WO2019200680A1 - 液晶显示面板的芯片温度控制电路及液晶显示面板 - Google Patents

液晶显示面板的芯片温度控制电路及液晶显示面板 Download PDF

Info

Publication number
WO2019200680A1
WO2019200680A1 PCT/CN2018/090855 CN2018090855W WO2019200680A1 WO 2019200680 A1 WO2019200680 A1 WO 2019200680A1 CN 2018090855 W CN2018090855 W CN 2018090855W WO 2019200680 A1 WO2019200680 A1 WO 2019200680A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
liquid crystal
crystal display
display panel
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/090855
Other languages
English (en)
French (fr)
Inventor
李文芳
张先明
曹丹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US16/080,208 priority Critical patent/US20210080775A1/en
Publication of WO2019200680A1 publication Critical patent/WO2019200680A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/043—Compensation electrodes or other additional electrodes in matrix displays related to distortions or compensation signals, e.g. for modifying TFT threshold voltage in column driver
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/08—Details of timing specific for flat panels, other than clock recovery
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2320/00—Control of display operating conditions
    • G09G2320/04—Maintaining the quality of display appearance
    • G09G2320/043—Preventing or counteracting the effects of ageing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02—Details of power systems and of start or stop of display operation
    • G09G2330/021—Power management, e.g. power saving
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/04—Display protection
    • G09G2330/045—Protection against panel overheating

