WO2020031669A1 - Composition de silicone et son procédé de fabrication - Google Patents

Composition de silicone et son procédé de fabrication Download PDF

Info

Publication number
WO2020031669A1
WO2020031669A1 PCT/JP2019/028593 JP2019028593W WO2020031669A1 WO 2020031669 A1 WO2020031669 A1 WO 2020031669A1 JP 2019028593 W JP2019028593 W JP 2019028593W WO 2020031669 A1 WO2020031669 A1 WO 2020031669A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
group
mass
parts
silicone composition
Prior art date
Application number
PCT/JP2019/028593
Other languages
English (en)
Japanese (ja)
Inventor
啓太 北沢
櫻井　郁男
岩田　充弘
貴仁 大木
貴大 山口
Original Assignee
信越化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越化学工業株式会社 filed Critical 信越化学工業株式会社
Priority to JP2020536427A priority Critical patent/JP7010381B2/ja
Publication of WO2020031669A1 publication Critical patent/WO2020031669A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

Definitions

  • the present invention relates to a silicone composition and a method for producing the same.
  • a silicone composition having thermal conductivity an inorganic filler having a specific particle shape, which is calculated from the BET specific surface area and the average particle diameter, is defined by the specific surface area assuming a spherical shape, is blended.
  • the present invention relates to a thermally conductive silicone composition and a method for producing the same, which are capable of suppressing performance deterioration due to cracks and deviations during a thermal cycle.
  • this one-part type thermally conductive silicone composition also had some problems. For example, refrigeration or freezing is required for storage, and thawing is required before use.
  • heating and cooling are required when assembling the additional one-component thermally conductive silicone composition, it is necessary to introduce a heating furnace / cooling furnace into a production facility using the material, or to perform heating for a long time. There was a problem that the production efficiency was reduced due to the necessity of a cooling step. Further, even from the viewpoint of energy efficiency, such a heating step must be heated not only for the thermally conductive material but also for each part, and thus cannot be said to be an efficient step.
  • Japanese Patent No. 3580366 Japanese Patent No. 4130091 JP 2004-352947
  • a Japanese Patent No. 4787128 Japanese Patent No. 5733087
  • the present invention has been made in view of the above circumstances, and does not require refrigeration or freezing storage, and further does not require a heating / cooling step at the time of mounting, so that production efficiency is high, and cracks and deviations during a cooling / heating cycle are eliminated.
  • An object of the present invention is to provide a thermally conductive silicone composition and a method for producing the same, which are capable of suppressing performance degradation caused by the composition.
  • the present inventors have conducted intensive studies in order to achieve the above object, and as a result, calculated from the BET specific surface area and the average particle diameter, defined by the specific surface area assuming a spherical shape, the inorganic filler having a specific particle shape It has been found that by adding an agent, it is possible to obtain a silicone composition capable of suppressing performance deterioration due to cracks and misalignments during a cooling / heating cycle, and has accomplished the present invention.
  • the present invention provides the following silicone composition and a method for producing the same. [1].
  • Composition. In the formula, R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, and each R 1 may be the same or different. It represents an integer of 5 to 100.) [4].
  • component (B) Organohydrogenpolysiloxane having two or more hydrogen atoms (SiH groups) bonded to silicon atoms in one molecule: SiH based on the total number of aliphatic unsaturated hydrocarbon groups in component (A) An amount such that the number of groups is 0.5 to 5, (C) a platinum group metal catalyst: an effective amount, (E) at least one inorganic filler selected from the group consisting of metals, metal oxides, metal hydroxides, metal nitrides, metal carbides and allotropes of carbon: 100 per 100 parts by mass of component (A) 5,000 parts by mass provided that the component (E) satisfies the following expression.
  • the silicone composition of the present invention suppresses performance deterioration caused by cracks and misalignments at the time of cooling, which does not require refrigeration or freezing storage, does not require a heating / cooling step at the time of mounting, and which are difficult with conventional techniques. And can be used in a wide range of fields requiring heat radiation and cooling / heat resistance, such as electric and electronic fields and transport equipment fields.
  • Component (A) The component (A) has at least one, preferably 1 to 2 aliphatic unsaturated hydrocarbon groups in one molecule, and has a kinematic viscosity at 25 ° C of 60 to 100,000 mm 2 /. s is an organopolysiloxane.
