WO2020019583A1 - Oled面板及其制作方法 - Google Patents

Oled面板及其制作方法 Download PDF

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Publication number
WO2020019583A1
WO2020019583A1 PCT/CN2018/115461 CN2018115461W WO2020019583A1 WO 2020019583 A1 WO2020019583 A1 WO 2020019583A1 CN 2018115461 W CN2018115461 W CN 2018115461W WO 2020019583 A1 WO2020019583 A1 WO 2020019583A1
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WIPO (PCT)
Prior art keywords
layer
electrical connection
extension
cathode
anode
Prior art date
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Ceased
Application number
PCT/CN2018/115461
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English (en)
French (fr)
Inventor
张良芬
徐鉉植
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication of WO2020019583A1 publication Critical patent/WO2020019583A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements

Definitions

  • the present invention relates to a technical solution in the field of OLED panels, and in particular, to an OLED panel and a manufacturing method thereof.
  • auxiliary electrode During the production of OLED panels, a part of the auxiliary electrode is hollowed out in a flat layer to form a hollowed out area, and then the auxiliary electrode is electrically connected from both sides of the hollowed out area through a display layer. The auxiliary electrode is exposed.
  • a photomask will be added to block in the hollowed out area.
  • the manufacturing process of the photomask is complicated and difficult, which reduces the production efficiency and increases the production cost, which is extremely disadvantageous for the mass production of OLEDs. influences.
  • An object of the present invention is to provide an OLED panel and a manufacturing method thereof, so as to solve the problem of increasing the cost by manufacturing a photomask in the prior art.
  • An OLED panel includes a substrate, a flat layer provided on a surface of the substrate, the flat layer provided with a hollowed-out area, an auxiliary electrode, the auxiliary electrode provided in the hollowed-out area, and a display
  • An image layer the developing layer is provided on the surface of the flat layer, the developing layer includes an electrical connection portion and a shielding portion, and the electrical connection portion extends to the hollow area to be electrically connected to the auxiliary electrode, The shielding portion extends to a position opposite to the hollowed-out area, and the shielding portion is separated from the auxiliary electrode and the electrical connection portion.
  • the developing layer includes an anode layer, the anode layer is provided on the surface of the flat layer, a part of the anode layer is an anode extension portion, and the anode extension portion extends to a position opposite to the hollow area. Position so that the anode extension constitutes a part of the shielding portion.
  • the display layer further includes a pixel definition layer, which is provided on the surface of the anode layer and the flat layer at the same time, and a part of the pixel definition layer is a pixel extension portion, and the pixel The extension portion is provided on a surface of the anode extension portion, so that the pixel extension portion constitutes a part of the shielding portion.
  • the display layer further includes an organic light emitting layer, which is provided on the surface of the anode layer and the pixel defining layer at the same time, and a part of the organic light emitting layer is a light emitting extension, and the light emitting layer
  • the extension portion is provided on the surface of the pixel extension portion, so that the light emitting extension portion constitutes a part of the shielding portion;
  • the organic light emitting layer also has a portion that is a light emitting electrical connection portion, and the light emitting electrical connection portion extends to The hollow region is electrically connected to the auxiliary electrode, so that the light-emitting electrical connection portion constitutes a part of the electrical connection portion.
  • the developing layer further includes a cathode layer provided on a surface of the organic light emitting layer, and a part of the cathode layer is a cathode extension portion, and the cathode extension portion is provided on the light emitting extension portion.
  • a cathode layer provided on a surface of the organic light emitting layer, and a part of the cathode layer is a cathode extension portion, and the cathode extension portion is provided on the light emitting extension portion.
  • Surface of the cathode so that the cathode extension part constitutes a part of the shielding part
  • the cathode layer further has a cathode electrical connection part, and the cathode electrical connection part extends to the hollow area to cover the light-emitting electricity
  • the cathode electrical connection portion is also electrically connected to the auxiliary electrode, so that the cathode electrical connection portion constitutes a part of the electrical connection portion.
  • a manufacturing method of an OLED panel which is used for manufacturing the above-mentioned OLED panel, includes the following steps:
  • Step 1 A flat layer and an auxiliary electrode are provided on a substrate, and the auxiliary electrode is provided in the hollow area of the flat layer;
  • Step 2 setting an anode layer to cover the flat layer and the hollowed out area, and placing a portion of the anode layer in the hollowed out area as a portion to be etched;
  • Step 3 providing a resist layer on the surface of the anode layer, using a part of the resist layer as an etching resist, and setting the etching resist at a position opposite to the hollow area;
  • Step 4 Etching the portion to be etched so that the auxiliary electrode is exposed, and the anode layer forms an anode extension under the corrosion resistance portion, and the anode extension exposes the auxiliary electrode. Partial occlusion of the exposed area;
  • Step 5 Strip the resist layer, and then sequentially set a pixel definition layer, an organic light emitting layer, and a cathode layer on the anode layer to form a developing layer;
  • the developing layer formed on the anode extension portion is used as a shielding portion, and the shielding portion and the auxiliary electrode and the electrical connection portion are separated from each other.
  • the step 5 includes the step 51.
  • the pixel definition layer covers the anode layer and the auxiliary electrode as a whole, and then performs an exposure operation on the pixel definition layer to eliminate the pixel definition layer.
  • the pixel defining layer covers the auxiliary electrode, and the pixel defining layer forms a pixel extension on the surface of the anode extension, and the pixel extension constitutes a part of the shielding portion.
  • the step 5 further includes a step 52, in which the organic light emitting layer is formed on the surface of the anode layer and the pixel definition layer by a vapor deposition method, and the organic light emitting layer is formed by using the shielding portion.
  • the organic light emitting layer is formed on the surface of the anode layer and the pixel definition layer by a vapor deposition method, and the organic light emitting layer is formed by using the shielding portion.
  • the step 5 further includes a step 53 of forming the cathode layer on the surface of the organic light-emitting layer by using a vapor deposition method, and the cathode layer is formed by using the shielding portion to perform vapor deposition by shielding to form a cathode A connection part, the cathode electrical connection part covering a surface of the light-emitting electrical connection part, and the cathode electrical connection part also covering a part of a surface of the auxiliary electrode; and forming a cathode extension part on a surface of the light-emitting extension part
  • the cathode extension portion constitutes a part of the shielding portion.
  • the resist layer is made of a photoresist.
  • the application also provides an OLED panel, including:
  • An auxiliary electrode provided on a surface of the substrate
  • a flat layer which is provided on the surface of the substrate and the auxiliary electrode, and the flat layer is provided with a hollowed-out area at a position corresponding to the auxiliary electrode;
  • the developing layer is provided on the surface of the flat layer, the developing layer includes an electrical connection portion and a shielding portion, and the electrical connection portion extends to the hollow area and is electrically connected to the auxiliary electrode.
