JP2023138827A - Screen mask, production method of screen mask and printed matter production method - Google Patents

Abstract

To provide a screen mask capable of reducing load in printing, and a production method of a screen mask.SOLUTION: A screen mask in one embodiment comprises: a supporting material having a hole through which a coating material can pass; and a mask film including an opening which is formed in the support material and penetrates in a thickness direction, and through which the coating material passes, and a recess part which is formed at a position at least partially different from the position of the opening, and in which a surface on a printing surface side as one side of the coating material in a discharge direction retreats toward the other side.SELECTED DRAWING: Figure 1

Description

The present invention relates to a screen mask, a method for manufacturing a screen mask, and a method for manufacturing a printed matter.

Screen printing, which is one of the printing methods, is a method of forming arbitrary printed materials on a printing material using a screen mask in which predetermined pattern openings made of a resin composition are formed on a mesh that is a support material. . This screen printing method is used for various types of printing, such as printing wiring, electrodes, and fluorescent materials, and is used in various fields including electronic components.

In recent years, with the miniaturization and higher quality of electronic components, there has been a demand for higher precision screen masks.

For example, a screen mask includes a mesh having holes through which a coating material can pass, and a mask film provided in the mesh and having patterned openings. The pattern opening formed in the mask film has a shape corresponding to, for example, a printed pattern and has a predetermined width. For example, after applying an emulsion forming a mask film to a mesh, pattern openings are formed by exposure processing using a photomask overlaid.

When producing printed matter using such a screen mask, for example, if there is a protrusion such as a component on an object to be printed such as a substrate, a load is applied to the mask, causing damage.

Japanese Patent Application Publication No. 2013-169783

In such screen masks, there is a need for a screen mask, a method of manufacturing a screen mask, and a method of manufacturing a printed matter that can reduce the load during printing.

A screen mask according to one embodiment includes: a support material having holes through which a coating material can pass; an opening formed in the support material that penetrates in the thickness direction and through which the coating material passes; A mask film is provided, which has a recessed part formed at a different position and in which a surface on a printing surface side, which is one side in the discharge direction of the coating material, retreats to the other side.

A method for manufacturing a screen mask according to another embodiment includes a first layer forming step of forming a first emulsion layer by coating a first emulsion on a support material having holes through which the coating material can pass; a first patterning step in which the emulsion layer is exposed with a predetermined first exposure pattern; and a second layer forming step in which a second emulsion is coated on the first emulsion layer to form a second emulsion layer. , a second patterning step of exposing with a second exposure pattern different from the first exposure pattern, and forming openings in the first emulsion layer and the second emulsion layer by etching treatment, and forming openings on one side surface. an etching process for forming a recessed part in which the part is retracted to the other side.

According to the embodiments of the present invention, it is possible to provide a screen mask, a method of manufacturing a screen mask, and a method of manufacturing a printed matter that can reduce the load during printing.

FIG. 2 is an explanatory diagram of a screen mask according to the first embodiment. FIG. 1 is an explanatory diagram of a screen printing apparatus according to a first embodiment. FIG. 3 is a perspective view of the screen mask according to the same embodiment. FIG. 3 is a cross-sectional view showing a part of the screen mask according to the same embodiment. FIG. 3 is a perspective view showing a partial configuration of the screen mask. FIG. 3 is a plan view showing a partial configuration of the screen mask. FIG. 3 is a cross-sectional view showing a part of the screen mask according to the same embodiment. FIG. 3 is a plan view showing a partial configuration of the screen mask. FIG. 3 is a perspective view showing a partial configuration of the screen mask. An explanatory diagram of a mask film and a printed shape according to the same screen mask and a comparative example. An explanatory diagram showing a method for manufacturing the same screen mask. FIG. 3 is a cross-sectional view showing the configuration of a recessed portion of a screen mask according to another embodiment. FIG. 3 is a perspective view showing the structure of the recessed portion of the screen mask. FIG. 7 is an explanatory diagram showing a method for manufacturing a screen mask according to another embodiment. FIG. 7 is a plan view showing a partial configuration of a screen mask according to another embodiment. FIG. 3 is a cross-sectional view showing a partial configuration of the screen mask. FIG. 7 is an explanatory diagram showing a method for manufacturing a screen mask according to another embodiment. FIG. 7 is an explanatory diagram showing the configuration of a screen mask according to another embodiment.