  • the aliphatic unsaturated hydrocarbon group is preferably a monovalent hydrocarbon group having an aliphatic unsaturated bond and having 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, and more preferably an alkenyl group.
  • alkenyl groups such as vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl, and octenyl. Particularly preferred is a vinyl group.
  • the aliphatic unsaturated hydrocarbon group may be bonded to any of a silicon atom at the terminal of the molecular chain and a silicon atom in the middle of the molecular chain, or may be bonded to both.
  • Examples of the organic group other than the aliphatic unsaturated hydrocarbon group bonded to the silicon atom of the organopolysiloxane include C 1 to C 18, preferably C 1 to C 10, more preferably C 1 to C 8, It is a substituted or substituted monovalent hydrocarbon group.
  • alkyl groups such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, and decyl group;
  • Aryl groups such as phenyl group, tolyl group, xylyl group, and naphthyl group; aralkyl groups such as benzyl group, phenylethyl group, phenylpropyl group, or a part or all of the hydrogen atoms of these groups are fluorine, bromine, chlorine, etc.
  • a halogen atom, a cyano group, and the like for example, a chloromethyl group, a chloropropyl group, a bromoethyl group, a trifluoropropyl group, and a cyanoethyl group.
  • a methyl group and a phenyl group are preferable, and a methyl group is particularly preferable.
  • the organopolysiloxane has a kinematic viscosity at 25 ° C. of 60 to 100,000 mm 2 / s, preferably 100 to 30,000 mm 2 / s.
  • the kinematic viscosity is less than 60 mm 2 / s, the physical properties of the silicone composition deteriorate, and when it exceeds 100,000 mm 2 / s, the extensibility of the silicone composition becomes poor.
  • the kinematic viscosity is a value at 25 ° C. measured by an Ubbelohde Ostwald viscometer (the same applies hereinafter).
  • the molecular structure of the organopolysiloxane is not particularly limited as long as it has the above properties, and examples thereof include a linear structure, a branched structure, a partially branched structure, or a linear structure having a cyclic structure. .
  • examples thereof include a linear structure, a branched structure, a partially branched structure, or a linear structure having a cyclic structure.
  • those having a linear structure in which the main chain is composed of repeating diorganosiloxane units and both ends of the molecular chain are blocked with a triorganosiloxy group are preferred.
  • the organopolysiloxane having a linear structure may have a partially branched structure or a cyclic structure. These organopolysiloxanes can be used alone or in combination of two or more.
  • the component (B) is composed of two or more, preferably three or more, particularly preferably 3 to 100, and more preferably 3 to 20 hydrogen atoms (SiH groups) bonded to a silicon atom in one molecule.
  • organohydrogenpolysiloxanes The organohydrogenpolysiloxane is capable of forming a crosslinked structure by the addition reaction of the SiH group in the molecule with the aliphatic unsaturated hydrocarbon group of the component (A) in the presence of a platinum group metal catalyst. I just need.
  • the SiH group may be bonded to any of a silicon atom at the terminal of the molecular chain and a silicon atom in the middle of the molecular chain, or may be bonded to both.
  • the molecular structure of the organohydrogenpolysiloxane is not particularly limited as long as it has the above properties, and is a linear structure having a linear structure, a branched structure, a cyclic structure, a partially branched structure or a cyclic structure. And the like. Preferred are a linear structure and a cyclic structure.
  • the organohydrogenpolysiloxane has a kinematic viscosity at 25 ° C. of preferably 1 to 1,000 mm 2 / s, more preferably 10 to 100 mm 2 / s.
  • a kinematic viscosity at 25 ° C. preferably 1 to 1,000 mm 2 / s, more preferably 10 to 100 mm 2 / s.
  • the kinematic viscosity is 1 mm 2 / s or more, there is no possibility that the physical properties of the silicone composition are reduced.
  • the kinematic viscosity is 1,000 mm 2 / s or less, the extensibility of the silicone composition may be poor. There is no.
  • the organohydrogenpolysiloxane preferably has 2 to 100, more preferably 5 to 50, silicon atoms in one molecule.
  • Examples of the organic group bonded to the silicon atom of the organohydrogenpolysiloxane include a monovalent hydrocarbon group other than the aliphatic unsaturated hydrocarbon group. Particularly, it is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12, preferably 1 to 10 carbon atoms.
