip 300.
  • the middle of the four corners or sides of the projection In this way, when the curved photosensitive chip 300 is manufactured using the planar photosensitive chip 300a as the original material, the force distribution applied to the peripheral area of the planar photosensitive chip 300a through the guide pillar 21 (refer to FIG. 8) can be more uniform, which is beneficial to the curved photosensitive chip 300 Of curved surface shapes.
  • the photosensitive member 10 a of the present invention further includes a filler 500, and the filler 500 is filled in the plurality of through holes 101. Therefore, after the curved photosensitive chip 300 is formed by using the planar photosensitive chip 300a as the raw material, the filling member 500 filled in the through hole 101 can make the circuit board 100 have better support strength and can support the curved photosensitive chip 300 and the lens assembly 10b. And other components.
  • the filling member 500 is a buried hole glue, and the buried hole glue is in a liquid state or a semi-solid state. After the buried adhesive in the through hole 101 is cured, a filling member 500 of the photosensitive component 10 a is formed.
  • the encapsulant 400 extends inwardly and is connected to the adhesive layer 200. Specifically, in this embodiment, the encapsulant 400 may also extend outward to a side away from the curved photosensitive chip 300. In this way, the connection firmness of the curved photosensitive chip 300 and the circuit board 100 is further increased.
  • the manner in which the curved photosensitive chip 300 and the circuit board 100 are electrically connected specifically uses a conductive wire 600 for electrical connection, and both ends of the conductive wire 600 are electrically connected to the curved photosensitive chip 300 and the circuit board 100, respectively.
  • a conductive wire 600 for electrical connection, and both ends of the conductive wire 600 are electrically connected to the curved photosensitive chip 300 and the circuit board 100, respectively.
  • an end of the conductive wire 600 connected to the circuit board 100 is embedded in the packaging gel 400.
  • the material of the conductive wire 600 may be a metal, an alloy, a non-metal, or the like having conductive properties.
  • the conductive wire 600 is a gold wire.
  • a conductive post may be used instead of the conductive wire 600. Specifically, one end of the conductive post is in contact with one surface of the curved photosensitive chip 300 near the circuit board 100 to be electrically connected, and the other end is connected to the upper surface of the circuit board 100. 110 is soldered and electrically connected. At this time, the conductive pillars and the through-holes 101 are staggered and independent of each other.
  • FIG. 3 is a schematic structural diagram of the circuit board 100.
  • the circuit board 100 includes an upper surface 110 and a lower surface 120 opposite to the upper surface 110.
  • Through holes 101 are formed on the circuit board 100 and communicate with the upper surface 110 and the lower surface 120. The number of the through holes 101 is multiple.
  • an adhesive layer 200 is formed on the upper surface 110 of the circuit board 100, and the adhesive layer 200 is located on the inner side of the pattern surrounded by the plurality of through holes 101.
  • the adhesive layer 200 is formed in a central region of a pattern formed by enclosing a plurality of through holes 101. More specifically, in this embodiment, the central axis of the figure enclosed by the plurality of through holes 101 coincides with the central axis of the circuit board 100, and the adhesive layer 200 is formed in the central region of the circuit board 100.
  • a planar photosensitive chip 300a is provided.
  • the planar photosensitive chip 300a is also called a planar image sensor, and is a device that converts an optical signal into an electrical signal and the photosensitive surface is planar.
  • the planar photosensitive chip 300a may be a flexible planar photosensitive chip or a rigid planar photosensitive chip. As shown in FIG. 5, the central region of the planar photosensitive chip 300 a is attached to the adhesive layer 200, and the peripheral region of the planar photosensitive chip 300 a covers the through hole 101.
  • the central area of the planar photosensitive chip 300a can be fixed inside the pattern formed by the plurality of through holes 101 in other ways (for example, in the central area of the curved photosensitive chip and the circuit board)
  • the upper surface is provided with a buckle and a groove that cooperate with each other, and the curved photosensitive chip and the circuit board are fixedly connected through the cooperation of the buckle and the groove, or the central area of the curved photosensitive chip is magnetically fixed with the upper surface of the circuit board.
  • Step S42 that is, the step of forming the adhesive layer 200 on the upper surface 110 of the circuit board 100 may be omitted.
  • a conductive wire 600 is provided. As shown in FIG. 6, both ends of the conductive wire 600 are electrically connected to the planar photosensitive chip 300 a and the circuit board 100, respectively. In this way, before the guide post 21 penetrates the through-hole 101 to lift up the peripheral area of the planar photosensitive chip 300a (see step S46 and FIG. 8 below), the planar photosensitive chip 300a and the circuit board 100 are preferentially wire-bonded, thereby avoiding the formation of the curved photosensitive chip 300. Wire bonding afterwards may cause uneven bonding of the chip and risk of weak bonding.
