WO2020022106A1 - Multilayer film and package - Google Patents

Multilayer film and package Download PDF

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Publication number
WO2020022106A1
WO2020022106A1 PCT/JP2019/027680 JP2019027680W WO2020022106A1 WO 2020022106 A1 WO2020022106 A1 WO 2020022106A1 JP 2019027680 W JP2019027680 W JP 2019027680W WO 2020022106 A1 WO2020022106 A1 WO 2020022106A1
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WO
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Prior art keywords
layer
multilayer film
density polyethylene
sealant layer
resin
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PCT/JP2019/027680
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French (fr)
Japanese (ja)
Inventor
藤原 達也
研太 佐々木
智大 中田
惇 松本
俊介 越智
Original Assignee
住友ベークライト株式会社
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Application filed by 住友ベークライト株式会社 filed Critical 住友ベークライト株式会社
Priority to JP2019565969A priority Critical patent/JP6659002B1/en
Priority to CN201980040615.8A priority patent/CN112313077A/en
Publication of WO2020022106A1 publication Critical patent/WO2020022106A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes

Definitions

  • the present invention relates to a multilayer film and a package.
  • This application discloses Japanese Patent Application No. 2018-137395 filed in Japan on July 23, 2018, Japanese Patent Application No. 2019-40869 filed in Japan on March 6, 2019, and July 2, 2019. Priority is claimed based on Japanese Patent Application No. 2019-123818 filed in Japan, the contents of which are incorporated herein by reference.
  • deep-drawn packages (hereinafter also referred to as “deep-drawn packages”) have been used as medical packages.
  • the deep-drawing package has a bottom material composed of a multilayer film having a concave portion formed in the center and a lid material composed of a nonwoven fabric made of polyethylene or sterilized paper (hereinafter, also referred to as a “nonwoven fabric made of PE”).
  • a nonwoven fabric made of PE a nonwoven fabric made of PE”.
  • a bottom material used for a medical package a multilayer film in which a polyester film or a nylon film and a heat-sealable resin film are laminated (lamination method) is widely and generally used.
  • a nonwoven fabric made of polyethylene or sterilized paper is used as described above from the viewpoint of air permeability of a sterilizing gas in a sterilizing process.
  • the medical packaging is required to be easily openable depending on the mode of use.
  • a polyethylene nonwoven fabric is selected from the viewpoint that hygiene is emphasized. Since the polyethylene nonwoven fabric coated with an adhesive and imparted easy-opening properties is expensive and the gas permeability is reduced, the easy peeling function is provided to the side of the multilayer film sealed with the polyethylene nonwoven fabric.
  • An easily peelable resin layer hereinafter, also referred to as an “easy peel layer” is provided on a sealing side with a nonwoven fabric made of PE or the like as a multilayer film used as a bottom material in order to impart easy-opening properties to a medical package. Is known (Patent Document 1).
  • Patent Document 2 Also known is a co-extruded multilayer film for deep drawing, comprising a polyamide resin, a nonwoven fabric or sterilized paper made of polyethylene at 135 ° C. or less and a seal layer capable of heat sealing with a seal layer, and an easy peel layer having delamination property with the seal layer.
  • a multilayer film as a bottom material used for a medical package requires a proper sealing strength when heat-sealing with sterilized paper as a lid material. If a part of the sterilized paper remains on the medical device, the so-called paper residue occurs, paper fibers may adhere to the medical instruments etc. stored in the medical package and enter the body, Hygiene problems such as lowering occur.
  • the present invention has been made in view of the above circumstances, and when heat-sealed with sterilized paper, while ensuring an appropriate sealing strength, a multilayer film that can be used as a bottom material that does not generate paper residue on the peeled surface, and It is an object to provide a package.
  • the present invention employs the following configurations.
  • the sealant layer further contains low-density polyethylene, and a mass ratio of the linear low-density polyethylene to the low-density polyethylene is in a range of 50:50 to 99: 1.
  • the molecular weight distribution (Mw / Mn) of the linear low density polyethylene contained in the sealant layer is 7.0 or less, and the number average molecular weight Mn of the linear low density polyethylene is 20,000 or more.
  • the multilayer film according to any one of [1] to [7] which can be heat-sealed with sterilized paper in a temperature range of 135 to 155 ° C.
  • the package according to [9], wherein a seal strength between the multilayer film and the sterilized paper is 1.0 to 7.7 (N / 15 mm).
  • the multilayer film of the present invention includes at least a sealant layer provided to be a surface layer, wherein the sealant layer contains at least linear low-density polyethylene, and Since the density of the low-density polyethylene is 0.93 or more, the package in which the multilayer film and the sterilized paper are heat-sealed, when the sterilized paper is peeled off while ensuring appropriate sealing strength, the bottom material is peeled off.
  • This has an excellent effect that it is possible to suppress the occurrence of so-called paper residue, which is a part of the sterilized paper remaining on the surface, and to provide a package having no hygiene problems.
  • BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional schematic diagram of the multilayer film 1 which is one Embodiment to which this invention is applied.
  • BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional schematic diagram of the multilayer film 1 which is one Embodiment to which this invention is applied.
  • FIG. 1 is a schematic cross-sectional view of a multilayer film 1 according to an embodiment to which the present invention is applied.
  • a multilayer film 1 of the present embodiment has a schematic configuration including a sealant layer 2 provided as a surface layer, and a base material layer 3 provided adjacent to the sealant layer 2.
  • the multilayer film 1 of the present embodiment includes a sealant layer 2 provided as a surface layer, a base layer 3 provided adjacent to the sealant layer 2, and a base layer 3. It may be schematically configured to include another resin layer laminated thereon.
  • the multilayer film 1 of the present embodiment can be used as a film for a package, particularly for a bottom material of a medical package.
  • the sealant layer 2 is a resin layer provided to be joined to sterilized paper to be joined by heat sealing and to provide easy-openability.
  • the sealant layer 2 contains at least linear low-density polyethylene, and the linear low-density polyethylene has a density of 0.93 or more, preferably 0.93 or more and 0.98 or less, more preferably 0.93 or more. 0.95 or less.
  • the resin that can be used for the sealant layer 2 is not particularly limited as long as it is a resin containing linear low-density polyethylene (LLDPE) having the above density, but includes a metallocene-catalyzed linear low-density polyethylene (mLLDPE). Resins are preferred.
  • LLDPE linear low-density polyethylene
  • mLLDPE metallocene-catalyzed linear low-density polyethylene
  • Resins are preferred.
  • the linear low-density polyethylene (LLDPE) having the above density a resin having a low detection amount of a low-molecular-weight volatile component by GC-MS is preferable. If the low-molecular-weight volatile component is small, no gas is generated during molding, and equipment contamination can be prevented.
  • the detection amount of the low molecular weight volatile component is preferably 0.1 wt% or less, and more preferably 0.05 wt% or less.
  • the linear low-density polyethylene (LLDPE) having the above density is preferably a resin having a low molecular weight component content in the molecular weight distribution (Mw / Mn) by GPC.
  • Mw / Mn molecular weight distribution
  • the molecular weight distribution (Mw / Mn) by GPC is preferably 7.0 or less, more preferably 4.5 or less.
  • the number average molecular weight Mn is preferably 20,000 or more, more preferably 23,000 or more.
  • the linear low-density polyethylene (LLDPE) may have one melting point peak or two or more melting point peaks measured by DSC, and the highest melting point peak temperature is 120 ° C. or higher. preferable. More preferably, a resin having the highest melting point peak temperature of 120 ° C. or higher and the lowest melting point peak not present at 100 ° C. or lower is preferable. More preferably, a resin having a highest melting point peak temperature of 120 ° C. or higher and a lowest melting point peak not present at 110 ° C. or lower is preferable. According to the above, the resin is not melted by heating at the time of molding, and equipment contamination can be prevented.
  • the sealant layer 2 may further contain low-density polyethylene.
  • the mass ratio of the linear low-density polyethylene to the low-density polyethylene in the resin constituting the sealant layer 2 is preferably in the range of 50:50 to 99: 1, The range is more preferably from 60:40 to 99: 1, and even more preferably from 80:20 to 99: 1.
  • the content of the linear low-density polyethylene in the entire resin constituting the sealant layer 2 is preferably 30 to 100% by mass, and more preferably 50 to 100% by mass.
  • the sealant layer 2 further contains low-density polyethylene
  • the total content of linear low-density polyethylene and low-density polyethylene is preferably 30 to 100% by mass, and 50 to 100% by mass. Is more preferred.
  • the content of the linear low-density polyethylene is within the above preferred range, the heat seal strength is more stable, and when the sterilized paper is peeled off, paper residue on the sealant layer 2 is further suppressed.
  • the sealant layer 2 may contain an additive from the viewpoint of improving the low-temperature heat sealability.
  • the additive include a terpene resin (for example, “Hirodine series” manufactured by Yashara Chemical Co., Ltd.).
  • the thickness of the sealant layer 2 is preferably from 3 to 70 ⁇ m, more preferably from 5 to 45 ⁇ m.
  • the thickness is at least the lower limit of the preferred range, a higher seal strength is obtained when heat-sealing with sterilized paper, and when the thickness is at most the lower limit, the effect of easy-opening property is higher when opening. .
  • the base material layer (also referred to as a core layer) 3 is a resin layer provided to be adjacent to the above-described sealant layer 2 for the purpose of imparting flexibility to the multilayer film 1.
  • the resin that can be used for the base material layer 3 is not particularly limited as long as it is a resin that can impart the above function, and examples thereof include a polyethylene-based resin.
  • polyethylene-based resin examples include ethylene homopolymers such as low-density polyethylene (LDPE) resin, linear low-density polyethylene (LLDPE) resin, medium-density polyethylene (MDPE) resin, and high-density polyethylene (HDPE) resin; Ethylene-vinyl acetate copolymer (EVA) resin, ethylene-methyl methacrylate copolymer (EMMA) resin, ethylene-ethyl acrylate copolymer (EEA) resin, ethylene-methyl acrylate copolymer (EMA) resin, ethylene- Ethylene copolymers such as ethyl acrylate-maleic anhydride copolymer (E-EA-MAH) resin, ethylene-acrylic acid copolymer (EAA) resin, ethylene-methacrylic acid copolymer (EMAA) resin; ionomers (ION) ) Resin, etc., alone or two or more types The combined used in.
  • EVA Eth
  • the above-mentioned LLDPE is preferable.
  • LLDPE As the polyethylene resin, the above-mentioned LLDPE is preferable.
  • LLDPE As the resin contained in the base material layer 3, more stable heat seal strength (a synergistic effect with the resin containing linear low-density polyethylene used in the sealant layer 2) can be obtained.
  • the base material layer 3 may be only one layer or, as shown in FIG. 2, may be two or more layers. For example, by forming the base layer 3 from a plurality of layers made of different materials, characteristics such as hardness of the base layer 3 can be adjusted. Examples of the two or more base material layers include a base material layer having two layers of LDPE and LLDPE.
  • the thickness of the base material layer 3 is preferably from 15 to 150 ⁇ m, more preferably from 30 to 100 ⁇ m. When the thickness is not less than the lower limit of the preferred range, the flexibility of the multilayer film 1 is improved, and when it is not more than the upper limit, more stable sealing strength can be obtained.
  • the thickness ratio between the sealant layer 2 and the base material layer 3 is preferably in the range of 1: 0.5 to 1:15, and is preferably in the range of 1: 0.5 to 1:15. It is more preferably in the range of 1:10, more preferably in the range of 1: 2 to 1:10.
  • the above-mentioned ratio is at least the lower limit of the preferable range, an effect of preventing curling of the package is obtained, and when it is at most the upper limit, more stable sealing strength is obtained.
  • the multilayer film 1 of the present embodiment may include another resin layer other than the sealant layer 2 and the base material layer 3 as long as the effects of the present invention are not impaired.
  • an adhesive resin layer 4 and a pinhole-resistant layer 5 are laminated on the base layer 3 as other resin layers.
  • the adhesive resin layer 4 is a resin layer provided to increase the interlayer strength of each resin layer constituting the multilayer film 1 other than the layer between the sealant layer 2 and the base material layer 3 described above.
  • the adhesive resin applicable to the adhesive resin layer 4 a known adhesive olefin resin, for example, an adhesive polypropylene resin, an adhesive polyethylene resin, or the like is used.
  • the adhesive resin layer 4 may contain an antioxidant to prevent its oxidation.
  • a known antioxidant for example, a hindered phenol-based antioxidant, a phosphorus-based antioxidant, a thioether-based antioxidant, or the like is used alone or in combination of two or more.
