WO2020029248A1 - 一种导热垫片矩阵排布阵列式结构 - Google Patents

一种导热垫片矩阵排布阵列式结构 Download PDF

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Publication number
WO2020029248A1
WO2020029248A1 PCT/CN2018/099956 CN2018099956W WO2020029248A1 WO 2020029248 A1 WO2020029248 A1 WO 2020029248A1 CN 2018099956 W CN2018099956 W CN 2018099956W WO 2020029248 A1 WO2020029248 A1 WO 2020029248A1
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thermally conductive
substrate
fixing
conductive pads
hole
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PCT/CN2018/099956
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English (en)
French (fr)
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范勇
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平湖阿莱德实业有限公司
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Application filed by 平湖阿莱德实业有限公司 filed Critical 平湖阿莱德实业有限公司
Priority to PCT/CN2018/099956 priority Critical patent/WO2020029248A1/zh
Priority to CN201880003062.4A priority patent/CN110050521B/zh
Publication of WO2020029248A1 publication Critical patent/WO2020029248A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • the invention relates to a matrix arrangement array structure of thermally conductive pads.
  • Thermal pads are a key component of heat dissipation for electronic components. There is a very fine uneven space between the surface of the electronic device and the heat sink. If they are directly installed together, the actual contact area between them is only about 10% of the area of the base of the heat sink, and the rest are air gaps. Since air is a poor conductor of heat, contact thermal resistance will be formed between the electronic components and the heat sink, reducing the efficiency of the heat sink.
  • the thermally conductive gasket is filled between the electronic heating device and the heat sink to eliminate the air therein, and an effective heat conduction channel is established therebetween to reduce the contact thermal resistance and improve the heat transfer performance.
  • High-frequency communication antennas (such as 38Hz, 39Hz) are arranged closely and in large numbers. Generally, 32 arrays, 64 arrays, and 128 arrays are used, and the size is small, generally 3x3mm. Therefore, manual assembly is prone to inaccurate positioning and leakage. And the wrong assembly; and the robot assembly, the thermal pad is easy to deform, or the assembled thermal product is easy to move, misplace, or even fall, and the robot investment cost is high. In addition, the above two assembly methods are extremely inefficient. It needs to be assembled one by one every time, which takes a long time.
  • the technical problem to be solved by the present invention is to provide a thermally conductive gasket matrix arrangement array structure, which solves the technical problem that the existing thermally conductive gaskets have low assembly efficiency during assembly.
  • a thermally conductive pad matrix arrangement array structure including a substrate, the substrate includes a fixing portion, the fixing portion includes a fixing hole, and the fixing portion
  • the protruding mechanism on the inner wall of the hole is inserted into the side wall of the thermal pad through the protruding mechanism to fix the thermal pad in the fixing hole, and the fixing holes are arranged in a matrix on the substrate.
  • the protruding mechanism includes a protruding block, and the protruding block is provided with a spiked point inserted into a side wall of the heat conductive pad.
  • the protruding mechanism includes at least two bumps, and the bumps are evenly distributed on the fixing hole.
  • the protrusion is integrally formed with the fixing hole.
  • the fixing hole is a polygonal hole, a circular hole or a trapezoidal hole.
  • the substrate further includes a positioning portion, and the substrate is positioned and mounted on the electronic component by means of the positioning portion.
  • the positioning portion is a positioning hole or a positioning post provided on the substrate.
  • the substrate is prepared by PC, PVC, PET, aluminum foil, copper foil, graphite sheet or paper, and the thickness of the substrate is 0.05-5 mm.
  • the advantages of the present invention are: 1.
  • the installation of the thermal pad through the fixing hole can realize the rapid and accurate positioning of the thermal pad on the substrate, and the thermal pad can be inserted into the side wall of the thermal pad through the protruding mechanism.