  • both ends of the conductive wire 600 may be electrically connected to the curved photosensitive chip 300 and the circuit board 100, respectively.
  • a fixed block 30 is provided.
  • the fixing block 30 is disposed on the upper surface 110 of the circuit board 100 and is used to assist the guide post 21 to jack up the peripheral area of the planar photosensitive chip 300 a (see step S46 and FIG. 8 below).
  • the fixing block 30 can increase the weight of the circuit board 100. In this way, in the process of the guide pillar 21 jacking up the peripheral area of the planar photosensitive chip 300a, the circuit board 100 can be prevented from being lifted along with the planar photosensitive chip 300a, thereby affecting the molding effect of the curved photosensitive chip 300a.
  • the planar photosensitive chip 300 a is first attached to the adhesive layer 200 and covers the through hole 101, and then a fixing block 30 is disposed on the upper surface 110 of the circuit board 100.
  • a fixing block 30 may be provided on the upper surface 110 of the circuit board 100, and then an adhesive layer 200 may be formed on the upper surface 110 of the circuit board 100, and then the central area of the planar photosensitive chip 300 a may be pasted. It is attached to the adhesive layer 200 so that the peripheral area of the planar photosensitive chip 300 a covers the through hole 101.
  • the above-mentioned fixing block 30 may be a hollow structure with both ends open, and the planar photosensitive chip 300 a is located inside the fixing block 30. In this way, the weight around the circuit board 100 is increased, which can further prevent the circuit board 100 from moving upward along with the planar photosensitive chip 300a. It can be understood that, in other embodiments, the above-mentioned fixing block 30 may be omitted. At this time, the circuit board 100 may be fixed on the work surface by means of vacuum suction or the like.
  • a jacking device 20 is provided. As shown in FIG. 8, the jacking device 20 includes connected guide posts 21 and drivers 22, and the number of the guide posts 21 is multiple.
  • the driver 22 may be a stepping motor or a linear motor.
  • step S46 the plurality of guide pillars 21 are respectively opposite to the plurality of through holes 101, and the driver 22 drives the guide pillars 21 through the through holes 101 to jack up the peripheral area of the planar photosensitive chip 300a.
  • the plurality of guide posts 21 are driven by one driver 22. It can be understood that, in other embodiments, the plurality of guide posts 21 may also be driven by a plurality of drivers 22 respectively. It should be noted that the plurality of guide posts 21 can also be pushed by human power, and the driver 22 can be omitted at this time.
  • step S47 the gap between the planar photosensitive chip 300a and the circuit board 100 is filled with the encapsulant 400, and cured to form a curved photosensitive chip 300.
  • the encapsulating gel 400 surrounds the adhesive layer 200 so that the encapsulating gel 400 extends inwardly, is connected to the adhesive layer 200, and extends outward to a side away from the curved photosensitive chip 300.
  • the curved photosensitive chip 300 can be firmly fixed on the circuit board 100, the molding effect of the curved photosensitive chip 300 can be maintained, and the overall structural strength of the photosensitive element 10a can be increased.
  • the curved photosensitive chip 300 having a curved surface effect can be obtained by using the above-mentioned photosensitive component manufacturing method, and in the above-mentioned photosensitive component manufacturing method, the curved photosensitive chip 300 is directly molded on the circuit board 100, and the shaped curved photosensitive chip 300 is eliminated.
  • the process of bonding on the circuit board 100 is simpler.
  • the guide post 21 is driven by the driver 22, which realizes the automation and precision movement of the process of the guide post 21 pushing up the planar photosensitive chip 300a, and the molding effect of the curved photosensitive chip 300 is better.
  • the jacking device 20 further includes a jig 23, and the jig 23 is provided with a plurality of guide holes 231.
  • the circuit board 100 is fixed on the jig 23 so that the multiple through holes 101 are respectively opposite to the multiple guide holes 231, and then The plurality of guide posts are respectively opposite to the plurality of guide holes, so that the plurality of guide posts are respectively opposite to the plurality of through holes, so that the guide posts 21 pass through the guide holes 231.
  • the precise positioning of the guide post 21 in the through-hole 101 can be achieved, and the stability of the process of the guide post 21 jacking up the chip can be increased.
  • the center of the jig 23 is provided with a vacuum hole 232, and the vacuum hole 232 and the guide hole 231 are independent of each other.
