WO2020043794A1 - Procédé et dispositif d'usinage laser de matériau d'une pièce au moyen d'impulsion photonique - Google Patents

Procédé et dispositif d'usinage laser de matériau d'une pièce au moyen d'impulsion photonique Download PDF

Info

Publication number
WO2020043794A1
WO2020043794A1 PCT/EP2019/073008 EP2019073008W WO2020043794A1 WO 2020043794 A1 WO2020043794 A1 WO 2020043794A1 EP 2019073008 W EP2019073008 W EP 2019073008W WO 2020043794 A1 WO2020043794 A1 WO 2020043794A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
laser
radiation source
workpiece
pulse
Prior art date
Application number
PCT/EP2019/073008
Other languages
German (de)
English (en)
Inventor
Eckhard Beyer
Achim Mahrle
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Technische Universität Dresden
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Technische Universität Dresden filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Publication of WO2020043794A1 publication Critical patent/WO2020043794A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Definitions

  • the present invention relates to a method and a device for laser material processing of a workpiece by means of a photon pulse.
  • a disadvantage of pulsed methods is that the thermally activated interaction volume and the achievable ablation rates are small due to the typically low average powers. In contrast, cw laser radiation sources with high average output powers are available.
  • the disadvantage of this is that there are no process-inherent interaction mechanisms that not only result in an energy input due to radiation absorption, but also a pulse transfer to the thermally activated interaction volume can be achieved. A material expulsion must therefore be achieved by an additionally supplied gas jet, which limits the flexibility of the process and the gas used makes the process more expensive.
  • the present invention is therefore based on the object of proposing a method and a device with which the disadvantages mentioned can be avoided, that is to say high separation rates can be achieved without complex additional workpiece treatment.
  • a first laser beam from a first laser radiation source and a second laser beam from a second laser radiation source are at a common point of incidence on a workpiece to be processed or in a material which is melted with or by the first laser beam Workpiece directed.
  • the workpiece surface or the workpiece is melted by the first laser beam and a material drive is carried out by the second laser beam.
  • An exposure time, which can also be referred to as an interaction time, of the second laser beam is shorter than an exposure time of the first laser beam.
  • the second laser beam By separating the workpiece by the first laser beam with its longer interaction time with the material, the second laser beam, the action time of which is typically too short for a separating machining process, is used to drive out the material, so that no additional measures are taken at the point of impact or by the first laser beam melted material is necessary.
  • the point of impact and / or the melted material can also be referred to as a process zone.
  • the proposed synergetic coupling makes it possible that removal or separation processes previously carried out exclusively with a pulsed laser beam processes can be realized thermally more efficiently and with an increased removal rate.
  • the second laser beam is emitted as a pulsed laser beam from the second laser radiation source.
  • the first laser beam can be emitted as a continuous laser beam from the first laser radiation source or the first laser beam can be emitted as a pulsed laser beam with a pulse duration from the first laser radiation source that is greater than a pulse duration of the second laser beam. In this way, the exposure times or interaction times can be determined in a targeted manner.
  • the first laser beam and the second laser beam can be directed onto the workpiece surface by at least one imaging optical element, preferably a lens, typically a biconvex lens, in order to achieve a sufficiently high power density by focusing on the workpiece surface.
  • at least one imaging optical element preferably a lens, typically a biconvex lens
  • the first laser beam and / or the second laser beam can be guided through an optical deflection element arranged between the optical element to be imaged and the first laser radiation source and the second laser radiation source and superimposed by the optical deflection element in order to simplify beam guidance and to define a defined process zone To reach the workpiece.
  • the optical deflection element is preferably designed as a beam splitter, for example a beam splitter plate or a beam splitter cube, or a dichroic mirror.
  • the first laser beam can be emitted with a power in the range from 0.1 kW to 20 kW, preferably in the range from 1 kW to 10 kW.
  • the second laser beam can have a pulse peak power in the range of preferably 0.1 MW to 100 MW.
  • the ratio of the power (pulse peak power) of the second laser beam to the power (average Power) of the first laser beam between 5-10 ° and 1-10 6 .
  • a protective gas for shielding the point of impact or the process zone is guided onto the workpiece surface.
  • the protective gas can be selected from argon, helium or a mixture of argon and helium, optionally with the addition of proportions of other atomic or molecular gas components.
  • the protective gas should be directed coaxially with the first laser beam and / or the second laser beam onto the workpiece surface.
  • the shielding gas can also be fed laterally through a separate shielding gas nozzle into the process zone or onto the workpiece surface.
  • the second laser beam can be emitted with a pulse duration of less than 10 ps, preferably with a pulse duration of less than 10 ns, particularly preferably with a pulse duration of less than 10 ps, in order not to allow excessive thermal interaction with the material.
  • the pulse duration is preferably in the range between 1 fs and 10 ps.
  • the second laser beam with a pulse repetition frequency between 1 kHz and 10 MHz, preferably between 5 kHz and 5 MHz, is emitted in order to ensure the material expulsion efficiently.
  • the first laser beam and / or the second laser beam is or are emitted with a pulse energy between 5 pJ and 500 mJ, preferably between 50 pJ and 100 mJ, so that both the melting and the expulsion are carried out, if necessary of the material takes place in an efficient manner.
  • a device for laser material processing of a workpiece by means of a photon pulse has a first laser radiation source for emitting a first laser beam and a second laser radiation source for emitting a second laser beam.
  • the first laser radiation source and the second laser radiation source are set up to direct the first laser beam and the second laser beam onto a common point of impact on a workpiece surface to be processed or into a material of the workpiece melted with the first laser beam.
  • the first laser beam melts the workpiece surface or the workpiece. Material and through the second laser beam a material expulsion is achieved.
  • An exposure time of the second laser beam is shorter than an exposure time of the first laser beam.
  • the described method is typically carried out with the described device, i. H. the device described is set up to carry out the method described.
  • Fig. 1 is a schematic representation of a method for laser material processing, in which a workpiece is machined separately and a material discharge is directed away from a laser radiation source and
  • Fig. 2 is a representation corresponding to Figure 1, in which the workpiece is machined or sequentially separating (by repeatedly traversing a machining contour) and in which the material discharge is directed primarily opposite to the direction of movement of the relative movement between the laser beam and the material.
