WO2019218491A1 - 一种柔性电路板及显示屏 - Google Patents

一种柔性电路板及显示屏 Download PDF

Info

Publication number
WO2019218491A1
WO2019218491A1 PCT/CN2018/098083 CN2018098083W WO2019218491A1 WO 2019218491 A1 WO2019218491 A1 WO 2019218491A1 CN 2018098083 W CN2018098083 W CN 2018098083W WO 2019218491 A1 WO2019218491 A1 WO 2019218491A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
layer
cover layer
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/098083
Other languages
English (en)
French (fr)
Inventor
吴嘉树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/630,488 priority Critical patent/US11006519B2/en
Publication of WO2019218491A1 publication Critical patent/WO2019218491A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible circuit board and a display screen.
  • a flexible circuit board is used to bond with the display panel and bend the flexible circuit board, thereby reducing the length of the display-free area and achieving a high aspect ratio. Claim.
  • the flexible circuit board is prone to micro-cracks after bending, the circuit is broken or the circuit is peeled off, resulting in poor display of the flexible AMOLED display.
  • a photosensitive adhesive or a Tafel adhesive is applied to a bonding region and a bent region of a flexible circuit board to prevent defects of the flexible circuit board after bending.
  • the coating uniformity of a large area is not well controlled, the thickness of the coating is limited, the thickness is too thick, the bending is not easy, and the strength of the glue is limited.
  • the object of the present invention is to provide a flexible circuit board and a display screen, which make the flexible circuit board easier to bend, avoid circuit damage, improve the strength of the flexible circuit board, and effectively protect the flexible circuit board.
  • the present invention provides a flexible circuit board comprising: a base body and a protective layer disposed on the base body; wherein
  • the protective layer includes a glue layer, a first cover layer, a patterned functional layer and a second cover layer which are sequentially stacked on the base body, and the graphic function layer includes a frame and a plurality of frames disposed in the frame a bending portion, the plurality of bending portions are arranged in the frame at intervals, and an arrangement direction of the plurality of bending portions is consistent with a bending direction of the flexible circuit board;
  • the frame and the plurality of bent portions are made of a flexible inorganic fiber material or a thin metal; the first cover layer and the second cover layer are made of polyimide or polyethylene terephthalate. Alcohol ester.
  • the flexible inorganic fiber material comprises glass fiber, ceramic fiber or carbon fiber.
  • the base body includes a bent portion, and the protective layer is disposed above the bent portion.
  • the substrate further includes a bonding region for bonding the panel
  • the protective layer has an area larger than an area of the bending region, and the protective layer is The bend zone extends to the bond zone.
  • the side of the protective layer that is in contact with the bonding region is provided with a viscous material such that the flexible circuit board is bonded and fixed to the panel by the viscous material.
  • the projection of the patterned functional layer on the first cover layer is located within the first cover layer.
  • the projection of the first cover layer on the substrate coincides with the projection of the second cover layer on the substrate.
  • the present invention also provides a flexible circuit board comprising: a base body and a protective layer disposed on the base body; wherein
  • the protective layer includes a glue layer, a first cover layer, a patterned functional layer and a second cover layer which are sequentially stacked on the base body
  • the graphic function layer includes a frame and a plurality of frames disposed in the frame In the bent portion, the plurality of bent portions are arranged in the frame at intervals, and the arrangement direction of the plurality of bent portions coincides with the bending direction of the flexible circuit board.
