WO2019200933A1 - 红光模组密封结构及其实时密封性检测系统 - Google Patents

红光模组密封结构及其实时密封性检测系统 Download PDF

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Publication number
WO2019200933A1
WO2019200933A1 PCT/CN2018/118819 CN2018118819W WO2019200933A1 WO 2019200933 A1 WO2019200933 A1 WO 2019200933A1 CN 2018118819 W CN2018118819 W CN 2018118819W WO 2019200933 A1 WO2019200933 A1 WO 2019200933A1
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Prior art keywords
upper cover
red light
light module
lower cover
cover
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PCT/CN2018/118819
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English (en)
French (fr)
Inventor
谢颂婷
易琪
程文波
李屹
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Shenzhen Appotronics Corp Ltd
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Appotronics Corp Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
    • G01M3/20—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using special tracer materials, e.g. dye, fluorescent material, radioactive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers

Definitions

  • the invention relates to the technical field of projectors, in particular to a red light module sealing structure and a real-time sealing performance detecting system thereof.
  • red laser In order to increase the vividness of the color of the display screen, a certain red laser is generally added to the blue laser to achieve the light laser; in addition, the added red laser and blue light realize wavelength conversion into yellow light, so The emission rate of red light in laser cost is also particularly important; the box-like structure composed of red laser, lens for collecting red laser, TEC, PCB board, etc. is called red light module, red inside red light module
  • the laser generates a high amount of heat, but in order to ensure the life of the red laser, it is necessary to maintain its working environment at about 20 ° C under normal conditions, so the temperature is lowered mainly by terminating the TEC under the laser;
  • the internal requirements of the red light module for air tightness are very strict; the existing red light module is mainly sealed by means of rubberizing and installing fastening screws, but often due to insufficient glue or adhesive adhesion. Not enough, the red light module is poorly sealed.
  • the air When the outside air enters the interior of the red light module, the air will condense due to the large temperature difference between the inside and the outside. These condensations will accumulate on the top of the lens, which will seriously affect the red light. The emission rate and the life of the red laser are reduced; therefore, how to enhance the sealing of the red light module is an urgent problem to be solved.
  • a first object of the present invention is to provide a red light module sealing structure capable of effectively improving the adhesion of glue and enhancing the sealing property of the red light module.
  • a second object of the present invention is to provide a real-time sealing detection system capable of quickly detecting the airtightness of a red light module and quickly positioning a poorly sealed position according to the setting of the inert gas detecting sensor.
  • a red light module sealing structure includes an upper cover and a lower cover, a top of the upper cover is provided with a window, and at least one side wall of the opposite side walls of the upper cover and the lower cover is provided with a matte a surface and a plane, the plane is located on an inner ring of the frosted surface, and an inner ring of the bonding surface of the upper cover and the lower cover is adhered with a first glue, and the upper cover and the lower cover are attached
  • the outer ring of the facing is adhesively coated with a second glue, the adhesion and hardness of the first glue is greater than the adhesion and hardness of the second glue, and the adhesive area of the second glue comprises a frosted area.
  • the outer edge of the upper surface of the lower cover is provided with the frosted surface
  • the inner ring of the frosted surface is provided with the plane
  • the frosted surface is lower than the plane
