WO2020004574A1

WO2020004574A1 - Apparatus temperature adjusting device

Info

Publication number: WO2020004574A1
Application number: PCT/JP2019/025672
Authority: WO
Inventors: 功嗣三浦; 井上　誠司; 康光大見; 義則　毅; 竹内　雅之
Original assignee: 株式会社デンソー
Priority date: 2018-06-29
Filing date: 2019-06-27
Publication date: 2020-01-02

Abstract

This apparatus temperature adjusting device, provided with a thermosiphon (10) that has a first circulation circuit (100) through which a first heat medium circulates, is provided with a refrigeration cycle (20) that has a second circulation circuit (200) through which a second heat medium circulates. A condenser (16) of the thermosiphon has an inflow port (163) through which the second heat medium flows in and an outflow port (164) through which the second heat medium flows out. When the operation of a compressor (23) of the refrigeration cycle is stopped, the inflow of the second heat medium from a heat exchanger (21) for heat radiation in the refrigeration cycle to the condenser of the thermosiphon is facilitated.

Description

Equipment temperature controller

Cross-reference to related application

This application is based on Japanese Patent Application No. 2018-124858 filed on June 29, 2018 and Japanese Patent Application No. 2019-103925 filed on June 3, 2019, wherein The description is incorporated by reference.

The present disclosure relates to a device temperature controller.

Conventionally, there is a cooling device described in Patent Document 1. This device uses two systems, a mechanical compression circuit that operates a compressor that circulates refrigerant and circulates a working fluid, and a thermosiphon that cools equipment to be cooled by circulating refrigerant naturally. It is configured as a secondary loop refrigeration circuit that exchanges heat via an exchanger.

JP 2008-96084 A

According to the study of the inventor, it is conceivable that the device described in Patent Document 1 is applied to a vehicle-mounted cooling device that cools a cooling target device mounted on a vehicle. However, in the device described in Patent Document 1, the height of the refrigerant outlet of the condenser is equal to the height of the refrigerant inlet of the heat exchanger that exchanges heat between the two circuits, and the compressor operates. When the operation is stopped, sufficient refrigerant is not introduced from the condenser to the heat exchanger that exchanges heat between the two circuits. That is, when the compressor must stop operating, such as when the vehicle stops, the flow rate of the refrigerant in the mechanical compression circuit flowing into the heat exchanger that exchanges heat between the two circuits decreases. As a result, the device to be cooled cannot be sufficiently cooled.

開示 The present disclosure has an object to make it possible to cool a device to be cooled even when the compressor stops operating.

According to one aspect of the present disclosure, an apparatus temperature controller includes a thermosiphon having a first circulation circuit that circulates a first heat medium, and a target apparatus is provided by a phase change between a liquid phase and a gas phase of the first heat medium. A device for controlling the temperature of the device, a second circulation circuit for circulating a second heat medium, a compressor for compressing and discharging the second heat medium inside the second circulation circuit, and A radiating heat exchanger for exchanging heat with the discharged second heat medium and air to radiate heat of the second heat medium, and an expansion valve for decompressing the second heat medium flowing out of the radiating heat exchanger. The thermosiphon is provided in the first circulation circuit, and is configured for heat exchange between the target device and the second heat medium such that the first heat medium evaporates when the target device is cooled. Heat exchange between the heat exchanger, the second heat medium depressurized by the expansion valve, and equipment And a condenser for exchanging heat with the first heat medium evaporated by the first heat medium to condense the first heat medium, wherein the condenser has an inlet through which the second heat medium flows, and a stream through which the second heat medium flows out An outlet for flowing in the second heat medium, and an outlet for flowing out the second heat medium, wherein the second circulation circuit has a heat exchange for heat release. A first connecting pipe connecting between the outlet of the condenser and the inlet of the condenser, and a second connecting pipe connecting between the outlet of the condenser and the inlet of the heat-radiating heat exchanger. Then, when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted.

According to such a configuration, when the operation of the compressor is stopped, the second heat medium in the liquid phase condensed in the heat-radiating heat exchanger can be promoted to flow into the condenser by gravity. . Therefore, the target device can be cooled by the thermosiphon.

According to another aspect of the present disclosure, the device temperature control device includes a thermosiphon having a first circulation circuit that circulates the first heat medium, and the thermosiphon has a liquid phase and a gas phase change of the first heat medium. A device temperature controller for adjusting a temperature of a target device, wherein at least one portion of a first circulation circuit is in contact with a heat transfer member for cooling by heat transfer.

According to such a configuration, when the compressor stops operating, the heat of the first heat medium in the first circulation circuit is transferred to the heat transfer member to cool the first heat medium. Therefore, even when the compressor stops operating, the device to be cooled can be further cooled.

Note that reference numerals in parentheses attached to the respective components and the like indicate an example of the correspondence between the components and the like and specific components and the like described in the embodiments described later.

It is a lineblock diagram of an apparatus temperature control device of a 1st embodiment. It is a block diagram which disassembled the cooler and secondary battery of a thermosiphon. 3 is a flowchart of the ECU according to the first embodiment. It is a figure showing a situation of a doorway of a capacitor of a 1st embodiment. It is the figure which showed the mode of the entrance of the capacitor | condenser of 2nd Embodiment. It is the figure which showed the mode of the entrance of the capacitor of 3rd Embodiment. It is a lineblock diagram of an apparatus temperature controller of a 4th embodiment. It is a flowchart of ECU of 4th Embodiment. It is a lineblock diagram of an apparatus temperature control device of a 5th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 6th embodiment. It is a flowchart of ECU of 6th Embodiment. It is a lineblock diagram of an apparatus temperature controller of a 7th embodiment. It is a block diagram of the apparatus temperature control apparatus of 8th Embodiment. It is a flowchart of ECU of 8th Embodiment. It is a block diagram of the apparatus temperature controller of 9th Embodiment. It is a lineblock diagram of an apparatus temperature controller of a 10th embodiment. It is a block diagram of the apparatus temperature controller of 11th Embodiment. It is a lineblock diagram of an apparatus temperature controller of a 12th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 13th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 14th embodiment. It is a lineblock diagram of an apparatus temperature control device of a 15th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 16th embodiment. It is a figure for explaining arrangement of a heat transfer member of an apparatus temperature controller of a 16th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 17th embodiment. It is a flowchart of the ECU of the seventeenth embodiment. It is a lineblock diagram of an apparatus temperature control device of an 18th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 19th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 20th embodiment. It is a lineblock diagram of an apparatus temperature controller of a 21st embodiment. It is a lineblock diagram of an apparatus temperature controller of a 22nd embodiment. It is a figure showing the cooler and the secondary battery of the device temperature controller according to the twenty-third embodiment. It is a figure showing the cooler and the secondary battery of the device temperature controller according to the twenty-fourth embodiment. It is a figure showing a cooler and a secondary battery of a device temperature controller according to a twenty-fifth embodiment. It is a lineblock diagram of an apparatus temperature controller concerning a 26th embodiment. It is a flowchart of ECU of the 27th embodiment. It is a flowchart of the ECU of the twenty-eighth embodiment. It is a flowchart of ECU of the 29th embodiment. It is a flowchart of ECU of the 30th embodiment. It is a flowchart of ECU of the 31st embodiment. It is a flowchart of ECU of the 32nd embodiment. It is a flowchart of ECU of the 33rd embodiment. It is a flowchart of ECU of the 34th embodiment.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, portions that are the same or equivalent are denoted by the same reference numerals in the drawings.

(1st Embodiment)
An apparatus temperature controller according to a first embodiment will be described with reference to FIGS. 1 is mounted on a vehicle such as an electric vehicle or a hybrid vehicle. Then, in the present embodiment, the device temperature controller cools the

secondary batteries

12a and 12b shown in FIG. That is, the objects to be cooled by the device temperature controller of the present embodiment are the

secondary batteries

12a and 12b mounted on the electric vehicle. In each of the drawings, the arrow DR1 indicates the up-down direction. In the arrow DR1, the up arrow indicates the upper side in the up-down direction of the vehicle, and the down arrow indicates the lower side in the up-down direction of the vehicle.

(4) In a vehicle equipped with the device temperature controller, the electric power stored in the power storage device including the

secondary batteries

12a and 12b is supplied to the electric motor via an inverter circuit or the like, whereby the vehicle runs. The

secondary batteries

12a and 12b generate heat when outputting electric power to the electric motor via the inverter.

When the temperature of the

secondary batteries

12a and 12b becomes excessively high, the deterioration of the battery cells 13 constituting the

secondary batteries

12a and 12b is promoted. There is a need to limit input.

Therefore, in order to secure the output and the input of the battery cell 13, a cooling device for maintaining the

secondary batteries

12a and 12b at a predetermined temperature or lower is required.

電池 Also, the battery temperature rises not only while the vehicle is running but also during parking in summer. In addition, the power storage device is often arranged under the floor of the vehicle, under a trunk room, or the like, and although the amount of heat given to the

secondary batteries

12a and 12b per unit time is small, the battery temperature gradually rises by leaving the battery for a long time. .

If the

secondary batteries

12a, 12b are left in a high temperature state, the life of the

secondary batteries

12a, 12b is greatly reduced. Therefore, the battery temperature is maintained at a low temperature by cooling the

secondary batteries

12a, 12b even while the vehicle is left. It is desired.

The

secondary batteries

12a and 12b of the present embodiment are configured as an assembled battery in which a plurality of battery cells 13 are stacked in the traveling direction of the vehicle. The deterioration is biased, and the performance of the power storage device is reduced.

This is because the input / output characteristics of the power storage device are determined according to the characteristics of the battery cell 13 that has deteriorated the most. Therefore, in order for the power storage device to exhibit desired performance over a long period of time, it is important to equalize the temperature to reduce temperature variations among the plurality of battery cells 13.

Further, as another cooling device for cooling the

secondary batteries

12a and 12b, air blowing by a blower or a direct cooling system using a refrigeration cycle has been generally used, but the blower blows air in a vehicle compartment. Therefore, the cooling capacity of the blower is low.

In addition, in the blowing by the blower, the

secondary batteries

12a and 12b are cooled by the sensible heat of the air, so that the temperature difference between the upstream and downstream of the air flow becomes large, and the temperature variation between the battery cells 13 cannot be sufficiently suppressed. .

Further, air cooling using cold air generated in a refrigeration cycle, or water cooling using cold water has a high cooling capacity, but the heat exchange part with the battery cell 13 is sensible heat cooling in either air cooling or water cooling. Temperature variation between the battery cells 13 cannot be sufficiently suppressed.

From these backgrounds, in the device temperature controller of the present embodiment, a thermosiphon system is used in which the refrigerant for thermosiphon is cooled using a refrigeration cycle and the

secondary batteries

12a and 12b are cooled by natural circulation of the refrigerant for thermosiphon. Has been adopted.

機器 The device temperature controller of the present embodiment includes a thermosiphon 10 and a refrigeration cycle 20, as shown in FIG.

The thermosiphon 10 has a cooler 14, a condenser 16, and a first circulation circuit 100 that circulates a thermosiphonic refrigerant as a first heat medium. The first circulation circuit 100 has an outgoing pipe 101 and a return pipe 102.

The condenser 16 has a primary side circuit 16a and a secondary side circuit 16b. In the primary circuit 16a of the condenser 16, there are formed an inlet 161 for injecting the thermosiphon refrigerant into the primary circuit 16a and an outlet 162 for discharging the thermosiphon refrigerant from the primary circuit 16a. The inflow port 161 and the outflow port 162 of the condenser 16 are arranged on the upper surface of the primary circuit 16 a of the condenser 16. The secondary circuit 16b of the condenser 16 has an inlet 163 through which the refrigerant for the refrigeration cycle flows into the secondary circuit 16b, and an outlet 134 from which the refrigerant for the refrigeration cycle flows out from the secondary circuit 16b. Have been.

The primary circuit 16a of the condenser 16, the outgoing pipe 101, the cooler 14, and the return pipe 102 are connected in a ring shape to form a first circulation circuit 100 in which a thermosiphon refrigerant circulates.

冷媒 The first circulation circuit 100 of the present embodiment is filled with a thermosiphon refrigerant. The refrigerant for thermosiphon naturally circulates through the first circulation circuit 100 by evaporation and condensation, and the device temperature controller controls the temperature of the

secondary batteries

12a and 12b by a phase change between the liquid phase and the gas phase of the refrigerant for thermosiphon. To adjust.

The refrigerant charged in the first circulation circuit 100 is, for example, a chlorofluorocarbon-based refrigerant such as HFO-1234yf or HFC-134a. Alternatively, various working fluids other than the chlorofluorocarbon-based refrigerant such as water and ammonia may be used as the refrigerant.

When the refrigerant for thermosiphon in the main body 143 of the cooler 14 evaporates by heat exchange with the

secondary batteries

12a and 12b and becomes a gaseous refrigerant, the gaseous refrigerant flows from the outlet 142 through the return pipe 102 to the condenser. 16 flows into the primary side circuit 16a of the condenser 16 from the 16 inlets 161.

