WO2019200961A1 - Nonlinear temperature compensation device, optical module and method - Google Patents

Nonlinear temperature compensation device, optical module and method Download PDF

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Publication number
WO2019200961A1
WO2019200961A1 PCT/CN2018/123409 CN2018123409W WO2019200961A1 WO 2019200961 A1 WO2019200961 A1 WO 2019200961A1 CN 2018123409 W CN2018123409 W CN 2018123409W WO 2019200961 A1 WO2019200961 A1 WO 2019200961A1
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WO
WIPO (PCT)
Prior art keywords
temperature
shape memory
memory alloy
length
way shape
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PCT/CN2018/123409
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French (fr)
Chinese (zh)
Inventor
李长安
凌九红
全本庆
Original Assignee
武汉光迅科技股份有限公司
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Publication of WO2019200961A1 publication Critical patent/WO2019200961A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
    • G02B6/1203—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients

Definitions

  • the present invention relates to the field of optical communication technologies, and in particular, to a nonlinear temperature compensation device, an optical module, and a method.
  • Arrayed Waveguide Gratings are planar optical waveguide-based optical devices consisting of an input waveguide, an input slab waveguide, an array waveguide, an output slab waveguide, and an output waveguide, wherein adjacent array waveguides have a fixed length difference. .
  • the traditional silicon-based AWG chip is sensitive to temperature. The drift of the center wavelength with temperature is 0.0118nm/°C.
  • the AWG Dense Wavelength Division Multiplexing system requires high center wavelength stability of the multiplexer/demultiplexer. Wavelength accuracy needs to be controlled within +/- 5% of the channel spacing.
  • the center wavelength accuracy needs to be controlled at +/- 0.04 nm, +/- 0.02 nm, and Within +/- 0.01 nm. Therefore, measures are needed to control the center wavelength of the AWG chip so that it can operate normally within the operating temperature range.
  • the curve of variation is a parabola.
  • An existing AWG chip temperature compensation technology adopts a mechanical moving method.
  • a patented CN 101099098A introduces an AWG chip temperature compensation scheme, which divides the AWG chip into two parts, and the two parts of the driver driving chip move relative to each other to compensate the AWG.
  • the wavelength of the chip is offset by temperature. In this scheme, the wavelength change value is linear with the temperature change value.
  • the temperature/wavelength change curve is still parabolic; and when the AWG chip moves at a suitable distance, The temperature characteristic of AWG is symmetric compensation.
  • the wavelength variation from normal temperature to high temperature and from normal temperature to low temperature is similar.
  • the temperature characteristic of AWG is overcompensated, and the wavelength change from normal temperature to high temperature is relatively small.
  • the wavelength change from normal temperature to low temperature is relatively large; when the moving distance of the AWG chip is small, the temperature characteristic of the AWG is under-compensated, and the wavelength change from normal temperature to low temperature is relatively small, but the wavelength change from normal temperature to high temperature is compared.
  • the compensation curve is shown in Figure 1. The intersection of the curve corresponds to the horizontal coordinate of about 25 ° C, indicating Temperature.
  • some piecewise linear compensation schemes have been developed, such as the patents CN107490823A and CN201510216683, which are all driven by multiple poles and different poles are different.
  • the temperature range acts to produce different compensation amounts in different temperature ranges, such as generating a large drive in the high temperature range, the temperature-wavelength curve exhibiting overcompensation, and generating a smaller drive in the low temperature range, temperature -
  • the wavelength curve appears to be under-compensated, allowing the wavelength to have a small amount of drift over the entire temperature range.
  • the action of the rod in different temperature ranges mainly depends on the contact and non-contact of the structure. Therefore, the processing and assembly of the structure are required to have high precision, and it is usually required to reach the sub-micron level. These factors increase these. The difficulty of processing and assembling parts of the solution.
  • the processing and assembly of the structure are required to have high precision, and the sub-micron level is usually required, which increases the processing and assembly difficulty of the parts; and the linear compensation applicable temperature range is narrow.
  • the wavelength drift is large.
  • the present invention provides a nonlinear temperature compensating apparatus comprising a drive rod 101 and a two-way shape memory alloy spring 103, the drive rod 101 being provided with one or more elastic structures 102, the two-way shape Two ends of the memory alloy spring 103 are connected to the driving rod 101, and the two-way shape memory alloy spring 103 is connected in parallel with the one or more elastic structures 102; wherein the two-way shape memory alloy spring 103 is A material that achieves a two-way shape memory behavior whose length varies nonlinearly with temperature.
  • the martensitic transformation start temperature T 1 of the two-way shape memory alloy spring 103 ranges from -40 to 85 ° C, and the length of the two-way shape memory alloy spring 103 when the temperature is higher than T 1 Start to change.
  • the length of the driving rod 101 varies with temperature, and the length change of the driving rod 101 is caused by thermal expansion and contraction of the driving rod material and the length change of the two-way shape memory alloy spring 103; wherein, the temperature is low At T 1 , the rod length variation of the driving rod 101 is dL 1 , and when the temperature is higher than T 1 , the rod length variation of the driving rod 101 is dL 2 , wherein dL 1 is smaller than dL 2 .
  • the driving rod 101 is internally provided with a hole groove, and the hole groove is connected in parallel with the elastic structure 102, and both ends of the two-way shape memory alloy spring 103 are fixed on the inner wall of the hole groove.
  • the present invention also provides a nonlinear temperature-compensated optical module comprising the above-mentioned nonlinear temperature compensating device, the optical module comprising a nonlinear temperature compensating device 1 and an AWG, the AWG being cut into two parts, The two ends of the nonlinear temperature compensating device 1 are respectively connected to two parts of the AWG; the nonlinear temperature compensating device 1 performs nonlinear compensation on the change of the AWG wavelength with temperature by adjusting the length of the driving rod 101.
  • the compensation of the AWG by the nonlinear temperature compensating device 1 is under-compensation; when the temperature is higher than T 1 , the compensation of the AWG by the nonlinear temperature compensating device 1 is overcompensated .
  • the optical path base is further cut to form a first area 301 and a second area 302, and two parts of the AWG are respectively disposed on the first area 301 and the second area 302, the non- Both ends of the linear temperature compensating device 1 are fixed to the first region 301 and the second region 302, respectively.
  • the AWG includes an input device 201, an input slab waveguide 202, an arrayed waveguide 203, an output slab waveguide 204, and an output device 205, and is sequentially connected and fixed; wherein the AWG is cut to form a cutting slit 206, the cutting The slit 206 is located at any position of the input slab waveguide 202 or the arrayed waveguide 203 or the output slab waveguide 204.
  • the present invention also provides a method for nonlinear temperature compensation of an AWG wavelength by using the above-mentioned nonlinear temperature compensation optical module, wherein the driving rod 101 has a rod length with temperature when the temperature changes.
  • the nonlinear change which in turn drives the relative movement of the two parts of the AWG; wherein the change in the length of the rod of the drive rod 101 is caused by the thermal expansion and contraction of the material of the drive rod and the change in the length of the two-way shape memory alloy spring 103,
  • the change in the length of the rod caused by the thermal expansion and contraction is proportional to the temperature, and the change in the length of the rod caused by the two-way shape memory alloy spring 103 is related to the spring strain recovery rate ⁇ ; wherein ⁇ varies nonlinearly with temperature.
  • the amount of change in the length of the rod of the driving rod 101 with temperature is as follows: Where L is the length of the drive rod 101 at T 1 , ⁇ is the thermal expansion coefficient of the drive rod material, dT is the temperature change, and K 1 and K 2 are the elastic structure 102 and the two-way shape memory alloy, respectively.
  • the stiffness of the spring 103, L M and L A is the length of the two-way shape memory alloy spring 103 in the pure martensitic state and the pure austenite state, respectively.
  • the two-way shape memory alloy spring is used to nonlinearly compensate the change of the wavelength with temperature.
  • the structure is simple and easy to manufacture; and the wavelength drift is smaller than the linear compensation, and the applicable temperature range is wider, so that the wavelength shift of the AWG chip can be controlled within a small range from -40 ° C to 85 ° C.
  • Figure 1 is a graph showing the variation of a conventional AWG wavelength with temperature under different compensation effects
  • FIG. 2 is a schematic structural diagram of a nonlinear temperature compensation device according to an embodiment of the present invention.
  • 3 is a typical dynamic curve of a two-way shape memory alloy spring according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of another nonlinear temperature compensation device according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a nonlinear temperature compensation optical module according to an embodiment of the present disclosure
  • FIG. 6 is a graph showing changes in AWG wavelength with temperature after nonlinear temperature compensation according to an embodiment of the present invention
  • FIG. 7 is a schematic structural diagram of another nonlinear temperature compensation optical module according to an embodiment of the present invention.
  • the symbol “/” indicates the meaning of having two functions at the same time
  • the symbol “A and/or B” indicates that the combination between the preceding and succeeding objects connected by the symbol includes “A”, “ B", “A and B” three cases.
  • An embodiment of the present invention provides a nonlinear temperature compensation device, as shown in FIG. 2, including a driving rod 101 and a two-way shape memory alloy spring 103.
  • the driving rod 101 is provided with one or more elastic structures 102.
  • Two ends of the two-way shape memory alloy spring 103 are connected to the driving rod 101, and the two-way shape memory alloy spring 103 is connected in parallel with the one or more elastic structures 102; wherein the two-way shape memory alloy
  • the spring 103 is made of a material that achieves a two-way shape memory behavior, the length of which varies nonlinearly with temperature.
  • the invention provides a nonlinear temperature compensating device. According to the nonlinear behavior of the two-way shape memory alloy material with temperature change, a two-way shape memory alloy spring is used as a component to realize nonlinearity, simple structure and easy manufacture.
  • the driving rod 101 is provided with two elastic structures 102, and the elastic structure 102 can be symmetrically disposed at an intermediate position of the rod of the driving rod 101, and the driving rod 101
  • the inside of the rod body is provided with a hole groove, and the hole groove is connected in parallel with the two elastic structures 102.