  • the shielding portion extends to a position opposite to the hollowed-out area, and the shielding portion is separated from the auxiliary electrode and the electrical connection portion.
  • the developing layer includes an anode layer, the anode layer is provided on the surface of the flat layer, a part of the anode layer is an anode extension portion, and the anode extension portion extends to a position opposite to the hollow area. Position so that the anode extension constitutes a part of the shielding portion.
  • the display layer further includes a pixel definition layer, which is provided on the surface of the anode layer and the flat layer at the same time, and a part of the pixel definition layer is a pixel extension portion, and the pixel The extension portion is provided on a surface of the anode extension portion, so that the pixel extension portion constitutes a part of the shielding portion.
  • the display layer further includes an organic light emitting layer, which is provided on the surface of the anode layer and the pixel defining layer at the same time, and a part of the organic light emitting layer is a light emitting extension, and the light emitting layer
  • the extension portion is provided on the surface of the pixel extension portion, so that the light emitting extension portion constitutes a part of the shielding portion;
  • the organic light emitting layer also has a portion that is a light emitting electrical connection portion, and the light emitting electrical connection portion extends to The hollow region is electrically connected to the auxiliary electrode, so that the light-emitting electrical connection portion constitutes a part of the electrical connection portion.
  • the developing layer further includes a cathode layer provided on a surface of the organic light emitting layer, and a part of the cathode layer is a cathode extension portion, and the cathode extension portion is provided on the light emitting extension portion.
  • a cathode layer provided on a surface of the organic light emitting layer, and a part of the cathode layer is a cathode extension portion, and the cathode extension portion is provided on the light emitting extension portion.
  • Surface of the cathode so that the cathode extension part constitutes a part of the shielding part
  • the cathode layer further has a cathode electrical connection part, and the cathode electrical connection part extends to the hollow area to cover the light-emitting electricity
  • the cathode electrical connection portion is also electrically connected to the auxiliary electrode, so that the cathode electrical connection portion constitutes a part of the electrical connection portion.
  • the developing layer includes an electrical connection portion and a shielding portion, and the electrical connection portion extends to the hollow area to be electrically connected to the auxiliary electrode.
  • the shielding portion extends to a position opposite to the hollowed out area, so this method saves the setting of the photomask under the premise of keeping the hollowed out area and electrically connected with the auxiliary electrode, simplifying the manufacturing process and production Cost has provided important help for the production of OLED panels.
  • the resist layer is extended to a position opposite to the hollowed-out area, so that an anode can be formed after the etching.
  • the extension portion and the entire shield portion formed by the anode extension portion can realize the shielding of the hollowed out area, and the shield portion can be used for shielding evaporation to form an electrical connection portion to ensure the electrical connection with the auxiliary electrode and eliminate the light.
  • the setting of the cover simplifies the manufacturing process and manufacturing cost, and provides important help for the production of OLED panels.
  • FIG. 1 is a schematic structural diagram provided by a preferred embodiment of the OLED panel of the present invention.
  • FIG. 2 is a schematic diagram of manufacturing a flat layer provided by a preferred embodiment of a method for manufacturing an OLED panel according to the present invention
  • FIG. 3 is a schematic diagram of manufacturing an anode layer provided by a preferred embodiment of a method for manufacturing an OLED panel according to the present invention
  • FIG. 4 is a schematic diagram of manufacturing a resist layer provided by a preferred embodiment of a method for manufacturing an OLED panel according to the present invention
  • FIG. 5 is a schematic view of etching of a portion to be etched provided by a preferred embodiment of a method for manufacturing an OLED panel according to the present invention
  • FIG. 6 is a schematic diagram of manufacturing a pixel definition layer provided by a preferred embodiment of a method for manufacturing an OLED panel according to the present invention.
  • FIG. 7 is a schematic diagram of a pixel definition layer exposure process provided by a preferred embodiment of a method for manufacturing an OLED panel according to the present invention.
  • FIG. 8 is a schematic diagram of manufacturing a cathode layer provided by a preferred embodiment of a method for manufacturing an OLED panel according to the present invention.
  • the OLED panel according to the embodiment of the present invention includes:
  • the substrate 1 defines the upper surface of the substrate 1 as the upper surface and the lower surface of the substrate 1.
  • the substrate 1 is made of glass material.
  • the auxiliary electrode 2 is provided on the upper surface of the substrate 1.
  • the flat layer 3 and the flat layer 3 completely cover the upper surface of the substrate 1, and the flat layer 3 partially covers the auxiliary electrode 2.
  • the space where the flat layer 3 does not cover the auxiliary electrode 2 is a hollow area 31, and the auxiliary electrode 2 is Appears in the hollowed-out area 31.
  • the anode layer 4 is divided left and right based on the hollowed area 31.
  • the left anode layer 4 is provided on the surface of the left flat layer 3.
  • the left anode layer 4 does not extend above the hollowed area 31, and the right
  • the anode layer 4 on the side is provided on the surface of the flat layer 3 on the right side.
  • the anode layer 4 on the right side extends above the hollowed area 31, and the anode layer 4 extends above the hollowed area 31 as the anode extension 41.
  • the pixel definition layer 5 is divided left and right based on the hollowed-out area 31.
  • the left pixel definition layer 5 covers the surface of the left anode layer 4 and the left flat layer 3 at the same time.
  • the left pixel definition layer 5 is not
  • the pixel definition layer 5 extends to the surface of the anode extension 41 on the right side and extends above the hollow area 31.
  • the pixel definition layer 5 extends above the hollow area 31 as a pixel extension. 51.
  • the organic light-emitting layer 6 is divided left and right based on the hollowed-out area 31.
  • the left organic light-emitting layer 6 covers the surface of the left anode layer 4 and the left pixel definition layer 5 at the same time.
  • the right side extends into the hollowed-out area 31 to form a light-emitting electrical connection portion 61, which partially covers the auxiliary electrode 2.
  • the right-side organic light-emitting layer 6 is provided on the surface of the pixel extension portion 51 and extends to the hollowed-out area. Above 31, a portion where the organic light emitting layer 6 extends above the hollow area 31 is a light emitting extension 62.
  • the cathode layer 7 is divided left and right with the hollow area 31 as a reference.
  • the left cathode layer 7 covers the surface of the left organic light emitting layer 6 and the right side of the left cathode layer 7 extends into the hollow area 31 to form a cathode.
  • the electrical connection portion 71, the cathode electrical connection portion 71 covers the light-emitting electrical connection portion 61, and the cathode electrical connection portion 71 also covers the auxiliary electrode 2.
  • the right cathode layer 7 is provided on the surface of the light-emitting extension portion 62, and Extending above the hollowed-out area 31, a portion where the cathode layer 7 extends above the hollowed-out area 31 is a cathode extension 72.