The thermosyphon refrigerant flowing into the primary circuit 16a is condensed by heat exchange with the refrigeration cycle refrigerant inside the secondary circuit 16b of the condenser 16 to become a liquid-phase refrigerant. Then, the gas flows from the outlet 162 of the primary circuit 16 a of the condenser 16 through the outward pipe 101 into the main body 143 of the cooler 14 through the inlet 141 formed in the main body 143 of the cooler 14.

(4) A liquid-phase refrigerant having a relatively high specific gravity is stored below the main body 143 of the cooler 14, and a gas-phase refrigerant having a relatively low specific gravity is stored above the main body 143 of the cooler 14. Therefore, the gas-phase refrigerant in the main body 143 is exclusively discharged from the outlet 142 out of the inlet 141 and the outlet 142.

冷却 As shown in FIG. 2, the cooler 14 is disposed between the

secondary batteries

12a and 12b. The cooler 14 corresponds to an equipment heat exchanger. The cooler 14 cools the

secondary batteries

12a and 12b by exchanging heat between the heat of the

secondary batteries

12a and 12b and the heat of the thermosiphon refrigerant. The cooler 14 has a main body 143 made of, for example, a metal having high thermal conductivity.

The main body 143 of the cooler 14 has an inlet 141 through which the thermosyphonic refrigerant flows and an outlet 142 through which the thermosiphonic refrigerant flows out. The outlet 142 is arranged above the inlet 141 in the up-down direction. The outward pipe 101 connects between an outlet 162 of the condenser 16 formed in the primary circuit 16 a of the condenser 16 and an inlet 141 formed in the main body 143 of the cooler 14. In addition, the return pipe 102 connects an outlet 142 formed in the main body 143 of the cooler 14 and an inlet 161 formed in the primary circuit 16 a of the condenser 16.

では In the present embodiment, the condenser 16 is housed in a front storage room or a trunk room. The front storage room is a room that is disposed on the front side in the vehicle traveling direction with respect to the vehicle interior of the vehicle and houses a traveling engine and a traveling electric motor. The trunk room is a storage room that is disposed rearward in the vehicle traveling direction with respect to the vehicle interior of the vehicle and stores luggage and the like.

The refrigeration cycle 20 constitutes a vapor compression refrigeration cycle including a circulation circuit 200 in which a refrigerant for a refrigeration cycle as a second heat medium circulates, a compressor 23, a condenser 21, and an expansion valve 30. The refrigeration cycle 20 includes a second circulation circuit 200 for circulating the refrigerant for the refrigeration cycle, and a compressor 23 for compressing and discharging the refrigerant for the refrigeration cycle in the second circulation circuit 200.

The refrigeration cycle 20 further includes a condenser 21 for exchanging heat between the refrigeration cycle refrigerant discharged from the compressor 23 and the outside air to radiate the refrigeration cycle refrigerant discharged from the compressor 23. Further, an expansion valve 30 is provided to reduce the pressure of the refrigerant for the refrigeration cycle flowing out of the condenser 21 and to flow the refrigerant into the secondary circuit 16 b of the condenser 16. The condenser 21 corresponds to a radiating heat exchanger that exchanges heat between the refrigeration cycle refrigerant discharged from the compressor 23 and air and radiates heat of the refrigeration cycle refrigerant.

The refrigeration cycle 20 further includes an ECU 50 that controls the compressor 23 and the expansion valve 30. The expansion valve 30 of the present embodiment is an electric expansion valve that operates according to the control of the ECU 50. The ECU 50 is configured as a computer having a ROM, a RAM, a CPU, an I / O, and the like, and the CPU performs various processes according to a program stored in the ROM. The ROM and the RAM are non-transitional substantive storage media.

The circulation circuit 200 connects the compressor 23, the condenser 21, the expansion valve 30, and the primary circuit 16a of the condenser 16 in a ring shape. The circulation circuit 200 has a first connection pipe 201 that supplies the refrigerant for the refrigeration cycle flowing out of the condenser 21 to the secondary circuit 16 b of the condenser 16. Further, a second connection pipe 202 for supplying the refrigerant for the refrigeration cycle flowing out of the secondary circuit 16 b of the condenser 16 to the condenser 21 is provided. The secondary circuit 16 b of the condenser 16 functions as an evaporator of the refrigeration cycle 20.

The first connection pipe 201 connects between an outlet 212 formed in the condenser 21 and an inlet 163 formed in the secondary circuit 16 b of the condenser 16. The second connection pipe 202 connects between an outlet 164 formed in the secondary circuit 16 b of the condenser 16 and an inlet 211 formed in the condenser 21. The compressor 23 is provided in the middle of the second connection pipe 202.

By the way, the vehicle of the present embodiment stops the power supply from the

secondary batteries

12a and 12b during parking. Therefore, during parking, the compressor 23 of the refrigeration cycle 20 also stops operating. Therefore, the refrigerant for the refrigeration cycle cannot be supplied to the condenser 16 by the compressor 23, and the cooling target device cannot be cooled.

場合 When the operation of the compressor 23 is stopped, the first heat medium of the first circulation circuit has substantially the same temperature as the secondary battery. Therefore, the temperature of the thermosiphon refrigerant in the primary circuit 16a in the condenser is also substantially the same as that of the target device. On the other hand, when the operation of the compressor 23 is stopped, the condenser of the second circulation circuit is cooled to the outside air.

Here, when the battery temperature is higher than the outside air temperature, the condenser in the first circulation circuit that has received more heat of the thermosiphon refrigerant becomes higher than the outside air temperature. On the other hand, the condenser is cooled to the outside air temperature. Therefore, condensation occurs in the refrigerant for the refrigeration cycle in the condenser. In addition, when the other components of the refrigeration cycle 20 except for the condenser 21 are higher than the temperature of the condenser which is substantially equal to the outside air temperature, the refrigeration cycle refrigerant evaporates from the other components and the refrigeration cycle The phenomenon of refrigerant condensation tends to occur. In particular, when the outside air temperature is lower than in the daytime, such as in the evening or at night during parking, the above-described event occurs.

Therefore, in the device temperature controller of the present embodiment, by adopting a configuration in which the inflow of the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 by gravity is promoted, even when the operation of the compressor 23 is stopped, cooling is performed. The target device can be cooled.

In the device temperature controller of the present embodiment, when the compressor 23 stops operating, the arrangement is such that the inflow of the refrigeration cycle refrigerant from the condenser 21 to the condenser 16 is promoted.

Specifically, the condenser 16 has an inlet 163 into which the refrigerant for the refrigeration cycle flows, and an outlet 164 from which the refrigerant for the refrigeration cycle flows, and the inlet 163 of the condenser 16 It is arranged below the outlet 212 in the vertical direction. The inflow port 163 of the condenser 16 is disposed below the compressor 23, the condenser 21, and the expansion valve 30 that constitute the refrigeration cycle 20 in the up-down direction.

As shown in FIG. 4, the condenser 21 of the present embodiment is arranged such that the refrigerant for the refrigeration cycle flows in the heat exchange part in the condenser 21 in the lateral direction. Further, the condenser 21 has two inlets / outlets 213 forming an inlet 211 for flowing the refrigerant for the refrigeration cycle and an outlet 212 for flowing the refrigerant for the refrigeration cycle, and the inlets / outlets 213 of the condenser 21 are different from each other in the vertical direction. Is located in the position. Further, the first connection pipe 201 connects between the inlet / outlet 213 of the condenser 16 and the inlet / outlet 213 of the condenser 21 which is disposed on the lower side in the vertical direction from the inlet / outlet 213 disposed on the upper side in the vertical direction. are doing.

In the device temperature controller of the present embodiment, the first connection pipe 201 is connected to the outlet 212 of the condenser 21 and the inlet 163 of the condenser 16 without passing through the upper side in the vertical direction from the outlet 212 of the condenser 21. Are connected between.

As described above, when the operation of the compressor 23 is stopped, the flow of the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 is promoted.

{Circle around (4)} Further, when the compressor 23 stops operating, the ECU 50 of the device temperature controller of the present embodiment performs a process of controlling the expansion valve 30 so that the refrigerant for the refrigeration cycle flows from the condenser 21 to the condenser 16.

Next, the processing of the ECU 50 will be described with reference to FIG. The ECU 50 periodically performs the processing shown in FIG.

First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input. Here, when a signal instructing to turn off the refrigeration cycle is not input, the ECU 50 normally operates the compressor 23 and normally operates the expansion valve 30 in S102. Specifically, the expansion valve 30 is controlled so that the valve opening becomes a predetermined target opening, and the process returns to the main routine.

When a signal instructing to turn off the refrigeration cycle is input, ECU 50 determines in S104 whether or not cooling of the target device is necessary based on a signal from a temperature sensor that detects the temperature of the target device. . For example, when the temperature of the target device is equal to or higher than a predetermined value, it is determined that the target device needs to be cooled. If the temperature of the target device is lower than the predetermined value, it is determined that cooling of the target device is not necessary.

Here, when it is determined that the target device needs to be cooled, the ECU 50 stops the operation of the compressor 23, and controls the expansion valve 30 to fully open the valve in S108, and executes the main routine. Return to

Therefore, when the operation of the compressor 23 is stopped, the expansion valve 30 is controlled so as to fully open the valve, so that the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 is promoted.

If the ECU 50 determines in S100 that cooling of the target device is not necessary, the ECU 50 stops the operation of the compressor 23 and stops the operation of the expansion valve 30 in S106. Specifically, the expansion valve 30 is controlled so that the valve opening is fully closed, and the process returns to the main routine.

Therefore, when the operation of the compressor 23 is stopped, the expansion valve 30 is controlled so that the valve opening is fully closed, so that the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 is suppressed.

As described above, the device temperature controller of the present embodiment includes the thermosiphon 10 having the first circulation circuit 100 that circulates the thermosiphon refrigerant. Then, the temperature of the

batteries

12a and 12b as the target devices is adjusted by the phase change between the liquid phase and the gas phase of the thermosyphon refrigerant. Further, a second circulation circuit 200 for circulating the refrigeration cycle refrigerant and a compressor 23 for compressing and discharging the refrigeration cycle refrigerant inside the second circulation circuit 200 are provided. Further, a condenser 21 is provided for exchanging heat between the refrigerant for the refrigeration cycle discharged from the compressor 23 and the air to radiate the heat of the refrigerant for the refrigeration cycle. Further, an expansion valve 30 for reducing the pressure of the refrigerant for the refrigeration cycle flowing out of the condenser 21 is provided.

Further, the thermosiphon 10 is disposed in the first circulation circuit 100 and includes a cooler 14 configured to be capable of exchanging heat between the target device and the refrigerant for the refrigeration cycle so that the refrigerant for the thermosiphon evaporates when the target device is cooled. Have. The condenser 16 also has a condenser 16 for exchanging heat between the refrigerant for the refrigeration cycle, which has been depressurized by the expansion valve 30, and the refrigerant for the thermosiphon evaporated by the cooler 14, thereby condensing the refrigerant for the thermosiphon.

The condenser 16 has an inlet 163 through which the refrigerant for the refrigeration cycle flows, and an outlet 164 through which the refrigerant for the refrigeration cycle flows out. The condenser 21 has an inlet 211 for flowing the refrigerant for the refrigeration cycle and an outlet 212 for flowing the refrigerant for the refrigeration cycle.

The second circulation circuit 200 includes a first connection pipe 201 that connects between the outlet 212 of the condenser 21 and the inlet 163 of the condenser 16, an outlet 164 of the condenser 16, and an inlet 211 of the condenser 21. And a second connection pipe 202 that connects between the two. When the operation of the compressor 23 is stopped, the flow of the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 is promoted.

According to such a configuration, when the operation of the compressor 23 is stopped, the flow of the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 is promoted, so that the equipment to be cooled can be sufficiently cooled. .

機器 In addition, the device temperature controller of the present embodiment is arranged such that when the compressor 23 stops operating, the flow of the refrigeration cycle refrigerant from the condenser 21 to the condenser 16 is promoted.

Specifically, the inlet 163 of the condenser 16 is disposed below the outlet 212 of the condenser 21 in the vertical direction. The inflow port 163 of the condenser 16 is disposed below the compressor 23, the condenser 21, and the expansion valve 30 that constitute the refrigeration cycle 20 in the up-down direction. Further, the first connection pipe 201 connects between the outlet 212 of the condenser 21 and the inlet 163 of the condenser 16 without passing vertically above the outlet 212 of the condenser 21.

Therefore, when the operation of the compressor 23 is stopped, the flow of the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 can be promoted.

In addition, the condenser 21 has at least two inlets and outlets 213 that constitute an inlet 211 for flowing the refrigerant for the refrigeration cycle and an outlet 212 for flowing the refrigerant for the refrigeration cycle. They are located at different locations. Further, the first connection pipe 201 connects between the inlet / outlet 213 of the condenser 16 and the inlet / outlet 213 of the condenser 21 which is disposed on the lower side in the vertical direction from the inlet / outlet 213 disposed on the upper side in the vertical direction. are doing.

