WO2019239246A1 - 半導体装置、及び電子機器 - Google Patents

半導体装置、及び電子機器 Download PDF

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Publication number
WO2019239246A1
WO2019239246A1 PCT/IB2019/054515 IB2019054515W WO2019239246A1 WO 2019239246 A1 WO2019239246 A1 WO 2019239246A1 IB 2019054515 W IB2019054515 W IB 2019054515W WO 2019239246 A1 WO2019239246 A1 WO 2019239246A1
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Prior art keywords
terminal
transistor
circuit
electrically connected
switch
Prior art date
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Ceased
Application number
PCT/IB2019/054515
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English (en)
French (fr)
Japanese (ja)
Inventor
木村肇
黒川義元
井上達則
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2020524940A priority Critical patent/JP7330961B2/ja
Priority to US16/973,223 priority patent/US11424737B2/en
Publication of WO2019239246A1 publication Critical patent/WO2019239246A1/ja
Anticipated expiration legal-status Critical
Priority to US17/883,748 priority patent/US11848664B2/en
Priority to JP2023130363A priority patent/JP7562785B2/ja
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1006—Data managing, e.g. manipulating data before writing or reading out, data bus switches or control circuits therefor
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/30—Modifications for providing a predetermined threshold before switching
    • H03K17/302—Modifications for providing a predetermined threshold before switching in field-effect transistor switches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/06—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons
    • G06N3/063—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using electronic means
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/54—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using elements simulating biological cells, e.g. neuron
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
    • H03K17/0812—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
    • H03K2017/6878—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors using multi-gate field-effect transistors

Definitions

  • One embodiment of the present invention relates to a semiconductor device and an electronic device.
  • one embodiment of the present invention is not limited to the above technical field.
  • the technical field of the invention disclosed in this specification and the like relates to an object, a method, or a manufacturing method.
  • one embodiment of the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter). Therefore, the technical field of one embodiment of the present invention disclosed in this specification more specifically includes a semiconductor device, a display device, a liquid crystal display device, a light-emitting device, a power storage device, an imaging device, a memory device, a signal processing device, and a processor.
  • An electronic device, a system, a driving method thereof, a manufacturing method thereof, or an inspection method thereof can be given as an example.
  • the integrated circuit incorporates a brain mechanism as an electronic circuit, and has circuits corresponding to “neurons” and “synapses” of the human brain. For this reason, such an integrated circuit is sometimes referred to as “neuromorphic” or “brainmorphic”.
  • the integrated circuit has a non-Neumann architecture and is expected to be able to perform parallel processing with very little power consumption as compared to a Neumann architecture in which power consumption increases as the processing speed increases.
  • Non-Patent Document 1 An information processing model imitating a neural network having “neurons” and “synapses” is called an artificial neural network (ANN).
  • ANN artificial neural network
  • Patent Document 1 Patent Document 2, Non-Patent Document 1, and Non-Patent Document 2 disclose an arithmetic device that forms an artificial neural network using ReRAM (Resistive Random Access Memory).
  • Non-Patent Document 1 and Non-Patent Document 2 disclose circuits that simulate the mechanism of the brain having the arithmetic device.
  • an artificial neural network a calculation is performed by multiplying the synaptic connection strength (sometimes referred to as a weighting factor) that connects two neurons with a signal transmitted between the two neurons.
  • the connection strength of each synapse between a plurality of first neurons in the first layer and one of the second neurons in the second layer, and the plurality of first neurons in the first layer Need to be multiplied by each signal input to one of the second neurons in the second layer, and the connection strength and the number of parameters indicating the signal are determined according to the scale of the artificial neural network. . That is, in the artificial neural network, as the number of layers, the number of neurons, and the like increase, the number of circuits corresponding to each of “neuron” and “synapse” increases, and the amount of calculation may become enormous.
  • the circuits constituting the chip When the number of circuits constituting the chip increases, power consumption increases and the amount of heat generated when the device is driven increases. In particular, as the amount of heat generation increases, the characteristics of the circuit elements included in the chip are affected. Therefore, it is preferable that the circuits constituting the chip have circuit elements that are not easily affected by temperature. In addition, when a plurality of circuit elements are formed in a chip manufacturing process, characteristics of the circuit elements may vary. Therefore, a circuit included in the chip has a function of correcting variations in characteristics of the circuit elements. It is preferable.
  • An object of one embodiment of the present invention is to provide a semiconductor device or the like in which a hierarchical artificial neural network is constructed. Another object of one embodiment of the present invention is to provide a semiconductor device or the like with low power consumption. Another object of one embodiment of the present invention is to provide a semiconductor device or the like that is not easily affected by environmental temperature. Another object of one embodiment of the present invention is to provide a semiconductor device or the like having a function of correcting variation in characteristics of circuit elements. Another object of one embodiment of the present invention is to provide a novel semiconductor device or the like.
  • problems of one embodiment of the present invention are not limited to the problems listed above.
  • the problems listed above do not disturb the existence of other problems.
  • Other issues are issues not mentioned in this section, which are described in the following description. Problems not mentioned in this item can be derived from descriptions of the specification or drawings by those skilled in the art, and can be appropriately extracted from these descriptions.
  • one embodiment of the present invention solves at least one of the above-described problems and other problems. Note that one embodiment of the present invention does not have to solve all of the problems listed above and other problems.
  • One embodiment of the present invention includes a circuit including an input terminal, an output terminal, and a first transistor, and a first holding portion including a sixth transistor and a capacitor, and the first transistor includes a first gate. And the second gate, the second gate of the first transistor is electrically connected to the first terminal of the sixth transistor and the first terminal of the capacitor, and the first holding unit is A function of holding a potential at the first terminal of the capacitive element, and a function of determining a time from when an input signal is input to the input terminal of the circuit until the output signal is output from the output terminal according to the potential. It is a semiconductor device.
  • One embodiment of the present invention includes a first circuit, and the first circuit includes a first input terminal, a second input terminal, a first output terminal, a second output terminal, and a second A circuit, a third circuit, and a switching circuit, the second circuit includes a first transistor, the first transistor includes a first gate and a second gate, and the switching circuit includes , Having third to fifth input terminals, the first input terminal is electrically connected to the input terminal of the second circuit, the second input terminal is electrically connected to the input terminal of the third circuit, The output terminal of the second circuit is electrically connected to the third input terminal, the output terminal of the third circuit is electrically connected to the fourth input terminal, and the second circuit is connected to the input terminal of the second circuit.
  • the function of correcting the input signal and outputting the corrected signal to the output terminal of the second circuit, and the potential of the second gate of the first transistor Accordingly, a function of changing a time from when a signal is input to the input terminal of the second circuit to when a corrected signal is output from the output terminal of the second circuit is provided.
  • the function of correcting the signal input to the input terminal of the third circuit and outputting the corrected signal to the output terminal of the third circuit is provided, and the switching circuit is responsive to the signal input to the fifth input terminal.
  • the third input terminal and one of the first output terminal or the second output terminal are electrically connected, and the fourth input terminal and the other of the first output terminal or the second output terminal are electrically connected. This is a semiconductor device having a function of connecting to each other.
  • the first circuit includes a plurality of stages, and the first output terminal of the first circuit in the front stage is the first circuit of the first circuit in the rear stage.
  • the second output terminal of the first circuit in the preceding stage is electrically connected to the input terminal, and the second output terminal of the first circuit in the first stage is electrically connected to the second input terminal of the first circuit in the subsequent stage.
  • a potential corresponding to the corresponding first data is applied to each of the gates, and a first signal corresponding to the corresponding second data is applied to each of the fifth input terminals of all the switching circuits.
  • input signals are respectively input to the first input terminal and the second input terminal of the first circuit of the first stage, and output from the first output terminal and the second output terminal of the first circuit of the final stage.
  • the time difference between the output signals depends on the product sum of the first data and the second data. Time to become a semiconductor device.
  • One embodiment of the present invention has the fourth circuit in the configuration of (3), and the fourth circuit includes a first output terminal of the first circuit in the final stage, a second output terminal,
  • the fourth circuit is a semiconductor device having a function of generating a signal corresponding to a time difference between output signals.
  • the second circuit includes a second transistor, a first holding portion, a first inverter circuit
  • the first transistor is an n-channel transistor
  • the second transistor is a p-channel transistor
  • the input terminal of the second circuit is the gate of the second transistor and the first transistor 1 gate
  • the first terminal of the second transistor is electrically connected to the first terminal of the first transistor and the input terminal of the first inverter circuit.
  • the output terminal is electrically connected to the output terminal of the second circuit
  • the second gate of the first transistor is electrically connected to the first holding unit
  • the first holding unit is the second gate of the first transistor. Hold the potential of Capable of a semiconductor device.
  • the second circuit includes the second to fifth transistors, the first holding portion, and the second holding. And a first inverter circuit, wherein the first transistor and the third transistor are n-channel transistors, the second transistor is a p-channel transistor, and the fourth transistor is And the input terminal of the second circuit is electrically connected to the gate of the second transistor, the third gate of the fourth transistor, and the first gate of the first transistor.
  • the first terminal of the second transistor is electrically connected to the first terminal of the third transistor, the first terminal of the fifth transistor, and the input terminal of the first inverter circuit.
  • the second terminal is The first terminal of the first transistor is electrically connected to the first terminal, the second terminal of the fifth transistor is electrically connected to the first terminal of the fourth transistor, and the output terminal of the first inverter circuit is connected to the second circuit.
  • the second gate of the first transistor is electrically connected to the first holding portion, the fourth gate of the fourth transistor is electrically connected to the second holding portion, and is electrically connected to the output terminal.
  • the 1 holding unit is a semiconductor device having a function of holding the potential of the second gate of the first transistor, and the second holding unit has a function of holding the potential of the fourth gate of the fourth transistor.
  • the second circuit includes a second transistor, a third transistor, a first holding portion, Each of the first transistor and the third transistor is an n-channel transistor, the second transistor is a p-channel transistor, and the input terminal of the second circuit is The gate of the second transistor, the gate of the third transistor, and the first gate of the first transistor are electrically connected, and the first terminal of the second transistor is connected to the first terminal of the third transistor, The second terminal of the third transistor is electrically connected to the first terminal of the first transistor, and the output terminal of the first inverter circuit is electrically connected to the input terminal of the inverter circuit.
  • the second circuit is electrically connected to the output terminal of the second circuit, the second gate of the first transistor is electrically connected to the first holding unit, and the first holding unit holds the potential of the second gate of the first transistor.
  • the second circuit includes a load element, a first holding unit, and a first inverter circuit.
  • the input terminal of the second circuit is electrically connected to the first gate of the first transistor
  • the first terminal of the load element is the first terminal of the first transistor
  • the input terminal of the first inverter circuit is electrically connected to the first holding unit
  • the first holding unit is a semiconductor device having a function of holding the potential of the second gate of the first transistor.
  • the first holding portion includes a sixth transistor and a capacitor.
  • the second gate is electrically connected to the first terminal of the sixth transistor and the first terminal of the capacitor, and the sixth transistor is a semiconductor device having a metal oxide in a channel formation region.
  • the first holding unit includes a second inverter circuit and a third inverter circuit.
  • the second gate of the first transistor is electrically connected to the input terminal of the second inverter circuit and the output terminal of the third inverter circuit, and the output terminal of the second inverter circuit is the input terminal of the third inverter circuit.
  • the semiconductor device is electrically connected to the semiconductor device.
  • One embodiment of the present invention includes a circuit.
  • the circuit includes a driving portion, a correction portion, and a first holding portion.
  • the driving portion includes a first transistor and a second transistor.
  • the second transistor is a p-channel transistor
  • the first transistor is an n-channel transistor having a first gate and a second gate
  • the driving unit Generates an inverted signal of the signal input to the input terminal and outputs the inverted signal to the output terminal of the circuit.
  • the correction unit corrects the threshold voltage of the first transistor and / or the second transistor.
  • the first holding unit is a semiconductor device having a function of holding the potential of the second gate of the first transistor.
  • the correction unit includes first to fourth switches and a first capacitor, and the input terminal of the circuit is the first
  • the first gate of the transistor is electrically connected to the gate of the second transistor, and the first terminal of the second transistor is electrically connected to the first terminal of the first switch and the output terminal of the circuit.
  • the first terminal of the first transistor is electrically connected to the second terminal of the first switch and the first terminal of the second switch, and the second terminal of the first transistor is the second terminal of the third switch.
  • the second gate of the first transistor is electrically connected to the second terminal of the second switch and the first terminal of the first capacitor element, and is connected to the first terminal of the first capacitor element.
  • the two terminals are the second terminal of the third switch, the first terminal of the fourth switch, Is electrically connected to the second terminal of the fourth switch is electrically connected to the first holding part is a semiconductor device.
  • the correction unit includes third to eighth switches and a first capacitor
  • the input terminal of the circuit is the second
  • the gate of the transistor is electrically connected to the first terminal of the fifth switch
  • the second terminal of the fifth switch is electrically connected to the first gate of the first transistor and the first terminal of the seventh switch.
  • the first terminal of the second transistor is electrically connected to the first terminal of the first transistor and the output terminal of the circuit
  • the second terminal of the first transistor is the second terminal of the third switch. 1 terminal, a second terminal of the seventh switch, and a first terminal of the eighth switch, and the second gate of the first transistor is connected to the first terminal of the sixth switch and the first capacitor.
  • the semiconductor device is electrically connected to the second terminal of the third switch and the first terminal of the fourth switch, and the second terminal of the fourth switch is electrically connected to the first holding portion. It is.
  • the correction unit includes first to fourth switches and a first capacitor, and the input terminal of the circuit is the first
  • the first gate of the transistor is electrically connected to the gate of the second transistor, and the first terminal of the second transistor is electrically connected to the first terminal of the first transistor and the output terminal of the circuit.
  • the second terminal of the second transistor is electrically connected to the first terminal of the first switch, the first terminal of the first transistor is electrically connected to the first terminal of the second switch, and
  • the second terminal of the transistor is electrically connected to the first terminal of the third switch, and the second gate of the first transistor is connected to the second terminal of the second switch and the first terminal of the first capacitor.
  • the second terminal of the first capacitor is electrically connected, and the third capacitor
  • the second terminal of the switch is electrically connected to the first terminal of the fourth switch, and the second terminal of the fourth switch is a semiconductor device electrically connected to the first holding portion. .
  • the correction unit includes eighth to eleventh switches and a second capacitor, and the input terminal of the circuit is the tenth.
  • the first terminal of the switch is electrically connected to the first gate of the first transistor
  • the first terminal of the second transistor is the first terminal of the first transistor
  • the first terminal of the eleventh switch
  • the second terminal of the second transistor is electrically connected to the first terminal of the ninth switch
  • the second terminal of the tenth switch is connected to the second terminal of the ninth switch
  • the second terminal of the second transistor is electrically connected to the second terminal of the ninth switch
  • the second terminal of the tenth switch is connected to the second terminal of the ninth switch
  • the gate of the second transistor is electrically connected to the second terminal of the eleventh switch and the second terminal of the second capacitor, and is electrically connected to the first terminal of the capacitor.
  • the first terminal of the transistor is electrically connected to the output terminal of the circuit, and the first terminal
  • the switch is a circuit element electrically connected between the first terminal of the first transistor and the first terminal of the second transistor, or a circuit element electrically connected to the second terminal of the first transistor.
  • the second gate of one transistor is a semiconductor device that is electrically connected to the first holding unit.
  • the correction unit in the configuration of (11), includes first, ninth, tenth, and eleventh switches, and a second capacitor.
  • the input terminal is electrically connected to the first terminal of the tenth switch and the first gate of the first transistor, and the first terminal of the second transistor is the first terminal of the first transistor and the output of the circuit
  • the second terminal of the second transistor is electrically connected to the first terminal of the first switch and the first terminal of the ninth switch, and the second terminal of the tenth switch.
  • the terminal is electrically connected to the second terminal of the ninth switch and the first terminal of the second capacitor element, and the gate of the second transistor is connected to the first terminal of the eleventh switch and the second capacitor element.
  • the second gate of the first transistor is electrically connected to the second terminal.
  • is electrically connected to the holding part is a semiconductor device.
  • the correction unit includes ninth to eleventh switches and a second capacitor element.
  • the input terminal of the circuit and the first terminal of the tenth switch are electrically connected between the terminal and the gate of the second transistor, and the second terminal of the tenth switch and the first terminal of the second capacitor element are Electrically connected, the second terminal of the second capacitor element and the gate of the second transistor are electrically connected, and the first terminal of the ninth switch is electrically connected to the first terminal of the second transistor.
  • the second terminal of the ninth switch is electrically connected to the second terminal of the tenth switch and the first terminal of the second capacitive element, and the first terminal of the eleventh switch is the second terminal of the second transistor.
  • the second terminal of the eleventh switch is electrically connected to the two terminals.
  • a second terminal of the second capacitor, a first gate of the second transistor, the are electrically connected to a semiconductor device.
  • the correction unit includes a first switch, ninth to eleventh switches, and a second capacitor, and the first switch Is electrically connected to the second terminal of the second transistor, and the input terminal of the circuit and the first terminal of the tenth switch are electrically connected between the input terminal of the circuit and the gate of the second transistor.
  • the second terminal of the tenth switch and the first terminal of the second capacitor element are electrically connected, the second terminal of the second capacitor element and the gate of the second transistor are electrically connected, and the ninth switch
  • the first terminal of the ninth switch is electrically connected to the second terminal of the second transistor and the first terminal of the first switch, and the second terminal of the ninth switch is connected to the second terminal of the tenth switch,
  • the first terminal of the pitch has a second terminal of the second capacitive element, and the gate of the second transistor, the are electrically connected to a semiconductor device.
  • the correction unit includes ninth to eleventh switches and a second capacitor, and the input terminal of the circuit and the second transistor The circuit input terminal and the first terminal of the tenth switch are electrically connected to each other, and the second terminal of the tenth switch and the first terminal of the second capacitor element are electrically connected to each other.
  • the second terminal of the second capacitor element and the gate of the second transistor are electrically connected, the first terminal of the ninth switch, the second terminal of the second transistor, the first terminal of the first switch,
  • the second terminal of the ninth switch is electrically connected to the second terminal of the tenth switch and the first terminal of the second capacitor element, and the first terminal of the eleventh switch is ,
  • the second terminal of the second capacitor element and the gate of the second transistor It is connected, a semiconductor device.
  • the first holding portion includes a third transistor and a third capacitor
  • a second gate of one transistor is electrically connected to a first terminal of the third transistor and a first terminal of the third capacitor
  • the third transistor includes a metal oxide in a channel formation region.
  • the first holding unit includes a first inverter circuit and a second inverter circuit.
  • the second gate of the first transistor is electrically connected to the input terminal of the first inverter circuit and the output terminal of the second inverter circuit, and the output terminal of the first inverter circuit is the input terminal of the second inverter circuit.
  • the semiconductor device is electrically connected to the semiconductor device.
  • One embodiment of the present invention includes a first circuit including two circuits in any one of the above structures (11) to (21), and the first circuit includes a first input terminal and , A second input terminal, a first output terminal, a second output terminal, a second circuit, a third circuit, and a switching circuit, wherein the switching circuit includes third to fifth input terminals, The first input terminal is electrically connected to the input terminal of one of the two circuits, and the output terminal of one of the two circuits is the third output terminal.
  • the third output terminal is electrically connected to the first output terminal, the second input terminal is electrically connected to the input terminal of the other circuit of the two, and the third output terminal is electrically connected to the input terminal.
  • the output terminal of the other circuit is electrically connected to the fourth input terminal, and the fourth output terminal is electrically connected to the second output terminal.
  • the second circuit is between the first input terminal and the input terminal of one of the two circuits, between the output terminal of one of the two circuits and the third input terminal, or between the third output terminal and the second input terminal.
  • the third circuit is electrically connected to any one of the two output terminals, and the third circuit is connected between the second input terminal and the input terminal of the other of the two circuits, and the output of the other of the two circuits.
  • a signal input to the input terminal of the second circuit is electrically connected to either the terminal and the fourth input terminal or between the fourth output terminal and the second output terminal.
  • the inverted signal is generated and output to the output terminal of the second circuit.
  • the third circuit generates the inverted signal of the signal input to the input terminal of the third circuit and
  • the switching circuit has a function of outputting a signal to the output terminal of the third circuit, and the switching circuit receives the third input in accordance with the signal input to the fifth input terminal.
  • a function of electrically connecting the terminal and one of the third output terminal or the fourth output terminal and electrically connecting the fourth input terminal and the other of the third output terminal or the fourth output terminal A semiconductor device having
  • the first circuit in the structure of (22), includes a plurality of stages, and the first output terminal of the first circuit in the front stage is the first circuit of the first circuit in the rear stage.
  • the second output terminal of the first circuit in the preceding stage is electrically connected to the input terminal, and the second input terminal of the first circuit in the subsequent stage is electrically connected to each of the holding nodes of all the first circuits.
  • the first stage When the potential corresponding to the corresponding first data is held, and the first signal corresponding to the corresponding second data is applied to each of the fifth input terminals of all the switching circuits, the first stage When the input signals are input to the first input terminal and the second input terminal of the first circuit of the first circuit, respectively, the respective outputs output from the first output terminal and the second output terminal of the first circuit of the final stage
  • the time difference between the signals is a time corresponding to the product sum of the first data and the second data.
  • One embodiment of the present invention includes the fourth circuit in the configuration of (23), and the fourth circuit includes a first output terminal of the first circuit in the final stage, a second output terminal,
  • the fourth circuit is a semiconductor device having a function of generating a signal corresponding to a time difference between output signals.
  • One embodiment of the present invention is a semiconductor device in any one of the above structures (1) to (24), in which the first transistor includes a metal oxide in a channel formation region.
  • One embodiment of the present invention is an electronic device that includes the semiconductor device according to any one of (1) to (25) and performs a neural network operation using the semiconductor device.
  • a semiconductor device refers to a device using semiconductor characteristics, such as a circuit including a semiconductor element (a transistor, a diode, a photodiode, or the like), a device including the circuit, or the like. In addition, it refers to all devices that can function by utilizing semiconductor characteristics. For example, an integrated circuit, a chip including the integrated circuit, and an electronic component in which the chip is housed in a package are examples of the semiconductor device.
  • a memory device, a display device, a light-emitting device, a lighting device, an electronic device, and the like are themselves semiconductor devices and may include a semiconductor device.
  • X and Y are connected, X and Y are electrically connected, and X and Y are functionally connected. And the case where X and Y are directly connected are disclosed in this specification and the like. Therefore, it is not limited to a predetermined connection relationship, for example, the connection relationship shown in the figure or text, and things other than the connection relation shown in the figure or text are also disclosed in the figure or text.
  • X and Y are objects (for example, devices, elements, circuits, wirings, electrodes, terminals, conductive films, layers, etc.).
  • an element for example, a switch, a transistor, a capacitive element, an inductor, a resistance element, a diode, a display, etc.
  • the switch has a function of controlling on / off. That is, the switch is in a conductive state (on state) or a non-conductive state (off state), and has a function of controlling whether or not to pass a current.
  • a circuit for example, a logic circuit (an inverter, a NAND circuit, a NOR circuit, etc.) that enables a functional connection between X and Y, signal conversion, etc.
  • Circuit (DA conversion circuit, AD conversion circuit, gamma correction circuit, etc.), potential level conversion circuit (power supply circuit (boost circuit, step-down circuit, etc.), level shifter circuit that changes signal potential level, etc.), voltage source, current source, switching Circuit, amplifier circuit (circuit that can increase signal amplitude or current amount, operational amplifier, differential amplifier circuit, source follower circuit, buffer circuit, etc.), signal generation circuit, memory circuit, control circuit, etc.)
  • One or more can be connected between them.
  • a circuit for example, a logic circuit (an inverter, a NAND circuit, a NOR circuit, etc.) that enables a functional connection between X and Y, signal conversion, etc.
  • Circuit (DA conversion circuit, AD conversion circuit, gamma correction circuit, etc.), potential level conversion circuit (power
  • X and Y, the source (or the first terminal) and the drain (or the second terminal) of the transistor are electrically connected to each other, and X and the source (or the first terminal of the transistor). 1 ”, the drain of the transistor (or the second terminal, and the like) and the Y are connected in this order.” Or “the source (or the first terminal, etc.) of the transistor is electrically connected to X, the drain (or the second terminal, etc.) of the transistor is electrically connected to Y, and X, the source of the transistor ( Or the first terminal or the like, the drain of the transistor (or the second terminal, or the like) and Y are electrically connected in this order.
  • X is electrically connected to Y through the source (or the first terminal) and the drain (or the second terminal) of the transistor, and X is the source of the transistor (or the first terminal). Terminal, etc.), the drain of the transistor (or the second terminal, etc.), and Y are provided in this connection order.
  • the source (or the first terminal, etc.) and the drain (or the second terminal, etc.) of the transistor are separated. Apart from that, the technical scope can be determined.
  • these expression methods are examples, and are not limited to these expression methods.
  • X and Y are assumed to be objects (for example, devices, elements, circuits, wirings, electrodes, terminals, conductive films, layers, etc.).
  • the term “electrically connected” in this specification includes in its category such a case where one conductive film has functions of a plurality of components.
  • a transistor has three terminals called a gate, a source, and a drain.
  • the gate is a control terminal that controls the conduction state of the transistor.
  • Two terminals functioning as a source or a drain are input / output terminals of the transistor.
  • One of the two input / output terminals serves as a source and the other serves as a drain depending on the conductivity type (n-channel type and p-channel type) of the transistor and the potential applied to the three terminals of the transistor.
  • the terms source and drain can be paraphrased.
  • a back gate may be provided.
  • one of the gate and the back gate of the transistor may be referred to as a first gate
  • the other of the transistor and the back gate may be referred to as a second gate.
  • the terms “gate” and “back gate” can be interchanged.
  • the respective gates may be referred to as a first gate, a second gate, a third gate, and the like.
  • a node can be restated as a terminal, a wiring, an electrode, a conductive layer, a conductor, an impurity region, or the like depending on a circuit configuration, a device structure, or the like. Further, a terminal, a wiring, or the like can be referred to as a node.
  • Voltage is a potential difference from a reference potential.
  • the reference potential is a ground potential (ground potential)
  • “voltage” can be rephrased as “potential”.
  • the ground potential does not necessarily mean 0V. Note that the potential is relative, and the potential applied to the wiring or the like may be changed depending on the reference potential.
  • “current” is defined as a charge transfer phenomenon (electric conduction) associated with the movement of a positive charged body, but the description “electric conduction of a positive charged body” In other words, “negatively charged electric conduction occurs in the opposite direction”. Therefore, in this specification and the like, “current” refers to a charge movement phenomenon (electric conduction) accompanying the movement of carriers unless otherwise specified. Examples of the carrier here include electrons, holes, anions, cations, complex ions, and the like, and the carriers differ depending on the system in which current flows (for example, semiconductor, metal, electrolyte, vacuum, etc.).
  • the “current direction” in the wiring or the like is a direction in which positive carriers move, and is described as a positive current amount.
  • the direction in which the negative carriers move is opposite to the direction of the current, and is expressed by a negative current amount. Therefore, in this specification and the like, when there is no notice about the positive / negative of the current (or the direction of the current), a description such as “current flows from element A to element B” is “current flows from element B to element A” or the like In other words. In addition, a description such as “current is input to element A” can be restated as “current is output from element A” or the like.
  • the ordinal numbers “first”, “second”, and “third” are given to avoid confusion between components. Therefore, the number of components is not limited. Further, the order of the components is not limited. For example, a component referred to as “first” in one embodiment of the present specification is assumed to be a component referred to as “second” in another embodiment or in the claims. There is also a possibility. In addition, for example, the constituent elements referred to as “first” in one embodiment of the present specification and the like may be omitted in other embodiments or in the claims.
  • the terms “upper” and “lower” do not limit that the positional relationship between the constituent elements is directly above or directly below and in direct contact with each other.
  • the expression “electrode B on the insulating layer A” does not require the electrode B to be formed in direct contact with the insulating layer A, and another configuration between the insulating layer A and the electrode B. Do not exclude things that contain elements.
  • conductive layer may be changed to the term “conductive film”.
  • insulating film may be changed to the term “insulating layer”.
  • the term “conductive layer” or “conductive film” may be changed to the term “conductor” in some cases.
  • the terms “insulating layer” and “insulating film” may be changed to the term “insulator”.
  • Electrode and “wiring” do not functionally limit these components.
  • an “electrode” may be used as part of a “wiring” and vice versa.
  • the terms “electrode” and “wiring” include a case where a plurality of “electrodes” and “wirings” are integrally formed.
  • wiring in this specification and the like, terms such as “wiring”, “signal line”, and “power supply line” can be interchanged with each other depending on circumstances or circumstances.
  • the term “wiring” may be changed to a term such as “power supply line”.
  • the reverse is also true, and there are cases where terms such as “signal line” and “power supply line” can be changed to the term “wiring”.
  • a term such as “power line” may be changed to a term such as “signal line”.
  • a term such as “signal line” may be changed to a term such as “power line”.
  • the term “potential” applied to the wiring may be changed to a term “signal” or the like depending on circumstances or circumstances. The reverse is also true, and a term such as “signal” may be changed to a term “potential”.
  • a semiconductor impurity means, for example, a component other than the main component constituting a semiconductor layer.
  • an element having a concentration of less than 0.1 atomic% is an impurity.
  • impurities for example, DOS (Density of States) may be formed in the semiconductor, carrier mobility may be reduced, and crystallinity may be reduced.
  • examples of impurities that change the characteristics of the semiconductor include Group 1 elements, Group 2 elements, Group 13 elements, Group 14 elements, Group 15 elements, and components other than main components Examples include transition metals, and in particular, hydrogen (also included in water), lithium, sodium, silicon, boron, phosphorus, carbon, nitrogen, and the like.
  • oxygen vacancies may be formed by mixing impurities such as hydrogen, for example.
  • impurities such as hydrogen, for example.
  • examples of impurities that change the characteristics of the semiconductor include group 1 elements, group 2 elements, group 13 elements, and group 15 elements excluding oxygen and hydrogen.
  • a switch refers to a switch that is in a conductive state (on state) or a non-conductive state (off state) and has a function of controlling whether or not to pass a current.
  • the switch refers to a switch having a function of selecting and switching a current flow path.
  • an electrical switch, a mechanical switch, or the like can be used. That is, the switch is not limited to a specific one as long as it can control the current.
  • Examples of electrical switches include transistors (eg, bipolar transistors, MOS transistors, etc.), diodes (eg, PN diodes, PIN diodes, Schottky diodes, MIM (Metal Insulator Metal) diodes, MIS (Metal Insulator Semiconductor) diodes. , Diode-connected transistors, etc.), or a logic circuit combining these.
  • transistors eg, bipolar transistors, MOS transistors, etc.
  • diodes eg, PN diodes, PIN diodes, Schottky diodes, MIM (Metal Insulator Metal) diodes, MIS (Metal Insulator Semiconductor) diodes. , Diode-connected transistors, etc.
  • the “conducting state” of the transistor means a state in which the source electrode and the drain electrode of the transistor can be regarded as being electrically short-circuited.
  • non-conducting state of a transistor refers to a state where the source electrode and the drain electrode of the transistor can be regarded as being electrically disconnected. Note that when a transistor is operated as a simple switch, the polarity (conductivity type) of the transistor is not particularly limited.
  • a mechanical switch is a switch using MEMS (micro electro mechanical system) technology such as a digital micromirror device (DMD).
  • MEMS micro electro mechanical system
  • DMD digital micromirror device
  • the switch has an electrode that can be moved mechanically, and operates by controlling conduction and non-conduction by moving the electrode.
  • a semiconductor device or the like in which a hierarchical artificial neural network is constructed can be provided.
  • a semiconductor device or the like with low power consumption can be provided.
  • a semiconductor device or the like that is hardly affected by environmental temperature can be provided.
  • a semiconductor device or the like having a function of correcting variation in characteristics of circuit elements can be provided.
