WO2020054823A1 - Tampon de polissage, outil de polissage, et procédé de polissage - Google Patents

Tampon de polissage, outil de polissage, et procédé de polissage Download PDF

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Publication number
WO2020054823A1
WO2020054823A1 PCT/JP2019/035976 JP2019035976W WO2020054823A1 WO 2020054823 A1 WO2020054823 A1 WO 2020054823A1 JP 2019035976 W JP2019035976 W JP 2019035976W WO 2020054823 A1 WO2020054823 A1 WO 2020054823A1
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WIPO (PCT)
Prior art keywords
polishing
polished
layer
polishing pad
annular
Prior art date
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PCT/JP2019/035976
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English (en)
Japanese (ja)
Inventor
恭祐 天▲高▼
翔太 菱田
大祐 安井
英治 長谷
堀田　和利
Original Assignee
株式会社フジミインコーポレーテッド
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Priority to JP2020546207A priority Critical patent/JPWO2020054823A1/ja
Publication of WO2020054823A1 publication Critical patent/WO2020054823A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a polishing pad, a polishing tool, and a polishing method.
  • Polishing using a polishing pad is known as a processing method for smoothing a curved surface to be polished (for example, a painted surface of a vehicle body of an automobile or the like) of an object to be polished.
  • the polishing pad is composed of a laminate including a polishing layer having a polishing surface and a support layer made of an elastic body and supporting the polishing layer (for example, see Patent Document 1). Since the support layer of the polishing pad is soft, the polishing surface is deformed during polishing and follows the curved surface to be polished of the object to be polished, so that the curved surface to be polished can be polished.
  • the polishing layer (polishing surface) needs to be somewhat hard, but if the polishing layer is hard, the polishing surface may be deformed. In some cases, it is difficult to sufficiently follow a curved surface to be polished. As a result, the undulation of the curved surface to be polished of the object to be polished cannot be sufficiently removed, and the curved surface to be polished cannot be beautifully finished in some cases.
  • a polished surface can follow a curved surface having various curvatures to polish a curved surface to be polished of an object to be polished, thereby removing undulations of the curved surface to be polished. It is an object to provide a simple polishing pad, a polishing tool, and a polishing method.
  • a polishing pad includes a stacked body including a polishing layer having a polishing surface, and a support layer formed of an elastic body and supporting the polishing layer, and a region inside the outer edge of the polishing layer.
  • a penetrating portion penetrating the polishing layer in the thickness direction is formed on the polishing layer, and the polishing layer is formed of a material having a durometer hardness type A specified in JIS # K6253-3: 2012 of 30 or more. The point is that
  • a polishing tool includes the polishing pad according to the above aspect.
  • the polishing surface of the polishing pad according to the above aspect and the curved surface to be polished of the object to be polished are slid in the presence of the polishing composition. Accordingly, the object of the present invention is to polish the surface to be polished.
  • the polishing method according to still another aspect of the present invention is directed to a polishing method according to the above aspect, in which the polishing surface of the polishing pad provided in the polishing tool and the curved surface to be polished of the object to be polished are provided with a polishing composition.
  • the gist is that the surface to be polished is polished by sliding it down.
  • the polishing surface of the polishing pad also follows the curved surface of various curvatures, performs polishing of the curved polished surface of the object to be polished, and undulates the curved polished surface. It is possible to remove it.
  • FIG. 2 is a top view illustrating one embodiment of the polishing pad according to the present invention.
  • FIG. 2 is a cross-sectional view of the polishing pad of FIG. 1 taken along line BB. It is a top view explaining other embodiments of the polishing pad concerning the present invention.
  • FIG. 4 is a sectional view taken along line AA of the polishing pad of FIG. 3.
  • FIG. 4 is a top view of a polishing layer of a polishing pad in which a planar shape of an opening of a penetrating portion is different from the example of FIG. 3. It is sectional drawing of the polishing pad which shows the modification of the cross-sectional shape of a penetration part. It is sectional drawing of the polishing pad which has a linear groove in a polishing layer.
  • FIG. 13 is a top view of a polishing layer of the polishing pad of Comparative Example 3.
  • the polishing method of the present embodiment is suitable for polishing an object to be polished having a curved surface to be polished (for example, a painted surface of a vehicle body such as an automobile). That is, the polishing method of the present embodiment slides the polishing surface 10a of the polishing pad 10 and the curved surface 90a of the polishing object 90 in the presence of a polishing composition (not shown). This is to polish the curved surface to be polished 90a (see FIG. 8A).
  • the polishing pad 10 used in the polishing method according to the present embodiment includes a polishing layer 1 having a polishing surface 10a for polishing a surface 90a to be polished of a polishing object 90, and an elastic body. And a support layer 2 that supports the polishing layer 1.
  • the laminate constituting the polishing pad 10 is not limited to the two-layer structure, but is provided between the polishing layer 1 and the support layer 2 or on the surface of the support layer 2 opposite to the surface facing the polishing layer 1.
  • Another layer may be provided on the side to form a laminate of three or more layers.
  • the polishing layer 1 has a penetrating portion 1a. More specifically, a penetrating portion 1a, which is a hole penetrating the polishing layer 1 in the thickness direction, is formed in a region inside (center side) of the outer edge of the polishing layer 1 (or the polishing surface 10a). That is, the opening of the penetrating portion 1a is not open at the outer edge of the polishing layer 1, but is a closed opening.
  • the through portion 1 a may be a hole extending in parallel with the thickness direction of the polishing layer 1 if it is formed in a region inside the outer edge of the polishing layer 1, or may be a hole extending in the thickness direction of the polishing layer 1. A hole extending in the inclined direction may be used.
  • the penetrating portion 1a has a continuous annular shape along the circumferential direction of the polishing surface 10a, and the polishing surface 10a is penetrated by the penetrating portion 1a.
  • the shape may be such that it is divided into an annular polishing surface 10c outside the portion 1a and a circular polishing surface 10d inside the through portion 1a.
  • the through portion 1a is not continuous along the circumferential direction of the polishing surface 10a, and has such a shape that the polishing surface 10a is not divided into a plurality by the through portion 1a. (Hereinafter, also referred to as “non-annular”).
  • the polishing layer 1 is formed of a material having a durometer hardness type A (hereinafter referred to as “A hardness”) of 30 or more specified in JIS K6253-3: 2012. Examples of such a material include a material containing a urethane resin, an epoxy resin, or a polyimide resin. Further, the polishing layer 1 can be formed of a nonwoven fabric, a resin sheet, or a suede.
  • a hardness a material having a durometer hardness type A (hereinafter referred to as “A hardness”) of 30 or more specified in JIS K6253-3: 2012. Examples of such a material include a material containing a urethane resin, an epoxy resin, or a polyimide resin. Further, the polishing layer 1 can be formed of a nonwoven fabric, a resin sheet, or a suede.
  • the above JIS @ K6253 is a standard corresponding to ISO7619.
  • the surface of the polishing layer 1 constituting the polishing surface 10a may not hold abrasive grains, or may hold abrasive grains by means such as bonding or embedding.
  • the abrasive grains are held such that a part of the surface is exposed from the polishing surface 10a.
  • the abrasive grains may be held directly on the polishing surface 10a, but may be held via an adhesive sheet or the like.