  • the vacuum hole 232 is communicated with the suction device.
  • the circuit board 100 is firmly fixed on the jig 23 due to vacuum adsorption.
  • the number of the vacuum holes 232 is one and is located inside the plurality of guide holes 231.
  • the circuit board 100 can be attracted to the jig 23 through the vacuum hole 232, so that the circuit board 100 is closely attached to the jig 23, and When the chip is lifted, the circuit board 100 is not separated from the jig 23 as the chip moves upward together.
  • step S47 that is, after forming the curved photosensitive chip 300
  • the method for manufacturing a photosensitive component further includes the following steps:
  • step S48a the guide post 21 is separated from the through hole 101 and the guide hole 231.
  • the driver 22 drives the guide post 21 to move away from the curved photosensitive chip 300 so that the guide post 21 exits from the through hole 101 and the guide hole 231.
  • step S48b the circuit board 100 and the jig 23 are separated. Specifically, after the suction device stops working, the circuit board 100 is removed from the jig 23.
  • step S48c the fixing block 30 is separated from the circuit board 100.
  • step S48c is in no particular order from step S48a and step S48b.
  • step S48b the method for manufacturing a photosensitive component further includes the following steps:
  • a filler 500 is provided.
  • the filler 500 is filled in the plurality of through holes 101.
  • the filler 500 is a buried hole glue, and the buried hole glue is in a liquid or semi-solid state. After the buried adhesive in the through hole 101 is cured, a filling member 500 of the photosensitive component 10 a is formed.
  • the circuit board 100 can have better supporting strength, and can support components such as the curved photosensitive chip 300 and the lens assembly 10b.
  • the step of filling the filler 500 includes:
  • step S49a as shown in FIG. 10, the photosensitive module 10a having the curved photosensitive chip 300 obtained after being separated from the lifting device 20 and the fixing block 30 is inverted, even if the circuit board 100 is directly above the curved photosensitive chip 300.