  • the gap between the frosted surface and the lower bottom surface of the upper cover is larger than the gap between the flat surface and the lower bottom surface of the upper cover.
  • the outer edges of the opposite side walls of the upper cover and the lower cover are respectively provided with the frosted surface, the inner ring of the frosted surface is disposed as the plane, and the frosted surface is lower than The plane.
  • the outer edges of at least one side wall of the opposite side walls of the upper cover and the lower cover are provided with a chamfer for increasing the amount of glue injected, and the inclined surface of the chamfer is provided with the frosted surface .
  • the outer edge of the upper surface of the lower cover is inclined downwardly provided with the chamfering, and the gap between the chamfer and the lower bottom surface of the upper cover is larger than the upper cover and the lower cover The fit gap between the two.
  • the outer edge of the upper surface of the lower cover and the outer edge of the lower surface of the upper cover are provided with the chamfer.
  • the opposite side walls of the upper cover and the lower cover are disposed in a plane, and the plane is disposed adjacent to the chamfer.
  • a real-time sealing detection system comprising the above-mentioned red light module sealing structure, and an inert gas detecting sensor disposed between the upper surface of the red light module sealing structure and the two bonding surfaces of the lower cover;
  • the sealed chamber between the lower cover and the lower cover is filled with an inert gas, and the inert gas detecting sensor is electrically connected to an external electronic control device.
  • the inert gas is set to helium, neon or argon.
  • the present invention includes an upper cover and a lower cover, a top of the upper cover is provided with a window, and at least one side wall of the opposite side walls of the upper cover and the lower cover is provided with a frosted surface And a plane, the plane is located on the inner ring of the frosted surface, and the inner ring of the bonding surface of the upper cover and the lower cover is adhered with a first glue, and the upper cover and the lower cover are attached
  • the outer ring of the face is adhesively coated with a second glue, the adhesion and hardness of the first glue is greater than the adhesion and hardness of the second glue, and the adhesive area of the second glue comprises a frosted area.
  • the present invention also provides a real-time sealing detection system, which is detected by inert gas.
  • the sensor is set to detect the airtightness of the red light module in real time and quickly locate the poorly sealed position.
  • FIG. 1 is a front elevational view showing a state in which a lower cover is provided with a frosted surface in a first embodiment of the present invention.
  • Figure 2 is a front elevational view of the upper cover mated with the lower cover of Figure 1.
  • Figure 3 is a schematic cross-sectional view of the upper and lower covers of Figures 1 and 2 mated.
  • Fig. 4 is a front elevational view showing the upper cover provided with a frosted surface in the first embodiment of the present invention.
  • Fig. 5 is a front elevational view showing the lower cover in cooperation with the upper cover of Fig. 4 with a frosted surface provided thereon.
  • Figure 6 is a schematic cross-sectional view of the upper and lower covers of Figures 4 and 5 mated.
  • Fig. 7 is a perspective view showing a state in which the lower cover is chamfered in the second embodiment of the present invention.
  • Figure 8 is a cross-sectional view showing the upper cover in cooperation with the lower cover of Figure 7 in the second embodiment of the present invention.
  • Figure 9 is a perspective view showing a state in which both the upper cover and the lower cover are chamfered in the second embodiment of the present invention.
  • Figure 10 is a perspective view of a real-time sealability detecting system in accordance with a third embodiment of the present invention.
  • the embodiment provides a red light module sealing structure, which includes an upper cover 1 and a lower cover 2.
  • the top of the upper cover 1 is provided with a window 11, and the upper cover 1 and the lower cover 2 are opposite.