Further, the device temperature control device of the present embodiment is disposed on a path connecting the condenser 21 and the condenser 16, and an expansion valve 30 as a path opening / closing unit that opens and closes a path connecting the condenser 21 and the condenser 16. It has. Also, it is determined whether or not the cooling of the target device is necessary based on the temperature of the target device (S104). If it is determined that the compressor 23 stops operating and the cooling of the target device is necessary, The expansion valve 30 is opened (S112).

Therefore, when the operation of the compressor 23 is stopped, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 can be promoted to flow into the condenser 16 by gravity. Therefore, the target device can be cooled by the thermosiphon 10.

(2nd Embodiment)
An apparatus temperature controller according to the second embodiment will be described with reference to FIG. The capacitor 21 of the first embodiment has two ports 213 as shown in FIG. The first connection pipe 201 connects between the inlet / outlet 213 of the condenser 16 and the inlet / outlet 213 of the condenser 21 which is disposed on the lower side in the vertical direction from the inlet / outlet 213 disposed on the upper side in the vertical direction. are doing.

On the other hand, the condenser 21 of the present embodiment has three ports 213 as shown in FIG. The first connection pipe 201 connects between the inlet / outlet 213 of the condenser 16 and the inlet / outlet 213 of the condenser 21 which is disposed on the lower side in the vertical direction from the inlet / outlet 213 disposed on the uppermost side in the vertical direction. Connected.

According to such a configuration, when the compressor 23 stops operating, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 easily flows out to the condenser 16, and the condenser 16 The flow of the refrigerant for the refrigeration cycle into the refrigerant can be promoted. Therefore, the target device can be cooled by the thermosiphon 10.

(Third embodiment)
An apparatus temperature controller according to a third embodiment will be described with reference to FIG. In the present embodiment, the refrigerant for the refrigeration cycle is arranged to flow in the heat exchange section in the condenser 21 in the vertical direction. Further, the capacitor 21 of the present embodiment has three entrances 213. Further, the first connection pipe 201 connects between the inlet / outlet 213 of the condenser 16 and the inlet / outlet 213 of the condenser 21 which is disposed on the lower side in the vertical direction from the inlet / outlet 213 disposed on the uppermost side in the vertical direction. Connected.

(Fourth embodiment)
A device temperature controller according to a fourth embodiment will be described with reference to FIGS. The device temperature control device of the first embodiment has an expansion valve 30 that operates according to the control of the ECU 50. However, the device temperature control device of the present embodiment has a mechanical expansion valve instead of the expansion valve 30. 31. Furthermore, the device temperature control device of the present embodiment has a bypass flow path 204 that bypasses the mechanical expansion valve 31 and an on-off valve 32 that is disposed in the bypass flow path 204. The on-off valve 32 is configured by an electric valve that operates according to the control of the ECU 50.

First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input. Here, when the signal instructing to turn off the refrigeration cycle has not been input, the ECU 50 controls the valve 32 to a closed state in S102. At this time, the pressure of the refrigeration cycle is reduced by the expansion valve 31.

Here, if it is determined that the target device needs to be cooled, the ECU 50 stops the operation of the compressor 23, controls the valve 32 to fully open the valve in S112, and returns to the main routine.

Therefore, when the operation of the compressor 23 is stopped, the valve 32 is controlled so as to fully open the valve, so that the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 is promoted.

If the ECU 50 determines in S100 that cooling of the target device is not necessary, the ECU 50 controls the valve 32 so that the valve is fully closed in S114.

Therefore, when the operation of the compressor 23 is stopped, the valve 32 is controlled so that the valve is fully closed, so that the inflow of the refrigeration cycle refrigerant from the condenser 21 to the condenser 16 is suppressed, and the cooling of the control target is performed. Can not be promoted.

(Fifth embodiment)
A device temperature controller according to a fifth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the first connection pipe 201 is arranged so as to be inclined downward in the vertical direction as the outlet 212 of the condenser 21 approaches the inlet 163 of the condenser 16. The inflow port 163 of the condenser 16 is disposed below the target liquid level of the refrigeration cycle refrigerant when the second circulation circuit 200 is filled with the refrigeration cycle refrigerant. Further, in the device temperature controller of the present embodiment, the mechanical expansion valve 31 and the on-off valve 32 are connected to the first connection pipe 201. Note that the control of the ECU 50 is the same as the process shown in FIG. 8, and thus the details thereof are omitted here.

As described above, the first connection pipe 201 is disposed so as to be inclined downward in the up-down direction as it approaches the inflow port 163 of the condenser 16 from the outflow port 212 of the condenser 21. Therefore, the refrigerant for the refrigeration cycle flows easily from the outlet 212 of the condenser 21 to the inlet 163 of the condenser 16, and the inflow of the refrigerant for the refrigeration cycle from the condenser 21 to the condenser 16 is promoted.

The inlet 163 of the condenser 16 is disposed below the target liquid level of the refrigeration cycle refrigerant when the second circulation circuit 200 is filled with the refrigeration cycle refrigerant. Therefore, when the operation of the compressor 23 is stopped, the refrigerant for the refrigeration cycle can be stored in the condenser 16, and the device to be cooled can be cooled.

(Sixth embodiment)
A device temperature controller according to a sixth embodiment will be described with reference to FIGS. The device temperature control device of the present embodiment is different from the device temperature control device of the first embodiment in that, when the compressor 23 stops operating, the cooling device is given priority over the condenser 16 as the first condenser. A parking heat exchanger 18 for condensing the thermosiphon refrigerant evaporated by the heat exchanger 14 is provided. The parking heat exchanger 18 corresponds to a second condenser. When the compressor 23 stops operating, the flow of the refrigeration cycle refrigerant from the condenser 21 to the parking heat exchanger 18 is promoted. Further, the device temperature control device of the present embodiment has an on-off valve 32 that operates according to the control of the ECU 50.

機器 The device temperature controller of the present embodiment has a bypass channel 103 that branches off from the middle of the return pipe 102 and reaches the inlet 141 of the cooler 14.

時 During the operation of the compressor, the temperature of the refrigeration cycle refrigerant flowing out of the outlet 212 of the condenser 21 is higher than the temperature of the thermosiphon refrigerant flowing out of the outlet 142 of the cooler 14.

The parking heat exchanger 18 has an inlet 181 for flowing a thermosiphon refrigerant, an outlet 182 for flowing a thermosiphon refrigerant, an inlet 183 for flowing a refrigeration cycle refrigerant, and a refrigeration cycle refrigerant. And an outlet 184. The inflow port 181 of the parking heat exchanger 18 is disposed below the inflow port 161 of the condenser 16 in the vertical direction. The parking heat exchanger 18 is arranged in the bypass channel 103. The parking heat exchanger 18 is disposed upstream of the on-off valve 32 in the refrigerant flow direction of the refrigerant for the refrigeration cycle.

The parking heat exchanger 18 exchanges heat between the thermosiphon refrigerant and the refrigeration cycle refrigerant to condense the thermosiphon refrigerant. The parking heat exchanger 18 is arranged such that when the compressor 23 stops operating, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 easily flows in due to gravity. Therefore, the refrigerant for thermosiphon evaporated by the cooler 14 is condensed prior to the condenser 16.

(4) When the refrigeration cycle refrigerant flowing out of the outlet 142 of the cooler 14 flows into the parking heat exchanger 18, it condenses inside the parking heat exchanger 18. The refrigeration cycle refrigerant condensed inside the parking heat exchanger 18 is introduced into the cooler 14 from the inlet 141 of the cooler 14.

Next, control of the on-off valve 32 by the ECU 50 will be described with reference to FIG. The ECU 50 periodically performs the processing shown in FIG.

First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input. Here, when the signal for instructing the refrigerating cycle to be turned off is not input, the ECU 50 normally operates the compressor 23 and controls the on-off valve 32 so that the valve is fully opened in S102. Return.

Here, the temperature of the thermosyphon refrigerant flowing out of the outlet 142 of the cooler 14 is lower than the temperature of the refrigeration cycle refrigerant passing through the parking heat exchanger 18. Therefore, heat is not exchanged in the parking heat exchanger 18. The refrigerant for the thermosiphon flowing out of the outlet 142 of the cooler 14 exchanges heat with the refrigerant for the refrigeration cycle in the condenser 16 and condenses. The refrigerant for thermosiphon condensed in the condenser 16 is introduced into the inside of the cooler 14 from an inlet 141 of the cooler 14.

When a signal instructing to turn off the refrigeration cycle is input, ECU 50 determines in S104 whether or not cooling of the target device is necessary based on a signal from a temperature sensor that detects the temperature of the target device. .

Here, when it is determined that the target device needs to be cooled, the ECU 50 stops the operation of the compressor 23 and controls the on-off valve 32 to fully open the valve in S206, and executes the main routine. Return to

Therefore, when the operation of the compressor 23 is stopped, the on-off valve 32 is controlled so that the valve opening is fully opened, so that the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 is used due to gravity for parking. The flow into the heat exchanger 18 is facilitated. The thermosiphon refrigerant condensed in the parking heat exchanger 18 is introduced into the cooler 14 from the inlet 141 of the cooler 14. Therefore, since the gas-phase refrigerant for thermosiphon flowing out of the outlet 142 of the cooler 14 is introduced into the cooler 14 through a different path, cooling of the target device is promoted.

If it is determined in S100 that the cooling of the target device is not necessary, the ECU 50 stops the operation of the compressor 23 and controls the on-off valve 32 to fully close the valve opening in S208. Return to the main routine.

Therefore, when the compressor 23 stops operating, the valve 32 is controlled so that the valve opening is fully closed. Thereby, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 is suppressed from flowing into the parking heat exchanger 18 due to gravity, and cooling of the controlled object can not be promoted.

(Seventh embodiment)
A device temperature controller according to a seventh embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the parking heat exchanger 18 is disposed downstream of the expansion valve 30 in the refrigerant flow direction of the refrigerant for the refrigeration cycle. Note that the processing of the ECU 50 is the same as that of the flowchart shown in FIG. 3, and a description thereof will be omitted here. In this manner, the parking heat exchanger 18 may be arranged downstream of the expansion valve 30 in the refrigerant flow direction of the refrigerant for the refrigeration cycle.

(Eighth embodiment)
An apparatus temperature controller according to an eighth embodiment will be described with reference to FIGS. The device temperature controller of the present embodiment is formed by a bypass passage 205 that bypasses the parking heat exchanger 18, an on-off valve 32 that opens and closes a flow path formed by the bypass passage 205, and a first connection pipe 201. Opening / closing valve 34 for opening / closing the flow path. The on-off

valves

32 and 34 operate according to the control of the ECU 50, respectively.

First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input. Here, when a signal instructing to turn off the refrigeration cycle is not input, the ECU 50 operates the compressor 23 normally. Further, in S302, the expansion valve 30 is operated normally. Further, the

valves

32 and 34 are controlled so that the refrigerant for the refrigeration cycle does not flow into the heat exchanger 18 for parking. More specifically, the expansion valve 30 is controlled so that the valve opening becomes a predetermined target opening, the valve 32 is controlled so that the valve opening is fully opened, and the on-off valve 34 is controlled such that the valve opening is fully closed. And returns to the main routine. Therefore, heat exchange by the parking heat exchanger 18 is hardly performed.

Here, when it is determined that the target device needs to be cooled, the ECU 50 stops the operation of the compressor 23 and, in S305, causes the valve 32 to flow the refrigeration cycle refrigerant to the parking-time heat exchanger 18. , 34 are controlled. Specifically, the valve 32 is controlled so that the valve opening is fully closed, the on-off valve 34 is controlled such that the valve opening is fully opened, and the process returns to the main routine.

Therefore, it is promoted that the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 flows into the parking heat exchanger 18 by gravity. The thermosiphon refrigerant condensed in the parking heat exchanger 18 is introduced into the cooler 14 from the inlet 141 of the cooler 14. Therefore, since the refrigerant for thermosyphon flowing out of the outlet 142 of the cooler 14 is introduced into the cooler 14 through a different path, cooling of the target device is promoted.

If the ECU 50 determines in S100 that cooling of the target device is not necessary, the ECU 50 stops the operation of the compressor 23, and in S306, prevents the refrigerant for the refrigeration cycle from flowing to the parking-time heat exchanger 18. The

valves

32 and 34 are controlled. Specifically, the on-off valve 34 is controlled so that both the

valves

32 and 34 are fully closed, and the process returns to the main routine.

Therefore, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 is suppressed from flowing into the parking heat exchanger 18 due to gravity, and cooling of the controlled object is not promoted.

(Ninth embodiment)
A device temperature controller according to a ninth embodiment will be described with reference to FIG. In the device temperature control apparatus of the seventh embodiment, the heat exchanger 18 for parking is disposed upstream of the expansion valve 30 in the refrigerant flow direction of the refrigerant for the refrigeration cycle. On the other hand, in the apparatus temperature controller of the present embodiment, the parking heat exchanger 18 is disposed downstream of the expansion valve 30 in the refrigerant flow of the refrigeration cycle refrigerant. Note that the processing of the ECU 50 is the same as that of the flowchart shown in FIG. 14, and a description thereof will be omitted.

