WO2020012623A1 - Treatment tool - Google Patents

Treatment tool Download PDF

Info

Publication number
WO2020012623A1
WO2020012623A1 PCT/JP2018/026406 JP2018026406W WO2020012623A1 WO 2020012623 A1 WO2020012623 A1 WO 2020012623A1 JP 2018026406 W JP2018026406 W JP 2018026406W WO 2020012623 A1 WO2020012623 A1 WO 2020012623A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
treatment tool
hole
heat
substrate
Prior art date
Application number
PCT/JP2018/026406
Other languages
French (fr)
Japanese (ja)
Inventor
雅人 成澤
Original Assignee
オリンパス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Priority to PCT/JP2018/026406 priority Critical patent/WO2020012623A1/en
Publication of WO2020012623A1 publication Critical patent/WO2020012623A1/en

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
    • A61B18/08—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by means of electrically-heated probes

Definitions

  • the present invention relates to a treatment tool.
  • Patent Literature 1 a treatment system that treats a target part of a living tissue by applying energy to the part to be treated (hereinafter, referred to as a target part) has been known (for example, see Patent Document 1).
  • the treatment system described in Patent Literature 1 includes a treatment tool having a grasping unit that grasps a target site.
  • the grip is provided with a heater for heating the target portion.
  • the heater includes a substrate and a resistance pattern provided on the substrate.
  • the resistance pattern includes a heat-generating region that generates heat by energization, and a connection region that is electrically connected to the heat-generating region and is connected to a wiring member that supplies power.
  • the treatment system employs a configuration for solving the problem of uneven load.
  • the uneven load refers to a state in which the target portion is gripped by a part of the gripping surface, not the entire gripping surface of the gripping portion that grips the target portion.
  • a treatment region In the case where one heater region is provided in the entire region of the heater that overlaps with the gripping surface in the thickness direction of the substrate (hereinafter, referred to as a treatment region), there is the following problem.
  • the load is unevenly distributed, in the heat generation region, the temperature of the portion covered by the target portion is lower than the target temperature by transmitting heat to the target portion. .
  • the portion not covered by the target portion does not transmit heat to the target portion, and thus the temperature of the portion becomes higher than the target temperature. That is, there is a problem in that the target site cannot be heated at the target temperature, and the treatment time is long.
  • the treatment system described in Patent Document 1 employs a heater in which two resistance patterns are provided on a substrate. Specifically, the respective heat generating regions constituting the two resistance patterns are respectively provided on the substrate at different positions in the longitudinal direction of the substrate (the longitudinal direction of the grip portion). The two heat-generating regions are controlled independently of each other. With such a configuration, even if the load is unevenly distributed, the target portion can be heated at the target temperature, and the target portion can be appropriately treated.
  • the resistance pattern provided on the distal end side of the substrate has a connection region located substantially near the center in the longitudinal direction of the substrate.
  • the connection area is located in the treatment area. That is, since the wiring member is connected to the connection region in the treatment region, the thickness of the treatment region (dimension in the thickness direction of the substrate) in the grip portion is increased.
  • the treatment tool described in Patent Document 1 has a problem that it is difficult to reduce the size.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a treatment tool that can be reduced in size.
  • a treatment tool includes a treatment member that transmits heat to a living tissue, and a first surface joined to the treatment member, An insulating substrate having the first surface and a second surface forming the front and back, and a first resistance pattern provided on the substrate, wherein the first resistance pattern is formed on the first surface; A first heat-generating region that generates heat when electric power is supplied, and a first heat-generating region that is provided between the first heat-generating region and a base end of the substrate and electrically connected to the first heat-generating region; A first resistance pattern having a first connection region to which a first wiring member for supplying a first electric power is connected, and a second resistance pattern provided on the substrate, wherein On the surface, formed between the first heat-generating region and the tip of the substrate; A second heat-generating region that generates heat by applying a force, and a second wiring member that is provided between the first heat-generating region and the base end of the substrate and that supplies the second power;
  • the second region is a region where the first heat generating region is provided, and the third region is a region where the first connection region and the second connection region are provided.
  • a second resistor on the first surface, wherein the second resistor is a second resistor on the first surface. Includes a turn, the.
  • downsizing can be achieved.
  • FIG. 1 is a diagram illustrating a treatment system according to the first embodiment.
  • FIG. 2 is an enlarged view of the distal end portion of the treatment tool.
  • FIG. 3 is an exploded perspective view showing the heat generating structure.
  • FIG. 4 is a diagram illustrating a heater.
  • FIG. 5 is a diagram illustrating a heater.
  • FIG. 6 is a diagram illustrating a heater.
  • FIG. 7 is a diagram illustrating a heater according to the second embodiment.
  • FIG. 8 is a diagram illustrating a heater according to the second embodiment.
  • FIG. 9 is a diagram illustrating a heater according to the second embodiment.
  • FIG. 10 is a diagram illustrating a heater according to the third embodiment.
  • FIG. 11 is a diagram illustrating a heater according to the third embodiment.
  • FIG. 12 is a diagram illustrating a heater according to the third embodiment.
  • FIG. 1 is a diagram showing a treatment system 1 according to the first embodiment.
  • the treatment system 1 treats a target part of a living tissue by applying thermal energy to a part to be treated (hereinafter, referred to as a target part).
  • the treatment means, for example, coagulation and incision of the target site.
  • the treatment system 1 includes a treatment tool 2, a control device 3, and a foot switch 4, as shown in FIG.
  • the treatment tool 2 is, for example, a surgical treatment tool for treating a target site while passing through the abdominal wall.
  • the treatment tool 2 includes a handle 5, a shaft 6, and a grip 7, as shown in FIG.
  • the handle 5 is a part that the operator holds by hand.
  • the handle 5 is provided with an operation knob 51 as shown in FIG.
  • the shaft 6 has a substantially cylindrical shape, and one end is connected to the handle 5 (FIG. 1).
  • a grip 7 is attached to the other end of the shaft 6.
  • An opening / closing mechanism (FIG. 1) for opening and closing the first and second gripping members 8, 9 (FIG. 1) constituting the gripping portion 7 according to the operation of the operating knob 51 by the operator. (Abbreviated).
  • An electric cable C (FIG. 1) is provided from one end to the other end of the shaft 6 via the handle 5 inside the shaft 6.
  • FIG. 2 is an enlarged view of the distal end portion of the treatment tool 2.
  • the grasping unit 7 is a part that treats the target site while holding the target site.
  • the grip 7 includes first and second gripping members 8 and 9.
  • the first and second gripping members 8 and 9 are configured to be openable and closable in the direction of arrow R1 (FIG. 2) in accordance with the operation of the operation knob 51 by the operator.
  • the first gripping member 8 is disposed below the second gripping member 9 in FIG. 1 or 2.
  • the first holding member 8 includes a first jaw 10 and a heat generating structure 11, as shown in FIG.
  • the first jaw 10 is formed in a long shape extending in a longitudinal direction (left and right directions in FIGS. 1 and 2) from the distal end of the grip portion 7 to the proximal end.
  • a concave portion 101 is formed on the upper surface in FIG.
  • the concave portion 101 is located at the center of the first jaw 10 in the width direction, and extends along the longitudinal direction of the first jaw 10. Further, among the side walls forming the concave portion 101, the side wall on the base end side is omitted.
  • the first jaw 10 is fixed to the distal end of the shaft 6 with the concave portion 101 facing upward in FIG. 2 while supporting the heat generating structure 11.
  • FIG. 3 is an exploded perspective view showing the heating structure 11. Specifically, FIG. 3 is an exploded perspective view of the heat generating structure 11 viewed from above in FIGS.
  • the heat generating structure 11 is housed in the recess 101 with a part thereof protruding upward from the recess 101 in FIG. Then, the heat generating structure 11 generates heat energy under the control of the control device 3.
  • the heat generating structure 11 includes a heat transfer plate 12, a heater 13, and an adhesive member 14.
  • the heat transfer plate 12 corresponds to a treatment member according to the present invention.
  • the heat transfer plate 12 is a long plate formed of, for example, a material such as copper and extending along the longitudinal direction of the grip portion 7.
  • the upper surface of the heat transfer plate 12 contacts the target portion while the target portion is gripped by the first and second gripping members 8 and 9. Then, the surface transmits heat from the heater 13 to the target portion. That is, the surface functions as a treatment surface 121 (FIGS. 2 and 3) for applying thermal energy to the target portion.
  • the treatment surface 121 is in a direction A1 where the first and second gripping members 8 and 9 face each other in a state where the target portion is gripped by the first and second gripping members 8 and 9 ( It is constituted by a flat surface orthogonal to FIG. 2).
  • the treatment surface 121 is configured by a flat surface, but is not limited thereto, and may be configured by another shape such as a convex shape or a concave shape. The same applies to a gripping surface 191 described later.
  • FIG. 4 to 6 are views showing the heater 13. Specifically, FIG. 4 is a view of the heater 13 as viewed from the heat transfer plate 12 side.
  • FIG. 5 is a view of the heater 13 as viewed from the bottom surface side of the concave portion 101.
  • FIG. 6 is a view of the heater 13 as viewed from the side (a direction along the width direction of the heater 13). In FIG. 6, for convenience of description, only two of the first conductive portions 174a to 174c among the four first conductive portions 174a to 174d are illustrated.
  • the heater 13 is a seat heater that heats the heat transfer plate 12 by partially generating heat.
  • the heater 13 includes a substrate 15 and first and second resistance patterns 16 and 17 as shown in FIGS.
  • the substrate 15 is a long sheet made of an insulating material such as polyimide and extending along the longitudinal direction of the grip 7.
  • the material of the substrate 15 is not limited to polyimide, but may be a high heat-resistant insulating material such as aluminum nitride, alumina, glass, and zirconia.
  • the surface facing the heat transfer plate 12 is the first surface 151 (FIGS. 4 and 6), and the surface that forms the front and back of the first surface 151 is the second surface 152 (FIGS. 6).
  • the first resistance pattern 16 is made of a conductive material. As shown in FIG. 4 or FIG. 6, the first resistance pattern 16 includes a pair of first connection portions 161 and a first heating portion 162.
  • the pair of first connection portions 161 correspond to a first connection region according to the present invention.
  • the pair of first connection portions 161 are provided on the first surface 151 on the proximal end side, respectively, and extend from the proximal end side to the distal end side, respectively. They oppose each other along the width direction of the substrate 15.
  • two first lead wires C1 (FIGS. 4 and 6) constituting the electric cable C are respectively connected to the pair of first connection portions 161.
  • the first lead wire C1 corresponds to a first wiring member according to the present invention. In FIG. 6, only one first lead C1 is shown for convenience of explanation.
  • the first heat generating portion 162 corresponds to a first heat generating region according to the present invention. As shown in FIG. 4, the first heat generating portion 162 has one end located on the base end side on the first surface 151, and extends in a meandering manner from the one end toward the tip end side. In addition, the first heat generating portion 162 is folded in the vicinity of the approximate center of the substrate 15 in the longitudinal direction, and then extends in a meandering manner toward the base end side. That is, the first heat generating portion 162 has a U-shape. Then, both ends of the first heat generating portion 162 are electrically connected to the pair of first connecting portions 161 respectively.
  • the temperature coefficient of resistance, the resistance value, and the electrical resistivity of the first connection portion 161 are set to be smaller than those of the first heating portion 162, respectively.
  • a material forming the first heat generating portion 162 stainless steel or the like can be exemplified.
  • examples of a material forming the first connection portion 161 include gold and the like.
  • the first connection portion 161 may be formed of the same material as that of the first heat generating portion 162, and then may be formed by plating the surface with gold or the like. Then, a voltage (corresponding to the first power according to the present invention) is applied to the pair of first connection portions 161 by passing through the two first lead wires C1 under the control of the control device 3. Is done. Thereby, in the first resistance pattern 16, the first heat generating portion 162 mainly generates heat.
  • the substrate 15 is divided into three regions of first to third regions Ar1 to Ar3 (FIGS. 4 to 6) arranged in parallel along the longitudinal direction of the substrate 15. 4 to 6, two planes PL1 and PL2 that divide the substrate 15 into three regions of first to third regions Ar1 to Ar3 are shown by alternate long and short dash lines.
  • the second area Ar2 is an area where the first heat generating portion 162 is provided.
  • the first region Ar1 is a region located between the second region Ar2 and the tip of the substrate 15 (the left end in FIG. 3).
  • the third region Ar3 is a region located between the second region Ar2 and the base end (the right end in FIG. 3) of the substrate 15, and is a region where the first connection portion 161 is provided. .
  • the second region Ar2 on the first surface 151 is referred to as a fourth region Ar4 (FIG. 4) for convenience of description.
  • the second resistance pattern 17 is made of a conductive material. As shown in FIGS. 4 to 6, the second resistance pattern 17 includes a pair of second connection portions 171 (FIGS. 4 and 6) and a second heating portion 172 (FIGS. 4 and 6). , And a wiring portion 173.
  • the pair of second connection portions 171 correspond to a second connection region according to the present invention. As shown in FIG. 4, the pair of second connection portions 171 are provided on the first surface 151 on the proximal end side, respectively, and extend from the proximal end side to the distal end side, respectively.
  • the pair of first connection portions 161 are opposed to each other along the width direction of the substrate 15 with the first connection portions 161 interposed therebetween.
  • the pair of second connection portions 171 are provided in the third region Ar3 on the first surface 151.
  • two second lead wires C2 (FIGS. 4 and 6) constituting the electric cable C are connected to the pair of second connection portions 171 respectively.
  • the second lead wire C2 corresponds to a second wiring member according to the present invention. In FIG. 6, only one second lead C2 is shown for convenience of explanation.
  • the second heat generating section 172 corresponds to a second heat generating area according to the present invention.
  • the second heat generating portion 172 has one end located on the base end side of the first region Ar1 on the first surface 151, and meanders in a wavy manner from the one end toward the front end side. While extending.
  • the second heat generating portion 172 is folded back on the distal end side of the substrate 15 and then extends in a meandering manner toward the base end side. That is, the second heat generating portion 172 has a U-shape.
  • the second heat generating portion 172 is provided in the first area Ar1 on the first surface 151.
  • the first and second heat generating portions 162 and 172 are provided at different positions in the longitudinal direction of the substrate 15, respectively.
  • the wiring section 173 corresponds to a wiring area according to the present invention.
  • the wiring portion 173 includes four first conductive portions 174a to 174d and two second conductive portions 175a and 175b (FIGS. 5 and 6).
  • the four first conductive portions 174a to 174d correspond to the through-hole region according to the present invention.
  • the substrate 15 has two first through holes 153a and 153b and two second through holes penetrating the first and second surfaces 151 and 152, respectively. 154a and 154b are formed.
  • the two first through holes 153a and 153b are provided on the base end side in the first region Ar1. More specifically, the two first through holes 153a and 153b are provided between the first heat generating portion 162 and the second heat generating portion 172, respectively. Further, the two second through holes 154a and 154b are provided in the third region Ar3, respectively.
  • the two first conductive portions 174a and 174b are conductive portions provided in the two first through holes 153a and 153b, respectively, and are electrically connected to both ends of the second heat generating portion 172, respectively. .
  • the two first conductive portions 174c and 174d are conductive portions provided in the two second through holes 154a and 154b, respectively, and are electrically connected to the pair of second connection portions 171 respectively. . That is, each of the four first conductive portions 174a to 174d is a through hole.
  • the four first conductive portions 174a to 174d are formed of two first through holes 153a and 153b and two second through holes 154a and 154b. Each is embedded in the whole.
  • the four first conductive portions 174a to 174d may be provided only on the inner peripheral surfaces of the two first through holes 153a and 153b and the two second through holes 154a and 154b. In the embedded configuration as in the first embodiment, since the cross-sectional area is large, the resistance values of the four first conductive portions 174a to 174d can be reduced as compared with the configuration provided only on the inner peripheral surface. Become.
  • the two second conductive portions 175a and 175b correspond to the region outside the through hole according to the present invention. These two second conductive portions 175a and 175b are provided on the second surface 152 as shown in FIG. 5 or FIG.
  • One of the second conductive portions 175a has one end electrically connected to the first conductive portion 174a, extends from the one end toward the base end, and has the other end connected to the first conductive portion 174c. Make an electrical connection.
  • the other second conductive portion 175b has one end electrically connected to the first conductive portion 174b, extends from the one end toward the base end, and has the other end connected to the first conductive portion 174d. Make an electrical connection.
  • the width of each of the two second conductive portions 175a and 175b is set to be larger than each of the second heat generating portions 172. Accordingly, the resistance values of the two second conductive portions 175a and 175b are set lower than the resistance value of the second heat generating portion 172.
  • a part of the wiring portion 173 is provided in the second region Ar2 on the second surface 152. In other words, the wiring portion 173 is provided so as to avoid the fourth region Ar4.
  • the temperature coefficient of resistance, the resistance value, and the electrical resistivity of the second connection portion 171 and the wiring portion 173 are set to be smaller than those of the second heating portion 172, respectively. Further, the temperature coefficient of resistance, the resistance value, and the electrical resistivity of the first conductive portions 174a to 174d are set smaller than those of the second connection portion 171 and the second conductive portions 175a, 175b.
  • a material of the second heat generating portion 172 stainless steel or the like can be exemplified.
  • examples of a material forming the second connection portion 171 and the second conductive portions 175a and 175b include gold and the like.
  • the second connecting portion 171 and the second conductive portions 175a and 175b are made of the same material as that of the second heat generating portion 172, and the surface thereof is plated with gold or the like. It does not matter. Further, examples of the material forming the first conductive portions 174a to 174d include copper and the like. Then, a voltage (corresponding to the second power according to the present invention) is applied to the pair of second connection portions 171 by passing through the two second lead wires C2 under the control of the control device 3. Is done. Thereby, in the first resistance pattern 16, the second heat generating portion 172 mainly generates heat.
  • the bonding member 14 is a long sheet provided between the heat transfer plate 12 and the first surface 151 of the substrate 15 and extending along the longitudinal direction of the grip 7. is there. Then, the adhesive member 14 adhesively fixes the heat transfer plate 12 and the substrate 15.
  • the adhesive member 14 has good thermal conductivity and insulating properties, withstands high temperatures, and has adhesive properties.
  • the heat transfer plate 12 is disposed so as to cover the entire first and second heat generating portions 162 and 172. That is, the heat transfer plate 12 is disposed so as to cover only the first and second regions Ar1 and Ar2 without covering the third region Ar3.
  • the adhesive member 14 covers the entire first and second heat generating portions 162 and 172 and also covers a part of each of the pair of first connection portions 161 and the pair of second connection portions 171. Is done. That is, the adhesive member 14 is disposed in a state of protruding toward the base end side with respect to the heat transfer plate 12. Then, the two first lead wires C1 and the two second lead wires C2 are located in a region of the pair of first connection portions 161 and the pair of second connection portions 171 that are not covered by the adhesive member 14. Connected respectively.
  • the second gripping member 9 includes a second jaw 18 and an opposing plate 19.
  • the second jaw 18 has the same shape as the first jaw 10. That is, the second jaw 18 has a concave portion 181 similar to the concave portion 101, as shown in FIG. Then, the second jaw 18 is rotatably supported on the shaft 6 in a posture in which the concave portion 181 faces downward in FIG. 2 while supporting the opposing plate 19 within the concave portion 181, and rotates. To open and close the first gripping member 8.
  • the first gripping member 8 (first jaw 10) is fixed to the shaft 6, and the second gripping member 9 (second jaw 18) is fixed to the shaft 6.
  • the first gripping member 8 is pivotally supported on the shaft 6
  • the second gripping member 9 is fixed on the shaft 6, and the second gripping member 8 rotates to rotate the second gripping member 9.
  • a configuration that opens and closes with respect to the gripping member 9 may be employed.
  • the opposing plate 19 is made of, for example, a conductive material such as copper.
  • the opposite plate 19 is a flat plate having substantially the same planar shape as the recess 181 and is fixed in the recess 181. Then, in the opposing plate 19, the gripping surface 191 on the lower side in FIG.
  • the opposing plate 19 is not limited to the conductive material, and may be made of another material, for example, a resin material such as PEEK (polyetheretherketone).
  • the foot switch 4 is a part operated by the surgeon using his / her foot. Then, in response to the operation on the foot switch 4, the treatment control by the control device 3 is executed.
  • the means for executing the treatment control is not limited to the foot switch 4, but may be a switch operated by hand or the like.
  • the control device 3 includes a CPU (Central Processing Unit), an FGPA (Field-Programmable Gate Array), and the like, and executes treatment control for treating a target site by operating the treatment tool 2 according to a predetermined program. I do.
  • the operation of the above-described treatment system 1 will be described.
  • the operator holds the treatment tool 2 by hand and inserts the distal end portion (a part of the grip 7 and the shaft 6) of the treatment tool 2 into the abdominal cavity after passing through the abdominal wall using, for example, a trocar. Further, the operator operates the operation knob 51. Then, the operator grips the target site with the gripping unit 7. Thereafter, the surgeon operates the foot switch 4. Then, the control device 3 executes the following treatment control.
  • the control device 3 executes a treatment control for switching between the first state and the second state at a predetermined control cycle.
  • the first state is a state in which a voltage is applied to the pair of first connection portions 161 via two first lead wires C1.
  • the first state is a state in which only the first resistance pattern 16 of the first and second resistance patterns 16 and 17 is energized.
  • the second state is a state in which a voltage is applied to the pair of second connection portions 171 via the two second lead wires C2. That is, the second state is a state in which only the second resistance pattern 17 of the first and second resistance patterns 16 and 17 is energized.
  • the control device 3 uses, for example, a voltage drop method from the voltage value and the current value supplied to the first resistance pattern 16 or the second resistance pattern 17. To measure the first and second heater resistances.
  • the first heater resistance means a resistance value of the first resistance pattern 16.
  • the second heater resistance means a resistance value of the second resistance pattern 17.
  • the control device 3 refers to the first and second resistance-temperature characteristics measured in advance.
  • the first resistance-temperature characteristic is a characteristic indicating a relationship between the first heater resistance and the temperature of the first heat generating portion 162 (hereinafter, referred to as a first heater temperature).
  • the second resistance-temperature characteristic is a characteristic indicating the relationship between the second heater resistance and the temperature of the second heating section 172 (hereinafter, referred to as a second heater temperature). Then, the control device 3 changes the first and second heater resistances in the first and second resistance-temperature characteristics while changing the power supplied to the first and second resistance patterns 16 and 17. Control is performed to the target resistance value corresponding to the target temperature. As a result, the first and second heat generating units 162 and 172 are controlled to the target temperatures independently of each other. That is, heat from the first and second heat generating units 162 and 172 controlled to the target temperature is transmitted to the target portion by passing through the heat transfer plate 12. Then, the target site is incised while coagulating.
  • the first and second heat generating units 162 and 172 are provided at different positions in the longitudinal direction of the grip unit 7 and are controlled independently of each other. For this reason, similarly to the configuration described in Patent Literature 1, the target site can be heated at the target temperature even if the load is unevenly distributed, and the target site can be appropriately treated. Further, the first and second connection portions 161 and 171 are provided in a third region Ar3 that is not covered by the heat transfer plate 12.
  • the heat transfer plate 12 The thickness dimension (dimension in the thickness direction of the substrate 15) of the first and second regions Ar1 and Ar2 covered by the first and second regions Ar1 and Ar2 does not increase.
  • the diameter of the grip 7 that is, to reduce the size of the treatment tool 2
  • the wiring portion 173 includes four first conductive portions 174a to 174d and two second conductive portions 175a and 175b. That is, the wiring portion 173 is provided on the substrate 15 at a position avoiding the fourth region Ar4. For this reason, the width dimension of the substrate 15 can be reduced, and the diameter of the grip portion 7 can be reduced, that is, the treatment tool 2 can be reduced in size.
  • the resistance value and the electric resistivity of the wiring portion 173 are set to be smaller than those of the second heat generating portion 172, respectively. Therefore, when current is supplied to the second resistance pattern 17, heat generation of the wiring portion 173 can be suppressed.
  • the resistance value of the wiring portion 173 easily changes depending on the temperature. That is, the second heater temperature is deviated from the target temperature by being affected by the heat generated by the first and second heat generating portions 162 and 172 and the heat being released by the structure contacting the wiring portion 173. The temperature may fluctuate, resulting in an unintended temperature.
  • the resistance temperature coefficient of the wiring portion 173 is set smaller than that of the second heating portion 172. For this reason, the above-described influence can be suppressed, and the second heater temperature can be accurately controlled to the target temperature.
  • the four first conductive portions 174a to 174d are through holes penetrating the first and second surfaces 151 and 152, respectively. Therefore, when the four first conductive portions 174a to 174d are formed, the region where the first and second heat generating portions 162 and 172 are formed is formed by the formation of the four first conductive portions 174a to 174d. It becomes smaller by the area. That is, the size of the four first conductive portions 174a to 174d is desirably small in order to make the regions where the first and second heat generating portions 162 and 172 are formed as large as possible.
  • the temperature coefficient of resistance, the resistance value, and the electrical resistivity of the first conductive portions 174a to 174d are respectively smaller than those of the second conductive portions 175a and 175b. It is set small. Therefore, even when the size of the first conductive portions 174a to 174d is reduced, local overheating can be suppressed and the risk of disconnection can be reduced.
  • the two first conductive portions 174a and 174b are provided between the first heat generating portion 162 and the second heat generating portion 172, respectively. For this reason, even if the heat of the second heat generating portion 172 escapes from the two first conductive portions 174a and 174b, the heat from the first heat generating portion 162 causes the two first conductive portions 174a and 174b. It is possible to compensate for the temperature drop in the part. That is, the uniformity of the entire treatment surface 121 can be achieved.
  • the first and second connection portions 161 and 171 are provided on the first surface 151, respectively. That is, the first and second connection portions 161 and 171 are provided on the same surface. For this reason, the wiring work of the first and second lead wires C1 and C2 can be easily performed.
  • FIG. 7 is a diagram corresponding to FIG.
  • FIG. 8 is a diagram corresponding to FIG.
  • FIG. 9 is a diagram corresponding to FIG. Note that FIG. 9 illustrates only one of the first conductive portions 174a of the two first conductive portions 174a and 174b for convenience of description, and one of the conductive portions 163 of the two conductive portions 163. Only one is shown.
  • the first and second connection portions 161 and 171 are different from the first connection portions 161 and 171. Is provided on the second surface 152, not on the surface 151.
  • the pair of first connection portions 161 according to the second embodiment are mutually connected along the width direction of the substrate 15 in the third region Ar3 of the second surface 152. Each is provided in an opposed state.
  • the substrate 15 is formed with two second through holes 155 penetrating the first and second surfaces 151 and 152, respectively.
  • the two second through holes 155 are provided in the third region Ar3, respectively.
  • conductive portions 163 made of a conductive material are provided in the second through holes 155, respectively. That is, each of the two conductive portions 163 is a through hole.
  • the two conductive portions 163 electrically connect both ends of the first heat generating portion 162 and the pair of first connecting portions 161 respectively.
  • the pair of second connection portions 171 according to the second embodiment sandwich the pair of first connection portions 161 in the third region Ar3 of the second surface 152. In this state, they are provided facing each other along the width direction of the substrate 15. Then, the pair of second connection portions 171 are electrically connected to the two second conductive portions 175a and 175b, respectively. That is, in the heater 13A according to the second embodiment, two second through holes 154a and 154b and two first conductive portions 174c and 174d are different from the heater 13 described in the first embodiment. Not provided.
  • the two first lead wires C1 and the two second lead wires C2 are arranged as shown in FIG. As shown in FIG. 9, wiring is performed on the second surface 152 side.
  • FIGS. 10 to 12 are views showing a heater 13B according to the third embodiment.
  • FIG. 10 is a diagram corresponding to FIG.
  • FIG. 11 is a diagram corresponding to FIG.
  • FIG. 12 is a diagram corresponding to FIG. Note that FIG. 12 illustrates only one of the first conductive portions 174a of the two first conductive portions 174a and 174b for convenience of description.
  • the second connection portion 171 is located on the first surface 151. Rather, it is provided on the second surface 152.
  • the pair of second connection portions 171 according to the third embodiment are connected to each other along the width direction of the substrate 15 in the third region Ar3 of the second surface 152. Each is provided in an opposed state. Then, the pair of second connection portions 171 are electrically connected to the two second conductive portions 175a and 175b, respectively. That is, in the heater 13B according to the third embodiment, two second through holes 154a and 154b and two first conductive portions 174c and 174d are different from the heater 13 described in the first embodiment. Not provided. With the provision of the second connection portion 171 on the second surface 152, the two second lead wires C2 are connected on the second surface 152 side as shown in FIG. 11 or FIG. Is done. On the other hand, the two first lead wires C1 are wired on the first surface 151 side, as shown in FIG. 10 or 12, as in the first embodiment.
  • the second holding member 9 is also provided with the heaters 13, 13A and 13B, and heat energy is applied from both the first and second holding members 8 and 9 to the target portion.
  • the configuration may be as follows.
  • a configuration may be employed in which high-frequency energy or ultrasonic energy is further applied to a target portion in addition to heat energy. Note that "giving high frequency energy to a target portion” means flowing high frequency current to the target portion. “Applying ultrasonic energy to a target portion” means applying ultrasonic vibration to a target portion.
  • the present invention is not limited to this, and three or more resistance patterns may be provided.
  • three or more heat generating units including the first and second heat generating units 162 and 172 are provided at different positions in the longitudinal direction of the substrate 15 respectively.
  • the position at which the wiring portion 173 is provided is not limited to the position described in Embodiments 1 to 3 described above, and if the wiring portion 173 is located at a position avoiding the fourth region Ar4. May be provided on the side end surface of the substrate 15.
  • the two first conductive portions 174a and 174b are provided between the first heat generating portion 162 and the second heat generating portion 172, respectively, but the present invention is not limited to this. .
  • the two first conductive portions 174a and 174b may be provided on the tip side of the first region Ar1, that is, on the tip side of the second heat generating portion 172. With such a configuration, heat generation at the distal end side is suppressed, and a tissue such as a blood vessel grasped at the distal end can be sealed without incision.
  • the first connection portion 161 is provided on the first surface 151 and the second connection portion 171 is provided on the second surface 152.
  • the present invention is not limited to this.
  • the second connection portion 171 may be provided on the first surface 151
  • the first connection portion 161 may be provided on the second surface 152.

