WO2020048418A1 - 终端热处理的方法、装置、设备以及存储介质 - Google Patents

终端热处理的方法、装置、设备以及存储介质 Download PDF

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Publication number
WO2020048418A1
WO2020048418A1 PCT/CN2019/103980 CN2019103980W WO2020048418A1 WO 2020048418 A1 WO2020048418 A1 WO 2020048418A1 CN 2019103980 W CN2019103980 W CN 2019103980W WO 2020048418 A1 WO2020048418 A1 WO 2020048418A1
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Prior art keywords
temperature
key device
terminal
working environment
normal working
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PCT/CN2019/103980
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English (en)
French (fr)
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刘婷
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中兴通讯股份有限公司
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Publication of WO2020048418A1 publication Critical patent/WO2020048418A1/zh

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to, but is not limited to, the field of wireless communication technologies.
  • NB-IOT Near Internet and Internet of Things
  • CPE Consumer and Equipment
  • the present disclosure provides a method for heat treatment of a terminal, including: the terminal obtains temperature information of the key device by performing temperature detection on the key device; and the terminal judges the key based on the temperature information of the key device. Whether the device is in a normal working environment; when it is judged that the key device is not in a normal working environment, the terminal performs temperature adjustment on the key device by controlling a heating radiator, so that the key device is in a normal state after the temperature adjustment Working environment.
  • the present disclosure provides an apparatus for terminal heat treatment, including: an acquisition module configured to acquire temperature information of the key device by performing temperature detection on the key device; and a judgment module configured to be based on the temperature of the key device Information to determine whether the key device is in a normal working environment; a temperature adjustment module is configured to, when it is determined that the key device is not in a normal working environment, perform temperature adjustment on the key device by controlling a heating radiator to make the key device Key components are in normal working environment after temperature adjustment.
  • the present disclosure provides a device for terminal heat treatment, including: a processor, and a memory coupled to the processor; the memory stores a program for terminal heat treatment that can be run on the processor, When the terminal heat treatment program is executed by the processor, any method described herein is implemented.
  • the present disclosure provides a computer storage medium having stored thereon a terminal heat treatment program that, when executed by a processor, implements any of the methods described herein.
  • FIG. 1 is a flowchart of a terminal heat treatment method according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a terminal heat treatment device according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of a terminal heat treatment system provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of a shape of a heating radiator provided by an embodiment of the present disclosure.
  • NB-IOT Near Internet and Internet of Things
  • CPE Consumer and Equipment
  • the heat treatment method adopted on the vehicle and the CPE terminal, especially the outdoor CPE terminal is performed in two parts.
  • heat dissipation heat dissipation is basically installed through the use of heat sinks.
  • heat sinks For products with tight space, it is generally applied through structural parts.
  • Thermally conductive silicone or thermally conductive materials For outdoor CPE products working in extreme harsh low-temperature environments, the terminal needs to be equipped with heating devices to ensure that the system can start and work normally under low-temperature conditions.
  • the present disclosure particularly provides a method, an apparatus, a device, and a storage medium for terminal heat treatment, which substantially avoid one or more of the problems caused by the limitations and disadvantages of the related art.
  • FIG. 1 is a flowchart of a terminal heat treatment method according to an embodiment of the present disclosure. As shown in FIG. 1, in some embodiments, the method may include steps S101 to S103.
  • step S101 the terminal obtains temperature information of the key device by performing temperature detection on the key device.
  • the method may further include: receiving, by the terminal, and storing a minimum temperature and a maximum temperature at which the key device normally operates and set by the user, and the The terminal receives and saves the heating temperature threshold when the key device is heated and the heat dissipation temperature threshold when the key device is radiating, which is set by the user.
  • the key device may be a device that generates severe heat such as an IC chip, a radio frequency chip, and a radio frequency power amplifier.
  • step S102 the terminal determines whether the key device is in a normal working environment according to the temperature information of the key device.