  • the adhesive resin layer 4 may contain cellulose nanofibers from the viewpoint of improving adhesiveness and mechanical properties.
  • the thickness of the adhesive resin layer 4 is not particularly limited as long as each layer can be joined with a required adhesive strength, but is preferably 2 to 30 ⁇ m, more preferably 5 to 25 ⁇ m.
  • the pinhole-resistant layer 5 is a resin layer provided for imparting pinhole resistance to the multilayer film 1.
  • the pinhole-resistant layer 5 preferably contains a polyamide resin from the viewpoint of improving the pinhole resistance.
  • the polyamide resin contained in the anti-pinhole layer 5 include 4-nylon, 6-nylon, 7-nylon, 11-nylon, 12-nylon, 46-nylon, 66-nylon, 69-nylon, and 610-nylon Nylon, 611-nylon, 612-nylon, 6T-nylon, 6I nylon, 6-nylon and 66-nylon copolymer (nylon 6/66), 6-nylon and 610-nylon copolymer, 6-nylon and 611-nylon Copolymer, copolymer of 6-nylon and 12-nylon (nylon 6/12), copolymer of 6-nylon and 612 nylon, copolymer of 6-nylon and 6T-nylon, copolymer of 6-nylon and 6I-nylon, 6-nylon
  • the total thickness of the pinhole-resistant layer 5 is not particularly limited, but is preferably 10 to 90 ⁇ m, and more preferably 12 to 50 ⁇ m.
  • the multilayer film 1 of the present embodiment may contain a known lubricant or additive in the above-described sealant layer 2 and base material layer 3 for the purpose of preventing slippage and blocking and imparting anti-fogging property as needed. You may give.
  • organic lubricants such as oleic amide and erucamide
  • inorganic lubricants such as silica, zeolite and calcium carbonate
  • a known surfactant or the like can be appropriately used.
  • the method for producing the above-mentioned multilayer film 1 is not particularly limited, but a co-extrusion T-die method such as a feed block method or a multi-manifold method in which a resin or the like as a raw material is melt-extruded by several extruders, An air-cooled or water-cooled co-extrusion inflation method and a laminating method are mentioned. Among them, a method of forming a film by a co-extrusion T-die method is particularly preferable because it is excellent in controlling the thickness of each layer.
  • Examples of the laminating method include a dry laminating method, a laminating method, a hot laminating method, a wet laminating method, and a thermal (thermal) laminating method in which a single-layer sheet or film forming each layer is bonded using an appropriate adhesive. And their methods can be used in combination. Moreover, you may laminate
  • the package of the present embodiment includes the above-described multilayer film and sterile paper, and at least a part of the sealant layer of the multilayer film is heat-sealed to the surface of the sterile paper.
  • the sterilizing paper applicable to the package of the present embodiment is heat-sealable with a sealant layer, has air permeability, prevents bacteria from passing therethrough (has a fungicidal property), and is sterilized.
  • the sheet is not particularly limited as long as it can be processed and is a sheet mainly composed of paper. Examples of the sterilized paper include Medica D (manufactured by Oji F-Tex).
  • the sterilized paper has small holes that are capable of exhibiting air permeability and bacterial barrier properties. Specifically, it is preferably made of sterilized paper having a fiber weight in the range of 0.0001 to 20 dtex and a basis weight of 10 to 300 g / m 2 .
  • the package of the present embodiment can be used as a deep-drawn package by deep-drawing the bottom material, filling it with contents such as gauze, covering it with a lid, and heat-sealing.
  • contents such as gauze
  • a lid a lid
  • heat-sealing a good deep-drawn package can be obtained.
  • the package of the present embodiment can be manufactured by bonding a multilayer film used as a bottom material and sterilized paper used as a lid material by bonding means such as heat sealing.
  • a package can be produced by heat-sealing the multilayer film and sterilized paper, preferably in a temperature range of 135 to 155 ° C.
  • the sealing strength between the multilayer film 1 and the sterilized paper is preferably 1.0 to 7.7 N / 15 mm, and is 1.2 to 6.0 N / 15 mm. Is more preferable.
  • the sealing property of the package is higher, and if it is not more than the upper limit, better openability (such as tearing of fibers and fluffing during peeling). Suppression) is obtained.
  • the sealant layer provided to be the surface layer contains at least linear low-density polyethylene, and the density of the linear low-density polyethylene. Is 0.93 or more, the package obtained by heat-sealing the multilayer film and the sterilized paper has an appropriate sealing strength, and when the sterilized paper is peeled off, paper residue remains on the peeling surface of the bottom material. It has an excellent effect that generation can be suppressed and a package having no hygiene problem can be provided.
  • the package of the present embodiment is configured to include the multilayer film 1 and sterilized paper, and the sealing strength between the multilayer film 1 and the sterilized paper is 1.0 to 7.7 (N / 15 mm). Are more excellent in terms of seal strength and easy peelability.
  • the multilayer film 1 shown in FIG. 1 has a configuration in which the sealant layer 2 and the base material layer 3 are laminated in this order, but this is an example, and the present invention is not limited to this.
  • the multilayer film according to one embodiment of the present invention includes a sealant layer 2, a base layer 30, a base layer 31, an adhesive resin layer 4, and a pinhole-resistant layer 5 laminated in this order.
  • the adhesive resin layer 4 and the pinhole-resistant layer 5 may be alternately laminated two by two, or three or more layers may be alternately laminated. It may be.
  • a layer having another function may be newly provided between each layer or on the outermost layer opposite to the sealant layer 2.
  • a resin layer made of an ethylene-vinyl alcohol copolymer resin may be provided.
  • a resin layer made of a polypropylene-based resin (PP) may be provided.
  • PP polypropylene-based resin
  • a resin layer composed of an ethylene-vinyl acetate copolymer layer (EVA layer) or a polyethylene layer (PE layer) may be provided.
  • Example 1 A multilayer film having the configuration shown in FIG. 1 and further including the adhesive resin layer and the pinhole-resistant layer in the lamination order shown in FIG. 2 was produced by the following procedure. First, nylon (manufactured by Ube Industries, product number: 1022B) was prepared as a resin contained in the pinhole-resistant layer. Further, as a resin contained in the adhesive resin layer (hereinafter, simply referred to as “adhesive layer”), an adhesive polyethylene resin (manufactured by Mitsui Chemicals, Inc., product number: NF536) was prepared.
  • polyethylene manufactured by Ube Maruzen Polyethylene Corporation, product number: F222NH
  • a resin contained in the sealant layer a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., Ltd., product number: 4040FC, melting point 126 ° C.) and a low-density polyethylene (LDPE) (Ube Maruzen Polyethylene Co., Ltd.) (Product number: F222NH, melting point: 110 ° C.), and these were mixed (kneaded) in a ratio of 80:20.
  • mLLDPE linear low-density polyethylene
  • LDPE low-density polyethylene
  • the density of the resin contained in the resulting sealant layer was 0.938 g / cm 3.
  • a multilayer film having a four-layer structure in the order of sealant layer / base layer / adhesive resin layer / pinhole-resistant layer was produced (laminated) by extrusion.
  • the thickness of the sealant layer was 12 ⁇ m
  • the thickness of the base material layer was 68 ⁇ m
  • the thickness of the adhesive resin layer was 14 ⁇ m
  • the thickness of the pinhole-resistant layer was 16 ⁇ m.
  • the density of the resin contained in the sealant layer was measured using a specific gravity measuring device (Shibayama Scientific Instruments) based on the density gradient tube method of JIS K7112.
  • the melting point was measured by differential scanning calorimetry (DSC, DSC6200, manufactured by Hitachi High-Tech Science Corporation) in a nitrogen atmosphere from 25 ° C to 300 ° C, at a rate of 5 ° C / min, and then to 25 ° C. It was cooled at a rate of ⁇ 50 ° C./min, heated again from 25 ° C. to 300 ° C. at a rate of 5 ° C./min, and measured at the time of re-heating to obtain a temperature.
  • DSC differential scanning calorimetry
  • Example 2 As the resin contained in the sealant layer, instead of the metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., Ltd., product number: 4040FC), a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (Sumitomo Chemical)
  • mLLDPE metallocene-catalyzed linear low-density polyethylene
  • FV407 product number: FV407, melting point: 124 ° C.
  • the density of the resin contained in the resulting sealant layer (g / cm 3) was 0.930 g / cm 3.
  • the thickness of the sealant layer was 14 ⁇ m
  • the thickness of the base material layer was 68 ⁇ m
  • the thickness of the adhesive resin layer was 14 ⁇ m
  • the thickness of the pinhole-resistant layer was 16 ⁇ m.
  • Example 3 As the resin contained in the sealant layer, instead of the metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., part number: 4040FC), a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (prime polymer) (Product number: SP3530, melting point: 97, 121, 125 ° C.), except that sealant layer / base material layer / adhesive resin layer / pinhole-resistant layer were used in the same manner as in Example 1. A multilayer film having the configuration was produced (laminated) by extrusion.
  • mLLDPE metallocene-catalyzed linear low-density polyethylene
  • the density of the resin contained in the resulting sealant layer (g / cm 3) was 0.931 g / cm 3.
  • the thickness of the sealant layer was 14 ⁇ m
  • the thickness of the base material layer was 68 ⁇ m
  • the thickness of the adhesive resin layer was 14 ⁇ m
  • the thickness of the pinhole-resistant layer was 16 ⁇ m.
  • Example 4 As the resin contained in the sealant layer, low-density polyethylene (LDPE) was not used, and a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., Ltd., product number: 4040FC, melting point 126 ° C., density 0.938 g) / Cm 3 ), except that only a sealant layer / substrate layer / adhesive resin layer / pinhole-resistant layer was formed in the same manner as in Example 1 except that only a multilayer film was extruded. (Laminated). The density of the resin contained in the resulting sealant layer (g / cm 3) was 0.938 g / cm 3. The thickness of the sealant layer was 12 ⁇ m, the thickness of the base material layer was 68 ⁇ m, the thickness of the adhesive resin layer was 14 ⁇ m, and the thickness of the pinhole-resistant layer was 16 ⁇ m.
  • mLLDPE metallocen
  • mLLDPE metallocene-catalyzed linear low-density polyethylene
  • DLD metallocene-catalyzed linear low-density polyethylene
  • sealant layer / base layer / adhesive resin layer / pinhole-resistant layer was used in the same manner as in Example 1.
  • a multilayer film having a layer configuration was produced (laminated) by extrusion.
  • the density (g / cm 3 ) of the resin contained in the obtained sealant layer was 0.915 g / cm 3 .
  • the thickness of the sealant layer was 14 ⁇ m
  • the thickness of the base material layer was 68 ⁇ m
  • the thickness of the adhesive resin layer was 14 ⁇ m
  • the thickness of the pinhole-resistant layer was 16 ⁇ m.
  • the evaluation of the low molecular weight volatile component is performed by pyrolysis-GC-MS (pyrolyzer: Frontier Laboratories, PY-2020iD type heating furnace type pyrolyzer, GC: Agilent Technologies, 6890N type gas chromatograph, MS: Agilent) Using a 5975B type mass detector (manufactured by Technology Co., Ltd.), about 27 mg of a linear low-density polyethylene sample contained in the sealant layer was heated under a heating atmosphere of helium at 120 ° C. for 10 minutes.
  • GC-MS measurement was performed using an acetone-diluted solution of n-decane having a known concentration, the peak area values of the generated gas components were compared, and the converted quantification values for the standard sample were summed up. It was calculated as a weight fraction relative to the sample weight.
  • Table 2 shows the weight fraction with respect to the sample weight of each linear low-density polyethylene in Examples and Comparative Examples.
  • the molecular weight distribution (Mw / Mn) of the linear low-density polyethylenes of Examples and Comparative Examples was measured using a GPC apparatus (Apparatus: PL-GPC220 manufactured by Agilent, column: Agilent PLgel Olexis x 2 + Guard). After the linear low-density polyethylene of the example was eluted with orthodichlorobenzene, it was injected into a column at a temperature of 145 ° C, a concentration of 0.1 wt / vol%, and a flow rate of 1.0 ml / min, and the amount of elution was detected by a differential refractometer.
  • Table 3 shows the molecular weight distribution (Mw / Mn) and the number average molecular weight (Mn) of the linear low-density polyethylenes of Examples and Comparative Examples. In the table, "-" indicates that the evaluation has not been performed.
  • the sealing strength was higher than when the sealing temperature was 130 ° C.
