WO2020001186A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2020001186A1
WO2020001186A1 PCT/CN2019/086958 CN2019086958W WO2020001186A1 WO 2020001186 A1 WO2020001186 A1 WO 2020001186A1 CN 2019086958 W CN2019086958 W CN 2019086958W WO 2020001186 A1 WO2020001186 A1 WO 2020001186A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
metal
layer
housing
display screen
Prior art date
Application number
PCT/CN2019/086958
Other languages
English (en)
French (fr)
Inventor
周林
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020001186A1 publication Critical patent/WO2020001186A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0225—Rotatable telephones, i.e. the body parts pivoting to an open position around an axis perpendicular to the plane they define in closed position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/0404—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas the mobile station comprising multiple antennas, e.g. to provide uplink diversity
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/0413—MIMO systems
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Definitions

  • the present application relates to the field of communication technologies, and in particular, to an electronic device.
  • an electronic device When an electronic device communicates with a base station or other electronic equipment, it needs to transmit an uplink signal to the outside world through an antenna and receive a downlink signal from the outside world, so as to achieve data interaction with the base station or other electronic equipment.
  • the embodiment of the present application provides an electronic device, which can improve the flexibility of a multi-antenna design.
  • an embodiment of the present application provides an electronic device including a first casing, a second casing, a rotating shaft, a first display screen, and a rear cover.
  • the first casing communicates with the second casing.
  • the rotation shaft is connected;
  • the first display screen includes a first portion and a second portion, the first portion is mounted on the first housing, the second portion is mounted on the second housing, and the rear cover is mounted on all On the second casing, the back cover and the second portion are respectively disposed on opposite sides of the second casing;
  • a patch board is further included between the back cover and the second part, and the patch board includes a metal layer, a dielectric layer, and a metal patch layer, and the dielectric layer is disposed between the metal layer and the metal patch layer
  • a cross-sectional area of the dielectric layer is smaller than a cross-sectional area of the metal layer
  • a cross-sectional area of the metal patch layer is smaller than a cross-sectional area of the dielectric layer
  • the dielectric layer includes four dielectric substrates
  • the metal patch layer includes four metal patches, the four dielectric substrates are disposed on the metal layer at intervals, and the four metal patches are sequentially disposed on the four dielectric substrates for forming Four microstrip antennas.
  • an embodiment of the present application provides an electronic device including a first case, a second case, a rotating shaft, a first display screen, and a rear cover.
  • the first case communicates with the second case.
  • the rotation shaft is connected;
  • the first display screen includes a first portion and a second portion, the first portion is mounted on the first housing, the second portion is mounted on the second housing, and the rear cover is mounted on all On the second casing, the back cover and the second portion are respectively disposed on opposite sides of the second casing;
  • a plurality of microstrip antennas are disposed between the back cover and the second part.
  • FIG. 1 is a first schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a rear view of the electronic device shown in FIG. 1.
  • FIG. 3 is a schematic diagram of a second structure of an electronic device according to an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a chip board of an electronic device according to an embodiment of the present application.
  • FIG. 5 is a schematic top view of a chip board of an electronic device according to an embodiment of the present application.
  • FIG. 6 is a third schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 7 is a fourth schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 8 is a fifth schematic structural diagram of an electronic device according to an embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless it is specifically and specifically defined otherwise.
  • the electronic device may be a device such as a smart phone, a tablet computer, or a game device, an AR (Augmented Reality, AR) device, a car, a data storage device, an audio playback device, a video playback device, a notebook, a desktop computing device, etc. .
  • a device such as a smart phone, a tablet computer, or a game device, an AR (Augmented Reality, AR) device, a car, a data storage device, an audio playback device, a video playback device, a notebook, a desktop computing device, etc.
  • An embodiment of the present invention provides an electronic device including a first casing, a second casing, a rotating shaft, a first display screen, and a rear cover, and the first casing and the second casing are connected through the rotating shaft;
  • the first display screen includes a first portion and a second portion, the first portion is mounted on the first housing, the second portion is mounted on the second housing, and the rear cover is mounted on all On the second casing, the back cover and the second portion are respectively disposed on opposite sides of the second casing;
  • a patch board is further included between the back cover and the second part, and the patch board includes a metal layer, a dielectric layer, and a metal patch layer, and the dielectric layer is disposed between the metal layer and the metal patch layer
  • a cross-sectional area of the dielectric layer is smaller than a cross-sectional area of the metal layer
  • a cross-sectional area of the metal patch layer is smaller than a cross-sectional area of the dielectric layer
  • the dielectric layer includes four dielectric substrates
  • the metal patch layer includes four metal patches, the four dielectric substrates are disposed on the metal layer at intervals, and the four metal patches are sequentially disposed on the four dielectric substrates for forming Four microstrip antennas.
  • An embodiment of the present invention provides an electronic device including a first casing, a second casing, a rotating shaft, a first display screen, and a rear cover, and the first casing and the second casing are connected through the rotating shaft;
  • the first display screen includes a first portion and a second portion, the first portion is mounted on the first housing, the second portion is mounted on the second housing, and the rear cover is mounted on all On the second casing, the back cover and the second portion are respectively disposed on opposite sides of the second casing;
  • a plurality of microstrip antennas are disposed between the back cover and the second part.