  • the cathode layer 7, the organic light-emitting layer 6, the pixel definition layer 5, and the anode layer 4 are stacked in order from the top to the bottom to form a developing layer, which is used to realize the imaging display of the OLED panel;
  • the connection portion 71 and the light-emitting electrical connection portion 61 are sequentially stacked from top to bottom to form an electrical connection portion for electrically connecting with the auxiliary electrode 2, and the cathode extension portion 72, the light-emitting extension portion 62, the pixel extension portion 51, and the anode extension portion.
  • 41 is formed from the top to the bottom in order to form a shielding portion for shielding the hollowed-out area 31.
  • an OLED panel including a substrate 1; a flat layer 3, the flat layer 3 is provided on the surface of the substrate 1, and the flat layer 3 is provided with a hollow area 31; An auxiliary electrode 2, which is disposed in the hollow area 31; and a developing layer, which is provided on the surface of the flat layer 3, the developing layer includes an electrical connection portion and a shielding portion, The electrical connection portion extends into the hollow area 31 to be electrically connected to the auxiliary electrode 2, the shielding portion extends to a position disposed opposite to the hollow area 31, and the shielding portion and the auxiliary electrode 2 And the electrical connection portions are separated from each other.
  • a part of the developing layer can be used as an electrical connection portion for electrically connecting with the auxiliary electrode 2 and a part of the developing layer can be used as a shielding portion to shield the hollow area 31, thereby replacing the current
  • a mask structure for shielding which simplifies the manufacturing process and manufacturing cost, and provides important help for the production of OLED panels.
  • the developing layer includes an anode layer 4, the anode layer 4 is provided on the surface of the flat layer 3, a part of the anode layer 4 is an anode extension 41, and the anode The extending portion 41 extends to a position disposed opposite to the hollowed-out area 31, so that the anode extending portion 41 constitutes a part of the shielding portion.
  • the anode extension 41 is used as a part of the anode layer 4 without any change in material.
  • the position of the anode layer 4 at a specific position is defined as the anode extension 41.
  • the anode extension 41 is It can be used as the base of the shielding portion, so as to cover the anode extension portion 41 with other layers to form the shielding portion.
  • the imaging layer further includes a pixel definition layer 5 which is provided on the surface of the anode layer 4 and the flat layer 3 at the same time, and the pixel A part of the definition layer 5 is a pixel extension 51, and the pixel extension 51 is provided on a surface of the anode extension 41 so that the pixel extension 51 constitutes a part of the shielding portion.
  • the pixel extension portion 51 is used as a part of the pixel definition layer 5.
  • the material of the pixel extension portion 51 has not changed.
  • the pixel extension portion 51 is defined as the pixel extension portion 51.
  • the pixel extension portion 51 and the anode extension portion 41 can be used together as a base of the shielding portion, so that the pixel extension portion 51 is covered with other layers to form the shielding portion.
  • the organic light-emitting layer 6 is summarized as: the developing layer further includes an organic light-emitting layer 6, which is provided on the surface of the anode layer 4 and the pixel definition layer 5 at the same time, and the organic light-emitting layer A part is a light emitting extension part 62, and the light emitting extension part 62 is provided on the surface of the pixel extension part 51 so that the light emitting extension part 62 forms a part of the shielding part; the organic light emitting layer 6 has One part is a light-emitting electrical connection portion 61, and the light-emitting electrical connection portion 61 extends to the hollow area 31 and is electrically connected to the auxiliary electrode 2 so that the light-emitting electrical connection portion 61 constitutes a part of the electrical connection portion.
  • the light-emitting extension portion 62 and the light-emitting electrical connection portion 61 are both part of the organic light-emitting layer, and the material of the light-emitting extension portion 62 is not changed. Another portion of the organic light-emitting layer 6 at a specific position is defined as a light-emitting electrical connection portion 61.
  • the light-emitting extension portion 62, the pixel extension portion 51, and the anode extension portion 41 can collectively serve as a base of the shielding portion, so that The light-emitting extension portion 62 is covered with other layers to form a shielding portion, and the light-emitting electrical connection portion 61 can be electrically connected to the auxiliary electrode 2 as a part of the electrical connection portion.
  • the developing layer further includes a cathode layer 7, the cathode layer 7 is provided on the surface of the organic light emitting layer 6, and a part of the cathode layer 7 is a cathode extension 72,
  • the cathode extension portion 72 is provided on the surface of the light emitting extension portion 62 so that the cathode extension portion 72 constitutes a part of the shielding portion;
  • the cathode layer 7 also has a portion that is a cathode electrical connection portion 71.
  • the cathode electrical connection portion 71 extends to the hollow area 31 to cover the light-emitting electrical connection portion 61.
  • the cathode electrical connection portion 71 is also electrically connected to the auxiliary electrode 2 so that the cathode electrical connection portion 71 constitutes a part of the electrical connection portion.
  • the cathode extension portion 72 and the cathode electrical connection portion 71 are both part of the cathode layer 7.
  • the material of the cathode extension portion 72 has not changed.
  • a portion having the cathode layer 7 at a specific position is defined as the cathode extension portion 72.
  • the other part of the cathode layer 7 at a specific position is defined as a cathode electrical connection portion 71.
  • the cathode extension portion 72, the light emitting extension portion 62, the pixel extension portion 51, and the anode extension portion 41 can collectively constitute a shielding portion.
  • the cathode electrical connection portion 71 and the light-emitting electrical connection portion 61 can form an electrical connection portion together, thereby achieving electrical connection with the auxiliary electrode 2.
  • the manufacturing method of the OLED panel according to the embodiment of the present invention includes the following steps:
  • step 1 as shown in FIG. 2, a flat layer 3 and an auxiliary electrode 2 are provided on the substrate 1, and the auxiliary electrode 2 is provided in the hollowed-out area 31 of the flat layer 3;
  • the electrode 2 is disposed on the upper surface of the substrate 1, and then the upper surface of the substrate 1 is covered to form a flat layer 3.
  • the flat layer 3 will completely cover the auxiliary electrode 2, and then the flat layer 3 is placed on the auxiliary electrode 2.
  • a part of the surface is etched to form the hollowed-out area 31, and the appearance of the auxiliary electrode 2 in the hollowed-out area 31 can be achieved.
  • Step 2 As shown in FIGS. 2 and 3, an anode layer 4 is set to cover the flat layer 3 and the hollowed-out area 31, and a portion of the anode layer 4 placed in the hollowed-out area 31 is used as a portion to be etched 42 Wherein, the material to be etched 42 is a part of the anode layer 4, and the material is not changed. For the convenience of description, the portion where the anode layer 4 is placed at a specific position is defined as the etched portion 42.
  • a resist layer 8 is provided on the surface of the anode layer 4, a part of the resist layer 8 is used as an etching resisting portion 81, and the etching resisting portion 81 is provided on Where the hollowed-out area 31 is opposite, at this time, the rest of the resist layer 8 should be placed at a position other than directly above the hollowed-out area 31; wherein, the resist layer 8 can be made of photoresist, and the resist 81 As a part of the resist layer, the material is not changed in any way.
