WO2019242258A1 - 一种高频微小阶梯槽的制作方法 - Google Patents

一种高频微小阶梯槽的制作方法 Download PDF

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WO2019242258A1
WO2019242258A1 PCT/CN2018/121549 CN2018121549W WO2019242258A1 WO 2019242258 A1 WO2019242258 A1 WO 2019242258A1 CN 2018121549 W CN2018121549 W CN 2018121549W WO 2019242258 A1 WO2019242258 A1 WO 2019242258A1
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frequency
core
board
core board
manufacturing
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PCT/CN2018/121549
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French (fr)
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何艳球
吴永德
张亚锋
夏国伟
施世坤
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胜宏科技（惠州）股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing

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  • the invention relates to the field of PCB boards, in particular to a method for manufacturing a high-frequency micro-stepped groove.
  • the microwave radio frequency module as an important part of the communication network base station has also continued to develop in the direction of high frequency and multi-function.
  • the board is a microwave radio frequency board.
  • the design and manufacturing of microwave radio frequency boards have also continued to develop, the most significant of which is the development towards high frequency and miniaturization.
  • the position of the signal transmitting head of the PCB board usually has the following two design methods, one is to open the slot, and the other is to open the stepped slot.
  • the two methods achieve There are basically no differences in the effects, and both can achieve high-fidelity transmission of high-frequency signals, but the cost of high-frequency materials is high, which increases the manufacturing cost of PCB boards.
  • the stepped slot is convenient for installing special functional devices and is also an important part to achieve high power dissipation of the product. It is widely used in the industry, but the higher the microwave frequency, the smaller the size of the stepped slot is required.
  • the slotted size It is only 1.8 * 3.6mm, because the size of the step groove is too small, the accuracy cannot be controlled, the handling is difficult, the compression placement and inspection are difficult, and the groove cannot be slotted as usual, and then the PTFE gasket is filled or buried during the compression.
  • the method of making stepped grooves using the method described above, and the method of making stepped grooves using a gasket is complicated in manufacturing process, difficult to operate, and low in production efficiency, and is not suitable for mass production.
  • a method for manufacturing a high-frequency micro-stepped groove includes the following steps:
  • S3 Put the prepreg between the high-frequency core board group and the ordinary core board group, press the high-frequency core board group, the prepreg and the ordinary core board group, drill, and electroplating, where An and By are located on the two sides of the prepreg respectively.
  • Side high-frequency board and core board also includes the following steps:
  • Depth controlled milling Depth controlled milling is performed from the ordinary core plate group to the high frequency core plate group. The groove formed by the controlled depth milling passes through the ordinary core plate group into the prepreg, but does not pass through the prepreg. The thickness from By to the preset range;
  • S32 Laser ablation: Absolute the dielectric thickness of the An high frequency board, and expose the copper layer of the An high frequency board;
  • step S3 further includes steps after the line is etched: S4: performing solder protection; S5: text; S6 surface treatment and molding; S7: testing, FQC and packaging.
  • the high-frequency boards A1 to An-1 are pasted with a protective film and then pressed.
  • the B1-By-1 core board is pasted with a protective film and then pressed.
  • the protective film is a dry film.
  • step S3 the high-frequency core plate group, the prepreg, and the ordinary core plate group are fixed in a riveting manner during compression.