  • the left end of the two-way shape memory alloy spring 103 is fixed on the inner wall of the left side of the hole groove, and the two-way shape memory alloy spring 103 is The right end is fixed on the inner wall of the right side of the slot, and the two-way shape memory alloy spring 103 can be connected in parallel with the two elastic structures 102 after the fixing is completed.
  • the drive rod 101 can be synchronously expanded and contracted by the elastic structure 102.
  • the two-way shape memory alloy spring 103 is made of a material capable of realizing a two-way shape memory behavior, such as NiTi or NiTiCu, and the two-way shape memory alloy spring 103 has a characteristic of narrow hysteresis, and the martensitic transformation begins.
  • the temperature T 1 is in the range of -40 to 85 ° C. In the embodiment of the present invention, T 1 is preferably located at a temperature of about 25 ° C.
  • the dynamic curve of the two-way shape memory alloy spring 103 is as shown in FIG. 3 .
  • the principle and implementation method of the nonlinear temperature compensation device of the present invention are as follows:
  • the two-way shape memory alloy is a functional material with a two-way memory effect. During heating or cooling, the memory alloy can spontaneously "remember" the high temperature austenite state and the low temperature martensite state without external force. Two different shapes. Let L M be the length of the two-way shape memory alloy spring 103 in the pure martensite state, and L A be the length of the two-way shape memory alloy spring 103 in the pure austenite state, L T is the The length of the two-way shape memory alloy spring 103 at different temperatures T, the shape memory strain recovery rate ⁇ is expressed by the formula (1):
  • ⁇ is related to various factors such as material, structure and two-way memory training mechanism.
  • the length of the two-way shape memory alloy spring 103 is nonlinear with temperature change, and nonlinear driving can be realized.
  • the spring strain recovery rate ⁇ is zero, and the length of the two-way shape memory alloy spring 103 remains unchanged, and remains the length L M in the martensite state; when the temperature is high At T 1 , the length of the two-way shape memory alloy spring 103 begins to change.
  • the length of the driving rod 101 changes with temperature, and the length change of the driving rod (101) is changed by the thermal expansion and contraction of the driving rod material and the length of the two-way shape memory alloy spring (103).
  • the rod length change of the driving rod (101) is dL 1
  • the rod length variation of the driving rod (101) is dL 2 , wherein dL 1 is less than dL 2 .
  • the stiffness of the elastic structure 102 on the driving rod 101 is K 1
  • the stiffness of the two-way shape memory alloy spring 103 is K 2
  • the length of the driving rod 101 changes with temperature as in the formula (2).
  • L is the length of the drive rod 101 at normal temperature T 1
  • ⁇ is the thermal expansion coefficient of the drive rod material
  • dT is the temperature change
  • dL is the amount of change in the length of the drive rod 101 with temperature. It can be seen from the formula (1) that ⁇ varies nonlinearly with temperature, and therefore, dL also varies nonlinearly with temperature.
  • the two-way shape memory alloy spring 103 is preset as a compression spring. When the temperature is less than T 1 , the spring strain recovery rate ⁇ is zero. As shown in FIG.
  • the length variation dL of the driving rod 101 at this time is 1 is determined by the L ⁇ dT term in the formula (2); when the temperature is greater than T 1 , the spring starts to elongate, and the spring strain recovery rate ⁇ also gradually increases, as shown in FIG. 3, the length variation dL of the driving rod 101 at this time. 2 by the L ⁇ dT term in equation (2) A joint decision will also generate a bigger drive. Therefore, the device has a small driving amount at a low temperature (temperature less than T 1 ), and a larger driving amount at a high temperature (temperature greater than T 1 ), that is, dL 1 is smaller than dL 2 .
  • the meaning of connecting the two-way shape memory alloy spring 103 and the elastic structure 102 in parallel can be further explained: the relative displacement dx of the two parts required for compensating the AWG is micrometer, and the deformation of the two-way memory alloy spring The amount is ⁇ (L A -L M ). If the deformation amount ⁇ (L A -L M ) of the two-way memory alloy spring is simply compensated, the precision of the spring must be on the order of micrometers. This is very difficult. After the two-way shape memory alloy spring is connected in parallel with the elastic structure, the deformation amount of the parallel structure is Then, the manufacturing precision requirements of the two-way shape memory alloy spring are lowered, and the manufacturing difficulty is lowered.
  • the structural change of the two-way shape memory alloy spring, the change of the number of springs, and the change of the alloy material can also be performed.
  • the principle and implementation method are similar to the embodiment of the present invention. Within the scope of the invention, it will not be repeated here.
  • Embodiment 2 of the present invention further provides another nonlinear temperature compensating device.
  • the main difference from the device described in Embodiment 1 is that there is no need to open a hole in the driving rod.
  • the groove is used to fix the spring, but the fixed block structure is added, and the fixed block is used to realize the fixed connection between the two-way shape memory alloy spring and the driving rod.
  • the device includes a driving rod 101, a two-way shape memory alloy spring 103, a first fixing block 104, a second fixing block 105, and a third fixing block 106, and the driving rod 101 is provided with one or a plurality of elastic structures 102, and the two-way shape memory alloy springs 103 are connected in parallel with the one or more elastic structures 102.
  • the driving rod 101 is provided with an elastic structure 102, The elastic structure 102 may be disposed at an intermediate position of the rod of the drive rod 101.
  • the left and right ends of the two-way shape memory alloy spring 103 are respectively fixed on the first fixing block 104 and the second fixing block 105, and the left and right ends of the driving rod 101 are respectively fixed to the first fixing block 104.
  • the third fixing block 106, the two-way shape memory alloy spring 103 may be parallel to the driving rod 101 after the fixing is completed.
  • the drive rod 101 can be synchronously expanded and contracted by the elastic structure 102.
  • the two-way shape memory alloy spring 103 is made of a material capable of realizing a two-way shape memory behavior, such as NiTi or NiTiCu, whose length varies nonlinearly with temperature, and the two-way shape memory alloy spring 103 has a narrow hysteresis.
  • the martensite transformation starting temperature T 1 is in the range of -40 to 85 ° C. In the embodiment of the present invention, T 1 is preferably located at a temperature of about 25 ° C.
  • the dynamic curve of the two-way shape memory alloy spring 103 is as follows. Figure 3 shows.
  • a nonlinear temperature compensation device according to Embodiment 2 of the present invention is also based on a two-way shape.
  • the structural form change, the change of the number of springs, and the change of the alloy material of the two-way shape memory alloy spring are all within the protection scope of the present invention, and will not be described herein. .
  • Embodiment 3 of the present invention further provides a nonlinear temperature compensation optical module, which uses the nonlinear temperature compensation device described in Embodiment 1, as shown in FIG. 5, the optical module includes nonlinearity.
  • the temperature compensating device 1 and the AWG are cut into two parts, and the two ends of the nonlinear temperature compensating device 1 are respectively connected to two parts of the AWG; the nonlinear temperature compensating device 1 adjusts the driving rod 101 by adjusting Length, nonlinearly compensates for changes in AWG wavelength with temperature.
  • the invention provides a nonlinear temperature compensating optical module, which adopts the nonlinear temperature compensating device described in Embodiment 1, and adopts a two-way shape memory alloy spring to nonlinearly compensate the change of wavelength with temperature, and has a simple structure and is easy to be used. Compared with linear compensation, the wavelength drift is smaller and the applicable temperature range is wider, so that the wavelength shift of the AWG chip can be controlled within a small range from -40 ° C to 85 ° C.
  • the optical module further includes an optical path base, the optical path base is cut to form a first area 301 and a second area 302, and two parts of the AWG are respectively disposed on the first area 301 and the second area 302.
  • the left and right ends of the nonlinear temperature compensating device 1 are respectively fixed to the first region 301 and the second region 302, that is, the a end and the b end of the driving rod 101 (as shown in FIG. 2 ) and the The first area 301 and the second area 302 are fixed.
  • the AWG chip assembly includes an input device 201, an input slab waveguide 202, an array waveguide 203, an output slab waveguide 204, and an output device 205, which are sequentially connected and fixed; the input device 201 is coupled to an end surface of the input slab waveguide 202, The output device 205 is coupled to an end face of the output slab waveguide 204; wherein the AWG chip assembly is cut to form a dicing slit 206, and the dicing slit 206 can be located at the input slab waveguide 202 or the arrayed waveguide 203 or at any position of the output slab waveguide 204.
  • the principle and implementation method of the nonlinear temperature compensation device of the present invention are as follows:
  • the nonlinear temperature compensating device 1 in Embodiment 1 when the temperature changes, the length of the driving rod 101 changes nonlinearly with temperature, and when the length of the driving rod 101 changes, the a end of the driving rod 101 and The b-end can respectively drive the first region 301 and the second region 302 to move, and the first region 301 and the second region 302 are relatively displaced, thereby causing relative displacement of the two portions of the AWG cut, thereby The AWG wavelength is nonlinearly compensated for changes in temperature.
  • the spring strain recovery rate ⁇ is zero, and the two-way shape memory alloy spring 103 does not change at this time, and does not contribute to the change in the length of the driving rod 101, and when the temperature changes, the driving The length change dL 1 of the rod 101 is L ⁇ dT, the driving displacement is small, and the compensation for the AWG wavelength is in an under-compensated state; the two-way shape memory alloy spring 103 in the nonlinear temperature compensating device 1 is prefabricated as a compression spring when the temperature is greater than When T 1 , the spring starts to elongate, and when the temperature changes, the length change dL 2 of the driving rod 101 is That is, dL 2 >dL 1 , that is to say, the driving displacement at this time is large, and the compensation for the AWG wavelength is overcompensated.
  • the obtained AWG temperature compensation curve is as shown in Fig. 6, and has a small wavelength shift in the temperature range of -40 to 85 °C.