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a chip temperature control circuit and a liquid crystal display panel of a liquid crystal display panel.
  • TFT LCD thin film transistor liquid crystal display panel
  • the chip is, for example, a PMIC (Power Management IC), a source driver chip, etc., so that the chip The temperature is also getting higher and higher, and the higher temperature will affect the life of the chip.
  • PMIC Power Management IC
  • the technical problem to be solved by the embodiments of the present invention is to provide a chip temperature control circuit and a liquid crystal display panel of a liquid crystal display panel, which can improve the life of the liquid crystal display panel.
  • the first aspect of the present invention provides a chip temperature control circuit for a liquid crystal display panel, including:
  • thermo element that is placed on the chip and that changes its electrical characteristics in response to changes in the temperature of the chip
  • An analog to digital converter electrically coupled to both ends of the thermal element to obtain an analog voltage signal of the thermal element, the analog to digital converter converting the obtained analog voltage signal into a corresponding digital voltage signal;
  • timing controller electrically connected to an output of the analog-to-digital converter and a chip, respectively, the timing controller obtaining a corresponding chip temperature according to the obtained digital voltage signal, and the timing controller when the chip temperature exceeds a predetermined temperature
  • the chip is adjusted to reduce power consumption.
  • the thermal element is a PN junction, and the PN junction changes a voltage between both ends thereof as the temperature of the chip changes.
  • the thermistor is a thermistor, and the thermistor changes its resistance value as the temperature of the chip changes.
  • the thermal element is further electrically coupled to a power source to form a closed loop.
  • the power source is a current source; or the power source is a voltage source, and the loop further includes a second resistor connected in series with the thermistor.
  • the timing controller stores a correspondence table of a digital voltage signal range and a chip temperature, and the timing controller determines a corresponding chip according to the received digital voltage signal and the correspondence table. temperature.
  • the chip includes a substrate and an electronic component, the electronic component is located on the substrate, the thermal element is located on the substrate, and the electronic component surrounds the The thermal element setting.
  • the chip is a power management chip, a source driving chip or a gate driving chip; or the chip includes a power management chip and a driving chip, the power management chip and the Thermal sensors are respectively disposed on the driving chips, and the thermal elements are electrically connected to the analog to digital converters, respectively.
  • the timing controller reduces the operating frequency of the chip when the chip temperature exceeds a predetermined temperature.
  • a second aspect of the present invention provides a liquid crystal display panel including the chip temperature control circuit of the liquid crystal display panel described above.
  • the analog converter is electrically coupled to both ends of the thermal element to obtain an analog voltage signal of the thermal element, the mode The digital converter converts the obtained analog voltage signal into a corresponding digital voltage signal, and the timing controller is electrically connected to an output of the analog-to-digital converter and the chip, respectively, and the timing controller obtains according to the obtained digital voltage signal
  • the timing controller adjusts the chip to reduce power consumption when the chip temperature exceeds a predetermined temperature, so that the chip temperature can be controlled, the chip temperature is not too high, and the life of the chip is not Lowering, the life of other components will not be reduced, which will help to improve the service life of the liquid crystal display panel.
  • FIG. 1 is a schematic diagram of a chip temperature control circuit of a liquid crystal display panel according to a first embodiment of the present invention
  • FIG. 2 is a schematic diagram of a chip temperature control circuit of a liquid crystal display panel according to a second embodiment of the present invention
  • 110-chip 110-chip; 111-PN junction; 120-decoder; 121-analog-to-digital converter; 130-timing controller; 210-power management chip; 310-drive chip.
  • a first embodiment of the present invention provides a chip temperature control circuit for a liquid crystal display panel.
  • the chip temperature control circuit of the liquid crystal display panel includes a chip 110, a thermal element, an analog-to-digital converter 121, and a timing controller. 130.
  • the chip 110 rises in temperature as power consumption increases.
  • the chip 110 is located outside the array substrate of the liquid crystal display panel, and the chip 110 is electrically connected to the circuit on the array substrate through a flexible circuit board or other lines.
  • the chip 110 includes a substrate and electronic components on which the electronic components are located.
  • the chip 110 may be a power management chip (PMIC), a data driver chip, or a gate driver.
  • the heat sensitive element is located on the chip 110, and the temperature sensitive element can feel the temperature of the chip 110 at any time, and the heat sensitive element changes its electrical characteristics according to the change of the temperature of the chip 110, for example, changing its The resistance characteristic or the voltage characteristic, when the resistance characteristic is changed, the resistance value of the temperature sensitive element changes with a change in temperature, and when the voltage characteristic is changed, the voltage across the temperature sensitive element changes with temperature.
  • the thermal element is a PN junction 111, and the PN junction 111 is located on the chip 110, specifically on the substrate of the chip 110, and the PN junction 111 changes as the temperature of the chip 110 changes. The voltage across it.
  • the thermal element may also be a thermistor, the thermistor is located on the chip, specifically on the substrate of the chip, and the thermistor follows the chip temperature. Change the value of its own resistance.
  • the analog-to-digital converter 121 is electrically connected to both ends of the thermal element, and an analog voltage signal of the thermal element is obtained by detecting a voltage across the thermal element, the analog-to-digital converter 121 converts the obtained analog voltage signal into a corresponding digital voltage signal.
  • the liquid crystal display panel includes a decoder 120, and the decoder 120 includes the analog-to-digital converter 121, so that the existing decoder 120 of the liquid crystal display panel can be utilized, and no additional mode is needed. The number converter 121 can thereby reduce the cost.
