CN102193149A - Afebrile array waveguide grating wavelength division multiplexer - Google Patents
Afebrile array waveguide grating wavelength division multiplexer Download PDFInfo
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- CN102193149A CN102193149A CN 201110148539 CN201110148539A CN102193149A CN 102193149 A CN102193149 A CN 102193149A CN 201110148539 CN201110148539 CN 201110148539 CN 201110148539 A CN201110148539 A CN 201110148539A CN 102193149 A CN102193149 A CN 102193149A
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Abstract
The invention provides an afebrile array waveguide grating wavelength division multiplexer. The afebrile array waveguide grating wavelength division multiplexer comprises an array wavelength grating chip; the array wavelength grating chip comprises a plane substrate; the plane substrate is provided with an input optical waveguide, an input planar waveguide which is connected with the input optical waveguide, an output optical waveguide, an output planar waveguide which is connected with the output optical waveguide, and a plurality of slab waveguides which are connected between the input planar waveguide and the output planar waveguide; the afebrile array waveguide grating wavelength division multiplexer also comprises a substrate and a sliding assembly; the array wavelength grating chip is fixed on the upper surface of the substrate; the substrate is divided into a first part and a second part by at least one parting plane; the parting plane transversely passes through at least one of the input planar waveguide and the output planar waveguide; two ends of the sliding assembly are fixed on the first part and the second part; and the sliding assembly is an expansion link of which the length is changed along with the change of temperature. The afebrile array waveguide grating wavelength division multiplexer provided by the invention has low production cost; temperature drift of a central wavelength is not obvious; and working stability is high.
Description
Technical field
The present invention relates to a kind of optical device, relate in particular to a kind of non-heat array wave guide grating wavelength division multiplexer.
Background technology
Along with the development of network communication, the data transfer rate of fiber optic network is more and more faster, and is also more and more higher to the capacity requirement of fiber optic network.In the present high speed fibre network system, wavelength-division multiplex technique is usually used in improving the capacity of fiber optic network, and this technology mainly uses arrayed waveguide grating multiplexer to realize.
The structure of existing a kind of arrayed waveguide grating multiplexer as shown in Figure 1, it has the planar substrate 10 that silicon materials are made, the upper surface of substrate 10 deposits ducting layer, and ducting layer comprises input waveguide 11, input planar waveguide 12, Waveguide array 16, output planar waveguide 14 and output optical waveguide 15.Usually, ducting layer is made by silica glass material, and Waveguide array 16 is made of many slab waveguides arranged side by side 13, and many slab waveguide 13 bendings are set up in parallel, have length difference between two adjacent slab waveguides 13, and the length of each root slab waveguide 13 is all inequality.
The output terminal of input waveguide 11 is connected to input planar waveguide 12, and input planar waveguide 12 is connected to the dull and stereotyped waveguide 14 of output by many slab waveguides 13, and the output terminal of output planar waveguide 14 is connected to many output optical waveguides 15.
When the multiplexing optical signal of transmission in the input waveguide 11 enters input during planar waveguide 12, this multiplexing optical signal no longer is tied in side direction, so launch because of diffraction.The multiplexing optical signal that the side direction diffraction launches is coupled into many slab waveguides 13 and propagates in many slab waveguides 13.Because there is length difference each other in many slab waveguides 13, there is certain phase difference in the multiplexing optical signal of propagating in each root slab waveguide 13 each other when arriving output planar waveguide 14.These phase differential cause the wavetilt in the output planar waveguide 14.Because the phase shift size is relevant with wavelength, the image position that pools of each wavelength light signal depends on input optical wavelength, the output optical waveguide 15 that is provided with at different image space places can decompose wavelength optical signals in the corresponding output optical waveguide 15, finishes the demultiplexing function.
Otherwise, change the input waveguide among Fig. 1 11 into output optical waveguide, change the output optical waveguide among Fig. 1 15 into input waveguide, the wavelength optical signals that has in the input waveguide can be converged in the same output waveguide, finish multiplexing function.Therefore, according to the difference of input radiation direction, existing wavelength division multiplexer can be realized the function of multiplexing or demultiplexing.