  • a sheet (eg, a paper file) holding abrasive grains is adhered to the surface of a layered member formed of a material such as urethane resin or nonwoven fabric, and is polished by the surface having the abrasive grains of the attached paper file.
  • the surface 10a may be configured.
  • the polishing layer 1 is composed of a layered member formed of a material such as urethane resin or nonwoven fabric and a paper file.
  • the type of the material constituting the support layer 2 is not particularly limited.
  • an elastic body made of an elastically deformable resin may be used. it can.
  • an elastic body made of a resin foam such as foamed polyurethane, foamed polyethylene, foamed polypropylene, foamed polystyrene, foamed polyethylene terephthalate and the like can be mentioned.
  • the hardness of the support layer 2 is lower than that of the polishing layer 1.
  • the polishing surface 10a of the polishing surface 90a of the polishing object 90 is polished by using the polishing pad 10 having such a configuration
  • the polishing surface 10a of the polishing pad 10 is three-dimensionally deformed, and the polishing surface 10a is curved. Since it follows the polished surface 90a, it is possible to sufficiently remove the undulation of the curved polished surface 90a. Therefore, when polishing is performed using the polishing pad 10 of the present embodiment, a beautiful surface finish can be applied to the curved surface 90a to be polished.
  • the polishing surface 10a of the polishing pad 10 is It can be easily deformed according to the curved shape of the polished surface 90a. Therefore, when the polishing surface 10a having a curved surface is polished by using the polishing pad 10 of the present embodiment, the polishing surface 10a of the polishing pad 10 is three-dimensionally irrespective of the size of the curvature, regardless of the curvature. Since the polished surface 90a is polished while being deformed and following the curved polished surface 90a, it is possible to sufficiently remove the undulation of the curved polished surface 90a. Further, the polishing method of the present embodiment can be suitably applied to a polished surface having a plurality of curved portions having different curvatures, and a polished surface having a concave portion and a convex portion.
  • the penetrating portion 1a is formed in a region inside the outer edge of the polishing layer 1, and the opening of the penetrating portion 1a is not closed at the outer edge of the polishing layer 1 but is a closed opening. Therefore, there are no corners or cutouts at the outer edge of the polishing layer 1, and the outer edge of the polishing layer 1 has a smooth linear shape. Therefore, even when the outer edge of the polishing layer 1 comes into contact with the polishing target 90 during polishing, breakage such as chipping of the polishing pad 10 is less likely to occur. Therefore, when the polishing pad 10 of the present embodiment is used, even when the corners and edges of the polishing target 90 are polished, breakage such as chipping or the like of the polishing pad 10 is unlikely to occur. Overpolishing hardly occurs at the edge. Furthermore, the polishing pad 10 of the present embodiment has a long life because it is hardly damaged during polishing.
  • the A hardness of the polishing layer 1 needs to be 30 or more, more preferably 40 or more, further preferably 60 or more, and more preferably 80 or more. Even more preferred.
  • a polishing layer having an A hardness of 30 or more is hard and may not be easily deformed. However, the polishing layer 1 is easily deformed because the penetrating portion 1a is formed in the polishing layer 1.
  • the swell of the polished surface 90a is easily removed because the hardness of the polishing layer 1 is good.
  • the planar shape of the opening of the penetrating part 1a that is, the shape of the opening of the penetrating part 1a in the vertical projection view when the opening of the penetrating part 1a is viewed from the viewpoint of a position perpendicular to the polishing surface 10a is:
  • Examples of the planar shape of the opening of the through portion 1a include an annular shape (see FIG. 1) and a non-annular shape.
  • Non-circular includes circular (see FIG. 3), cocoon (see FIG.
  • ellipse polygon (triangle, square, pentagon, hexagon, octagon, etc.), straight line (band), curve Shape (arc shape, C-shape, U-shape, S-shape, etc.), irregular shape and the like.
  • a shape having no corner portion such as an annular shape or a circular shape is preferable.
  • the shapes of the openings of the plurality of through portions 1a may be all the same, or some or all of them may be different.
  • the size of the opening of the penetrating portion 1a and the number of the penetrating portions 1a depend on the area of the polishing surface 10a (the entire area of the region inside the outer edge of the polishing surface 10a including the opening of the penetrating portion 1a). It is preferable that the ratio of the total area of the opening 1a is set to be 3% or more and 35% or less. That is, the area of the polishing surface 10a and the area of the opening of the through portion 1a are measured in a vertical projection view when the polishing surface 10a is viewed from a viewpoint perpendicular to the polishing surface 10a.
  • the areas of the openings of all the penetrating portions 1a are summed, and the total area of the openings of the penetrating portions 1a is divided by the area of the polishing surface 10a to obtain the opening of the penetrating portion 1a with respect to the area of the polishing surface 10a. Calculate the percentage of the total area of the part.
  • the ratio of the total area of the openings of the penetrating portions 1a to the area of the polishing surface 10a is 3% or more, the flexibility of the polishing layer 1 becomes good, and the polishing layer 1 can easily follow the curved surface 90a.
  • the ratio of the total area of the openings of the through portions 1a to the area of the polishing surface 10a is 35% or less, the polishing performance of the polishing layer 1 becomes good, and the undulation of the curved surface to be polished 90a is easily removed.
  • the ratio of the total area of the opening of the through portion 1a to the area of the polishing surface 10a is set to be 6% or more and 20% or less.
  • the size and number of the through portion 1a of the opening of the through portion 1a is preferably the total area of the opening of the through portion 1a is set to be 20 mm 2 or more 25000 mm 2 or less. If the total area of the openings of the through-holes 1a is 20 mm 2 or more, the flexibility of the polishing layer 1 is good, so that the polishing layer 1 can easily follow the curved polished surface 90a. On the other hand, if the total area of the openings of the penetrating portions 1a is 25000 mm 2 or less, the polishing performance of the polishing layer 1 is improved, and the undulation of the curved surface to be polished 90a is easily removed.
  • the total area of the openings of the penetrating portion 1a is more preferably set to be 350 mm 2 or more 9500Mm 2 or less, more preferably set to be 700 mm 2 or more 4000 mm 2 or less.
  • the total area of the opening of the through portion 1a is obtained by measuring the area of the opening of the through portion 1a in a vertical projection view when the polishing surface 10a is viewed from a viewpoint perpendicular to the polishing surface 10a. It can be obtained by:
  • the mode of arrangement of the openings of the penetrating portions 1a in the polishing surface 10a is not particularly limited, but the distance from the outer edge of the polishing surface 10a to the flexibility and the polishing performance of the polishing layer 1 is preferable. It is preferable to appropriately set the distance from the center of the polishing surface 10a, the distance between the openings of the through portion 1a, and the like.
  • the penetrating portion 1a may be formed only in a region outside a circular region having a radius of 15 mm (more preferably 30 mm, more preferably 35 mm) centered on the center of the polishing surface 10a. Then, the undulation of the curved surface to be polished 90a is easily removed.
  • the polishing surface 10a is divided into an annular polishing surface 10c outside the through portion 1a and a circular polishing surface 10d inside the through portion 1a.
  • the shape of the penetrating portion 1a at this time is not particularly limited, and may be a perfect circle or an ellipse.