  • step S49b a filler 500 is filled into each of the through holes 101, and a state shown in FIG. 11 is formed.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "a plurality” is at least two, for example, two, three, etc., unless it is specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and other terms shall be understood in a broad sense unless otherwise specified and defined, for example, they may be fixed connections or removable connections , Or integrated; it can be mechanical or electrical; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of the two elements or the interaction between the two elements, unless otherwise specified The limit.
  • the specific meanings of the above terms in the present invention can be understood according to specific situations.
  • the first feature "on” or “down” of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact.
  • the first feature is “above”, “above”, and “above” the second feature.
  • the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature.
  • the first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

一种感光组件制作方法，包括如下步骤：提供电路板(100)，电路板(100)包括上表面(110)及与上表面(110)相对的下表面(120)，在电路板(100)开设连通上表面(110)与下表面(120)的通孔(101)，通孔(101)的数量为多个；提供感光面为平面的平面感光芯片(300a)，将平面感光芯片(300a)的中心区域固定在多个通孔(101)围合形成的图形内侧，平面感光芯片(300a)的周边区域覆盖通孔(101)；提供多个导柱(21)，将多个导柱(21)分别与多个通孔(101)正对，将多个导柱(21)穿过多个通孔(101)后顶起平面感光芯片(300a)的周边区域；在平面感光芯片(300a)与电路板(100)之间的间隙填充封装胶体(400)，固化形成感光面为曲面的曲面感光芯片(300)。

Description

感光组件制作方法、感光组件、摄像模组及智能终端 技术领域
本发明涉及摄像头技术领域，特别是涉及一种感光组件制作方法、感光组件、摄像模组及智能终端。
背景技术
随着具有摄像功能的智能设备在生活中的应用越来越普及，用户对摄像模组的要求越来越高。传统摄像模组采用平面感光芯片，平面感光芯片(又称平面图像传感器)是指感光面为平面的感光芯片，由于平面感光芯片的边缘部分与中心部分的光程差不同，导致光线在平面感光芯片的边缘位置容易出现畸变、边角失光以及锐角下降等现象，从而降低了摄像模组成像的像素。
为了解决上述问题，摄像模组开始采用曲面感光芯片，曲面感光芯片(又称曲面图像传感器)是指感光面为曲面的感光芯片，由于其感光面为曲面，更接近于同为曲面的视网膜，因此成像效果更接近于人眼，被认为是未来摄像领域的发展趋势。但是，传统摄像模组中具有曲面感光芯片的感光组件在制作过程中，一般先单独制作曲面感光芯片，再将成型后的曲面感光芯片安装于电路板上，制作流程较为复杂。
发明内容
基于此，有必要提供一种感光组件制作方法、感光组件、摄像模组及智能终端。
一种感光组件制作方法，其步骤包括：
提供一电路板，所述电路板包括上表面以及与所述上表面相对的下表面，在所述电路板上开设连通所述上表面与所述下表面的通孔，所述通孔的数量为多个；
提供一感光面为平面的平面感光芯片，将所述平面感光芯片的中心区域固定在所述多个通孔围合形成的图形的内侧，所述平面感光芯片的周边区域覆盖所述通孔；
提供多个导柱，将所述多个导柱分别与所述多个通孔正对，并将所述多个导柱分别穿过所述多个通孔后顶起所述平面感光芯片的周边区域；
在所述平面感光芯片与所述电路板之间的间隙填充封装胶体，固化形成感光面为曲面的曲面感光芯片；以及
分离所述导柱与所述通孔。
一种感光组件，包括：
电路板，包括上表面以及与所述上表面相对的下表面，所述电路板上开设有连通所述上表面与所述下表面的通孔，所述通孔的数量为多个；
曲面感光芯片，其感光面为曲面，所述曲面感光芯片的中心区域固定于所述多个通孔围合形成的图形的内侧，且所述曲面感光芯片与所述电路板电性连接；