  • a first laser radiation source 2 emits a first laser beam 1 as a continuous laser beam, that is to say as a cw laser beam.
  • a second laser radiation source 4 emits a second laser beam 3 as a pulsed laser beam, ie as a pw laser beam.
  • the first laser radiation source 2 and the two te laser radiation source 4 are typically spatially separated from one another and / or each have their own electrical energy supply.
  • the first laser beam 1 and the second laser beam 3 are passed through a di chroic mirror 8 so that they are guided together in the direction of the workpiece to be treated.
  • the second laser beam 3 is here deflected at the dichroic mirror, in the illustrated embodiment by 90 °, while the first laser beam 1 passes in a straight line.
  • Both laser beams 1 and 3 are focused by a biconvex lens 7 as an imaging optical element on a workpiece surface 6, where the first laser beam 1 performs a separating processing 9 of the workpiece by melting a material of the workpiece at the point of impact 5, while the second laser beam 3 for a material discharge 10 is responsible.
  • Coaxial guidance and simultaneous temporal and spatial impingement of the laser beams 1 and 3 ensure an effective cutting process with the material discharge 10 or material expulsion directly at the cutting front.
  • the material discharge 10 or material expulsion takes place according to a side facing away from the first laser radiation source 1 or the second laser radiation source 2.
  • the parameters of the first laser beam 1 and the second laser beam 3 are selected such that the material discharge 10 is directed away from the first laser radiation source 2 and the second laser radiation source 4.
  • the exposure time or interaction time of the first laser beam 1 is longer than the exposure time of the second laser beam 3 due to the continuous emission.
  • the first laser radiation source 2 emits a pulsed laser beam as the first laser beam 1 animals, wherein a pulse duration of the first laser beam 1 is in this case greater than a pulse duration of the second laser beam 2.
  • the pulse duration of the first laser beam 1 is a multiple or at least one order of magnitude longer than the pulse duration of the second laser beam 3.
  • the pulse duration of the second laser beam 3 is less than 100 ps.
  • shear forces are induced as a result of a radiation pressure or photon pulse, in particular at high incidence angles of laser radiation typical of cutting sheet metal, on an inclined cutting front, and a melt which forms is driven off primarily in the molten state.
  • the method described can therefore be used in particular in sheet metal processing, ie for processing metal workpieces which have been rolled to form plates with a thickness of typically not more than 1 cm.
  • the first laser beam 1 and the second laser beam 3 have an identical beam diameter, but variations in the beam diameter of both beams 1, 3 by up to 10 percent of the beam with the larger beam diameter can also be provided.
  • the second laser beam 3 is not used to heat the material of the workpiece already melted by the first laser beam ml to boiling temperature, but rather to discharge the material 10 as a result of the effective radiation pressure.
  • the first laser steel 1 is emitted in the embodiment shown in FIG. 1 with a power in the range of 1 kW, while the second laser beam 3 has an average pulse peak power of 42 MW with a pulse duration of 12 ps and a pulse energy of 500 pJ.
  • a ratio of the powers to one another can also be in the range from 5-10 ° and 1-10 6 .
  • the protective gas is applied to the workpiece surface 6 coaxially with the first laser beam 1 and / or the second laser beam 3 through a protective gas nozzle.
  • the protective gas can also be guided into or to the process zone via a laterally arranged, separate protective gas nozzle.
  • a lateral arrangement is to be understood here in particular to mean an arrangement in which the protective gas flows at an angle of 45 ° to 90 ° relative to the first laser beam 1 and / or the second laser beam 3 onto the point of impact 5 or the workpiece surface 6.
  • the described ne method can, however, as described above, also be carried out free of gas impingement of the impact point 5, i. H. only the second laser beam 3 is responsible for the material discharge 10.
  • exemplary embodiments can also be provided in which the first laser beam 1 and the second laser beam 3 are directed at the point of incidence 5 or the workpiece surface 6 at different angles.
  • first laser beam 1 and the second laser beam 3 are directed at the point of incidence 5 or the workpiece surface 6 at different angles.
  • a deflecting element and optionally a deflecting optical element.
  • Removal and separating processes of laser-based material processing are characterized in that the material along the processing contour must be thermally activated (melting, evaporation) and must be expelled from the processing zone simultaneously. This double effect is only achieved a priori in those applications in which the material is evaporated along the kerf. The range of application of this process variant is therefore limited to those materials which have no pronounced melting phase. For all other materials, evaporation-based process control is not feasible due to thermal interactions or is not sensible to use in terms of energy.
  • Thermal activation of the interaction volume with simultaneous material expulsion or material expulsion is achieved using pw laser beam sources such as the second laser radiation source 4.
  • the interaction phenomena underlying such a process control are dependent on the available pulse energy or pulse energy current density (fluence) and the pulse duration.
  • the pulse duration not only determines the duration of the process phase for the energy input into the material and the power density that is effective during the pulse phase (intensity of the laser radiation), but also the extent of heat conduction in the base material adjacent to the immediate process zone.
  • the pulse duration has a significant influence on the effective driving forces for the material expulsion 10, since the latter are determined in particular by the pulse power as a ratio of pulse energy to pulse duration or the pulse intensity as a ratio of pulse power to the interaction area (focus size).
  • the principle of action of the hybrid approach presented is based on the fact that the energy of the cw laser beam is primarily used to melt the material along a processing path, while simultaneously or simultaneously the exposure of the process zone to laser beam pulses of the second laser beam 3 causes the molten material to be expelled.
  • the proposed synergetic coupling it is possible that previously only removal and separation processes carried out with a pw beam source can be realized thermally more efficiently and with an increased removal rate.
  • removal and separation processes previously carried out exclusively with a cw beam source can be realized without additional process gas, which on the one hand can lower operating and manufacturing costs and on the other hand can achieve greater flexibility for processing.
  • gases can be used to shield the process zone from the atmosphere.
  • FIG. 2 shows a view corresponding to FIG. 1, in which the parameters of the first laser beam 1 were chosen such that the workpiece is not completely separated, but is only cut, the material discharge 10 now being directed away from the workpiece and primarily in one direction opposite to the machining direction.
  • Recurring features are provided in this figure with identical reference numerals as in Figure 1.