  • the size of the annular penetration portion 1a, the annular polishing surface 10c outside the penetration portion 1a, and the circular polishing surface 10d inside the penetration portion 1a is not particularly limited, but the circle inside the penetration portion 1a.
  • the diameter of the polished surface 10d is preferably 30 mm or more and 120 mm or less, more preferably 60 mm or more and 120 mm or less, and even more preferably 72 mm or more and 115 mm or less. If the diameter of the circular polishing surface 10d inside the through portion 1a is 30 mm or more, the undulation of the curved polishing target surface 90a is easily removed. On the other hand, if the diameter of the circular polishing surface 10d inside the through portion 1a is 120 mm or less, the polishing surface 10a can easily follow the curved surface to be polished 90a.
  • the diameter of the annular polishing surface 10c outside the through portion 1a is more preferably larger than the diameter of the circular polishing surface 10d inside the through portion 1a and not more than 300 mm, and the circular shape inside the through portion 1a is more preferable. More preferably, it is larger than the diameter of the polished surface 10d and 200 mm or less. If the diameter of the annular polishing surface 10c outside the through portion 1a is 300 mm or less, the polishing surface 10a can easily follow the curved surface to be polished 90a.
  • the width of the annular polishing surface 10c outside the through portion 1a is preferably 10 mm or more, and more preferably 15 mm or more. If the width of the annular polishing surface 10c outside the through portion 1a is 10 mm or more, the undulation of the curved surface to be polished 90a is easily removed.
  • the width of the annular through portion 1a is preferably 11 mm or more and 17 mm or less, and more preferably 13 mm or more and 17 mm or less. Within this range, the polished surface 10a can easily follow the curved polished surface 90a, and the undulation of the curved polished surface 90a is easily removed.
  • the ratio of the width of the annular through portion 1a to the diameter of the polishing surface 10a is preferably set to be 2.5% or more and 15% or less, and more preferably 8% or more and 13% or less. Within this range, the polished surface 10a can easily follow the curved polished surface 90a, and the undulation of the curved polished surface 90a is easily removed.
  • the position of the annular penetration portion 1a on the polishing surface 10a is not particularly limited as long as it is a region inside (center side) of the outer edge of the polishing surface 10a, but the annular polishing surface 10c outside the penetration portion 1a. It is preferable to dispose the annular through portion 1a at a position where the center of the circle and the center of the circular polishing surface 10d inside the through portion 1a are common.
  • the polishing layer 1 having the annular polishing surface 10c outside the penetrating portion 1a and the polishing layer 1 having the circular polishing surface 10d inside the penetrating portion 1a may be formed of the same material or different. It may be formed of a material. More efficient when the A hardness of the polishing layer 1 having the circular polishing surface 10d inside the penetrating portion 1a is larger than the A hardness of the polishing layer 1 having the annular polishing surface 10c outside the penetrating portion 1a. This is preferable because the undulation of the polished surface 90a can be removed.
  • the size of the opening of the penetrating part 1a and the number of the penetrating parts 1a are not particularly limited, but the number of the penetrating parts 1a is three or more.
  • the number is preferably 16 or less, more preferably 5 or more and 10 or less.
  • the polishing performance of the polishing layer 1 is improved, and the undulation of the curved surface to be polished 90a is easily removed.
  • the sizes of the openings of the plurality of penetration portions 1a may be all the same, or some or all of them may be different.
  • the size of the opening of the non-circular through portion 1a is not particularly limited, but the diameter is determined when the opening has a circular plane shape, and the shorter diameter is determined when the opening has a cocoon shape or an elliptical shape ( (Shorter diameter) is preferably from 11 mm to 17 mm, more preferably from 13 mm to 17 mm. Within this range, the polished surface 10a can easily follow the curved polished surface 90a, and the undulation of the curved polished surface 90a is easily removed.
  • the mode of arrangement of the non-annular through portions 1a is not particularly limited.
  • the openings of the plurality of non-annular through portions 1a may be linearly arranged on the polishing surface 10a or may be arranged in a curved line. Or may be arranged in a ring.
  • the polishing surface 10a has an annular polishing surface 10c outside the through-portion 1a divided by the annular through-portion 1a and an inner polishing surface 10c inside the through-portion 1a. It can be considered that the circular polishing surface 10d is connected and connected at a plurality of locations, and the polishing surface 10a can easily follow the curved polishing target surface 90a. The undulation of the polished surface 90a is easily removed.
  • a plurality of groups of openings in which the openings of the plurality of non-annular through-holes 1a are arranged linearly, curvedly, or annularly may be provided on the polishing surface 10a regularly or irregularly.
  • a plurality of opening groups in which the openings of the plurality of non-annular through-holes 1a are arranged in a straight line or a curved line may be arranged in parallel with the polishing surface 10a.
  • a plurality of aperture groups in which the apertures of the plurality of non-annular through-holes 1a are arranged in a ring may be arranged concentrically or in rows on the polishing surface 10a.
  • the angle ⁇ formed by these two virtual straight lines Is preferably not less than 20 degrees and not more than 85 degrees, and more preferably not less than 20 degrees and not more than 40 degrees.
  • the polished surface 10a can easily follow the curved polished surface 90a, and the undulation of the curved polished surface 90a is easily removed.
  • the openings of the plurality of non-circular through-holes 1a are arranged on the polishing surface 10a so as to have symmetry such as line symmetry and point symmetry as a whole.
  • the opening of the non-circular through-hole 1a is formed such that a virtual straight line sequentially connecting the centers of the openings of the adjacent non-circular through-holes 1a forms a regular polygon such as a square, a regular hexagon, and a regular octagon.
  • they are arranged.
  • the centers of the openings of the plurality of non-annular through-holes 1a are respectively arranged at positions corresponding to the vertices of a regular polygon virtually arranged on the polishing surface 10a. In this case, it is preferable that the center of the polishing surface 10a coincides with the center of the regular polygon.
  • the polishing pad 10 shown in FIG. 3 is an example in which the openings of the eight non-circular through portions 1a are arranged at positions corresponding to the vertices of a regular octagon, respectively, and the polishing pad 10 shown in FIG. This is an example in which the openings of the plurality of non-annular through-holes 1a are arranged at positions corresponding to the vertices of a regular hexagon.
  • a concave portion 2 a may be provided in the support layer 2.
  • the concave portion 2a of the support layer 2 may be a penetrating portion penetrating the support layer 2 in the thickness direction as shown in FIG. 4, or may be in contact with the polishing layer 1 of the support layer 2 as shown in FIG. It may be a bottomed hole formed in the surface on the side.
  • the cross-sectional shape (cross-sectional shape when cut along a plane orthogonal to the polishing surface 10a) is not particularly limited, and the V-shape shown in FIG.
  • the shape may be a polygon such as a rectangle or an arc.
  • the concave portion 2a of the support layer 2 may be formed continuously with the annular or non-annular through portion 1a of the polishing layer 1 (ie, at the same position on the polishing surface 10a). May be arranged) or may be formed discontinuously (not shown).
  • the planar shape of the polishing layer 1 and the polishing surface 10a is not particularly limited, but the polishing layer 1 is formed in a plate shape such as a disk shape or a square plate shape, and the outer surface (supporting surface) of the polishing layer 1 forming the polishing surface 10a is formed.
