WO2020057054A1 - Structure de carte mère pour panneau d'affichage oled flexible et procédé de coupe - Google Patents

Structure de carte mère pour panneau d'affichage oled flexible et procédé de coupe Download PDF

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Publication number
WO2020057054A1
WO2020057054A1 PCT/CN2019/075627 CN2019075627W WO2020057054A1 WO 2020057054 A1 WO2020057054 A1 WO 2020057054A1 CN 2019075627 W CN2019075627 W CN 2019075627W WO 2020057054 A1 WO2020057054 A1 WO 2020057054A1
Authority
WO
WIPO (PCT)
Prior art keywords
end portion
display panel
oled display
cutting
flexible oled
Prior art date
Application number
PCT/CN2019/075627
Other languages
English (en)
Chinese (zh)
Inventor
向磊
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Publication of WO2020057054A1 publication Critical patent/WO2020057054A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technology, and in particular, to a motherboard structure and a cutting method for a flexible OLED display panel.
  • the technical problem mainly solved in this application is how to extract the ashes generated during the cutting process.
  • the present application provides a motherboard structure for a flexible OLED display panel, which includes:
  • a motherboard structure for a flexible OLED display panel includes:
  • a plurality of spaced-apart flexible OLED display panels disposed on the support surface, wherein the support surface is further provided with a plurality of cutting grooves, and each of the cutting grooves is located adjacent to the flexible OLED Between display panels;
  • the plurality of cutting grooves are arranged in an array on the supporting substrate, and the depth of the cutting grooves is smaller than the thickness of the supporting substrate.
  • the support substrate includes a first end portion and a second end portion that are oppositely disposed, and a third end portion and a fourth end portion that are oppositely disposed;
  • the plurality of cutting grooves are provided along the first end portion, the second end portion, the third end portion, and the fourth end portion.
  • the plurality of cutting grooves are spaced from each other.
  • the cutting groove provided at the first end portion and the cutting groove provided at the second end portion are symmetrical to each other;
  • the cutting groove provided at the third end portion and the cutting groove provided at the fourth end portion are symmetrical to each other.
  • a length of the cutting groove provided at the first end portion and a length of the cutting groove provided at the second end portion are smaller than a first pitch, and the first pitch is A distance between the first end portion and the second end portion;
  • the length of the cutting groove provided at the third end portion and the length of the cutting groove provided at the fourth end portion are less than a second distance, and the second distance is the distance between the third end portion and the The distance between the fourth ends is described.
  • one side of the OLED display panel corresponds to at least two of the cutting grooves.
  • the support substrate includes a first end portion and a second end portion that are oppositely disposed, and a third end portion and a fourth end portion that are oppositely disposed;
  • the plurality of cutting grooves include a plurality of first cutting grooves and a plurality of second cutting grooves, wherein the first cutting groove extends from the first end portion to the second end portion, and the second cutting groove A groove extends from the third end to the fourth end.
  • the depth of the cutting groove is smaller than the thickness of the supporting substrate.
  • the present application provides a motherboard structure for a flexible OLED display panel, which includes:
  • a motherboard structure for a flexible OLED display panel includes:
  • a plurality of spaced-apart flexible OLED display panels disposed on the support surface; wherein the support surface is further provided with a plurality of cutting grooves, and each of the cutting grooves is located adjacent to the flexible OLED Between display panels.
  • the support substrate includes a first end portion and a second end portion that are oppositely disposed, and a third end portion and a fourth end portion that are oppositely disposed;
  • the plurality of cutting grooves are provided along the first end portion, the second end portion, the third end portion, and the fourth end portion.
  • the plurality of cutting grooves are spaced from each other.
  • the cutting groove provided at the first end portion and the cutting groove provided at the second end portion are symmetrical to each other;
  • the cutting groove provided at the third end portion and the cutting groove provided at the fourth end portion are symmetrical to each other.
  • a length of the cutting groove provided at the first end portion and a length of the cutting groove provided at the second end portion are smaller than a first pitch, and the first pitch is A distance between the first end portion and the second end portion;
  • the length of the cutting groove provided at the third end portion and the length of the cutting groove provided at the fourth end portion are less than a second distance, and the second distance is the distance between the third end portion and the The distance between the fourth ends is described.
  • the plurality of cutting grooves are arranged in an array on the support substrate.
  • one side of the OLED display panel corresponds to at least two of the cutting grooves.
  • the support substrate includes a first end portion and a second end portion that are oppositely disposed, and a third end portion and a fourth end portion that are oppositely disposed;
  • the plurality of cutting grooves include a plurality of first cutting grooves and a plurality of second cutting grooves, wherein the first cutting groove extends from the first end portion to the second end portion, and the second cutting groove A groove extends from the third end to the fourth end.
  • the depth of the cutting groove is smaller than the thickness of the supporting substrate.
  • the present application further provides a cutting method, including:
  • the mother board structure of the flexible OLED display panel is cut to obtain a single-piece flexible OLED display panel.