封装胶体，所述封装胶体填充于所述曲面感光芯片与所述电路板之间的间隙。
一种摄像模组，包括：
上述任一的感光组件；以及
镜头组件，设于所述感光组件的感光路径上。
一种智能终端，包括：
终端本体；以及
上述任一的摄像模组，所述摄像模组设于所述终端本体上。
附图说明
为了更好地描述和说明这里公开的那些发明的实施例和/或示例，可以参考一幅或多幅附图。用于描述附图的附加细节或示例不应当被认为是对所公开的发明、目前描述的实施例和/或示例以及目前理解的这些发明的最佳模式 中的任何一者的范围的限制。
图1为本发明一实施方式的摄像模组的结构示意图；
图2为图1中感光组件的结构示意图；
图3为图2中电路板的结构示意图；
图4为图3中电路板的上表面设有粘结层的结构示意图；
图5为图4中粘结层上设有平面感光芯片的结构示意图；
图6为图5中平面感光芯片与电路板通过导电线连接的结构示意图；
图7为图6中电路板的上表面上设有固定块的结构示意图；
图8为图7中的平面感光芯片的周边区域被顶升装置顶起后形成曲面感光芯片的结构示意图；
图9为在图8中曲面感光芯片与电路板之间的间隙填充封装胶体后的结构示意图；
图10为图9中感光组件的通孔填充填充件的示意图；
图11为图10中感光组件的通孔填充填充件后的结构示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施方式。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本发明的公开内容理解的更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“内”、“外”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用 的术语只是为了描述具体地实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
如图1所示，本发明一实施方式的摄像模组10，应用于智能终端上。具体地，在本实施方式中，智能终端包括终端本体以及设于终端本体上的摄像模组10。更具体地，在本实施方式中，智能终端为智能手机、笔记本电脑、平板电脑、便携电话机、视频电话、数码静物相机、电子书籍阅读器、便携多媒体播放器(PMP)、移动医疗装置、可穿戴式设备等智能终端。
在本实施方式中，该摄像模组10包括感光组件10a以及镜头组件10b。镜头组件10b设于感光组件10a的感光路径上，物体侧的光线经过镜头组件10b后到达感光组件10a，从而实现成像。
如图2所示，在本实施方式中，本发明的感光组件10a包括电路板100、粘结层200(可省略)、曲面感光芯片300以及封装胶体400。电路板100用于承载曲面感光芯片300等元件。电路板100可以为PCB(Printed Circuit Board，印制电路板)，也可以为软硬结合板，也可以为补强后的FPC(Flexible Printed Circuit，柔性电路板)，其中，软硬结合板包括层叠设置的PCB及FPC，补强后的柔性电路板包括层叠设置的FPC及补强片，补强片可以为钢片等散热性能良好的片材。
电路板100包括上表面110以及与上表面110相对的下表面120，电路板100上开设有连通上表面110与下表面120的通孔101，通孔101的数量为多个。
粘结层200设于上表面110，粘结层200位于多个通孔101围合形成的图形的内侧。具体地，在本实施方式中，粘结层200设于多个通孔101围合形成的图形的中心区域。更具体地，在本实施方式中，多个通孔101围合形成的图形的中轴线与电路板100的中轴线重合，粘结层200设于电路板100的中心区域。其中，上述多个通孔101围合形成的图形可以但不限定为圆形、矩形、多边形等。
曲面感光芯片300又称曲面图像传感器，是一种将光信号转换为电信号且感光面为曲面的器件，曲面感光芯片300可以为CCD(Charge-coupled Device，电荷耦合元件)感光芯片或CMOS(Complementary Metal-Oxide-Semiconductor，互补金属氧化物半导体)感光芯片。曲面感光芯片300的中心区域与粘结层200连接，且曲面感光芯片300与电路板100电性连接。可以理解，在其它实施方式中，当曲面感光芯片300能够通过其他方式固定在电路板100的上表面110上时(例如：曲面感光芯片的中心区域与电路板的上表面设有相互配合的卡扣和卡槽，通过卡扣与卡槽的配合实现曲面感光芯片与电路板的固定连接，或曲面感光芯片的中心区域与电路板的上表面磁性连接固定)，此时粘结层200可以省略。
封装胶体400填充于曲面感光芯片300与电路板100之间的间隙。如此，能够使曲面感光芯片300牢固地固定在电路板100上，维持曲面感光芯片300的成型效果，增加感光组件10a整体的结构强度。在其他实施方式中，也可以采用固定于电路板100的上表面110上的支撑柱来替代封装胶体400，具体地，支撑柱一端与曲面感光芯片300靠近电路板100的一表面抵接，另一端与电路板100的上表面110固定，此时，支撑柱与通孔101错位设置，相互独立。