  • the surface opposite to the surface facing the layer 2 and the surface exposed to the outside may be circular or polygonal.
  • the polishing layer 1 may be formed in a truncated cone shape such as a truncated cone shape or a truncated pyramid shape.
  • the shape of the support layer 2 is not particularly limited, but may be a columnar shape such as a columnar shape or a prismatic shape, or a frustum shape such as a truncated cone or a truncated pyramid.
  • the shape of the support layer 2 is frustum-shaped, the two bottom surfaces of the frustum, that is, the surface on the side facing the polishing layer 1 and the surface on the opposite side (that is, the pad mounting portion of the polishing tool 104 described later) (The surface facing the surface) can be 0.5 or more and 4 or less, preferably 0.5 or more and 2 or less.
  • the flexibility of the polishing layer 1 can be controlled by this area ratio.
  • the surface facing the polishing layer 1 is more preferably a surface larger than the surface on the opposite side.
  • the area ratio of both surfaces is preferably 1.08 or more and 4 or less, more preferably 1.08 or more and 2.6 or less, and further preferably 1.2 or more and 1.7 or less. preferable.
  • the ratio of the diameters of both surfaces is preferably 1.04 or more and 2 or less, more preferably 1.04 or more and 1.6 or less, and even more preferably 1.1 or more and 1.3 or less.
  • the side surfaces of the support layer 2 are cylindrical or conical when the support layer 2 is cylindrical or truncated cone, and are flat when the support layer 2 is prismatic or truncated pyramid, but these side surfaces are flat.
  • the present invention is not limited thereto, and may be a convex surface protruding toward the outside of the support layer 2 or a concave surface concave toward the inside of the support layer 2.
  • the shape of the support layer 2 is frustum-shaped, the inclination angle of the side surface of the support layer 2 with respect to the center axis of the frustum is not particularly limited, but the flexibility of the polishing layer 1 is adjusted by the inclination angle. can do.
  • the thickness of the polishing layer 1 is not particularly limited, but is preferably 0.5 mm or more, and more preferably 0.8 mm or more. When the thickness of the polishing layer 1 is within the above range, the hardness of the polishing layer 1 becomes good, and the undulation of the polished surface 90a is easily removed. In addition, the thickness of the polishing layer 1 is preferably 5 mm or less, more preferably 3.0 mm or less. When the thickness of the polishing layer 1 is within the above range, the flexibility of the polishing layer 1 is good, and the polished surface 10a easily follows the polished surface 90a. Therefore, the undulation of the polished surface 90a is easily removed, and the contact area between the polished surface 10a and the curved surface increases, so that the polishing efficiency tends to be improved.
  • the support layer 2 may be thicker than the polishing layer 1. If the support layer 2 is thicker than the polishing layer 1, the polishing surface 10a can easily follow the polished surface 90a due to the flexibility of the support layer 2.
  • the hardness of the support layer 2 is not particularly limited as long as the support layer 2 has the flexibility of giving the polishing surface 10a the ease of deformation, but the A hardness of the support layer 2 is higher than that of the polishing layer. It is preferable that the hardness is lower than the A hardness of 1.
  • a linear groove 1c may be formed on the polishing surface 10a of the polishing layer 1, as shown in FIG.
  • the polishing surface 10a can more easily follow the curved surface to be polished 90a, and the undulation of the polished surface 90a of the polishing target 90 can be easily removed.
  • the polishing composition easily spreads along the linear groove 1c to the central portion of the polishing surface 10a, and when foreign matter enters between the polishing surface 10a and the surface to be polished 90a, the linear groove is formed. Since foreign matter is easily discharged along 1c, even if the polished surface 90a is a relatively soft surface such as a coating film, generation of polishing scratches is suppressed.
  • the number of linear grooves 1c formed on the polishing surface 10a is not particularly limited, and may be one or more. Further, the linear groove 1c may be linear or curved. Then, the linear or curved linear grooves 1c may be arranged in parallel with each other to form stripes, or may be formed to intersect in a lattice. Alternatively, a circular or elliptical linear groove 1c may be formed concentrically.
  • the width of the linear groove 1c is not particularly limited, but may be, for example, 0.5 mm or more and 5 mm or less. Further, the linear groove 1c may be a groove having a depth penetrating from the polishing surface 10a (outer surface) of the polishing layer 1 to the surface in contact with the support layer 2, or as shown in FIG. Groove may be used. However, when the linear groove 1c is a groove having a bottom, the polishing layer 1 is less likely to be damaged. Further, the cross-sectional shape of the linear groove 1c (cross-sectional shape when cut along a plane orthogonal to the polishing surface 10a) is not particularly limited, and may be rectangular as shown in FIG. Shape, arc shape, etc. may be used.
  • a water-stop layer (not shown) for suppressing the slurry-like or emulsion-like polishing composition from penetrating into the support layer 2 is provided. May be formed on the inner surface of the concave portion 2 a of the support layer 2.
  • a water-stop layer made of a water-stop material (for example, foamed rubber) having a low water absorption, the polishing composition is less likely to penetrate into the support layer 2 during polishing. Therefore, the amount of the polishing composition not used for polishing is reduced, and the utilization efficiency of the polishing composition is increased, so that the polishing cost can be reduced.
  • the type of the water-stopping material is not particularly limited.
  • chloroprene rubber foam, ethylene-propylene rubber foam, silicone rubber foam, Foam rubbers such as a fluoro rubber foam, a polyurethane foam, and a polyethylene foam are exemplified.
  • a water-stopping layer may be provided on a portion of the surface of the support layer 2 which is easily contacted with the polishing composition.
  • the material of the object to be polished to which the polishing method of the present embodiment can be applied is not particularly limited.
  • resins oxides such as silicon, aluminum, zirconium, calcium, and barium, carbides, nitrides, and borides
  • a metal such as magnesium, aluminum, titanium, iron, nickel, cobalt, copper, zinc, manganese or an alloy containing the same as a main component.
  • a resin is preferable among them.
  • the object to be polished may be a member formed of resin (resin member) or a resin coating film coated on the surface of the base material.
  • the type of the resin is not particularly limited, and examples thereof include a urethane resin, an acrylic resin, and a polycarbonate resin. Accordingly, the type of the resin constituting the resin coating film is not particularly limited, and examples thereof include a urethane resin and an acrylic resin, and the resin coating film may be a transparent clear coating film.
  • the thickness of the resin coating is not particularly limited, and may be 100 ⁇ m or less, or 10 ⁇ m or more and 40 ⁇ m or less.
  • the polishing method of the present embodiment can be used for manufacturing a coated member in which a resin film is coated on the surface of a substrate. If the outer surface of the resin coating of the coated member is polished using the polishing method of the present embodiment, the resin coating can be polished at a high polishing rate, and the outer surface of the resin coating that is the surface to be polished can be polished. Since polishing flaws are less likely to occur on the surface (hereinafter sometimes referred to as a “resin-coated surface”), it is possible to produce a coated member having a beautifully glossy resin coating film with little waviness and polishing flaws with high productivity.
  • the type of the coating member (that is, the application of the resin coating film) is not particularly limited, and examples thereof include an automobile body, a railway vehicle, an aircraft, and a resin member.