  • step S3 a layer of a common core board is laminated on a side of the high-frequency core board group opposite to the prepreg.
  • the media thickness described in step S31 is 0.05-0.2 mm.
  • the y core plate is a TG plate.
  • the invention mainly uses the method of controlling deep milling before etching, and then removing the residual medium by laser to expose the bottom copper, and finally etching the bottom copper to precisely produce the micro stepped groove.
  • the manufacturing method of the invention is simple and each step is easy to operate Control, can achieve the precise control of the size of the step groove, and improve the production efficiency.
  • the present invention can make NPTH step grooves smaller than 2 * 5mm, which provides a strong technical guarantee for 5G and future wireless base station technology upgrades.
  • the slot size tolerance of the invention can meet the requirements, and there is no residual glue and no cavity at the bottom, and there is no need to manually press the PTFE block as in the prior art, which reduces the production cost.
  • FIG. 1 is a schematic diagram of the embodiment of the present invention before controlled depth milling
  • FIG. 2 is a schematic diagram of the embodiment of the present invention after controlled depth milling
  • FIG. 3 is a schematic diagram of an embodiment of the present invention after laser irradiation
  • FIG. 4 is a schematic diagram of an embodiment of the present invention after etching.
  • this embodiment provides a method for manufacturing a high-frequency micro-stepped groove, which includes the following steps:
  • S1 Making a high-frequency core board group: Cut and drill two A1 high-frequency boards and A2 high-frequency boards respectively, and then make A2 high-frequency board circuits.
  • the high-frequency core board group is formed.
  • Two high-frequency boards are double-sided copper-clad.
  • A1 high-frequency board is pasted with a protective film and then laminated, which can protect the copper foil on A1 to remain intact after lamination.
  • the protective film is dry. membrane;
  • Depth controlled milling Depth controlled milling is performed from the ordinary core plate group to the high-frequency core plate group. The groove formed by the controlled depth milling passes through the ordinary core plate group into the prepreg, but does not pass through the prepreg. After depth controlled milling A2
  • the thickness of B2 is a preset range. When the thickness is 0.05 ⁇ 0.2mm, it is convenient for subsequent laser ablation;
  • S32 Laser ablation: Absolute the dielectric thickness of the A2 high-frequency board and expose the copper layer of the A2 high-frequency board;
  • micro-erosive blasting After laser ablation, micro-erosive blasting is performed to remove the browning film and rinse away the residue of laser ablation;
  • A1 is a double-sided high-frequency core board
  • a layer of ordinary core board needs to be laminated on the side of A1 opposite to the prepreg to shield signal interference.
  • the invention mainly uses the method of controlling deep milling before etching, and then removing the residual medium by laser to expose the bottom copper, and finally etching the bottom copper to precisely produce the micro stepped groove.
  • the manufacturing method of the invention is simple and each step is easy to operate Control, can achieve the precise control of the size of the step groove, and improve the production efficiency.
  • the present invention can make NPTH step grooves smaller than 2 * 5mm. Controlling the depth of depth, laser ablation parameters and laser ablation process during the production process can significantly improve the production effect of step grooves.
  • the wireless base station technology upgrade provides a strong technical guarantee.
  • the slot size tolerance of the invention can meet the requirements, and there is no residual glue and no cavity at the bottom, and there is no need to manually press the PTFE block as in the prior art, which reduces the production cost.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种高频微小阶梯槽的制作方法，包括以下步骤：S1：制作高频芯板组；S2：制作普通芯板组；S3：将半固化片放在高频芯板组和普通芯板组之间，将高频芯板组、半固化片和普通芯板组进行压合，然后钻孔、电镀；所述方法简单、容易操作控制，能够对阶梯槽的尺寸实现精准的控制，并且能够提高生产效率。

