WO2019216516A1

WO2019216516A1 - Apparatus and method for automatically supplying solder container

Info

Publication number: WO2019216516A1
Application number: PCT/KR2019/000262
Authority: WO
Inventors: 김귀한; 최지욱; 심은혁
Original assignee: 한화정밀기계 주식회사
Priority date: 2018-05-10
Filing date: 2019-01-08
Publication date: 2019-11-14
Also published as: CN110475438A; CN110475438B; KR102051499B1; KR20190129167A

Abstract

The present invention relates to an apparatus and a method for automatically supplying a solder container, the apparatus comprising: a supply unit for supplying a solder container by means of the weight of the solder container; a mount unit for mounting the solder container supplied from the supply unit; a work unit for applying solder paste on a printed circuit board while having mounted the solder container supplied from the mount unit; and a transfer unit for reciprocatively transferring the mount unit between the supply unit and the work unit. The work unit can comprise: a standby zone in which the solder container is positioned in a standby state before being mounted; a mount zone in which the solder container moved from the standby zone is mounted; and a discharge zone in which, in accordance with a remaining amount measurement value from a sensor which has measured the amount of remaining solder paste inside the solder container mounted in the mount zone, the mounted solder container is moved to be discharged.

Description

Automatic feeding device and method of solder container

The present invention relates to an automatic supplying device and method of a solder container, and more particularly, a solder container capable of automatically draining a solder-drained container without interruption of the process, and automatically supplying a new container filled with solder. Relates to an automatic feeding device and method.

In general, a printed circuit board (PCB) embedded as a main component of an electronic device such as a computer or a home appliance is a molten solder so that various types of small electronic components such as semiconductor chips or resistance chips can be mounted. The paste is applied in a regular pattern.

The application process of the solder paste is performed by a solder paste coating apparatus called a screen printer. The screen printer presses a solder paste supplied on a metal mask on which a specific pattern of opening is formed with a squeegee to print a printed circuit board. It is applied to the parts mounting part of.

In such a conventional screen printer, after mounting a solder container filled with solder paste, the solder paste is applied onto a printed circuit board (particularly, a mask top surface in which a specific pattern of openings are marked). If not, the solder paste was sometimes applied to the printed circuit board as a defect.

In addition, if the solder paste in the solder container is exhausted, the operator must perform the work of replacing the solder container after the screen printer is stopped, thus requiring additional working time and manpower, thereby improving overall process efficiency. There was a problem of this deterioration.

(Prior art document)

(Patent Document 1) Korean Patent Registration No. 10-1196284 (2012.10.25.)

The present invention has been made in view of the above-mentioned problems, the technical problem to be solved by the present invention, it is possible to automatically replace the solder container without interrupting the process during the process, unnecessary input of labor time and manpower It is to provide an automatic feeding device and method of solder container which can reduce the overall efficiency of the process.

In addition, the technical problem to be solved by the present invention is to provide a solder container automatic supply device and method that can increase the safety of the operator's work performance by minimizing the access and exposure of the operator to the solder paste harmful to the human body.

In addition, the technical problem to be solved by the present invention, by detecting the remaining amount of the solder paste in the solder container, if the remaining amount of the detected solder paste is not enough to be automatically replaced by a new solder container filled with the solder paste, It is an object of the present invention to provide an automatic supply apparatus and method for solder containers that can prevent solder paste from being applied to a printed circuit board in a bad manner.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

Solder container automatic supply apparatus according to an embodiment of the present invention for solving the above problems, the solder container is supplied by its own weight supply; A mounting unit to which the solder container supplied from the supply unit is mounted; A work part for applying solder paste onto a printed circuit board with the solder container supplied from the mounting part mounted; And a transfer part for reciprocating the mounting part between the supply part and the working part, wherein the working part comprises: an atmospheric zone positioned in a standby state before the solder container is mounted; A mounting zone to which the solder container moved from the air zone is mounted; And a discharge zone moved to discharge the mounted solder container according to a measurement value of a sensor measuring the remaining amount of solder paste in the solder container mounted in the mounting zone.

Here, the work part may be provided with a solder detector for detecting a solder paste remaining amount measurement value according to the remaining amount of the solder paste in the solder container.