  • the case where the sealing temperature is 140 ° C. and 150 ° C. is particularly excellent in both the high sealing strength and the effect of suppressing the residual paper on the peeled surface.
  • Comparative Examples 1 to 3 in any of the evaluation samples having a sealing temperature of 130 ° C. or higher, a remarkable paper residue on the peeled surface occurred. In particular, in Comparative Example 3, in all the evaluation samples having a sealing temperature of 130 ° C. or higher, a remarkable paper residue occurred on the peeled surface.
  • Table 2 shows the results of pyrolysis-GC-MS for Examples 1, 3 and 4. From these results, it can be seen that Examples 1 and 4 have a smaller amount of low molecular weight volatile components by GC-MS as compared with Example 3, so that less gas is generated during molding and equipment contamination can be further prevented. Inferred.
  • Example 3 shows the evaluation of equipment contamination with a press machine for Examples 1 to 3 and Comparative Examples 1 to 3. From these results, it can be seen that in Example 3 in which the amount of low-molecular-weight volatile components in GC-MS is larger than that in Example 1, the migration of low-molecular-weight volatile components is larger and the equipment is more easily contaminated.
  • Table 2 shows melting points (melting point peak temperatures) of Examples 1 to 4 and Comparative Examples 1 to 3 based on DSC measurement results. From these results, Examples 1, 2 and 4 have the highest melting point peak temperature of 120 ° C. or higher and the lowest melting point peak does not exist at 100 ° C. or lower as compared with Example 3, thereby further preventing equipment contamination. It is speculated that it can be done.
  • Examples 1 and 4 have narrower molecular weight distributions and smaller amounts of low molecular weight components than those of Example 3, and It is considered that there is no generation of extraneous matter even when the operation time of the equipment is long because the amount of extraneous matter attached to the hot plate is small and the production equipment can be prevented from being contaminated.
  • the multilayer film and the package of the present invention can be used as a package for medical devices such as gauze and catheter and medical devices.

Abstract

The present invention is: a multilayer film (1) provided with at least a sealant layer (2) provided so as to be a surface layer, the sealant layer (2) including at least straight-chain low-density polyethylene, and the density of the straight-chain low-density polyethylene being 0.93 or greater; and a package provided with the multilayer film (1) and a sterilizing paper, at least a portion of the sealant layer (2) of the multilayer film (1) being heat-sealed to the surface of the sterilizing paper.

Description

多層フィルム及び包装体Multilayer film and package
 本発明は、多層フィルム及び包装体に関する。
 本願は、2018年7月23日に、日本に出願された特願2018-137395号、2019年3月6日に、日本に出願された特願2019-40869号、及び、2019年7月2日に、日本に出願された特願2019-123818号に基づき優先権を主張し、その内容をここに援用する。
The present invention relates to a multilayer film and a package.
This application discloses Japanese Patent Application No. 2018-137395 filed in Japan on July 23, 2018, Japanese Patent Application No. 2019-40869 filed in Japan on March 6, 2019, and July 2, 2019. Priority is claimed based on Japanese Patent Application No. 2019-123818 filed in Japan, the contents of which are incorporated herein by reference.
 近年、医療用包装体として、深絞り成形された包装体(以下、「深絞り包装体」ともいう)が用いられている。深絞り包装体は、中央部に凹部が形成された多層フィルムからなる底材と、ポリエチレン製不織布や滅菌紙等(以下、「PE製不織布等」ともいう)からなる蓋材とがヒートシール等によって接合されている。そして、上述した凹部に、業務用ガーゼや綿棒、医療器具等が収容される。 In recent years, deep-drawn packages (hereinafter also referred to as “deep-drawn packages”) have been used as medical packages. The deep-drawing package has a bottom material composed of a multilayer film having a concave portion formed in the center and a lid material composed of a nonwoven fabric made of polyethylene or sterilized paper (hereinafter, also referred to as a “nonwoven fabric made of PE”). Are joined by And the gauze for business use, a cotton swab, a medical instrument, etc. are stored in the above-mentioned crevice.
 従来、医療用包装体に用いる底材としては、ポリエステル系フィルムやナイロン系フィルムと、ヒートシール可能な樹脂フィルムとをラミネート(ラミネート法)させた多層フィルムが広く一般に使用されている。一方、蓋材としては、滅菌工程における滅菌ガスの通気性の観点から、上述のように、ポリエチレン製不織布や滅菌紙が使用されている。 Conventionally, as a bottom material used for a medical package, a multilayer film in which a polyester film or a nylon film and a heat-sealable resin film are laminated (lamination method) is widely and generally used. On the other hand, as described above, a nonwoven fabric made of polyethylene or sterilized paper is used as described above from the viewpoint of air permeability of a sterilizing gas in a sterilizing process.
 ところで、医療用包装体には、その使用態様により、易開封性が要求されている。また、医療用包装体の蓋材としては、衛生性が重視されるという観点から、ポリエチレン製不織布が選定される。接着剤を塗工し易開封性を付与したポリエチレン製不織布は高価であり、ガス透過性も低下することから、易剥離性機能はポリエチレン製不織布とシールされる多層フィルム側へ付与される。医療用包装体に易開封性を付与するため、底材として用いる多層フィルムとして、PE製不織布等とのシール側に易剥離性の樹脂層(以下、「イージーピール層」ともいう)を設ける構成が知られている(特許文献1)。また、ポリアミド樹脂、135℃以下でポリエチレン製不織布又は滅菌紙とヒートシール可能なシール層、及びシール層との層間剥離性を有するイージーピール層とを有する深絞り成形用共押出多層フィルムが知られている(特許文献2)。 By the way, the medical packaging is required to be easily openable depending on the mode of use. As the lid material of the medical package, a polyethylene nonwoven fabric is selected from the viewpoint that hygiene is emphasized. Since the polyethylene nonwoven fabric coated with an adhesive and imparted easy-opening properties is expensive and the gas permeability is reduced, the easy peeling function is provided to the side of the multilayer film sealed with the polyethylene nonwoven fabric. A structure in which an easily peelable resin layer (hereinafter, also referred to as an “easy peel layer”) is provided on a sealing side with a nonwoven fabric made of PE or the like as a multilayer film used as a bottom material in order to impart easy-opening properties to a medical package. Is known (Patent Document 1). Also known is a co-extruded multilayer film for deep drawing, comprising a polyamide resin, a nonwoven fabric or sterilized paper made of polyethylene at 135 ° C. or less and a seal layer capable of heat sealing with a seal layer, and an easy peel layer having delamination property with the seal layer. (Patent Document 2).
特開2014-162162号公報JP 2014-162162 A 特開2014-19006号公報JP 2014-19006 A
 医療用包装体に用いる底材としての多層フィルムは、蓋材としての滅菌紙とヒートシールする際に、適切なシール強度が必要であるが、滅菌紙を剥離した際に、底材の剥離面に滅菌紙の一部が残る、いわゆる紙残りが発生すると、医療用包装体に収納されている医療器具等に紙の繊維が付着して体内に入る可能性や、繊維が舞ってクリーン度が下がる等の衛生上の問題が生じる。 A multilayer film as a bottom material used for a medical package requires a proper sealing strength when heat-sealing with sterilized paper as a lid material. If a part of the sterilized paper remains on the medical device, the so-called paper residue occurs, paper fibers may adhere to the medical instruments etc. stored in the medical package and enter the body, Hygiene problems such as lowering occur.
 本発明は、上記実情に鑑みなされたものであり、滅菌紙とヒートシールした際に、適切なシール強度を担保しつつ、剥離面に紙残りが発生しない底材として利用可能な多層フィルム、及び包装体を提供することを課題とする。 The present invention has been made in view of the above circumstances, and when heat-sealed with sterilized paper, while ensuring an appropriate sealing strength, a multilayer film that can be used as a bottom material that does not generate paper residue on the peeled surface, and It is an object to provide a package.
 上記の目的を達成するために、本発明は以下の構成を採用した。
[1]表面層となるように設けられたシーラント層を、少なくとも備え、
 前記シーラント層が、少なくとも直鎖状低密度ポリエチレンを含み、かつ、前記直鎖状低密度ポリエチレンの密度が0.93以上である、多層フィルム。
[2]前記シーラント層が、さらに、低密度ポリエチレンを含み、前記直鎖状低密度ポリエチレンと前記低密度ポリエチレンとの質量比が、50:50~99:1の範囲である、[1]に記載の多層フィルム。
[3]前記シーラント層と隣接するように設けられ、ポリエチレン系樹脂を含む基材層を備える、[1]又は[2]に記載の多層フィルム。
[4]前記基材層が、直鎖状低密度ポリエチレンを含む、[3]に記載の多層フィルム。
[5]前記シーラント層と前記基材層との厚みの比が、1:0.5~1:15の範囲である、[3]又は[4]に記載の多層フィルム。
[6]前記シーラント層に含まれる直鎖状低密度ポリエチレンの低分子量揮発成分が0.1wt%以下である、[1]~[5]のいずれか一項に記載の多層フィルム。
[7]前記シーラント層に含まれる直鎖状低密度ポリエチレンの分子量分布(Mw/Mn)が7.0以下であり、かつ、前記直鎖状低密度ポリエチレンの数平均分子量Mnが20000以上である、[1]~[6]のいずれか一項に記載の多層フィルム。
[8]135~155℃の範囲で、滅菌紙とヒートシールが可能である、[1]~[7]のいずれか一項に記載の多層フィルム。
[9][1]~[8]のいずれか一項に記載の多層フィルムと、滅菌紙と、を備え、
 前記多層フィルムのシーラント層の少なくとも一部が前記滅菌紙の表面にヒートシールされた、包装体。
[10]前記多層フィルムと、前記滅菌紙と、のシール強度が、1.0~7.7(N/15mm)である、[9]に記載の包装体。
In order to achieve the above object, the present invention employs the following configurations.
[1] At least a sealant layer provided to be a surface layer,
A multilayer film, wherein the sealant layer contains at least linear low-density polyethylene, and the linear low-density polyethylene has a density of 0.93 or more.
[2] The sealant according to [1], wherein the sealant layer further contains low-density polyethylene, and a mass ratio of the linear low-density polyethylene to the low-density polyethylene is in a range of 50:50 to 99: 1. The multilayer film according to the above.
[3] The multilayer film according to [1] or [2], which is provided so as to be adjacent to the sealant layer and includes a base layer containing a polyethylene resin.
[4] The multilayer film according to [3], wherein the base material layer includes a linear low-density polyethylene.
[5] The multilayer film according to [3] or [4], wherein the thickness ratio of the sealant layer to the base material layer is in the range of 1: 0.5 to 1:15.
[6] The multilayer film according to any one of [1] to [5], wherein the low-molecular-weight volatile component of the linear low-density polyethylene contained in the sealant layer is 0.1% by weight or less.
[7] The molecular weight distribution (Mw / Mn) of the linear low density polyethylene contained in the sealant layer is 7.0 or less, and the number average molecular weight Mn of the linear low density polyethylene is 20,000 or more. And the multilayer film according to any one of [1] to [6].
[8] The multilayer film according to any one of [1] to [7], which can be heat-sealed with sterilized paper in a temperature range of 135 to 155 ° C.
[9] The multilayer film according to any one of [1] to [8], and sterilized paper,
A package wherein at least a part of the sealant layer of the multilayer film is heat-sealed to the surface of the sterilized paper.
[10] The package according to [9], wherein a seal strength between the multilayer film and the sterilized paper is 1.0 to 7.7 (N / 15 mm).
 以上説明したように、本発明の多層フィルムは、表面層となるように設けられたシーラント層を、少なくとも備え、前記シーラント層が、少なくとも直鎖状低密度ポリエチレンを含み、かつ、前記直鎖状低密度ポリエチレンの密度が0.93以上であるため、前記多層フィルムと滅菌紙とをヒートシールした包装体は、適切なシール強度を担保しつつ、滅菌紙を剥離した際に、底材の剥離面に滅菌紙の一部が残る、いわゆる紙残りが発生するのを抑制させることができ、衛生上問題のない包装体を提供できるという優れた効果を有する。 As described above, the multilayer film of the present invention includes at least a sealant layer provided to be a surface layer, wherein the sealant layer contains at least linear low-density polyethylene, and Since the density of the low-density polyethylene is 0.93 or more, the package in which the multilayer film and the sterilized paper are heat-sealed, when the sterilized paper is peeled off while ensuring appropriate sealing strength, the bottom material is peeled off. This has an excellent effect that it is possible to suppress the occurrence of so-called paper residue, which is a part of the sterilized paper remaining on the surface, and to provide a package having no hygiene problems.