Abstract

This treatment tool is provided with: an insulating substrate 15 comprising first and second surfaces 151, 152 forming a front and a back with respect to each other; and first and second resistance patterns 16, 17 each provided to the substrate 15. The first resistance pattern 16 comprises a first heat-generating area 162 formed on the first surface 151 and a first connection area provided between the first heat-generating area 162 and the base end of the substrate 15 and electrically connected with the first heat-generating area 162. The second resistance pattern 17 comprises, on the first surface 151, a second heat-generating area 172 formed between the first heat-generating area 162 and the leading end of the substrate, a second connection area 171 provided between the first heat-generating area 162 and the base end of the substrate 15, and a wiring area 173 electrically connecting the second heat-generating area 172 and the second connection area 171. The wiring area 173 is provided to a position away from a fourth area. The fourth area is a second area Ar2 in which a second heat-generating area 162 is provided in the first surface 151.

Description

処置具Treatment tool
　本発明は、処置具に関する。 The present invention relates to a treatment tool.
　従来、生体組織における処置の対象となる部位（以下、対象部位と記載）に対してエネルギを付与することによって当該対象部位を処置する処置システムが知られている（例えば、特許文献１参照）。
　特許文献１に記載の処置システムは、対象部位を把持する把持部を有する処置具を備える。当該把持部には、対象部位を加熱するためのヒータが設けられている。当該ヒータは、基板と、当該基板上に設けられた抵抗パターンとを備える。当該抵抗パターンは、通電によって発熱する発熱領域と、当該発熱領域と電気的に接続するとともに、電力を通電する配線部材が接続される接続領域とを備える。そして、当該処置システムでは、偏在負荷の問題を解決する構成が採用されている。 2. Description of the Related Art Conventionally, a treatment system that treats a target part of a living tissue by applying energy to the part to be treated (hereinafter, referred to as a target part) has been known (for example, see Patent Document 1).
The treatment system described in Patent Literature 1 includes a treatment tool having a grasping unit that grasps a target site. The grip is provided with a heater for heating the target portion. The heater includes a substrate and a resistance pattern provided on the substrate. The resistance pattern includes a heat-generating region that generates heat by energization, and a connection region that is electrically connected to the heat-generating region and is connected to a wiring member that supplies power. The treatment system employs a configuration for solving the problem of uneven load.
　ここで、偏在負荷とは、把持部における対象部位を把持する把持面全面ではなく、当該把持面の一部で対象部位を把持した状態を意味する。
　そして、ヒータにおいて、把持面に対して基板の厚み方向に重なり合う領域（以下、処置領域と記載）全体に一つの発熱領域が設けられている場合には、以下の問題がある。
　偏在負荷になっている場合には、発熱領域において、対象部位にて覆われている部分は、当該対象部位に対して熱が伝達されることによって、当該部分の温度が目標温度よりも低くなる。一方、発熱領域において、対象部位にて覆われていない部分は、当該対象部位に対して熱が伝達されないため、当該部分の温度が目標温度よりも高くなる。すなわち、目標温度で対象部位を加熱することができず、処置時間が長く掛かってしまう、という問題がある。 Here, the uneven load refers to a state in which the target portion is gripped by a part of the gripping surface, not the entire gripping surface of the gripping portion that grips the target portion.
In the case where one heater region is provided in the entire region of the heater that overlaps with the gripping surface in the thickness direction of the substrate (hereinafter, referred to as a treatment region), there is the following problem.
In the case where the load is unevenly distributed, in the heat generation region, the temperature of the portion covered by the target portion is lower than the target temperature by transmitting heat to the target portion. . On the other hand, in the heat generating region, the portion not covered by the target portion does not transmit heat to the target portion, and thus the temperature of the portion becomes higher than the target temperature. That is, there is a problem in that the target site cannot be heated at the target temperature, and the treatment time is long.
　そこで、特許文献１に記載の処置システムでは、基板上に２つの抵抗パターンが設けられたヒータを採用している。具体的に、２つの抵抗パターンをそれぞれ構成する各発熱領域は、基板上において、当該基板の長手方向（把持部の長手方向）の異なる位置にそれぞれ設けられている。そして、当該２つの発熱領域は、互いに独立した状態で制御される。このような構成により、偏在負荷になっていても、目標温度で対象部位を加熱することができ、適切に当該対象部位を処置することができる。 Therefore, the treatment system described in Patent Document 1 employs a heater in which two resistance patterns are provided on a substrate. Specifically, the respective heat generating regions constituting the two resistance patterns are respectively provided on the substrate at different positions in the longitudinal direction of the substrate (the longitudinal direction of the grip portion). The two heat-generating regions are controlled independently of each other. With such a configuration, even if the load is unevenly distributed, the target portion can be heated at the target temperature, and the target portion can be appropriately treated.
特許第４５９３２４１号公報Japanese Patent No. 4593241
　しかしながら、特許文献１に記載の処置具では、２つの抵抗パターンのうち基板の先端側に設けられた抵抗パターンは、接続領域が基板の長手方向における略中央付近に位置する。言い換えれば、当該接続領域は、処置領域内に位置する。すなわち、当該処置領域内において当該接続領域に対して配線部材が接続されるため、把持部において、当該処置領域の厚み寸法（基板の厚み方向の寸法）が大型化してしまう。ここで、把持部を細径化、すなわち、処置具を小型化するためには、当該把持部において、処置領域の厚み寸法を小さくする必要がある。したがって、特許文献１に記載の処置具では、小型化を図ることが難しい、という問題がある。 However, in the treatment tool described in Patent Literature 1, of the two resistance patterns, the resistance pattern provided on the distal end side of the substrate has a connection region located substantially near the center in the longitudinal direction of the substrate. In other words, the connection area is located in the treatment area. That is, since the wiring member is connected to the connection region in the treatment region, the thickness of the treatment region (dimension in the thickness direction of the substrate) in the grip portion is increased. Here, in order to reduce the diameter of the grip portion, that is, to reduce the size of the treatment tool, it is necessary to reduce the thickness of the treatment region in the grip portion. Therefore, the treatment tool described in Patent Document 1 has a problem that it is difficult to reduce the size.
　本発明は、上記に鑑みてなされたものであって、小型化を図ることができる処置具を提供することを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to provide a treatment tool that can be reduced in size.
　上述した課題を解決し、目的を達成するために、本発明に係る処置具は、生体組織に対して熱を伝達する処置部材と、前記処置部材に対して接合される第１の面と、前記第１の面と表裏をなす第２の面とを有する絶縁性の基板と、前記基板に設けられた第１の抵抗パターンであって、前記第１の面上に形成され、第１の電力を通電することによって発熱する第１の発熱領域と、前記第１の発熱領域と前記基板の基端との間に設けられ、前記第１の発熱領域と電気的に接続するとともに、前記第１の電力を通電する第１の配線部材が接続される第１の接続領域と、を有する第１の抵抗パターンと、前記基板に設けられた第２の抵抗パターンであって、前記第１の面上において、前記第１の発熱領域と前記基板の先端との間に形成され、第２の電力を通電することによって発熱する第２の発熱領域と、前記第１の発熱領域と前記基板の基端との間に設けられ、前記第２の電力を通電する第２の配線部材が接続される第２の接続領域と、前記基板を前記基板の長手方向に沿って並列する第１の領域と第２の領域と第３の領域との３つの領域に区画した場合に、第４の領域を避けた位置に設けられ、前記第２の発熱領域と前記第２の接続領域とを電気的に接続する配線領域と、を有し、前記第１の領域は、前記第２の発熱領域が設けられた領域であり、前記第２の領域は、前記第１の発熱領域が設けられた領域であり、前記第３の領域は、前記第１の接続領域と前記第２の接続領域とが設けられた領域であり、前記第４の領域は、前記第１の面における前記第２の領域である、第２の抵抗パターンと、を備える。 In order to solve the above-described problems and achieve the object, a treatment tool according to the present invention includes a treatment member that transmits heat to a living tissue, and a first surface joined to the treatment member, An insulating substrate having the first surface and a second surface forming the front and back, and a first resistance pattern provided on the substrate, wherein the first resistance pattern is formed on the first surface; A first heat-generating region that generates heat when electric power is supplied, and a first heat-generating region that is provided between the first heat-generating region and a base end of the substrate and electrically connected to the first heat-generating region; A first resistance pattern having a first connection region to which a first wiring member for supplying a first electric power is connected, and a second resistance pattern provided on the substrate, wherein On the surface, formed between the first heat-generating region and the tip of the substrate; A second heat-generating region that generates heat by applying a force, and a second wiring member that is provided between the first heat-generating region and the base end of the substrate and that supplies the second power; A fourth connection region when the substrate is divided into three regions: a first region, a second region, and a third region, which are arranged in parallel along the longitudinal direction of the substrate; And a wiring region for electrically connecting the second heat-generating region and the second connection region, wherein the first region is formed by the second heat-generating region. The second region is a region where the first heat generating region is provided, and the third region is a region where the first connection region and the second connection region are provided. A second resistor on the first surface, wherein the second resistor is a second resistor on the first surface. Includes a turn, the.
　本発明に係る処置具によれば、小型化を図ることができる。 According to the treatment tool according to the present invention, downsizing can be achieved.
図１は、実施の形態１に係る処置システムを示す図である。FIG. 1 is a diagram illustrating a treatment system according to the first embodiment. 図２は、処置具の先端部分を拡大した図である。FIG. 2 is an enlarged view of the distal end portion of the treatment tool. 図３は、発熱構造体を示す分解斜視図である。FIG. 3 is an exploded perspective view showing the heat generating structure. 図４は、ヒータを示す図である。FIG. 4 is a diagram illustrating a heater. 図５は、ヒータを示す図である。FIG. 5 is a diagram illustrating a heater. 図６は、ヒータを示す図である。FIG. 6 is a diagram illustrating a heater. 図７は、実施の形態２に係るヒータを示す図である。FIG. 7 is a diagram illustrating a heater according to the second embodiment. 図８は、実施の形態２に係るヒータを示す図である。FIG. 8 is a diagram illustrating a heater according to the second embodiment. 図９は、実施の形態２に係るヒータを示す図である。FIG. 9 is a diagram illustrating a heater according to the second embodiment. 図１０は、実施の形態３に係るヒータを示す図である。FIG. 10 is a diagram illustrating a heater according to the third embodiment. 図１１は、実施の形態３に係るヒータを示す図である。FIG. 11 is a diagram illustrating a heater according to the third embodiment. 図１２は、実施の形態３に係るヒータを示す図である。FIG. 12 is a diagram illustrating a heater according to the third embodiment.
　以下に、図面を参照して、本発明を実施するための形態（以下、実施の形態）について説明する。なお、以下に説明する実施の形態によって本発明が限定されるものではない。さらに、図面の記載において、同一の部分には同一の符号を付している。 Hereinafter, an embodiment (hereinafter, an embodiment) for carrying out the present invention will be described with reference to the drawings. The present invention is not limited by the embodiments described below. Further, in the description of the drawings, the same portions are denoted by the same reference numerals.
（実施の形態１）
　〔処置システムの概略構成〕
　図１は、本実施の形態１に係る処置システム１を示す図である。
　処置システム１は、生体組織における処置の対象となる部位（以下、対象部位と記載）に対して熱エネルギを付与することによって、当該対象部位を処置する。ここで、当該処置とは、例えば、対象部位の凝固及び切開を意味する。この処置システム１は、図１に示すように、処置具２と、制御装置３と、フットスイッチ４とを備える。 (Embodiment 1)
[Schematic configuration of treatment system]
FIG. 1 is a diagram showing a treatment system 1 according to the first embodiment.
The treatment system 1 treats a target part of a living tissue by applying thermal energy to a part to be treated (hereinafter, referred to as a target part). Here, the treatment means, for example, coagulation and incision of the target site. The treatment system 1 includes a treatment tool 2, a control device 3, and a foot switch 4, as shown in FIG.
　〔処置具の構成〕
　処置具２は、例えば、腹壁を通した状態で対象部位を処置するための外科医療用処置具である。この処置具２は、図１に示すように、ハンドル５と、シャフト６と、把持部７とを備える。
　ハンドル５は、術者が手で持つ部分である。そして、このハンドル５には、図１に示すように、操作ノブ５１が設けられている。
　シャフト６は、略円筒形状を有し、一端がハンドル５に対して接続されている（図１）。また、シャフト６の他端には、把持部７が取り付けられている。そして、このシャフト６の内部には、術者による操作ノブ５１の操作に応じて、把持部７を構成する第１，第２の把持部材８，９（図１）を開閉させる開閉機構（図示略）が設けられている。また、このシャフト６の内部には、電気ケーブルＣ（図１）がハンドル５を経由することによって一端側から他端側まで配設されている。 [Configuration of treatment tool]
The treatment tool 2 is, for example, a surgical treatment tool for treating a target site while passing through the abdominal wall. The treatment tool 2 includes a handle 5, a shaft 6, and a grip 7, as shown in FIG.
The handle 5 is a part that the operator holds by hand. The handle 5 is provided with an operation knob 51 as shown in FIG.
The shaft 6 has a substantially cylindrical shape, and one end is connected to the handle 5 (FIG. 1). A grip 7 is attached to the other end of the shaft 6. Inside the shaft 6, an opening / closing mechanism (FIG. 1) for opening and closing the first and second gripping members 8, 9 (FIG. 1) constituting the gripping portion 7 according to the operation of the operating knob 51 by the operator. (Abbreviated). An electric cable C (FIG. 1) is provided from one end to the other end of the shaft 6 via the handle 5 inside the shaft 6.
　〔把持部の構成〕
　なお、以下で記載する「先端側」は、把持部７の先端側であって、図１中、左側を意味する。また、以下で記載する「基端側」は、把持部７のシャフト６側であって、図１中、右側を意味する。
　図２は、処置具２の先端部分を拡大した図である。
　把持部７は、対象部位を把持した状態で当該対象部位を処置する部分である。この把持部７は、図１または図２に示すように、第１，第２の把持部材８，９を備える。