The centre wavelength of wavelength division multiplexer can be subjected to influence of temperature variation, and existing wavelength division multiplexer center wavelength variation is 0.011nm/ ℃ with the representative value of variation of temperature, and along with temperature variation is big more, center wavelength variation is big more, and this phenomenon is called temperature drift.Because temperature drift has very big influence to the job stability of wavelength division multiplexer, people improve to reduce temperature drift wavelength division multiplexer.
Referring to Fig. 2, existing a kind of non-heat array wave guide grating wavelength division multiplexer comprises substrate 20, deposit ducting layer on the substrate 20, ducting layer comprises input waveguide 23, input planar waveguide 24, Waveguide array 25, output planar waveguide 26 and output optical waveguide 27, wherein Waveguide array 25 comprises the many arranged side by side and crooked slab waveguides that are provided with, and has length difference between two adjacent slab waveguides.
Arrayed waveguide grating multiplexer is divided into two parts by a divisional plane 29, is respectively first 21 and second portion 22, and divisional plane 29 is horizontally through input planar waveguide 24.Also be provided with sliding part 28 on the ducting layer of arrayed waveguide grating multiplexer, the two ends of sliding part 28 are separately fixed on first 21 and the second portion 22, sliding part 28 is made greater than the material of substrate 20 by thermal linear expansion coefficient, as aluminium material, when temperature changes, sliding part 28 can vary with temperature and stretch, first 21 is subjected to displacement in substrate 20 planes with respect to second portion 22, import planar waveguide 24 divided two parts and also relative displacement can take place this moment, thereby the centre wavelength of wavelength division multiplexer is compensated.
It is opening parabolic shape up that the centre wavelength of non-heat array wave guide grating wavelength division multiplexer varies with temperature curve, shown in the dotted line a-b-c of Fig. 3.Here, centre wavelength temperature drift in the time of 20 ℃ that wavelength division multiplexer is set is zero, but temperature is when changing for-30 ℃ to 70 ℃, the maximum drift of centre wavelength reaches 0.04 nanometer, under the bigger environment of temperature variation, perhaps in logical wideer, the network system of frequency interval less than the 100G hertz of band, the performance of the wavelength division multiplexer of this kind temperature drift characteristic will be seriously influenced.
In addition, arrayed waveguide grating multiplexer is on the basis of substrate 20, passes through follow-up precision and expensive technological operation, produces ducting layer as flame hydrolysis deposition, photoetching, reactive ion beam etching (RIBE) etc. just to obtain, and cost of manufacture is higher.Above-mentioned wavelength division multiplexer directly is provided with sliding part 28 on ducting layer, it takies the bigger area of ducting layer, causes great waste, has also increased the production cost of wavelength division multiplexer.
Summary of the invention
Fundamental purpose of the present invention provides the lower non-heat array wave guide grating wavelength division multiplexer of a kind of production cost.
Another object of the present invention provides the less non-heat array wave guide grating wavelength division multiplexer of a kind of centre wavelength temperature drift.
In order to realize above-mentioned fundamental purpose, non-heat array wave guide grating wavelength division multiplexer provided by the invention comprises array waveguide grid chip, has planar substrate, substrate is provided with input waveguide on the substrate, the input planar waveguide that is connected with input waveguide, output optical waveguide, the output planar waveguide that is connected with output optical waveguide, be connected many slab waveguides between input planar waveguide and the output planar waveguide, wherein, also comprise substrate and slide assemblies, array waveguide grid chip is fixed on the upper surface of substrate, substrate is divided into first and second portion by at least one divisional plane, divisional plane is horizontally through at least one in input planar waveguide and the output planar waveguide, the two ends of slide assemblies are separately fixed on first and the second portion, and slide assemblies is to have to vary with temperature and the expansion link of length change.
By such scheme as seen, slide assemblies is not set directly on the ducting layer of array waveguide grid chip, and be arranged on the substrate, the higher array waveguide grid chip of cost of manufacture is fixed on the lower substrate of cost of manufacture, can reduce the area of required array waveguide grid chip so greatly, thereby reduce the production cost of non-heat array wave guide grating wavelength division multiplexer.