  • the determining whether the key device is in a normal working environment according to the temperature information of the key device includes: determining, by the terminal, the temperature information indicated by the key device according to the temperature information of the key device. Whether the temperature is between the minimum temperature and the maximum temperature; when it is determined that the temperature is between the minimum temperature and the maximum temperature, the terminal determines that the key device is in a normal working environment; when If it is determined that the temperature is not between the minimum temperature and the maximum temperature, the terminal determines that the key device is not in a normal working environment.
  • step S103 when it is determined that the key device is not in a normal working environment, the terminal performs temperature adjustment on the key device by controlling a heating radiator, so that the key device is in a normal working environment after temperature adjustment.
  • the terminal performing temperature adjustment on the key device by controlling a heating radiator includes: when it is determined that the key device is not in normal work.
  • the terminal determines whether the temperature is lower than the minimum temperature or higher than the maximum temperature; when it is determined that the temperature is lower than the minimum temperature, the terminal controls the heating through a control switch The heat sink enters a heating state so as to heat-process the key device; when it is determined that the temperature is higher than the maximum temperature, the terminal controls the heating heat sink to enter a heat dissipation state through a control switch, so that the The key components are heat-treated.
  • the method may further include: when the heating radiator is in a heating state, the terminal controls the critical device.
  • the device performs real-time temperature detection to obtain the real-time temperature of the key device; when the real-time temperature of the key device reaches the heating temperature threshold, the terminal controls the heating radiator to enter a standby state through a control switch.
  • the method may further include: when the heating radiator is in a heat dissipation state, the terminal controls the critical device.
  • the device performs real-time temperature detection to obtain the real-time temperature of the key device; when the real-time temperature of the key device reaches the heat dissipation temperature threshold, the terminal controls the heating radiator to enter a standby state through a control switch.
  • the method may further include: when it is determined that the key device is in a normal working environment, the terminal controls the heating radiator to enter a standby state through a control switch.
  • FIG. 2 is a schematic diagram of a terminal heat treatment apparatus according to an embodiment of the present disclosure.
  • the apparatus may include: an obtaining module 201, a determining module 202, and a temperature adjusting module 203.
  • the obtaining module 201 may be configured to obtain temperature information of the key device by performing temperature detection on the key device; and the determining module 202 may be configured to determine the temperature of the key device based on the temperature information of the key device. Whether the key device is in a normal working environment; the temperature adjustment module 203 may be configured to, when judging that the key device is not in a normal working environment, perform temperature adjustment on the key device by controlling a heating radiator to make the key device Key components are in normal working environment after temperature adjustment.
  • a device for terminal heat treatment may include: a processor and a memory coupled to the processor; the memory stores a program for terminal heat treatment that can be run on the processor, so that When the terminal heat treatment program is executed by the processor, any method described herein is implemented.
  • the processor may be a central processing unit (CPU), a microprocessor (Micro Processor Unit, MPU), a digital signal processor (Digital Signal Processor, DSP), or a field programmable gate array (Field Programmable). Gate array, FPGA) and so on.
  • the memory may be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory.
  • the present disclosure provides a computer storage medium.
  • the computer storage medium stores a terminal heat treatment program, and the terminal heat treatment program implements any of the methods described herein when executed by a processor.
  • the computer storage medium may include various media that can store program code, such as a mobile storage device, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk, or an optical disc.
  • the heating and heat-dissipating material of the heating radiator can be used as a part of the terminal structure, such as a structure at any position of the terminal's front and rear shells, or it can be attached to the structure as a separate part, or attached to a PCB-based (( Printed circuit board).
  • FIG. 3 is a schematic diagram of a terminal heat treatment system according to an embodiment of the present disclosure. As shown in FIG. 3, it is composed of a system, a power source, a temperature detector, a control switch, and a heating radiator.
  • the system is the core working part of terminal products such as automotive and outdoor CPE.
  • the power supply supplies power to the system, temperature detector and control switch.
  • the power supply can be a power adapter or a battery.
  • the voltage is determined by the actual needs of the system and can be Arbitrary range;
  • the temperature detector is mainly configured to perform temperature detection on the instantaneous operating temperature of the terminal structure.
  • the temperature detection part can use the current conventional thermistor to collect voltage for temperature detection, or it can be a general technology in other industries.