本発明を適用した一実施形態である多層フィルム1の断面模式図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional schematic diagram of the multilayer film 1 which is one Embodiment to which this invention is applied. 本発明を適用した一実施形態である多層フィルム1の断面模式図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional schematic diagram of the multilayer film 1 which is one Embodiment to which this invention is applied.
 以下、本発明を適用した一実施形態である多層フィルム及び包装体について詳細に説明する。なお、以下の説明で用いる図面は、特徴をわかりやすくするために、便宜上特徴となる部分を拡大して示している場合があり、各構成要素の寸法比率などが実際と同じであるとは限らない。 Hereinafter, a multilayer film and a package according to an embodiment of the present invention will be described in detail. In addition, in the drawings used in the following description, in order to make the characteristics easy to understand, the characteristic portions may be enlarged for convenience, and the dimensional ratios and the like of the respective components are not necessarily the same as the actual ones. Absent.
<多層フィルム>
 先ず、本発明を適用した一実施形態である多層フィルムの構成について説明する。図1は、本発明を適用した一実施形態である多層フィルム1の断面模式図である。図1に示すように、本実施形態の多層フィルム1は、表面層として設けられたシーラント層2と、シーラント層2と隣接するように設けられた基材層3とを備えて、概略構成されている。また、本実施形態の多層フィルム1は、図2に示すように、表面層として設けられたシーラント層2と、シーラント層2と隣接するように設けられた基材層3と、基材層3上に積層された他の樹脂層とを備えて、概略構成されていてもよい。本実施形態の多層フィルム1は、包装体、特に医療用包装体の底材用のフィルムとして用いることができる。
<Multilayer film>
First, the configuration of a multilayer film according to an embodiment of the present invention will be described. FIG. 1 is a schematic cross-sectional view of a multilayer film 1 according to an embodiment to which the present invention is applied. As shown in FIG. 1, a multilayer film 1 of the present embodiment has a schematic configuration including a sealant layer 2 provided as a surface layer, and a base material layer 3 provided adjacent to the sealant layer 2. ing. Further, as shown in FIG. 2, the multilayer film 1 of the present embodiment includes a sealant layer 2 provided as a surface layer, a base layer 3 provided adjacent to the sealant layer 2, and a base layer 3. It may be schematically configured to include another resin layer laminated thereon. The multilayer film 1 of the present embodiment can be used as a film for a package, particularly for a bottom material of a medical package.
(シーラント層)
 シーラント層2は、接合の対象となる滅菌紙とヒートシールによって接合するとともに、易開封性を付与するために設けられた樹脂層である。シーラント層2は、少なくとも直鎖状低密度ポリエチレンを含み、かつ前記直鎖状低密度ポリエチレンの密度が0.93以上、好ましくは、0.93以上0.98以下、より好ましくは0.93以上0.95以下である。前記直鎖状低密度ポリエチレンの密度が上記範囲の下限値以上であると、滅菌紙と、適切なシール強度のヒートシールが可能であり、かつ、滅菌紙を剥離した際に、剥離面に紙残りが発生するのを抑制させることができる。一方、上記範囲の上限値以下であると、滅菌紙とヒートシールし易くなる。
(Sealant layer)
The sealant layer 2 is a resin layer provided to be joined to sterilized paper to be joined by heat sealing and to provide easy-openability. The sealant layer 2 contains at least linear low-density polyethylene, and the linear low-density polyethylene has a density of 0.93 or more, preferably 0.93 or more and 0.98 or less, more preferably 0.93 or more. 0.95 or less. When the density of the linear low-density polyethylene is equal to or higher than the lower limit of the above range, sterilized paper, heat sealing with an appropriate seal strength is possible, and when the sterilized paper is peeled, paper The occurrence of the remainder can be suppressed. On the other hand, when it is below the upper limit of the above range, heat sealing with sterilized paper becomes easy.
 シーラント層2に用いることが可能な樹脂としては、上記密度を有する直鎖状低密度ポリエチレン(LLDPE)を含む樹脂であれば特に制限されないが、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)を含む樹脂が好ましい。
 上記密度を有する直鎖状低密度ポリエチレン(LLDPE)は、GC-MSでの低分子量揮発成分検出量が少ない樹脂が好ましい。低分子量揮発成分が少ないと成形時にガスが発生せず、設備汚染を防ぐことができる。低分子量揮発成分検出量は0.1wt%以下が好ましく、0.05wt%以下がより好ましい。
 また、上記密度を有する直鎖状低密度ポリエチレン(LLDPE)は、GPCでの分子量分布(Mw/Mn)で低分子量成分含有量が少ない樹脂が好ましい。低分子量成分含有量が少ないと成形時に成形熱板上へ付着異物が発生せず、設備汚染を防ぐことができる。直鎖状低密度ポリエチレン(LLDPE)についてはGPCによる分子量分布(Mw/Mn)の値で7.0以下が好ましく、4.5以下がより好ましい。且つ、数平均分子量Mnは20000以上が好ましく、23000以上がより好ましい。
 また、直鎖状低密度ポリエチレン(LLDPE)は、DSC測定の融点ピークは1つでもよいし、2つ以上のピークを有してもよく、最も高い融点ピーク温度が120℃以上であることが好ましい。より好ましくは、最も高い融点ピーク温度が120℃以上であり、最も低い融点ピークが100℃以下に存在しない樹脂が好ましい。更に好ましくは最も高い融点ピーク温度が120℃以上であり、最も低い融点ピークが110℃以下に存在しない樹脂が好ましい。上記であると、成形時の加熱で樹脂が融けず、設備汚染を防ぐことができる。
The resin that can be used for the sealant layer 2 is not particularly limited as long as it is a resin containing linear low-density polyethylene (LLDPE) having the above density, but includes a metallocene-catalyzed linear low-density polyethylene (mLLDPE). Resins are preferred.
As the linear low-density polyethylene (LLDPE) having the above density, a resin having a low detection amount of a low-molecular-weight volatile component by GC-MS is preferable. If the low-molecular-weight volatile component is small, no gas is generated during molding, and equipment contamination can be prevented. The detection amount of the low molecular weight volatile component is preferably 0.1 wt% or less, and more preferably 0.05 wt% or less.
The linear low-density polyethylene (LLDPE) having the above density is preferably a resin having a low molecular weight component content in the molecular weight distribution (Mw / Mn) by GPC. When the content of the low-molecular-weight component is small, no adhered foreign matter is generated on the molding hot plate during molding, and equipment contamination can be prevented. For linear low density polyethylene (LLDPE), the molecular weight distribution (Mw / Mn) by GPC is preferably 7.0 or less, more preferably 4.5 or less. Moreover, the number average molecular weight Mn is preferably 20,000 or more, more preferably 23,000 or more.
The linear low-density polyethylene (LLDPE) may have one melting point peak or two or more melting point peaks measured by DSC, and the highest melting point peak temperature is 120 ° C. or higher. preferable. More preferably, a resin having the highest melting point peak temperature of 120 ° C. or higher and the lowest melting point peak not present at 100 ° C. or lower is preferable. More preferably, a resin having a highest melting point peak temperature of 120 ° C. or higher and a lowest melting point peak not present at 110 ° C. or lower is preferable. According to the above, the resin is not melted by heating at the time of molding, and equipment contamination can be prevented.
 また、シーラント層2には、さらに低密度ポリエチレンを含んでもよい。 シ ー The sealant layer 2 may further contain low-density polyethylene.
 シーラント層2が、さらに低密度ポリエチレンを含む場合、シーラント層2を構成する樹脂中の直鎖状低密度ポリエチレンと低密度ポリエチレンとの質量比は、50:50~99:1の範囲が好ましく、60:40~99:1の範囲がより好ましく、80:20~99:1の範囲がさらに好ましい。 When the sealant layer 2 further contains low-density polyethylene, the mass ratio of the linear low-density polyethylene to the low-density polyethylene in the resin constituting the sealant layer 2 is preferably in the range of 50:50 to 99: 1, The range is more preferably from 60:40 to 99: 1, and even more preferably from 80:20 to 99: 1.
 シーラント層2を構成する全樹脂中、直鎖状低密度ポリエチレンの含有量は、30~100質量%が好ましく、50~100質量%であることがより好ましい。シーラント層2が、さらに低密度ポリエチレンを含む場合は、直鎖状低密度ポリエチレンと低密度ポリエチレンとの合計含有量が、30~100質量%であることが好ましく、50~100質量%であることがより好ましい。
 直鎖状低密度ポリエチレンの含有量が上記好ましい範囲内であると、ヒートシール強度がより安定し、滅菌紙を剥離した際に、シーラント層2への紙残りがより抑制される。
The content of the linear low-density polyethylene in the entire resin constituting the sealant layer 2 is preferably 30 to 100% by mass, and more preferably 50 to 100% by mass. When the sealant layer 2 further contains low-density polyethylene, the total content of linear low-density polyethylene and low-density polyethylene is preferably 30 to 100% by mass, and 50 to 100% by mass. Is more preferred.
When the content of the linear low-density polyethylene is within the above preferred range, the heat seal strength is more stable, and when the sterilized paper is peeled off, paper residue on the sealant layer 2 is further suppressed.
 シーラント層2は、低温ヒートシール性を向上させる観点から、添加剤を含有していてもよい。添加剤としては、例えば、テルペン系樹脂(例えば、ヤスハラケミカル社製「ヒロダインシリーズ」)等が挙げられる。 The sealant layer 2 may contain an additive from the viewpoint of improving the low-temperature heat sealability. Examples of the additive include a terpene resin (for example, “Hirodine series” manufactured by Yashara Chemical Co., Ltd.).
 シーラント層2の厚みは、3~70μmであることが好ましく、5~45μmであることがより好ましい。上記厚みが好ましい範囲の下限値以上であると、滅菌紙とヒートシールした際に、より高いシール強度が得られ、上限値以下であると、開封する際、易開封性の効果がより高くなる。 The thickness of the sealant layer 2 is preferably from 3 to 70 μm, more preferably from 5 to 45 μm. When the thickness is at least the lower limit of the preferred range, a higher seal strength is obtained when heat-sealing with sterilized paper, and when the thickness is at most the lower limit, the effect of easy-opening property is higher when opening. .
(基材層)
 基材層(コア層ともいう)3は、多層フィルム1に柔軟性を付与することを目的として、上述したシーラント層2と隣接するように設けられた樹脂層である。基材層3に用いることが可能な樹脂としては、上記機能を付与することが可能な樹脂であれば特に制限されないが、ポリエチレン系樹脂等が挙げられる。
(Base material layer)
The base material layer (also referred to as a core layer) 3 is a resin layer provided to be adjacent to the above-described sealant layer 2 for the purpose of imparting flexibility to the multilayer film 1. The resin that can be used for the base material layer 3 is not particularly limited as long as it is a resin that can impart the above function, and examples thereof include a polyethylene-based resin.
 ポリエチレン系樹脂としては、例えば、低密度ポリエチレン(LDPE)樹脂、直鎖状低密度ポリエチレン(LLDPE)樹脂、中密度ポリエチレン(MDPE)樹脂、高密度ポリエチレン(HDPE)樹脂等のエチレンの単独重合体;エチレン-酢酸ビニル共重合体(EVA)樹脂、エチレン-メチルメタクリレート共重合体(EMMA)樹脂、エチレン-エチルアクリレート共重合体(EEA)樹脂、エチレン-メチルアクリレート共重合体(EMA)樹脂、エチレン-エチルアクリレート-無水マレイン酸共重合体(E-EA-MAH)樹脂、エチレン-アクリル酸共重合体(EAA)樹脂、エチレン-メタクリル酸共重合体(EMAA)樹脂等のエチレン系コポリマー;アイオノマー(ION)樹脂などが、単体でまたは2種類以上混合して用いられる。
 ポリエチレン樹脂としては、好ましいのは、上記LLDPEである。基材層3が含む樹脂としてLLDPEを用いることにより、より安定したヒートシール強度(シーラント層2で用いた直鎖状低密度ポリエチレンを含む樹脂との相乗効果)が得られる。
Examples of the polyethylene-based resin include ethylene homopolymers such as low-density polyethylene (LDPE) resin, linear low-density polyethylene (LLDPE) resin, medium-density polyethylene (MDPE) resin, and high-density polyethylene (HDPE) resin; Ethylene-vinyl acetate copolymer (EVA) resin, ethylene-methyl methacrylate copolymer (EMMA) resin, ethylene-ethyl acrylate copolymer (EEA) resin, ethylene-methyl acrylate copolymer (EMA) resin, ethylene- Ethylene copolymers such as ethyl acrylate-maleic anhydride copolymer (E-EA-MAH) resin, ethylene-acrylic acid copolymer (EAA) resin, ethylene-methacrylic acid copolymer (EMAA) resin; ionomers (ION) ) Resin, etc., alone or two or more types The combined used in.