  • Embodiment 4 of the present invention further provides another nonlinear temperature compensation optical module, which uses the nonlinear temperature compensation device described in Embodiment 2, as shown in FIG. 7, the optical module includes a linear temperature compensating device 1 and an AWG, the AWG is cut into two parts, and the two ends of the nonlinear temperature compensating device 1 are respectively connected to two parts of the AWG; the nonlinear temperature compensating device 1 adjusts the driving rod 101 length, nonlinearly compensates for changes in AWG wavelength with temperature.
  • the invention provides a nonlinear temperature compensating optical module, which adopts the nonlinear temperature compensating device described in Embodiment 1, and adopts a two-way shape memory alloy spring to nonlinearly compensate the change of wavelength with temperature, and has a simple structure and is easy to be used. Compared with linear compensation, the wavelength drift is smaller and the applicable temperature range is wider, so that the wavelength shift of the AWG chip can be controlled within a small range from -40 ° C to 85 ° C.
  • the optical module further includes an optical path base, the optical path base is cut to form a first area 301 and a second area 302, and two parts of the AWG are respectively disposed on the first area 301 and the second area 302.
  • the left and right ends of the nonlinear temperature compensating device 1 are respectively fixed to the first region 301 and the second region 302, that is, the first fixing block 104 (as shown in FIG. 4) is fixed to the first region 301.
  • the second fixed block 105 and the third fixed block 106 (as shown in FIG. 4) are both fixed to the second region 302.
  • the AWG chip assembly includes an input device 201, an input slab waveguide 202, an array waveguide 203, an output slab waveguide 204, and an output device 205, which are sequentially connected and fixed; the input device 201 is coupled to an end surface of the input slab waveguide 202, The output device 205 is coupled to an end face of the output slab waveguide 204; wherein the AWG chip assembly is cut to form a dicing slit 206, and the dicing slit 206 can be located at the input slab waveguide 202 or the arrayed waveguide 203 or at any position of the output slab waveguide 204.
  • the principle and implementation method of the nonlinear temperature compensation device of the present invention are as follows:
  • the nonlinear temperature compensating device 1 in Embodiment 2 when the temperature changes, the length of the driving rod 101 changes nonlinearly with temperature, and when the length of the driving rod 101 changes, the first fixing block 104
  • the first region 301 can be moved, the second fixed block 105 and the third fixed block 106 can move the second region 302, and the first region 301 and the second region 302 are relatively displaced.
  • the two portions of the AWG cut are relatively displaced, thereby nonlinearly compensating for changes in the AWG wavelength with temperature.
  • the spring strain recovery rate ⁇ is zero, and the two-way shape memory alloy spring 103 does not change at this time, and does not contribute to the change in the length of the driving rod 101, and when the temperature changes, the driving The length change dL 1 of the rod 101 is L ⁇ dT, the driving displacement is small, and the compensation for the AWG wavelength is in an under-compensated state; the two-way shape memory alloy spring 103 in the nonlinear temperature compensating device 1 is prefabricated as a compression spring when the temperature is greater than When T 1 , the spring starts to elongate, and when the temperature changes, the length change dL 2 of the driving rod 101 is That is, dL 2 >dL 1 , that is to say, the driving displacement at this time is large, and the compensation for the AWG wavelength is overcompensated.
  • the obtained AWG temperature compensation curve is as shown in Fig. 6, and has a small wavelength shift in the temperature range of -40 to 85 °C.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

Provided are a nonlinear temperature compensation device (1), an optical module and a method. The device (1) comprises a driving rod (101) and a two-way shape memory alloy spring (103), wherein the driving rod (101) is provided with an elastic structure (102), two ends of the two-way shape memory alloy spring (103) are connected to the driving rod (101), and the two-way shape memory alloy spring (103) is connected to the elastic structure (102) in parallel; the two-way shape memory alloy spring (103) is made of a material capable of realizing a two-way shape memory behavior, and the length thereof changes with temperature non-linearly; and the optical module uses the nonlinear temperature compensation device (1) to compensate the AWG wavelength non-linearly. According to the nonlinear behavior of the two-way shape memory alloy material changing with temperature, the two-way shape memory alloy spring (103) is used for compensating the change of the AWG wavelength with temperature, and the structure is simple and the manufacture is easy; and compared with linear compensation, the wavelength drift is smaller, and the applicable temperature range is wider.

Description

一种非线性温度补偿装置、光模块及方法Nonlinear temperature compensation device, optical module and method 【技术领域】[Technical Field]
本发明涉及光通信技术领域，具体涉及一种非线性温度补偿装置、光模块及方法。The present invention relates to the field of optical communication technologies, and in particular, to a nonlinear temperature compensation device, an optical module, and a method.
【背景技术】【Background technique】
阵列波导光栅(Arrayed Waveguide Gratings，简写为AWG)是基于平面光波导的光器件，由输入波导、输入平板波导、阵列波导、输出平板波导和输出波导组成，其中相邻阵列波导具有固定的长度差。传统的硅基AWG芯片对温度比较敏感，一般中心波长随温度的漂移为0.0118nm/℃，而AWG密集波分复用系统对复用/解复用器件的中心波长稳定性要求较高，中心波长精度需要控制在通道间隔的+/-5％以内，通常在100GHz、50GHz和25GHz间隔的波分复用系统中，中心波长精度分别需要控制在+/-0.04nm、+/-0.02nm和+/-0.01nm以内。因此，需要采取措施来控制AWG芯片的中心波长，使其能在工作环境温度范围内正常工作。Arrayed Waveguide Gratings (AWG) are planar optical waveguide-based optical devices consisting of an input waveguide, an input slab waveguide, an array waveguide, an output slab waveguide, and an output waveguide, wherein adjacent array waveguides have a fixed length difference. . The traditional silicon-based AWG chip is sensitive to temperature. The drift of the center wavelength with temperature is 0.0118nm/°C. The AWG Dense Wavelength Division Multiplexing system requires high center wavelength stability of the multiplexer/demultiplexer. Wavelength accuracy needs to be controlled within +/- 5% of the channel spacing. Typically in wavelength division multiplexing systems with 100 GHz, 50 GHz and 25 GHz spacing, the center wavelength accuracy needs to be controlled at +/- 0.04 nm, +/- 0.02 nm, and Within +/- 0.01 nm. Therefore, measures are needed to control the center wavelength of the AWG chip so that it can operate normally within the operating temperature range.
在实际工作情况中，AWG芯片的波长λ随温度T的变化值并不是单一的线性关系，而是如式dλ＝a·dT 2+b·dT+c所示具有非线性关系，温度/波长变化曲线为抛物线。现有的一种AWG芯片温度补偿技术是采用机械移动方式，如专利CN 101099098A中介绍了一种AWG芯片温度补偿方案，将AWG芯片分割为两部分，驱动器驱动芯片的两部分相对移动从而补偿AWG芯片波长由温度引起的偏移，在该方案中波长变化值与温度变化值是线性的关系，经过单一的线性补偿后，温度/波长变化曲线仍为抛物线；并且当AWG芯片移动距离合适时，AWG温度特性表现为对称补偿，从常温到高温和从常温到低温的波长变化量差不多；当AWG芯片移动距离值偏大时，AWG温度特性表现为过补偿，从常温到高温的波长变化比较小，但是从常温到低温时的波长变化比较大；当AWG芯片移动 距离值偏小时，AWG温度特性表现为欠补偿，从常温到低温的波长变化比较小，但是从常温到高温时的波长变化比较大，补偿曲线如图1所示，曲线的交点处对应横坐标约为25℃，表示常温。采用以上方法时，对于图中波长变化较大的温度区间内无法满足波长补偿要求，也就是说适用的温度范围较窄。 In actual working conditions, the variation of the wavelength λ of the AWG chip with temperature T is not a single linear relationship, but has a nonlinear relationship as shown by the formula dλ=a·dT 2 +b·dT+c, temperature/wavelength. The curve of variation is a parabola. An existing AWG chip temperature compensation technology adopts a mechanical moving method. For example, a patented CN 101099098A introduces an AWG chip temperature compensation scheme, which divides the AWG chip into two parts, and the two parts of the driver driving chip move relative to each other to compensate the AWG. The wavelength of the chip is offset by temperature. In this scheme, the wavelength change value is linear with the temperature change value. After a single linear compensation, the temperature/wavelength change curve is still parabolic; and when the AWG chip moves at a suitable distance, The temperature characteristic of AWG is symmetric compensation. The wavelength variation from normal temperature to high temperature and from normal temperature to low temperature is similar. When the moving distance of AWG chip is too large, the temperature characteristic of AWG is overcompensated, and the wavelength change from normal temperature to high temperature is relatively small. However, the wavelength change from normal temperature to low temperature is relatively large; when the moving distance of the AWG chip is small, the temperature characteristic of the AWG is under-compensated, and the wavelength change from normal temperature to low temperature is relatively small, but the wavelength change from normal temperature to high temperature is compared. Large, the compensation curve is shown in Figure 1. The intersection of the curve corresponds to the horizontal coordinate of about 25 ° C, indicating Temperature. When the above method is adopted, the wavelength compensation requirement cannot be satisfied in the temperature range in which the wavelength changes greatly in the figure, that is, the applicable temperature range is narrow.
为了适应对更宽工作温度范围或更密集波分复用系统的应用需求，一些分段线性补偿方案被开发出来，如专利CN107490823A和CN201510216683，这些方案都采用多杆驱动，且不同的杆在不同的温度范围内起作用，从而在不同的温度区间内产生不同的补偿量，例如在高温段产生较大的驱动，温度-波长曲线表现为过补偿，在低温段产生较小的驱动，温度-波长曲线表现为欠补偿，从而实现波长在整个温度范围内均具有较小的漂移量。但是这种结构中，杆在不同温度区间内作用与否主要依靠结构的接触与非接触，因此，要求结构的加工与组装具有较高的精度，通常要求达到次微米级，这些因素增加了这些方案的零件加工与组装难度。In order to adapt to the application requirements for a wider operating temperature range or more dense wavelength division multiplexing systems, some piecewise linear compensation schemes have been developed, such as the patents CN107490823A and CN201510216683, which are all driven by multiple poles and different poles are different. The temperature range acts to produce different compensation amounts in different temperature ranges, such as generating a large drive in the high temperature range, the temperature-wavelength curve exhibiting overcompensation, and generating a smaller drive in the low temperature range, temperature - The wavelength curve appears to be under-compensated, allowing the wavelength to have a small amount of drift over the entire temperature range. However, in this structure, the action of the rod in different temperature ranges mainly depends on the contact and non-contact of the structure. Therefore, the processing and assembly of the structure are required to have high precision, and it is usually required to reach the sub-micron level. These factors increase these. The difficulty of processing and assembling parts of the solution.