  • Fixing in the fixing hole can not only improve the installation efficiency of the thermal pad, because the protruding mechanism is inserted on the side of the thermal pad, ensuring that the thermal pad does not shake in the radial direction of the fixing hole, and improving the fixing of the thermal pad Effect, to ensure the overall heat conduction efficiency of the substrate, the fixed holes are arranged in a matrix on the substrate, which is beneficial to the integral molding of the fixed holes, reducing the overall processing technology and processing cost of the substrate, and the assembled thermal pad is convenient for online inspection and avoids
  • the missing installation of the thermal pad can greatly improve the thermal conductivity of the thermal pad, and can be widely used in communication base station units, microelectronic equipment and other fields;
  • the bumps are arranged into at least two pieces and evenly distributed on the fixing holes, which can ensure the stability of the thermal pads, avoid the problem of the thermal pads tilting up and down, and ensure the thermal conductivity of the thermal pads;
  • the bumps and the fixing holes are integrated into one piece, which can improve the connection strength between the bumps and the fixing holes, avoid the misalignment of the bumps during the installation of the thermal pad, facilitate the insertion of the puncture point into the thermal pad, and simplify the projection. Installation process of blocks and fixing holes;
  • the fixed hole as a polygonal hole or a round hole or a trapezoidal hole, which can be set according to different application scenarios, and can meet different product requirements;
  • the positioning part can realize the accurate positioning and mounting of the substrate on the electronic components, and the rapid assembly of the entire substrate according to the needs of the client's site;
  • the positioning part is set as a positioning hole or a positioning post, which can quickly realize the fast installation and fixing of the substrate, and the structure of the positioning part can be selected according to different installation environments, and the practical performance is good;
  • the substrate is made of PC or PVC or PET or aluminum foil or copper foil or graphite sheet or paper, and the thickness of the substrate is set to 0.05 to 5mm, which can make the entire substrate meet the UL-94V0 flame retardant level, which can ensure The substrate is not deformed in size at a high temperature of 200 ° C, which can meet the needs of different customers. It has good practical performance and can be determined according to the layout of the application scenario.
  • FIG. 1 is a schematic structural diagram of an array structure of an array of thermally conductive pads according to the present invention
  • FIG. 2 is a schematic structural diagram of a substrate of the present invention.
  • 1 base plate 2 thermal pads, 3 fixing portions, 31 fixing holes, 32 protruding mechanisms, 4 positioning portions.
  • a thermally conductive pad matrix array structure includes a substrate 1, the substrate 1 includes a fixing portion 3, and the fixing portion 3 includes a fixing hole 31 and an inner wall of the fixing hole 31.
  • the protruding mechanism 32 is inserted into the side wall of the thermal pad 2 through the protruding mechanism 32 to fix the thermal pad in the fixing hole 31, and the fixing holes 31 are arranged in a matrix on the substrate, and the thermal pad is realized through the fixing hole.
  • the installation can realize the rapid and accurate positioning of the thermal pad on the substrate, and the thermal pad can be fixed in the fixing hole by inserting the protruding mechanism into the side wall of the thermal pad, which can not only improve the installation efficiency of the thermal pad, but also because of the protruding mechanism
  • In order to insert on the side of the thermal pad ensure that the thermal pad does not shake in the radial direction of the fixing hole, improve the fixing effect of the thermal pad, ensure the thermal conductivity of the entire substrate, and arrange the fixing holes in a matrix on the substrate. It is beneficial to the integral molding of the fixing holes, reducing the overall processing technology and processing cost of the substrate, and the assembled thermal pad is convenient for online inspection, avoiding the missing installation of the thermal pad, and can greatly improve the conductivity.
  • the thermal conductivity of thermal pads can be widely used in communication base station units, microelectronic equipment and other fields.
  • the protruding mechanism includes a bump
  • the bump is provided with a spike point inserted into a side wall of the thermal pad, and the bump increases the contact area between the spike point and the fixing hole, and reduces the installation of the thermal pad.
  • the breakage and damage of the puncture point at the time improves the overall installation efficiency.
  • the protruding mechanism includes four bumps, and the bumps are evenly distributed on the fixing hole, which can ensure the stability of the thermal pad and avoid heat conduction.
  • the gasket has a problem of tilting up and down to ensure the thermal conductivity of the thermal pad.
  • the bump is integrally formed with the fixing hole, which can improve the connection strength between the bump and the fixing hole, and can avoid the displacement of the bump when the thermal pad is installed. Facilitate the insertion of the thermally conductive gasket at the point of stabbing, and also simplify the installation process of the bump and the fixing hole.
  • the fixing hole 31 is a round hole, which is convenient for processing the round hole, which is beneficial to the integral molding of the bumps.
  • the fixing hole 31 can be set into a polygonal hole or a trapezoidal hole according to different application scenarios, which can meet different product requirements.