As the polyethylene resin, the above-mentioned LLDPE is preferable. By using LLDPE as the resin contained in the base material layer 3, more stable heat seal strength (a synergistic effect with the resin containing linear low-density polyethylene used in the sealant layer 2) can be obtained.
 基材層3は、1層のみでもよいし、図2に示したように、2層以上の複数層でもよい。例えば、基材層3を、異なる材質の複数層からなるものとすることで、基材層3の硬さ等の特性を調節できる。2層以上の基材層としては、例えば、LDPEとLLDPEの2層を有する基材層等が挙げられる。 The base material layer 3 may be only one layer or, as shown in FIG. 2, may be two or more layers. For example, by forming the base layer 3 from a plurality of layers made of different materials, characteristics such as hardness of the base layer 3 can be adjusted. Examples of the two or more base material layers include a base material layer having two layers of LDPE and LLDPE.
 基材層3の厚みは、15~150μmであることが好ましく、30~100μmであることがより好ましい。上記厚みが好ましい範囲の下限値以上であると、多層フィルム1の柔軟性が向上し、上限値以下であると、より安定したシール強度が得られる。 The thickness of the base material layer 3 is preferably from 15 to 150 μm, more preferably from 30 to 100 μm. When the thickness is not less than the lower limit of the preferred range, the flexibility of the multilayer film 1 is improved, and when it is not more than the upper limit, more stable sealing strength can be obtained.
 本実施形態の多層フィルム1においては、上述したシーラント層2と基材層3との厚みの比が、1:0.5~1:15の範囲であることが好ましく、1:0.5~1:10の範囲であることがより好ましく、1:2~1:10の範囲であることがより好ましい。上述した比が上記好ましい範囲の下限値以上であると、包装体のカール防止の効果が得られ、上限値以下であると、より安定したシール強度が得られる。 In the multilayer film 1 of the present embodiment, the thickness ratio between the sealant layer 2 and the base material layer 3 is preferably in the range of 1: 0.5 to 1:15, and is preferably in the range of 1: 0.5 to 1:15. It is more preferably in the range of 1:10, more preferably in the range of 1: 2 to 1:10. When the above-mentioned ratio is at least the lower limit of the preferable range, an effect of preventing curling of the package is obtained, and when it is at most the upper limit, more stable sealing strength is obtained.
 本実施形態の多層フィルム1は、上述したシーラント層2及び基材層3以外に、本発明の効果を損なわない範囲において、他の樹脂層を備えていてもよい。図2に示す多層フィルム1は、基材層3上に、他の樹脂層として、接着性樹脂層4と耐ピンホール層5とが積層されている。 多層 The multilayer film 1 of the present embodiment may include another resin layer other than the sealant layer 2 and the base material layer 3 as long as the effects of the present invention are not impaired. In the multilayer film 1 shown in FIG. 2, an adhesive resin layer 4 and a pinhole-resistant layer 5 are laminated on the base layer 3 as other resin layers.
(接着性樹脂層)
 接着性樹脂層4は、上述したシーラント層2と基材層3との層間以外の、多層フィルム1を構成する各樹脂層の層間強度を高めるために設けられた樹脂層である。
(Adhesive resin layer)
The adhesive resin layer 4 is a resin layer provided to increase the interlayer strength of each resin layer constituting the multilayer film 1 other than the layer between the sealant layer 2 and the base material layer 3 described above.
 接着性樹脂層4に適用可能な接着性樹脂としては、公知の接着性のオレフィン系樹脂、例えば、接着性ポリプロピレン系樹脂、接着性ポリエチレン系樹脂などが用いられる。接着性樹脂層4は、その酸化を防止するために、酸化防止剤を含有していてもよい。酸化防止剤としては、公知の酸化防止剤、例えば、ヒンダードフェノール系酸化防止剤、リン系酸化防止剤、チオエーテル系酸化防止剤などが、単体でまたは2種類以上混合して用いられる。また、接着性樹脂層4は、接着性や機械的特性の向上の観点から、セルロースナノファイバーを含有していてもよい。 As the adhesive resin applicable to the adhesive resin layer 4, a known adhesive olefin resin, for example, an adhesive polypropylene resin, an adhesive polyethylene resin, or the like is used. The adhesive resin layer 4 may contain an antioxidant to prevent its oxidation. As the antioxidant, a known antioxidant, for example, a hindered phenol-based antioxidant, a phosphorus-based antioxidant, a thioether-based antioxidant, or the like is used alone or in combination of two or more. Further, the adhesive resin layer 4 may contain cellulose nanofibers from the viewpoint of improving adhesiveness and mechanical properties.
 接着樹脂層4の厚みは、各層を必要な接着強度で接合できれば特に制限されないが、2~30μmが好ましく、5~25μmがより好ましい。 厚 み The thickness of the adhesive resin layer 4 is not particularly limited as long as each layer can be joined with a required adhesive strength, but is preferably 2 to 30 μm, more preferably 5 to 25 μm.
(耐ピンホール層)
 耐ピンホール層5は、多層フィルム1に耐ピンホール性を付与するために設けられた樹脂層である。耐ピンホール層5は、耐ピンホール性を向上させる観点から、ポリアミド樹脂を含むものが好ましい。耐ピンホール層5に含まれるポリアミド樹脂としては、例えば、4-ナイロン、6-ナイロン、7-ナイロン、11-ナイロン、12-ナイロン、46-ナイロン、66-ナイロン、69-ナイロン、610-ナイロン、611-ナイロン、612-ナイロン、6T-ナイロン、6Iナイロン、6-ナイロンと66-ナイロンのコポリマー(ナイロン6/66)、6-ナイロンと610-ナイロンのコポリマー、6-ナイロンと611-ナイロンのコポリマー、6-ナイロンと12-ナイロンのコポリマー(ナイロン6/12)、6-ナイロンと612ナイロンのコポリマー、6-ナイロンと6T-ナイロンのコポリマー、6-ナイロンと6I-ナイロンのコポリマー、6-ナイロンと66-ナイロンと610-ナイロンのコポリマー、6-ナイロンと66-ナイロンと12-ナイロンのコポリマー(ナイロン6/66/12)、6-ナイロンと66-ナイロンと612-ナイロンのコポリマー、66-ナイロンと6T-ナイロンのコポリマー、66-ナイロンと6I-ナイロンのコポリマー、6T-ナイロンと6I-ナイロンのコポリマー、及び66-ナイロンと6T-ナイロンと6I-ナイロンのコポリマー、非晶性ナイロン等が挙げられる。中でも、耐熱性、機械的強度、及び入手の容易性の点から、6-ナイロン、12-ナイロン、66-ナイロン、ナイロン6/66、ナイロン6/12、及びナイロン6/66/12等が好ましく、6-ナイロンがより好ましい。
(Pinhole resistant layer)
The pinhole-resistant layer 5 is a resin layer provided for imparting pinhole resistance to the multilayer film 1. The pinhole-resistant layer 5 preferably contains a polyamide resin from the viewpoint of improving the pinhole resistance. Examples of the polyamide resin contained in the anti-pinhole layer 5 include 4-nylon, 6-nylon, 7-nylon, 11-nylon, 12-nylon, 46-nylon, 66-nylon, 69-nylon, and 610-nylon Nylon, 611-nylon, 612-nylon, 6T-nylon, 6I nylon, 6-nylon and 66-nylon copolymer (nylon 6/66), 6-nylon and 610-nylon copolymer, 6-nylon and 611-nylon Copolymer, copolymer of 6-nylon and 12-nylon (nylon 6/12), copolymer of 6-nylon and 612 nylon, copolymer of 6-nylon and 6T-nylon, copolymer of 6-nylon and 6I-nylon, 6-nylon And copolymers of 66-nylon and 610-nylon, 6- Copolymer of nylon and 66-nylon and 12-nylon (nylon 6/66/12), copolymer of 6-nylon and 66-nylon and 612-nylon, copolymer of 66-nylon and 6T-nylon, 66-nylon and 6I- Nylon copolymer, 6T-nylon and 6I-nylon copolymer, 66-nylon and 6T-nylon and 6I-nylon copolymer, amorphous nylon and the like. Among these, 6-nylon, 12-nylon, 66-nylon, nylon 6/66, nylon 6/12, nylon 6/66/12, and the like are preferable from the viewpoint of heat resistance, mechanical strength, and availability. , 6-nylon are more preferred.
 耐ピンホール層5の総厚は、特に制限されないが、10~90μmが好ましく、12~50μmがより好ましい。 総 The total thickness of the pinhole-resistant layer 5 is not particularly limited, but is preferably 10 to 90 μm, and more preferably 12 to 50 μm.
(添加剤)
 本実施形態の多層フィルム1は、上述したシーラント層2及び基材層3中に、必要に応じて滑り性やブロッキングを防止、防曇性を付与する目的で適宜、公知の滑剤や添加剤を付与してもよい。滑り性やブロッキング防止の目的では、オレイン酸アミド、エルカ酸アミド等の有機系滑剤、シリカ、ゼオライト、炭酸カルシウム等の無機系滑剤を挙げることができる。また、防曇性を付与する為には、既に公知の界面活性剤等を適宜使用することができる。
(Additive)
The multilayer film 1 of the present embodiment may contain a known lubricant or additive in the above-described sealant layer 2 and base material layer 3 for the purpose of preventing slippage and blocking and imparting anti-fogging property as needed. You may give. For the purpose of slipperiness and blocking prevention, organic lubricants such as oleic amide and erucamide, and inorganic lubricants such as silica, zeolite and calcium carbonate can be exemplified. In order to impart antifogging property, a known surfactant or the like can be appropriately used.
<多層フィルムの製造方法>
 次に、上述した多層フィルム1の製造方法の一例について説明する。
 上述した多層フィルム1の製造方法は、特に限定されるものではないが、数台の押出機により、原料となる樹脂等を溶融押出するフィードブロック法やマルチマニホールド法等の共押出Tダイ法、空冷式又は水冷式共押出インフレーション法、及びラミネート法が挙げられる。この中でも、共押出Tダイ法で製膜する方法が各層の厚さ制御に優れる点で特に好ましい。
<Method for producing multilayer film>
Next, an example of a method for manufacturing the above-described multilayer film 1 will be described.
The method for producing the above-mentioned multilayer film 1 is not particularly limited, but a co-extrusion T-die method such as a feed block method or a multi-manifold method in which a resin or the like as a raw material is melt-extruded by several extruders, An air-cooled or water-cooled co-extrusion inflation method and a laminating method are mentioned. Among them, a method of forming a film by a co-extrusion T-die method is particularly preferable because it is excellent in controlling the thickness of each layer.
 ラミネート法としては、各層を形成する単層のシート又はフィルムを適当な接着剤を用いて貼り合せるドライラミネート法、押出ラミネート法、ホットメルトラミネート法、ウエットラミネート法、サーマル(熱)ラミネート法等、及びそれらの方法を組み合わせて用いることができる。また、コーティングによる方法で積層してもよい。 Examples of the laminating method include a dry laminating method, a laminating method, a hot laminating method, a wet laminating method, and a thermal (thermal) laminating method in which a single-layer sheet or film forming each layer is bonded using an appropriate adhesive. And their methods can be used in combination. Moreover, you may laminate | stack by the method by coating.
<包装体>
 次に、上述した多層フィルム1を用いた、包装体の一例について説明する。
 本実施形態の包装体は、上述した多層フィルムと、滅菌紙とを備え、多層フィルムのシーラント層の少なくとも一部が滅菌紙の表面にヒートシールされている。
<Package>
Next, an example of a package using the above-described multilayer film 1 will be described.
The package of the present embodiment includes the above-described multilayer film and sterile paper, and at least a part of the sealant layer of the multilayer film is heat-sealed to the surface of the sterile paper.
 本実施形態の包装体に適用可能な滅菌紙としては、シーラント層とヒートシール可能であり、通気性を有し、これを介した菌の透過を防止し(遮菌性を有し)、滅菌処理を施すことが可能な、紙を主たる構成材料とするシートであれば、特に限定されない。前記滅菌紙としては、「メディカD(王子エフテックス製)」等が挙げられる。 The sterilizing paper applicable to the package of the present embodiment is heat-sealable with a sealant layer, has air permeability, prevents bacteria from passing therethrough (has a fungicidal property), and is sterilized. The sheet is not particularly limited as long as it can be processed and is a sheet mainly composed of paper. Examples of the sterilized paper include Medica D (manufactured by Oji F-Tex).
 本実施形態の包装体を医療用包装体として用いる場合、滅菌紙は、通気性及び遮菌性を発揮し得る程度の小孔を有することが好ましい。具体的には、0.0001~20dtexの範囲内の繊維で構成されるとともに、目付が10~300g/mの滅菌紙であることが好ましい。 When the package of the present embodiment is used as a medical package, it is preferable that the sterilized paper has small holes that are capable of exhibiting air permeability and bacterial barrier properties. Specifically, it is preferably made of sterilized paper having a fiber weight in the range of 0.0001 to 20 dtex and a basis weight of 10 to 300 g / m 2 .
 本実施形態の包装体は、底材を深絞り成形した後、ガーゼ等の内容物を充填し、その上に蓋材を被せてヒートシールすることにより、深絞り包装体として用いることができる。特に、上述した多層フィルムを深絞り包装体の底材として用いるとともに、滅菌紙を蓋材として用いる場合、良好な深絞り包装体を得ることができる。 包装 The package of the present embodiment can be used as a deep-drawn package by deep-drawing the bottom material, filling it with contents such as gauze, covering it with a lid, and heat-sealing. In particular, when the above-described multilayer film is used as the bottom material of the deep-drawn package and sterilized paper is used as the lid, a good deep-drawn package can be obtained.
 本実施形態の包装体は、底材として用いる多層フィルムと、蓋材として用いる滅菌紙とを、ヒートシール等の接着手段により接着することにより作製することができる。具体的には、多層フィルムと滅菌紙との、好ましくは135~155℃の温度範囲でのヒートシールにより、包装体を作製することができる。
 また、本実施形態の包装体は、多層フィルム1と、滅菌紙と、のシール強度が、1.0~7.7N/15mmであることが好ましく、1.2~6.0N/15mmであることがより好ましい。上述したシール強度が、上記好ましい範囲の下限値以上であると、包装体の密封性がより高くなり、上限値以下であると、より良好な開封性(剥離時の繊維の裂けやケバ立ちの抑制)が得られる。
The package of the present embodiment can be manufactured by bonding a multilayer film used as a bottom material and sterilized paper used as a lid material by bonding means such as heat sealing. Specifically, a package can be produced by heat-sealing the multilayer film and sterilized paper, preferably in a temperature range of 135 to 155 ° C.
Further, in the package of the present embodiment, the sealing strength between the multilayer film 1 and the sterilized paper is preferably 1.0 to 7.7 N / 15 mm, and is 1.2 to 6.0 N / 15 mm. Is more preferable. When the above-mentioned seal strength is not less than the lower limit of the above-mentioned preferred range, the sealing property of the package is higher, and if it is not more than the upper limit, better openability (such as tearing of fibers and fluffing during peeling). Suppression) is obtained.
 以上説明したように、本実施形態の多層フィルムによれば、表面層となるように設けられたシーラント層が、少なくとも直鎖状低密度ポリエチレンを含み、かつ、前記直鎖状低密度ポリエチレンの密度が0.93以上であるため、前記多層フィルムと滅菌紙とをヒートシールした包装体は、適切なシール強度を担保しつつ、滅菌紙を剥離した際に、底材の剥離面に紙残りが発生するのを抑制させることができ、衛生上問題のない包装体を提供できるという優れた効果を有する。 As described above, according to the multilayer film of the present embodiment, the sealant layer provided to be the surface layer contains at least linear low-density polyethylene, and the density of the linear low-density polyethylene. Is 0.93 or more, the package obtained by heat-sealing the multilayer film and the sterilized paper has an appropriate sealing strength, and when the sterilized paper is peeled off, paper residue remains on the peeling surface of the bottom material. It has an excellent effect that generation can be suppressed and a package having no hygiene problem can be provided.
 本実施形態の包装体は、多層フィルム1と滅菌紙とを備える構成であり、多層フィルム1と、滅菌紙と、のシール強度が、1.0~7.7(N/15mm)である場合には、シール強度と易剥離性の点で、さらに優れたものとなる。 The package of the present embodiment is configured to include the multilayer film 1 and sterilized paper, and the sealing strength between the multilayer film 1 and the sterilized paper is 1.0 to 7.7 (N / 15 mm). Are more excellent in terms of seal strength and easy peelability.
 以上、この発明の実施形態について図面を参照して詳述してきたが、具体的な構成はこの実施形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計等も含まれる。例えば、図1に示す多層フィルム1は、シーラント層2及び基材層3が、この順に積層された構成を有するが、これは一例であり、これに限定されるものではない。例えば、本発明の一実施形態に係る多層フィルムは、図2に示すように、シーラント層2、基材層30、基材層31、接着性樹脂層4及び耐ピンホール層5がこの順に積層された構造を有していてもよく、また、接着性樹脂層4及び耐ピンホール層5が、交互に2層ずつ積層したものであってもよいし、3層以上を交互に積層したものであってもよい。 Although the embodiment of the present invention has been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and includes a design and the like without departing from the gist of the present invention. For example, the multilayer film 1 shown in FIG. 1 has a configuration in which the sealant layer 2 and the base material layer 3 are laminated in this order, but this is an example, and the present invention is not limited to this. For example, as shown in FIG. 2, the multilayer film according to one embodiment of the present invention includes a sealant layer 2, a base layer 30, a base layer 31, an adhesive resin layer 4, and a pinhole-resistant layer 5 laminated in this order. The adhesive resin layer 4 and the pinhole-resistant layer 5 may be alternately laminated two by two, or three or more layers may be alternately laminated. It may be.
 また、多層フィルム1には、各層の間やシーラント層2と反対側の最表層に、別の機能を有する層を新たに設けてもよい。例えば、多層フィルム1に酸素ガスバリア性を付与する観点から、エチレン-ビニルアルコール共重合体樹脂からなる樹脂層を設けてもよい。また、多層フィルム1に強度を付与する観点から、ポリプロピレン系樹脂(PP)からなる樹脂層を設けてもよい。また、多層フィルム1に柔軟性を付与する観点から、エチレン-酢酸ビニル共重合体層(EVA層)、又はポリエチレン層(PE層)からなる樹脂層を設けてもよい。 In the multilayer film 1, a layer having another function may be newly provided between each layer or on the outermost layer opposite to the sealant layer 2. For example, from the viewpoint of providing the multilayer film 1 with an oxygen gas barrier property, a resin layer made of an ethylene-vinyl alcohol copolymer resin may be provided. Further, from the viewpoint of imparting strength to the multilayer film 1, a resin layer made of a polypropylene-based resin (PP) may be provided. From the viewpoint of imparting flexibility to the multilayer film 1, a resin layer composed of an ethylene-vinyl acetate copolymer layer (EVA layer) or a polyethylene layer (PE layer) may be provided.
 以下、実施例および比較例に基づき本発明を更に詳細に説明するが、本発明はこれらにより限定されるものではない。 Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples, but the present invention is not limited thereto.
<多層フィルムの作製>
(実施例1)
 図1に示す構成を有し、さらに、図2に示す積層順で接着性樹脂層及び耐ピンホール層を備えた多層フィルムを、以下の手順で作製した。
 先ず、耐ピンホール層に含まれる樹脂として、ナイロン(宇部興産社製、品番:1022B)を用意した。
 また、接着性樹脂層(以下、単に「接着層」という)に含まれる樹脂として、接着性ポリエチレン系樹脂(三井化学株式会社製、品番:NF536)を用意した。
 また、基材層に含まれる樹脂として、ポリエチレン(宇部丸善ポリエチレン社製、品番:F222NH)を用意した。
 また、シーラント層に含まれる樹脂として、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(宇部丸善ポリエチレン社製、品番:4040FC、融点126℃)と、低密度ポリエチレン(LDPE)(宇部丸善ポリエチレン社製、品番:F222NH、融点110℃)とを用意し、これらを80:20の割合となるように混合(混練)した。得られたシーラント層に含まれる樹脂の密度(g/cm)は、0.938g/cmであった。
 次に、シーラント層/基材層/接着性樹脂層/耐ピンホール層の順の4層構成の多層フィルムを押し出し加工にて作製(積層)した。
 シーラント層の厚みは、12μmであり、基材層の厚みは、68μmであり、接着性樹脂層の厚みは、14μmであり、耐ピンホール層の厚みは、16μmであった。
 なお、シーラント層に含まれる樹脂の密度は、JIS K7112の密度勾配管法に基づいて、比重測定装置(柴山科学器械製作所)を用いて測定した。
 なお、融点は、示差走査熱量測定(DSC、日立ハイテクサイエンス社製、DSC6200)により、窒素雰囲気下で25℃~300℃まで、昇温速度5℃/minで昇温後、25℃まで昇温速度-50℃/minで冷却し、再度25℃~300℃まで昇温速度5℃/minで昇温し、再昇温時に測定して得た。
<Preparation of multilayer film>
(Example 1)
A multilayer film having the configuration shown in FIG. 1 and further including the adhesive resin layer and the pinhole-resistant layer in the lamination order shown in FIG. 2 was produced by the following procedure.
First, nylon (manufactured by Ube Industries, product number: 1022B) was prepared as a resin contained in the pinhole-resistant layer.
Further, as a resin contained in the adhesive resin layer (hereinafter, simply referred to as “adhesive layer”), an adhesive polyethylene resin (manufactured by Mitsui Chemicals, Inc., product number: NF536) was prepared.
Further, polyethylene (manufactured by Ube Maruzen Polyethylene Corporation, product number: F222NH) was prepared as a resin contained in the base material layer.
Further, as a resin contained in the sealant layer, a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., Ltd., product number: 4040FC, melting point 126 ° C.) and a low-density polyethylene (LDPE) (Ube Maruzen Polyethylene Co., Ltd.) (Product number: F222NH, melting point: 110 ° C.), and these were mixed (kneaded) in a ratio of 80:20. The density of the resin contained in the resulting sealant layer (g / cm 3) was 0.938 g / cm 3.
Next, a multilayer film having a four-layer structure in the order of sealant layer / base layer / adhesive resin layer / pinhole-resistant layer was produced (laminated) by extrusion.
The thickness of the sealant layer was 12 μm, the thickness of the base material layer was 68 μm, the thickness of the adhesive resin layer was 14 μm, and the thickness of the pinhole-resistant layer was 16 μm.
In addition, the density of the resin contained in the sealant layer was measured using a specific gravity measuring device (Shibayama Scientific Instruments) based on the density gradient tube method of JIS K7112.
The melting point was measured by differential scanning calorimetry (DSC, DSC6200, manufactured by Hitachi High-Tech Science Corporation) in a nitrogen atmosphere from 25 ° C to 300 ° C, at a rate of 5 ° C / min, and then to 25 ° C. It was cooled at a rate of −50 ° C./min, heated again from 25 ° C. to 300 ° C. at a rate of 5 ° C./min, and measured at the time of re-heating to obtain a temperature.
(実施例2)
 シーラント層に含まれる樹脂として、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(宇部丸善ポリエチレン社製、品番:4040FC)の代わりに、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(住友化学社製、品番:FV407、融点:124℃)を用いる以外は、実施例1と同様にして、シーラント層/基材層/接着性樹脂層/耐ピンホール層の順の4層構成の多層フィルムを押し出し加工にて作製(積層)した。得られたシーラント層に含まれる樹脂の密度(g/cm)は、0.930g/cmであった。
 シーラント層の厚みは、14μmであり、基材層の厚みは、68μmであり、接着性樹脂層の厚みは、14μmであり、耐ピンホール層の厚みは、16μmであった。
(Example 2)
As the resin contained in the sealant layer, instead of the metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., Ltd., product number: 4040FC), a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (Sumitomo Chemical) The product is manufactured in the same manner as in Example 1 except that a multi-layer film of sealant layer / base material layer / adhesive resin layer / pinhole-resistant layer is used in the same manner as in Example 1, except that FV407 (product number: FV407, melting point: 124 ° C.) is used. Was produced (laminated) by extrusion. The density of the resin contained in the resulting sealant layer (g / cm 3) was 0.930 g / cm 3.
The thickness of the sealant layer was 14 μm, the thickness of the base material layer was 68 μm, the thickness of the adhesive resin layer was 14 μm, and the thickness of the pinhole-resistant layer was 16 μm.