  • the resin coating film coated on the surface of the body of the automobile has a large area and a curved surface
  • the polishing method of the present embodiment is suitable for polishing the outer surface of such a resin coating film.
  • the material of the base material include iron alloys such as stainless steel, aluminum alloys, resins, and ceramics. Iron alloys are used in general vehicles including automobiles, for example, as steel plates. For example, stainless steel is used for railway vehicles. The steel sheet may be provided with a surface coating. Aluminum alloys are used for parts such as automobiles and aircraft. Further, the resin is used for a resin member such as a bumper.
  • the polishing is performed by interposing the polishing composition between the polishing surface of the polishing pad and the surface to be polished of the object to be polished.
  • a slurry containing abrasive grains, additives, a liquid medium, and the like can be used.
  • the type of abrasive grains is not particularly limited, silica, alumina, ceria, titania, zirconia, iron oxide, metal oxides such as oxides and manganese oxide, particles of resin, organic particles of resin, and organic-inorganic composite particles And so on.
  • the type of the additive is not particularly limited, for example, additives such as a pH adjuster, an etching agent, an oxidizing agent, a water-soluble polymer, an anticorrosive, a chelating agent, a dispersing aid, a preservative, and a fungicide. May be added to the polishing composition, if desired.
  • the liquid medium is used as a dispersion medium or a solvent for dispersing or dissolving each component such as abrasive grains and additives.
  • the type of the liquid medium is not particularly limited, and examples thereof include water and an organic solvent.
  • the liquid medium may be used singly or as a mixture of two or more, but preferably contains water. From the viewpoint of suppressing the inhibition of the action of other components, water containing as little impurities as possible is preferred. Specifically, after removing impurity ions with an ion-exchange resin, pure water obtained by removing foreign substances through a filter is preferred. Water, ultrapure water, or distilled water is preferred.
  • an aqueous slurry containing abrasive grains, and abrasive grains, an oil agent, an emulsion stabilizer, and at least one additive selected from thickeners And an emulsion containing the following can be used as the polishing composition.
  • the polishing composition will be described in detail.
  • the type of abrasive grains is not particularly limited. For example, particles made of silicon carbide such as silicon carbide, particles made of silicon dioxide (silica), particles made of metal oxide, and organic matter made of thermoplastic resin Particles and organic-inorganic composite particles.
  • metal oxide examples include aluminum oxide (alumina), ceria, titania, zirconia, iron oxide, and manganese oxide.
  • abrasive grains composed of at least one of aluminum oxide, ceria, zirconia, silicon carbide, and silicon dioxide are particularly preferable.
  • Alumina includes, for example, ⁇ -alumina, ⁇ -alumina, ⁇ -alumina, and ⁇ -alumina having different crystal forms, and an aluminum compound called hydrated alumina also exists. From the viewpoint of the polishing rate, those containing ⁇ -alumina as a main component are more preferable as abrasive grains.
  • the average secondary particle diameter of the abrasive grains is not particularly limited, but is preferably 15.0 ⁇ m or less, more preferably 5.0 ⁇ m or less. As the average secondary particle diameter decreases, the dispersion stability of the emulsion improves, and the occurrence of scratches on the surface to be polished is suppressed.
  • the average secondary particle diameter of the abrasive grains can be measured, for example, by a laser diffraction / scattering method (measurement machine: LA-950V2 manufactured by Horiba, Ltd.).
  • the content of the abrasive grains in the polishing composition is not particularly limited, but is preferably 0.1% by mass or more, more preferably 5.0% by mass or more, and still more preferably 10% by mass. % Or more. As the content of abrasive grains increases, the polishing rate tends to increase. When the content of the abrasive grains is within the above range, it becomes easy to improve the polishing rate to a practically particularly suitable level.
  • the content of the abrasive grains is not particularly limited, it is preferably 50% by mass or less, more preferably 35% by mass or less, and further preferably 30% by mass or less. When the content of the abrasive grains is within the above range, the cost of the polishing composition can be reduced.
  • the object to be polished may include at least one selected from the group consisting of a resin material, an alloy material, and a metal oxide material.
  • the polishing composition is preferably an emulsion containing additives such as an oil agent, an emulsion stabilizer, and a thickener.
  • additives such as an oil agent, an emulsion stabilizer, and a thickener.
  • the additives may be used alone or as a mixture of two or more. Addition of the additive tends to improve the stability of the emulsion. Note that a polymer material, an alkali, or the like may be further used as an additive.
  • oils examples include synthetic oils such as liquid paraffin, polybutene, ⁇ -olefin oligomer, alkylbenzene, polyol ester, phosphate ester, silicone oil, mineral oils such as spindle oil, neutral oil, bright stock, castor oil, Vegetable oils and fats such as soybean oil, coconut oil, linseed oil, cottonseed oil, rapeseed oil, drill oil and olive oil, and animal oils and fats such as beef tallow, squalane and lanolin.
  • the emulsion stabilizer include polyhydric alcohols such as glycerin, ethylene glycol and propylene glycol, and aliphatic alcohols such as cetyl alcohol and stearyl alcohol.
  • thickener examples include synthetic thickeners such as polyacrylic acid and sodium polyacrylate (eg, fully neutralized product, partially neutralized product, associated alkali-soluble polyacrylic acid (acrylic polymer), etc.). Agents, cellulosic thickeners such as carboxymethylcellulose and carboxyethylcellulose (semi-synthetic thickeners), and natural thickeners such as agar, carrageenan, layered silicate compounds, xanthan gum and gum arabic. .
  • synthetic thickeners such as polyacrylic acid and sodium polyacrylate (eg, fully neutralized product, partially neutralized product, associated alkali-soluble polyacrylic acid (acrylic polymer), etc.
  • Agents cellulosic thickeners such as carboxymethylcellulose and carboxyethylcellulose (semi-synthetic thickeners), and natural thickeners such as agar, carrageenan, layered silicate compounds, xanthan gum and gum arabic. .
  • polyacrylic acid and an alkali are used in combination.
  • the alkali include inorganic alkalis such as sodium hydroxide, potassium hydroxide, and ammonia, and organic alkalis such as triethanolamine.
  • the thickener may be a Newtonian fluid or a non-Newtonian fluid.
  • the polishing composition may appropriately contain other components such as a lubricating oil, an organic solvent, a surfactant and the like in addition to the above-mentioned abrasive grains.
  • the lubricating oil may be, for example, a synthetic oil, a mineral oil, a vegetable oil or a combination thereof.
  • the organic solvent may be, for example, a hydrocarbon solvent, alcohol, ether, glycols, glycerin, or the like.
  • the surfactant may be, for example, a so-called anionic surfactant, a cationic surfactant, a nonionic surfactant, or an amphoteric surfactant.
  • the polishing method of the present embodiment as described above is suitable for polishing an object to be polished having a curved surface to be polished (for example, a painted surface of a car body of an automobile or the like).
  • a method of polishing a resin-coated surface will be described as an example of the polishing method of the present embodiment.
  • the configuration of the polishing apparatus for performing the polishing is not particularly limited, and a general polishing apparatus such as a single-side polishing machine, a double-side polishing machine, and a lens polishing machine can be used.