  • the fixing holes 31 are arranged in a matrix on the substrate 1, which facilitates the rapid installation of the thermal pad 2, and facilitates the integral molding of the fixing holes 31, and facilitates the rapid processing of the fixing holes 31.
  • the substrate 1 further includes a positioning portion 4.
  • the substrate 1 is positioned and mounted on the electronic component by means of the positioning portion 4, so that the substrate can be accurately positioned and mounted on the electronic component, and can be implemented according to the needs of the client site. Quick assembly of the entire substrate.
  • the shape of the substrate 1 can be set according to different electronic components, such as rectangular, circular, or other shapes that are convenient for processing.
  • the substrate 1 is preferably rectangular, and the positioning portion 4 is arranged at the four corners of the substrate 1, which can ensure the stability of the installation of the substrate 1.
  • the positioning portion 4 is a positioning hole provided on the substrate 1, which can quickly achieve fast installation and fixation of the substrate 1, and the positioning hole can
  • the integrated processing with the fixing hole simplifies the overall processing process of the substrate, reduces the processing cost, and the number of the positioning portions 4 and the position of the positioning portions 4 on the substrate can be selected according to different installation environments.
  • the substrate 1 is prepared by PC or PVC or PET or aluminum foil or copper foil or graphite sheet or paper. And the thickness of the substrate 1 is 0.05 to 5 mm.
  • the substrate 1 is preferably made of PC, PVC, or PET, which can meet different customer requirements, has good practical performance, and can be used according to the application scenario. Arranged.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明涉及一种导热垫片矩阵排布阵列式结构，包括基板，所述基板包括固定部，所述固定部包括固定孔和设置在固定孔内壁上的突出机构，通过突出机构插入导热垫片的侧壁使导热垫片固定在固定孔内，且所述固定孔在基板上呈矩阵排布；本发明的优点：通过固定孔实现导热垫片的安装，能实现导热垫片快速准确的定位在基板上，并通过突出机构插入导热垫片的侧壁使导热垫片固定在固定孔内，不仅能提高导热垫片的安装效率，提高导热垫片的固定效果，装配后的导热垫片便于在线检查，避免了导热垫片的漏装，能大幅的提高导热垫片的导热效率，可广泛适用于通讯基站单元，微电子设备等领域。