  • the timing controller 130 is electrically connected to the output end of the analog-to-digital converter 121 and the chip 110, respectively, and the timing controller 130 obtains a corresponding chip temperature according to the obtained digital voltage signal, The timing controller 130 determines whether the chip temperature exceeds a predetermined temperature, which is preset in advance. When the timing controller 130 determines that the chip temperature exceeds a predetermined temperature, the timing controller 130 adjusts the chip 110 to reduce power consumption. Thereby reducing the temperature of the chip 110. In this embodiment, the timing controller 130 mainly reduces the power consumption by adjusting the operating frequency of the chip 110, but the present invention is not limited thereto.
  • the timing controller may also By adjusting some of the electronic components on the chip, some electronic components do not work to reduce the power consumption of the chip.
  • the timing controller may also reduce power consumption of the chip by adjusting other parameters of the chip, such as adjusting an inversion manner.
  • the timing controller 130 stores a correspondence table of a digital voltage signal range and a chip temperature, and the timing controller 130 is configured according to the received digital voltage signal. By looking up the table, the current chip temperature can be obtained, and then it can be judged whether the chip temperature exceeds the predetermined temperature.
  • the following table gives an example of a correspondence table between the digital voltage signal range and the chip temperature:
  • Digital voltage signal range Chip temperature (0.01V, 0.05V) 40° (0.05V, 0.1V) 41° (0.1V, 0.2V) 42°
  • the timing controller 130 looks up the table and finds that the digital voltage signal is 0.05V falling within the range (0.01V, 0.05V), thereby obtaining the current
  • the chip temperature is 40 degrees.
  • the predetermined temperature may be a preset value or a plurality of preset values.
  • the timing controller 130 may perform different processing according to the chip temperature exceeding a different predetermined temperature, for example, the corresponding frequency is different after the adjustment.
  • the analog converter is electrically connected to both ends of the thermal element to obtain a thermal element.
  • the analog-to-digital converter 121 converts the obtained analog voltage signal into a corresponding digital voltage signal
  • the timing controller 130 is electrically connected to the output end of the analog-to-digital converter 121 and the chip 110, respectively.
  • the timing controller 130 obtains a corresponding chip temperature according to the obtained digital voltage signal, and the timing controller 130 adjusts the chip 110 to reduce power consumption when the chip temperature exceeds a predetermined temperature, so that the chip temperature can be controlled.
  • the temperature of the chip is not too high, so the service life of the chip 110 will not be reduced, and the service life of other components will not be lowered, thereby contributing to the improvement of the service life of the liquid crystal display panel.
  • the electronic component on the chip 110 is disposed around the thermal element, so that when the electronic component on the chip 110 is heated, The thermal element is relatively close to these electronic components, so that the temperature change of the chip 110 can be accurately detected.
  • the thermistor when the thermistor is a thermistor, the thermistor needs to be electrically connected to a power source to form a closed loop, so that the analog-to-digital converter is electrically connected to the thermistor. Both ends of the analog voltage signal to obtain the thermistor.
  • the power source is a current source, and two ends of the current source are respectively electrically connected to both ends of the thermistor, and when the resistance value of the thermistor changes, The analog voltage signal received by the analog-to-digital converter will also change accordingly.
  • the power source is a voltage source
  • a second resistor is further connected in series between the voltage source and the thermistor, and the voltage source, the thermistor, and the second resistor are connected in series.
  • an embodiment of the present invention further provides a liquid crystal display panel including the chip temperature control circuit of the liquid crystal display panel described above.
  • FIG. 2 is a chip temperature control circuit of a liquid crystal display panel according to a second embodiment of the present invention.
  • the circuit of FIG. 2 is similar to the circuit of FIG. 1. Therefore, the same component symbols represent the same components, and the first embodiment and the first implementation.
  • the main difference between the examples is that the power management chip and the driver chip are both provided with thermal elements.
  • the chip temperature control circuit of the liquid crystal display panel includes a power management chip (PMIC) 210 , a driving chip 310 , a thermal element, an analog-to-digital converter 121 , and a timing controller 130 .
  • PMIC power management chip
  • the power management chip 210 and the driving chip 310 both increase in temperature with an increase in power consumption
  • the driving chip 310 is, for example, a data driving chip or a gate driving chip.
  • the power management chip 210 and the driving chip 310 are each provided with a thermal element, where the thermal element is a PN junction 111, both ends of the thermal element on the power management chip 210 and the Both ends of the thermal element on the driving chip 310 are electrically connected to the analog-to-digital converter 121, and the analog-to-digital converter 121 obtains two analog voltage signals respectively corresponding to the voltages across the thermal element of the power management chip 210. And the voltage across the thermal element on the drive chip 310.
  • the analog-to-digital converter 121 converts the two analog voltage signals into corresponding two digital voltage signals and respectively transmits them to the timing controller 130, and the timing controller 130 obtains corresponding signals according to obtaining two digital voltage signals.
  • the temperature of the power management chip 210 and the temperature of the driving chip 310 the timing controller 130 determines whether the two temperatures respectively exceed a predetermined temperature, where the predetermined temperature corresponding to the power management chip 210 corresponds to the driving chip 310.
  • the predetermined temperatures may be the same or different.
  • the timing controller 130 adjusts the corresponding power management chip 210 or the driving chip 310 to reduce power consumption, thereby reducing the temperature of the power management chip 210 or the driving chip 310.
  • the thermal element on both the power management chip 210 and the driving chip 310, it is possible to monitor in real time whether the temperature of the power management chip 210 and the driving chip 310 is too high, and prevent the power management chip 210 and the driving chip 310 from being damaged due to excessive temperature. At the same time, the power consumption of the liquid crystal display panel can be reduced.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Liquid Crystal Display Device Control (AREA)
  • Liquid Crystal (AREA)