Abstract

La présente invention concerne un procédé ainsi qu'un dispositif correspondant pour l'usinage laser de matériau d'une pièce au moyen d'une impulsion photonique, selon lequel un premier faisceau laser (1) provenant d'une première source de rayonnement (2) laser et un deuxième faisceau laser (3) provenant d'une deuxième source de rayonnement (4) laser sont dirigés sur un point d'impact (5) commun sur une surface de pièce (6) à traiter ou dans un matériau fondu de la pièce au moyen du premier faisceau laser (1). Le premier faisceau laser (1) permet d'obtenir une fusion (9) de la surface de pièce (6) ou du matériau et le deuxième faisceau laser (3) permet d'obtenir une ébarbure (10) de matériau, une durée d'action du deuxième faisceau laser (3) étant plus courte qu'une durée d'action du premier faisceau laser (1).
PCT/EP2019/073008 2018-08-30 2019-08-28 Procédé et dispositif d'usinage laser de matériau d'une pièce au moyen d'impulsion photonique WO2020043794A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018214742.6 2018-08-30
DE102018214742.6A DE102018214742A1 (de) 2018-08-30 2018-08-30 Verfahren und Vorrichtung zur Lasermaterialbearbeitung eines Werkstücks mittels Photonenimpuls

Publications (1)

Publication Number Publication Date
WO2020043794A1 true WO2020043794A1 (fr) 2020-03-05

Family

ID=65084649

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/073008 WO2020043794A1 (fr) 2018-08-30 2019-08-28 Procédé et dispositif d'usinage laser de matériau d'une pièce au moyen d'impulsion photonique

Country Status (2)