(実施例3)
 シーラント層に含まれる樹脂として、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(宇部丸善ポリエチレン社製、品番:4040FC)の代わりに、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(プライムポリマー社製、品番:SP3530、融点:97、121、125℃)を用いる以外は、実施例1と同様にして、シーラント層/基材層/接着性樹脂層/耐ピンホール層の順の4層構成の多層フィルムを押し出し加工にて作製(積層)した。得られたシーラント層に含まれる樹脂の密度(g/cm)は、0.931g/cmであった。
 シーラント層の厚みは、14μmであり、基材層の厚みは、68μmであり、接着性樹脂層の厚みは、14μmであり、耐ピンホール層の厚みは、16μmであった。
(Example 3)
As the resin contained in the sealant layer, instead of the metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., part number: 4040FC), a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (prime polymer) (Product number: SP3530, melting point: 97, 121, 125 ° C.), except that sealant layer / base material layer / adhesive resin layer / pinhole-resistant layer were used in the same manner as in Example 1. A multilayer film having the configuration was produced (laminated) by extrusion. The density of the resin contained in the resulting sealant layer (g / cm 3) was 0.931 g / cm 3.
The thickness of the sealant layer was 14 μm, the thickness of the base material layer was 68 μm, the thickness of the adhesive resin layer was 14 μm, and the thickness of the pinhole-resistant layer was 16 μm.
(実施例4)
 シーラント層に含まれる樹脂として、低密度ポリエチレン(LDPE)を使用せず、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(宇部丸善ポリエチレン社製、品番:4040FC、融点126℃、密度0.938g/cm)のみを使用した以外は、実施例1と同様にして、シーラント層/基材層/接着性樹脂層/耐ピンホール層の順の4層構成の多層フィルムを押し出し加工にて作製(積層)した。得られたシーラント層に含まれる樹脂の密度(g/cm)は、0.938g/cmであった。
 シーラント層の厚みは、12μmであり、基材層の厚みは、68μmであり、接着性樹脂層の厚みは、14μmであり、耐ピンホール層の厚みは、16μmであった。
(Example 4)
As the resin contained in the sealant layer, low-density polyethylene (LDPE) was not used, and a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., Ltd., product number: 4040FC, melting point 126 ° C., density 0.938 g) / Cm 3 ), except that only a sealant layer / substrate layer / adhesive resin layer / pinhole-resistant layer was formed in the same manner as in Example 1 except that only a multilayer film was extruded. (Laminated). The density of the resin contained in the resulting sealant layer (g / cm 3) was 0.938 g / cm 3.
The thickness of the sealant layer was 12 μm, the thickness of the base material layer was 68 μm, the thickness of the adhesive resin layer was 14 μm, and the thickness of the pinhole-resistant layer was 16 μm.
(比較例1)
 シーラント層に含まれる樹脂として、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(宇部丸善ポリエチレン社製、品番:4040FC)の代わりに、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(ダウ・ケミカル社製、品番:5220G、融点:102、113、124℃)を用いる以外は、実施例1と同様にして、シーラント層/基材層/接着性樹脂層/耐ピンホール層の順の4層構成の多層フィルムを押し出し加工にて作製(積層)した。得られたシーラント層に含まれる樹脂の密度(g/cm)は、0.915g/cmであった。
 シーラント層の厚みは、14μmであり、基材層の厚みは、68μmであり、接着性樹脂層の厚みは、14μmであり、耐ピンホール層の厚みは、16μmであった。
(Comparative Example 1)
As the resin contained in the sealant layer, a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., part number: 4040FC) is used instead of a metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (DLD. (Manufactured by Chemical Co., Ltd., product number: 5220G, melting point: 102, 113, 124 ° C.) except that sealant layer / base layer / adhesive resin layer / pinhole-resistant layer was used in the same manner as in Example 1. A multilayer film having a layer configuration was produced (laminated) by extrusion. The density (g / cm 3 ) of the resin contained in the obtained sealant layer was 0.915 g / cm 3 .
The thickness of the sealant layer was 14 μm, the thickness of the base material layer was 68 μm, the thickness of the adhesive resin layer was 14 μm, and the thickness of the pinhole-resistant layer was 16 μm.
(比較例2)
 シーラント層に含まれる樹脂として、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(宇部丸善ポリエチレン社製、品番:4040FC)の代わりに、直鎖状低密度ポリエチレン(LLDPE)樹脂(プライムポリマー社製、品番:2540R、融点:121℃)を用いる以外は、実施例1と同様にして、シーラント層/基材層/接着性樹脂層/耐ピンホール層の順の4層構成の多層フィルムを押し出し加工にて作製(積層)した。得られたシーラント層に含まれる樹脂の密度(g/cm)は、0.923g/cmであった。
 シーラント層の厚みは、14μmであり、基材層の厚みは、68μmであり、接着性樹脂層の厚みは、14μmであり、耐ピンホール層の厚みは、16μmであった。
(Comparative Example 2)
As the resin contained in the sealant layer, instead of the metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene Co., part number: 4040FC), a linear low-density polyethylene (LLDPE) resin (manufactured by Prime Polymer Co., Ltd.) Extruding a sealant layer / base material layer / adhesive resin layer / pinhole-resistant layer in the same manner as in Example 1 except that a multi-layered film was extruded. Fabricated (laminated) by processing. The density of the resin contained in the resulting sealant layer (g / cm 3) was 0.923 g / cm 3.
The thickness of the sealant layer was 14 μm, the thickness of the base material layer was 68 μm, the thickness of the adhesive resin layer was 14 μm, and the thickness of the pinhole-resistant layer was 16 μm.
(比較例3)
 シーラント層に含まれる樹脂として、メタロセン触媒直鎖状低密度ポリエチレン(mLLDPE)樹脂(宇部丸善ポリエチレン社製、品番:4040FC)の代わりに、メタロセン触媒直鎖状低密度ポリエチレン樹脂(宇部丸善ポリエチレン社製、品番:1540F、融点:114℃)を用いる以外は、実施例1と同様にして、シーラント層/基材層/接着性樹脂層/耐ピンホール層の順の4層構成の多層フィルムを押し出し加工にて作製(積層)した。得られたシーラント層に含まれる樹脂の密度(g/cm)は、0.913g/cmであった。
 シーラント層の厚みは、14μmであり、基材層の厚みは、68μmであり、接着性樹脂層の厚みは、14μmであり、耐ピンホール層の厚みは、16μmであった。
(Comparative Example 3)
As the resin contained in the sealant layer, instead of the metallocene-catalyzed linear low-density polyethylene (mLLDPE) resin (manufactured by Ube Maruzen Polyethylene, part number: 4040FC), the metallocene-catalyzed linear low-density polyethylene resin (manufactured by Ube Maruzen Polyethylene) Extruding a sealant layer / substrate layer / adhesive resin layer / pinhole-resistant layer in the same manner as in Example 1 except for using the following: Fabricated (laminated) by processing. The density of the resin contained in the resulting sealant layer (g / cm 3) was 0.913 g / cm 3.
The thickness of the sealant layer was 14 μm, the thickness of the base material layer was 68 μm, the thickness of the adhesive resin layer was 14 μm, and the thickness of the pinhole-resistant layer was 16 μm.
<包装体の製造>
 実施例及び比較例で得られた多層フィルムと、滅菌紙とを、滅菌紙側を熱板側になるように重ね、テフロン(登録商標)シートを乗せた後、オートカップシーラーを用いて下記の条件でシールして包装体の評価用サンプルを作製した。剥離はフィルムのMD方向及びTD方向で行った。
・シール圧力:2.0kgf/cm(0.2MPa)
・シール時間:3.0秒
・シール温度:130℃、140℃、150℃(10℃間隔にて、3条件)
<Manufacture of packaging>
The multilayer films obtained in Examples and Comparative Examples and sterilized paper were stacked such that the sterilized paper side was on the hot plate side, and a Teflon (registered trademark) sheet was placed thereon. A sample for evaluation of the package was produced by sealing under the conditions. Peeling was performed in the MD and TD directions of the film.
・ Seal pressure: 2.0 kgf / cm 2 (0.2 MPa)
-Sealing time: 3.0 seconds-Sealing temperature: 130 ° C, 140 ° C, 150 ° C (3 conditions at 10 ° C intervals)
<評価>
 実施例及び比較例で得られた包装体の評価サンプルについて、ヒートシール性(シール強度)、剥離面の紙残りの評価、低分子量揮発成分の評価、設備汚染の評価、分子量分布の評価、及び熱板付着の評価を行った。
<Evaluation>
About the evaluation sample of the package obtained by the Example and the comparative example, heat sealing property (seal strength), evaluation of the paper residue of a peeling surface, evaluation of low molecular weight volatile components, evaluation of equipment contamination, evaluation of molecular weight distribution, and The hot plate adhesion was evaluated.
(ヒートシール性の評価)
 ヒートシール性の評価は、引張試験機(株式会社エー・アンド・デイ社製、TENSILON RTG-1310)を用いて、シール幅15mmでのシール強度を測定することにより行った。剥離速度は、200mm/分で行なった。表1に、実施例及び比較例について、各シール温度で作製した評価サンプルのシール強度を示す。
(Evaluation of heat sealability)
The heat sealability was evaluated by measuring the seal strength at a seal width of 15 mm using a tensile tester (TENSILON RTG-1310, manufactured by A & D Corporation). The peeling speed was 200 mm / min. Table 1 shows the seal strengths of the evaluation samples prepared at the respective seal temperatures for the examples and the comparative examples.
(剥離面の紙残りの評価)
 紙残りの評価は、5枚の上記の評価サンプルを用い、評価サンプルとなる包装体の蓋材と底材とを引き剥がすことにより行った。
 評価は、引き剥がした後の蓋材と底材との剥離面をそれぞれ観察し、底材の剥離面の紙残りの有無を判定した。表1に、実施例及び比較例について、各シール温度で作製した評価サンプル中の紙残りがあるサンプルの数を示す。
(Evaluation of paper residue on peeled surface)
The evaluation of the remaining paper was performed by peeling off the lid material and the bottom material of the package used as the evaluation sample using the five evaluation samples described above.
In the evaluation, the peeled surfaces of the lid material and the bottom material after peeling were observed, and the presence or absence of paper residue on the peeled surface of the bottom material was determined. Table 1 shows the number of samples having paper residue in the evaluation samples prepared at each sealing temperature for the examples and the comparative examples.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
(低分子量揮発成分の評価)
 低分子量揮発成分の評価は熱分解-GC-MS(熱分解装置:フロンティア・ラボ社製、PY-2020iD型加熱炉型熱分解装置、GC:アジレントテクノロジー社製、6890N型ガスクロマトグラフ、MS:アジレントテクノロジー社製、5975B型質量検出器)を用いてシーラント層に含まれる直鎖状低密度ポリエチレン試料約27mg、加熱条件120℃×10分、加熱雰囲気ヘリウムで行った。検出成分の定量については、既知濃度のn-デカンのアセトン希釈用液を用いてGC-MS測定を行い、発生ガス成分のピーク面積値を比較することによって標準試料に対する換算定量値を合計し、試料重量に対する重量分率として算出した。表2に、実施例及び比較例について、各直鎖状低密度ポリエチレンの試料重量に対する重量分率を示す。
(Evaluation of low molecular weight volatile components)
The evaluation of the low molecular weight volatile component is performed by pyrolysis-GC-MS (pyrolyzer: Frontier Laboratories, PY-2020iD type heating furnace type pyrolyzer, GC: Agilent Technologies, 6890N type gas chromatograph, MS: Agilent) Using a 5975B type mass detector (manufactured by Technology Co., Ltd.), about 27 mg of a linear low-density polyethylene sample contained in the sealant layer was heated under a heating atmosphere of helium at 120 ° C. for 10 minutes. Regarding the quantification of the detection component, GC-MS measurement was performed using an acetone-diluted solution of n-decane having a known concentration, the peak area values of the generated gas components were compared, and the converted quantification values for the standard sample were summed up. It was calculated as a weight fraction relative to the sample weight. Table 2 shows the weight fraction with respect to the sample weight of each linear low-density polyethylene in Examples and Comparative Examples.
(設備汚染の評価)
 設備汚染の評価は、実施例及び比較例で得られた多層フィルムを10cm角にカットし、アルミ箔と重ね、プレス機を用いて下記条件でプレスし、アルミ箔に移行する低分子量成分を観察することにより行った。
・プレス圧:10MPa
・プレス時間:10分
・プレス温度:110℃
 評価基準を下記に示す。
A:アルミ箔に対し、低分子量成分の移行面積がアルミ箔全体の5%以下
B:アルミ箔に対し、低分子量成分の移行面積がアルミ箔全治の5%より多い
 表2に、実施例及び比較例で得られた多層フィルムについて、評価結果を示す。なお、表中、「-」は、未評価であることを示す。
(Evaluation of equipment contamination)
For the evaluation of equipment contamination, the multilayer films obtained in Examples and Comparative Examples were cut into 10 cm squares, layered on aluminum foil, pressed using a press machine under the following conditions, and observed for low molecular weight components transferred to aluminum foil. It was done by doing.