  • the interaction between the detector and the control switch can be achieved by enabling the control, such as GPIO (General-Purpose Input / Output), which controls the level of the level; the control switch is configured to determine whether heat dissipation or heating is required, that is, based on temperature detection
  • the detection result of the device controls the state of the heating radiator.
  • Some circuits of the control switch can be relays or other circuits that turn on the power. It can be a group of control switches or two groups according to the preset temperature. Or any group.
  • the heating radiator is configured to realize the heating or heat dissipation function required by the terminal according to specific conditions. According to the detection results, the temperature detector feeds back to the control switch according to the preset temperature range, high temperature range, low temperature range, etc.
  • the heating radiator which is used to achieve the heating or cooling function required by the terminal according to the specific situation.
  • the preset conditions when the temperature is too high or the power consumption is too large, the heat dissipation function of the heat radiation heater is started, and the preset conditions are also reached, and the heating device is started under low temperature conditions.
  • heating radiators use temperature-variable materials, such as semiconductor materials, which exhibit different temperature characteristics under the action of different voltages or currents, and fluctuate within a preset temperature range, such as -40 ° C to 85 ° C. , Can be any temperature range required by the product's working environment.
  • the heating radiator can be of any structure.
  • FIG. 4 is a schematic diagram of a shape of a heating radiator provided by an embodiment of the present disclosure. As shown in FIG. 4, in one embodiment, the heating radiator may be a comb-like form of S51, a tooth-like form of S52, a polyline-like form of S53, a shape of S54, or any combination thereof. According to the final needs of the end product, the heating radiator can have any thickness and any shape, can be attached to key temperature-sensitive components such as PCBs, and can also be used as a part of a structural component.
  • key temperature-sensitive components such as PCBs
  • the temperature detector performs temperature detection on key components of the system.
  • a certain threshold such as -10 ° C (any temperature can be set as required in the actual working environment)
  • the temperature is enabled.
  • Control inform the control switch, the control switch is turned on, so that the heat radiation heater works in the heating state.
  • the working environment temperature of the system is 0 ° C (can be in the actual working environment as needed)
  • the temperature enable control is informed to the control switch, the control switch is turned off, and the heat radiation heater stops working.
  • the temperature detector performs temperature detection on the key components of the system.
  • a certain threshold such as 40 ° C (any temperature can be set as required in the actual working environment)
  • the temperature enable control Inform the control switch
  • the control switch is turned on, so that the heat radiation heating device works in a heat dissipation state, when the heat radiation heater works for a period of time, the working environment temperature of the system is 30 °C
  • the temperature enable control is notified to the control switch, the control switch is turned off, and the heat radiation heater stops working.
  • the temperature detector performs temperature detection on the key components of the system.
  • a certain threshold such as 30 ° C (any temperature can be set as required in the actual working environment), but higher than a certain temperature.
  • Threshold for example, when the temperature is 0 ° C (any temperature can be set as required in the actual working environment), the temperature-enabled control and the control switch control the heat-dissipating heater to make it work in the standby state.