  • a patch board is further included between the back cover and the second part, and the patch board includes a metal layer, a dielectric layer, and a metal patch layer, and the dielectric layer is disposed on the metal layer.
  • the metal patch layer, the cross-sectional area of the dielectric layer is smaller than the cross-sectional area of the metal layer, the cross-sectional area of the metal patch layer is smaller than the cross-sectional area of the dielectric layer, and the dielectric layer Including a plurality of dielectric substrates, the metal patch layer includes a plurality of metal patches, the dielectric substrates are disposed on the metal layer at intervals, and the metal patches are disposed on the dielectric substrate for forming Multiple microstrip antennas.
  • the patch plate is parallel to the back cover, and the plurality of metal patch layers are close to the back cover.
  • the plurality of metal patches are equal in size, and the plurality of dielectric substrates are equal in size.
  • a material of the metal layer includes an aluminum alloy or a titanium alloy.
  • a material of the metal patch includes an aluminum alloy or a titanium alloy.
  • the material of the dielectric substrate includes alumina ceramics.
  • the plurality of microstrip antennas are arranged at intervals in a matrix shape.
  • the number of the microstrip antennas is four.
  • the number of the microstrip antennas is eight.
  • the number of the microstrip antennas is twelve.
  • a material of the back cover includes plastic.
  • the radio frequency transceiver module includes multiple signal sources, each of which is used to generate a radio frequency signal, and each microstrip antenna is connected to one of the signal sources. .
  • each of the microstrip antennas is configured to transmit and receive radio frequency signals in a preset frequency range.
  • the preset frequency range includes 24 GHz to 100 GHz.
  • a second display screen is further installed on the first housing, and the second display screen and the first portion of the first display screen are respectively disposed in the first housing. The two opposite sides of the first casing are described.
  • the method further includes a plurality of antenna radiators for transmitting and receiving radio frequency signals in a first frequency range or a second frequency range.
  • the radio frequency signal in the first frequency range is a 4G signal.
  • the radio frequency signal in the second frequency range is a 5G signal.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the electronic device 100 includes a first casing 10, a second casing 20, a rotating shaft 30, a first display screen 40, a circuit board 50, and a battery 60.
  • the first casing 10 and the second casing 20 are rotatably connected.
  • the first casing 10 and the second casing 20 may include a display screen, a middle frame, a circuit board, a back cover and other structures arranged in a stack.
  • the first casing 10 and the second casing 20 are connected through the rotating shaft 30. That is, the first casing 10 is connected to the rotation shaft 30, and the second casing 20 is also connected to the rotation shaft 30. Therefore, both the first casing 10 and the second casing 20 can rotate around the rotating shaft 30.
  • the material of the rotating shaft 30 may include plastic or metal. Both the first casing 10 and the second casing 20 can be wound around the rotating shaft 30.
  • the first display screen 40 can be used to display information such as images and text, thereby forming a display surface of the electronic device 100.
  • the first display screen 40 may be a liquid crystal display (Liquid Crystal Display, LCD) or an organic light emitting diode display (Organic Light-Emitting Diode, OLED).
  • the first display screen 40 includes a first portion 41 and a second portion 42. Both the first part 41 and the second part 42 can implement a display function.
  • the first portion 41 is connected to the second portion 42.
  • the connection portion between the first portion 41 and the second portion 42 is a flexible screen, that is, the connection portion between the first portion 41 and the second portion 42 may be bent. Wherein, the connection may be used for displaying information or may not be used for displaying information.
  • the first display screen 40 may be a flexible screen.
  • the first portion 41 is mounted on the first casing 10, and the second portion 42 is mounted on the second casing 20. Therefore, when the first casing 10 and the second casing 20 are rotated around the rotation shaft 30, the first portion 41 and the second portion 42 of the first display screen 40 can be rotated around the rotation shaft 30 at the same time. When the first casing 10 and the second casing 20 are rotated to the same plane, the first portion 41 and the second portion 42 of the first display screen 40 are also located on the same plane, which can achieve a larger screen display effect.
  • the first casing 10 and the second casing 20 are turned inward when rotating around the rotating shaft 30, wherein the first casing 10 and the second casing 20 are both oriented along the direction
  • the display screen of the first display screen 40 is rotated on one side, that is, it can be rotated to a state where the first portion 41 and the second portion 42 of the first display screen 40 are attached to each other.
  • a circuit board 50 may be installed inside the first casing 10. Wherein, the circuit board 50 and the first portion 41 of the first display screen 40 may be stacked, that is, the circuit board 50 may be disposed below the first portion 41 of the first display screen 40.
  • the circuit board 50 may be a main board of the electronic device 100.
  • a ground point is provided on the circuit board 50 to achieve grounding of the circuit board 50.
  • a processor is integrated on the circuit board 50.
  • the circuit board 50 may also integrate one, two or other functional components such as a motor, a microphone, a speaker, a receiver, a headphone interface, a universal serial bus interface (USB interface), a camera, a distance sensor, an ambient light sensor, a gyroscope, or the like. Multiple. Meanwhile, the first display screen 40 may be electrically connected to the circuit board 50.
  • a display control circuit is disposed on the circuit board 50.