鉴于此，克服上述现有技术所存在的缺陷是本技术领域亟待解决的问题。In view of this, it is an urgent problem to be solved in the art to overcome the drawbacks of the prior art described above.
【发明内容】[Summary of the Invention]
本发明需要解决的技术问题是：The technical problems to be solved by the present invention are:
现有的温度补偿装置中，实现非线性补偿时要求结构的加工与组装具有较高的精度，通常要求达到次微米级，增加了零件的加工与组装难度；而线性补偿适用温度范围较窄，波长漂移较大。In the existing temperature compensation device, when the nonlinear compensation is realized, the processing and assembly of the structure are required to have high precision, and the sub-micron level is usually required, which increases the processing and assembly difficulty of the parts; and the linear compensation applicable temperature range is narrow. The wavelength drift is large.
本发明通过如下技术方案达到上述目的：The present invention achieves the above object by the following technical solutions:
第一方面，本发明提供了一种非线性温度补偿装置，包括驱动杆101和双程形状记忆合金弹簧103，所述驱动杆101上设置有一个或多个弹性结构102，所述双程形状记忆合金弹簧103的两端与所述驱动杆101连接，且所述双程形状记忆合金弹簧103与所述一个或多个弹性结构102并联；其中，所述双程形状记忆合金弹簧103采用可实现双程形状记忆行为的材料做成，其长度随温度呈非线性变化。In a first aspect, the present invention provides a nonlinear temperature compensating apparatus comprising a drive rod 101 and a two-way shape memory alloy spring 103, the drive rod 101 being provided with one or more elastic structures 102, the two-way shape Two ends of the memory alloy spring 103 are connected to the driving rod 101, and the two-way shape memory alloy spring 103 is connected in parallel with the one or more elastic structures 102; wherein the two-way shape memory alloy spring 103 is A material that achieves a two-way shape memory behavior whose length varies nonlinearly with temperature.
优选的，所述双程形状记忆合金弹簧103的马氏体相变开始温度T 1的范围为-40～85℃，当温度高于T 1时，所述双程形状记忆合金弹簧103的长度开始变化。 Preferably, the martensitic transformation start temperature T 1 of the two-way shape memory alloy spring 103 ranges from -40 to 85 ° C, and the length of the two-way shape memory alloy spring 103 when the temperature is higher than T 1 Start to change.
优选的，所述驱动杆101长度随温度发生变化，且所述驱动杆101长度变化由驱动杆材料的热胀冷缩和所述双程形状记忆合金弹簧103的长度变化引起；其中，温度低于T 1时，所述驱动杆101杆长变化量为dL 1，温度高于T 1时，所述驱动杆101杆长变化量为dL 2，其中，dL 1小于dL 2。 Preferably, the length of the driving rod 101 varies with temperature, and the length change of the driving rod 101 is caused by thermal expansion and contraction of the driving rod material and the length change of the two-way shape memory alloy spring 103; wherein, the temperature is low At T 1 , the rod length variation of the driving rod 101 is dL 1 , and when the temperature is higher than T 1 , the rod length variation of the driving rod 101 is dL 2 , wherein dL 1 is smaller than dL 2 .
优选的，所述驱动杆101内部开有孔槽，所述孔槽与所述弹性结构102并联，所述双程形状记忆合金弹簧103的两端固定在孔槽内壁上。Preferably, the driving rod 101 is internally provided with a hole groove, and the hole groove is connected in parallel with the elastic structure 102, and both ends of the two-way shape memory alloy spring 103 are fixed on the inner wall of the hole groove.
第二方面，本发明还提供了一种运用上述非线性温度补偿装置组成的非线性温度补偿光模块，所述光模块包括非线性温度补偿装置1和AWG，所述AWG被切割成两部分，所述非线性温度补偿装置1两端分别连接所述AWG的两部分；所述非线性温度补偿装置1通过调整所述驱动杆101长度，对AWG波长随温度的变化进行非线性补偿。In a second aspect, the present invention also provides a nonlinear temperature-compensated optical module comprising the above-mentioned nonlinear temperature compensating device, the optical module comprising a nonlinear temperature compensating device 1 and an AWG, the AWG being cut into two parts, The two ends of the nonlinear temperature compensating device 1 are respectively connected to two parts of the AWG; the nonlinear temperature compensating device 1 performs nonlinear compensation on the change of the AWG wavelength with temperature by adjusting the length of the driving rod 101.
优选的，当温度低于T 1时，所述非线性温度补偿装置1对AWG的补偿为欠补偿；当温度高于T 1时，所述非线性温度补偿装置1对AWG的补偿为过补偿。 Preferably, when the temperature is lower than T 1 , the compensation of the AWG by the nonlinear temperature compensating device 1 is under-compensation; when the temperature is higher than T 1 , the compensation of the AWG by the nonlinear temperature compensating device 1 is overcompensated .
优选的，还包括光路底座，所述光路底座被切割形成第一区域301和第二区域302，所述AWG的两部分分别设置于所述第一区域301和第二区域302上，所述非线性温度补偿装置1两端分别与所述第一区域301和第二区域302固定。Preferably, the optical path base is further cut to form a first area 301 and a second area 302, and two parts of the AWG are respectively disposed on the first area 301 and the second area 302, the non- Both ends of the linear temperature compensating device 1 are fixed to the first region 301 and the second region 302, respectively.
优选的，所述AWG包括输入装置201、输入平板波导202、阵列波导203、输出平板波导204和输出装置205，并依次连接固定；其中，所述AWG被切割而形成切割缝隙206，所述切割缝隙206位于所述输入平板波导202或所述阵列波导203或所述输出平板波导204的任意位置处。Preferably, the AWG includes an input device 201, an input slab waveguide 202, an arrayed waveguide 203, an output slab waveguide 204, and an output device 205, and is sequentially connected and fixed; wherein the AWG is cut to form a cutting slit 206, the cutting The slit 206 is located at any position of the input slab waveguide 202 or the arrayed waveguide 203 or the output slab waveguide 204.
第三方面，本发明还提供了一种运用上述非线性温度补偿光模块对AWG波长进行非线性温度补偿的方法，所述方法为：当温度变化时，所述驱动杆101杆长随温度呈非线性变化，进而带动所述AWG的两部分相对移动；其中，所述 驱动杆101的杆长变化由驱动杆材料的热胀冷缩和所述双程形状记忆合金弹簧103的长度变化引起，由热胀冷缩导致的杆长变化与温度成正比，由所述双程形状记忆合金弹簧103导致的杆长变化与弹簧应变恢复率η有关；其中，η随温度非线性变化。In a third aspect, the present invention also provides a method for nonlinear temperature compensation of an AWG wavelength by using the above-mentioned nonlinear temperature compensation optical module, wherein the driving rod 101 has a rod length with temperature when the temperature changes. The nonlinear change, which in turn drives the relative movement of the two parts of the AWG; wherein the change in the length of the rod of the drive rod 101 is caused by the thermal expansion and contraction of the material of the drive rod and the change in the length of the two-way shape memory alloy spring 103, The change in the length of the rod caused by the thermal expansion and contraction is proportional to the temperature, and the change in the length of the rod caused by the two-way shape memory alloy spring 103 is related to the spring strain recovery rate η; wherein η varies nonlinearly with temperature.
优选的，所述驱动杆101的杆长随温度的变化量dL如式：
Figure PCTCN2018123409-appb-000001
其中，L为所述驱动杆101在T 1下的长度，α为驱动杆材料的热膨胀系数，dT为温度变化，K 1和K 2分别为所述弹性结构102和所述双程形状记忆合金弹簧103的刚度，L M和L A分别为所述双程形状记忆合金弹簧103在纯马氏体状态和纯奥氏体状态下的长度。 Preferably, the amount of change in the length of the rod of the driving rod 101 with temperature is as follows:
Figure PCTCN2018123409-appb-000001
Where L is the length of the drive rod 101 at T 1 , α is the thermal expansion coefficient of the drive rod material, dT is the temperature change, and K 1 and K 2 are the elastic structure 102 and the two-way shape memory alloy, respectively. The stiffness of the spring 103, L M and L A , is the length of the two-way shape memory alloy spring 103 in the pure martensitic state and the pure austenite state, respectively.
本发明的有益效果是：The beneficial effects of the invention are:
本发明提供的一种非线性温度补偿装置、光模块及方法中，根据双程形状记忆合金材料随温度变化的非线性行为，采用双程形状记忆合金弹簧对波长随温度的变化进行非线性补偿，结构简单，易于制作；而且相比线性补偿，波长漂移更小，适用温度范围更宽，使AWG芯片的波长偏移在-40℃～85℃区间均能控制在较小的范围内。In the nonlinear temperature compensating device, the optical module and the method provided by the invention, according to the nonlinear behavior of the two-way shape memory alloy material with temperature, the two-way shape memory alloy spring is used to nonlinearly compensate the change of the wavelength with temperature. The structure is simple and easy to manufacture; and the wavelength drift is smaller than the linear compensation, and the applicable temperature range is wider, so that the wavelength shift of the AWG chip can be controlled within a small range from -40 ° C to 85 ° C.
【附图说明】[Description of the Drawings]
为了更清楚地说明本发明实施例的技术方案，下面将对本发明实施例中所需要使用的附图作简单地介绍。显而易见地，下面所描述的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings to be used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are only some embodiments of the present invention, and other drawings may be obtained from those skilled in the art without departing from the drawings.