  • the beneficial effect of the present application is that a plurality of cutting grooves are provided on the supporting surface, and each cutting groove is located between adjacent flexible OLED display panels. After the cutting is completed, the ashes generated during the cutting process can be extracted. Therefore, the cleanliness of the surface of the display panel is improved, and the success rate of bonding the back cover to the display panel is improved, thereby improving the product yield.
  • FIG. 1 is a schematic structural diagram of a first embodiment of a motherboard structure of a flexible OLED display panel provided in this application.
  • FIG. 2 is a schematic structural diagram of a second embodiment of a motherboard structure of a flexible OLED display panel provided by the present application.
  • FIG. 3 is a schematic structural diagram of a third embodiment of a motherboard structure of a flexible OLED display panel provided by the present application.
  • FIG. 4 is a schematic structural diagram of a fourth embodiment of a motherboard structure of a flexible OLED display panel provided by the present application.
  • FIG. 5 is a schematic structural diagram of a fifth embodiment of a motherboard structure of a flexible OLED display panel provided by the present application.
  • FIG. 6 is a schematic flowchart of a cutting method according to an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a first embodiment of a motherboard structure of a flexible OLED display panel provided by the present application.
  • An embodiment of the present application provides a motherboard structure 100 for a flexible OLED display panel, including:
  • the supporting substrate 10 has a supporting surface 20.
  • a plurality of flexible OLED display panels 30 arranged on the support surface 20 are arranged at intervals.
  • the supporting surface 20 is further provided with a plurality of cutting grooves 201, and each cutting groove 201 is located between adjacent flexible OLED display panels 30.
  • a protective film can also be attached to the other surface of the support substrate 10, and the protective film can be used to protect the support substrate 10.
  • the flexible OLED mother board 100 may include a thin film transistor array layer, an anode layer, an organic light emitting layer, a cathode layer, and an encapsulation layer that are stacked in this order.
  • the thin film transistor array layer is provided with various structural film layers such as a thin film transistor, a data line, and a scan line.
  • the organic light-emitting layer may include a hole-transporting functional layer, a light-emitting material layer, an electron-transporting functional layer, and the like made of an organic material.
  • the material of the support substrate 10 may be polyethylene terephthalate.
  • the motherboard structure 100 of the flexible OLED display panel in the embodiment of the present application may form a plurality of flexible OLED display panels 30 through processes such as cutting and peeling.
  • the mother substrate structure 100 of the flexible OLED display panel may be cut by a laser chamfering cutter to form a plurality of single-piece flexible OLED display panels 30.
  • the supporting substrate 10 can be made in advance according to the size of the motherboard structure 100 of the flexible OLED display panel.
  • a plurality of dicing grooves 201 are produced together with the support substrate 10.
  • the support substrate 10 may be cut by a laser cutting method to form a cutting groove 201 as shown in FIG. 1.
  • the support substrate 10 includes a first end portion 101 and a second end portion 102 opposite to each other, and a third end portion 103 and a fourth end portion 104 opposite to each other.
  • FIG. 2 is a schematic structural diagram of a second embodiment of a motherboard structure of a flexible OLED display panel provided in this application.
  • a plurality of first end portions 101, a plurality of second end portions 102, a plurality of third end portions 103, and a plurality of fourth end portions 104 are provided on the support substrate 10. Among them, a plurality of cutting grooves 201 are provided along the first end portion 101, the second end portion 102, the third end portion 103, and the fourth end portion 104.
  • the laser chamfering cutter cuts the motherboard structure 100 of the flexible OLED display panel according to the position of the cutting groove 201.
  • the cutting groove 201 is provided on the first end portion 101, the second end portion 102, the third end portion 103, and the fourth end portion 104.
  • the ash generated by the laser and the motherboard structure 100 of the flexible OLED display panel during the cutting process can be easily collected by the laser chamfering cutting machine
  • the dust system is drawn out. Therefore, the cleanliness of the surface of the display panel is improved, and the success rate of bonding the back cover to the display panel is improved, thereby improving the product yield.
  • a plurality of cutting grooves 201 are arranged at intervals from each other.
  • the cutting groove 201 provided at the first end portion 101 and the cutting groove 201 provided at the second end portion 102 are symmetrical to each other.
  • the cutting groove 201 provided at the third end portion 103 and the cutting groove 201 provided at the fourth end portion 104 are symmetrical to each other.
  • the length of the cutting groove 201 provided at the first end portion 101 and the length of the cutting groove 201 provided at the second end portion 102 are smaller than the first pitch.
  • the first distance is a distance between the first end portion 101 and the second end portion 102.
  • the length of the cutting groove 201 provided at the third end portion 103 and the length of the cutting groove 201 provided at the fourth end portion 104 are smaller than the second distance, and the second distance is a distance between the third end portion and the fourth end portion.
  • a part of the supporting substrate 10 is further provided between the cutting groove 201 of the first end portion 101 and the cutting groove 201 of the second end portion 102.