  • the frame and the plurality of bent portions are made of a flexible inorganic fiber material or a thin metal.
  • the flexible inorganic fiber material comprises glass fiber, ceramic fiber or carbon fiber.
  • the base body includes a bent portion, and the protective layer is disposed above the bent portion.
  • the substrate further includes a bonding region for bonding the panel
  • the protective layer has an area larger than an area of the bending region, and the protective layer is The bend zone extends to the bond zone.
  • the side of the protective layer that is in contact with the bonding region is provided with a viscous material such that the flexible circuit board is bonded and fixed to the panel by the viscous material.
  • the first cover layer and the second cover layer are made of polyimide or polyethylene terephthalate.
  • the projection of the patterned functional layer on the first cover layer is located within the first cover layer.
  • the projection of the first cover layer on the substrate coincides with the projection of the second cover layer on the substrate.
  • the present invention also provides a display screen including a flexible circuit board including: a base body and a protective layer disposed on the base body; wherein
  • the protective layer includes a glue layer, a first cover layer, a patterned functional layer and a second cover layer which are sequentially stacked on the base body
  • the graphic function layer includes a frame and a plurality of frames disposed in the frame In the bent portion, the plurality of bent portions are arranged in the frame at intervals, and the arrangement direction of the plurality of bent portions coincides with the bending direction of the flexible circuit board.
  • the frame and the plurality of bent portions are made of a flexible inorganic fiber material or a thin metal.
  • the flexible inorganic fiber material comprises glass fibers, ceramic fibers or carbon fibers.
  • the base body includes a bending zone, and the protective layer is disposed above the bending zone.
  • the flexible circuit board and the display screen provided by the invention provide a glue layer, a first cover layer, a graphic functional layer and a second cover layer on the base of the flexible circuit board, and the graphic functional layer comprises a frame and a plurality of frames arranged in the frame a plurality of bent portions are arranged in the frame at intervals, and the direction of the plurality of bent portions is aligned with the bending direction of the flexible circuit board, so that the flexible circuit board is bent at a plurality of intervals
  • the folding portion serves to promote the bending of the flexible circuit board.
  • the frame functions to fix, protect, and strengthen the flexible circuit board, thereby avoiding damage to the circuit and improving the strength of the flexible circuit board, thereby effectively protecting the flexible circuit board. , improve the quality of the display.
  • FIG. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present invention.
  • FIG. 2 is a schematic plan view of a patterned functional layer in a flexible circuit board according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • FIG. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present invention
  • FIG. 2 is a schematic plan view of a patterned functional layer in a flexible circuit board according to an embodiment of the present invention
  • a flexible circuit board 1 according to an embodiment of the present invention includes a base 10 and a protective layer 20 disposed on the base 10.
  • the protective layer 20 includes a glue laminated on the base 10 in sequence.
  • the layer 201, the first cover layer 202, the patterned functional layer 203, and the second cover layer 204 are examples of the base 10 in sequence.
  • a glue layer 201, a first cover layer 202, a patterned functional layer 203, and a second cover layer 204 are disposed on the base 10 of the flexible circuit board 1.
  • the first cover layer 202, the patterned functional layer 203, and the second cover layer 204 are disposed.