As described above, even when the parking heat exchanger 18 is disposed on the downstream side of the refrigerant flow of the refrigeration cycle refrigerant with respect to the expansion valve 30, the condensation of the thermosiphon refrigerant in the parking heat exchanger 18 can be further improved. Can be promoted.

(Tenth embodiment)
An apparatus temperature controller according to a tenth embodiment will be described with reference to FIG. The device temperature controller of the seventh embodiment is configured so that the thermosiphon refrigerant condensed in the parking heat exchanger 18 is introduced into the inlet 141 of the cooler 14. On the other hand, the device temperature controller of the present embodiment is configured such that the thermosiphon refrigerant condensed in the parking heat exchanger 18 is introduced into the outlet 142 of the cooler 14. Note that the processing of the ECU 50 is the same as that of the flowchart shown in FIG. 3, and a description thereof will be omitted here.

When the compressor 23 is operating, the refrigerant for the thermosiphon evaporated in the cooler 14 is heat-exchanged with the refrigerant for the refrigeration cycle in the heat exchanger 18 for parking, and then in the condenser 16. Heat exchange with the refrigerant for the refrigeration cycle.

When the compressor 23 stops operating, the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 flows into the parking heat exchanger 18 by gravity. Then, the thermosiphon refrigerant flowing out of the outlet 142 of the cooler 14 is condensed by the parking heat exchanger 18, and the condensed thermosiphon refrigerant returns into the cooler 14 from the outlet 142 of the cooler 14. . Thereby, cooling of the target device is promoted.

(Eleventh embodiment)
The device temperature controller according to the eleventh embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the parking-time heat exchanger 18 is disposed upstream of the expansion valve 30 in the refrigerant flow direction of the refrigerant for the refrigeration cycle. Further, an on-off valve 34 is provided on the upstream side of the refrigerant flow of the refrigerant for the refrigeration cycle with respect to the heat exchanger 18 for parking. Note that the processing of the ECU 50 is the same as that of the flowchart shown in FIG. 11, and a description thereof will be omitted here.

As in the present embodiment, when the heat exchanger for parking 18 is arranged on the upstream side of the refrigerant flow of the refrigerant for the refrigeration cycle with respect to the expansion valve 30, the refrigeration cycle is smaller than the heat exchanger 18 for parking. It is desirable to control the on-off valve 34 arranged on the upstream side of the refrigerant flow of the working refrigerant to be in an open state. That is, when the compressor 23 stops operating and when it is determined that the target device needs to be cooled, the on-off valve 34 disposed on the refrigerant flow upstream side of the refrigeration cycle refrigerant with respect to the parking-time heat exchanger 18 is operated. It is desirable to control the valve to be open.

(Twelfth embodiment)
A device temperature controller according to a twelfth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the outlet 164 of the condenser 16 is disposed above the inlet 163 of the condenser 16 in the up-down direction. Then, the refrigerant for the refrigeration cycle flowing from the inlet 163 of the condenser 16 evaporates, moves upward and downward, and flows out of the outlet 164 of the condenser 16.

In the device temperature controller of the present embodiment, the inlet 163 of the condenser 16 is disposed below the outlet 212 of the condenser 21 in the vertical direction. Therefore, when the compressor 23 stops operating, it is promoted that the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 flows into the parking heat exchanger 18 by gravity. Therefore, the target device can be cooled by the thermosiphon 10.

(5) The outlet 164 of the condenser 16 is disposed above the inlet 163 of the condenser 16 in the vertical direction. For this reason, when the liquid-phase refrigeration cycle refrigerant that has flowed into the condenser 16 evaporates and gasifies inside the condenser 16, the discharge performance is improved, and the cooling capacity of the cooler 14 can be improved. .

(Thirteenth embodiment)
A device temperature controller according to a thirteenth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the outlet 184 of the parking heat exchanger 18 is disposed above the inlet 183 of the condenser 16 in the vertical direction. The refrigerant for the refrigeration cycle flowing from the inlet 183 of the parking heat exchanger 18 evaporates, moves upward and downward, and flows out of the outlet 184 of the parking heat exchanger 18. .

As described above, the outflow port 184 of the parking heat exchanger 18 is arranged vertically above the inflow port 183 of the condenser 16. Therefore, when the liquid-phase refrigeration cycle refrigerant that has flowed into the parking heat exchanger 18 evaporates and gasifies inside the parking heat exchanger 18, the discharge performance is improved, and the cooling of the cooler 14 is improved. Ability can be improved.

(14th embodiment)
A device temperature controller according to a fourteenth embodiment will be described with reference to FIG. The device temperature controller of the present embodiment is arranged such that the first connection pipe 201 is inclined downward in the up-down direction as the first connection pipe 201 approaches the inflow port 183 of the parking heat exchanger 18 from the outflow port 212 of the condenser 21. .

The inlet 163 of the condenser 16 is disposed below the target liquid level of the refrigerant for the refrigeration cycle when the second circulation circuit 200 is filled with the refrigerant for the refrigeration cycle. Note that the control by the ECU 50 is the same as the process shown in FIG.

Thus, the first connection pipe 201 is arranged so as to be inclined downward in the vertical direction as it approaches the inflow port 183 of the parking heat exchanger 18 from the outflow port 212 of the condenser 21. Therefore, when the compressor 23 stops operating, it is promoted that the liquid-phase refrigeration cycle refrigerant condensed in the condenser 21 flows into the parking heat exchanger 18 by gravity. Therefore, the target device can be cooled by the thermosiphon 10.

The inlet 163 of the condenser 16 is disposed below the target liquid level of the refrigerant for the refrigeration cycle when the second circulation circuit 200 is filled with the refrigerant for the refrigeration cycle. Therefore, the flow of the refrigerant for the refrigeration cycle from the condenser 21 to the heat exchanger 18 for parking can be further promoted.

(Fifteenth embodiment)
A device temperature controller according to a fifteenth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the parking heat exchanger 18 is disposed downstream of the expansion valve 30 in the refrigerant flow direction of the refrigerant for the refrigeration cycle. Note that the control by the ECU 50 is the same as the process shown in FIG.

As described above, the heat exchanger for parking 18 may be arranged on the downstream side of the refrigerant flow of the refrigerant for the refrigeration cycle with respect to the expansion valve 30.

(Sixteenth embodiment)
The device temperature controller according to the sixteenth embodiment will be described with reference to FIGS. The equipment temperature controller of the sixth embodiment is a parking heat exchanger that condenses the thermosiphon refrigerant by exchanging heat between the refrigeration cycle refrigerant flowing out of the condenser 21 and the thermosiphon refrigerant flowing out of the cooler 14. 18 was provided. On the other hand, the device temperature controller of the present embodiment includes the heat transfer member 40 that transfers the heat of the thermosyphonic refrigerant flowing through the return pipe 102 to the first connection pipe 201 instead of the parking heat exchanger 18. Have. The heat transfer member 40 is made of a high heat conductive member such as copper or aluminum.

(4) The heat transfer member 40 cools the refrigerant for the gas-phase thermosiphon flowing out of the outlet 142 of the cooler 14. Then, the refrigerant for the thermosiphon condenses into a liquid phase and flows into the inside of the cooler 14 from the outlet 142 of the cooler 14. Therefore, the target device can be cooled.

In this embodiment, the heat transfer member 40 is in contact with the first connection pipe 201 on the upstream side of the refrigerant flow of the refrigerant for the refrigeration cycle of the expansion valve 30. It may be configured to contact the first connection pipe 201 on the downstream side of the refrigerant flow of the refrigerant.

Further, as shown by arrows A to C in FIG. 23, the contact portion between the first circulation circuit 100 and the heat transfer member 40 is used for the thermosiphon when the first circulation circuit 100 is filled with the refrigerant for thermosiphon. It is preferable to set the upper side in the vertical direction from the target liquid level of the refrigerant. This target liquid level is the same as the liquid level when the thermosiphon is not operating, that is, when the thermosyphon refrigerant is not circulating in the first circulation circuit 100.

That is, the contact portion between the first circulation circuit 100 and the heat transfer member 40 is located above and below the target liquid level of the refrigerant for the thermosiphon shown by the arrow A and on the side of the cooler 14 from the top of the return pipe 102. Is preferably arranged. In addition, it is preferable to arrange a contact portion between the first circulation circuit 100 and the heat transfer member 40 in a region between the uppermost portion of the return pipe 102 indicated by the arrow B and the condenser 16. In addition, the first circulation circuit 100 and the heat transfer member 40 are located above and below the target liquid level of the refrigerant for the thermosiphon indicated by the arrow C, and in a region between the condenser 16 and the connection portion between the return pipe 102. It is preferable to arrange the contact portions of the above.

In addition, also about the area | region in which the heat exchanger 18 for parking at the time of each said embodiment is arrange | positioned, similarly to the target liquid level of the refrigerant | coolant for thermosiphon when the 1st circulation circuit 100 is filled with the refrigerant for thermosiphon. It is preferable to set the upper side in the vertical direction.

接触 Further, a contact portion between the first circulation circuit 100 and the heat transfer member 40 can be arranged in the regions indicated by the arrows B and C. In this case, the liquid-phase thermosiphon refrigerant condensed in the heat transfer member 40 is introduced into the cooler 14 through a different path from the gas-phase thermosiphon refrigerant flowing out of the outlet 142 of the cooler 14. . Therefore, cooling of the target device is promoted.

In addition, also about the area | region where the heat exchanger 18 for parking at the time of each said embodiment is arrange | positioned, similarly to the area | region between the uppermost part of the return piping 102 shown by the arrow B and the condenser 16, the 1st circulation circuit 100 It is preferable to arrange a contact portion with the heat transfer member 40. In addition, the first circulation circuit 100 and the heat transfer member 40 are located above and below the target liquid level of the refrigerant for the thermosiphon indicated by the arrow C, and in a region between the condenser 16 and the connection portion between the return pipe 102. It is preferable to arrange the contact portions of the above.

Also, it is preferable that the condenser 16 be vertically above the target liquid level of the thermosiphon refrigerant when the first circulation circuit 100 is filled with the thermosiphon refrigerant.

In the present embodiment, the heat transfer member 40 for transferring the heat of the thermosyphonic refrigerant flowing in the return pipe 102 to the first connection pipe 201 is provided. A heat transfer member 40 for transferring the heat of the medium may be provided.

(Seventeenth embodiment)
The device temperature controller according to the seventeenth embodiment will be described with reference to FIGS. In the present embodiment, the second circulation circuit 200 has a bypass pipe 206 through which the refrigerant for the refrigeration cycle flows so as to bypass the compressor 23. Further, the bypass pipe 206 is provided with a bypass channel opening / closing section 36 that opens and closes a channel formed by the bypass pipe 206. When the operation of the compressor 23 is stopped, the bypass thermostat opening / closing section 36 is controlled to be in an open state, and the refrigerant for the refrigeration cycle evaporated in the condenser 16 circulates through the bypass pipe 206. A siphon is configured.

Next, the control of the ECU 50 will be described with reference to FIG. The ECU 50 periodically performs the processing shown in FIG.

First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input. Here, when the signal for instructing to turn off the refrigeration cycle is not input, the ECU 50 controls the bypass flow path opening / closing section 36 so that the compressor 23 is normally operated and the switching to the loop thermosiphon is not performed in S402. I do. Specifically, the bypass flow path opening / closing section 36 is controlled so as to be in the valve closed state. Thus, the refrigerant for the refrigeration cycle compressed by the compressor 23 circulates in the circulation circuit 200.

Here, when it is determined that the target device needs to be cooled, the ECU 50 stops the operation of the compressor 23 and controls the bypass flow passage opening / closing unit 36 to switch to the loop thermosiphon in S404. Specifically, the bypass passage opening / closing section 36 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

Therefore, even if the compressor 23 stops operating, the refrigerant for the refrigeration cycle circulates in the second circulation circuit 200 through the bypass pipe 206 so as to bypass the condenser 16. Therefore, the cooling of the target device by the cooler 14 is continued.

If it is determined in step S100 that cooling of the target device is not necessary, the ECU 50 stops the operation of the compressor 23 and controls the bypass passage opening / closing unit 36 in step S402 so as not to switch to the loop thermosiphon. And returns to the main routine. Specifically, the bypass flow path opening / closing section 36 is controlled so as to be in the valve closed state. As a result, the circulation of the refrigerant for the refrigeration cycle is hindered by the compressor 23, so that the circulation circuit 200 does not function as a loop-type thermosiphon, so that the cooling of the target device by the cooler 14 is not promoted.

(Eighteenth embodiment)
The device temperature controller according to the eighteenth embodiment will be described with reference to FIG. The device temperature controller of the present embodiment includes a heat transfer member 40 that transfers heat of the thermosiphon refrigerant flowing through the return pipe 102 to the first connection pipe 201. Further, in the present embodiment, the second circulation circuit 200 includes the bypass pipe 206 through which the refrigerant for the refrigeration cycle flows so as to bypass the compressor 23. Further, the bypass pipe 206 is provided with a bypass channel opening / closing section 36 that opens and closes a channel formed by the bypass pipe 206. When the operation of the compressor 23 is stopped, the bypass channel opening / closing unit 36 is controlled to be in an open state, and the refrigerant for the refrigeration cycle evaporated in the condenser 16 circulates through the bypass pipe 206. A siphon is configured.