[First embodiment]
Hereinafter, a screen printing apparatus 10 and a screen mask 20 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 12. FIG. 1 is an explanatory diagram of a screen mask 20 according to this embodiment, and FIG. 2 is an explanatory diagram showing a screen printing apparatus 10. FIG. 3 is a perspective view of the screen mask 20. FIG. 4 is a cross-sectional view schematically showing the structure of a part of the screen mask 20, FIG. 5 is a perspective view, and FIG. 6 is a plan view. FIG. 7 is a sectional view schematically showing the structure of a part of the screen mask 20, FIG. 8 is a plan view, and FIG. 9 is a perspective view. In addition, in each figure, the structure is enlarged, reduced, or omitted as appropriate for explanation. Arrows X, Y, and Z in the figure indicate three directions that are perpendicular to each other.

As shown in FIG. 2, the screen printing apparatus 10 includes a screen mask 20, a holding member 12 that holds a print medium Ba facing a surface (one surface) 20a that is the printing surface side of the screen mask 20, and a screen. A squeegee 13 configured to be movable while in contact with the back surface (the other surface) 20b opposite to the printing surface side of the mask 20, a moving section that moves the squeegee 13, and a moving section that moves the screen mask 20 to the printing medium Ba. and supporting portions that support each other in opposition to each other.

The screen printing device 10 forms various printing materials in predetermined patterns on the surface of the printing medium Ba. For example, chip components (capacitors, chip resistors, inductors, thermistors, etc.), touch panels, liquid crystal display (LCD) seals, LTCC (Low Temperature Co-fired ceramics) substrates, electrodes for solar cells, and other electronic components. Used for manufacturing etc.

As shown in FIGS. 1 to 3, the screen mask 20 includes a frame 21, a mesh 22 that is a support material stretched over the frame 21, and a mask film 23 formed on the mesh 22. In the screen mask 20, the side facing the front surface of the printing medium Ba when printing is designated as the front surface 20a, and the opposite side to which the coating material Pe is supplied is designated as the back surface 20b.

The frame 21 has two pairs of sides parallel to each other, and is configured in a frame shape, for example, with a rectangular opening of a desired size. The frame 21 supports the outer peripheral edge of the mesh 22 and stretches the mesh 22 in the opening. In this embodiment, as an example, the dimension of the opening of the frame 21 in the Y direction is 275 mm, and the dimension in the X direction is 275 mm.

The frame 21 also functions as a frame that holds a predetermined amount of coating material Pe on the back side of the mask film 23. The frame 21 and the mesh 22 are bonded together at a joint using, for example, a synthetic rubber adhesive or a cyanoacrylate adhesive.

The mesh 22 is a woven fabric formed by weaving warp threads 22a and weft threads 22b, and has a large number of holes 22c that allow the application material Pe to pass therethrough. The warp threads 22a and the weft threads 22b are, for example, wires made of metal such as stainless steel, or fibers made of resin such as polyester. The warp threads 22a and the weft threads 22b each extend diagonally, for example, with respect to the moving direction (first direction) of the squeegee 13.

A mask film 23 having a predetermined pattern of openings 24 is formed on this mesh 22 . That is, the mask film 23 is held in the opening portion of the frame 21 by the mesh 22 .

The mask film 23 is a layer made of a photocurable resin composition, such as PVA, PVAc, silicone resin, acrylic resin, epoxy resin, or the like. For example, the mask film 23 has a two-layer structure in which a base layer 23b and a cover layer 23c are laminated. For example, the cover layer 23c is made of a softer material than the base layer 23b.

The thickness of the mask film 23 is, for example, 10 μm to 200 μm.

The mask film 23 is formed on the mesh 22 and placed in the opening of the frame 21 . A predetermined pattern opening 24 for printing and a recess 25 are formed in the mask film 23 by exposure.

The pattern opening 24 is, for example, a line-shaped pattern hole. The pattern openings 24 constitute slits having a pattern shape corresponding to the printed pattern and penetrating the mask film 23 in the thickness direction (depth direction). The minimum opening width of the pattern opening 24, that is, the width dimension of the opening at the narrowest part of the pattern opening 24 is 20 μm or less. Here, as an example, the dimensions on the surface of the mask film 23, that is, the surface 20a facing the print medium Ba, are used as a reference.