  • the thickness and the number of the adhesive layer are reduced to prevent the occurrence of the overflow phenomenon, and the thickness of the flexible circuit board 1 is more easily bent, and the microcircuit crack of the flexible circuit board 1 can be prevented. , the circuit is broken or peeled off.
  • the graphical function layer 203 includes a frame 2031 and a plurality of bent portions 2032 disposed in the frame 2031.
  • the plurality of bent portions 2032 are spaced apart in the frame 2031, and the direction and flexibility of the plurality of bent portions 2032 are arranged.
  • the bending direction of the circuit board 1 is the same, so that when the flexible circuit board 1 is bent, the plurality of spaced-apart bending portions 2032 function to promote the bending of the flexible circuit board 1.
  • the frame 2031 is fixed, protected, and The function of the flexible circuit board 1 is strengthened to avoid the damage of the circuit, and the strength of the flexible circuit board 1 is improved, the flexible circuit board 1 is effectively protected, and the quality of the display screen is improved.
  • the frame 2031 and the plurality of bent portions 2032 in the patterned functional layer 203 are made of a flexible inorganic fiber material or a thin metal, and the patterned functional layer 203 makes the flexible circuit board 1 have a certain strength. At the same time, it also has the characteristics of being easy to bend.
  • the flexible inorganic fiber material may be glass fiber, ceramic fiber or carbon fiber.
  • the projection of the patterned functional layer 203 on the first cover layer 202 is located in the first cover layer 202; in addition, the projection of the first cover layer 202 on the base 10 and the projection of the second cover layer 204 on the base 10 coincide.
  • the first cover layer 202 and the second cover layer 204 are made of polyimide or polyethylene terephthalate. That is, both the first cover layer 202 and the second cover layer 204 have characteristics of easy molding and flexibility.
  • the base 10 includes a bending zone 101, and the protective layer 20 is disposed above the bending zone 101.
  • the protective layer 20 is bent in the bending zone 101, the bending zone 101 can be more easily bent than the prior art, and the strength of the bending zone 101 can be increased, so that the bending zone 101 can be effectively protected.
  • the base 10 further includes a bonding area 102 for bonding the panel to connect the flexible circuit board 1 to the panel.
  • the area of the protective layer 20 is larger than the area of the bent area 101, and the protective layer 20 extends from the bent area 101 to the bonded area 102.
  • the protective layer 20 is disposed over the bend region 101 and the bond region 102.
  • the side of the protective layer 20 in contact with the bonding region 102 is provided with a viscous material such that the flexible circuit board 1 is bonded and fixed to the panel by a viscous material.
  • the present invention also provides a display screen, which includes the flexible circuit board described above, and may be specifically referred to above, and will not be described herein.
  • the flexible circuit board and the display screen provided by the invention provide a glue layer, a first cover layer, a graphic functional layer and a second cover layer on the base of the flexible circuit board, and the graphic functional layer comprises a frame and a plurality of frames arranged in the frame a plurality of bent portions are arranged in the frame at intervals, and the direction of the plurality of bent portions is aligned with the bending direction of the flexible circuit board, so that the flexible circuit board is bent at a plurality of intervals
  • the folding portion serves to promote the bending of the flexible circuit board.
  • the frame functions to fix, protect, and strengthen the flexible circuit board, thereby avoiding damage to the circuit and improving the strength of the flexible circuit board, thereby effectively protecting the flexible circuit board. , improve the quality of the display.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明提供一种柔性电路板及显示屏，包括：基体以及设置在基体上的保护层；其中，保护层包括依次层叠设置于基体上的胶层、第一覆盖层、图形化功能层、第二覆盖层，图形化功能层包括边框以及多个弯折部，多个弯折部间隔排列在边框内，且多个弯折部的排列方向与柔性电路板的弯折方向一致。