  • the embodiment of the present disclosure can heat and dissipate heat in a limited terminal space and / or a harsh working environment, which improves the user experience.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Telephone Function (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请提供了一种终端热处理的方法、装置、设备及存储介质所述方法包括：终端通过对关键器件进行温度检测，获取所述关键器件的温度信息；所述终端根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中；当判断所述关键器件不处于正常工作环境时，则所述终端通过控制加热散热器对所述关键器件进行温度调整，使所述关键器件在温度调整后处于正常工作环境中。

Description

终端热处理的方法、装置、设备以及存储介质 技术领域
本公开涉及但不限于无线通信技术领域。
背景技术
随着物联网的日益发展，对车载产品、NB-IOT(Narrow Band Internet of Things，窄带物联网)类产品、室外CPE(Consumer Premise Equipment，家庭融合类产品)产品的应用越来越多，但是这种室外应用的产品，往往面对的是比手机及其他智能穿戴设备复杂的使用环境，工作在低温或酷热的环境比比皆是。
发明内容
一方面，本公开提供了一种终端热处理的方法，包括：终端通过对关键器件进行温度检测，获取所述关键器件的温度信息；所述终端根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中；当判断所述关键器件不处于正常工作环境时，则所述终端通过控制加热散热器对所述关键器件进行温度调整，使所述关键器件在温度调整后处于正常工作环境中。
另一方面，本公开提供一种终端热处理的装置，包括：获取模块，配置为通过对关键器件进行温度检测，获取所述关键器件的温度信息；判断模块，配置为根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中；温度调整模块，配置为当判断所述关键器件不处于正常工作环境时，通过控制加热散热器对所述关键器件进行温度调整，使所述关键器件在温度调整后处于正常工作环境中。
另一方面，本公开提供一种终端热处理的设备，包括：处理器，以及与所述处理器耦接的存储器；所述存储器上存储有可在所述处理器上运行的终端热处理的程序，所述终端热处理的程序被所述处理器执行时实现本文所述的任一方法。
另一方面，本公开提供一种计算机存储介质，其上存储有终端 热处理的程序，所述终端热处理的程序被处理器执行时实现本文所述的任一方法。
附图说明
图1是本公开实施例提供的一种终端热处理的方法流程图；
图2是本公开实施例提供的一种终端热处理的装置示意图；
图3是本公开实施例提供的终端热处理的系统示意图；
图4是本公开实施例提供的加热散热器的形状示意图。
具体实施方式
以下结合附图对本公开的实施例进行详细说明，应当理解，以下所说明的实施例仅用于说明和解释本公开，并不用于限定本公开。
随着物联网的日益发展，对车载产品、NB-IOT(Narrow Band Internet of Things，窄带物联网)类产品、室外CPE(Consumer Premise Equipment，家庭融合类产品)产品的应用越来越多，但是这种室外应用的产品，往往面对的是比手机及其他智能穿戴设备复杂的使用环境，工作在低温或酷热的环境比比皆是。
在完成项目的过程中，发现室外CPE终端以及车载设备的使用环境较一般手机等终端更严酷，面临超高温和超低温的考验，为了避免超高温和超低温的情况下终端无法启动的问题，需要加散热器以及加热器，散热器和加热器既需要很大空间来放置，需要很高的成本，还需要复杂的人工装配，费时费力，对出现问题，进行整机售后也有各种拆机上的麻烦。在进行高低温验证的时候，在设定的期望温度的限值附近，会有临界状态，低温会有无法启动的情况出现，这个时候必须辅以加热设备来对终端进行加热升温，到达一定的温度后，终端才能启动进入工作状态。
