WO2020044650A1 - Alliage de brasage - Google Patents

Alliage de brasage Download PDF

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Publication number
WO2020044650A1
WO2020044650A1 PCT/JP2019/016718 JP2019016718W WO2020044650A1 WO 2020044650 A1 WO2020044650 A1 WO 2020044650A1 JP 2019016718 W JP2019016718 W JP 2019016718W WO 2020044650 A1 WO2020044650 A1 WO 2020044650A1
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WO
WIPO (PCT)
Prior art keywords
mass
content
solder alloy
solder
alloy according
Prior art date
Application number
PCT/JP2019/016718
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English (en)
Japanese (ja)
Inventor
英治 日野
広信 澤渡
Original Assignee
Ｊｘ金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ金属株式会社 filed Critical Ｊｘ金属株式会社
Priority to JP2019543866A priority Critical patent/JPWO2020044650A1/ja
Priority to CN201980001971.9A priority patent/CN111132794B/zh
Publication of WO2020044650A1 publication Critical patent/WO2020044650A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a solder alloy.
  • solder alloys are soldered from environmental considerations.
  • the temperature range suitable for use as a solder varies depending on the composition of the solder alloy.
  • Power devices are used in a wide range of fields, such as hybrid vehicles and power transmission and transformation, as power conversion elements.
  • SiC devices could be used, but SiC, GaN, etc., which have a larger bandgap than Si, have attracted attention in recent years in fields requiring high breakdown voltage, large current applications, and high-speed operation.
  • the operating temperature of conventional power modules was up to about 170 ° C., but the temperature range of next-generation SiC, GaN, etc. is likely to be 200 ° C. or higher. Accordingly, heat resistance and heat dissipation are required for each material used for a module on which these chips are mounted.
  • Sn-3.0Ag-0.5Cu solder is preferable from the viewpoint of Pb-free, but the melting point is around 220 ° C. because the operating temperature of the next-generation module may exceed 200 ° C. More heat resistance is required than Sn-3.0Ag-0.5Cu solder.
  • solder having a melting point of preferably 250 ° C. or more is required from the viewpoint of cooling of the radiator and tolerance of the temperature around the engine.
  • the composition of the solder is expressed in terms of mass% unless otherwise specified. In the case of Sn-3.0Ag-0.5Cu, the composition of Ag: 3.0 mass%, Cu: 0.5 mass%, and the balance of Sn That is.
  • Pb solder Pb-5Sn
  • Au-based solder Au-Ge, Au-Si, Au-Sn
  • Sn-based solders are known as inexpensive solders (Patent Documents 1 and 2).
  • metal powder paste has attracted attention as a bonding material for next-generation modules. Due to the small size of the metal powder, the surface energy is high and sintering begins at a temperature much lower than the melting point of the metal. And, unlike solder, once it is sintered, it does not re-melt unless it is heated to near the melting point of the metal. Taking advantage of such characteristics, development of an Ag fine powder paste is in progress (Patent Document 3).
  • Pb-5Sn solder has a sufficient function as a bonding material for the next-generation power module, but is leaded, and is desirably not used from the viewpoint of future environmental regulations.
  • Au-based solder is desirable as a bonding material in terms of function and environment, but has a problem of material price.
  • the Sn-based solder has a low melting point and may reduce the bonding strength in a high-temperature environment such as 250 ° C. Further, the Ag fine powder paste can provide sufficient bonding strength and heat resistance to the bonding layer depending on conditions, but has a problem of material price.
  • solder paste of Patent Literature 4 a plurality of types of powders having different compositions are blended and are designed to be alloyed after melting. For that purpose, heating exceeding the melting point of each powder is required. For example, if Cu powder is used, complete melting cannot be expected unless the powder is heated to a melting point of 1084.6 ° C. or higher, and there is a concern about non-uniformity depending on a heating operation at the time of soldering.
  • an object of the present invention is to provide a novel solder alloy that can be used in a high temperature range without being added with lead.
  • the present invention includes the following (1).
  • a solder alloy containing Sn, Bi, and Cu The Sn content is 1.9 to 4.3% by mass, the Cu content is 1.9 to 4.5% by mass, the balance is Bi and inevitable impurities, and the Sn content and the Cu content are Solder alloy that satisfies the following formula: Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.00 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.63
  • solder alloy having excellent properties even in a high temperature range required for a bonding material of a next-generation power module, for example, in a temperature range exceeding 250 ° C. without adding lead. Can be.
  • FIG. 1 is an explanatory diagram illustrating a range of an expression satisfied by the embodiment of the present application.