图1为现有的一种AWG波长在不同补偿效果下随温度的变化曲线图；Figure 1 is a graph showing the variation of a conventional AWG wavelength with temperature under different compensation effects;
图2为本发明实施例提供的一种非线性温度补偿装置结构示意图；2 is a schematic structural diagram of a nonlinear temperature compensation device according to an embodiment of the present invention;
图3为本发明实施例提供的一种双程形状记忆合金弹簧的典型动力学曲线；3 is a typical dynamic curve of a two-way shape memory alloy spring according to an embodiment of the present invention;
图4为本发明实施例提供的另一种非线性温度补偿装置结构示意图；4 is a schematic structural diagram of another nonlinear temperature compensation device according to an embodiment of the present invention;
图5为本发明实施例提供的一种非线性温度补偿光模块结构示意图；FIG. 5 is a schematic structural diagram of a nonlinear temperature compensation optical module according to an embodiment of the present disclosure;
图6为本发明实施例提供的一种经非线性温度补偿后AWG波长随温度的变化曲线图；6 is a graph showing changes in AWG wavelength with temperature after nonlinear temperature compensation according to an embodiment of the present invention;
图7为本发明实施例提供的另一种非线性温度补偿光模块结构示意图。FIG. 7 is a schematic structural diagram of another nonlinear temperature compensation optical module according to an embodiment of the present invention.
【具体实施方式】【detailed description】
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
在本发明的描述中，术语“内”、“外”、“纵向”、“横向”、“上”、“下”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明而不是要求本发明必须以特定的方位构造和操作，因此不应当理解为对本发明的限制。In the description of the present invention, the orientations or positional relationships of the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom", etc. are based on the drawings. The orientation or positional relationship shown is for the purpose of describing the present invention and is not intended to be a limitation of the invention.
在本发明各实施例中，符号“/”表示同时具有两种功能的含义，而对于符号“A和/或B”则表明由该符号连接的前后对象之间的组合包括“A”、“B”、“A和B”三种情况。In various embodiments of the present invention, the symbol "/" indicates the meaning of having two functions at the same time, and the symbol "A and/or B" indicates that the combination between the preceding and succeeding objects connected by the symbol includes "A", " B", "A and B" three cases.
此外，下面所描述的本发明各个实施方式中所涉及到的技术特征只要彼此之间未构成冲突就可以相互组合。下面就参考附图和实施例结合来详细说明本发明。Further, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not constitute a conflict with each other. The invention will be described in detail below with reference to the drawings and embodiments.
实施例1：Example 1:
本发明实施例提供了一种非线性温度补偿装置，如图2所示，包括驱动杆101和双程形状记忆合金弹簧103，所述驱动杆101上设置有一个或多个弹性结构102，所述双程形状记忆合金弹簧103的两端与所述驱动杆101连接，且所述双程形状记忆合金弹簧103与所述一个或多个弹性结构102并联；其中，所述双程形状记忆合金弹簧103采用可实现双程形状记忆行为的材料做成，其长度随温度呈非线性变化。An embodiment of the present invention provides a nonlinear temperature compensation device, as shown in FIG. 2, including a driving rod 101 and a two-way shape memory alloy spring 103. The driving rod 101 is provided with one or more elastic structures 102. Two ends of the two-way shape memory alloy spring 103 are connected to the driving rod 101, and the two-way shape memory alloy spring 103 is connected in parallel with the one or more elastic structures 102; wherein the two-way shape memory alloy The spring 103 is made of a material that achieves a two-way shape memory behavior, the length of which varies nonlinearly with temperature.
本发明提供的一种非线性温度补偿装置，根据双程形状记忆合金材料随温度变化的非线性行为，采用双程形状记忆合金弹簧作为零部件以实现非线性， 结构简单，易于制作。The invention provides a nonlinear temperature compensating device. According to the nonlinear behavior of the two-way shape memory alloy material with temperature change, a two-way shape memory alloy spring is used as a component to realize nonlinearity, simple structure and easy manufacture.
如图2，在本发明实施例中，所述驱动杆101上设置有两个弹性结构102，所述弹性结构102可对称设置在所述驱动杆101杆体的中间位置处，所述驱动杆101杆体内部开有孔槽，且所述孔槽与所述两个弹性结构102并联，所述双程形状记忆合金弹簧103左端固定在孔槽左侧内壁上，所述双程形状记忆合金弹簧103右端固定在孔槽右侧内壁上，则固定完成后所述双程形状记忆合金弹簧103可与所述两个弹性结构102并联。当所述双程形状记忆合金弹簧103伸缩时，所述驱动杆101可通过所述弹性结构102实现同步伸缩。As shown in FIG. 2, in the embodiment of the present invention, the driving rod 101 is provided with two elastic structures 102, and the elastic structure 102 can be symmetrically disposed at an intermediate position of the rod of the driving rod 101, and the driving rod 101 The inside of the rod body is provided with a hole groove, and the hole groove is connected in parallel with the two elastic structures 102. The left end of the two-way shape memory alloy spring 103 is fixed on the inner wall of the left side of the hole groove, and the two-way shape memory alloy spring 103 is The right end is fixed on the inner wall of the right side of the slot, and the two-way shape memory alloy spring 103 can be connected in parallel with the two elastic structures 102 after the fixing is completed. When the two-way shape memory alloy spring 103 is expanded and contracted, the drive rod 101 can be synchronously expanded and contracted by the elastic structure 102.
所述双程形状记忆合金弹簧103采用可实现双程形状记忆行为的材料做成，比如NiTi或NiTiCu，并且所述双程形状记忆合金弹簧103具有窄滞后的特点，其马氏体相变开始温度T 1在-40～85℃范围内，本发明实施例中T 1优选的位于室温25℃附近，所述双程形状记忆合金弹簧103的动力学曲线如图3所示。 The two-way shape memory alloy spring 103 is made of a material capable of realizing a two-way shape memory behavior, such as NiTi or NiTiCu, and the two-way shape memory alloy spring 103 has a characteristic of narrow hysteresis, and the martensitic transformation begins. The temperature T 1 is in the range of -40 to 85 ° C. In the embodiment of the present invention, T 1 is preferably located at a temperature of about 25 ° C. The dynamic curve of the two-way shape memory alloy spring 103 is as shown in FIG. 3 .
本发明非线性温度补偿装置的原理与实现方法如下：The principle and implementation method of the nonlinear temperature compensation device of the present invention are as follows:
双程形状记忆合金是一种功能材料，具有双程记忆效应，在加热或冷却过程中，记忆合金可以在无外力的作用下自发地“记住”高温奥氏体态和低温马氏体态的两种不同形状。设L M为所述双程形状记忆合金弹簧103在纯马氏体状态下的长度，L A为所述双程形状记忆合金弹簧103在纯奥氏体状态下的长度，L T为所述双程形状记忆合金弹簧103在不同温度T下的长度，则形状记忆应变恢复率η用公式(1)表示： The two-way shape memory alloy is a functional material with a two-way memory effect. During heating or cooling, the memory alloy can spontaneously "remember" the high temperature austenite state and the low temperature martensite state without external force. Two different shapes. Let L M be the length of the two-way shape memory alloy spring 103 in the pure martensite state, and L A be the length of the two-way shape memory alloy spring 103 in the pure austenite state, L T is the The length of the two-way shape memory alloy spring 103 at different temperatures T, the shape memory strain recovery rate η is expressed by the formula (1):
Figure PCTCN2018123409-appb-000002
Figure PCTCN2018123409-appb-000002
其中，η与材料、结构以及双程记忆训练机制等多种因素有关。从图3可以看出，所述双程形状记忆合金弹簧103的长度随温度变化是非线性的，可以实现非线性驱动。其中，当温度低于T 1时，弹簧应变恢复率η为零，此时所述双程形状记忆合金弹簧103的长度不变，仍保持为马氏体状态下的长度L M；当温度高于T 1时，所述双程形状记忆合金弹簧103的长度开始变化。 Among them, η is related to various factors such as material, structure and two-way memory training mechanism. As can be seen from FIG. 3, the length of the two-way shape memory alloy spring 103 is nonlinear with temperature change, and nonlinear driving can be realized. Wherein, when the temperature is lower than T 1 , the spring strain recovery rate η is zero, and the length of the two-way shape memory alloy spring 103 remains unchanged, and remains the length L M in the martensite state; when the temperature is high At T 1 , the length of the two-way shape memory alloy spring 103 begins to change.
当温度变化时，所述驱动杆101长度随温度发生变化，且所述驱动杆(101) 长度变化由驱动杆材料的热胀冷缩和所述双程形状记忆合金弹簧(103)的长度变化引起；其中，温度低于T 1时，所述驱动杆(101)杆长变化量为dL 1，温度高于T 1时，所述驱动杆(101)杆长变化量为dL 2，其中，dL 1小于dL 2。 When the temperature changes, the length of the driving rod 101 changes with temperature, and the length change of the driving rod (101) is changed by the thermal expansion and contraction of the driving rod material and the length of the two-way shape memory alloy spring (103). Causing; wherein, when the temperature is lower than T 1 , the rod length change of the driving rod (101) is dL 1 , and when the temperature is higher than T 1 , the rod length variation of the driving rod (101) is dL 2 , wherein dL 1 is less than dL 2 .