目前在车载和CPE终端，尤其是室外CPE终端上采取的热处理方法，是分开两部分进行的，对散热，基本是通过安装散热片来散热，对空间紧张的产品来说，一般通过结构件贴导热硅胶或者导热材料等。对工作在极限恶劣低温环境下的室外CPE产品，还需要终端带有加热 装置，以保证在低温情况下系统能够启动并且正常工作。
因此，本公开特别提供了终端热处理的方法、装置、设备以及存储介质，其基本上避免了由于相关技术的局限和缺点所导致的问题中的一个或多个。
一方面，本公开提供了一种终端热处理的方法。图1是本公开实施例提供的一种终端热处理的方法流程图。如图1所示，在一些实施例中，所述方法可以包括步骤S101至S103。
在步骤S101，终端通过对关键器件进行温度检测，获取所述关键器件的温度信息。
在一个实施例中，在所述终端对关键器件进行温度检测之前，所述方法还可以包括：所述终端接收并保存用户设置的所述关键器件正常工作的最低温度和最高温度，以及所述终端接收并保存用户设置的所述关键器件加热时的加热温度阈值和所述关键器件散热时的散热温度阈值。
例如，所述关键器件可以为IC芯片、射频芯片、射频功放等发热严重的器件。
在步骤S102，所述终端根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中。
在一个实施例中，所述终端根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中包括：所述终端根据所述关键器件的温度信息，确定所述温度信息所指示的温度是否处于所述最低温度和所述最高温度之间；当确定所述温度处于所述最低温度和所述最高温度之间，则所述终端判断所述关键器件处于正常工作环境中；当确定所述温度不处于所述最低温度和所述最高温度之间，则所述终端判断所述关键器件不处于正常工作环境中。
在步骤S103，当判断所述关键器件不处于正常工作环境时，则所述终端通过控制加热散热器对所述关键器件进行温度调整，使所述关键器件在温度调整后处于正常工作环境中。
在一个实施例中，所述当判断所述关键器件不处于正常工作环境时，则所述终端通过控制加热散热器对所述关键器件进行温度调整 包括：当判断所述关键器件不处于正常工作环境时，则所述终端确定所述温度是低于所述最低温度还是高于所述最高温度；当确定所述温度是低于所述最低温度时，所述终端通过控制开关控制所述加热散热器进入加热状态，以便对所述关键器件进行加热处理；当确定所述温度是高于所述最高温度时，所述终端通过控制开关控制所述加热散热器进入散热状态，以便对所述关键器件进行散热处理。
在一个实施例中，在所述终端通过控制加热散热器对所述关键器件进行温度调整之后，所述方法还可以包括：当所述加热散热器处于加热状态时，所述终端对所述关键器件进行实时温度检测，得到所述关键器件的实时温度；当所述关键器件的实时温度达到所述加热温度阈值时，所述终端通过控制开关控制所述加热散热器进入待机状态。
在一个实施例中，在所述终端通过控制加热散热器对所述关键器件进行温度调整之后，所述方法还可以包括：当所述加热散热器处于散热状态时，所述终端对所述关键器件进行实时温度检测，得到所述关键器件的实时温度；当所述关键器件的实时温度达到所述散热温度阈值时，所述终端通过控制开关控制所述加热散热器进入待机状态。
在一个实施例中，所述方法还可以包括：当判断所述关键器件处于正常工作环境时，所述终端通过控制开关控制所述加热散热器进入待机状态。
另一方面，本公开提供了一种终端热处理的装置。图2是本公开实施例提供的一种终端热处理的装置示意图。如图2所示，在一些实施例中，所述装置可以包括：获取模块201、判断模块202以及温度调整模块203。
在一个实施例中，所述获取模块201可以配置为通过对关键器件进行温度检测，获取所述关键器件的温度信息；所述判断模块202可以配置为根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中；所述温度调整模块203可以配置为当判断所述关键器件不处于正常工作环境时，则通过控制加热散热器对所述关键器件进行温度调整，使所述关键器件在温度调整后处于正常工作环境中。
另一方面，本公开提供了一种终端热处理的设备。在一些实施 例中，一种终端热处理的设备可以包括：处理器、以及与所述处理器耦接的存储器；所述存储器上存储有可在所述处理器上运行的终端热处理的程序，所述终端热处理的程序被所述处理器执行时实现本文所述的任一方法。例如，所述处理器可以为中央处理器(Central Processing Unit，CPU)、微处理器(Micro Processor Unit，MPU)、数字信号处理器(Digital Signal Processor，DSP)或现场可编程门阵列(Field Programmable Gate Array，FPGA)等。例如，所述存储器可以是易失性存储器或非易失性存储器，或可包括易失性和非易失性存储器两者。