The mask film 23 constitutes a printed portion in which no photosensitive resin exists in the pattern openings 24 and the coating material Pe can pass through the holes of the mesh 22 from the back surface to the front surface. A portion of the mask film 23 other than the pattern openings 24 in which the holes of the mesh 22 are closed with the photosensitive resin constitutes a non-printing portion through which the ink as the coating material Pe does not pass.

The recess 25 is formed in a predetermined pattern shape different from the pattern opening 24. It is formed at a position facing the protrusion Pc of the object to be printed, and is arranged, for example, at a position corresponding to the protrusion Pc of a component Pc arranged on the object to be printed.
A plurality of recesses 25 may be provided. For example, in this embodiment, the recess 25 is formed at a position that is at least partially different from the pattern opening. The recessed portion 25 is a relief portion in which the surface on the printing surface side, which is one side in the discharge direction of the coating material, retreats to the other side, and the load during printing can be avoided.

The recess 25 may be arranged at a position apart from the pattern opening, as shown in FIGS. 4 to 6. For example, if the recess 25 has a surrounded shape, it is possible to prevent the coating material from entering into the recess 25 during printing.

At least a portion of the recess 25 may be continuous with the pattern opening, as shown in FIGS. 7 to 9. For example, the recess 25 shown in FIGS. 7 to 9 communicates with pattern openings 24 arranged on both sides thereof. In this manner, the coating material flows into the recessed portion 25 communicating with the pattern opening 24 from the pattern opening 24 during printing, and the coating material is simultaneously applied to the parts.

The depth ΔD of the recess 25 from the printing surface satisfies 3 μm≦ΔD≦ _TE . Here, _TE is the milk thickness, which is the thickness dimension obtained by subtracting the dimension in the thickness direction of the mesh from the total thickness T. Note that in order to prevent the mask film 23 from peeling off from the mesh 22, the milk thickness _TE is set to be less than 80% of the total thickness T of the screen mask 20.

FIG. 10 is an explanatory diagram showing printing patterns and states before printing, during printing, and after printing for the screen mask 20 according to the present embodiment and a screen mask without recesses as a comparative example. In FIG. 10, a recess 25 provided apart from the pattern opening 24 and a recess 25 communicating with the pattern opening 24 will be compared and explained.

The mesh 22 on which the mask film 23 is formed is configured to be elastically deformable, such that it is bent and deformed by the pressing force of the squeegee 13, for example, and returns to its original state when the pressing force is released. As shown in FIGS. 2 and 10, when the coating material Pe is held in the pattern openings 24 of the mask film 23, the mask film 23 comes into contact with and separates from the printing medium Ba due to elastic deformation of the mesh 22, so that the coating material Pe is transferred from the pattern opening 24 to the print medium Ba.

The squeegee 13 is made of a material such as urethane rubber, silicone rubber, synthetic rubber, metal, or plastic, and has a thin plate shape, for example. For example, the squeegee 13 is chamfered to reduce the thickness of the tip. The squeegee 13 is configured to be movable with respect to the frame 21. For example, the squeegee 13 is configured to have a length spanning the entire length of the mask film 23 in a direction perpendicular to the moving direction. With the tip 13a of the squeegee 13 in contact with the back surface 20b of the screen mask 20 and pressed against the front side, the entire surface of the mask film 23 is pressed and coated by moving in the moving direction along arrow A in FIG. The coating material Pe is pushed out to the front side from the pattern opening 24 filled with the material Pe in advance.

The support section supports the frame 21 in parallel with the print medium Ba at a predetermined distance. The moving unit moves the squeegee 13 at a predetermined speed in a predetermined direction.

Next, a method for manufacturing the screen mask 20 according to this embodiment will be described with reference to FIG. 11. FIG. 11 is an explanatory diagram showing a method of manufacturing the screen mask 20. The method for manufacturing the screen mask 20 includes a first layer forming step ST1, a first patterning step ST2, a second layer forming step ST3, a seasoning step, a second patterning step ST4, and an etching step ST5.

The first emulsion is, for example, a photocurable resin, and is a liquid containing, for example, polyvinyl alcohol (PVA), polyvinyl acetate (PVAc), silicone resin, acrylic resin, epoxy resin, and the like.