具体原理如下：所述驱动杆101上弹性结构102的刚度为K 1，所述双程形状记忆合金弹簧103的刚度为K 2，所述驱动杆101长度随温度的变化如公式(2)所示： The specific principle is as follows: the stiffness of the elastic structure 102 on the driving rod 101 is K 1 , the stiffness of the two-way shape memory alloy spring 103 is K 2 , and the length of the driving rod 101 changes with temperature as in the formula (2). Show:
Figure PCTCN2018123409-appb-000003
Figure PCTCN2018123409-appb-000003
其中，L为所述驱动杆101在常温T 1下的长度，α为驱动杆材料的热膨胀系数，dT为温度变化，dL为所述驱动杆101长度随温度的变化量。由公式(1)可知，η随温度非线性变化，因此，dL随温度也是非线性变化的。例如，将所述双程形状记忆合金弹簧103预设为压簧，当温度小于T 1时，弹簧应变恢复率η为零，如图3，则此时所述驱动杆101的长度变化量dL 1由公式(2)中LαdT项决定；当温度大于T 1时，弹簧开始伸长，弹簧应变恢复率η也逐渐增大，如图3，则此时所述驱动杆101的长度变化量dL 2由公式(2)中LαdT项和
Figure PCTCN2018123409-appb-000004
项共同决定，也就会产生更大的驱动。因此，所述装置在低温(温度小于T 1)时驱动量较小，在高温(温度大于T 1)时驱动量较大，即dL 1小于dL 2。根据机械移动方式对AWG进行温度补偿的原理，被分割的AWG芯片两部分的相对位移dx由驱动杆提供，即dx＝dL，则当其运用到AWG中时，可实现从常温到低温对AWG进行欠补偿，从常温到高温对AWG进行过补偿。 Where L is the length of the drive rod 101 at normal temperature T 1 , α is the thermal expansion coefficient of the drive rod material, dT is the temperature change, and dL is the amount of change in the length of the drive rod 101 with temperature. It can be seen from the formula (1) that η varies nonlinearly with temperature, and therefore, dL also varies nonlinearly with temperature. For example, the two-way shape memory alloy spring 103 is preset as a compression spring. When the temperature is less than T 1 , the spring strain recovery rate η is zero. As shown in FIG. 3 , the length variation dL of the driving rod 101 at this time is 1 is determined by the LαdT term in the formula (2); when the temperature is greater than T 1 , the spring starts to elongate, and the spring strain recovery rate η also gradually increases, as shown in FIG. 3, the length variation dL of the driving rod 101 at this time. 2 by the LαdT term in equation (2)
Figure PCTCN2018123409-appb-000004
A joint decision will also generate a bigger drive. Therefore, the device has a small driving amount at a low temperature (temperature less than T 1 ), and a larger driving amount at a high temperature (temperature greater than T 1 ), that is, dL 1 is smaller than dL 2 . According to the principle of temperature compensation of the AWG according to the mechanical movement mode, the relative displacement dx of the two parts of the divided AWG chip is provided by the driving rod, that is, dx=dL, when it is applied to the AWG, the AWG can be realized from normal temperature to low temperature. Under-compensation, the AWG is compensated from normal temperature to high temperature.
根据上述补偿原理，也可以进一步解释将所述双程形状记忆合金弹簧103和所述弹性结构102并联的意义：补偿AWG所需两部分的相对位移dx为微米级，双程记忆合金弹簧的变形量为η·(L A-L M)，若单纯的用双程记忆合金弹簧的变形量η·(L A-L M)进行补偿，则弹簧的制作精度需为微米量级，这是非常困难的。将双程形状记忆合金弹簧与弹性结构并联后，并联结构的变形量为
Figure PCTCN2018123409-appb-000005
则双程形状记忆合金弹簧的制作精度要求降低，制作难度降低。 优选的，K1>>K2。 According to the above compensation principle, the meaning of connecting the two-way shape memory alloy spring 103 and the elastic structure 102 in parallel can be further explained: the relative displacement dx of the two parts required for compensating the AWG is micrometer, and the deformation of the two-way memory alloy spring The amount is η·(L A -L M ). If the deformation amount η·(L A -L M ) of the two-way memory alloy spring is simply compensated, the precision of the spring must be on the order of micrometers. This is very difficult. After the two-way shape memory alloy spring is connected in parallel with the elastic structure, the deformation amount of the parallel structure is
Figure PCTCN2018123409-appb-000005
Then, the manufacturing precision requirements of the two-way shape memory alloy spring are lowered, and the manufacturing difficulty is lowered. Preferably, K1>>K2.
在本发明实施例的基础上，还可对双程形状记忆合金弹簧进行结构形式上的改变、弹簧数量的改变以及合金材质的改变，其原理与实现方法与本发明实施例类似，均在本发明的保护范围之内，此处不再赘述。On the basis of the embodiment of the present invention, the structural change of the two-way shape memory alloy spring, the change of the number of springs, and the change of the alloy material can also be performed. The principle and implementation method are similar to the embodiment of the present invention. Within the scope of the invention, it will not be repeated here.
实施例2：Example 2:
在实施例1的基础上，本发明实施例2还提供了另一种非线性温度补偿装置，如图4所示，与实施例1所述装置的主要区别在于：无需在驱动杆内部开设孔槽来固定弹簧，而是增加固定块结构，通过固定块来实现双程形状记忆合金弹簧与驱动杆的固定连接。On the basis of Embodiment 1, Embodiment 2 of the present invention further provides another nonlinear temperature compensating device. As shown in FIG. 4, the main difference from the device described in Embodiment 1 is that there is no need to open a hole in the driving rod. The groove is used to fix the spring, but the fixed block structure is added, and the fixed block is used to realize the fixed connection between the two-way shape memory alloy spring and the driving rod.
具体结构如图4，所述装置包括驱动杆101、双程形状记忆合金弹簧103、第一固定块104、第二固定块105和第三固定块106，所述驱动杆101上设置有一个或多个弹性结构102，且所述双程形状记忆合金弹簧103与所述一个或多个弹性结构102并联；在本发明实施例中，所述驱动杆101上设置有一个弹性结构102，所述弹性结构102可设置在所述驱动杆101杆体的中间位置处。所述双程形状记忆合金弹簧103的左右两端分别固定在所述第一固定块104和第二固定块105上，所述驱动杆101的左右两端分别固定在所述第一固定块104和第三固定块106上，则固定完成后所述双程形状记忆合金弹簧103可与所述驱动杆101平行。当所述双程形状记忆合金弹簧103伸缩时，所述驱动杆101可通过所述弹性结构102实现同步伸缩。Specifically, as shown in FIG. 4, the device includes a driving rod 101, a two-way shape memory alloy spring 103, a first fixing block 104, a second fixing block 105, and a third fixing block 106, and the driving rod 101 is provided with one or a plurality of elastic structures 102, and the two-way shape memory alloy springs 103 are connected in parallel with the one or more elastic structures 102. In the embodiment of the present invention, the driving rod 101 is provided with an elastic structure 102, The elastic structure 102 may be disposed at an intermediate position of the rod of the drive rod 101. The left and right ends of the two-way shape memory alloy spring 103 are respectively fixed on the first fixing block 104 and the second fixing block 105, and the left and right ends of the driving rod 101 are respectively fixed to the first fixing block 104. And the third fixing block 106, the two-way shape memory alloy spring 103 may be parallel to the driving rod 101 after the fixing is completed. When the two-way shape memory alloy spring 103 is expanded and contracted, the drive rod 101 can be synchronously expanded and contracted by the elastic structure 102.
所述双程形状记忆合金弹簧103采用可实现双程形状记忆行为的材料做成，比如NiTi或NiTiCu，其长度随温度呈非线性变化，并且所述双程形状记忆合金弹簧103具有窄滞后的特点，其马氏体相变开始温度T 1在-40～85℃范围内，本发明实施例中T 1优选的位于室温25℃附近，所述双程形状记忆合金弹簧103的动力学曲线如图3所示。 The two-way shape memory alloy spring 103 is made of a material capable of realizing a two-way shape memory behavior, such as NiTi or NiTiCu, whose length varies nonlinearly with temperature, and the two-way shape memory alloy spring 103 has a narrow hysteresis. The martensite transformation starting temperature T 1 is in the range of -40 to 85 ° C. In the embodiment of the present invention, T 1 is preferably located at a temperature of about 25 ° C. The dynamic curve of the two-way shape memory alloy spring 103 is as follows. Figure 3 shows.
本发明实施例2所述非线性温度补偿装置的原理及实现方法与实施例1中类似，此处不再赘述；本发明实施例2提供的一种非线性温度补偿装置，同样 根据双程形状记忆合金材料随温度变化的非线性行为，采用双程形状记忆合金弹簧作为零部件以实现非线性，结构简单，易于制作。The principle and implementation method of the nonlinear temperature compensation device according to Embodiment 2 of the present invention are similar to those in Embodiment 1, and are not described herein again. A nonlinear temperature compensation device according to Embodiment 2 of the present invention is also based on a two-way shape. The nonlinear behavior of the memory alloy material with temperature changes, using a two-way shape memory alloy spring as a component to achieve nonlinearity, simple structure, and easy to manufacture.
在本发明实施例的基础上，还可对双程形状记忆合金弹簧进行结构形式上的改变、弹簧数量的改变以及合金材质的改变，均在本发明的保护范围之内，此处不再赘述。On the basis of the embodiment of the present invention, the structural form change, the change of the number of springs, and the change of the alloy material of the two-way shape memory alloy spring are all within the protection scope of the present invention, and will not be described herein. .
实施例3：Example 3:
在实施例1的基础上，本发明实施例3还提供了一种非线性温度补偿光模块，运用实施例1中所述的非线性温度补偿装置，如图5，所述光模块包括非线性温度补偿装置1和AWG，所述AWG被切割成两部分，所述非线性温度补偿装置1两端分别连接所述AWG的两部分；所述非线性温度补偿装置1通过调整所述驱动杆101长度，对AWG波长随温度的变化进行非线性补偿。On the basis of Embodiment 1, Embodiment 3 of the present invention further provides a nonlinear temperature compensation optical module, which uses the nonlinear temperature compensation device described in Embodiment 1, as shown in FIG. 5, the optical module includes nonlinearity. The temperature compensating device 1 and the AWG are cut into two parts, and the two ends of the nonlinear temperature compensating device 1 are respectively connected to two parts of the AWG; the nonlinear temperature compensating device 1 adjusts the driving rod 101 by adjusting Length, nonlinearly compensates for changes in AWG wavelength with temperature.