Description

一种柔性电路板及显示屏 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性电路板及显示屏。
 背景技术
目前在柔性AMOLED显示屏的设计中，为了实现窄边框的目的，现采用软性电路板与显示面板粘结并弯折软性电路板，以此来减少无显示区的长度，达到高占屏比的要求。但是软性电路板在弯折后易产生微裂纹，电路断裂或者电路剥离，导致柔性AMOLED显示屏显示不良。
现有技术中在软性电路板的粘结区域和弯折区域涂布光敏胶或者塔菲胶来防止软性电路板在弯折后产生的缺陷。但大面积的涂布均匀性不好控制，涂布的厚度有限制，厚度太厚不易弯折及胶的强度有限制等。
 技术问题
本发明的目的在于提供一种柔性电路板及显示屏，使柔性电路板更易弯折，避免电路受损，提高柔性电路板的强度，有效地保护柔性电路板。
 技术解决方案
本发明提供一种柔性电路板，其包括：基体以及设置在所述基体上的保护层；其中，
所述保护层包括依次层叠设置于所述基体上的胶层、第一覆盖层、图形化功能层、第二覆盖层，所述图形化功能层包括边框以及设置在所述边框内的多个弯折部，所述多个弯折部间隔排列在所述边框内，且所述多个弯折部的排列方向与所述柔性电路板的弯折方向一致；
所述边框和所述多个弯折部的材质为柔性无机纤维材料或薄型金属；所述第一覆盖层和所述第二覆盖层的材质为聚酰亚胺或聚对苯二甲酸乙二醇酯。
在本发明的柔性电路板中，所述柔性无机纤维材料包括玻璃纤维、陶瓷纤维或碳纤维。
在本发明的柔性电路板中，所述基体包括弯折区，所述保护层设置在所述弯折区之上。
在本发明的柔性电路板中，所述基体还包括粘结区，所述粘结区用于粘结面板，所述保护层的面积大于所述弯折区的面积，所述保护层从所述弯折区延伸至所述粘结区。
在本发明的柔性电路板中，所述保护层与所述粘结区接触的一侧设置有粘性材料，以使得柔性电路板通过所述粘性材料与所述面板粘结固定。
在本发明的柔性电路板中，所述图形化功能层在所述第一覆盖层上的投影位于所述第一覆盖层内。
在本发明的柔性电路板中，所述第一覆盖层在所述基体上的投影与所述第二覆盖层在所述基体上的投影重合。
本发明还提供一种柔性电路板，包括：基体以及设置在所述基体上的保护层；其中，
所述保护层包括依次层叠设置于所述基体上的胶层、第一覆盖层、图形化功能层、第二覆盖层，所述图形化功能层包括边框以及设置在所述边框内的多个弯折部，所述多个弯折部间隔排列在所述边框内，且所述多个弯折部的排列方向与所述柔性电路板的弯折方向一致。
在本发明的柔性电路板中，所述边框和所述多个弯折部的材质为柔性无机纤维材料或薄型金属。
在本发明的柔性电路板中，所述柔性无机纤维材料包括玻璃纤维、陶瓷纤维或碳纤维。
在本发明的柔性电路板中，所述基体包括弯折区，所述保护层设置在所述弯折区之上。
在本发明的柔性电路板中，所述基体还包括粘结区，所述粘结区用于粘结面板，所述保护层的面积大于所述弯折区的面积，所述保护层从所述弯折区延伸至所述粘结区。
在本发明的柔性电路板中，所述保护层与所述粘结区接触的一侧设置有粘性材料，以使得柔性电路板通过所述粘性材料与所述面板粘结固定。
在本发明的柔性电路板中，所述第一覆盖层和所述第二覆盖层的材质为聚酰亚胺或聚对苯二甲酸乙二醇酯。
在本发明的柔性电路板中，所述图形化功能层在所述第一覆盖层上的投影位于所述第一覆盖层内。
在本发明的柔性电路板中，所述第一覆盖层在所述基体上的投影与所述第二覆盖层在所述基体上的投影重合。
本发明还提供一种显示屏，其包括柔性电路板，所述柔性电路板包括：基体以及设置在所述基体上的保护层；其中，
所述保护层包括依次层叠设置于所述基体上的胶层、第一覆盖层、图形化功能层、第二覆盖层，所述图形化功能层包括边框以及设置在所述边框内的多个弯折部，所述多个弯折部间隔排列在所述边框内，且所述多个弯折部的排列方向与所述柔性电路板的弯折方向一致。
在本发明的显示屏中，所述边框和所述多个弯折部的材质为柔性无机纤维材料或薄型金属。
在本发明的显示屏中，所述柔性无机纤维材料包括玻璃纤维、陶瓷纤维或碳纤维。
在本发明的显示屏中，所述基体包括弯折区，所述保护层设置在所述弯折区之上。
 有益效果