同时参考图2、图8和图9，在上述电路板100开设有通孔101，穿设于通孔101上的导柱21可以对平面感光芯片300a(平面感光芯片300a又称平面图像传感器，是一种将光信号转换为电信号且感光面为平面的器件)的周边区域施加作用力，使得平面感光芯片300a弯曲，进而在封装胶体400的固化作用下形成曲面感光芯片300，从而可以以平面感光芯片300a为原材来制作曲面感光芯片300。在上述感光组件10a中，进行成像的曲面感光芯片300，更接近于同为曲面的视网膜，相比平面感光芯片300a的成像效果更佳。本申请实施例的平面感光芯片300a可以为柔性的平面感光芯片，也可以为刚性的平面感光芯片，本申请不作限制。
进一步，请继续参考图2，在本实施方式中，曲面感光芯片300在电路 板100的上表面110上的投影为矩形，并覆盖通孔101，通孔101位于曲面感光芯片300在上表面110上的投影的四角或四边的中部。如此，当以平面感光芯片300a为原材来制作曲面感光芯片300时，可以使得通过导柱21(参考图8)施加给平面感光芯片300a周边区域的力分布更加均匀，有利于曲面感光芯片300的曲面形状的成型。
进一步，在本实施方式中，本发明的感光组件10a还包括填充件500，填充件500填充于多个通孔101内。从而当以平面感光芯片300a为原材制作形成曲面感光芯片300后，填充于通孔101内的填充件500可以使得电路板100具有较好的支撑强度，能够支撑曲面感光芯片300、镜头组件10b等元器件。具体地，在本实施方式中，填充件500为埋孔胶，埋孔胶呈液态或半固态。通孔101中的埋孔胶固化后，形成感光组件10a的填充件500。
进一步，在本实施方式中，封装胶体400向内延伸，并与粘结层200连接。具体地，在本实施方式中，封装胶体400还可以向外延伸至远离曲面感光芯片300的一侧外。如此，进一步增加曲面感光芯片300与电路板100的连接牢固性。
进一步，在本实施方式中，曲面感光芯片300与电路板100电性连接的方式具体采用导电线600进行电性连接，导电线600的两端分别与曲面感光芯片300及电路板100电性连接，以实现曲面感光芯片300与电路板100电性连接。具体地，在本实施方式中，导电线600与电路板100连接的一端内嵌于封装胶体400内。如此，可以避免导电线600外露于封装胶体400外，降低导电线600损坏的风险，延长使用寿命，且还能够增加感光组件10a整体的结构牢固性。上述导电线600的材料可以是具有导电性能的金属、合金、非金属等材料。具体地，在本实施方式中，导电线600为金线。
在其他实施方式中，可以用导电柱来替代导电线600，具体地，导电柱一端与曲面感光芯片300靠近电路板100的一表面抵接而电性连接，另一端与电路板100的上表面110焊接而电性连接，此时，导电柱与通孔101错位设置，相互独立。
以下再结合图3至图11说明本发明的感光组件制作方法。
步骤S41,提供一电路板100。在本实施方式中，如图3所示，图3为电路板100的结构示意图。其中，电路板100包括上表面110以及与上表面110相对的下表面120，在电路板100上开设连通上表面110与下表面120的通孔101，通孔101的数量为多个。
步骤S42，如图4所示，在电路板100的上表面110形成粘结层200，粘结层200位于多个通孔101围合形成的图形的内侧。具体地，在本实施例中，粘结层200形成于多个通孔101围合形成的图形的中心区域。更具体地，在本实施方式中，多个通孔101围合形成的图形的中轴线与电路板100的中轴线重合，粘结层200形成于电路板100的中心区域。
步骤S43，提供一平面感光芯片300a。其中，平面感光芯片300a又称平面图像传感器，是一种将光信号转换为电信号且感光面为平面的器件。平面感光芯片300a可以为柔性的平面感光芯片或刚性的平面感光芯片。如图5所示，将平面感光芯片300a的中心区域贴附于粘结层200上，并使平面感光芯片300a的周边区域覆盖通孔101。可以理解，在其他实施方式中，当平面感光芯片300a的中心区域能够通过其他方式固定在多个通孔101围合形成的图形的内侧时(例如：在曲面感光芯片的中心区域与电路板的上表面设有相互配合的卡扣和卡槽，通过卡扣与卡槽的配合实现曲面感光芯片与电路板的固定连接，或曲面感光芯片的中心区域与电路板的上表面磁性连接固定)，步骤S42，也即在电路板100的上表面110形成粘结层200的步骤可以省略。
步骤S44a，提供导电线600。如图6所示，使导电线600的两端分别与平面感光芯片300a及电路板100电性连接。如此，在导柱21贯穿通孔101顶起平面感光芯片300a的周边区域之前(参见下文步骤S46和图8)，平面感光芯片300a与电路板100优先导线键合，避免了曲面感光芯片300成型后再导线键合，造成芯片的不平整键合以及键合不牢固的风险。
可以理解，在其它实施方式中，也可在曲面感光芯片300成型后，将导电线600的两端分别与曲面感光芯片300及电路板100电性连接。
步骤S44b，提供固定块30。如图7所示，固定块30设于电路板100的上表面110上，用以辅助导柱21顶起平面感光芯片300a的周边区域(参见下文步骤S46和图8)。具体地，在本实施方式中，固定块30能够增加电路板100的重量。如此，在导柱21顶起平面感光芯片300a的周边区域的过程中，可以避免电路板100随着平面感光芯片300a一起被顶起，影响曲面感光芯片300a的成型效果。
在本实施例中，先将平面感光芯片300a贴附于粘结层200上并覆盖通孔101后，再在电路板100的上表面110上设置固定块30。