Description

一种高频微小阶梯槽的制作方法 技术领域
本发明涉及PCB板领域，具体的说，尤其涉及一种高频微小阶梯槽的制作方法。
背景技术
随着网络通讯技术不断向高速、低延时和大容量传输方向的发展，作为通讯网络基站重要组成部分的微波射频模块也不断向高频化、多功能化方向发展，微波射频模块的基础承载板为微波射频板，微波射频板的设计与制造也不断发展，其中最显著的就是往高频化和小型化的发展。
为了保证高频信号的高保真传输，PCB板的信号发射头位置通常有以下两种设计方法，一是开通槽，二是开阶梯槽，当PCB板全部使用高频材料时，二种方法达到的效果基本上无差异，都能够实现高频信号的高保真传输，但是高频材料的成本高，增加了PCB板的制作成本。因为阶梯槽便于安装特殊的功能器件，也是实现产品大功率散热的重要部分，在行业内应用比较广泛，但是微波频率越高，对阶梯槽尺寸要求越小，当频率为64GHz时，开槽尺寸仅为1.8*3.6mm，因阶梯槽的尺寸太小，精度无法管控，拿放操作困难，压合放置及检查困难，无法按常规先开槽，再在压合时填充或埋入PTFE垫片的方式制作阶梯槽，而且采用垫片制作阶梯槽的方法制作工艺复杂、操作困难，生产效率低，不适用于大批量的生产。
发明内容
为了解决现有技术中PCB板的微小阶梯槽在制作过程中尺寸不能精准控制、阶梯槽制作方法复杂、操作困难，以及效率低下等问题，现提供一种高频微小阶梯槽的制作方法。
一种高频微小阶梯槽的制作方法，包括以下步骤：
S1：制作高频芯板组：将n(n>＝1)块的A1……An高频板分别进行开料、钻孔，之后制作An高频板的线路，将n块高频板进行压合、棕化形成高频芯板组，其中An高频板压合后位于高频芯板组的外层，n块高频板为双面覆铜；
S2：制作普通芯板组：将y(y>＝1)块的B1……By芯板分别进行开料、钻孔，之后制作By芯板的线路，将y块芯板进行压合、棕化，形成普通芯板组，其中By芯板压合后位于普通芯板组的外层，y块芯板为双面覆铜；
S3：将半固化片放在高频芯板组和普通芯板组之间，将高频芯板组、半固化片和普通芯板组进行压合，钻孔、电镀，其中An和By为分别位于半固化片两侧的高频板和芯板；还包括 以下步骤：
S31：控深铣：从普通芯板组往高频芯板组的方向进行控深铣，控深铣形成的槽穿过普通芯板组到半固化片内，未穿过半固化片，控深铣后An到By的介厚为预设范围值；
S32：镭射烧蚀：将An高频板上的介厚烧蚀干净，露出An高频板的铜层；
S33：微蚀喷砂：镭射烧蚀后，进行微蚀喷砂；
S34：线路蚀刻，将An高频板裸露的铜层蚀刻掉，得到精确的阶梯槽。
优选的，步骤S3在线路蚀刻后还包括步骤：S4：进行防焊；S5：文字；S6表面处理、成型；S7：测试、FQC和包装。
优选的，在步骤S1中制作An高频板的线路后，将A1～An-1高频板贴上保护膜再进行压合。
优选的，在步骤S2中制作By芯板的线路后，将B1～By-1芯板贴上保护膜再进行压合。
优选的，所述的保护膜为干膜。
优选的，步骤S3高频芯板组、半固化片、普通芯板组在压合时通过铆合的方式固定。
优选的，步骤S3中在高频芯板组相对于半固化片的一侧压合有一层普通芯板。
优选的，步骤S31所述的介厚为0.05～0.2mm。
优选的，y块的芯板采用TG板材。