本发明提供的一种非线性温度补偿光模块，采用了实施例1中所述的非线性温度补偿装置，采用双程形状记忆合金弹簧对波长随温度的变化进行非线性补偿，结构简单，易于制作；而且相比线性补偿，波长漂移更小，适用温度范围更宽，使AWG芯片的波长偏移在-40℃～85℃区间均能控制在较小的范围内。The invention provides a nonlinear temperature compensating optical module, which adopts the nonlinear temperature compensating device described in Embodiment 1, and adopts a two-way shape memory alloy spring to nonlinearly compensate the change of wavelength with temperature, and has a simple structure and is easy to be used. Compared with linear compensation, the wavelength drift is smaller and the applicable temperature range is wider, so that the wavelength shift of the AWG chip can be controlled within a small range from -40 ° C to 85 ° C.
如图5，所述光模块还包括光路底座，所述光路底座被切割形成第一区域301和第二区域302，所述AWG的两部分分别设置于所述第一区域301和第二区域302上，所述非线性温度补偿装置1的左右两端分别与所述第一区域301和第二区域302固定，即所述驱动杆101的a端、b端(如图2)分别与所述第一区域301和第二区域302固定。所述AWG芯片组件包括输入装置201、输入平板波导202、阵列波导203、输出平板波导204和输出装置205，并依次连接固定；所述输入装置201耦合在所述输入平板波导202的端面上，所述输出装置205耦合在所述输出平板波导204的端面上；其中，所述AWG芯片组件被切割而形成切割缝隙206，所述切割缝隙206可位于所述输入平板波导202或所述阵列波导203或所述输出平板波导204的任意位置处。As shown in FIG. 5, the optical module further includes an optical path base, the optical path base is cut to form a first area 301 and a second area 302, and two parts of the AWG are respectively disposed on the first area 301 and the second area 302. The left and right ends of the nonlinear temperature compensating device 1 are respectively fixed to the first region 301 and the second region 302, that is, the a end and the b end of the driving rod 101 (as shown in FIG. 2 ) and the The first area 301 and the second area 302 are fixed. The AWG chip assembly includes an input device 201, an input slab waveguide 202, an array waveguide 203, an output slab waveguide 204, and an output device 205, which are sequentially connected and fixed; the input device 201 is coupled to an end surface of the input slab waveguide 202, The output device 205 is coupled to an end face of the output slab waveguide 204; wherein the AWG chip assembly is cut to form a dicing slit 206, and the dicing slit 206 can be located at the input slab waveguide 202 or the arrayed waveguide 203 or at any position of the output slab waveguide 204.
本发明非线性温度补偿装置的原理与实现方法如下：The principle and implementation method of the nonlinear temperature compensation device of the present invention are as follows:
由实施例1中对所述非线性温度补偿装置1的介绍可知，当温度变化时，所述驱动杆101的长度随温度非线性变化，驱动杆101长度变化时，驱动杆101的a端和b端可分别带动所述第一区域301和第二区域302移动，则所述第一区域301和第二区域302发生相对位移，进而使所述AWG切割开的两部分发生相对位移，从而对AWG波长随温度的变化进行非线性补偿。It can be seen from the introduction of the nonlinear temperature compensating device 1 in Embodiment 1 that when the temperature changes, the length of the driving rod 101 changes nonlinearly with temperature, and when the length of the driving rod 101 changes, the a end of the driving rod 101 and The b-end can respectively drive the first region 301 and the second region 302 to move, and the first region 301 and the second region 302 are relatively displaced, thereby causing relative displacement of the two portions of the AWG cut, thereby The AWG wavelength is nonlinearly compensated for changes in temperature.
当温度小于T 1时，弹簧应变恢复率η为零，所述双程形状记忆合金弹簧103此时长度不变，对驱动杆101的长度变化不起作用，则当温度变化时，所述驱动杆101的长度变化dL 1为LαdT，驱动位移较小，对AWG波长的补偿呈欠补偿状态；所述非线性温度补偿装置1中的双程形状记忆合金弹簧103预制为压簧，当温度大于T 1时，弹簧开始伸长，则当温度变化时，所述驱动杆101的长度变化dL 2为
Figure PCTCN2018123409-appb-000006
即dL 2＞dL 1，也就是说此时的驱动位移较大，对AWG波长的补偿呈过补偿状态。所得到的AWG温度补偿曲线如图6所示，在-40～85℃温度范围内均具有较小的波长偏移。 When the temperature is less than T 1 , the spring strain recovery rate η is zero, and the two-way shape memory alloy spring 103 does not change at this time, and does not contribute to the change in the length of the driving rod 101, and when the temperature changes, the driving The length change dL 1 of the rod 101 is LαdT, the driving displacement is small, and the compensation for the AWG wavelength is in an under-compensated state; the two-way shape memory alloy spring 103 in the nonlinear temperature compensating device 1 is prefabricated as a compression spring when the temperature is greater than When T 1 , the spring starts to elongate, and when the temperature changes, the length change dL 2 of the driving rod 101 is
Figure PCTCN2018123409-appb-000006
That is, dL 2 >dL 1 , that is to say, the driving displacement at this time is large, and the compensation for the AWG wavelength is overcompensated. The obtained AWG temperature compensation curve is as shown in Fig. 6, and has a small wavelength shift in the temperature range of -40 to 85 °C.
实施例4：Example 4:
在实施例2的基础上，本发明实施例4还提供了另一种非线性温度补偿光模块，运用实施例2中所述的非线性温度补偿装置，如图7，所述光模块包括非线性温度补偿装置1和AWG，所述AWG被切割成两部分，所述非线性温度补偿装置1两端分别连接所述AWG的两部分；所述非线性温度补偿装置1通过调整所述驱动杆101长度，对AWG波长随温度的变化进行非线性补偿。On the basis of Embodiment 2, Embodiment 4 of the present invention further provides another nonlinear temperature compensation optical module, which uses the nonlinear temperature compensation device described in Embodiment 2, as shown in FIG. 7, the optical module includes a linear temperature compensating device 1 and an AWG, the AWG is cut into two parts, and the two ends of the nonlinear temperature compensating device 1 are respectively connected to two parts of the AWG; the nonlinear temperature compensating device 1 adjusts the driving rod 101 length, nonlinearly compensates for changes in AWG wavelength with temperature.
本发明提供的一种非线性温度补偿光模块，采用了实施例1中所述的非线性温度补偿装置，采用双程形状记忆合金弹簧对波长随温度的变化进行非线性补偿，结构简单，易于制作；而且相比线性补偿，波长漂移更小，适用温度范围更宽，使AWG芯片的波长偏移在-40℃～85℃区间均能控制在较小的范围内。The invention provides a nonlinear temperature compensating optical module, which adopts the nonlinear temperature compensating device described in Embodiment 1, and adopts a two-way shape memory alloy spring to nonlinearly compensate the change of wavelength with temperature, and has a simple structure and is easy to be used. Compared with linear compensation, the wavelength drift is smaller and the applicable temperature range is wider, so that the wavelength shift of the AWG chip can be controlled within a small range from -40 ° C to 85 ° C.
如图7，所述光模块还包括光路底座，所述光路底座被切割形成第一区域301和第二区域302，所述AWG的两部分分别设置于所述第一区域301和第二 区域302上，所述非线性温度补偿装置1的左右两端分别与所述第一区域301和第二区域302固定，即所述第一固定块104(如图4)与所述第一区域301固定，所述第二固定块105和第三固定块106(如图4)均与所述第二区域302固定。所述AWG芯片组件包括输入装置201、输入平板波导202、阵列波导203、输出平板波导204和输出装置205，并依次连接固定；所述输入装置201耦合在所述输入平板波导202的端面上，所述输出装置205耦合在所述输出平板波导204的端面上；其中，所述AWG芯片组件被切割而形成切割缝隙206，所述切割缝隙206可位于所述输入平板波导202或所述阵列波导203或所述输出平板波导204的任意位置处。As shown in FIG. 7, the optical module further includes an optical path base, the optical path base is cut to form a first area 301 and a second area 302, and two parts of the AWG are respectively disposed on the first area 301 and the second area 302. The left and right ends of the nonlinear temperature compensating device 1 are respectively fixed to the first region 301 and the second region 302, that is, the first fixing block 104 (as shown in FIG. 4) is fixed to the first region 301. The second fixed block 105 and the third fixed block 106 (as shown in FIG. 4) are both fixed to the second region 302. The AWG chip assembly includes an input device 201, an input slab waveguide 202, an array waveguide 203, an output slab waveguide 204, and an output device 205, which are sequentially connected and fixed; the input device 201 is coupled to an end surface of the input slab waveguide 202, The output device 205 is coupled to an end face of the output slab waveguide 204; wherein the AWG chip assembly is cut to form a dicing slit 206, and the dicing slit 206 can be located at the input slab waveguide 202 or the arrayed waveguide 203 or at any position of the output slab waveguide 204.
本发明非线性温度补偿装置的原理与实现方法如下：The principle and implementation method of the nonlinear temperature compensation device of the present invention are as follows:
由实施例2中对所述非线性温度补偿装置1的介绍可知，当温度变化时，所述驱动杆101的长度随温度非线性变化，驱动杆101长度变化时，所述第一固定块104可带动所述第一区域301移动，所述第二固定块105和所述第三固定块106可带动所述第二区域302移动，则所述第一区域301和第二区域302发生相对位移，进而使所述AWG切割开的两部分发生相对位移，从而对AWG波长随温度的变化进行非线性补偿。It can be seen from the introduction of the nonlinear temperature compensating device 1 in Embodiment 2 that when the temperature changes, the length of the driving rod 101 changes nonlinearly with temperature, and when the length of the driving rod 101 changes, the first fixing block 104 The first region 301 can be moved, the second fixed block 105 and the third fixed block 106 can move the second region 302, and the first region 301 and the second region 302 are relatively displaced. In turn, the two portions of the AWG cut are relatively displaced, thereby nonlinearly compensating for changes in the AWG wavelength with temperature.
