WO2019241988A1 - 一种电子载体纸带打孔模具用包装系统 - Google Patents

一种电子载体纸带打孔模具用包装系统 Download PDF

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Publication number
WO2019241988A1
WO2019241988A1 PCT/CN2018/092338 CN2018092338W WO2019241988A1 WO 2019241988 A1 WO2019241988 A1 WO 2019241988A1 CN 2018092338 W CN2018092338 W CN 2018092338W WO 2019241988 A1 WO2019241988 A1 WO 2019241988A1
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WIPO (PCT)
Prior art keywords
packaging box
cavity
mold
packaging
punching
Prior art date
Application number
PCT/CN2018/092338
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English (en)
French (fr)
Inventor
程书华
Original Assignee
如皋纵固精密电子有限公司
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Application filed by 如皋纵固精密电子有限公司 filed Critical 如皋纵固精密电子有限公司
Priority to PCT/CN2018/092338 priority Critical patent/WO2019241988A1/zh
Publication of WO2019241988A1 publication Critical patent/WO2019241988A1/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25HWORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H5/00Tool, instrument or work supports or storage means used in association with vehicles; Workers' supports, e.g. mechanics' creepers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B26F1/14Punching tools; Punching dies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02Internal fittings
    • B65D25/04Partitions

Definitions

  • the utility model relates to the field of electronic carrier processing, in particular to a packaging system for an electronic carrier paper tape punching mold.
  • Chip electronic components are the mainstream form of discrete electronic components at present, and their size is getting smaller and smaller. At present, it has developed to 1.0mm ⁇ 0.5 mm is even 0.5mm ⁇ 0.25mm, or even smaller. At such a small scale, there must be corresponding carriers in the packaging, transportation, and access of components. At present, more plastic carriers are used as packaging carriers or paper carriers are used as miniature chip electronic components.
  • the specific packaging processing technology uses a puncher to punch two rows of holes on a paper carrier tape.
  • One row is a positioning round hole that is easily identified by the automatic identification system (where the distance from the center of the round hole to the edge of the paper tape is called E size)
  • E size the distance from the center of the round hole to the edge of the paper tape.
  • a row of square holes for chip-type electronic components are punched with a punching die after the paper tape enters the punching device through the punching positioning device.
  • Existing punching dies usually include a pair of upper and lower dies that cooperate with each other. Punching needles are installed on the upper dies, and the lower dies have pinholes for inserting the punching needles.
  • the storage of the upper mold and the lower mold is usually directly stored in an ordinary open box or placed directly on the shelf.
  • problems with such storage There are many specifications and quantities of molds and lower molds, so when directly placed on the shelf, it is easy to cause the upper molds and lower molds of different specifications to mix together, leading to mismatches and easy collisions.
  • the upper die is provided with punching pins, it is easy for the punching pins to be bent or crushed.
  • the technical problem to be solved by the utility model is to provide a packaging system for an electronic carrier paper tape punching mold which avoids disorder during storage and can protect the punching needle of the upper mold.
  • the technical solution of the present utility model is: a packaging system for an electronic carrier paper tape punching mold, and its innovations include:
  • a packaging box body which is a hollow rectangular parallelepiped box structure with an open upper end, and has a partition in the packaging box body that divides the cavity of the packaging box body into an upper mold housing cavity and a lower mold housing cavity;
  • the upper mold mounting cavity is rectangular, and at the same time, a pair of support bases are arranged in the packaging cavity of the upper mold inside the packaging box.
  • the support bases are U-shaped, and the two support bases jointly support the upper mold, and There is a gap between the two supporting bases for the punching needle of the upper mold to enter;
  • the lower mold receiving cavity has a waist shape.
  • the distance between the upper end of the support base and the bottom end of the upper cavity in which the upper die is placed is greater than the length of the punching needle on the upper die exposed outside the upper die.
  • the advantage of the utility model is that in the utility model, a set of upper and lower molds can be stored in the packing box through the cooperation between the packing box and the partition, and can be stored separately to avoid collisions with each other. Through the setting of a pair of support bases, the upper mold is supported, so that the upper mold is suspended and the pressing needle is avoided.
  • the thickness of the support seat is designed to be greater than the length of the punching pin to ensure that The punching needle is suspended to avoid bending and crushing.
  • FIG. 1 is a plan view of a packaging system for an electronic carrier paper tape punching mold according to the present invention.
  • FIG. 2 is a side view of a packaging system for an electronic carrier paper tape punching mold according to the present invention.
  • An electronic carrier paper tape punching mold packaging system as shown in Figs. 1 and 2 includes:
  • a packaging box 1 which is a hollow rectangular parallelepiped box structure with an open upper end.
  • the packaging box 1 has a cavity in the packaging box 1 that separates the cavity of the packaging box 1 into an upper mold placing cavity 3 and a lower mold placing cavity. 2 of the partition 4.
  • the upper mold mounting cavity 3 is rectangular.
  • a pair of support bases 5 are provided in the packaging box 1 in the upper mold mounting cavity 3.
  • the support base 5 is U-shaped.
  • the two support bases jointly support the upper mold.
  • a gap is formed between the two support bases 5 to allow the punching needles of the upper mold to enter.
  • the distance between the upper end of the support base 5 and the bottom end of the upper die mounting cavity 3 is greater than the length of the punching needle on the upper die exposed outside the upper die.
  • the thickness of the support base 5 is designed to be greater than the length of the punching needle, so as to ensure that the punching needle is suspended and avoid the phenomenon of bending or crushing.
  • the lower mold receiving cavity 2 has a waist shape.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

