WO2020015739A1 - 一种晶片取片分离装置及方法 - Google Patents

一种晶片取片分离装置及方法 Download PDF

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Publication number
WO2020015739A1
WO2020015739A1 PCT/CN2019/096807 CN2019096807W WO2020015739A1 WO 2020015739 A1 WO2020015739 A1 WO 2020015739A1 CN 2019096807 W CN2019096807 W CN 2019096807W WO 2020015739 A1 WO2020015739 A1 WO 2020015739A1
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WO
WIPO (PCT)
Prior art keywords
adsorption
arm
plate
drive
wafer
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PCT/CN2019/096807
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English (en)
French (fr)
Inventor
邹金成
魏民
申兵兵
索拉布吉·库石特
桑福德·埃里克
尤时达·史蒂文
维尔卡·拉杰
何甘
艾契尔·美利莎
Original Assignee
东泰高科装备科技有限公司
奥塔装置公司
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Publication of WO2020015739A1 publication Critical patent/WO2020015739A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the technical field of solar cell manufacturing equipment, and in particular, to a wafer fetching and separating device and method.
  • Thin-film solar cells are a new type of photovoltaic device to alleviate the energy crisis.
  • Thin-film solar cells can be manufactured using inexpensive materials such as ceramics, graphite, and metal sheets as substrates. Therefore, under the same light-receiving area, the amount of raw materials can be greatly reduced compared to silicon-based solar cells. It forms a thin film that can generate voltage The thickness is only a few microns, and it has good conversion efficiency.
  • thin film solar cells can also be made into non-planar structures because of their flexibility. They have a wide range of applications, can be combined with buildings or become part of buildings, and they are widely used.
  • the thin-film and the square substrate are combined and placed in a carrier by surface tension.
  • the substrates need to be taken out of the carrier one by one, and then the substrates and the thin films are separated.
  • the substrate needs to be placed in another separation module to separate the substrate from the film, so it can also only realize one set of substrates at a time.
  • the separation process of the bottom and the film, the above-mentioned substrate removal and separation are divided into two processes, which need to be completed by different equipment, and the separation process takes a long time, which greatly affects the productivity.
  • the present disclosure provides a wafer fetching and separating device and method, which can not only realize the rapid retrieval of the substrate, but also the rapid separation of the substrate and the thin film, thereby improving the productivity.
  • the present disclosure provides a wafer fetching and separating device including a separating component and a driving component.
  • the wafer includes a substrate and a thin film provided on the substrate, and the driving component is connected to the separating component.
  • An adsorption plate is fixed on the separation component, and the adsorption plate is used to adsorb and fix the substrate.
  • a reversible adsorption arm is provided on one side of the adsorption plate, and the adsorption plate and the adsorption arm can be respectively adsorbed on the adsorption plate.
  • the lower surface of the substrate and the upper surface of the film so that the wafer is clamped between the adsorption plate and the adsorption arm.
  • the adsorption arm and The suction plate can move synchronously to take out the wafer from the carrier;
  • a motion controller is connected to the adsorption arm, and when the driving component drives the adsorption plate to contact and vacuum adsorb on the lower surface of the substrate, the motion controller can drive the adsorption arm to move vertically to The adsorption arm is brought into contact with and vacuum-adsorbs the film; the motion controller can also drive the adsorption arm to turn sideways, so that the adsorption arm drives the film to be separated from the substrate.
  • the motion controller includes a rotation mechanism and a slide control mechanism, and the slide control mechanism is connected to the suction arm through the rotation mechanism, and the rotation is driven by the slide control mechanism.
  • the mechanism and the suction arm can slide vertically, and the rotation mechanism can drive the suction arm to perform sideways turning.
  • the rotation mechanism includes a belt transmission mechanism, a driving motor of the belt transmission mechanism is connected to a servo motor through a rotary coupling, and any driven wheel of the belt transmission mechanism is connected to the adsorption arm through a rotation shaft. Connection; the rotary coupling and the rotating shaft are respectively connected with the sliding control mechanism.
  • the sliding control mechanism includes:
  • a rotary slide plate is connected to a guide rail through a slider, which is used to drive the rotary slide plate to slide vertically along the guide rail, and the rotary coupling and the rotating shaft are respectively fixed on the rotary slide plate;
  • the air cylinder is vertically connected to the rotary slide, and can drive the rotary slide to slide when the air cylinder is retracted;
  • a limiting unit is installed on the rotary slide plate, and limits the highest point and the lowest point of the sliding stroke of the rotary plate, respectively.
  • the limit unit includes a limit fixing block and a limit set, and the limit fixing blocks are provided at the highest and lowest positions of the sliding stroke of the rotary slide plate, and the rotary slide plate Limit stops are respectively provided on both sides of the limit stop.
  • One of the limit stops is opposite to the limit fixing block provided at the highest position, and the other limit stop is provided with the limit fixing block provided at the lowest position.
  • Relative setting; the limit kit is set on any pair of the limit table and the limit fixing block.
  • the limit kit includes a set limit bolt and a limit nut.
  • two ends of the rotating shaft are respectively connected to the rotary slide plate through a bearing fixing seat.
  • the adsorption arm includes a central axis and a vacuum adsorption sheet, the rotation mechanism and the vacuum adsorption sheet are respectively connected to two ends of the central axis, and the central axis and the vacuum adsorption sheet are different from each other.
  • a shaft is provided, and driven by the sliding control mechanism, the central shaft can drive the vacuum adsorption sheet to slide vertically, and drive the vacuum adsorption sheet to turn sideways around the central axis.
  • the suction arm further includes a stepped shaft, one end of the stepped shaft is connected to the central shaft, and the other end is provided with a connection arm, and the stepped shaft is connected to the vacuum suction sheet through the connection arm.
  • Connection, the connecting arm and the central axis are arranged non-coaxially, and when the central axis rotates, the connecting arm can drive the vacuum adsorption sheet from the One side of the central axis is turned to the other side, so that the vacuum adsorption sheet is turned sideways around the central axis.
  • a range of a turning angle of the vacuum adsorption sheet to be laterally turned around the central axis is 0 to 360 °.
  • the adsorption arm further includes a vacuum generator, and the vacuum generator is connected to the vacuum adsorption sheet.
  • the separating assembly further includes a bearing platform, the suction plate is fixed on the bearing platform, the suction arm is mounted on the bearing platform through a motion controller, and the bearing platform is connected to the bearing platform.
  • the bearing platform On the driving component, driven by the driving component, the bearing platform can drive the adsorption plate and the adsorption arm to move synchronously.
  • the loading platform includes a fixed bottom plate and a fixed side plate, the fixed side plate stands on the fixed bottom plate, and the motion controller is installed on one side of the fixed side plate, and the fixed A fixed arm protrudes outward from an end of the bottom plate, the fixed arm is correspondingly disposed on one side of the motion controller, and the adsorption plate is connected to the extended end of the fixed arm.
  • a reversible adsorption arm and an adsorption plate are used to form a separation unit.
  • the separation unit includes a forward separation unit and a reverse separation unit.
  • the adsorption arm of the forward separation unit is provided.
  • the adsorption arm of the reverse separation unit is disposed on the inside of the adsorption plate; the forward separation unit and the reverse separation unit are arranged at intervals, and the adjacent forward separation unit and the The reverse directions of the two adsorption arms in the reverse separation unit are opposite.
  • the driving component includes:
  • An X-axis driver connected to the separation assembly to drive the adsorption plate and the adsorption arm to move horizontally in synchronization;
  • the Y-axis driver is connected to the X-axis driver and is used to drive the X-axis driver for vertical movement.
  • the driving assembly further includes a connection mechanism, the X-axis driver is fixed on the connection mechanism, the Y-axis driver is connected to the connection mechanism, and under the driving action of the Y-axis driver, all the The connecting mechanism can drive the X-axis driver to move vertically.
  • connection mechanism includes a connection bottom plate and a connection side plate
  • the X-axis driver is fixed on the connection bottom plate
  • the connection bottom plate is fixed on the connection side plate
  • the connection side plate is connected with
  • the Y-axis driver is connected, and the Y-axis driver is used to drive the connection side plate to move the connection base plate vertically.
  • the X-axis driver includes an X-axis drive motor, a synchronous pulley, and a horizontal slide rail.
  • the horizontal slide rail is laid on the connection floor, and a slidable slide rail is provided on the horizontal slide rail.
  • a horizontal slider, the separation component is fixedly connected to the horizontal slider, and the X-axis drive motor drives the horizontal slider to move horizontally along the horizontal slide rail through the synchronous belt wheel, so that the The horizontal slider drives the separation component to move horizontally.
  • the Y-axis driver includes a Y-axis drive motor and a vertical slide rail.
  • the vertical slide rail is provided with a movable vertical slider, and the vertical slider and the Y-axis
  • the driving motor is connected and can be moved vertically along the vertical slide rail under the drive of the Y-axis driving motor;
  • the connecting side plate is fixedly connected to the vertical slider, and the vertical Driven by the slider, the connecting side plate drives the connecting base plate to move vertically to drive the X-axis driver to move vertically.
  • the vertical slide rail is a lead screw
  • the lead screw is connected to the Y-axis drive motor through a drive coupling
  • the vertical slider is sleeved on the lead screw
  • the The Y-axis drive motor drives the lead screw to rotate through the drive coupling to drive the vertical slider to move vertically along the lead screw.
  • the present disclosure also provides a wafer fetching and separating method, which is proposed based on the wafer fetching and separating device as described above, and the method includes the following steps:
  • the driving component drives the suction plate to contact and vacuum-suck on the lower surface of the substrate, and drives the suction arm to turn sideways through the motion controller, so that the suction arm is turned over the substrate, and the suction arm and There are gaps between the adsorption plates;
  • the motion controller drives the adsorption arm to slide vertically, so that the adsorption arm contacts and vacuum adsorbs the film on the substrate;
  • the adsorption plate is kept fixed, and the adsorption arm drives the adsorption arm to turn sideways through the motion controller, so that the adsorption arm drives the film to be separated from the substrate.
  • the motion controller includes a rotation mechanism and a slide control mechanism, and the slide control mechanism is connected to the suction arm through the rotation mechanism, and the rotation is driven by the slide control mechanism.
  • the mechanism and the suction arm can slide vertically, and the rotation mechanism can drive the suction arm to perform sideways turning.
  • a reversible adsorption arm and an adsorption plate are used to form a separation unit.
  • the separation unit includes a forward separation unit and a reverse separation unit.
  • the adsorption arm of the forward separation unit is provided.
  • the adsorption arm of the reverse separation unit is disposed on the inside of the adsorption plate; the forward separation unit and the reverse separation unit are arranged at intervals, and the adjacent forward separation unit and the The reverse directions of the two adsorption arms in the reverse separation unit are opposite.
  • the substrate is vacuum-adsorbed by the adsorption plate, and the vertical self-sliding of the adsorption arm is driven by the motion controller, so that the adsorption arm adsorbs the film on the substrate, thereby
  • the wafer is clamped between the adsorption arm and the adsorption plate, and the driving assembly is used to drive the adsorption arm and the adsorption plate to move synchronously to achieve rapid retrieval of the wafer and effectively ensure the integrity of the substrate and the film of the wafer during retrieval.
  • the device uses a motion controller to drive the lateral turning of the suction arm, so that the film on the substrate is lifted laterally by the turning of the suction arm, so that the substrate and the film are safely separated.
  • the method can realize the rapid retrieval of the wafer and the rapid separation of the substrate and the thin film of the wafer on the same device, which can effectively save the process conversion time and greatly increase the productivity;
  • the motion controller drives the vertical self-sliding of the adsorption arm
  • the wafer clamping and taking process is further decomposed into two steps, and when the adsorption plate adsorbs the substrate, the film and There is a vertical safety gap between the adsorption arms, which can prevent the film from being damaged or falling off.