  • alkyl groups such as methyl group, ethyl group, propyl group, butyl group, hexyl group and dodecyl group, aryl groups such as phenyl group, aralkyl groups such as 2-phenylethyl group and 2-phenylpropyl group, hydrogen of these Those in which some or all of the atoms have been substituted with halogen atoms such as fluorine, bromine, chlorine, etc., cyano groups, epoxy ring-containing organic groups (glycidyl groups or glycidyloxy group-substituted alkyl groups), for example, chloromethyl group, chloropropyl Groups, bromoethyl group, trifluoropropyl group, cyanoethyl group, 2-glycidoxyethyl group, 3-glycidoxypropyl group, 4-glycidoxybutyl group and the like. Among these, a methyl group is preferred.
  • the amount of the organohydrogenpolysiloxane of the component (B) is such that the number of SiH groups in the component (B) is 0.5 to 5 relative to the total number of aliphatic unsaturated hydrocarbon groups in the component (A). Amount, preferably an amount of 0.6 to 2, more preferably an amount of 0.7 to 1.5.
  • the amount of the component (B) is less than the above lower limit, the addition reaction does not proceed sufficiently and the crosslinking becomes insufficient. If the content exceeds the upper limit, the crosslinked structure becomes non-uniform, and the storage stability of the composition is significantly deteriorated.
  • the platinum group metal catalyst of the component (C) is a hydrosilylation catalyst and functions to promote the above-mentioned addition reaction.
  • a conventionally known catalyst used for an addition reaction can be used.
  • platinum-based, palladium-based, and rhodium-based catalysts can be mentioned, and among them, platinum or a platinum compound which is relatively easily available is preferable.
  • a simple substance of platinum, platinum black, chloroplatinic acid, a platinum-olefin complex, a platinum-alcohol complex, a platinum coordination compound and the like can be mentioned.
  • the platinum group metal catalyst may be used alone or in combination of two or more.
  • the compounding amount of the component (C) may be an effective amount as a catalyst, that is, an effective amount necessary to promote the addition reaction and cure the composition of the present invention.
  • the amount is 0.1 to 500 ppm, more preferably 1 to 200 ppm, based on the mass of the platinum group metal atom, based on the component (A). If the amount of the catalyst is less than the above lower limit, the effect as a catalyst may not be obtained. Further, exceeding the above upper limit is not preferable because the catalytic effect does not increase and is uneconomical.
  • the platinum group metal catalyst may be used after being diluted with an organic solvent such as toluene or a polyorganosiloxane in order to improve the dispersibility in the silicone composition.
  • the silicone composition of the present invention may further contain (D) a reaction control agent.
  • the reaction control agent of the component (D) functions to suppress the progress of the hydrosilylation reaction at room temperature and to extend shelf life and pot life.
  • a conventionally known control agent used for an addition-curable silicone composition can be used.
  • acetylene compounds such as acetylene alcohols (eg, 1-ethynyl-1-cyclohexanol, 3,5-dimethyl-1-hexyn-3-ol), and various nitrogen compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole
  • organic phosphorus compounds such as triphenylphosphine, oxime compounds, and organic chloro compounds.
  • the amount is preferably 0.04 to 5 parts by mass, more preferably 0.04 to 2 parts by mass, per 100 parts by mass of the component (A). If the amount of the reaction control agent is less than the lower limit, the desired sufficient shelf life and pot life may not be obtained, and if the amount exceeds the upper limit, the curability of the silicone composition may decrease.
  • the reaction control agent may be used after being diluted with toluene or the like in order to improve the dispersibility in the silicone composition.
  • the component (E) is at least one member selected from the group consisting of metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon, preferably one to three, and furthermore, Preferred are one or two inorganic fillers.
  • metals metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon, preferably one to three, and furthermore, Preferred are one or two inorganic fillers.
  • the component (E) is preferably a metal oxide, more preferably silica, aluminum oxide, or zinc oxide. These can be used alone or in combination of two or more.
  • the thickness is desirably in the range of 0.01 to 1,000 ⁇ m, preferably in the range of 0.05 to 500 ⁇ m, and more preferably in the range of 0.1 to 100 ⁇ m.
  • the average particle diameter can be determined, for example, as a mass average value (or median diameter) in a particle size distribution measurement by a laser light diffraction method.
  • the component (E) satisfies the following expression.
  • i is 1 to n
  • n is the number of types of the inorganic filler contained in the component (E).
  • e is the total amount of the component (E) and is represented by the following formula.
  • the component (Ei) is one kind of inorganic filler in the component (E).
  • each component (E) which is an inorganic filler
  • the shape of each component (E), which is an inorganic filler, is not particularly limited as long as the above formula is satisfied.