Abstract

一种液晶显示面板及液晶显示面板的芯片（110）温度控制电路，包括：芯片（110），其随着功耗的增加而温度上升；热敏元件，其位于芯片（110）上且根据芯片（110）温度的变化而改变其电特性；模数转换器（121），其与热敏元件的两端电连接以获得热敏元件的模拟电压信号，模数转换器（121）将获得的模拟电压信号转换为对应的数字电压信号；时序控制器（130），其分别与模数转换器（121）的输出端和芯片（110）电连接，时序控制器（130）根据获得的数字电压信号获得对应的芯片（110）温度，当芯片（110）温度超过预定温度时时序控制器（130）调整芯片（110）以降低功耗；具有改善液晶显示面板的使用寿命的优点。

Description

液晶显示面板的芯片温度控制电路及液晶显示面板
本申请要求2018年4月17日提交中国专利局的，申请号为201810343761.5，发明名称为“液晶显示面板的芯片温度控制电路及液晶显示面板”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及显示技术领域，特别是涉及一种液晶显示面板的芯片温度控制电路及液晶显示面板。
背景技术
随着薄膜晶体管液晶显示面板(TFT LCD)的技术越来越成熟，电视、电脑等产品要求液晶显示面板的尺寸也在逐步变大，液晶显示面板的分辨率也越来越高，相对应的液晶显示面板的功耗也越来越大，导致液晶显示面板内的芯片功耗也越来越高，该芯片例如为PMIC(Power Management IC，电源管理芯片)、源极驱动芯片等，使得芯片的温度也越来越高，较高的温度会影响芯片的使用寿命。
发明内容
本发明实施例所要解决的技术问题在于，提供一种液晶显示面板的芯片温度控制电路及液晶显示面板，可改善液晶显示面板的寿命。
为了解决上述技术问题，本发明第一方面实施例提供了一种液晶显示面板的芯片温度控制电路，包括：
芯片，其随着功耗的增加而温度上升；
热敏元件，其位于芯片上且根据芯片温度的变化而改变其电特性；
模数转换器，其与所述热敏元件的两端电连接以获得热敏元件的模拟电压信号，所述模数转换器将获得的模拟电压信号转换为对应的数字电压信号；
时序控制器，其分别与所述模数转换器的输出端和芯片电连接，所述时序控制器根据获得的数字电压信号获得对应的芯片温度，当芯片温度超过预定温度时所述时序控制器调整所述芯片以降低功耗。
在本发明第一方面一实施例中，所述热敏元件为PN结，所述PN结随着芯片温度的变化而改变其两端之间的电压。
在本发明第一方面一实施例中，所述热敏元件为热敏电阻，所述热敏电阻随着芯片温度的变化而改变其电阻值。
在本发明第一方面一实施例中，所述热敏元件还与一电源电连接以形成闭合的回路。
在本发明第一方面一实施例中，所述电源为电流源；或者所述电源为电压源，所述回路上还包括与热敏电阻串联的第二电阻。
在本发明第一方面一实施例中，所述时序控制器存储有数字电压信号范围与芯片温度的对应表，所述时序控制器根据收到的数字电压信号、所述对应表确定对应的芯片温度。
在本发明第一方面一实施例中，所述芯片包括衬底和电子元件，所述电子元件位于所述衬底上，所述热敏元件位于所述衬底上，所述电子元件环绕所述热敏元件设置。
在本发明第一方面一实施例中，所述芯片为电源管理芯片、源极驱动芯片或者栅极驱动芯片；或者，所述芯片包括电源管理芯片和驱动芯片，所述电源管理芯片和所述驱动芯片上分别设有热敏元件，所述热敏元件分别与所述模数转换器电连接。
在本发明第一方面一实施例中，当芯片温度超过预定温度时所述时序控制器降低所述芯片的工作频率。
本发明第二方面实施例提供了一种液晶显示面板，包括上述的液晶显示面板的芯片温度控制电路。
实施本发明实施例，具有如下有益效果：
由于所述热敏元件位于芯片上且根据芯片温度的变化而改变其电特性，所述模拟转换器与所述热敏元件的两端电连接以获得热敏元件的模拟电压信号，所述模数转换器将获得的模拟电压信号转换为对应的数字电压信号，所述时序控制器分别与所述模数转换器的输出端和芯片电连接，所述时序控制器根据获得的数字电压信号获得对应的芯片温度，当芯片温度超过预定温度时所述时序控制器调整所述芯片以降低功耗，从而，所述芯片温度可以得到控制，芯片温度不会太高，因此芯片的使用寿命不会降低，同样其他元器件的使用寿命也不会降低，从而有利于改善液晶显示面板的使用寿命。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明第一实施例液晶显示面板的芯片温度控制电路的示意图；