  • a novel semiconductor device or the like can be provided.
  • the effects of one embodiment of the present invention are not limited to the effects listed above.
  • the effects listed above do not preclude the existence of other effects.
  • the other effects are effects not mentioned in this item described in the following description. Effects not mentioned in this item can be derived from the description of the specification or drawings by those skilled in the art, and can be appropriately extracted from these descriptions.
  • one embodiment of the present invention has at least one of the effects listed above and other effects. Accordingly, one embodiment of the present invention may not have the above-described effects depending on circumstances.
  • FIG. 2A is a block diagram illustrating a configuration example of a semiconductor device
  • FIG. 2B is a block diagram illustrating a configuration example of a circuit included in the semiconductor device
  • FIG. 4A is a block diagram illustrating a configuration example of a circuit included in a semiconductor device
  • FIG. 4B is a circuit diagram illustrating a configuration example of a circuit included in the semiconductor device.
  • FIGS. 4A to 4C are circuit diagrams illustrating configuration examples of circuits included in a semiconductor device.
  • FIGS. FIGS. 5A and 5B are diagrams illustrating a hierarchical neural network.
  • FIGS. FIGS. 4A and 4B are block diagrams illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • 4A is a timing chart illustrating an operation example of a circuit included in a semiconductor device.
  • FIGS. 4A and 4B are circuit diagrams illustrating configuration examples of circuits included in a semiconductor device.
  • FIGS. FIG. 10 is a block diagram illustrating a configuration example of a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a block diagram illustrating a configuration example of a semiconductor device. (A1) (A2) (B) (C) (D) Circuit diagram showing a structural example of a circuit included in a semiconductor device.
  • FIGS. 5A to 5C are circuit diagrams illustrating configuration examples of circuits included in a semiconductor device.
  • FIGS. FIGS. 4A and 4B are circuit diagrams illustrating configuration examples of circuits included in a semiconductor device.
  • FIGS. FIGS. 4A and 4B are block diagrams illustrating a configuration example of a circuit included in a semiconductor device.
  • FIGS. FIGS. 4A and 4B are circuit diagrams illustrating configuration examples of circuits included in a semiconductor device.
  • FIGS. 6 is a timing chart illustrating an operation example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device. 6 is a timing chart illustrating an operation example of a circuit included in a semiconductor device.
  • FIGS. 6 is a timing chart illustrating an operation example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device. 6 is a timing chart illustrating an operation example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIG. 10 is a circuit diagram illustrating a configuration example of a circuit included in a semiconductor device.
  • FIGS. 4A and 4B are circuit diagrams illustrating configuration examples of circuits included in a semiconductor device.
  • FIGS. FIGS. 4A and 4B are block diagrams illustrating a configuration example of a circuit included in a semiconductor device.
  • FIGS. FIG. 10 is a block diagram illustrating a configuration example of a semiconductor device.
  • FIG. 10 is a cross-sectional view illustrating a structure example of a semiconductor device.
  • FIG. 10 is a cross-sectional view illustrating a structure example of a semiconductor device.
  • 10A to 10C are cross-sectional views illustrating structural examples of transistors.
  • 4A is a top view illustrating a structure example of a transistor
  • FIG. 3B is a cross-sectional view illustrating a structure example of a transistor
  • 4A is a top view illustrating a structure example of a transistor
  • FIG. 3B is a cross-sectional view illustrating a structure example of a transistor.
  • 4A is a top view illustrating a structure example of a transistor
  • FIG. 3B is a cross-sectional view illustrating a structure example of a transistor.
  • FIG. 4A is a top view illustrating a structure example of a transistor
  • FIG. 3B is a cross-sectional view illustrating a structure example of a transistor
  • 4A is a top view illustrating a structure example of a transistor
  • FIG. 3B is a cross-sectional view illustrating a structure example of a transistor
  • FIG. 5A is a top view illustrating a structure example of a transistor
  • FIG. 5B is a perspective view illustrating a structure example of a transistor
  • 4A and 4B are cross-sectional views illustrating structural examples of transistors.
  • FIG. 4A is a top view illustrating a structure example of a capacitor element
  • FIG. 4B is a cross-sectional perspective view illustrating a structure example of a capacitor element.
  • FIG. 2A is a top view illustrating a structure example of a capacitor element
  • FIG. 1B is a cross-sectional view illustrating a structure example of the capacitor element
  • FIG. (A) The perspective view which shows an example of a semiconductor wafer
  • (B) (C) (D) The perspective view which shows an example of an electronic component.
  • (A) (B) (C) The perspective view which shows an example of an electronic device.
  • the synaptic connection strength can be changed by giving existing information to the neural network.
  • the process of giving existing information to the neural network and determining the coupling strength is sometimes called “learning”.
  • new information can be output based on the connection strength by giving some information to the neural network that has been “learned” (the connection strength is determined).
  • the connection strength is determined.
  • a process of outputting new information based on given information and connection strength may be referred to as “inference” or “cognition”.
  • Examples of neural network models include a hop field type and a hierarchical type.
  • a neural network having a multilayer structure may be referred to as a “deep neural network” (DNN), and machine learning by the deep neural network may be referred to as “deep learning”.
  • DNN deep neural network
  • a metal oxide is a metal oxide in a broad sense. Metal oxides are classified into oxide insulators, oxide conductors (including transparent oxide conductors), oxide semiconductors (also referred to as oxide semiconductors or simply OS), and the like. For example, when a metal oxide is used for an active layer of a transistor, the metal oxide may be referred to as an oxide semiconductor. In other words, in the case where a metal oxide can form a channel formation region of a transistor having at least one of an amplifying function, a rectifying function, and a switching function, the metal oxide is abbreviated as a metal oxide semiconductor (metal oxide semiconductor). It can be called OS. In addition, in the case of describing an OS FET or an OS transistor, it can be restated as a transistor including a metal oxide or an oxide semiconductor.
  • metal oxides having nitrogen may be collectively referred to as metal oxides.
  • a metal oxide containing nitrogen may be referred to as a metal oxynitride.
  • the content described in one embodiment (may be a part of content) is different from the other content described in the embodiment (may be a part of content) and one or more other implementations.
  • Application, combination, replacement, or the like can be performed on at least one of the contents described in the form (may be part of the contents).
  • a drawing (or a part thereof) described in one embodiment may be different from another part of the drawing, another drawing (may be a part) described in the embodiment, or one or more different drawings.
  • more drawings can be formed.
  • the code is for identification such as “_1”, “[n]”, “[m, n]”, etc. May be added and described.
  • the hierarchical neural network has one input layer, one or a plurality of intermediate layers (hidden layers), and one output layer, and is configured by a total of three or more layers.
  • An example of the hierarchical neural network 100 shown in FIG. 4A is shown.
  • the neural network 100 includes a first layer to an R layer (R here can be an integer of 4 or more). have.
  • R can be an integer of 4 or more.
  • the first layer corresponds to an input layer
  • the Rth layer corresponds to an output layer
  • the other layers correspond to intermediate layers.
  • FIG. 4A illustrates the (k ⁇ 1) th layer and the kth layer (here, k is an integer of 3 or more and R ⁇ 1 or less) as the intermediate layer, and the others.
  • the intermediate layer is not shown.
  • Each layer of the neural network 100 has one or a plurality of neurons.
  • the first layer has neurons N 1 (1) to N p (1) (where p is an integer equal to or greater than 1), and the (k ⁇ 1) th layer is The neuron N 1 (k ⁇ 1) to the neuron N m (k ⁇ 1) (where m is an integer equal to or greater than 1), and the k-th layer is the neuron N 1 (k) to the neuron N n ( k) (where n is an integer equal to or greater than 1), and the R-th layer is a neuron N 1 (R) to a neuron N q (R) (where q is an integer greater than or equal to 1). ).
  • FIG. 4A shows a neuron N 1 (1) , a neuron N p (1) , a neuron N 1 (k-1) , a neuron N m (k-1) , a neuron N 1 (k) , a neuron
  • the neuron N i (k-1) in the ( k ⁇ 1) -th layer where i is 1 or more and m or less
  • a neuron N j (k ) in the k-th layer is also illustrated, and the other neurons are not illustrated.
  • FIG. 4 (B) the neuron N j of the k-th layer (k), shows the signal which is input to the neuron N j (k), a signal output from the neuron N j (k), the.
  • z 1 (k ⁇ 1) to z m (k ⁇ ), which are output signals of the neurons N 1 (k ⁇ 1) to N m (k ⁇ 1) in the (k ⁇ 1) -th layer, respectively. 1) is output towards the neuron N j (k) .
  • the neuron N j (k) is, z 1 (k-1) to z m (k-1) to generate a z j (k) in response to, the z j (k) is an output signal (k + 1 ) Output to each neuron in the layer (not shown).
  • a signal input from a neuron in the previous layer to a neuron in the next layer has a degree of signal transmission determined by the synaptic connection strength (hereinafter referred to as a weighting factor) connecting the neurons.
  • the signal output from the neuron in the previous layer is multiplied by the corresponding weight coefficient and input to the neuron in the next layer.
  • i be an integer greater than or equal to 1 and less than or equal to m
  • w i (k ) be the synaptic weight coefficient between the neuron N i (k ⁇ 1) in the (k ⁇ 1) -th layer and the neuron N j (k) in the k-th layer.
  • j (k) is assumed, the signal input to the neuron N j (k) in the k-th layer can be expressed by Expression (1.1).
  • the neuron N j (k) generates an output signal z j (k) according to u j (k) .
  • the output signal z j (k) from the neuron N j (k) is defined by the following equation.
  • the function f (u j (k) ) is an activation function in a hierarchical neural network, and a step function, a linear ramp function, a sigmoid function, or the like can be used. Note that the activation function may be the same in all neurons or may be different. In addition, the activation function of the neuron may be the same or different for each layer.
  • the signals output by the neurons in each layer may be analog values or binary values.
  • a linear ramp function or a sigmoid function may be used as the activation function.
  • a step function with an output of ⁇ 1 or 1 may be used.
  • each layer from the first layer (input layer) to the last layer (output layer) is sequentially input from the previous layer. Based on the signal, an output signal is generated using equations (1.1) to (1.3), and the output signal is output to the next layer.
  • the signal output from the last layer (output layer) corresponds to the result calculated by the neural network 100.
  • ⁇ Calculation circuit> in the neural network 100 in which the neuron activation function is a step function having an output of ⁇ 1 or 1, an arithmetic circuit capable of performing the calculations of Expressions (1.2) and (1.3) Will be described.
  • An arithmetic circuit 110 illustrated in FIG. 1A is a semiconductor device including circuits MPC [1] to MPC [m], a circuit ACTF, and a conversion circuit TRF.
  • Arithmetic circuit 110 processes the signal input to the FIG. 4 (A) neurons N j of the k-th layer in (B) (k), the signal output from the neuron N j (k) z j ( k) Is a circuit that generates Note that in this specification and the like, the circuit MPC [1] to the circuit MPC [m] are described as the circuit MPC when they are not distinguished from each other.
  • FIG. 1B is a diagram illustrating terminals included in the circuit MPC.
  • the circuit MPC includes a terminal inp, a terminal inn, a terminal outp, a terminal outn, a terminal wt, and a terminal xt.
  • the circuit MPC has a function of outputting a signal input to the terminal inp to one of the terminal outp or the terminal outn and outputting a signal input to the terminal inn to the other of the terminal outp or the terminal outn.
  • the output destinations of the signals input to the terminal inp and the terminal inn can be determined by the signal input to the terminal xt.
  • the circuit MPC has a function of varying a time taken from when a signal is input to the terminal inp until it is output from one of the terminal outp or the terminal outn.
  • the time can be determined by a signal input to the terminal wt.
  • the time taken from when a signal is input to the input terminal of the circuit until the signal is output from the output terminal of the circuit is referred to as input / output time.
  • FIG. 2A A structural example of the circuit MPC is shown in FIG.
  • a circuit MPC illustrated in FIG. 2A includes a circuit BF1, a circuit BF2, and a switching circuit SC.
  • the input terminal of the circuit BF1 is electrically connected to the terminal inp, and the output terminal of the circuit BF1 is electrically connected to one of the two input terminals of the switching circuit SC.
  • the input terminal of the circuit BF2 is electrically connected to the terminal inn, and the output terminal of the circuit BF2 is electrically connected to the other of the two input terminals of the switching circuit SC.
  • One of the two output terminals of the switching circuit SC is electrically connected to the terminal outp, and the other of the two output terminals of the switching circuit SC is electrically connected to the terminal outn.
  • the circuit BF1 functions as a circuit that corrects a signal input to the input terminal of the circuit BF1 and outputs the corrected signal to the output terminal of the circuit BF1.
  • a circuit buffer circuit in which two inverter circuits are connected in series can be applied. Note that the number of inverter circuits is not limited to two. However, since it is easier to configure the circuit when outputting with the same logical value as the input, a plurality of outputs are desirable.
  • a NAND circuit, a NOR circuit, or the like can be used.
  • FIG. 2A illustrates a structure in which the circuit BF1 includes an inverter circuit DINV1 and an inverter circuit INV1.
  • Each of the inverter circuit DINV1 and the inverter circuit INV1 has a function of outputting an inverted signal of the input signal.
  • the inverter circuit DINV1 is electrically connected to the terminal wt, and the drive speed of the inverter circuit DINV1 can be determined according to a signal input to the terminal wt. That is, the input / output time of the inverter circuit DINV1 can be varied.
  • FIG. 2 (B1) shows a specific configuration example of the circuit BF1.
  • the inverter circuit DINV1 includes transistors Tr01 to Tr03 and a capacitor C01
  • the inverter circuit INV1 includes a transistor Tr04 and a transistor Tr05.
  • the transistor Tr01 and the transistor Tr04 are p-channel transistors
  • the transistor Tr02, the transistor Tr03, and the transistor Tr05 are n-channel transistors.
  • the transistor Tr02 is a transistor having a back gate.
  • the transistor Tr03 may be a transistor having a structure having a back gate.
  • the transistor Tr03 is preferably a transistor with low off-state current.
  • the transistor Tr03 is preferably an OS transistor.
  • OS transistors may be employed as n-channel transistors.
  • transistors having various structures can be used as a transistor.
  • a transistor including single crystal silicon, or a non-single crystal semiconductor film typified by amorphous silicon, polycrystalline silicon, microcrystalline (also referred to as microcrystal, nanocrystal, or semi-amorphous) silicon is used.
  • a transistor including the above can be used.
  • a thin film transistor (TFT) obtained by thinning those semiconductors can be used.
  • TFT thin film transistor
  • the manufacturing apparatus can be enlarged, it can be manufactured on a large substrate. Therefore, since a large number of display devices can be manufactured at the same time, it can be manufactured at low cost. Alternatively, since the manufacturing temperature is low, a substrate with low heat resistance can be used. Therefore, a transistor can be manufactured over a light-transmitting substrate. Alternatively, light transmission through the display element can be controlled using a transistor over a light-transmitting substrate. Alternatively, since the thickness of the transistor is small, part of the film forming the transistor can transmit light. Therefore, the aperture ratio can be improved.
  • a compound semiconductor eg, SiGe, GaAs, or the like
  • an oxide semiconductor eg, Zn—O, In—Ga—Zn—O, In—Zn—O, or In—Sn—O ( ITO), Sn-O, Ti-O, Al-Zn-Sn-O, In-Sn-Zn-O, and the like
  • a thin film transistor obtained by thinning these compound semiconductors or these oxide semiconductors can be used.
  • the manufacturing temperature can be lowered, so that the transistor can be manufactured at room temperature, for example.
  • the transistor can be formed directly on a substrate having low heat resistance, such as a plastic substrate or a film substrate.
  • these compound semiconductors or oxide semiconductors can be used not only for a channel portion of a transistor but also for other purposes.
  • these compound semiconductors or oxide semiconductors can be used as a wiring, a resistance element, a pixel electrode, a light-transmitting electrode, or the like. Since these can be formed or formed simultaneously with the transistor, cost can be reduced.
  • a transistor formed using an inkjet method or a printing method can be used. By these, it can manufacture at room temperature, manufacture at a low vacuum degree, or can manufacture on a large sized board
  • a transistor an organic semiconductor, a transistor including a carbon nanotube, or the like can be used.
  • a transistor can be formed over a substrate that can be bent.
  • An apparatus using a transistor having an organic semiconductor or a carbon nanotube can be made strong against impact.
  • transistors having various structures can be used as the transistor.
  • a MOS transistor, a junction transistor, a bipolar transistor, or the like can be used as the transistor.
  • MOS transistor the size of the transistor can be reduced. Therefore, a large number of transistors can be mounted.
  • bipolar transistor a large current can flow. Therefore, the circuit can be operated at high speed.
  • a MOS transistor and a bipolar transistor may be mixed on one substrate. Thereby, low power consumption, miniaturization, high-speed operation, etc. can be realized.
  • a transistor having a structure in which gate electrodes are arranged above and below a channel can be used as an example of a transistor.
  • a structure in which gate electrodes are arranged above and below a channel With a structure in which gate electrodes are arranged above and below a channel, a circuit configuration in which a plurality of transistors are connected in parallel is obtained. Therefore, since the channel formation region is increased, the current value can be increased.
  • a structure in which gate electrodes are provided above and below a channel facilitates the formation of a depletion layer, so that the S value can be improved.
  • a structure in which a gate electrode is disposed over a channel formation region a structure in which a gate electrode is disposed under a channel formation region, a normal stagger structure, an inverted stagger structure, and a channel formation region Transistors such as a structure divided into a plurality of regions, a structure in which channel formation regions are connected in parallel, or a structure in which channel formation regions are connected in series can be used.
  • a planar type a FIN type (fin type), a TRI-GATE type (trigate type), a top gate type, a bottom gate type, a double gate type (with gates arranged above and below the channel), and the like
  • a planar type a FIN type (fin type), a TRI-GATE type (trigate type), a top gate type, a bottom gate type, a double gate type (with gates arranged above and below the channel), and the like
  • a transistor having a structure in which a source electrode or a drain electrode overlaps with a channel formation region (or part of it) can be used.
  • the structure where the source electrode and the drain electrode overlap with the channel formation region (or part thereof) unstable operation due to accumulation of electric charge in part of the channel formation region can be prevented.
  • a structure provided with an LDD region can be used as an example of a transistor.
  • the LDD region By providing the LDD region, off-state current can be reduced or the breakdown voltage of the transistor can be improved (reliability improvement).
  • the LDD region when operating in the saturation region, even if the voltage between the drain and the source changes, the drain current does not change so much and voltage / current characteristics with a flat slope can be obtained. it can.
  • a transistor can be formed using various substrates.
  • substrate is not limited to a specific thing.
  • the substrate include a semiconductor substrate (for example, a single crystal substrate or a silicon substrate), an SOI substrate, a glass substrate, a quartz substrate, a plastic substrate, a sapphire glass substrate, a metal substrate, a stainless steel substrate, and a stainless steel foil.
  • the glass substrate include barium borosilicate glass, aluminoborosilicate glass, and soda lime glass.
  • Examples of the flexible substrate, the laminated film, and the base film include the following.
  • plastics represented by polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), and polytetrafluoroethylene (PTFE).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PES polyethersulfone
  • PTFE polytetrafluoroethylene
  • Another example is a synthetic resin such as acrylic.
  • examples include polypropylene, polyester, polyvinyl fluoride, and polyvinyl chloride.
  • a transistor with small variation in characteristics, size, or shape, high current capability, and small size can be manufactured.
  • the power consumption of the circuit can be reduced or the circuit can be highly integrated.
  • a flexible substrate may be used as the substrate, and the transistor may be formed directly on the flexible substrate.
  • a separation layer may be provided between the substrate and the transistor. The separation layer can be used to separate a semiconductor device from another substrate and transfer it to another substrate after a semiconductor device is partially or entirely completed thereon. At that time, the transistor can be transferred to a substrate having poor heat resistance or a flexible substrate.
  • a structure of a laminated structure of an inorganic film of a tungsten film and a silicon oxide film or a structure in which an organic resin film such as polyimide is formed over a substrate can be used for the above-described release layer.
  • a transistor may be formed using a certain substrate, and then the transistor may be transferred to another substrate, and the transistor may be disposed on another substrate.
  • a substrate to which a transistor is transferred include a paper substrate, a cellophane substrate, an aramid film substrate, a polyimide film substrate, a stone substrate, a wood substrate, a cloth substrate (natural fiber) in addition to the above-described substrate capable of forming a transistor. (Silk, cotton, hemp), synthetic fibers (including nylon, polyurethane, polyester) or recycled fibers (including acetate, cupra, rayon, recycled polyester), leather substrates, rubber substrates, and the like. By using these substrates, it is possible to form a transistor with good characteristics, a transistor with low power consumption, manufacture a device that is not easily broken, impart heat resistance, reduce weight, or reduce thickness.
  • all the circuits necessary for realizing a predetermined function can be formed over the same substrate (for example, a glass substrate, a plastic substrate, a single crystal substrate, or an SOI substrate).
  • the cost can be reduced by reducing the number of components, or the reliability can be improved by reducing the number of connection points with circuit components.
  • a part of the circuit necessary for realizing the predetermined function is formed on a certain substrate, and another part of the circuit necessary for realizing the predetermined function is formed on another substrate. It is possible. For example, a part of a circuit necessary for realizing a predetermined function is formed on a glass substrate, and another part of a circuit required for realizing a predetermined function is a single crystal substrate (or an SOI substrate). Can be formed. Then, a single crystal substrate (also referred to as an IC chip) on which another part of a circuit necessary for realizing a predetermined function is formed is connected to the glass substrate by COG (Chip On Glass).
  • COG Chip On Glass
  • the IC chip can be connected to the glass substrate using TAB (Tape Automated Bonding), COF (Chip On Film), SMT (Surface Mount Technology), or a printed circuit board.
  • TAB Transmission Automated Bonding
  • COF Chip On Film
  • SMT Surface Mount Technology
  • part of the circuit is formed over the same substrate as the pixel portion, so that the cost can be reduced by reducing the number of components or the reliability can be improved by reducing the number of connection points with circuit components.
  • power consumption is often increased in a circuit having a high driving voltage or a circuit having a high driving frequency. Therefore, such a circuit is formed on a substrate (for example, a single crystal substrate) different from the pixel portion to constitute an IC chip. By using this IC chip, an increase in power consumption can be prevented.
  • the gate of the transistor Tr01 and the gate of the transistor Tr02 are electrically connected to the terminal inp, the first terminal of the transistor Tr01 is electrically connected to the wiring VDDL, and the second terminal of the transistor Tr01 is connected to the transistor Tr02. Is electrically connected to the first terminal.
  • the second terminal of the transistor Tr02 is electrically connected to the wiring VSSL, and the back gate of the transistor Tr02 is electrically connected to the first terminal of the transistor Tr03 and the first terminal of the capacitor C01.
  • a second terminal of the transistor Tr03 is electrically connected to the terminal wt, and a gate of the transistor Tr03 is electrically connected to the wiring SL01.
  • a second terminal of the capacitor C01 is electrically connected to the wiring VL.
  • the second terminal of the transistor Tr01 and the first terminal of the transistor Tr02 are electrically connected to the input terminal of the inverter circuit INV1.
  • the gate of the transistor Tr04 and the gate of the transistor Tr05 are electrically connected to the input terminal of the inverter circuit INV1, and the first terminal of the transistor Tr04 is electrically connected to the wiring VDDL.
  • the two terminals are electrically connected to the first terminal of the transistor Tr05.
  • a second terminal of the transistor Tr05 is electrically connected to the wiring VSSL.
  • the second terminal of the transistor Tr04 and the first terminal of the transistor Tr05 are electrically connected to the output terminal of the inverter circuit INV1.
  • the wiring VDDL functions as a voltage line that supplies a voltage VDD that is a high level potential
  • the wiring VSSL functions as a voltage line that supplies a voltage VSS that is a low level potential.
  • a negative potential, a positive potential, or a potential of 0 V (GND) may be supplied to the wiring VSSL.
  • the wiring VL functions as a voltage line for supplying a constant voltage, and the constant voltage can be VDD, VSS, a ground potential, or the like.
  • the transistor Tr03 and the capacitive element C01 are included in the holding unit HCA.
  • the holding unit HCA has a function of holding a potential corresponding to a signal input from the terminal wt.
  • the potential can be one of a low-level potential and a high-level potential indicating two values, or a potential indicating an analog value.
  • the transistor Tr03 included in the holding unit HCA functions as a switching element, and the transistor Tr03 can be turned on or off by applying a potential from the wiring SL01 to the gate of the transistor Tr03.
  • the terminal wt and the first terminal of the capacitor C01 can be brought into conduction.
  • the circuit MPC can write a potential corresponding to the signal to the first terminal of the capacitor C01. Then, after the potential is written to the first terminal of the capacitor C01, the potential can be held in the holding portion HCA by applying a low-level potential to the wiring SL01 and turning off the transistor Tr03.
  • the transistor Tr03 is preferably an OS transistor when it is desired to hold the potential written to the first terminal of the capacitor C01 for a long time.
  • the channel formation region of the transistor Tr03 is more preferably an oxide containing at least one of indium, element M (the element M includes aluminum, gallium, yttrium, tin, and the like) and zinc.
  • the transistor Tr03 particularly preferably has the structure of the transistor described in Embodiment 5.
  • An OS transistor has a characteristic that an off-state current is extremely small because a metal oxide functioning as a channel formation region has a large band gap. Therefore, by using an OS transistor as the transistor Tr03, the leakage current from the first terminal to the terminal wt of the capacitor C01 when the transistor Tr03 is in an off state can be extremely reduced. That is, since the refresh operation of the potential of the first terminal of the capacitor C01 can be reduced, power consumption required to hold the potential of the first terminal of the capacitor C01 can be reduced.
  • the threshold voltage of the transistor Tr02 can be changed in accordance with the potential by applying a potential to the back gate.
  • the threshold voltage of the transistor Tr02 is determined according to the potential of the first terminal of the capacitor C01.
  • the threshold voltage of the transistor Tr02 fluctuates to the negative side, so that the amount of current flowing between the source and drain of the transistor Tr02 increases.
  • the input / output time required from when the signal is input to the input terminal of the inverter circuit DINV1 until the signal is output from the output terminal is shortened.
  • the threshold voltage of the transistor Tr02 varies to the plus side, so that the amount of current flowing between the source and drain of the transistor Tr02 is small. Become.
  • the input / output time required from when a signal is input to the input terminal of the inverter circuit DINV1 to when the signal is output from the output terminal is increased.
  • the back gate of the transistor Tr02 when the potential range applied to the gate of the transistor Tr02 is operated at ⁇ 0.8 V or more and 2.5 V or less, the back gate of the transistor Tr02 has, for example, a potential of 1.5 V or more as a high level potential. And a potential of less than 1.5 V may be applied as a low level potential.
  • the transistor Tr03 may also have a back gate.
  • 2B2 illustrates a circuit configuration in the case where the transistor Tr03 includes a back gate in the inverter circuit DINV1 illustrated in FIG. 2B1.
  • the gate of the transistor Tr03 can be used as an electrical connection destination of the back gate of the transistor Tr03.
  • the current that flows when the transistor Tr03 is on can be increased.
  • a wiring for electrically connecting to an external circuit may be provided in the back gate of the transistor Tr03, and the threshold voltage may be increased by applying a potential to the back gate of the transistor Tr03 by the external circuit. . With such a structure, the off-state current of the transistor Tr03 can be reduced by an external circuit.
  • the circuit BF2 has an inverter circuit DINV2 and an inverter circuit INV2. Similarly to the circuit BF1, the circuit BF2 functions as an amplifier circuit that amplifies the signal input to the input terminal of the circuit BF2 and outputs the amplified signal to the output terminal of the circuit BF2. Therefore, the circuit BF2 can have a structure similar to that of the circuit BF1 illustrated in FIG. In this case, it is preferable to hold an intermediate potential between the high level potential and the low level potential at the first terminal of the capacitor C01 of the inverter circuit DINV2.
  • the input / output time of the circuit BF1 is made shorter or longer than the input / output time of the circuit BF2. be able to.
  • the circuit BF2 may have a circuit configuration illustrated in FIG.
  • the inverter circuit DINV2 in FIG. 2C1 includes a transistor Tr06 and a transistor Tr07, and the inverter circuit INV2 includes a transistor Tr08 and a transistor Tr09.
  • the transistors Tr06 and Tr08 are p-channel transistors, and the transistors Tr07 and Tr09 are n-channel transistors.
  • the gate of the transistor Tr06 and the gate of the transistor Tr07 are electrically connected to the terminal inn, the first terminal of the transistor Tr06 is electrically connected to the wiring VDDL, and the second terminal of the transistor Tr06 is connected to the transistor Tr07. Is electrically connected to the first terminal.
  • a second terminal of the transistor Tr07 is electrically connected to the wiring VSSL.
  • the second terminal of the transistor Tr06 and the first terminal of the transistor Tr07 are electrically connected to the input terminal of the inverter circuit INV2.
  • the gate of the transistor Tr08 and the gate of the transistor Tr09 are electrically connected to the input terminal of the inverter circuit INV2, and the first terminal of the transistor Tr08 is electrically connected to the wiring VDDL.
  • the two terminals are electrically connected to the first terminal of the transistor Tr09.
  • a second terminal of the transistor Tr09 is electrically connected to the wiring VSSL.
  • the second terminal of the transistor Tr08 and the first terminal of the transistor Tr09 are electrically connected to the output terminal of the inverter circuit INV2.
  • the circuit configuration of the inverter circuit DINV2 can be the same as that of the inverter circuit INV2.
  • a back gate may be provided for the transistor Tr07, and the back gate may be connected to the wiring VSSL.
  • the inverter circuit INV1, the inverter circuit INV2, and the inverter circuit DINV2 described above may be replaced with, for example, the configuration of the inverter circuit INV1A shown in FIG.
  • the transistor Tr05 in the circuit configuration of the inverter circuit INV1, the inverter circuit INV2, and the inverter circuit DINV2, the transistor Tr05 (transistor Tr07, transistor Tr09) has a back gate, and the back gate is the transistor Tr05 (transistor Tr07, transistor Tr09).
  • the second terminal is electrically connected.
  • the switching circuit SC has a function of selecting an output destination of a signal input to the terminal inp or the terminal inn in the circuit MPC as either the terminal outp or the terminal outn.
  • the switching circuit SC is electrically connected to the terminal xt and corresponds to a signal (signals x 1 (k ⁇ 1) to x m (k ⁇ 1) in FIG. 1A) input to the terminal xt.
  • the output destination can be determined.
  • FIG. 3A shows a configuration example of the switching circuit SC.
  • the switching circuit SC includes switches S01 to S04 and an inverter circuit INV3.
  • the first terminal of the switch S01 is electrically connected to the output terminal of the circuit BF1 and the first terminal of the switch S03, and the second terminal of the switch S01 is electrically connected to the terminal outp.
  • the first terminal of the switch S02 is electrically connected to the output terminal of the circuit BF2 and the first terminal of the switch S04, and the second terminal of the switch S02 is electrically connected to the terminal outn.
  • the second terminal of the switch S03 is electrically connected to the terminal outn, and the second terminal of the switch S04 is electrically connected to the terminal outp.
  • the terminal xt is electrically connected to the control terminals of the switches S01 and S02 and the input terminal of the inverter circuit INV3.
  • the output terminal of the inverter circuit INV3 is connected to the control terminals of the switches S03 and S04. , Is electrically connected to.
  • each of the switches S01 to S04 is turned on when a high level potential is applied to the control terminal, and is turned off when a low level potential is applied to the control terminal.
  • the operation of the switching circuit SC will be described. For example, when a high level potential is applied to the terminal xt, the switch S01 and the switch S02 are turned on, and the switch S03 and the switch S04 are turned off. Therefore, the switching circuit SC is connected to the output terminal of the circuit BF1 and the terminal outp. Between the output terminal of the circuit BF2 and the terminal outn. Further, for example, when a low level potential is applied to the terminal xt, the switch S03 and the switch S04 are turned on and the switch S01 and the switch S02 are turned off, so that the switching circuit SC is connected to the output terminal of the circuit BF1. The terminal outn is in a conductive state, and the circuit BF2 operates so as to be in a conductive state between the output terminal and the terminal outp.