一种电子载体纸带打孔模具用包装系统,包括包装箱体(1),该包装箱体为一上端开口的空心长方体箱体结构,在包装箱体内具有一将包装箱体的空腔分隔为上模安放腔(3)与下模安放腔(2)的隔板(4);所述上模安放腔呈矩形状,同时在包装箱体内位于上模安放腔内还设置有一对支撑座(5),所述支撑座呈U字形状,两个支撑座共同实现对上模的支撑,且两个支撑座之间留有容上模的打孔针伸入的间隙;所述下模安放腔呈腰形状。该包装系统通过包装箱体以及隔板之间的配合,从而可将一套上下模存储在包装箱体内,并能分开存储,避免相互间的碰撞。

Description

一种电子载体纸带打孔模具用包装系统 技术领域
本实用新型涉及电子载体加工领域,特别涉及一种电子载体纸带打孔模具用包装系统。
背景技术
随着电器的小型化发展,对电子元器件微型化的要求越来越高,片式电子元件是目前分立电子元器件的主流形式,其尺寸越来越小,目前已经发展到了1.0mm×0.5mm甚至到了0.5mm×0.25mm,甚至更小。在这么小的尺度上,元器件的包装、运输和取用等方面必须要有相应的载体,目前采用较多的是利用塑料载带作为封装载体或利用纸质载带作为微型片式电子元器件的封装载体,但利用塑料载带作为封装载体,电子元器件的尺寸较大时使用塑料载带尚可,在尺寸较小时,塑料载带的生产就非常困难了,其尺寸精度难以保证,因此,用纸质载带作为微型片式电子元器件的封装载体是电子元器件微型化发展的必然趋势。具体封装加工工艺是利用打孔机在一条纸质载带上打出两排孔,一排是便于自动识别系统识别的定位圆孔(其中圆孔中心到邻近纸带边缘的距离称为E尺寸),一排为安放片式电子元件的方形孔,这些孔都是纸带通过打孔定位装置进入打孔装置后用冲孔模具冲制而成的。
现有的冲孔模具其通常包括一对相互配合的上模与下模,在上模上安装有打孔针,在下模上具有容打孔针插入的针孔。而在使用的过 程中,对于上模与下模的存储通常都是直接用一普通的开口箱子存放,或是直接摆放在架子上,但是,这样的存储会存在着几个问题:由于上模与下模的规格、数量较多,因此直接放在架子上的时候,容易导致不同规格的上模与下模混在一起,导致不匹配,而且容易发生碰撞,而直接存放在箱子内时,由于上模上是带有打孔针的,因此就容易出现打孔针被压弯、压坏的情况。
实用新型内容
本实用新型要解决的技术问题是提供一种避免存储时发生错乱、能够保护上模打孔针的电子载体纸带打孔模具用包装系统。
为解决上述技术问题,本实用新型的技术方案为:一种电子载体纸带打孔模具用包装系统,其创新点在于:包括
一包装箱体,该包装箱体为一上端开口的空心长方体箱体结构,在包装箱体内具有一将包装箱体的空腔分隔为上模安放腔与下模安放腔的隔板;
所述上模安放腔呈矩形状,同时在包装箱体内位于上模安放腔内还设置有一对支撑座,所述支撑座呈U字形状,两个支撑座共同实现对上模的支撑,且两个支撑座之间留有容上模的打孔针伸入的间隙;
所述下模安放腔呈腰形状。
进一步的,在包装箱体的两侧以及隔板的上端还开有缺口。
进一步的,所述支撑座的上端距上模安放腔底端的距离大于上模上的打孔针的露出上模外的长度。
本实用新型的优点在于:在本实用新型中,通过包装箱体以及隔 板之间的配合,从而可将一套上下模存储在包装箱体内,并能分开存储,避免相互间的碰撞,另外,通过一对支撑座的设置,从而对上模进行支撑,使得上模悬空,避免压到打空针。
通过在包装箱体的两侧以及隔板上设置缺口,则是为了方便从包装箱体内将下模或上模取出;对于支撑座的厚度设计的大于打孔针的长度,则是为了能够确保打孔针是悬空的,避免其出现压弯、压坏的现象。
附图说明
下面结合附图和具体实施方式对本实用新型作进一步详细的说明。
图1为本实用新型的电子载体纸带打孔模具用包装系统的俯视图。
图2为本实用新型的电子载体纸带打孔模具用包装系统的侧视图。
具体实施方式
下面的实施例可以使本专业的技术人员更全面地理解本实用新型,但并不因此将本实用新型限制在所述的实施例范围之中。
如图1、图2所示的一种电子载体纸带打孔模具用包装系统,包括
一包装箱体1,该包装箱体1为一上端开口的空心长方体箱体结构,在包装箱体1内具有一将包装箱体1的空腔分隔为上模安放腔3与下模安放腔2的隔板4。
如图2所示的示意图可知,在包装箱体1的两侧以及隔板4的上 端还开有缺口6。通过在包装箱体1的两侧以及隔板4上设置缺口6,则是为了方便从包装箱体1内将下模或上模取出。
上模安放腔3呈矩形状,同时在包装箱体1内位于上模安放腔3内还设置有一对支撑座5,支撑座5呈U字形状,两个支撑座共同实现对上模的支撑,且两个支撑座5之间留有容上模的打孔针伸入的间隙。
支撑座5的上端距上模安放腔3底端的距离大于上模上的打孔针的露出上模外的长度。对于支撑座5的厚度设计的大于打孔针的长度,则是为了能够确保打孔针是悬空的,避免其出现压弯、压坏的现象。
下模安放腔2呈腰形状。
本行业的技术人员应该了解,本实用新型不受上述实施例的限制,上述实施例和说明书中描述的只是说明本实用新型的原理,在不脱离本实用新型精神和范围的前提下,本实用新型还会有各种变化和改进,这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等效物界定。