图2是本发明第二实施例液晶显示面板的芯片温度控制电路的示意图；
图示标号：
110-芯片；111-PN结；120-解码器；121-模数转换器；130-时序控制器；210-电源管理芯片；310-驱动芯片。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本申请说明书、权利要求书和附图中出现的术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。此外，术语“第一”、“第二”和“第三”等是用于区别不同的对象，而并非用于描述特定的顺序。
第一实施例
本发明第一实施例提供一种液晶显示面板的芯片温度控制电路，请参见图1，所述液晶显示面板的芯片温度控制电路包括芯片110、热敏元件、模数转换器121和时序控制器130。
在本实施例中，所述芯片110随着功耗的增加而温度上升。在本实施例中，所述芯片110位于所述液晶显示面板的阵列基板的外部，所述芯片110通过柔性电路板或者其他线路与所述阵列基板上的电路进行电连接。在本实施例中，所述芯片110包括衬底和电子元件，所述电子元件位于所述衬底上。在本实施例中，所述芯片110可以为电源管理芯片(PMIC)、数据驱动芯片(source driver)或栅极驱动芯片(gate driver)。
在本实施例中，所述热敏元件位于芯片110上，所述热敏元件可随时感受芯片110的温度，所述热敏元件根据芯片110的温度的变化而改变其电特性，例如改变其电阻特性或者电压特性，当改变电阻特性时，所述热敏元件的电阻值随着温度的变化而改变，当改变电压特性时，所述热敏元件两端的电压随着温度的变化而改变。在本实施例中，所述热敏元件为PN结111，所述PN结111位于芯片110上，具体为位于芯片110的衬底上，所述PN结111随着芯片110温度的变化而改变其两端的电压。另外，在本发明的其他实施例中，所述热敏元件还可以是热敏电阻，所述热敏电阻位于芯片上，具体为位于芯片的衬底上，所述热敏电阻随着芯片温度的变化而改变其本身的电阻值。
在本实施例中，所述模数转换器121与所述热敏元件的两端电连接，通过侦测热敏元件两端的电压，获得热敏元件的模拟电压信号，所述模数转换器121根据获得的模拟电压信号转换为对应的数字电压信号。在本实施例中，所述液晶显示面板包括解码器120，所述解码器120包括所述模数转换器121，从而，可以利用液晶显示面板现有的解码器120，不需要再额外添加模数转换器121，从而可以降低成本。
在本实施例中，所述时序控制器130分别与所述模数转换器121的输出端和芯片110电连接，所述时序控制器130根据获得的数字电压信号获得对应的芯片温度，所述时序控制器130判断芯片温度是否超过预定温度，该预定温度是提前已经预设好，当时序控制器130判断芯片温度超过预定温度时，所述时序控制器130调整所述芯片110以降低功耗，进而降低所述芯片110的温度。在本实施例中，所述时序控制器130主要通过调整所述芯片110的工作频率以降低功耗，但本发明不限于此，在本发明的其他实施例中，所述时序控制器还可以通过调整芯片上的部分电子元件工作、部分电子元件不工作以降低芯片的功耗。另外，在本发明的其他实施例中，所述时序控制器还可以通过调整芯片的其他参数来降低芯片的功耗，例如调整反转方式等。
为了通过数字电压信号获得对应的芯片温度，在本实施例中，所述时序控制器130中存储有数字电压信号范围与芯片温度的对应表，所述时序控制器130根据接收到的数字电压信号，通过查找该表，可以获得当前的芯片温度，进而可以判断芯片温度是否超过预定温度，下表给出了一种数字电压信号范围与芯片温度的对应表的一个示例：
数字电压信号范围 芯片温度
(0.01V，0.05V] 40°
(0.05V，0.1V] 41°
(0.1V,0.2V] 42°
例如，当时序控制器130接收到的数字电压信号为0.05V时，时序控制器130查表，得知数字电压信号0.05V落入区间(0.01V，0.05V]的范围内，进而可以获得当前的芯片温度为40度。
在本实施例中，该预定温度可以是一个预设的值，也可以是多个预设的值。当该预定温度为多个预设的值时，所述时序控制器130可以根据芯片温度超过不同的预定温度，所述时序控制器130进行不同的处理，例如调整后对应的频率不同。