  • At least one side wall of the opposite side walls is provided with a frosted surface 21 and a flat surface 22, and the flat surface 22 is located on the inner ring of the frosted surface 21, and the inner ring of the bonding surface of the upper cover 1 and the lower cover 2 is coated with the first inner ring
  • the glue, the outer ring of the bonding surface of the upper cover 1 and the lower cover 2 is adhered with the second glue, the adhesion and hardness of the first glue are greater than the adhesion and hardness of the second glue, and the adhesion area of the second glue includes the frosting In the region, the hardness of the first glue and the second glue in the embodiment is preferably the hardness after the glue is cured.
  • the outer edge of the upper surface of the lower cover 2 is provided with a frosted surface 21, and the inner ring of the frosted surface 21 is provided with a plane 22, and the frosted surface 21 is lower than the plane 22 .
  • the frosted surface in this embodiment is provided as a concave-convex surface
  • the flat surface 22 is set as a flat surface
  • the gap between the frosted surface 21 and the lower bottom surface of the upper cover 1 is larger than the gap between the flat surface 22 and the lower bottom surface of the upper cover 1.
  • the outer edges of the opposite side walls of the upper cover 1 and the lower cover 2 may be provided with frosted surfaces 21a, 21b, frosted surface.
  • the inner rings of 21a, 21b are each provided as planes 22a, 22b, and the matte faces 21a, 21b are lower than the planes 22a, 22b.
  • the cross-sectional view of the upper cover 1 and the lower cover 2 is shown in FIG. 6.
  • the structural design is such that the glue adhesion between the two frosted surfaces 21a, 21b of the upper cover 1 and the lower cover 2 is further enhanced. Therefore, the sealing performance of the red light module can be better improved.
  • the first embodiment differs from the first embodiment in that the outer edges of at least one side wall of the opposite side walls of the upper cover and the lower cover are provided with an additional amount of glue for increasing the amount of glue injected.
  • the chamfer 4b, the inclined surface of the chamfer 4b is provided with a frosted surface (not shown).
  • the outer edge of the upper surface of the lower cover 4 is inclined downwardly provided with a chamfer 4b, a gap between the chamfer 4b and the lower bottom surface of the upper cover 3, It is larger than the bonding gap between the upper cover 3 and the lower cover 4.
  • the adhesive glue can be infiltrated into the gap between the upper cover 3 and the lower cover 4, so that the upper cover 3 and the lower cover 4 are more closely attached, and the overall sealing property of the red light module is further strengthened.
  • the outer edge of the upper surface of the lower cover 4 and the outer edge of the lower surface of the upper cover 5 may be chamfered, and the upper cover 5 and the lower cover 4 are fitted together.
  • the opposite side walls are all arranged in a plane, and the plane is disposed adjacent to the chamfer.
  • the present invention provides a real-time sealing detection system, comprising the above-mentioned red light module sealing structure, and between the two upper surfaces of the upper cover 1 and the lower cover 2 of the red light module sealing structure.
  • the inert gas detecting sensor 6 ; the sealed chamber between the upper cover 1 and the lower cover 2 is filled with an inert gas, and the inert gas detecting sensor 6 is electrically connected to the external electronic control unit 7.
  • the inert gas is preferably set to helium gas (the property is stable, and it is not easy to expand at the internal temperature of the red light module), and each inert gas detecting sensor 6 is connected in series to the MCU of the external electronic control device 7 (Microcontroller Unit, micro The control unit) performs detection control on the relevant pin.
  • the MCU of the external electronic control device 7 Microcontroller Unit, micro The control unit
  • the inert gas detecting sensor detects the leakage of the inert gas, and immediately informs
  • the MCU Microcontroller Unit

