WO2019240275A1 - Method for manufacturing screen mask, and exposure device - Google Patents

Method for manufacturing screen mask, and exposure device Download PDF

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Publication number
WO2019240275A1
WO2019240275A1 PCT/JP2019/023721 JP2019023721W WO2019240275A1 WO 2019240275 A1 WO2019240275 A1 WO 2019240275A1 JP 2019023721 W JP2019023721 W JP 2019023721W WO 2019240275 A1 WO2019240275 A1 WO 2019240275A1
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WO
WIPO (PCT)
Prior art keywords
mesh
pattern
exposure
screen mask
mask
Prior art date
Application number
PCT/JP2019/023721
Other languages
French (fr)
Japanese (ja)
Inventor
希仁 青木
華奈 松本
恵 坪井
晃一 旭
Original Assignee
ミタニマイクロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミタニマイクロニクス株式会社 filed Critical ミタニマイクロニクス株式会社
Priority to CN201980015266.4A priority Critical patent/CN111770839A/en
Publication of WO2019240275A1 publication Critical patent/WO2019240275A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/055—Thermographic processes for producing printing formes, e.g. with a thermal print head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • Embodiments described herein relate generally to a method for manufacturing a screen mask and an exposure apparatus.
  • the screen printing method which is one of printing methods, is a method of forming an arbitrary printed body on a printing material using a screen mask in which a predetermined pattern opening formed of a resin composition is formed on a mesh.
  • This screen printing method is used for various printing such as wiring, electrodes, and fluorescent material printing, and is used in various fields including electronic components.
  • the screen mask includes a mesh having holes that can pass through the coating material, and a mask film that is provided in the mesh and has a pattern opening.
  • a pattern opening is formed by an exposure process in which a photomask having a predetermined pattern is overlaid.
  • the mesh is composed of a plurality of mesh wires. For example, when the pattern opening overlaps with the mesh wire, a part of the pattern opening is blocked with the mesh material, so that the print shape changes and it becomes difficult to obtain a desired print shape.
  • An object of the present invention is to provide a method of manufacturing a screen mask and an exposure apparatus capable of high-precision printing.
  • a method of manufacturing a screen mask wherein a mask film of a photosensitive material formed on a mesh portion having a transmission portion that transmits a coating material is irradiated with light with a predetermined exposure pattern, and the mask film is irradiated with light. Exposure processing for forming a predetermined pattern opening, and correcting the exposure pattern based on information of the transmission part.
  • FIG. 1 is an explanatory diagram illustrating the configuration of the screen printing apparatus according to the first embodiment.
  • FIG. 2 is a plan view of a screen mask of the screen printing apparatus.
  • FIG. 3 is an enlarged plan view showing a part of the screen mask.
  • FIG. 4 is an enlarged plan view showing a part of the screen mask.
  • FIG. 5 is an enlarged sectional view showing a part of the screen mask.
  • FIG. 6 is an explanatory view of a solar cell patterned using the screen mask.
  • FIG. 7 is an explanatory diagram showing a method for manufacturing the screen mask according to the embodiment.
  • FIG. 8 is an explanatory view showing the method for manufacturing the screen mask.
  • FIG. 9 is an explanatory view showing a correction process in the manufacturing method of the screen mask.
  • FIG. 1 is an explanatory diagram illustrating the configuration of the screen printing apparatus according to the first embodiment.
  • FIG. 2 is a plan view of a screen mask of the screen printing apparatus.
  • FIG. 3 is an
  • FIG. 10 is an explanatory diagram showing a configuration of a screen mask according to another embodiment.
  • FIG. 11 is an explanatory diagram showing a configuration of a screen mask according to another embodiment.
  • FIG. 12 is an explanatory diagram showing a configuration of a screen mask according to another embodiment.
  • FIG. 13 is an explanatory diagram showing a configuration of a screen mask according to another embodiment.
  • FIG. 14 is an explanatory diagram showing a configuration of a screen mask according to another embodiment.
  • FIG. 15 is an explanatory diagram showing a correction process in a method for manufacturing a screen mask according to another embodiment.
  • FIG. 1 is an explanatory diagram showing a configuration of a screen printing apparatus 10 according to the present embodiment
  • FIG. 2 is a plan view of a screen mask 20 of the screen printing apparatus 10.
  • 3 to 5 are a plan view and a sectional view showing a part of the screen mask 20 in an enlarged manner.
  • FIG. 6 is a perspective view showing a configuration of a solar cell patterned using the screen mask 20.
  • the configuration is appropriately enlarged, reduced, and omitted.
  • arrows X, Y, and Z indicate three directions orthogonal to each other, the first direction is the Y direction, and the second direction is the X direction.
  • the screen printing apparatus 10 includes a screen mask 20 and a holding member 12 that holds a print medium 30 facing one surface (front surface) that is the printing surface side of the screen mask 20.
  • the squeegee 13 is configured to be movable in contact with the other surface (back surface) opposite to the printing surface side of the screen mask 20, moving means for moving the squeegee 13, and the screen mask 20 as the printing medium 30.
  • a supporting means for supporting the opposite face.
  • the screen printing apparatus 10 forms various printing materials in a predetermined pattern on the surface of the printing medium 30.
  • the screen printing apparatus 10 includes, for example, chip components (capacitors, chip resistors, inductors, thermistors, etc.), touch panels, liquid crystal substrates (LCD) seals, LTCC (Low Temperature Co-fired ceramics) substrates, and solar cells. Used for manufacturing electrodes and other electronic components.
  • the screen mask 20 includes a frame 21, a mesh portion 22 stretched on the frame 21, and a photosensitive material mask film 23 formed on the mesh portion 22.
  • the side facing the surface of the print medium 30 when performing printing is the front surface, and the opposite side, the side to which the coating material is supplied, is the back surface.
  • the frame 21 has two pairs of sides parallel to each other, and is configured in a frame shape having a square opening of a desired size, for example.
  • the frame 21 supports the outer peripheral edge of the mesh portion 22 and stretches the mesh portion 22 in the opening.
  • the frame 21 also functions as a frame for holding a predetermined amount of coating material on the back side of the mask film 23.
  • the frame 21 and the mesh portion 22 are joined at a joint portion by, for example, a synthetic rubber-based or cyanoacrylate-based adhesive.
  • the mesh portion 22 is a so-called combination type in which an inner main mesh 26 and an outer support mesh 27 having different elongation rates are fixedly connected with a UV curable adhesive.
  • the mesh portion 22 holds the mask film 23 in the opening portion of the frame 21.
  • the main mesh 26 is configured in a square shape or a rectangular shape.
  • the main mesh 26 is a woven fabric knitted with warp yarns 26a and weft yarns 26b as mesh wire rods, and has a large number of hole portions 26c that are transmissive portions that are open to allow the coating material to pass therethrough.
  • the warp yarns 26a and the weft yarns 26b of the main mesh 26 are made of a metal wire such as stainless steel or tungsten.
  • the diameter d1 of the warp 26a and the diameter d2 of the weft are 10 to 150 ⁇ m, respectively.
  • the warp yarn 26a and the weft yarn 26b have a 90 ° phase difference.
  • the warp yarn 26a is along the X direction and the weft yarn 26b is along the Y direction.
  • the vertical and horizontal dimensions of the hole 26c are 54.6 ⁇ m, respectively
  • the number of meshes is 360.
  • the support mesh 27 is joined to the outer periphery of the main mesh 26 with an adhesive.
  • the support mesh 27 is a woven fabric formed by knitting warps 27a and wefts 27b.
  • the support mesh 27 is configured to have a higher elongation rate than the main mesh 26.
  • the warp 27a and the weft 27b of the support mesh 27 are made of synthetic resin such as polyester, for example.
  • the elongation rate of the main mesh 26 is smaller than the elongation rate of the support mesh 27.
  • the outer shape of the support mesh 27 is a shape corresponding to the shape of the opening portion of the frame 21, and is configured in a square shape in which the dimension in the X direction is the same as the dimension in the Y direction.
  • the outer periphery of the support mesh 27 is joined to and supported by the frame 21 with an adhesive or the like.
  • the mask film 23 is a layer made of a photocurable resin composition such as PVA, PVAc, silicon resin, acrylic resin, epoxy resin, or the like.
  • the mask film 23 is formed on the mesh portion 22 and is disposed in the opening portion of the frame 21.
  • a predetermined pattern opening 23a for printing is formed in the mask film 23 by maskless exposure.
  • the pattern opening 23 a is formed in the effective area of the mask film 23 formed in the main mesh 26.
  • the pattern opening 23a of the present embodiment has a shape corresponding to, for example, the pattern shape of the electrode of the solar cell, and includes a plurality of parallel line-shaped finger portions 23b and a line-shaped bus bar portion 23c extending across the finger portions 23b. And it is comprised in the square shape provided with.
  • a plurality of finger portions 23b are arranged in the vertical direction, and a plurality of bus bar portions are arranged in the horizontal direction. That is, the finger part 23b and the bus bar part 23c extend in the direction along the warp and the weft of the main mesh 26, respectively.
  • the pattern opening 23a has a rectangular shape of 100 mm to 400 mm square
  • the line width dimension wf1 of the finger portion 23b is 0.015 mm to 0.050 mm
  • the pitch Pf1 of the finger portion 23b is 0.5 to 2. It is arranged at 0.0mm.
  • the bus bar portions 23c have a width dimension Wb1 of 0.1 mm to 2.0 mm, a pitch Pb1 of 15 mm to 60 mm, and 3 to 6 lines arranged in the drawing area.
  • the inclination angle between the finger portion 23b and the warp yarn 26a of the mesh material is set to 0 ⁇ 0.1 °, and the inclination angle between the finger portion 23b and the weft yarn 26b of the mesh material is set to 90 ⁇ 5 °.
  • the inclination angle between the bus bar portion 23c and the warp yarn 26a of the mesh material is set to 90 ⁇ 5 °, and the inclination angle between the bus bar portion 23c and the weft yarn 26b of the mesh material is set to 0 ⁇ 5 °.
  • a plurality of finger portions 23b are arranged in parallel in a posture along the direction of the warp 26a, and are arranged so as not to overlap with the warp 26a, that is, along a line of holes 26c between a pair of adjacent warps 26a. It arrange
  • the bus bar portion 23c is arranged along a line of holes 26c between a pair of adjacent wefts 26b so that the opening is in a positional relationship that is not blocked by the mesh yarn.
  • the finger part 23b is orthogonal to the weft thread 26b at 90 degrees, and the bus bar part 23c is orthogonal to the warp thread 26a at 90 degrees.