在本实施例中，由于所述热敏元件位于芯片110上且根据芯片温度的变化而改变其电特性，所述模拟转换器与所述热敏元件的两端电连接以获得热敏元件的模拟电压信号，所述模 数转换器121将获得的模拟电压信号转换为对应的数字电压信号，所述时序控制器130分别与所述模数转换器121的输出端和芯片110电连接，所述时序控制器130根据获得的数字电压信号获得对应的芯片温度，当芯片温度超过预定温度时所述时序控制器130调整所述芯片110以降低功耗，从而，所述芯片温度可以得到控制，芯片温度不会太高，因此芯片110的使用寿命不会降低，同样其他元器件的使用寿命也不会降低，从而有利于改善液晶显示面板的使用寿命。
为了使热敏元件电特性的变化准确的反应芯片温度的变化，在本实施例中，所述芯片110上的电子元件环绕所述热敏元件设置，从而芯片110上的电子元件发热时，由于热敏元件距离这些电子元件比较近，从而可以准确的侦测到芯片110的温度变化。
另外，在本发明的其他实施例中，当所述热敏元件为热敏电阻时，所述热敏电阻需要与电源电连接以形成闭合的回路，从而，模数转换器电连接热敏电阻的两端以获得热敏电阻的模拟电压信号。在本发明的其他实施例中，所述电源为电流源，所述电流源的两端分别与所述热敏电阻的两端电连接，当所述热敏电阻的电阻值改变时，所述模数转换器接收到的模拟电压信号也会相应改变。在本发明的其他实施例中，所述电源为电压源，所述电压源与所述热敏电阻之间还串联一个第二电阻，所述电压源、热敏电阻、第二电阻串联，当所述热敏电阻的电阻值随芯片温度改变时，所述热敏电阻两端的电压也会随之改变，从而所述模数转换器接收到的模拟电压信号也会相应改变。
另外，本发明实施例还提供一种液晶显示面板，所述液晶显示面板包括上述的液晶显示面板的芯片温度控制电路。
第二实施例
图2是本发明第二实施例提供的一种液晶显示面板的芯片温度控制电路，图2的电路与图1的电路相似，因此相同的元件符号代表相同的元件，本实施例与第一实施例的主要差别点是在电源管理芯片和驱动芯片均设有热敏元件。
请参见图2，在本实施例中，所述液晶显示面板的芯片温度控制电路包括电源管理芯片(PMIC)210、驱动芯片310、热敏元件、模数转换器121和时序控制器130。
在本实施例中，所述电源管理芯片210、驱动芯片310均随着功耗的增加而温度上升，所述驱动芯片310例如为数据驱动芯片或者栅极驱动芯片。所述电源管理芯片210和所述驱动芯片310上均设有热敏元件，在此处所述热敏元件为PN结111，所述电源管理芯片210上的热敏元件的两端和所述驱动芯片310上的热敏元件的两端均电连接到模数转换器121，所述模数转换器121获得两个模拟电压信号，分别对应电源管理芯片210上的热敏元件的两端 的电压和驱动芯片310上的热敏元件的两端的电压。其后模数转换器121将这两个模拟电压信号转换为对应的两个数字电压信号并分别传输给所述时序控制器130，所述时序控制器130根据获得两个数字电压信号获得对应的电源管理芯片210的温度和驱动芯片310的温度，所述时序控制器130判断该两个温度分别是否超过预定温度，在此处，电源管理芯片210对应的预定温度和所述驱动芯片310对应的预定温度可以相同，也可以不同。当时序控制器130判断只要有一个温度超过预定温度时，所述时序控制器130调整对应的电源管理芯片210或者驱动芯片310以降低功耗，进而降低电源管理芯片210或者驱动芯片310的温度。通过在电源管理芯片210和驱动芯片310上均设置热敏元件，可以实时监控电源管理芯片210和驱动芯片310的温度是否过高，防止电源管理芯片210和驱动芯片310由于温度过高而损坏，同时可以降低液晶显示面板的功耗。
需要说明的是，本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其它实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。对于装置实施例而言，由于其与方法实施例基本相似，所以描述的比较简单，相关之处参见方法实施例的部分说明即可。
以上所揭露的仅为本发明较佳实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明权利要求所作的等同变化，仍属本发明所涵盖的范围。