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Examining Or Testing Airtightness (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

红光模组密封结构及其实时密封性检测系统，包括上盖（1，3）和下盖（2，4），上盖（1，3）的顶部设置有视窗（11），上盖（1，3）和下盖（2，4）相贴合的相对两侧壁至少有一侧壁设置有磨砂面（21，21a，21b）和平面（22，22a，22b），平面（22，22a，22b）位于磨砂面（21，21a，21b）的内圈，上盖（1，3）和下盖（2，4）的贴合面的内圈粘涂有第一胶水，上盖（1，3）和下盖（2，4）的贴合面的外圈粘涂有第二胶水，第一胶水的附着力和硬度大于第二胶水的附着力和硬度，第二胶水的粘涂区域包含磨砂区域。以此结构设计，通过磨砂面（21，21a，21b）及平面（22，22a，22b）的设置，有效提升胶水附着力，增强红光模组的气密性。一种实时密封性检测系统，该系统通过惰性气体检测传感器（6）的设置，能够实时快速的检测红光模组气密性，并对密封不良位置进行快速定位。

Description

红光模组密封结构及其实时密封性检测系统 技术领域
本发明涉及投影机技术领域，尤其涉及红光模组密封结构及其实时密封性检测系统。
背景技术
目前，在影院激光投影设备中，为了增加显示画面色彩的鲜艳性，一般会在蓝激光中加入一定的红激光来实现；另外，加入的红激光与蓝光实现波长转换变成黄光，因此在激光成本中红光的出射率也显的尤为重要；由红激光器、收聚红激光的透镜、TEC、PCB板等组成的盒状结构体称为红光模组，红光模组内部的红激光发热量高，但为保证红激光寿命，正常情况下需要维持其工作在20℃左右的环境中，因此主要是通过在激光器下端接TEC实现降温；
此外，红光模组内部对空气密封性要求非常严格；现有的红光模组主要通过打胶及安装紧固螺丝的方式实现密封，但常常会因为打胶不足或粘接胶的附着力不够而导致红光模组密封性不良，当外部空气进入红光模组内部，空气会由于内外部较大的温差而出现凝露的现象，这些凝露聚集在透镜顶部，会严重影响红光出射率，并且降低红激光器的寿命；因此如何增强红光模组的密封性是我们目前急需解决的问题。
发明内容
本发明的第一目的在于提供一种能够有效提升胶水附着力，增强红光模组密封性的红光模组密封结构。
本发明的第二目的在于提供一种能够根据惰性气体检测传感器的设置，实时快速的检测红光模组气密性，以及对密封不良位置进行快速定位的实时密封性检测系统。
为达此目的，本发明采用以下技术方案：
一种红光模组密封结构，包括上盖和下盖，所述上盖的顶部设置有视窗，所述上盖和所述下盖相贴合的相对两侧壁至少有一侧壁设置有磨砂面和平面，所述平面位于所述磨砂面的内圈，所述上盖和所述下盖的贴合面的内圈粘涂有第一胶水，所述上盖和所述下盖的贴合面的外圈粘涂有第二胶水，所述第一胶水的附着力和硬度大于所述第二胶水的附着力和硬度，所述第二胶水的粘涂区域包含磨砂区域。
其中，所述下盖的上表面的外边缘设置有所述磨砂面，所述磨砂面的内圈设置有所述平面，所述磨砂面低于所述平面。
其中，所述磨砂面与所述上盖的下底面之间的间隙，大于所述平面与所述上盖的下底面之间的间隙。
其中，所述上盖和所述下盖相贴合的相对两侧壁的外边缘均设置有所述磨砂面，所述磨砂面的内圈均设置为所述平面，所述磨砂面低于所述平面。
其中，所述上盖和所述下盖相贴合的相对两侧壁至少有一侧壁的外边缘设置有用于增加胶水注入量的倒角，所述倒角的倾斜面设置有所述磨砂面。
其中，所述下盖的上表面的外边缘向下倾斜设置有所述倒角，所述倒角与所述上盖的下底面之间的间隙，大于所述上盖与所述下盖之间的贴合间隙。
其中，所述下盖的上表面的外边缘及所述上盖的下表面的外边缘均设置有所述倒角。
其中，所述上盖及所述下盖相贴合的相对两侧壁均设置为平面，所述平面与所述倒角相邻设置。
一种实时密封性检测系统，包括上述红光模组密封结构，以及设置于所述红光模组密封结构的上盖和下盖两贴合面之间的惰性气体检测传感器；所述上 盖和下盖之间的密封腔内填充有惰性气体，所述惰性气体检测传感器与外部电控装置电连接。
其中，所述惰性气体设置为氦气、氖气或氩气。
本发明的有益效果：本发明包括上盖和下盖，所述上盖的顶部设置有视窗，所述上盖和所述下盖相贴合的相对两侧壁至少有一侧壁设置有磨砂面和平面，所述平面位于所述磨砂面的内圈，所述上盖和所述下盖的贴合面的内圈粘涂有第一胶水，所述上盖和所述下盖的贴合面的外圈粘涂有第二胶水，所述第一胶水的附着力和硬度大于所述第二胶水的附着力和硬度，所述第二胶水的粘涂区域包含磨砂区域。以此结构设计，通过磨砂面及平面的设置，有效提升胶水附着力，增强红光模组的气密性；此外，本发明还提供了一种实时密封性检测系统，该系统通过惰性气体检测传感器的设置，能够实时快速的检测红光模组气密性，并对密封不良位置进行快速定位。