Description

一种导热垫片矩阵排布阵列式结构 技术领域
本发明涉及一种导热垫片矩阵排布阵列式结构。
背景技术
导热垫片是电子元器件散热的关键组件。在电子器件表面和散热器之间存在极细微的凹凸不平的空隙，如果将他们直接安装在一起，它们间的实际接触面积大约只有散热器底座面积的10％，其余均为空气间隙。由于空气是热的不良导体，将在电子元件与散热器间形成接触热阻，降低散热器的效能。导热垫片通过填充于电子发热器件与散热器之间以排除其中的空气，并在其间建立有效的热传导通道，降低接触热阻，提升传热性能。
高频通讯天线(如38Hz，39Hz)排布较为紧密且数量较多，一般采用32阵列，64阵列，128阵列，且尺寸较小，一般为3x3mm，所以人工装配易发生定位不准，易漏装、错装；而机械人装配，导热垫片易变形，或装配完成的导热产品也会容易移动、错位，甚至掉落，而且机器人投入成本较高，另外，上述两种装配方式效率极低，需每个阵子逐一装配，时间较长。
发明内容
本发明要解决的技术问题就是提供一种导热垫片矩阵排布阵列式结构，解决现有导热垫片在装配时存在装配效率低的技术问题。
为了解决上述技术问题，本实用新型是通过以下技术方案实现的：一种导热垫片矩阵排布阵列式结构，包括基板，所述基板包括固定部，所述固定部包 括固定孔和设置在固定孔内壁上的突出机构，通过突出机构插入导热垫片的侧壁使导热垫片固定在固定孔内，且所述固定孔在基板上呈矩阵排布。
优选的，所述突出机构包括凸块，所述凸块上设有插入导热垫片的侧壁的尖刺点。
优选的，所述突出机构包括至少两个凸块，所述凸块均匀的分布在固定孔上。
优选的，所述凸块与固定孔一体成型。
优选的，所述固定孔为多边形孔或圆孔或梯形孔。
优选的，所述基板还包括定位部，所述基板依靠定位部定位安装在电子元器件上。
优选的，所述定位部为设置在基板上的定位孔或定位柱。
优选的，所述基板通过PC或PVC或PET或铝箔或铜箔或石墨片或纸张制备而成，且所述基板的厚度为0.05～5mm。
综上所述，本发明的优点：1.通过固定孔实现导热垫片的安装，能实现导热垫片快速准确的定位在基板上，并通过突出机构插入导热垫片的侧壁使导热垫片固定在固定孔内，不仅能提高导热垫片的安装效率，由于突出机构为插入在导热垫片的侧面，确保导热垫片在固定孔的径向方向上不发生晃动，提高导热垫片的固定效果，确保基板整体的导热效率，将固定孔在基板上呈矩阵排布，有利于固定孔的一体成型，减少基板整体的加工工艺和加工成本，且装配后的导热垫片便于在线检查，避免了导热垫片的漏装，能大幅的提高导热垫片的导 热效率，可广泛适用于通讯基站单元，微电子设备等领域；
2.将突出机构设置成具有尖刺点的凸块；通过凸块来增大尖刺点与固定孔的接触面积，减少导热垫片安装时尖刺点的断裂和损坏，提高了整体的安装效率；
3.将凸块设置成至少两块且均匀的分布在固定孔上，能确保导热垫片固定的稳定性，避免导热垫片出现上下倾斜的问题，确保导热垫片的导热性能；
4.将凸块与固定孔设置成一体成型，能提高凸块与固定孔的连接强度，能避免导热垫片安装时凸块的错位，有利于尖刺点插入导热垫片，也简化了凸块与固定孔的安装工艺；
5.将固定孔设置成多边形孔或圆孔或梯形孔，能根据不同的应用场景进行设置，能满足不同的产品需求；
6.定位部的设置，能实现基板准确的定位安装在电子元器件上，且能根据客户端现场的需求实现基板整体的快速装配；
7.将定位部设置成定位孔或定位柱，能快速的实现基板的快速安装固定，能根据不同的安装环境选择定位部的结构，实用性能好；
8.将基板通过PC或PVC或PET或铝箔或铜箔或石墨片或纸张制备而成，且将基板的厚度设置为0.05～5mm，能使基板整体能满足UL-94V0阻燃等级，能确保基板在200℃高温环境下尺寸不变形，能满足不同的客户需求，实用性能好，能根据应用场景的排布而定。
附图说明
图1为本发明一种导热垫片矩阵排布阵列式结构的结构示意图；
图2为本发明基板的结构示意图。
附图标记：
1基板、2导热垫片、3固定部、31固定孔、32突出机构、4定位部。
具体实施方式
如图1、图2所示，一种导热垫片矩阵排布阵列式结构，包括基板1，所述基板1包括固定部3，所述固定部3包括固定孔31和设置在固定孔31内壁上的突出机构32，通过突出机构32插入导热垫片2的侧壁使导热垫片固定在固定孔31内，且所述固定孔31在基板上呈矩阵排布，通过固定孔实现导热垫片的安装，能实现导热垫片快速准确的定位在基板上，并通过突出机构插入导热垫片的侧壁使导热垫片固定在固定孔内，不仅能提高导热垫片的安装效率，由于突出机构为插入在导热垫片的侧面，确保导热垫片在固定孔的径向方向上不发生晃动，提高导热垫片的固定效果，确保基板整体的导热效率，将固定孔在基板上呈矩阵排布，有利于固定孔的一体成型，减少基板整体的加工工艺和加工成本，且装配后的导热垫片便于在线检查，避免了导热垫片的漏装，能大幅的提高导热垫片的导热效率，可广泛适用于通讯基站单元，微电子设备等领域。