  • solder alloy of the present invention is a solder alloy containing Sn, Bi, and Cu, and has a Sn content of 1.9 to 4.3% by mass and a Cu content of 1.9 to 4.5%. %, The balance being Bi and unavoidable impurities, the Sn content and the Cu content being in the solder alloy satisfying the following formula: Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.00 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.63
  • the solder alloy of the present invention has a high solidus temperature and a liquidus temperature both in a high temperature range, and in order to maintain sufficient bonding strength even after long-time holding at a high temperature, a bonding material for a next-generation power module is used. It has excellent characteristics even in a high temperature range required for, for example, a temperature range exceeding 250 ° C.
  • the solder alloy of the present invention is advantageous from the viewpoint of future environmental regulations because lead is not intentionally added and contained, and the material is used because expensive Ag is not used. It is also advantageous in terms of price.
  • the unavoidable impurities are not the components intentionally added but the components unavoidably mixed from the material or the process.
  • the metal used as the raw material is a 4N product
  • the inevitable impurities contain 0.01% by mass at the maximum.
  • the solder alloy of the present invention is a so-called lead-free solder alloy. It may be contained.
  • [Bi] Bi bismuth is contained as a main constituent element of the solder alloy of the present invention.
  • the content of Bi in the solder alloy is, for example, 91.2 to 96.2% by mass, preferably 91.3 to 95.9% by mass, or 91.3 to 94.0% by mass. can do.
  • the content of Bi with respect to the solder alloy is, for example, 91.2% by mass or more, preferably 91.3% by mass or more, or 96.2% by mass or less, preferably 95.9% by mass or less. , 94.0% by mass or less.
  • the Sn content with respect to the solder alloy can be, for example, 1.9 to 4.3% by mass, preferably 2.1 to 4.2% by mass, or 3.0 to 4.2% by mass.
  • the content of Sn relative to the solder alloy is, for example, 1.9% by mass or more, preferably 2.1% by mass or more, more preferably 3.0% by mass or more, or for example 4.3% by mass. Or less, preferably 4.2 mass% or less.
  • the content of Cu in the solder alloy is, for example, in the range of 1.9 to 4.5% by mass, preferably 2.0 to 4.5% by mass or 3.0 to 4.5% by mass. It can be.
  • the content of Cu with respect to the solder alloy is, for example, 1.9% by mass or more, preferably 2.0% by mass or more, more preferably 3.0 or more, or for example 4.5% by mass or less. can do. Even if the Cu concentration is 1.9% by mass or more, there is no increase in the liquidus temperature, and the shear strength after 250 ° C. for 1000 hours can be easily secured to 40 MPa or more. On the other hand, if the Cu concentration exceeds 4.50 mass%, the adhesion of the solder to the manufacturing equipment cannot be ignored and continuous manufacturing becomes difficult.
  • the Cu and Sn contents satisfy the following formula: Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.00 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.63
  • the Cu and Sn contents satisfy the following formula: Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.16 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.50
  • the Cu and Sn contents satisfy the following formula: Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.50 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.50
  • the solidus temperature can be, for example, 228 ° C. or higher, or 235 ° C. or higher.
  • the shear strength after 1000 hours under a 250 ° C. environment is 40 MPa or more, so that it can be used sufficiently in a high temperature range.
  • the liquidus temperature can be, for example, 272 ° C or lower, 270 ° C or lower, or 268 ° C or lower.
  • [Liquid temperature and solidus temperature] In a preferred embodiment, the value of the following equation: [liquidus temperature]-[solidus temperature] (solidus liquidus temperature difference: PR) is, for example, 33 ° C or less, or 24 ° C or less. Can be.
  • the composition of the solder alloy can be, for example, as follows.
  • Sn: Bi: Cu 2.1 to 4.2% by mass: 91.3 to 95.9% by mass: 2.0 to 4.5% by mass, which satisfies the following formula: Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.16 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.50
  • Sn: Bi: Cu 3.0 to 4.2% by mass: 91.3 to 94.0% by mass: 3.0 to 4.5% by mass, which satisfies the following formula: Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.50 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.50
  • the bonding strength of the solder alloy can be measured by the means described in the examples.
  • the bonding strength can be set as the shear strength after one or three reflow treatments, for example, 39 MPa or more, 43 MPa or more, or 47 MPa or more as the shear strength after one reflow treatment.
  • the shear strength after three reflow treatments can be, for example, 39 MPa or more, or 47 MPa or more, preferably 54 MPa or more.
  • the bonding strength can be, for example, 40 MPa or more, or 43 MPa or more, preferably 46 MPa or more, as the shear strength measured after being kept at 250 ° C. for 1000 hours in an air atmosphere.