附图说明
图1是本发明第一实施例中下盖设置有磨砂面时的主视图。
图2是与图1中的下盖相配合的上盖的主视图。
图3是图1和图2中上盖和下盖配合后的截面示意图。
图4是本发明第一实施例中上盖设置有磨砂面时的主视图。
图5是与图4中的上盖相配合的下盖设置有磨砂面时的主视图。
图6是图4和图5中上盖和下盖配合后的截面示意图。
图7是本发明第二实施例中下盖设置有倒角时的轴测图。
图8是本发明第二实施例中上盖与图7中的下盖配合时的截面图。
图9是本发明第二实施例中上盖和下盖均设置有倒角时的轴测图。
图10是本发明第三实施例一种实时密封性检测系统的轴测图。
具体实施方式
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
实施例一
结合图1至图3所示，本实施例提供了一种红光模组密封结构，包括上盖1和下盖2，上盖1的顶部设置有视窗11，上盖1和下盖2相贴合的相对两侧壁至少有一侧壁设置有磨砂面21和平面22，平面22位于磨砂面21的内圈，，上盖1和下盖2的贴合面的内圈粘涂有第一胶水，上盖1和下盖2的贴合面的外圈粘涂有第二胶水，第一胶水的附着力和硬度大于第二胶水的附着力和硬度，第二胶水的粘涂区域包含磨砂区域，本实施例中第一胶水和第二胶水的硬度优选胶水固化后的硬度。
具体的，本实施例中，结合图1及图3所示，下盖2的上表面的外边缘设置有磨砂面21，磨砂面21的内圈设置有平面22，磨砂面21低于平面22。本实施例中的磨砂面设置为凹凸面，平面22设置为平整面，且磨砂面21与上盖1的下底面之间的间隙，大于平面22与上盖1的下底面之间的间隙。以此结构设计，可通过磨砂面的设置，增加粘接胶的注入量，提升胶水附着力，磨砂面内圈的平整结构在粘接胶足够的情况下可保证红光模组整体结构的密封性；
结合图4至图6所示，采用同样的原理，本实施例中也可以将上盖1和下盖2相贴合的相对两侧壁的外边缘均设置有磨砂面21a、21b，磨砂面21a、21b的内圈均设置为平面22a、22b,磨砂面21a、21b低于平面22a、22b。上盖1和下盖2配合后的截面图如图6所示，以此结构设计，使得填充于上盖1和下盖2两磨砂面21a、21b之间的胶水附着力更进一步的增强，从而能够更好的提升该红光模组的密封性。
实施例二
结合图7至图9所示，本实施例中与实施例一不同之处在于，上盖和下盖相贴合的相对两侧壁至少有一侧壁的外边缘设置有用于增加胶水注入量的倒角4b，倒角4b的倾斜面设置有磨砂面(图中未标出)。
具体的，结合图7和图8所示，本实施例中，下盖4的上表面的外边缘向下倾斜设置有倒角4b，倒角4b与上盖3的下底面之间的间隙，大于上盖3与下盖4之间的贴合间隙。以此结构设计，能够使得粘接胶渗透到上盖3和下盖4贴合间隙处，使上盖3和下盖4贴合更加紧密，红光模组的整体密封性也进一步加强。
本实施例中，结合图9所示，也可以在下盖4的上表面的外边缘及上盖5的下表面的外边缘均设置有倒角,且上盖5及下盖4相贴合的相对两侧壁均设置为平面，平面与倒角相邻设置。以此起到上述同样的技术效果，在此不做具体赘述。
实施例三
结合图10所示，本发明提供了一种实时密封性检测系统，包括上述红光模组密封结构，以及设置于红光模组密封结构的上盖1和下盖2两贴合面之间的惰性气体检测传感器6；上盖1和下盖2之间的密封腔内填充有惰性气体，惰性气体检测传感器6与外部电控装置7电连接。本实施例中，惰性气体优选设置为氦气(性质稳定，在红光模组内部温度下不易膨胀)，每个惰性气体检测传感器6串联接到外部电控装置7的MCU(Microcontroller Unit，微控制单元)相关引脚上进行检测控制，当红光模组内部出现密封性不良时，模组内部的的惰性气体就会向外界扩散，此时惰性气体检测传感器检测到有惰性气体泄漏，立刻通知MCU(Microcontroller Unit，微控制单元)进行相关操作，可以报警提醒使用者红光模组密封性不良，及时进行维护；并且可以通过不同惰性气体检 测传感器的变化信号可以对密封不良的位置进行快速定位。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理，而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式，这些方式都将落入本发明的保护范围之内。