  • the display control circuit outputs a control signal to the first display screen 40 to control the first display screen 40 to display information.
  • the battery 60 may be installed inside the second case 20. Wherein, the battery 60 and the second portion 42 of the first display screen 40 may be stacked, that is, the battery 60 may be disposed below the second portion 42 of the first display screen 40.
  • the battery 60 may be electrically connected to the circuit board 50 so that the battery 60 provides power to the electronic device 100.
  • the circuit board 50 may be provided with a power management circuit.
  • the power management circuit is used to distribute the voltage provided by the battery 60 to various electronic components in the electronic device 100.
  • FIG. 2 is a rear view of the electronic device 100 shown in FIG. 1.
  • the electronic device 100 further includes a rear cover 70.
  • the back cover 70 is mounted on the second casing 20.
  • the back cover 70 and the second portion 42 of the first display screen 40 are respectively disposed on opposite sides of the second casing 20, for example, respectively disposed on the front and rear sides of the second casing 20. Therefore, the second portion 42 and the rear cover 70 of the first display screen 40 can be used as the front and rear shells of the second casing 20, respectively.
  • the back cover 70 may be integrally formed. During the molding process of the back cover 70, structures such as a rear camera hole, a fingerprint film group mounting hole, and the like may be formed in the back cover 70. In one embodiment, the material of the back cover 70 may include plastic.
  • the electronic device 100 further includes a second display screen 80.
  • the second display screen 80 is mounted on the first casing 10.
  • the second display screen 80 and the first portion 41 of the first display screen 40 are respectively disposed on opposite sides of the first casing 10, for example, disposed on the front and rear sides of the first casing 10, respectively. Therefore, the first portion 41 and the second display screen 80 of the first display screen 40 can be used as the front case and the rear case of the first casing 10, respectively.
  • the second display screen 80 may also be a liquid crystal display (Liquid Crystal Display, LCD) or an organic light emitting diode display (Organic Light-Emitting Diode, OLED).
  • the second display screen 80 can also be used to display information such as images and text.
  • the second display screen 80 may be used as a display screen of the electronic device 100.
  • the first display screen 40 may remain in an off-screen state.
  • a middle frame structure may be provided inside the first casing 10 and the second casing 20.
  • the middle frame structure is used to provide support for the electronic components inside the first casing 10 and the second casing 20.
  • the circuit board 50 and other electronic components in the first casing 10 may be disposed on a middle frame structure inside the first casing 10.
  • the battery 60 and other electronic components in the second casing 20 may be disposed on a middle frame structure inside the second casing 20.
  • a patch board 90 is further disposed between the rear cover 70 and the second portion 42 of the first display screen 40.
  • the patch board 90 may be formed by The metal layer 91, the dielectric layer 92, and the metal patch layer 93 are formed between the metal layer 91 and the metal patch layer 93.
  • the cross-sectional area of the dielectric layer 92 is smaller than that of the metal layer 91. Area, the cross-sectional area of the metal patch layer 93 is smaller than the cross-sectional area of the dielectric layer 92.
  • the dielectric layer 92 may include four dielectric substrates.
  • the metal patch layer 93 may include four metal patches.
  • the 4 Dielectric substrates are disposed at intervals on the metal layer 91, and the four metal patches are sequentially disposed on the four dielectric substrates for forming four microstrip antennas 901.
  • the material of the metal layer 91 and the metal patches may include Aluminum alloy or titanium alloy, etc.
  • the material of the dielectric substrate may include alumina ceramics.
  • the microstrip antenna is a thin dielectric substrate. One side is attached with a thin metal layer as a ground plate, and the other side is made into a metal patch with a certain shape by photolithographic etching.
  • the microstrip line or coaxial probe is used to attach the metal The patch feeds the antenna.
  • the metal patch is excited by a radio frequency electromagnetic field and radiates electromagnetic waves into space.
  • the metal layer 91 is used for grounding, the dielectric substrate is used for transmitting radio frequency signals, and the metal patch is used for transmitting radio frequency signals in the form of electromagnetic waves when the dielectric substrate transmits radio frequency signals.
  • the patch plate 90 is parallel to the back cover 70, and the metal patch layer 93 is close to the back cover 70, so that electromagnetic waves emitted by multiple metal patches can propagate through the back cover 70 Into space.
  • the four metal patches in the metal patch layer 93 may form a MIMO (Multiple-Input Multiple-Output, Multiple Output) antenna, so that the electromagnetic waves emitted by the four metal patches can be superimposed. , To reduce the problem of attenuation due to electromagnetic wave propagation in the atmosphere.
  • MIMO Multiple-Input Multiple-Output, Multiple Output
  • the size of the four dielectric substrates in the dielectric layer 92 may be equal, and the size of the four metal patches in the metal patch layer 93 may be equal, so that 4 Two metal patches can transmit RF signals in the same frequency band, which can be used to form a MIMO antenna.
  • the four metal patches are arranged in a matrix shape, which can form a microstrip antenna matrix, which can better reduce the risk of electromagnetic wave propagation in the atmosphere. The problem of attenuation.
  • the dielectric layer 92 may include eight dielectric substrates, and the metal patch layer 93 may include eight metal patches for forming eight microstrip antennas 901.