  • the mask film 23 constitutes a printing part in which the photosensitive resin does not exist in the pattern opening 23a and passes through the hole of the mesh part 22 so that the coating material can be transmitted from the back surface to the front surface.
  • a portion other than the pattern opening 23a of the mask film 23 and where the hole portion of the mesh portion 22 is blocked with a photosensitive resin constitutes a non-printing portion that does not transmit ink as a coating material.
  • the mesh portion 22 on which the mask film 23 is formed is configured to be elastically deformable so as to be bent and deformed by the pressing force of the squeegee 13, for example, and restored when the pressing force is released.
  • the mask film 23 contacts and separates from the printing medium 30 due to elastic deformation of the mesh portion 22, so that the coating material is transferred from the pattern opening 23a to the printing medium 30. Is done.
  • the squeegee 13 is made of a material such as urethane rubber, silicon rubber, synthetic rubber, metal or plastic, for example, in a thin plate shape.
  • the squeegee 13 is chamfered so that the thickness of the tip is reduced.
  • the squeegee 13 is configured to be able to reciprocate relative to the frame 21.
  • the squeegee 13 has a length extending over the entire length of the mask film 23 in a direction orthogonal to the moving direction.
  • the tip portion 13a of the squeegee 13 is in contact with the back surface of the screen mask 20 and is pressed to the front side, so that it moves in the moving direction along the Y direction, thereby pressing the entire surface of the mask film 23 and pre-filled with the coating material.
  • the coating material is extruded to the front side from the pattern opening 23a.
  • the support means supports the frame 21 in parallel with the print medium 30 at a predetermined interval.
  • the moving means moves the squeegee 13 along the first direction at a predetermined speed.
  • the surface side of the screen mask 20 is arranged to face the surface of the print medium 30 held by the holding member 12.
  • a high-viscosity paste-like coating material is supplied from the back side of the screen mask 20, that is, the surface opposite to the printing medium 30, and the coating material is filled into the pattern openings 23a.
  • the squeegee 13 is arranged on the back surface of the screen mask 20, that is, the surface opposite to the printing surface side. At this time, for example, the squeegee 13 is arranged at a predetermined angle ⁇ with respect to the surface on the front side of the print medium 30. The squeegee 13 is moved at a predetermined speed along the Y direction while pressing the squeegee 13 toward the print medium 30 with a predetermined printing pressure on the back surface of the mesh portion 22 and the mask film 23.
  • the squeegee 13 presses the mask film 23 in an area covering the entire back surface of the mask film 23, for example.
  • the mask film 23 is deformed so that the pressed portion is displaced to the front side, and comes into contact with the printing medium 30.
  • the coating material through which the squeegee 13 has passed is pushed out from the pattern opening 23a to the print medium 30 side.
  • the coating material is various materials including, for example, a metal material and a resin material, and various materials are used depending on the type of print target, for example, an electronic component, a display, and the like.
  • the solar cell 100 shown in FIG. 6 is patterned using, for example, the screen mask 20, and an electrode 123 having a pattern shape corresponding to the pattern opening 23 a of the screen mask 20 is formed.
  • the electrode 123 includes line-shaped finger electrodes 123b and bus bar electrodes 123c corresponding to the plurality of finger portions 23b and the plurality of bus bar portions 23c, which are line-shaped openings in the pattern openings 23a.
  • the squeegee 13 that is long in the X direction is moved in the Y direction by a predetermined amount while being pressed in the Z direction.
  • the mesh portion 22 is deformed and stretched.
  • FIGS. 7 and 8 are explanatory views showing a method for manufacturing the screen mask 20, and FIG. 7 shows a configuration of the mesh detection device 60.
  • FIG. 8 shows an exposure apparatus.
  • FIG. 9 is an explanatory diagram showing the correction process.
  • the manufacturing method of the screen mask 20 includes mesh data detection processing, emulsion Pm coating processing, and exposure processing.
  • a mesh base having a mesh portion 22 attached inside the frame 21 is set, and mesh pattern data including information on the position and shape of the mesh wire and the transmission portion is detected by a scanning process.
  • a mesh pattern detection process is performed.
  • the mesh detection device 60 detects, as CAD data, mesh pattern data that is information on the shape and size of the mesh portion 22 and the positions and shapes of the warps 26a, wefts 26b, and holes 26c of the main mesh 26.
  • the mesh detection device 60 stores the mesh data and transmits it to the exposure device 50.
  • a coating process for coating the emulsion Pm on the mesh portion 22 is performed to form the emulsion Pm on the mesh portion 22 in a flat plate shape.
  • the emulsion Pm used as a mask material is a photo-curable resin, and is a liquid including, for example, polyvinyl alcohol (PVA), polyvinyl acetate (PVAc), silicon resin, acrylic resin, epoxy resin, and the like.
  • PVA polyvinyl alcohol
  • PVAc polyvinyl acetate
  • silicon resin acrylic resin
  • epoxy resin epoxy resin
  • the coating process may be repeated a plurality of times as necessary.
  • the thickness of the emulsion Pm is set so that the milk thickness tm is about 10 ⁇ m after drying.
  • the mesh may be applied in a horizontal posture or may be applied in a vertical posture.
  • a maskless exposure process is performed with a predetermined exposure pattern using a so-called maskless exposure apparatus 50 (maskless exposure machine) that does not use a photomask.
  • FIG. 8 is an explanatory diagram showing the configuration of the exposure apparatus 50.
  • the exposure apparatus 50 includes a support device 51, an irradiation head 52 including a DMD element, and a control device 57 that controls the operation of each unit.
  • the exposure apparatus 50 is an exposure apparatus that directly draws on the screen mask 20 with the irradiation head 52 in a predetermined exposure pattern without interposing a photomask.
  • the support device 51 includes a stage 51 a that can move a mesh member having the frame 21 and the mesh portion 22.
  • the support device 51 is driven by, for example, the control of the control device 57, and includes a moving mechanism that moves the stage 51a in, for example, two directions of the X axis and the Y axis.
  • the stage 51a includes a suction mechanism, for example. The moving mechanism relatively moves the irradiation head 52 and the screen mask 20.
  • the irradiation head 52 is configured to be able to irradiate lasers having a plurality of wavelengths. For example, it is driven by the control of the control device 57 and irradiates, for example, a laser having two wavelengths (375 and 405 nm) alone or in combination.
  • the irradiation head 52 includes a laser light source 52a that emits laser light, a plurality of DMD elements 52b as irradiation elements that reflect and irradiate light from the laser light source 52a, and a microlens array 52c.
  • Each DMD element 52b is ON / OFF controlled in accordance with a predetermined exposure pattern stored or calculated as CAD data under the control of the control unit 57a, and laser light is emitted from the element to the mask film 23 in the ON state. Irradiated.
  • the laser light is condensed by the microlens array 52c. For example, the DMD element 52b is switched on / off several tens of thousands of times per second.
  • the control device 57 includes a control unit 57a that executes a predetermined program, and a storage unit 57b that stores various programs and setting values.
  • the storage unit 57b stores drawing data such as an exposure pattern, output conditions for exposure processing, and the like.
  • the controller 57a drives the irradiation head 52 and the support device 51 based on, for example, preset programs and various data, thereby exposing the mask film 23 with a predetermined exposure pattern to form a pattern opening 23a. .
  • control unit 57a corrects the exposure pattern based on the mesh pattern data including the position information of the hole 26c. That is, the control unit 57a performs correction processing (adjustment processing) on the base pattern data, which is CAD data set in advance corresponding to the shape of the pattern opening to be drawn, based on the mesh information, and performs actual exposure processing. An exposure pattern which is CAD data of the pattern is determined.
  • the control unit 57a adjusts the positional relationship between the pattern opening 23a and the hole 26c of the mesh unit 22 in the target drawing area. For example, the control unit 57a adjusts any one or more of the opening width and pitch of the line-shaped openings 23d of the pattern openings 23a, and the inclination angle between the mesh wire 26d and the line-shaped openings 23d.
  • position adjustment is performed so that the opening of the pattern opening 23a overlaps with the position of the mesh hole (transmission part) 26c.
  • the position, size, inclination angle, and exposure pattern of the exposure pattern with respect to the mask film 23 are adjusted.
  • the opening width and pitch of each line-shaped opening 23d are increased or decreased.
  • the pattern opening 23 a has a shape in which a plurality of finger portions 23 b that are line-shaped openings 23 d having a width dimension of 0.03 mm are arranged at intervals of 0.18 mm. Is illustrated.
  • the control unit detects the data of the main mesh 26 by scanning, converts the opening position of the mesh, that is, the position of the transmission part, into data, and detects the arrangement direction of the transmission parts and the parallel interval.
  • the control unit increases or decreases the arrangement interval or extension angle of the finger portions 23b according to the arrangement interval or parallel angle of the transmission portions.
  • the control unit inclines the extending direction of the finger portions 23b in accordance with the extending direction of the row of transmitting portions.
  • the relative angle between the pattern opening 23a and the mesh portion 22 is adjusted so that the inclination angle with the warp yarn 26a that is the mesh wire 26d is in the range of -5 degrees to 5 degrees, preferably 0 degrees.
  • the center line as the reference position of the finger portion 23b is brought closer to the intermediate position of the pair of warps 26a.
  • the center line of the finger portion 23b is overlapped with the middle line of the pair of warps 26a.
  • the pitch Pf1 that is the interval between the arrangement of the finger portions 23b is set to a multiple of the pitch Pm1 of the warps 26a, so that all the finger portions 23b do not overlap with the warps 26a of the main mesh 26.
  • the interval is changed from 0.18 mm to 0.22 mm.
  • the center line of the bus bar portion 23c is disposed at an intermediate position between the pair of wefts 26b, and the opening is not blocked by the mesh thread.
  • the position of the bus bar portion in the exposure pattern is adjusted so that the relationship is established.
  • a wide pattern such as a bus bar may have a relatively large weft and tilt angle. Therefore, in the case of having line-shaped openings in a plurality of different directions, the angle is adjusted by giving priority to the direction of the narrow line-shaped openings.
  • the correction amount for shifting the position of the line-shaped opening is ⁇ 0.05 mm or less.
  • the correction amount for shifting the position of the line-shaped opening is preferably equal to or smaller than the line width.
  • the correction amount for shifting the position of the finger part 23b is 0.03 mm or less.
  • the correction amount of the line-shaped opening may be set to 1 ⁇ 2 or less of the line width. That is, for example, in a # 360 mesh having 360 meshes, when the line width of the finger portion 23b and the electrode is 0.071, it is set to ⁇ 0.035 or less.
  • the exposure process is an exposure process in which light is irradiated from the printing surface side, and a predetermined range corresponding to the exposure pattern is cured by exposing with a predetermined exposure pattern.