Note that the control of the ECU 50 is the same as the process shown in FIG. 25, and thus the details thereof are omitted here.

When operating the compressor 23, the high-temperature and high-pressure refrigerant flows through the first connection pipe 201, so that the thermosiphon refrigerant receives heat via the heat transfer member 40. However, since the contact portion between the first circulation circuit 100 and the heat transfer member 40 is arranged in the region indicated by the arrow A in FIG. 23, the liquid-phase thermosiphon refrigerant condensed in the condenser 16 is again discharged. There is no fear of evaporation. Therefore, it is possible to suppress a decrease in cooling performance when the compressor 23 is operated.

In addition, even if the contact part of the 1st circulation circuit 100 and the heat transfer member 40 is arrange | positioned in the area | region between the uppermost part of the return piping 102 shown by the arrow B of FIG. It is possible to suppress a decrease in the cooling performance when activated.

(19th embodiment)
A device temperature controller according to a nineteenth embodiment will be described with reference to FIG. The device temperature controller of the present embodiment includes an evaporator 51 for air conditioning, a blower 52 for air conditioning, an expansion valve 53 for air conditioning, and a compressor 54 for air conditioning. Further, the condenser 21 of the present embodiment is configured as an air conditioning condenser.

(4) The air conditioning evaporator 51, the air conditioning blower 52, the air conditioning expansion valve 53, the air conditioning compressor 54, and the condenser 21 constitute an air conditioning refrigeration cycle.

When the air conditioning compressor 54 starts operating, the refrigerant for the refrigeration cycle compressed by the air conditioning compressor 54 is radiated by the condenser 21. Then, the refrigerant for the refrigeration cycle flowing out of the condenser 21 is depressurized by the air conditioning expansion valve 53 and flows into the condenser 16. Then, the refrigeration cycle refrigerant flowing into the condenser 16 is compressed again by the air conditioning compressor 54.

When the air conditioning compressor 54 stops operating, the refrigerant for the refrigeration cycle inside the air conditioning evaporator 51 is condensed by the cooled air in the passenger compartment. At this time, the expansion valve 30 and the air-conditioning expansion valve 53 are controlled as shown in FIG. 3, so that the condensed liquid-phase refrigeration cycle refrigerant flows into the condenser 16. Thus, the inflow of the refrigerant for the refrigeration cycle from the air conditioner evaporator 51 to the condenser 16 is promoted.

The device temperature controller of the present embodiment includes the air conditioning evaporator 51, and when the compressor 54 stops operating, the flow of the refrigeration cycle refrigerant from the air conditioning evaporator 51 to the condenser 16 is promoted. It has a configuration. On the other hand, instead of the air-conditioning evaporator 51, a water-refrigerant heat exchanger that cools the equipment to be cooled by heat exchange between the cooling water and the refrigerant for the refrigeration cycle may be provided. Then, when the operation of the compressor 54 is stopped, the flow of the refrigerant for the refrigeration cycle from the water refrigerant heat exchanger to the condenser 16 may be promoted.

(Twentieth embodiment)
A device temperature control device according to a twentieth embodiment will be described with reference to FIG. When the operation of the compressor 23 is stopped, the first heat medium of the first circulation circuit has substantially the same temperature as the secondary battery. Therefore, the temperature of the thermosiphon refrigerant in the primary side circuit 16a in the condenser becomes substantially the same as that of the target device. On the other hand, when the operation of the compressor 23 is stopped, the condenser of the second circulation circuit is cooled to the outside air.

{Here, when the battery temperature is higher than the outside air temperature, the condenser that has received the thermosiphon refrigerant in the first circulation circuit} has a higher temperature than the outside air temperature. On the other hand, the condenser is cooled to the outside air temperature. Therefore, condensation occurs in the refrigerant for the refrigeration cycle in the condenser. In addition, when the other components of the refrigeration cycle 20 except for the condenser 21 are higher than the temperature of the condenser which is substantially equal to the outside air temperature, the refrigeration cycle refrigerant evaporates from the other components and the refrigeration cycle The phenomenon of refrigerant condensation tends to occur. In particular, when the outside air temperature is lower than in the daytime, such as in the evening or at night during parking, the above-described event occurs.

機器 In the device temperature control device of the present embodiment, the compressor 23 is disposed so as to be in contact with the heat capacity member 230 that can store the heat generated by the compressor 23. The heat capacity member 230 of the present embodiment is made of a metal member such as copper and aluminum. Therefore, the temperature of the compressor 23 tends to be maintained higher than the temperature of the condenser 21.

By arranging the compressor 23 in contact with the heat capacity member 230 capable of storing heat generated by the compressor 23 in this manner, even when the operation of the compressor 23 is stopped, more Can be evaporated. Therefore, since more refrigerant for the refrigeration cycle can be condensed in the condenser 21, the target device can be further cooled.

Note that, for example, an internal combustion engine of a vehicle, a body of a vehicle, a frame of a vehicle, or the like may be used as the heat capacity member 230.

(Twenty-first embodiment)
A device temperature controller according to a twenty-first embodiment will be described with reference to FIG. The device temperature controller of each of the above embodiments is arranged such that when the compressor 23 stops operating, the flow of the refrigeration cycle refrigerant from the condenser 21 to the condenser 16 is promoted. On the other hand, in the apparatus temperature controller of the present embodiment, the return pipe 102 for introducing the refrigerant for thermosiphon flowing out of the cooler 14 into the condenser 16 has a heat transfer path for cooling the return pipe 102 by heat transfer. It is in contact with the member 41.

That is, the device temperature controller of the present embodiment includes the heat transfer member 41 that transfers the heat of the thermosiphon refrigerant flowing through the return pipe 102 to the condenser 21.

In the device temperature controller of the present embodiment, the heat of the thermosiphon refrigerant flowing through the return pipe 102 is transferred to the condenser 21 cooled by the outside air via the heat transfer member 41, The refrigerant is condensed.

Therefore, even when the compressor 23 stops operating, the refrigerant for the thermosiphon flowing through the return pipe 102 is condensed, and the condensed refrigerant for the thermosiphon flows into the cooler 14 and cools the target device by the cooler 14. Can be continued.

batteries

12a and 12b as the target devices is adjusted by the phase change between the liquid phase and the gas phase of the thermosyphon refrigerant. Further, a second circulation circuit 200 for circulating the refrigerant for the refrigeration cycle and a compressor 23 for compressing and discharging the refrigerant for the refrigeration cycle inside the second circulation circuit 200 are provided. A condenser 21 for exchanging heat between the refrigeration cycle refrigerant and air discharged from the compressor 23 to radiate heat of the refrigeration cycle refrigerant; an expansion valve 30 for decompressing the refrigeration cycle refrigerant flowing out of the condenser 21; It has.

Further, the first circulation circuit 100 has a return pipe 102 for introducing the thermosiphon refrigerant flowing out of the cooler 14 into the condenser 16. The return pipe 102 is for cooling the return pipe 102 by heat transfer. It is in contact with heat transfer member 41.

According to such a configuration, even when the compressor 23 stops operating, the thermosyphonic refrigerant flowing through the return pipe 102 is cooled by the heat transfer member 41, and the cooled thermosiphonic refrigerant is supplied to the cooler 14. be introduced. Therefore, even when the compressor 23 stops operating, the device to be cooled can be further cooled.

When the compressor 23 is operated, the high-temperature high-pressure refrigerant flowing through the condenser 21 or the outside air when the outside air temperature is higher than the temperature of the thermosiphon refrigerant causes the thermosiphon refrigerant to receive heat through the heat transfer member 41. I do. However, the contact portion between the first circulation circuit 100 and the heat transfer member 41 is located above and below the target liquid level of the thermosiphon refrigerant shown by the arrow A in FIG. It is arranged in the area on the 14 side. For this reason, there is no concern that the liquid-phase thermosiphon refrigerant condensed in the condenser 16 evaporates again. Therefore, it is possible to suppress a decrease in cooling performance when the compressor 23 is operated.

In addition, even if the contact part of the 1st circulation circuit 100 and the heat transfer member 41 is arrange | positioned in the area | region between the uppermost part of the return piping 102 shown by the arrow B of FIG. It is possible to suppress a decrease in the cooling performance when activated.

In the present embodiment, the return pipe 102 is in contact with the heat transfer member 41 for cooling by heat transfer. However, at least one portion of the first circulation circuit has a heat transfer member for cooling by heat transfer. 41 may be constituted.

(Twenty-second embodiment)
An appliance temperature controller according to a twenty-second embodiment will be described with reference to FIG. The device temperature control device of the present embodiment includes a bypass flow path 104 for bypassing the condenser 16 for the refrigerant for thermosiphon, and an on-off valve 35 for opening and closing a flow path formed by the bypass flow path 104. . Further, a heat transfer member 41 that transfers heat of the thermosiphon refrigerant flowing through the bypass flow path 104 to the condenser 21 is provided.

機器 In the device temperature control device of the present embodiment, the on-off valve 35 is controlled so that the valve is opened when it is determined by the ECU (not shown) that cooling is necessary. At this time, the heat of the thermosiphon refrigerant flowing in the bypass flow path 104 bypassing the condenser 16 is transferred to the condenser 21 cooled by the outside air through the heat transfer member 41, and the thermosyphonic refrigerant flowing in the bypass flow path 104 The siphon refrigerant is condensed.

(4) When the refrigerant for the thermosiphon flowing in the bypass flow path 104 condenses, it is introduced into the cooler 14 through the outward pipe 101.

{Circle around (5)} When the ECU (not shown) determines that cooling is not necessary, the on-off valve 35 is controlled to be in the closed state. Therefore, the thermosiphon refrigerant evaporated by the cooler 14 is introduced into the condenser 16 and is condensed inside the condenser 16.

In the present embodiment, the on-off valve 35 is arranged on the upstream side of the flow of the thermosiphon refrigerant from the contact portion between the bypass passage 104 and the heat transfer member 41. The on-off valve 35 may be arranged downstream of the flow of the thermosiphon refrigerant.

(Twenty-third embodiment)
The device temperature controller according to the twenty-third embodiment will be described with reference to FIG. The cooler 14 of the present embodiment has a heat exchange core 14a and

tanks

14b and 14c. The tank 14c is connected to the outbound piping 101, and the tank 14b is connected to the inbound piping 102. Heat exchange core 14a is arranged between

batteries

12a and 12b.

Battery 12a and battery 12b have terminals T1 and T2, respectively. In the device temperature controller of the present embodiment, terminals T1 and T2 are arranged on the side surfaces of the

batteries

12a and 12b.

(4) Thermosyphon refrigerant is introduced from the condenser 16 into the tank 14c via the return pipe 102. The heat exchange core 14a cools the

batteries

12a and 12b by exchanging heat between the refrigerant for the refrigeration cycle and the refrigerant for the thermosiphon. At this time, the refrigerant for the thermosiphon evaporates inside the heat exchange core 14a, and the evaporated refrigerant for the thermosiphon is introduced into the condenser 16 via the return pipe 102.

(24th embodiment)
A device temperature controller according to a twenty-fourth embodiment will be described with reference to FIG. In the device temperature controller of the twelfth embodiment, terminals T1 and T2 are arranged on the side surfaces of the

batteries

12a and 12b. On the other hand, in the device temperature controller of the present embodiment, terminals T1 and T2 are arranged on the upper surfaces of the

batteries

12a and 12b.

(25th embodiment)
A device temperature controller according to a twenty-fifth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the heat exchange core 14a of the cooler 14 is arranged on the lower surfaces of the

batteries

12a and 12b. That is, the battery 12a and the battery 12b are arranged only on one surface of the heat exchange core 14a.

(Twenty-sixth embodiment)
The device temperature controller according to the twenty-sixth embodiment will be described with reference to FIG. In the device temperature controller of the present embodiment, the inlet 163 of the condenser 16 is arranged at the same height as the outlet 212 of the condenser 21. The first connection pipe 201 that connects the inlet 163 of the condenser 16 and the outlet 212 of the condenser 21 is disposed horizontally.

As described above, even if the inlet 163 of the condenser 16 is arranged so as to be at the same height as the outlet 212 of the condenser 21, when the compressor stops operating, the liquid phase condensed in the condenser 21 is reduced. The second heat medium can be promoted to flow into the condenser by gravity. Therefore, the target device can be cooled by the thermosiphon 10.

(Twenty-seventh embodiment)
An appliance temperature controller according to a twenty-seventh embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as that of the device temperature control device of the first embodiment. The device temperature controller of the present embodiment is different from the device temperature controller of the first embodiment in the processing of the ECU 50 after S104.

ＥＣＵ The ECU 50 of the present embodiment periodically executes the processing shown in FIG. First, in S100, ECU 50 determines whether or not to turn off the refrigeration cycle based on whether or not a signal for instructing to turn off the refrigeration cycle has been input.

Here, when a signal instructing to turn off the refrigeration cycle is input, the ECU 50 determines in S104 whether or not the target device needs to be cooled based on a signal from the temperature sensor that detects the temperature of the target device. judge.