  • the size of the eight dielectric substrates in the dielectric layer 92 can be equal, and the size of the eight metal patches in the metal patch layer 93 can be equal, so that eight microstrip antennas 901 can form a MIMO antenna, and eight The microstrip antenna 901 is arranged in a matrix shape to form a microstrip antenna matrix. Since the superposition degree of the eight microstrip antennas 901 is greater than the superposition degree of the four microstrip antennas 901, the attenuation caused by the electromagnetic wave propagation in the atmosphere can be further reduced problem.
  • the dielectric layer 92 may include 12 dielectric substrates
  • the metal patch layer 93 may include 12 metal patches for forming 12 microstrip antennas 901
  • the size of the 12 dielectric substrates in the dielectric layer 92 can be equal, and the size of the 12 metal patches in the metal patch layer 93 can be equal, so that 12 microstrip antennas 901 can form a MIMO antenna, and 12
  • the microstrip antenna 901 is arranged in a matrix shape to form a microstrip antenna matrix. Since the superposition degree of 12 microstrip antennas 901 is greater than the superposition degree of 8 microstrip antennas 901, the attenuation due to electromagnetic wave propagation in the atmosphere can be further reduced The problem.
  • the number of microstrip antennas is not limited to the above example, and the number of microstrip antennas 901 can be freely set according to actual needs.
  • the electronic device 100 further includes a radio frequency transceiver module 101.
  • the RF transceiver module 101 can be connected to the circuit board 50 of the electronic device 100.
  • the radio frequency transceiver module 101 includes a plurality of signal sources 1011.
  • the multiple signal sources 1011 may be controlled by a processor of the electronic device 100.
  • Each of the signal sources 1011 is used to generate a radio frequency signal.
  • Each of the microstrip antennas 901 is connected to one of the signal sources 1011.
  • a plurality of the signal sources 1011 may be used to generate a radio frequency signal with a preset frequency range.
  • one or more of the plurality of signal sources 1011 may be used to generate a 5G (The 5th Generation Mobile Communication Technology) signal, which may specifically be a 5G millimeter wave signal.
  • 5G The 5th Generation Mobile Communication Technology
  • the preset frequency range includes 24 GHz (Gigahertz) to 100 GHz.
  • the electronic device 100 may further include multiple antenna radiators for receiving and transmitting radio frequency signals in the first frequency range or the second frequency range.
  • the radio frequency signal in the first frequency range is a 4G (The 4th Generation, Mobile Communication, Technology, fourth generation mobile communication technology) signal
  • the radio frequency signal in the second frequency range is a 5G signal.
  • the highest frequency in the first frequency range is smaller than the lowest frequency in the second frequency range. That is, each of the antenna radiators can be used to transmit and receive 4G signals and 5G signals.
  • the second portion 42 of the first display screen 40 mounted on the second body portion 20 may include a display area and a non-display area.
  • the non-display area on the second part 42 may be used to set one or more of functional components such as a camera, a receiver, a proximity sensor, and an ambient light sensor.
  • the electronic device includes a first housing, a second housing, a rotating shaft, a first display screen, and a rear cover, and the first housing and the second housing are connected through the rotating shaft;
  • the first display screen Including a first part and a second part, the first part is mounted on the first housing, the second part is mounted on the second housing, the rear cover is mounted on the second housing, and the rear cover and the second part are respectively disposed on the second Opposite sides of the casing;
  • a plurality of microstrip antennas are arranged between the back cover and the second part.
  • the first display screen includes a first part and a second part, the rear cover and the second part are respectively disposed on opposite sides of the second housing, and a plurality of microstrip antennas are provided between the rear cover and the second part.
  • Multiple microstrip antennas can form a MIMO antenna, which can improve the efficiency of electronic equipment when communicating with a base station, and improve the flexibility of multi-antenna design.