In the first layer forming step, the first emulsion Pm1 is applied to a support material having holes through which the coating material can pass, thereby forming a first emulsion layer. Specifically, first, with the mesh 22 mounted within the frame 21 so as to be substantially flat, a coating process is performed to apply the first emulsion Pm1 onto the mesh 22, as shown in ST1. Then, on the mesh 22, a base layer 23b is formed in the shape of a flat plate. At this time, since the thickness changes depending on the number of times of application, the application is repeated multiple times as necessary. In addition, the film thickness may be measured after drying and additional coating may be applied depending on the case. In this embodiment, the thickness of the emulsion Pm1 is set so that the first emulsion layer has a thickness of about 5 to 20 μm after drying.

Next, a first patterning step is performed in which the first emulsion layer is exposed with a predetermined first exposure pattern. For example, as shown in ST2, a first maskless exposure process is performed using a maskless exposure machine that does not use a photomask. Specifically, the surface side of the base layer 23b is placed in a predetermined exposure pattern area so as to face illumination such as an ultraviolet lamp or an ultraviolet LED, and light is irradiated by the illumination to perform an exposure process to illuminate the surface of the emulsion. The first exposed portion of the base layer 23b that is exposed by the first exposure process becomes a first emulsion hardened portion (first photocrosslinked portion) Pa1 that is hardened by ultraviolet rays. On the other hand, the first non-exposed portion of the base layer 23b excluding the first exposed portion becomes an uncured portion Pb1 where the emulsion is not hardened. The first uncured portion Pb1 (first non-exposed portion) constitutes a first removal target portion that will be removed in a later step to form a base opening. Here, the first exposure pattern and the second exposure pattern are different.

As described above, the base layer 23b is patterned and removed in a later etching process to form a first removal target portion that constitutes a base opening.

Next, as shown in ST3, by performing a coating process of overlappingly applying the second emulsion Pm2 on the base layer 23b, a second emulsion layer is formed with the second emulsion Pm2 on the printing surface side of the base layer 23b. A certain cover layer 23c is formed. At this time, since the thickness changes depending on the number of times of application, the application is repeated multiple times as necessary. In addition, the film thickness may be measured after drying and additional coating may be applied depending on the case. Then, a seasoning process is performed in which the temperature of the frame is made to be about the same as that during the first maskless exposure process by leaving it for about 3 hours under conditions for performing the maskless exposure process.

Next, a second patterning step is performed in which exposure is performed using a second exposure pattern different from the first exposure pattern. That is, as shown in ST4, a second maskless exposure process is performed using a maskless exposure machine that does not use a photomask. Specifically, an exposure process is performed in which the surface side of the emulsion Pm2 is placed in a predetermined second exposure pattern area so as to face illumination such as an ultraviolet lamp or an ultraviolet LED, and light is irradiated by the illumination to illuminate the surface of the emulsion Pm2. I do. By the second exposure process, the portions of the emulsion Pm2 that are irradiated with ultraviolet rays are cured by the ultraviolet rays, corresponding to the portions of the exposed pattern area. That is, the second exposed portion of the cover layer 23c that is exposed by the second exposure process forms a second emulsion hardened portion (second photocrosslinked portion) Pa2 that is hardened by ultraviolet rays. A second non-exposed region of the cover layer 23c excluding the second exposed region becomes a second uncured region Pb2 where the emulsion is not hardened. The second uncured portion Pb2 includes a second removal target portion that will be removed in a later step to form the recess 25.

Both the first exposure process and the second exposure process are exposure processes in which light is irradiated from the printing surface side, and the second exposure process is a process in which light is irradiated from the same direction as the first exposure process. Rather, a predetermined range is cured by exposing a narrower area to light in a pattern. In the second patterning step, exposure is performed using a second exposure pattern different from the first exposure pattern.

Note that, for example, when the second cover layer 23c is thick, in order to increase the adhesive strength between the first base layer 23b and the second cover layer 23c, the first layer is The first exposure pattern of the base layer 23b may be wider than the desired opening pattern, and the opening pattern may be exposed when the second cover layer 23c is exposed.
It is also possible to align the edges of the second layer with the edges of the first layer.