Here, the solder container mounted in the mounting zone is discharged to the discharge zone according to the solder paste remaining amount measured value of the solder detector, the solder container located in the air zone is moved to the mounting zone, and the supply unit and the The controller may further include a controller configured to apply an input signal to supply a new solder container to the atmospheric zone by driving the mounting unit.

Here, the solder detection unit includes a photoelectric sensor for detecting the level of the solder paste in the solder container, the control unit is applied to the detection value of the photoelectric sensor and the set value of the solder paste to replace the solder container; In comparison, the operation of the supply part, the mounting part, the working part, and the transfer part may be controlled.

Here, the supply unit is disposed to be inclined downward inclined accommodating portion to which the solder container slides; A first cylinder operated according to an input signal of the controller; And a first stopper that moves up and down according to the operation of the first cylinder to intervene the movement of the new solder container disposed on the inclined receiver.

The solder container is supplied to the supply part in a first direction, the mounting part includes a second stopper on a surface facing the first direction so that the solder container supplied is not separated from the solder container, and the transfer part includes the first stopper. The mounting portion can be reciprocated in parallel with a second direction orthogonal to the direction.

On the other hand, the working portion, as the lifting is made, the second cylinder for mounting or detaching the cap on the rear end of the solder container located in the mounting zone; And a milpin for pushing the solder container in order from the mounting portion to the atmosphere zone, the mounting zone to the mounting zone, and the discharge zone to the discharge zone, and a third cylinder for reciprocating the milpin. The second cylinder and the third cylinder may be driven according to an input signal of the controller.

Here, at least one of the supply part, the mounting part or the transfer part may further include a temperature control member for controlling the temperature of the solder paste of the solder container.

The transfer unit may include: a lead screw coupled to the mounting unit to move the mounting unit in a first direction; A transfer motor providing a driving force to rotate the lead screw; And a rail unit coupled to the mounting unit to guide the movement of the mounting unit.

On the other hand, the automatic supply method of the solder container according to an embodiment of the present invention, (a) the operation portion includes an atmosphere zone, the mounting zone and the discharge zone, the step of detecting the remaining amount of solder paste in the solder container mounted in the mounting zone ; (b) separating the solder container mounted in the mounting zone when the remaining amount of the solder paste is equal to or less than a preset value; (c) pushing the exhausted solder container into the discharge zone while pushing and mounting a new solder container located in the atmosphere zone into the mounting zone; (d) mounting a new solder container filled with solder paste supplied to the supply unit to the mounting unit; (e) a conveying unit transferring the mounting unit from the supply unit to the working unit; (f) pushing the new solder container from the mounting portion into the atmosphere zone; And (g) when a new solder container is supplied to the mounting zone of the work part, sealing the rear end of the new solder container with a cap, and then continuously applying solder paste onto a printed circuit board.

Other specific details of the invention are included in the detailed description and drawings.

According to the apparatus and method for automatically supplying a solder container according to an embodiment of the present invention, the solder container can be automatically replaced without interrupting the process during the process, thereby providing an effect of increasing the efficiency of the overall process.

In addition, according to the automatic supply apparatus and method of the solder container according to an embodiment of the present invention, after detecting the remaining amount of the solder paste in the solder container, if the remaining amount of the solder paste is not enough, a new solder container filled with the solder paste The replacement of the furnace may also provide an effect of preventing the solder paste from being poorly applied to the printed circuit board.

In addition, according to the apparatus and method for automatically supplying a solder container according to an embodiment of the present invention, the worker's work performance may be increased by minimizing the worker's access and exposure to the solder paste harmful to the human body.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a block diagram showing a screen printer to which the automatic supply of the solder container according to an embodiment of the present invention is applied.

2 is a view illustrating a supply unit of an automatic supply apparatus of a solder container according to an embodiment of the present invention.

FIG. 3 shows the state immediately before the solder container is mounted from the solder container supply part of FIG. 2 to the mounting part.

4 is a view illustrating a state in which the solder container of FIG. 3 is mounted to a mounting unit.

5A is a view showing a state in which the mounting portion is moved to the X-axis direction by the transfer portion and disposed on the work portion.

FIG. 5B is a view schematically illustrating a second cylinder mounted inside the screen printer in FIG. 5A.

FIG. 5C is another direction diagram schematically illustrating a second cylinder mounted inside the screen printer in FIG. 5A.

6 illustrates a state in which the solder container of the working part is moved in the order of the air zone, the mounting zone and the discharge zone.