A preferred scheme is, offers at least one filler opening on the expansion link, is filled with filling material in the filler opening, and the thermal linear expansion coefficient of filling material is less than the thermal linear expansion coefficient of expansion link.
This shows, when temperature variation is big, the linear change of filling material is not obvious, filling material can be connected on the end walls of filler opening, the length of avoiding expansion link to shrink is excessive, thereby reduce the length variations of expansion link, and then reduce the temperature drift of non-heat array wave guide grating wavelength division multiplexer centre wavelength.
Further scheme is, the non-heat array wave guide grating wavelength division multiplexer also comprises the shift suppression assembly, have a clip and first pressing plate, first pressing plate has abutting part, abutting part is connected to the upper surface of first and the upper surface of second portion, and the first butt limit of clip is connected to first pressing plate on the surface of abutting part.
As seen, use the clip upper and lower surface of clamping substrate on perpendicular to the direction of upper surface of base plate directly or indirectly, can avoid first to be offset with respect to second portion in vertical direction, thereby guarantee the stability of non-heat array wave guide grating wavelength division multiplexer work.
Non-heat array wave guide grating wavelength division multiplexer of the present invention can also be to comprise array waveguide grid chip, it has planar substrate, substrate is provided with the input planar waveguide, output optical waveguide, the output planar waveguide that is connected with output optical waveguide, be connected many slab waveguides between input planar waveguide and the output planar waveguide, and comprise substrate, array waveguide grid chip is fixed on the upper surface of substrate, substrate is divided into first and second portion by at least one divisional plane, divisional plane is horizontally through the end face of described input planar waveguide, one input optical fibre is fixed in the first, and the output terminal of input optical fibre is over against the input planar waveguide, also has slide assemblies, the two ends of slide assemblies are separately fixed on first and the second portion, and slide assemblies is to have to vary with temperature and the expansion link of length change.
By such scheme as seen, slide assemblies is not set directly on the ducting layer of array waveguide grid chip, and be arranged on the substrate, the higher array waveguide grid chip of cost of manufacture is fixed on the lower substrate of cost of manufacture, can reduce the area of array waveguide grid chip so greatly, reduce the production cost of non-heat array wave guide grating wavelength division multiplexer.
Description of drawings
Fig. 1 is the structural drawing of existing a kind of arrayed waveguide grating multiplexer.
Fig. 2 is the structural drawing of existing a kind of non-heat array wave guide grating wavelength division multiplexer.
Fig. 3 is the centre wavelength of several arrayed waveguide grating multiplexers and the curve map of temperature relation.
Fig. 4 is the structural drawing of first embodiment of the invention.
Fig. 5 be among Fig. 4 A-A to profile.
Fig. 6 is the sectional view of slide assemblies and substrate in first variation of first embodiment of the invention.
Fig. 7 is the sectional view of slide assemblies and substrate in second variation of first embodiment of the invention.
Fig. 8 is the structural drawing of second embodiment of the invention.
Fig. 9 is the partial structurtes figure of fourth embodiment of the invention.
Figure 10 be among Fig. 9 B-B to profile.
Figure 11 is the structural drawing of fifth embodiment of the invention.
Figure 12 be among Figure 11 C-C to profile.
Figure 13 is the sectional view of shift suppression assembly and substrate in the sixth embodiment of the invention, input planar waveguide.
Figure 14 is the structural drawing of third embodiment of the invention.
The invention will be further described below in conjunction with drawings and Examples.
Embodiment
First embodiment:
Referring to Fig. 4, present embodiment has a substrate 30, the upper surface of substrate 30 is provided with array waveguide grid chip 35, array waveguide grid chip 35 has planar substrate 36, substrate 36 is fabricated from a silicon, deposit ducting layer on the substrate 36, ducting layer has input waveguide 37, input planar waveguide 38, Waveguide array 39, output planar waveguide 40 and output optical waveguide 41, wherein Waveguide array 39 has many and is set up in parallel and crooked slab waveguide, has length difference between two adjacent slab waveguides.
In the present embodiment, substrate 30 is fabricated from a silicon, and promptly substrate 30 is identical with the material of substrate 36.Array waveguide grid chip 35 is made the back that finishes and is used glue to be bonded on the bigger substrate 30 of area.Certainly, during practical application, substrate 30 can also use material such as pyroceram (Pyrex) or invar (Invar) alloy.
In the present embodiment, divisional plane 33 is perpendicular to the upper surface of input planar waveguide 38.Certainly, divisional plane 33 also can with the input planar waveguide 38 the less at an angle angle of upper surface shape, as 8 ° angle.
Because substrate 30 is divided into first 31 and second portion 32, so first 31 can be subjected to displacement with respect to second portion 32.Simultaneously, because being positioned at the part of the array waveguide grid chip 35 in the first 31 is to be bonded in the first 31, therefore when first 31 was subjected to displacement with respect to second portion 32, the first input planar waveguide 42 also can be subjected to displacement with respect to the second input planar waveguide 43.By regulating the relative position of the first input planar waveguide 42 and the second input planar waveguide 43, the centre wavelength that can regulate the non-heat array wave guide grating wavelength division multiplexer.Like this, under different temperatures, the relative position of the control first input planar waveguide 42 and the second input planar waveguide 43 can be realized the adjusting to centre wavelength, thereby realize compensation, improve the job stability of non-heat array wave guide grating wavelength division multiplexer temperature drift.
In order to realize that the substrate 30 of present embodiment is provided with slide assemblies 50 to the adjusting of the relative position of the first input planar waveguide 42 and the second input planar waveguide 43.Referring to Fig. 5, slide assemblies 50 has an expansion link 51, expansion link 51 is made greater than the material of silicon materials by thermal linear expansion coefficient, makes as alumina based material, and the two ends of expansion link 51 are fixed on first 31 and the second portion 32 by fixture 52,53 respectively.In the present embodiment, fixture 52,53 selects for use the material with UV light to make.Because pyroceram has the thermal linear expansion coefficient that is close with silicon materials, and the saturating UV light of energy, therefore select for use pyroceram as the material of making fixture 52,53.
Bigger variation takes place owing to the length of expansion link 51 varies with temperature, thereby can under different temperatures, regulate the relative position of first 31 and second portion 32, thereby change the relative position of the first input planar waveguide 42 and the second input planar waveguide 43, realization reduces the influence of temperature drift to centre wavelength to the compensation of centre wavelength.
In addition, because slide assemblies 50 is fixed on the lower substrate of cost of manufacture 30 upper surfaces, rather than be arranged on the ducting layer of array waveguide grid chip, therefore the area of array waveguide grid chip can be done very for a short time, avoid because of the bigger array waveguide grid chip of usable floor area causes waste, thus the production cost of reduction non-heat array wave guide grating wavelength division multiplexer.
Certainly, in the present embodiment, divisional plane 33 is to be horizontally through input planar waveguide 38, and during practical application, divisional plane 33 also can be horizontally through output planar waveguide 40, perhaps runs transverse through input planar waveguide 38 and output planar waveguide 40.
In addition, in the present embodiment, slide assemblies can also be designed to the shape as Fig. 6 and Fig. 7, and among Fig. 6, expansion link 55 is designed to bridge shape, and fixture 56,57 lays respectively at expansion link 55 two ends near first 31 and second portion 32 upper surface places.Among Fig. 7, expansion link 58 is designed to bridge shape, and two ends directly are fixed on first 31 and the second portion 32, and fixture is not set.
Second embodiment:
Referring to Fig. 8, present embodiment has substrate 60, and substrate 60 is fabricated from a silicon.Be fixed with array waveguide grid chip 65 at substrate 60 upper surfaces, array waveguide grid chip 65 comprises planar substrate 66, substrate 66 is provided with input waveguide 67, be connected input planar waveguide 68 with input waveguide 67 output terminals, output optical waveguide 71, the output planar waveguide 70 that is connected with output optical waveguide 71 input ends, also be provided with the Waveguide array 69 that is connected between input planar waveguide 68 and the output planar waveguide 70 on the substrate 66, Waveguide array 69 is made of many arranged side by side and crooked slab waveguides.
Also be provided with slide assemblies 72 on the substrate 60, the two ends of slide assemblies 72 are separately fixed on first 61 and the second portion 62, and slide assemblies has expansion link, expansion link is made by alumina based material, its thermal linear expansion coefficient is greater than the thermal linear expansion coefficient of substrate 60, so that regulate the relative position of first 61 and second portion 62 when temperature variation.The structure of slide assemblies 72 is identical with the structure of slide assemblies among first embodiment, does not repeat them here.
The 3rd embodiment:
Present embodiment changes to some extent assembly on the basis of second embodiment and obtains.Present embodiment has substrate, and substrate is divided into first and the second portion that is separated from each other by divisional plane, and divisional plane just runs transverse through the end face of input planar waveguide near input optical fibre.The input planar waveguide of array waveguide grid chip, Waveguide array, output planar waveguide and output optical waveguide are positioned at second portion, in the first only are an input optical fibre and be bonded in.That is to say, partly replace with an input optical fibre and realize the non-heat array wave guide grating multiplexer being bonded in the array waveguide grid chip that only comprises input waveguide 67 in the first 61 among second embodiment.
As shown in figure 14, input optical fibre 167 is not to be produced on the substrate, but directly is bonded on the substrate, and the output terminal of input optical fibre 167 is over against input planar waveguide 168.
In addition, present embodiment also is provided with slide assemblies 172, and the two ends of slide assemblies 172 are separately fixed on first and the second portion, and the structure of slide assemblies 172 is identical with the structure of slide assemblies among second embodiment, repeats no more.
In addition, slide assemblies 172 two ends are fixed on the substrate, rather than are fixed on the ducting layer, can reduce the area of ducting layer like this, thereby reduce the production cost of wavelength division multiplexer.
Among first embodiment, second embodiment and the 3rd embodiment, expansion link is made of aluminum, its thermal linear expansion coefficient is 23.6ppm/ ℃, and substrate is fabricated from a silicon, its thermal linear expansion coefficient is 2.5ppm/ ℃, therefore, it is bigger with the length value of temperature drift to use the expansion link of aluminium matter to be used for compensating the centre wavelength of non-heat array wave guide grating wavelength division multiplexer.Non-heat array wave guide grating wavelength division multiplexer after the compensation, temperature is when changing for-30 ℃ to 70 ℃, the side-play amount of its centre wavelength is 0.04 nanometer, the temperature variant curve of centre wavelength is shown in the dotted line a-b-c among Fig. 3, it still can not satisfy the job requirement of the network system of the logical broad of band, and the present invention also improves to reduce the temperature drift of centre wavelength slide assemblies.
The 4th embodiment:
Present embodiment has substrate, substrate is provided with array waveguide grid chip, and array waveguide grid chip has substrate, and substrate is provided with input waveguide, input planar waveguide, Waveguide array, output planar waveguide and output optical waveguide, said structure is identical with first embodiment, repeats no more.
Referring to Fig. 9 and Figure 10, substrate is divided into first 81 and second portion 82 by divisional plane 83, and slide assemblies 84 is fixed on the substrate, and the two ends of slide assemblies 84 are separately fixed on first 81 and the second portion 82.
When temperature was 20 ℃, filling material 89 was filled in the filler opening 88, and filling material 89 just is in contact with one another and does not produce interaction force with filler opening 88 end walls.When temperature was lower than 20 ℃, filling material 89 contract by distance were less, and its two ends are with the end walls of butt filler opening 88, thus the contracted length of inhibition expansion link 85.When temperature was higher than 20 ℃, the free end of filling material 89 did not contact with the end wall of filler opening 88, so did not produce interaction force between filling material 89 and the filler opening 88.
After the compensation by 89 pairs of expansion link 85 contracted length of filling material, in temperature variation during from-30 ℃ to 70 ℃, center wavelength shift amount in the non-heat array wave guide grating wavelength division multiplexer has only 0.01 nanometer, and the relation curve of centre wavelength and temperature is shown in the solid line d-e-f-g-h among Fig. 3.In the present embodiment, the side-play amount that non-heat array wave guide grating wavelength division multiplexer centre wavelength is set is zero when-5 ℃ and 45 ℃.As seen, with respect to first embodiment and second embodiment, present embodiment has better temperature stability.
During practical application, on the expansion link 85 two or more filler openings can be set, each filler opening is filled with the filling material of unlike material, fill copper as filling material as one of them filler opening, another filler opening is filled silver as filling material etc., and the thermal linear expansion coefficient of two kinds of filling materials is inequality, can realize the compensation to centre wavelength so better.
In addition, the filling material of filling in the different filler openings also can be identical material, promptly has identical thermal linear expansion coefficient, and this does not influence enforcement of the present invention.
The first 81 and the second portion 82 of substrate link together by slide assemblies 84, and are being parallel on the direction of upper surface of base plate and can realizing accurate the aligning by the passive coupling technology.Yet, when the non-heat array wave guide grating wavelength division multiplexer is given a shock, on direction, be easy to misalignment between first 81 and the second portion 82 perpendicular to upper surface of base plate, promptly form skew.
The 5th embodiment:
Referring to Figure 11, present embodiment has substrate 90, substrate 90 is provided with array waveguide grid chip 95, array waveguide grid chip 95 comprises flat substrate 96, substrate 96 is provided with ducting layer, ducting layer comprises input waveguide 97, input planar waveguide 98, Waveguide array 99, output planar waveguide 100 and output optical waveguide 101, and wherein Waveguide array 99 is made of many bendings and the slab waveguide that is set up in parallel.
Present embodiment also is provided with shift suppression assembly 110, and the substrate that is used to suppress first 91 is created in perpendicular to moving or rotating on the base plan direction relative to the substrate of second portion 92.Referring to Figure 12, shift suppression assembly 110 comprises a clip 111 and pressing plate 115, and pressing plate 115 has the abutting part that 116, two butt pin 116 of two butt pin have constituted present embodiment.Two butt pin 116 are positioned on the pressing plate 115 a pair of opposed side edges, and extend to the upper surface of base plate direction from the plate body of pressing plate 115, and two butt pin 116 are connected on the upper surface of substrate.Form certain space between two butt pin 116, the input planar waveguide 98 between two butt pin 116, and the input planar waveguide 98 upper surface do not contact with pressing plate 115, like this, pressing plate 115 can not push input planar waveguide 98, avoids the input planar waveguide is impacted.
The 6th embodiment:
Present embodiment has substrate, substrate is provided with array waveguide grid chip, array waveguide grid chip has substrate, substrate is provided with input waveguide, input planar waveguide, Waveguide array, output planar waveguide and output optical waveguide, and substrate is divided into first and second portion by divisional plane, and divisional plane runs transverse through the input planar waveguide.Slide assemblies is arranged on the substrate, and the two ends of slide assemblies are separately fixed on first and the second portion, and said structure is identical with the 5th embodiment, repeats no more.
Present embodiment also is provided with the shift suppression assembly, the shift suppression assembly as shown in figure 13, comprise clip 120 and pressing plate 125,127, pressing plate 125 has two butt pin 126, butt pin 126 is connected on the upper surface of substrate 130, and input planar waveguide 131 is between two butt pin 126, and input planar waveguide 131 contact with pressing plate 125, imports planar waveguides 131 to prevent pressing plate 125 extruding.The butt limit 121 of clip 120 is connected to pressing plate 125 on the surface of substrate 130.
Pressing plate 127 also is provided with 128, two butt pin 128 of two butt pin and is connected on the lower surface of substrate 130, and the butt limit 122 of clip 120 is connected to pressing plate 127 on the surface of substrate 130.