After that, as an etching process ST5, at least one side of the mask film is washed away with water or a solvent. By this treatment, uncured portions of the emulsions Pm1 and Pm2 are washed away, and pattern openings 24 penetrating from the front side to the back side in the thickness direction are formed, as well as recesses 25. That is, on one surface, a recess 25 is formed in a region where the cover layer corresponding to the second non-exposed region is not formed. The recess 25 serves as an escape part that retreats to the opposite side of the ejection direction, and for example, when there is a protrusion or step such as a component or alignment mark on the side of a member such as a print medium that faces the screen mask 20 during printing, the protrusion Pc This makes it possible to avoid interference with the

Next, a method for manufacturing printed matter by a screen printing method using the screen printing apparatus 10 according to this embodiment will be described with reference to FIGS. 2 and 10. First, the front surface side of the screen mask 20 is placed so as to face the surface of the printing medium Ba held by the holding member 12. Positioning is performed so that the protrusion Pc of the component placed on the opposing print medium Ba is placed in the recess 25.

Then, as shown by the two-dot chain line in FIG. 2, a highly viscous paste coating material Pe is supplied from the back side of the screen mask 20, that is, the surface opposite to the printing medium Ba, and the coating material Pe is patterned. The opening 24 is filled.

Next, the squeegee 13 is placed on the back surface 20b of the screen mask 20, that is, the surface opposite to the printing surface side. At this time, for example, the squeegee 13 is placed at a predetermined angle with respect to the front surface of the print medium Ba. Then, the squeegee 13 is moved at a predetermined speed while pressing the back surface of the mesh 22 and the mask film 23 toward the print medium Ba side with a predetermined printing pressure. The squeegee 13 presses the mask film 23 in a region covering the entire back surface of the mask film 23. By pressing with the squeegee 13, the mask film 23 is deformed so that the pressed portion is displaced to the front side and comes into contact with the printing medium Ba. The coating material Pe passed by the squeegee 13 is pushed out from the pattern opening 24 toward the printing medium Ba.

At this time, the coating material Pe simultaneously wraps around the recess 25 disposed in a position communicating with the pattern opening 24.

After the squeegee 13 passes, the mask film 23 and the mesh 22 are deformed so as to recover and separate from the printing medium Ba, and some of the coating material Pe is transferred and remains on the printing medium Ba, so that the printing medium Ba A pattern is printed on top to complete the printed product. At this time, part of the back side of the coating material Pe remains on the mask film 23 side. Note that the coating material Pe is various materials including, for example, metal materials and resin materials, and various materials are used depending on the type of printing target, for example, electronic parts, displays, etc. Then, the coating material Pe is also applied onto the component placed at a position facing the recess 25 placed in communication with the pattern opening 24. On the other hand, the coating material Pe is not applied to the recesses 25 arranged independently of the pattern openings 24.

According to the screen mask 20, screen printing device 10, and screen printing method configured as described above, it is possible to reduce the load during printing. The concave portion 25 serves as a relief portion that retreats to the opposite side of the ejection direction, and for example, if there is a protrusion such as an alignment mark or a step on the side of a member such as a print medium that faces the screen mask 20 during printing, interference with the protrusion may occur. It is possible to avoid this.

Further, according to the present embodiment, the first exposure process and the second exposure process are both exposure processes in which light is irradiated from the printing surface side, and by varying the conditions such as the exposure amount and exposure time, It is possible to easily form the recesses 25 and pattern openings 24.

Furthermore, by patterning with maskless exposure, the position and depth of the pattern opening 24 as well as the recess 25 can be adjusted with high precision. Can be formed.

For example, as shown in the center of FIG. 10, when connecting the pattern formed by the pattern opening 24 to an electronic component, a conductive coating material is passed around the recess 25 through the pattern opening 24. By doing so, two stages of wiring can be performed simultaneously. For example, when forming a predetermined pattern wiring around a component mounted on a board in advance, connections from the pattern wiring to the component can be made at the same time, and load on the component and the board can be avoided. That is, it is possible to form another pattern continuing from the pattern opening 24 by forming the recess 25 in a pattern different from that of the pattern opening 24, and it becomes possible to simultaneously perform three-dimensional and stepwise application.

It should be noted that the present invention is not limited to the above-described embodiments as they are, but can be implemented by modifying the constituent elements within the scope of the invention at the implementation stage.