另一方面，本公开提供了一种计算机存储介质。在一些实施例中，计算机存储介质存储有终端热处理的程序，所述终端热处理的程序被处理器执行时实现本文所述的任一方法。例如，计算机存储介质可以包括：移动存储设备、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
随着物联网的发展，对车载产品、室外CPE、NB-IOT的应用也越来越广泛，需求越来越多，对通信能力，数据，位置，语音等能力上的要求日益增强，在满足上述功能的时候，最先需要保证的是车载和室外CPE终端的产品可靠性，对可靠性而言，最基础的就是工作环境，此类产品经常会有极端工作温度的情景出现，为了保证终端能够工作在正常的范围内，需要稳定的可靠性。根据本公开的热处理装置可以很好的应对终端工作在此类极限温度下的情况。由于终端的结构特性，空间有限，采用具有半导体材料或者其他具有热特性的金属等特性材料，通过启动加热或者散热的电路来实现。加热散热器的加热散热材料可以作为终端结构件的一部分，如终端前后壳等任意位置的结构件，也可以作为单独的部分，附在结构件上，或者附在功耗较大的基于PCB(印刷电路板)的元器件上。
图3是本公开实施例提供的终端热处理的系统示意图。如图3所示，其由系统、电源、温度检测器、控制开关以及加热散热器组成。系统为车载、室外CPE等终端类产品的核心工作部分；电源为系统、 温度检测器及控制开关供电，电源供电的形式可以是电源适配器，也可是电池，电压由系统的实际需要决定，可以是任意范围；温度检测器，主要配置为对终端结构的即时工作温度进行温度检测，温度检测部分可以采用目前常规的温敏电阻，采集电压进行温度检测，也可以是其他行业内的通用技术，温度检测器和控制开关之间的交互可以通过使能控制实现，例如GPIO(General-Purpose Input/Output)，控制电平的高低；控制开关配置为判断是否需要进行散热或者加热处理，即根据温度检测器的检测结果对加热散热器的状态进行控制，控制开关部分电路可以采用继电器，也可以是其他导通电源的电路，可以根据预设温度的需要是一组控制开关，也可以是两组，或者任意组。加热散热器，配置为实现终端根据具体情况所需要的加热或者散热功能。温度检测器按照检测结果，根据预先设定的温度范围、高温范围、低温范围等，反馈给控制开关，来对加热散热器进行控制，用来实现终端根据具体情况所需要的加热或者散热功能，达到预设的条件，温度过高或者功耗过大时，启动散热加热器的散热功能，同样达到预设的条件，在低温条件下启动加热装置。
例如，加热散热器采用温度可变的材料，例如半导体材料，在不同的电压或者电流的作用下，呈现不同的温度特性，在预先设定的温度范围内波动，例如在-40℃至85℃，可以是产品工作环境需要的任意温度范围。对于加热散热器，可以是任意的结构形式。图4是本公开实施例提供的加热散热器的形状示意图。如图4所示，在一个实施例中，加热散热器可以是S51的梳状形式、S52的齿状形式、S53的折线状形式、S54的形状、或它们的任意组合。根据终端产品的最终需要，加热散热器可以具有任意厚度和任意形状，可以附着于PCB等对温度敏感的关键器件，也可以作为结构件的一部分。
在一个实施例中，温度检测器对系统的关键器件进行温度检测，当温度低于一定的门限，例如-10℃(可以在是实际的工作环境中按照需要设置任意温度)，通过温度使能控制，告知控制开关，控制开关导通，使散热加热器工作在加热状态，当散热加热器工作一段时间后，系统所处的工作环境温度在0℃(可以在是实际的工作环境中按 照需要设置任意温度)以上时，通过温度使能控制，告知控制开关，控制开关关闭，散热加热器停止工作。
在一个实施例中，温度检测器对系统的关键器件进行温度检测，当温度高于一定的门限，例如40℃(可以在是实际的工作环境中按照需要设置任意温度)，通过温度使能控制，告知控制开关，控制开关导通，使散热加热装置工作在散热状态，当散热加热器工作一段时间后，系统所处的工作环境温度在30℃(可以在是实际的工作环境中按照需要设置任意温度)以下时，通过温度使能控制，告知控制开关，控制开关关闭，散热加热器停止工作。
在一个实施例中，温度检测器对系统的关键器件进行温度检测，当温度低于一定的门限，例如30℃(可以在是实际的工作环境中按照需要设置任意温度)，但高于一定的门限，例如0℃(可以在是实际的工作环境中按照需要设置任意温度)时，通过温度使能控制，控制开关对散热加热器进行控制，使其工作在待机状态。