Claims (10)

  1. 一种红光模组密封结构，包括上盖和下盖，所述上盖的顶部设置有视窗，其特征在于：所述上盖和所述下盖相贴合的相对两侧壁至少有一侧壁设置有磨砂面和平面，所述平面位于所述磨砂面的内圈，所述上盖和所述下盖的贴合面的内圈粘涂有第一胶水，所述上盖和所述下盖的贴合面的外圈粘涂有第二胶水，所述第一胶水的附着力和硬度大于所述第二胶水的附着力和硬度，所述第二胶水的粘涂区域包含磨砂区域。
  2. 根据权利要求1所述的一种红光模组密封结构，其特征在于：所述下盖的上表面的外边缘设置有所述磨砂面，所述磨砂面的内圈设置有所述平面，所述磨砂面低于所述平面。
  3. 根据权利要求2所述的一种红光模组密封结构，其特征在于：所述磨砂面与所述上盖的下底面之间的间隙，大于所述平面与所述上盖的下底面之间的间隙。
  4. 根据权利要求1所述的一种红光模组密封结构，其特征在于：所述上盖和所述下盖相贴合的相对两侧壁的外边缘均设置有所述磨砂面，所述磨砂面的内圈均设置为所述平面，所述磨砂面低于所述平面。
  5. 根据权利要求1所述的一种红光模组密封结构，其特征在于：所述上盖和所述下盖相贴合的相对两侧壁至少有一侧壁的外边缘设置有用于增加胶水注入量的倒角，所述倒角的倾斜面设置有所述磨砂面。
  6. 根据权利要求5所述的一种红光模组密封结构，其特征在于：所述下盖的上表面的外边缘向下倾斜设置有所述倒角，所述倒角与所述上盖的下底面之间的间隙，大于所述上盖与所述下盖之间的贴合间隙。
  7. 根据权利要求5所述的一种红光模组密封结构，其特征在于：所述下盖的上表面的外边缘及所述上盖的下表面的外边缘均设置有所述倒角。
  8. 根据权利要求7所述的一种红光模组密封结构，其特征在于：所述上盖及所述下盖相贴合的相对两侧壁均设置为平面，所述平面与所述倒角相邻设置。
  9. 一种实时密封性检测系统，其特征在于：包括权利要求1至8任意一项所述的红光模组密封结构，以及设置于所述红光模组密封结构的上盖和下盖两贴合面之间的惰性气体检测传感器；所述上盖和下盖之间的密封腔内填充有惰性气体，所述惰性气体检测传感器与外部电控装置电连接。
  10. 根据权利要求9所述的一种实时密封性检测系统，其特征在于：所述惰性气体设置为氦气、氖气或氩气。
PCT/CN2018/118819 2018-04-17 2018-12-03 红光模组密封结构及其实时密封性检测系统 Ceased WO2019200933A1 (zh)

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