WO2019187073A1

WO2019187073A1 - Optical waveguide inspection method and optical waveguide manufacturing method using same

Info

Publication number: WO2019187073A1
Application number: PCT/JP2018/013821
Authority: WO
Inventors: 博紀小澤; 大祐塚原; 明有馬
Original assignee: 日東電工株式会社
Priority date: 2018-03-30
Filing date: 2018-03-30
Publication date: 2019-10-03

Abstract

Provided are: an optical waveguide inspection method in which the time required to position an image capturing element when capturing an image of emitted light can be reduced; and an optical waveguide manufacturing method using same. In the optical waveguide inspection method according to the present invention, the position of a light emission unit (a connection surface 7c) of an optical waveguide is detected by a position detector such as a laser displacement meter (30), and on the basis of the position information of the light emission unit, a camera 20 is positioned at a place at which an image capturing element of the camera 20 is focused on the light emission unit. Then, light L that has traveled from a light incident unit of the optical waveguide to a core 7 is emitted from the light emission unit, and the emitted light L is captured by the image capturing element of the camera 20. Subsequently, the state of the core 7 (for example, light propagation properties, dimensions, inclination angle of a light reflection surface, or the like) is inspected by analyzing the captured image of the emitted light L. Also, the inspection is deemed to have passed if the state of the inspected core 7 meets predetermined criteria.

Description

Optical waveguide inspection method and optical waveguide manufacturing method using the same

The present invention relates to an optical waveguide inspection method used in the fields of optical communication, optical information processing and other general optics, and a method of manufacturing an optical waveguide using the same.

In recent electronic devices, as the amount of transmission information increases, optical wiring is used in addition to electrical wiring. As such, an opto-electric hybrid board is proposed in which an electric circuit board having electric wiring and an optical waveguide having a core (optical wiring) are laminated. Some of the opto-electric hybrid boards are used with an optical element mounted on the electric circuit board, and the optical waveguide core part corresponding to the mounting position of the optical element is the core part of the optical circuit board. It is formed on a light reflecting surface inclined by 45 ° with respect to the longitudinal direction.

In the optical waveguide manufacturing process, after the core is formed, the state of the core (eg, light propagation performance, dimensions, inclination angle of the light reflecting surface, etc.) is inspected (eg, Patent Documents 1 to 3). reference). An example of the inspection method will be described. First, light is emitted from a light source such as an LED (light emitting diode) toward the first end of the core, and the light emitted from the second end of the core is converted into a CCD (charge). Coupling element) Captured by an image sensor such as an image sensor and imaged by the image sensor. During the imaging, it is necessary to focus the imaging element on the light emitting part (second end of the core). As a result, the image sensor is positioned at a position appropriate for imaging the emitted light. Next, the state of the core (the light propagation performance and the like) is inspected by analyzing the image of the captured emitted light. And the thing in which the state of the inspected core meets a preset standard is regarded as a passing product of the above inspection.

In order to increase the efficiency of the inspection, a strip-shaped optical waveguide assembly sheet is produced by arranging a plurality of optical waveguides in a direction perpendicular to the longitudinal direction of the core, and each optical waveguide of the optical waveguide assembly sheet is produced. Has been proposed (see, for example, Patent Document 3 above). Then, after the inspection, individual optical waveguides are cut out from the optical waveguide assembly sheet.

JP 2014-173849 A JP 2014-199229 A JP 2015-215237 A

However, in the above-described conventional optical waveguide inspection method, a long time (for example, about 280 seconds for 25 optical waveguides) is required for the step of focusing the image pickup device on the light emitting portion of the core (the image pickup device positioning step). Cost. Even in the method of improving efficiency as in Patent Document 3 described above, the step of focusing is required, and a similar long time is required. Therefore, the productivity of the optical waveguide is deteriorated. In addition, when the processing state of the light emitting portion of the core is poor or the dimensions are small, the focusing requires a longer time, and the productivity of the optical waveguide is further deteriorated.

The present invention has been made in view of such circumstances, and provides an optical waveguide inspection method and an optical waveguide manufacturing method using the optical waveguide inspection method that can shorten the time required to position an image pickup device when imaging emitted light. provide.

The present invention provides a step of preparing an optical waveguide having a light incident portion and a light emitting portion and having an optical path core between the light incident portion and the light emitting portion, and the light emission of the optical waveguide. Detecting the position of the part by a position detector, causing the light to enter the core of the optical waveguide from the light incident part, and emitting the light from the light emitting part, and detecting the detected light emitting part. A step of positioning the imaging device based on the position information, imaging the emitted light emitted from the light emitting unit by the imaging device, and a step of inspecting the state of the core by image analysis of the captured emitted light An inspection method for an optical waveguide provided with

Further, the present invention is a method of manufacturing an optical waveguide comprising a step of forming a core and a step of inspecting the state of the core by the optical waveguide inspection method, and the optical waveguide whose inspection result meets a standard The manufacturing method of the optical waveguide which makes a waveguide an acceptable product is made into the 2nd summary.