根据本公开实施例提供的方案，能够在有限的终端空间中和/或恶劣的工作环境中即能加热又能散热，提高了用户体验。
尽管上文对本公开进行了详细说明，但是本公开不限于此，本技术领域技术人员可以根据本公开的原理进行各种修改。因此，凡按照本公开原理所作的修改，都应当理解为落入本公开的保护范围。

Claims (10)

  1. 一种终端热处理的方法，包括：
    终端通过对关键器件进行温度检测，获取所述关键器件的温度信息；
    所述终端根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中；
    当判断所述关键器件不处于正常工作环境时，则所述终端通过控制加热散热器对所述关键器件进行温度调整，使所述关键器件在温度调整后处于正常工作环境中。
  2. 根据权利要求1所述的方法，其中，在所述终端对关键器件进行温度检测之前，所述方法还包括：
    所述终端接收并保存用户设置的所述关键器件正常工作的最低温度和最高温度，以及
    所述终端接收并保存用户设置的所述关键器件加热时的加热温度阈值和所述关键器件散热时的散热温度阈值。
  3. 根据权利要求2所述的方法，其中，所述终端根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中包括：
    所述终端根据所述关键器件的温度信息，确定所述温度信息所指示的温度是否处于所述最低温度和所述最高温度之间；
    当确定所述温度处于所述最低温度和所述最高温度之间，则所述终端判断所述关键器件处于正常工作环境中；
    当确定所述温度不处于所述最低温度和所述最高温度之间，则所述终端判断所述关键器件不处于正常工作环境中。
  4. 根据权利要求3所述的方法，其中，所述当判断所述关键器件不处于正常工作环境时，则所述终端通过控制加热散热器对所述关键器件进行温度调整包括：
    当判断所述关键器件不处于正常工作环境时，则所述终端确定所述温度是低于所述最低温度还是高于所述最高温度；
    当确定所述温度是低于所述最低温度时，所述终端通过控制开关控制所述加热散热器进入加热状态，以便对所述关键器件进行加热处理；
    当确定所述温度是高于所述最高温度时，所述终端通过控制开关控制所述加热散热器进入散热状态，以便对所述关键器件进行散热处理。
  5. 根据权利要求4所述的方法，其中，在所述终端通过控制加热散热器对所述关键器件进行温度调整之后，所述方法还包括：
    当所述加热散热器处于加热状态时，所述终端对所述关键器件进行实时温度检测，得到所述关键器件的实时温度；
    当所述关键器件的实时温度达到所述加热温度阈值时，所述终端通过控制开关控制所述加热散热器进入待机状态。
  6. 根据权利要求4所述的方法，其中，在所述终端通过控制加热散热器对所述关键器件进行温度调整之后，所述方法还包括：
    当所述加热散热器处于散热状态时，所述终端对所述关键器件进行实时温度检测，得到所述关键器件的实时温度；
    当所述关键器件的实时温度达到所述散热温度阈值时，所述终端通过控制开关控制所述加热散热器进入待机状态。
  7. 根据权利要求1至6中任一项所述的方法，还包括：
    当判断所述关键器件处于正常工作环境时，所述终端通过控制开关控制所述加热散热器进入待机状态。
  8. 一种终端热处理的装置，包括：
    获取模块，其配置为通过对关键器件进行温度检测，获取所述关键器件的温度信息；
    判断模块，其配置为根据所述关键器件的温度信息，判断所述关键器件是否处于正常工作环境中；
    温度调整模块，其配置为当判断所述关键器件不处于正常工作环境时，则通过控制加热散热器对所述关键器件进行温度调整，使所述关键器件在温度调整后处于正常工作环境中。
  9. 一种终端热处理的设备，包括：处理器、以及与所述处理器耦接的存储器；所述存储器上存储有可在所述处理器上运行的终端热处理的程序，所述终端热处理的程序被所述处理器执行时实现如权利要求1至7中任一项所述的终端热处理的方法的步骤。
  10. 一种计算机存储介质，其上存储有终端热处理的程序，所述终端热处理的程序被处理器执行时实现如权利要求1至7中任一项所述的终端热处理的方法的步骤。
PCT/CN2019/103980 2018-09-07 2019-09-02 终端热处理的方法、装置、设备以及存储介质 WO2020048418A1 (zh)

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