  • Examples of the shape include spherical, round, polyhedral, irregular, needle-like, flat, and crushed shapes. Things.
  • the amount of component (E) is 100 to 5,000 parts by mass, preferably 200 to 4,000 parts by mass, per 100 parts by mass of component (A). With this amount, the silicone composition of the present invention can ensure sufficient thermal conductivity and extensibility.
  • the silicone composition of the present invention may further contain a hydrolyzable organopolysiloxane compound (F) represented by the following general formula (1).
  • the hydrolyzable organopolysiloxane compound of the component (F) is used for treating the surface of the inorganic filler, and plays a role in assisting the filling of the filler to a high degree.
  • R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, and each R 1 may be the same or different. It represents an integer of 5 to 100.
  • R 1 in the above formula (1) is a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, and is preferably a monovalent saturated aliphatic group which may have a substituent.
  • Branched alkyl groups such as alkyl group, isopropyl group, isobutyl group, tert-butyl group, isopentyl group, neopentyl group and ethylhexyl group; cycloalkyl group such as cyclopentyl group, cyclohexyl group and cycloheptyl group; chloromethyl group; C1-C20, preferably C1-C14, more preferably C1-C12, such as halogen-substituted alkyl groups such as chloropropyl group, 3,3,3-trifluoropropyl group and bromopropyl group. Things.
  • the monovalent unsaturated aliphatic hydrocarbon group which may have a substituent include an alkenyl group such as an ethenyl group, a 1-methylethenyl group and a 2-propenyl group, an ethynyl group, and a 2-propynyl group. It has 2 to 20 carbon atoms, preferably 2 to 12 carbon atoms, and more preferably 2 to 6 carbon atoms, such as an alkynyl group.
  • the optionally substituted monovalent aromatic hydrocarbon group includes an aryl group such as a phenyl group, a tolyl group and a naphthyl group, a benzyl group, and 2-phenylethyl.
  • a aralkyl group such as a group, a halogen-substituted aryl group such as an ⁇ , ⁇ , ⁇ -trifluorotolyl group, a chlorobenzyl group, an aromatic hetero ring such as a furyl group, a thienyl group, etc., having 4 to 20 carbon atoms, preferably 4 to 12.
  • R 1 is preferably a methyl group, an ethyl group, a 3,3,3-trifluoropropyl group or a phenyl group, more preferably a methyl group, an ethyl group or a phenyl group, and particularly preferably a methyl group. It is.
  • ⁇ m is an integer of 5 to 100, preferably an integer of 10 to 70.
  • (F) kinematic viscosity at 25 ° C. of the component usually preferably 5 ⁇ 100,000mm 2 / s, more preferably 10 ⁇ 50,000mm 2 / s. If the kinematic viscosity is lower than 5 mm 2 / s, oil bleed is likely to be generated from the cured composition, and the composition may be easily dripped. If the kinematic viscosity is higher than 100,000 mm 2 / s, the fluidity of the obtained composition will be poor, and the coating workability may be deteriorated.
  • the amount is 1 to 200 parts by mass, preferably 10 to 150 parts by mass, per 100 parts by mass of the component (A). If the amount is too small, the inorganic filler as the component (E) may be difficult to fill. On the other hand, if the amount is too large, oil bleed may easily occur from the composition after curing, and the curing reaction becomes insufficient.
  • the silicone composition of the present invention may contain a non-reactive organo (poly) siloxane such as methylpolysiloxane to adjust the viscosity of the composition. Further, in order to prevent deterioration of the silicone composition, a conventionally known antioxidant such as 2,6-di-tert-butyl-4-methylphenol may be contained as necessary. Further, an adhesion aid, a release agent, a dye, a pigment, a flame retardant, an anti-settling agent, a thixotropy improver, and the like can be added as necessary.
  • a non-reactive organo (poly) siloxane such as methylpolysiloxane
  • a conventionally known antioxidant such as 2,6-di-tert-butyl-4-methylphenol may be contained as necessary.
  • an adhesion aid, a release agent, a dye, a pigment, a flame retardant, an anti-settling agent, a thixotropy improver, and the like can
  • the method for producing the silicone composition in the present invention is not particularly limited, but the components (A) to (C) and (E) described above, and if necessary, the components (D) and (F) and other components may be used.
  • Trimix, Twin Mix, Planetary Mixer all are registered trademarks of a mixer manufactured by Inoue Seisakusho Co., Ltd.
  • Ultra Mixer registered trademark of a mixer manufactured by Mizuho Industry Co., Ltd.
  • Hibis Dispermix special machine
  • a method of mixing using a mixer such as a chemical compounder (registered trademark of Chemical Industry Co., Ltd.) is used.
  • the component (F) is added, it may be added in the step of mixing the components (A) and (E).
  • the silicone composition of the present invention may be mixed while heating, or may be crosslinked while heating.