7 is a block diagram schematically illustrating a control relationship of an automatic supply apparatus of a solder container according to an embodiment of the present invention.

8 is a block diagram schematically illustrating a control relationship of a temperature regulating member for adjusting a temperature of a solder container in which solder paste is mounted in an automatic supplying device of a solder container according to an embodiment of the present invention.

9 is a flowchart sequentially illustrating a method of automatically supplying a solder container according to an embodiment of the present invention.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

In addition, the embodiments described herein will be described with reference to cross-sectional and / or schematic diagrams, which are ideal illustrations of the invention. Accordingly, shapes of the exemplary views may be modified by manufacturing techniques and / or tolerances. In addition, each component in each drawing shown in the present invention may be shown to be somewhat enlarged or reduced in view of the convenience of description. Like reference numerals refer to like elements throughout.

Hereinafter, a preferred embodiment according to the automatic supply device and method of the solder container of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram illustrating a screen printer 10 to which an automatic supply device for a solder container 100 according to an embodiment of the present invention is applied.

Referring to FIG. 1, the screen printer 10 to which the automatic supply device for the solder container 100 according to the embodiment of the present invention is applied includes a supply part 20 of the solder container 100 and a mounting part of the solder container 100 ( 30), and includes a working part 40 of the solder container 100, and may include a transfer part 50 for moving the mounting part 30 of the solder container 100 in the X-axis direction.

Here, the transfer unit 50 may include a transfer motor 51 and a lead screw 52. The lead unit 52 is rotated by the driving of the transfer motor 51 to X the mounting unit 30. By moving in the axial direction, it is possible to move the solder container 100 mounted on the mounting portion 30 to the working portion 40, a specific operation relationship thereof will be described later.

In addition, although not shown in FIG. 1, the screen printer 10 to which the automatic supply device for the solder container 100 according to the embodiment of the present invention is applied may include a solder detector 200 that detects a paste remaining amount of the solder container 100. ), The control unit 300 may further include an input signal to the supply unit 20, the work unit 40, and the transfer unit 50 according to the measured value of the solder detection unit 200. It will be described later.

2 is a view showing a supply unit 20 of the automatic supply apparatus of the solder container 100 according to an embodiment of the present invention.

Referring to FIG. 2, the supply unit 20 according to the embodiment of the present invention may supply the new solder container 100 filled with the solder paste to the mounting unit 30 by its own weight.

In detail, the supply unit 20 is disposed to be inclined downward so that the inclination receiving unit 21 into which the new solder container 100 can be slid, the first cylinder 22 operated according to an input signal of the control unit 300, and The first stopper 23 may be configured to include a first stopper 23 that moves up and down according to the operation of the first cylinder 22 to intercept the movement of the newly supplied solder container 100.

Therefore, when the operator inputs the solder container 100 filled with the solder paste into the inlet of the supply unit 20, the solder container 100 is inclined toward the mounting portion 30 by the inclined receiver 21 arranged to be inclined downward. When the first stopper 23 is raised, the slip is interrupted by the first stopper 23 to achieve a state of being disposed on the inclined receiver 21.

In this state, when the first cylinder 22 is operated to lower the first stopper 23 according to the input signal, the solder container 100 is lowered by its own weight to be mounted on the mounting portion 30. .

In addition, the supply unit 20 of the automatic supply device of the solder container 100 according to an embodiment of the present invention is to detect the cover 24 and the opening and closing of the cover 24, the inclination receiving portion 21 Opening and closing detection unit 25 may further include.

The control unit 300 may apply whether the transfer unit 50 drives the transfer unit 51 to transfer the mounting unit 30 according to a detection result value of whether the cover 24 of the open / close detection unit 25 is opened or closed. Can be. That is, when the cover 24 of the supply unit 20 is detected to be in an open state, in consideration of the safety of the worker, the driving of the feed motor 51 of the work unit 40 is not applied, and the cover of the supply unit 20 ( When 24 is detected to be closed, driving of the transfer motor 51 may be applied.

3 is a view showing a state immediately before the solder container 100 is mounted from the solder container 100 supply unit 20 of FIG. 2 to the mounting unit 30, and FIG. 4 is a mounting unit of the solder container 100 of FIG. 3. It shows the state attached to the (30).

As described above, the supply unit 20 may block or open the movement of the solder container 100 as the first stopper 23 is elevated by the operation of the first cylinder 22.