  • the adsorption arm is driven to move vertically to cling to the film, thereby using the vacuum.
  • the film is adsorbed to prevent the offset between the adsorption arm and the film, and between the film and the substrate, thereby ensuring that the wafer is securely clamped by the adsorption plate and the adsorption arm, and the film is prevented from being damaged. Both can ensure that there is no relative displacement between the substrate and the film, so that the fetching and separation processes have high accuracy;
  • multiple sets of separation units are respectively arranged on the same separation component, so as to achieve the simultaneous completion of the picking, placing and separation of multiple wafers in one operation.
  • the forward separation unit and the reverse separation unit are arranged at intervals, and the two adsorption arms in adjacent forward separation units and reverse separation units have opposite flip directions, thereby preventing Adsorption arms of two adjacent sets of separation units interfere with each other when flipped, improving equipment safety and effectively saving equipment space;
  • the rotary slide plate has a controllable vertical sliding stroke, so as to improve the accuracy of film picking and separation.
  • FIG. 1 is a schematic structural diagram of a wafer fetching and separating device according to a first embodiment of the present disclosure
  • FIG. 2 is a top view of a separation component according to the first embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of a rotation mechanism according to Embodiment 1 of the present disclosure.
  • FIG. 4 is a working state diagram of a motion controller according to the first embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of a motion controller according to Embodiment 2 of the present disclosure.
  • FIG. 6 is a schematic structural diagram of a carrier according to Embodiments 1 to 3 of the present disclosure.
  • FIG. 7 is a schematic diagram of a wafer loading state according to the first to third embodiments of the present disclosure.
  • FIG. 8 is a schematic diagram of taking out pieces of the separation components according to the first to third embodiments of the present disclosure.
  • FIG. 9 is a schematic structural diagram of an initial separation state of the separation components according to the first to third embodiments of the present disclosure.
  • FIG. 10 is a schematic structural diagram of a separated state of the separated components according to the first to third embodiments of the present disclosure.
  • a plurality means two or more.
  • the terms “up”, “down”, “left”, “right”, “inside”, “outside”, “front end”, “back end”, “head”, “tail”, etc. indicate the orientation or positional relationship as Based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood Is a limitation on this disclosure.
  • the first embodiment provides a wafer fetching and separating device for quickly picking up and separating a wafer.
  • the wafer includes a substrate 200 and a thin film 300 provided on the substrate 200.
  • the device includes a separation component 4 and a driving component.
  • the driving component is connected to the separation component 4 and the driving component can drive the entire movement of the separation component.
  • an adsorption plate 90 is fixed on the separation component 4 and the adsorption plate 90 is used for vacuum adsorption of the substrate 200.
  • a reversible adsorption arm 70 is provided on one side of the adsorption plate 90, and the adsorption arm 70 can not only be turned over the substrate 200, but also can be turned outward in the axial direction to leave the position of the substrate 200.
  • the adsorption arm 70 is connected with a motion controller.
  • the driving component drives the separation assembly 4 to move as a whole
  • the adsorption plate 90 can contact and vacuum adsorb on the lower surface of the substrate 200.
  • the motion controller can drive the adsorption arm 70 to move vertically.
  • the adsorption arm 70 contacts and vacuum-adsorbs the upper surface of the film 300, so that the wafer is clamped between the adsorption plate 90 and the adsorption arm 70; when the wafer is clamped between the adsorption plate 90 and the adsorption arm 70, the driving Driven by the component, the suction arm 70 and the suction plate 90 can move synchronously to take out the wafer from the carrier, so as to achieve rapid access to the wafer and effectively protect the integrity of the substrate and film of the wafer during retrieval. To prevent wafer quality from being affected.
  • the motion controller can also separately drive the adsorption arm 70 for side turning, so that the adsorption arm 70 can drive the film 300 and the substrate 200 to separate, so as to realize the safe separation of the substrate 200 and the film 300.
  • the device can not only realize the rapid retrieval of wafers, but also the rapid separation of wafer substrate 200 and film 300 on the same device, which can effectively save process conversion time and greatly increase production capacity.
  • the motion controller can drive the vertical self-sliding of the adsorption arm 70, thereby further decomposing the wafer clamping and extraction process into two steps.
  • the adsorption plate 90 adsorbs the substrate 200, the film 300 and the adsorption arm 70 There is a vertical safety gap between them, which can prevent the film 300 from being damaged or falling off.
  • the adsorption arm 70 is driven to move vertically, so that the adsorption arm 70's
  • the absolute displacement is decomposed from at least two degrees of freedom, and the precision of the adsorption position of the adsorption arm 70 and the film 300 is finely adjusted, thereby preventing the offset between the adsorption arm 70 and the film 300 and between the film 300 and the substrate 200, and further Ensure that the wafer is securely clamped by the suction plate 90 and the suction arm 70 to avoid damage to the film 300, and that there is no gap between the substrate 200 and the film 300 during the fetching and separation process. Displacement, so that the sheet and the separation step of taking a high accuracy.
  • the separation component 4 of the device can realize the fetching and separation respectively.
  • the separation component 4 is driven by the driving component to drive the adsorption plate 90 to contact and vacuum adsorb on the lower surface of the substrate 200. Since the adsorption arm 70 has a preset vertical sliding stroke, when the adsorption arm 70 flips to When the substrate 200 is above, because there is a safe gap between the adsorption arm 70 and the film 200, the flipping of the adsorption arm 70 will not touch the wafer, and the motion controller will be used to drive the adsorption arm 70 to slide down vertically, so that The wafer is contacted and vacuum-sucked on the film 300, and the wafer is accurately clamped between the suction plate 90 and the suction arm 70 to prevent relative displacement of the substrate 200 and the film 300 when the wafer is taken. After the wafer is clamped, the driving assembly drives the separation assembly 4 to move as a whole, so as to drive the suction plate 90 and the suction arm 70 to move synchronously to quickly remove the wafer from the carrier 100.
  • the separation module 4 is provided with a separation initial state and a separation end state, as shown in FIGS. 9 and 10.
  • the separation module 4 is in the separation initial state, the adsorption arm 70 and the adsorption plate 90 are clamped and adsorbed respectively.
  • the adsorption arm 70 is flipped from the upper direction of the adsorption plate 90 to the side of the adsorption plate 90.
  • the separation component 4 uses the motion controller to drive the adsorption arm 70 to perform a side turn, so that the film 300 on the substrate 200 is lifted laterally by the turning of the adsorption arm 70, so that the substrate 200 and the film 300 are safely separated.
  • the horizontal direction is the X axis and the vertical direction is the Y axis.
  • the driving mechanism includes an X-axis driver 2 and a Y-axis driver 1.
  • the X-axis driver 2 is connected to the separation module 4 and is used to drive the separation module.
  • the overall movement of 4 is horizontal movement, that is, the horizontal movement is performed by driving the suction plate 90 and the suction arm 70 synchronously;
  • the Y-axis driver 1 is connected to the X-axis driver 2 for driving the X-axis driver 2 for vertical movement.
  • the driving assembly further includes a connection mechanism.
  • the X-axis driver 2 is fixed on the connection mechanism.
  • the connection mechanism is connected to the Y-axis driver 1. Under the driving action of the Y-axis driver 1, the connection mechanism can drive the X-axis driver 2 For vertical movement.
  • the connecting mechanism includes a connecting base plate 3 and a connecting side plate 5, the X-axis driver 2 is fixed on the connecting base plate 3, the connecting base plate 3 is fixed on the connecting side plate 5, the connecting side plate 5 is connected to the Y-axis driver 1, and the Y-axis driver 1 Driven by, the connecting side plate 5 can drive the connecting bottom plate 3 to move vertically, thereby driving the X-axis driver 2 to move vertically.
  • connection mechanism may include other structures in addition to the above-mentioned structure, as long as the X-axis driver 2 can be fixed on the connection mechanism, and the connection mechanism is connected to the Y-axis driver 1, so that the Y-axis driver When the driving connection mechanism moves, the X-axis driver 2 can be moved vertically.
  • the X-axis driver 2 includes an X-axis drive motor, a synchronous pulley, and a horizontal slide rail.
  • the horizontal slide rail is laid on the connection floor 3, and a horizontal slide block is provided on the horizontal slide rail to separate the components.
  • 4 is fixedly connected to the horizontal slider, and the X-axis driving motor drives the horizontal slider to move horizontally along the horizontal slide rail through the synchronous belt wheel, so that the horizontal slider drives the entire separation assembly 4 to move along the horizontal X axis.
  • the Y-axis drive 1 includes a Y-axis drive motor and a vertical slide rail. The vertical slide rail is erected, and a vertical slider is provided thereon.
  • the vertical slider can slide along the vertical slide rail, and the Y-axis drive.
  • the motor can be installed on either end of the vertical slide rail and can drive the vertical slider to slide.
  • the connection side plate 5 is fixedly connected to the vertical slider, so that the vertical slider can drive the connection side plate 5 to move vertically. Then, the X-axis driver 2 is driven to move vertically.
  • the vertical slide rail of the Y-axis driver may also adopt a structure in which a screw and a nut are movably assembled.
  • the vertical slide rail is a lead screw
  • the vertical slider is a nut.
  • the lead screw is connected to the output shaft of the Y-axis drive motor through a drive coupling, so that the Y-axis drive motor drives the lead screw through the drive coupling. The rotation causes the vertical slider screwed on the screw to move along the screw, thereby realizing the vertical movement of the vertical slider.
  • the driving motor may be a servo motor 31 or a stepping motor; the horizontal slide rail of the X-axis driver 2 and the Y-axis driver 1
  • the vertical slide rails can be replaced by a screw and a support seat assembly;
  • the synchronous pulley of the X-axis drive 2 can be replaced by a gear assembly, that is, the X-axis drive motor is connected to the separation assembly 4 through the gear assembly to drive the separation assembly 4 along
  • the horizontal smooth rail moves horizontally;
  • the drive coupling of the Y-axis driver 1 can be replaced by a synchronous pulley or gear assembly, as long as the Y-axis drive motor can drive the X-axis driver 2 to move along the vertical slide rail through the connection side plate 5 can.
  • the reference coordinate system of this device is shown in FIG. 1, where the positive direction of the Z axis is the outside and the negative direction of the Z axis is the inside.
  • a reversible adsorption arm 70 and an adsorption plate 90 are used as a separation unit.
  • the separation unit includes a forward separation unit and a reverse separation unit.
  • the adsorption arm 70 of the forward separation unit is disposed on the adsorption unit. Outside the plate 90, an adsorption arm 70 of the reverse separation unit is provided inside the adsorption plate 90.
  • one or more sets of separation units are provided on the separation module.
  • the separation unit may be either a forward separation unit or a reverse separation unit; when multiple sets of separation units are provided At this time, the forward separation unit and the reverse separation unit are arranged at intervals. Since the adsorption arms 70 in each group of separation units can be controlled individually, two adjacent ones of the forward separation unit and the reverse separation unit The turning directions of the two suction arms 70 are opposite, and the turning angle range of each suction arm 70 when it is turned sideways can be 0 to 360 °. Therefore, the device can not only realize the removal of multiple substrates 200 in one operation at the same time. Putting and separating can also make the two adsorption arms 70 of two adjacent sets of separation units avoid mutual interference when turning over, improve equipment safety, and can effectively save equipment space.
  • two separation units are separately provided on one separation unit 4 as an example to describe the structure of the separation unit 4 in which one of the two separation units is a forward separation unit and one is a reverse separation unit.
  • the adsorption arm 70 of the safety unit is turned over safely, and the two adsorption plates 90 in the two sets of separation units are adjacent to each other.