The optical waveguide inspection method of the present invention includes a step of detecting the position of the light emitting portion by a position detector prior to the step of imaging the emitted light emitted from the light emitting portion. That is, in the imaging step, the position of the light emitting unit has already been recognized, and thereby the position where the focus of the image sensor matches the light emitting unit (the appropriate position for imaging the emitted light) has been determined. Is in a state. Therefore, prior to the imaging step or in the imaging step, the imaging element can be quickly positioned at a position where the focus of the imaging element is aligned with the light emitting portion (a position appropriate for imaging the emitted light). That is, in the optical waveguide inspection method of the present invention, a process for focusing the image pickup device, which takes a long time, is unnecessary. Therefore, the time required for positioning the image sensor can be shortened. As a result, the time required for the inspection can be shortened.

Particularly, a plurality of the optical waveguides are juxtaposed in a direction perpendicular to the longitudinal direction of the core, and the plurality of optical waveguides form a strip-shaped optical waveguide assembly sheet, and the optical waveguides of the optical waveguide assembly sheet are arranged in parallel. In the case of sequentially inspecting, the inspection can be continuously performed in the parallel order of the optical waveguides, so that the inspection efficiency can be improved.

Further, the optical waveguide assembly sheet includes a plurality of optical waveguides arranged in parallel in a direction perpendicular to the longitudinal direction of the core, and a plurality of the optical waveguides are in parallel. In this case, since the number of optical waveguides that can be inspected at the same time increases by the number of the above-described columns, the inspection efficiency can be further improved.

Further, when the position detector for detecting the position of the light emitting portion of the optical waveguide is a laser displacement meter, the time required for detecting the position of the light emitting portion can be shortened, so that further inspection efficiency can be achieved. Can be achieved.

In the optical waveguide manufacturing method of the present invention, after the core is formed, the state of the core is inspected by the above-described optical waveguide inspection method, and the optical waveguide whose inspection result meets the standard is accepted. Here, since the time required for the inspection can be shortened, the productivity of the optical waveguide can be increased.

(A) shows typically an opto-electric hybrid board assembly sheet in which a plurality of opto-electric hybrid boards provided with an optical waveguide to be inspected according to the first embodiment of the optical waveguide inspection method of the present invention are arranged in parallel. It is a top view, (b) is XX sectional drawing of (a). It is a longitudinal cross-sectional view which shows typically the opto-electric hybrid module using the said opto-electric hybrid board. (A)-(b) is explanatory drawing which shows typically the formation process of the electric circuit board of the said opto-electric hybrid board | substrate, (c) is a schematic process of forming the metal layer of the said opto-electric hybrid board | substrate. It is explanatory drawing shown in. (A)-(d) is explanatory drawing which shows typically the formation process of the optical waveguide of the said opto-electric hybrid board | substrate. It is explanatory drawing which shows typically 1st Embodiment of the inspection method of the said optical waveguide. It is explanatory drawing which shows typically 2nd Embodiment of the test | inspection method of the optical waveguide of this invention. It is a cross-sectional view which shows typically the opto-electric hybrid board | substrate provided with the optical waveguide used as the test object of 3rd Embodiment of the inspection method of the optical waveguide of this invention. It is explanatory drawing which shows typically 3rd Embodiment of the test | inspection method of the said optical waveguide. It is explanatory drawing which shows typically 4th Embodiment of the test | inspection method of the optical waveguide of this invention.

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1A is a plan view showing an opto-electric hybrid board assembly sheet in which a plurality of opto-electric hybrid boards having optical waveguides to be inspected according to the first embodiment of the optical waveguide inspection method of the present invention are arranged in parallel. FIG. 1B is a cross-sectional view (XX cross-sectional view of FIG. 1A) showing the opto-electric hybrid board included in the opto-electric hybrid board assembly sheet. In this embodiment, the opto-electric hybrid board A1 before the inspection is laminated on the electric circuit board E and one surface of the electric circuit board E (the lower surface in FIG. 1B) as shown in FIG. And a formed optical waveguide W1 before inspection. In this embodiment, a reinforcing metal layer M is disposed in a part between the electric circuit board E and the optical waveguide W1. Then, as shown in FIG. 1A, the opto-electric hybrid board assembly sheet (optical waveguide assembly sheet) S includes a plurality of the opto-electric hybrid boards A1 (a plurality of optical waveguides W1) and the optical waveguide W. In the direction perpendicular to the longitudinal direction of the core 7, the belt 7 is formed in parallel with a gap.