当温度小于T 1时，弹簧应变恢复率η为零，所述双程形状记忆合金弹簧103此时长度不变，对驱动杆101的长度变化不起作用，则当温度变化时，所述驱动杆101的长度变化dL 1为LαdT，驱动位移较小，对AWG波长的补偿呈欠补偿状态；所述非线性温度补偿装置1中的双程形状记忆合金弹簧103预制为压簧，当温度大于T 1时，弹簧开始伸长，则当温度变化时，所述驱动杆101的长度变化dL 2为
Figure PCTCN2018123409-appb-000007
即dL 2＞dL 1，也就是说此时的驱动位移较大，对AWG波长的补偿呈过补偿状态。所得到的AWG温度补偿曲线如图6所示，在-40～85℃温度范围内均具有较小的波长偏移。 When the temperature is less than T 1 , the spring strain recovery rate η is zero, and the two-way shape memory alloy spring 103 does not change at this time, and does not contribute to the change in the length of the driving rod 101, and when the temperature changes, the driving The length change dL 1 of the rod 101 is LαdT, the driving displacement is small, and the compensation for the AWG wavelength is in an under-compensated state; the two-way shape memory alloy spring 103 in the nonlinear temperature compensating device 1 is prefabricated as a compression spring when the temperature is greater than When T 1 , the spring starts to elongate, and when the temperature changes, the length change dL 2 of the driving rod 101 is
Figure PCTCN2018123409-appb-000007
That is, dL 2 >dL 1 , that is to say, the driving displacement at this time is large, and the compensation for the AWG wavelength is overcompensated. The obtained AWG temperature compensation curve is as shown in Fig. 6, and has a small wavelength shift in the temperature range of -40 to 85 °C.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明 的保护范围之内。The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

Claims (10)

  1. 一种非线性温度补偿装置，其特征在于，包括驱动杆(101)和双程形状记忆合金弹簧(103)，所述驱动杆(101)上设置有一个或多个弹性结构(102)，所述双程形状记忆合金弹簧(103)的两端与所述驱动杆(101)连接，且所述双程形状记忆合金弹簧(103)与所述一个或多个弹性结构(102)并联；其中，所述双程形状记忆合金弹簧(103)采用可实现双程形状记忆行为的材料做成，其长度随温度呈非线性变化。A nonlinear temperature compensating device, comprising: a driving rod (101) and a two-way shape memory alloy spring (103), wherein the driving rod (101) is provided with one or more elastic structures (102), Two ends of the two-way shape memory alloy spring (103) are connected to the driving rod (101), and the two-way shape memory alloy spring (103) is connected in parallel with the one or more elastic structures (102); The two-way shape memory alloy spring (103) is made of a material that can realize a two-way shape memory behavior, and its length varies nonlinearly with temperature.
  2. 根据权利要求1所述的非线性温度补偿装置，其特征在于，所述双程形状记忆合金弹簧(103)的马氏体相变开始温度T 1的范围为-40～85℃，当温度高于T 1时，所述双程形状记忆合金弹簧(103)的长度开始变化。 The nonlinear temperature compensating apparatus according to claim 1, wherein said two-way shape memory alloy spring (103) has a martensitic transformation starting temperature T 1 in a range of -40 to 85 ° C when the temperature is high. At T 1 , the length of the two-way shape memory alloy spring (103) begins to change.
  3. 根据权利要求2所述的非线性温度补偿装置，其特征在于，所述驱动杆(101)长度随温度发生变化，且所述驱动杆(101)长度变化由驱动杆材料的热胀冷缩和所述双程形状记忆合金弹簧(103)的长度变化引起；其中，温度低于T 1时，所述驱动杆(101)杆长变化量为dL 1，温度高于T 1时，所述驱动杆(101)杆长变化量为dL 2，其中，dL 1小于dL 2。 The non-linear temperature compensating device according to claim 2, wherein the length of the driving rod (101) changes with temperature, and the length of the driving rod (101) changes by thermal expansion and contraction of the driving rod material. the length of the two-way shape memory alloy spring (103) causes a change; wherein the temperature is less than T 1, said drive rod (101) lever length change amount is dL 1, a temperature greater than T 1, said driving The rod (101) rod length variation is dL 2 , where dL 1 is less than dL 2 .
  4. 根据权利要求1所述的非线性温度补偿装置，其特征在于，所述驱动杆(101)内部开有孔槽，所述孔槽与所述弹性结构(102)并联，所述双程形状记忆合金弹簧(103)的两端固定在孔槽内壁上。The non-linear temperature compensating device according to claim 1, wherein the driving rod (101) is internally provided with a hole groove, and the hole groove is connected in parallel with the elastic structure (102), the two-way shape memory Both ends of the alloy spring (103) are fixed to the inner wall of the slot.
  5. 一种非线性温度补偿光模块，其特征在于，包括权利要求1-4任一所述的非线性温度补偿装置(1)和AWG，所述AWG被切割成两部分，所述非线性温度补偿装置(1)两端分别连接所述AWG的两部分；所述非线性温度补偿装置(1)通过调整所述驱动杆(101)长度，对AWG波长随温度的变化进行非线性补偿。A nonlinear temperature compensating optical module, comprising the nonlinear temperature compensating device (1) and the AWG according to any one of claims 1-4, the AWG being cut into two parts, the nonlinear temperature compensation The two ends of the device (1) are respectively connected to two parts of the AWG; the nonlinear temperature compensating device (1) nonlinearly compensates for the change of the AWG wavelength with temperature by adjusting the length of the driving rod (101).
  6. 根据权利要求5所述的非线性温度补偿光模块，其特征在于，当温度低于T 1时，所述非线性温度补偿装置(1)对AWG的补偿为欠补偿；当温度高于T 1时，所述非线性温度补偿装置(1)对AWG的补偿为过补偿。 The non-linear temperature compensation of the optical module as claimed in claim 5, wherein, when the temperature is lower than T 1, said non-linear temperature compensation means (1) for the compensation of the AWG undercompensation; 1 when the temperature is higher than T At the time, the compensation of the AWG by the nonlinear temperature compensating device (1) is overcompensated.
  7. 根据权利要求5所述的非线性温度补偿光模块，其特征在于，还包括光路底座，所述光路底座被切割形成第一区域(301)和第二区域(302)，所述AWG的两部分分别设置于所述第一区域(301)和第二区域(302)上，所述非线性温度补偿装置(1)两端分别与所述第一区域(301)和第二区域(302)固定。The nonlinear temperature-compensated optical module according to claim 5, further comprising an optical path base, the optical path base being cut to form a first area (301) and a second area (302), two parts of the AWG And respectively disposed on the first region (301) and the second region (302), the two ends of the nonlinear temperature compensation device (1) are respectively fixed to the first region (301) and the second region (302) .
  8. 根据权利要求5所述的非线性温度补偿光模块，其特征在于，所述AWG包括输入装置(201)、输入平板波导(202)、阵列波导(203)、输出平板波导(204)和输出装置(205)，并依次连接固定；其中，所述AWG被切割而形成切割缝隙(206)，所述切割缝隙(206)位于所述输入平板波导(202)或所述阵列波导(203)或所述输出平板波导(204)的任意位置处。The nonlinear temperature-compensated optical module according to claim 5, wherein the AWG comprises an input device (201), an input slab waveguide (202), an array waveguide (203), an output slab waveguide (204), and an output device. (205), and sequentially connected and fixed; wherein the AWG is cut to form a cutting slit (206), the cutting slit (206) being located at the input slab waveguide (202) or the array waveguide (203) or Said output slab waveguide (204) at any position.
  9. 一种非线性温度补偿方法，其特征在于，使用权利要求5-8任一所述的非线性温度补偿光模块，当温度变化时，所述驱动杆(101)杆长随温度呈非线性变化，进而带动所述AWG的两部分相对移动；A nonlinear temperature compensation method, characterized in that the nonlinear temperature compensation optical module according to any one of claims 5-8 is used, and when the temperature changes, the rod length of the driving rod (101) changes nonlinearly with temperature. , which in turn drives the relative movement of the two parts of the AWG;
    其中，所述驱动杆(101)的杆长变化由驱动杆材料的热胀冷缩和所述双程形状记忆合金弹簧(103)的长度变化引起，由热胀冷缩导致的杆长变化与温度成正比，由所述双程形状记忆合金弹簧(103)导致的杆长变化与弹簧应变恢复率η有关；其中，η随温度非线性变化。Wherein, the change in the length of the rod of the driving rod (101) is caused by the thermal expansion and contraction of the material of the driving rod and the length change of the two-way shape memory alloy spring (103), and the variation of the length of the rod caused by thermal expansion and contraction In proportion to the temperature, the change in rod length caused by the two-way shape memory alloy spring (103) is related to the spring strain recovery rate η; wherein η varies nonlinearly with temperature.
  10. 根据权利要求9所述的非线性温度补偿方法，其特征在于，所述驱动杆(101)杆长随温度的变化量dL如式：
    Figure PCTCN2018123409-appb-100001
    The non-linear temperature compensation method according to claim 9, wherein the amount of change in the length of the rod of the driving rod (101) with temperature is as follows:
    Figure PCTCN2018123409-appb-100001
    其中，L为所述驱动杆(101)在T 1下的长度，α为驱动杆材料的热膨胀系数，dT为温度变化，K 1和K 2分别为所述弹性结构(102)和所述双程形状记忆合金弹簧(103)的刚度，L M和L A分别为所述双程形状记忆合金弹簧(103)在纯马氏体状态和纯奥氏体状态下的长度。 Wherein, L is the drive rod (101) in the length T 1, α is the thermal expansion coefficient of the drive rod material, dT is a change in temperature, K 1 and K 2 are the elastic structure (102) and the bis The stiffness of the shape memory alloy spring (103), L M and L A , is the length of the two-way shape memory alloy spring (103) in the pure martensite state and the pure austenite state, respectively.
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