In the above embodiment, the configuration of the recess 25 is shown as communicating with the pattern openings 24 on both sides, but the configuration is not limited to this. For example, as shown in FIGS. 12 and 13 as another embodiment, the configuration of the recess 25 is The shape may be such that only one side communicates with the pattern opening 24. FIG. 14 shows an example of the manufacturing method. For example, when the second cover layer 23c is thick, in order to increase the adhesion strength between the first base layer 23b and the second cover layer 23c, the opening pattern 24 is also formed on the first base layer 23c. The first exposure pattern of the layer 23b may be wider than the desired opening pattern, and the opening pattern may be exposed when the second cover layer 23c is exposed. Note that it is also possible to align the edges of the cover layer 23c and the edges of the base layer 23b.

Further, in the above embodiment, an example is shown in which the openings have a linear pattern, but the invention is not limited to this. For example, as shown in FIGS. 15 and 16 as another embodiment, the non-coated area may have a linear pattern shape. As for the printing shape, as shown in FIG. 15, the non-coating area is a fine pattern with a line width of 20 μm, for example, and the parts are arranged in a part of the non-coating area on the printing medium Ba. As shown in FIG. 16, the mask film 23 includes a recessed portion in a part of the non-coated area where the component is placed. Even in this case, the load during printing can be reduced by having the recess 25 at a position facing the protrusion, as in the above embodiment, and also, as in the above embodiment, maskless exposure allows for non-coating. The recesses 25 can be formed with high accuracy in a fine pattern with an area of 20 μm or less.

In the above embodiment, a configuration having one stage of recessed portions 25 is illustrated, but the number of stages is not limited to one stage. A plurality of types of recesses may be formed with different depths or different patterns. For example, as shown in FIG. 17, the shape of the emulsion can be defined in three steps by performing the emulsion forming step and the exposure step in three steps. Accordingly, as shown in FIG. 18, a plurality of types of recesses 25 having different heights can be formed, and the shape of the mask film can be defined by a three-dimensional pattern. For example, even if parts have different heights, the depth, position, and shape of the recess can be defined according to the height and position of each part, and a plurality of different types of recesses can be formed.

According to such a screen mask, a method for manufacturing a screen mask, and a method for manufacturing a printed matter, a step having a recessed portion can be formed at an arbitrary location with high precision. For example, if there is a protrusion or step such as an alignment mark on the opposing surface of the screen mask, a recess that will serve as a recess that is retracted in the opposite direction to the ejection direction can be formed in that portion with high precision. Therefore, a screen mask 20 with high printing accuracy can be provided.

In each of the above embodiments, when the first emulsion and the second emulsion are used, the first emulsion and the second emulsion may be made of different materials or may be made of the same material.

Further, in the above embodiment, an example was shown in which the mesh 22 was attached to the frame 21 with an adhesive and the mask film 23 was formed over the entire opening of the frame 21, but the present invention is not limited to this. For example, the mesh may be of a so-called combination type, or the mask film 23 may be formed only in a part of the central portion of the mesh 22.

In addition, each component illustrated in the above embodiment may be deleted, or the shape, structure, material, etc. of each component may be changed. Various inventions can be formed by appropriately combining the plurality of components disclosed in the above embodiments.

DESCRIPTION OF SYMBOLS 10... Screen printing device, 12... Holding member, 13... Squeegee, 20,... Screen mask, 20a... Front surface, 20b... Back surface, 21... Frame, 22... Mesh, 22a... Warp, 22b... Weft, 22c... Hole, 23...Mask film, 24...Pattern opening, 23b...Base layer, 23c...Cover layer, 25...Concave portion, Pa1...First emulsion hardened part, Pa2...Second emulsion hardened part, Pb1...First uncured part, Pb2... Second uncured portion, Pm1...first emulsion, Pm2...second emulsion, Pc...protrusion.

A method for manufacturing a printed matter according to one embodiment includes: a support material having a hole through which a coating material can pass; an opening formed in the support material that penetrates in the thickness direction and through which the coating material passes; and a mask film having a recessed part at least partially communicating with the mask film and a recessed part in which the surface on the printing surface side, which is the discharge side of the coating material, retreats to the other side. The components are disposed facing each other on the printing target so that they are disposed in the recesses, and the coating material is supplied to the openings so that the coating material is passed around into the recesses through the openings and coated. connecting the material to the component.