  • a part of the supporting substrate 10 also exists between the cutting groove 201 of the third end portion 103 and the cutting groove 201 of the fourth end portion 104 during the manufacturing process of the supporting substrate 10. That is, the cutting grooves 201 on the first end portion 101, the second end portion 102, the third end portion 103, and the fourth end portion 104 can be manufactured together, thereby reducing the time required for the process and improving the work efficiency.
  • FIG. 3 is a schematic structural diagram of a third embodiment of a motherboard structure of a flexible OLED display panel provided by the present application.
  • the plurality of cutting grooves 201 may be of the same size and size, and are arranged in a regular array on the supporting surface 20 of the supporting substrate 10. This can reduce the difficulty of the process.
  • the plurality of cutting grooves 201 are arranged on the support substrate 10 in an array. Therefore, it is not only convenient to cut the motherboard structure of the flexible OLED display panel. At the same time, it can also ensure that the ash generated during the cutting process can be extracted by the dust collection system in the laser chamfering cutting device, thereby improving the cleanliness of the surface of the flexible OLED display panel.
  • FIG. 4 is a schematic structural diagram of a fourth embodiment of a motherboard structure of a flexible OLED display panel provided by the present application.
  • One side of the OLED display panel 20 corresponds to at least two cutting grooves 201.
  • One side of the OLED display panel 20 may correspond to two cutting grooves 201, as shown in FIG. 4.
  • one side of the OLED display panel 20 may correspond to three cutting grooves 201, or one side of the OLED display panel 20 may correspond to a plurality of grooves 201.
  • only two cutting grooves 201 are used as an example for description.
  • FIG. 5 is a schematic structural diagram of a fifth embodiment of a motherboard structure of a flexible OLED display panel provided by the present application.
  • the support substrate 10 includes a first end portion 101 and a second end portion 102 opposite to each other, and a third end portion 103 and a fourth end portion 104 opposite to each other.
  • the setting methods of the first end portion 101, the second end portion 102, the third end portion 103, and the fourth end portion 104 in this embodiment are similar to those in the previous embodiment, and are not repeated here.
  • the difference between this example and the previous embodiment is:
  • the plurality of cutting grooves 201 include a plurality of first cutting grooves 2011 and a plurality of second cutting grooves 2012.
  • the first cutting groove 2011 extends from the first end portion 101 to the second end portion 102
  • the second cutting groove 2012 extends from the third end portion 103 to the fourth end portion 104.
  • a plurality of first cutting grooves 2011 extend from the first end portion 101 to the second end portion 102 and are disposed on the support surface 20 of the support substrate 10 at intervals.
  • the shapes and sizes of the plurality of first cutting grooves 2011 are the same.
  • a plurality of first cutting grooves 2011 are provided on the support substrate 10 at intervals, and the plurality of first cutting grooves 2011 extend from the first end portion 101 to the second end portion 102, it is possible to further The cleanliness of the surface of the display panel 30 is improved, and the success rate of bonding the back cover to the display panel 30 is improved, thereby improving the product yield.
  • the plurality of first cutting grooves 2011 extend from the first end portion 101 to the second end portion 102.
  • the solution of this embodiment further improves the product yield.
  • the setting method of the second cutting slot 2012 is similar to the setting method of the first cutting slot 2011. For details, please refer to the setting method of the first cutting slot 2011, and details are not described herein again.
  • the depth of the cutting groove 201 is smaller than the thickness of the support substrate 10.
  • a plurality of cutting grooves 201 are provided on the support surface 20, and each cutting groove 201 is located between adjacent flexible OLED display panels 30. After the cutting is completed, The ashes generated during the cutting process can be extracted. Therefore, the cleanliness of the surface of the display panel 30 is improved, and the success rate of bonding the back cover to the display panel 30 is improved, thereby further improving the product yield.
  • FIG. 6 is a schematic flowchart of a cutting method according to an embodiment of the present application.
  • a cutting method includes:
  • 301 Provide a motherboard structure for a flexible OLED display panel.
  • the motherboard structure of the flexible OLED display panel can refer to FIG. 1, FIG. 2, FIG. 3, FIG. 4 or FIG. 5 above.
  • the motherboard structure and cutting method of the flexible OLED display panel provided in the present application are provided with a plurality of cutting grooves on a supporting surface, and each cutting groove is located between adjacent flexible OLED display panels. After the cutting is completed, the ashes generated during the cutting process can be extracted. Therefore, the cleanliness of the surface of the display panel is improved, and the success rate of bonding the back cover to the display panel is improved, thereby improving the product yield.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne une structure de carte mère pour un panneau d'affichage OLED flexible et un procédé de coupe. Le panneau d'affichage OLED flexible comprend : un substrat de support ayant une surface de support ; et de multiples panneaux d'affichage OLED flexibles disposés à des intervalles sur la surface de support, une pluralité d'évidements de coupe étant agencés au niveau de la surface de support, et chaque évidement de coupe étant positionné entre les panneaux d'affichage OLED flexibles adjacents.
PCT/CN2019/075627 2018-09-17 2019-02-21 Structure de carte mère pour panneau d'affichage oled flexible et procédé de coupe WO2020057054A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811081938.5A CN109326629B (zh) 2018-09-17 2018-09-17 柔性oled显示面板的母板结构以及切割方法
CN201811081938.5 2018-09-17

Publications (1)

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WO2020057054A1 true WO2020057054A1 (fr) 2020-03-26

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PCT/CN2019/075627 WO2020057054A1 (fr) 2018-09-17 2019-02-21 Structure de carte mère pour panneau d'affichage oled flexible et procédé de coupe

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WO (1) WO2020057054A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109326629B (zh) * 2018-09-17 2021-02-02 武汉华星光电半导体显示技术有限公司 柔性oled显示面板的母板结构以及切割方法
CN110010550B (zh) * 2019-04-18 2021-01-22 京东方科技集团股份有限公司 一种阵列基板制备方法及显示面板制备方法
CN115691327A (zh) * 2022-09-29 2023-02-03 惠科股份有限公司 支撑膜、柔性母板、柔性显示面板及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014110601A (ja) * 2012-12-04 2014-06-12 Hitachi Aloka Medical Ltd 超音波振動子ユニットおよびその製造方法
CN108198772A (zh) * 2017-12-28 2018-06-22 武汉华星光电半导体显示技术有限公司 承载组件及切割设备、柔性介质的切割方法
CN108500478A (zh) * 2018-03-29 2018-09-07 武汉华星光电半导体显示技术有限公司 显示面板切割设备和显示面板的切割辅助装置
CN109326629A (zh) * 2018-09-17 2019-02-12 武汉华星光电半导体显示技术有限公司 柔性oled显示面板的母板结构以及切割方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009059773A (ja) * 2007-08-30 2009-03-19 Panasonic Corp 半導体レーザ装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014110601A (ja) * 2012-12-04 2014-06-12 Hitachi Aloka Medical Ltd 超音波振動子ユニットおよびその製造方法
CN108198772A (zh) * 2017-12-28 2018-06-22 武汉华星光电半导体显示技术有限公司 承载组件及切割设备、柔性介质的切割方法
CN108500478A (zh) * 2018-03-29 2018-09-07 武汉华星光电半导体显示技术有限公司 显示面板切割设备和显示面板的切割辅助装置
CN109326629A (zh) * 2018-09-17 2019-02-12 武汉华星光电半导体显示技术有限公司 柔性oled显示面板的母板结构以及切割方法

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CN109326629A (zh) 2019-02-12

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