Specifically, when the temperature of the target device is equal to or higher than the first threshold, the ECU 50 determines that the target device needs to be cooled, and when the temperature of the target device is lower than the first threshold, the target device needs to be cooled. It is determined that it is not.

Here, if it is determined that the target device needs to be cooled, the ECU 50 determines in S502 whether the cooling capacity needs to be increased. Specifically, when the temperature of the target device is equal to or higher than a second threshold value higher than the first threshold value, it is determined that the cooling capacity of the target device needs to be increased. If the temperature of the target device is less than the second threshold, it is determined that it is not necessary to increase the cooling capacity of the target device.

Here, if the temperature of the target device is equal to or higher than the second threshold, the ECU 50 turns on the refrigeration cycle in S504. Specifically, the compressor 23 is operated. Further, the expansion valve 30 is normally operated. Specifically, the expansion valve 30 is controlled so that the valve opening becomes a predetermined target opening, and the process returns to the main routine.

When the temperature of the target device is lower than the second threshold, the ECU 50 controls the expansion valve 30 to fully open the valve in S108 without operating the compressor 23, and proceeds to the main routine. Return.

As described above, the ECU 50 of the device temperature controller of the present embodiment determines that the compressor 23 has stopped operating, determines that the target device needs to be cooled, and determines the cooling capacity of the target device. If it is determined that the increase is necessary, the compressor 23 is operated in S504.

In other words, when it is determined that the cooling capacity of the target device needs to be increased, the first heat medium can be forced to flow into the condenser 16 and the cooling performance can be increased.

(4) If it is determined that the cooling capacity of the target device does not need to be increased, the compressor 23 is not operated, so that power for driving the compressor 23 can be prevented from being consumed.

In the present embodiment, it is determined whether the cooling capacity of the target device needs to be increased based on whether the temperature of the target device is equal to or higher than the second threshold. On the other hand, when an increase in the cooling capacity of the target device is instructed from a user operation, it may be determined that the cooling capability of the target device needs to be increased.

(Twenty-eighth embodiment)
An appliance temperature controller according to a twenty-eighth embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control device of the fourth embodiment. The device temperature control device of the present embodiment is different from the device temperature control device of the tenth embodiment in the processing of the ECU 50 after S104.

Here, if the temperature of the target device is equal to or higher than the second threshold, the ECU 50 turns on the refrigeration cycle in S604. Specifically, the compressor 23 is operated. Further, the valve 32 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

If the temperature of the target device is lower than the second threshold, the ECU 50 controls the valve 32 to fully open the valve in S112 without operating the compressor 23, and returns to the main routine. .

As described above, the ECU 50 of the device temperature controller of the present embodiment determines that the compressor 23 has stopped operating, determines that the target device needs to be cooled, and determines the cooling capacity of the target device. If it is determined that the increase is necessary, the compressor 23 is operated in S304.

(Twenty-ninth embodiment)
A device temperature controller according to a twenty-ninth embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as that of the device temperature control device of the sixth embodiment. The device temperature controller of the present embodiment is different from the device temperature controller of the sixth embodiment in the processing of the ECU 50 after S104.

Here, if the temperature of the target device is equal to or higher than the second threshold, the ECU 50 turns on the refrigeration cycle in S704. Specifically, the compressor 23 is operated. Further, the on-off valve 32 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

If the temperature of the target device is lower than the second threshold value, the ECU 50 controls the on-off valve 32 to fully open the valve in S206 without operating the compressor 23, and proceeds to the main routine. Return.

(Thirtieth embodiment)
An appliance temperature controller according to a thirtieth embodiment will be described with reference to FIG. The configuration of the device temperature controller of the present embodiment is the same as the device temperature controller of the eighth embodiment. The device temperature controller of the present embodiment is different from the device temperature controller of the sixth embodiment in the processing of the ECU 50 after S104.

Here, if the temperature of the target device is equal to or higher than the second threshold, the ECU 50 turns on the refrigeration cycle in S804. Specifically, the compressor 23 is operated. Further, the on-off valve 32 is controlled so as to fully open the valve so that the refrigerant for the refrigeration cycle does not flow to the heat exchanger 18 for parking, and the on-off valve 34 is controlled so that the valve is fully closed, Return to the main routine.

If the temperature of the target device is lower than the second threshold, the ECU 50 operates the valve 32 to flow the refrigeration cycle refrigerant to the parking heat exchanger 18 in S305 without operating the compressor 23. 34 is controlled. Specifically, the valve 32 is controlled so that the valve opening is fully closed, the on-off valve 34 is controlled such that the valve opening is fully opened, and the process returns to the main routine.

As described above, the ECU 50 of the device temperature controller of the present embodiment determines that the compressor 23 has stopped operating, determines that the target device needs to be cooled, and determines the cooling capacity of the target device. If it is determined that the increase is necessary, the compressor 23 is operated in S804.

(Thirty-first embodiment)
The device temperature controller according to the thirty-first embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control devices of the first and 27th embodiments. The device temperature controller of the present embodiment is different from the above-described twenty-seventh embodiment in the processing of the ECU 50 after S502.

(4) In S502, the ECU 50 determines whether it is necessary to increase the cooling capacity. Specifically, when the temperature of the target device is equal to or higher than the threshold, it is determined that the cooling capacity of the target device needs to be increased, and when the temperature of the target device is lower than the threshold, the cooling capability of the target device does not need to be increased. Is determined.

Here, if the temperature of the target device is equal to or higher than the threshold, the ECU 50 determines in S506 whether or not to permit an increase in the cooling capacity of the target device. For example, when the target device is the

secondary batteries

12a and 12b, when it is estimated that the

secondary batteries

12a and 12b are being charged or the charging of the

secondary batteries

12a and 12b is started, the cooling capacity of the target device is increased. It is determined to be permitted.

If the

secondary batteries

12a and 12b are not being charged, or if it is estimated that the charging of the

secondary batteries

12a and 12b will not be started, it is determined that the increase in the cooling capacity of the target device is not permitted.

Here, if it is estimated that the

secondary batteries

12a and 12b are being charged or that the charging of the

secondary batteries

12a and 12b is to be started, the ECU 50 turns on the refrigeration cycle in S504. Specifically, the compressor 23 is operated. Further, the on-off valve 35 is controlled so that the expansion valve 30 operates normally, and the process returns to the main routine.

When the

secondary batteries

12a and 12b are not being charged or when it is estimated that the charging of the

secondary batteries

12a and 12b is not started, the ECU 50 does not turn on the refrigeration cycle, and in S508, The on-off valve 35 is controlled so that the valve opening is fully opened. Then, the process returns to the main routine.

As described above, when it is determined in S502 that the cooling capacity of the target device needs to be increased, the ECU 50 of the device temperature control device of the present embodiment increases the cooling capability of the target device in S506. It is determined whether to permit.

{Circle around (4)} In S506, when the permission determining unit determines that the increase of the cooling capacity of the target device is permitted, the compressor 23 is operated in S504. That is, when it is determined that the increase of the cooling capacity of the target device is permitted, the first heat medium can be forced to flow into the condenser 16 and the cooling performance can be increased.

(4) When it is not determined that the increase of the cooling capacity of the target device is permitted, the compressor 23 is not operated, so that the power for driving the compressor 23 can be prevented from being consumed.

In addition, the ECU 50 of the device temperature controller of the present embodiment, when estimating that the

secondary batteries

12a and 12b are being charged or that the charging of the

secondary batteries

12a and 12b is to be started, increases the cooling capacity of the target device. It is determined to be permitted. Therefore, since power for driving the compressor 23 can be secured, it is possible to suppress a decrease in the cruising distance due to the

secondary batteries

12a and 12b during the next traveling.

(Thirty-second embodiment)
A device temperature controller according to a thirty-second embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control devices of the sixth and 29th embodiments. The device temperature controller of the present embodiment is different from the above-described twenty-ninth embodiment in the processing of the ECU 50 after S502.

secondary batteries

12a and 12b, when it is estimated that the

secondary batteries

12a and 12b are being charged or the charging of the

secondary batteries

If the

secondary batteries

Here, if it is estimated that the

secondary batteries

12a and 12b are being charged or that the charging of the

secondary batteries

12a and 12b is to be started, the ECU 50 turns on the refrigeration cycle in S604. Specifically, the compressor 23 is operated. Further, the on / off valve 32 is controlled so that the valve is fully opened, and the process returns to the main routine.

When the

secondary batteries

12a and 12b is not started, the ECU 50 does not turn on the refrigeration cycle, and in S508, The on-off valve 32 is controlled so that the valve opening is fully closed. Then, the process returns to the main routine.

{Circle around (4)} In S506, when the permission determination unit determines that the increase of the cooling capacity of the target device is permitted, the compressor 23 is operated in S604. That is, when it is determined that the increase of the cooling capacity of the target device is permitted, the first heat medium can be forced to flow into the condenser 16 and the cooling performance can be increased.

secondary batteries

12a and 12b are being charged or that the charging of the

secondary batteries

12a and 12b during the next traveling.

(Thirty-third embodiment)
An appliance temperature controller according to a thirty-third embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control devices of the sixth, 29th, and 32nd embodiments. In the twenty-ninth embodiment, in S100, the ECU 50 determines whether or not to turn off the refrigeration cycle. If it is determined that the refrigeration cycle is to be turned off, the processing from S104 is performed. In contrast, in the present embodiment, in S1001, the ECU 50 determines whether or not the vehicle has stopped traveling, and if it is determined that the vehicle has stopped traveling, performs the processing from S104.

First, in S1001, the ECU 50 determines whether or not the vehicle has stopped traveling. Here, when the vehicle is running, the process returns to the main routine without performing any special processing. When the vehicle has stopped traveling, the ECU 50 determines in S104 whether the target device needs to be cooled. Here, when it is determined that cooling of the target device is not necessary, the ECU 50 turns off the refrigeration cycle in S2081. Specifically, the compressor 23 is stopped. Further, the on / off valve 32 is controlled so that the valve opening is fully closed, and the process returns to the main routine.

{Circle around (5)} In S104, when it is determined that the target device needs to be cooled, the ECU 50 determines in S502 whether it is necessary to increase the cooling capacity. Here, when it is determined that it is not necessary to increase the cooling capacity, the ECU 50 turns off the refrigeration cycle in S2061. Specifically, the compressor 23 is stopped. Further, the on-off valve 32 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

If it is determined in S502 that the cooling capacity needs to be increased, the ECU 50 turns on the refrigeration cycle in S7041. Specifically, the compressor 23 is operated. Further, the on-off valve 32 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

As described above, the ECU 50 determines that the vehicle is stopped, determines that the target device needs to be cooled, and determines that the cooling capacity needs to be increased. Then, the on-off valve 32 is controlled so that the refrigeration cycle is turned on and the valve opening is fully opened. Therefore, the first heat medium can be forced to flow into the condenser 16, and the cooling performance can be increased.

(34th embodiment)
An appliance temperature controller according to a thirty-fourth embodiment will be described with reference to FIG. The configuration of the device temperature control device of the present embodiment is the same as the device temperature control devices of the sixth, 29th, 32nd, and 33rd embodiments. In the thirty-second embodiment, in S100, the ECU 50 determines whether or not to turn off the refrigeration cycle. If it is determined that the refrigeration cycle is to be turned off, the processing from S104 is performed. In contrast, in the present embodiment, in S1001, the ECU 50 determines whether or not the vehicle has stopped traveling, and if it is determined that the vehicle has stopped traveling, performs the processing from S104.

{Circle around (5)} In S502, when it is determined that the cooling capacity needs to be increased, the ECU 50 determines in S506 whether to allow the cooling capacity of the target device to be increased. Here, if it is determined that the increase in the cooling capacity of the target device is not permitted, the ECU 50 controls the on-off valve 32 to turn off the refrigeration cycle and fully open the valve opening in S5081 as in S2061. I do. On the other hand, when it is determined that the increase of the cooling capacity of the target device is permitted, the ECU 50 turns on the refrigeration cycle in S7041. Specifically, the compressor 23 is operated. Further, the on-off valve 32 is controlled so that the valve opening is fully opened, and the process returns to the main routine.

As described above, it is determined that the vehicle is stopped, it is determined that cooling of the target device is necessary, it is determined that the cooling capacity needs to be increased, and it is determined that the cooling capacity of the target device is allowed to increase. If so, the ECU 50 turns on the refrigeration cycle. Further, the ECU 50 controls the on-off valve 32 so that the valve opening is fully opened. Therefore, the first heat medium can be forced to flow into the condenser 16, and the cooling performance can be increased.

(Other embodiments)
(1) In the above embodiment, the cooler 14 is arranged between the

secondary batteries

12a and 12b as shown in FIG. 2, but the arrangement is not limited to this.

(2) In the above-described twenty-first and twenty-second embodiments, the heat transfer member 41 is disposed so as to transfer heat to the condenser 21 cooled by outside air, but is not limited thereto. The heat may be directly or indirectly transferred to a place cooled by the outside air. For example, a place easily affected by the heat of the outside air, such as a vehicle body, may be used.