  • the separation assembly 4 includes a rotation mechanism 30 and a slide control mechanism.
  • the motion controller includes a rotation mechanism 30 and a slide control mechanism.
  • the slide control mechanism is connected to the adsorption arm 70 through the rotation mechanism 30 and drives the slide control mechanism. Downward and downward, the rotating mechanism 30 and the adsorption arm 70 can perform vertical sliding synchronously, and the rotating mechanism 30 can also separately drive the adsorption arm 70 for side turning.
  • the driving assembly can drive the entire separation assembly 4 to move, when the entire separation assembly 4 moves, it means that the rotation mechanism 30, the sliding control mechanism, and the adsorption plate 90 fixed on the separation assembly 4 move synchronously, so that when the adsorption plate 90 After the position of the is determined, the suction arm 70 can be driven to move and flip through the cooperation of the rotation mechanism 30 and the slide control mechanism on this basis.
  • the separation assembly 4 may further include a bearing platform, the adsorption plate 90 is fixed on the bearing platform, and the adsorption arm 70 is installed on the bearing platform through the motion controller.
  • the supporting platform is connected to the driving component, and the driving component can drive the supporting platform to move, so that the supporting platform drives the adsorption plate 90 and the adsorption arm 70 to move synchronously, so that the driving component can realize the driving effect of the overall movement of the separation component 4.
  • the bearing platform includes, but is not limited to, the fixed base plate 10 and the fixed side plate 20, the fixed side plate 20 stands on the fixed base plate 10, and the rotation mechanism 30 and the slide control mechanism of the motion controller are both installed on the same side of the fixed side plate 20,
  • An end of the fixed bottom plate 10 is extended with a fixed arm 80.
  • the fixed arm 80 is correspondingly disposed on one side of the motion controller.
  • the extended end of the fixed arm 80 is connected with an adsorption plate 90.
  • a fixed side plate 20 can be erected at each end of the fixed bottom plate 10, and two rotating arms are respectively connected to two adsorption arms 70 in the two sets of separation units. 30.
  • the two rotating mechanisms 30 are respectively installed on the inner sides of the two fixed side plates 20 through a sliding control mechanism, and two fixed arms 80 extend side by side at the same end of the fixed bottom plate 10, and the extension of each fixed arm 80
  • An adsorption plate 90 is fixed at the exit end.
  • the adsorption plate 90 includes an adsorption end portion, which is inserted into the carrier 100 through the adsorption end portion to be vacuum-adsorbed on the lower surface of the substrate 200.
  • a preset distance is reserved between the two fixing arms 80 to avoid collisions between the substrate 200 and the film 300 of the two wafers when taking or separating the wafers. This is because: if two rotating mechanisms When the turning direction of 30 is the same, the preset distance between the two fixed arms 80 should be sufficiently large, so that a sufficient space is required between the two films 300 to ensure that no interference occurs during separation; but On the one hand, when the distance between the two films 300 is sufficiently large, the volume of the mechanism will become large, and the two adsorption arms 70 of the device respectively adopt a left-to-right reverse flip method to separate the two at the same time. The substrate 200 and the thin film 300 of the wafer can effectively reduce the space occupied by the mechanism.
  • the space between the thin film 300 of the two wafers can be achieved by increasing the size of the carrier 100,
  • the two suction arms 70 are set to be movable so that the distance between the two suction arms 70 can be adjusted.
  • the device adopts the reverse direction of the two suction arms 70 to realize the simultaneous separation of the thin film 300 and the substrate 200 of the two wafers, thereby ensuring the safety of the original carrier 100 without changing the size of the original carrier 100.
  • the process of realizing multiple wafers synchronous separation, without adjusting the distance between the adsorption arms 70 and causing interference between the two films 300, has the highest safety and reliability.
  • the adsorption arm 70 may include a central axis and a vacuum adsorption sheet, and a rotation mechanism and a vacuum adsorption sheet are respectively connected to both ends of the central axis, and the central axis and the vacuum adsorption sheet are arranged non-coaxially. Therefore, the rotation mechanism is vertically moved by the sliding control mechanism, and the central axis can drive the vacuum adsorption sheet to slide vertically, and the self-rotation of the central axis drives the vacuum adsorption sheet to turn sideways around the central axis. .
  • the suction arm 70 may further include a stepped shaft, one end of the stepped shaft is connected to the central shaft, and the other end is provided with a connecting arm, and the stepped shaft passes through the connection
  • the arm is connected to the vacuum adsorption sheet, and when the central axis is rotated, the connecting arm is driven by the rotation of the stepped shaft to turn the vacuum adsorption sheet from one side of the central axis to the other side, so that the vacuum adsorption sheet surrounds the central axis.
  • the connecting arm and the central axis are non-coaxially arranged, and the turning radius of the lateral flipping of the connecting arm can be reasonably controlled, so that the vacuum adsorption sheet is flipped over the film 300 under the driving of the rotating mechanism.
  • the motion controller driven by the motion controller, it moves vertically downwards to clamp the wafer from the upper surface of the film 300 while vacuum-adhering to the film 300, and then using the turning of the vacuum adsorption sheet to drive the film 300 from the substrate 200 Lift; among them, the number of step levels of the step axis can be determined according to the turning radius of the vacuum suction sheet and the structural strength coefficient.
  • the rotation angle of the central axis can be controlled by the rotation mechanism 30, thereby controlling the turning position and turning speed of the vacuum suction sheet.
  • a vacuum generator is also connected to the vacuum adsorption sheet, so as to create a vacuum negative pressure environment between the vacuum adsorption sheet and the film 200, so that the vacuum adsorption sheet vacuum adsorbs the film 200.
  • a vacuum generation is also connected to the adsorption plate 90. Device.
  • the rotation mechanism 30 of the first embodiment includes a belt transmission mechanism.
  • a driving motor 34 of the belt transmission mechanism is connected to a servo motor 31 through a rotation coupling 32.
  • One or Multiple driven wheels 36, and any one of the driven wheels 36 of the belt transmission mechanism is connected to the adsorption arm 70 through the rotation shaft 37.
  • the rotation of the driving shaft of the servo motor 31 causes the rotation shaft 37 to rotate, thereby driving the adsorption arm 70 to sideways
  • the turning coupling 32 and the rotating shaft 37 are respectively connected with the sliding control mechanism.
  • the sliding control mechanism can simultaneously drive the rotating coupling 32 and the rotating shaft 37 to move synchronously, thereby realizing the vertical reciprocating self-sliding of the rotating mechanism 30.
  • the belt transmission mechanism of the rotation mechanism 30 may also adopt a gear transmission mechanism.
  • the driving gear in the gear transmission mechanism is connected to the rotation coupling 32, and any driven gear is connected to the rotation shaft 37, thereby achieving Reliable transmission of power and torque of the servo motor 31;
  • the power unit of the rotation mechanism 30 can be either a servo motor 31 or a stepper motor.
  • the sliding control mechanism of the first embodiment includes a rotating slide 40, an air cylinder 50, and a limit unit.
  • the guide rail 60 can be laid on the fixed side plate 20 of the bearing platform, so that when the driving mechanism drives the bearing platform to move, the guide rail 60 can move with the bearing platform, thereby pushing the rotation mechanism 30 to follow the entirety of the separation assembly 4.
  • the rotary slide 40 is connected to the guide rail 60 through a slider, and the slider drives the rotary slide 40 to slide vertically along the guide 60.
  • the guide 60 is used to limit the moving direction of the rotary slide 40; the rotary coupling 32 and the rotating shaft 37 are respectively fixed at The rotary slide plate 40 can be moved as the rotary slide plate 40 slides.
  • the two ends of the rotary shaft 37 can be connected to the rotary slide plate 40 through a bearing fixing seat 38, and the rotary coupling 32 can be fixed to the rotation through a rotary connection plate 33.
  • the slide plate 40 ensures high rotation accuracy of the rotating shaft 37 and the rotating coupling 32, respectively.
  • a screw assembly can also be used to limit the moving direction of the rotary slide 40, that is, a screw nut is provided on the rotary slide 40, and the screw is fixed to a fixed position.
  • the vertical sliding of the rotary slide 40 is achieved by using the vertical sliding of the screw nut on the screw.
  • the air cylinder 50 is vertically connected to the rotary slide plate 40 and can drive the rotary slide plate 40 to slide when the air cylinder 50 expands and contracts.
  • the cylinder tube of the air cylinder 50 may be fixed on the fixed side plate 20 through a fixing frame 407, one end of a piston rod of the air cylinder 50 is fixed on the fixed bottom plate 10, and the other end reciprocates in the axial direction of the cylinder tube.
  • the fixed base plate 10 is immovable relative to the whole of the separation assembly 4, when the cylinder 50 is in an extended state, one end of the piston rod is against the fixed base plate 10, and the other end pushes the slider to move upward along the guide rail 60; 40 is fixed on the slider, the rotation mechanism 30 is fixed on the rotary slide 40, and the suction arm 70 is fixed on the rotation mechanism 30. Therefore, when the piston rod of the cylinder 50 is extended, the slider of the guide rail 60 will move upward, so that the rotary slide 40, the rotating mechanism 30 and the adsorption arm 70 will also move upward.
  • a screw nut assembly structure can also be used to drive the rotary slide 40 to slide. And move along the axial direction of the screw, the screw nut is fixed on the rotary slide 40, so that the relative movement of the screw nut and the screw is used to drive the vertical sliding of the rotary slide 40.
  • the limit unit is installed on the rotary slide 40 to limit the highest and lowest points of the sliding stroke of the rotary slide 40, so that the combination of the guide rail 60 and the limit unit is used to realize the The double limit of the sliding direction and the sliding stroke further realizes fine adjustment of the displacement of the adsorption arm 70 to ensure that the adsorption arm 70 securely adsorbs the film 300.
  • the limit unit includes limit fixing blocks 401 and 406 and a limit kit.
  • Limit fixing blocks 401 and 406 are provided at the highest and lowest positions of the sliding stroke of the rotary slide 40, respectively, and the two sides of the rotary slide 40 are respectively Set limit tables, one of which is opposite to the limit fixing block 401 at the highest position, and the other of which is opposite to the limit fixing block 406 at the lowest position; the limit kit is set to any pair On the limiting table and the limiting fixing blocks 401 and 406, the limiting kit may include supporting bolts 402 and 404 and limiting nuts 403 and 405.
  • a lower limit table is provided on the left side of the top of the rotary slide plate 40 in the first embodiment, and a higher limit table is provided on the right side to extend outward, thereby forming a stepped structure on the top of the rotary slide plate 40.
  • a highest point limit fixing block 401 is provided above the left limit table
  • a limit bolt 402 is provided on the limit fixing block 401
  • a limit nut 403 is provided at a corresponding position of the limit table to Make this set of limit bolts 402 and limit nuts 403 opposite to each other, so as to form a set of limit sets set at the highest point; similarly, set the lowest point limit fixing block below the right limit table 406.
  • a limit bolt 404 is provided on the outwardly extending limit table, and a limit nut 405 is correspondingly provided on the limit fixing block 406, so that a set of the limit bolt 404 and the limit nut 405 are provided. Relative to each other, thus forming a set of limit set at the lowest point.
  • the limit bolt 402 located at the highest point contacts the limit nut 403, then this position is the highest point of the sliding stroke; when the piston rod of the cylinder 50 is retracted, the limit located at the lowest point When the bolt 404 and the limit nut 405 are in contact, this position is the lowest point of the sliding stroke.
  • the structure of the wafer fetching and separating device according to the second embodiment is basically the same as that of the device according to the first embodiment, and the same points are not described again.
  • the rotating mechanism 30 is connected to the rotating shaft 37 through a swinging cylinder 50.
  • the swinging cylinder 50 drives the rotating shaft 37 to rotate, thereby driving the adsorption handle to turn sideways.
  • the swinging cylinder 50 and the rotating shaft 37 are respectively connected to the rotary slide 40, and It is connected with the sliding control mechanism, which can simultaneously drive the swing cylinder 50 and the rotating shaft 37 to move synchronously, thereby realizing the vertical reciprocating self-sliding of the rotating mechanism 30.
  • the third embodiment provides a wafer fetching and separating method, which includes the following steps:
  • the driving component drives the adsorption plate to contact and vacuum adsorb on the lower surface of the substrate, and drives the adsorption arm to turn sideways through the motion controller, so that the adsorption arm is turned over the substrate, and between the adsorption arm and the adsorption plate Leave gaps.
  • the motion controller drives the adsorption arm to slide vertically, so that the adsorption arm contacts and vacuum adsorbs the film on the substrate.
  • the suction plate and the suction arm are synchronously moved by the driving component to synchronously take out the substrate and the film from the carrier.
  • steps S1 to S4 are step of taking film
  • step S5 is a step of separation.
  • a plurality of square carriers 100 are arranged side by side.
  • Each carrier 100 is provided with a groove for loading a square substrate 200 in the wafer.
  • the substrate 200 When the substrate 200 is loaded in the groove, the substrate The edge of the film 300 on the bottom 200 is mounted on the upper surface of the carrier 100; one end of the carrier 100 is provided with channels matching the adsorption plate 90, and the number of channels is the same as the number of adsorption ends on the adsorption plate 90.
  • the adsorption plate 90 may be vacuum-adsorbed on the lower surface of the substrate 100, and then the adsorption arm 70 is turned over the adsorption plate 90 so that the wafer is located on the adsorption plate 90. And the adsorption arm 70; the adsorption arm 70 can also be flipped over the adsorption plate 90, and then the adsorption plate 90 can be driven and moved to the lower surface of the substrate 100 by driving the component, that is, the wafer is inserted into the adsorption plate 90 and the adsorption Between the arms 70.
  • the air cylinder 50 Since the air cylinder 50 is kept in an extended state, there is a certain safety gap between the adsorption arm 70 and the adsorption plate 90. Therefore, when the adsorption plate 90 is located in the channel of the carrier 100 and is adsorbed below the substrate 200, the adsorption arm 70 is located above the film 300 and is not in contact with the film 300.
  • S302 The entire movement of the separation assembly 4 is driven to the preset separation position by the X-axis driver 2.
  • the adsorption plate 90 and the adsorption arm 70 can respectively remove the film 300 and the substrate 200 from the carrier 100 at the same time. .
  • the separation step may be specifically decomposed into the following steps:
  • the rotation mechanism 30 is driven to rotate to drive the adsorption arm 70 to flip sideways, thereby lifting the film 300 from the substrate 200, and the rotation mechanism 30 rotates the film 300 from the substrate 200 by rotating a certain angle, thereby realizing the film 300 And substrate 200.
  • the separation module 4 between step 402 and step 403 has undergone a process from a separation initial state to a separation end state.
  • the water jet 6 continuously sprays water on the joint surface of the substrate 200 and the film 300 to improve the film 300
  • the degree of lubrication with the substrate 200 ensures the safety of the separation and the integrity of the workpiece.
  • the two rotation mechanisms 30 provided in each of the two sets of separation units can simultaneously rotate slowly in opposite directions by a certain angle, that is, the left adsorption arm 70 in FIG. 8 performs left rotation, The right suction arm 70 performs a right-hand rotation.
  • the two rotating mechanisms 30 are respectively rotated by a certain angle, the two substrates 200 and the thin film 300 are separately separated.
  • the two rotating mechanisms 30 are quickly rotated to the outer positions as shown in FIG. 10 to completely separate the film 300 and the substrate 200, and the separation module 4 is in a separated state at this time.
  • the adsorption plate 90 is used to vacuum adsorb the substrate 200, and the motion controller is used to drive the vertical self-sliding of the adsorption arm 70 to make the adsorption arm 70
  • the thin film 300 on the substrate 200 is adsorbed, so that the wafer is clamped between the adsorption arm 70 and the adsorption plate 90.
  • the driving component drives the adsorption arm 70 and the adsorption plate 90 to move synchronously to achieve rapid access to the wafer.
  • the integrity of the substrate 200 and the thin film 300 of the wafer can be effectively ensured during removal, and the quality of the wafer can be prevented from being affected.
  • the film 300 on the substrate is lifted sideways to separate the substrate 200 and the film 300 safely, so that the device and method can realize the rapid access of the wafer and the substrate 200 and the film 300 on the same device.
  • the rapid separation can effectively save the process conversion time and greatly increase the production capacity.
  • the motion controller drives the vertical self-sliding of the adsorption arm 70
  • the wafer clamping process is further decomposed into two steps, and when the adsorption plate 90 adsorbs the substrate 200, the film 300 and the adsorption arm There is a vertical safety gap between 70, which can prevent the film 300 from being damaged or falling off.
  • the adsorption arm 70 is driven to move vertically to adhere to the film 300.
  • the vacuum film is used to hold the film 300 to prevent the offset between the suction arm 70 and the film 300, and between the film 300 and the substrate 200, thereby ensuring that the wafer is securely clamped by the suction plate 90 and the suction arm 70 to avoid the film. 300 is damaged, and no relative displacement between the substrate 200 and the thin film 300 can be ensured during the fetching and separating process, so that the fetching and separating process has high accuracy;
  • a plurality of sets of separation units are respectively arranged on the same separation component, so as to realize the completion of taking and placing and separating multiple wafers in one operation.
  • the forward separation unit and the reverse separation unit are arranged at intervals, and the two adsorption arms 70 in adjacent forward separation units and reverse separation units have opposite turning directions, thereby preventing the adjacent two groups from separating.
  • the suction arms 70 of the unit interfere with each other when it is flipped, improving the safety of the equipment and effectively saving the equipment space;
  • the rotary slide 40 has a controllable vertical sliding stroke to improve the accuracy of film picking and separation.

Abstract

一种晶片取片分离装置及方法。其中，驱动组件与分离组件（4）连接，分离组件（4）上固定有吸附板（90），吸附板（90）的一侧设有的可翻转的吸附手臂（70）与吸附板（90）能分别吸附在衬底（200）的下表面和薄膜（300）的上表面，以使晶片夹持在吸附板（90）和吸附手臂（70）之间，并在驱动组件的驱动作用下能同步移动，以将晶片自载具中取出；吸附手臂（70）连接有运动控制器，驱动组件驱动吸附板（90）接触并真空吸附在衬底（200）的下表面时，运动控制器能驱动吸附手臂（70）作竖向移动，以使吸附手臂（70）接触并真空吸附薄膜（300），也能驱动吸附手臂（70）作侧向翻转，以使吸附手臂（70）带动薄膜（300）与衬底（200）分离，从而既能实现晶片的快速取用，又能实现衬底（200）与薄膜（300）的快速分离，极大的提高了产能。

Description

一种晶片取片分离装置及方法
交叉引用
本申请引用于2018年07月20日提交的专利名称为“一种晶片取片分离装置及方法”的第2018108061872号中国专利申请，其通过引用被全部并入本申请。
技术领域
本公开涉及太阳能电池制造设备技术领域，尤其涉及一种晶片取片分离装置及方法。
背景技术
薄膜太阳能电池是缓解能源危机的新型光伏器件。薄膜太阳能电池可以使用在价格低廉的陶瓷、石墨、金属片等不同材料当基板来制造，因此在同一受光面积之下可较硅衬底太阳能电池大幅减少原料的用量，其形成可产生电压的薄膜厚度仅需数微米，并具有很好的转换效率。薄膜电池太阳电池除了平面之外，也因为具有可挠性可以制作成非平面构造其应用范围大，可与建筑物结合或是变成建筑体的一部份，应用非常广泛。
在薄膜太阳能电池的制造过程中，带有太阳能薄膜的方形衬底在经过刻蚀工艺后，薄膜和方形衬底(wafer)靠表面张力结合放置在载具中。为了满足后续的生产工艺需求，需要逐个将衬底自载具中取出，然后将衬底与薄膜分离。现有技术中，每次只能取出一片衬底，且在衬底取出后，需要将衬底放入另一分离组件中进行衬底与薄膜的分离，因此同样每次只能实现一组衬底与薄膜的分离工序，上述的衬底取用和分离分为先后两个工序，需要动用不同设备完成，且分离工序用时较长，极大的影响产能。
发明内容
(一)要解决的技术问题
本公开提供了一种晶片取片分离装置及方法，既能实现衬底的快速取用，又能实现衬底与薄膜的快速分离，从而提高产能。
(二)技术方案
为了解决上述技术问题，本公开提供了一种晶片取片分离装置，包括分离组件和驱动组件，晶片包括衬底和设在所述衬底上的薄膜，所述驱动组件与分离组件连接，所述分离组件上固定有吸附板，所述吸附板用于吸附固定所述衬底，所述吸附板的一侧设有可翻转的吸附手臂，所述吸附板和所述吸附手臂能分别吸附在所述衬底的下表面和所述薄膜的上表面，以使所述晶片夹持在所述吸附板和所述吸附手臂之间，在所述驱动组件的驱动作用下，所述吸附手臂和所述吸附板能同步移动，以将所述晶片自载具中取出；
所述吸附手臂连接有运动控制器，所述驱动组件驱动所述吸附板接触并真空吸附在所述衬底的下表面时，所述运动控制器能驱动所述吸附手臂作竖向移动，以使所述吸附手臂接触并真空吸附所述薄膜；所述运动控制器还能驱动所述吸附手臂作侧向翻转，以使所述吸附手臂带动所述薄膜与所述衬底分离。
在一个实施例中，所述运动控制器包括旋转机构和滑动控制机构，所述滑动控制机构通过所述旋转机构与所述吸附手臂连接，在所述滑动控制机构的驱动作用下，所述旋转机构和所述吸附手臂能同步的作竖向滑动，所述旋转机构能驱动所述吸附手臂作侧向翻转。
在一个实施例中，所述旋转机构包括皮带传动机构，所述皮带传动机构的主动轮通过旋转联轴器连接有伺服电机，所述皮带传动机构的任一从动轮通过转轴与所述吸附手臂连接；所述旋转联轴器和所述转轴分别与所述滑动控制机构连接。
在一个实施例中，所述滑动控制机构包括：
旋转滑板，通过滑块连接有导轨，所述滑块用于带动所述旋转滑板沿所述导轨竖直滑动，所述旋转联轴器和所述转轴分别固定在所述旋转滑板上；
气缸，竖直连接在所述旋转滑板上，在所述气缸伸缩时能带动所述旋转滑板滑动；
限位单元，安装在所述旋转滑板上，分别对所述旋转滑板的滑动行程最高点和最低点进行限位。
在一个实施例中，所述限位单元包括限位固定块和限位套件，在所述旋转滑板的滑动行程最高处和最低处各设有所述限位固定块，并在所述旋转滑板的两侧分别设置有限位台，其中一个所述限位台与设置在最高处的所述限位固定块相对设置，另一个所述限位台与设置在最低处的所述限位固定块相对设置；所述限位套件设置在任一对所述限位台和限位固定块上。
在一个实施例中，所述限位套件包括配套设置的限位螺栓和限位螺母。
在一个实施例中，所述转轴的两端分别通过轴承固定座与所述旋转滑板连接。
在一个实施例中，所述吸附手臂包括中心轴和真空吸附片，所述旋转机构和真空吸附片分别连接在所述中心轴的两端，且所述中心轴与真空吸附片之间非同轴设置，在所述滑动控制机构的带动下，所述中心轴能带动所述真空吸附片竖向滑动、以及驱动所述真空吸附片围绕所述中心轴作侧向翻转。
在一个实施例中，所述吸附手臂还包括阶梯轴，所述阶梯轴的一端与所述中心轴连接，另一端设有连接臂，所述阶梯轴通过所述连接臂与所述真空吸附片连接，所述连接臂与所述中心轴之间非同轴设置，所述中心轴在旋转时，所述连接臂在所述阶梯轴的转动作用下，能带动所述真空吸附片由所述中心轴的一侧向另一侧翻转，以使所述真空吸附片围绕所述中心轴作侧向翻转。
在一个实施例中，所述真空吸附片围绕所述中心轴作侧向翻转的翻转角度范围为0～360°。
在一个实施例中，所述吸附手臂还包括真空发生器，所述真空发生器与真空吸附片连接。
在一个实施例中，所述分离组件还包括承载台，所述吸附板固定在所述承载台上，所述吸附手臂通过运动控制器安装在所述承载台上，所述承载台连接在所述驱动组件上，在所述驱动组件的带动下，所述承载台能带动所述吸附板和所述吸附手臂同步移动。
在一个实施例中，所述承载台包括固定底板和固定侧板，所述固定侧 板立在所述固定底板上，所述固定侧板的一侧安装有所述运动控制器，所述固定底板的端部向外伸出有固定臂，所述固定臂对应设置在所述运动控制器的一侧，所述固定臂的伸出端连接有所述吸附板。
在一个实施例中，以一个可翻转的所述吸附手臂和一个所述吸附板组成分离单元，所述分离单元包括正向分离单元和反向分离单元，所述正向分离单元的吸附手臂设置在吸附板的外侧，所述反向分离单元的吸附手臂设置在吸附板的内侧；所述正向分离单元和所述反向分离单元间隔排列，且相邻的所述正向分离单元和所述反向分离单元中的两个所述吸附手臂的翻转方向相反。
在一个实施例中，所述驱动组件包括：
X轴驱动器，与所述分离组件连接，以驱动所述吸附板和所述吸附手臂同步的作水平移动；
Y轴驱动器，与所述X轴驱动器连接，用于驱动所述X轴驱动器作竖直移动。
在一个实施例中，所述驱动组件还包括连接机构，所述X轴驱动器固定在连接机构上，所述Y轴驱动器与所述连接机构连接，在所述Y轴驱动器的驱动作用下，所述连接机构能带动所述X轴驱动器作竖直移动。
在一个实施例中，所述连接机构包括连接底板和连接侧板，所述X轴驱动器固定在所述连接底板上，所述连接底板固定在所述连接侧板上，所述连接侧板与所述Y轴驱动器连接，在所述Y轴驱动器的带动下，所述连接侧板能带动所述连接底板作竖直移动。
在一个实施例中，所述X轴驱动器包括X轴驱动电机、同步带轮和水平滑轨，所述水平滑轨铺设在所述连接底板上，在所述水平滑轨上设有可滑动的水平滑块，所述分离组件固定连接在所述水平滑块上，所述X轴驱动电机通过所述同步带轮驱动所述水平滑块沿所述水平滑轨作水平移动，以使所述水平滑块带动所述分离组件作水平移动。
在一个实施例中，所述Y轴驱动器包括Y轴驱动电机和竖直滑轨，所述竖直滑轨上设有可活动的竖直滑块，所述竖直滑块与所述Y轴驱动电机连接，并能在所述Y轴驱动电机的驱动下、沿所述竖直滑轨作竖直移动；所述连接侧板固定连接在所述竖直滑块上，在所述竖直滑块的带动下，所 述连接侧板带动所述连接底板竖直移动，以带动所述X轴驱动器作竖直移动。
在一个实施例中，所述竖直滑轨为丝杠，所述丝杠通过驱动联轴器与所述Y轴驱动电机连接，所述竖直滑块套装在所述丝杠上，所述Y轴驱动电机通过所述驱动联轴器驱动所述丝杠转动，以驱动所述竖直滑块沿所述丝杠作竖直移动。
本公开还提供了一种晶片取片分离方法，该方法基于如上所述的晶片取片分离装置提出，该方法包括以下步骤：
驱动组件驱动吸附板接触并真空吸附在衬底的下表面，并通过运动控制器驱动吸附手臂作侧向翻转，以使所述吸附手臂翻转至所述衬底的上方，且所述吸附手臂与吸附板之间留有空隙；
所述运动控制器驱动所述吸附手臂作竖向滑动，以使所述吸附手臂接触并真空吸附所述衬底上的薄膜；
在所述驱动组件驱动所述吸附板和所述吸附手臂同步移动，以将所述衬底和所述薄膜自载具中同步取出；
保持所述吸附板固定，通过所述运动控制器带动所述吸附手臂作侧向翻转，以使所述吸附手臂带动所述薄膜与所述衬底分离。
在一个实施例中，所述运动控制器包括旋转机构和滑动控制机构，所述滑动控制机构通过所述旋转机构与所述吸附手臂连接，在所述滑动控制机构的驱动作用下，所述旋转机构和所述吸附手臂能同步的作竖向滑动，所述旋转机构能驱动所述吸附手臂作侧向翻转。
在一个实施例中，以一个可翻转的所述吸附手臂和一个所述吸附板组成分离单元，所述分离单元包括正向分离单元和反向分离单元，所述正向分离单元的吸附手臂设置在吸附板的外侧，所述反向分离单元的吸附手臂设置在吸附板的内侧；所述正向分离单元和所述反向分离单元间隔排列，且相邻的所述正向分离单元和所述反向分离单元中的两个所述吸附手臂的翻转方向相反。
(三)有益效果
本公开的上述技术方案具有以下有益效果：
1、本公开所述的晶片取片分离装置及方法中，利用吸附板真空吸附 衬底，利用运动控制器驱动吸附手臂的竖向自滑动，以使吸附手臂吸附住衬底上的薄膜，从而使晶片被夹持在吸附手臂和吸附板之间，利用驱动组件驱动吸附手臂和吸附板同步移动，以实现对晶片的快速取用，并在取用时有效保证晶片的衬底和薄膜的完整性，防止晶片质量受到影响；该装置利用运动控制器驱动吸附手臂的侧向翻转，从而通过吸附手臂的翻转将衬底上的薄膜侧向掀起，以使衬底与薄膜安全分离，故而本装置及方法能够在同一装置上既能实现晶片的快速取用，又能实现晶片的衬底与薄膜的快速分离，有效节约工序转换时间，极大的提高产能；
2、本公开所述的装置及方法中，由于运动控制器驱动吸附手臂的竖向自滑动，将晶片的夹持取用工序进一步分解为两个步骤，且吸附板吸附衬底时，薄膜与吸附手臂之间存在有竖向的安全空隙，能够防止薄膜受损或脱落；当吸附板完成对衬底的下表面的吸附以后，再驱动吸附手臂竖向移动，以贴紧薄膜，从而利用真空吸附住薄膜，防止吸附手臂与薄膜之间、以及薄膜和衬底之间产生偏移，进而确保吸附板和吸附手臂对晶片的安全夹紧，避免薄膜受损，且在取片和分离过程中均能确保衬底和薄膜之间没有相对位移，使得取片和分离工序具有很高的精确性；
3、本公开所述的装置及方法中，同一分离组件上分别设置多组分离单元，以实现一次操作同时完成多片晶片的取放和分离。
4、本公开所述的装置及方法中，正向分离单元和反向分离单元间隔排列，且相邻的正向分离单元和反向分离单元中的两个吸附手臂的翻转方向相反，从而防止相邻两组分离单元的吸附手臂在翻转时互相干涉，提高设备安全性，并能有效节约设备空间；
5、本公开所述的装置及方法中，通过设置限位单元，使得旋转滑板具有可控的竖向滑动行程，以提高取片和分离的精准性。
附图说明
图1为本公开实施例一的晶片取片分离装置的结构示意图；
图2为本公开实施例一的分离组件的俯视图；
图3为本公开实施例一的旋转机构的结构示意图；
图4为本公开实施例一的运动控制器的工作状态图；
图5为本公开实施例二的运动控制器的结构示意图；
图6为本公开实施例一至三的载具的结构示意图；
图7为本公开实施例一至三的晶片的装载状态示意图；
图8为本公开实施例一至三的分离组件的取片示意图；
图9为本公开实施例一至三的分离组件的分离初始状态的结构示意图；
图10为本公开实施例一至三的分离组件的分离状态的结构示意图。
其中，1、Y轴驱动器；2、X轴驱动器；3、连接底板；4、分离组件；5、连接侧板；6、喷水口；
10、固定底板；20、固定侧板；30、旋转机构；40、旋转滑板；50、气缸；60、导轨；70、吸附手臂；80、固定臂；90、吸附板；
31、伺服电机；32、旋转联轴器；33、旋转连接板；34、主动轮；35、皮带；36、从动轮；37、转轴；38、轴承固定座；
401、406、限位固定块；402、404、限位螺栓；403、405、限位螺母；407、固定架；
100、载具；200、衬底；300、薄膜。
具体实施方式
下面结合附图和实施例对本公开的实施方式作进一步详细描述。以下实施例用于说明本公开，但不能用来限制本公开的范围。
在本公开的描述中，除非另有说明，“多个”的含义是两个或两个以上。术语“上”、“下”、“左”、“右”、“内”、“外”、“前端”、“后端”、“头部”、“尾部”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
实施例一
如图1所示，本实施例一提供了一种晶片取片分离装置，用于对晶片进行快速取放和分离，其中，晶片包括衬底200和设在衬底200上的薄膜300。该装置包括分离组件4和驱动组件，驱动组件与分离组件4连接，驱动组件能驱动分离组件整体移动；其中，分离组件4上固定有吸附板90，吸附板90用于真空吸附衬底200，吸附板90的一侧设有可翻转的吸附手 臂70，吸附手臂70既能翻转到衬底200的上方，也能轴向向外翻转从而离开衬底200位置。吸附手臂70连接有运动控制器，驱动组件驱动分离组件4整体移动时，吸附板90能接触并真空吸附在衬底200的下表面，此时，运动控制器能驱动吸附手臂70作竖向移动，以使吸附手臂70接触并真空吸附薄膜300的上表面，以使晶片夹持在吸附板90和吸附手臂70之间；当晶片夹持在吸附板90和吸附手臂70之间时，在驱动组件的驱动作用下，吸附手臂70和吸附板90能同步移动，以将晶片自载具中取出，从而实现对晶片的快速取用，并在取用时有效保护晶片的衬底和薄膜的完整性，防止晶片质量受到影响。此外，运动控制器还能单独驱动吸附手臂70作侧向翻转，以使吸附手臂70能带动薄膜300与衬底200分离，以实现衬底200与薄膜300的安全分离。
由此可知，本装置能够在同一装置上既能实现晶片的快速取用，又能实现晶片的衬底200与薄膜300的快速分离，有效节约工序转换时间，极大的提高产能；同时，由于运动控制器能驱动吸附手臂70的竖向自滑动，从而将晶片的夹持取用工序进一步分解为两个步骤，一方面，在吸附板90吸附衬底200时，薄膜300与吸附手臂70之间存在有竖向的安全空隙，能够防止薄膜300受损或脱落；另一方面，当吸附板90完成对衬底200的吸附以后，再驱动吸附手臂70竖向移动，从而将吸附手臂70的绝对位移从至少两个自由度上分解，实现吸附手臂70和薄膜300的吸附位置的精度微调，从而防止吸附手臂70与薄膜300之间、以及薄膜300和衬底200之间产生偏移，进而确保吸附板90和吸附手臂70对晶片的安全夹紧，避免薄膜300受损，且在取片和分离过程中均能确保衬底200和薄膜300之间没有相对位移，使得取片和分离工序具有很高的精确性。
该装置的分离组件4可分别实现取片和分离。
在取片时，通过驱动组件驱动分离组件4移动，以带动吸附板90接触并真空吸附在衬底200的下表面；由于吸附手臂70具有预设的竖向滑动行程，当吸附手臂70翻转到衬底200上方时，由于吸附手臂70与薄膜200之间存在安全空隙，因此，吸附手臂70的翻转不会碰触伤害到晶片，再利用运动控制器驱动吸附手臂70竖向下滑，从而使其接触并真空吸附在薄膜300上，则晶片被准确的夹持在吸附板90和吸附手臂70之间，防 止衬底200和薄膜300在取片时发生相对位移。将晶片夹持好以后，利用驱动组件驱动分离组件4整体移动，从而驱动吸附板90和吸附手臂70同步移动，以将晶片自载具100中快速取出。
在分离时，该分离组件4分别设有分离初始状态和分离结束状态，如图9和图10所示，当分离组件4处于分离初始状态时，吸附手臂70和吸附板90分别夹紧吸附在晶片的上下两侧，当分离组件4处于分离结束状态时，吸附手臂70自吸附板90的上方向翻转到吸附板90的侧面，在分离组件4由分离初始状态到分离结束状态的过程中，分离组件4利用运动控制器驱动吸附手臂70作侧向翻转，从而通过吸附手臂70的翻转将衬底200上的薄膜300侧向掀起，以使衬底200与薄膜300安全分离。
具体的，图1中，以水平方向为X轴，以竖直方向为Y轴，驱动机构包括X轴驱动器2和Y轴驱动器1，X轴驱动器2与分离组件4连接，用于驱动分离组件4的整体作水平运动，即以驱动吸附板90和吸附手臂70同步的作水平移动；Y轴驱动器1与X轴驱动器2连接，用于驱动X轴驱动器2作竖直运动。
本实施例一中，驱动组件还包括连接机构，X轴驱动器2固定在连接机构上，连接机构与Y轴驱动器1连接，在Y轴驱动器1的驱动作用下，连接机构能带动X轴驱动器2作竖直移动。连接机构包括连接底板3和连接侧板5，X轴驱动器2固定在连接底板3上，连接底板3固定在连接侧板5上，连接侧板5与Y轴驱动器1连接，在Y轴驱动器1的带动下，连接侧板5能带动连接底板3作竖直移动，从而带动X轴驱动器2作竖直移动。
需要说明的是，连接机构除了上述的结构外，还可以包括其他结构，只要满足能够保证X轴驱动器2能够固定在该连接机构上，且该连接机构连接Y轴驱动器1，从而使得Y轴驱动器驱动连接机构运动时，能够带动X轴驱动器2作竖直移动即可。
在一个实施例中，X轴驱动器2包括X轴驱动电机、同步带轮和水平滑轨，水平滑轨铺设在连接底板3上，在水平滑轨上设有可滑动的水平滑块，分离组件4固定连接在水平滑块上，X轴驱动电机通过同步带轮驱动水平滑块沿水平滑轨作水平移动，从而使得水平滑块带动分离组件4的整 体沿水平的X轴移动。同理，Y轴驱动器1包括Y轴驱动电机和竖直滑轨，竖直滑轨竖立设置，其上设有竖直滑块，竖直滑块能够沿着竖直滑轨滑动，Y轴驱动电机可安装在竖直滑轨的任一端，并能驱动竖直滑块滑动，连接侧板5固定连接在竖直滑块上，从而使得竖直滑块能够带动连接侧板5竖直运动，进而带动X轴驱动器2竖直运动。
为了驱动机构的结构可靠性更强，Y轴驱动器的竖直滑轨除了上述的滑块活动装配在轨道内的结构外，还可以采用丝杠与螺母活动装配的结构。其中，可竖直滑轨为丝杠，则竖直滑块为螺母，丝杠通过驱动联轴器与Y轴驱动电机的输出轴连接，以使Y轴驱动电机通过驱动联轴器驱动丝杠转动，从而带动螺接在丝杠上的竖直滑块沿丝杠移动，进而实现竖直滑块的竖直移动。
需要说明的是，本实施例一的X轴驱动器2和Y轴驱动器1中，驱动电机可以选用伺服电机31，也可以选用步进电机；X轴驱动器2的水平滑轨、以及Y轴驱动器1的竖直滑轨均可以由丝杠和支撑座组件替代；X轴驱动器2的同步带轮可以由齿轮组件替代，即X轴驱动电机通过齿轮组件与分离组件4连接，以驱动分离组件4沿水平滑轨水平移动；Y轴驱动器1的驱动联轴器可以替换为同步带轮或者齿轮组件，只要能够使得Y轴驱动电机带动通过连接侧板5带动X轴驱动器2沿竖直滑轨移动即可。
图1中示出了本装置的参考坐标系，其中，以Z轴的正向为外侧，Z轴的反向为内侧。在本实施例一的装置中，以一个可翻转的吸附手臂70和一个吸附板90为分离单元，分离单元包括正向分离单元和反向分离单元，正向分离单元的吸附手臂70设置在吸附板90的外侧，反向分离单元的吸附手臂70设置在吸附板90的内侧。本实施例中，分离组件上设有一组或多组分离单元，当设有一组分离单元时，该分离单元既可以为正向分离单元也可以为反向分离单元；当设有多组分离单元时，正向分离单元和反向分离单元间隔排列，由于每组分离单元中的吸附手臂70均可以各自单独控制，且相邻的所述正向分离单元和所述反向分离单元中的两个吸附手臂70的翻转方向相反，每个吸附手臂70作侧向翻转时的翻转角度范围可以是0～360°，因此，本装置不但可以实现在一次操作中同时完成多片衬底200的取放和分离，还可以使得相邻两组分离单元的两个吸附手臂70 在翻转时避免互相干涉，提高设备安全性，并能有效节约设备空间。
以下以一个分离组件4上分别设置两组分离单元为例具体介绍分离组件4的结构，其中，两组分离单元中一个为正向分离单元，一个为反向分离单元，且为了更加方便各组的吸附手臂70的安全翻转，这两组分离单元中的两个吸附板90相邻。
如图2所示，分离组件4包括旋转机构30和滑动控制机构，运动控制器包括旋转机构30和滑动控制机构，滑动控制机构通过旋转机构30与吸附手臂70连接，在滑动控制机构的驱动作用下下，旋转机构30和吸附手臂70能同步的作竖向滑动，旋转机构30还能单独的驱动吸附手臂70作侧向翻转。由于驱动组件能带动分离组件4整体移动，因此，在分离组件4整体移动时，意味着旋转机构30、滑动控制机构、以及固定在分离组件4上的吸附板90同步移动，从而当吸附板90的位置确定后，可以以此为基准通过旋转机构30和滑动控制机构的互相配合，来驱动吸附手臂70进行移动和翻转运动。
为了进一步实现分离组件4与驱动组件的可靠连接，提高装置的操作精度，分离组件4还可包括承载台，吸附板90固定在承载台上，吸附手臂70通过运动控制器安装在承载台上，承载台连接在驱动组件上，驱动组件能够驱动承载台移动，从而使承载台带动吸附板90和吸附手臂70同步移动，进而使驱动组件实现对分离组件4的整体移动的驱动作用。
其中，承载台包括但不限于固定底板10和固定侧板20，固定侧板20立在固定底板10上，运动控制器的旋转机构30和滑动控制机构均安装在固定侧板20的同一侧，固定底板10的端部向外伸出有固定臂80，固定臂80对应设置在运动控制器的一侧，固定臂80的伸出端连接有吸附板90。
当分离组件4上设有两组分离单元时，可分别在固定底板10的两端各立有一个固定侧板20，两组分离单元中的两个吸附手臂70上分别连接有两个旋转机构30，这两个旋转机构30分别通过滑动控制机构安装在两个固定侧板20的内侧，在固定底板10的同一端并排向外伸出有两个固定臂80，每个固定臂80的伸出端固定有一吸附板90，其中，吸附板90包括有吸附端部，通过吸附端部插入载具100内，以真空吸附在衬底200的下表面。这两个固定臂80之间预留有预设距离，以避免在取片或分离时、 两个晶片的衬底200之间和薄膜300之间相互碰撞，这是因为：如果两个旋转机构30的翻转方向相同时，则两个固定臂80之间的预设距离应留足够大，从而需要在两个薄膜300之间留有足够大的空间，才能保证在分离时不发生干涉；但是，一方面当两个薄膜300之间的距离足够大时，机构体积就会变大，而本装置的两个吸附手臂70分别采用一左一右的反向翻转的方式，来同时分离两个晶片的衬底200和薄膜300，从而能够有效的减少机构占地空间；另一方面，两个晶片的薄膜300之间的空间可以通过增大载具100的尺寸来实现，也可以在载具100尺寸不变的情况下，将两个吸附手臂70设置为可动状态，以便能调节两个吸附手臂70之间的间距。而本装置采用设置两个吸附手臂70的翻转方向相反，来实现两个晶片的薄膜300和衬底200的同时分离，从而保证了在不改变原有载具100尺寸的基础上，能够安全的实现多晶片同步分离的工序，并且既不需要调整吸附手臂70的间距，也不会引起两个薄膜300之间的干涉，因此具有最高的安全可靠性。
为了实现吸附手臂70的侧向翻转，吸附手臂70可包括中心轴和真空吸附片，旋转机构和真空吸附片分别连接在中心轴的两端，且中心轴与真空吸附片之间非同轴设置，因此，旋转机构在滑动控制机构的带动下竖直运动，同时中心轴能驱动真空吸附片竖向滑动，并通过中心轴的自身旋转，来驱动真空吸附片围绕所述中心轴作侧向翻转。
为了确保真空吸附片翻转时的翻转精度足够高，吸附手臂70还可包括阶梯轴，所述阶梯轴的一端与所述中心轴连接，另一端设有连接臂，所述阶梯轴通过所述连接臂与所述真空吸附片连接，中心轴在旋转时，连接臂在阶梯轴的转动作用下，能带动真空吸附片由中心轴的一侧向另一侧翻转，以使真空吸附片围绕中心轴作侧向翻转；且连接臂与中心轴之间非同轴设置，并能合理控制连接臂的侧向翻转的翻转半径，从而在旋转机构的带动下，使得真空吸附片翻转到薄膜300的上方后，在运动控制器的带动下，竖向向下移动，以从薄膜300的上表面夹紧晶片，同时真空吸附在薄膜300上，然后利用真空吸附片的翻转带动薄膜300自衬底200上掀起；其中，阶梯轴的阶梯层级数量可以根据真空吸附片的翻转半径、以及结构强度系数确定。中心轴的旋转角度可由旋转机构30调控，从而控制真空 吸附片的翻转位置和翻转速度。真空吸附片还连接有真空发生器，从而在真空吸附片与薄膜200之间创造真空负压环境，以便于真空吸附片真空吸附住薄膜200，同理的，吸附板90上也连接有真空发生器。
具体的，如图3所示，本实施例一的旋转机构30包括皮带传动机构，皮带传动机构的主动轮34通过旋转联轴器32连接有伺服电机31，皮带传动机构中可以设有一个或多个从动轮36，而皮带传动机构的任一从动轮36通过转轴37与吸附手臂70连接，即可通过伺服电机31的主动轴的旋转从而带动转轴37旋转，从而驱动吸附手臂70作侧向翻转；其中，旋转联轴器32和转轴37分别与滑动控制机构连接，滑动控制机构能够同时带动旋转联轴器32和转轴37同步移动，从而实现旋转机构30的竖向往复自滑动。
需要说明的是，旋转机构30的皮带传动机构也可以采用齿轮传动机构的，对应的，齿轮传动机构中的主动齿轮与旋转联轴器32连接，任一从动齿轮与转轴37连接，从而实现伺服电机31动力和扭矩的可靠传动；旋转机构30的动力单元既可以选用伺服电机31，也可以选用步进电机。
如图4所示，为了可靠控制旋转机构30的竖向往复自滑动，本实施例一的滑动控制机构包括旋转滑板40、气缸50和限位单元。
具体的，导轨60可铺设在承载台的固定侧板20上，从而在驱动机构驱动承载台移动时，导轨60能够随着承载台而移动，从而推动使旋转机构30随着分离组件4的整体移动；旋转滑板40通过滑块与导轨60连接，滑块带动旋转滑板40沿导轨60竖直滑动，利用导轨60对旋转滑板40的移动方向进行限制；旋转联轴器32和转轴37分别固定在旋转滑板40上，能够随着旋转滑板40的滑动而移动，其中，转轴37的两端可分别通过轴承固定座38与旋转滑板40连接，旋转联轴器32可通过旋转连接板33固定在旋转滑板40上，从而分别保证转轴37和旋转联轴器32的转动精度高。
除了利用导轨60对旋转滑板40的移动方向进行限位外，还可以采用丝杠组件对旋转滑板40的移动方向进行限位，即旋转滑板40上设置丝杠螺母，并将丝杠固定在固定侧板20上，从而利用丝杠螺母在丝杠上的竖直滑动，实现旋转滑板40的竖直滑动。
气缸50竖直连接在旋转滑板40上，在气缸50伸缩时能带动旋转滑板40滑动。本实施例一中，气缸50的缸筒可通过固定架407固定在固定侧板20上，气缸50的活塞杆一端固定在固定底板10上，另一端沿缸筒的轴向作往复运动。由于固定底板10相对于分离组件4的整体而言是固定不动的，当气缸50处于伸出状态时，活塞杆一端顶住固定底板10，另一端推动滑块沿导轨60向上运动；旋转滑板40固定在滑块上，旋转机构30固定在旋转滑板40上，而吸附手臂70又固定在旋转机构30上。因此当气缸50的活塞杆伸出时，导轨60滑块会向上运动，从而旋转滑板40、旋转机构30以及吸附手臂70也随之向上运动；当气缸50的活塞杆缩紧时，则活塞杆拉动滑块沿导轨60向下运动，旋转滑板40、旋转机构30以及吸附手臂70也随之向下运动，从而实现旋转机构30的竖向滑动。
需要说明的是，除了利用气缸50的伸缩带动旋转滑板40滑动外，还可以采用丝杠螺母装配结构带动旋转滑板40滑动，即将丝杠立在固定底板10上，丝杠螺母套装在丝杠外，并沿丝杠轴向移动，丝杠螺母固定在旋转滑板40上，从而利用丝杠螺母与丝杠的相对移动，带动旋转滑板40的竖直滑动。
在一个实施例中，限位单元安装在旋转滑板40上，分别对旋转滑板40的滑动行程最高点和最低点进行限位，从而利用导轨60和限位单元的组合，实现对旋转滑板40的滑动方向及滑动行程的双重限位，进而实现对吸附手臂70的位移微调，确保吸附手臂70安全的吸附住薄膜300。
具体的，限位单元包括限位固定块401、406和限位套件，在旋转滑板40的滑动行程最高处和最低处各设有限位固定块401、406，并在旋转滑板40的两侧分别设置有限位台，其中一个限位台与设置在最高处的限位固定块401相对设置，另一个限位台与设置在最低处的限位固定块406相对设置；限位套件设置在任一对限位台和限位固定块401、406上，限位套件可包括配套设置的限位螺栓402、404和限位螺母403、405。
本实施例一的旋转滑板40的顶部左侧设有一较低的限位台，右侧设有一向外伸出的较高的限位台，从而在旋转滑板40的顶部形成阶梯结构。一方面，在左侧限位台的上方设置最高点限位固定块401，在该限位固定块401上设置限位螺栓402，且在该限位台的对应位置设置限位螺母403， 以使这一套限位螺栓402和限位螺母403之间相对设置，从而形成一套设置在最高点的限位套件；同理的，在右侧限位台的下方设置最低点限位固定块406，在该向外伸出的限位台上设置限位螺栓404，并在该限位固定块406上对应设置限位螺母405，以使这一套限位螺栓404和限位螺母405之间相对设置，从而形成一套设置在最低点的限位套件。当气缸50的活塞杆伸出时，位于最高点的限位螺栓402和限位螺母403接触，则此位置为滑动行程最高点；当气缸50的活塞杆回缩时，位于最低点的限位螺栓404和限位螺母405接触，则此位置为滑动行程最低点。旋转滑板40无论滑动至行程最高点还是最低点均会由于限位螺栓402、404与限位螺母403、405的碰撞而停止滑动，从而实现旋转滑板40的滑动行程的上下限位。
实施例二
本实施例二所述的晶片取片分离装置的结构与实施例一所述的装置结构基本相同，相同之处不再赘述，不同之处在于：如图5所示，本实施例二所述的装置中，旋转机构30通过摆动气缸50与转轴37连接，摆动气缸50带动转轴37旋转，从而驱动吸附手柄作侧向翻转；其中，摆动气缸50和转轴37分别连接在旋转滑板40上，并与滑动控制机构连接，滑动控制机构能够同时带动摆动气缸50和转轴37同步移动，从而实现旋转机构30的竖向往复自滑动。
实施例三
在实施例一或实施例二的基础上，本实施例三提供了一种晶片取片分离方法，包括以下步骤：
S1、驱动组件驱动吸附板接触并真空吸附在衬底的下表面，并通过运动控制器驱动吸附手臂作侧向翻转，以使吸附手臂翻转至衬底的上方，且吸附手臂与吸附板之间留有空隙。
S2、运动控制器驱动吸附手臂作竖向滑动，以使吸附手臂接触并真空吸附衬底上的薄膜。
S3、在驱动组件驱动吸附板和吸附手臂同步移动，以将衬底和薄膜自载具中同步取出。
S4、保持吸附板固定，通过运动控制器带动吸附手臂作侧向翻转，以 使吸附手臂带动薄膜与衬底分离。
其中，步骤S1～步骤S4为取片步骤，步骤S5为分离步骤。
进一步的，取片步骤中，具体可分解为以下步骤：
S201：驱动X轴驱动器2水平移动，驱动Y轴驱动器1向上运动，以使吸附板90和衬底200的下表面接触，并通过真空吸附在衬底200上；通过运动控制器的旋转机构30驱动吸附手臂70作侧向翻转，以使吸附手臂70翻转至衬底200的上方，且吸附手臂70与吸附板90之间留有空隙。
如图6和图7所示，多个方形载具100并列设置，每个载具100内设有用于装载晶片的方形衬底200的凹槽，当衬底200装载在凹槽内时，衬底200上的薄膜300的边缘搭载在载具100上表面；载具100的一端设有与吸附板90相匹配的通道，且通道的数量与吸附板90上的吸附端部的数量相同，本实施例三中，吸附板90的吸附端部为两个，则载具100的通道对应设有两个。
如图8所示，分离组件4在取片时，可以先将吸附板90真空吸附在衬底100的下表面，然后再将吸附手臂70翻转到吸附板90的上方，使得晶片位于吸附板90和吸附手臂70之间；也可以先将吸附手臂70翻转到吸附板90的上方，再通过驱动组件带动吸附板90移动并吸附到衬底100的下表面，即将晶片插入至吸附板90和吸附手臂70之间。
由于气缸50保持在伸出状态，吸附手臂70和吸附板90之间留有一定的安全空隙，因此当吸附板90位于载具100的通道内，并吸附在衬底200的下方时，吸附手臂70位于薄膜300的上方，没有和薄膜300接触。
S201：驱动气缸50缩回，以带动旋转机构30和吸附手臂70沿Y轴方向同步向下运动，从而使吸附手臂70和薄膜300上表面发生接触，并使吸附手臂70通过真空吸附在薄膜300上。
S301：保证晶片被夹持在吸附手臂70和吸附板90之间，驱动Y轴驱动器1向上运动一定距离，以使分离组件4的吸附板90和吸附手臂70同步带动晶片的衬底200和薄膜300离开载具100，并保证分离组件4与载具100之间不接触。
S302：通过X轴驱动器2驱动分离组件4的整体移动至预设的分离位置，则吸附板90和吸附手臂70能分别将薄膜300和衬底200同时从载具 100中取出，取片步骤完成。
在上述的取片步骤中，由于本装置的分离组件4上设有两组分离器，因此可以实现每次均能同步取出两个衬底200，有效提高产能。
进一步的，分离步骤中，具体可分解为以下步骤：
S401：分别驱动X轴驱动器2和Y轴驱动器1移动到预设的分离位置，该分离位置设有喷水口6。
S402：通过X轴驱动器2和Y轴驱动器1的移动对薄膜300和衬底200的位置进行同步调整，以使每个晶片的薄膜300和衬底200之间各设有一个喷水口6。
S403：驱动旋转机构30旋转，以带动吸附手臂70侧向翻转，从而将薄膜300自衬底200上掀起，旋转机构30通过旋转一定角度，将薄膜300从衬底200上掀起，从而实现薄膜300和衬底200的分离。
步骤402和步骤403之间的分离组件4经历了分离初始状态到分离结束状态的过程，在此过程中，喷水口6持续向衬底200和薄膜300的结合面喷水，以提高薄膜300和衬底200之间的润滑度，保证分离的安全性和工件完整性。
由于本装置设有两组分离单元，则两组分离单元中各自配设的两个旋转机构30能同时向相反的方向缓慢的旋转一定角度，即图8中的左侧吸附手臂70进行左旋，而右侧吸附手臂70进行右旋。当两个旋转机构30分别旋转一定角度后，两个衬底200和薄膜300各自完成分离。
S504：当衬底200与薄膜300分离后，驱动旋转机构30快速旋转，以带动吸附手臂70翻转至外侧位，以使衬底200与薄膜300完全分离，至此完成衬底200和薄膜300的分离步骤。
同样的，本装置的两组分离单元中，两个旋转机构30分别快速旋转至如图10所示的外侧位，以使薄膜300和衬底200完全分离，此时分离组件4处于分离状态。
由上述内容可知，分离组件4上安装有两组分离单元时，两组分离单元中一个为正向分离单元，一个为反向分离单元，且为了更加方便各组的吸附手臂70的安全翻转，这两组分离单元中的两个吸附板90相邻，且这两组分离单元中的两个吸附手臂70的翻转方向相反，因此，通过该方法 对衬底200和薄膜300进行分离，可以实现一次操作同时完成多片衬底200的取放和分离，并能有效防止相邻两组分离器在翻转吸附手臂70时互相干涉，提高设备安全性，并能有效节约设备空间。
综上所述，以上各个实施例所述的晶片取片分离装置及方法中，利用吸附板90真空吸附衬底200，利用运动控制器驱动吸附手臂70的竖向自滑动，以使吸附手臂70吸附住衬底200上的薄膜300，从而使晶片被夹持在吸附手臂70和吸附板90之间，利用驱动组件驱动吸附手臂70和吸附板90同步移动，以实现对晶片的快速取用，并在取用时有效保证晶片的衬底200和薄膜300的完整性，防止晶片质量受到影响；该装置利用运动控制器驱动吸附手臂70的侧向翻转，从而通过吸附手臂70的翻转将衬底200上的薄膜300侧向掀起，以使衬底200与薄膜300安全分离，故而使得本装置及方法能够在同一装置上既能实现晶片的快速取用，又能实现晶片的衬底200与薄膜300的快速分离，有效节约工序转换时间，极大的提高产能。
本装置和方法中，由于运动控制器驱动吸附手臂70的竖向自滑动，将晶片的夹持取用工序进一步分解为两个步骤，且吸附板90吸附衬底200时，薄膜300与吸附手臂70之间存在有竖向的安全空隙，能够防止薄膜300受损或脱落；当吸附板90完成对衬底200的下表面的吸附以后，再驱动吸附手臂70竖向移动，以贴紧薄膜300，从而利用真空吸附住薄膜300，防止吸附手臂70与薄膜300之间、以及薄膜300和衬底200之间产生偏移，进而确保吸附板90和吸附手臂70对晶片的安全夹紧，避免薄膜300受损，且在取片和分离过程中均能确保衬底200和薄膜300之间没有相对位移，使得取片和分离工序具有很高的精确性；
本装置和方法中，同一分离组件上分别设置多组分离单元，以实现一次操作同时完成多片晶片的取放和分离。
本装置和方法中，正向分离单元和反向分离单元间隔排列，且相邻的正向分离单元和反向分离单元中的两个吸附手臂70的翻转方向相反，从而防止相邻两组分离单元的吸附手臂70在翻转时互相干涉，提高设备安全性，并能有效节约设备空间；
本装置和方法中，通过设置限位单元，使得旋转滑板40具有可控的 竖向滑动行程，以提高取片和分离的精准性。
本公开的实施例是为了示例和描述起见而给出的，而并不是无遗漏的或者将本公开限于所公开的形式。很多修改和变化对于本领域的普通技术人员而言是显而易见的。选择和描述实施例是为了更好说明本公开的原理和实际应用，并且使本领域的普通技术人员能够理解本公开从而设计适于特定用途的带有各种修改的各种实施例。

Claims (23)

  1. 一种晶片取片分离装置，其特征在于，包括分离组件和驱动组件，晶片包括衬底和设在所述衬底上的薄膜，所述驱动组件与分离组件连接，所述分离组件上固定有吸附板，所述吸附板用于吸附固定所述衬底，所述吸附板的一侧设有可翻转的吸附手臂，所述吸附板和所述吸附手臂能分别吸附在所述衬底的下表面和所述薄膜的上表面，以使所述晶片夹持在所述吸附板和所述吸附手臂之间，在所述驱动组件的驱动作用下，所述吸附手臂和所述吸附板能同步移动，以将所述晶片自载具中取出；
    所述吸附手臂连接有运动控制器，所述驱动组件驱动所述吸附板接触并真空吸附在所述衬底的下表面时，所述运动控制器能驱动所述吸附手臂作竖向移动，以使所述吸附手臂接触并真空吸附所述薄膜；所述运动控制器还能驱动所述吸附手臂作侧向翻转，以使所述吸附手臂带动所述薄膜与所述衬底分离。
  2. 根据权利要求1所述的晶片取片分离装置，其特征在于，所述运动控制器包括旋转机构和滑动控制机构，所述滑动控制机构通过所述旋转机构与所述吸附手臂连接，在所述滑动控制机构的驱动作用下，所述旋转机构和所述吸附手臂能同步的作竖向滑动，所述旋转机构能驱动所述吸附手臂作侧向翻转。
  3. 根据权利要求2所述的晶片取片分离装置，其特征在于，所述旋转机构包括皮带传动机构，所述皮带传动机构的主动轮通过旋转联轴器连接有伺服电机，所述皮带传动机构的任一从动轮通过转轴与所述吸附手臂连接；所述旋转联轴器和所述转轴分别与所述滑动控制机构连接。
  4. 根据权利要求3所述的晶片取片分离装置，其特征在于，所述滑动控制机构包括：
    旋转滑板，通过滑块连接有导轨，所述滑块用于带动所述旋转滑板沿所述导轨竖直滑动，所述旋转联轴器和所述转轴分别固定在所述旋转滑板上；
    气缸，竖直连接在所述旋转滑板上，在所述气缸伸缩时能带动所述旋转滑板滑动；
    限位单元，安装在所述旋转滑板上，分别对所述旋转滑板的滑动行程 最高点和最低点进行限位。
  5. 根据权利要求4所述的晶片取片分离装置，其特征在于，所述限位单元包括限位固定块和限位套件，在所述旋转滑板的滑动行程最高处和最低处各设有所述限位固定块，并在所述旋转滑板的两侧分别设置有限位台，其中一个所述限位台与设置在最高处的所述限位固定块相对设置，另一个所述限位台与设置在最低处的所述限位固定块相对设置；所述限位套件设置在任一对所述限位台和限位固定块上。
  6. 根据权利要求5所述的晶片取片分离装置，其特征在于，所述限位套件包括配套设置的限位螺栓和限位螺母。
  7. 根据权利要求4所述的晶片取片分离装置，其特征在于，所述转轴的两端分别通过轴承固定座与所述旋转滑板连接。
  8. 根据权利要求2所述的晶片取片分离装置，其特征在于，所述吸附手臂包括中心轴和真空吸附片，所述旋转机构和真空吸附片分别连接在所述中心轴的两端，且所述中心轴与真空吸附片之间非同轴设置，在所述滑动控制机构的带动下，所述中心轴能带动所述真空吸附片竖向滑动、以及驱动所述真空吸附片围绕所述中心轴作侧向翻转。
  9. 根据权利要求8所述的晶片取片分离装置，其特征在于，所述吸附手臂还包括阶梯轴，所述阶梯轴的一端与所述中心轴连接，另一端设有连接臂，所述阶梯轴通过所述连接臂与所述真空吸附片连接，所述连接臂与所述中心轴之间非同轴设置，所述中心轴在旋转时，所述连接臂在所述阶梯轴的转动作用下，能带动所述真空吸附片由所述中心轴的一侧向另一侧翻转，以使所述真空吸附片围绕所述中心轴作侧向翻转。
  10. 根据权利要求8所述的晶片取片分离装置，其特征在于，所述真空吸附片围绕所述中心轴作侧向翻转的翻转角度范围为0～360°。
  11. 根据权利要求8所述的晶片取片分离装置，其特征在于，所述吸附手臂还包括真空发生器，所述真空发生器与真空吸附片连接。
  12. 根据权利要求2所述的晶片取片分离装置，其特征在于，所述分离组件还包括承载台，所述吸附板固定在所述承载台上，所述吸附手臂通过运动控制器安装在所述承载台上，所述承载台连接在所述驱动组件上，在所述驱动组件的带动下，所述承载台能带动所述吸附板和所述吸附手臂 同步移动。
  13. 根据权利要求12所述的晶片取片分离装置，其特征在于，所述承载台包括固定底板和固定侧板，所述固定侧板立在所述固定底板上，所述固定侧板的一侧安装有所述运动控制器，所述固定底板的端部向外伸出有固定臂，所述固定臂对应设置在所述运动控制器的一侧，所述固定臂的伸出端连接有所述吸附板。
  14. 根据权利要求1-13任一项所述的晶片取片分离装置，其特征在于，以一个可翻转的所述吸附手臂和一个所述吸附板组成分离单元，所述分离单元包括正向分离单元和反向分离单元，所述正向分离单元的吸附手臂设置在吸附板的外侧，所述反向分离单元的吸附手臂设置在吸附板的内侧；所述正向分离单元和所述反向分离单元间隔排列，且相邻的所述正向分离单元和所述反向分离单元中的两个所述吸附手臂的翻转方向相反。
  15. 根据权利要求1-13任一项所述的晶片取片分离装置，其特征在于，所述驱动组件包括：
    X轴驱动器，与所述分离组件连接，以驱动所述吸附板和所述吸附手臂同步的作水平移动；
    Y轴驱动器，与所述X轴驱动器连接，用于驱动所述X轴驱动器作竖直移动。
  16. 根据权利要求15所述的晶片取片分离装置，其特征在于，所述驱动组件还包括连接机构，所述X轴驱动器固定在连接机构上，所述Y轴驱动器与所述连接机构连接，在所述Y轴驱动器的驱动作用下，所述连接机构能带动所述X轴驱动器作竖直移动。
  17. 根据权利要求16所述的晶片取片分离装置，其特征在于，所述连接机构包括连接底板和连接侧板，所述X轴驱动器固定在所述连接底板上，所述连接底板固定在所述连接侧板上，所述连接侧板与所述Y轴驱动器连接，在所述Y轴驱动器的带动下，所述连接侧板能带动所述连接底板作竖直移动。
  18. 根据权利要求17所述的晶片取片分离装置，其特征在于，所述X轴驱动器包括X轴驱动电机、同步带轮和水平滑轨，所述水平滑轨铺设在所述连接底板上，在所述水平滑轨上设有可滑动的水平滑块，所述分离组 件固定连接在所述水平滑块上，所述X轴驱动电机通过所述同步带轮驱动所述水平滑块沿所述水平滑轨作水平移动，以使所述水平滑块带动所述分离组件作水平移动。
  19. 根据权利要求17所述的晶片取片分离装置，其特征在于，所述Y轴驱动器包括Y轴驱动电机和竖直滑轨，所述竖直滑轨上设有可活动的竖直滑块，所述竖直滑块与所述Y轴驱动电机连接，并能在所述Y轴驱动电机的驱动下、沿所述竖直滑轨作竖直移动；所述连接侧板固定连接在所述竖直滑块上，在所述竖直滑块的带动下，所述连接侧板带动所述连接底板竖直移动，以带动所述X轴驱动器作竖直移动。
  20. 根据权利要求19所述的晶片取片分离装置，其特征在于，所述竖直滑轨为丝杠，所述丝杠通过驱动联轴器与所述Y轴驱动电机连接，所述竖直滑块套装在所述丝杠上，所述Y轴驱动电机通过所述驱动联轴器驱动所述丝杠转动，以驱动所述竖直滑块沿所述丝杠作竖直移动。
  21. 一种晶片取片分离方法，其特征在于，该方法基于如权利要求1-20任一项所述的晶片取片分离装置提出，该方法包括以下步骤：
    驱动组件驱动吸附板接触并真空吸附在衬底的下表面，并通过运动控制器驱动吸附手臂作侧向翻转，以使所述吸附手臂翻转至所述衬底的上方，且所述吸附手臂与吸附板之间留有空隙；
    所述运动控制器驱动所述吸附手臂作竖向滑动，以使所述吸附手臂接触并真空吸附所述衬底上的薄膜；
    在所述驱动组件驱动所述吸附板和所述吸附手臂同步移动，以将所述衬底和所述薄膜自载具中同步取出；
    保持所述吸附板固定，通过所述运动控制器带动所述吸附手臂作侧向翻转，以使所述吸附手臂带动所述薄膜与所述衬底分离。
  22. 根据权利要求21所述的取片分离方法，其特征在于，所述运动控制器包括旋转机构和滑动控制机构，所述滑动控制机构通过所述旋转机构与所述吸附手臂连接，在所述滑动控制机构的驱动作用下，所述旋转机构和所述吸附手臂能同步的作竖向滑动，所述旋转机构能驱动所述吸附手臂作侧向翻转。
  23. 根据权利要求21或22所述的晶片取片分离方法，其特征在于， 以一个可翻转的所述吸附手臂和一个所述吸附板组成分离单元，所述分离单元包括正向分离单元和反向分离单元，所述正向分离单元的吸附手臂设置在吸附板的外侧，所述反向分离单元的吸附手臂设置在吸附板的内侧；所述正向分离单元和所述反向分离单元间隔排列，且相邻的所述正向分离单元和所述反向分离单元中的两个所述吸附手臂的翻转方向相反。
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