At this time, when the first cylinder 22 is operated and the first stopper 23 is lowered, the solder container 100 slides along the lower surface of the inclined accommodation portion 21 by its own weight in a downwardly inclined direction. Will move.

Here, the solder container 100 is supplied to the supply unit 20 in the first direction, and the mounting unit 30 has a second stopper on a surface facing the first direction so that the solder container 100 is not separated. (31).

Since the solder container 100 according to the embodiment of the present invention has a shape of a Jar-type, the second stopper 31 may also be formed to correspond to the round shape of the ruler type solder container 100. have.

In addition, referring to FIG. 2, the first cylinder 22 of the supply unit 20 may have a second stopper 31 and a second stopper 31 in the solder container 100 so that the solder container 100 may be stably mounted to the mounting unit 30. It can be driven to support the opposite lower end (A).

Referring to FIG. 3, the mounting portion 30 has a container shape for accommodating the solder container 100, and the pneumatic pressure of the first cylinder 22 and the second stopper 31 of the solder container 100 may be used. While both sides of the first direction are supported, the solder container 100 can be stably received with respect to the mounting portion 30.

5A is a view showing a state in which the mounting portion 30 is disposed on the work portion 40 by moving in the X-axis direction by the transfer portion 50. FIG. 5B is a view schematically illustrating a second cylinder mounted inside the screen printer in FIG. 5A. FIG. 5C is another direction diagram schematically illustrating a second cylinder mounted inside the screen printer in FIG. 5A.

5A to 5C, in a state in which the solder container 100 is mounted on the mounting portion 30, the mounting portion 30 moves in the X-axis direction to the working portion 40 by the operation of the transfer portion 50. Transfer may be made, and after the solder container 100 is supplied from the mounting portion 30 to the working portion 40, the empty mounting portion 30 is returned from the working portion 40 toward the supply portion 20 again. Can be.

Here, referring again to FIG. 1, the X-axis direction in which the mounting unit 30 reciprocates between the supply unit 20 and the work unit 40 is the first direction in which the solder container 100 is supplied to the supply unit 20. It may be formed parallel to the second direction orthogonal to the.

The work part 40 may apply solder paste onto a printed circuit board in a state in which the solder container 100 supplied from the mounting part 30 is mounted. 1 and 5A to 5C, the work part 40 is a solder container 100 moved from the standby zone 41 and the standby zone 41, which is placed in the standby state before the solder container 100 is mounted. It may be configured to include a mounting zone 42 and the discharge zone 43 is mounted, the discharge zone 43 is a section that is moved to discharge the exhausted solder container 100 from the mounting zone 42 .

Here, the second cylinder 11 for sealing the rear end of the solder container 100 by sealing the cap (not shown) in the upper side of the mounting zone 42 of the working part 40 up and down Can be arranged. The second cylinder 11 is disposed inside the screen printer 10 so that the cylinder formed therein is pressed up and down to press the upper cover of the solder container 100 to solder through an opening opened in the lower part of the solder container 100. May have a structure to be discharged. Therefore, the solder detector 200 to be described later may be disposed adjacent to the second cylinder 11. In addition, a cap is installed at the tip of the second cylinder 11, and a pneumatic hose (not shown) for providing pneumatic pressure may be connected to one side of the cap.

The second cylinder 11 is lifted in response to an input signal to seal the cap at the rear end of the solder container 100 or to separate the cap from the rear end of the solder container 100.

In addition, a lower portion of the mounting zone 42 facing the cap may include a correction unit (not shown) for correcting the position of the solder container 100 moved from the atmospheric zone 41 to the mounting zone 42. The correction unit may be formed to correspond to the round shape of the Jar-type solder container 100 according to the embodiment of the present invention.

Here, the work part 40 may further include a squeeze motor 44, and the squeeze motor 44 may have a work part 40 in a second axis direction parallel to a first axis and an X axis orthogonal to the first axis. Solder paste may be applied onto the printed circuit board while driving the solder container 100 supplied from the mounting unit 30 in the mounting zone 42.

6 illustrates a state in which the solder container 100 of the work part 40 is moved in the order of the atmospheric zone 41, the mounting zone 42, and the discharge zone 43.