Identical with the 5th embodiment, the pressing plate 125,127 of present embodiment is connected in the first and second portion of substrate 130, be that shift suppression assembly 120 is crossed over first and second portion, be offset on direction with respect to second portion perpendicular to upper surface of base plate thereby suppress first.
During practical application, among the 5th embodiment and the 6th embodiment, two the butt pin of pressing plate that are positioned at upper surface of base plate need be dodged array waveguide grid chip, promptly two butt pin can not be connected on the ducting layer, to avoid pressing plate to the extruding of ducting layer and the work of array waveguide grid chip is impacted.
Certainly, the foregoing description only is a preferred implementation of the present invention, during practical application, more change can also be arranged, for example, use the bigger nonmetallic materials of thermal linear expansion coefficient to make the expansion link of slide assemblies, as rubber etc., perhaps, in a plurality of filler openings that are provided with on the expansion link, in the multiple filling material, the thermal linear expansion coefficient of a part of filling material is greater than the thermal linear expansion coefficient of expansion link, the thermal linear expansion coefficient of other filling materials is less than thermal linear expansion coefficient of expansion link etc., and such change also can realize purpose of the present invention.
It is emphasized that at last to the invention is not restricted to above-mentioned embodiment, also should be included in the protection domain of claim of the present invention as the variations such as change of change, clip and the platen shape of baseplate material.
Claims (10)
1. the non-heat array wave guide grating wavelength division multiplexer comprises
Array waveguide grid chip, have planar substrate, described substrate is provided with input waveguide, the input planar waveguide that is connected with described input waveguide, output optical waveguide, the output planar waveguide that is connected with described output optical waveguide, is connected many slab waveguides between described input planar waveguide and the described output planar waveguide;
It is characterized in that:
Substrate, described array waveguide grid chip is fixed on the upper surface of described substrate, described substrate is divided into first and second portion by at least one divisional plane, and described divisional plane is horizontally through at least one in described input planar waveguide and the described output planar waveguide;
Slide assemblies, the two ends of described slide assemblies are separately fixed on described first and the described second portion, and described slide assemblies is to have to vary with temperature and the expansion link of length change.
2. non-heat array wave guide grating wavelength division multiplexer according to claim 1 is characterized in that:
Described divisional plane is vertical with the upper surface of divided described input planar waveguide and/or described output planar waveguide.
3. non-heat array wave guide grating wavelength division multiplexer according to claim 1 is characterized in that:
The angle that forms between the upper surface of described divisional plane and divided described input planar waveguide and/or described output planar waveguide is an acute angle.
4. according to each described non-heat array wave guide grating wavelength division multiplexer of claim 1 to 3, it is characterized in that:
Offer at least one filler opening on the described expansion link, be filled with filling material in the described filler opening, the thermal linear expansion coefficient of described filling material is less than the thermal linear expansion coefficient of described expansion link.
5. non-heat array wave guide grating wavelength division multiplexer according to claim 4 is characterized in that:
Described filler opening is the through hole that runs through described expansion link upper and lower surface.
6. non-heat array wave guide grating wavelength division multiplexer according to claim 4 is characterized in that:
The quantity of described filler opening is more than two or two, all is filled with described filling material in each described filler opening.
7. according to each described non-heat array wave guide grating wavelength division multiplexer of claim 1 to 3, it is characterized in that:
Also comprise the shift suppression assembly, have a clip and first pressing plate, described first pressing plate has abutting part, described abutting part is connected to the upper surface of described first and the upper surface of described second portion, and the first butt limit of described clip is connected to described first pressing plate on the surface of described substrate.
8. non-heat array wave guide grating wavelength division multiplexer according to claim 7 is characterized in that:
Described abutting part comprises the first butt pin and the second butt pin that is positioned on a pair of relative side of described first pressing plate, and described input planar waveguide or described output planar waveguide are between described first butt pin and the described second butt pin.
9. non-heat array wave guide grating wavelength division multiplexer according to claim 7 is characterized in that:
Described shift suppression assembly also comprises second pressing plate, and described second pressing plate is connected to the lower surface of described substrate, and the second butt limit of described clip is connected to described second pressing plate on the surface of described substrate.