  • a general polishing apparatus such as a single-side polishing machine, a double-side polishing machine, and a lens polishing machine can be used.
  • An automatic polishing device can be used.
  • the automatic polishing apparatus shown in FIG. 8A includes a robot arm 102, a polishing pad 10, a polishing tool 104, a pressing force detection unit 105, and a controller 107. Since the robot arm 102 has a plurality of joints 120, 121, and 122, the tip 123 on which the polishing pad 10, the polishing tool 104, and the pressing force detection unit 105 are mounted can be moved in a plurality of directions. .
  • the coating member, which is the object to be polished 90 is formed by coating the surface of a base material with a resin coating, and the resin coating surface, which is the polished surface 90a of the coating member, has a large area and a curved surface. .
  • the polishing tool 104 is attached to the distal end portion 123 via the pressing force detection unit 105, and rotates the polishing pad 10 about a direction perpendicular to the polishing surface 10a of the polishing pad 10 by a built-in driving unit.
  • the driving means of the polishing tool 104 is not particularly limited, but a single action, a double action, a gear action, or the like is generally used, and a double action is preferred in polishing a coating member.
  • a pad mounting portion 111 which is a portion to which the polishing pad 10 is mounted is provided at the tip of the polishing tool 104.
  • FIG. 8B shows an example in which the diameter of the pad mounting portion 111 and the diameter of the polishing layer 1 of the polishing pad 10 are the same, and FIG. This is also an example where the diameter of the polishing layer 1 of the polishing pad 10 is larger.
  • controller 107 controls the behavior of the robot arm 102 and the rotation of the polishing pad 10 by the polishing tool 104.
  • a polishing composition supply mechanism (not shown) supplies the polishing composition between the polishing surface 10a of the polishing pad 10 and the resin-coated surface of the coating member.
  • the controller 107 polishes the resin-coated surface of the coating member by pressing the polishing surface 10a of the polishing pad 10 against the resin-coated surface of the coating member by the robot arm 102 and rotating the polishing pad 10.
  • the pressing force detection unit 105 detects the pressing force of the polishing surface 10a of the polishing pad 10 against the resin-coated surface of the coating member.
  • the controller 107 may adjust the force for pressing the polishing surface 10a against the resin-coated surface of the coating member based on the detection result of the pressing force by the pressing force detection unit 105.
  • the controller 107 holds the polishing pad 10 on the resin coating surface of the coating member while keeping the pressing force of the polishing surface 10a against the resin coating surface of the coating member constant.
  • the robot arm 102 may be controlled so that the robot moves.
  • the method for fixing the polishing pad 10 to the pad mounting portion of the polishing tool 104 is not particularly limited, and examples thereof include a fixing method using a double-sided adhesive tape, an adhesive, a surface fastener, or the like.
  • the cross-sectional shape of the portion of the polishing pad 10 that comes into contact with the pad mounting portion of the polishing tool 104 is not particularly limited, and may be, for example, a linear shape, a curved shape, or a combination thereof.
  • the outer peripheral shape of the portion of the polishing pad 10 that comes into contact with the pad mounting portion of the polishing tool 104 is not particularly limited, and examples thereof include a circular shape and a polygonal shape.
  • processing such as groove processing, hole processing, and embossing may be performed, but other processing may be performed.
  • the material of the pad mounting portion of the polishing tool 104 is not particularly limited as long as the material is harder than the material of the polishing pad in order to sufficiently transmit the pressing pressure to the polishing pad. Ceramics, fiber reinforced resins, composites and the like can be used. Examples of the fiber reinforced resin include a carbon fiber reinforced resin and a glass fiber reinforced resin. The type of resin used for the fiber reinforced resin is not particularly limited, and examples thereof include an epoxy resin. Further, examples of the composite material include a composite material obtained by combining two or more types of materials such as a metal intentionally containing inorganic particles.
  • the polishing method of the present embodiment is not limited to the above-mentioned automatic polishing apparatus.
  • the polishing method of the present embodiment may be applied to a case where a polishing pad is attached to the tip of a hand polisher, and a polishing operator manually moves the hand polisher to polish the resin-coated surface.
  • the driving means of the hand polisher is not particularly limited, but a single action, a double action, a gear action, and the like are generally used, and a double action is preferred in polishing a coating member.
  • the above embodiment is an example of the present invention, and the present invention is not limited to the embodiment.
  • various changes or improvements can be added to the above-described embodiment, and embodiments in which such changes or improvements are added can be included in the present invention.
  • the polishing method of the present embodiment is suitable for polishing a curved surface to be polished, but is also applicable to polishing a planar surface to be polished.
  • the polishing pad of Example 1 includes a polishing layer made of a disc-shaped nonwoven fabric having a diameter of 125 mm and a thickness of 1.6 mm, and a support layer made of a disc-shaped foamed polyurethane having a diameter of 125 mm and a thickness of 20 mm.
  • One disk surface of the polishing layer forms a polishing surface, and the support layer is joined to the other disk surface.
  • the hardness (A hardness) of the polishing layer measured by a type A durometer (durometer hardness tester) is 84.
  • the polishing pad of Example 1 is the same as the polishing pad shown in FIG. 1, and has an annular through portion formed in the polishing layer.
  • the opening of the annular through portion is disposed concentrically with the polishing surface, and has an inner radius of 36 mm and an outer radius of 50 mm. That is, the opening of the annular through portion has a width of 14 mm.
  • the polished surface is a circle having a diameter of 125 mm
  • the area of the polished surface is 12266 mm 2 .
  • the opening of the annular through portion is an annular shape having an inner diameter of 72 mm and an outer diameter of 100 mm
  • the total area of the opening of the annular through portion is 3781 mm 2 . Therefore, the ratio of the total area of the openings of the through-holes to the area of the polished surface (in Table 1, indicated as “area ratio of openings”) is 31%.
  • An annular recess is also formed in the support layer at the same position as the polishing layer.
  • This concave portion is a through hole penetrating the support layer in the thickness direction.
  • the concave portion of the support layer is formed continuously with the annular penetrating portion of the polishing layer, and the concave portion of the support layer and the circular penetrating portion of the polishing layer are integrated to penetrate the polishing pad in the thickness direction.
  • One annular through hole is formed.
  • Example 2 The polishing pad of Example 2 was composed of a polishing layer made of a disc-shaped suede having a diameter of 125 mm and a thickness of 1.4 mm, and a support layer made of a disc-shaped foamed polyurethane having a diameter of 125 mm and a thickness of 20 mm.
  • One disk surface of the polishing layer forms a polishing surface, and the support layer is joined to the other disk surface.
  • the hardness (A hardness) of the polishing layer measured with a type A durometer (durometer hardness tester) is 43.
  • the polishing pad of Example 2 is the same as the polishing pad shown in FIG. 3, and eight non-annular through-holes are formed in the polishing layer.
  • the plane shapes of the openings of these eight non-annular through-holes are circular with a diameter of 16 mm.
  • the openings of the eight non-annular through-holes are provided at positions corresponding to the vertices of a regular octagon virtually arranged on the polishing surface.
  • the distance from the center of the polishing surface to the center of the opening of the non-annular through portion is 43 mm, and the distance from the center of the polishing surface to the radially inner end of the non-annular through portion is 35 mm. Further, when a virtual straight line is drawn from the opposing ends of two adjacent non-annular through portions to the center of the polishing surface, the angle between these two virtual straight lines is 24 degrees.