　第１，第２の把持部材８，９は、術者による操作ノブ５１の操作に応じて、矢印Ｒ１（図２）方向に開閉可能に構成されている。 (Configuration of gripping part)
Note that the “distal end side” described below is the distal end side of the grip portion 7 and means the left side in FIG. The “proximal side” described below is the side of the shaft 6 of the grip portion 7 and means the right side in FIG.
FIG. 2 is an enlarged view of the distal end portion of the treatment tool 2.
The grasping unit 7 is a part that treats the target site while holding the target site. As shown in FIG. 1 or 2, the grip 7 includes first and second gripping members 8 and 9.
The first and second gripping members 8 and 9 are configured to be openable and closable in the direction of arrow R1 (FIG. 2) in accordance with the operation of the operation knob 51 by the operator.
　〔第１の把持部材の構成〕
　第１の把持部材８は、第２の把持部材９に対して、図１または図２中、下方側に配設されている。この第１の把持部材８は、図２に示すように、第１のジョー１０と、発熱構造体１１とを備える。
　第１のジョー１０は、把持部７の先端から基端に向かう長手方向（図１，図２中、左右方向）に延在する長尺状に形成されている。この第１のジョー１０において、図２中、上方側の面には、凹部１０１が形成されている。
　凹部１０１は、第１のジョー１０における幅方向の中心に位置し、当該第１のジョー１０の長手方向に沿って延在する。また、凹部１０１を構成する側壁部のうち、基端側の側壁部は、省略されている。
　そして、第１のジョー１０は、発熱構造体１１を支持しつつ、凹部１０１が図２中、上方側に向く姿勢でシャフト６の先端側の端部に対して固定される。 [Configuration of First Holding Member]
The first gripping member 8 is disposed below the second gripping member 9 in FIG. 1 or 2. The first holding member 8 includes a first jaw 10 and a heat generating structure 11, as shown in FIG.
The first jaw 10 is formed in a long shape extending in a longitudinal direction (left and right directions in FIGS. 1 and 2) from the distal end of the grip portion 7 to the proximal end. In the first jaw 10, a concave portion 101 is formed on the upper surface in FIG.
The concave portion 101 is located at the center of the first jaw 10 in the width direction, and extends along the longitudinal direction of the first jaw 10. Further, among the side walls forming the concave portion 101, the side wall on the base end side is omitted.
The first jaw 10 is fixed to the distal end of the shaft 6 with the concave portion 101 facing upward in FIG. 2 while supporting the heat generating structure 11.
　図３は、発熱構造体１１を示す分解斜視図である。具体的に、図３は、図１，図２中、上方側から発熱構造体１１を見た分解斜視図である。
　発熱構造体１１は、一部が凹部１０１から図２中、上方側に突出した状態で、凹部１０１内に収容される。そして、発熱構造体１１は、制御装置３による制御の下、熱エネルギを発生する。この発熱構造体１１は、図３に示すように、伝熱板１２と、ヒータ１３と、接着部材１４とを備える。 FIG. 3 is an exploded perspective view showing the heating structure 11. Specifically, FIG. 3 is an exploded perspective view of the heat generating structure 11 viewed from above in FIGS.
The heat generating structure 11 is housed in the recess 101 with a part thereof protruding upward from the recess 101 in FIG. Then, the heat generating structure 11 generates heat energy under the control of the control device 3. As shown in FIG. 3, the heat generating structure 11 includes a heat transfer plate 12, a heater 13, and an adhesive member 14.
　伝熱板１２は、本発明に係る処置部材に相当する。この伝熱板１２は、例えば銅等の材料によって構成され、把持部７の長手方向に沿って延在する長尺状の板体である。
　この伝熱板１２において、図２，図３中、上方側の面は、第１，第２の把持部材８，９によって対象部位を把持した状態で、当該対象部位に対して接触する。そして、当該面は、ヒータ１３からの熱を対象部位に伝達する。すなわち、当該面は、対象部位に対して熱エネルギを付与する処置面１２１（図２，図３）として機能する。本実施の形態１では、処置面１２１は、第１，第２の把持部材８，９によって対象部位を把持した状態で当該第１，第２の把持部材８，９が互いに対向する方向Ａ１（図２）に対して直交する平坦面によって構成されている。
　本実施の形態１では、処置面１２１は、平坦面によって構成されているが、これに限らず、凸形状、凹形状等のその他の形状によって構成しても構わない。後述する把持面１９１も同様である。 The heat transfer plate 12 corresponds to a treatment member according to the present invention. The heat transfer plate 12 is a long plate formed of, for example, a material such as copper and extending along the longitudinal direction of the grip portion 7.
In FIG. 2 and FIG. 3, the upper surface of the heat transfer plate 12 contacts the target portion while the target portion is gripped by the first and second gripping members 8 and 9. Then, the surface transmits heat from the heater 13 to the target portion. That is, the surface functions as a treatment surface 121 (FIGS. 2 and 3) for applying thermal energy to the target portion. In the first embodiment, the treatment surface 121 is in a direction A1 where the first and second gripping members 8 and 9 face each other in a state where the target portion is gripped by the first and second gripping members 8 and 9 ( It is constituted by a flat surface orthogonal to FIG. 2).
In the first embodiment, the treatment surface 121 is configured by a flat surface, but is not limited thereto, and may be configured by another shape such as a convex shape or a concave shape. The same applies to a gripping surface 191 described later.
　図４ないし図６は、ヒータ１３を示す図である。具体的に、図４は、ヒータ１３を伝熱板１２側から見た図である。図５は、ヒータ１３を凹部１０１の底面側から見た図である。図６は、ヒータ１３を側方（ヒータ１３の幅方向に沿う方向）から見た図である。なお、図６では、説明の便宜上、４つの第１の導電部１７４ａ～１７４ｄのうち第１の導電部１７４ａ，１７４ｃの２つのみを図示している。
　ヒータ１３は、一部が発熱することによって伝熱板１２を加熱するシートヒータである。このヒータ１３は、図４ないし図６に示すように、基板１５と、第１，第２の抵抗パターン１６，１７とを備える。
　基板１５は、ポリイミド等の絶縁性材料によって構成され、把持部７の長手方向に沿って延在する長尺状のシートである。
　なお、基板１５の材料としては、ポリイミドに限らず、例えば、窒化アルミニウム、アルミナ、ガラス、ジルコニア等の高耐熱絶縁性材料を採用しても構わない。
　以下では、基板１５において、伝熱板１２に対向する面を第１の面１５１（図４，図６）、当該第１の面１５１と表裏をなす面を第２の面１５２（図５，図６）とする。 4 to 6 are views showing the heater 13. Specifically, FIG. 4 is a view of the heater 13 as viewed from the heat transfer plate 12 side. FIG. 5 is a view of the heater 13 as viewed from the bottom surface side of the concave portion 101. FIG. 6 is a view of the heater 13 as viewed from the side (a direction along the width direction of the heater 13). In FIG. 6, for convenience of description, only two of the first conductive portions 174a to 174c among the four first conductive portions 174a to 174d are illustrated.
The heater 13 is a seat heater that heats the heat transfer plate 12 by partially generating heat. The heater 13 includes a substrate 15 and first and second resistance patterns 16 and 17 as shown in FIGS.
The substrate 15 is a long sheet made of an insulating material such as polyimide and extending along the longitudinal direction of the grip 7.
The material of the substrate 15 is not limited to polyimide, but may be a high heat-resistant insulating material such as aluminum nitride, alumina, glass, and zirconia.
In the following, in the substrate 15, the surface facing the heat transfer plate 12 is the first surface 151 (FIGS. 4 and 6), and the surface that forms the front and back of the first surface 151 is the second surface 152 (FIGS. 6).
　第１の抵抗パターン１６は、導電性材料によって構成されている。この第１の抵抗パターン１６は、図４または図６に示すように、一対の第１の接続部１６１と、第１の発熱部１６２とを備える。
　一対の第１の接続部１６１は、本発明に係る第１の接続領域に相当する。これら一対の第１の接続部１６１は、図４に示すように、第１の面１５１上において、基端側にそれぞれ設けられ、当該基端側から先端側に向けてそれぞれ延在するとともに、基板１５の幅方向に沿って互いに対向する。そして、一対の第１の接続部１６１には、電気ケーブルＣを構成する２つの第１のリード線Ｃ１（図４，図６）がそれぞれ接続される。当該第１のリード線Ｃ１は、本発明に係る第１の配線部材に相当する。なお、図６では、説明の便宜上、第１のリード線Ｃ１を１本のみ図示している。 The first resistance pattern 16 is made of a conductive material. As shown in FIG. 4 or FIG. 6, the first resistance pattern 16 includes a pair of first connection portions 161 and a first heating portion 162.
The pair of first connection portions 161 correspond to a first connection region according to the present invention. As shown in FIG. 4, the pair of first connection portions 161 are provided on the first surface 151 on the proximal end side, respectively, and extend from the proximal end side to the distal end side, respectively. They oppose each other along the width direction of the substrate 15. Then, two first lead wires C1 (FIGS. 4 and 6) constituting the electric cable C are respectively connected to the pair of first connection portions 161. The first lead wire C1 corresponds to a first wiring member according to the present invention. In FIG. 6, only one first lead C1 is shown for convenience of explanation.
　第１の発熱部１６２は、本発明に係る第１の発熱領域に相当する。この第１の発熱部１６２は、図４に示すように、第１の面１５１上において、一端が基端側に位置し、当該一端から先端側に向けて波状に蛇行しながら延在する。また、第１の発熱部１６２は、基板１５における長手方向の略中央付近で折り返した後、基端側に向けて波状に蛇行しながら延在する。すなわち、第１の発熱部１６２は、Ｕ字形状を有する。そして、第１の発熱部１６２の両端は、一対の第１の接続部１６１とそれぞれ電気的に接続する。 {Circle around (1)} The first heat generating portion 162 corresponds to a first heat generating region according to the present invention. As shown in FIG. 4, the first heat generating portion 162 has one end located on the base end side on the first surface 151, and extends in a meandering manner from the one end toward the tip end side. In addition, the first heat generating portion 162 is folded in the vicinity of the approximate center of the substrate 15 in the longitudinal direction, and then extends in a meandering manner toward the base end side. That is, the first heat generating portion 162 has a U-shape. Then, both ends of the first heat generating portion 162 are electrically connected to the pair of first connecting portions 161 respectively.
　ここで、第１の接続部１６１の抵抗温度係数、抵抗値、及び電気抵抗率は、第１の発熱部１６２よりもそれぞれ小さく設定されている。なお、第１の発熱部１６２を構成する材料としては、ステンレス等を例示することができる。また、第１の接続部１６１を構成する材料としては、金等を例示することができる。なお、第１の接続部１６１としては、第１の発熱部１６２と同一の材料によって構成した後、その表面に対して、金等をメッキした構成を採用しても構わない。
　そして、一対の第１の接続部１６１には、制御装置３による制御の下、２つの第１のリード線Ｃ１を経由することによって、電圧（本発明に係る第１の電力に相当）が印加される。これによって、第１の抵抗パターン１６では、第１の発熱部１６２が主に発熱する。 Here, the temperature coefficient of resistance, the resistance value, and the electrical resistivity of the first connection portion 161 are set to be smaller than those of the first heating portion 162, respectively. In addition, as a material forming the first heat generating portion 162, stainless steel or the like can be exemplified. In addition, examples of a material forming the first connection portion 161 include gold and the like. The first connection portion 161 may be formed of the same material as that of the first heat generating portion 162, and then may be formed by plating the surface with gold or the like.
Then, a voltage (corresponding to the first power according to the present invention) is applied to the pair of first connection portions 161 by passing through the two first lead wires C1 under the control of the control device 3. Is done. Thereby, in the first resistance pattern 16, the first heat generating portion 162 mainly generates heat.
　以下では、説明の便宜上、基板１５を当該基板１５の長手方向に沿って並列する第１～第３の領域Ａｒ１～Ａｒ３（図４～図６）の３つの領域に区画する。なお、図４ないし図６では、基板１５を第１～第３の領域Ａｒ１～Ａｒ３の３つの領域に区画する２つの平面ＰＬ１，ＰＬ２を一点鎖線で図示している。
　第２の領域Ａｒ２は、第１の発熱部１６２が設けられている領域である。
　第１の領域Ａｒ１は、第２の領域Ａｒ２と基板１５の先端（図３中、左端）との間に位置する領域である。
　第３の領域Ａｒ３は、第２の領域Ａｒ２と基板１５の基端（図３中、右端）との間に位置する領域であって、第１の接続部１６１が設けられている領域である。
　また、以下では、説明の便宜上、第１の面１５１における第２の領域Ａｒ２を第４の領域Ａｒ４（図４）と記載する。 Hereinafter, for convenience of description, the substrate 15 is divided into three regions of first to third regions Ar1 to Ar3 (FIGS. 4 to 6) arranged in parallel along the longitudinal direction of the substrate 15. 4 to 6, two planes PL1 and PL2 that divide the substrate 15 into three regions of first to third regions Ar1 to Ar3 are shown by alternate long and short dash lines.
The second area Ar2 is an area where the first heat generating portion 162 is provided.
The first region Ar1 is a region located between the second region Ar2 and the tip of the substrate 15 (the left end in FIG. 3).
The third region Ar3 is a region located between the second region Ar2 and the base end (the right end in FIG. 3) of the substrate 15, and is a region where the first connection portion 161 is provided. .
In the following, the second region Ar2 on the first surface 151 is referred to as a fourth region Ar4 (FIG. 4) for convenience of description.
　第２の抵抗パターン１７は、導電性材料によって構成されている。この第２の抵抗パターン１７は、図４ないし図６に示すように、一対の第２の接続部１７１（図４，図６）と、第２の発熱部１７２（図４，図６）と、配線部１７３とを備える。
　一対の第２の接続部１７１は、本発明に係る第２の接続領域に相当する。これら一対の第２の接続部１７１は、図４に示すように、第１の面１５１上において、基端側にそれぞれ設けられ、当該基端側から先端側に向けてそれぞれ延在するとともに、一対の第１の接続部１６１を挟んだ状態で基板１５の幅方向に沿って互いに対向する。すなわち、一対の第２の接続部１７１は、第１の面１５１における第３の領域Ａｒ３に設けられている。そして、一対の第２の接続部１７１には、電気ケーブルＣを構成する２つの第２のリード線Ｃ２（図４，図６）がそれぞれ接続される。当該第２のリード線Ｃ２は、本発明に係る第２の配線部材に相当する。なお、図６では、説明の便宜上、第２のリード線Ｃ２を１本のみ図示している。 The second resistance pattern 17 is made of a conductive material. As shown in FIGS. 4 to 6, the second resistance pattern 17 includes a pair of second connection portions 171 (FIGS. 4 and 6) and a second heating portion 172 (FIGS. 4 and 6). , And a wiring portion 173.
The pair of second connection portions 171 correspond to a second connection region according to the present invention. As shown in FIG. 4, the pair of second connection portions 171 are provided on the first surface 151 on the proximal end side, respectively, and extend from the proximal end side to the distal end side, respectively. The pair of first connection portions 161 are opposed to each other along the width direction of the substrate 15 with the first connection portions 161 interposed therebetween. That is, the pair of second connection portions 171 are provided in the third region Ar3 on the first surface 151. Then, two second lead wires C2 (FIGS. 4 and 6) constituting the electric cable C are connected to the pair of second connection portions 171 respectively. The second lead wire C2 corresponds to a second wiring member according to the present invention. In FIG. 6, only one second lead C2 is shown for convenience of explanation.