本发明提供的柔性电路板及显示屏，在柔性电路板的基体上设置胶层、第一覆盖层、图形化功能层、第二覆盖层，图形化功能层包括边框以及设置在边框内的多个弯折部，多个弯折部间隔排列在边框内，且多个弯折部的排列方向与柔性电路板的弯折方向一致，使柔性电路板在弯折时，多个间隔排列的弯折部起到促进柔性电路板弯折的作用，另外，边框起到固定、保护、强化柔性电路板的作用，避免电路受损的同时提高了柔性电路板的强度，有效地保护了柔性电路板，提高了显示屏的质量。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的柔性电路板的结构示意图。
图2为本发明实施例提供的柔性电路板中图形化功能层的平面示意图。
 本发明的最佳实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1、图2，图1为本发明实施例提供的柔性电路板的结构示意图，图2为本发明实施例提供的柔性电路板中图形化功能层的平面示意图。结合图1、图2所示，本发明实施例提供的柔性电路板1，包括：基体10以及设置在基体10上的保护层20；其中，保护层20包括依次层叠设置于基体10上的胶层201、第一覆盖层202、图形化功能层203、第二覆盖层204。
在柔性电路板1的基体10上设置胶层201、第一覆盖层202、图形化功能层203、第二覆盖层204，使第一覆盖层202、图形化功能层203、第二覆盖层204代替了现有技术中部分的胶层，使胶层的厚度、数量下降，防止溢胶现象的产生，而且厚度降低后使柔性电路板1更易弯折，并且可以防止柔性电路板1产生微裂痕、电路断裂或剥离。
进一步的，图形化功能层203包括边框2031以及设置在边框2031内的多个弯折部2032，多个弯折部2032间隔排列在边框2031内，且多个弯折部2032的排列方向与柔性电路板1的弯折方向一致，使柔性电路板1在弯折时，多个间隔排列的弯折部2032起到促进柔性电路板1弯折的作用，另外，边框2031起到固定、保护、强化柔性电路板1的作用，避免电路受损的同时提高了柔性电路板1的强度，有效地保护了柔性电路板1，提高了显示屏的质量。
在本发明实施例中，该图形化功能层203中的边框2031以及多个弯折部2032的材质为柔性无机纤维材料或薄型金属，该图形化功能层203使柔性电路板1具有一定强度的同时，也具有易弯折的特性。其中，该柔性无机纤维材料可以为玻璃纤维、陶瓷纤维或碳纤维。需要说明的是，在形成该图形化功能层203时，可通过不同的工艺形成边框2031和弯折部2032，以使得边框2031具有高强度与易弯折的特性，弯折部2032具有高强度、易成型、易加工的特性。
进一步的，图形化功能层203在第一覆盖层202上的投影位于第一覆盖层202内；另外，第一覆盖层202在基体10上的投影与第二覆盖层204在基体10上的投影重合。
在本发明的柔性电路板中，第一覆盖层202和第二覆盖层204的材质为聚酰亚胺或聚对苯二甲酸乙二醇酯。也即，第一覆盖层202和第二覆盖层204均具有易成型与易弯曲的特性。
本发明实施例中，基体10包括弯折区101，保护层20设置于弯折区101之上。使保护层20在弯折区101弯折的时候，既可以使弯折区101比现有技术更易弯折，还可以使弯折区101的强度增加，使弯折区101得到有效地保护。
本发明实施例中，基体10还包括粘结区102，粘结区102用于粘结面板，使柔性电路板1与面板相连接。保护层20的面积大于弯折区101的面积，保护层20从弯折区101延伸至粘结区102。使保护层20设置于弯折区101和粘结区102之上。优选的，保护层20与粘结区102接触的一侧设置有粘性材料，以使得柔性电路板1通过粘性材料与面板粘结固定。
本发明还提供一种显示屏，其包括以上所述的柔性电路板，具体可参照以上所述，在此不做赘述。
本发明提供的柔性电路板及显示屏，在柔性电路板的基体上设置胶层、第一覆盖层、图形化功能层、第二覆盖层，图形化功能层包括边框以及设置在边框内的多个弯折部，多个弯折部间隔排列在边框内，且多个弯折部的排列方向与柔性电路板的弯折方向一致，使柔性电路板在弯折时，多个间隔排列的弯折部起到促进柔性电路板弯折的作用，另外，边框起到固定、保护、强化柔性电路板的作用，避免电路受损的同时提高了柔性电路板的强度，有效地保护了柔性电路板，提高了显示屏的质量。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种柔性电路板，其包括：基体以及设置在所述基体上的保护层；其中，