  • FIG. 3B shows a circuit configuration in which the switches S01 to S04 included in the switching circuit SC of FIG. 3A are replaced with analog switches A01 to A04.
  • the switching circuit SC in FIG. 3C includes transistors Tr11 to Tr14 and an inverter circuit INV3.
  • the transistors Tr11 to Tr14 are n-channel transistors. Note that the control terminals of the switches S01 to S04 correspond to the gates of the transistors Tr11 to Tr14.
  • the first terminal of the transistor Tr11 is electrically connected to the output terminal of the circuit BF1 and the first terminal of the transistor Tr13, and the second terminal of the transistor Tr11 is electrically connected to the terminal outp.
  • the first terminal of the transistor Tr12 is electrically connected to the output terminal of the circuit BF2 and the first terminal of the transistor Tr14, and the second terminal of the transistor Tr12 is electrically connected to the terminal outn.
  • the second terminal of the transistor Tr13 is electrically connected to the terminal outn, and the second terminal of the transistor Tr14 is electrically connected to the terminal outp.
  • the terminal xt is electrically connected to the gates of the transistors Tr11 to Tr14. Note that the gates of the transistors Tr13 and Tr14 are electrically connected to the terminal xt via the inverter circuit INV3.
  • the switching circuit SC in FIG. 3D includes transistors Tr11 to Tr14 as in FIG.
  • the transistors Tr11 and Tr12 are n-channel transistors, and the transistors Tr13 and Tr14 are p-channel transistors.
  • the control terminals of the switches S01 to S04 correspond to the gates of the transistors Tr11 to Tr14. Since the transistors Tr11 and Tr12 and the transistors Tr13 and Tr14 have different polarities, the switching circuit SC in FIG. 3D does not include the inverter circuit INV3.
  • the signals x 1 (k ⁇ 1) to x m (k ⁇ 1) input to the terminal xt are low.
  • the signal can be a level potential or a high level potential signal.
  • the switching circuit SC applied to the circuit MPC can be selected from any one shown in FIGS. 3A to 3D depending on the situation. Further, the switching circuit SC applied to the circuit MPC may have a circuit configuration different from that of the switching circuit SC illustrated in FIGS.
  • FIG. 1C illustrates a terminal included in the circuit ACTF.
  • the circuit ACTF includes a terminal inpa, a terminal inna, and a terminal outa.
  • the circuit ACTF generates signals in accordance with the order and / or time difference of the signals (signals Sp [m] and Sn [m] in FIG. 1A) input to each of the terminal inpa and the terminal inna. , And has a function of outputting the signal from the terminal outa. Note that this signal corresponds to z j (k) in FIGS.
  • the circuit ACTF when the signal input to the terminal inpa is slower than the signal input to the terminal inna, the circuit ACTF outputs a low level potential as a signal from the terminal outa, and the signal input to the terminal inpa is output to the terminal inna.
  • a high-level potential can be output as a signal from the terminal outa.
  • the transition of the potential input to the terminal inpa is slower than the transition of the potential input to the terminal inna, the transition of the potential input to the terminal inpa is output from the terminal outa as a low level potential.
  • the circuit ACTF can correspond to a circuit that performs a step function calculation.
  • the circuit ACTF may be a circuit that outputs an analog value such as a sigmoid function or a linear ramp function.
  • the circuit ACTF may have a function of outputting a digital value or an analog value in accordance with a timing shift between signals input to the terminal inpa and the terminal inna.
  • the circuit ACTF has a function of calculating a neuron activation function in the neural network 100.
  • circuit ACTF will be described as a circuit that performs a step function calculation.
  • the circuit ACTF can apply a flip-flop circuit as a circuit for performing a step function operation. In such a case, when the signal input to the terminal inna transitions, the circuit ACTF performs an operation of reading the signal input to the terminal inpa and outputting the signal to the terminal outa.
  • the conversion circuit TRF includes signals z 1 (k ⁇ 1) to z 1 (k ⁇ 1) to neuron N 1 (k ⁇ 1) to neurons N m (k ⁇ 1) in the (k ⁇ 1) layer. z m (k ⁇ 1) is appropriately converted, and the converted signals are transmitted to the circuits MPC [1] to MPC [m].
  • signals z 1 (k ⁇ 1) to z m (k ⁇ 1) are converted into signals x 1 (k ⁇ 1) to x m (k ⁇ 1) , and the signal x 1 (k -1) to x m (k-1) are transmitted to the circuits MPC [1] to MPC [m], respectively.
  • each of the signals z 1 (k ⁇ 1) to z m (k ⁇ 1) has a value of ⁇ 1 or 1 as described above, and the signals x 1 (k ⁇ 1) to x m (k ⁇ 1). ) Can be a low-level potential signal or a high-level potential signal as described above for the switching circuit SC, so that the conversion circuit TRF can be configured as a logic circuit.
  • the circuit MPC included in the arithmetic circuit 110 in FIG. 1 is not limited to the configuration of the circuit MPC described above, and the circuit configuration of the circuit MPC may be changed depending on the situation.
  • the circuit MPC can employ the structures in FIGS. 5A and 5B.
  • the circuit MPC illustrated in FIG. 5A includes an inverter in which the order of electrical connection between the inverter circuit DINV1 and the inverter circuit INV1 in the circuit BF1 in FIG. 2A is changed, and the inverter in the circuit BF2 in FIG.
  • circuit MPC illustrated in FIG. 5B includes a circuit in which the order of electrical connection between the inverter circuit INV1 and the switching circuit SC in the circuit BF1 in FIG. 2A is changed, and the inverter circuit in FIG. The order of electrical connection between INV2 and switching circuit SC is changed.
  • the transistors included in the above-described circuit MPC, circuit ACTF, conversion circuit TRF, and the like are preferably OS transistors.
  • an OS transistor is preferably used as the transistor Tr03.
  • the OS transistor particularly preferably has the structure of the transistor described in Embodiment 5. Note that one embodiment of the present invention is not limited to this.
  • a transistor included in the circuit MPC, the circuit ACTF, the conversion circuit TRF, or the like may be a transistor including silicon in a channel formation region (hereinafter referred to as a Si transistor) instead of an OS transistor.
  • silicon for example, hydrogenated amorphous silicon, microcrystalline silicon, polycrystalline silicon, or the like can be used.
  • transistors other than OS transistors and Si transistors transistors using Ge as an active layer, transistors using a compound semiconductor such as ZnSe, CdS, GaAs, InP, GaN, and SiGe as active layers, and carbon nanotubes as active layers
  • a transistor, a transistor using an organic semiconductor as an active layer, or the like can be used.
  • the arithmetic circuit 110 may have a configuration in which an OS transistor is applied as an n-channel transistor included in the circuit MPC, the circuit ACTF, the conversion circuit TRF, and the like, and a Si transistor is applied as a p-channel transistor.
  • FIG. 6A shows a configuration example of the circuit MPC [i] handled in this operation example.
  • the circuit BF1 illustrated in FIG. 2B1 is applied as the circuit BF1 and the circuit BF2
  • the switching circuit SC illustrated in FIG. 3A is applied as the switching circuit SC.
  • each of the circuit elements included in the inverter circuit DINV2 of the circuit BF2 illustrated in FIG. 6A has “m” appended to the end of the reference numeral in order to distinguish it from the inverter circuit DINV1 of the circuit BF1. Therefore, in the inverter circuit DINV2, the holding unit HCAm corresponds to the holding unit HCA, the transistor Tr01m corresponds to the transistor Tr01 of the inverter circuit DINV1, the transistor Tr02m corresponds to the transistor Tr02 of the inverter circuit DINV1, and the transistor Tr03m is the inverter circuit.
  • the capacitor C01m corresponds to the transistor Tr03 of DINV1
  • the capacitor C01m corresponds to the capacitor C01 of the inverter circuit DINV1
  • the wiring SL01m corresponds to the wiring SL01 of the inverter circuit DINV1.
  • the terminal wtm functions as an input terminal for writing a potential to the first terminal of the capacitor C01m.
  • the terminal wt in the holding unit HCA of the circuit BF1 is electrically connected to the wiring DL
  • the terminal wtm in the holding unit HCAm of the circuit BF2 is electrically connected to the wiring DLm.
  • the wiring SL01 in the circuit BF1 and the wiring SL01m in the circuit BF2 are electrically connected to the wiring SWL.
  • the transistor Tr01 to the transistor Tr05, the transistor Tr01m to the transistor Tr03m, the transistor Tr08, the transistor Tr09, and the transistor Tr11 to the transistor Tr14 are finally linear regions in the on state unless otherwise specified.
  • the gate voltage, the source voltage, and the drain voltage of each transistor described above include a case where the voltage is appropriately biased to a voltage in a range where the transistor operates in a linear region.
  • each of the low level potential and the high level potential corresponding to the signal input to and output from the circuit MPC may be a potential different from the low level potential and the high level potential applied to the wiring SL01.
  • a potential corresponding to the weighting factor w i (k ⁇ 1) j (k) is input to the wiring DL, and an intermediate potential is input to the wiring DLm.
  • a high-level potential is applied to the wiring SWL, so that the transistor Tr03 and the transistor Tr03m are turned on.
  • a potential corresponding to the weighting factor w i (k ⁇ 1) j (k) is written to the first terminal of the capacitor C01, and an intermediate potential is written to the first terminal of the capacitor C01m.
  • the threshold voltage of the transistor Tr02 varies according to the weighting coefficient w i (k ⁇ 1) j (k), and the threshold voltage of the transistor Tr02m varies according to the intermediate potential.
  • a low-level potential is applied to the wiring SWL to turn off the transistor Tr03 and the transistor Tr03m, whereby the potentials of the first terminal of the capacitor C01 and the first terminal of the capacitor C01m are held. be able to.
  • the signal Sp [i-1] is supplied to the terminal inp of the circuit MPC [i] (where i is an integer of 1 to m), and the signal Sn [i-1] is supplied to the terminal inn.
  • the arithmetic operation is started in the circuit MPC [i].
  • the signals Sp [0] and Sn [0] have almost no time difference (substantially simultaneously) and are input to the terminals inp and inn of the circuit MPC [1].
  • i 2 or more, the signals Sp [i ⁇ 1] and Sn [i ⁇ 1] are output from the circuit MPC [i ⁇ 1], and therefore there may be a time difference between them.
  • FIG. 7A is a timing chart showing variations in potential of the terminal inp, the terminal inn, the terminal outp, and the terminal outn in that case.
  • high-level potentials are applied as signals Sp [i ⁇ 1] and Sn [i ⁇ 1] to the terminals inp and inn of the circuit MPC [i], respectively. Then, it is assumed that the potentials of the terminal inp and the terminal inn of the circuit MPC [i] reach the high level potential at the time T1.
  • the high level potential is applied as the signal Sp [i-1] to the input terminal of the circuit BF1 of the circuit MPC [i]
  • the high level potential is output from the output terminal of the circuit BF1 of the circuit MPC [i].
  • a high level potential is applied as the signal Sn [i-1] to the input terminal of the circuit BF2 of the circuit MPC [i]
  • the high level potential is output from the output terminal of the circuit BF2 of the circuit MPC [i].
  • the circuit BF1 since the high-level potential is applied to the back gate of the transistor Tr02 in the circuit BF1, and the intermediate potential is applied to the back gate of the transistor Tr02m in the circuit BF2, the circuit BF1 operates faster than the circuit BF2. Therefore, when signals are input to the terminal inp and the terminal inn at the same time, the circuit BF1 outputs an output signal before the circuit BF2.
  • the output terminal of the circuit BF1 and the terminal outp are in a conductive state, and the output terminal of the circuit BF2 and the terminal outn are in a conductive state. It becomes a state. That is, the output signal from the circuit BF1 is output from the terminal outp, and the output signal from the circuit BF2 is output from the terminal outn.
  • FIG. 7B is a timing chart showing variations in potential of the terminal inp, the terminal inn, the terminal outp, and the terminal outn in that case.
  • high-level potentials are applied to the terminals inp and inn of the circuit MPC [i] as signals Sp [i ⁇ 1] and Sn [i ⁇ 1], respectively. Then, it is assumed that the potentials of the terminal inp and the terminal inn of the circuit MPC [i] reach the high level potential at the time T1.
  • the high level potential is applied as the signal Sp [i-1] to the input terminal of the circuit BF1 of the circuit MPC [i]
  • the high level potential is output from the output terminal of the circuit BF1 of the circuit MPC [i].
  • a high level potential is applied as the signal Sn [i-1] to the input terminal of the circuit BF2 of the circuit MPC [i]
  • the high level potential is output from the output terminal of the circuit BF2 of the circuit MPC [i].
  • the low-level potential is applied to the back gate of the transistor Tr02 in the circuit BF1
  • the intermediate potential is applied to the back gate of the transistor Tr02m in the circuit BF2
  • the circuit BF1 operates slower than the circuit BF2. Therefore, when signals are input to the terminal inp and the terminal inn at the same time, the circuit BF1 outputs an output signal after the circuit BF2.
  • the output terminal of the circuit BF1 and the terminal outp are in a conductive state, and the circuit BF2 Between the output terminal and the terminal outn. That is, the output signal from the circuit BF1 is output from the terminal outp, and the output signal from the circuit BF2 is output from the terminal outn.
  • FIG. 7C is a timing chart showing variations in potential of the terminal inp, the terminal inn, the terminal outp, and the terminal outn in that case.
  • high-level potentials are applied to the terminals inp and inn of the circuit MPC [i] as signals Sp [i ⁇ 1] and Sn [i ⁇ 1], respectively. Then, it is assumed that the potentials of the terminal inp and the terminal inn of the circuit MPC [i] reach the high level potential at the time T1.
  • the high level potential is applied as the signal Sp [i-1] to the input terminal of the circuit BF1 of the circuit MPC [i]
  • the high level potential is output from the output terminal of the circuit BF1 of the circuit MPC [i].
  • a high level potential is applied as the signal Sn [i-1] to the input terminal of the circuit BF2 of the circuit MPC [i]
  • the high level potential is output from the output terminal of the circuit BF2 of the circuit MPC [i].
  • the circuit BF1 since the high-level potential is applied to the back gate of the transistor Tr02 in the circuit BF1, and the intermediate potential is applied to the back gate of the transistor Tr02m in the circuit BF2, the circuit BF1 operates faster than the circuit BF2. Therefore, when signals are input to the terminal inp and the terminal inn at the same time, the circuit BF1 outputs an output signal before the circuit BF2.
  • the output terminal of the circuit BF1 and the terminal outn are in a conductive state, and the output terminal of the circuit BF2 and the terminal outp are conductive. It becomes a state. That is, the output signal from the circuit BF1 is output from the terminal outn, and the output signal from the circuit BF2 is output from the terminal outp.
  • FIG. 7D is a timing chart showing variations in potential of the terminal inp, the terminal inn, the terminal outp, and the terminal outn in that case.
  • high-level potentials are applied to the terminals inp and inn of the circuit MPC [i] as signals Sp [i ⁇ 1] and Sn [i ⁇ 1], respectively. Then, it is assumed that the potentials of the terminal inp and the terminal inn of the circuit MPC [i] reach the high level potential at the time T1.
  • the high level potential is applied as the signal Sp [i-1] to the input terminal of the circuit BF1 of the circuit MPC [i]
  • the high level potential is output from the output terminal of the circuit BF1 of the circuit MPC [i].
  • a high level potential is applied as the signal Sn [i-1] to the input terminal of the circuit BF2 of the circuit MPC [i]
  • the high level potential is output from the output terminal of the circuit BF2 of the circuit MPC [i].
  • the low-level potential is applied to the back gate of the transistor Tr02 in the circuit BF1
  • the intermediate potential is applied to the back gate of the transistor Tr02m in the circuit BF2
  • the circuit BF1 operates slower than the circuit BF2. Therefore, when signals are input to the terminal inp and the terminal inn at the same time, the circuit BF1 outputs an output signal after the circuit BF2.
  • the output terminal of the circuit BF1 and the terminal outn are in a conductive state, and the output terminal of the circuit BF2 and the terminal outp are conductive. It becomes a state. That is, the output signal from the circuit BF1 is output from the terminal outn, and the output signal from the circuit BF2 is output from the terminal outp.
  • the potential of the terminal outp becomes a high level potential at time T3, and then the terminal outn at time T4. Becomes a high level potential. That is, Sp [i] is output as an output signal from the terminal outp at time T3, and Sn [i] is output as an output signal from the terminal outn at time T4.
  • the input / output time from when the signal Sp [i ⁇ 1] is input to the terminal inp to when the signal Sn [i] is output from the terminal outn is denoted as TL.
  • the input / output time from when the signal Sn [i ⁇ 1] is input to inn to when the signal Sp [i] is output from the terminal outp is described as T M.
  • T [i] the time difference in which the signal Sp [i] is output from the terminal outp is defined as T [i] with reference to the time in which the signal Sn [i] is output from the terminal outn (FIG. 7 ( In A) to (D),
  • the weighting factor w i (k ⁇ 1) j (k) the weighting factor w i (k ⁇ 1) j T [i] becomes smaller as the potential corresponding to (k) is higher
  • T [i] takes a negative value when the time when the signal Sn [i] is output from the terminal outn is used as a reference.
  • T [i] takes a positive value when the time when the signal Sn [i] is output from the terminal outn is used as a reference.
  • the difference between the input and output times of the circuit BF1 with respect to the circuit BF2 is output as it is, and according to the signal x i (k ⁇ 1) .
  • the circuit MPC [i] is output with the difference in input / output time of the circuit BF1 with respect to the circuit BF2 multiplied by -1.
  • a time difference in which the signal Sp [i] is output from the terminal outp is defined based on the time in which the signal Sn [i] is output from the terminal outn.
  • the signal Sp [i] is output from the terminal outp with reference to the time during which the signal Sn [i] is output from the terminal outn in Condition 3 (timing chart in FIG. 7C).
  • the time difference is ⁇ T [i].
  • the switching circuit SC also has a delay from when a signal is input to when it is output, so that the signal Sp from the terminal outp is based on the time when the signal Sn [i] is output from the terminal outn.
  • the time difference T [i] from which [i] is output includes the delay time. In the present embodiment, the description will be made ignoring the delay.
  • the circuit MPC [i] receives the signals Sp [i ⁇ 1] and Sn [i ⁇ 1] to the circuit MPC [i], and thus the weight coefficient w i (k ⁇ 1) j (k ) And a potential corresponding to the signal x i (k ⁇ 1) , a time difference T [i] corresponding to the two signals Sp [i] and Sn [ i].
  • the time difference between the two signals Sp [i-1] and Sn [i-1] output from the circuit MPC [i-1] is T [i-1]
  • the two signals output from the circuit MPC [i] is T [i]
  • the relational expression between T [i] and T [i-1] can be expressed by the following expression.
  • g (w i (k ⁇ 1) j (k) ) is a function that outputs a time difference between signals output from the circuit BF1 and the circuit BF2 in the circuit MPC [i] using the weighting coefficient as a variable.
  • a term indicating the delay time may be added to the equation (1.4).
  • Expression (1.4) is obtained by calculating the circuit MPC [[1 ⁇ 1] for the time difference T [i ⁇ 1] between the two signals Sp [i ⁇ 1] and Sn [i ⁇ 1] output from the circuit MPC [i ⁇ 1].
  • i] is added with g (w i (k ⁇ 1) j (k) ), which is a time difference corresponding to the weighting coefficient w i (k ⁇ 1) j (k) , and the value is changed to the switching circuit SC.
  • Is obtained by multiplying the value of the signal x i (k ⁇ 1) .
  • T [1] is expressed by the following equation.
  • T [m] is a function g (w) depending on the weighting coefficient according to Equation (1.6) and Equation (1.7).
  • i (k-1) j (k) ) and the signal z i (k-1) can be calculated by the arithmetic circuit 110.
  • the signals z 1 (k ⁇ 1) to z m (k ⁇ 1) are converted to signals x 1 (k ⁇ 1) to x 1 (k ⁇ 1) to satisfy the relationships of Expression (1.9) and Expression (1.10).
  • the conversion circuit TRF that converts to x m (k ⁇ 1) will be described.
  • Z i (k ⁇ 1) and z i + 1 (k ⁇ 1) shown in the equation (1.9) are respectively the neuron N i (k ⁇ 1) and neuron N i + 1 ( k ⁇ 1) of the (k ⁇ 1) layer. This is a signal output from ( k-1) .
  • the neuron activation function is a step function whose output takes ⁇ 1 or 1
  • the value taken by the signal x i (k ⁇ 1) is also ⁇ 1 or 1. Therefore, x i (k ⁇ 1) can be expressed by negating the exclusive OR of z i (k ⁇ 1) and z i + 1 (k ⁇ 1) .
  • FIGS. 8A and 8B includes conversions for converting signals z 1 (k ⁇ 1) to z m (k ⁇ 1) into signals x 1 (k ⁇ 1) to x m (k ⁇ 1).
  • a configuration example of the circuit TRF is illustrated.
  • the conversion circuit TRF shown in FIG. 8A includes a matching circuit (an exclusive OR circuit) E [1] to a matching circuit E [m ⁇ 1].
  • a matching circuit an exclusive OR circuit
  • E [1] to a matching circuit E [m ⁇ 1].
  • FIG. 8A only the coincidence circuit E [1], the coincidence circuit E [2], the coincidence circuit E [i], the coincidence circuit E [m-2], and the coincidence circuit E [m-1] are illustrated.
  • the other matching circuits are not shown.
  • the coincidence circuit E [i] (where i is an integer of 1 to m ⁇ 1) will be described.
  • the signal z i (k ⁇ 1) is input to the first terminal of the matching circuit E [i]
  • the signal z i + 1 (k ⁇ 1) is input to the second terminal of the matching circuit E [i].
  • the signal x i (k ⁇ 1) is output from the output terminal of the coincidence circuit E [i].
  • the conversion circuit TRF illustrated in FIG. 8A receives the signal z m (k ⁇ 1) and outputs the signal z m (k ⁇ 1) as the signal x m (k ⁇ 1) as it is. ing.
  • the signals z 1 (k ⁇ 1) to z m (k ) are satisfied so as to satisfy the relational expressions of the expressions (1.9) and (1.10).
  • -1) signals x 1 (k ⁇ 1) to x m (k ⁇ 1) can be converted.
  • the conversion circuit TRF included in the arithmetic circuit 110 is not limited to the circuit configuration illustrated in FIG. 8A, and the configuration of the conversion circuit TRF illustrated in FIG. 8A may be changed depending on the situation.
  • the conversion circuit TRF shown in FIG. 8B may be applied as the conversion circuit TRF included in the arithmetic circuit 110.
  • the conversion circuit TRF in FIG. 8B has a configuration in which a matching circuit E [m] is added to the conversion circuit TRF in FIG.
  • the signal z m (k ⁇ 1) is input to the first terminal of the matching circuit E [m], and the signal SigL corresponding to the low level potential is input to the second terminal of the matching circuit E [m]. Entered. Further, the signal x m (k ⁇ 1) is output from the output terminal of the coincidence circuit E [m].
  • Embodiment 2 In this embodiment, another example of the structure of the arithmetic circuit 110 described in Embodiment 1 is described.
  • the circuit MPC can be arranged in a matrix, for example.
  • a configuration example of such an arithmetic circuit is shown in FIG.
  • the arithmetic circuit 120 includes an array part ALP in which the circuits MPC are arranged in a matrix, a circuit AFP including a plurality of circuits ACTF, a circuit TSG, a circuit WLD, a circuit SWLD, and a conversion circuit TRF.
  • the array unit ALP has n ⁇ m circuit MPCs, and the circuit MPCs are arranged in a matrix of n rows and m columns in the array unit ALP.
  • a circuit MPC located in j rows and i columns (where j is an integer of 1 to n and i is an integer of 1 to m) is represented by a circuit MPC [j, i].
  • FIG. 9 only the circuit MPC [1,1], the circuit MPC [1, m], the circuit MPC [n, 1], and the circuit MPC [n, m] are illustrated, and the other circuit MPC is illustrated. The illustration is omitted.
  • the circuit AFP has n circuit ACTFs, and each circuit ACTF is arranged in one line in the circuit AFP.
  • the circuit ACTF located in the j-th row is denoted as circuit ACTF [j].
  • the circuit ACTF [1] and the circuit ACTF [n] are shown, and the other circuits ACTF are not shown.
  • the circuits MPC [j, 1] to MPC [j, m] are the circuits MPC adjacent to each other, and the terminal outp and the terminal inp are electrically connected to each other.
  • the terminal outn and the terminal inn are electrically connected.
  • the terminal outp and the terminal outn of the circuit MPC [j, m] are electrically connected to the terminal inpa and the terminal inna of the circuit ACTF [j], respectively.
  • the terminals xt of the circuits MPC [j, 1] to MPC [j, m] are electrically connected to the conversion circuit TRF.
  • the one-line circuit MPC and the circuit ACTF can be regarded as the arithmetic circuit 110 shown in FIG.
  • the circuit MPC included in the array unit ALP includes a terminal st in addition to the terminal wt, the terminal wtm, the terminal xt, the terminal inp, the terminal inn, the terminal outp, and the terminal outn described in the first embodiment.
  • the terminal st is a terminal that is electrically connected to the wiring SL01 described in Embodiment 1.
  • the terminals st of the circuits MPC [j, 1] to MPC [j, m] are electrically connected to the wiring SWL [j].
  • the wiring SWL [j] corresponds to the wiring SWL in Embodiment 1
  • FIG. 9 illustrates the wiring SWL [1] and the wiring SWL [n].
  • the terminals wt of the circuits MPC [1, i] to MPC [n, i] are electrically connected to the wiring DL [i].
  • the wiring DL [i] corresponds to the wiring DL in Embodiment 1
  • FIG. 9 illustrates the wiring DL [1] and the wiring DL [m].
  • each terminal wtm of the circuits MPC [1, i] to MPC [n, i] is electrically connected to the wiring DLm [i].
  • the wiring DLm [i] corresponds to the wiring DLm in Embodiment 1, and FIG. 9 illustrates the wiring DLm [1] and the wiring DLm [m].
  • the circuit TSG is a circuit that generates signals to be input to the terminals inp and terminals inn of the circuits MPC [1,1] to MPC [n, 1].
  • the circuit WLD has a function of applying a potential corresponding to the weighting coefficient to the wirings DL [1] to DL [m] and a function of applying an intermediate potential to the wirings DLm [1] to DLm [m].
  • the circuit SWLD is a circuit for selecting a holding unit for holding a potential corresponding to the weight coefficient.
  • the circuit SWLD includes the gates of the transistors Tr03 and Tr03m of the holding units HCA and HCAm included in the circuits MPC [j, 1] to MPC [j, m] through the wiring SWL [j]. It has a function of applying a potential to.
  • the potential held in each of the holding unit HCA and the holding unit HCAm of the circuit MPC [j, i] is applied by the circuit WLD.
  • the circuit WLD By applying a high level potential to the wiring SWL [j] by the circuit SWLD and turning on the transistors Tr03 and Tr03m of the holding portions HCA and HCAm of the circuit MPC [j, i], the capacitive element
  • the potentials of the wiring DL [i] and the wiring DLm [i] can be written into the first terminals of C01 and the capacitor C01m.
  • a low level potential is applied to the wiring SWL [j] by the circuit SWLD, and the holding portion HCA of the circuit MPC [j, i] is applied.
  • the potentials written in the holding unit HCA and the holding unit HCAm can be held by turning off the transistors Tr03 and Tr03m of the HCAm and the transistor Tr03m, respectively.
  • FIG. 9 illustrates a state in which the signal z 1 (k ⁇ 1) and the signal z m (k ⁇ 1) are input to the conversion circuit TRF.
  • signals x 1 (k ⁇ 1) to x m (k ⁇ 1) output by converting signals z 1 (k ⁇ 1) to z m (k ⁇ 1) input to the conversion circuit TRF are:
  • the data is sent to the circuit MPC included in the array unit ALP.
  • the signal x i (k ⁇ 1) is sent to the terminals xt of the circuits MPC [1, i] to MPC [n, i].
  • the arithmetic circuit 120 shown in FIG. 9 By configuring the arithmetic circuit 120 shown in FIG. 9, a plurality of calculations can be performed simultaneously.
  • the arithmetic circuit 110 in FIG. 1 has been described as a circuit for obtaining the signal z j (k) output from the neuron N j (k) in FIG. 4B.
  • the arithmetic circuit 120 illustrated in FIG. The signals z 1 (k) to z n (k) output from the neurons N 1 (k) to N n (k) can be obtained simultaneously.
  • each of the neurons N 1 (k) to N n (k) in the k-th layer includes the neurons N 1 (k ⁇ 1) to N m (k ⁇ ) in the (k ⁇ 1) -th layer. All of signals z 1 (k ⁇ 1) to z m (k ⁇ 1) output from each of 1) are input. This corresponds to the signals x 1 (k ⁇ 1) to x m (k ⁇ 1) output from the conversion circuit TRF being sent to the circuit MPC included in the array unit ALP.
  • a potential corresponding to the weighting factor of the neuron N i (k ⁇ 1) in the (k ⁇ 1) -th layer and the neuron N j (k) in the k-th layer is supplied to the holding unit HCA of the circuit MPC [j, i].
  • the signal z j (k) output from the neuron N j (k) in the k-th layer can be output from the circuit ACTF [j].
  • FIG. 9 illustrates that the signal z 1 (k) is output from the circuit ACTF [1] and the signal z n (k) is output from the circuit ACTF [n].
  • the semiconductor device of one embodiment of the present invention is not limited to the arithmetic circuit 120 illustrated in FIG.
  • the arithmetic circuit 120 illustrated in FIG. 9 has a configuration in which the circuit MPC [i] illustrated in FIG. 6 is arranged in a matrix.
  • the arithmetic circuit also includes the circuit MPC [i] illustrated in FIG. Can be configured.
  • the circuit MPC [i] in FIG. 10 includes a point where the terminal wt in the holding unit HCA of the circuit BF1 and the terminal wtm in the holding unit HCAm of the circuit BF2 are electrically connected to the wiring DL, and the wiring in the circuit BF1.
  • 6 is different from the circuit MPC [i] in FIG. 6 in that SL01 is electrically connected to the wiring SWL and that the wiring SL01m in the circuit BF2 is electrically connected to the wiring SWLm.
  • FIG. 11 shows an example in which the arithmetic circuit is configured by arranging the circuits MPC [i] in FIG. 10 in an n ⁇ m matrix form, similarly to the arithmetic circuit 120 in FIG.
  • An arithmetic circuit 130 illustrated in FIG. 11 is different from the arithmetic circuit 120 in FIG. 9 in some terminals of the circuit MPC and wirings connected to the partial terminals.
  • the circuit MPC included in the array unit ALP includes a terminal st and a terminal stm in addition to the terminal wt, the terminal wtm, the terminal xt, the terminal inp, the terminal inn, the terminal outp, and the terminal outn illustrated in FIG.
  • the terminal st is a terminal electrically connected to the wiring SL01 in the circuit BF1
  • the terminal stm is a terminal electrically connected to the wiring SL01m in the circuit BF2. Since the terminal wt and the terminal wtm are electrically connected to each other in FIG. 10, the illustration of the terminal wtm is omitted in FIG. 11, and the terminal wtm is regarded as the same terminal as the terminal wt.
  • the terminals st of the circuits MPC [j, 1] to MPC [j, m] are electrically connected to the wiring SWL [j].
  • the wiring SWL [j] corresponds to the wiring SWL in FIG. 10, and FIG. 11 illustrates the wiring SWL [1] and the wiring SWL [n].
  • the terminals stm of the circuits MPC [j, 1] to MPC [j, m] are electrically connected to the wiring SWLm [j].