　第２の発熱部１７２は、本発明に係る第２の発熱領域に相当する。この第２の発熱部１７２は、図４に示すように、第１の面１５１上において、一端が第１の領域Ａｒ１の基端側に位置し、当該一端から先端側に向けて波状に蛇行しながら延在する。また、第２の発熱部１７２は、基板１５における先端側で折り返した後、基端側に向けて波状に蛇行しながら延在する。すなわち、第２の発熱部１７２は、Ｕ字形状を有する。また、第２の発熱部１７２は、第１の面１５１における第１の領域Ａｒ１に設けられている。
　以上のように、第１，第２の発熱部１６２，１７２は、基板１５の長手方向の異なる位置にそれぞれ設けられている。 The second heat generating section 172 corresponds to a second heat generating area according to the present invention. As shown in FIG. 4, the second heat generating portion 172 has one end located on the base end side of the first region Ar1 on the first surface 151, and meanders in a wavy manner from the one end toward the front end side. While extending. The second heat generating portion 172 is folded back on the distal end side of the substrate 15 and then extends in a meandering manner toward the base end side. That is, the second heat generating portion 172 has a U-shape. Further, the second heat generating portion 172 is provided in the first area Ar1 on the first surface 151.
As described above, the first and second heat generating portions 162 and 172 are provided at different positions in the longitudinal direction of the substrate 15, respectively.
　配線部１７３は、本発明に係る配線領域に相当する。この配線部１７３は、図４ないし図６に示すように、４つの第１の導電部１７４ａ～１７４ｄと、２つの第２の導電部１７５ａ，１７５ｂ（図５，図６）とを備える。
　４つの第１の導電部１７４ａ～１７４ｄは、本発明に係る貫通孔内領域に相当する。
　ここで、基板１５には、図４ないし図６に示すように、第１，第２の面１５１，１５２をそれぞれ貫通する２つの第１の貫通孔１５３ａ，１５３ｂ及び２つの第２の貫通孔１５４ａ，１５４ｂが形成されている。 The wiring section 173 corresponds to a wiring area according to the present invention. As shown in FIGS. 4 to 6, the wiring portion 173 includes four first conductive portions 174a to 174d and two second conductive portions 175a and 175b (FIGS. 5 and 6).
The four first conductive portions 174a to 174d correspond to the through-hole region according to the present invention.
Here, as shown in FIGS. 4 to 6, the substrate 15 has two first through holes 153a and 153b and two second through holes penetrating the first and second surfaces 151 and 152, respectively. 154a and 154b are formed.
　２つの第１の貫通孔１５３ａ，１５３ｂは、第１の領域Ａｒ１における基端側にそれぞれ設けられている。より具体的に、２つの第１の貫通孔１５３ａ，１５３ｂは、第１の発熱部１６２と第２の発熱部１７２との間にそれぞれ設けられている。また、２つの第２の貫通孔１５４ａ，１５４ｂは、第３の領域Ａｒ３にそれぞれ設けられている。
　そして、２つの第１の導電部１７４ａ，１７４ｂは、２つの第１の貫通孔１５３ａ，１５３ｂ内にそれぞれ設けられた導電部分であり、第２の発熱部１７２の両端とそれぞれ電気的に接続する。また、２つの第１の導電部１７４ｃ，１７４ｄは、２つの第２の貫通孔１５４ａ，１５４ｂ内にそれぞれ設けられた導電部分であり、一対の第２の接続部１７１とそれぞれ電気的に接続する。すなわち、４つの第１の導電部１７４ａ～１７４ｄは、それぞれスルーホールである。本実施の形態１では、４つの第１の導電部１７４ａ～１７４ｄは、図４ないし図６に示すように、２つの第１の貫通孔１５３ａ，１５３ｂ及び２つの第２の貫通孔１５４ａ，１５４ｂ内全体にそれぞれ埋め込まれている。
　なお、４つの第１の導電部１７４ａ～１７４ｄとしては、２つの第１の貫通孔１５３ａ，１５３ｂ及び２つの第２の貫通孔１５４ａ，１５４ｂの内周面にのみ設けた構成としても構わない。本実施の形態１のように埋め込んだ構成では、断面積が大きくなるため、当該内周面にのみ設けた構成よりも４つの第１の導電部１７４ａ～１７４ｄの抵抗値を下げることが可能となる。 The two first through holes 153a and 153b are provided on the base end side in the first region Ar1. More specifically, the two first through holes 153a and 153b are provided between the first heat generating portion 162 and the second heat generating portion 172, respectively. Further, the two second through holes 154a and 154b are provided in the third region Ar3, respectively.
The two first conductive portions 174a and 174b are conductive portions provided in the two first through holes 153a and 153b, respectively, and are electrically connected to both ends of the second heat generating portion 172, respectively. . The two first conductive portions 174c and 174d are conductive portions provided in the two second through holes 154a and 154b, respectively, and are electrically connected to the pair of second connection portions 171 respectively. . That is, each of the four first conductive portions 174a to 174d is a through hole. In the first embodiment, as shown in FIGS. 4 to 6, the four first conductive portions 174a to 174d are formed of two first through holes 153a and 153b and two second through holes 154a and 154b. Each is embedded in the whole.
The four first conductive portions 174a to 174d may be provided only on the inner peripheral surfaces of the two first through holes 153a and 153b and the two second through holes 154a and 154b. In the embedded configuration as in the first embodiment, since the cross-sectional area is large, the resistance values of the four first conductive portions 174a to 174d can be reduced as compared with the configuration provided only on the inner peripheral surface. Become.
　２つの第２の導電部１７５ａ，１７５ｂは、本発明に係る貫通孔外領域に相当する。これら２つの第２の導電部１７５ａ，１７５ｂは、図５または図６に示すように、第２の面１５２上にそれぞれ設けられている。そして、一方の第２の導電部１７５ａは、一端が第１の導電部１７４ａと電気的に接続し、当該一端から基端側に向けて延在し、他端が第１の導電部１７４ｃと電気的に接続する。また、他方の第２の導電部１７５ｂは、一端が第１の導電部１７４ｂと電気的に接続し、当該一端から基端側に向けて延在し、他端が第１の導電部１７４ｄと電気的に接続する。本実施の形態１では、２つの第２の導電部１７５ａ，１７５ｂの幅寸法は、第２の発熱部１７２よりもそれぞれ大きく設定されている。これにより、第２の発熱部１７２の抵抗値よりも２つの第２の導電部１７５ａ，１７５ｂの抵抗値は低く設定されている。
　以上のように、配線部１７３の一部は、第２の面１５２における第２の領域Ａｒ２に設けられている。言い換えれば、配線部１７３は、第４の領域Ａｒ４を避けた状態で設けられている。 The two second conductive portions 175a and 175b correspond to the region outside the through hole according to the present invention. These two second conductive portions 175a and 175b are provided on the second surface 152 as shown in FIG. 5 or FIG. One of the second conductive portions 175a has one end electrically connected to the first conductive portion 174a, extends from the one end toward the base end, and has the other end connected to the first conductive portion 174c. Make an electrical connection. The other second conductive portion 175b has one end electrically connected to the first conductive portion 174b, extends from the one end toward the base end, and has the other end connected to the first conductive portion 174d. Make an electrical connection. In the first embodiment, the width of each of the two second conductive portions 175a and 175b is set to be larger than each of the second heat generating portions 172. Accordingly, the resistance values of the two second conductive portions 175a and 175b are set lower than the resistance value of the second heat generating portion 172.
As described above, a part of the wiring portion 173 is provided in the second region Ar2 on the second surface 152. In other words, the wiring portion 173 is provided so as to avoid the fourth region Ar4.
　ここで、第２の接続部１７１及び配線部１７３の抵抗温度係数、抵抗値、及び電気抵抗率は、第２の発熱部１７２よりもそれぞれ小さく設定されている。また、第１の導電部１７４ａ～１７４ｄの抵抗温度係数、抵抗値、及び電気抵抗率は、第２の接続部１７１及び第２の導電部１７５ａ，１７５ｂよりもそれぞれ小さく設定されている。なお、第２の発熱部１７２を構成する材料としては、ステンレス等を例示することができる。また、第２の接続部１７１及び第２の導電部１７５ａ，１７５ｂを構成する材料としては、金等を例示することができる。なお、第２の接続部１７１及び第２の導電部１７５ａ，１７５ｂとしては、第２の発熱部１７２と同一の材料によって構成した後、その表面に対して、金等をメッキした構成を採用しても構わない。さらに、第１の導電部１７４ａ～１７４ｄを構成する材料としては、銅等を例示することができる。
　そして、一対の第２の接続部１７１には、制御装置３による制御の下、２つの第２のリード線Ｃ２を経由することによって、電圧（本発明に係る第２の電力に相当）が印加される。これによって、第１の抵抗パターン１６では、第２の発熱部１７２が主に発熱する。 Here, the temperature coefficient of resistance, the resistance value, and the electrical resistivity of the second connection portion 171 and the wiring portion 173 are set to be smaller than those of the second heating portion 172, respectively. Further, the temperature coefficient of resistance, the resistance value, and the electrical resistivity of the first conductive portions 174a to 174d are set smaller than those of the second connection portion 171 and the second conductive portions 175a, 175b. In addition, as a material of the second heat generating portion 172, stainless steel or the like can be exemplified. In addition, examples of a material forming the second connection portion 171 and the second conductive portions 175a and 175b include gold and the like. The second connecting portion 171 and the second conductive portions 175a and 175b are made of the same material as that of the second heat generating portion 172, and the surface thereof is plated with gold or the like. It does not matter. Further, examples of the material forming the first conductive portions 174a to 174d include copper and the like.
Then, a voltage (corresponding to the second power according to the present invention) is applied to the pair of second connection portions 171 by passing through the two second lead wires C2 under the control of the control device 3. Is done. Thereby, in the first resistance pattern 16, the second heat generating portion 172 mainly generates heat.
　接着部材１４は、図３に示すように、伝熱板１２と基板１５における第１の面１５１との間に設けられ、把持部７の長手方向に沿って延在する長尺状のシートである。そして、接着部材１４は、伝熱板１２と基板１５とを接着固定する。この接着部材１４は、良好な熱伝導性及び絶縁性を有し、かつ、高温に耐え、接着性を有する。 As shown in FIG. 3, the bonding member 14 is a long sheet provided between the heat transfer plate 12 and the first surface 151 of the substrate 15 and extending along the longitudinal direction of the grip 7. is there. Then, the adhesive member 14 adhesively fixes the heat transfer plate 12 and the substrate 15. The adhesive member 14 has good thermal conductivity and insulating properties, withstands high temperatures, and has adhesive properties.
　そして、伝熱板１２は、図３に示すように、第１，第２の発熱部１６２，１７２全体を覆う状態で配置される。すなわち、伝熱板１２は、第３の領域Ａｒ３を覆うことなく、第１，第２の領域Ａｒ１，Ａｒ２のみを覆う状態で配置される。また、接着部材１４は、第１，第２の発熱部１６２，１７２全体を覆うとともに、一対の第１の接続部１６１と一対の第２の接続部１７１とのそれぞれ一部を覆う状態で配置される。すなわち、接着部材１４は、伝熱板１２に対して基端側に張り出した状態で配置される。そして、２つの第１のリード線Ｃ１及び２つの第２のリード線Ｃ２は、一対の第１の接続部１６１及び一対の第２の接続部１７１において、接着部材１４によって覆われていない領域にそれぞれ接続される。 熱 Then, as shown in FIG. 3, the heat transfer plate 12 is disposed so as to cover the entire first and second heat generating portions 162 and 172. That is, the heat transfer plate 12 is disposed so as to cover only the first and second regions Ar1 and Ar2 without covering the third region Ar3. The adhesive member 14 covers the entire first and second heat generating portions 162 and 172 and also covers a part of each of the pair of first connection portions 161 and the pair of second connection portions 171. Is done. That is, the adhesive member 14 is disposed in a state of protruding toward the base end side with respect to the heat transfer plate 12. Then, the two first lead wires C1 and the two second lead wires C2 are located in a region of the pair of first connection portions 161 and the pair of second connection portions 171 that are not covered by the adhesive member 14. Connected respectively.
　〔第２の把持部材の構成〕
　第２の把持部材９は、図２に示すように、第２のジョー１８と、対向板１９とを備える。
　第２のジョー１８は、第１のジョー１０と同一の形状を有する。すなわち、第２のジョー１８は、図２に示すように、凹部１０１と同様の凹部１８１を有する。そして、第２のジョー１８は、凹部１８１内で対向板１９を支持しつつ、凹部１８１が図２中、下方に向く姿勢でシャフト６に対して回動可能に軸支され、回動することによって第１の把持部材８に対して開閉する。 [Configuration of Second Holding Member]
As shown in FIG. 2, the second gripping member 9 includes a second jaw 18 and an opposing plate 19.
The second jaw 18 has the same shape as the first jaw 10. That is, the second jaw 18 has a concave portion 181 similar to the concave portion 101, as shown in FIG. Then, the second jaw 18 is rotatably supported on the shaft 6 in a posture in which the concave portion 181 faces downward in FIG. 2 while supporting the opposing plate 19 within the concave portion 181, and rotates. To open and close the first gripping member 8.
　なお、本実施の形態１では、第１の把持部材８（第１のジョー１０）がシャフト６に対して固定され、第２の把持部材９（第２のジョー１８）がシャフト６に対して軸支された構成としているが、これに限らない。例えば、第１，第２の把持部材８，９の双方がシャフト６に対して軸支され、それぞれ回動することによって第１，第２の把持部材８，９が開閉する構成を採用しても構わない。また、例えば、第１の把持部材８がシャフト６に対して軸支され、第２の把持部材９がシャフト６に対して固定され、第１の把持部材８が回動することによって第２の把持部材９に対して開閉する構成を採用しても構わない。 In the first embodiment, the first gripping member 8 (first jaw 10) is fixed to the shaft 6, and the second gripping member 9 (second jaw 18) is fixed to the shaft 6. Although it is configured to be pivotally supported, it is not limited to this. For example, a configuration is adopted in which both the first and second gripping members 8 and 9 are pivotally supported on the shaft 6 and the first and second gripping members 8 and 9 are opened and closed by rotating respectively. No problem. Also, for example, the first gripping member 8 is pivotally supported on the shaft 6, the second gripping member 9 is fixed on the shaft 6, and the second gripping member 8 rotates to rotate the second gripping member 9. A configuration that opens and closes with respect to the gripping member 9 may be employed.
　対向板１９は、例えば銅等の導電性材料によって構成されている。この対向板１９は、凹部１８１と略同一の平面形状を有する平板であり、当該凹部１８１内に固定される。そして、対向板１９において、図２中、下方側の把持面１９１は、処置面１２１との間において対象部位を把持する。
　なお、対向板１９としては、導電性材料に限らず、その他の材料、例えば、ＰＥＥＫ（ポリエーテルエーテルケトン）等の樹脂材料によって構成しても構わない。 The opposing plate 19 is made of, for example, a conductive material such as copper. The opposite plate 19 is a flat plate having substantially the same planar shape as the recess 181 and is fixed in the recess 181. Then, in the opposing plate 19, the gripping surface 191 on the lower side in FIG.
The opposing plate 19 is not limited to the conductive material, and may be made of another material, for example, a resin material such as PEEK (polyetheretherketone).
　〔制御装置及びフットスイッチの構成〕
　フットスイッチ４は、術者が足によって操作する部分である。そして、フットスイッチ４への当該操作に応じて、制御装置３による処置制御が実行される。