  • the surface side of the emulsion Pm is arranged in a predetermined area toward an irradiation head such as an ultraviolet lamp or an ultraviolet LED, and light is irradiated by the irradiation head 52 to perform exposure processing for illuminating the surface of the emulsion Pm.
  • the exposure amount is about 1000 mJ / cm 2, for example.
  • the control unit 57a irradiates a predetermined exposure area with laser light based on the calculated exposure pattern data. At this time, a predetermined drawing area may be exposed while scanning an area narrower than the drawing area divided into a plurality of times.
  • the portion of the emulsion Pm irradiated with the ultraviolet ray corresponding to the portion of the exposure pattern is cured by the ultraviolet ray.
  • the surface side of the emulsion Pm is washed away with water or a solvent as an etching process.
  • the uncured portion of the emulsion Pm is washed away. That is, in the emulsion Pm layer, all uncured regions are washed away, and pattern openings 23a penetrating from the front surface side to the back surface side in the thickness direction are formed.
  • a mask film 23 having a pattern opening 23a having a predetermined shape is formed from the emulsion Pm.
  • the method for manufacturing a screen mask configured as described above, it is possible to suppress the opening from being blocked by the mesh wire material 26d by correcting the positions of the pattern openings 23a and the holes 26c. Therefore, it is possible to manufacture the screen mask 20 that can obtain a desired printed shape. Therefore, for example, in a screen mask for forming an electrode of a solar cell having many finger portions 23b which are fine line-shaped openings 23d, the pattern shape is not interrupted, and variations in the opening width are reduced, so that disconnection and increase in resistance value can be prevented. A stable electrode can be formed. In addition, in the electrode of a solar cell, the performance as a solar cell electrode can be ensured by setting the correction amount to 0.05 mm or less, or a line width or less, more preferably 1/2 or less of the line width.
  • correction processing according to the shape of each mesh portion 22 can be easily realized by performing maskless exposure without using a photomask. That is, for example, in the case of pattern formation using a photomask, it is necessary to form a photomask that matches the shape of the mesh for each mesh. By simply correcting the exposure data of exposure, correction according to individual mesh shapes can be realized, and a screen mask capable of forming a highly accurate pattern can be formed.
  • FIG. 10 is an explanatory diagram showing correspondence between a plurality of types of mesh portions 22 and pattern openings 23a.
  • ⁇ indicates the wire diameter of the warp yarn 26a and the weft yarn 26b of the mesh portion 22
  • OP indicates the opening width of the mesh portion 22.
  • the pattern opening 23a for forming the electrode for the solar battery is exemplified, but the present invention is not limited to this.
  • the angle may be adjusted so that both the warp yarn 26a and the weft yarn 26b are inclined. Good. Even in this case, since each line-shaped opening 23d is not blocked by the mesh wire 26d, the same effect as the above embodiment can be obtained.
  • the respective line-shaped portions are represented by warps 26a and wefts.
  • the effect similar to that of the above-described embodiment can be obtained by arranging in the direction along each of 26b and correcting so that the line-shaped opening 23d is arranged between the adjacent mesh wires 26d.
  • each opening 23e, 23f is formed in a hole 26c of the mesh part 22. You may correct
  • each constituent element exemplified in the above embodiment may be deleted, and the shape, structure, material, and the like of each constituent element may be changed.
  • Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment.
  • DMD element 52c ... microlens array, 57 ... control device, 57a ... control unit, 57b ... storage unit, 60 ... Mesh detector, 61 ... support device, 62 ... scan head, 63 ... LED illumination.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)

Abstract

Provided are a method for manufacturing a screen mask capable of high-precision printing, and an exposure device. A method for manufacturing a screen mask according to one aspect of the present invention comprises: an exposure process, in which light is radiated in a prescribed exposure pattern onto a mask film of a photosensitive material formed on a mesh part having a transmissive part where a coating material is transmissive, and openings in a prescribed pattern are formed in the mask film; and the act of correcting the exposure pattern on the basis of information on the transmissive part.

Description

スクリーンマスクの製造方法及び露光装置Screen mask manufacturing method and exposure apparatus
　本発明の実施形態は、スクリーンマスクの製造方法、及び露光装置に関する。 Embodiments described herein relate generally to a method for manufacturing a screen mask and an exposure apparatus.
　印刷手法の一つであるスクリーン印刷法は、メッシュ上に樹脂組成物で形成された所定のパターン開口が形成されたスクリーンマスクを用い、被印刷物に任意の印刷体を形成する方法である。このスクリーン印刷法は、例えば配線、電極、蛍光材料の印刷等、種々の印刷に用いられ、電子部品等を含む様々な分野で利用されている。 The screen printing method, which is one of printing methods, is a method of forming an arbitrary printed body on a printing material using a screen mask in which a predetermined pattern opening formed of a resin composition is formed on a mesh. This screen printing method is used for various printing such as wiring, electrodes, and fluorescent material printing, and is used in various fields including electronic components.
　近年、電子部品の小型化、高品質化により、スクリーンマスクの高精度化が求められている。 In recent years, high precision of screen masks has been required due to miniaturization and high quality of electronic components.
　例えば、スクリーンマスクは、塗布材を透過可能な孔を有するメッシュと、メッシュに設けられパターン開口を有するマスク膜と、を備える。例えばマスク膜を形成する乳剤をメッシュに塗布した後に、所定のパターンを有するフォトマスクを重ねた露光処理によってパターン開口を形成している。 For example, the screen mask includes a mesh having holes that can pass through the coating material, and a mask film that is provided in the mesh and has a pattern opening. For example, after an emulsion for forming a mask film is applied to a mesh, a pattern opening is formed by an exposure process in which a photomask having a predetermined pattern is overlaid.
　メッシュは、複数のメッシュ線材が編成されて構成されている。例えばパターン開口がメッシュ線材と重なる場合、パターン開口の一部がメッシュ材で塞がれることにより、印刷形状が変わり、所望の印刷形状を得ることが困難となる。 The mesh is composed of a plurality of mesh wires. For example, when the pattern opening overlaps with the mesh wire, a part of the pattern opening is blocked with the mesh material, so that the print shape changes and it becomes difficult to obtain a desired print shape.
日本国特開２０１３－１６９７８３号公報Japanese Laid-Open Patent Publication No. 2013-169783
　本発明は高精度の印刷が可能なスクリーンマスクの製造方法、及び露光装置、を提供することを目的とする。 An object of the present invention is to provide a method of manufacturing a screen mask and an exposure apparatus capable of high-precision printing.
　本発明の一態様にかかるスクリーンマスクの製造方法は、塗布材を透過する透過部を有するメッシュ部に形成された感光性材料のマスク膜に所定の露光パターンで光を照射し、前記マスク膜に所定のパターン開口を形成する露光処理と、前記透過部の情報に基づき、前記露光パターンを補正することと、を備える。 According to an aspect of the present invention, there is provided a method of manufacturing a screen mask, wherein a mask film of a photosensitive material formed on a mesh portion having a transmission portion that transmits a coating material is irradiated with light with a predetermined exposure pattern, and the mask film is irradiated with light. Exposure processing for forming a predetermined pattern opening, and correcting the exposure pattern based on information of the transmission part.
　本発明の実施形態によれば、高精細なパターン形成が可能なスクリーンマスクの製造方法、及び露光装置、を提供できる。 According to the embodiment of the present invention, it is possible to provide a screen mask manufacturing method and an exposure apparatus capable of forming a high-definition pattern.
図１は、第１実施形態にかかるスクリーン印刷装置の構成を示す説明図である。FIG. 1 is an explanatory diagram illustrating the configuration of the screen printing apparatus according to the first embodiment. 図２は、同スクリーン印刷装置のスクリーンマスクの平面図である。FIG. 2 is a plan view of a screen mask of the screen printing apparatus. 図３は、同スクリーンマスクの一部を拡大して示す平面図である。FIG. 3 is an enlarged plan view showing a part of the screen mask. 図４は、同スクリーンマスクの一部を拡大して示す平面図である。FIG. 4 is an enlarged plan view showing a part of the screen mask. 図５は、同スクリーンマスクの一部を拡大して示す断面図である。FIG. 5 is an enlarged sectional view showing a part of the screen mask. 図６は、同スクリーンマスクを用いてパターン形成された太陽電池の説明図である。FIG. 6 is an explanatory view of a solar cell patterned using the screen mask. 図７は、同実施形態にかかるスクリーンマスクの製造方法を示す説明図である。FIG. 7 is an explanatory diagram showing a method for manufacturing the screen mask according to the embodiment. 図８は、同スクリーンマスクの製造方法を示す説明図である。FIG. 8 is an explanatory view showing the method for manufacturing the screen mask. 図９は、同スクリーンマスクの製造方法における補正処理を示す説明図である。FIG. 9 is an explanatory view showing a correction process in the manufacturing method of the screen mask. 図１０は、他の実施形態にかかるスクリーンマスクの構成を示す説明図である。FIG. 10 is an explanatory diagram showing a configuration of a screen mask according to another embodiment. 図１１は、他の実施形態にかかるスクリーンマスクの構成を示す説明図である。FIG. 11 is an explanatory diagram showing a configuration of a screen mask according to another embodiment. 図１２は、他の実施形態にかかるスクリーンマスクの構成を示す説明図である。FIG. 12 is an explanatory diagram showing a configuration of a screen mask according to another embodiment. 図１３は、他の実施形態にかかるスクリーンマスクの構成を示す説明図である。FIG. 13 is an explanatory diagram showing a configuration of a screen mask according to another embodiment. 図１４は、他の実施形態にかかるスクリーンマスクの構成を示す説明図である。FIG. 14 is an explanatory diagram showing a configuration of a screen mask according to another embodiment. 図１５は、他の実施形態にかかるスクリーンマスクの製造方法における補正処理を示す説明図である。FIG. 15 is an explanatory diagram showing a correction process in a method for manufacturing a screen mask according to another embodiment.