The heat may be transferred to a place where the temperature is likely to be lower than that of the

secondary batteries

12a and 12b. For example, an air-conditioning evaporator, a water-refrigerant heat exchanger that cools a device to be cooled by heat exchange with a refrigerant for a refrigeration cycle, or a vehicle cabin may be provided on a path through which dew condensation water generated in the air-conditioning evaporator is discharged.

密度 In the vehicle cabin, the lower the air temperature, the higher the density. Therefore, the lower the height in the vehicle cabin, the lower the temperature. Therefore, it is desirable to arrange the heat transfer member 41 so that heat is transferred to a place lower than the place where the battery is installed.

(3) In the above-described twenty-first and twenty-second embodiments, the heat transfer member 41 is in contact with the return pipe 102 of the first circulation circuit 100, but is not limited thereto. If the heat transfer member 41 and the gas-phase refrigerant can be heat-exchanged by contacting any one of the region indicated by the arrow A, the region indicated by the arrow B, and the region indicated by the arrow C in FIG. 12b can be cooled.

(4) In the above embodiment, the device temperature control device is used for an electric vehicle or a hybrid, but is not limited to this. For example, it may be used for an idle stop car or a coasting car using a secondary battery. Even when the compressor is used in the above-described vehicle, the same effect can be obtained when the operation of the compressor is stopped.

Note that the present disclosure is not limited to the above-described embodiment, and can be appropriately modified. The above embodiments are not irrelevant to each other, and can be appropriately combined unless a combination is clearly not possible. In each of the above embodiments, it is needless to say that elements constituting the embodiments are not necessarily essential, unless otherwise clearly indicated as essential or in principle considered to be clearly essential. No. In each of the above embodiments, when a numerical value such as the number, numerical value, amount, range, or the like of the constituent elements of the exemplary embodiment is mentioned, it is particularly limited to a specific number when it is clearly stated that it is essential and in principle The number is not limited to the specific number unless otherwise specified. Further, in each of the above embodiments, when referring to the material, shape, positional relationship, and the like of the components and the like, unless otherwise specified, and in principle, it is limited to a specific material, shape, positional relationship, and the like. However, the material, shape, positional relationship, and the like are not limited.

(Summary)
According to a first aspect described in part or all of the above embodiments, the device temperature control device includes a thermosiphon having a first circulation circuit that circulates a first heat medium, and a first heat medium. The temperature of the target device is adjusted by the phase change between the liquid phase and the gas phase. Further, the device temperature control device includes a second circulation circuit that circulates the second heat medium, a compressor that compresses and discharges the second heat medium, and a heat radiation device that exchanges heat with the discharged second heat medium. The refrigeration cycle includes a heat exchanger and an expansion valve for reducing the pressure of the second heat medium from the heat exchanger for heat radiation. In addition, the thermosiphon is provided in the first circulation circuit, and includes a device heat exchanger configured to be able to exchange heat between the target device and the second heat medium such that the first heat medium evaporates when the target device is cooled. Have. In addition, there is provided a condenser for exchanging heat between the second heat medium depressurized by the expansion valve and the first heat medium evaporated by the equipment heat exchanger to condense the first heat medium.

Further, the condenser has an inlet for flowing in the second heat medium, and an outlet for flowing out the second heat medium, and the heat exchanger for heat dissipation has an inlet for flowing in the second heat medium; And an outlet for flowing out the second heat medium.

In addition, the second circulation circuit includes a first connection pipe that connects between an outlet of the heat-radiating heat exchanger and an inlet of the condenser, and a first connection pipe that connects the outlet of the condenser and the inlet of the heat-radiating heat exchanger. And a second connection pipe connecting between them. When the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted.

Further, according to the second aspect, the device temperature control device is arranged such that when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted. I have. Therefore, when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted, and the device to be cooled can be further cooled.

According to the third aspect, the inlet of the condenser is arranged below the outlet of the heat exchanger for heat radiation in the up-down direction, so that when the compressor stops operating, the heat is released. The flow of the second heat medium from the heat exchanger to the condenser is promoted, and the device to be cooled can be further cooled.

According to the fourth aspect, the inlet of the condenser is arranged at the same height as the outlet of the heat exchanger for heat radiation. Thus, even if the inlet of the condenser is arranged at the same height as the outlet of the heat exchanger for heat dissipation, the liquid phase condensed in the heat exchanger for heat dissipation when the compressor stops operating Can be promoted to flow into the condenser by gravity.

According to the fifth aspect, the inflow port of the condenser is disposed below the compressor, the heat-radiating heat exchanger, and the expansion valve that constitute the refrigeration cycle, in the vertical direction. Therefore, when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted, and the device to be cooled can be further cooled.

According to the sixth aspect, the first connection pipe is provided between the outlet of the heat-dissipating heat exchanger and the inlet of the condenser without passing vertically above the outlet of the heat-dissipating heat exchanger. Are connected. Therefore, when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted, and the device to be cooled can be further cooled.

According to the seventh aspect, the first connection pipe is arranged so as to be inclined downward in the up-down direction as it approaches the inlet of the condenser from the outlet of the heat exchanger for heat dissipation. Therefore, when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted, and the device to be cooled can be further cooled.

According to the eighth aspect, the inlet of the condenser is disposed below the target liquid level of the second heat medium when the second circulation medium is filled with the second heat medium, in the vertical direction. I have. Therefore, when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted, and the device to be cooled can be further cooled.

According to the ninth aspect, the outlet of the condenser is arranged vertically above the inlet of the second condenser, and the second heat medium flowing from the inlet of the condenser is arranged vertically upward. And flows out of the outlet of the condenser.

Therefore, when the compressor stops operating, the liquid phase second heat medium flowing into the condenser evaporates inside the condenser and becomes more dischargeable when gasified, so that the heat exchange of the condenser is improved. The efficiency is improved, and the cooling target device can be further cooled.

According to the tenth aspect, the heat-radiating heat exchanger has at least two inlets and outlets forming an inlet for flowing the second heat medium and an outlet for flowing the second heat medium. The entrances and exits of the exchanger are arranged at different positions in the vertical direction. And the 1st connection piping connects between the entrance and exit arranged in the up-and-down direction lower than the entrance and exit arranged in the up-and-down direction most among the entrances and exits of the heat exchanger for heat radiation, and the inflow of the condenser. I have.

Therefore, when the operation of the compressor is stopped, the flow of the second heat medium from the heat radiating heat exchanger to the condenser is promoted, and the device to be cooled can be further cooled.

According to the eleventh aspect, the condenser is disposed above and below the target liquid level of the first heat medium when the first circulation medium is filled with the first heat medium. In this manner, by disposing the condenser vertically above the target liquid level of the first heat medium when the first circulation medium is filled with the first heat medium, the condenser can efficiently operate the first heat medium. Can be condensed.

According to a twelfth aspect, the first circulation circuit has a return pipe for introducing the first heat medium flowing out of the equipment heat exchanger into the condenser.

According to such a configuration, the heat of the first heat medium flowing out of the equipment heat exchanger is transferred to the first connection pipe, and the first heat medium flowing out of the equipment heat exchanger is cooled. Condenses inside. Then, the condensed first heat medium flows into the equipment heat exchanger. Therefore, when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted, and the device to be cooled can be further cooled.

Further, according to the thirteenth aspect, the heat transfer member for transferring the heat of the first heat medium provided in the first circulation circuit to the first connection pipe is the target liquid when the thermosyphonic refrigerant is charged. It is arranged above the surface in the vertical direction. Thus, the heat transfer member exchanges heat with the gas-phase refrigerant portion in the first circulation circuit. Therefore, it is possible to further increase the cooling capacity of the device to be cooled when the operation of the compressor is stopped.

According to a fourteenth aspect, the first circulation circuit has a return pipe for introducing the first heat medium flowing out of the equipment heat exchanger into the condenser. The return pipe is provided with a heat transfer member that transfers the heat of the first heat medium flowing through the return pipe to the first connection pipe.

Accordingly, when the heat transfer member receives heat while the compressor is operating, the liquid-phase refrigerant condensed in the condenser does not evaporate again. Therefore, when the heat transfer member receives heat when the compressor operates, it is possible to prevent a decrease in the cooling capacity of the device to be cooled. In addition, it is also possible to cool the equipment to be cooled when the compressor stops operating, as described above.

According to a fifteenth aspect, the first circulation circuit has a return pipe for introducing the first heat medium flowing out of the equipment heat exchanger into the condenser. The return pipe is provided with a heat transfer member that transfers the heat of the first heat medium flowing through the return pipe to the first connection pipe.

According to the sixteenth aspect, the device temperature control device is disposed on a path connecting the heat radiation heat exchanger and the condenser, and opens and closes a path connecting the heat radiation heat exchanger and the condenser. It has a route opening / closing part. In addition, a cooling determination unit that determines whether cooling of the target device is necessary based on the temperature of the target device is provided. Further, an expansion valve opening control unit that opens the path opening / closing unit when the compressor stops operating and the cooling determination unit determines that the target device needs to be cooled is provided.

Therefore, when the compressor stops operating and the cooling determination unit determines that the target device needs to be cooled, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted. Thus, the device to be cooled can be further cooled.

According to the seventeenth aspect, the device temperature control device closes the path opening / closing unit when the compressor stops operating and the cooling determination unit determines that cooling of the target device is not necessary. An expansion valve closing control unit is provided.

Therefore, when the compressor stops operating and the cooling determination unit determines that the cooling of the target device is not necessary, the flow of the second heat medium from the heat radiating heat exchanger to the condenser is not promoted. It is possible to stop the cooling of the device to be cooled.

According to an eighteenth aspect, the path opening / closing part is an electric expansion valve. As described above, the path opening / closing unit can be configured by the electric expansion valve.

According to the nineteenth aspect, the compressor is arranged to be in contact with a heat capacity member capable of storing heat generated by the compressor. In this way, by arranging the compressor to be in contact with a heat capacity member capable of storing heat generated by the compressor, even when the operation of the compressor is stopped, more refrigeration cycles are used. The refrigerant can be evaporated, and the target device can be further cooled.

According to a twentieth aspect, the heat-radiating heat exchanger is mounted on a vehicle, and the heat-radiating heat exchanger exchanges heat between the second heat medium discharged from the compressor and the outside air of the vehicle. (2) An outside air heat exchanger that radiates heat of the heat medium. As described above, the heat-radiating heat exchanger can also be constituted by an external-air heat exchanger that exchanges heat between the second heat medium discharged from the compressor and the outside air of the vehicle and radiates heat of the second heat medium. .

According to a twenty-first aspect, the second circulation circuit has a bypass pipe through which the second heat medium flows so as to bypass the compressor, and the bypass pipe has a flow path formed by the bypass pipe. A detour channel opening / closing part that opens and closes is provided. When the compressor stops operating, the loop-type thermosiphon is controlled such that the bypass passage opening / closing unit is opened, and the second heat medium evaporated in the condenser circulates through the bypass pipe. You.

Therefore, even when the compressor stops operating, the cooling of the device to be cooled by the cooler can be continued.

According to a twenty-second aspect, the condenser is a first condenser, and when the compressor stops operating, the first condenser evaporated by the equipment heat exchanger in preference to the first condenser. A second condenser for condensing the heat medium is provided. And when a compressor stops operation | movement, it is comprised so that the inflow of the 2nd heat medium from a heat-radiation heat exchanger to a 2nd condenser may be promoted.

Therefore, even when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the second condenser is promoted, and the device to be cooled can be further cooled.

According to the twenty-third aspect, when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the second condenser is promoted. Therefore, even when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the second condenser is promoted, and the device to be cooled can be further cooled.

According to a twenty-fourth aspect, the second condenser has an inlet through which the second heat medium flows, and the inlet of the second condenser is arranged more vertically than the outlet of the heat exchanger for heat radiation. It is located on the lower side.

According to a twenty-fifth aspect, an apparatus temperature controller includes a thermosiphon having a first circulation circuit that circulates a first heat medium, and the target apparatus is controlled by a phase change between a liquid phase and a gas phase of the first heat medium. Adjust the temperature of the. At least one portion of the first circulation circuit is in contact with a heat transfer member for cooling by heat transfer.

According to the twenty-sixth aspect, the heat transfer member is in contact with at least one portion of the first circulation circuit that is above the target liquid level of the first heat medium. Thus, the heat transfer member exchanges heat with the gas-phase refrigerant portion in the first circulation circuit. Therefore, it is possible to further increase the cooling capacity of the device to be cooled when the operation of the compressor is stopped.

According to a twenty-seventh aspect, an apparatus temperature controller includes a second circulation circuit that circulates a second heat medium, a compressor that compresses a second heat medium, and a compressor that compresses the second heat medium and air. A refrigeration cycle having a heat exchanger for heat exchange for heat exchange and an expansion valve for reducing the pressure of the second heat medium is provided. In addition, the thermosiphon is provided in the first circulation circuit, and includes a device heat exchanger configured to be able to exchange heat between the target device and the second heat medium such that the first heat medium evaporates when the target device is cooled. Have. Further, a condenser is provided for exchanging heat between the second heat medium depressurized by the expansion valve and the first heat medium evaporated by the equipment heat exchanger to condense the first heat medium. Further, the first circulation circuit has a return pipe for introducing the first heat medium flowing out of the equipment heat exchanger into the condenser, and the heat transfer member is in contact with the return pipe.

According to the twenty-eighth aspect, the device temperature controller includes the cooling determination unit that determines whether the target device needs to be cooled. In addition, there is provided a capacity increase determination unit that determines whether the cooling capacity of the target device needs to be increased.

Further, when the cooling determination unit determines that the target device needs to be cooled and the capacity increase determination unit determines that the cooling capability of the target device needs to be increased, the compressor operation for operating the compressor is performed. It has a part.

Therefore, even when it is determined that the cooling of the target device is necessary, the compressor operating unit determines whether the cooling capacity of the target device needs to be increased by the capacity increase determination unit. The first heat medium can be forced to flow in, and the cooling performance can be increased.

According to the twenty-ninth aspect, the cooling determination unit determines that the target device needs to be cooled when the temperature of the target device is equal to or higher than the first threshold, and determines that the temperature of the target device is lower than the first threshold. In this case, it is determined that cooling of the target device is not necessary.

In addition, when the temperature of the target device is equal to or higher than a second threshold value higher than the first threshold value, the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, and the temperature of the target device becomes the second threshold value. If less than, it is determined that it is not necessary to increase the cooling capacity of the target device.

Thus, when the temperature of the target device is equal to or higher than the first threshold, the cooling determination unit determines that the target device needs to be cooled, and the capacity increase determination unit determines that the temperature of the target device is lower than the first threshold. If it is equal to or higher than the high second threshold, it is preferable to determine that the cooling capacity of the target device needs to be increased.

According to the thirtieth aspect, when the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, the permission determination for determining whether to permit the increase of the cooling capacity of the target device is performed. It has a part.

{Circle around (4)} When the permission determining unit determines that the increase in the cooling capacity of the target device is permitted, the compressor operating unit operates the compressor.

As described above, it is determined whether or not the increase in the cooling capacity of the target device is permitted. If it is determined that the increase in the cooling capability of the target device is permitted, the compressor can be operated.

According to the thirty-first aspect, the target device is a secondary battery that supplies power to the compressor, and the permission determination unit determines that the secondary battery is being charged or that the charging of the secondary battery is started. When it is estimated, it is determined that the increase of the cooling capacity of the target device is permitted. Therefore, since electric power for driving the compressor 23 can be secured, it is possible to suppress a decrease in the cruising distance due to the secondary battery in the next traveling.

Note that the processing of S504, S604, S704, and S804 corresponds to a compressor operating unit. Further, the condenser 21 corresponds to an outside air heat exchanger that exchanges heat between the second heat medium discharged from the compressor 23 and the outside air of the vehicle and radiates heat of the second heat medium. Further, the processing of S502 corresponds to a capacity increase determination unit, the processing of S112 corresponds to an expansion valve opening control unit, the processing of S114 corresponds to an expansion valve closing control unit, and the processing of S104 corresponds to a cooling determination unit. .

Claims

A thermosiphon (10) having a first circulation circuit (100) for circulating a first heat medium is provided, and a temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase and a gas phase of the first heat medium. Device temperature control device,
A second circulation circuit (200) for circulating a second heat medium, a compressor (23) for compressing and discharging the second heat medium inside the second circulation circuit, and a compressor (23) discharged from the compressor. A heat-dissipating heat exchanger (21) for exchanging heat with the second heat medium and air to dissipate heat of the second heat medium; and an expansion valve for decompressing the second heat medium flowing out of the heat-dissipating heat exchanger. (30, 31), and a refrigeration cycle (20) having
The thermosiphon,
A device heat exchanger (14) that is arranged in the first circulation circuit and configured to allow heat exchange between the target device and the second heat medium such that the first heat medium evaporates when the target device is cooled. )When,
A condenser (16) for exchanging heat between the second heat medium depressurized by the expansion valve and the first heat medium evaporated by the equipment heat exchanger to condense the first heat medium. And
The condenser has an inlet (163) through which the second heat medium flows, and an outlet (164) through which the second heat medium flows,
The heat-radiating heat exchanger has an inlet (211) through which the second heat medium flows, and an outlet (212) through which the second heat medium flows,
The second circulation circuit includes a first connection pipe (201) that connects the outlet of the heat exchanger for heat dissipation and the inlet of the condenser, and the outlet of the condenser and the heat sink. A second connection pipe (202) for connecting with the inflow port of the heat exchanger.
An apparatus temperature control device configured to promote the flow of the second heat medium from the heat-radiating heat exchanger to the condenser when the compressor stops operating.
The device temperature control device according to claim 1, wherein when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the condenser is promoted.
The apparatus temperature controller according to claim 1 or 2, wherein the inlet of the condenser is disposed below the outlet of the heat exchanger for heat radiation in the up-down direction.
(3) The apparatus temperature controller according to claim 1 or 2, wherein the inlet of the condenser is arranged at the same height as the outlet of the heat exchanger for heat radiation.
The inflow port of the condenser is arranged below the compressor, the heat-dissipating heat exchanger, and the expansion valve that constitute the refrigeration cycle in a vertical direction. The device temperature control device according to one of the above.
The first connection pipe connects the outlet of the heat exchanger for heat radiation and the inlet of the condenser without passing through the heat exchanger for heat radiation vertically above the outlet of the heat exchanger for heat radiation. The apparatus temperature controller according to any one of claims 3 to 5, wherein:
The first connection pipe according to any one of claims 1 to 3, 5 to 6, wherein the first connection pipe is arranged to be inclined downward in the up-down direction as approaching from the outflow port of the heat radiation heat exchanger to the inflow port of the condenser. The device temperature control device according to any one of the above.
The inflow port of the condenser is arranged below a target liquid level of the second heat medium when the second circulation medium is filled with the second heat medium in a vertical direction. 8. The device temperature controller according to any one of items 7 to 7.
The outlet of the condenser is arranged vertically above the inlet of the condenser,
The said 2nd heat medium which flowed in from the said inlet of the said condenser moves up and down in the up-down direction, and it is comprised so that it may flow out of the said outlet of the said condenser. Equipment temperature controller.
The heat-radiating heat exchanger has at least two ports (213) constituting the inflow port for inflow of the second heat medium and the outflow port for outflow of the second heat medium,
The entrance and exit of the heat exchanger for heat radiation are arranged at different positions in the vertical direction,
The first connection pipe is formed between the inlet and the outlet of the condenser and the inlet and the outlet of the condenser, which are arranged at a lower side in the vertical direction than the inlet and the outlet arranged at the uppermost part in the vertical direction. The apparatus temperature controller according to any one of claims 1 to 9, wherein the devices are connected to each other.
11. The condenser according to claim 1, wherein the condenser is arranged vertically above a target liquid level of the first heat medium when the first circulation circuit is filled with the first heat medium. 12. The device temperature control device according to any one of the above.
The heat transfer member (40) that transfers heat of the first heat medium to the first connection pipe is provided in at least a part of the first circulation circuit. The device temperature controller according to the above.
The apparatus temperature control device according to claim 12, wherein the heat transfer member is provided at least at one or more locations above a target liquid level of the first heat medium.
The first circulation circuit has a return pipe (102) for introducing the first heat medium flowing out of the equipment heat exchanger into the condenser,
The device temperature control device according to claim 12 or 13, wherein the heat transfer member (40) is provided in the return pipe.
The first circulation circuit has a return pipe (102) for introducing the first heat medium flowing out of the equipment heat exchanger into the condenser,
The heat return member (40) for transmitting the heat of the first heat medium flowing through the return pipe to the ac connection pipe is provided on the return pipe. The device temperature control device according to 1.
A path opening / closing section (32) arranged on a path connecting the heat radiation heat exchanger and the condenser, and opening and closing a path connecting the heat radiation heat exchanger and the condenser;
A cooling determination unit (S104) that determines whether cooling of the target device is necessary based on the temperature of the target device;
An expansion valve opening control unit (S112) for opening the path opening / closing unit when the compressor stops operating and the cooling determination unit determines that the target device needs to be cooled; The apparatus temperature controller according to any one of claims 1 to 15, comprising:
An expansion valve closing control unit (S114) that closes the path open / close unit when the compressor stops operating and the cooling determination unit determines that cooling of the target device is unnecessary. The device temperature controller according to claim 16.
18. The device temperature controller according to claim 16, wherein the path opening / closing unit is an electric expansion valve.
19. The device temperature controller according to claim 1, wherein the compressor is arranged to be in contact with a heat capacity member capable of storing heat generated by the compressor.
The heat radiation heat exchanger is mounted on a vehicle,
The heat radiation heat exchanger is an outside air heat exchanger that exchanges heat between the second heat medium discharged from the compressor and outside air of the vehicle to radiate heat of the second heat medium. 20. The device temperature control device according to any one of items 19 to 19.
The second circulation circuit includes a bypass pipe (206) through which the second heat medium flows to bypass the compressor.
The bypass pipe is provided with a bypass channel opening / closing section (36) for opening and closing a channel formed by the bypass pipe,
When the compressor stops operating, the bypass thermostat is controlled to be in an open state, and the second heat medium evaporated in the condenser is circulated through the bypass pipe. The device temperature control device according to any one of claims 1 to 20, wherein
The condenser is a first condenser (16);
A second condenser (18) for condensing the first heat medium evaporated by the equipment heat exchanger in preference to the first condenser when the compressor stops operating;
22. The system according to claim 1, wherein when the compressor stops operating, the flow of the second heat medium from the heat-radiating heat exchanger to the second condenser is promoted. The device temperature control device according to any one of the above.
23. The device temperature control according to claim 22, wherein when the compressor stops operating, the flow of the second heat medium from the heat radiation heat exchanger to the second condenser is promoted. apparatus.
The second condenser has an inlet (183) through which the second heat medium flows,
24. The apparatus temperature control device according to claim 22, wherein the inflow port of the second condenser is disposed vertically below the outflow port of the heat exchanger for heat dissipation.
A thermosiphon (10) having a first circulation circuit (100) for circulating a first heat medium is provided, and a temperature of a target device (12a, 12b) is adjusted by a phase change between a liquid phase and a gas phase of the first heat medium. Device temperature control device,
At least one location of the first circulation circuit is in contact with a heat transfer member (41) for cooling by heat transfer.
26. The apparatus temperature controller according to claim 25, wherein the heat transfer member is in contact with at least one portion of the first circulation circuit that is above a target liquid level of the first heat medium.
A second circulation circuit (200) for circulating a second heat medium, a compressor (23) for compressing and discharging the second heat medium inside the second circulation circuit, and a compressor (23) discharged from the compressor. A heat-dissipating heat exchanger (21) for exchanging heat with the second heat medium and air to dissipate heat of the second heat medium; and an expansion valve for decompressing the second heat medium flowing out of the heat-dissipating heat exchanger. (30, 31), and a refrigeration cycle (20) having
The thermosiphon,
A device heat exchanger (14) that is arranged in the first circulation circuit and configured to allow heat exchange between the target device and the second heat medium such that the first heat medium evaporates when the target device is cooled. )When,
A condenser (16) for exchanging heat between the second heat medium decompressed by the expansion valve and the first heat medium evaporated by the equipment heat exchanger to condense the first heat medium. ,
The first circulation circuit has a return pipe (102) for introducing the first heat medium flowing out of the equipment heat exchanger into the condenser,
27. The apparatus temperature controller according to claim 25, wherein the heat transfer member is in contact with the return pipe.
A cooling determination unit (S104) for determining whether the target device needs to be cooled;
A capacity increase determination unit (S502) for determining whether the cooling capacity of the target device needs to be increased;
When the cooling determination unit determines that the target device needs to be cooled, and when the capacity increase determination unit determines that the cooling capability of the target device needs to be increased, the compressor is operated. 25. The apparatus temperature controller according to claim 1 or 24, further comprising a compressor operating section (S504, S604, S704, S804).
The cooling determination unit determines that cooling of the target device is necessary when the temperature of the target device is equal to or higher than a first threshold, and determines the target device when the temperature of the target device is lower than the first threshold. Judge that cooling is not necessary,
When the temperature of the target device is equal to or higher than a second threshold value higher than the first threshold value, the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, and the temperature of the target device is higher. The device temperature controller according to claim 28, wherein it is determined that the cooling capacity of the target device does not need to be increased when the value is less than the second threshold value.
When the capacity increase determination unit determines that the cooling capacity of the target device needs to be increased, a permission determination unit (S308) that determines whether to increase the cooling capacity of the target device is provided,
30. The device temperature control device according to claim 28, wherein the compressor operating unit operates the compressor when the permission determining unit determines that the increase of the cooling capacity of the target device is permitted.
The target device is a secondary battery that supplies power to the compressor,
31. The device according to claim 30, wherein the permission determination unit determines that an increase in cooling capacity of the target device is permitted when the secondary battery is being charged or when it is estimated that charging of the secondary battery is started. Temperature control device.