  • the portion where the resist layer 8 is placed at a specific position is defined as the corrosion resisting portion 81.
  • step 4 as shown in FIGS. 2, 4 and 5, the portion to be etched 42 is etched so that the auxiliary electrode 2 is exposed, and the anode layer 4 forms an anode under the corrosion resisting portion 81.
  • the extension portion 41 where the anode extension portion 41 partially shields the exposed part of the auxiliary electrode 2 from being exposed; wherein, the wet etching method can be used to etch the etched portion 42, because the resist 8 does not cover the hollow area 31
  • the left side of the to-be-etched portion 42 will be completely wet-etched while the left portion of the to-be-etched portion 42 is in an exposed state, and the right-side portion of the to-be-etched portion 42 is shielded and protected by the corrosion-resistant portion 81, so that part of the to-be-etched portion 42 remains formed Anode extension 41.
  • step 5 as shown in FIGS. 1, 2, and 5 to 8, the resist layer 8 is peeled off, and then a pixel definition layer 5, an organic light-emitting layer 6, and a cathode layer 7 are sequentially disposed on the anode layer 4.
  • the developing layer formed on the portion 41 serves as a shielding portion, and separates the shielding portion from the auxiliary electrode 2 and the electrical connection portion from each other.
  • Step 5 can be divided into the following sub-steps:
  • step 51 the pixel definition layer 5 first covers the anode layer 4 and the auxiliary electrode 2 as a whole, and then performs an exposure operation on the pixel definition layer 5 to eliminate
  • the pixel definition layer 5 covers the auxiliary electrode 2, and the pixel definition layer 5 forms a pixel extension 51 on the surface of the anode extension 41, and the pixel extension 51 constitutes a part of the shielding portion;
  • a light blocking structure may be used to block parts of the pixel definition layer 5 that do not need to be exposed, so as to control the position and size of the exposed area of the pixel definition layer 5.
  • the organic light emitting layer 6 is formed on the surface of the anode layer 4 and the pixel definition layer 5 by evaporation.
  • the organic light emitting layer 6 is shielded by using the shielding portion.
  • a light-emitting electrical connection portion 61 is formed by plating, the light-emitting electrical connection portion 61 covers a part of the surface of the auxiliary electrode 2, and the light-emitting electrical connection portion 61 constitutes a part of the electrical connection portion; and the organic light-emitting layer 6 is
  • a light-emitting extension 62 is formed on the surface of the pixel extension 51, and the light-emitting extension 62 constitutes a part of the shielding portion. Where only the angle of vapor deposition is controlled, it is possible to control which parts of the hollow area 31 form a light-emitting electrical connection.
  • the portion 62 can be selected by matching the evaporation angle according to the size and position of the shielding portion.
  • Step 53 as shown in FIGS. 1 and 8, the cathode layer 7 is formed on the surface of the organic light-emitting layer 6 by evaporation, and the cathode layer 7 forms a cathode electrical connection portion by using the shielding portion for shielding evaporation. 71.