  • the wiring SWLm [j] corresponds to the wiring SWLm in FIG. 10, and FIG. 11 illustrates the wiring SWLm [1] and the wiring SWLm [n].
  • the terminals wt of the circuits MPC [1, i] to MPC [n, i] are electrically connected to the wiring DL [i].
  • the wiring DL [i] corresponds to the wiring DL in FIG. 10, and FIG. 11 illustrates the wiring DL [1] and the wiring DL [m].
  • the arithmetic circuit 120 inputs potentials to be held in the two holding portions HCA included in the circuit MPC through separate wirings, and the switching between the on state and the off state of the transistor Tr03 and the transistor Tr03m is performed with one wiring.
  • the arithmetic circuit 130 inputs a potential to be held in the two holding portions HCA included in the circuit MPC through one wiring, and switches the transistor Tr03 and the transistor Tr03m between the on state and the off state separately. It is the structure performed by wiring.
  • FIG. 12 (A1) (A2) (B) (C) (D) and FIG. 13 (A) (B) (C) (D) (E) (F) used in the description of this embodiment a circuit similar to the inverter circuit DINV1 can be applied to the inverter circuit DINV2.
  • a circuit similar to the inverter circuit DINV1 can be applied as the inverter circuit DINV2
  • a circuit configuration similar to that of the circuit BF1 can be applied as the circuit BF2.
  • An inverter circuit DINV1 illustrated in FIG. 12A1 is a circuit obtained by changing the configuration of the inverter circuit DINV1 of the circuit BF1 illustrated in FIG.
  • the inverter circuit DINV1 shown in FIG. 12A1 has a structure in which a transistor Tr04 is added to the inverter circuit DINV1 shown in FIG. 2B1.
  • the transistor Tr04 is a transistor having a back gate.
  • the transistor Tr02 does not have a back gate and is therefore not electrically connected to the first terminal of the capacitor C01.
  • the first terminal of the transistor Tr04 is electrically connected to the second terminal of the transistor Tr02, the second terminal of the transistor Tr04 is electrically connected to the wiring VSSL, and the gate of the transistor Tr04 is electrically connected to the terminal inp.
  • the back gate of the transistor Tr04 is electrically connected to the first terminal of the capacitor C01 and the first terminal of the transistor Tr03.
  • the inverter circuit DINV1 in FIG. 12A1 has a structure similar to that of the inverter circuit INV1 illustrated in FIG. 2B1 by the transistor Tr01 and the transistor Tr02, and a low-level potential is input through the transistor Tr04. It is the composition to do.
  • the driving speed of the inverter circuit DINV1 in FIG. 12A1 can be determined in accordance with the potential applied to the back gate of the transistor Tr04. Further, the potential of the back gate of the transistor Tr04 can be held by the transistor Tr03 and the capacitor C01 as in the inverter circuit DINV1 in FIG.
  • the inverter circuit DINV1 illustrated in FIG. 12A2 has a structure in which the connection of the transistor Tr04 of the inverter circuit DINV1 illustrated in FIG. Specifically, the first terminal of the transistor Tr04 is electrically connected to the wiring VDDL, and the second terminal of the transistor Tr04 is electrically connected to the first terminal of the transistor Tr01.
  • the inverter circuit DINV1 in FIG. 12A2 holds the potential of the back gate of the transistor Tr04 by the transistor Tr03 and the capacitor C01.
  • the driving speed of the inverter circuit DINV1 can be determined according to the potential of the back gate.
  • the inverter circuit DINV1 shown in FIG. 12B has a configuration in which the holding unit HCA of the inverter circuit DINV1 shown in FIG. 2B1 is changed to a holding unit HCB.
  • the holding unit HCB includes an inverter circuit SINV1 and an inverter circuit SINV2.
  • the input terminal of the inverter circuit SINV1 is electrically connected to the terminal wt, the output terminal of the inverter circuit SINV2, and the back gate of the transistor Tr02.
  • the output terminal of the inverter circuit SINV1 is electrically connected to the input terminal of the inverter circuit SINV2. Connected.
  • the high power supply potential input terminals of the inverter circuit SINV1 and the inverter circuit SINV2 are electrically connected to the wiring VSS1L, and the low power supply potential input terminals of the inverter circuit SINV1 and the inverter circuit SINV2 are Are electrically connected to the wiring VSS2L.
  • the wiring VSS1L functions as a voltage line that supplies the voltage VSS1.
  • the wiring VSS2L functions as a voltage line that supplies a potential VSS2 lower than the voltage VSS1.
  • the voltage VSS1 can be set to a value equal to or lower than the voltage VSS, for example.
  • the holding unit HCB has an inverter loop configuration of the inverter circuit SINV1 and the inverter circuit SINV2, and therefore, the transistor HCB has a transistor corresponding to the potential according to the signal input to the terminal wt.
  • the potential of the back gate of Tr02 can be held as one of VSS1 or VSS2.
  • the holding unit HCB of the inverter circuit DINV1 shown in FIG. 12B can hold binary data as a weighting coefficient. Therefore, when the circuit BF1 illustrated in FIG. 12B is used as the circuit BF1 included in the circuit MPC, the weighting coefficient input to the terminal wt is preferably binary data.
  • the driving speed of the inverter circuit DINV1 in FIG. Specifically, when the potential applied to the back gate of the transistor Tr02 is VSS1, the drive speed of the inverter circuit DINV1 is faster than when the potential applied to the back gate of the transistor Tr02 is VSS2.
  • An inverter circuit DINV1 illustrated in FIG. 12C is a circuit obtained by changing the configuration of the inverter circuit DINV1 of the circuit BF1 illustrated in FIG. Specifically, in the inverter circuit DINV1 illustrated in FIG. 12C, a transistor Tr01p having a back gate is used as the transistor Tr01. As the transistor Tr01p, for example, a p-channel transistor having an SOI (Silicon On Insulator) structure can be used. Further, the transistor Tr02 does not need to have a back gate.
  • SOI Silicon On Insulator
  • the back gate of the transistor Tr01p is electrically connected to the first terminal of the capacitor C01 and the first terminal of the transistor Tr03.
  • the inverter circuit DINV1 in FIG. 12C can change the input / output time similarly to the inverter circuit DINV1 in FIG.
  • An inverter circuit DINV1 illustrated in FIG. 12D is a circuit obtained by changing the configuration of the inverter circuit DINV1 of the circuit BF1 illustrated in FIG. Specifically, the inverter circuit DINV1 illustrated in FIG. 12D does not include the transistor Tr01 but includes a load element LE, a transistor Tr02, a transistor Tr03, and a capacitor C01.
  • the first terminal of the load element LE is electrically connected to the wiring VDDL, and the second terminal of the load element LE is electrically connected to the first terminal of the transistor Tr02 and the input terminal of the inverter circuit INV1. Yes.
  • the description of the connection structure of the inverter circuit DINV1 in FIG. 2B1 is referred to.
  • the load element LE for example, a resistance element can be used.
  • the inverter circuit DINV1 illustrated in FIG. 13A has a configuration in which a resistance element R01 is applied as the load element LE.
  • the load element LE for example, a diode can be used.
  • the inverter circuit DINV1 illustrated in FIG. 13B has a configuration in which a diode D01 is applied as the load element LE.
  • the load element for example, the same n-channel transistor as the transistor Tr02 can be used.
  • the inverter circuit DINV1 shown in FIG. 13C has a configuration in which a transistor Tr15 in which the gate and the first terminal are electrically connected (diode connection) is applied as the load element LE.
  • the inverter circuit DINV1 shown in FIG. 13D has a configuration in which the transistor Tr15 in which the gate and the second terminal are electrically connected is applied as the load element LE.
  • the transistor Tr15 applied as the load element LE may be a transistor having a back gate. Further, when a transistor in which a gate and a back gate are electrically connected is used, the on-state current of the transistor can be increased.
  • FIGS. 13E and 13F has a structure in which a back gate is provided in the transistor Tr05 shown in FIGS. 13C and 13D and the gate and the back gate of the transistor Tr15 are electrically connected. ing.
  • a circuit BF1 illustrated in FIG. 14A is a circuit in which the configuration of the inverter circuit DINV1 of the circuit BF1 illustrated in FIG. 2B1 is changed.
  • the inverter circuit DINV1 illustrated in FIG. 14A has a circuit configuration including a holding unit HCA1 and a holding unit HCA2 as the holding unit HCA of the circuit BF1 in FIG. 2B1.
  • the circuit BF1 in FIG. 14A includes a transistor Tr02a, a switch S05, and a switch S05a in addition to the circuit elements included in the circuit BF1 in FIG.
  • the transistor Tr02a is a transistor having a back gate.
  • the holding unit HCA1 and the holding unit HCA2 have a circuit configuration similar to that of the holding unit HCA of the circuit BF1 in FIG.
  • the holding portion HCA1 is described as a transistor Tr03 and a capacitor element C01
  • the holding portion HCA2 is described as a transistor Tr03a and a capacitor element C01a to be distinguished from the circuit element of the holding portion HCA1. Yes.
  • the switch S05 is electrically connected between the second terminal of the transistor Tr01 and the first terminal of the transistor Tr02 in the circuit BF1 in FIG. 2B1. Specifically, the second terminal of the transistor Tr01 is electrically connected to the first terminal of the switch S05 and the input terminal of the inverter circuit INV1, and the first terminal of the transistor Tr02 is connected to the second terminal of the switch S05. Electrically connected. The control terminal of the switch S05 is electrically connected to the wiring SL02.
  • the first terminal of the switch S05a is electrically connected to the second terminal of the transistor Tr01 and the input terminal of the inverter circuit INV1, and the second terminal of the switch S05a is electrically connected to the first terminal of the transistor Tr02a.
  • the control terminal of the switch S05a is electrically connected to the wiring SL02a.
  • the second terminal of the transistor Tr02a is electrically connected to the wiring VSSL, and the gate of the transistor Tr02a is electrically connected to the terminal inp, the gate of the transistor Tr01, and the gate of the transistor Tr02.
  • the back gate of the transistor Tr02a is electrically connected to the first terminal of the transistor Tr03a included in the holding unit HCA2 and the first terminal of the capacitor C01a.
  • the second terminal of the transistor Tr03a is electrically connected to the terminal wta, the gate of the transistor Tr03a is electrically connected to the wiring SL01, and the second terminal of the second terminal of the capacitor C01a is electrically connected to the wiring VL. It is connected to the.
  • the gate of the transistor Tr03a is electrically connected to the wiring SL01 similarly to the gate of the transistor Tr03. Therefore, switching control of the transistor Tr03 and the transistor Tr03a is performed by the wiring SL01.
  • the terminal wt and the terminal wta to which the potential held in the holding unit HCA1 and the holding unit HCA2 is input need to be connected by separate wirings. Therefore, the circuit BF1 in FIG. 14A has a structure in which the terminal wt is electrically connected to the wiring DL and the terminal wta is electrically connected to the wiring DLm.
  • the switch S05 can be turned on or off by applying a potential from the wiring SL02 to the control terminal of the switch S05.
  • the switch S05a can be turned on or off by applying a potential from the wiring SL02a to the gate of the switch S05a.
  • the transistor Tr03a functions as a switching element, and the transistor Tr03a can be turned on or off by applying a potential from the wiring SL01a to the gate of the transistor Tr03a.
  • each of the holding unit HCA1 and the holding unit HCA2 can hold a potential corresponding to the corresponding weighting coefficient, like the holding unit HCA. That is, the circuit BF1 in FIG. 14A can hold potentials corresponding to two weighting factors.
  • the calculation can be performed by switching the weight coefficient.
  • the weighting factors w 1 (k ⁇ 1) j (k) to w m (k ⁇ 1) are assigned to the respective holding units HCA1 of the circuit BF1 included in the circuits MPC [1] to MPC [m] of the arithmetic circuit 110.
  • j (k) is held, and the weighting coefficient w 1 (k ⁇ 1) h (k) to w m (k ⁇ 1) h (k) (h is 1 or more and n or less ) in the holding unit HCA2.
  • the arithmetic circuit 110 causes the weighting coefficient w 1 ( k-1) Performing a product sum of j (k) to w m (k-1) j (k) and signals z 1 (k-1) to z m (k-1) and an activation function Can do.
  • the arithmetic circuit 110 causes the weighting factor w 1 (k -1) A product sum of h (k) to w m (k-1) h (k) and signals z 1 (k-1) to z m (k-1) and an activation function can be calculated. it can.
  • the operation corresponding to each weight coefficient can be performed by switching the weight coefficient.
  • the holding unit HCA1 and the holding unit HCA2 are illustrated as the holding unit HCA, but the inverter circuit DINV1 may include three or more holding units.
  • the weighting coefficient handled by the neural network is 1 bit (binary), for example, the holding unit HCA1 holds a high level potential, the holding unit HCA2 holds a low level potential, and the weighting factor is set according to the situation. It is possible to perform computations while switching between.
  • the location where the switch S05 and the switch S05a for switching the weighting factor are provided is not limited to the configuration of the circuit BF1 in FIG.
  • the position where the switch S05 and the switch S05a are provided can be different from that in FIG.
  • the switch S05 is provided between the second terminal of the transistor Tr02 and the wiring VSSL
  • the switch S05a is provided between the second terminal of the transistor Tr02a and the wiring VSSL. Is provided.
  • the circuit BF1 in FIG. 14B can perform the same operation as the circuit BF1 in FIG.
  • circuit included in the semiconductor device includes FIGS. 12A1 to 12F, FIGS. 13A to 13F, and FIG. ) (B) is not limited to the circuit configuration shown in FIG. 12, and depending on the situation, FIG. 12 (A1) (A2) (B) (C), (D), FIG. 14 (A) and 14 (B) may be modified.
  • circuits included in the semiconductor device according to one embodiment of the present invention include FIGS. 12A1 to 12A, FIGS. 13A to 13F, and FIG. ) (B) may be combined with each other.
  • FIG. 15A is a block diagram illustrating an example of a circuit that can be applied to the circuit BF1 (circuit BF2) included in the circuit MPC described in the above embodiment.
  • the circuit BF1 (BF2) of FIG. 15A includes an inverter circuit DINV1 (inverter circuit DINV2) including a drive unit DRV, a correction unit COR, and a holding unit HCA (holding unit HCAm), and an inverter circuit INV1 (inverter circuit INV2). And having.
  • the driving unit DRV includes a transistor Tr01 and a transistor Tr02. As described in the above embodiment, the transistor Tr01 is a p-channel transistor, and the transistor Tr02 is an n-channel transistor having a back gate.
  • the correction unit COR has a function of correcting the threshold voltage of the transistor Tr01 and / or the transistor Tr02. Therefore, the correction unit COR is electrically connected to the drive unit DRV.
  • the correction unit COR is electrically connected to the wiring CL, and the wiring CL has a function of supplying a necessary signal to the correction unit COR in order to operate the correction unit COR.
  • the wiring CL may be shown as a plurality of wirings instead of one.
  • the holding unit HCA (holding unit HCAm) has a function of holding the potential of the back gate of the transistor Tr02 as described in the previous embodiment. Therefore, the holding unit HCA (holding unit HCAm) is electrically connected to the drive unit DRV.
  • the correction unit COR may be electrically connected to a wiring that electrically connects the holding unit HCA (holding unit HCAm) and the drive unit DRV. That is, the holding unit HCA (holding unit HCAm) may be electrically connected to the correction unit COR.
  • holding unit HCA holding unit HCAm
  • the inverter circuit DINV1 (inverter circuit DINV2) (strictly, the drive unit DRV having the function of an inverter circuit) and / or the inverter circuit INV1 (inverter circuit INV2) illustrated in FIG. It can be replaced with a circuit, a NOR circuit, an XOR circuit, or a combination thereof (hereinafter, a NAND circuit, a NOR circuit, an XOR circuit, or a combination thereof is collectively referred to as a logic circuit).
  • FIG. 15B is a block diagram illustrating an example of a circuit which is different from FIG. 15A and can be applied to the circuit BF1 (circuit BF2) included in the circuit MPC described in the above embodiment.
  • each of the logic circuit LGC1 and the logic circuit LGC2 has a function of generating and outputting an inverted signal with respect to a signal input to the corresponding circuit, and an example thereof can be the above-described inverter circuit.
  • a NAND circuit when a NAND circuit is used as the logic circuit LGC1 and / or the logic circuit LGC2, a NAND circuit functions as an inverter circuit by inputting a high-level potential as a fixed potential to one of two input terminals of the NAND circuit. be able to.
  • a NOR circuit when a NOR circuit is applied as the logic circuit LGC1 and / or the logic circuit LGC2, a low level potential is input as a fixed potential to one of the two input terminals of the NOR circuit, thereby making the NOR circuit an inverter circuit. Can function.
  • an XOR circuit when applied as the logic circuit LGC1 and / or the logic circuit LGC2, a high-level potential is input as a fixed potential to one of the two input terminals of the XOR circuit, whereby the XOR circuit is used as an inverter circuit. Can function.
  • inverter circuit As described above, the inverter circuit described in this specification and the like can be replaced with a logic circuit such as a NAND circuit, a NOR circuit, an XOR circuit, or a combination thereof. Therefore, in this specification and the like, the term “inverter circuit” can be broadly referred to as “logic circuit”.
  • circuit BF2 can have a structure similar to that of the circuit BF1, and therefore, in the drawings used for the following description, BF1 (BF2) is described as a symbol representing the circuit BF1.
  • constituent elements of the circuit BF2 that have different signs from the constituent elements of the circuit BF1 are described in parentheses near the reference numerals indicating the constituent elements of the circuit BF1.
  • circuit BF1 is treated unless otherwise specified. Therefore, when considering the circuit BF2, the reference numerals in the parentheses described in the drawings can be referred to and the constituent elements of the circuit BF1 described below can be replaced with the reference numerals in the parentheses.
  • FIG. 15A A structural example of the circuit BF1 in FIG. 15A is illustrated in FIG.
  • a circuit BF1 illustrated in FIG. 16A has a function of correcting the threshold voltage of the transistor Tr02.
  • the correction unit COR includes switches S51 to S54 and a capacitive element C21.
  • the second terminal of the transistor Tr01 of the drive unit DRV is electrically connected to the first terminal of the switch S51 and the input terminal of the inverter circuit INV1, and the second terminal of the switch S51 is connected to the transistor Tr02 of the drive unit DRV.
  • the first terminal and the first terminal of the switch S52 are electrically connected.
  • the second terminal of the switch S52 is electrically connected to the back gate of the transistor Tr02 and the first terminal of the capacitor C21.
  • the second terminal of the transistor Tr02 is connected to the first terminal of the switch S53 and the wiring VSSL. , Is electrically connected to.
  • the second terminal of the capacitive element C21 is electrically connected to the second terminal of the switch S53 and the first terminal of the switch S54.
  • the second terminal of the switch S54 is electrically connected to the first terminal of the transistor Tr03 of the holding unit HCA and the first terminal of the capacitive element C01 of the holding unit HCA.
  • the terminal inp of the circuit MPC is electrically connected to the gates of the transistor Tr01 and the transistor Tr02.
  • the wirings SL51 to SL54 are electrically connected to the control terminals of the switches S51 to S54, respectively. That is, each of the switches S51 to S54 can be turned on or off by applying a predetermined voltage to each of the wirings SL51 to SL54. Note that in this specification and the like, each of the switches S51 to S54 is turned on when a high-level potential is applied to the control terminal, and is turned off when a low-level potential is applied to the control terminal. And The wirings SL51 to SL54 correspond to the wiring CL in FIG.
  • switches S51 to S54 for example, electrical switches such as analog switches and transistors can be applied.
  • mechanical switches may be applied as the switches S51 to S54.
  • the transistor when a transistor is used for the switch S52, the transistor is preferably an OS transistor. Since it is preferable to hold the potential of the first terminal of the capacitor C21 and the potential of the back gate of the transistor Tr02 for a long time, the switch S52 is preferably an OS transistor with low off-state current. In addition, an OS transistor may be employed for switches other than the switch S52.
  • an electrical connection point between the second terminal of the switch S52, the back gate of the transistor Tr02, and the first terminal of the capacitor C21 is referred to as a node nd1.
  • an electrical connection point between the second terminal of the capacitive element C21, the second terminal of the switch S53, and the first terminal of the switch S54 is referred to as a node nd3.
  • an electrical connection point between the first terminal of the transistor Tr03, the first terminal of the capacitor C01, and the second terminal of the switch S54 is referred to as a node nd2.
  • the circuit BF1 included in the semiconductor device of one embodiment of the present invention is not limited to the circuit BF1 in FIG. 16A, and the circuit BF1 in FIG. 16A is changed depending on circumstances. Can do.
  • the switch S51 is provided between the second terminal of the transistor Tr01 and the first terminal of the transistor Tr02.
  • the circuit BF1 in FIG. S51 may be provided between the wiring VDDL and the first terminal of the transistor Tr01. Note that in FIG. 16B, reference numerals of the wirings CL are omitted.
  • FIG. 17 is a timing chart showing an operation example of correcting the threshold voltage of the transistor Tr02 in the circuit BF1 in FIGS. 16A and 16B. The period from time T11 to time T16 and its periphery are shown. The change in the potential of the terminal inp, the wiring SL51 to the wiring SL54, the wiring SL01, and the nodes nd1 to nd3 at the time of FIG.
  • the voltage VSS given by the wiring VSSL is described as 0 V as an example.
  • the circuit BF1 is initialized in the operation of correcting the threshold voltage of the transistor Tr02. Specifically, the voltage VSS is applied to the terminal inp, a high level potential is applied to the wirings SL51 to SL53, and a low level potential is applied to the wirings SL54 and SL01.
  • the switch S51 and the switch S52 are in the on state, the wiring VDDL and the first terminal of the capacitor C21 are in a conductive state. As a result, the potential of the node nd1 becomes VDD.
  • 0V is input as VSS to the gate of the transistor Tr02 at this time
  • 0V is input as VSS to the second terminal of the transistor Tr02
  • VDD is input to the first terminal of the transistor Tr02.
  • the first terminal of Tr02 functions as a drain
  • the second terminal of transistor Tr02 functions as a source.
  • the gate-source voltage V GS of the transistor Tr02 is 0V. Since VDD is input to the back gate of the transistor Tr02 and the threshold voltage of the transistor Tr02 is shifted to the negative side, the transistor Tr02 is on.
  • the potential of the wiring SL51 changes to a low level potential, and the switch S51 is turned off.
  • the positive charge charged in the first terminal of the capacitor C21 flows to the wiring VSSL via the portion between the first terminal and the second terminal of the transistor Tr02 until the transistor Tr02 is turned off.
  • negative charge flows from the wiring VSSL to the first terminal of the capacitor C21 through the portion between the first terminal and the second terminal of the transistor Tr02 until the transistor Tr02 is turned off.
  • the potential of the node nd1 decreases from VDD, and the threshold voltage of the transistor Tr02 shifts to the positive side.
  • the potential of the wiring SL52 changes to a low level potential, and the switch S52 is turned off. Accordingly, the node nd1 is in an electrically floating state, and the potential of the node nd1 is held by the capacitor C21.
  • the voltage between the back gate and the source of the transistor Tr02 (between the first terminal and the second terminal of the capacitor C21) is set to a voltage V BGS at which the threshold voltage of the transistor Tr02 is 0V.
  • the transistor Tr03 since the high-level potential is applied to the wiring SL01 between the time T14 and the time 15, the transistor Tr03 is turned on. Note that this time the terminal wt, it is assumed that the potential V W corresponding to the weighting factor is input. Therefore, by the capacitor C01, a node nd2, potential V W input from the terminal wt is held. Note that in this operation example, the potential VW is treated as a potential lower than 0 V as an example.
  • the potential of the wiring SL54 changes to a high level potential, and the switch S54 is turned on.
  • the second terminal of the terminal wt and the capacitor C21 becomes conductive, the second terminal (node nd3) of the capacitor C21, the potential V W input from the terminal is applied.
  • the potential of the node nd1 varies due to the capacitive coupling of the capacitive element C21 when the potential of the node nd3 varies.
  • the amount of fluctuation of the potential of the node nd1 is determined by the capacitive coupling coefficient, and the capacitive coupling coefficient is determined by the gate capacitance of the transistor Tr02, the parasitic capacitance of the wiring around the node nd1, and the like.
  • the amount of change in potential of the node nd1 and the amount of change in potential of the node nd3 are described as the same value. This corresponds to setting the capacitance coupling coefficient to 1.
  • the potential of the wiring SL01 changes to a low level potential, so that the transistor Tr03 is turned off. Accordingly, the potentials of the node nd2 and the node nd3 are held by the capacitor C01 and the capacitor C21. That is, V BGS + V W which is the potential of the node nd1 is also held.
  • the circuit BF1 in FIGS. 16A and 16B performs the operation from the time T11 to the time T16 shown in the timing chart of FIG. 17 and after the time T16, so that the threshold voltage of the transistor Tr02 is almost zero.
  • a potential corresponding to the weighting coefficient can be input to the back gate of the transistor Tr02. Therefore, variation in threshold voltage of each transistor Tr02, which occurs when a plurality of circuits BF1 are manufactured, can be suppressed.
  • a potential corresponding to a weighting coefficient is applied to the back gate of each transistor Tr02. It is possible to input more accurately.
  • the correction unit COR includes a switch S53 to a switch S58 and a capacitive element C21.
  • the second terminal of the transistor Tr01 of the drive unit DRV is electrically connected to the input terminal of the inverter circuit INV1 and the first terminal of the transistor Tr02 of the drive unit DRV, and the gate of the transistor Tr01 is the first terminal of the switch S55. And electrically connected to the terminal.
  • the second terminal of the switch S55 is electrically connected to the gate of the transistor Tr02 and the first terminal of the switch S57.
  • the second terminal of the switch S57 is electrically connected to the second terminal of the transistor Tr02, the first terminal of the switch S53, and the first terminal of the switch S58, and the second terminal of the switch S58 is connected to the wiring VSSL. Electrically connected.
  • the back gate of the transistor Tr02 is electrically connected to the first terminal of the switch S56 and the first terminal of the capacitor C21, and the second terminal of the switch S56 is electrically connected to the wiring Vref1L.
  • the second terminal of the capacitive element C21 is electrically connected to the second terminal of the switch S53 and the first terminal of the switch S54, and the second terminal of the switch S54 is the first terminal of the transistor Tr03 of the holding unit HCA.
  • the first terminal of the capacitive element C01 of the holding unit HCA is electrically connected to the gate of the transistor Tr01 and the first terminal of the switch S55.
  • the wirings SL53 to SL58 are electrically connected to the control terminals of the switches S53 to S58, respectively. That is, each of the switches S53 to S58 can be turned on or off by applying a predetermined voltage to each of the wirings SL53 to SL58. Note that in this specification and the like, each of the switches S53 to S58 is turned on when a high-level potential is applied to the control terminal, and is turned off when a low-level potential is applied to the control terminal. And The wirings SL53 to SL58 correspond to the wiring CL in FIG.
  • switches S53 to S58 for example, analog switches, transistors, and the like can be applied in the same manner as the switches S51 to S54 described in the configuration example 1. Further, as the switches S53 to S58, for example, mechanical switches may be applied.
  • the transistor when a transistor is used as the switch S56, the transistor is preferably an OS transistor. Since it is preferable to hold the potential of the first terminal of the capacitor C21 and the potential of the back gate of the transistor Tr02 for a long time, the switch S56 is preferably an OS transistor with low off-state current. Further, an OS transistor may be employed for switches other than the switch S56.
  • Wiring Vref1L is a wiring for applying a predetermined constant voltage V ref1.
  • the constant voltage is preferably a voltage that shifts the threshold voltage of the transistor Tr02 in the negative direction by inputting the constant voltage to the back gate of the transistor Tr02.
  • an electrical connection point between the first terminal of the switch S56, the back gate of the transistor Tr02, and the first terminal of the capacitor C21 is referred to as a node nd1.
  • an electrical connection point between the second terminal of the capacitive element C21, the second terminal of the switch S53, and the first terminal of the switch S54 is referred to as a node nd3.
  • an electrical connection point between the first terminal of the transistor Tr03, the first terminal of the capacitor C01, and the second terminal of the switch S54 is referred to as a node nd2.
  • FIG. 19 is a timing chart showing an example of the operation of correcting the threshold voltage of the transistor Tr02 in the circuit BF1 of FIG. 18, and shows the terminal inp between time T21 and time T26 and around the time. , Changes in potentials of the wirings SL53 to SL58, the wiring SL01, and the nodes nd1 to nd3 are shown.
  • the voltage VSS given by the wiring VSSL is described as 0 V as an example.
  • the circuit BF1 is initialized in the operation of correcting the threshold voltage of the transistor Tr02. Specifically, the voltage VSS is applied to the terminal inp, a high level potential is applied to the wiring SL53, the wiring SL56 to the wiring SL58, and a low level potential is applied to the wiring SL54, the wiring SL55, and the wiring SL01. .
  • the switch S53, the switch S56 to the switch S58 are turned on, and the switch S54, the switch S55, and the transistor Tr03 are turned off.
  • the switch S56 since the switch S56 is in the on state, the conductive state is established between the wiring Vref1L and the first terminal of the capacitor C21. As a result, the potential of the node nd1 becomes V ref1 .
  • the switch S57 and the switch S58 are in the on state, the conductive state is established between the wiring VSSL and the gate of the transistor Tr02. Accordingly, 0 V is input as VSS to each of the gate and the second terminal of the transistor Tr02. Since VDD is applied to the first terminal of the transistor Tr02, the first terminal of the transistor Tr02 functions as a drain, and the second terminal of the transistor Tr02 functions as a source.
  • the gate-source voltage V GS of the transistor Tr02 is 0V. Since V ref1 is input to the back gate of the transistor Tr02 and the threshold voltage of the transistor Tr02 is shifted to the negative side, the transistor Tr02 is in an on state.
  • the potential of the wiring SL58 changes to a low level potential, and the switch S58 is turned off. Accordingly, the negative charge charged in the second terminal of the capacitive element C21 flows to the wiring VDDL through the portion between the first terminal and the second terminal of the transistor Tr02 until the transistor Tr02 is turned off. In other words, positive charge flows from the wiring VDDL to the second terminal of the capacitor C21 through the portion between the first terminal and the second terminal of the transistor Tr02 until the transistor Tr02 is turned off.
  • the potential of the wiring SL56 changes to a low level potential, and the switch S56 is turned off. Accordingly, the node nd1 is in an electrically floating state, and the potential V ref1 of the node nd1 is held by the first terminal of the capacitor C21.
  • the voltage between the back gate and the source of the transistor Tr02 (between the first terminal and the second terminal of the capacitor C21) is set to a voltage V BGS at which the threshold voltage of the transistor Tr02 becomes 0V. .
  • the potential of the wiring SL53 and the wiring SL57 changes to a low level potential, and the switch S53 and the switch S57 are turned off.
  • the potentials of the wiring SL55 and the wiring SL58 are changed to a high level potential, and the switch S55 and the switch S58 are turned on. Accordingly, the terminal inp and the gate of the transistor Tr01 and the terminal inp and the gate of the transistor Tr02 are in a conductive state, respectively. Further, the second terminal of the transistor Tr02 and the wiring VSSL are in a conductive state.
  • the transistor Tr03 since the high-level potential is applied to the wiring SL01 between the time T24 and the time 25, the transistor Tr03 is turned on. Note that this time the terminal wt, it is assumed that the potential V W corresponding to the weighting factor is input. Therefore, by the capacitor C01, a node nd2, potential V W input from the terminal wt is held. Note that in this operation example, the potential VW is treated as a potential lower than 0 V as an example.
  • the potential of the wiring SL54 changes to a high level potential, and the switch S54 is turned on.
  • the second terminal of the terminal wt and the capacitor C21 becomes conductive, the second terminal (node nd3) of the capacitor C21, the potential V W input from the terminal is applied.