在其他实施方式中，也可以先在电路板100的上表面110上设置固定块30后，再在电路板100的上表面110上形成粘结层200，然后将平面感光芯片300a的中心区域贴附于粘结层200上，并使得平面感光芯片300a的周边区域覆盖通孔101。
具体地，在本实施方式中，上述固定块30可为两端开口的中空结构，平面感光芯片300a位于固定块30内侧。如此，电路板100的四周的重量均有所增加，能进一步防止电路板100随着平面感光芯片300a一起向上运动。可以理解，在其它实施方式中，上述固定块30可以省略，此时，可以通过真空吸附等方式将电路板100固定在工作台面上。
需要说明的是，上述步骤S44a和步骤S44b不分先后顺序。
步骤S45，提供顶升装置20。如图8所示，顶升装置20包括相连的导柱21以及驱动器22，导柱21的数目为多个。其中，上述驱动器22可以为步进电机或直线电机。
步骤S46，将多个导柱21分别与多个通孔101正对，驱动器22驱动导柱21穿过通孔101后顶起平面感光芯片300a的周边区域。具体地，在本实施方式中，多个导柱21由一个驱动器22驱动。可以理解，在其它实施方式中，多个导柱21也可分别由多个驱动器22驱动。需要说明的是，上述多个导柱21也可由人力推动，此时驱动器22可以省略。
步骤S47，如图9所示，在平面感光芯片300a与电路板100之间的间隙 填充封装胶体400，固化形成曲面感光芯片300。具体地，在本实施方式中，将封装胶体400环绕粘结层200，使封装胶体400向内延伸，并与粘结层200连接，向外延伸至远离曲面感光芯片300的一侧外。如此，能够使曲面感光芯片300牢固地固定在电路板100上，维持曲面感光芯片300的成型效果，增加感光组件10a整体的结构强度。
采用上述感光组件制作方法可以获得具有曲面效果的曲面感光芯片300，而且在上述感光组件制作方法中，曲面感光芯片300直接成型于电路板100上，免去了成型后的曲面感光芯片300再在电路板100上进行贴合的过程，制程更加简单。且在曲面感光芯片300的成型过程中，实现了在不接触芯片的成像面(也即不接触芯片的感光面)的前提下，即可完成曲面感光芯片的制作，不会污染芯片的成像面，具有更好的感光效果。而且，导柱21由驱动器22驱动，实现了导柱21顶起平面感光芯片300a过程的自动化以及精密运动，曲面感光芯片300的成型效果更佳。
进一步，请继续参考图8，在本实施方式中，顶升装置20还包括治具23，治具23上开设有多个导孔231。在步骤S46之前，也即在驱动器22驱动导柱21穿过通孔101之前，将电路板100固定在治具23上，使多个通孔101分别与多个导孔231正对，再将多个导柱分别与多个导孔正对，以令多个导柱分别与多个通孔正对，以便导柱21穿过导孔231。如此，可以实现导柱21穿设于通孔101过程的精准定位，同时能够增加导柱21顶起芯片过程的稳定性。
进一步，请继续参考图8，治具23的中心开设有真空孔232，真空孔232与导孔231相互独立。在将电路板100固定在治具23上的步骤中，使得真空孔232与抽气装置连通，当抽气装置工作时，电路板100因真空吸附而牢固的固定在治具23上。具体地，在本实施方式中，真空孔232的数量为一个并位于多个导孔231的内侧。如此，在驱动器22驱动导柱21顶起平面感光芯片300a的过程中，能够使电路板100通过真空孔232与治具23相互吸合，从而电路板100紧密地与治具23贴合，而不至于在顶起芯片时使电路板100 随着芯片一起向上运动而与治具23脱离。
进一步，在步骤S47之后，也即在形成曲面感光芯片300之后，感光组件制作方法还包括如下步骤：
步骤S48a，分离导柱21与通孔101以及导孔231。具体地，驱动器22驱动导柱21朝着远离曲面感光芯片300的一侧运动，以使导柱21从通孔101以及导孔231中退出。
步骤S48b，分离电路板100与治具23。具体地，抽气装置停止工作后，将电路板100从治具23上取下。
步骤S48c，分离固定块30与电路板100。
如此，可以得到具有曲面感光芯片300的感光组件10a，该感光组件10a可继续进行后续封装制程。其中，上述步骤S48c分别与步骤S48a和步骤S48b不分先后。
进一步，在步骤S48b之后，感光组件制作方法还包括如下步骤：
步骤S49，提供填充件500。结合图10和图11，将填充件500填充于多个通孔101中。具体地，该填充件500为埋孔胶，埋孔胶呈液态或半固态。通孔101中的埋孔胶固化后，形成感光组件10a的填充件500。
如此，可以使得电路板100具有较好的支撑强度，能够支撑曲面感光芯片300、镜头组件10b等元器件。
具体地，在本实施方式中，填充填充件500的步骤包括：
步骤S49a，如图10所示，将与顶升装置20以及固定块30分离后得到的具有曲面感光芯片300的感光组件10a倒立，也即使电路板100处于曲面感光芯片300的正上方。
步骤S49b，向各个通孔101内填充填充件500，形成如图11所示的状态。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了 便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种感光组件制作方法，其步骤包括：