More specifically, the electric circuit board E has electric wiring (not shown) and element mounting pads 2 formed on the first surface of the light-transmitting insulating layer 1. Here, the insulating layer 1 is formed on the first surface (surface opposite to the optical waveguide W) of the metal layer M.

The optical waveguide W1 is configured such that a linear core 7 for an optical path is sandwiched between a first cladding layer 6 and a second cladding layer 8. And the 1st end part of the said optical waveguide W corresponding to the element mounting pad 2 of the said electric circuit board | substrate E is formed in the inclined surface inclined 45 degrees with respect to the longitudinal direction of the core 7, The inclined surface The portion of the core 7 located at is a light reflecting surface 7a. The second end of the optical waveguide W1 (the end opposite to the light reflecting surface 7a) is formed on a right-angled plane perpendicular to the longitudinal direction of the core 7, and the core 7 positioned on the right-angled plane is formed. The part is a connection surface 7c connected to the end surface of the core 9 of the optical fiber F (see FIG. 2). Here, the first cladding layer 6 is formed on the second surface of the metal layer M (the surface opposite to the electric circuit board E).

Then, after the inspection of the optical waveguide W1, only the opto-electric hybrid board A having the optical waveguide W that has passed the inspection is individually cut out from the opto-electric hybrid board assembly sheet S. The opto-electric hybrid board A is used by being connected to both ends of the optical fiber F as shown in FIG. Here, the optical waveguide W1 before the inspection and the optical waveguide W after the inspection have the same configuration. The opto-electric hybrid board A1 including the optical waveguide W1 before the inspection and the opto-electric hybrid board A including the optical waveguide W after the inspection have the same configuration. The light emitting element 11 is mounted on the element mounting pad 2 of the opto-electric hybrid board A at the first end (left end in FIG. 2), and the second end (right end in FIG. 2). The light receiving element 12 is mounted on the element mounting pad 2 of the opto-electric hybrid board A. Thus, an opto-electric hybrid module is formed by the opto-electric hybrid board A, the optical fiber F, the light emitting element 11, and the light receiving element 12, and is mounted on an electronic device or the like.

The light propagation in the opto-electric hybrid module is performed as follows. That is, the light L emitted from the light emitting element 11 mounted on the opto-electric hybrid board A at the first end (left end in FIG. 2) is transmitted from the core 7 of the opto-electric hybrid board A to the optical fiber. The light propagates through the core 9 of the F and the core 7 of the opto-electric hybrid board A at the second end (right end in FIG. 2) in this order and is received by the light receiving element 12.

Thus, in the opto-electric hybrid board A at each end, the light propagation performance of the core 7 is important. Therefore, in this embodiment, as described below, in the manufacturing process of the opto-electric hybrid board A, the light propagation performance of the core 7 of the optical waveguide W1 (see FIG. 1B) is inspected.

That is, in the production of the opto-electric hybrid board A provided with the inspection step, first, the strip-like opto-electric hybrid board assembly sheet S in which a plurality of opto-electric hybrid boards A1 before inspection are arranged in parallel is produced. The production of each opto-electric hybrid board A1 in the opto-electric hybrid board assembly sheet S is performed as follows.

[Formation of the electric circuit board E of the opto-electric hybrid board A1]
First, a strip-shaped metal sheet material Ma (see FIG. 3A) for forming the metal layer M is prepared. Examples of a material for forming the metal sheet material Ma include stainless steel, an alloy of iron and nickel (containing 42 wt% nickel), and stainless steel is preferable from the viewpoint of dimensional accuracy. The thickness of the metal sheet material Ma (metal layer M) is set within a range of 10 to 100 μm, for example.

Next, as shown in FIG. 3A, a photosensitive insulating resin is applied to the first surface of the metal sheet material Ma, and the insulating layer 1 having a predetermined pattern is formed by photolithography. Examples of the material for forming the insulating layer 1 include synthetic resins such as polyimide, polyether nitrile, polyether sulfone, polyethylene terephthalate, polyethylene naphthalate, and polyvinyl chloride, and silicone-based sol-gel materials. The thickness of the insulating layer 1 is set within a range of 10 to 100 μm, for example.

Next, as shown in FIG. 3B, the electrical wiring (not shown) and the element mounting pad 2 are formed by, for example, a semi-additive method, a subtractive method, or the like. In this way, the electric circuit board E is formed on the first surface of the metal sheet material Ma.

[Formation of metal layer M of opto-electric hybrid board A1]
Thereafter, as shown in FIG. 3C, etching or the like is performed on the metal sheet material Ma to remove unnecessary portions of the metal sheet material Ma so as to shape the metal sheet material Ma. To form.