Referring to FIG. 6, the working part 40 according to the embodiment of the present invention includes the solder container 100 from the mounting part 30 to the atmospheric zone 41, the mounting zone 42, and the discharge zone of the working part 40. (43) may include a mil pin 46 to push in order, the mil pin 46 is a solder container 100 as the movement in the horizontal direction by the third cylinder (45) actuated by the input signal ) To push the air zone 41, the mounting zone 42 and the discharge zone 43 in order. In addition, the solder container 100 in which the solder paste is exhausted may be collected freely falling into the external collection space.

Since the solder container 100 according to the embodiment of the present invention has a shape of a jar type, the mill pin 46 may also be formed to correspond to the round shape of the solder container 100 of the ruler type.

Meanwhile, a solder detector 200 for measuring the amount of solder paste remaining in the solder container 100 may be disposed in the work part 40, and the solder detector 200 may be the solder container 100 of the mounting zone 42. By detecting the residual amount of solder paste in the () and transmits its signal to the control unit 300, the control unit 300 controls the operation of the supply unit 20 and the mounting unit 30, and the work unit 40 and the transfer unit 50 You can do it.

Here, the solder detection unit 200 is a photoelectric sensor that determines whether light is returned by returning the light, and the remaining amount of the solder paste gradually decreases as it is filled in the solder container 100 and discharged, so that the water level is lower than the set position. When it is lowered (off), the on / off sensor to transmit the off signal to the control unit 300 may be applied.

However, the solder detection unit 200 is an on / off sensor only one embodiment, and the present invention is not limited thereto. If the solder detection unit 200 detects the remaining amount of solder paste in the solder container 100, various conventionally known sensors may be used. Of course, it may be applied.

The automatic supply method of the solder container 100 using the automatic supply device of the solder container 100 according to an embodiment of the present invention that can be made as described above is as follows.

7 is a block diagram schematically illustrating a control relationship of an automatic supply apparatus of the solder container 100 according to an embodiment of the present invention, and FIG. 8 is an automatic supply apparatus of a solder container according to an embodiment of the present invention. It is a block diagram which shows schematically the control relationship of the temperature control member which adjusts the temperature of the solder container which mounts the solder paste. 9 is a flowchart sequentially illustrating a method of automatically supplying a solder container 100 according to an exemplary embodiment of the present invention.

7 to 9, in the automatic supply apparatus of the solder container 100 according to the embodiment of the present invention, the solder detecting unit 200 for detecting the remaining amount of the solder paste in the solder container 100 is the controller 300. Is connected to the circuit, and the control unit 300 is also connected to the supply unit 20, the working unit 40 and the transfer unit 50, respectively.

Therefore, the control unit 300 may control the operation of the supply unit 20, the work unit 40, and the transfer unit 50 according to the input signal of the solder detection unit 200. .

First, in a state in which the solder container 100 is mounted in the mounting zone 42 of the work part 40, the screen printer 10 operates to apply solder paste onto a printed circuit board. The solder detector 200 detects the remaining amount of solder paste in the solder container 100 and transmits the residual amount of solder paste to the controller 300.

In this case, the worker may supply the new solder container 100 filled with the solder paste in the inlet of the supply unit 20 in preparation for the replacement of the solder container 100 used in the process as shown in FIG. 2. .

As such, in a state where the new solder container 100 is supplied to the supply unit 20, the solder container 100 moves downward by one side by riding on the inclined receiver 21 of the supply unit 20 by its own weight. At this time, the first stopper 23 is maintained in a raised state by the first cylinder 22, so that the solder container 100 is positioned in the waiting state on the inclined container 21.

In this state, during the solder paste application process by the screen printer 10, the solder detection unit 200 detects the remaining amount of solder paste in the solder container 100 used in the process and transmits this signal to the control unit 300. In this case, when it is detected that the solder paste is less than a predetermined value, that is, a sufficient amount of the paste to be applied on the printed circuit board and transmits this signal to the control unit 300, the control unit 300 is a solder container A replacement signal of 100 is transmitted.

When the replacement signal of the solder container 100 by the control unit 300 is input, the input signal is applied to the work unit 40 to stop providing the pneumatic pressure to the solder container 100 through the pneumatic hose, and at the same time, the work unit ( 40) The second cylinder 11 disposed on the upper side is operated to separate the cap from the rear end of the solder container 100. That is, as the second cylinder 11 is raised, the cap is separated from the rear end of the solder container 100.