Claims (3)

  1. 一种电子载体纸带打孔模具用包装系统,其特征在于:包括
    一包装箱体,该包装箱体为一上端开口的空心长方体箱体结构,在包装箱体内具有一将包装箱体的空腔分隔为上模安放腔与下模安放腔的隔板;
    所述上模安放腔呈矩形状,同时在包装箱体内位于上模安放腔内还设置有一对支撑座,所述支撑座呈U字形状,两个支撑座共同实现对上模的支撑,且两个支撑座之间留有容上模的打孔针伸入的间隙;
    所述下模安放腔呈腰形状。
  2. 根据权利要求1所述的电子载体纸带打模具用包装系统,其特征在于:在包装箱体的两侧以及隔板的上端还开有缺口。
  3. 根据权利要求1所述的电子载体纸带打模具用包装系统,其特征在于:所述支撑座的上端距上模安放腔底端的距离大于上模上的打孔针的露出上模外的长度。
PCT/CN2018/092338 2018-06-22 2018-06-22 一种电子载体纸带打孔模具用包装系统 WO2019241988A1 (zh)

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* Cited by examiner, † Cited by third party
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US4161382A (en) * 1976-09-15 1979-07-17 Industrie Specializzate Articoli Plastici S.P.A. Apparatus for producing a container matrix
CN201647380U (zh) * 2010-03-30 2010-11-24 江苏中兴药业有限公司 一种能防潮的模具箱
CN201921928U (zh) * 2011-01-12 2011-08-10 常州市伟泰电子科技有限公司 一种大容量数控冲模具柜
CN205221382U (zh) * 2015-12-17 2016-05-11 苏州长征-欣凯制药有限公司 一种胶囊填充机模具存放箱
CN206476286U (zh) * 2017-02-23 2017-09-08 江门市弈创企业管理咨询有限公司 一种模具用分类放置装置
CN208393883U (zh) * 2018-05-11 2019-01-18 如皋纵固精密电子有限公司 一种电子载体纸带打孔模具用包装系统

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4161382A (en) * 1976-09-15 1979-07-17 Industrie Specializzate Articoli Plastici S.P.A. Apparatus for producing a container matrix
CN201647380U (zh) * 2010-03-30 2010-11-24 江苏中兴药业有限公司 一种能防潮的模具箱
CN201921928U (zh) * 2011-01-12 2011-08-10 常州市伟泰电子科技有限公司 一种大容量数控冲模具柜
CN205221382U (zh) * 2015-12-17 2016-05-11 苏州长征-欣凯制药有限公司 一种胶囊填充机模具存放箱
CN206476286U (zh) * 2017-02-23 2017-09-08 江门市弈创企业管理咨询有限公司 一种模具用分类放置装置
CN208393883U (zh) * 2018-05-11 2019-01-18 如皋纵固精密电子有限公司 一种电子载体纸带打孔模具用包装系统

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