    所述保护层包括依次层叠设置于所述基体上的胶层、第一覆盖层、图形化功能层、第二覆盖层，所述图形化功能层包括边框以及设置在所述边框内的多个弯折部，所述多个弯折部间隔排列在所述边框内，且所述多个弯折部的排列方向与所述柔性电路板的弯折方向一致；
    所述边框和所述多个弯折部的材质为柔性无机纤维材料或薄型金属；所述第一覆盖层和所述第二覆盖层的材质为聚酰亚胺或聚对苯二甲酸乙二醇酯。
  2. 根据权利要求1所述的柔性电路板，其中，所述柔性无机纤维材料包括玻璃纤维、陶瓷纤维或碳纤维。
  3. 根据权利要求1所述的柔性电路板，其中，所述基体包括弯折区，所述保护层设置在所述弯折区之上。
  4. 根据权利要求3所述的柔性电路板，其中，所述基体还包括粘结区，所述粘结区用于粘结面板，所述保护层的面积大于所述弯折区的面积，所述保护层从所述弯折区延伸至所述粘结区。
  5. 根据权利要求4所述的柔性电路板，其中，所述保护层与所述粘结区接触的一侧设置有粘性材料，以使得柔性电路板通过所述粘性材料与所述面板粘结固定。
  6. 根据权利要求1所述的柔性电路板，其中，所述图形化功能层在所述第一覆盖层上的投影位于所述第一覆盖层内。
  7. 根据权利要求1所述的柔性电路板，其中，所述第一覆盖层在所述基体上的投影与所述第二覆盖层在所述基体上的投影重合。
  8. 一种柔性电路板，其包括：基体以及设置在所述基体上的保护层；其中，
    所述保护层包括依次层叠设置于所述基体上的胶层、第一覆盖层、图形化功能层、第二覆盖层，所述图形化功能层包括边框以及设置在所述边框内的多个弯折部，所述多个弯折部间隔排列在所述边框内，且所述多个弯折部的排列方向与所述柔性电路板的弯折方向一致。
  9. 根据权利要求8所述的柔性电路板，其中，所述边框和所述多个弯折部的材质为柔性无机纤维材料或薄型金属。
  10. 根据权利要求9所述的柔性电路板，其中，所述柔性无机纤维材料包括玻璃纤维、陶瓷纤维或碳纤维。
  11. 根据权利要求8所述的柔性电路板，其中，所述基体包括弯折区，所述保护层设置在所述弯折区之上。
  12. 根据权利要求11所述的柔性电路板，其中，所述基体还包括粘结区，所述粘结区用于粘结面板，所述保护层的面积大于所述弯折区的面积，所述保护层从所述弯折区延伸至所述粘结区。
  13. 根据权利要求12所述的柔性电路板，其中，所述保护层与所述粘结区接触的一侧设置有粘性材料，以使得柔性电路板通过所述粘性材料与所述面板粘结固定。
  14. 根据权利要求8所述的柔性电路板，其中，所述第一覆盖层和所述第二覆盖层的材质为聚酰亚胺或聚对苯二甲酸乙二醇酯。
  15. 根据权利要求8所述的柔性电路板，其中，所述图形化功能层在所述第一覆盖层上的投影位于所述第一覆盖层内。
  16. 根据权利要求8所述的柔性电路板，其中，所述第一覆盖层在所述基体上的投影与所述第二覆盖层在所述基体上的投影重合。
  17. 一种显示屏，其包括柔性电路板，所述柔性电路板包括：基体以及设置在所述基体上的保护层；其中，
    所述保护层包括依次层叠设置于所述基体上的胶层、第一覆盖层、图形化功能层、第二覆盖层，所述图形化功能层包括边框以及设置在所述边框内的多个弯折部，所述多个弯折部间隔排列在所述边框内，且所述多个弯折部的排列方向与所述柔性电路板的弯折方向一致。
  18. 根据权利要求17所述的显示屏，其中，所述边框和所述多个弯折部的材质为柔性无机纤维材料或薄型金属。
  19. 根据权利要求17所述的显示屏，其中，所述柔性无机纤维材料包括玻璃纤维、陶瓷纤维或碳纤维。
  20. 根据权利要求17所述的显示屏，其中，所述基体包括弯折区，所述保护层设置在所述弯折区之上。
PCT/CN2018/098083 2018-05-15 2018-08-01 一种柔性电路板及显示屏 Ceased WO2019218491A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/630,488 US11006519B2 (en) 2018-05-15 2018-08-01 Flexible circuit board and display panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810462330.0 2018-05-15
CN201810462330.0A CN108650776B (zh) 2018-05-15 2018-05-15 一种柔性电路板及显示屏