  • solder alloy shape As the shape of the solder alloy of the present invention, a shape as required for use as a solder can be appropriately adopted. It can be a sheet-shaped member as described in the examples, and further can be a member having a shape such as a wire, a powder, a ball, a plate, and a bar.
  • the shape of the solder alloy is particularly preferably a powder shape, a solder ball shape (ball shape), or a sheet shape.
  • the solder ball is, for example, a ball having a diameter of 50 ⁇ m to 500 ⁇ m.
  • the term “solder powder” may be used to include the powder and the solder balls.
  • the solder powder can be used for a solder paste. In this case, for example, a powder having a particle size of less than 50 ⁇ m can be used.
  • the present invention includes the following (1).
  • a solder alloy containing Sn, Bi, and Cu The Sn content is 1.9 to 4.3% by mass, the Cu content is 1.9 to 4.5% by mass, the balance is Bi and inevitable impurities, and the Sn content and the Cu content are Solder alloy that satisfies the following formula: Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.00 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.63
  • a printed circuit board comprising the solder alloy according to any one of (1) to (8).
  • An electronic component comprising the solder alloy according to any one of (1) to (8).
  • a power transistor comprising the solder alloy according to any one of (1) to (8).
  • An electronic device comprising the solder joint according to (11) or (12), the printed circuit board according to (13), the electronic component according to (14), or the power transistor according to (15).
  • the present invention is a member made of the above-mentioned solder alloy, an internal joint solder joint of an electronic component soldered with the solder alloy, a solder joint of a power transistor soldered with the solder alloy, It includes a printed circuit board having the solder alloy, an electronic component having the solder alloy, and a power transistor having the solder alloy.
  • the present invention includes the above-described solder joint, a printed circuit board, an electronic component, and an electronic device having a power transistor, and includes a power device having the above-described solder joint.
  • Example 1 A predetermined amount of Bi, Cu, and Sn chip raw materials was charged into a graphite crucible, the graphite crucible was set in an atomizing apparatus, an inert gas atmosphere was maintained, and a predetermined time was maintained until the raw materials were uniformly dissolved to obtain a molten metal. Thereafter, the stopper installed at the bottom of the graphite crucible was pulled up, and the molten metal was dropped on the lower part. At that time, an inert gas was sprayed on the molten metal to produce a solder powder. 0.5 g of the solder powder was accurately weighed and dissolved in an acid, and then the concentration was measured with an ICP emission spectrometer. The result is shown in Table 1.
  • Example 2 In the same procedure as in Example 1, a solder powder was prepared, the concentration was measured with an ICP emission spectrometer, and the solidus temperature, liquidus temperature, and melting point were measured by differential scanning calorimetry. After the treatment, the shear strength after three reflow treatments and after the high temperature test were measured. The results are summarized in Table 1.
  • solder alloys of Examples 1 to 6 maintained a sufficient shear strength even after the high temperature test (after a lapse of 1000 hours at 250 ° C.).
  • Example 1 had substantially the same Cu content as Comparative Example 4, but had a significantly improved shear strength after a high-temperature test due to a different Sn content.
  • Example 3 as compared with Comparative Example 7, the Cu content was almost the same, but the Sn content was different, so that the shear strength after the high-temperature test was greatly improved.
  • Example 5 as compared with Comparative Example 10, the Cu content was almost the same, but the Sn content was different, so that the shear strength after the high-temperature test was greatly improved.
  • compositions of the solder alloys of Examples 1 to 6 satisfied the following ranges: 1.9 ⁇ Sn content (% by mass) ⁇ 4.3 1.9 ⁇ Cu content (% by mass) ⁇ 4.5 Cu content (% by mass) ⁇ 1.50 ⁇ Sn content (% by mass) ⁇ 1.00 Cu content (% by mass) ⁇ 1.45 ⁇ Sn content (% by mass) ⁇ 1.63
  • the present invention provides a solder alloy having excellent properties in a high temperature range.
  • the present invention is an industrially useful invention.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un nouvel alliage de brasage sans plomb qui peut être utilisé dans une plage de températures élevée. L'alliage de brasage selon l'invention contient du Sn, du Bi et du Cu. La teneur en Sn est de 1,9 à 4,3 % massiques, la teneur en Cu est de 1,9 à 4,5 % massiques, le reste est du Bi et les inévitables impuretés, et la teneur en Sn et la teneur en Cu vérifient la formule : teneur en Cu (en % massique) ≤ 1,50 × teneur en Sn (en % massique) - 1,00 teneur en Cu (en % massique) ≥ 1,45 × teneur en Sn (en % massique) - 1,63.
PCT/JP2019/016718 2018-08-31 2019-04-18 Alliage de brasage WO2020044650A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019543866A JPWO2020044650A1 (ja) 2018-08-31 2019-04-18 はんだ合金
CN201980001971.9A CN111132794B (zh) 2018-08-31 2019-04-18 焊料合金