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Abstract

本申请提供一种电子设备，包括：第一壳体、第二壳体、转轴、第一显示屏以及后盖，第一壳体与第二壳体通过转轴连接；第一显示屏包括第一部分和第二部分，第一部分安装在第一壳体上，第二部分安装在第二壳体上，后盖安装在第二壳体上，后盖与第二部分分别设置在第二壳体的相对两侧；后盖与第二部分之间设置有多个微带天线。

Description

电子设备
本申请要求于2018年06月29日提交中国专利局、申请号为201810701632.9、发明名称为“一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，特别涉及一种电子设备。
背景技术
随着电子技术的发展，诸如智能手机等电子设备在人们的生活中发挥着越来越重要的作用。用户可以通过电子设备实现通信、购物、娱乐等各种功能。
电子设备在与基站或其它电子设备通信时，需要通过天线向外界发射上行信号，以及从外界接收下行信号，从而实现与基站或其它电子设备之间的数据交互。
当前，随着电子设备的通信需求以及可支持的通信频段的多样化，电子设备上多天线的设计变得困难。
发明内容
本申请实施例提供一种电子设备，可以提升多天线设计的灵活性。
第一方面，本申请实施例提供了一种电子设备，包括第一壳体、第二壳体、转轴、第一显示屏以及后盖，所述第一壳体与所述第二壳体通过所述转轴连接；
所述第一显示屏包括第一部分和第二部分，所述第一部分安装在所述第一壳体上，所述第二部分安装在所述第二壳体上，所述后盖安装在所述第二壳体上，所述后盖与所述第二部分分别设置在所述第二壳体的相对两侧；
所述后盖与所述第二部分之间还包括贴片板，所述贴片板包括金属层、介质层以及金属贴片层，介质层设置在所述金属层与金属贴片层之间，所述介质层的横截面积小于所述金属层的横截面积，所述金属贴片层的横截面积小于所述介质层的横截面积，所述介质层包括四个介质基片，所述金属贴片层包括四个金属贴片，所述四个介质基片间隔设置在所述金属层上，所述四个金属贴片依次设置在所述四个介质基片上，用于形成四个微带天线。
第二方面，本申请实施例提供了一种电子设备，包括第一壳体、第二壳体、转轴、第一显示屏以及后盖，所述第一壳体与所述第二壳体通过所述转轴连接；
所述第一显示屏包括第一部分和第二部分，所述第一部分安装在所述第一壳体上，所述第二部分安装在所述第二壳体上，所述后盖安装在所述第二壳体上，所述后盖与所述第二部分分别设置在所述第二壳体的相对两侧；
所述后盖与所述第二部分之间设置有多个微带天线。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的第一种结构示意图。
图2为图1所示电子设备的后视图。
图3为本申请实施例提供的电子设备的第二种结构示意图。
图4为本申请实施例提供的电子设备的贴片板的截面示意图。
图5为本申请实施例提供的电子设备的贴片板的俯视示意图。
图6为本申请实施例提供的电子设备的第三种结构示意图。
图7为本申请实施例提供的电子设备的第四种结构示意图。
图8为本申请实施例提供的电子设备的第五结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
本申请实施例提供一种电子设备。所述电子设备可以是智能手机、平板电脑等设备，还可以是游戏设备、AR(Augmented Reality，增强现实)设备、汽车、数据存储装置、音频播放装置、视频播放装置、笔记本、桌面计算设备 等。
本发明实施例提供一种电子设备，包括第一壳体、第二壳体、转轴、第一显示屏以及后盖，所述第一壳体与所述第二壳体通过所述转轴连接；
所述第一显示屏包括第一部分和第二部分，所述第一部分安装在所述第一壳体上，所述第二部分安装在所述第二壳体上，所述后盖安装在所述第二壳体上，所述后盖与所述第二部分分别设置在所述第二壳体的相对两侧；
所述后盖与所述第二部分之间还包括贴片板，所述贴片板包括金属层、介质层以及金属贴片层，介质层设置在所述金属层与金属贴片层之间，所述介质层的横截面积小于所述金属层的横截面积，所述金属贴片层的横截面积小于所述介质层的横截面积，所述介质层包括四个介质基片，所述金属贴片层包括四个金属贴片，所述四个介质基片间隔设置在所述金属层上，所述四个金属贴片依次设置在所述四个介质基片上，用于形成四个微带天线。
本发明实施例提供一种电子设备，包括第一壳体、第二壳体、转轴、第一显示屏以及后盖，所述第一壳体与所述第二壳体通过所述转轴连接；
所述第一显示屏包括第一部分和第二部分，所述第一部分安装在所述第一壳体上，所述第二部分安装在所述第二壳体上，所述后盖安装在所述第二壳体上，所述后盖与所述第二部分分别设置在所述第二壳体的相对两侧；
所述后盖与所述第二部分之间设置有多个微带天线。
在一种实施方式中，所述后盖与所述第二部分之间还包括贴片板，所述贴片板包括金属层、介质层以及金属贴片层，介质层设置在所述金属层与金属贴片层之间，所述介质层的横截面积小于所述金属层的横截面积，所述金属贴片层的横截面积小于所述介质层的横截面积，所述介质层包括多个介质基片，所述金属贴片层包括多个金属贴片，所述介质基片间隔设置在所述金属层上，所述金属贴片设置在所述介质基片上，用于形成多个微带天线。
在一种实施方式中，所述贴片板与所述后盖平行，所述多个金属贴片层靠近所述后盖。
在一种实施方式中，所述多个金属贴片的大小相等，所述多个介质基片的大小相等。
在一种实施方式中，所述金属层的材质包括铝合金或者钛合金。
在一种实施方式中，所述金属贴片的材质包括铝合金或者钛合金。
在一种实施方式中，所述介质基片的材质包括氧化铝陶瓷。
在一种实施方式中，所述多个微带天线呈矩阵式形状间隔设置。
在一种实施方式中，所述微带天线的数量为4个。
在一种实施方式中，所述微带天线的数量为8个。
在一种实施方式中，所述微带天线的数量为12个。
在一种实施方式中，所述后盖的材质包括塑料。
在一种实施方式中，还包括射频收发模块，所述射频收发模块包括多个信号源，每一个所述信号源均用于产生射频信号，每一个微带天线均与一个所述信号源连接。
在一种实施方式中，每一个所述微带天线均用于收发预设频率范围的射频信号。
在一种实施方式中，所述预设频率范围包括24GHz至100GHz。
在一种实施方式中，还包括第二显示屏，所述第二显示屏安装在所述第一壳体上，所述第二显示屏与所述第一显示屏的第一部分分别设置在所述第一壳体的相对两侧。
在一种实施方式中，还包括多个天线辐射体，用于收发第一频率范围或第二频率范围的射频信号。
在一种实施方式中，所述第一频率范围的射频信号为4G信号。
在一种实施方式中，所述第二频率范围的射频信号为5G信号。
参考图1，图1为本申请实施例提供的电子设备的结构示意图。电子设备100包括第一壳体10、第二壳体20、转轴30、第一显示屏40、电路板50以及电池60。
其中，第一壳体10、第二壳体20可旋转地连接。第一壳体10、第二壳体20可以包括层叠设置的显示屏、中框、电路板、后盖等结构。
所述第一壳体10与所述第二壳体20通过所述转轴30连接。也即，所述第一壳体10与所述转轴30连接，并且所述第二壳体20也与所述转轴30连接。从而所述第一壳体10、第二壳体20均可以绕所述转轴30旋转。其中，所述转轴30的材质可以包括塑料或金属。所述第一壳体10、第二壳体20均可以绕设在所述转轴30上。
第一显示屏40可用于显示图像、文本等信息，从而形成电子设备100的 显示面。所述第一显示屏40可以为液晶显示屏(Liquid Crystal Display，LCD)或有机发光二极管显示屏(Organic Light-Emitting Diode，OLED)等类型的显示屏。
所述第一显示屏40包括第一部分41和第二部分42。所述第一部分41、第二部分42均可以实现显示功能。所述第一部分41与所述第二部分42连接。所述第一部分41与所述第二部分42连接处为柔性屏，也即所述第一部分41与所述第二部分42的连接处可以弯曲。其中，所述连接处可以用于显示信息，也可以不用于显示信息。在一些实施例中，所述第一显示屏40可以为柔性屏。
所述第一部分41安装在所述第一壳体10上，所述第二部分42安装在所述第二壳体20上。从而，当所述第一壳体10、第二壳体20绕所述转轴30旋转时，所述第一显示屏40的第一部分41、第二部分42可以同时绕所述转轴30旋转。当所述第一壳体10、第二壳体20旋转至同一平面时，所述第一显示屏40的第一部分41、第二部分42也位于同一平面，可以达到较大的屏幕显示效果。
在一些实施例中，所述第一壳体10、第二壳体20绕所述转轴30旋转时的旋转方式为内折，其中，第一壳体10、第二壳体20均沿着朝向第一显示屏40的显示面一侧旋转，也即可以旋转至第一显示屏40的第一部分41与第二部分42互相贴合的状态。
继续参考图1，其中电路板50可以安装在所述第一壳体10内部。其中，所述电路板50与所述第一显示屏40的第一部分41可以呈层叠设置，也即电路板50可以设置在所述第一显示屏40的第一部分41下方。
电路板50可以为电子设备100的主板。电路板50上设置有接地点，以实现电路板50的接地。电路板50上集成有处理器。电路板50上还可以集成有马达、麦克风、扬声器、受话器、耳机接口、通用串行总线接口(USB接口)、摄像头、距离传感器、环境光传感器、陀螺仪等功能组件中的一个、两个或多个。同时，所述第一显示屏40可以电连接至电路板50。
在一些实施例中，电路板50上设置有显示控制电路。所述显示控制电路向所述第一显示屏40输出控制信号，以控制所述第一显示屏40显示信息。
电池60可以安装在所述第二壳体20内部。其中，所述电池60与所述第一显示屏40的第二部分42可以呈层叠设置，也即电池60可以设置在所述第 一显示屏40的第二部分42下方。
电池60可以电连接至所述电路板50，以实现电池60为电子设备100供电。其中，电路板50上可以设置有电源管理电路。所述电源管理电路用于将电池60提供的电压分配到电子设备100中的各个电子元件。
同时参考图2，其中图2为图1所示电子设备100的后视图。在一些实施例中，电子设备100还包括后盖70。其中，所述后盖70安装在所述第二壳体20上。所述后盖70与所述第一显示屏40的第二部分42分别设置在所述第二壳体20的相对两侧，例如分别设置在所述第二壳体20的前后两侧。从而，所述第一显示屏40的第二部分42、后盖70可以分别作为所述第二壳体20的前壳和后壳。
所述后盖70可以一体成型。在后盖70的成型过程中，可以在后盖70上形成后置摄像头孔、指纹膜组安装孔等结构。在一实施方式中，该后盖70的材料可以包括塑料。