A screen mask according to another embodiment includes: a support material having holes through which a coating material can pass; an opening formed in the support material and penetrating in the thickness direction and through which the coating material passes; and a recessed part formed at least partially at a different position so that the surface of the printing surface, which is the discharge side of the coating material, retreats to the other side, and the recessed part has It is formed at a position facing the parts to be placed, and at least a portion thereof is continuous with the opening.
A screen mask according to another embodiment includes: a support material having holes through which a coating material can pass; an opening formed in the support material and penetrating in the thickness direction and through which the coating material passes; and a recessed part formed at least partially at a different position so that the surface of the printing surface, which is the discharge side of the coating material, retreats to the other side, and the recessed part has It is formed at a position facing the parts to be placed, and is continuous with the openings placed on both sides.
A screen mask according to another embodiment includes: a support material having holes through which a coating material can pass; an opening formed in the support material and penetrating in the thickness direction and through which the coating material passes; and a recessed part formed at least partially at a different position so that the surface of the printing surface, which is the discharge side of the coating material, retreats to the other side, and the recessed part has It is formed at a position facing the parts to be placed, and one side portion is continuous with the opening.

In addition, each component illustrated in the above embodiment may be deleted, or the shape, structure, material, etc. of each component may be changed. Various inventions can be formed by appropriately combining the plurality of components disclosed in the above embodiments.
Below, descriptions equivalent to the invention stated in the original claims of this application will be added.
(1)
a support material having holes through which the coating material can pass;
an opening formed in the support material that penetrates in the thickness direction and through which the coating material passes; and a printing surface that is formed at a position at least partially different from the opening and is on one side in the discharge direction of the coating material. a mask film having a recess in which one side surface retreats to the other side;
A screen mask with.
(2)
The screen mask according to (1), wherein the recess is formed at a position facing a protrusion disposed on the printing target, and at least a portion thereof is continuous with the opening.
(3)
The screen mask according to (1), wherein the concave portion is formed at a position facing a protrusion disposed on the printing target and is disposed at a position spaced apart from the opening.
(4)
a first layer forming step of forming a first emulsion layer by coating a first emulsion on a support material having holes through which the coating material can pass;
a first patterning step of exposing the first emulsion layer with a predetermined first exposure pattern;
a second layer forming step of coating a second emulsion over the first emulsion layer to form a second emulsion layer;
a second patterning step of exposing with a second exposure pattern different from the first exposure pattern;
A method for manufacturing a screen mask, comprising: forming openings in the first emulsion layer and the second emulsion layer by etching, and forming a recessed portion in which one surface retreats to the other side.
(5)
5. The method of manufacturing a screen mask according to claim 4, wherein the exposure is maskless exposure.
(6)
(1) The screen mask according to any one of (3) is placed facing a printing target having a component on the opposing surface so that the component is disposed in the recess, and the coating material is applied to the opening. A method for producing a printed matter, comprising: forming a coating material in a pattern corresponding to the shape of the opening by supplying the coating material from the opening.

Claims (6)

a support material having holes through which the coating material can pass;
an opening formed in the support material that penetrates in the thickness direction and through which the coating material passes; and a printing surface that is formed at a position at least partially different from the opening and is on one side in the discharge direction of the coating material. a mask film having a recess in which one side surface retreats to the other side;
A screen mask with. The screen mask according to claim 1, wherein the recess is formed at a position facing a protrusion disposed on the printing target, and at least a portion thereof is continuous with the opening. The screen mask according to claim 1, wherein the recess is formed at a position facing a protrusion disposed on the printing target and spaced apart from the opening. a first layer forming step of forming a first emulsion layer by coating a first emulsion on a support material having holes through which the coating material can pass;
a first patterning step of exposing the first emulsion layer with a predetermined first exposure pattern;
a second layer forming step of coating a second emulsion over the first emulsion layer to form a second emulsion layer;
a second patterning step of exposing with a second exposure pattern different from the first exposure pattern;
A method for manufacturing a screen mask, comprising: forming openings in the first emulsion layer and the second emulsion layer by etching, and forming a recessed portion in which one surface retreats to the other side. 5. The method of manufacturing a screen mask according to claim 4, wherein the exposure is maskless exposure. The screen mask according to any one of claims 1 to 3 is placed facing a printing target having a component on an opposing surface so that the component is disposed in the recess, and the coating material is applied from the opening. A method of manufacturing a printed matter, comprising supplying a coating material in a pattern corresponding to the shape of the opening.