  • the heating conditions are not particularly limited, but the temperature is usually 25 to 200 ° C, preferably 60 to 180 ° C, particularly preferably 80 to 170 ° C, and the time is usually 3 minutes to 24 hours, preferably 5 minutes to It is 12 hours, particularly preferably 10 minutes to 6 hours.
  • the silicone composition of the present invention has a viscosity measured at 25 ° C of preferably 1 to 1,000 Pa ⁇ s, more preferably 10 to 700 Pa ⁇ s, and still more preferably 50 to 600 Pa ⁇ s.
  • the viscosity is less than 1 Pa ⁇ s, workability may be deteriorated, such as difficulty in maintaining the shape.
  • the viscosity exceeds 1,000 Pa ⁇ s, there is a possibility that workability may be deteriorated, such as difficulty in ejection and application.
  • the viscosity can be obtained by adjusting the amount of each component described above.
  • the silicone composition of the present invention is thermally conductive and usually has a thermal conductivity of 0.5 to 10 W / m ⁇ K.
  • the thermal conductivity can be measured using TPS-2500S manufactured by Kyoto Electronics Industry Co., Ltd.
  • the silicone composition of the present invention does not require refrigeration or freezing storage, and further does not require a heating / cooling step at the time of mounting, it has high production efficiency and further suppresses performance deterioration due to cracks and deviations during a cooling / heating cycle. It is possible to do. Because of these characteristics, it can be used in a wide range of fields where heat radiation and heat resistance are required, such as in the field of electric and electronic equipment and transport equipment.
  • the kinematic viscosity indicates a value at 25 ° C. measured by an Ubbelohde Ostwald viscometer.
  • the value of the average particle size is the median diameter D 50 was measured with a laser diffraction / scattering type particle size measuring apparatus (LA-750 :( Ltd.) Horiba). Further, the value of the BET specific surface area was measured with an Automatic Surface Area Analyzer (Macsorb HM-model 1201: manufactured by MOUNTEC).
  • A-2 Dimethylpolysiloxane having a kinematic viscosity at 25 ° C. of 800 mm 2 / s, wherein both terminals represented by the following formula (3) are blocked with dimethylvinylsilyl and trimethylsilyl groups. (However, c is a number that becomes the above kinematic viscosity.)
  • Component B-1 Methyl hydrogen dimethylpolysiloxane having a kinematic viscosity at 25 ° C. of 28 mm 2 / s, wherein both terminals represented by the following formula (4) are blocked with a trimethylsilyl group:
  • Component C-1 A solution obtained by dissolving a platinum-divinyltetramethyldisiloxane complex in dimethylpolysiloxane having a kinematic viscosity of 600 mm 2 / s at 25 ° C., both ends of which are blocked with a dimethylvinylsilyl group (platinum atom content: 1 as platinum atom) mass%)
  • Component F-1 A dimethylpolysiloxane having a kinematic viscosity at 25 ° C. of 30 mm 2 / s in which one end represented by the following formula (7) is blocked with a trimethylsilyl group and the other end is blocked with a trimethoxysilyl group.
  • the silicone compositions of Examples 1 to 10 satisfying the requirements of the present invention the values of the slippage property ( ⁇ ⁇ ⁇ ) and the cracking property ( ⁇ ⁇ ⁇ ) are small. That is, it can be determined that the resistance to displacement and the resistance to cracking are excellent.
  • the silicone compositions of Comparative Examples 1 to 8 have large values of the slippage property ( ⁇ ⁇ ⁇ ) and the cracking property ( ⁇ ⁇ ⁇ ). That is, it is determined that the resistance to displacement and the resistance to cracking are poor. Therefore, it was confirmed that the silicone composition of the present invention was able to suppress performance deterioration due to cracks and deviations during a cooling / heating cycle. Due to these properties, the silicone composition of the present invention can be used in a wide range of fields where heat radiation and cooling / heat resistance are required, such as in the field of electrical and electronic equipment and transport equipment.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une composition de silicone comprenant une charge inorganique qui se présente sous la forme de particules ayant une forme spécifique définie par la surface spécifique calculée à partir de la surface spécifique BET et du diamètre de particule moyen suivant l'hypothèse que les particules ont une forme sphérique. L'inclusion de la charge inorganique permet de supprimer la détérioration des performances de la composition de silicone, une telle détérioration provoquée par des fissures et des décalages qui sont générés pendant un cycle de refroidissement/chauffage.
PCT/JP2019/028593 2018-08-10 2019-07-22 Composition de silicone et son procédé de fabrication WO2020031669A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020536427A JP7010381B2 (ja) 2018-08-10 2019-07-22 シリコーン組成物及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018151290 2018-08-10
JP2018-151290 2018-08-10