在一些实施例中，电子设备100还包括第二显示屏80。其中，所述第二显示屏80安装在所述第一壳体10上。所述第二显示屏80与所述第一显示屏40的第一部分41分别设置在所述第一壳体10的相对两侧，例如分别设置在所述第一壳体10的前后两侧。从而，所述第一显示屏40的第一部分41、第二显示屏80可以分别作为所述第一壳体10的前壳和后壳。
其中，所述第二显示屏80也可以为液晶显示屏(Liquid Crystal Display，LCD)或有机发光二极管显示屏(Organic Light-Emitting Diode，OLED)等类型的显示屏。所述第二显示屏80也可以用于显示图像、文本等信息。
例如，当所述第一壳体10、第二壳体20绕所述转轴30旋转至闭合状态，也即旋转至所述第一显示屏40的第一部分41与第二部分42互相贴合时，所述第二显示屏80可以作为电子设备100的显示屏。此时，所述第一显示屏40可以保持熄屏状态。
此外，在一些实施例中，所述第一壳体10、第二壳体20内部均可以设置有中框结构。其中，中框结构用于为所述第一壳体10和第二壳体20内部的电子元件提供支撑作用。
例如，所述第一壳体10中的电路板50以及其它电子元件可以设置在第一壳体10内部的中框结构上。所述第二壳体20中的电池60以及其它电子元件 可以设置在第二壳体20内部的中框结构上。
在一些实施例中，如图3以及图4所示，所述后盖70与所述第一显示屏40的第二部分42之间还设置有贴片板90，该贴片板90可以由金属层91、介质层92以及金属贴片层93组成，该介质层92设置在金属层91与该金属贴片层93之间，该介质层92的横截面积小于该金属层91的横截面积，该金属贴片层93的横截面积小于该介质层92的横截面积，该介质层92可以包括4个介质基片，该金属贴片层93可以包括4个金属贴片，该4个介质基片间隔设置在该金属层91，该4个金属贴片依次设置在该4个介质基片上，用于形成4个微带天线901，该金属层91以及金属贴片的材质可以包括铝合金或者钛合金等等。该介质基片的材料可以包括氧化铝陶瓷。该微带天线为在一个薄介质基片上，一面附上金属薄层作为接地板，另一面用光刻腐蚀方法制成一定形状的金属贴片，利用微带线或同轴探针对金属贴片馈电构成的天线。金属贴片上激励有射频电磁场，并向空间辐射电磁波。所述金属层91用于起接地的作用，所述介质基片用于传输射频信号，所述金属贴片用于在介质基片传输射频信号时，将射频信号以电磁波的形式发射出去。
在一些实施例中，所述贴片板90与所述后盖70平行，且所述金属贴片层93靠近所述后盖70，使得多个金属贴片发射的电磁波可以穿过后盖70传播到空间中。
在一些实施例中，所述金属贴片层93中的4个金属贴片可以组成MIMO(Multiple-Input Multiple-Output，多入多出)天线，使得4个金属贴片发射的电磁波可以进行叠加，降低由于电磁波在大气中传播会造成衰减的问题。
在一些实施例中，如图5所示，该介质层92中的4个介质基片的大小都可以相等，该金属贴片层93中的4个金属贴片的大小都可以相等，使得4个金属贴片可以发射同一频段的射频信号，进而可以组成MIMO天线，且4个金属贴片呈矩阵式形状设置，可以形成微带天线矩阵，可以更好的降低由于电磁波在大气中传播会造成衰减的问题。
在一些实施例中，如图6所示，该介质层92可以包括8个介质基片，该金属贴片层93可以包括8个金属贴片，用于形成8个微带天线901，且该介质层92中的8个介质基片的大小都可以相等，该金属贴片层93中的8个金属贴片的大小都可以相等，使得8个微带天线901可以组成MIMO天线，且8 个微带天线901呈矩阵式形状设置，形成微带天线矩阵，由于8个微带天线901的叠加度大于4个微带天线901的叠加度，可以进一步降低由于电磁波在大气中传播会造成衰减的问题。
在一些实施例中，如图7所示，该介质层92可以包括12个介质基片，该金属贴片层93可以包括12个金属贴片，用于形成12个微带天线901，且该介质层92中的12个介质基片的大小都可以相等，该金属贴片层93中的12个金属贴片的大小都可以相等，使得12个微带天线901可以组成MIMO天线，且12个微带天线901呈矩阵式形状设置，形成微带天线矩阵，由于12个微带天线901的叠加度大于8个微带天线901的叠加度，可以再进一步降低由于电磁波在大气中传播会造成衰减的问题。
由上述可知，微带天线901的数量越多，叠加度越好，辐射的衰减度越低，而微带天线的数量不限于上述举例，可根据实际需要，自由设置微带天线901的数量。
在一些实施例中，如图8所示，电子设备100还包括射频收发模块101。其中，所述射频收发模块101可以与电子设备100的电路板50连接。所述射频收发模块101包括多个信号源1011。所述多个信号源1011可以由电子设备100的处理器进行控制。每一个所述信号源1011均用于产生射频信号。每一个所述微带天线901均与一个所述信号源1011连接。
在一些实施例中，多个所述信号源1011可以用于产生预设频率范围的射频信号。例如，多个所述信号源1011中的一个或多个可以用于产生5G(The 5th Generation Mobile Communication Technology，第五代移动通信技术)信号，具体可以为5G毫米波信号。
在一些实施例中，所述预设频率范围包括24GHz(吉赫兹)至100GHz。