　なお、当該処置制御を実行させる手段としては、フットスイッチ４に限らず、その他、手によって操作するスイッチ等を採用しても構わない。
　制御装置３は、ＣＰＵ（Central　Processing　Unit）、ＦＧＰＡ（Field-Programmable　Gate　Array）等を含んで構成され、所定のプログラムにしたがって、処置具２を動作させることによって対象部位を処置する処置制御を実行する。 [Configuration of control device and foot switch]
The foot switch 4 is a part operated by the surgeon using his / her foot. Then, in response to the operation on the foot switch 4, the treatment control by the control device 3 is executed.
The means for executing the treatment control is not limited to the foot switch 4, but may be a switch operated by hand or the like.
The control device 3 includes a CPU (Central Processing Unit), an FGPA (Field-Programmable Gate Array), and the like, and executes treatment control for treating a target site by operating the treatment tool 2 according to a predetermined program. I do.
　〔処置システムの動作〕
　次に、上述した処置システム１の動作について説明する。
　術者は、処置具２を手で持ち、当該処置具２の先端部分（把持部７及びシャフト６の一部）を、例えば、トロッカ等を用いて腹壁を通してから腹腔内に挿入する。また、術者は、操作ノブ５１を操作する。そして、術者は、把持部７によって対象部位を把持する。この後、術者は、フットスイッチ４を操作する。そして、制御装置３は、以下に示す処置制御を実行する。
　制御装置３は、第１の状態と第２の状態とを所定の制御周期で切り替える処置制御を実行する。ここで、第１の状態は、２つの第１のリード線Ｃ１を経由することによって、一対の第１の接続部１６１に対して電圧を印加した状態である。すなわち、第１の状態は、第１，第２の抵抗パターン１６，１７のうち、第１の抵抗パターン１６のみに通電した状態である。また、第２の状態は、２つの第２のリード線Ｃ２を経由することによって、一対の第２の接続部１７１に対して電圧を印加した状態である。すなわち、第２の状態は、第１，第２の抵抗パターン１６，１７のうち、第２の抵抗パターン１７のみに通電した状態である。 [Operation of treatment system]
Next, the operation of the above-described treatment system 1 will be described.
The operator holds the treatment tool 2 by hand and inserts the distal end portion (a part of the grip 7 and the shaft 6) of the treatment tool 2 into the abdominal cavity after passing through the abdominal wall using, for example, a trocar. Further, the operator operates the operation knob 51. Then, the operator grips the target site with the gripping unit 7. Thereafter, the surgeon operates the foot switch 4. Then, the control device 3 executes the following treatment control.
The control device 3 executes a treatment control for switching between the first state and the second state at a predetermined control cycle. Here, the first state is a state in which a voltage is applied to the pair of first connection portions 161 via two first lead wires C1. That is, the first state is a state in which only the first resistance pattern 16 of the first and second resistance patterns 16 and 17 is energized. In addition, the second state is a state in which a voltage is applied to the pair of second connection portions 171 via the two second lead wires C2. That is, the second state is a state in which only the second resistance pattern 17 of the first and second resistance patterns 16 and 17 is energized.
　また、制御装置３は、当該処置制御を実行している際、第１の抵抗パターン１６または第２の抵抗パターン１７に対して供給している電圧値及び電流値から、例えば電圧降下法を用いて第１，第２のヒータ抵抗を計測する。なお、第１のヒータ抵抗は、第１の抵抗パターン１６の抵抗値を意味する。また、第２のヒータ抵抗は、第２の抵抗パターン１７の抵抗値を意味する。また、制御装置３は、予め測定された第１，第２の抵抗温度特性を参照する。なお、第１の抵抗温度特性は、第１のヒータ抵抗と第１の発熱部１６２の温度（以下、第１のヒータ温度と記載）との関係を示す特性である。また、第２の抵抗温度特性は、第２のヒータ抵抗と第２の発熱部１７２の温度（以下、第２のヒータ温度と記載）との関係を示す特性である。そして、制御装置３は、第１，第２の抵抗パターン１６，１７に対して供給する電力を変更しながら、当該第１，第２のヒータ抵抗を当該第１，第２の抵抗温度特性における目標温度に対応する目標抵抗値に制御する。これによって、第１，第２の発熱部１６２，１７２は、互いに独立した状態でそれぞれ目標温度に制御される。すなわち、目標温度に制御された第１，第２の発熱部１６２，１７２からの熱が伝熱板１２を経由することによって対象部位に対して伝達される。そして、対象部位は、凝固しつつ切開される。 Further, when executing the treatment control, the control device 3 uses, for example, a voltage drop method from the voltage value and the current value supplied to the first resistance pattern 16 or the second resistance pattern 17. To measure the first and second heater resistances. Note that the first heater resistance means a resistance value of the first resistance pattern 16. Further, the second heater resistance means a resistance value of the second resistance pattern 17. The control device 3 refers to the first and second resistance-temperature characteristics measured in advance. Note that the first resistance-temperature characteristic is a characteristic indicating a relationship between the first heater resistance and the temperature of the first heat generating portion 162 (hereinafter, referred to as a first heater temperature). The second resistance-temperature characteristic is a characteristic indicating the relationship between the second heater resistance and the temperature of the second heating section 172 (hereinafter, referred to as a second heater temperature). Then, the control device 3 changes the first and second heater resistances in the first and second resistance-temperature characteristics while changing the power supplied to the first and second resistance patterns 16 and 17. Control is performed to the target resistance value corresponding to the target temperature. As a result, the first and second heat generating units 162 and 172 are controlled to the target temperatures independently of each other. That is, heat from the first and second heat generating units 162 and 172 controlled to the target temperature is transmitted to the target portion by passing through the heat transfer plate 12. Then, the target site is incised while coagulating.
　以上説明した本実施の形態１によれば、以下の効果を奏する。
　本実施の形態１に係る処置システム１では、第１，第２の発熱部１６２，１７２は、把持部７の長手方向の異なる位置にそれぞれ設けられ、互いに独立した状態で制御される。
　このため、特許文献１に記載の構成と同様に、偏在負荷になっていても、目標温度で対象部位を加熱することができ、適切に当該対象部位を処置することができる。
　また、第１，第２の接続部１６１，１７１は、伝熱板１２によって覆われない第３の領域Ａｒ３に設けられている。すなわち、当該第３の領域Ａｒ３において当該第１，第２の接続部１６１，１７１に対して第１，第２のリード線Ｃ１，Ｃ２が接続されるため、把持部７において、伝熱板１２によって覆われる第１，第２の領域Ａｒ１，Ａｒ２の厚み寸法（基板１５の厚み方向の寸法）が大型化してしまうことがない。ここで、把持部７を細径化、すなわち、処置具２を小型化するためには、当該把持部７において、第１，第２の領域Ａｒ１，Ａｒ２の厚み寸法を小さくする必要がある。したがって、本実施の形態１に記載の処置具２によれば、小型化を図ることができる。 According to the first embodiment described above, the following effects can be obtained.
In the treatment system 1 according to the first embodiment, the first and second heat generating units 162 and 172 are provided at different positions in the longitudinal direction of the grip unit 7 and are controlled independently of each other.
For this reason, similarly to the configuration described in Patent Literature 1, the target site can be heated at the target temperature even if the load is unevenly distributed, and the target site can be appropriately treated.
Further, the first and second connection portions 161 and 171 are provided in a third region Ar3 that is not covered by the heat transfer plate 12. That is, since the first and second lead wires C1 and C2 are connected to the first and second connection portions 161 and 171 in the third region Ar3, the heat transfer plate 12 The thickness dimension (dimension in the thickness direction of the substrate 15) of the first and second regions Ar1 and Ar2 covered by the first and second regions Ar1 and Ar2 does not increase. Here, in order to reduce the diameter of the grip 7, that is, to reduce the size of the treatment tool 2, it is necessary to reduce the thickness of the first and second regions Ar 1 and Ar 2 in the grip 7. Therefore, according to the treatment tool 2 described in the first embodiment, downsizing can be achieved.
　ところで、配線部１７３としては、その一部を第４の領域Ａｒ４に設けることも考えられる。この際、配線部１７３の一部は、第１の面１５１上において、第１の発熱部１６２に対して基板１５の幅方向外側に設けられる。この場合には、当該配線部１７３の一部を第１の発熱部１６２に対して基板１５の幅方向外側に設ける分、基板１５の幅寸法を小さくすることが難しい。
　これに対して、本実施の形態１に係る処置具２では、配線部１７３は、４つの第１の導電部１７４ａ～１７４ｄと２つの第２の導電部１７５ａ，１７５ｂとによって構成されている。すなわち、配線部１７３は、基板１５において、第４の領域Ａｒ４を避けた位置に設けられている。このため、基板１５の幅寸法を小さくすることができ、把持部７の細径化、すなわち、処置具２の小型化を図ることができる。 By the way, it is conceivable to provide a part of the wiring portion 173 in the fourth region Ar4. At this time, a part of the wiring portion 173 is provided on the first surface 151 outside the first heat generating portion 162 in the width direction of the substrate 15. In this case, it is difficult to reduce the width dimension of the substrate 15 by providing a part of the wiring portion 173 outside the first heat generating portion 162 in the width direction of the substrate 15.
On the other hand, in the treatment tool 2 according to the first embodiment, the wiring portion 173 includes four first conductive portions 174a to 174d and two second conductive portions 175a and 175b. That is, the wiring portion 173 is provided on the substrate 15 at a position avoiding the fourth region Ar4. For this reason, the width dimension of the substrate 15 can be reduced, and the diameter of the grip portion 7 can be reduced, that is, the treatment tool 2 can be reduced in size.
　また、本実施の形態１に係る処置具２では、配線部１７３の抵抗値及び電気抵抗率は、第２の発熱部１７２よりもそれぞれ小さく設定されている。
　このため、第２の抵抗パターン１７への通電時において、配線部１７３の発熱を抑制することができる。 In the treatment tool 2 according to the first embodiment, the resistance value and the electric resistivity of the wiring portion 173 are set to be smaller than those of the second heat generating portion 172, respectively.
Therefore, when current is supplied to the second resistance pattern 17, heat generation of the wiring portion 173 can be suppressed.
　ところで、配線部１７３の抵抗温度係数が大きい場合には、当該配線部１７３は、温度によって抵抗値が変化し易いものとなる。すなわち、第１，第２の発熱部１６２，１７２の発熱の影響や当該配線部１７３に対して接触する構造物による熱の逃げの影響等を受けることによって、第２のヒータ温度が目標温度から変動してしまい、意図しない温度となる可能性がある。
　これに対して、本実施の形態１に係る処置具２では、配線部１７３の抵抗温度係数は、第２の発熱部１７２よりも小さく設定されている。このため、上述した影響を抑制し、第２のヒータ温度を目標温度に精度良く制御することができる。 By the way, when the temperature coefficient of resistance of the wiring portion 173 is large, the resistance value of the wiring portion 173 easily changes depending on the temperature. That is, the second heater temperature is deviated from the target temperature by being affected by the heat generated by the first and second heat generating portions 162 and 172 and the heat being released by the structure contacting the wiring portion 173. The temperature may fluctuate, resulting in an unintended temperature.
On the other hand, in the treatment tool 2 according to the first embodiment, the resistance temperature coefficient of the wiring portion 173 is set smaller than that of the second heating portion 172. For this reason, the above-described influence can be suppressed, and the second heater temperature can be accurately controlled to the target temperature.
　ところで、４つの第１の導電部１７４ａ～１７４ｄは、第１，第２の面１５１，１５２をそれぞれ貫通したスルーホールである。このため、４つの第１の導電部１７４ａ～１７４ｄを形成した場合には、第１，第２の発熱部１６２，１７２を形成する領域は、当該４つの第１の導電部１７４ａ～１７４ｄの形成領域分、小さくなる。すなわち、第１，第２の発熱部１６２，１７２を形成する領域をできるだけ広くするためには、４つの第１の導電部１７４ａ～１７４ｄのサイズは、小さいことが望ましい。一方で、４つの第１の導電部１７４ａ～１７４ｄのサイズが小さくなると当該４つの第１の導電部１７４ａ～１７４ｄの抵抗値が高くなるため、局所過熱、及び断線のリスクがある。
　これに対して、本実施の形態１に係る処置具２では、第１の導電部１７４ａ～１７４ｄの抵抗温度係数、抵抗値、及び電気抵抗率は、第２の導電部１７５ａ，１７５ｂよりもそれぞれ小さく設定されている。このため、第１の導電部１７４ａ～１７４ｄのサイズを小さくした場合であっても、局所過熱を抑制することができるとともに、断線のリスクを低減することができる。 Incidentally, the four first conductive portions 174a to 174d are through holes penetrating the first and second surfaces 151 and 152, respectively. Therefore, when the four first conductive portions 174a to 174d are formed, the region where the first and second heat generating portions 162 and 172 are formed is formed by the formation of the four first conductive portions 174a to 174d. It becomes smaller by the area. That is, the size of the four first conductive portions 174a to 174d is desirably small in order to make the regions where the first and second heat generating portions 162 and 172 are formed as large as possible. On the other hand, when the size of the four first conductive portions 174a to 174d decreases, the resistance of the four first conductive portions 174a to 174d increases, and there is a risk of local overheating and disconnection.
On the other hand, in the treatment tool 2 according to the first embodiment, the temperature coefficient of resistance, the resistance value, and the electrical resistivity of the first conductive portions 174a to 174d are respectively smaller than those of the second conductive portions 175a and 175b. It is set small. Therefore, even when the size of the first conductive portions 174a to 174d is reduced, local overheating can be suppressed and the risk of disconnection can be reduced.
　本実施の形態１に係る処置具２では、２つの第１の導電部１７４ａ，１７４ｂは、第１の発熱部１６２と第２の発熱部１７２との間にそれぞれ設けられている。このため、第２の発熱部１７２の熱が２つの第１の導電部１７４ａ，１７４ｂから逃げてしまっても、第１の発熱部１６２からの熱により当該２つの第１の導電部１７４ａ，１７４ｂ部分での温度の低下を補うことができる。すなわち、処置面１２１全体の均熱化を図ることができる。 で は In the treatment tool 2 according to Embodiment 1, the two first conductive portions 174a and 174b are provided between the first heat generating portion 162 and the second heat generating portion 172, respectively. For this reason, even if the heat of the second heat generating portion 172 escapes from the two first conductive portions 174a and 174b, the heat from the first heat generating portion 162 causes the two first conductive portions 174a and 174b. It is possible to compensate for the temperature drop in the part. That is, the uniformity of the entire treatment surface 121 can be achieved.
　また、本実施の形態１に係る処置具２では、第１，第２の接続部１６１，１７１は、第１の面１５１上にそれぞれ設けられている。すなわち、第１，第２の接続部１６１，１７１は、同一面上に設けられている。