  • the cathode electrical connection portion 71 covers the surface of the light-emitting electrical connection portion 61, and the cathode electrical connection portion 71 also covers a portion of the surface of the auxiliary electrode 2; and on the surface of the light-emitting extension portion 62 A cathode extension portion 72 is formed, and the cathode extension portion 72 forms a part of the shielding portion; similarly, by controlling the angle of evaporation, it is possible to control where in the hollowed area 31 the cathode electrical connection portion is formed, and the angle of evaporation The matching and selection may be performed according to the size and position of the shielding portion.
  • the entire manufacturing process of the present invention does not add any new raw materials, but extends the resist layer 8 to a position opposite to the hollowed-out area 31, so that After etching, the anode extension portion 41 can be formed, and the shield extension portion can be formed as a whole by the anode extension portion 41, thereby shielding the hollowed-out area 31. Furthermore, the shield portion can be used for shielding vapor deposition to form an electrical connection portion to ensure the connection with the auxiliary The electrode 2 is electrically connected, thereby eliminating the setting of the photomask, simplifying the manufacturing process and manufacturing cost, and providing important help for the production of the OLED panel.

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Abstract

一种OLED面板及其制作方法，OLED面板包括基板（1）；平坦层（3），设于所述基板（1）表面且设有镂空区（31）；辅助电极（2），设于所述镂空区（31）内；显像层，设于所述平坦层（3）表面且包括电连接部和遮挡部，所述电连接部延伸至所述镂空区（31）内与所述辅助电极（2）电连接，所述遮挡部延伸至与所述镂空区（31）相对布置的位置且与所述辅助电极（2）、所述电连接部相分离。

Description

OLED面板及其制作方法 技术领域
本发明涉及OLED面板领域的技术方案，特别涉及一种OLED面板及其制作方法。
 背景技术
在进行OLED面板生产的过程中，会在平坦层覆盖辅助电极的一部分镂空形成镂空区，然后通过显像层从镂空区两侧与辅助电极进行电性连接，由于此时镂空区的其余部位会将辅助电极外露，为解决此问题，会在镂空区内增设光罩进行遮挡，但是光罩制作过程复杂困难，从而降低了生产效率和提高了生产成本，为OLED的批量生产带来极为不利的影响。
 技术问题
本发明的目的在于提供一种OLED面板及其制作方法，以解决现有技术需要制作光罩而增加成本的问题。
 技术解决方案
为解决上述问题，本发明提供的技术方案如下：
一种OLED面板，包括，基板；平坦层，所述平坦层设于所述基板的表面，所述平坦层设有镂空区；辅助电极，所述辅助电极设于所述镂空区内；以及显像层，所述显像层设于所述平坦层表面，所述显像层包括电连接部和遮挡部，所述电连接部延伸至所述镂空区内与所述辅助电极电性连接，所述遮挡部延伸至与所述镂空区相对布置的位置，所述遮挡部与所述辅助电极、以及所述电连接部相互分离。
有关OLED面板，所述显像层包括阳极层，所述阳极层设于所述平坦层表面，所述阳极层一部分为阳极延伸部，所述阳极延伸部延伸至与所述镂空区相对布置的位置，以使所述阳极延伸部构成所述遮挡部的一部分。
有关OLED面板，所述显像层还包括像素定义层，所述像素定义层同时设于所述阳极层和所述平坦层的表面，所述像素定义层的一部分为像素延伸部，所述像素延伸部设于所述阳极延伸部的表面，以使所述像素延伸部构成所述遮挡部的一部分。
有关OLED面板，所述显像层还包括有机发光层，所述有机发光层同时设于所述阳极层和所述像素定义层表面，所述有机发光层有一部分为发光延伸部，所述发光延伸部设于所述像素延伸部的表面，以使所述发光延伸部构成所述遮挡部的一部分；所述有机发光层还有一部分为发光电连接部，所述发光电连接部延伸至所述镂空区与所述辅助电极电性连接，以使所述发光电连接部构成所述电连接部的一部分。
有关OLED面板，所述显像层还包括阴极层，所述阴极层设于所述有机发光层表面，所述阴极层有一部分为阴极延伸部，所述阴极延伸部设于所述发光延伸部的表面，以使所述阴极延伸部构成所述遮挡部的一部分；所述阴极层还有一部分为阴极电连接部，所述阴极电连接部延伸至所述镂空区以覆盖于所述发光电连接部上，所述阴极电连接部还与所述辅助电极电性连接，以使所述阴极电连接部构成所述电连接部的一部分。
一种OLED面板的制作方法，用于制作上述的OLED面板，包括以下步骤：
步骤1，在基板上设置平坦层和辅助电极，并将所述辅助电极设于所述平坦层的所述镂空区内；
步骤2，设置阳极层覆盖所述平坦层和所述镂空区，并将所述阳极层置于所述镂空区内的部分作为待蚀部；
步骤3，在所述阳极层表面设置抗蚀层，将所述抗蚀层的一部分作为阻蚀部，并将所述阻蚀部设于与所述镂空区相对的位置；
步骤4，对所述待蚀部进行刻蚀，以使得所述辅助电极外露显现、以及所述阳极层在所述阻蚀部下方形成阳极延伸部，所述阳极延伸部对所述辅助电极外露显现的部位进行局部遮挡；
步骤5，剥离所述抗蚀层，然后在所述阳极层上依序设置像素定义层、有机发光层和阴极层，以此构成显像层；