在一些实施例中，电子设备100上还可以包括多个天线辐射体用于收发第一频率范围或第二频率范围的射频信号。其中，所述第一频率范围的射频信号为4G(The 4th Generation Mobile Communication Technology，第四代移动通信技术)信号，所述第二频率范围的射频信号为5G信号。所述第一频率范围中的最高频率小于所述第二频率范围中的最低频率。也即，每一个所述天线辐射体均可以用于收发4G信号和5G信号。
在一些实施例中，所述第一显示屏40安装在所述第二主体部20上的第二 部分42可以包括显示区域和非显示区域。其中，所述第二部分42上的非显示区域可以用于设置摄像头、受话器、接近传感器、环境光传感器等功能组件中的一个或多个。
由上可知，本申请实施例提供的电子设备包括第一壳体、第二壳体、转轴、第一显示屏以及后盖，第一壳体与第二壳体通过转轴连接；第一显示屏包括第一部分和第二部分，第一部分安装在第一壳体上，第二部分安装在第二壳体上，后盖安装在第二壳体上，后盖与第二部分分别设置在第二壳体的相对两侧；后盖与第二部分之间设置有多个微带天线。电子设备中，第一显示屏包括第一部分和第二部分，后盖与第二部分分别设置在第二壳体的相对两侧，且后盖与第二部分之间设置有多个微带天线，多个微带天线可以组成MIMO天线，从而可以提高电子设备与基站通信时的效率，并且提升了多天线设计的灵活性。
以上对本申请实施例提供的电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种电子设备，其中，包括第一壳体、第二壳体、转轴、第一显示屏以及后盖，所述第一壳体与所述第二壳体通过所述转轴连接；
    所述第一显示屏包括第一部分和第二部分，所述第一部分安装在所述第一壳体上，所述第二部分安装在所述第二壳体上，所述后盖安装在所述第二壳体上，所述后盖与所述第二部分分别设置在所述第二壳体的相对两侧；
    所述后盖与所述第二部分之间还包括贴片板，所述贴片板包括金属层、介质层以及金属贴片层，介质层设置在所述金属层与金属贴片层之间，所述介质层的横截面积小于所述金属层的横截面积，所述金属贴片层的横截面积小于所述介质层的横截面积，所述介质层包括四个介质基片，所述金属贴片层包括四个金属贴片，所述四个介质基片间隔设置在所述金属层上，所述四个金属贴片依次设置在所述四个介质基片上，用于形成四个微带天线。
  2. 一种电子设备，其中，包括第一壳体、第二壳体、转轴、第一显示屏以及后盖，所述第一壳体与所述第二壳体通过所述转轴连接；
    所述第一显示屏包括第一部分和第二部分，所述第一部分安装在所述第一壳体上，所述第二部分安装在所述第二壳体上，所述后盖安装在所述第二壳体上，所述后盖与所述第二部分分别设置在所述第二壳体的相对两侧；
    所述后盖与所述第二部分之间设置有多个微带天线。
  3. 根据权利要求2所述的电子设备，其中，所述后盖与所述第二部分之间还包括贴片板，所述贴片板包括金属层、介质层以及金属贴片层，介质层设置在所述金属层与金属贴片层之间，所述介质层的横截面积小于所述金属层的横截面积，所述金属贴片层的横截面积小于所述介质层的横截面积，所述介质层包括多个介质基片，所述金属贴片层包括多个金属贴片，所述介质基片间隔设置在所述金属层上，所述金属贴片设置在所述介质基片上，用于形成多个微带天线。
  4. 根据权利要求3所述的电子设备，其中，所述贴片板与所述后盖平行，所述多个金属贴片层靠近所述后盖。
  5. 根据权利要求3所述的电子设备，其中，所述多个金属贴片的大小相等，所述多个介质基片的大小相等。
  6. 根据权利要求3所述的电子设备，其中，所述金属层的材质包括铝合 金或者钛合金。
  7. 根据权利要求3所述的电子设备，其中，所述金属贴片的材质包括铝合金或者钛合金。
  8. 根据权利要求3所述的电子设备，其中，所述介质基片的材质包括氧化铝陶瓷。
  9. 根据权利要求5所述的电子设备，其中，所述多个微带天线呈矩阵式形状间隔设置。
  10. 根据权利要求9所述的电子设备，其中，所述微带天线的数量为4个。
  11. 根据权利要求9所述的电子设备，其中，所述微带天线的数量为8个。
  12. 根据权利要求9所述的电子设备，其中，所述微带天线的数量为12个。
  13. 根据权利要求2所述的电子设备，其中，所述后盖的材质包括塑料。
  14. 根据权利要求2所述的电子设备，其中，还包括射频收发模块，所述射频收发模块包括多个信号源，每一个所述信号源均用于产生射频信号，每一个微带天线均与一个所述信号源连接。
  15. 根据权利要求2所述的电子设备，其中，每一个所述微带天线均用于收发预设频率范围的射频信号。
  16. 根据权利要求15所述的电子设备，其中，所述预设频率范围包括24GHz至100GHz。
  17. 根据权利要求2所述的电子设备，其中，还包括第二显示屏，所述第二显示屏安装在所述第一壳体上，所述第二显示屏与所述第一显示屏的第一部分分别设置在所述第一壳体的相对两侧。
  18. 根据权利要求2所述的电子设备，其中，还包括多个天线辐射体，用于收发第一频率范围或第二频率范围的射频信号。
  19. 根据权利要求18所述的电子设备，其中，所述第一频率范围的射频信号为4G信号。
  20. 根据权利要求19所述的电子设备，其中，所述第二频率范围的射频信号为5G信号。
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