　このため、第１，第２のリード線Ｃ１，Ｃ２の配線作業を容易に行うことができる。 In the treatment tool 2 according to the first embodiment, the first and second connection portions 161 and 171 are provided on the first surface 151, respectively. That is, the first and second connection portions 161 and 171 are provided on the same surface.
For this reason, the wiring work of the first and second lead wires C1 and C2 can be easily performed.
（実施の形態２）
　次に、本実施の形態２について説明する。
　以下の説明では、上述した実施の形態１と同様の構成及びステップには同一符号を付し、その詳細な説明は省略または簡略化する。
　図７ないし図９は、本実施の形態２に係るヒータ１３Ａを示す図である。具体的に、図７は、図４に対応した図である。図８は、図５に対応した図である。図９は、図６に対応した図である。なお、図９では、説明の便宜上、２つの第１の導電部１７４ａ，１７４ｂのうち第１の導電部１７４ａの１つのみを図示するとともに、２つの導電部１６３のうち導電部１６３の１つのみを図示している。
　本実施の形態２に係るヒータ１３Ａでは、図７ないし図９に示すように、上述した実施の形態１において説明したヒータ１３とは異なり、第１，第２の接続部１６１，１７１が第１の面１５１上ではなく第２の面１５２上に設けられている。 (Embodiment 2)
Next, the second embodiment will be described.
In the following description, the same configurations and steps as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted or simplified.
7 to 9 are views showing a heater 13A according to the second embodiment. Specifically, FIG. 7 is a diagram corresponding to FIG. FIG. 8 is a diagram corresponding to FIG. FIG. 9 is a diagram corresponding to FIG. Note that FIG. 9 illustrates only one of the first conductive portions 174a of the two first conductive portions 174a and 174b for convenience of description, and one of the conductive portions 163 of the two conductive portions 163. Only one is shown.
In the heater 13A according to the second embodiment, as shown in FIGS. 7 to 9, unlike the heater 13 described in the first embodiment, the first and second connection portions 161 and 171 are different from the first connection portions 161 and 171. Is provided on the second surface 152, not on the surface 151.
　具体的に、本実施の形態２に係る一対の第１の接続部１６１は、図８に示すように、第２の面１５２の第３の領域Ａｒ３において、基板１５の幅方向に沿って互いに対向した状態でそれぞれ設けられている。
　ここで、基板１５には、図７ないし図９に示すように、第１，第２の面１５１，１５２をそれぞれ貫通する２つの第２の貫通孔１５５が形成されている。
　２つの第２の貫通孔１５５は、第３の領域Ａｒ３にそれぞれ設けられている。
　そして、第２の貫通孔１５５内には、図７ないし図９に示すように、導電性材料によって構成された導電部１６３がそれぞれ設けられている。すなわち、２つの導電部１６３は、それぞれスルーホールである。そして、２つの導電部１６３は、第１の発熱部１６２の両端と一対の第１の接続部１６１とをそれぞれ電気的に接続する。 Specifically, as shown in FIG. 8, the pair of first connection portions 161 according to the second embodiment are mutually connected along the width direction of the substrate 15 in the third region Ar3 of the second surface 152. Each is provided in an opposed state.
Here, as shown in FIGS. 7 to 9, the substrate 15 is formed with two second through holes 155 penetrating the first and second surfaces 151 and 152, respectively.
The two second through holes 155 are provided in the third region Ar3, respectively.
7 to 9, conductive portions 163 made of a conductive material are provided in the second through holes 155, respectively. That is, each of the two conductive portions 163 is a through hole. The two conductive portions 163 electrically connect both ends of the first heat generating portion 162 and the pair of first connecting portions 161 respectively.
　また、本実施の形態２に係る一対の第２の接続部１７１は、図８に示すように、第２の面１５２の第３の領域Ａｒ３において、一対の第１の接続部１６１を挟んだ状態で基板１５の幅方向に沿って互いに対向した状態でそれぞれ設けられている。そして、一対の第２の接続部１７１は、２つの第２の導電部１７５ａ，１７５ｂとそれぞれ電気的に接続する。すなわち、本実施の形態２に係るヒータ１３Ａでは、上述した実施の形態１において説明したヒータ１３に対して、２つの第２の貫通孔１５４ａ，１５４ｂ及び２つの第１の導電部１７４ｃ，１７４ｄが設けられていない。
　そして、第１，第２の接続部１６１，１７１を第２の面１５２上に設けたことに伴い、２つの第１のリード線Ｃ１及び２つの第２のリード線Ｃ２は、図８または図９に示すように、第２の面１５２側において配線される。 As shown in FIG. 8, the pair of second connection portions 171 according to the second embodiment sandwich the pair of first connection portions 161 in the third region Ar3 of the second surface 152. In this state, they are provided facing each other along the width direction of the substrate 15. Then, the pair of second connection portions 171 are electrically connected to the two second conductive portions 175a and 175b, respectively. That is, in the heater 13A according to the second embodiment, two second through holes 154a and 154b and two first conductive portions 174c and 174d are different from the heater 13 described in the first embodiment. Not provided.
Then, with the provision of the first and second connection portions 161 and 171 on the second surface 152, the two first lead wires C1 and the two second lead wires C2 are arranged as shown in FIG. As shown in FIG. 9, wiring is performed on the second surface 152 side.
　以上説明した本実施の形態２のように第１，第２の接続部１６１，１７１を第２の面１５２上に設けた場合であっても、上述した実施の形態１と同様の効果を奏する。 Even when the first and second connection portions 161 and 171 are provided on the second surface 152 as in the second embodiment described above, the same effects as in the first embodiment can be obtained. .
（実施の形態３）
　次に、本実施の形態３について説明する。
　以下の説明では、上述した実施の形態１と同様の構成及びステップには同一符号を付し、その詳細な説明は省略または簡略化する。
　図１０ないし図１２は、本実施の形態３に係るヒータ１３Ｂを示す図である。具体的に、図１０は、図４に対応した図である。図１１は、図５に対応した図である。図１２は、図６に対応した図である。なお、図１２では、説明の便宜上、２つの第１の導電部１７４ａ，１７４ｂのうち第１の導電部１７４ａの１つのみを図示している。
　本実施の形態３に係るヒータ１３Ｂでは、図１０ないし図１２に示すように、上述した実施の形態１において説明したヒータ１３とは異なり、第２の接続部１７１が第１の面１５１上ではなく第２の面１５２上に設けられている。 (Embodiment 3)
Next, the third embodiment will be described.
In the following description, the same configurations and steps as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted or simplified.
FIGS. 10 to 12 are views showing a heater 13B according to the third embodiment. Specifically, FIG. 10 is a diagram corresponding to FIG. FIG. 11 is a diagram corresponding to FIG. FIG. 12 is a diagram corresponding to FIG. Note that FIG. 12 illustrates only one of the first conductive portions 174a of the two first conductive portions 174a and 174b for convenience of description.
In the heater 13B according to the third embodiment, as shown in FIGS. 10 to 12, unlike the heater 13 described in the above-described first embodiment, the second connection portion 171 is located on the first surface 151. Rather, it is provided on the second surface 152.
　具体的に、本実施の形態３に係る一対の第２の接続部１７１は、図１１に示すように、第２の面１５２の第３の領域Ａｒ３において、基板１５の幅方向に沿って互いに対向した状態でそれぞれ設けられている。そして、一対の第２の接続部１７１は、２つの第２の導電部１７５ａ，１７５ｂとそれぞれ電気的に接続する。すなわち、本実施の形態３に係るヒータ１３Ｂでは、上述した実施の形態１において説明したヒータ１３に対して、２つの第２の貫通孔１５４ａ，１５４ｂ及び２つの第１の導電部１７４ｃ，１７４ｄが設けられていない。
　そして、第２の接続部１７１を第２の面１５２上に設けたことに伴い、２つの第２のリード線Ｃ２は、図１１または図１２に示すように、第２の面１５２側において配線される。一方、２つの第１のリード線Ｃ１は、上述した実施の形態１と同様に、図１０または図１２に示すように、第１の面１５１側において配線される。 Specifically, as shown in FIG. 11, the pair of second connection portions 171 according to the third embodiment are connected to each other along the width direction of the substrate 15 in the third region Ar3 of the second surface 152. Each is provided in an opposed state. Then, the pair of second connection portions 171 are electrically connected to the two second conductive portions 175a and 175b, respectively. That is, in the heater 13B according to the third embodiment, two second through holes 154a and 154b and two first conductive portions 174c and 174d are different from the heater 13 described in the first embodiment. Not provided.
With the provision of the second connection portion 171 on the second surface 152, the two second lead wires C2 are connected on the second surface 152 side as shown in FIG. 11 or FIG. Is done. On the other hand, the two first lead wires C1 are wired on the first surface 151 side, as shown in FIG. 10 or 12, as in the first embodiment.
　以上説明した本実施の形態３のように第２の接続部１７１を第２の面１５２上に設けた場合であっても、上述した実施の形態１と同様の効果を奏する。 っ て も Even in the case where the second connection portion 171 is provided on the second surface 152 as in the above-described third embodiment, the same effect as in the above-described first embodiment is exerted.
（その他の実施形態）
　ここまで、本発明を実施するための形態を説明してきたが、本発明は上述した実施の形態１～３によってのみ限定されるべきものではない。
　上述した実施の形態１～３において、第２の把持部材９にもヒータ１３，１３Ａ，１３Ｂを設け、第１，第２の把持部材８，９の双方から対象部位に対して熱エネルギを付与する構成としても構わない。
　上述した実施の形態１～３において、対象部位に対して熱エネルギの他、高周波エネルギや超音波エネルギをさらに付与する構成としても構わない。なお、「対象部位に対して高周波エネルギを付与する」とは、対象部位に対して高周波電流を流すことを意味する。また、「対象部位に対して超音波エネルギを付与する」とは、対象部位に対して超音波振動を付与することを意味する。 (Other embodiments)
The embodiments for implementing the present invention have been described so far, but the present invention should not be limited only to the above-described first to third embodiments.
In the above-described first to third embodiments, the second holding member 9 is also provided with the heaters 13, 13A and 13B, and heat energy is applied from both the first and second holding members 8 and 9 to the target portion. Alternatively, the configuration may be as follows.
In the above-described first to third embodiments, a configuration may be employed in which high-frequency energy or ultrasonic energy is further applied to a target portion in addition to heat energy. Note that "giving high frequency energy to a target portion" means flowing high frequency current to the target portion. “Applying ultrasonic energy to a target portion” means applying ultrasonic vibration to a target portion.
　上述した実施の形態１～３では、抵抗パターンを第１，第２の抵抗パターン１６，１７の２つのみ設けていたが、これに限らず、３つ以上設けても構わない。この際、第１，第２の発熱部１６２，１７２を含む３つ以上の発熱部については、基板１５の長手方向の異なる位置にそれぞれ設ける。
　上述した実施の形態１～３において、配線部１７３を設ける位置は、上述した実施の形態１～３において説明した位置に限らず、第４の領域Ａｒ４を避けた位置であれば、配線部１７３の一部を基板１５の側端面に設けても構わない。
　上述した実施の形態１～３では、２つの第１の導電部１７４ａ，１７４ｂは、第１の発熱部１６２と第２の発熱部１７２との間にそれぞれ設けられていたが、これに限らない。例えば、２つの第１の導電部１７４ａ，１７４ｂを第１の領域Ａｒ１の先端側、すなわち、第２の発熱部１７２よりも先端側に設けても構わない。このような構成とすることで、先端側の発熱が抑えられ、先端で把持した血管等の組織を切開せずに封止することができる。
　上述した実施の形態３では、第１の面１５１上に第１の接続部１６１が設けられ、第２の面１５２上に第２の接続部１７１が設けられていたが、これに限らない。例えば、第１の面１５１上に第２の接続部１７１を設け、第２の面１５２上に第１の接続部１６１を設けても構わない。 In the above-described first to third embodiments, only two resistance patterns of the first and second resistance patterns 16 and 17 are provided. However, the present invention is not limited to this, and three or more resistance patterns may be provided. At this time, three or more heat generating units including the first and second heat generating units 162 and 172 are provided at different positions in the longitudinal direction of the substrate 15 respectively.
In Embodiments 1 to 3 described above, the position at which the wiring portion 173 is provided is not limited to the position described in Embodiments 1 to 3 described above, and if the wiring portion 173 is located at a position avoiding the fourth region Ar4. May be provided on the side end surface of the substrate 15.
In the first to third embodiments described above, the two first conductive portions 174a and 174b are provided between the first heat generating portion 162 and the second heat generating portion 172, respectively, but the present invention is not limited to this. . For example, the two first conductive portions 174a and 174b may be provided on the tip side of the first region Ar1, that is, on the tip side of the second heat generating portion 172. With such a configuration, heat generation at the distal end side is suppressed, and a tissue such as a blood vessel grasped at the distal end can be sealed without incision.
In the above-described third embodiment, the first connection portion 161 is provided on the first surface 151 and the second connection portion 171 is provided on the second surface 152. However, the present invention is not limited to this. For example, the second connection portion 171 may be provided on the first surface 151, and the first connection portion 161 may be provided on the second surface 152.
　１　処置システム
　２　処置具
　３　制御装置
　４　フットスイッチ
　５　ハンドル
　６　シャフト
　７　把持部
　８　第１の把持部材
　９　第２の把持部材
　１０　第１のジョー
　１１　発熱構造体
　１２　伝熱板
　１３，１３Ａ，１３Ｂ　ヒータ
　１４　接着部材
　１５　基板
　１６　第１の抵抗パターン
　１７　第２の抵抗パターン
　１８　第２のジョー
　１９　対向板
　５１　操作ノブ
　１０１　凹部
　１２１　処置面
　１５１　第１の面
　１５２　第２の面
　１５３ａ，１５３ｂ　第１の貫通孔
　１５４ａ，１５４ｂ，１５５　第２の貫通孔
　１６１　第１の接続部
　１６２　第１の発熱部
　１６３　導電部
　１７１　第２の接続部
　１７２　第２の発熱部
　１７３　配線部
　１７４ａ～１７４ｄ　第１の導電部
　１７５ａ，１７５ｂ　第２の導電部
　１８１　凹部
　１９１　把持面
　Ａ１　方向
　Ａｒ１　第１の領域
　Ａｒ２　第２の領域
　Ａｒ３　第３の領域
　Ａｒ４　第４の領域
　Ｃ　電気ケーブル
　Ｃ１　第１のリード線
　Ｃ２　第２のリード線
　ＰＬ１，ＰＬ２　基板を３つの領域に区画する平面
　Ｒ１　矢印 REFERENCE SIGNS LIST 1 treatment system 2 treatment tool 3 control device 4 foot switch 5 handle 6 shaft 7 gripper 8 first gripper 9 second gripper 10 first jaw 11 heat generating structure 12 heat transfer plate 13, 13A, 13B heater DESCRIPTION OF SYMBOLS 14 Adhesive member 15 Substrate 16 1st resistance pattern 17 2nd resistance pattern 18 2nd jaw 19 Opposing plate 51 Operation knob 101 Depression 121 Treatment surface 151 1st surface 152 2nd surface 153a, 153b 1st penetration Holes 154a, 154b, 155 Second through hole 161 First connection portion 162 First heat generation portion 163 Conductive portion 171 Second connection portion 172 Second heat generation portion 173 Wiring portion 174a to 174d First conductive portion 175a , 175b second conductive portion 181 recess 191 gripping surface A1 direction Ar1 first region Ar2 second region A 3 third region Ar4 fourth region C the electrical cable C1 first lead C2 second lead PL1, PL2 plane partitioning the substrate into three regions R1 arrows