・ Pressing pressure: 10MPa
・ Press time: 10 minutes ・ Press temperature: 110 ° C
The evaluation criteria are shown below.
A: The transition area of the low molecular weight component to the aluminum foil is 5% or less of the whole aluminum foil. B: The transition area of the low molecular weight component to the aluminum foil is more than 5% of the total cure of the aluminum foil. The evaluation results are shown for the multilayer films obtained in Comparative Examples. In the table, "-" indicates that the evaluation has not been performed.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
(分子量分布の評価)
 実施例および比較例の直鎖状低密度ポリエチレンの分子量分布(Mw/Mn)はGPC装置(装置:Agilent製PL-GPC220、カラム:Agilent PLgel Olexis×2本+Guard)を用いて、実施例および比較例の直鎖状低密度ポリエチレンをオルトジクロロベンゼンで溶離した後、温度145℃、濃度0.1wt/vol%、流速1.0ml/minでカラムに注入し示差屈折計にて溶出量を検出し、得られた溶出曲線から求めた。表3に、実施例及び比較例の直鎖状低密度ポリエチレンの分子量分布(Mw/Mn)及び数平均分子量(Mn)を示す。なお、表中、「-」は、未評価であることを示す。
(Evaluation of molecular weight distribution)
The molecular weight distribution (Mw / Mn) of the linear low-density polyethylenes of Examples and Comparative Examples was measured using a GPC apparatus (Apparatus: PL-GPC220 manufactured by Agilent, column: Agilent PLgel Olexis x 2 + Guard). After the linear low-density polyethylene of the example was eluted with orthodichlorobenzene, it was injected into a column at a temperature of 145 ° C, a concentration of 0.1 wt / vol%, and a flow rate of 1.0 ml / min, and the amount of elution was detected by a differential refractometer. Was determined from the obtained elution curve. Table 3 shows the molecular weight distribution (Mw / Mn) and the number average molecular weight (Mn) of the linear low-density polyethylenes of Examples and Comparative Examples. In the table, "-" indicates that the evaluation has not been performed.
(熱板付着の評価)
 熱板付着の評価はGEA PowerPak ST 420を使用し、成形熱板をアルコールで清掃後、成形温度108℃、加熱時間9.9秒、シールなしの条件で7時間稼働させた後に、熱板表面をヘラで擦り付着物堆積の有無を確認した。表3に、実施例及び比較例について、熱板付着物堆積の有無を示す。
(Evaluation of hot plate adhesion)
Evaluation of hot plate adhesion was performed using a GEA PowerPak ST 420, after cleaning the hot plate with alcohol, operating at a molding temperature of 108 ° C., a heating time of 9.9 seconds, and without sealing for 7 hours. Was rubbed with a spatula to confirm the presence or absence of deposits. Table 3 shows the presence or absence of hot plate deposits for the examples and comparative examples.
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
 表1に示すように、実施例1~4では、シール温度140℃及び150℃の全ての評価サンプルにおいて、シール強度が1.2N/15mm以上であり、140℃及び150℃の温度範囲でヒートシール可能であって、ヒートシール性に優れていることが確認された。また、シール温度130℃及び140℃の全ての評価サンプルにおいて、剥離した際に剥離面に紙残りがなく、シール温度150℃でも、剥離面の紙残りは少なく、剥離面の紙残りが抑制されていることが確認された。
 一方、シール温度が140℃及び150℃の場合には、シール温度が130℃の場合よりも、シール強度が高かった。このように、シール強度の高さと、剥離面の紙残りの抑制効果と、の両方に特に優れているのは、シール温度が140℃及び150℃の場合であった。
As shown in Table 1, in Examples 1 to 4, in all the evaluation samples at the sealing temperatures of 140 ° C. and 150 ° C., the sealing strength was 1.2 N / 15 mm or more, and the heat was applied in the temperature range of 140 ° C. and 150 ° C. It was confirmed that it was sealable and had excellent heat sealability. In addition, in all of the evaluation samples at the sealing temperatures of 130 ° C. and 140 ° C., there is no paper residue on the peeling surface when peeling, and even at the sealing temperature of 150 ° C., the paper residue on the peeling surface is small and the paper residue on the peeling surface is suppressed. It was confirmed that.
On the other hand, when the sealing temperature was 140 ° C. and 150 ° C., the sealing strength was higher than when the sealing temperature was 130 ° C. As described above, the case where the sealing temperature is 140 ° C. and 150 ° C. is particularly excellent in both the high sealing strength and the effect of suppressing the residual paper on the peeled surface.
 これに対して、比較例1~3では、シール温度130℃以上の評価サンプルのいずれかにおいて、剥離面の顕著な紙残りが発生していた。とくに比較例3では、シール温度130℃以上の全ての評価サンプルにおいて、剥離面に顕著な紙残りが発生していた。 In contrast, in Comparative Examples 1 to 3, in any of the evaluation samples having a sealing temperature of 130 ° C. or higher, a remarkable paper residue on the peeled surface occurred. In particular, in Comparative Example 3, in all the evaluation samples having a sealing temperature of 130 ° C. or higher, a remarkable paper residue occurred on the peeled surface.
 また、実施例1、3および4について、熱分解-GC-MSの結果を表2に示す。この結果より、実施例1および実施例4は実施例3と比較してGC-MSでの低分子量揮発成分量が少ないため、成形時にガスの発生が少なく、より設備汚染を防ぐことができると推察される。 Table 2 shows the results of pyrolysis-GC-MS for Examples 1, 3 and 4. From these results, it can be seen that Examples 1 and 4 have a smaller amount of low molecular weight volatile components by GC-MS as compared with Example 3, so that less gas is generated during molding and equipment contamination can be further prevented. Inferred.
 また、実施例1~3および比較例1~3について、プレス機での設備汚染評価を表2に示す。この結果より、実施例1よりGC-MSでの低分子量揮発成分が多い実施例3は低分子量揮発成分の移行が多く、設備汚染しやすいことがわかる。 Table 2 shows the evaluation of equipment contamination with a press machine for Examples 1 to 3 and Comparative Examples 1 to 3. From these results, it can be seen that in Example 3 in which the amount of low-molecular-weight volatile components in GC-MS is larger than that in Example 1, the migration of low-molecular-weight volatile components is larger and the equipment is more easily contaminated.
 また、実施例1~4および比較例1~3について、DSC測定結果に基づく融点(融点ピーク温度)を表2に示す。この結果より、実施例1、2および4は実施例3と比較して、最も高い融点ピーク温度が120℃以上であり、最も低い融点ピークが100℃以下に存在しないため、より設備汚染を防ぐことができると推察される。 Table 2 shows melting points (melting point peak temperatures) of Examples 1 to 4 and Comparative Examples 1 to 3 based on DSC measurement results. From these results, Examples 1, 2 and 4 have the highest melting point peak temperature of 120 ° C. or higher and the lowest melting point peak does not exist at 100 ° C. or lower as compared with Example 3, thereby further preventing equipment contamination. It is speculated that it can be done.
 さらに、表3に示した、GPCによる分子量分布(Mw/Mn)の結果より、実施例1および4は、実施例3と比較して分子量分布が狭く、低分子量成分量が少ないため、成形時に熱板への付着異物の発生が少なく設備稼働時間が長くなっても付着異物の発生が無く、生産設備汚染を防ぐことができると考えられる。 Further, from the results of the molecular weight distribution (Mw / Mn) by GPC shown in Table 3, Examples 1 and 4 have narrower molecular weight distributions and smaller amounts of low molecular weight components than those of Example 3, and It is considered that there is no generation of extraneous matter even when the operation time of the equipment is long because the amount of extraneous matter attached to the hot plate is small and the production equipment can be prevented from being contaminated.
 本発明の多層フィルム、及び包装体は、ガーゼ、カテーテル等の医療用器具や医療用機器の包装体として利用可能性を有する。 多層 The multilayer film and the package of the present invention can be used as a package for medical devices such as gauze and catheter and medical devices.
 1…多層フィルム
 2…シーラント層
 3…基材層
 30…基材層1
 31…基材層2
 4…接着性樹脂層
 5…耐ピンホール層
DESCRIPTION OF SYMBOLS 1 ... Multilayer film 2 ... Sealant layer 3 ... Base layer 30 ... Base layer 1
31 ... base material layer 2
4 ... adhesive resin layer 5 ... pinhole resistant layer

Claims (10)

  1.  表面層となるように設けられたシーラント層を、少なくとも備え、
     前記シーラント層が、少なくとも直鎖状低密度ポリエチレンを含み、かつ、前記直鎖状低密度ポリエチレンの密度が0.93以上である、多層フィルム。
    At least a sealant layer provided to be a surface layer,
    A multilayer film, wherein the sealant layer contains at least linear low-density polyethylene, and the linear low-density polyethylene has a density of 0.93 or more.
  2.  前記シーラント層が、さらに、低密度ポリエチレンを含み、前記直鎖状低密度ポリエチレンと前記低密度ポリエチレンとの質量比が、50:50~99:1の範囲である、請求項1に記載の多層フィルム。 The multilayer according to claim 1, wherein the sealant layer further comprises a low-density polyethylene, and a mass ratio of the linear low-density polyethylene to the low-density polyethylene ranges from 50:50 to 99: 1. the film.
  3.  前記シーラント層と隣接するように設けられ、ポリエチレン系樹脂を含む基材層を備える、請求項1又は2に記載の多層フィルム。 The multilayer film according to claim 1 or 2, further comprising a base layer provided adjacent to the sealant layer and including a polyethylene-based resin.
  4.  前記基材層が、直鎖状低密度ポリエチレンを含む、請求項3に記載の多層フィルム。 The multilayer film according to claim 3, wherein the base material layer includes a linear low-density polyethylene.
  5.  前記シーラント層と前記基材層との厚みの比が、1:0.5~1:15の範囲である、請求項3又は4に記載の多層フィルム。 The multilayer film according to claim 3, wherein the ratio of the thickness of the sealant layer to the thickness of the base material layer is in the range of 1: 0.5 to 1:15.
  6.  前記シーラント層に含まれる直鎖状低密度ポリエチレンの低分子量揮発成分が0.1wt%以下である、請求項1~5のいずれか一項に記載の多層フィルム。 The multilayer film according to any one of claims 1 to 5, wherein the low-molecular-weight volatile component of the linear low-density polyethylene contained in the sealant layer is 0.1 wt% or less.
  7.  前記シーラント層に含まれる直鎖状低密度ポリエチレンの分子量分布(Mw/Mn)が7.0以下であり、かつ、前記直鎖状低密度ポリエチレンの数平均分子量Mnが20000以上である、請求項1~6のいずれか一項に記載の多層フィルム。 The molecular weight distribution (Mw / Mn) of the linear low density polyethylene contained in the sealant layer is 7.0 or less, and the number average molecular weight Mn of the linear low density polyethylene is 20,000 or more. The multilayer film according to any one of claims 1 to 6.
  8.  135~155℃の範囲で、滅菌紙とヒートシールが可能である、請求項1~7のいずれか一項に記載の多層フィルム。 The multilayer film according to any one of claims 1 to 7, which can be heat-sealed with sterilized paper at a temperature in the range of 135 to 155 ° C.
  9.  請求項1~8のいずれか一項に記載の多層フィルムと、滅菌紙と、を備え、
     前記多層フィルムのシーラント層の少なくとも一部が前記滅菌紙の表面にヒートシールされた、包装体。
    A multilayer film according to any one of claims 1 to 8, and a sterilized paper,
    A package wherein at least a part of the sealant layer of the multilayer film is heat-sealed to the surface of the sterilized paper.
  10.  前記多層フィルムと、前記滅菌紙と、のシール強度が、1.0~7.7(N/15mm)である、請求項9に記載の包装体。 (10) The package according to (9), wherein the sealing strength between the multilayer film and the sterilized paper is 1.0 to 7.7 (N / 15 mm).
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JP2006256144A (en) * 2005-03-17 2006-09-28 Mitsubishi Plastics Ind Ltd Coextruded film for deep drawing molding, bottom material for deep drawing pakage, and deep drawing package
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