Claims (20)

  1. 一种液晶显示面板的芯片温度控制电路，其中，包括：
    芯片，其随着功耗的增加而温度上升；
    热敏元件，其位于所述芯片上且根据所述芯片温度的变化而改变其电特性；
    模数转换器，其与所述热敏元件的两端电连接以获得热敏元件的模拟电压信号，所述模数转换器将获得的所述模拟电压信号转换为对应的数字电压信号；
    时序控制器，其分别与所述模数转换器的输出端和所述芯片电连接，所述时序控制器根据获得的所述数字电压信号获得对应的芯片温度，当芯片温度超过预定温度时所述时序控制器调整所述芯片以降低功耗。
  2. 如权利要求1所述的液晶显示面板的芯片温度控制电路，其中，所述热敏元件为PN结，所述PN结随着芯片温度的变化而改变其两端之间的电压。
  3. 如权利要求1所述的液晶显示面板的芯片温度控制电路，其中，所述热敏元件为热敏电阻，所述热敏电阻随着芯片温度的变化而改变其电阻值。
  4. 如权利要求3所述的液晶显示面板的芯片温度控制电路，其中，所述热敏元件还与一电源电连接以形成闭合的回路。
  5. 如权利要求4所述的液晶显示面板的芯片温度控制电路，其中，所述电源为电流源；或者所述电源为电压源，所述回路上还包括与所述热敏电阻串联的第二电阻。
  6. 如权利要求1所述的液晶显示面板的芯片温度控制电路，其中，所述时序控制器存储有数字电压信号范围与芯片温度的对应表，所述时序控制器根据收到的数字电压信号、所述对应表确定对应的芯片温度。
  7. 如权利要求1所述的液晶显示面板的芯片温度控制电路，其中，所述芯片包括衬底和电子元件，所述电子元件位于所述衬底上，所述热敏元件位于所述衬底上，所述电子元件环绕所述热敏元件设置。
  8. 如权利要求1所述的液晶显示面板的芯片温度控制电路，其中，所述芯片为电源管理芯片、源极驱动芯片或栅极驱动芯片；或者，
    所述芯片包括电源管理芯片和驱动芯片，所述电源管理芯片和所述驱动芯片上分别设有热敏元件，所述热敏元件分别与所述模数转换器电连接。
  9. 如权利要求1所述的液晶显示面板的芯片温度控制电路，其中，当芯片温度超过预定温度时所述时序控制器降低所述芯片的工作频率。
  10. 如权利要求1所述的液晶显示面板的芯片温度控制电路，其中，所述芯片位于所述液晶显示面板的阵列基板的外部，所述芯片与所述阵列基板上的电路电连接。
  11. 一种液晶显示面板，其中，包括如权利要求1所述的液晶显示面板的芯片温度控制电路。
  12. 如权利要求11所述的液晶显示面板，其中，所述热敏元件为PN结，所述PN结随着芯片温度的变化而改变其两端之间的电压。
  13. 如权利要求11所述的液晶显示面板，其中，所述热敏元件为热敏电阻，所述热敏电阻随着芯片温度的变化而改变其电阻值。
  14. 如权利要求13所述的液晶显示面板，其中，所述热敏元件还与一电源电连接以形成闭合的回路。
  15. 如权利要求14所述的液晶显示面板，其中，所述电源为电流源；或者所述电源为电压源，所述回路上还包括与所述热敏电阻串联的第二电阻。
  16. 如权利要求11所述的液晶显示面板，其中，所述时序控制器存储有数字电压信号范围与芯片温度的对应表，所述时序控制器根据收到的数字电压信号、所述对应表确定对应的芯片温度。
  17. 如权利要求11所述的液晶显示面板，其中，所述芯片包括衬底和电子元件，所述电 子元件位于所述衬底上，所述热敏元件位于所述衬底上，所述电子元件环绕所述热敏元件设置。
  18. 如权利要求11所述的液晶显示面板，其中，所述芯片为电源管理芯片、源极驱动芯片或栅极驱动芯片；或者，
    所述芯片包括电源管理芯片和驱动芯片，所述电源管理芯片和所述驱动芯片上分别设有热敏元件，所述热敏元件分别与所述模数转换器电连接。
  19. 如权利要求11所述的液晶显示面板，其中，当芯片温度超过预定温度时所述时序控制器降低所述芯片的工作频率。
  20. 如权利要求11所述的液晶显示面板，其中，所述芯片位于所述液晶显示面板的阵列基板的外部，所述芯片与所述阵列基板上的电路电连接。
PCT/CN2018/090855 2018-04-17 2018-06-12 液晶显示面板的芯片温度控制电路及液晶显示面板 Ceased WO2019200680A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/080,208 US20210080775A1 (en) 2018-04-17 2018-06-12 Chip temperature control circuit of liquid crystal display panel and liquid crystal display panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810343761.5A CN108346409A (zh) 2018-04-17 2018-04-17 液晶显示面板的芯片温度控制电路及液晶显示面板
CN201810343761.5 2018-04-17

Publications (1)

Publication Number Publication Date
WO2019200680A1 true WO2019200680A1 (zh) 2019-10-24

Family

ID=62955130

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/090855 Ceased WO2019200680A1 (zh) 2018-04-17 2018-06-12 液晶显示面板的芯片温度控制电路及液晶显示面板

Country Status (3)