Claims (17)

  1. 　生体組織に対して熱を伝達する処置部材と、
    　前記処置部材に対して接合される第１の面と、前記第１の面と表裏をなす第２の面とを有する絶縁性の基板と、
    　前記基板に設けられた第１の抵抗パターンであって、前記第１の面上に形成され、第１の電力を通電することによって発熱する第１の発熱領域と、前記第１の発熱領域と前記基板の基端との間に設けられ、前記第１の発熱領域と電気的に接続するとともに、前記第１の電力を通電する第１の配線部材が接続される第１の接続領域と、を有する第１の抵抗パターンと、
    　前記基板に設けられた第２の抵抗パターンであって、前記第１の面上において、前記第１の発熱領域と前記基板の先端との間に形成され、第２の電力を通電することによって発熱する第２の発熱領域と、前記第１の発熱領域と前記基板の基端との間に設けられ、前記第２の電力を通電する第２の配線部材が接続される第２の接続領域と、前記基板を前記基板の長手方向に沿って並列する第１の領域と第２の領域と第３の領域との３つの領域に区画した場合に、第４の領域を避けた位置に設けられ、前記第２の発熱領域と前記第２の接続領域とを電気的に接続する配線領域と、を有し、前記第１の領域は、前記第２の発熱領域が設けられた領域であり、前記第２の領域は、前記第１の発熱領域が設けられた領域であり、前記第３の領域は、前記第１の接続領域と前記第２の接続領域とが設けられた領域であり、前記第４の領域は、前記第１の面における前記第２の領域である、第２の抵抗パターンと、
    を備える処置具。     A treatment member that transmits heat to living tissue,
    An insulating substrate having a first surface joined to the treatment member, and a second surface facing the first surface;
    A first resistive pattern provided on the substrate, the first resistive pattern being formed on the first surface and generating heat by applying a first electric power; A first connection region provided between the base end of the substrate and electrically connected to the first heat generation region, and connected to a first wiring member for supplying the first power; A first resistor pattern having:
    A second resistance pattern provided on the substrate, the second resistance pattern being formed on the first surface between the first heat generating region and a tip of the substrate, and supplying a second electric power A second heat-generating region that generates heat, and a second connection region that is provided between the first heat-generating region and a base end of the substrate and that is connected to a second wiring member that supplies the second power. And when the substrate is divided into three regions of a first region, a second region, and a third region arranged in parallel along the longitudinal direction of the substrate, the substrate is provided at a position avoiding the fourth region. And a wiring area for electrically connecting the second heat generating area and the second connection area, wherein the first area is an area provided with the second heat generating area. , The second region is a region where the first heat generating region is provided, and the third region is A region where the first connection area and the second connection region are provided, the fourth region is the second region in the first surface, a second resistor pattern,
    A treatment tool comprising:
  2. 　前記配線領域の一部は、
    　前記第２の面における前記第２の領域に設けられている、請求項１に記載の処置具。     Part of the wiring area,
    The treatment tool according to claim 1, wherein the treatment tool is provided in the second area on the second surface.
  3. 　前記配線領域は、
    　前記第２の発熱領域よりも抵抗温度係数が小さい、請求項１に記載の処置具。     The wiring area is
    The treatment tool according to claim 1, wherein the temperature coefficient of resistance is smaller than that of the second heat generating region.
  4. 　前記配線領域は、
    　前記第２の発熱領域よりも抵抗値が小さい、請求項１に記載の処置具。     The wiring area is
    The treatment tool according to claim 1, wherein a resistance value is smaller than that of the second heat generating region.
  5. 　前記配線領域は、
    　前記第２の発熱領域よりも電気抵抗率が小さい、請求項４に記載の処置具。     The wiring area is
    The treatment tool according to claim 4, wherein the electrical resistivity is smaller than that of the second heat generating region.
  6. 　前記配線領域は、
    　前記第２の発熱領域よりも抵抗温度係数と抵抗値と電気抵抗率とがそれぞれ小さい、請求項１に記載の処置具。     The wiring area is
    The treatment tool according to claim 1, wherein the temperature coefficient of resistance, the resistance value, and the electrical resistivity are each smaller than the second heat generating region.
  7. 　前記基板は、
    　前記第１の面と前記第２の面とを貫通する貫通孔を有し、
    　前記配線領域は、
    　前記貫通孔内に設けられた貫通孔内領域と、
    　前記貫通孔外に設けられた貫通孔外領域と、を有する、請求項１に記載の処置具。     The substrate is
    A through hole penetrating through the first surface and the second surface;
    The wiring area is
    A through-hole area provided in the through-hole,
    The treatment tool according to claim 1, further comprising a through-hole outside region provided outside the through-hole.
  8. 　前記貫通孔内領域は、
    　前記貫通孔外領域よりも抵抗温度係数が小さい、請求項７に記載の処置具。     The area inside the through hole,
    The treatment tool according to claim 7, wherein the temperature coefficient of resistance is smaller than that of the region outside the through hole.
  9. 　前記貫通孔内領域は、
    　前記貫通孔外領域よりも抵抗値が小さい、請求項７に記載の処置具。     The area inside the through hole,
    The treatment tool according to claim 7, wherein a resistance value is smaller than that of the region outside the through hole.
  10. 　前記貫通孔内領域は、
    　前記貫通孔外領域よりも電気抵抗率が小さい、請求項９に記載の処置具。     The area inside the through hole,
    The treatment tool according to claim 9, wherein the electric resistivity is lower than that of the region outside the through hole.
  11. 　前記貫通孔内領域は、
    　前記貫通孔外領域よりも抵抗温度係数と抵抗値と電気抵抗率とがそれぞれ小さい、請求項７に記載の処置具。     The area inside the through hole,
    The treatment tool according to claim 7, wherein the temperature coefficient of resistance, the resistance value, and the electrical resistivity are each smaller than the region outside the through hole.
  12. 　前記貫通孔は、
    　前記第１の発熱領域と前記第２の発熱領域との間に位置する、請求項７に記載の処置具。     The through hole,
    The treatment tool according to claim 7, wherein the treatment tool is located between the first heat generation region and the second heat generation region.
  13. 　前記第１の接続領域と前記第２の接続領域とは、
    　前記第１の面と前記第２の面との一方の同一面上にそれぞれ設けられている、請求項１に記載の処置具。     The first connection region and the second connection region are:
    The treatment tool according to claim 1, wherein the treatment tool is provided on one and the same surface of the first surface and the second surface.
  14. 　前記第１の接続領域と前記第２の接続領域とは、
    　前記第１の面上にそれぞれ設けられ、
    　前記基板は、
    　前記第１の面と前記第２の面とをそれぞれ貫通する第１の貫通孔と第２の貫通孔とを有し、
    　前記配線領域は、
    　前記第１の貫通孔と前記第２の貫通孔とを経由することによって、前記第２の発熱領域と前記第２の接続領域とを電気的に接続する、請求項１３に記載の処置具。     The first connection region and the second connection region are:
    Respectively provided on the first surface,
    The substrate is
    A first through-hole and a second through-hole penetrating the first surface and the second surface, respectively;
    The wiring area is
    14. The treatment tool according to claim 13, wherein the second heat generating region and the second connection region are electrically connected to each other by passing through the first through hole and the second through hole. 15.
  15. 　前記第１の貫通孔は、
    　前記第１の発熱領域と前記第２の発熱領域との間に設けられている、請求項１４に記載の処置具。     The first through hole,
    The treatment tool according to claim 14, wherein the treatment tool is provided between the first heat generation region and the second heat generation region.
  16. 　前記第１の接続領域と前記第２の接続領域とは、
    　前記第２の面上にそれぞれ設けられ、
    　前記基板は、
    　前記第１の面と前記第２の面とをそれぞれ貫通する第１の貫通孔と第２の貫通孔とを有し、
    　前記配線領域は、
    　前記第１の貫通孔を経由することによって、前記第２の発熱領域と前記第２の接続領域とを電気的に接続し、
    　前記第１の接続領域は、
    　前記第２の貫通孔を経由することによって、前記第１の発熱領域と電気的に接続する、請求項１３に記載の処置具。     The first connection region and the second connection region are:
    Respectively provided on the second surface,
    The substrate is
    A first through-hole and a second through-hole penetrating the first surface and the second surface, respectively;
    The wiring area is
    Electrically connecting the second heat generating region and the second connection region by passing through the first through hole;
    The first connection region includes:
    14. The treatment tool according to claim 13, wherein the treatment tool is electrically connected to the first heat generating region by passing through the second through hole.
  17. 　前記第１の貫通孔は、
    　前記第１の発熱領域と前記第２の発熱領域との間に設けられている、請求項１６に記載の処置具。     The first through hole,
    17. The treatment tool according to claim 16, wherein the treatment tool is provided between the first heat generation region and the second heat generation region.
PCT/JP2018/026406 2018-07-12 2018-07-12 Treatment tool WO2020012623A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/026406 WO2020012623A1 (en) 2018-07-12 2018-07-12 Treatment tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/026406 WO2020012623A1 (en) 2018-07-12 2018-07-12 Treatment tool