另外，所述突出机构包括凸块，所述凸块上设有插入导热垫片的侧壁的尖刺点，通过凸块来增大尖刺点与固定孔的接触面积，减少导热垫片安装时尖刺点的断裂和损坏，提高了整体的安装效率，所述突出机构包括四个凸块，所述凸块均匀的分布在固定孔上，能确保导热垫片固定的稳定性，避免导热垫片出 现上下倾斜的问题，确保导热垫片的导热性能，所述凸块与固定孔一体成型，能提高凸块与固定孔的连接强度，能避免导热垫片安装时凸块的错位，有利于尖刺点插入导热垫片，也简化了凸块与固定孔的安装工艺。
所述固定孔31为圆孔，圆孔加工方便，有利于凸块的一体成型，且所述固定孔31能根据不同的应用场景进行设置成多边形孔或梯形孔，能满足不同的产品需求，所述固定孔31在基板1上呈矩阵排布，有利于导热垫片2的快速安装，且有利于固定孔31的一体成型，有利于固定孔31的快速加工。
然后，所述基板1还包括定位部4，所述基板1依靠定位部4定位安装在电子元器件上，能实现基板准确的定位安装在电子元器件上，且能根据客户端现场的需求实现基板整体的快速装配，另外，基板1的形状可根据不同的电子元器件进行设置，如矩形、圆形或其他便于加工的形状，本实施例中优选所述基板1为矩形，所述定位部4设置在基板1的四个转角处，能确保基板1安装的稳定性，所述定位部4为设置在基板1上的定位孔，能快速的实现基板1的快速安装固定，且定位孔能与固定孔一体加工，简化了基板的整体的加工工艺，降低了加工成本，且定位部4的数量及定位部4在基板上的位置能根据不同的安装环境选择。
另外，为了能使基板1整体能满足UL-94V0阻燃等级，在200℃高温环境下基板1整体的尺寸不变形，基板1通过PC或PVC或PET或铝箔或铜箔或石墨片或纸张制备而成，且所述基板1的厚度为0.05～5mm，而本实施例优选所述基板1通过PC或PVC或PET制备而成，能满足不同的客户需求，实用性能好，能根 据应用场景的排布而定。
除上述优选实施例外，本发明还有其他的实施方式，本领域技术人员可以根据本发明作出各种改变和变形，只要不脱离发明的精神，均应属于本发明所附权利要求所定义的范围。

Claims (8)

  1. 一种导热垫片矩阵排布阵列式结构，包括基板，其特征在于：所述基板包括固定部，所述固定部包括固定孔和设置在固定孔内壁上的突出机构，通过突出机构插入导热垫片的侧壁使导热垫片固定在固定孔内，且所述固定孔在基板上呈矩阵排布。
  2. 根据权利要求1所述的一种导热垫片矩阵排布阵列式结构，其特征在于：所述突出机构包括凸块，所述凸块上设有插入导热垫片的侧壁的尖刺点。
  3. 根据权利要求2所述的一种导热垫片矩阵排布阵列式结构，其特征在于：所述突出机构包括至少两个凸块，所述凸块均匀的分布在固定孔上。
  4. 根据权利要求2或3所述的一种导热垫片矩阵排布阵列式结构，其特征在于：所述凸块与固定孔一体成型。
  5. 根据权利要求4所述的一种导热垫片矩阵排布阵列式结构，其特征在于：所述固定孔为多边形孔或圆孔或梯形孔。
  6. 根据权利要求1-3任一项所述的一种导热垫片矩阵排布阵列式结构，其特征在于：所述基板还包括定位部，所述基板依靠定位部定位安装在电子元器件上。
  7. 根据权利要求6所述的一种导热垫片矩阵排布阵列式结构，其特征在于：所述定位部为设置在基板上的定位孔或定位柱。
  8. 根据权利要求1-3任一项所述的一种导热垫片矩阵排布阵列式结构，其特征在于：所述基板通过PC或PVC或PET或铝箔或铜箔或石墨片或纸张制备而成，且所述基板的厚度为0.05～5mm。
PCT/CN2018/099956 2018-08-10 2018-08-10 一种导热垫片矩阵排布阵列式结构 WO2020029248A1 (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2335267Y (zh) * 1998-06-23 1999-08-25 钛钇科技股份有限公司 蜂巢式散热器
CN201430739Y (zh) * 2009-03-30 2010-03-24 英业达科技有限公司 板卡与散热器的组合装置
CN204880052U (zh) * 2015-07-16 2015-12-16 深圳市同一方光电技术有限公司 一种led光源的快速散热结构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US9119327B2 (en) * 2010-10-26 2015-08-25 Tdk-Lambda Corporation Thermal management system and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2335267Y (zh) * 1998-06-23 1999-08-25 钛钇科技股份有限公司 蜂巢式散热器
CN201430739Y (zh) * 2009-03-30 2010-03-24 英业达科技有限公司 板卡与散热器的组合装置
CN204880052U (zh) * 2015-07-16 2015-12-16 深圳市同一方光电技术有限公司 一种led光源的快速散热结构

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