  • the area of the opening of one penetrating part is 201 mm 2
  • the total area of the opening of the penetrating part is 1608 mm 2
  • the total area of the opening of eight non-annular penetrating parts with respect to the area of the polishing surface Is 13%.
  • Eight concave portions are formed in the support layer, and these concave portions are through holes penetrating the support layer in the thickness direction.
  • the concave portions of the support layer are respectively formed continuously with the penetrating portions of the polishing layer, and the concave portions of the support layer and the penetrating portions of the polishing layer are integrally formed to penetrate the polishing pad in the thickness direction. Two non-circular through holes are formed.
  • the polishing pad of the third embodiment is the same as the polishing pad of the second embodiment except that the number of non-annular through-holes and the planar shape of the opening of the non-annular through-hole are different. That is, the polishing pad of Example 3 is similar to the polishing pad shown in FIG. 5, and six non-annular through-holes are formed in the polishing layer.
  • the planar shape of the openings of these six penetration portions is a cocoon shape with a short diameter of 14 mm.
  • the openings of the six through-holes are provided at positions corresponding to the vertices of a regular hexagon virtually arranged on the polishing surface.
  • the distance from the center of the polishing surface to the center of the opening of the through portion is 43 mm, and the distance from the center of the polishing surface to the radially inner end of the through portion is 36 mm. Further, when a virtual straight line is drawn from the opposing ends of two adjacent penetrating portions to the center of the polishing surface, the angle between these two virtual straight lines is 24 degrees. Since the area of the opening of one penetration is 346 mm 2 , the total area of the openings of the penetration is 2076 mm 2 , and the ratio of the total area of the openings of the six penetrations to the area of the polishing surface is: 17%.
  • Example 4 The polishing pad of Example 4 is the same as the polishing pad of Example 3 except that the polishing layer is made of a disc-shaped nonwoven fabric having a diameter of 125 mm, a thickness of 1.6 mm, and an A hardness of 84.
  • Example 5 The polishing pad of Example 5 was composed of a polishing layer made of a disc-shaped suede having a diameter of 150 mm and a thickness of 1.4 mm, and a support layer made of a disc-shaped foamed polyurethane having a diameter of 150 mm and a thickness of 20 mm.
  • One disk surface of the polishing layer forms a polishing surface, and the support layer is joined to the other disk surface.
  • the hardness (A hardness) of the polishing layer measured with a type A durometer (durometer hardness tester) is 43.
  • the polishing pad of the fifth embodiment has the same non-circular through-hole as that of the third embodiment.
  • the planar shape of the openings of these six penetration portions is a cocoon shape with a short diameter of 14 mm.
  • the openings of the six through-holes are provided at positions corresponding to the vertices of a regular hexagon virtually arranged on the polishing surface.
  • the distance from the center of the polishing surface to the center of the opening of the non-annular through portion is 43 mm, and the distance from the center of the polishing surface to the radially inner end of the non-annular through portion is 36 mm. Further, when a virtual straight line is drawn from the opposing ends of two adjacent non-annular through portions to the center of the polishing surface, the angle between these two virtual straight lines is 24 degrees. Since the area of the opening of one penetration is 346 mm 2 , the total area of the opening of the penetration is 2076 mm 2 , and the total area of the openings of the six non-annular penetrations with respect to the area of the polishing surface. Is 12%.
  • Example 6 The polishing pad of Example 6 is the same as the polishing pad of Example 5, except that the polishing layer is made of a disc-shaped nonwoven fabric having a diameter of 150 mm, a thickness of 1.6 mm, and an A hardness of 84.
  • Example 7 The polishing pad of the seventh embodiment is the same as the polishing pad of the fourth embodiment. However, Example 7 is an example in which a polishing pad was attached to a hand polisher having a pad attaching portion having a diameter smaller than the diameter of the polishing layer, as described later in detail, and evaluation was performed.
  • Example 8 The polishing pad of the eighth embodiment is the same as the polishing pad of the sixth embodiment. However, Example 8 is an example in which a polishing pad was attached to a hand polisher having a pad attaching portion having a diameter smaller than the diameter of the polishing layer, and evaluation was performed, as described later in detail.
  • Example 9 The polishing pad of the ninth embodiment is the same as the polishing pad of the fifth embodiment. However, Example 9 is an example in which a polishing pad was attached to a hand polisher having a pad attaching portion having a diameter smaller than the diameter of the polishing layer, as described later in detail, and evaluation was performed.
  • the polishing pad was the same as the polishing pad of Example 2 except that no penetrating portion was formed in the polishing layer and no concave portion was formed in the support layer.
  • the polishing pad is the same as the polishing pad of Example 4 except that no penetrating portion is formed in the polishing layer and no concave portion is formed in the support layer.
  • the polishing pad of Comparative Example 3 was composed of a polishing layer made of a disc-shaped nonwoven fabric having a diameter of 125 mm and a thickness of 1.6 mm, and a support layer made of a disc-shaped foamed polyurethane having a diameter of 125 mm and a thickness of 20 mm.
  • One disk surface of the polishing layer forms a polishing surface, and the support layer is joined to the other disk surface.
  • the hardness (A hardness) of the polishing layer measured by a type A durometer (durometer hardness tester) is 84.
  • polishing pads of Examples 1 to 9 and Comparative Examples 1 to 3 were polished, and the undulation removability of the planar polished surface was evaluated.
  • the surface to be polished was polished so that the polishing pad could follow the surface to be polished and the bonnet edge. Possibility of polishing was evaluated. Detailed evaluation methods for these three evaluation items will be described below.
  • the area of the portion of the polishing surface of the polishing pad that was in contact with the polishing object was calculated.
  • the area of the contacted part in the case of a curved surface was represented by a relative value with the area of the contacted part in the case of a plane being 100%.
  • the area ratio of the contacted portion is 65% or more, A, 60% to 64%, B, and less than 60%, C.
  • the concave surface 1 and the concave surface 2 the contact is made.
  • Table 1 shows that the ratio of the area of the portion is 53% or more, B when the ratio is 50 to 52%, and C when the ratio is less than 50%.
  • a planar surface to be polished of the object to be polished was polished using the polishing pads of Examples 1 to 9 and Comparative Examples 1 to 3, respectively.
  • the object to be polished is a flat metal plate, the surface of which is coated with a synthetic resin paint. That is, the surface to be polished is a coated film surface made of a synthetic resin. The thickness of the coating is 40 ⁇ m.
  • a polishing composition described below was interposed between the surface to be polished of the object to be polished and the polishing surface of the polishing pad.
  • a polishing pad was attached to a pad mounting portion having a diameter of 125 mm of a hand polisher, and the polishing pad was rotated at a rotation speed of 4200 min -1 to obtain a planar shape.
  • the polishing pad was attached to a pad mounting portion of a hand polisher having a diameter of 75 mm, and was rotated at a rotation speed of 4200 min -1 to polish the planar coating film surface for 5 minutes.
  • the amount of the polishing composition used was 2 mL / min. Then, when the polishing was completed, the undulation removability of the polished surface of each polishing object was evaluated.
  • Table 1 shows the results. Table 1 also shows the ratio of the diameter of the polishing layer of the polishing pad to the diameter of the pad mounting portion ([diameter of polishing layer of polishing pad] / [diameter of pad mounting portion]). In addition, the value of We measured by a coating surface texture measuring device “Wavescan dual” manufactured by BYK-Gardner was used for evaluation of the undulation removal property. The value of We before polishing was 7.5.
  • the surface of the polished surface after polishing is 2 or less, it is determined that the surface is particularly good because the waviness is particularly small.
  • the We is more than 2 and 4 or less, it is determined that the swell is small and within a range without any problem.
  • We is more than 4 and 6 or less it is determined that the swell is within the usable range. If the We is more than 6, it is judged that there is a problem because it is impossible to apply a beautiful surface finish due to a large undulation.
  • the curved surface to be polished of the object to be polished was polished using the polishing pads of Examples 1 to 9 and Comparative Examples 1 to 3, respectively.
  • the object to be polished is a hood of an automobile coated with a synthetic resin paint, and the thickness of the coating film is 40 ⁇ m.
  • a polishing composition described later was interposed between the surface to be polished of the object to be polished and the polishing surface of the polishing pad.
  • Examples 1 to 6 and Comparative Examples 1 to 3 a polishing pad was attached to a pad mounting portion of a hand polisher having a diameter of 125 mm, and was rotated at a rotation speed of 4200 min -1 . Only the edge of the bonnet was polished for 2 minutes.
  • the polishing pad was mounted on a pad mounting portion of a hand polisher having a diameter of 75 mm, and was rotated at a rotation speed of 4200 min -1 to polish only the edge of the hood of the automobile for 2 minutes.
  • the amount of the polishing composition used was 2 mL / min.
  • the contents of the polishing composition used in the above evaluation are as follows.
  • Glycerin 2% by mass ⁇
  • Acrylic acid polymer 2.0% by mass ⁇
  • Sodium hydroxide 0.06% by mass ⁇
  • Alumina 15% by mass ⁇ Sodium steven site: 0.1% by mass -Remainder: water-Viscosity: 1 to 30,000 mPa ⁇ s (measured at a rotation speed of 20 min -1 using a rotational viscometer TVB-10H)
  • Alumina has an average secondary particle diameter (D50) of 0.5 ⁇ m and a pregelatinization ratio of 60 to 100%.
  • the average secondary particle size was measured using a laser diffraction / scattering type particle size distribution analyzer LA-950V2 manufactured by Horiba, Ltd.
  • the ⁇ -formation ratio was determined from the integrated intensity ratio of the (113) plane diffraction line by X-ray diffraction measurement using an X-ray analyzer Ultima-IV manufactured by Rigaku Corporation.
  • D50 is the particle diameter at which the cumulative frequency from the small particle size side becomes 50% in the volume-based cumulative particle size distribution.
  • the average primary particle diameter of sodium stevensite is 0.08 ⁇ m, and the aspect ratio is 80.
  • the average primary particle diameter and the aspect ratio were measured by scanning electron microscope observation.
  • the viscosity of the aqueous dispersion of sodium stevensite is 1000 mPa ⁇ s, and the swelling power of sodium stevensite is 12 mL / 2 g.
  • the viscosity of the aqueous dispersion was measured using a BM type viscometer.
  • the concentration of sodium stevensite in the aqueous dispersion is 4% by mass.
  • the measurement conditions are a rotation speed of 60 min ⁇ 1 and a temperature of 25 ° C.
  • the polishing pads of Examples 1 to 9 were excellent in follow-up properties and undulation removal properties because the through-holes were formed in the polishing layer. In addition, there are no corners or cutouts on the outer edge of the polishing layer, and the outer edge of the polishing layer has a smooth linear shape. No damage such as Furthermore, in the polishing pads of Examples 5 to 9, the generation of local pressure was suppressed because the pad mounting portion did not easily contact the surface to be polished.
  • the polishing pads of Comparative Examples 1 and 2 had insufficient followability because no penetrating portion was formed in the polishing layer.
  • the polishing pad of Comparative Example 3 has excellent notionability because the notch is formed in the polishing layer, but has a notch at the outer edge of the polishing layer, and the outer edge of the polishing layer is smooth. Since the polishing pad did not have a linear shape, the polishing pad was damaged when the polishing pad came into contact with the edge of the bonnet during polishing.

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  • Chemical & Material Sciences (AREA)
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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un tampon de polissage qui peut polir une surface incurvée devant être polie sur un objet devant être poli et éliminer toute ondulation sur la surface incurvée devant être polie au moyen d'une surface de polissage qui suit des surfaces incurvées ayant divers degrés de courbure. Le tampon de polissage (10) comprend un corps stratifié qui comprend : une couche de polissage (1) ayant une surface de polissage (10a) ; et une couche de support (2) constituée d'un corps élastique et supportant la couche de polissage (1). Une partie traversante (1a) qui pénètre dans la couche de polissage (1) dans la direction allant dans le sens de l'épaisseur est formée dans la zone allant le plus vers l'intérieur par rapport au bord extérieur de la couche de polissage (1). En outre, la couche de polissage (1) est formée à partir d'un matériau ayant un type de dureté au duromètre A de 30 ou plus comme stipulé dans JIS K 6253-3:2012.
PCT/JP2019/035976 2018-09-14 2019-09-12 Tampon de polissage, outil de polissage, et procédé de polissage WO2020054823A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113231968A (zh) * 2021-05-28 2021-08-10 广东伟艺抛磨材料有限公司 一种无溶剂型无纺布抛光轮及其制造方法
EP4282588A4 (fr) * 2021-02-26 2024-07-03 Fujimi Inc Tampon de polissage et procédé de polissage

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WO2016031142A1 (fr) * 2014-08-27 2016-03-03 株式会社フジミインコーポレーテッド Outil et procédé pour polir un élément présentant une forme de surface courbe
JP2017064851A (ja) * 2015-09-30 2017-04-06 富士紡ホールディングス株式会社 研磨パッド

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JP2003071731A (ja) * 2001-09-03 2003-03-12 Three M Innovative Properties Co ディンプル構造の研磨材料
JP2005001083A (ja) * 2003-06-13 2005-01-06 Sumitomo Bakelite Co Ltd 研磨用積層体および研磨方法
JP3107068U (ja) * 2004-08-06 2005-01-27 株式会社エービーエス 自動車ボディ用研磨バフ
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WO2016031142A1 (fr) * 2014-08-27 2016-03-03 株式会社フジミインコーポレーテッド Outil et procédé pour polir un élément présentant une forme de surface courbe
JP2017064851A (ja) * 2015-09-30 2017-04-06 富士紡ホールディングス株式会社 研磨パッド

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4282588A4 (fr) * 2021-02-26 2024-07-03 Fujimi Inc Tampon de polissage et procédé de polissage
CN113231968A (zh) * 2021-05-28 2021-08-10 广东伟艺抛磨材料有限公司 一种无溶剂型无纺布抛光轮及其制造方法
CN113231968B (zh) * 2021-05-28 2022-08-09 广东伟艺抛磨材料有限公司 一种无溶剂型无纺布抛光轮及其制造方法

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