Publications (1)

Publication Number Publication Date
WO2020012623A1 true WO2020012623A1 (en) 2020-01-16

Family

ID=69142363

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/026406 WO2020012623A1 (en) 2018-07-12 2018-07-12 Treatment tool

Country Status (1)

Country Link
WO (1) WO2020012623A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003325538A (en) * 2002-05-10 2003-11-18 Olympus Optical Co Ltd Medical instrument
WO2008051402A2 (en) * 2006-10-19 2008-05-02 Apsara Medical Corporation Method and apparatus for carrying out the controlled heating of tissue in the region of dermis
JP4593241B2 (en) * 2004-11-09 2010-12-08 オリンパス株式会社 Heating element and medical treatment tool using the same
WO2012081515A1 (en) * 2010-12-14 2012-06-21 オリンパス株式会社 Treatment device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003325538A (en) * 2002-05-10 2003-11-18 Olympus Optical Co Ltd Medical instrument
JP4593241B2 (en) * 2004-11-09 2010-12-08 オリンパス株式会社 Heating element and medical treatment tool using the same
WO2008051402A2 (en) * 2006-10-19 2008-05-02 Apsara Medical Corporation Method and apparatus for carrying out the controlled heating of tissue in the region of dermis
WO2012081515A1 (en) * 2010-12-14 2012-06-21 オリンパス株式会社 Treatment device

Similar Documents

Publication Publication Date Title
CN109788978B (en) Treatment tool
EP2939625B1 (en) Therapeutic treatment device
JP6274881B2 (en) Therapeutic treatment device
JP6487723B2 (en) Medical treatment device
US10603097B2 (en) Treatment energy application structure and medical treatment device
WO2020012623A1 (en) Treatment tool
US20190365455A1 (en) Treatment instrument
WO2020012622A1 (en) Treatment tool
JPWO2018055778A1 (en) Treatment tool and treatment system
US20180028254A1 (en) Therapeutic energy applying structure and medical treatment device
JP6458127B2 (en) Therapeutic energy application structure and medical treatment apparatus
US20180055555A1 (en) Therapeutic energy applying structure and medical treatment device
JP7044895B2 (en) Medical heaters, treatment tools, and methods for manufacturing treatment tools
JP6833849B2 (en) Treatment tool
WO2017163410A1 (en) Energy treatment tool
WO2020183681A1 (en) Medical heater, and treatment instrument
WO2018146729A1 (en) Energy applying structure and treatment tool
WO2020183673A1 (en) Treatment instrument, and method for manufacturing treatment instrument
WO2018146730A1 (en) Energy applying structure and treatment tool
JP7179070B2 (en) Medical heater, treatment instrument, and method for manufacturing treatment instrument
WO2020183679A1 (en) Treatment instrument
US20190110831A1 (en) Treatment tool
WO2020183680A1 (en) Treatment instrument
US20210000526A1 (en) Method of manufacturing medical heater, medical heater, treatment tool, and treatment system
WO2018179303A1 (en) Heating structure and treatment tool

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18925996

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18925996

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP