CN207937671U - A kind of pedestal for fixed array waveguide grid chip - Google Patents

A kind of pedestal for fixed array waveguide grid chip Download PDF

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Publication number
CN207937671U
CN207937671U CN201721532421.4U CN201721532421U CN207937671U CN 207937671 U CN207937671 U CN 207937671U CN 201721532421 U CN201721532421 U CN 201721532421U CN 207937671 U CN207937671 U CN 207937671U
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China
Prior art keywords
pedestal
sub
protrusion
array waveguide
screw rod
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CN201721532421.4U
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蔡文龙
刘丹
李家喻
黄望隆
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WUHAN YILUT TECHNOLOGY Co Ltd
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WUHAN YILUT TECHNOLOGY Co Ltd
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Abstract

The utility model provides a kind of pedestal for fixed array waveguide grid chip, including base body and compensation adjustment screw rod;Base body includes the first sub- pedestal with protrusion and the second sub- pedestal with recess portion, and protrusion matches with the recess portion and protrusion is arranged in the recess portion;First side of the second sub- pedestal is provided with the chip channel and protrusion for protruding from the first side, protrusion includes the first support plate and the second support plate for being mutually V-type setting, first support plate is provided with the first groove close to the side of recess portion, and the second support plate is provided with the second groove close to the side of recess portion;The compensation adjustment screw rod is set between the one end of the second support plate and the protrusion.Compensation adjustment screw rod is arranged by cutting base in the utility model, and when the AWG chips on pedestal being made to be affected by temperature and generate variation, expanding with heat and contract with cold for compensation adjustment screw rod makes slab guide move, and compensates for influence of the temperature to AWG centre wavelengths.

Description

A kind of pedestal for fixed array waveguide grid chip
Technical field
The utility model is related to fields of communication technology, more particularly to a kind of bottom for fixed array waveguide grid chip Seat.
Background technology
With the rapid development of the communication technology and its business, the research of high-capacity optical fiber communication system has prodigious application Value.Acquired optical fiber maximum transfer capacity is only equivalent to the 0.24 of its latent capacity so far.Coarse wavelength division multiplexing (CWDM) skill Art can excavate the transmission potential of optical fiber well.Its research and application are being carried out at the same time based on array waveguide grating (AWG) optical device has important application prospect, research and development work to obtain quickly recent years in WDM technology Development.
The concept of AWG was proposed in 1988 by the Smit of Dutch Delft universities first.Its important application value is drawn The concern of NTT companies and the laboratories Bell etc. is played, researcher has developed the AWG devices of different indexs on Si and InP materials Part sample simultaneously starts to be used for system.With the development of communication service and the surge of transmission capacity, coarse wavelength division multiplexing systems (CWDM) Increasingly it is valued by people.Early stage is applied to the CWDM of North America backbone network, is rapidly advanced to the whole world now, And it is widely applied among Metropolitan Area Network (MAN).There are mainly three types of types for the CWDM technologies developed both at home and abroad at present, they distinguish base In array waveguide grating (AWG-Arrayed Waveguide Grating) and dielectric coating filter (TFF) and fiber grating (FBG) technology.AWG is a kind of plane waveguiding device, is the array waveguide grating made on a chip substrate using PLC technology. The prior art is in order to solve the temperature sensitive feature of silicon substrate AWG chips, usually using temperature controller and temperature-control circuit To stablize center output wavelength;But which increases the cost of AWG chips, sizes, and limit the application range of AWG.
Compared with FBG and TTF, AWG is high with integrated level, number of active lanes is more, insertion loss is small, is easy to batch for the country at present The advantages that automated production.But AWG chips are since itself is very fragile, more demanding for its encapsulation.The prior art is to understand The certainly temperature sensitive feature of silicon substrate AWG chips stablizes center output usually using temperature controller and temperature-control circuit Wavelength;But which increases the cost of AWG chips, sizes, and limit the application range of AWG.Existing AWG chips Firm banking stability it is poor, heat dissipation performance is also bad, leads to AWG chip service life reductions.
Utility model content
The utility model is the above problem for solving the prior art, is provided a kind of for fixed array waveguide grid chip Pedestal.
The utility model provides a kind of pedestal for fixed array waveguide grid chip, including base body and compensation are adjusted Save screw rod;
The base body includes the first sub- pedestal with protrusion and the second sub- pedestal with recess portion, the protrusion with The recess portion matches and the protrusion is arranged in the recess portion;
First side of the second sub- pedestal is provided with the chip channel and protrusion for protruding from first side, described First side and the recess portion are that the described second sub- pedestal intersects and adjacent two sides, and the protrusion be located remotely from it is described recessed The one end in portion;
The protrusion includes the first support plate and the second support plate for being mutually V-type setting, and first support plate is close to the recess portion Side be provided with the first groove, second support plate is provided with the second groove close to the side of the recess portion;
The compensation adjustment screw rod, and the compensation adjustment are set between the one end and the protrusion of second support plate Screw rod is parallel to first side.
Wherein, the pedestal is stainless steel base.
Wherein, the width of first groove is 0.83 ± 0.05mm, the width of second groove is 0.83 ± 0.05mm。
Wherein, there is divisional plane, the middle part of the divisional plane to be equipped with one between the described first sub- pedestal and the second sub- pedestal The width of cross-notching, the fluting is 0.57 ± 0.05mm.
Wherein, the described second sub- pedestal pastes the surface of AWG chips equipped with a pair of of rectangular through-hole, the width of the rectangular through-hole Degree is 2 ± 0.05mm, and the length of the rectangular through-hole is 4 ± 0.05mm;Grating fixture is installed in the rectangular through-hole, it is described The height of grating fixture is more than the depth of the rectangular through-hole.
Wherein, the left side of the described first sub- pedestal is equipped with semi-circular through hole, and the radius of the semi-circular through hole is 1.1 ± 0.05mm。
Wherein, the pedestal further includes at least four nuts;
The compensation adjustment screw rod is connected by least two nuts with the one end of second support plate;It is described Compensation adjustment screw rod is connected by least two nuts with the protrusion of the described second sub- pedestal.
Wherein, the coefficient of thermal expansion of the pedestal is less than 0.7 × 10-6 DEG C, the coefficient of thermal expansion of the compensation adjustment screw rod It it is 12.7 × 10-6 DEG C, the coefficient of thermal expansion of the nut is less than 1.8 × 10-6 DEG C.
Wherein, the susceptor surface stickup is fixed with AWG chips;
The array waveguide grid chip is 40 channel AWG chips, and the divisional plane passes through the array waveguide grating core Piece input planar waveguide in or it is described input planar waveguide entrance face.
Wherein, the divisional plane is vertical with the base body and the upper surface of AWG chips.
Afebrile array waveguide grating wavelength division multiplexer provided by the utility model by cutting base, and is arranged compensation and adjusts Screw rod is saved, when the AWG chips on pedestal being made to be affected by temperature and generate variation, expanding with heat and contract with cold for compensation adjustment screw rod makes plane wave Movement is led, is matched with fixed expanding with heat and contract with cold for AWG chips on pedestal, it is real to compensate for influence of the temperature to AWG centre wavelengths The stabilization of existing AWG chip center wavelength.The utility model eliminates the bias effect that temperature change generates AWG centre wavelengths, Reduce the cost and size of AWG chips;Both ends of the first sub- pedestal at the port of the second sub- pedestal are respectively equipped with first When compensation adjustment screw rod being made to deform upon, the relative displacement of two sub- pedestals is buffered by two grooves for groove and the second groove, Improve the stability of pedestal.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts, Other drawings may also be obtained based on these drawings.
Fig. 1 is to be illustrated according to the understructure for fixed array waveguide grid chip that the utility model embodiment provides Figure;
Fig. 2 is the conventional AWG chip operation principle schematic diagram provided according to the utility model embodiment;
Fig. 3 is the operation principle schematic diagram of fixed AWG chips on the pedestal provided according to the utility model embodiment;
Fig. 4 is the Heatless AWG core of the afebrile array waveguide grating wavelength division multiplexer provided according to the utility model embodiment Piece compensated curve;
In figure:1, the first sub- pedestal;2, the second sub- pedestal;3, compensation adjustment screw rod;4, the first groove;5, the second groove; 6, it slots;7, rectangular through-hole;8, semi-circular through hole;9, nut;10, the first support plate;11, the second support plate;12, protrusion.
Specific implementation mode
It is new below in conjunction with this practicality to keep the purpose, technical scheme and advantage of the utility model embodiment clearer Attached drawing in type embodiment, is explicitly described the technical scheme in the embodiment of the utility model, it is clear that described reality It is one module embodiments of the utility model to apply example, instead of all the embodiments.Based on the embodiments of the present invention, ability It is new to belong to this practicality for the every other embodiment that domain those of ordinary skill is obtained without making creative work The range of type protection.
Fig. 1 is a kind of understructure for fixed array waveguide grid chip provided according to the utility model embodiment Schematic diagram, referring to Fig.1, the pedestal provided in this embodiment for fixed array waveguide grid chip includes base body and compensation Adjusting screw rod 3;
The base body includes the first sub- pedestal 1 with protrusion and the second sub- pedestal 2 with recess portion, the protrusion Match with the recess portion and the protrusion is arranged in the recess portion;
First side of the second sub- pedestal 2 is provided with the chip channel and protrusion 12 for protruding from first side, First side is intersected for the described second sub- pedestal with the recess portion and adjacent two sides, and the protrusion 12 is located remotely from One end of the recess portion;
The protrusion includes the first support plate 10 and the second support plate 11 for being mutually V-type setting, and first support plate 10 is close to institute The side for stating recess portion is provided with the first groove 4, and second support plate 11 is provided with the second groove 5 close to the side of the recess portion; First groove 4 and second groove 5 are used to buffer the opposite position of the described first sub- pedestal 1 and the described second sub- pedestal 2 Shifting amount;
The compensation adjustment screw rod 3, and the benefit are set between the one end and the protrusion 12 of second support plate 11 It repays adjusting screw rod 3 and is parallel to first side.
Specifically, the utility model embodiment mainly provides a kind of pedestal for fixing AWG chips, passes through pedestal and benefit Repaying the cooperation of adjusting screw rod 3 makes sufficient center wavelength accuracy of the array waveguide grid chip between -10 DEG C~75 DEG C.
The pedestal includes base body and compensation adjustment screw rod 3;The base body includes the first son for having protrusion Pedestal 1 and the second sub- pedestal 2 with recess portion, it is succinct to describe, " base body " is referred to as " pedestal " below, " array wave Waveguide Grating chip " is referred to as " AWG chips ".
Base body is divided into the first sub- pedestal 1 and the second sub- pedestal 2 by least one divisional plane, such as using cutting automatically Pedestal can be cut into two parts by cutting mill:First sub- pedestal 1 and the second sub- pedestal 2;Referring to Fig.1, the lower-left of base body Side is the first sub- pedestal, and the upper right side of base body is the second sub- pedestal 2.
Referring to Fig.1, the first sub- pedestal 1 has protrusion, and protrusion includes the first support plate 10 and the second support plate for being mutually V-type setting 11, first support plate 10 is provided with the first groove close to the side of the recess portion, and second support plate 11 is close to the recess portion Side be provided with the second groove;First groove and second groove are for buffering the described first sub- pedestal and described the The relative shift of two sub- pedestals.
Compensation adjustment screw rod 3 is set between the one end of second support plate 11 and the protrusion 12 of the second sub- pedestal, and compensates and adjusts Section screw rod 3 is parallel to the first side.When the temperature is changed, 3 expanded by heating of compensation adjustment screw rod, when compensation adjustment screw rod 3 is because of warm Swollen shrinkage and occur length variation when, stress variation and the deformation of 4/ second groove 5 of the first groove can be driven accordingly, with pedestal Upper fixed expanding with heat and contract with cold for AWG chips matches, and realizes the stabilization of AWG chip center wavelength.
First side of the second sub- pedestal 2 is provided with the chip channel and protrusion 12 for protruding from first side, described First side is intersected for the described second sub- pedestal 2 with the recess portion and adjacent two sides, and the protrusion 12 is located remotely from institute State one end of recess portion;The length of compensation adjustment screw rod 3 changes with the variation of temperature, so as to adjust the first sub- pedestal 1 and The relative position of two sub- pedestals 2 further adjusts the position of fixed array waveguide grid chip on pedestal, makes waveguide input terminal The position of facing arrays grating shifts, and realizes the stabilization of centre wavelength.
Fig. 2 is the conventional AWG chip operation principle schematic diagram that the utility model embodiment provides, and Fig. 3 is the utility model The operation principle schematic diagram of fixed AWG chips on the pedestal that embodiment provides.With reference to Fig. 2, (a) is conventional AWG chip low The schematic diagram that focus shifts under temperature state is (b) schematic diagram of the conventional AWG chip under middle temperature state, is (c) tradition AWG cores The piece schematic diagram that focus shifts at high operating temperatures.
With reference to Fig. 3, fixed AWG chips wave under low-temperature condition on the pedestal that (a) provides for the utility model embodiment The schematic diagram of overheat contraction and movement is connected, be (b) on pedestal that the utility model embodiment provides fixed AWG chips in Schematic diagram under temperature state (c) is fixed AWG chips wave at high operating temperatures on the pedestal that provides of the utility model embodiment It was connected and thermally expanded and mobile schematic diagram.By Fig. 2 and Fig. 3 it is found that the focus of conventional AWG chip is varied with temperature and shifted, The focus of Heatless AWG chip varies with temperature and keeps stable.
Fixed AWG chips are by the larger compensation adjustment of coefficient of thermal expansion on the pedestal that the utility model embodiment provides Screw rod 3 drives the waveguide movement of input terminal, the compensation adjustment spiral shell of the coefficient of thermal expansion and metal of displacement distance and material itself The length of bar 3 is related.The distance dX that input waveguide is moved with temperature meets following formula with environment temperature T variations:
Wherein, LfFor the focusing length of slab waveguide portion, D spacing between adjacent array waveguide, Δ L is adjacent array The length difference of waveguide, λoCentered on wavelength, ngFor group index, nsFor the effective refractive index of planar waveguide.
Fig. 4 is the Heatless AWG core of the afebrile array waveguide grating wavelength division multiplexer provided according to the utility model embodiment Piece compensated curve, the variations in refractive index of AWG chips and the coefficient of thermal expansion of metal are although be approximately constant, after practical compensation The relationship meeting of wavelength and temperature as shown in figure 4, the offset of its AWG centre wavelength be affected by temperature in -10~70 DEG C it is smaller.
The afebrile array waveguide grating wavelength division multiplexer that the utility model embodiment provides, by cutting base, and is arranged Compensation adjustment screw rod, when the AWG chips on pedestal being made to be affected by temperature and generate variation, expanding with heat and contract with cold for compensation adjustment screw rod makes Slab guide is moved, and influence of the temperature to AWG centre wavelengths is compensated for.The utility model eliminates temperature change to the centers AWG The bias effect that wavelength generates, reduces the cost and size of AWG chips.First sub- pedestal is at the port of the second sub- pedestal Both ends be respectively equipped with the first groove and the second groove, when compensation adjustment screw rod being made to deform upon, pass through two grooves buffering two The relative displacement of a sub- pedestal, improves the stability of pedestal, improves the service life of pedestal.
In a preferred embodiment of the utility model, the pedestal is stainless steel base.The heat of stainless steel base is swollen Swollen coefficient is smaller, for fixing AWG chips.
In a preferred embodiment of the utility model, the width L1 of first groove 4 is 0.83 ± 0.05mm, institute The width for stating the second groove 5 is 0.83 ± 0.05mm.Experiment show that fixed AWG chips are affected by temperature every on bottom plate Degree Celsius variation 11.4pm, micromicron (picometer or pm) is length unit, and 1 micromicron is equivalent to 1 meter of trillionth. Compensation adjustment screw rod 3, which is affected by temperature, to expand with heat and contract with cold, and matches with fixed expanding with heat and contract with cold for AWG chips on pedestal, realizes AWG The stabilization of chip center's wavelength.Relative displacement occurs between first sub- pedestal 1 and the second sub- pedestal 2, the first groove 4 and second is recessed The width of slot 5 is 0.83 ± 0.05mm, can effectively relative displacement caused by buffer screw stem deformation.
In a preferred embodiment of the utility model, the middle part of the divisional plane is equipped with fluting 6, the fluting 6 Width is 0.57 ± 0.05mm.
Specifically, referring to Fig.1, the middle part of divisional plane is equipped with a cross-notching 6, and the 6 width L2 of slotting is 0.57 ± 0.05mm, The distance between cross-notching 6 L3 is 0.85 ± 0.05mm on pedestal, and fixed AWG chips pass through the fluting 6 wherein on pedestal, When on pedestal fixed AWG chips expand with heat and contract with cold deform upon when, the fluting 6 in the middle part of divisional plane also deforms upon, and avoids pedestal It is squeezed by AWG chips, improves the stability of pedestal, improve the service life of pedestal.
In a preferred embodiment of the utility model, the surface that the second sub- pedestal 2 pastes AWG chips is equipped with one To rectangular through-hole, the width L4 of the rectangular through-hole is 2 ± 0.05mm, and the length L5 of the rectangular through-hole is 4 ± 0.05mm;Institute It states and grating fixture is installed in rectangular through-hole, the height of the grating fixture is more than the depth of the rectangular through-hole.
Specifically, referring to Fig.1,2 surface of the second sub- pedestal is provided through rectangular through-hole, and grating is equipped in rectangular through-hole Fixture, the height of grating fixture are more than the depth of the rectangular through-hole;Grating fixture is pasted for fixing AWG chips, AWG chips It is fixed in grating fixture.A pair of of rectangular through-hole is set in susceptor surface, and grating fixture is set in through-hole, by fixture into One step fixes AWG chips, improves the stability of pedestal, pedestal is avoided to be influenced the service life of pedestal by AWG chip shocks.
In a preferred embodiment of the utility model, the left side of the first sub- pedestal 1 is equipped with semi-circular through hole 8, The radius R of the semi-circular through hole 8 is 1.1 ± 0.05mm.
Specifically, referring to Fig.1, semi-circular through hole 8 is arranged in the left side of the first sub- pedestal 1, and the radius R of semi-circular through hole 8 is 1.1±0.05mm.Semi-circular through hole 8 is set in the left side of the first sub- pedestal 1, improves the heat dissipation performance of pedestal, avoids pedestal On AWG chip temperatures it is excessively high influence AWG chips performance.
In a preferred embodiment of the utility model, the pedestal further includes at least four nuts 9;
The compensation adjustment screw rod 3 is connected by least two nuts 8 with the one end of second support plate 11; The compensation adjustment screw rod 3 is connected by least two nuts 9 with the protrusion 12 of the described second sub- pedestal 2.
Specifically, referring to Fig.1, nut 9 is used for fixed compensation adjusting screw rod 3 and pedestal;Compensation adjustment screw rod 3 passes through two Nut 9 is connected with the one end of the second support plate 11;Similarly, compensation adjustment screw rod 3 passes through two nuts 9 and the second sub- pedestal 2 protrusion 12 connects.Also, by adjusting nut 9 can on adjustment base fixed AWG chips centre wavelength.