10. the non-heat array wave guide grating wavelength division multiplexer comprises
Array waveguide grid chip, have planar substrate, described substrate is provided with input planar waveguide, output optical waveguide, the output planar waveguide that is connected with described output optical waveguide, is connected many slab waveguides between described input planar waveguide and the described output planar waveguide;
It is characterized in that:
Substrate, described array waveguide grid chip is fixed on the upper surface of described substrate, described substrate is divided into first and second portion by at least one divisional plane, described divisional plane is horizontally through the end face of described input planar waveguide, one input optical fibre is fixed in the described first, and the output terminal of input optical fibre is over against described input planar waveguide;
Slide assemblies, the two ends of described slide assemblies are separately fixed on described first and the described second portion, and described slide assemblies is to have to vary with temperature and the expansion link of length change.
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| CN102354028A (en) * | 2011-11-10 | 2012-02-15 | 武汉光迅科技股份有限公司 | Athermal arrayed waveguide grating wavelength-division multiplexer (WDM) and manufacturing method thereof |
| CN103926654A (en) * | 2014-04-25 | 2014-07-16 | 珠海保税区光联通讯技术有限公司 | Athermal arrayed waveguide grating wavelength division multiplexer |
| CN104090339A (en) * | 2014-07-03 | 2014-10-08 | 深圳市易飞扬通信技术有限公司 | Array waveguide grating wavelength division multiplexer |
| CN104101952A (en) * | 2013-04-01 | 2014-10-15 | 宜兴新崛起光集成芯片科技有限公司 | Array raster waveguide type wavelength division multiplexer |
| CN104503026A (en) * | 2014-12-12 | 2015-04-08 | 武汉光迅科技股份有限公司 | Athermal arrayed-waveguide-grating wavelength division multiplexer and manufacturing method thereof |
| CN110515155A (en) * | 2019-08-29 | 2019-11-29 | 易锐光电科技(安徽)有限公司 | A kind of controllable array waveguide grating of wavelength |
| CN115480347A (en) * | 2021-06-15 | 2022-12-16 | 中国科学院长春光学精密机械与物理研究所 | Method for improving verticality of array waveguide fiber and slab waveguide in wavelength division multiplexer |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102354028A (en) * | 2011-11-10 | 2012-02-15 | 武汉光迅科技股份有限公司 | Athermal arrayed waveguide grating wavelength-division multiplexer (WDM) and manufacturing method thereof |
| CN104101952A (en) * | 2013-04-01 | 2014-10-15 | 宜兴新崛起光集成芯片科技有限公司 | Array raster waveguide type wavelength division multiplexer |
| CN103926654A (en) * | 2014-04-25 | 2014-07-16 | 珠海保税区光联通讯技术有限公司 | Athermal arrayed waveguide grating wavelength division multiplexer |
| CN104090339A (en) * | 2014-07-03 | 2014-10-08 | 深圳市易飞扬通信技术有限公司 | Array waveguide grating wavelength division multiplexer |
| CN104090339B (en) * | 2014-07-03 | 2017-03-29 | 深圳市易飞扬通信技术有限公司 | Arrayed waveguide grating multiplexer |
| CN104503026A (en) * | 2014-12-12 | 2015-04-08 | 武汉光迅科技股份有限公司 | Athermal arrayed-waveguide-grating wavelength division multiplexer and manufacturing method thereof |
| WO2016090660A1 (en) * | 2014-12-12 | 2016-06-16 | 武汉光迅科技股份有限公司 | Athermal arrayed-waveguide-grating wavelength division multiplexer and manufacturing method therefor |
| CN110515155A (en) * | 2019-08-29 | 2019-11-29 | 易锐光电科技(安徽)有限公司 | A kind of controllable array waveguide grating of wavelength |
| CN115480347A (en) * | 2021-06-15 | 2022-12-16 | 中国科学院长春光学精密机械与物理研究所 | Method for improving verticality of array waveguide fiber and slab waveguide in wavelength division multiplexer |
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