  • the capacitive coupling coefficient of the capacitive element C21 is considered as 1. Therefore, description will be made assuming that the variation amount of the potential of the node nd1 is the same as the variation amount of the potential of the node nd3.
  • V ref1 -V BGS Due to the one capacitive coupling coefficient, by the potential of the node nd3 rises from V ref1 -V BGS to V ref1 -V BGS + V W, the potential of the node nd1, the V BGS + V W. Note that in this operation example, since V W is a negative potential, the potential of the node nd1 is lower than V BGS by V W.
  • the potential of the wiring SL01 changes to a low level potential, so that the transistor Tr03 is turned off. Accordingly, the potentials of the node nd2 and the node nd3 are held by the capacitor C01 and the capacitor C21. That is, V BGS + V W which is the potential of the node nd1 is also held.
  • the circuit BF1 in FIG. 18 performs the operation from the time T21 to the time T26 shown in the timing chart of FIG. 19 and after the time T26, so that the threshold voltage of the transistor Tr02 is almost 0 as in the configuration example 1. Then, a potential corresponding to the weighting coefficient can be input to the back gate of the transistor Tr02. Therefore, variation in threshold voltage of each transistor Tr02, which occurs when a plurality of circuits BF1 are manufactured, can be suppressed. As a result, a potential corresponding to a weighting coefficient is applied to the back gate of each transistor Tr02. It is possible to input more accurately.
  • FIG. 15A A structural example of the circuit BF1 in FIG. 15A is illustrated in FIG.
  • a circuit BF1 illustrated in FIG. 20A has a function of correcting the threshold voltage of the transistor Tr01.
  • the correction unit COR includes switches S58 to S61 and a capacitor C22.
  • the first terminal of the transistor Tr01 of the driving unit DRV is electrically connected to the first terminal of the switch S59 and the wiring VDDL.
  • the second terminal of the switch S59 is the first terminal of the capacitor C22 and the switch S60. Are electrically connected to the first terminal.
  • the second terminal of the capacitive element C22 is electrically connected to the gate of the transistor Tr01 and the first terminal of the switch S61.
  • the second terminal of the transistor Tr01 is the second terminal of the switch S61 and the second terminal of the switch S58. One terminal is electrically connected.
  • the second terminal of the switch S58 is electrically connected to the first terminal of the transistor Tr02 of the drive unit DRV and the input terminal of the inverter circuit INV1, and the second terminal of the switch S60 is connected to the terminal inp and the transistor Tr02. And electrically connected to the gate.
  • the wirings SL58 to SL61 are electrically connected to the control terminals of the switches S58 to S61, respectively. That is, each of the switches S58 to S61 can be turned on or off by applying a predetermined voltage to each of the wirings SL58 to SL61. Note that in this specification and the like, each of the switches S58 to S61 is turned on when a high-level potential is applied to the control terminal, and is turned off when a low-level potential is applied to the control terminal. And The wirings SL58 to SL61 correspond to the wiring CL in FIG.
  • the switch S58 to the switch S61 for example, an analog switch or a transistor can be applied. Further, as the switches S58 to S61, for example, mechanical switches may be applied.
  • the transistor when a transistor is used for the switch S61, the transistor is preferably an OS transistor. Since it is preferable to hold the potential of the second terminal of the capacitor C22 and the potential of the gate of the transistor Tr01 for a long time, the switch S61 is preferably an OS transistor with low off-state current. In addition, an OS transistor may be employed for switches other than the switch S61.
  • an electrical connection point between the gate of the transistor Tr01, the second terminal of the capacitive element C22, and the first terminal of the switch S61 is referred to as a node nd4.
  • an electrical connection point between the first terminal of the transistor Tr03, the first terminal of the capacitor C01, and the back gate of the transistor Tr02 is referred to as a node nd2.
  • the circuit BF1 included in the semiconductor device of one embodiment of the present invention is not limited to the circuit BF1 in FIG. 20A, and the circuit BF1 in FIG. 20A is changed depending on the situation. Can do.
  • a switch S58 provided between the second terminal of the transistor Tr01 and the first terminal of the transistor Tr02 is replaced with a wiring VSSL as in the circuit BF1 illustrated in FIG.
  • the second terminal of the transistor Tr02. Note that in FIG. 20B, reference numerals of the wirings CL are omitted.
  • FIG. 21 is a timing chart showing an operation example of correcting the threshold voltage of the transistor Tr01 in the circuit BF1 in FIGS. 20A and 20B. The period from time T31 to time T35 and its periphery are shown. The change in the potentials of the terminal inp, the wiring SL58 to the wiring SL61, the wiring SL01, the node nd2, and the node nd4 at the time of FIG.
  • the voltage VSS given by the wiring VSSL is described as 0 V as an example.
  • the circuit BF1 is initialized in the operation of correcting the threshold voltage of the transistor Tr01. Specifically, the voltage VDD is applied to the terminal inp, a high level potential is applied to the wiring SL58, the wiring SL59, and the wiring SL61, and a low level potential is applied to the wiring SL60 and the wiring SL01.
  • the switch S58, the switch S59, and the switch S61 are turned on, and the switch S60 and the transistor Tr03 are turned off.
  • VDD is input to the gate of the transistor Tr02, and thereby the transistor Tr02 is turned on.
  • the switch S59 is in an on state, a conduction state is established between the first terminal of the capacitor C22 and the wiring VDDL. As a result, the voltage between the first terminal and the second terminal of the capacitive element C22 becomes VDD.
  • 0V is input as VSS to the gate of the transistor Tr01
  • 0V is input as VSS to the second terminal of the transistor Tr01
  • VDD is input to the first terminal of the transistor Tr02.
  • the first terminal of Tr01 functions as a source
  • the second terminal of transistor Tr01 functions as a drain.
  • the transistor Tr01 since the gate-source voltage V GS of the transistor Tr01 is ⁇ VDD, the transistor Tr01 is in an on state.
  • the potential of the wiring SL58 changes to a low level potential, and the switch S58 is turned off. Accordingly, the negative charge charged in the second terminal of the capacitor C22 flows to the wiring VDDL through the portion between the first terminal and the second terminal of the transistor Tr01 until the transistor Tr01 is turned off. In other words, positive charge flows from the wiring VDDL to the second terminal of the capacitor C22 through the portion between the first terminal and the second terminal of the transistor Tr02 until the transistor Tr01 is turned off.
  • the potential of the node nd4 is gradually rises from VSS, the voltage V GS of the transistor Tr01 rises. Finally, when the voltage V GS of the transistor Tr01 reaches the threshold voltage of the transistor Tr01, the transistor Tr01 is turned off, and the potential of the node nd4 at this time is applied to the second terminal of the capacitor C22. Retained. Note that when the threshold voltage of the transistor Tr01 is Vth , the potential of the node nd4 at this time is VDD + Vth . Therefore, the voltage between the first terminal and the second terminal of the capacitive element C22 is Vth .
  • the potential of the wiring SL61 changes to a low level potential, and the switch S61 is turned off. Accordingly, the node nd4 is in an electrically floating state, and the potential of the node nd4 is held by the capacitor C22.
  • the voltage between the gate and source of the transistor Tr01 (between the first terminal and the second terminal of the capacitor C22) is set to the threshold voltage Vth of the transistor Tr01.
  • the potentials of the wiring SL58 and the wiring SL60 change to a high level potential, and the switch S58 and the switch S60 are turned on.
  • the potential of the wiring SL59 is changed to a low level potential, and the switch S59 is turned off.
  • the conductive state is established between the gate of the transistor Tr02 and the first terminal of the capacitor C22.
  • the second terminal of the transistor Tr01 and the first terminal of the transistor Tr02 are in a conductive state.
  • the second terminal of the transistor Tr02 and the wiring VSSL are connected. Is in a conductive state.
  • the transistor Tr03 since the high-level potential is applied to the wiring SL01 between the time T34 and the time 35, the transistor Tr03 is turned on. Note that this time the terminal wt, it is assumed that the potential V W corresponding to the weighting factor is input. Therefore, by the capacitor C01, a node nd2, potential V W input from the terminal wt is held. The potential V W to the back gate of the transistor Tr02 is input. Note that in this operation example, the potential VW is treated as a potential lower than 0 V as an example.
  • the potential of the wiring SL01 changes to a low level potential, so that the transistor Tr03 is turned off.
  • the potential V W of the node nd2 is capacitive element C01, is held by.
  • the circuit BF1 in FIGS. 20A and 20B performs the operation from the time T31 to the time T35 illustrated in the timing chart of FIG. 21 and after the time T35, thereby reducing the threshold voltage of the transistor Tr01 to almost zero. It can be corrected. Therefore, variation in threshold voltage of each transistor Tr01 that occurs when a plurality of circuits BF1 are manufactured can be suppressed.
  • ⁇ Configuration example 4> A configuration example different from the configuration example 3 is illustrated in FIG. 22 as the circuit BF1 having a function of correcting the threshold voltage of the transistor Tr01.
  • the correction unit COR includes a switch S51, a switch S59, a switch S60, a switch S62, and a capacitive element C22.
  • the first terminal of the switch S51 is electrically connected to the wiring VDDL, and the second terminal of the switch S51 is electrically connected to the first terminal of the transistor Tr01 of the driving unit DRV and the first terminal of the switch S59.
  • the second terminal of the switch S59 is electrically connected to the first terminal of the capacitive element C22 and the first terminal of the switch S60.
  • the second terminal of the capacitive element C22 is the gate of the transistor Tr01 and the switch S62.
  • the second terminal of the switch S62 is electrically connected to the wiring Vref2L.
  • the second terminal of the transistor Tr01 is electrically connected to the first terminal of the transistor Tr02 of the driving unit DRV and the input terminal of the inverter circuit INV1, and the second terminal of the switch S60 is connected to the gate of the transistor Tr02 and the terminal electrically connected to inp.
  • a wiring SL51, a wiring SL59, a wiring SL60, and a wiring SL62 are electrically connected to the control terminals of the switch S51, the switch S59, the switch S60, and the switch S62, respectively. That is, by applying a predetermined voltage to each of the wiring SL51, the wiring SL59, the wiring SL60, and the wiring SL62, each of the switch S51, the switch S59, the switch S60, and the switch S62 is turned on or off. be able to. Note that in this specification and the like, each of the switch S51, the switch S59, the switch S60, and the switch S62 is turned on when a high level potential is applied to the control terminal, and the low level potential is applied to the control terminal. Suppose that it is sometimes off.
  • the wiring SL51, the wiring SL59, the wiring SL60, and the wiring SL62 correspond to the wiring CL in FIG.
  • the switch S51, the switch S59, the switch S60, and the switch S62 for example, an analog switch, a transistor, or the like can be applied. Further, as the switch S51, the switch S59, the switch S60, and the switch S62, for example, a mechanical switch may be applied.
  • the transistor when a transistor is used for the switch S62, the transistor is preferably an OS transistor. Since it is preferable to hold the potential of the second terminal of the capacitor C22 and the potential of the gate of the transistor Tr01 for a long time, the switch S62 is preferably an OS transistor with low off-state current. In addition, an OS transistor may be employed for switches other than the switch S62.
  • Wiring Vref2L is a wiring for applying a predetermined constant voltage V ref2.
  • the constant voltage is preferably a potential lower than VDD, and more preferably a potential at which V ref2 ⁇ VDD is lower than the threshold voltage of the transistor Tr01.
  • V ref2 may be a ground potential.
  • an electrical connection point between the gate of the transistor Tr01, the second terminal of the capacitor C22, and the first terminal of the switch S62 is referred to as a node nd4, the second terminal of the switch S51, and the first terminal of the switch S59.
  • An electrical connection point between the terminal and the first terminal of the transistor Tr01 is referred to as a node nd5.
  • an electrical connection point between the first terminal of the transistor Tr03, the first terminal of the capacitor C01, and the back gate of the transistor Tr02 is referred to as a node nd2.
  • FIG. 23 is a timing chart showing an example of the operation of correcting the threshold voltage of the transistor Tr01 in the circuit BF1 of FIG. 22, and the terminal inp between time T41 and time T45 and the time around it.
  • changes in potentials of the wiring SL51, the wiring SL59, the wiring SL60, the wiring SL62, the wiring SL01, the node nd2, and the node nd4 are shown.
  • the voltage VSS given by the wiring VSSL is described as 0 V as an example.
  • the circuit BF1 is initialized in the operation of correcting the threshold voltage of the transistor Tr01. Specifically, the voltage VDD is applied to the terminal inp, a high level potential is applied to the wiring SL51, the wiring SL59, and the wiring SL62, and a low level potential is applied to the wiring SL60 and the wiring SL01.
  • the switch S51, the switch S59, and the switch S62 are turned on, and the switch S60 and the transistor Tr03 are turned off.
  • VDD is input to the gate of the transistor Tr02, and thereby the transistor Tr02 is turned on.
  • the switch S62 since the switch S62 is in an on state, the conductive state is established between the wiring Vref2L and the second terminal of the capacitor C22 and between the wiring Vref2L and the gate of the transistor Tr01. As a result, the potential of the node nd4 becomes V ref2 .
  • the switch S51 and the switch S59 are in the on state, the conductive state is established between the wiring VDDL and the first terminal of the capacitor C22. As a result, the voltage between the first terminal and the second terminal of the capacitive element C22 becomes VDD ⁇ V ref2 .
  • the transistor Tr02 since the transistor Tr02 is in an on state, the conductive state is established between the wiring VSSL and the second terminal of the transistor Tr01.
  • V ref2 is input to the gate of the transistor Tr01
  • 0 V is input as VSS to the second terminal of the transistor Tr01
  • VDD is input to the first terminal of the transistor Tr02.
  • the first terminal of the transistor Tr01 functions as a source
  • the second terminal of the transistor Tr01 functions as a drain.
  • the transistor Tr01 since the gate-source voltage V GS of the transistor Tr01 is V ref2 ⁇ VDD, the transistor Tr01 is in an on state.
  • the potential of the wiring SL51 changes to a low level potential, and the switch S51 is turned off.
  • the positive charge charged in the first terminal of the capacitor C22 flows to the wiring VSSL via the portion between the first terminal and the second terminal of the transistor Tr01 until the transistor Tr01 is turned off.
  • the first of the capacitor C22 is connected from the wiring VSSL through the first terminal to the second terminal of the transistor Tr02 and the first terminal to the second terminal of the transistor Tr01. Negative charge flows through the terminal.
  • the potential of the node nd5 is gradually decreased from VDD, the voltage V GS of the transistor Tr01 rises. Finally, when the voltage V GS of the transistor Tr01 reaches the threshold voltage of the transistor Tr01, the transistor Tr01 is turned off, so that the potential of the node nd5 at this time is applied to the first terminal of the capacitor C22. Retained. Incidentally, when the threshold voltage of the transistor Tr01 and V th, the potential of the node nd5 at this time is V ref2 -V th. Therefore, the voltage between the first terminal and the second terminal of the capacitive element C22 is Vth .
  • the potential of the wiring SL62 changes to a low level potential, and the switch S62 is turned off.
  • the node nd4 becomes electrically floating, and the potential of the node nd4 is held by the second terminal of the capacitor C22.
  • the voltage between the gate and source of the transistor Tr01 (between the first terminal and the second terminal of the capacitor C22) is set to the threshold voltage Vth of the transistor Tr01.
  • the potentials of the wiring SL51 and the wiring SL60 change to a high level potential, and the switch S51 and the switch S60 are turned on.
  • the potential of the wiring SL59 is changed to a low level potential, and the switch S59 is turned off.
  • the terminal inp and the first terminal of the capacitive element C22 become conductive.
  • the first terminal of the transistor Tr01 and the wiring VDDL are in a conductive state.
  • the transistor Tr03 since the high-level potential is applied to the wiring SL01 between the time T44 and the time 45, the transistor Tr03 is turned on. Note that this time the terminal wt, it is assumed that the potential V W corresponding to the weighting factor is input. Therefore, by the capacitor C01, a node nd2, potential V W input from the terminal wt is held. The potential V W to the back gate of the transistor Tr02 is input. Note that in this operation example, the potential VW is treated as a potential lower than 0 V as an example.
  • the potential of the wiring SL01 changes to a low level potential, so that the transistor Tr03 is turned off.
  • the potential V W of the node nd2 is capacitive element C01, is held by.
  • the circuit BF1 in FIG. 22 can correct the threshold voltage of the transistor Tr01 to almost zero by performing the operation from time T41 to time T45 and after time T45 shown in the timing chart of FIG. Therefore, variation in threshold voltage of each transistor Tr01 that occurs when a plurality of circuits BF1 are manufactured can be suppressed.
  • the circuit BF1 has a function of correcting the threshold voltage of the transistor Tr02.
  • the circuit BF1 has a function of correcting the threshold voltage of the transistor Tr01.
  • the circuit BF1 having a function of correcting the threshold voltages of the transistors Tr01 and Tr02 can be configured.
  • FIG. 24 illustrates an example of a configuration in which the circuit BF1 illustrated in FIG. 16A described in the configuration example 1 and the circuit BF1 illustrated in FIG. 20A described in the configuration example 3 are combined.
  • the switch S58 of the circuit BF1 illustrated in FIG. 24 can function as an alternative to the switch S51 of the correction unit COR of the circuit BF1 of FIG. That is, the circuit BF1 in FIG. 24 is configured such that the switch S51 included in the circuit BF1 in FIG. 16A and the switch S58 included in the circuit BF1 in FIG. Yes.
  • the circuit BF1 in FIG. 24 to the circuit MPC in the above embodiment, the threshold voltages of the transistors Tr01 and Tr02 included in the circuit BF1 can be corrected.
  • the wirings SL52 to SL54 and the wirings SL58 to SL61 correspond to the wiring CL in FIG. 15A (the reference numerals of the wiring CL are not shown in FIG. 24).
  • FIG. 25 illustrates an example of a configuration in which the circuit BF1 illustrated in FIG. 18 described in Configuration Example 2 and the circuit BF1 illustrated in FIG. 20A described in Configuration Example 3 are combined.
  • the circuit BF1 illustrated in FIG. 25 to the circuit MPC of the above embodiment, the threshold voltages of the transistors Tr01 and Tr02 included in the circuit BF1 can be corrected.
  • the wirings SL54 to SL61 correspond to the wiring CL in FIG. 15A (the reference numerals of the wirings CL are not illustrated in FIG. 25).
  • FIG. 26 illustrates an example of a configuration in which the circuit BF1 illustrated in FIG. 16B described in the configuration example 1 and the circuit BF1 illustrated in FIG. 22 described in the configuration example 4 are combined.
  • the switch S51 included in the circuit BF1 in FIG. 16B and the switch S51 included in the circuit BF1 in FIG. 22 are configured by the same switch.
  • the threshold voltages of the transistors Tr01 and Tr02 included in the circuit BF1 can be corrected.
  • the wirings SL51 to SL54, the wiring SL59, the wiring SL60, and the wiring SL62 correspond to the wiring CL in FIG. 15A (the reference numerals of the wiring CL are not illustrated in FIG. 26).
  • FIG. 27 shows an example of a configuration in which the circuit BF1 of FIG. 18 described in the configuration example 2 and the circuit BF1 of FIG. 22 described in the configuration example 4 are combined.
  • the circuit BF1 illustrated in FIG. 27 to the circuit MPC of the above embodiment, the threshold voltages of the transistors Tr01 and Tr02 included in the circuit BF1 can be corrected.
  • the wiring SL51, the wiring SL53 to the wiring SL60, and the wiring SL62 correspond to the wiring CL in FIG. 15A (the reference numerals of the wiring CL are not shown in FIG. 27).
  • Configuration Example 1 to Configuration Example 4 can be combined with the inverter circuit DINV1 described in Embodiment 3.
  • the circuit BF1 illustrated in FIG. 28 is configured by combining the circuit BF1 illustrated in FIG. 16A described in Configuration Example 1 and the inverter circuit DINV1 illustrated in FIG. 12B described in Embodiment 3. be able to.
  • a circuit BF1 illustrated in FIG. 28 has a configuration in which the holding unit HCA in FIG. 16A is replaced with a circuit in which the holding unit HCB in FIG. 12B and the transistor Tr03 are combined.
  • the output terminal of the inverter circuit SINV1 is electrically connected to the input terminal of the inverter circuit SINV2, and the output terminal of the inverter circuit SINV2 is the second terminal of the switch S54, the input terminal of the inverter circuit SINV1, and the transistor
  • the first terminal of Tr03 is electrically connected, and the second terminal of transistor Tr03 is electrically connected to terminal wt.
  • the transistor Tr03 functions as a switching element for holding a potential corresponding to the weighting factor input from the terminal wt. Note that in some cases, the transistor Tr03 is not necessarily provided in the inverter circuit DINV1 in FIG. 28 like the inverter circuit DINV1 in FIG.
  • FIG. 28 shows a circuit in which the holding unit HCA in FIG. 16A is combined with the holding unit HCB in FIG. 12B and the transistor Tr03.
  • the included HCA may be a circuit in which the holding unit HCB in FIG. 12B and the transistor Tr03 are combined (see FIG. 29).
  • the circuit BF1 illustrated in FIG. 30 has a circuit configuration that can hold two weighting coefficients and switch the weighting coefficients depending on the situation, similarly to the circuit BF1 in FIG. 14A of the third embodiment. It has become.
  • the driver DRV included in the circuit BF1 in FIG. 30 includes a transistor Tr02a in the driver DRV of the circuit BF1 in FIG. It has an added configuration.
  • the inverter circuit DINV1 includes a correction unit CORa having a circuit configuration similar to that of the correction unit COR in order to correct the threshold voltage of the transistor Tr02a. Further, since the inverter circuit DINV1 holds two potentials according to the weighting coefficient, the holding unit HCA1 and the holding unit HCA2 have the same circuit configuration as the holding unit HCA included in the inverter circuit DINV1 of FIG. And have.
  • the circuit elements included in the holding unit HCA1 are indicated by the same reference numerals as the circuit elements included in the holding unit HCA of the inverter circuit DINV1 in FIG.
  • “a” is added to the reference numeral of the circuit element included in the holding unit HCA of the inverter circuit DINV1 in FIG. As shown.
  • circuit elements included in the correction unit CORa are also denoted by “a” in order to distinguish them from the circuit elements included in the correction unit CORa.
  • parentheses indicating components and reference numerals in parentheses are omitted, the circuit BF1 in FIG. 30 can also be applied to the circuit BF2.
  • the second terminal of the transistor Tr01 is electrically connected to the first terminal of the switch S05, the first terminal of the switch S05a, and the input terminal of the inverter circuit INV1.
  • the second terminal of the switch S05 is electrically connected to the first terminal of the switch S51 of the correction unit COR, and the second terminal of the switch S05a is electrically connected to the first terminal of the switch S51a of the correction unit CORa.
  • the switch S51 and the switch S51a have a function of selecting a weighting coefficient held in each of the holding unit HCA1 and the holding unit HCA2.
  • the switch S05 when the weighting coefficient held in the holding unit HCA1 is used, the switch S05 is turned on and the switch S05a is turned off, and when the weighting factor held in the holding unit HCA2 is used, the switch S05 is turned off. S05a may be turned on. Note that when the threshold voltages of the transistors Tr02 and Tr02a are corrected, the switches S51 and S51a can be turned on simultaneously.
  • the control terminal of the switch S51a is electrically connected to the wiring SL51
  • the control terminal of the switch S52a is electrically connected to the wiring SL52
  • the control terminal of the switch S53a is electrically connected to the wiring SL53
  • the switch S54a The control terminal is electrically connected to the wiring SL54. That is, since the switching operations of the switches S51a to S54a of the correction unit CORa operate in the same manner as the switches S51 to S54 of the correction unit COR, the threshold voltage of the transistor Tr02a is corrected by the threshold of the transistor Tr02. It can be performed simultaneously with the correction of the value voltage.
  • ⁇ Configuration example 7> Although the circuit configuration BF1 described in Configuration Examples 1 to 6 has been described with reference to the circuit configuration applicable to the circuit BF1 in FIG. 15A, the driver DRV and / or the inverter described in Configuration Examples 1 to 6 is used.
  • the circuit INV1 may be replaced with a logic circuit LGC1 and a logic circuit LGC2 each having a function of an inverter circuit as in the configuration example of the circuit BF1 in FIG.
  • FIG. 31A shows a circuit configuration in which the driver DRV and the inverter circuit INV1 shown in FIG. 16A described in the configuration example 1 are replaced with the logic circuit LGC1 and the logic circuit LGC2, respectively.
  • the logic circuit LGC1 has a NAND circuit configuration as an example.
  • the logic circuit LGC1 includes a transistor Tr01, a transistor Tr02, a transistor Tr41, and a transistor Tr42, and a NAND circuit is configured by these transistors.
  • the first terminal of the transistor Tr01 is electrically connected to the wiring VDDL
  • the second terminal of the transistor Tr01 is electrically connected to the first terminal of the transistor Tr41 and the input terminal of the logic circuit LGC2.
  • the gate of the transistor Tr01 is electrically connected to the terminal inp and the gate of the transistor Tr02.
  • the second terminal of the transistor Tr41 is electrically connected to the first terminal of the switch S51
  • the gate of the transistor Tr41 is electrically connected to the gate of the transistor Tr42 and the wiring VAL.
  • the first terminal of the transistor Tr42 is electrically connected to the wiring VDDL, and the second terminal of the transistor Tr42 is electrically connected to the input terminal of the logic circuit LGC2.
  • the second terminal of the switch S51 is electrically connected to the first terminal of the transistor Tr02.
  • the wiring VAL functions as a wiring for supplying a constant voltage.
  • the constant voltage is preferably a high level potential.
  • the logic circuit LGC1 in FIG. 31A can function as an inverter circuit.
  • connection configuration around the transistor Tr02 included in the circuit BF1 in FIG. 31A is the same as the connection configuration around the transistor Tr02 in the circuit BF1 in FIG. That is, the circuit BF1 in FIG. 31A can correct the threshold voltage of the transistor Tr02 included in the logic circuit LGC1 as in the circuit BF1 in FIG.
  • the logic circuit LGC1 is configured as a NAND circuit, but may be configured as a NOR circuit.
  • the circuit BF1 in FIG. 31B has a configuration in which the logic circuit LGC1 is a NOR circuit.
  • the logic circuit LGC1 includes a transistor Tr01, a transistor Tr02, a transistor Tr43, and a transistor Tr44, and these transistors constitute a NOR circuit.
  • the first terminal of the transistor Tr01 is electrically connected to the wiring VDDL
  • the second terminal of the transistor Tr01 is electrically connected to the first terminal of the transistor Tr43
  • the gate of the transistor Tr01 is connected to the terminal inp.
  • the transistor Tr02 is electrically connected to the gate.
  • the second terminal of the transistor Tr43 is electrically connected to the first terminal of the switch S51, the input terminal of the logic circuit LGC2, and the first terminal of the transistor Tr44.
  • the gate of the transistor Tr43 is connected to the gate of the transistor Tr44 and the wiring Is electrically connected to VBL.
  • the first terminal of the transistor Tr02 is electrically connected to the second terminal of the switch S51, and the second terminal of the transistor Tr02 is electrically connected to the second terminal of the transistor Tr44.
  • the second terminal of the switch S51 is electrically connected to the first terminal of the transistor Tr02.
  • the wiring VBL functions as a wiring for supplying a constant voltage.
  • the constant voltage is preferably a low level potential.
  • the logic circuit LGC1 in FIG. 31B can function as an inverter circuit.
  • connection configuration around the transistor Tr02 included in the circuit BF1 in FIG. 31B is the same as the connection configuration around the transistor Tr02 in the circuit BF1 in FIG. That is, the circuit BF1 in FIG. 31B can correct the threshold voltage of the transistor Tr02 included in the logic circuit LGC1 as in the circuit BF1 in FIG.
  • the driver DRV and / or the inverter circuit INV1 in FIG. 15A are replaced with the logic circuit LGC1 and the logic circuit LGC2 having the function of an inverter circuit as in the configuration example of the circuit BF1 in FIG. Even if the circuit is replaced, the circuit BF1 in FIG. 15B can have a function similar to that of the circuit BF1 in FIG. Therefore, the inverter circuit DINV1 (inverter circuit DINV2) (strictly, the drive unit DRV having a function of an inverter circuit) and / or the inverter circuit INV1 (inverter circuit INV2) described in this specification and the like are NAND It can be configured as a logic circuit such as a circuit or a NOR circuit.
  • the inverter circuit DINV1 (inverter circuit DINV2) (drive unit DRV having a function of an inverter circuit) and / or the inverter circuit INV1 (inverter circuit INV2) is a logic circuit that combines a NAND circuit, a NOR circuit, an XOR circuit, and the like. Also good.
  • a circuit MPC illustrated in FIG. 32A includes the circuit BF1 in FIG. 16 and a circuit BF2 having a structure similar to that of the circuit BF1.
  • the correction unit COR is illustrated in each of the inverter circuit DINV1 and the inverter circuit DINV2 included in the circuit MPC.
  • the wiring SL51 to the wiring SL54 can be electrically connected to each correction unit COR.
  • the transistors Tr02 in the inverter circuit DINV1 and the inverter circuit DINV2 are included. (Not shown) can be simultaneously corrected.
  • the wirings SL51 to SL54 are collectively shown as a wiring CL.
  • the wiring CL can extend in the column direction.
  • the wiring CL may extend in the row direction.
  • part of the wirings SL51 to SL54 may extend in the column direction, and the rest may extend in the row direction (not shown).
  • 32A and 32B illustrate a circuit configuration in which the circuit BF1 (circuit BF2) in FIG. 16A of Configuration Example 1 is applied to the circuit MPC, the wirings SL51 to SL54 are used as the wiring CL.
  • a wiring corresponding to the wiring CL may be different from the wiring SL51 to the wiring SL54.
  • the wiring SL51 and the wirings SL59 to SL61 correspond to the wiring CL, and for example, FIG.
  • the 26 circuit BF1 (circuit BF2) is applied to the circuit MPC, the wirings SL51 to SL54, the wiring SL59, the wiring SL60, and the wiring SL62 correspond to the wiring CL.
  • the terminal wt that is electrically connected to the inverter circuit DINV1 is electrically connected to the wiring DL
  • the terminal wt that is electrically connected to the inverter circuit DINV2 is electrically connected to the wiring DLm.
  • the wiring SL01 that is electrically connected to the inverter circuit DINV1 and the inverter circuit DINV2 is electrically connected to the wiring SWL.
  • the wiring DL and / or the wiring DLm can extend in the column direction as an example.
  • the wiring SWL can extend in the row direction as an example. Note that the direction in which the wiring DL, the wiring DLm, and the wiring SWL of the circuit MPC illustrated in FIGS. 32A and 32B are extended is the wiring DL, the wiring DLm, and the wiring that are connected to the circuit MPC illustrated in FIG. This is the same as the direction in which SWL is extended.
  • the wiring DL extends in the column direction
  • the wiring SWL and the wiring SWLm extend in the row direction. It can be configured.
  • the terminal MP and the terminal wtm are electrically connected to the wiring DL
  • the wiring SL01 of the inverter circuit DINV1 is electrically connected to the wiring SWL
  • the inverter circuit DINV2 The wiring SL01 may be electrically connected to the wiring SWLm (not shown). Note that the description of FIG. 11 is referred to for the detailed connection configuration.
  • FIG. 33 shows a configuration example of an arithmetic circuit in which the circuit MPC of FIG. 32A is arranged in a matrix.
  • the arithmetic circuit 140 has a configuration in which the circuit MPD in FIG. 32A is applied and the circuit COD is separately provided in the configuration of the arithmetic circuit 120 in FIG. 9 described in the second embodiment. Therefore, the description in Embodiment 2 is referred to for the circuit AFP including the plurality of circuits ACTF, the circuit TSG, the circuit WLD, the circuit SWLD, and the conversion circuit TRF illustrated in FIG.
  • the array unit ALP has n ⁇ m circuit MPCs similarly to the arithmetic circuit 120 of FIG. 9, and the circuits MPC are arranged in a matrix of n rows and m columns in the array unit ALP.