　以下、本発明の第１実施形態にかかるスクリーン印刷装置１０及びスクリーンマスク２０について図１乃至図３を参照して説明する。図１は本実施形態に係るスクリーン印刷装置１０の構成を示す説明図であり、図２は同スクリーン印刷装置１０のスクリーンマスク２０の平面図である。図３乃至図５はスクリーンマスク２０の一部を拡大して示す平面図及び断面図である。図６はスクリーンマスク２０を用いてパターニングされた太陽電池の構成を示す斜視図である。なお、各図では説明のため、適宜構成を拡大、縮小、省略して示している。図中矢印Ｘ，Ｙ，Ｚは互いに直交する３方向をそれぞれ示しており、第１方向はＹ方向、第２方向はＸ方向である。 Hereinafter, the screen printing apparatus 10 and the screen mask 20 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is an explanatory diagram showing a configuration of a screen printing apparatus 10 according to the present embodiment, and FIG. 2 is a plan view of a screen mask 20 of the screen printing apparatus 10. 3 to 5 are a plan view and a sectional view showing a part of the screen mask 20 in an enlarged manner. FIG. 6 is a perspective view showing a configuration of a solar cell patterned using the screen mask 20. In each figure, for the sake of explanation, the configuration is appropriately enlarged, reduced, and omitted. In the figure, arrows X, Y, and Z indicate three directions orthogonal to each other, the first direction is the Y direction, and the second direction is the X direction.
　図１及び図２に示すように、スクリーン印刷装置１０は、スクリーンマスク２０と、スクリーンマスク２０の印刷面側である一方の面（表面）に対向して印刷媒体３０を保持する保持部材１２と、スクリーンマスク２０の印刷面側とは反対の他方の面（裏面）に当接した状態で移動可能に構成されたスキージ１３と、スキージ１３を移動させる移動手段と、スクリーンマスク２０を印刷媒体３０に対向して支持する支持手段と、を備える。 As shown in FIGS. 1 and 2, the screen printing apparatus 10 includes a screen mask 20 and a holding member 12 that holds a print medium 30 facing one surface (front surface) that is the printing surface side of the screen mask 20. The squeegee 13 is configured to be movable in contact with the other surface (back surface) opposite to the printing surface side of the screen mask 20, moving means for moving the squeegee 13, and the screen mask 20 as the printing medium 30. And a supporting means for supporting the opposite face.
　スクリーン印刷装置１０は、印刷媒体３０の表面に、各種印刷材料を所定のパターンで形成する。スクリーン印刷装置１０は、例えば、チップ部品（コンデンサー、チップ抵抗、インダクター、サーミスター等）、タッチパネル、液晶基板（Ｌｉｑｕｉｄ　ｃｒｙｓｔａｌ　ｄｉｓｐｌａｙ，　ＬＣＤ）シール、ＬＴＣＣ（Ｌｏｗ　Ｔｅｍｐｅｒａｔｕｒｅ　Ｃｏ－ｆｉｒｅｄ　ｃｅｒａｍｉｃｓ）基板、太陽電池用電極、その他の電子部品等の製造に用いられる。 The screen printing apparatus 10 forms various printing materials in a predetermined pattern on the surface of the printing medium 30. The screen printing apparatus 10 includes, for example, chip components (capacitors, chip resistors, inductors, thermistors, etc.), touch panels, liquid crystal substrates (LCD) seals, LTCC (Low Temperature Co-fired ceramics) substrates, and solar cells. Used for manufacturing electrodes and other electronic components.
　スクリーンマスク２０は、フレーム２１と、フレーム２１に張設されたメッシュ部２２と、メッシュ部２２に形成された感光性材料のマスク膜２３と、を備える。スクリーンマスク２０において、印刷を行う際に印刷媒体３０の表面に対向する側を表面とし、その反対側であって塗布材が供給される側を裏面とする。 The screen mask 20 includes a frame 21, a mesh portion 22 stretched on the frame 21, and a photosensitive material mask film 23 formed on the mesh portion 22. In the screen mask 20, the side facing the surface of the print medium 30 when performing printing is the front surface, and the opposite side, the side to which the coating material is supplied, is the back surface.
　フレーム２１は、互いに平行な２対の辺を有し、例えば所望のサイズの方形の開口を備える枠状に構成される。フレーム２１はメッシュ部２２の外周縁を支持し、開口にメッシュ部２２を張設する。 The frame 21 has two pairs of sides parallel to each other, and is configured in a frame shape having a square opening of a desired size, for example. The frame 21 supports the outer peripheral edge of the mesh portion 22 and stretches the mesh portion 22 in the opening.
　またフレーム２１は、所定量の塗布材をマスク膜２３の裏面側に保持する枠としても機能する。フレーム２１とメッシュ部２２は、例えば合成ゴム系やシアノアクリレート系の接着剤により接合部で接合されている。 The frame 21 also functions as a frame for holding a predetermined amount of coating material on the back side of the mask film 23. The frame 21 and the mesh portion 22 are joined at a joint portion by, for example, a synthetic rubber-based or cyanoacrylate-based adhesive.
　メッシュ部２２は、伸び率の異なる内側のメインメッシュ２６と外側のサポートメッシュ２７とがＵＶ硬化性の接着剤で固定されて接続されたいわゆるコンビネーション型である。メッシュ部２２は、フレーム２１の開口部分にマスク膜２３を保持する。 The mesh portion 22 is a so-called combination type in which an inner main mesh 26 and an outer support mesh 27 having different elongation rates are fixedly connected with a UV curable adhesive. The mesh portion 22 holds the mask film 23 in the opening portion of the frame 21.
　図１乃至図５に示すように、メインメッシュ２６は、正方形状又は長方形状に構成されている。メインメッシュ２６は、メッシュ線材としての経糸２６ａ及び緯糸２６ｂにより編成された織物であり、塗布材を透過可能に開口した透過部である孔部２６ｃを多数有している。メインメッシュ２６の経糸２６ａと緯糸２６ｂは、例えばステンレス，タングステン等の金属のワイヤで構成される。経糸２６ａの径ｄ１と緯糸の径ｄ２はそれぞれ１０～１５０μｍである。経糸２６ａと緯糸２６ｂとは９０°位相が異なり、例えば経糸２６ａはＸ方向、緯糸２６ｂがＹ方向に沿う。一例として本実施形態においてはｄ１＝ｄ２＝φ１６μｍ、孔部２６ｃの縦横の寸法はそれぞれ５４．６μｍ、メッシュ数はいずれも３６０本とした。 As shown in FIGS. 1 to 5, the main mesh 26 is configured in a square shape or a rectangular shape. The main mesh 26 is a woven fabric knitted with warp yarns 26a and weft yarns 26b as mesh wire rods, and has a large number of hole portions 26c that are transmissive portions that are open to allow the coating material to pass therethrough. The warp yarns 26a and the weft yarns 26b of the main mesh 26 are made of a metal wire such as stainless steel or tungsten. The diameter d1 of the warp 26a and the diameter d2 of the weft are 10 to 150 μm, respectively. The warp yarn 26a and the weft yarn 26b have a 90 ° phase difference. For example, the warp yarn 26a is along the X direction and the weft yarn 26b is along the Y direction. As an example, in the present embodiment, d1 = d2 = φ16 μm, the vertical and horizontal dimensions of the hole 26c are 54.6 μm, respectively, and the number of meshes is 360.
　サポートメッシュ２７は、メインメッシュ２６の外周に接着剤によって接合されている。サポートメッシュ２７は、経糸２７ａと緯糸２７ｂとが編まれて形成された織物である。サポートメッシュ２７は、メインメッシュ２６よりも伸び率が高く構成されている。サポートメッシュ２７の、経糸２７ａと緯糸２７ｂとは、例えば、ポリエステルなどの合成樹脂で構成されている。 The support mesh 27 is joined to the outer periphery of the main mesh 26 with an adhesive. The support mesh 27 is a woven fabric formed by knitting warps 27a and wefts 27b. The support mesh 27 is configured to have a higher elongation rate than the main mesh 26. The warp 27a and the weft 27b of the support mesh 27 are made of synthetic resin such as polyester, for example.
　例えば本実施形態において、メインメッシュ２６の伸び率は、サポートメッシュ２７の伸び率よりも小さい。 For example, in this embodiment, the elongation rate of the main mesh 26 is smaller than the elongation rate of the support mesh 27.
　サポートメッシュ２７の外形はフレーム２１の開口部分の形状に対応する形状であって、Ｘ方向の寸法とＹ方向の寸法が同等の正方形状に構成されている。サポートメッシュ２７の外周が接着剤等によってフレーム２１に接合され、支持されている。 The outer shape of the support mesh 27 is a shape corresponding to the shape of the opening portion of the frame 21, and is configured in a square shape in which the dimension in the X direction is the same as the dimension in the Y direction. The outer periphery of the support mesh 27 is joined to and supported by the frame 21 with an adhesive or the like.
　マスク膜２３は、光硬化性の樹脂組成物、例えばＰＶＡ、ＰＶＡｃ、シリコン樹脂、アクリル樹脂、エポキシ樹脂等からなる層である。マスク膜２３は、メッシュ部２２に形成され、フレーム２１の開口部分に配されている。マスク膜２３には、マスクレス露光によって、印刷用の所定のパターン開口２３ａが形成されている。 The mask film 23 is a layer made of a photocurable resin composition such as PVA, PVAc, silicon resin, acrylic resin, epoxy resin, or the like. The mask film 23 is formed on the mesh portion 22 and is disposed in the opening portion of the frame 21. A predetermined pattern opening 23a for printing is formed in the mask film 23 by maskless exposure.
　パターン開口２３ａはメインメッシュ２６に形成されたマスク膜２３の有効エリア内に形成されている。本実施形態のパターン開口２３ａは例えば太陽電池の電極のパターン形状に対応した形状であり、複数本の平行なライン状のフィンガー部２３ｂと、フィンガー部２３ｂと交差して延びるライン状のバスバー部２３ｃと、を備える方形状に構成されている。 The pattern opening 23 a is formed in the effective area of the mask film 23 formed in the main mesh 26. The pattern opening 23a of the present embodiment has a shape corresponding to, for example, the pattern shape of the electrode of the solar cell, and includes a plurality of parallel line-shaped finger portions 23b and a line-shaped bus bar portion 23c extending across the finger portions 23b. And it is comprised in the square shape provided with.
　フィンガー部２３ｂは縦方向に、バスバー部が横方向に、複数、配列されている。すなわち、フィンガー部２３ｂとバスバー部２３ｃがそれぞれメインメッシュ２６の経糸及び緯糸に沿う方向に延びている。 A plurality of finger portions 23b are arranged in the vertical direction, and a plurality of bus bar portions are arranged in the horizontal direction. That is, the finger part 23b and the bus bar part 23c extend in the direction along the warp and the weft of the main mesh 26, respectively.