In this state, as the third cylinder 45 of the working part 40 operates to horizontally move the mill pin 46, the new solder container 100 located in the atmospheric zone 41 is pushed into the mounting zone 42. While the cap is separated, the solder container 100 having the cap separated is moved from the mounting zone 42 to the discharge zone 43 in the horizontal direction, and the exhausted solder container 100 accumulates in the discharge zone 43 to the collection space. Free fall.

As described above, at the same time as the removal of the exhausted solder container 100 from the mounting zone 42 of the work part 40 is completed, the controller 300 applies an input signal to the supply part 20 to provide a first cylinder ( 22) is lowered, so that the new solder container 100 is caused to slide by its own weight in the downwardly inclined direction along the inclined receiving portion (21).

As such, the new solder container 100 which is released by the first stopper 23 and slides in the downwardly inclined direction along the inclined receiving portion 21 is disposed on the upper side of the mounting portion 30. After changing the direction in the vertical direction by the (31) will be free fall to the mounting portion 30 by its own weight.

As shown in FIG. 4, the new solder container 100 freely dropped in the direction perpendicular to the mounting portion 30 is mounted in the state accommodated in the mounting portion 30, and the solder container (for the mounting portion 30) When the mounting of the 100 is completed, the control unit 300 applies an input signal to the transfer unit 50 so that the mounting unit 30 is moved to the work unit 40.

The transfer unit 50 may include a transfer motor 51 and a lead screw 52, and move the mounting unit 30 in the X-axis direction while the lead screw 52 is rotated by the drive of the transfer motor 51. As a result, the solder container 100 mounted on the mounting unit 30 may be moved to the work unit 40.

In addition, the transfer unit 50 may further include a rail unit 53 coupled to the bottom of the mounting unit 30 in a ball bearing structure to guide the movement of the mounting unit 30, and by the operation of the transfer unit 50. Mounting portion 30 transferred to 40 will place the solder container 100 in the atmosphere zone 41 of the working portion (40).

Meanwhile, according to the above, the new solder container 100 located in the atmosphere zone 41 is mounted by first applying an input signal to the third cylinder 45 while the cap is separated from the exhausted solder container 100. The solder container 100 is newly supplied to the work part 40 by pushing in the zone 42, but the controller 300 of the automatic supply method of the solder container 100 according to the embodiment of the present invention is exhausted. The solder container 100 may be newly supplied to the work part 40 by first applying an input signal to the supply part 20 and the transfer part 50 in a state where the cap is separated from the container 100.

That is, the solder container 100 sequentially moves from the mounting portion 30 to the atmospheric zone 41, from the atmospheric zone 41 to the mounting zone 42, and from the mounting zone 42 to the discharge zone 43. The new solder container 100 may be supplied to the mounting zone 42 by being moved.

In the state where the new solder container 100 is supplied to the mounting zone 42, the control unit 300 lowers the cap by applying an input signal to the second cylinder 11 so that the cap ends the rear end of the new solder container 100. Make sure to seal it.

As such, when the cap is mounted to the rear end of the new solder container 100 in a sealed manner, since the mounting of the new solder container 100 to the work part 40 is completed, the cap is connected to the cap in this state. When the pneumatic pressure is provided, the solder paste filled in the new solder container 100 is applied onto the printed circuit board.

In addition, the supply unit 20 to which the solder container 100 is supplied, the mounting unit 30 on which the solder container 100 is mounted, and the transfer unit 50 for transferring the solder container between the supply unit 20 and the mounting unit 30. At least one of the temperature of the solder container 100, specifically, the temperature control member for adjusting the temperature of the solder paste filled in the inside of the solder container 100 may be provided.

The temperature regulating member cools the temperature of the solder paste filled inside the solder container before the solder container is located in the work part 40 to maintain the pre-soldering state and to maintain the standby state.

As described above, the automatic supply device of the solder container 100 according to an embodiment of the present invention, when the solder paste in the solder container 100 is exhausted, it is automatically replaced with a new solder container 100 By doing so, the operator does not have to replace the solder container 100 manually, the process efficiency can be greatly improved.

In particular, since the solder container 100 is automatically replaced, the process of the screen printer 10 may not be stopped for the solder container 100 replacement, and thus the overall process efficiency may be further improved.

In addition, the automatic supply device of the solder container 100 according to the present invention, after detecting the remaining amount of the solder paste in the solder container 100, when the remaining amount of the detected solder paste is not enough new solder container filled with solder paste Since the replacement is automatically performed at 100, the effect of preventing the poor application of the solder paste on the printed circuit board may be provided.