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018163840 2018-08-31
JP2018-163840 2018-08-31

Publications (1)

Publication Number Publication Date
WO2020044650A1 true WO2020044650A1 (fr) 2020-03-05

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PCT/JP2019/016718 WO2020044650A1 (fr) 2018-08-31 2019-04-18 Alliage de brasage

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JP (1) JPWO2020044650A1 (fr)
CN (1) CN111132794B (fr)
TW (1) TWI688660B (fr)
WO (1) WO2020044650A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010155268A (ja) * 2008-12-27 2010-07-15 Senju Metal Ind Co Ltd Ｂｉ−Ｓｎ系リール巻きはんだ線およびはんだ線の製造方法
JP2011251329A (ja) * 2010-06-04 2011-12-15 Sumitomo Metal Mining Co Ltd 高温鉛フリーはんだペースト
JP2017177122A (ja) * 2016-03-28 2017-10-05 住友金属鉱山株式会社 高温Ｐｂフリーはんだペースト及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3829475B2 (ja) * 1998-05-13 2006-10-04 株式会社村田製作所 Ｃｕ系母材接合用のはんだ組成物
EP1266975A1 (fr) * 2001-06-12 2002-12-18 ESEC Trading SA Soudure sans plomb
WO2007018288A1 (fr) * 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. Pâte à braser sans plomb et son application
TW200732082A (en) * 2005-11-11 2007-09-01 Senju Metal Industry Co Soldering paste and solder joints
US9017446B2 (en) * 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
JP2014024082A (ja) * 2012-07-26 2014-02-06 Sumitomo Metal Mining Co Ltd はんだ合金

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010155268A (ja) * 2008-12-27 2010-07-15 Senju Metal Ind Co Ltd Ｂｉ−Ｓｎ系リール巻きはんだ線およびはんだ線の製造方法
JP2011251329A (ja) * 2010-06-04 2011-12-15 Sumitomo Metal Mining Co Ltd 高温鉛フリーはんだペースト
JP2017177122A (ja) * 2016-03-28 2017-10-05 住友金属鉱山株式会社 高温Ｐｂフリーはんだペースト及びその製造方法

Also Published As

Publication number Publication date
CN111132794B (zh) 2021-08-17
JPWO2020044650A1 (ja) 2021-08-10
TWI688660B (zh) 2020-03-21
CN111132794A (zh) 2020-05-08
TW202010848A (zh) 2020-03-16

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