　一例として、本実施形態において、パターン開口２３ａは１００ｍｍ～４００ｍｍ四方の矩形状、フィンガー部２３ｂのラインの幅寸法ｗｆ１は０．０１５ｍｍ～０．０５０ｍｍ、フィンガー部２３ｂのピッチＰｆ１＝０．５～２．０ｍｍで配置されている。バスバー部２３ｃは、幅寸法Ｗｂ１は０．１ｍｍ～２．０ｍｍで、ピッチＰｂ１は１５ｍｍ～６０ｍｍで、描画エリア内に３～６本、配列されている。フィンガー部２３ｂとメッシュ材の経糸２６ａとの傾斜角は０±０．１°、フィンガー部２３ｂとメッシュ材の緯糸２６ｂとの傾斜角は９０±５°に設定される。バスバー部２３ｃとメッシュ材の経糸２６ａとの傾斜角は９０±５°、バスバー部２３ｃとメッシュ材の緯糸２６ｂとの傾斜角は０±５°に設定される。 As an example, in the present embodiment, the pattern opening 23a has a rectangular shape of 100 mm to 400 mm square, the line width dimension wf1 of the finger portion 23b is 0.015 mm to 0.050 mm, and the pitch Pf1 of the finger portion 23b is 0.5 to 2. It is arranged at 0.0mm. The bus bar portions 23c have a width dimension Wb1 of 0.1 mm to 2.0 mm, a pitch Pb1 of 15 mm to 60 mm, and 3 to 6 lines arranged in the drawing area. The inclination angle between the finger portion 23b and the warp yarn 26a of the mesh material is set to 0 ± 0.1 °, and the inclination angle between the finger portion 23b and the weft yarn 26b of the mesh material is set to 90 ± 5 °. The inclination angle between the bus bar portion 23c and the warp yarn 26a of the mesh material is set to 90 ± 5 °, and the inclination angle between the bus bar portion 23c and the weft yarn 26b of the mesh material is set to 0 ± 5 °.
　フィンガー部２３ｂは経糸２６ａの方向に沿う姿勢で複数並列配置されるとともに、経糸２６ａに重ならない位置、すなわち隣合う一対の経糸２６ａの間の孔部２６ｃの並びに沿って配され、マスク膜２３の開口がメッシュ線材によって塞がれない位置関係となるように配置されている。一方、バスバー部２３ｃは隣合う一対の緯糸２６ｂの間の孔部２６ｃの並びに沿って配され、開口がメッシュの糸によって塞がれない位置関係となるように配置されている。なお、フィンガー部２３ｂは緯糸２６ｂとは９０度で直交し、バスバー部２３ｃは経糸２６ａとは９０度で直交している。 A plurality of finger portions 23b are arranged in parallel in a posture along the direction of the warp 26a, and are arranged so as not to overlap with the warp 26a, that is, along a line of holes 26c between a pair of adjacent warps 26a. It arrange | positions so that it may become the positional relationship which opening is not obstruct | occluded with a mesh wire. On the other hand, the bus bar portion 23c is arranged along a line of holes 26c between a pair of adjacent wefts 26b so that the opening is in a positional relationship that is not blocked by the mesh yarn. The finger part 23b is orthogonal to the weft thread 26b at 90 degrees, and the bus bar part 23c is orthogonal to the warp thread 26a at 90 degrees.
　マスク膜２３は、パターン開口２３ａにおいて感光性樹脂が存在せず、メッシュ部２２の孔部を通過して塗布材が裏面から表面へと透過可能な印刷部を構成する。マスク膜２３のパターン開口２３ａ以外であってメッシュ部２２の孔部が感光性樹脂で塞がれた部位は、塗布材としてのインクを透過しない非印刷部を構成する。 The mask film 23 constitutes a printing part in which the photosensitive resin does not exist in the pattern opening 23a and passes through the hole of the mesh part 22 so that the coating material can be transmitted from the back surface to the front surface. A portion other than the pattern opening 23a of the mask film 23 and where the hole portion of the mesh portion 22 is blocked with a photosensitive resin constitutes a non-printing portion that does not transmit ink as a coating material.
　マスク膜２３が形成されたメッシュ部２２は、例えばスキージ１３による押圧力によって撓み変形し、押圧力が解除されることで復元するように、弾性変形可能に構成されている。マスク膜２３のパターン開口２３ａに塗布材が保持された状態で、メッシュ部２２の弾性変形によりマスク膜２３が印刷媒体３０に接離することで、塗布材がパターン開口２３ａから印刷媒体３０に転写される。 The mesh portion 22 on which the mask film 23 is formed is configured to be elastically deformable so as to be bent and deformed by the pressing force of the squeegee 13, for example, and restored when the pressing force is released. With the coating material held in the pattern opening 23a of the mask film 23, the mask film 23 contacts and separates from the printing medium 30 due to elastic deformation of the mesh portion 22, so that the coating material is transferred from the pattern opening 23a to the printing medium 30. Is done.
　スキージ１３は例えばウレタンゴム・シリコンゴム・合成ゴム・金属・プラスチック等の材料から、例えば薄い板状に構成される。例えば、スキージ１３は先端の厚みが低減するように面取りされている。スキージ１３はフレーム２１に対して相対的に往復移動可能に構成されている。例えばスキージ１３は移動方向と直交する方向においてマスク膜２３の領域の全長にわたる長さを有して構成される。スキージ１３の先端部分１３ａがスクリーンマスク２０の裏面に当接し、表側に押しつけられた状態で、Ｙ方向に沿う移動方向に移動することで、マスク膜２３の全面を押圧し、塗布材が予め充填されたパターン開口２３ａから塗布材を表側に押し出す。 The squeegee 13 is made of a material such as urethane rubber, silicon rubber, synthetic rubber, metal or plastic, for example, in a thin plate shape. For example, the squeegee 13 is chamfered so that the thickness of the tip is reduced. The squeegee 13 is configured to be able to reciprocate relative to the frame 21. For example, the squeegee 13 has a length extending over the entire length of the mask film 23 in a direction orthogonal to the moving direction. The tip portion 13a of the squeegee 13 is in contact with the back surface of the screen mask 20 and is pressed to the front side, so that it moves in the moving direction along the Y direction, thereby pressing the entire surface of the mask film 23 and pre-filled with the coating material. The coating material is extruded to the front side from the pattern opening 23a.
　支持手段は、印刷媒体３０に対して所定の間隔を開けて平行に、フレーム２１を支持する。移動手段は、スキージ１３を所定の速度で第１方向に沿って移動させる。 The support means supports the frame 21 in parallel with the print medium 30 at a predetermined interval. The moving means moves the squeegee 13 along the first direction at a predetermined speed.
　次に、本実施形態にかかるスクリーン印刷装置１０を用いたスクリーン印刷方法により印刷物３１を製造する印刷物の製造方法について、図１乃至図６を参照して説明する。まず、スクリーンマスク２０の表面側を保持部材１２で保持された印刷媒体３０の表面に対向させて配置する。 Next, a printed material manufacturing method for manufacturing the printed material 31 by the screen printing method using the screen printing apparatus 10 according to the present embodiment will be described with reference to FIGS. 1 to 6. First, the surface side of the screen mask 20 is arranged to face the surface of the print medium 30 held by the holding member 12.
　そして、高粘度のペースト状の塗布材をスクリーンマスク２０の裏面側、すなわち、印刷媒体３０とは反対側の面から供給し、塗布材をパターン開口２３ａ内に充填させる。 Then, a high-viscosity paste-like coating material is supplied from the back side of the screen mask 20, that is, the surface opposite to the printing medium 30, and the coating material is filled into the pattern openings 23a.
　次に、スクリーンマスク２０の裏面、すなわち印刷面側とは反対側の面に、スキージ１３を配置する。このとき、例えばスキージ１３を、印刷媒体３０の表側の面に対して所定の角度θで配置する。そして、スキージ１３をメッシュ部２２及びマスク膜２３の裏面において、所定の印圧で印刷媒体３０側に向けて押しつけながら、Ｙ方向に沿って、所定の速度で移動させる。 Next, the squeegee 13 is arranged on the back surface of the screen mask 20, that is, the surface opposite to the printing surface side. At this time, for example, the squeegee 13 is arranged at a predetermined angle θ with respect to the surface on the front side of the print medium 30. The squeegee 13 is moved at a predetermined speed along the Y direction while pressing the squeegee 13 toward the print medium 30 with a predetermined printing pressure on the back surface of the mesh portion 22 and the mask film 23.
　スキージ１３は、例えばマスク膜２３の裏面全面にわたる領域でマスク膜２３を押圧する。スキージ１３の押圧により、マスク膜２３は押圧される部分が表側に変位するように変形し、印刷媒体３０に当接する。スキージ１３が通過した塗布材がパターン開口２３ａから印刷媒体３０側に押し出される。 The squeegee 13 presses the mask film 23 in an area covering the entire back surface of the mask film 23, for example. By the pressing of the squeegee 13, the mask film 23 is deformed so that the pressed portion is displaced to the front side, and comes into contact with the printing medium 30. The coating material through which the squeegee 13 has passed is pushed out from the pattern opening 23a to the print medium 30 side.
　スキージ１３が通過した後、マスク膜２３及びメッシュ部２２が復元するように変形して印刷媒体３０から離れるとともに、一部の塗布材が印刷媒体３０上に転写されて残ることで、印刷媒体３０上にパターン印刷がなされ、印刷物３１が完成する。なお塗布材は、例えば金属材や樹脂材などを含む各種材料であり、印刷対象の種類、例えば、電子部品、ディスプレイ、等によって、多様な材料が用いられる。例えば図６に示す太陽電池１００は、例えばスクリーンマスク２０を用いてパターニングされ、スクリーンマスク２０のパターン開口２３ａに対応するパターン形状を有する電極１２３が形成されている。電極１２３は、パターン開口２３ａにおけるライン状開口である複数のフィンガー部２３ｂ及び複数のバスバー部２３ｃにそれぞれ対応するライン状のフィンガー電極１２３ｂ及びバスバー電極１２３ｃを有する。 After the squeegee 13 passes, the mask film 23 and the mesh portion 22 are deformed so as to be restored and separated from the print medium 30, and a part of the coating material is transferred onto the print medium 30 and remains. Pattern printing is performed on the top, and the printed matter 31 is completed. The coating material is various materials including, for example, a metal material and a resin material, and various materials are used depending on the type of print target, for example, an electronic component, a display, and the like. For example, the solar cell 100 shown in FIG. 6 is patterned using, for example, the screen mask 20, and an electrode 123 having a pattern shape corresponding to the pattern opening 23 a of the screen mask 20 is formed. The electrode 123 includes line-shaped finger electrodes 123b and bus bar electrodes 123c corresponding to the plurality of finger portions 23b and the plurality of bus bar portions 23c, which are line-shaped openings in the pattern openings 23a.