  • a circuit MPC located in j rows and i columns (where j is an integer of 1 to n and i is an integer of 1 to m) is represented by a circuit MPC [j, i].
  • FIG. 33 only the circuit MPC [1,1], the circuit MPC [1, m], the circuit MPC [n, 1], and the circuit MPC [n, m] are illustrated, and the other circuit MPC is illustrated. The illustration is omitted.
  • the terminal ct is illustrated in each of the circuit MPC [1,1] to the circuit MPC [n, m].
  • the terminal ct functions as a terminal for supplying a signal to the correction circuit COR of the inverter circuit DINV1 and the inverter circuit DINV2 included in each of the circuits MPC [1,1] to MPC [n, m].
  • Each terminal ct of the circuit MPC [1, i] to the circuit MPC [n, i] is electrically connected to the wiring CL [i].
  • the wiring CL [i] corresponds to the wiring CL in Structural Examples 1 to 7, and FIG. 33 illustrates the wiring CL [1] and the wiring CL [m].
  • the circuit COD includes a wiring CL [1] to a wiring for operating the correction unit COR of the inverter circuit DINV1 and the inverter circuit DINV2 included in each of the circuits MPC [1,1] to MPC [n, m]. It has a function of giving a predetermined signal to CL [m]. As described in the operation example of FIG. 16A, the circuit COD supplies a predetermined signal to the wirings SL51 to SL54 included in the wirings CL [1] to CL [m], respectively. The threshold voltage of the transistor Tr02 of the inverter circuit DINV1 and the inverter circuit DINV2 included in each of the MPC [1,1] to the circuit MPC [n, m] can be corrected.
  • the semiconductor device illustrated in FIG. 34 includes a transistor 300, a transistor 500, and a capacitor 600.
  • 36A is a cross-sectional view of the transistor 500 in the channel length direction
  • FIG. 36B is a cross-sectional view of the transistor 500 in the channel width direction
  • FIG. 36C is a cross-sectional view of the transistor 300 in the channel width direction.
  • the transistor 500 is a transistor (OS transistor) having a metal oxide in a channel formation region. Since the transistor 500 has a small off-state current, data used for a long time can be held by using the transistor 500 for a semiconductor device, particularly the transistor Tr03 of the arithmetic circuit 110. That is, since the frequency of the refresh operation is low or the refresh operation is not required, the power consumption of the semiconductor device can be reduced.
  • OS transistor OS transistor
  • the semiconductor device described in this embodiment includes a transistor 300, a transistor 500, and a capacitor 600 as illustrated in FIG.
  • the transistor 500 is provided above the transistor 300
  • the capacitor 600 is provided above the transistor 300 and the transistor 500.
  • the capacitor 600 can be the capacitor C01 in the circuit BF1.
  • the transistor 300 includes a conductor 316, an insulator 315, a semiconductor region 313 including a part of the substrate 311, a low resistance region 314a functioning as a source region or a drain region, and a low resistance region 314b. . Note that the transistor 300 can be used as the transistor in the above embodiment, for example.
  • the upper surface of the semiconductor region 313 and the side surface in the channel width direction are covered with the conductor 316 with the insulator 315 interposed therebetween.
  • an effective channel width is increased, whereby the on-state characteristics of the transistor 300 can be improved.
  • the contribution of the electric field of the gate electrode can be increased, off characteristics of the transistor 300 can be improved.
  • the transistor 300 may be either a p-channel type or an n-channel type.
  • the region in which the channel of the semiconductor region 313 is formed, the region in the vicinity thereof, the low resistance region 314a that serves as the source region or the drain region, the low resistance region 314b, and the like preferably include a semiconductor such as a silicon-based semiconductor. It preferably contains crystalline silicon. Alternatively, a material containing Ge (germanium), SiGe (silicon germanium), GaAs (gallium arsenide), GaAlAs (gallium aluminum arsenide), or the like may be used. A structure using silicon in which effective mass is controlled by applying stress to the crystal lattice and changing the lattice spacing may be employed. Alternatively, the transistor 300 may be a HEMT (High Electron Mobility Transistor) by using GaAs, GaAlAs, or the like.
  • HEMT High Electron Mobility Transistor
  • the low-resistance region 314a and the low-resistance region 314b provide an n-type conductivity element such as arsenic or phosphorus, or p-type conductivity such as boron, in addition to the semiconductor material used for the semiconductor region 313. Containing elements.
  • the conductor 316 functioning as a gate electrode includes a semiconductor material such as silicon, a metal material, an alloy containing an element imparting n-type conductivity such as arsenic or phosphorus, or an element imparting p-type conductivity such as boron.
  • a conductive material such as a material or a metal oxide material can be used.
  • the threshold voltage of the transistor can be adjusted by selecting the material of the conductor. Specifically, it is preferable to use a material such as titanium nitride or tantalum nitride for the conductor. Further, in order to achieve both conductivity and embeddability, it is preferable to use a metal material such as tungsten or aluminum as a laminate for the conductor, and tungsten is particularly preferable from the viewpoint of heat resistance.
  • the transistor 300 illustrated in FIGS. 34A and 34B is an example and is not limited to the structure, and an appropriate transistor may be used depending on a circuit configuration or a driving method.
  • the structure of the transistor 300 may be similar to that of the transistor 500 including an oxide semiconductor as illustrated in FIG. Note that details of the transistor 500 will be described later.
  • An insulator 320, an insulator 322, an insulator 324, and an insulator 326 are stacked in this order so as to cover the transistor 300.
  • the insulator 320, the insulator 322, the insulator 324, and the insulator 326 for example, silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, aluminum oxide, aluminum oxynitride, aluminum nitride oxide, aluminum nitride, or the like is used. That's fine.
  • silicon oxynitride refers to a material having a higher oxygen content than nitrogen as its composition
  • silicon nitride oxide refers to a material having a higher nitrogen content than oxygen as its composition.
  • aluminum oxynitride refers to a material having a higher oxygen content than nitrogen as its composition
  • aluminum nitride oxide refers to a material having a higher nitrogen content than oxygen as its composition.
  • the insulator 322 may have a function as a planarization film that planarizes a step generated by the transistor 300 or the like provided thereunder.
  • the upper surface of the insulator 322 may be planarized by a planarization process using a chemical mechanical polishing (CMP) method or the like to improve planarity.
  • CMP chemical mechanical polishing
  • the insulator 324 is preferably formed using a film having a barrier property such that hydrogen and impurities do not diffuse from the substrate 311 or the transistor 300 into a region where the transistor 500 is provided.
  • a film having a barrier property against hydrogen for example, silicon nitride formed by a CVD method can be used.
  • silicon nitride formed by a CVD method when hydrogen diffuses into a semiconductor element including an oxide semiconductor such as the transistor 500, characteristics of the semiconductor element may be deteriorated. Therefore, a film for suppressing hydrogen diffusion is preferably used between the transistor 500 and the transistor 300.
  • the film that suppresses the diffusion of hydrogen is a film with a small amount of hydrogen desorption.
  • the amount of desorption of hydrogen can be analyzed using, for example, a temperature programmed desorption gas analysis method (TDS).
  • TDS temperature programmed desorption gas analysis method
  • the amount of hydrogen desorbed from the insulator 324 is calculated by converting the amount of desorption converted to hydrogen atoms per area of the insulator 324 in the range of the surface temperature of the film from 50 ° C. to 500 ° C. in TDS analysis. 10 ⁇ 10 15 atoms / cm 2 or less, preferably 5 ⁇ 10 15 atoms / cm 2 or less.
  • the insulator 326 preferably has a lower dielectric constant than the insulator 324.
  • the dielectric constant of the insulator 326 is preferably less than 4, and more preferably less than 3.
  • the relative dielectric constant of the insulator 326 is preferably equal to or less than 0.7 times, more preferably equal to or less than 0.6 times that of the insulator 324.
  • the insulator 320, the insulator 322, the insulator 324, and the insulator 326 are embedded with the capacitor 600 or the conductor 328 connected to the transistor 500, the conductor 330, and the like.
  • the conductor 328 and the conductor 330 function as plugs or wirings.
  • a conductor having a function as a plug or a wiring may be given the same reference numeral by collecting a plurality of structures.
  • the wiring and the plug connected to the wiring may be integrated. That is, a part of the conductor may function as a wiring, and a part of the conductor may function as a plug.
  • a conductive material such as a metal material, an alloy material, a metal nitride material, or a metal oxide material is used as a single layer or a stacked layer. be able to. It is preferable to use a high melting point material such as tungsten or molybdenum that has both heat resistance and conductivity, and it is preferable to use tungsten. Or it is preferable to form with low resistance conductive materials, such as aluminum and copper. Wiring resistance can be lowered by using a low-resistance conductive material.
  • a wiring layer may be provided over the insulator 326 and the conductor 330.
  • an insulator 350, an insulator 352, and an insulator 354 are sequentially stacked.
  • a conductor 356 is formed in the insulator 350, the insulator 352, and the insulator 354.
  • the conductor 356 functions as a plug connected to the transistor 300 or a wiring. Note that the conductor 356 can be provided using a material similar to that of the conductor 328 and the conductor 330.
  • the insulator 350 is preferably an insulator having a barrier property against hydrogen, similarly to the insulator 324.
  • the conductor 356 preferably includes a conductor having a barrier property against hydrogen.
  • a conductor having a barrier property against hydrogen is formed in an opening portion of the insulator 350 having a barrier property against hydrogen.
  • tantalum nitride may be used as the conductor having a barrier property against hydrogen. Further, by stacking tantalum nitride and tungsten having high conductivity, diffusion of hydrogen from the transistor 300 can be suppressed while maintaining conductivity as a wiring. In this case, it is preferable that the tantalum nitride layer having a barrier property against hydrogen be in contact with the insulator 350 having a barrier property against hydrogen.
  • a wiring layer may be provided over the insulator 354 and the conductor 356.
  • an insulator 360, an insulator 362, and an insulator 364 are sequentially stacked.
  • a conductor 366 is formed in the insulator 360, the insulator 362, and the insulator 364.
  • the conductor 366 functions as a plug or a wiring. Note that the conductor 366 can be provided using a material similar to that of the conductor 328 and the conductor 330.
  • an insulator having a barrier property against hydrogen is preferably used as the insulator 360.
  • the conductor 366 preferably includes a conductor having a barrier property against hydrogen.
  • a conductor having a barrier property against hydrogen is formed in an opening of the insulator 360 having a barrier property against hydrogen.
  • a wiring layer may be provided over the insulator 364 and the conductor 366.
  • an insulator 370, an insulator 372, and an insulator 374 are sequentially stacked.
  • a conductor 376 is formed in the insulator 370, the insulator 372, and the insulator 374.
  • the conductor 376 functions as a plug or a wiring. Note that the conductor 376 can be provided using a material similar to that of the conductor 328 and the conductor 330.
  • the insulator 370 is preferably an insulator having a barrier property against hydrogen, similarly to the insulator 324.
  • the conductor 376 preferably includes a conductor having a barrier property against hydrogen.
  • a conductor having a barrier property against hydrogen is formed in an opening portion of the insulator 370 having a barrier property against hydrogen.
  • a wiring layer may be provided over the insulator 374 and the conductor 376.
  • an insulator 380, an insulator 382, and an insulator 384 are sequentially stacked.
  • a conductor 386 is formed over the insulator 380, the insulator 382, and the insulator 384.
  • the conductor 386 has a function as a plug or a wiring. Note that the conductor 386 can be provided using a material similar to that of the conductor 328 and the conductor 330.
  • an insulator having a barrier property against hydrogen is preferably used as the insulator 380.
  • the conductor 386 preferably includes a conductor having a barrier property against hydrogen.
  • a conductor having a barrier property against hydrogen is formed in an opening portion of the insulator 380 having a barrier property against hydrogen.
  • the semiconductor device has been described above, the semiconductor device according to this embodiment It is not limited to this.
  • the number of wiring layers similar to the wiring layer including the conductor 356 may be three or less, or the number of wiring layers similar to the wiring layer including the conductor 356 may be five or more.
  • an insulator 510, an insulator 512, an insulator 514, and an insulator 516 are sequentially stacked.
  • Any of the insulator 510, the insulator 512, the insulator 514, and the insulator 516 is preferably formed using a substance having a barrier property against oxygen or hydrogen.
  • a film having a barrier property so that hydrogen and impurities do not diffuse from a region where the substrate 311 or the transistor 300 is provided to a region where the transistor 500 is provided for example.
  • a material similar to that of the insulator 324 can be used.
  • silicon nitride formed by a CVD method can be used as an example of a film having a barrier property against hydrogen.
  • silicon nitride formed by a CVD method when hydrogen diffuses into a semiconductor element including an oxide semiconductor such as the transistor 500, characteristics of the semiconductor element may be deteriorated. Therefore, a film for suppressing hydrogen diffusion is preferably used between the transistor 500 and the transistor 300.
  • the film that suppresses the diffusion of hydrogen is a film with a small amount of hydrogen desorption.
  • a metal oxide such as aluminum oxide, hafnium oxide, or tantalum oxide is preferably used for the insulator 510 and the insulator 514.
  • aluminum oxide has a high blocking effect that prevents the film from permeating both oxygen and impurities such as hydrogen and moisture, which cause fluctuations in the electrical characteristics of the transistor. Therefore, aluminum oxide can prevent impurities such as hydrogen and moisture from entering the transistor 500 during and after the manufacturing process of the transistor. In addition, release of oxygen from the oxide included in the transistor 500 can be suppressed. Therefore, it is suitable for use as a protective film for the transistor 500.
  • the insulator 512 and the insulator 516 can be formed using the same material as the insulator 320.
  • a material having a relatively low dielectric constant to these insulators, parasitic capacitance generated between wirings can be reduced.
  • a silicon oxide film, a silicon oxynitride film, or the like can be used as the insulator 512 and the insulator 516.
  • a conductor 518 In the insulator 510, the insulator 512, the insulator 514, and the insulator 516, a conductor 518, a conductor included in the transistor 500 (eg, the conductor 503), and the like are embedded. Note that the conductor 518 functions as a plug or a wiring connected to the capacitor 600 or the transistor 300.
  • the conductor 518 can be provided using a material similar to that of the conductor 328 and the conductor 330.
  • the insulator 510 and the conductor 518 in a region in contact with the insulator 514 are preferably conductors having a barrier property against oxygen, hydrogen, and water.
  • the transistor 300 and the transistor 500 can be separated by a layer having a barrier property against oxygen, hydrogen, and water, and diffusion of hydrogen from the transistor 300 to the transistor 500 can be suppressed.
  • a transistor 500 is provided above the insulator 516.
  • the transistor 500 is provided over the insulator 514 and the insulator 516 and the conductor 503 which is embedded in the insulator 514 and the insulator 516.
  • the oxide 530b is disposed over the conductor 542a, the conductor 542b and the conductor 542b are spaced apart from each other over the oxide 530b, and the conductor 542a and the conductor 542b are disposed over the conductor 542a and the conductor 542b.
  • the insulator 544 is preferably provided between the oxide 530a, the oxide 530b, the conductor 542a, the conductor 542b, and the insulator 580.
  • the conductor 560 includes a conductor 560a provided inside the insulator 550 and a conductor 560b provided so as to be embedded inside the conductor 560a. It is preferable to have. 36A and 36B, an insulator 574 is preferably provided over the insulator 580, the conductor 560, and the insulator 550.
  • oxide 530a the oxide 530b, and the oxide 530c may be collectively referred to as an oxide 530.
  • the transistor 500 a structure in which three layers of the oxide 530a, the oxide 530b, and the oxide 530c are stacked in the vicinity of the region where the channel is formed is described; however, the present invention is not limited thereto. It is not a thing. For example, a single layer of the oxide 530b, a two-layer structure of the oxide 530b and the oxide 530a, a two-layer structure of the oxide 530b and the oxide 530c, or a stacked structure of four or more layers may be provided.
  • the conductor 560 is illustrated as a two-layer structure; however, the present invention is not limited to this.
  • the conductor 560 may have a single-layer structure or a stacked structure including three or more layers.
  • the transistor 500 illustrated in FIGS. 34A, 34B, 36A, and 36B is an example, and is not limited to the structure, and an appropriate transistor may be used depending on a circuit configuration or a driving method.
  • the conductor 560 functions as a gate electrode of the transistor, and the conductor 542a and the conductor 542b function as a source electrode or a drain electrode, respectively.
  • the conductor 560 is formed so as to be embedded in the opening of the insulator 580 and the region sandwiched between the conductors 542a and 542b.
  • the arrangement of the conductor 560, the conductor 542a, and the conductor 542b is selected in a self-aligned manner with respect to the opening of the insulator 580. That is, in the transistor 500, the gate electrode can be disposed in a self-aligned manner between the source electrode and the drain electrode. Therefore, the conductor 560 can be formed without providing a margin for alignment, so that the area occupied by the transistor 500 can be reduced. Thereby, miniaturization and high integration of the semiconductor device can be achieved.
  • the conductor 560 is formed in a self-aligned manner in a region between the conductors 542a and 542b, the conductor 560 does not have a region overlapping with the conductor 542a or the conductor 542b. Accordingly, parasitic capacitance formed between the conductor 560 and the conductors 542a and 542b can be reduced. Thus, the switching speed of the transistor 500 can be improved and high frequency characteristics can be obtained.
  • the conductor 560 may function as a first gate (also referred to as a top gate) electrode.
  • the conductor 503 may function as a second gate (also referred to as a bottom gate) electrode.
  • the threshold voltage of the transistor 500 can be controlled by changing the potential applied to the conductor 503 independently of the potential applied to the conductor 560 without being linked.
  • the threshold voltage of the transistor 500 can be higher than 0 V and the off-state current can be reduced. Therefore, when a negative potential is applied to the conductor 503, the drain current when the potential applied to the conductor 560 is 0 V can be made smaller than when a negative potential is not applied.
  • the conductor 503 is disposed so as to overlap with the oxide 530 and the conductor 560. Accordingly, when a potential is applied to the conductor 560 and the conductor 503, the electric field generated from the conductor 560 and the electric field generated from the conductor 503 are connected to cover the channel formation region formed in the oxide 530. Can do.
  • a transistor structure in which a channel formation region is electrically surrounded by an electric field of the first gate electrode and the second gate electrode is referred to as a surrounded channel (S-channel) structure.
  • the conductor 503 has the same structure as that of the conductor 518, and a conductor 503a is formed in contact with the inner walls of the openings of the insulator 514 and the insulator 516, and a conductor 503b is further formed inside.
  • the transistor 500 has a structure in which the conductors 503a and 503b are stacked, the present invention is not limited thereto.
  • the conductor 503 may be provided as a single layer or a stacked structure including three or more layers.
  • the conductor 503a is preferably formed using a conductive material having a function of suppressing diffusion of impurities such as hydrogen atoms, hydrogen molecules, water molecules, and copper atoms (the impurities are difficult to permeate).
  • a conductive material having a function of suppressing diffusion of oxygen for example, at least one of an oxygen atom and an oxygen molecule
  • the oxygen hardly transmits.
  • the function of suppressing diffusion of impurities or oxygen is a function of suppressing diffusion of any one or all of the impurities and oxygen.
  • the conductor 503a since the conductor 503a has a function of suppressing the diffusion of oxygen, it can be suppressed that the conductor 503b is oxidized and the conductivity is lowered.
  • the conductor 503b is preferably formed using a highly conductive material mainly containing tungsten, copper, or aluminum. In that case, the conductor 505 is not necessarily provided. Note that although the conductor 503b is illustrated as a single layer, it may have a stacked structure, for example, a stack of titanium, titanium nitride, and the above conductive material.
  • the insulator 520, the insulator 522, the insulator 524, and the insulator 550 function as a second gate insulating film.
  • the insulator 524 in contact with the oxide 530 is preferably an insulator containing more oxygen than oxygen that satisfies the stoichiometric composition. That is, it is preferable that an excess oxygen region be formed in the insulator 524.
  • an insulator containing excess oxygen in contact with the oxide 530 oxygen vacancies in the oxide 530 can be reduced and the reliability of the transistor 500 can be improved.
  • an oxide material from which part of oxygen is released by heating is preferably used as the insulator having an excess oxygen region.
  • the oxide that desorbs oxygen by heating means that the amount of desorbed oxygen in terms of oxygen atom is 1.0 ⁇ 10 18 atoms / cm 3 or more, preferably 1 in TDS (Thermal Desorption Spectroscopy) analysis.
  • the oxide film has a thickness of 0.0 ⁇ 10 19 atoms / cm 3 or more, more preferably 2.0 ⁇ 10 19 atoms / cm 3 or more, or 3.0 ⁇ 10 20 atoms / cm 3 or more.
  • the surface temperature of the film during the TDS analysis is preferably in the range of 100 ° C. or higher and 700 ° C. or lower, or 100 ° C. or higher and 400 ° C. or lower.
  • the insulator 522 preferably has a function of suppressing diffusion of oxygen (for example, oxygen atoms and oxygen molecules) (the oxygen hardly transmits).
  • the insulator 522 have a function of suppressing diffusion of oxygen and impurities so that oxygen included in the oxide 530 does not diffuse to the insulator 520 side. Further, the conductor 503 can be prevented from reacting with the oxygen included in the insulator 524 and the oxide 530.
  • the insulator 522 includes, for example, aluminum oxide, hafnium oxide, aluminum and an oxide containing hafnium (hafnium aluminate), tantalum oxide, zirconium oxide, lead zirconate titanate (PZT), strontium titanate (SrTiO 3 ), or An insulator containing a so-called high-k material such as (Ba, Sr) TiO 3 (BST) is preferably used in a single layer or a stacked layer. As transistor miniaturization and higher integration progress, problems such as leakage current may occur due to the thinning of the gate insulating film. By using a high-k material for the insulator functioning as a gate insulating film, the gate potential during transistor operation can be reduced while maintaining the physical film thickness.
  • an insulator including one or both of oxides of aluminum and hafnium which is an insulating material having a function of suppressing diffusion of impurities and oxygen (the oxygen hardly transmits) may be used.
  • the insulator containing one or both of aluminum and hafnium aluminum oxide, hafnium oxide, an oxide containing aluminum and hafnium (hafnium aluminate), or the like is preferably used.
  • the insulator 522 is formed using such a material, the insulator 522 suppresses release of oxygen from the oxide 530 and entry of impurities such as hydrogen from the periphery of the transistor 500 to the oxide 530. Acts as a layer.
  • aluminum oxide, bismuth oxide, germanium oxide, niobium oxide, silicon oxide, titanium oxide, tungsten oxide, yttrium oxide, or zirconium oxide may be added to these insulators.
  • these insulators may be nitrided. Silicon insulator, silicon oxynitride, or silicon nitride may be stacked over the above insulator.
  • the insulator 520 is preferably thermally stable.
  • silicon oxide and silicon oxynitride are preferable because they are thermally stable.
  • the insulator 520 having a stacked structure with high thermal stability and high relative dielectric constant can be obtained.
  • the insulator 520, the insulator 522, and the insulator 524 are illustrated as the second gate insulating film having a three-layer structure;
  • the two gate insulating films may have a single layer, two layers, or a stacked structure of four or more layers. In that case, it is not limited to the laminated structure which consists of the same material, The laminated structure which consists of a different material may be sufficient.
  • the oxide 530 includes an In-M-Zn oxide (the element M is aluminum, gallium, yttrium, copper, vanadium, beryllium, boron, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium) , One or more selected from hafnium, tantalum, tungsten, magnesium, or the like may be used.
  • the In-M-Zn oxide that can be used as the oxide 530 is preferably a CAAC-OS or a CAC-OS described in Embodiment 6.
  • an In—Ga oxide or an In—Zn oxide may be used as the oxide 530.
  • the metal oxide that functions as a channel formation region in the oxide 530 preferably has a band gap of 2 eV or more, preferably 2.5 eV or more. In this manner, off-state current of a transistor can be reduced by using a metal oxide having a large band gap.
  • the oxide 530 includes the oxide 530a below the oxide 530b, diffusion of impurities from the structure formed below the oxide 530a to the oxide 530b can be suppressed. In addition, by including the oxide 530c over the oxide 530b, diffusion of impurities from the structure formed above the oxide 530c to the oxide 530b can be suppressed.
  • the oxide 530 preferably has a stacked structure of oxides having different atomic ratios of metal atoms.
  • the atomic ratio of the element M in the constituent element is larger than the atomic ratio of the element M in the constituent element in the metal oxide used for the oxide 530b. It is preferable.
  • the atomic ratio of the element M to In is preferably larger than the atomic ratio of the element M to In in the metal oxide used for the oxide 530b.
  • the atomic ratio of In to the element M is preferably larger than the atomic ratio of In to the element M in the metal oxide used for the oxide 530a.
  • a metal oxide that can be used for the oxide 530a or the oxide 530b can be used.
  • the energy at the lower end of the conduction band of the oxide 530a and the oxide 530c is higher than the energy at the lower end of the conduction band of the oxide 530b.
  • the electron affinity of the oxide 530a and the oxide 530c is preferably smaller than the electron affinity of the oxide 530b.
  • the energy level at the lower end of the conduction band changes gently.
  • the energy level at the lower end of the conduction band at the junction of the oxide 530a, the oxide 530b, and the oxide 530c is continuously changed or continuously joined.
  • the density of defect states in the mixed layer formed at the interface between the oxide 530a and the oxide 530b and the interface between the oxide 530b and the oxide 530c is preferably lowered.
  • the oxide 530a and the oxide 530b, and the oxide 530b and the oxide 530c have a common element (main component) in addition to oxygen, so that a mixed layer with a low density of defect states is formed.
  • the oxide 530b is an In—Ga—Zn oxide
  • an In—Ga—Zn oxide, a Ga—Zn oxide, a gallium oxide, or the like may be used as the oxide 530a and the oxide 530c.
  • the main path of the carrier is the oxide 530b.
  • the oxide 530a and the oxide 530c have the above structures, the density of defect states at the interface between the oxide 530a and the oxide 530b and the interface between the oxide 530b and the oxide 530c can be reduced. Therefore, the influence on carrier conduction due to interface scattering is reduced, and the transistor 500 can obtain a high on-state current.
  • a conductor 542a and a conductor 542b functioning as a source electrode and a drain electrode are provided over the oxide 530b.
  • the conductor 542a and the conductor 542b aluminum, chromium, copper, silver, gold, platinum, tantalum, nickel, titanium, molybdenum, tungsten, hafnium, vanadium, niobium, manganese, magnesium, zirconium, beryllium, indium, ruthenium It is preferable to use a metal element selected from iridium, strontium, and lanthanum, an alloy containing the above-described metal element, or an alloy combining the above-described metal elements.
  • the conductor 542a and the conductor 542b are illustrated as a single-layer structure; however, a stacked structure including two or more layers may be employed.
  • a tantalum nitride film and a tungsten film are preferably stacked.
  • a titanium film and an aluminum film may be stacked.
  • a two-layer structure in which an aluminum film is stacked on a tungsten film a two-layer structure in which a copper film is stacked on a copper-magnesium-aluminum alloy film, a two-layer structure in which a copper film is stacked on a titanium film, and a tungsten film
  • a two-layer structure in which copper films are stacked may be used.
  • a titanium film or a titanium nitride film and a three-layer structure in which an aluminum film or a copper film is laminated on the titanium film or the titanium nitride film, and a titanium film or a titanium nitride film is further formed thereon, a molybdenum film or
  • a transparent conductive material containing indium oxide, tin oxide, or zinc oxide may be used.
  • a region 543a and a region 543b are formed as low resistance regions at and near the interface between the oxide 530 and the conductor 542a (conductor 542b). There is. At this time, the region 543a functions as one of a source region and a drain region, and the region 543b functions as the other of the source region and the drain region. In addition, a channel formation region is formed in a region between the region 543a and the region 543b.
  • the oxygen concentration in the region 543a (region 543b) may be reduced in some cases.
  • a metal compound layer including a metal contained in the conductor 542a (conductor 542b) and a component of the oxide 530 may be formed in the region 543a (region 543b). In such a case, the carrier density in the region 543a (region 543b) increases, and the region 543a (region 543b) becomes a low-resistance region.
  • the insulator 544 is provided so as to cover the conductor 542a and the conductor 542b, and suppresses oxidation of the conductor 542a and the conductor 542b. At this time, the insulator 544 may be provided so as to cover a side surface of the oxide 530 and to be in contact with the insulator 524.
  • insulator 544 a metal oxide containing one or more kinds selected from hafnium, aluminum, gallium, yttrium, zirconium, tungsten, titanium, tantalum, nickel, germanium, neodymium, lanthanum, magnesium, and the like is used. Can be used. As the insulator 544, silicon nitride oxide, silicon nitride, or the like can be used.
  • the insulator 544 it is preferable to use aluminum oxide, hafnium oxide, aluminum, an oxide containing hafnium (hafnium aluminate), or the like, which is an insulator containing one or both of aluminum and hafnium. .
  • hafnium aluminate has higher heat resistance than a hafnium oxide film. Therefore, it is preferable because it is difficult to crystallize in a heat treatment in a later step.
  • the insulator 544 is not an essential component in the case where the conductor 542a and the conductor 542b do not have a significant decrease in conductivity even when the material has oxidation resistance or absorbs oxygen. What is necessary is just to design suitably according to the transistor characteristic to request
  • the insulator 544 By including the insulator 544, it is possible to suppress diffusion of impurities such as water and hydrogen contained in the insulator 580 into the oxide 530b through the oxide 530c and the insulator 550. Further, the conductor 560 can be prevented from being oxidized by excess oxygen which the insulator 580 has.
  • the insulator 550 functions as a first gate insulating film.
  • the insulator 550 is preferably provided in contact with the inside (upper surface and side surfaces) of the oxide 530c.
  • the insulator 550 is preferably formed using an insulator that contains excess oxygen and from which oxygen is released by heating, like the insulator 524 described above.
  • silicon oxide having excess oxygen silicon oxynitride, silicon nitride oxide, silicon nitride, silicon oxide to which fluorine is added, silicon oxide to which carbon is added, silicon oxide to which carbon and nitrogen are added, and voids Silicon oxide can be used.
  • silicon oxide and silicon oxynitride are preferable because they are stable against heat.
  • An insulator from which oxygen is released by heating is provided as the insulator 550 so as to be in contact with the top surface of the oxide 530c, so that oxygen can be effectively supplied from the insulator 550 to the channel formation region of the oxide 530b through the oxide 530c. Can be supplied.
  • the concentration of impurities such as water or hydrogen in the insulator 550 is preferably reduced.
  • the thickness of the insulator 550 is preferably greater than or equal to 1 nm and less than or equal to 20 nm.
  • a metal oxide may be provided between the insulator 550 and the conductor 560 in order to efficiently supply excess oxygen included in the insulator 550 to the oxide 530.
  • the metal oxide preferably suppresses oxygen diffusion from the insulator 550 to the conductor 560.
  • diffusion of excess oxygen from the insulator 550 to the conductor 560 is suppressed. That is, a decrease in the amount of excess oxygen supplied to the oxide 530 can be suppressed. Further, oxidation of the conductor 560 due to excess oxygen can be suppressed.
  • a material that can be used for the insulator 544 may be used.
  • the insulator 550 may have a stacked structure like the second gate insulating film.
  • problems such as leakage current may occur due to thinning of a gate insulating film. Therefore, an insulator functioning as a gate insulating film is formed using a high-k material, heat
  • the gate potential during transistor operation can be reduced while maintaining the physical film thickness.
  • it is possible to obtain a laminated structure that is thermally stable and has a high relative dielectric constant.
  • the conductor 560 functioning as the first gate electrode is illustrated as a two-layer structure in FIGS. 36A and 36B, but may have a single-layer structure or a stacked structure including three or more layers.