Country Link
DE (1) DE102018214742A1 (fr)
WO (1) WO2020043794A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0481270A1 (fr) * 1990-10-19 1992-04-22 Hans Wilhelm Prof. Dr. Bergmann Procédé pour coupler des faisceaux laser cw-CO2
US6809291B1 (en) * 2002-08-30 2004-10-26 Southeastern Universities Research Assn., Inc. Process for laser machining and surface treatment
US20060249816A1 (en) * 2005-05-05 2006-11-09 Intel Corporation Dual pulsed beam laser micromachining method
EP2596900A1 (fr) * 2011-11-28 2013-05-29 Laser- und Medizin-Technologie GmbH Berlin Dispositif et procédé de traitement de matériau
WO2015108991A2 (fr) * 2014-01-17 2015-07-23 Imra America, Inc. Modification de materiaux transparents induite par traitement laser

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0481270A1 (fr) * 1990-10-19 1992-04-22 Hans Wilhelm Prof. Dr. Bergmann Procédé pour coupler des faisceaux laser cw-CO2
US6809291B1 (en) * 2002-08-30 2004-10-26 Southeastern Universities Research Assn., Inc. Process for laser machining and surface treatment
US20060249816A1 (en) * 2005-05-05 2006-11-09 Intel Corporation Dual pulsed beam laser micromachining method
EP2596900A1 (fr) * 2011-11-28 2013-05-29 Laser- und Medizin-Technologie GmbH Berlin Dispositif et procédé de traitement de matériau
WO2015108991A2 (fr) * 2014-01-17 2015-07-23 Imra America, Inc. Modification de materiaux transparents induite par traitement laser

Also Published As

Publication number Publication date
DE102018214742A1 (de) 2019-02-14

Similar Documents

Publication Publication Date Title
EP2489458B1 (fr) Dispositif de traitement laser doté d'un agencement laser commutable et procédé de traitement laser
DE102014213775B4 (de) Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
EP0558870B1 (fr) Soudage libre de structures métalliques avec un laser
EP2783787B1 (fr) Dispositif d'usinage d'une pièce à l'arc supporté par un laser, notamment pour son soudage ou sa découpe à l'arc
DE2922563C2 (fr)
WO2020239846A1 (fr) Dispositif d'usinage au laser et procédé pour l'usinage simultané et sélectif d'une pluralité de zones à usiner d'une pièce
DE19736110C2 (de) Verfahren und Vorrichtung zur grat- und schmelzfreien Mikrobearbeitung von Werkstücken
DE2644014A1 (de) Verfahren zum abtragen von material mittels laserstrahlen und anordnung zum durchfuehren des verfahrens
DE102018120011B4 (de) Schweißverfahren zum Verbinden eines transparenten, aluminiumoxidhaltigen ersten Substrats mit einem opaken zweiten Substrat
WO2020043794A1 (fr) Procédé et dispositif d'usinage laser de matériau d'une pièce au moyen d'impulsion photonique
WO2018234192A1 (fr) Système et procédé pour usiner une surface
DE2211195A1 (de) Verfahren und Vorrichtung zur Materialschweißung
DE1294153B (de) Verfahren zum Schneiden von Werkstuecken
DE19756110C1 (de) Verfahren und Vorrichtung zum Auftrennen von Glaslot-Verbindungen
DE10140533A1 (de) Verfahren und Vorrichtung zur Mikrobearbeitung eines Werkstücks mit Laserstrahlung
DE4033166A1 (de) Verfahren zur einkopplung von cw-co(pfeil abwaerts)2(pfeil abwaerts)-laserstrahlen
WO2021074427A1 (fr) Procédé d'assemblage de deux partenaires d'assemblage au moyen d'impulsions laser ultracourtes
DE102010047419B4 (de) Verfahren und Vorrichtung zur Erzeugung von EUV-Strahlung aus einem Gasentladungsplasma
DE102004027229A1 (de) Verfahren zum Schweißen von Werkstücken aus Aluminium oder einer Aluminiumlegierung
DE102019116803A1 (de) Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks
DE102023101453B3 (de) Verfahren und vorrichtung zur erzeugung von sekundärstrahlung, insbesondere euv-strahlung, mit wenigstens einem laser
DE102012202060A1 (de) Vorrichtung und Verfahren zur Materialbearbeitung
DE102012025294A1 (de) Verfahren zum Erzeugen von Strukturen auf einer Oberfläche eines Werkstücks
DE102020007017B4 (de) Verfahren zur Entfernung von Schmutzablagerungen an wenigstens einer geometrischen und mittels einer Mikrotechnik und/oder Nanotechnik hergestellten Struktur wenigstens eines Körpers und Verwendung eines ultrakurz gepulsten Lasers mit Pulsen im Burst-Modus
WO2021151789A2 (fr) Procédé et dispositif permettant l'usinage d'une pièce métallique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19761825

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19761825

Country of ref document: EP

Kind code of ref document: A1