将所述显像层的一部分作为电连接部，并使得所述电连接部延伸至所述镂空区内与所述辅助电极电性连接；
将在所述阳极延伸部上形成的所述显像层作为遮挡部，并使得所述遮挡部与所述辅助电极、以及所述电连接部相互分离。
有关OLED面板的制作方法，所述步骤5包括步骤51，先使得所述像素定义层对所述阳极层和所述辅助电极进行整体覆盖，然后对所述像素定义层进行曝光操作，以消除所述像素定义层对所述辅助电极的覆盖，并使得所述像素定义层在所述阳极延伸部表面形成像素延伸部，所述像素延伸部构成所述遮挡部的一部分。
有关OLED面板的制作方法，所述步骤5还包括步骤52，采用蒸镀方式在所述阳极层和所述像素定义层表面形成所述有机发光层，所述有机发光层通过利用所述遮挡部进行遮挡蒸镀形成发光电连接部，所述发光电连接部覆盖于所述辅助电极一部分的表面，所述发光电连接部构成所述电连接部的一部分；以及所述有机发光层在所述像素延伸部表面形成发光延伸部，所述发光延伸部构成所述遮挡部的一部分。
有关OLED面板的制作方法，所述步骤5还包括步骤53，采用蒸镀方式在所述有机发光层表面形成所述阴极层，所述阴极层通过利用所述遮挡部进行遮挡蒸镀形成阴极电连接部，所述阴极电连接部覆盖于所述发光电连接部的表面，且所述阴极电连接部还覆盖于所述辅助电极一部分的表面；以及在所述发光延伸部表面形成阴极延伸部，所述阴极延伸部构成所述遮挡部的一部分。
有关OLED面板的制作方法，在所述步骤3中，使用光阻制成所述抗蚀层。
本申请还提供一种OLED面板，包括，
基板；
辅助电极，所述辅助电极设于所述基板的表面；
平坦层，所述平坦层设于所述基板以及所述辅助电极的表面，且所述平坦层在对应所述辅助电极的位置设有镂空区；
以及显像层，所述显像层设于所述平坦层表面，所述显像层包括电连接部和遮挡部，所述电连接部延伸至所述镂空区内与所述辅助电极电性连接，所述遮挡部延伸至与所述镂空区相对布置的位置，所述遮挡部与所述辅助电极、以及所述电连接部相互分离。
有关OLED面板，所述显像层包括阳极层，所述阳极层设于所述平坦层表面，所述阳极层一部分为阳极延伸部，所述阳极延伸部延伸至与所述镂空区相对布置的位置，以使所述阳极延伸部构成所述遮挡部的一部分。
有关OLED面板，所述显像层还包括像素定义层，所述像素定义层同时设于所述阳极层和所述平坦层的表面，所述像素定义层的一部分为像素延伸部，所述像素延伸部设于所述阳极延伸部的表面，以使所述像素延伸部构成所述遮挡部的一部分。
有关OLED面板，所述显像层还包括有机发光层，所述有机发光层同时设于所述阳极层和所述像素定义层表面，所述有机发光层有一部分为发光延伸部，所述发光延伸部设于所述像素延伸部的表面，以使所述发光延伸部构成所述遮挡部的一部分；所述有机发光层还有一部分为发光电连接部，所述发光电连接部延伸至所述镂空区与所述辅助电极电性连接，以使所述发光电连接部构成所述电连接部的一部分。
有关OLED面板，所述显像层还包括阴极层，所述阴极层设于所述有机发光层表面，所述阴极层有一部分为阴极延伸部，所述阴极延伸部设于所述发光延伸部的表面，以使所述阴极延伸部构成所述遮挡部的一部分；所述阴极层还有一部分为阴极电连接部，所述阴极电连接部延伸至所述镂空区以覆盖于所述发光电连接部上，所述阴极电连接部还与所述辅助电极电性连接，以使所述阴极电连接部构成所述电连接部的一部分。
 有益效果
本发明的有益效果如下：
由于本发明所述的OLED面板包括有显像层，所述显像层包括电连接部和遮挡部，所述电连接部延伸至所述镂空区内与所述辅助电极电性连接，所述遮挡部延伸至与所述镂空区相对布置的位置，所以此方式在保持对镂空区进行遮挡、以及与辅助电极电性连接的前提下，省去了光罩的设置，简化了制作工艺和制作成本，为OLED面板的生产提供了重要帮助。
类似地，在上述OLED面板的制作方法中，由于整个制作过程并未添加任何新的原料，而是通过将抗蚀层延伸至与镂空区相对的位置，从而使得在进行刻蚀后能形成阳极延伸部，以及利用阳极延伸部形成遮挡部的整体，实现了对镂空区的遮挡，而且还可以利用遮挡部进行遮挡蒸镀形成电连接部，以确保与辅助电极的电性连接，取消了光罩的设置，简化了制作工艺和制作成本，为OLED面板的生产提供了重要帮助。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明OLED面板优选实施方式提供的结构示意图；
图2是本发明OLED面板制作方法优选实施方式提供的平坦层制作示意图；
图3是本发明OLED面板制作方法优选实施方式提供的阳极层制作示意图；
图4是本发明OLED面板制作方法优选实施方式提供的抗蚀层制作示意图；
图5是本发明OLED面板制作方法优选实施方式提供的待蚀部刻蚀示意图；
图6是本发明OLED面板制作方法优选实施方式提供的像素定义层制作示意图；
图7是本发明OLED面板制作方法优选实施方式提供的像素定义层曝光处理示意图；
图8是本发明OLED面板制作方法优选实施方式提供的阴极层制作示意图。
附图标记如下：
1、基板；2、辅助电极；3、平坦层；31、镂空区；4、阳极层；41、阳极延伸部；42、待蚀部；5、像素定义层；51、像素延伸部；6、有机发光层；61、发光电连接部；62、发光延伸部；7、阴极层；71、阴极电连接部；72、阴极延伸部；8、抗蚀层；81、阻蚀部。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
从图1可知，本发明实施例所述的OLED面板包括有：
基板1，定义基板1的上方为其上表面，下方为其下表面，其中，基板1采用玻璃材质制成。
辅助电极2，辅助电极2设于基板1的上表面。
平坦层3，平坦层3对基板1的上表面进行全面覆盖，且平坦层3对辅助电极2进行局部覆盖，平坦层3未对辅助电极2进行覆盖的空间为镂空区31，辅助电极2在镂空区31内显现。
阳极层4，以镂空区31为基准进行左右划分，则有左侧的阳极层4设于左侧的平坦层3表面，左侧的阳极层4并未延伸至镂空区31的上方，而右侧的阳极层4设于右侧的平坦层3表面，右侧的阳极层4延伸至镂空区31的上方，阳极层4此延伸至镂空区31上方的部位为阳极延伸部41。
像素定义层5，以镂空区31为基准进行左右划分，则有左侧的像素定义层5同时覆盖于左侧阳极层4和左侧平坦层3的表面，左侧的像素定义层5并未延伸至镂空区31的上方，而右侧的像素定义层5设于阳极延伸部41的表面，并延伸至镂空区31的上方，像素定义层5延伸至镂空区31上方的部位为像素延伸部51。
有机发光层6，以镂空区31为基准进行左右划分，则有左侧的有机发光层6同时覆盖于左侧阳极层4和左侧像素定义层5的表面，且左侧有机发光层6的右侧延伸至镂空区31内形成发光电连接部61，发光电连接部61对辅助电极2进行局部覆盖；而右侧的有机发光层6设于像素延伸部51的表面，并延伸至镂空区31的上方，有机发光层6延伸至镂空区31上方的部位为发光延伸部62。
阴极层7，以镂空区31为基准进行左右划分，则有左侧的阴极层7覆盖于左侧有机发光层6的表面，且左侧阴极层7的右侧延伸至镂空区31内形成阴极电连接部71，阴极电连接部71对发光电连接部61进行覆盖，且阴极电连接部71还对辅助电极2进行覆盖；而右侧的阴极层7设于发光延伸部62的表面，并延伸至镂空区31的上方，阴极层7延伸至镂空区31上方的部位为阴极延伸部72。
在上述基础上，所述的阴极层7、有机发光层6、像素定义层5和阳极层4从上往下依次层叠形成为显像层，用以实现OLED面板的成像显示；其中，阴极电连接部71与发光电连接部61从上往下依次层叠形成电连接部，用于与辅助电极2进行电性连接，而阴极延伸部72、发光延伸部62、像素延伸部51和阳极延伸部41从上往下依次层叠形成遮挡部，用于对镂空区31进行遮挡。