本发明主要通过在蚀刻前先控深铣，再镭射烧除残留介质，露出底铜，最后将底铜蚀刻掉的方式，精准制作出微小阶梯槽，本发明的制作方法简单、各个步骤容易操作控制，能够对阶梯槽的尺寸实现精准的控制，并且提高了生产的效率。经过实验验证，本发明可以制作小于2*5mm的NPTH阶梯槽，为5G及未来的无线基站技术升级提供强有力的技术保证。本发明开槽尺寸公差可满足要求，且底部无残胶、无空洞，无需如现有技术要手工压PTFE块，降低了生产成本。
附图说明
图1是本发明实施例在控深铣前的示意图；
图2是本发明实施例在控深铣后的示意图；
图3是本发明实施例在镭射后的示意图；
图4是本发明实施例在蚀刻后的示意图。
具体实施方式
下面将结合附图和实施例对本发明作进一步的说明。
参考附图1～4，本实施例提供一种高频微小阶梯槽的制作方法，包括以下步骤：
S1：制作高频芯板组：将2块的A1高频板、A2高频板分别进行开料、钻孔，之后制作A2高频板的线路，将2块高频板进行压合、棕化形成高频芯板组，2块高频板为双面覆铜，将A1高频板贴上保护膜再进行压合，能够保护A1上铜箔在压合后保留完整，保护膜采用干膜；
S2：制作普通芯板组：将2块的B1芯板、B2芯板分别进行开料、钻孔，之后制作B2芯板的线路，将2块芯板进行压合、棕化，形成普通芯板组，2块芯板为双面覆铜，采用TG板材，将B1芯板贴上保护膜再进行压合，能够保护B1上的铜箔在压合后保留完整，保护膜采用干膜；
S3：将半固化片PP放在高频芯板组和普通芯板组之间，将高频芯板组、半固化片和普通芯板组进行压合，钻孔、电镀，其中A2和B2为分别位于半固化片两侧的高频板和芯板，高频芯板组、半固化片、普通芯板组在压合时通过铆合的方式固定；
S31：控深铣：从普通芯板组往高频芯板组的方向进行控深铣，控深铣形成的槽穿过普通芯板组到半固化片内，未穿过半固化片，控深铣后A2到B2的介厚为预设范围值，当介厚为0.05～0.2mm方便后续进行镭射烧蚀；
S32：镭射烧蚀：将A2高频板上的介厚烧蚀干净，露出A2高频板的铜层；
S33：微蚀喷砂：镭射烧蚀后，进行微蚀喷砂，将棕化膜去除并将镭射烧蚀的残渣冲洗干净；
S34：线路蚀刻，将A2高频板裸露的铜层蚀刻掉，得到精确的阶梯槽。
S4：进行防焊；
S5：文字；
S6表面处理、成型；
S7：测试、FQC和包装。
当A1为双面的高频芯板时，在A1相对于半固化片的一侧需压合有一层普通芯板，屏蔽信号干扰。
本发明主要通过在蚀刻前先控深铣，再镭射烧除残留介质，露出底铜，最后将底铜蚀刻掉的方式，精准制作出微小阶梯槽，本发明的制作方法简单、各个步骤容易操作控制，能够对阶梯槽的尺寸实现精准的控制，并且提高了生产的效率。经过实验验证，本发明可以制作小于2*5mm的NPTH阶梯槽，制作过程中控制控深的深度，镭射烧蚀参数及镭射烧蚀过程，可显著提升阶梯槽的制作效果，为5G及未来的无线基站技术升级提供强有力的技术保证。本发明开槽尺寸公差可满足要求，且底部无残胶、无空洞，无需如现有技术要手工压 PTFE块，降低了生产成本。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本实施的精神和原则之内，所作的任何修改、等同替换、改进等，均包含在本发明的保护范围内。