  • the conductor 560a has a function of suppressing diffusion of impurities such as a hydrogen atom, a hydrogen molecule, a water molecule, a nitrogen atom, a nitrogen molecule, a nitrogen oxide molecule (N 2 O, NO, NO 2 ), a copper atom, and the like. It is preferable to use a material. Alternatively, a conductive material having a function of suppressing diffusion of oxygen (for example, at least one of oxygen atoms and oxygen molecules) is preferably used. When the conductor 560a has a function of suppressing diffusion of oxygen, it can be suppressed that the conductivity of the conductor 560b is reduced due to oxygen contained in the insulator 550 and the conductivity is reduced.
  • impurities such as a hydrogen atom, a hydrogen molecule, a water molecule, a nitrogen atom, a nitrogen molecule, a nitrogen oxide molecule (N 2 O, NO, NO 2 ), a copper atom, and the like. It is preferable to use a material
  • tantalum, tantalum nitride, ruthenium, or ruthenium oxide is preferably used as the conductive material having a function of suppressing oxygen diffusion.
  • an oxide semiconductor that can be used for the oxide 530 can be used. In that case, by forming a film of the conductor 560b by a sputtering method, the electrical resistance value of the conductor 560a can be reduced to obtain a conductor. This can be called an OC (Oxide Conductor) electrode.
  • the conductor 560b is preferably formed using a conductive material containing tungsten, copper, or aluminum as a main component.
  • the conductor 560b also functions as a wiring, and thus a conductor having high conductivity is preferably used.
  • a conductive material whose main component is tungsten, copper, or aluminum can be used.
  • the conductor 560b may have a stacked structure, for example, a stacked structure of titanium, titanium nitride, and the above conductive material.
  • the insulator 580 is provided over the conductor 542a and the conductor 542b with the insulator 544 provided therebetween.
  • the insulator 580 preferably has an excess oxygen region.
  • silicon oxide and silicon oxynitride are preferable because they are thermally stable.
  • silicon oxide and silicon oxide having holes are preferable because an excess oxygen region can be easily formed in a later step.
  • the insulator 580 preferably has an excess oxygen region. By providing the insulator 580 from which oxygen is released by heating in contact with the oxide 530c, oxygen in the insulator 580 can be efficiently supplied to the oxide 530 through the oxide 530c. Note that the concentration of impurities such as water or hydrogen in the insulator 580 is preferably reduced.
  • the opening of the insulator 580 is formed so as to overlap with a region between the conductor 542a and the conductor 542b.
  • the conductor 560 is formed so as to be embedded in the opening of the insulator 580 and the region sandwiched between the conductors 542a and 542b.
  • the conductor 560 can have a shape with a high aspect ratio.
  • the conductor 560 since the conductor 560 is provided so as to be embedded in the opening of the insulator 580, the conductor 560 can be formed without collapsing during the process even when the conductor 560 has a high aspect ratio. Can do.
  • the insulator 574 is preferably provided in contact with the upper surface of the insulator 580, the upper surface of the conductor 560, and the upper surface of the insulator 550.
  • an excess oxygen region can be provided in the insulator 550 and the insulator 580. Accordingly, oxygen can be supplied into the oxide 530 from the excess oxygen region.
  • a metal oxide containing one or more kinds selected from hafnium, aluminum, gallium, yttrium, zirconium, tungsten, titanium, tantalum, nickel, germanium, magnesium, and the like is used as the insulator 574. Can do.
  • aluminum oxide has a high barrier property and can suppress diffusion of hydrogen and nitrogen even in a thin film of 0.5 nm to 3.0 nm. Therefore, aluminum oxide formed by a sputtering method can serve as an oxygen supply source and function as a barrier film for impurities such as hydrogen.
  • an insulator 581 functioning as an interlayer film is preferably provided over the insulator 574.
  • the insulator 581 preferably has reduced concentration of impurities such as water or hydrogen in the film.
  • the conductor 540a and the conductor 540b are disposed in openings formed in the insulator 581, the insulator 574, the insulator 580, and the insulator 544.
  • the conductors 540a and 540b are provided to face each other with the conductor 560 interposed therebetween.
  • the conductor 540a and the conductor 540b have the same structure as a conductor 546 and a conductor 548 described later.
  • An insulator 582 is provided on the insulator 581.
  • the insulator 582 is preferably formed using a substance having a barrier property against oxygen or hydrogen. Therefore, the insulator 582 can be formed using a material similar to that of the insulator 514.
  • the insulator 582 is preferably formed using a metal oxide such as aluminum oxide, hafnium oxide, or tantalum oxide.
  • aluminum oxide has a high blocking effect that prevents the film from permeating both oxygen and impurities such as hydrogen and moisture, which cause fluctuations in the electrical characteristics of the transistor. Therefore, aluminum oxide can prevent impurities such as hydrogen and moisture from entering the transistor 500 during and after the manufacturing process of the transistor. In addition, release of oxygen from the oxide included in the transistor 500 can be suppressed. Therefore, it is suitable for use as a protective film for the transistor 500.
  • an insulator 586 is provided on the insulator 582.
  • the insulator 586 can be formed using a material similar to that of the insulator 320.
  • parasitic capacitance generated between wirings can be reduced.
  • a silicon oxide film, a silicon oxynitride film, or the like can be used as the insulator 586.
  • the insulator 520, the insulator 522, the insulator 524, the insulator 544, the insulator 580, the insulator 574, the insulator 581, the insulator 582, and the insulator 586 include the conductor 546, the conductor 548, and the like. Is embedded.
  • the conductor 546 and the conductor 548 function as a plug or a wiring connected to the capacitor 600, the transistor 500, or the transistor 300.
  • the conductor 546 and the conductor 548 can be provided using a material similar to that of the conductor 328 and the conductor 330.
  • the capacitor 600 includes a conductor 610, a conductor 620, and an insulator 630.
  • the conductor 612 may be provided over the conductor 546 and the conductor 548.
  • the conductor 612 functions as a plug connected to the transistor 500 or a wiring.
  • the conductor 610 functions as an electrode of the capacitor 600. Note that the conductor 612 and the conductor 610 can be formed at the same time.
  • the conductor 612 and the conductor 610 include a metal film containing an element selected from molybdenum, titanium, tantalum, tungsten, aluminum, copper, chromium, neodymium, and scandium, or a metal nitride film containing any of the above elements as a component (Tantalum nitride film, titanium nitride film, molybdenum nitride film, tungsten nitride film) or the like can be used.
  • indium tin oxide indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium zinc oxide, silicon oxide added It is also possible to apply a conductive material such as indium tin oxide.
  • the conductor 612 and the conductor 610 have a single-layer structure; however, the structure is not limited thereto, and a stacked structure of two or more layers may be used.
  • a conductor having a high barrier property and a conductor having a high barrier property may be formed between a conductor having a barrier property and a conductor having a high conductivity.
  • a conductor 620 is provided so as to overlap with the conductor 610 with the insulator 630 interposed therebetween.
  • the conductor 620 can be formed using a conductive material such as a metal material, an alloy material, or a metal oxide material. It is preferable to use a high-melting-point material such as tungsten or molybdenum that has both heat resistance and conductivity, and it is particularly preferable to use tungsten. In the case of forming simultaneously with other structures such as a conductor, Cu (copper), Al (aluminum), or the like, which is a low resistance metal material, may be used.
  • An insulator 650 is provided over the conductor 620 and the insulator 630.
  • the insulator 650 can be provided using a material similar to that of the insulator 320.
  • the insulator 650 may function as a planarization film that covers the concave and convex shapes below the insulator 650.
  • the transistor 500 of the semiconductor device described in this embodiment is not limited to the above structure.
  • structural examples that can be used for the transistor 500 will be described.
  • the transistor described below is a modified example of the transistor described above. Therefore, in the following description, different points are mainly described, and the same points may be omitted.
  • FIG. 37A is a top view of the transistor 500A.
  • FIG. 37B is a cross-sectional view illustrating a portion indicated by dashed-dotted line L1-L2 in FIG.
  • FIG. 37C is a cross-sectional view illustrating a portion indicated by dashed-dotted line W1-W2 in FIG. Note that for simplification of the drawing, some components are not illustrated in the top view in FIG.
  • a transistor 500A illustrated in FIGS. 37A to 37C includes a structure in which an insulator 511 functioning as an interlayer film and a conductor 505 functioning as a wiring are added to the transistor 500 illustrated in FIG. It has become.
  • the oxide 530c, the insulator 550, and the conductor 560 are provided in an opening provided in the insulator 580 with the insulator 544 provided therebetween.
  • the oxide 530c, the insulator 550, and the conductor 560 are disposed between the conductor 542a and the conductor 542b.
  • An insulator such as TiO 3 (BST) can be used in a single layer or a stacked layer.
  • aluminum oxide, bismuth oxide, germanium oxide, niobium oxide, silicon oxide, titanium oxide, tungsten oxide, yttrium oxide, or zirconium oxide may be added to these insulators.
  • these insulators may be nitrided. Silicon insulator, silicon oxynitride, or silicon nitride may be stacked over the above insulator.
  • the insulator 511 preferably functions as a barrier film that suppresses impurities such as water or hydrogen from entering the transistor 500A from the substrate side. Therefore, the insulator 511 is preferably formed using an insulating material having a function of suppressing diffusion of impurities such as a hydrogen atom, a hydrogen molecule, a water molecule, and a copper atom (the impurity is difficult to transmit). Alternatively, it is preferable to use an insulating material having a function of suppressing the diffusion of oxygen (for example, at least one of oxygen atoms and oxygen molecules). For example, aluminum oxide, silicon nitride, or the like may be used as the insulator 511. With this structure, impurities such as hydrogen and water can be prevented from diffusing from the substrate side to the transistor 500A side with respect to the insulator 511.
  • the insulator 512 preferably has a lower dielectric constant than the insulator 511.
  • parasitic capacitance generated between the wirings can be reduced.
  • the conductor 505 is formed so as to be embedded in the insulator 512.
  • the height of the upper surface of the conductor 505 and the height of the upper surface of the insulator 512 can be approximately the same.
  • the conductor 505 has a single-layer structure, the present invention is not limited to this.
  • the conductor 505 may have a multilayer structure including two or more layers.
  • the conductor 505 is preferably formed using a highly conductive material whose main component is tungsten, copper, or aluminum.
  • the insulator 514 and the insulator 516 function as interlayer films similarly to the insulator 511 or the insulator 512.
  • the insulator 514 preferably functions as a barrier film that prevents impurities such as water or hydrogen from entering the transistor 500A from the substrate side. With this structure, diffusion of impurities such as hydrogen and water from the substrate side to the transistor 500A side than the insulator 514 can be suppressed.
  • the insulator 516 preferably has a lower dielectric constant than the insulator 514. By using a material having a low dielectric constant as the interlayer film, parasitic capacitance generated between the wirings can be reduced.
  • the insulator 522 preferably has a barrier property.
  • the insulator 522 functions as a layer that suppresses entry of impurities such as hydrogen from the peripheral portion of the transistor 500A to the transistor 500A.
  • the oxide 530 c is preferably provided in the opening provided in the insulator 580 through the insulator 544.
  • the insulator 544 has barrier properties, diffusion of impurities from the insulator 580 into the oxide 530 can be suppressed.
  • a barrier layer may be provided over the conductor 542a and the conductor 542b.
  • a substance having a barrier property against oxygen or hydrogen is preferably used. With this structure, oxidation of the conductors 542a and 542b can be suppressed when the insulator 544 is formed.
  • a metal oxide can be used for the barrier layer.
  • an insulating film having a barrier property against oxygen and hydrogen such as aluminum oxide, hafnium oxide, and gallium oxide, is preferably used.
  • silicon nitride formed by a CVD method may be used.
  • the material selection range of the conductor 542a and the conductor 542b can be widened.
  • the conductor 542a and the conductor 542b can be formed using a material having low conductivity but high conductivity such as tungsten or aluminum.
  • a conductor that can be easily formed or processed can be used.
  • the insulator 550 functions as a first gate insulating film.
  • the insulator 550 is preferably provided in the opening provided in the insulator 580 through the oxide 530c and the insulator 544.
  • a conductive material such as a metal material, an alloy material, a metal nitride material, or a metal oxide material is used as a single layer or a stacked layer.
  • a high melting point material such as tungsten or molybdenum that has both heat resistance and conductivity.
  • low resistance conductive materials such as aluminum and copper. Wiring resistance can be lowered by using a low-resistance conductive material.
  • the conductor 540a and the conductor 540b for example, a stacked structure of tantalum nitride, which is a conductor having a barrier property against hydrogen and oxygen, and tungsten having high conductivity can be used. The diffusion of impurities from the outside can be suppressed while maintaining the electrical conductivity as described above.
  • a semiconductor device including a transistor including an oxide semiconductor with high on-state current can be provided.
  • a semiconductor device including a transistor including an oxide semiconductor with low off-state current can be provided.
  • FIG. 38A is a top view of the transistor 500B.
  • FIG. 38B is a cross-sectional view illustrating a portion indicated by dashed-dotted line L1-L2 in FIG.
  • FIG. 38C is a cross-sectional view illustrating a portion indicated by dashed-dotted line W1-W2 in FIG. Note that in the top view of FIG. 38A, some elements are omitted for clarity.
  • Transistor 500B is a modification of transistor 500A. Therefore, in order to prevent repeated description, differences from the transistor 500A are mainly described.
  • the transistor 500B includes a region where the conductor 542a (conductor 542b), the oxide 530c, the insulator 550, and the conductor 560 overlap with each other. With such a structure, a transistor with high on-state current can be provided. In addition, a transistor with high controllability can be provided.
  • the conductor 560 functioning as the first gate electrode includes a conductor 560a and a conductor 560b over the conductor 560a.
  • the conductor 560a is preferably formed using a conductive material having a function of suppressing diffusion of impurities such as a hydrogen atom, a hydrogen molecule, a water molecule, and a copper atom, like the conductor 503a.
  • a conductive material having a function of suppressing diffusion of oxygen for example, at least one of oxygen atoms and oxygen molecules is preferably used.
  • the conductor 560a has a function of suppressing the diffusion of oxygen, the material selectivity of the conductor 560b can be improved. That is, by including the conductor 560a, oxidation of the conductor 560b can be suppressed and reduction in conductivity can be prevented.
  • the insulator 544 is preferably provided so as to cover the top surface and the side surface of the conductor 560, the side surface of the insulator 550, and the side surface of the oxide 530c.
  • oxidation of the conductor 560 can be suppressed.
  • diffusion of water and impurities such as hydrogen included in the insulator 580 into the transistor 500B can be suppressed.
  • the contact plug of the transistor 500B is different from the configuration of the contact plug of the transistor 500A.
  • an insulator 576a (insulator 576b) having a barrier property is provided between the conductor 546a (conductor 546b) functioning as a contact plug and the insulator 580.
  • oxygen in the insulator 580 can be prevented from reacting with the conductor 546 and the conductor 546 being oxidized.
  • insulator 576a (insulator 576b) having a barrier property
  • the range of selection of materials for conductors used for plugs and wirings can be widened.
  • a low power consumption semiconductor device can be provided by using a metal material having high conductivity while absorbing oxygen for the conductor 546a (conductor 546b).
  • a material having high conductivity while having low oxidation resistance such as tungsten or aluminum can be used.
  • a conductor that can be easily formed or processed can be used.
  • FIG. 39A is a top view of the transistor 500C.
  • FIG. 39B is a cross-sectional view illustrating a portion indicated by dashed-dotted line L1-L2 in FIG.
  • FIG. 39C is a cross-sectional view illustrating a portion indicated by dashed-dotted line W1-W2 in FIG. Note that in the top view of FIG. 39A, some elements are omitted for clarity.
  • the transistor 500C is a modification of the transistor 500A. Therefore, in order to prevent repeated description, differences from the transistor 500A are mainly described.
  • the conductor 547a is disposed between the conductor 542a and the oxide 530b
  • the conductor 547b is disposed between the conductor 542b and the oxide 530b.
  • the conductor 542a extends beyond the top surface of the conductor 547a (conductor 547b) and the side surface on the conductor 560 side, and has a region in contact with the top surface of the oxide 530b.
  • a conductor that can be used for the conductor 542a and the conductor 542b may be used as the conductor 547a and the conductor 547b.
  • the conductors 547a and 547b are preferably thicker than at least the conductors 542a and 542b.
  • the transistor 500C illustrated in FIG. 39 has the above structure, whereby the conductor 542a and the conductor 542b can be made closer to the conductor 560 than the transistor 500A.
  • the conductor 560 can overlap the end portion of the conductor 542a and the end portion of the conductor 542b. Accordingly, the substantial channel length of the transistor 500C can be shortened, and the on-current and the frequency characteristics can be improved.
  • the conductor 547a (conductor 547b) is preferably provided so as to overlap with the conductor 542a (conductor 542b).
  • the conductor 547a (conductor 547b) functions as a stopper, and the oxide 530b is over-etched. Can be prevented.
  • the transistor 500C illustrated in FIG. 39 has a structure in which the insulator 545 is provided in contact with the insulator 544.
  • the insulator 544 preferably functions as a barrier insulating film which suppresses entry of impurities such as water or hydrogen and excess oxygen into the transistor 500C from the insulator 580 side.
  • an insulator that can be used for the insulator 544 can be used.
  • a nitride insulator such as aluminum nitride, aluminum titanium nitride, titanium nitride, silicon nitride, or silicon nitride oxide may be used.
  • the transistor 500C illustrated in FIG. 39 has the conductor 503 having a single-layer structure.
  • an insulating film to be the insulator 516 is formed over the patterned conductor 503, and the upper portion of the insulating film is removed using a CMP method or the like until the upper surface of the conductor 503 is exposed.
  • the flatness of the upper surface of the conductor 503 is preferably improved.
  • the average surface roughness (Ra) of the upper surface of the conductor 503 may be 1 nm or less, preferably 0.5 nm or less, more preferably 0.3 nm or less. Accordingly, the flatness of the insulating layer formed over the conductor 503 can be improved, and the crystallinity of the oxide 530b and the oxide 530c can be improved.
  • FIG. 40A is a top view of the transistor 500D.
  • FIG. 40B is a cross-sectional view illustrating a portion indicated by dashed-dotted line L1-L2 in FIG.
  • FIG. 40C is a cross-sectional view taken along dashed-dotted line W1-W2 in FIG. Note that in the top view of FIG. 40A, some elements are omitted for clarity.
  • Transistor 500D is a modification of the above transistor. Therefore, in order to prevent the description from being repeated, differences from the above transistor will be mainly described.
  • the transistor 500D illustrated in FIGS. 40A to 40C does not include the conductor 542a and the conductor 542b and has a region over a part of the surface of the exposed oxide 530b. 531a and a region 531b. One of the region 531a and the region 531b functions as a source region, and the other functions as a drain region.
  • the transistor 500D does not include the conductor 505, and the conductor 503 having a function as a second gate also functions as a wiring.
  • the insulator 550 is provided over the oxide 530c, and the metal oxide 552 is provided over the insulator 550.
  • the conductor 560 is provided over the metal oxide 552 and the insulator 570 is provided over the conductor 560.
  • the insulator 571 is provided over the insulator 570.
  • the metal oxide 552 preferably has a function of suppressing oxygen diffusion.
  • the metal oxide 552 that suppresses diffusion of oxygen between the insulator 550 and the conductor 560 diffusion of oxygen into the conductor 560 is suppressed. That is, a decrease in the amount of oxygen supplied to the oxide 530 can be suppressed. Further, oxidation of the conductor 560 due to oxygen can be suppressed.
  • the metal oxide 552 may function as a part of the first gate.
  • an oxide semiconductor that can be used as the oxide 530 can be used as the metal oxide 552.
  • the electric resistance value of the metal oxide 552 can be reduced to form a conductive layer, that is, an OC electrode.
  • the metal oxide 552 may function as a part of the gate insulating film. Therefore, when silicon oxide, silicon oxynitride, or the like is used for the insulator 550, the metal oxide 552 is preferably a metal oxide that is a high-k material with a high relative dielectric constant. By setting it as the said laminated structure, it can be set as the laminated structure stable with respect to a heat
  • EOT equivalent oxide thickness
  • the metal oxide 552 is illustrated as a single layer; however, a stacked structure including two or more layers may be used.
  • a metal oxide that functions as part of the gate electrode and a metal oxide that functions as part of the gate insulating film may be stacked.
  • the on-state current of the transistor 500D can be improved without weakening the influence of the electric field from the conductor 560.
  • the distance between the conductor 560 and the oxide 530 is maintained by the physical thickness of the insulator 550 and the metal oxide 552, so that the conductor 560 Leakage current with the oxide 530 can be suppressed. Therefore, by providing a stacked structure of the insulator 550 and the metal oxide 552, the physical distance between the conductor 560 and the oxide 530 and the electric field strength applied from the conductor 560 to the oxide 530 can be reduced. It can be easily adjusted as appropriate.
  • an oxide semiconductor that can be used for the oxide 530 can be used as the metal oxide 552 by reducing resistance.
  • a metal oxide containing one kind or two or more kinds selected from hafnium, aluminum, gallium, yttrium, zirconium, tungsten, titanium, tantalum, nickel, germanium, magnesium, and the like can be used.
  • hafnium oxide aluminum
  • hafnium aluminate oxide containing hafnium
  • hafnium aluminate has higher heat resistance than a hafnium oxide film. Therefore, it is preferable because it is difficult to crystallize in a heat treatment in a later step.
  • the metal oxide 552 is not an essential component. What is necessary is just to design suitably according to the transistor characteristic to request
  • an insulating material having a function of suppressing permeation of impurities such as water or hydrogen and oxygen may be used.
  • impurities such as water or hydrogen and oxygen
  • aluminum oxide or hafnium oxide is preferably used.
  • impurities such as water or hydrogen from above the insulator 570 can be prevented from entering the oxide 530 through the conductor 560 and the insulator 550.
  • the insulator 571 functions as a hard mask.
  • the side surface of the conductor 560 is substantially vertical.
  • the angle formed between the side surface of the conductor 560 and the substrate surface is 75 ° to 100 °, Preferably, it can be set to 80 degrees or more and 95 degrees or less.
  • the insulator 571 may also function as a barrier layer by using an insulating material having a function of suppressing permeation of impurities such as water or hydrogen and oxygen. In that case, the insulator 570 is not necessarily provided.
  • insulator 571 By using the insulator 571 as a hard mask, a part of the insulator 570, the conductor 560, the metal oxide 552, the insulator 550, and the oxide 530c is selectively removed, so that these side surfaces are substantially matched. In addition, a part of the surface of the oxide 530b can be exposed.
  • the transistor 500D includes a region 531a and a region 531b in part of the exposed surface of the oxide 530b.
  • One of the region 531a and the region 531b functions as a source region, and the other functions as a drain region.
  • the formation of the region 531a and the region 531b is performed by introducing an impurity element such as phosphorus or boron into the exposed oxide 530b surface by using, for example, an ion implantation method, an ion doping method, a plasma immersion ion implantation method, or a plasma treatment. This can be achieved.
  • an impurity element such as phosphorus or boron
  • an ion implantation method an ion doping method
  • a plasma immersion ion implantation method or a plasma treatment.
  • the “impurity element” in this embodiment and the like refers to an element other than the main component elements.
  • a metal film is formed after part of the surface of the oxide 530b is exposed, and then heat treatment is performed, whereby an element included in the metal film is diffused into the oxide 530b to form the region 531a and the region 531b.
  • the region 531a and the region 531b may be referred to as “impurity region” or “low resistance region”.
  • the region 531a and the region 531b can be formed in a self-alignment manner. Therefore, the region 531a and / or the region 531b does not overlap with the conductor 560, so that parasitic capacitance can be reduced. Further, no offset region is formed between the channel formation region and the source / drain region (the region 531a or the region 531b). By forming the region 531a and the region 531b in a self-alignment manner, an increase in on-state current, a reduction in threshold voltage, an improvement in operating frequency, and the like can be realized.
  • an offset region may be provided between the channel formation region and the source / drain region in order to further reduce the off-state current.
  • the offset region is a region having a high electrical resistivity and is a region where the impurity element is not introduced.
  • the offset region can be formed by introducing the impurity element described above after the insulator 575 is formed.
  • the insulator 575 functions as a mask similarly to the insulator 571 and the like. Therefore, the impurity element is not introduced into the region overlapping with the insulator 575 of the oxide 530b, and the electrical resistivity of the region can be kept high.
  • the transistor 500D includes the insulator 575 on the side surfaces of the insulator 570, the conductor 560, the metal oxide 552, the insulator 550, and the oxide 530c.
  • the insulator 575 is preferably an insulator having a low relative dielectric constant.
  • silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, silicon oxide to which fluorine is added, silicon oxide to which carbon is added, silicon oxide to which carbon and nitrogen are added, silicon oxide having voids, or resin Preferably there is.
  • silicon oxide, silicon oxynitride, silicon nitride oxide, or silicon oxide having a hole for the insulator 575 because an excess oxygen region can be easily formed in the insulator 575 in a later step.
  • Silicon oxide and silicon oxynitride are preferable because they are thermally stable.
  • the insulator 575 preferably has a function of diffusing oxygen.
  • the transistor 500D includes the insulator 575 and the insulator 544 over the oxide 530.
  • the insulator 544 is preferably formed by a sputtering method. By using a sputtering method, an insulator with few impurities such as water or hydrogen can be formed. For example, aluminum oxide may be used as the insulator 544.
  • an oxide film formed by a sputtering method may extract hydrogen from a deposition target structure. Therefore, the insulator 544 absorbs hydrogen and water from the oxide 530 and the insulator 575, whereby the hydrogen concentration in the oxide 530 and the insulator 575 can be reduced.
  • FIG. 41A is a top view of the transistor 500E.
  • FIG. 41B is a cross-sectional view illustrating a portion indicated by dashed-dotted line L1-L2 in FIG.
  • FIG. 41C is a cross-sectional view illustrating a portion indicated by dashed-dotted line W1-W2 in FIG. Note that for simplification of the drawing, some components are not illustrated in the top view in FIG.
  • Transistor 500E is a modification of the above transistor. Therefore, in order to prevent the description from being repeated, differences from the above transistor will be mainly described.
  • a region 531a and a region 531b are provided in part of the exposed surface of the oxide 530b without providing the conductor 542a and the conductor 542b.
  • One of the region 531a and the region 531b functions as a source region, and the other functions as a drain region.
  • an insulator 573 is provided between the oxide 530b and the insulator 544.
  • a region 531a and a region 531b are regions in which the following elements are added to the oxide 530b.
  • the region 531a and the region 531b can be formed by using a dummy gate, for example.
  • a dummy gate may be provided over the oxide 530b, and the dummy gate may be used as a mask, and an element for reducing the resistance of a part of the oxide 530b may be added. That is, the element is added to a region where the oxide 530 does not overlap with the dummy gate, so that the region 531a and the region 531b are formed.
  • an ion implantation method in which an ionized source gas is added by mass separation an ion doping method in which an ionized source gas is added without mass separation, a plasma immersion ion implantation method, or the like Can be used.
  • boron or phosphorus is given as an element for reducing the resistance of part of the oxide 530b.
  • hydrogen, carbon, nitrogen, fluorine, sulfur, chlorine, titanium, a rare gas element, or the like may be used.
  • the rare gas element include helium, neon, argon, krypton, and xenon. What is necessary is just to measure the density
  • boron and phosphorus can be added to an Si transistor manufacturing line apparatus in which amorphous silicon, low-temperature polysilicon, or the like is contained in a semiconductor layer. Therefore, by using the manufacturing line apparatus, one of oxides 530b can be added. The resistance of the part can be reduced. That is, part of the Si transistor manufacturing line can be used for the manufacturing process of the transistor 500E.
  • an insulating film to be the insulator 573 and an insulating film to be the insulator 544 may be formed over the oxide 530b and the dummy gate.
  • a CMP (Chemical Mechanical Polishing) process is performed on the insulating film to be the insulator 580.
  • a part of the insulating film is removed to expose the dummy gate.
  • part of the insulator 573 in contact with the dummy gate may be removed. Therefore, the insulator 544 and the insulator 573 are exposed on the side surface of the opening provided in the insulator 580, and the region 531a and the region 531b provided in the oxide 530b are exposed on the bottom surface of the opening. Each part is exposed.
  • an oxide film to be the oxide 530c, an insulating film to be the insulator 550, and a conductive film to be the conductor 560 are sequentially formed in the opening, CMP treatment or the like is performed until the insulator 580 is exposed.
  • the transistor illustrated in FIG. 41 can be formed by removing part of the oxide film to be the oxide 530c, the insulating film to be the insulator 550, and the conductive film to be the conductor 560.
  • the insulator 573 and the insulator 544 are not essential components. What is necessary is just to design suitably according to the transistor characteristic to request
  • FIG. 36 illustrates the structure example in which the conductor 560 functioning as a gate is formed inside the opening of the insulator 580.
  • the insulator is disposed above the conductor.
  • the provided structure can also be used. Examples of the structure of such a transistor are shown in FIGS.
  • FIG. 42A is a top view of the transistor
  • FIG. 42B is a perspective view of the transistor.
  • a cross-sectional view taken along line L1-L2 in FIG. 42A is shown in FIG. 43A
  • a cross-sectional view taken along W1-W2 is shown in FIG.
  • the transistor illustrated in FIGS. 42 and 43 includes a conductor BGE having a function as a back gate, an insulator BGI having a function as a gate insulating film, an oxide semiconductor S, and an insulating film having a function as a gate insulating film.
  • the conductor PE has a function as a plug for connecting the conductor WE to the oxide S, the conductor BGE, or the conductor FGE.
  • the oxide semiconductor S includes three layers of oxides S1, S2, and S3 is shown.
  • FIG. 44 illustrates a capacitor 600A as an example of the capacitor 600 applicable to the semiconductor device illustrated in FIG. 44A is a top view of the capacitor 600A
  • FIG. 44B is a perspective view showing a cross section taken along one-dot chain line L3-L4 of the capacitor 600A
  • FIG. 44C is a diagram of the capacitor 600A. It is the perspective view which showed the cross section in dashed-dotted line W3-L4.
  • the conductor 610 functions as one of the pair of electrodes of the capacitor 600A, and the conductor 620 functions as the other of the pair of electrodes of the capacitor 600A.
  • the insulator 630 functions as a dielectric sandwiched between the pair of electrodes.
  • the capacitor element 600 is electrically connected to the conductor 546 and the conductor 548 below the conductor 610.
  • the conductor 546 and the conductor 548 function as a plug or a wiring for connecting to another circuit element.
  • the conductor 546 and the conductor 548 are collectively referred to as a conductor 540.
  • the insulator 586 in which the conductor 546 and the conductor 548 are embedded and the insulator 650 covering the conductor 620 and the insulator 630 are omitted for the sake of clarity. ing.
  • the capacitor 600 shown in FIGS. 34, 35, and 44 is a planar type, the shape of the capacitor is not limited to this.
  • the capacitive element 600 may be a cylinder-type capacitive element 600B illustrated in FIG.
  • FIG. 45A is a top view of the capacitor 600B
  • FIG. 45B is a cross-sectional view taken along one-dot chain line L3-L4 of the capacitor 600B
  • FIG. 45C is one-dot chain line W3- It is the perspective view which showed the cross section in L4.
  • a capacitor 600B includes an insulator 631 over an insulator 586 in which the conductor 540 is embedded, an insulator 651 having an opening, and a conductor 610 functioning as one of a pair of electrodes. And a conductor 620 functioning as the other of the pair of electrodes.
  • the insulator 586, the insulator 650, and the insulator 651 are omitted for the sake of clarity.
  • the insulator 631 for example, a material similar to that of the insulator 586 can be used.
  • a conductor 611 is embedded in the insulator 631 so as to be electrically connected to the conductor 540.
  • a conductor 611 for example, a material similar to that of the conductor 330 and the conductor 518 can be used.
  • the insulator 651 for example, a material similar to that of the insulator 586 can be used.
  • the insulator 651 has an opening as described above, and the opening overlaps with the conductor 611.
  • the conductor 610 is formed on the bottom and side surfaces of the opening. That is, the conductor 621 overlaps with the conductor 611 and is electrically connected to the conductor 611.