As described above, when the solder paste remaining in the solder container 100 is insufficient during the application process of the solder paste to the printed circuit board in a state where replacement is made with the new solder container 100, new solder is supplied to the supply unit 20. Just put the container 100 in advance, the replacement of the new solder container 100 is automatically made by the operation sequence as described above.

Those skilled in the art will appreciate that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

Claims

A supply portion to which the solder container is supplied by its own weight;

A mounting unit to which the solder container supplied from the supply unit is mounted;

A work part for applying solder paste onto a printed circuit board with the solder container supplied from the mounting part mounted; And

And a transfer unit configured to reciprocally transfer the mounting unit between the supply unit and the working unit.

The working part,

An atmospheric zone positioned in the standby state before the solder container is mounted;

A mounting zone to which the solder container moved from the air zone is mounted; And

And a discharge zone moved to discharge the mounted solder container according to a measurement value of a sensor measuring a residual amount of solder paste in the solder container mounted in the mounting zone.
The method of claim 1,

The working part is provided with a solder sensing unit for detecting a solder paste remaining amount measurement value according to the remaining amount of the solder paste in the solder container, automatic supply device of the solder container.
The method of claim 2,

The solder container mounted in the mounting zone is discharged to the discharge zone according to the solder paste remaining amount measured value of the solder detector, the solder container located in the air zone is moved to the mounting zone, and the supply unit and the mounting unit And a control unit for applying an input signal to drive and supply a new solder container to the atmosphere zone.
The method of claim 3, wherein

The solder detection unit includes a photoelectric sensor for detecting the level of the solder paste in the solder container,

The control unit controls the operation of the supply unit, the mounting unit, the working unit and the transfer unit by comparing the set value of the solder paste to be replaced with the solder container in response to the detection value of the photoelectric sensor, automatic of the solder container Feeding device.
The method of claim 3, wherein

The supply unit,

An inclined accommodating part disposed to be inclined downward to slide the solder container;

A first cylinder operated according to an input signal of the controller; And

And a first stopper which is raised and lowered according to the operation of the first cylinder to interrupt movement of a new solder container disposed on the inclined receiving portion.
The method of claim 3, wherein

The solder container is supplied to the supply part in a first direction,

The mounting part includes a second stopper on a surface facing the first direction so that the solder container supplied is not separated.

And the transfer unit reciprocates the mounting portion in parallel with a second direction orthogonal to the first direction.
The method of claim 3, wherein

The working part,

A second cylinder for attaching or detaching a cap to a rear end of the solder container located in the mounting zone as the lifting is performed; And

And a pin pin for pushing the solder container in order from the mounting portion to the atmosphere zone, the mounting zone to the mounting zone, and the discharge zone to the discharge zone, and a third cylinder for reciprocating the mill pin.

And the second cylinder and the third cylinder are driven in response to an input signal from the controller.
The method of claim 1,

At least one of the supply unit, the mounting unit or the transfer unit further comprises a temperature control member for adjusting the temperature of the solder paste of the solder container, automatic supply device of the solder container.
The method of claim 1, wherein the transfer unit,

A lead screw coupled to the mounting part to move the mounting part in a first direction;

A transfer motor providing a driving force to rotate the lead screw; And

And a rail portion coupled to the mounting portion to guide movement of the mounting portion.
In the method for supplying a solder container mounted on the screen printer to apply the solder paste on the printed circuit board,

(a) a work part comprising an atmosphere zone, a mounting zone and a discharge zone, detecting a remaining amount of solder paste in a solder container mounted in the mounting zone;

(b) separating the solder container mounted in the mounting zone when the remaining amount of the solder paste is equal to or less than a preset value;

(c) pushing the exhausted solder container into the discharge zone while pushing and mounting a new solder container located in the atmosphere zone into the mounting zone;

(d) mounting a new solder container filled with solder paste supplied to the supply unit to the mounting unit;

(e) a transfer unit transferring the mounting unit from the supply unit to the work unit;

(f) pushing the new solder container from the mount into the atmosphere zone; And

(g) if a new solder container is supplied to the mounting zone of the work piece, sealing the rear end of the new solder container with a cap and then continuously applying solder paste onto a printed circuit board. Supply method.