　印刷時にはＸ方向に長いスキージ１３を、Ｚ方向に押し付けながら、Ｙ方向に所定量移動させる。この移動と押しつけによってメッシュ部２２が変形して伸びる。 During printing, the squeegee 13 that is long in the X direction is moved in the Y direction by a predetermined amount while being pressed in the Z direction. By this movement and pressing, the mesh portion 22 is deformed and stretched.
　次に、本実施形態にかかるスクリーンマスク２０の製造方法について図１乃至図９を参照して説明する。図７及び図８はスクリーンマスク２０の製造方法を示す説明図であり、図７はメッシュ検出装置６０の構成を示す。図８は露光装置を示している。図９は補正処理を示す説明図である。スクリーンマスク２０の製造方法は、メッシュデータ検出処理、乳剤Ｐｍの塗布処理、及び露光処理、を備える。 Next, a method for manufacturing the screen mask 20 according to the present embodiment will be described with reference to FIGS. 7 and 8 are explanatory views showing a method for manufacturing the screen mask 20, and FIG. 7 shows a configuration of the mesh detection device 60. FIG. 8 shows an exposure apparatus. FIG. 9 is an explanatory diagram showing the correction process. The manufacturing method of the screen mask 20 includes mesh data detection processing, emulsion Pm coating processing, and exposure processing.
　スクリーンマスク２０の製造方法において、まず、フレーム２１の枠内にメッシュ部２２が貼付けられたメッシュベースをセットし、スキャン処理によりメッシュ線材や透過部の位置や形状の情報を含むメッシュパターンデータを検出するメッシュパターン検出処理を行う。 In the manufacturing method of the screen mask 20, first, a mesh base having a mesh portion 22 attached inside the frame 21 is set, and mesh pattern data including information on the position and shape of the mesh wire and the transmission portion is detected by a scanning process. A mesh pattern detection process is performed.
　図７に示すメッシュ検出装置６０は、支持装置６１と、スキャンヘッド６２と、ＬＥＤ照明６３と、を備える。メッシュ検出装置６０は、メッシュ部２２の形状や大きさ、メインメッシュ２６の経糸２６ａ、緯糸２６ｂ、及び孔部２６ｃの位置及び形状の情報であるメッシュパターンデータをＣＡＤデータとして検出する。メッシュ検出装置６０はメッシュデータを記憶するとともに、露光装置５０に送信する。 7 includes a support device 61, a scan head 62, and an LED illumination 63. The mesh detection device 60 shown in FIG. The mesh detection device 60 detects, as CAD data, mesh pattern data that is information on the shape and size of the mesh portion 22 and the positions and shapes of the warps 26a, wefts 26b, and holes 26c of the main mesh 26. The mesh detection device 60 stores the mesh data and transmits it to the exposure device 50.
　次に、乳剤Ｐｍをメッシュ部２２上に塗布する塗布処理を行いメッシュ部２２上に、乳剤Ｐｍを平板状に形成する。 Next, a coating process for coating the emulsion Pm on the mesh portion 22 is performed to form the emulsion Pm on the mesh portion 22 in a flat plate shape.
　マスク材となる乳剤Ｐｍは、光硬化性の樹脂であり、たとえばポリビニルアルコール（ＰＶＡ）、ポリ酢酸ビニル（ＰＶＡｃ）、シリコン樹脂、アクリル樹脂、エポキシ樹脂等を包含する液体である。 The emulsion Pm used as a mask material is a photo-curable resin, and is a liquid including, for example, polyvinyl alcohol (PVA), polyvinyl acetate (PVAc), silicon resin, acrylic resin, epoxy resin, and the like.
　例えば塗布処理、必要に応じて複数回塗布を繰り返してもよい。本実施形態では乾燥後に乳厚ｔｍが１０μｍ程度となるように乳剤Ｐｍの厚さを設定する。なお、塗布処理においてメッシュを水平の姿勢として塗布してもよいし、鉛直の姿勢として塗布することも可能である。 For example, the coating process may be repeated a plurality of times as necessary. In the present embodiment, the thickness of the emulsion Pm is set so that the milk thickness tm is about 10 μm after drying. In the coating process, the mesh may be applied in a horizontal posture or may be applied in a vertical posture.
　次に、フォトマスクを用いないいわゆるマスクレスの露光装置５０（マスクレス露光機）にて、所定の露光パターンにてマスクレス露光処理を行う。 Next, a maskless exposure process is performed with a predetermined exposure pattern using a so-called maskless exposure apparatus 50 (maskless exposure machine) that does not use a photomask.
　図８は露光装置５０の構成を示す説明図である。図８に示すように、露光装置５０は、支持装置５１と、ＤＭＤ素子を備える照射ヘッド５２と、各部の動作を制御する制御装置５７と、を備える。 FIG. 8 is an explanatory diagram showing the configuration of the exposure apparatus 50. As illustrated in FIG. 8, the exposure apparatus 50 includes a support device 51, an irradiation head 52 including a DMD element, and a control device 57 that controls the operation of each unit.
　露光装置５０は、フォトマスクを介在させず、所定の露光パターンで、照射ヘッド５２で直接スクリーンマスク２０に描画する露光装置である。 The exposure apparatus 50 is an exposure apparatus that directly draws on the screen mask 20 with the irradiation head 52 in a predetermined exposure pattern without interposing a photomask.
　支持装置５１は、フレーム２１及びメッシュ部２２を有するメッシュ部材を移動可能なステージ５１ａを備える。支持装置５１は、例えば制御装置５７の制御により駆動され、ステージ５１ａを例えばＸ軸、及びＹ軸の２方向に移動させる移動機構を備える。ステージ５１ａは例えば吸着機構を備える。移動機構は照射ヘッド５２とスクリーンマスク２０とを相対的に移動させる。 The support device 51 includes a stage 51 a that can move a mesh member having the frame 21 and the mesh portion 22. The support device 51 is driven by, for example, the control of the control device 57, and includes a moving mechanism that moves the stage 51a in, for example, two directions of the X axis and the Y axis. The stage 51a includes a suction mechanism, for example. The moving mechanism relatively moves the irradiation head 52 and the screen mask 20.
　照射ヘッド５２は、複数の波長のレーザを照射可能に構成される。例えば制御装置５７の制御により駆動され、例えば２波長（３７５、４０５ｎｍ）のレーザを、単独、もしくは複合で照射する。 The irradiation head 52 is configured to be able to irradiate lasers having a plurality of wavelengths. For example, it is driven by the control of the control device 57 and irradiates, for example, a laser having two wavelengths (375 and 405 nm) alone or in combination.
　照射ヘッド５２は、レーザ光を発光するレーザ光源５２ａと、レーザ光源５２ａからの光を反射して照射する照射素子としての複数のＤＭＤ素子５２ｂと、マイクロレンズアレイ５２ｃと、を備える。各ＤＭＤ素子５２ｂは制御部５７ａの制御により、ＣＡＤデータとして記憶あるいは算出された所定の露光パターンに応じて、ＯＮ／ＯＦＦ制御され、ＯＮ状態にて当該素子からレーザ光がマスク膜２３に対して照射される。レーザ光はマイクロレンズアレイ５２ｃにより集光される。例えばＤＭＤ素子５２ｂは、１秒間に数万回ＯＮ／ＯＦＦ状態が切替えられる。 The irradiation head 52 includes a laser light source 52a that emits laser light, a plurality of DMD elements 52b as irradiation elements that reflect and irradiate light from the laser light source 52a, and a microlens array 52c. Each DMD element 52b is ON / OFF controlled in accordance with a predetermined exposure pattern stored or calculated as CAD data under the control of the control unit 57a, and laser light is emitted from the element to the mask film 23 in the ON state. Irradiated. The laser light is condensed by the microlens array 52c. For example, the DMD element 52b is switched on / off several tens of thousands of times per second.
　制御装置５７は、所定のプログラムを実行する制御部５７ａと、各種プログラムや設定値を記憶する記憶部５７ｂと、を備える。例えば記憶部５７ｂには、露光パターンなどの描画データや露光処理の出力条件などが、記憶されている。 The control device 57 includes a control unit 57a that executes a predetermined program, and a storage unit 57b that stores various programs and setting values. For example, the storage unit 57b stores drawing data such as an exposure pattern, output conditions for exposure processing, and the like.
　制御部５７ａは、例えば予め設定されたプログラムや各種データに基づいて、照射ヘッド５２や支持装置５１を駆動することにより、マスク膜２３を所定の露光パターンにて露光し、パターン開口２３ａを形成する。 The controller 57a drives the irradiation head 52 and the support device 51 based on, for example, preset programs and various data, thereby exposing the mask film 23 with a predetermined exposure pattern to form a pattern opening 23a. .
　また、制御部５７ａは、孔部２６ｃの位置情報を含むメッシュパターンデータに基づき、露光パターンを補正する。すなわち、制御部５７ａは、メッシュ情報に基づき、描画するパターン開口の形状に対応して予め設定されたＣＡＤデータであるベースパターンデータに、補正処理（調整処理）をして、実際の露光処理のパターンのＣＡＤデータである露光パターンを決定する。 Further, the control unit 57a corrects the exposure pattern based on the mesh pattern data including the position information of the hole 26c. That is, the control unit 57a performs correction processing (adjustment processing) on the base pattern data, which is CAD data set in advance corresponding to the shape of the pattern opening to be drawn, based on the mesh information, and performs actual exposure processing. An exposure pattern which is CAD data of the pattern is determined.
　補正処理において、制御部５７ａは、パターン開口２３ａと、対象の描画エリア内におけるメッシュ部２２の孔部２６ｃとの位置関係を調整する。例えば、制御部５７ａは、パターン開口２３ａのライン状開口２３ｄの開口幅、ピッチ、及びメッシュ線材２６ｄとライン状開口２３ｄとの傾斜角度、のいずれか１以上を調整する。 In the correction process, the control unit 57a adjusts the positional relationship between the pattern opening 23a and the hole 26c of the mesh unit 22 in the target drawing area. For example, the control unit 57a adjusts any one or more of the opening width and pitch of the line-shaped openings 23d of the pattern openings 23a, and the inclination angle between the mesh wire 26d and the line-shaped openings 23d.
　具体的には、例えばパターン開口２３ａの開口がメッシュの孔部（透過部）２６ｃの位置と重なるように位置調整を行い、例えばマスク膜２３に対する露光パターンの位置、サイズ、傾斜角度、露光パターンにおける各ライン状開口２３ｄの開口幅やピッチの増減を行う。 Specifically, for example, position adjustment is performed so that the opening of the pattern opening 23a overlaps with the position of the mesh hole (transmission part) 26c. For example, the position, size, inclination angle, and exposure pattern of the exposure pattern with respect to the mask film 23 are adjusted. The opening width and pitch of each line-shaped opening 23d are increased or decreased.