  • an opening is formed in the insulator 651 by an etching method or the like, and then the conductor 610 is formed by a sputtering method, an ALD method, or the like. After that, the conductor 610 formed over the insulator 651 may be removed by the CMP (Chemical Mechanical Polishing) method or the like while leaving the conductor 610 formed in the opening.
  • CMP Chemical Mechanical Polishing
  • the insulator 630 is located on the insulator 651 and on the surface on which the conductor 610 is formed. Note that the insulator 630 functions as a dielectric between the pair of electrodes in the capacitor.
  • the conductor 620 is formed on the insulator 630 so that the opening of the insulator 651 is filled.
  • the insulator 650 is formed so as to cover the insulator 630 and the conductor 620.
  • the cylinder-type capacitive element 600B shown in FIG. 45 can have a higher capacitance value than the planar-type capacitive element 600A. Therefore, for example, by applying the capacitor 600B as the capacitors C01 and C01m described in the above embodiment, the voltage between the terminals of the capacitor can be maintained for a long time.
  • CAAC c-axis aligned crystal
  • CAC Cloud-aligned Composite
  • CAC-OS or CAC-metal oxide has a conductive function in a part of the material and an insulating function in a part of the material, and the whole material has a function as a semiconductor.
  • the conductive function is a function of flowing electrons (or holes) serving as carriers
  • the insulating function is an electron serving as carriers. It is a function that does not flow.
  • a function of switching (a function of turning on / off) can be imparted to the CAC-OS or the CAC-metal oxide by causing the conductive function and the insulating function to act complementarily. By separating each function in CAC-OS or CAC-metal oxide, both functions can be maximized.
  • the CAC-OS or the CAC-metal oxide has a conductive region and an insulating region.
  • the conductive region has the above-described conductive function
  • the insulating region has the above-described insulating function.
  • the conductive region and the insulating region may be separated at the nanoparticle level.
  • the conductive region and the insulating region may be unevenly distributed in the material, respectively.
  • the conductive region may be observed with the periphery blurred and connected in a cloud shape.
  • the conductive region and the insulating region are dispersed in the material with a size of 0.5 nm to 10 nm, preferably 0.5 nm to 3 nm, respectively. There is.
  • CAC-OS or CAC-metal oxide is composed of components having different band gaps.
  • CAC-OS or CAC-metal oxide includes a component having a wide gap caused by an insulating region and a component having a narrow gap caused by a conductive region.
  • the carrier when the carrier flows, the carrier mainly flows in the component having the narrow gap.
  • the component having a narrow gap acts in a complementary manner to the component having a wide gap, and the carrier flows through the component having the wide gap in conjunction with the component having the narrow gap. Therefore, when the CAC-OS or the CAC-metal oxide is used for a channel formation region of a transistor, high current driving force, that is, high on-state current and high field-effect mobility can be obtained in the on-state of the transistor.
  • CAC-OS or CAC-metal oxide can also be called a matrix composite (metal matrix composite) or a metal matrix composite (metal matrix composite).
  • An oxide semiconductor is classified into a single crystal oxide semiconductor and a non-single-crystal oxide semiconductor.
  • the non-single-crystal oxide semiconductor include a CAAC-OS (c-axis aligned crystal oxide semiconductor), a polycrystalline oxide semiconductor, an nc-OS (nanocrystalline oxide semiconductor), and a pseudo-amorphous oxide semiconductor (a-like oxide semiconductor).
  • OS amorphous-like oxide semiconductor) and amorphous oxide semiconductor.
  • the CAAC-OS has a c-axis orientation and a crystal structure in which a plurality of nanocrystals are connected in the ab plane direction and has a strain.
  • the strain refers to a portion where the orientation of the lattice arrangement changes between a region where the lattice arrangement is aligned and a region where another lattice arrangement is aligned in a region where a plurality of nanocrystals are connected.
  • Nanocrystals are based on hexagons, but are not limited to regular hexagons and may be non-regular hexagons.
  • a lattice arrangement such as a pentagon and a heptagon in terms of distortion.
  • a clear crystal grain boundary also referred to as a grain boundary
  • the formation of crystal grain boundaries is suppressed by the distortion of the lattice arrangement. This is because the CAAC-OS can tolerate distortion due to the fact that the arrangement of oxygen atoms is not dense in the ab plane direction and the bond distance between atoms changes due to substitution of metal elements. This is probably because of this.
  • the CAAC-OS is a layered crystal in which a layer containing indium and oxygen (hereinafter referred to as an In layer) and a layer including elements M, zinc, and oxygen (hereinafter referred to as (M, Zn) layers) are stacked.
  • In layer a layer containing indium and oxygen
  • M, Zn elements M, zinc, and oxygen
  • indium and the element M can be replaced with each other, and when the element M in the (M, Zn) layer is replaced with indium, it can also be expressed as an (In, M, Zn) layer. Further, when indium in the In layer is replaced with the element M, it can also be expressed as an (In, M) layer.
  • CAAC-OS is an oxide semiconductor with high crystallinity.
  • CAAC-OS cannot confirm a clear crystal grain boundary, it can be said that a decrease in electron mobility due to the crystal grain boundary hardly occurs.
  • the CAAC-OS can be said to be an oxide semiconductor with few impurities and defects (such as oxygen vacancies). Therefore, the physical properties of the oxide semiconductor including a CAAC-OS are stable. Therefore, an oxide semiconductor including a CAAC-OS is resistant to heat and has high reliability.
  • the CAAC-OS is stable even at a high temperature (so-called thermal budget) in the manufacturing process. Therefore, when a CAAC-OS is used for the OS transistor, the degree of freedom in the manufacturing process can be increased.
  • Nc-OS has periodicity in atomic arrangement in a minute region (for example, a region of 1 nm to 10 nm, particularly a region of 1 nm to 3 nm).
  • the nc-OS has no regularity in crystal orientation between different nanocrystals. Therefore, orientation is not seen in the whole film. Therefore, the nc-OS may not be distinguished from an a-like OS or an amorphous oxide semiconductor depending on an analysis method.
  • the a-like OS is an oxide semiconductor having a structure between the nc-OS and the amorphous oxide semiconductor.
  • the a-like OS has a void or a low density region. That is, the a-like OS has lower crystallinity than the nc-OS and the CAAC-OS.
  • Oxide semiconductors have various structures and have different characteristics.
  • the oxide semiconductor of one embodiment of the present invention may include two or more of an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-like OS, an nc-OS, and a CAAC-OS.
  • a transistor with high field effect mobility can be realized by using the above oxide semiconductor for a transistor.
  • a highly reliable transistor can be realized.
  • an oxide semiconductor with low carrier density is preferably used.
  • the impurity concentration in the oxide semiconductor film may be decreased and the defect level density may be decreased.
  • a low impurity concentration and a low density of defect states are referred to as high purity intrinsic or substantially high purity intrinsic.
  • the oxide semiconductor has a carrier density of less than 8 ⁇ 10 11 / cm 3 , preferably less than 1 ⁇ 10 11 / cm 3 , more preferably less than 1 ⁇ 10 10 / cm 3 , and 1 ⁇ 10 ⁇ 9 / What is necessary is just to be cm 3 or more.
  • a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low defect level density and thus may have a low trap level density.
  • the charge trapped in the trap level of the oxide semiconductor takes a long time to disappear, and may behave as if it were a fixed charge. Therefore, a transistor in which a channel formation region is formed in an oxide semiconductor with a high trap state density may have unstable electrical characteristics.
  • Impurities include hydrogen, nitrogen, alkali metal, alkaline earth metal, iron, nickel, silicon, and the like.
  • the concentration of silicon or carbon in the oxide semiconductor and the concentration of silicon or carbon in the vicinity of the interface with the oxide semiconductor are 2 ⁇ 10 18 atoms / cm 3 or less, preferably 2 ⁇ 10 17 atoms / cm 3 or less.
  • the oxide semiconductor contains an alkali metal or an alkaline earth metal
  • a defect level may be formed and carriers may be generated. Therefore, a transistor including an oxide semiconductor containing an alkali metal or an alkaline earth metal is likely to be normally on. Therefore, it is preferable to reduce the concentration of alkali metal or alkaline earth metal in the oxide semiconductor.
  • the concentration of an alkali metal or an alkaline earth metal in an oxide semiconductor obtained by SIMS is set to 1 ⁇ 10 18 atoms / cm 3 or less, preferably 2 ⁇ 10 16 atoms / cm 3 or less.
  • nitrogen in the oxide semiconductor is preferably reduced as much as possible.
  • the nitrogen concentration in the oxide semiconductor is less than 5 ⁇ 10 19 atoms / cm 3 in SIMS, preferably 5 ⁇ 10 18. atoms / cm 3 or less, more preferably 1 ⁇ 10 18 atoms / cm 3 or less, and even more preferably 5 ⁇ 10 17 atoms / cm 3 or less.
  • the oxide semiconductor reacts with oxygen bonded to a metal atom to become water, so that an oxygen vacancy may be formed in some cases.
  • an oxygen vacancy may be formed in some cases.
  • electrons serving as carriers may be generated.
  • a part of hydrogen may be combined with oxygen bonded to a metal atom to generate electrons as carriers. Therefore, a transistor including an oxide semiconductor containing hydrogen is likely to be normally on. For this reason, it is preferable that hydrogen in the oxide semiconductor be reduced as much as possible.
  • the hydrogen concentration obtained by SIMS is less than 1 ⁇ 10 20 atoms / cm 3 , preferably less than 1 ⁇ 10 19 atoms / cm 3 , more preferably 5 ⁇ 10 18 atoms / cm 3. Less than 3 , more preferably less than 1 ⁇ 10 18 atoms / cm 3 .
  • Stable electrical characteristics can be provided by using an oxide semiconductor in which impurities are sufficiently reduced for a channel formation region of a transistor.
  • This embodiment shows an example of a semiconductor wafer on which the semiconductor device described in the above embodiment is formed and an electronic component in which the semiconductor device is incorporated.
  • a semiconductor wafer 4800 shown in FIG. 46A includes a wafer 4801 and a plurality of circuit portions 4802 provided on the upper surface of the wafer 4801. Note that a portion without the circuit portion 4802 on the upper surface of the wafer 4801 is a spacing 4803, which is a region for dicing.
  • the semiconductor wafer 4800 can be manufactured by forming a plurality of circuit portions 4802 on the surface of the wafer 4801 by a previous process. Then, the wafer 4801 may be thinned by grinding the opposite surface of the wafer 4801 where the plurality of circuit portions 4802 are formed. By this step, warpage of the wafer 4801 and the like can be reduced, and downsizing as a part can be achieved.
  • the dicing process is performed as the next process. Dicing is performed along the scribe line SCL1 and the scribe line SCL2 (sometimes referred to as a dicing line or a cutting line) indicated by a one-dot chain line.
  • the spacing 4803 is provided so that the plurality of scribe lines SCL1 are parallel, the plurality of scribe lines SCL2 are provided in parallel, and the scribe line SCL1 and the scribe line SCL2 are provided. It is preferable to provide it vertically.
  • a chip 4800a as shown in FIG. 46B can be cut out from the semiconductor wafer 4800.
  • the chip 4800a includes a wafer 4801a, a circuit portion 4802, and a spacing 4803a.
  • the spacing 4803a is preferably as small as possible.
  • the width of the spacing 4803 between the adjacent circuit portions 4802 may be approximately the same as the margin of the scribe line SCL1 or the margin of the scribe line SCL2.
  • the shape of the element substrate of one embodiment of the present invention is not limited to the shape of the semiconductor wafer 4800 illustrated in FIG.
  • a rectangular semiconductor wafer may be used.
  • the shape of the element substrate can be changed as appropriate in accordance with an element manufacturing process and an apparatus for manufacturing the element.
  • FIG. 46C is a perspective view of the electronic component 4700 and the substrate on which the electronic component 4700 is mounted (mounting substrate 4704).
  • An electronic component 4700 illustrated in FIG. 46C includes a lead 4701 and the above-described chip 4800a, and functions as an IC chip or the like.
  • an electronic component 4700 including a semiconductor device such as the arithmetic circuit 110 described in the above embodiment is referred to as a brain morphic processor (BMP).
  • BMP brain morphic processor
  • the electronic component 4700 includes, for example, a wire bonding process in which leads 4701 of the lead frame and electrodes on the chip 4800a are electrically connected with a thin metal wire (wire), a molding process in which sealing is performed with an epoxy resin, and the like.
  • the lead 4701 can be plated and the package surface can be printed. Further, for example, ball bonding or wedge bonding can be used for the wire bonding step.
  • QFP Quad Flat Package
  • the electronic component 4700 is mounted on a printed circuit board 4702, for example.
  • a plurality of such IC chips are combined and each is electrically connected on the printed circuit board 4702, whereby the mounting substrate 4704 is completed.
  • FIG. 46D is a perspective view of the electronic component 4730.
  • Electronic component 4730 is an example of SiP (System in Package) or MCM (Multi Chip Module).
  • an interposer 4731 is provided over a package substrate 4732 (printed substrate), and a semiconductor device 4735 and a plurality of semiconductor devices 4710 are provided over the interposer 4731.
  • the electronic component 4730 includes a semiconductor device 4710.
  • a semiconductor device 4710 for example, the semiconductor device described in the above embodiment, a broadband memory (HBM), or the like can be used.
  • HBM broadband memory
  • an integrated circuit semiconductor device such as a CPU, GPU, FPGA, or memory device can be used.
  • the package substrate 4732 can be a ceramic substrate, a plastic substrate, a glass epoxy substrate, or the like.
  • the interposer 4731 a silicon interposer, a resin interposer, or the like can be used.
  • the interposer 4731 includes a plurality of wirings and has a function of electrically connecting a plurality of integrated circuits having different terminal pitches.
  • the plurality of wirings are provided in a single layer or multiple layers.
  • the interposer 4731 has a function of electrically connecting an integrated circuit provided over the interposer 4731 to an electrode provided over the package substrate 4732.
  • the interposer is sometimes called a “redistribution substrate” or an “intermediate substrate”.
  • a through electrode is provided in the interposer 4731 and the integrated circuit and the package substrate 4732 are electrically connected to each other using the through electrode.
  • TSV Through Silicon Via
  • a silicon interposer As the interposer 4731. Since a silicon interposer does not require an active element, it can be manufactured at a lower cost than an integrated circuit. On the other hand, since the wiring formation of the silicon interposer can be performed by a semiconductor process, it is easy to form a fine wiring which is difficult with the resin interposer.
  • the interposer for mounting the HBM is required to form fine and high-density wiring. Therefore, it is preferable to use a silicon interposer as the interposer for mounting the HBM.
  • a heat sink may be provided so as to overlap with the electronic component 4730.
  • a heat sink it is preferable that the height of the integrated circuit provided over the interposer 4731 be uniform.
  • the heights of the semiconductor device 4710 and the semiconductor device 4735 are preferably aligned.
  • an electrode 4733 may be provided on the bottom of the package substrate 4732.
  • FIG. 46D illustrates an example in which the electrode 4733 is formed using a solder ball.
  • BGA Ball Grid Array
  • the electrode 4733 may be formed using a conductive pin.
  • PGA Peripheral Component Interconnect
  • the electronic component 4730 can be mounted on another board using various mounting methods, not limited to BGA and PGA.
  • BGA Band-B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B Intel® 845555B
  • FIG. 47 illustrates a state in which each electronic device includes an electronic component 4700 (BMP) including the semiconductor device.
  • An information terminal 5500 illustrated in FIG. 47 is a mobile phone (smart phone) which is a kind of information terminal.
  • the information terminal 5500 includes a housing 5510 and a display portion 5511.
  • a touch panel is provided in the display portion 5511 and a button is provided in the housing 5510.
  • the information terminal 5500 can execute an application using artificial intelligence by applying the semiconductor device described in the above embodiment.
  • an application using artificial intelligence for example, an application for recognizing a conversation and displaying the content of the conversation on the display unit 5511, a character or a figure input by the user on the touch panel provided in the display unit 5511, Examples thereof include an application displayed on the display unit 5511 and an application for performing biometric authentication such as a fingerprint and a voiceprint.
  • FIG. 47 shows a smart watch 5900 as an example of a wearable terminal.
  • a smart watch 5900 includes a housing 5901, a display portion 5902, operation buttons 5903, an operation element 5904, a band 5905, and the like.
  • the wearable terminal can execute an application using artificial intelligence by applying the semiconductor device described in the above embodiment.
  • Examples of the application using artificial intelligence include an application for managing the health condition of a person wearing a wearable terminal, and a navigation system for selecting and guiding an optimum path by inputting a destination.
  • FIG. 47 shows a desktop information terminal 5300.
  • the desktop information terminal 5300 includes an information terminal main body 5301, a display 5302, and a keyboard 5303.
  • the desktop information terminal 5300 can execute an application using artificial intelligence by applying the semiconductor device described in the above embodiment.
  • Examples of the application using artificial intelligence include design support software, sentence correction software, menu automatic generation software, and the like. Further, by using the desktop information terminal 5300, new artificial intelligence can be developed.
  • a smartphone and a desktop information terminal are illustrated as examples of the electronic device in FIG. 47, but an information terminal other than the smartphone and the desktop information terminal can be applied.
  • information terminals other than smartphones and desktop information terminals include PDAs (Personal Digital Assistants), notebook information terminals, and workstations.
  • FIG. 47 illustrates an electric refrigerator-freezer 5800 as an example of an electrical appliance.
  • An electric refrigerator-freezer 5800 includes a housing 5801, a refrigerator compartment door 5802, a refrigerator compartment door 5803, and the like.
  • the electric refrigerator-freezer 5800 having artificial intelligence can be realized.
  • the electric refrigerator-freezer 5800 is stored in the electric refrigerator-freezer 5800, a function for automatically generating menus based on the ingredients stored in the electric refrigerator-freezer 5800, the expiration date of the ingredients, and the like. It can have a function of automatically adjusting the temperature to the food material.
  • an electric refrigerator-freezer has been described as an electrical appliance.
  • Other electrical appliances include, for example, a vacuum cleaner, a microwave oven, a microwave oven, a rice cooker, a water heater, an IH cooker, a water server, and an air conditioner. Examples include appliances, washing machines, dryers, and audiovisual equipment.
  • FIG. 47 shows a portable game machine 5200 which is an example of a game machine.
  • a portable game machine 5200 includes a housing 5201, a display portion 5202, a button 5203, and the like.
  • FIG. 47 shows a stationary game machine 7500 which is an example of a game machine.
  • the stationary game machine 7500 includes a main body 7520 and a controller 7522.
  • a controller 7522 can be connected to the main body 7520 wirelessly or by wire.
  • the controller 7522 can include a display unit for displaying a game image, a touch panel or stick serving as an input interface other than buttons, a rotary knob, a slide knob, and the like.
  • the controller 7522 is not limited to the shape shown in FIG. 47, and the shape of the controller 7522 may be variously changed according to the game genre.
  • a controller having a shape imitating a gun using a trigger as a button can be used.
  • a controller shaped like a musical instrument or music device can be used.
  • the stationary game machine may be configured to use a game player's gesture and / or voice instead of using a controller, instead of including a camera, a depth sensor, a microphone, and the like.
  • the video of the above-described game machine can be output by a display device such as a television device, a personal computer display, a game display, or a head-mounted display.
  • a display device such as a television device, a personal computer display, a game display, or a head-mounted display.
  • the portable game machine 5200 By applying the semiconductor device described in the above embodiment to the portable game machine 5200, the portable game machine 5200 with low power consumption can be realized. Further, since heat generation from the circuit can be reduced with low power consumption, the influence of the heat generation on the circuit itself, peripheral circuits, and modules can be reduced.
  • the portable game machine 5200 having artificial intelligence can be realized.
  • expressions such as the progress of the game, the behavior of the creatures appearing in the game, and the phenomenon occurring in the game are determined by the program of the game, but by applying artificial intelligence to the portable game machine 5200
  • Expressions that are not limited to game programs are possible. For example, it is possible to express that the content that the player asks, the progress of the game, the time, and the behavior of the person appearing on the game change.
  • a game player when a game that requires a plurality of players is played on the portable game machine 5200, a game player can be formed artificially by artificial intelligence. Therefore, even if one player is made a game player using artificial intelligence, Can play games.
  • FIG. 47 illustrates a portable game machine and a home-use game machine as an example of the game machine, but the electronic device of one embodiment of the present invention is not limited thereto.
  • Examples of the electronic device of one embodiment of the present invention include an arcade game machine installed in an amusement facility (game center, amusement park, etc.), a batting practice pitching machine installed in a sports facility, and the like.
  • the semiconductor device described in any of the above embodiments can be applied to an automobile that is a moving body and the vicinity of a driver's seat of the automobile.
  • FIG. 47 shows an automobile 5700 which is an example of a moving body.
  • an instrument panel that provides various information such as speedometer, tachometer, mileage, fuel gauge, gear condition, air conditioner settings, etc.
  • a display device that displays such information may be provided around the driver's seat.
  • the display device can provide the driver with a view blocked by a pillar or the like, a blind spot of a driver's seat, and the like. . That is, by displaying an image from an imaging device provided outside the automobile 5700, the blind spot can be compensated for and safety can be improved.
  • the semiconductor device described in the above embodiment can be applied as a component of artificial intelligence, for example, the semiconductor device described in the above embodiment can be used in an automatic driving system of an automobile 5700.
  • the semiconductor device can be used in a system that performs road guidance, risk prediction, and the like.
  • the display device may be configured to display information such as road guidance and danger prediction.
  • a moving object can include a train, a monorail, a ship, a flying object (helicopter, unmanned aerial vehicle (drone), airplane, rocket), and the like, and the computer of one embodiment of the present invention is applied to these moving objects.
  • a system using artificial intelligence can be provided.
  • FIG. 47 illustrates a digital camera 6240 that is an example of an imaging apparatus.
  • the digital camera 6240 includes a housing 6241, a display portion 6242, operation buttons 6243, a shutter button 6244, and the like, and a detachable lens 6246 is attached to the digital camera 6240.
  • the digital camera 6240 is configured such that the lens 6246 can be removed from the housing 6241 and replaced, but the lens 6246 and the housing 6241 may be integrated.
  • the digital camera 6240 may have a configuration in which a strobe device, a viewfinder, or the like can be separately attached.
  • the digital camera 6240 By applying the semiconductor device described in the above embodiment to the digital camera 6240, the digital camera 6240 with low power consumption can be realized. Further, since heat generation from the circuit can be reduced with low power consumption, the influence of the heat generation on the circuit itself, peripheral circuits, and modules can be reduced.
  • the digital camera 6240 having artificial intelligence can be realized.
  • the digital camera 6240 can automatically recognize a subject such as a face or an object, or adjust the focus according to the subject, automatically flash a flash according to the environment, or a captured image. And the like.
  • Video camera The semiconductor device described in any of the above embodiments can be applied to a video camera.
  • FIG. 47 illustrates a video camera 6300 that is an example of an imaging apparatus.
  • the video camera 6300 includes a first housing 6301, a second housing 6302, a display portion 6303, operation keys 6304, a lens 6305, a connection portion 6306, and the like.
  • the operation key 6304 and the lens 6305 are provided in the first housing 6301, and the display portion 6303 is provided in the second housing 6302.
  • the first housing 6301 and the second housing 6302 are connected by the connection portion 6306, and the angle between the first housing 6301 and the second housing 6302 can be changed by the connection portion 6306. is there.
  • the video on the display portion 6303 may be switched according to the angle between the first housing 6301 and the second housing 6302 in the connection portion 6306.
  • the video camera 6300 can perform pattern recognition using the artificial intelligence during encoding. By this pattern recognition, difference data of people, animals, objects, etc. included in continuous captured image data can be calculated to compress the data.
  • the semiconductor device described in the above embodiment can be applied to a computer such as a PC (Personal Computer) and an expansion device for an information terminal.
  • a computer such as a PC (Personal Computer) and an expansion device for an information terminal.
  • FIG. 48A shows an expansion device 6100 externally attached to a PC on which a portable chip capable of arithmetic processing is mounted as an example of the expansion device.
  • the expansion device 6100 can perform arithmetic processing by the chip by connecting to a PC with, for example, a USB (Universal Serial Bus).
  • FIG. 48A illustrates an expansion device 6100 that is portable, but the expansion device according to one embodiment of the present invention is not limited thereto, and includes, for example, a cooling fan or the like.
  • the expansion device may be a relatively large form.
  • the expansion device 6100 includes a housing 6101, a cap 6102, a USB connector 6103, and a substrate 6104.
  • the substrate 6104 is housed in the housing 6101.
  • the substrate 6104 is provided with a circuit for driving the semiconductor device described in the above embodiment.
  • a chip 6105 eg, the semiconductor device, the electronic component 4700, or the memory chip described in the above embodiment
  • the USB connector 6103 functions as an interface for connecting to an external device.
  • the processing capability of the PC can be increased. As a result, even a PC with insufficient processing capability can perform calculations such as artificial intelligence and moving image processing.
  • FIG. 48 (B) schematically shows data transmission in the broadcasting system. Specifically, FIG. 48B shows a route through which a radio wave (broadcast signal) transmitted from the broadcast station 5680 reaches the television receiver (TV) 5600 in each home.
  • the TV 5600 includes a receiving device (not shown), and a broadcast signal received by the antenna 5650 is transmitted to the TV 5600 through the receiving device.
  • the antenna 5650 is a UHF (Ultra High Frequency) antenna, but as the antenna 5650, a BS / 110 ° CS antenna, a CS antenna, or the like can also be applied.
  • UHF Ultra High Frequency
  • Radio wave 5675A and radio wave 5675B are broadcast signals for terrestrial broadcasting, and radio tower 5670 amplifies received radio wave 5675A and transmits radio wave 5675B.
  • terrestrial broadcasting can be viewed on the TV 5600 by receiving the radio wave 5675B with the antenna 5650.
  • the broadcasting system is not limited to the terrestrial broadcasting shown in FIG. 48B, and may be satellite broadcasting using an artificial satellite, data broadcasting using an optical line, or the like.
  • the above-described broadcasting system may be a broadcasting system using artificial intelligence by applying the semiconductor device described in the above embodiment.
  • the broadcast data is transmitted from the broadcast station 5680 to the TV 5600 of each home, the broadcast data is compressed by the encoder.
  • the decoder of the receiving device included in the TV 5600 stores the broadcast data. Restoration is performed.
  • artificial intelligence for example, in motion compensated prediction, which is one of encoder compression methods, a display pattern included in a display image can be recognized.
  • intra-frame prediction using artificial intelligence can also be performed. For example, when broadcast data with a low resolution is received and the broadcast data is displayed on the TV 5600 with a high resolution, an image interpolation process such as up-conversion can be performed in the restoration of the broadcast data by the decoder.
  • the above-described broadcasting system using artificial intelligence is suitable for ultra-high definition television (UHDTV: 4K, 8K) broadcasting in which the amount of broadcast data increases.
  • a TV 5600 may be provided with a recording device having artificial intelligence.
  • a recording device having artificial intelligence By adopting such a configuration, it is possible to automatically record a program that meets the user's preference by causing the recording device to learn the user's preference using artificial intelligence.
  • FIG. 48C shows a palm print authentication apparatus, which includes a housing 6431, a display portion 6432, a palm print reading portion 6433, and a wiring 6434.
  • FIG. 48C shows a state in which the palmprint authentication apparatus acquires the palmprint of the hand 6435.
  • the acquired palm print is subjected to pattern recognition processing using artificial intelligence, and it can be determined whether or not the palm print belongs to the user. Thereby, it is possible to construct a system that performs authentication with high security.
  • the authentication system according to one aspect of the present invention is not limited to a palm print authentication device, and is a device that performs biometric authentication by acquiring biometric information such as fingerprints, veins, faces, irises, voiceprints, genes, and physiques. Also good.
  • MPC circuit, MPC [1]: circuit, MPC [i]: circuit, MPC [m]: circuit, ACTF: circuit, TRF: conversion circuit, BF1: circuit, BF2: circuit, SC: switching circuit, DINV1: inverter Circuit, DINV2: inverter circuit, INV1: inverter circuit, INV1A: inverter circuit, INV2: inverter circuit, INV3: inverter circuit, SINV1: inverter circuit, SINV2: inverter circuit, HCA: holding unit, HCAm: holding unit, HCA1: holding Section, HCA2: holding section, HCB: holding section, LGC1: logic circuit, LGC2: logic circuit, E [1]: matching circuit, E [2]: matching circuit, E [i]: matching circuit, E [m ⁇ 2]: coincidence circuit, E [m ⁇ 1]: coincidence circuit, E [m]: coincidence circuit, inp: terminal, inn: terminal, outp: Child, outn: terminal, wt:

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033228A (ja) * 2011-06-30 2013-02-14 Semiconductor Energy Lab Co Ltd 半導体装置
JP2013054346A (ja) * 2011-08-05 2013-03-21 Semiconductor Energy Lab Co Ltd 半導体装置
JP2015181228A (ja) * 2014-03-06 2015-10-15 株式会社半導体エネルギー研究所 電圧制御発振器、半導体装置、および電子機器
JP2016032297A (ja) * 2014-07-25 2016-03-07 株式会社半導体エネルギー研究所 発振回路、および、それを有する半導体装置
JP2017085571A (ja) * 2015-10-30 2017-05-18 株式会社半導体エネルギー研究所 半導体装置および電子機器
JP2017208815A (ja) * 2016-05-13 2017-11-24 株式会社半導体エネルギー研究所 半導体装置
JP2018109968A (ja) * 2016-12-28 2018-07-12 株式会社半導体エネルギー研究所 ニューラルネットワークを利用したデータ処理装置、電子部品、および電子機器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62272619A (ja) * 1986-05-21 1987-11-26 Hitachi Ltd 遅延回路
JP3873448B2 (ja) * 1998-04-23 2007-01-24 株式会社デンソー 論理演算回路
JP2000022160A (ja) * 1998-07-06 2000-01-21 Hitachi Ltd 半導体集積回路及びその製造方法
US7592841B2 (en) * 2006-05-11 2009-09-22 Dsm Solutions, Inc. Circuit configurations having four terminal JFET devices
JP6013084B2 (ja) * 2012-08-24 2016-10-25 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
KR101985953B1 (ko) * 2013-06-17 2019-06-05 에스케이하이닉스 주식회사 펌핑 회로
FR3009149A1 (fr) 2013-07-24 2015-01-30 St Microelectronics Sa Element a retard variable
JP5885719B2 (ja) * 2013-09-09 2016-03-15 株式会社東芝 識別装置および演算装置
KR20180063084A (ko) * 2015-09-30 2018-06-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 기기
JP2017108397A (ja) * 2015-11-30 2017-06-15 株式会社半導体エネルギー研究所 信号処理回路、及び該信号処理回路を有する半導体装置
JP6846297B2 (ja) 2016-06-20 2021-03-24 キオクシア株式会社 演算装置
US10410571B2 (en) * 2016-08-03 2019-09-10 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033228A (ja) * 2011-06-30 2013-02-14 Semiconductor Energy Lab Co Ltd 半導体装置
JP2013054346A (ja) * 2011-08-05 2013-03-21 Semiconductor Energy Lab Co Ltd 半導体装置
JP2015181228A (ja) * 2014-03-06 2015-10-15 株式会社半導体エネルギー研究所 電圧制御発振器、半導体装置、および電子機器
JP2016032297A (ja) * 2014-07-25 2016-03-07 株式会社半導体エネルギー研究所 発振回路、および、それを有する半導体装置
JP2017085571A (ja) * 2015-10-30 2017-05-18 株式会社半導体エネルギー研究所 半導体装置および電子機器
JP2017208815A (ja) * 2016-05-13 2017-11-24 株式会社半導体エネルギー研究所 半導体装置
JP2018109968A (ja) * 2016-12-28 2018-07-12 株式会社半導体エネルギー研究所 ニューラルネットワークを利用したデータ処理装置、電子部品、および電子機器

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