Claims (9)

  1. 一种高频微小阶梯槽的制作方法，其特征在于：包括以下步骤：
    S1：制作高频芯板组：将n(n>＝1)块的A1……An高频板分别进行开料、钻孔，之后制作An高频板的线路，将n块高频板进行压合、棕化形成高频芯板组，其中An高频板压合后位于高频芯板组的外层，n块高频板为双面覆铜；
    S2：制作普通芯板组：将y(y>＝1)块的B1……By芯板分别进行开料、钻孔，之后制作By芯板的线路，将y块芯板进行压合、棕化，形成普通芯板组，其中By芯板压合后位于普通芯板组的外层，y块芯板为双面覆铜；
    S3：将半固化片放在高频芯板组和普通芯板组之间，将高频芯板组、半固化片和普通芯板组进行压合，钻孔、电镀，其中An和By为分别位于半固化片两侧的高频板和芯板；还包括以下步骤：
    S31：控深铣：从普通芯板组往高频芯板组的方向进行控深铣，控深铣形成的槽穿过普通芯板组到半固化片内，未穿过半固化片，控深铣后An到By的介厚为预设范围值；
    S32：镭射烧蚀：将An高频板上的介厚烧蚀干净，露出An高频板的铜层；
    S33：微蚀喷砂：镭射烧蚀后，进行微蚀喷砂；
    S34：线路蚀刻，将An高频板裸露的铜层蚀刻掉，得到精确的阶梯槽。
  2. 根据权利要求1所述的一种高频微小阶梯槽的制作方法，其特征在于：步骤S3在线路蚀刻后还包括步骤：S4：进行防焊；S5：文字；S6表面处理、成型；S7：测试、FQC和包装。
  3. 根据权利要求1所述的一种高频微小阶梯槽的制作方法，其特征在于：在步骤S1中制作An高频板的线路后，将A1～An-1高频板贴上保护膜再进行压合。
  4. 根据权利要求1所述的一种高频微小阶梯槽的制作方法，其特征在于：在步骤S2中制作By芯板的线路后，将B1～By-1芯板贴上保护膜再进行压合。
  5. 根据权利要求2或3所述的一种高频微小阶梯槽的制作方法，其特征在于：所述的保护膜为干膜。
  6. 根据权利要求1所述的一种高频微小阶梯槽的制作方法，其特征在于：步骤S3高频芯板组、半固化片、普通芯板组在压合时通过铆合的方式固定。
  7. 根据权利要求1所述的一种高频微小阶梯槽的制作方法，其特征在于：步骤S3中在高频芯板组相对于半固化片的一侧压合有一层普通芯板。
  8. 根据权利要求1所述的一种高频微小阶梯槽的制作方法，其特征在于：步骤S31所述的介厚为0.05～0.2mm。
  9. 根据权利要求1所述的一种高频微小阶梯槽的制作方法，其特征在于：y块的芯板采用 TG板材。
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202721895U (zh) * 2012-08-27 2013-02-06 深圳市迅捷兴电路技术有限公司 高频阶梯板的阶梯结构
CN103298245A (zh) * 2013-06-14 2013-09-11 东莞生益电子有限公司 高频电路板的制作方法以及该方法制得的电路板
CN108112175A (zh) * 2018-02-02 2018-06-01 生益电子股份有限公司 一种阶梯槽底部图形化pcb的制作方法及pcb

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100782405B1 (ko) * 2006-10-27 2007-12-07 삼성전기주식회사 인쇄회로기판 제조방법
CN102149253B (zh) * 2010-12-29 2013-03-20 东莞生益电子有限公司 高频材料与普通fr4材料一次压合制作pcb板的方法
CN103517567B (zh) * 2012-06-29 2016-04-06 珠海方正科技高密电子有限公司 一种印制电路板的制作方法以及pcb
CN105517374B (zh) * 2015-12-17 2019-02-05 深圳崇达多层线路板有限公司 一种薄芯板hdi板的制作方法
CN105764258A (zh) * 2016-04-22 2016-07-13 深圳崇达多层线路板有限公司 一种在pcb上制作阶梯槽的方法
CN107484361A (zh) * 2017-09-25 2017-12-15 生益电子股份有限公司 一种高速pcb的制作方法及高速pcb

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202721895U (zh) * 2012-08-27 2013-02-06 深圳市迅捷兴电路技术有限公司 高频阶梯板的阶梯结构
CN103298245A (zh) * 2013-06-14 2013-09-11 东莞生益电子有限公司 高频电路板的制作方法以及该方法制得的电路板
CN108112175A (zh) * 2018-02-02 2018-06-01 生益电子股份有限公司 一种阶梯槽底部图形化pcb的制作方法及pcb

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