　一例として、図９に示す補正処理では、元データにおいてパターン開口２３ａの形状は、幅寸法が０．０３ｍｍのライン状開口２３ｄである複数のフィンガー部２３ｂが、０．１８ｍｍ間隔で並んでいる場合を例示する。制御部は、検出処理として、メインメッシュ２６のデータをスキャンにより検出し、メッシュの開口の位置、すなわち透過部の位置をデータ化し、透過部の並び方向や並列の間隔を検出する。補正処理として、制御部は、フィンガー部２３ｂの配列の間隔や延出角度を透過部の配列の間隔や並列角度に合わせて増減する。 As an example, in the correction process shown in FIG. 9, in the original data, the pattern opening 23 a has a shape in which a plurality of finger portions 23 b that are line-shaped openings 23 d having a width dimension of 0.03 mm are arranged at intervals of 0.18 mm. Is illustrated. As a detection process, the control unit detects the data of the main mesh 26 by scanning, converts the opening position of the mesh, that is, the position of the transmission part, into data, and detects the arrangement direction of the transmission parts and the parallel interval. As the correction processing, the control unit increases or decreases the arrangement interval or extension angle of the finger portions 23b according to the arrangement interval or parallel angle of the transmission portions.
　すなわち、制御部は補正処理として、フィンガー部２３ｂの延出方向を、透過部の列の延出方向に合わせて傾斜させる。例えば、メッシュ線材２６ｄである経糸２６ａとの傾斜角度が－５度から５度の範囲、好ましくは０度となるように、パターン開口２３ａとメッシュ部２２との相対角度を調整する。 That is, as a correction process, the control unit inclines the extending direction of the finger portions 23b in accordance with the extending direction of the row of transmitting portions. For example, the relative angle between the pattern opening 23a and the mesh portion 22 is adjusted so that the inclination angle with the warp yarn 26a that is the mesh wire 26d is in the range of -5 degrees to 5 degrees, preferably 0 degrees.
　また、基準位置との相対位置を調整する例として、例えばフィンガー部２３ｂの基準位置としての中心ラインを、一対の経糸２６ａの中間位置に、近づける。好ましくはフィンガー部２３ｂの中心ラインを、一対の経糸２６ａの中間のラインに重ね合わせる。 Further, as an example of adjusting the relative position with respect to the reference position, for example, the center line as the reference position of the finger portion 23b is brought closer to the intermediate position of the pair of warps 26a. Preferably, the center line of the finger portion 23b is overlapped with the middle line of the pair of warps 26a.
　さらに、フィンガー部２３ｂの配列の間隔であるピッチＰｆ１を、経糸２６ａのピッチＰｍ１の倍数に設定することで、全てのフィンガー部２３ｂをメインメッシュ２６の経糸２６ａと重ならない配置とする。例えば図９に示す例では、０．１８ｍｍから０．２２ｍｍの間隔へ変更する。 Furthermore, the pitch Pf1 that is the interval between the arrangement of the finger portions 23b is set to a multiple of the pitch Pm1 of the warps 26a, so that all the finger portions 23b do not overlap with the warps 26a of the main mesh 26. For example, in the example shown in FIG. 9, the interval is changed from 0.18 mm to 0.22 mm.
　また、基準位置との相対位置を調整する他の例として、補正において、バスバー部２３ｃの中心ラインを、一対の緯糸２６ｂの中間位置に、配置し、開口がメッシュの糸によって塞がれない位置関係となるように露光パターンにおけるバスバー部の位置を調整する。バスバーのような幅広いパターンは緯糸と傾斜角が比較的大きくてもよい。したがって、異なる複数の方向のライン状開口を有する場合には、幅の狭いライン状開口の方向を優先して角度を調整する。 As another example of adjusting the relative position with respect to the reference position, in the correction, the center line of the bus bar portion 23c is disposed at an intermediate position between the pair of wefts 26b, and the opening is not blocked by the mesh thread. The position of the bus bar portion in the exposure pattern is adjusted so that the relationship is established. A wide pattern such as a bus bar may have a relatively large weft and tilt angle. Therefore, in the case of having line-shaped openings in a plurality of different directions, the angle is adjusted by giving priority to the direction of the narrow line-shaped openings.
　ここで、ライン状開口の位置をシフトする補正量は±０．０５ｍｍ以下とする。また、本実施形態において、例えばライン状開口の位置をシフトする補正量は、ライン幅以下が好ましい。例えば電極及びフィンガー部２３ｂの幅寸法Ｗｆ１が０．０３０ｍｍ程度、配列のピッチＰｆ１が１．４ｍｍ程度である場合に、フィンガー部２３ｂの位置をシフトする補正量は０．０３ｍｍ以下とする。さらに好ましくは、ライン状開口の補正量はライン幅の１／２以下としてもよい。すなわち、例えばメッシュ数３６０本の♯３６０メッシュにおいて、フィンガー部２３ｂ及び電極の線幅が０．０７１である場合には、±０．０３５以下とする。 Here, the correction amount for shifting the position of the line-shaped opening is ± 0.05 mm or less. In the present embodiment, for example, the correction amount for shifting the position of the line-shaped opening is preferably equal to or smaller than the line width. For example, when the width dimension Wf1 of the electrode and finger part 23b is about 0.030 mm and the arrangement pitch Pf1 is about 1.4 mm, the correction amount for shifting the position of the finger part 23b is 0.03 mm or less. More preferably, the correction amount of the line-shaped opening may be set to ½ or less of the line width. That is, for example, in a # 360 mesh having 360 meshes, when the line width of the finger portion 23b and the electrode is 0.071, it is set to ± 0.035 or less.
　露光処理は、印刷面側から光を照射する露光処理であり、所定の露光パターンで露光することにより、露光パターンに対応する所定範囲を硬化させる。具体的には、所定の領域に、乳剤Ｐｍの表面側を紫外線ランプや紫外線ＬＥＤ等の照射ヘッドに向けて配置し、照射ヘッド５２により光を照射させ、乳剤Ｐｍの表面を照らす露光処理を行う。一例として露光量は例えば１０００ｍＪ／ｃｍ２程度である。 The exposure process is an exposure process in which light is irradiated from the printing surface side, and a predetermined range corresponding to the exposure pattern is cured by exposing with a predetermined exposure pattern. Specifically, the surface side of the emulsion Pm is arranged in a predetermined area toward an irradiation head such as an ultraviolet lamp or an ultraviolet LED, and light is irradiated by the irradiation head 52 to perform exposure processing for illuminating the surface of the emulsion Pm. . As an example, the exposure amount is about 1000 mJ / cm 2, for example.
　制御部５７ａは算出された露光パターンデータに基づき、所定の露光エリアにレーザ光を照射する。このとき、描画エリアよりも狭いエリアを複数回に分けてスキャンしながら所定の描画エリアを露光してもよい。 The control unit 57a irradiates a predetermined exposure area with laser light based on the calculated exposure pattern data. At this time, a predetermined drawing area may be exposed while scanning an area narrower than the drawing area divided into a plurality of times.
　露光処理によって、露光パターンの部位に対応して、乳剤Ｐｍの紫外線が照射された部分が紫外線によって硬化する。 By the exposure process, the portion of the emulsion Pm irradiated with the ultraviolet ray corresponding to the portion of the exposure pattern is cured by the ultraviolet ray.
　露光処理後、エッチング処理として、水や溶剤により、乳剤Ｐｍの表面側を洗い流す。この処理によって、乳剤Ｐｍの未硬化部分が洗い流される。すなわち、乳剤Ｐｍの層において、未硬化領域は全て洗い流され、厚み方向において表面側から裏面側まで貫通するパターン開口２３ａが形成される。以上により乳剤Ｐｍから、所定の形状のパターン開口２３ａを有するマスク膜２３が形成される。 After the exposure process, the surface side of the emulsion Pm is washed away with water or a solvent as an etching process. By this treatment, the uncured portion of the emulsion Pm is washed away. That is, in the emulsion Pm layer, all uncured regions are washed away, and pattern openings 23a penetrating from the front surface side to the back surface side in the thickness direction are formed. Thus, a mask film 23 having a pattern opening 23a having a predetermined shape is formed from the emulsion Pm.
　以上のように構成されたスクリーンマスクの製造方法によれば、パターン開口２３ａと孔部２６ｃとの位置を調整する補正により、開口がメッシュ線材２６ｄにより塞がれることを抑制できる。したがって、所望の印刷形状を得ることができるスクリーンマスク２０を製造することが可能となる。したがって、例えば細かいライン状開口２３ｄであるフィンガー部２３ｂを多数有する太陽電池の電極形成用のスクリーンマスクにおいて、パターン形状が途切れず開口幅のバラツキが少なくなるため、断線や抵抗値の上昇を防止でき、安定した電極を形成できる。なお、太陽光電池の電極において、補正量を０．０５ｍｍ以下、あるいはライン幅以下、さらに好ましくはライン幅の１／２以下、としたことで、太陽光電池の電極としての性能を確保できる。 According to the method for manufacturing a screen mask configured as described above, it is possible to suppress the opening from being blocked by the mesh wire material 26d by correcting the positions of the pattern openings 23a and the holes 26c. Therefore, it is possible to manufacture the screen mask 20 that can obtain a desired printed shape. Therefore, for example, in a screen mask for forming an electrode of a solar cell having many finger portions 23b which are fine line-shaped openings 23d, the pattern shape is not interrupted, and variations in the opening width are reduced, so that disconnection and increase in resistance value can be prevented. A stable electrode can be formed. In addition, in the electrode of a solar cell, the performance as a solar cell electrode can be ensured by setting the correction amount to 0.05 mm or less, or a line width or less, more preferably 1/2 or less of the line width.
　また、上記実施形態は、フォトマスクを用いないマスクレス露光とすることで、個々のメッシュ部２２の形状に応じた補正処理を容易に実現できる。すなわち、例えばフォトマスクを用いたパターン形成の場合、メッシュ毎に、メッシュの形状に合わせたフォトマスクを形成する必要があるが、上記実施形態によれば、フォトマスクが不要であるため、マスクレス露光の露光データを補正するだけで個々に異なるメッシュ形状に応じた補正が実現でき、高精度のパターン形成が可能なスクリーンマスクを形成できる。 In the above-described embodiment, correction processing according to the shape of each mesh portion 22 can be easily realized by performing maskless exposure without using a photomask. That is, for example, in the case of pattern formation using a photomask, it is necessary to form a photomask that matches the shape of the mesh for each mesh. By simply correcting the exposure data of exposure, correction according to individual mesh shapes can be realized, and a screen mask capable of forming a highly accurate pattern can be formed.