In a preferred embodiment of the utility model, the coefficient of thermal expansion of the pedestal is less than 0.7 × 10-6DEG C, institute The coefficient of thermal expansion for stating compensation adjustment screw rod 3 is 12.7 × 10-6DEG C, the coefficient of thermal expansion of the nut 9 is less than 1.8 × 10-6 ℃。
Specifically, pedestal is stainless steel base, and at -40~85 DEG C, the coefficient of thermal expansion of pedestal 1 is less than 0.7 × 10-6 DEG C, the coefficient of thermal expansion of compensation adjustment screw rod 3 is 12.7 × 10-6℃;When the every degree Celsius of variation affected by temperature of AWG chips 11.4pm, the expand with heat and contract with cold deformation of generation of compensation adjustment screw rod 3 make slab guide move, and compensation temperature is to AWG centre wavelengths It influences.The coefficient of thermal expansion of pedestal and nut 9 is relatively low, and 1 He of the first sub- pedestal is buffered by the first groove 4 and the second groove 5 Relative displacement between second sub- pedestal 2.Such as when the temperature increases, 3 expanded by heating of compensation adjustment screw rod, when compensation adjustment spiral shell When length variation occurs because expanding with heat and contract with cold for bar 3, the stress variation and shape of 4/ second groove 5 of the first groove can be driven accordingly Become, reduces the stress of pedestal being subject to, promote the service life of pedestal.
In a preferred embodiment of the utility model, the susceptor surface stickup is fixed with AWG chips;The array Waveguide grid chip is 40 channel AWG chips, and the divisional plane passes through the input planar waveguide of the array waveguide grid chip The entrance face of the interior or described input planar waveguide.
Specifically, using grating fixture and bonded adhesives, AWG chips is pasted and are fixed on the surface of stainless steel base. Stainless steel base and AWG chips are divided face segmentation;It, can be by the free waveguide of AWG chips such as using automatic gas cutting machine Cut-out, and keep cutting end face smooth;AWG chips and pedestal are cut into two parts, form divisional plane.It pastes and fixes on pedestal AWG chips have 40 channels, and by adjusting nut 9, can make 40 channel AWG chips centre wavelength be ITUT waves It is long.Divisional plane passes through in the input planar waveguide of the array waveguide grid chip or the entrance face of input planar waveguide.AWG The centre wavelength of chip can be adjusted when packaged, can eliminate the middle cardiac wave of itself in AWG chip generating process in this way Long inconsistency so that AWG chips can carry out commercialization.
In a preferred embodiment of the utility model, the divisional plane and the base body and the AWG chips Upper surface it is vertical.
Specifically, make divisional plane is vertical with the upper surface of pedestal and AWG chips can obtain vertical notch end face, not shadow Ring the performance of pedestal and AWG chips.
The afebrile array waveguide grating wavelength division multiplexer that the utility model embodiment provides, by cutting base, and is arranged Compensation adjustment screw rod, when the AWG chips on pedestal being made to be affected by temperature and generate variation, expanding with heat and contract with cold for compensation adjustment screw rod makes Slab guide is moved, and influence of the temperature to AWG centre wavelengths is compensated for;The utility model eliminates temperature change to the centers AWG The bias effect that wavelength generates, reduces the cost and size of AWG chips;First sub- pedestal is at the port of the second sub- pedestal Both ends be respectively equipped with the first groove and the second groove, when compensation adjustment screw rod being made to deform upon, pass through two grooves buffering two The relative displacement of a sub- pedestal, improves the stability of pedestal, improves the service life of pedestal.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also include other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that There is also other identical elements in process, method, article or equipment including the element.The fingers such as term "upper", "lower" The orientation or positional relationship shown be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the utility model and Simplify description, does not indicate or imply the indicated device or element must have a particular orientation, with specific azimuth configuration And operation, therefore should not be understood as limiting the present invention.Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect It connects;It can be mechanical connection, can also be electrical connection;It can be directly connected, can also indirectly connected through an intermediary, it can To be the connection inside two elements.For the ordinary skill in the art, can understand as the case may be above-mentioned The concrete meaning of term in the present invention.
Finally it should be noted that:Above example is only to illustrate the technical solution of the utility model, rather than its limitations; Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: It can still modify to the technical solution recorded in foregoing individual embodiments, or be carried out to wherein building block technique feature Equivalent replacement;And these modifications or replacements, each embodiment of the utility model that it does not separate the essence of the corresponding technical solution The spirit and scope of technical solution.

Claims (10)

1. a kind of pedestal for fixed array waveguide grid chip, which is characterized in that including base body and compensation adjustment spiral shell Bar;
The base body includes the first sub- pedestal with protrusion and the second sub- pedestal with recess portion, the protrusion with it is described Recess portion matches and the protrusion is arranged in the recess portion;
First side of the second sub- pedestal is provided with the chip channel and protrusion for protruding from first side, and described first Side is intersected for the described second sub- pedestal with the recess portion and adjacent two sides, and the protrusion is located remotely from the recess portion One end;
The protrusion includes the first support plate and the second support plate for being mutually V-type setting, and first support plate is close to the one of the recess portion Side is provided with the first groove, and second support plate is provided with the second groove close to the side of the recess portion;
The compensation adjustment screw rod, and the compensation adjustment screw rod are set between the one end and the protrusion of second support plate It is parallel to first side.
2. the pedestal for fixed array waveguide grid chip according to claim 1, which is characterized in that the pedestal For stainless steel base.
3. the pedestal for fixed array waveguide grid chip according to claim 1, which is characterized in that described first The width of groove is 0.83 ± 0.05mm, and the width of second groove is 0.83 ± 0.05mm.
4. the pedestal for fixed array waveguide grid chip according to claim 1, which is characterized in that described first There is divisional plane, the middle part of the divisional plane to be equipped with a cross-notching, the width of the fluting between sub- pedestal and the second sub- pedestal For 0.57 ± 0.05mm.
5. the pedestal for fixed array waveguide grid chip according to claim 1, which is characterized in that described second The surface that sub- pedestal pastes AWG chips is equipped with a pair of of rectangular through-hole, and the width of the rectangular through-hole is 2 ± 0.05mm, the square The length of shape through-hole is 4 ± 0.05mm;Grating fixture is installed, the height of the grating fixture is more than institute in the rectangular through-hole State the depth of rectangular through-hole.
6. the pedestal for fixed array waveguide grid chip according to claim 1, which is characterized in that described first The left side of sub- pedestal is equipped with semi-circular through hole, and the radius of the semi-circular through hole is 1.1 ± 0.05mm.
7. the pedestal according to claim 1 for fixed array waveguide grid chip, which is characterized in that further include at least Four nuts;
The compensation adjustment screw rod is connected by least two nuts with the one end of second support plate;
The compensation adjustment screw rod is connected by least two nuts with the protrusion of the described second sub- pedestal.
8. the pedestal according to claim 7 for fixed array waveguide grid chip, which is characterized in that
The coefficient of thermal expansion of the pedestal is less than 0.7 × 10-6DEG C, the coefficient of thermal expansion of the compensation adjustment screw rod is 12.7 × 10-6DEG C, the coefficient of thermal expansion of the nut is less than 1.8 × 10-6℃。
9. the pedestal according to claim 4 for fixed array waveguide grid chip, which is characterized in that the pedestal table Face, which is pasted, is fixed with AWG chips;
The array waveguide grid chip is 40 channel AWG chips, and the divisional plane passes through the array waveguide grid chip Input in planar waveguide or input the entrance face of planar waveguide.
10. the pedestal according to claim 9 for fixed array waveguide grid chip, which is characterized in that the segmentation Face is vertical with the base body and the upper surface of AWG chips.
CN201721532421.4U 2017-11-16 2017-11-16 A kind of pedestal for fixed array waveguide grid chip Active CN207937671U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107748421A (en) * 2017-11-16 2018-03-02 武汉驿路通科技股份有限公司 A kind of base for being used to fix array waveguide grid chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107748421A (en) * 2017-11-16 2018-03-02 武汉驿路通科技股份有限公司 A kind of base for being used to fix array waveguide grid chip

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