Publications (1)

Publication Number Publication Date
WO2019218491A1 true WO2019218491A1 (zh) 2019-11-21

Family

ID=63755773

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/098083 Ceased WO2019218491A1 (zh) 2018-05-15 2018-08-01 一种柔性电路板及显示屏

Country Status (3)

Country Link
US (1) US11006519B2 (zh)
CN (1) CN108650776B (zh)
WO (1) WO2019218491A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113766727A (zh) * 2021-09-03 2021-12-07 深圳市顺华智显技术有限公司 柔性电路板及其制作方法
CN114035704A (zh) * 2021-11-05 2022-02-11 业成科技（成都）有限公司 电路板结构、背光模组、显示模组及触控显示模组

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11682600B2 (en) * 2019-08-07 2023-06-20 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Protection layer for panel handling systems
US20210407341A1 (en) * 2019-08-19 2021-12-30 Boe Technology Group Co., Ltd. Flexible display apparatus and fabrication method thereof
CN114664180A (zh) * 2020-12-24 2022-06-24 华为技术有限公司 复合结构、柔性屏组件和可折叠终端
CN115416388B (zh) * 2021-05-31 2026-04-21 华为技术有限公司 复合结构、柔性屏组件和可折叠终端
CN115174715A (zh) * 2021-06-30 2022-10-11 Oppo广东移动通信有限公司 柔性显示屏支撑片、柔性显示屏及电子设备
CN114286503B (zh) * 2021-12-28 2024-02-09 武汉天马微电子有限公司 柔性电路板及其制备方法、显示模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183536A (ja) * 2003-12-17 2005-07-07 Seiko Epson Corp フレキシブル配線基板、電気光学装置及び電子機器
US20060215377A1 (en) * 2005-03-23 2006-09-28 Shinko Electric Industries Co., Ltd. Flexible circuit substrate and method of manufacturing the same
CN105960157A (zh) * 2016-07-06 2016-09-21 武汉华星光电技术有限公司 电磁屏蔽保护膜与fpc
CN107743340A (zh) * 2017-11-20 2018-02-27 武汉华星光电半导体显示技术有限公司 柔性电路板及显示屏
CN107911939A (zh) * 2017-11-24 2018-04-13 惠州市鹏程电子科技有限公司 一种柔性印刷电路板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190159335A1 (en) 2017-11-20 2019-05-23 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible circuit board and display panel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183536A (ja) * 2003-12-17 2005-07-07 Seiko Epson Corp フレキシブル配線基板、電気光学装置及び電子機器
US20060215377A1 (en) * 2005-03-23 2006-09-28 Shinko Electric Industries Co., Ltd. Flexible circuit substrate and method of manufacturing the same
CN105960157A (zh) * 2016-07-06 2016-09-21 武汉华星光电技术有限公司 电磁屏蔽保护膜与fpc
CN107743340A (zh) * 2017-11-20 2018-02-27 武汉华星光电半导体显示技术有限公司 柔性电路板及显示屏
CN107911939A (zh) * 2017-11-24 2018-04-13 惠州市鹏程电子科技有限公司 一种柔性印刷电路板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113766727A (zh) * 2021-09-03 2021-12-07 深圳市顺华智显技术有限公司 柔性电路板及其制作方法
CN114035704A (zh) * 2021-11-05 2022-02-11 业成科技（成都）有限公司 电路板结构、背光模组、显示模组及触控显示模组
CN114035704B (zh) * 2021-11-05 2023-07-18 业成科技（成都）有限公司 电路板结构、背光模组、显示模组及触控显示模组

Also Published As

Publication number Publication date
CN108650776A (zh) 2018-10-12
US20200163207A1 (en) 2020-05-21
US11006519B2 (en) 2021-05-11
CN108650776B (zh) 2020-04-03

Similar Documents

Publication Publication Date Title
WO2019218491A1 (zh) 一种柔性电路板及显示屏
WO2021003849A1 (zh) 显示面板及其制备方法
CN213240763U (zh) 一种阵列基板、显示面板及显示装置
WO2019205923A9 (zh) 触控显示模组、显示装置及透明光学胶层结构
WO2020015390A1 (zh) 显示面板及其制造方法
CN110634399B (zh) 一种柔性盖板、柔性显示装置及柔性盖板的制作方法
WO2021217809A1 (zh) Oled 显示屏及其制备方法
WO2020118893A1 (zh) 显示面板及显示装置
JP4820372B2 (ja) 回路部材、電極接続構造及びそれを備えた表示装置
CN115273663A (zh) 显示面板及显示装置
US20210333604A1 (en) Display panel and manufacturing method thereof
WO2021027247A1 (zh) 显示面板
WO2018035934A1 (zh) 触摸屏及其触摸感应组件
US20250275066A1 (en) Display panel and manufacturing method thereof
WO2019095464A1 (zh) 柔性电路板及显示屏
CN112185260B (zh) 显示面板与显示装置
CN104765195A (zh) 一种液晶显示面板及其制作方法、显示装置
WO2019178996A1 (zh) Ltps显示面板及液晶显示器
WO2021035958A1 (zh) 显示面板及其折弯方法及显示装置
WO2022193360A1 (zh) 显示面板和显示装置
CN114415856B (zh) 触控显示装置
CN110824759A (zh) 显示面板及显示装置
CN105425333A (zh) 一种导光基板、背光模组及显示装置
JP2008046307A (ja) 液晶表示パネル
WO2020238015A1 (zh) 一种触控显示面板及显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18918893

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18918893

Country of ref document: EP

Kind code of ref document: A1