此实施例至少具备以下有益效果：
1.将OLED面板的基础结构概括为：一种OLED面板，包括，基板1；平坦层3，所述平坦层3设于所述基板1的表面，所述平坦层3设有镂空区31；辅助电极2，所述辅助电极2设于所述镂空区31内；以及显像层，所述显像层设于所述平坦层3表面，所述显像层包括电连接部和遮挡部，所述电连接部延伸至所述镂空区31内与所述辅助电极2电性连接，所述遮挡部延伸至与所述镂空区31相对布置的位置，所述遮挡部与所述辅助电极2、以及所述电连接部相互分离。
在满足此结构后，能够利用显像层的一部分作为电连接部，用于与辅助电极2电性连接，以及利用显像层的一部分作为遮挡部对镂空区31进行遮挡，从而取替了现有技术需要设置光罩进行遮挡的结构，简化了制作工艺和制作成本，为OLED面板的生产提供了重要帮助。
2.将阳极层4的结构概括为：所述显像层包括阳极层4，所述阳极层4设于所述平坦层3表面，所述阳极层4一部分为阳极延伸部41，所述阳极延伸部41延伸至与所述镂空区31相对布置的位置，以使所述阳极延伸部41构成所述遮挡部的一部分。
阳极延伸部41作为阳极层4的一部分，其材质并没有任何改变，为便于描述，才将阳极层4处于特定位置的部位定义为阳极延伸部41，在满足此结构后，阳极延伸部41便可作为遮挡部的基底，以便在阳极延伸部41上覆盖各层其他材质形成遮挡部。
3.将像素定义层5的结构概括为：所述显像层还包括像素定义层5，所述像素定义层5同时设于所述阳极层4和所述平坦层3的表面，所述像素定义层5的一部分为像素延伸部51，所述像素延伸部51设于所述阳极延伸部41的表面，以使所述像素延伸部51构成所述遮挡部的一部分。
像素延伸部51作为像素定义层5的一部分，其材质并没有任何改变，为便于描述，才将像素定义层5处于特定位置的部位定义为像素延伸部51，在满足此结构后，像素延伸部51和阳极延伸部41便可共同作为遮挡部的基底，以便在像素延伸部51上覆盖各层其他材质形成遮挡部。
4.将有机发光层6概括为：所述显像层还包括有机发光层6，所述有机发光层6同时设于所述阳极层4和所述像素定义层5表面，所述有机发光层6有一部分为发光延伸部62，所述发光延伸部62设于所述像素延伸部51的表面，以使所述发光延伸部62构成所述遮挡部的一部分；所述有机发光层6还有一部分为发光电连接部61，所述发光电连接部61延伸至所述镂空区31与所述辅助电极2电性连接，以使所述发光电连接部61构成所述电连接部的一部分。
发光延伸部62和发光电连接部61均为有机发光层的一部分，其材质并没有任何改变，为便于描述，才将有机发光层6处于特定位置的一部位定义为发光延伸部62，以及将有机发光层6处于特定位置的另一部位定义为发光电连接部61，在满足此结构后，发光延伸部62、像素延伸部51和阳极延伸部41便可共同作为遮挡部的基底，以便在发光延伸部62上覆盖各层其他材质形成遮挡部，而发光电连接部61则可作为电连接部的一部分与辅助电极2实现电性连接。
5.将阴极层7的结构概括为：所述显像层还包括阴极层7，所述阴极层7设于所述有机发光层6表面，所述阴极层7有一部分为阴极延伸部72，所述阴极延伸部72设于所述发光延伸部62的表面，以使所述阴极延伸部72构成所述遮挡部的一部分；所述阴极层7还有一部分为阴极电连接部71，所述阴极电连接部71延伸至所述镂空区31以覆盖于所述发光电连接部61上，所述阴极电连接部71还与所述辅助电极2电性连接，以使所述阴极电连接部71构成所述电连接部的一部分。
阴极延伸部72和阴极电连接部71均为阴极层7的一部分，其材质并没有任何改变，为便于描述，才将有阴极层7处于特定位置的一部位定义为阴极延伸部72，以及将阴极层7处于特定位置的另一部位定义为阴极电连接部71，在满足此结构后，阴极延伸部72、发光延伸部62、像素延伸部51和阳极延伸部41便可共同构成遮挡部，以实现对镂空区的遮挡，而阴极电连接部71则可与发光电连接部61共同构成电连接部，以此与辅助电极2实现电性连接。
另外，从图1至8可知，本发明实施例所述OLED面板的制作方法，包括以下步骤：
步骤1，如图2所示，在基板1上设置平坦层3和辅助电极2，并将所述辅助电极2设于所述平坦层3的所述镂空区31内；其中，可先将辅助电极2设于基板1的上表面，然后在基板1上表面覆盖形成平坦层3，此时平坦层3将对辅助电极2进行完全覆盖，在这基础上再对平坦层3置于辅助电极2表面的一部分进行刻蚀形成镂空区31，便可实现辅助电极2在镂空区31的显现。
步骤2，如图2和3所示，设置阳极层4覆盖所述平坦层3和所述镂空区31，并将所述阳极层4置于所述镂空区31内的部分作为待蚀部42；其中，待蚀部42作为阳极层4的一部分，其材质并没有任何改变，为便于描述，才将阳极层4置于特定位置的部位定义为待蚀部42。
步骤3，如图2和4所示，在所述阳极层4表面设置抗蚀层8，将所述抗蚀层8的一部分作为阻蚀部81，并将所述阻蚀部81设于与所述镂空区31相对的位置，此时抗蚀层8的其余部分应置于镂空区31正上方以外的位置；其中，可使用光阻制成所述抗蚀层8，而阻蚀部81作为抗蚀层的一部分，其材质并没有任何改变，为便于描述，才将抗蚀层8置于特定位置的部位定义为阻蚀部81。
步骤4，如图2、4和5所示，对所述待蚀部42进行刻蚀，以使得所述辅助电极2外露显现、以及所述阳极层4在所述阻蚀部81下方形成阳极延伸部41，所述阳极延伸部41对所述辅助电极2外露显现的部位进行局部遮挡；其中，可采用湿蚀法对待蚀部42进行刻蚀，由于抗蚀层8并未对镂空区31的左侧进行遮挡，所以待蚀部42的左部将处于外露状态而被完全湿蚀，而待蚀部42的右侧部分被阻蚀部81遮挡保护，从而使得部分待蚀部42保留形成阳极延伸部41。
步骤5，如图1、2、以及5至8所示，剥离所述抗蚀层8，然后在所述阳极层4上依序设置像素定义层5、有机发光层6和阴极层7，以此构成显像层；将所述显像层的一部分作为电连接部，并使得所述电连接部延伸至所述镂空区31内与所述辅助电极2电性连接；将在所述阳极延伸部41上形成的所述显像层作为遮挡部，并使得所述遮挡部与所述辅助电极2、以及所述电连接部相互分离。
其中，步骤5可以分为以下子步骤：
步骤51，如图6和7所示，先使得所述像素定义层5对所述阳极层4和所述辅助电极2进行整体覆盖，然后对所述像素定义层5进行曝光操作，以消除所述像素定义层5对所述辅助电极2的覆盖，并使得所述像素定义层5在所述阳极延伸部41表面形成像素延伸部51，所述像素延伸部51构成所述遮挡部的一部分；其中，在进行曝光操作时，可使用挡光结构对像素定义层5无需曝光的部位进行遮挡，从而控制像素定义层5的曝光区域位置和大小。
步骤52，如图8所示，采用蒸镀方式在所述阳极层4和所述像素定义层5表面形成所述有机发光层6，所述有机发光层6通过利用所述遮挡部进行遮挡蒸镀形成发光电连接部61，所述发光电连接部61覆盖于所述辅助电极2一部分的表面，所述发光电连接部61构成所述电连接部的一部分；以及所述有机发光层6在所述像素延伸部51表面形成发光延伸部62，所述发光延伸部62构成所述遮挡部的一部分；其中，只需控制蒸镀的角度，便可控制在镂空区31哪些部位形成发光电连接部62，而蒸镀角度根据遮挡部的大小、位置进行匹配选择便可。
步骤53，如图1和8所示，采用蒸镀方式在所述有机发光层6表面形成所述阴极层7，所述阴极层7通过利用所述遮挡部进行遮挡蒸镀形成阴极电连接部71，所述阴极电连接部71覆盖于所述发光电连接部61的表面，且所述阴极电连接部71还覆盖于所述辅助电极2一部分的表面；以及在所述发光延伸部62表面形成阴极延伸部72，所述阴极延伸部72构成所述遮挡部的一部分；同理，只需控制蒸镀的角度，便可控制在镂空区31哪些部位形成阴极电连接部，而蒸镀角度根据遮挡部的大小、位置进行匹配选择便可。