Country Link
US (1) US20210080775A1 (zh)
CN (1) CN108346409A (zh)
WO (1) WO2019200680A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11790827B2 (en) * 2020-10-30 2023-10-17 Samsung Electronics Co., Ltd. Display system with thermal sensor and method of operating the same
CN112332648B (zh) * 2020-11-13 2022-09-27 山特电子（深圳）有限公司 一种主动平衡并联功率器件的热性能的装置和方法
CN112770432A (zh) * 2021-01-20 2021-05-07 华域视觉科技(上海)有限公司 Oled灯具的过温保护电路、方法及oled灯具
CN113939076B (zh) * 2021-10-12 2024-07-26 维沃移动通信有限公司 电路板结构、信息处理方法、装置及通信设备
CN114694613B (zh) * 2022-03-30 2023-03-28 绵阳惠科光电科技有限公司 显示面板的控制板及显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1704737A (zh) * 2004-05-26 2005-12-07 鸿富锦精密工业（深圳）有限公司 芯片温测装置及其温测方法
KR20070076927A (ko) * 2006-01-20 2007-07-25 삼성전자주식회사 표시 장치
CN103050092A (zh) * 2012-12-20 2013-04-17 深圳市华星光电技术有限公司 一种背光驱动电路的保护电路、背光模组和液晶显示装置
CN105261344A (zh) * 2015-11-25 2016-01-20 深圳市华星光电技术有限公司 一种显示面板的控制装置以及控制方法
CN106128386A (zh) * 2016-08-26 2016-11-16 深圳市华星光电技术有限公司 一种芯片保护电路及平板显示设备
CN106339011A (zh) * 2015-07-10 2017-01-18 深圳市中兴微电子技术有限公司 一种芯片温度检测和控制方法与装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4238913B2 (ja) * 2006-12-19 2009-03-18 ソニー株式会社 表示装置の温度制御方法及び表示装置
CN102385848A (zh) * 2011-11-10 2012-03-21 深圳市华星光电技术有限公司 液晶显示器、发光二极管的温度控制方法及装置
CN205879394U (zh) * 2016-08-12 2017-01-11 桂林电子科技大学 一种温度测量电路及采用该电路的高精度温度测量装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1704737A (zh) * 2004-05-26 2005-12-07 鸿富锦精密工业（深圳）有限公司 芯片温测装置及其温测方法
KR20070076927A (ko) * 2006-01-20 2007-07-25 삼성전자주식회사 표시 장치
CN103050092A (zh) * 2012-12-20 2013-04-17 深圳市华星光电技术有限公司 一种背光驱动电路的保护电路、背光模组和液晶显示装置
CN106339011A (zh) * 2015-07-10 2017-01-18 深圳市中兴微电子技术有限公司 一种芯片温度检测和控制方法与装置
CN105261344A (zh) * 2015-11-25 2016-01-20 深圳市华星光电技术有限公司 一种显示面板的控制装置以及控制方法
CN106128386A (zh) * 2016-08-26 2016-11-16 深圳市华星光电技术有限公司 一种芯片保护电路及平板显示设备

Also Published As

Publication number Publication date
CN108346409A (zh) 2018-07-31
US20210080775A1 (en) 2021-03-18

Similar Documents

Publication Publication Date Title
WO2019200680A1 (zh) 液晶显示面板的芯片温度控制电路及液晶显示面板
CN108665861B (zh) 一种显示驱动装置、显示驱动方法和显示装置
US9134352B2 (en) Current detecting circuit, temperature compensating device and display device
WO2016011781A1 (zh) 显示装置
US11886065B2 (en) Display panel, temperature compensation method thereof and display device
CN113467739B (zh) 一种图像处理方法、装置、电子设备及存储介质
WO2017190532A1 (zh) 温度补偿电路、显示面板和温度补偿方法
CN108831406A (zh) 电压提供电路、栅极驱动信号提供模组、方法和显示面板
CN104778934A (zh) 一种液晶显示面板、其驱动方法、其驱动电路及显示装置
CN117116224B (zh) 显示面板和显示装置
CN106226934B (zh) 一种检测电路、显示基板、显示面板、显示装置
TW201413678A (zh) 平面顯示器及其臨界電壓感測電路
WO2020206770A1 (zh) 一种显示面板及显示装置
WO2014172990A1 (zh) 调节电路及显示装置
CN116721642B (zh) 显示面板的驱动电路、驱动方法以及显示面板
US10872575B2 (en) Display device
WO2022007085A1 (zh) 显示设备及显示装置
WO2019061879A1 (zh) 保护电路和显示装置
CN210136001U (zh) 温度检测电路、供电装置及显示装置
US8933921B2 (en) Adjustment method of LCD overdrive voltage and device thereof
CN108599096B (zh) 过流保护电路及方法、显示装置
CN118098119B (zh) 显示面板的驱动方法及驱动电路、显示装置
CN113077736A (zh) 控制电路、显示装置以及电子设备
CN109883562A (zh) 显示装置、温度传感器以及温度感测方法
TWI671731B (zh) 電壓補償電路、顯示裝置以及電壓補償方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18915382

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18915382

Country of ref document: EP

Kind code of ref document: A1