    提供一电路板，所述电路板包括上表面以及与所述上表面相对的下表面，在所述电路板上开设连通所述上表面与所述下表面的通孔，所述通孔的数量为多个；
    提供一感光面为平面的平面感光芯片，将所述平面感光芯片的中心区域固定在所述多个通孔围合形成的图形的内侧，所述平面感光芯片的周边区域覆盖所述多个通孔；
    提供多个导柱，将所述多个导柱分别与所述多个通孔正对，并将所述多个导柱分别穿过所述多个通孔后顶起所述平面感光芯片的周边区域；以及
    在所述平面感光芯片与所述电路板之间的间隙填充封装胶体，固化形成感光面为曲面的曲面感光芯片；以及
    分离所述导柱与所述通孔。
  2. 根据权利要求1所述的感光组件制作方法，其特征在于，所述将所述平面感光芯片的中心区域固定在所述多个通孔围合形成的图形的内侧，具体包括：
    在所述电路板的所述上表面形成位于所述图形的内侧的粘结层；
    将所述平面感光芯片的中心区域贴附于所述粘结层。
  3. 根据权利要求2所述的感光组件制作方法，其特征在于，所述在所述电路板的所述上表面形成位于所述图形的内侧的粘结层，具体为：
    在所述电路板的所述上表面形成位于所述图形的中心区域的粘结层。
  4. 根据权利要求1所述的感光组件制作方法，其特征在于，所述将所述多个导柱分别与所述多个通孔正对，具体包括：
    将所述电路板固定于一治具；
    将所述多个通孔分别与所述治具上开设的多个导孔正对；
    将所述导柱分别与所述导孔正对，以令所述多个导柱分别与所述多个通孔正对。
  5. 根据权利要求4所述的感光组件制作方法，其特征在于，所述将所述电路板固定于一治具，具体为：
    通过所述治具的真空孔，令所述电路板吸附固定于所述治具。
  6. 根据权利要求1所述的感光组件制作方法，其特征在于，在所述将所述多个导柱分别穿过所述多个通孔后顶起所述平面感光芯片的周边区域之前，所述感光组件制作方法还包括如下步骤：
    提供导电线，并使所述导电线的两端分别与所述平面感光芯片及所述电路板电性连接。
  7. 根据权利要求1所述的感光组件制作方法，其特征在于，在所述将所述多个导柱分别穿过所述多个通孔后顶起所述平面感光芯片的周边区域之前，所述感光组件制作方法还包括如下步骤：
    提供固定块，将所述固定块贴合于所述电路板的所述上表面，以辅助所述导柱顶起所述平面感光芯片的周边区域。
  8. 根据权利要求1所述的感光组件制作方法，其特征在于，在分离所述导柱与所述通孔的步骤之后，所述感光组件制作方法还包括如下步骤：
    提供填充件，将所述填充件填充于所述多个通孔中。
  9. 根据权利要求8所述的感光组件制作方法，其特征在于，所述将所述填充件填充于所述多个通孔中的步骤，具体为：
    将埋孔胶填充于所述多个通孔中并固化形成所述填充件。
  10. 一种感光组件，包括：
    电路板，包括上表面以及与所述上表面相对的下表面，所述电路板上开设有连通所述上表面与所述下表面的通孔，所述通孔的数量为多个；
    曲面感光芯片，其感光面为曲面，所述曲面感光芯片的中心区域固定于所述多个通孔围合形成的图形的内侧，且所述曲面感光芯片与所述电路板电性连接；以及
    封装胶体，所述封装胶体填充于所述曲面感光芯片与所述电路板之间的间隙。
  11. 根据权利要求10所述的感光组件，其特征在于，所述曲面感光芯片的中心区域固定于所述多个通孔围合形成的图形的内侧的方式具体采用粘接层进行固定，所述粘结层形成于所述电路板的所述上表面，且位于所述多个通孔围合形成的图形的内侧，所述曲面感光芯片的中心区域贴附于所述粘结层上，以令所述曲面感光芯片的中心区域设于所述多个通孔围合形成的图形的内侧。
  12. 根据权利要求11所述的感光组件，其特征在于，所述粘结层位于所述多个通孔围合形成的图形的中心区域。
  13. 根据权利要求11所述的感光组件，其特征在于，所述封装胶体向内延伸，并与所述粘结层连接。
  14. 根据权利要求11所述的感光组件，其特征在于，所述封装胶体向外延伸至远离所述曲面感光芯片的一侧外。
  15. 根据权利要求10所述的感光组件，其特征在于，所述曲面感光芯片与所述电路板电性连接的方式具体采用导电线进行电性连接，所述导电线的两端分别与所述曲面感光芯片及所述电路板电性连接，以令所述曲面感光芯片与所述电路板电性连接。
  16. 根据权利要求15所述的感光组件，其特征在于，所述导电线与所述电路板连接的一端内嵌于所述封装胶体内。
  17. 根据权利要求10所述的感光组件，其特征在于，所述感光组件还包括填充件，所述填充件填充于所述多个通孔中。
  18. 根据权利要求17所述的感光组件，其特征在于，所述填充件包括埋孔胶。
  19. 一种摄像模组，包括：
    如权利要求10至18中任意一项所述的感光组件；以及
    镜头组件，设于所述感光组件的感光路径上。
  20. 一种智能终端，包括：
    终端本体；以及
    如权利要求19所述的摄像模组，所述摄像模组设于所述终端本体上。
PCT/CN2019/103013 2018-09-21 2019-08-28 感光组件制作方法、感光组件、摄像模组及智能终端 WO2020057334A1 (zh)

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