　なお、本発明は上記各実施形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。 Note that the present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage.
　例えばメッシュ部２２やパターン開口２３ａの形状は上記実施形態に限られるものではなく適宜変更可能である。例えば図１０は複数種類のメッシュ部２２とパターン開口２３ａとの対応を示す説明図である。図中、φはメッシュ部２２の経糸２６ａ及び緯糸２６ｂの線径、ＯＰはメッシュ部２２の開口幅をそれぞれ示す。図１０に示すように、ライン状開口２３ｄと、経糸２６ａまたは緯糸２６ｂの角度を揃えるとともに、ライン状開口２３ｄを並列する一対の糸の間の孔部２６ｃに配置することで、上記実施形態と同様の効果が得られる。 For example, the shape of the mesh portion 22 and the pattern opening 23a is not limited to the above embodiment, and can be changed as appropriate. For example, FIG. 10 is an explanatory diagram showing correspondence between a plurality of types of mesh portions 22 and pattern openings 23a. In the figure, φ indicates the wire diameter of the warp yarn 26a and the weft yarn 26b of the mesh portion 22, and OP indicates the opening width of the mesh portion 22. As shown in FIG. 10, by aligning the angles of the line-shaped openings 23d and the warps 26a or the wefts 26b, and arranging the line-shaped openings 23d in the hole portions 26c between a pair of parallel threads, Similar effects can be obtained.
　また、上記実施形態においては太陽光電池用の電極を形成するパターン開口２３ａを例示したがこれに限られるものではない。 In the above embodiment, the pattern opening 23a for forming the electrode for the solar battery is exemplified, but the present invention is not limited to this.
　他の実施形態として図１１に示すように、一方向に延びる複数のライン状開口２３ｄを有するパターン形状の場合、経糸２６ａ及び緯糸２６ｂの両方に傾斜する角度となるように角度を調整してもよい。この場合であっても、それぞれのライン状開口２３ｄがメッシュ線材２６ｄによって塞がれないため、上記実施形態と同様の効果が得られる。 As shown in FIG. 11 as another embodiment, in the case of a pattern shape having a plurality of line-shaped openings 23d extending in one direction, the angle may be adjusted so that both the warp yarn 26a and the weft yarn 26b are inclined. Good. Even in this case, since each line-shaped opening 23d is not blocked by the mesh wire 26d, the same effect as the above embodiment can be obtained.
　他の実施形態として図１２及び図１３に示すように屈曲して異なる方向を向くライン状部分を有するライン状開口２３ｄを備えるパターン形状のパターン開口２３ａにおいて、それぞれのライン状部分を経糸２６ａ及び緯糸２６ｂにそれぞれ沿う方向に配置するとともに、隣り合うメッシュ線材２６ｄの間にライン状開口２３ｄが配置されるように補正することで、上記実施形態と同様の効果が得られる。 As another embodiment, as shown in FIGS. 12 and 13, in a pattern-shaped pattern opening 23a having a line-shaped opening 23d having a line-shaped portion that bends and faces in different directions, the respective line-shaped portions are represented by warps 26a and wefts. The effect similar to that of the above-described embodiment can be obtained by arranging in the direction along each of 26b and correcting so that the line-shaped opening 23d is arranged between the adjacent mesh wires 26d.
　他の実施形態として図１４に示すように角形や円形の複数の開口部２３ｅ、２３ｆが複数点在するパターン形状のパターン開口２３ａにおいて、各開口部２３ｅ、２３ｆがメッシュ部２２の孔部２６ｃに配置されるように補正してもよい。この場合であっても、それぞれの開口部２３ｅ、２３ｆがメッシュ線材２６ｄによって塞がれないため、上記実施形態と同様の効果が得られる。 As another embodiment, as shown in FIG. 14, in a pattern-shaped pattern opening 23a in which a plurality of rectangular or circular openings 23e, 23f are scattered, each opening 23e, 23f is formed in a hole 26c of the mesh part 22. You may correct | amend so that it may arrange | position. Even in this case, since the respective openings 23e and 23f are not blocked by the mesh wire 26d, the same effect as the above embodiment can be obtained.
　また、上記実施形態においては、パターンのピッチの調整の後に角度を調整する例を示したがこれに限られるものではない。例えば図１５に示すように、パターン全体の角度をメッシュの延出角度に合わせて調整した後、ライン状開口２３ｄの位置をずらす補正をしてもよい。 In the above embodiment, the example in which the angle is adjusted after the adjustment of the pitch of the pattern is shown, but the present invention is not limited to this. For example, as shown in FIG. 15, after adjusting the angle of the entire pattern in accordance with the extension angle of the mesh, correction may be made to shift the position of the line-shaped opening 23d.
　さらに上記実施形態においてはレーザ光源によりレーザ光を照射した例を示したが、これに限られるものではなく、紫外線光を照射する紫外線光源を備える構成としてもよい。 Furthermore, in the above-described embodiment, an example in which laser light is irradiated by a laser light source has been shown, but the present invention is not limited to this, and an ultraviolet light source that irradiates ultraviolet light may be provided.
　この他、上記実施形態に例示された各構成要素を削除してもよく、各構成要素の形状、構造、材質等を変更してもよい。上記実施形態に開示されている複数の構成要素の適宜な組み合わせにより、種々の発明を形成できる。 In addition, each constituent element exemplified in the above embodiment may be deleted, and the shape, structure, material, and the like of each constituent element may be changed. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment.
１０…スクリーン印刷装置、１２…保持部材、１３…スキージ、１３ａ…先端部分、２０…スクリーンマスク、２１…フレーム、２２…メッシュ部、２３…マスク膜、２３ａ…パターン開口、２３ｂ…フィンガー部、２３ｃ…バスバー部、２６…メインメッシュ、２６ａ…経糸、２６ｂ…緯糸、２６ｃ…孔部（透過部）、２７…サポートメッシュ、２７ａ…経糸、２７ｂ…緯糸、３０…印刷媒体、３１…印刷物、５０…露光装置、５１…支持装置、５１ａ…ステージ、５２…照射ヘッド、５２ａ…レーザ光源、５２ｂ…ＤＭＤ素子、５２ｃ…マイクロレンズアレイ、５７…制御装置、５７ａ…制御部、５７ｂ…記憶部、６０…メッシュ検出装置、６１…支持装置、６２…スキャンヘッド、６３…ＬＥＤ照明。 DESCRIPTION OF SYMBOLS 10 ... Screen printer, 12 ... Holding member, 13 ... Squeegee, 13a ... Tip part, 20 ... Screen mask, 21 ... Frame, 22 ... Mesh part, 23 ... Mask film | membrane, 23a ... Pattern opening, 23b ... Finger part, 23c ... Busbar part, 26 ... Main mesh, 26a ... War, 26b ... Weft, 26c ... Hole (transmission part), 27 ... Support mesh, 27a ... War, 27b ... Weft, 30 ... Print medium, 31 ... Print, 50 ... Exposure device, 51 ... support device, 51a ... stage, 52 ... irradiation head, 52a ... laser light source, 52b ... DMD element, 52c ... microlens array, 57 ... control device, 57a ... control unit, 57b ... storage unit, 60 ... Mesh detector, 61 ... support device, 62 ... scan head, 63 ... LED illumination.

Claims (6)

  1. 　塗布材を透過する透過部を有するメッシュ部に形成された感光性材料のマスク膜に所定の露光パターンで光を照射し、前記マスク膜に所定のパターン開口を形成する露光処理と、
    　前記透過部の情報に基づき、前記露光処理の露光パターンを補正することと、を備える、スクリーンマスクの製造方法。     An exposure process for irradiating light with a predetermined exposure pattern on a mask film of a photosensitive material formed on a mesh part having a transmission part that transmits a coating material, and forming a predetermined pattern opening in the mask film;
    Correcting the exposure pattern of the exposure process based on the information of the transmissive portion.
  2. 　前記露光処理はマスクレス露光であり、
    　前記補正において、前記露光パターンの基準位置と前記メッシュ部の前記透過部との相対位置を調整する、請求項１に記載のスクリーンマスクの製造方法。     The exposure process is maskless exposure;
    The method for manufacturing a screen mask according to claim 1, wherein in the correction, a relative position between a reference position of the exposure pattern and the transmission portion of the mesh portion is adjusted.
  3. 　前記メッシュ部は複数本並列に配されるメッシュ線材を有し、
    　前記パターン開口は複数並列に配されるライン状開口を有し、
    　前記補正において、前記露光パターンにおける、前記ライン状開口の開口幅、ピッチ、及び前記メッシュ部を形成するメッシュ線材と前記ライン状開口との傾斜角度、のいずれか１以上を調整する、請求項１または請求項２に記載のスクリーンマスクの製造方法。     The mesh portion has a plurality of mesh wires arranged in parallel,
    The pattern opening has a plurality of line openings arranged in parallel,
    2. The correction includes adjusting at least one of an opening width and pitch of the line-shaped openings and an inclination angle between the mesh wire forming the mesh portion and the line-shaped openings in the exposure pattern. Or the manufacturing method of the screen mask of Claim 2.
  4. 　前記補正において、前記ライン状開口の中心位置と、複数の前記メッシュ線材の中間位置とを近づける、請求項３に記載のスクリーンマスクの製造方法。 4. The method of manufacturing a screen mask according to claim 3, wherein, in the correction, a center position of the line-shaped opening and an intermediate position of the plurality of mesh wires are brought close to each other.
  5. 　前記メッシュ部の前記透過部の位置情報を検出することを備える、請求項１乃至請求項４のいずれか１項に記載のスクリーンマスクの製造方法。 The method of manufacturing a screen mask according to any one of claims 1 to 4, comprising detecting position information of the transmission part of the mesh part.
  6. 　塗布材を透過する透過部を有するメッシュ部と、前記メッシュ部に形成されたマスク膜と、を備えるスクリーンマスクのマスク膜を、所定の露光パターンで露光するマスクレス露光機であって、
    　前記スクリーンマスクのマスク膜に、光を照射する照射ヘッドと、
    　前記照射ヘッドと前記スクリーンマスクとを相対的に移動させる移動機構と、
    　前記スクリーンマスクの前記透過部の位置情報に基づき、前記露光パターンを補正する制御部と、を備える、露光装置。     A maskless exposure machine that exposes a mask film of a screen mask having a transmission part that transmits a coating material and a mask film formed on the mesh part with a predetermined exposure pattern,
    An irradiation head for irradiating the mask film of the screen mask with light;
    A moving mechanism for relatively moving the irradiation head and the screen mask;
    An exposure apparatus comprising: a control unit that corrects the exposure pattern based on positional information of the transmission part of the screen mask.
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