从此制作方法可知，相比于现有的制作工艺，本发明的整个制作过程并未添加任何新的原料，而是通过将抗蚀层8延伸至与镂空区31相对的位置，从而使得在进行刻蚀后能形成阳极延伸部41，以及利用阳极延伸部41形成遮挡部的整体，实现了对镂空区31的遮挡，而且还可以利用遮挡部进行遮挡蒸镀形成电连接部，以确保与辅助电极2的电性连接，从而取消了光罩的设置，简化了制作工艺和制作成本，为OLED面板的生产提供了重要帮助。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (15)

  1. 一种OLED面板，其中，包括，
    基板；
    平坦层，所述平坦层设于所述基板的表面，所述平坦层设有镂空区；
    辅助电极，所述辅助电极设于所述镂空区内；
    以及显像层，所述显像层设于所述平坦层表面，所述显像层包括电连接部和遮挡部，所述电连接部延伸至所述镂空区内与所述辅助电极电性连接，所述遮挡部延伸至与所述镂空区相对布置的位置，所述遮挡部与所述辅助电极、以及所述电连接部相互分离。
  2. 根据权利要求1所述OLED面板，其中，所述显像层包括阳极层，所述阳极层设于所述平坦层表面，所述阳极层一部分为阳极延伸部，所述阳极延伸部延伸至与所述镂空区相对布置的位置，以使所述阳极延伸部构成所述遮挡部的一部分。
  3. 根据权利要求2所述OLED面板，其中，所述显像层还包括像素定义层，所述像素定义层同时设于所述阳极层和所述平坦层的表面，所述像素定义层的一部分为像素延伸部，所述像素延伸部设于所述阳极延伸部的表面，以使所述像素延伸部构成所述遮挡部的一部分。
  4. 根据权利要求3所述OLED面板，其中，所述显像层还包括有机发光层，所述有机发光层同时设于所述阳极层和所述像素定义层表面，所述有机发光层有一部分为发光延伸部，所述发光延伸部设于所述像素延伸部的表面，以使所述发光延伸部构成所述遮挡部的一部分；所述有机发光层还有一部分为发光电连接部，所述发光电连接部延伸至所述镂空区与所述辅助电极电性连接，以使所述发光电连接部构成所述电连接部的一部分。
  5. 根据权利要求4所述OLED面板，其中，所述显像层还包括阴极层，所述阴极层设于所述有机发光层表面，所述阴极层有一部分为阴极延伸部，所述阴极延伸部设于所述发光延伸部的表面，以使所述阴极延伸部构成所述遮挡部的一部分；所述阴极层还有一部分为阴极电连接部，所述阴极电连接部延伸至所述镂空区以覆盖于所述发光电连接部上，所述阴极电连接部还与所述辅助电极电性连接，以使所述阴极电连接部构成所述电连接部的一部分。
  6. 一种OLED面板的制作方法，用于制作权利要求1所述的OLED面板，其中包括以下步骤：
    步骤1，在基板上设置平坦层和辅助电极，并将所述辅助电极设于所述平坦层的所述镂空区内；
    步骤2，设置阳极层覆盖所述平坦层和所述镂空区，并将所述阳极层置于所述镂空区内的部分作为待蚀部；
    步骤3，在所述阳极层表面设置抗蚀层，将所述抗蚀层的一部分作为阻蚀部，并将所述阻蚀部设于与所述镂空区相对的位置；
    步骤4，对所述待蚀部进行刻蚀，以使得所述辅助电极外露显现、以及所述阳极层在所述阻蚀部下方形成阳极延伸部，所述阳极延伸部对所述辅助电极外露显现的部位进行局部遮挡；
    步骤5，剥离所述抗蚀层，然后在所述阳极层上依序设置像素定义层、有机发光层和阴极层，以此构成显像层；
    将所述显像层的一部分作为电连接部，并使得所述电连接部延伸至所述镂空区内与所述辅助电极电性连接；
    将在所述阳极延伸部上形成的所述显像层作为遮挡部，并使得所述遮挡部与所述辅助电极、以及所述电连接部相互分离。
  7. 根据权利要求6所述的OLED面板的制作方法，其中，
    所述步骤5包括步骤51，先使得所述像素定义层对所述阳极层和所述辅助电极进行整体覆盖，然后对所述像素定义层进行曝光操作，以消除所述像素定义层对所述辅助电极的覆盖，并使得所述像素定义层在所述阳极延伸部表面形成像素延伸部，所述像素延伸部构成所述遮挡部的一部分。
  8. 根据权利要求7所述的OLED面板的制作方法，其中，
    所述步骤5还包括步骤52，采用蒸镀方式在所述阳极层和所述像素定义层表面形成所述有机发光层，所述有机发光层通过利用所述遮挡部进行遮挡蒸镀形成发光电连接部，所述发光电连接部覆盖于所述辅助电极一部分的表面，所述发光电连接部构成所述电连接部的一部分；
    以及所述有机发光层在所述像素延伸部表面形成发光延伸部，所述发光延伸部构成所述遮挡部的一部分。
  9. 根据权利要求8所述的OLED面板的制作方法，其中，
    所述步骤5还包括步骤53，采用蒸镀方式在所述有机发光层表面形成所述阴极层，所述阴极层通过利用所述遮挡部进行遮挡蒸镀形成阴极电连接部，所述阴极电连接部覆盖于所述发光电连接部的表面，且所述阴极电连接部还覆盖于所述辅助电极一部分的表面；
    以及在所述发光延伸部表面形成阴极延伸部，所述阴极延伸部构成所述遮挡部的一部分。
  10. 根据权利要求6所述的OLED面板的制作方法，其中，在所述步骤3中，使用光阻制成所述抗蚀层。
  11. 一种OLED面板，其中，包括，
    基板；
    辅助电极，所述辅助电极设于所述基板的表面；
    平坦层，所述平坦层设于所述基板以及所述辅助电极的表面，且所述平坦层在对应所述辅助电极的位置设有镂空区；
    以及显像层，所述显像层设于所述平坦层表面，所述显像层包括电连接部和遮挡部，所述电连接部延伸至所述镂空区内与所述辅助电极电性连接，所述遮挡部延伸至与所述镂空区相对布置的位置，所述遮挡部与所述辅助电极、以及所述电连接部相互分离。
  12. 根据权利要求11所述OLED面板，其中，所述显像层包括阳极层，所述阳极层设于所述平坦层表面，所述阳极层一部分为阳极延伸部，所述阳极延伸部延伸至与所述镂空区相对布置的位置，以使所述阳极延伸部构成所述遮挡部的一部分。
  13. 根据权利要求12所述OLED面板，其中，所述显像层还包括像素定义层，所述像素定义层同时设于所述阳极层和所述平坦层的表面，所述像素定义层的一部分为像素延伸部，所述像素延伸部设于所述阳极延伸部的表面，以使所述像素延伸部构成所述遮挡部的一部分。
  14. 根据权利要求13所述OLED面板，其中，所述显像层还包括有机发光层，所述有机发光层同时设于所述阳极层和所述像素定义层表面，所述有机发光层有一部分为发光延伸部，所述发光延伸部设于所述像素延伸部的表面，以使所述发光延伸部构成所述遮挡部的一部分；所述有机发光层还有一部分为发光电连接部，所述发光电连接部延伸至所述镂空区与所述辅助电极电性连接，以使所述发光电连接部构成所述电连接部的一部分。
  15. 根据权利要求14所述OLED面板，其中，所述显像层还包括阴极层，所述阴极层设于所述有机发光层表面，所述阴极层有一部分为阴极延伸部，所述阴极延伸部设于所述发光延伸部的表面，以使所述阴极延伸部构成所述遮挡部的一部分；所述阴极层还有一部分为阴极电连接部，所述阴极电连接部延伸至所述镂空区以覆盖于所述发光电连接部上，所述阴极电连接部还与所述辅助电极电性连接，以使所述阴极电连接部构成所述电连接部的一部分。
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CN113097408B (zh) * 2021-03-17 2022-08-23 深圳市华星光电半导体显示技术有限公司 一种显示面板及其制备方法
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