Publications (1)

Publication Number Publication Date
WO2020031669A1 true WO2020031669A1 (fr) 2020-02-13

Family

ID=69414803

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/028593 WO2020031669A1 (fr) 2018-08-10 2019-07-22 Composition de silicone et son procédé de fabrication

Country Status (2)

Country Link
JP (1) JP7010381B2 (fr)
WO (1) WO2020031669A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019174193A (ja) * 2018-03-27 2019-10-10 トヨタ自動車株式会社 グリスの劣化予測方法、グリス、及び、グリスの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014105283A (ja) * 2012-11-28 2014-06-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP2015059191A (ja) * 2013-09-20 2015-03-30 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
JP2016053140A (ja) * 2014-09-04 2016-04-14 信越化学工業株式会社 シリコーン組成物
JP2017075282A (ja) * 2015-10-16 2017-04-20 信越化学工業株式会社 熱伝導性シリコーングリース組成物
WO2018079215A1 (fr) * 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 Composition de graisse silicone thermoconductrice monocomposant de type durcissable et composant électronique/électrique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014105283A (ja) * 2012-11-28 2014-06-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
JP2015059191A (ja) * 2013-09-20 2015-03-30 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
JP2016053140A (ja) * 2014-09-04 2016-04-14 信越化学工業株式会社 シリコーン組成物
JP2017075282A (ja) * 2015-10-16 2017-04-20 信越化学工業株式会社 熱伝導性シリコーングリース組成物
WO2018079215A1 (fr) * 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 Composition de graisse silicone thermoconductrice monocomposant de type durcissable et composant électronique/électrique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019174193A (ja) * 2018-03-27 2019-10-10 トヨタ自動車株式会社 グリスの劣化予測方法、グリス、及び、グリスの製造方法

Also Published As

Publication number Publication date
JP7010381B2 (ja) 2022-01-26
JPWO2020031669A1 (ja) 2021-08-02

Similar Documents

Publication Publication Date Title
KR102176435B1 (ko) 열전도성 실리콘 조성물
JP5553006B2 (ja) 熱伝導性シリコーングリース組成物
EP3225662B1 (fr) Composition de silicone durcissable par addition à un seul constituant, procédé permettant de stocker ladite composition, et procédé pour son durcissement
EP3533839B1 (fr) Composition de silicone thermoconductrice
JP5472055B2 (ja) 熱伝導性シリコーングリース組成物
JP5947267B2 (ja) シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
WO2018207696A1 (fr) Composition thermoconductrice de silicone
US20230053865A1 (en) Thermal-conductive silicone composition
JP7371249B2 (ja) 高熱伝導性シリコーン組成物
JP7010381B2 (ja) シリコーン組成物及びその製造方法
EP4333047A1 (fr) Composition de silicone durcissable et dispositif à semi-conducteur
JP7355708B2 (ja) 熱伝導性付加硬化型シリコーン組成物
CN115386231A (zh) 热传导性硅酮组合物及其固化物
EP4349916A1 (fr) Composition de silicone thermoconductrice et objet durci obtenu à partir de celle-ci
EP4082970A1 (fr) Composition de résine de silicone thermoconductrice
JP7335678B2 (ja) 熱伝導性付加硬化型シリコーン組成物及びその硬化物
TWI534255B (zh) Heat-conductive silicone grease composition
WO2023145438A1 (fr) Composition de silicone durcissable par addition thermoconductrice et produit durci de celle-ci
WO2023149175A1 (fr) Composition thermoconductrice de silicone et procédé de production associé
WO2023132192A1 (fr) Composition de silicone hautement thermoconductrice

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19848082

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020536427

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19848082

Country of ref document: EP

Kind code of ref document: A1