[Formation of optical waveguide W of opto-electric hybrid board A1]
In order to form the optical waveguide W1 (see FIG. 1B) on the second surface (surface opposite to the electric circuit substrate E) of the laminate of the electric circuit substrate E and the metal layer M, first, As shown in FIG. 4A, a photosensitive resin, which is a material for forming the first cladding layer 6, is applied to the second surface (the lower surface in the drawing) of the laminate. Thereafter, the coating layer is exposed to radiation and cured to form the first cladding layer 6. The thickness of the first cladding layer 6 (thickness from the second surface of the metal layer M) is set, for example, within a range of 5 to 80 μm. When the optical waveguide W is formed (when the first clad layer 6, the following core 7 and the second clad layer 8 are formed), the second surface of the laminate is directed upward.

Next, as shown in FIG. 4B, a core 7 having a predetermined pattern is formed on the first surface (lower surface in the drawing) of the first cladding layer 6 by photolithography. For example, the dimensions of the core 7 are set in a range of 5 to 200 μm in width and in a range of 5 to 200 μm in thickness. Examples of the material for forming the core 7 include the same photosensitive resin as that for the first cladding layer 6, and the formation of the first cladding layer 6 and the second cladding layer 8 described below (see FIG. 4C). A material having a higher refractive index than the material is used.

Next, as shown in FIG. 4C, the second cladding layer 8 is formed by photolithography on the first surface (the lower surface in the figure) of the first cladding layer 6 so as to cover the core 7. To do. The thickness of the second cladding layer 8 [thickness from the top surface (lower surface in the figure) of the core 7] is set in the range of 3 to 50 μm, for example. Examples of the material for forming the second cladding layer 8 include the same photosensitive resin as that for the first cladding layer 6.

Thereafter, as shown in FIG. 4D, the portion (first end portion) of the core 7 corresponding to the element mounting pad 2 of the electric circuit board E (positioned downward in the drawing) is moved to the first cladding. The layer 6 and the second cladding layer 8 are formed on an inclined surface inclined by 45 ° with respect to the longitudinal direction of the core 7 by, for example, excimer laser processing. The portion of the core 7 located on these inclined surfaces becomes the light reflecting surface 7a. The second end of the core 7 (the end opposite to the light reflecting surface 7a) is formed on a surface perpendicular to the longitudinal direction of the core 7, and the core 9 of the optical fiber F (see FIG. 1). The connection surface 7c is connected to the end surface. Thus, the optical waveguide W1 before the inspection is obtained, and the optical / electrical hybrid substrate assembly sheet S in which a plurality of the optical / electrical hybrid substrates A1 provided with the optical waveguide W1 are arranged in parallel [FIGS. 1 (a), (b) Browse].

<Inspection method of optical waveguide W1>
Then, the light propagation performance of the core 7 of the optical waveguide W1 is inspected as follows. This inspection method is a method of detecting the position of the light emitting portion prior to imaging the light emitted after propagating through the core 7 by the imaging device. This inspection method is the first feature of the present invention.

That is, in this embodiment, as shown in FIG. 5, the inspection method first adsorbs the strip-like opto-electric hybrid board assembly sheet S on the upper surface of an air adsorption belt (not shown), and the light. The electric mixed board assembly sheet S is moved in the longitudinal direction (the arrow direction shown in FIG. 5). A laser displacement meter (position detector) 30 is installed on the upstream side of the movement, and a light source 10 such as an LED (light emitting diode) that emits uniform light and a CCD (charge coupled device) image sensor on the downstream side. And a camera 20 equipped with an image sensor such as a CMOS (phase correction metal oxide semiconductor) image sensor. In FIG. 5, in order to facilitate understanding of the inspection method, a part of the configuration of the opto-electric hybrid board assembly sheet S is simplified or omitted.

More specifically, the laser displacement meter 30 is a transmission type including an emitter 31 that emits a laser beam 30a in a planar shape and a light receiver 32 that receives the emitted laser beam 30a. The light emitting body 31 and the light receiving body 32 are placed between the body 31 and the light receiving body 32 so that the side edge portion with the connection surface 7c serving as the light emitting section of the opto-electric hybrid board assembly sheet S is located. Deploy.

The light source 10 is installed above the portion of the electric circuit board E corresponding to the light reflecting surface 7 a at the first end of the core 7, and the light reflecting surface 7 a at the first end of the core 7 from the light source 10. Light L is emitted toward. As a result, the light L is incident on the optical waveguide W1 (see FIG. 1B) from the first surface portion (the light incident portion of the optical waveguide W1) of the first cladding layer 6 corresponding to the light reflecting surface 7a. Thereafter, the light is reflected by the light reflecting surface 7a and emitted from the connection surface 7c (light emitting portion of the optical waveguide W1) at the second end of the core 7 (see FIG. 2).

The camera 20 is installed in a state of facing the connection surface 7c at the second end of the core 7, and the light L emitted from the connection surface 7c can be captured by the imaging element. The camera 20 is fixed to a camera moving unit (not shown) that can move in three dimensions, and the camera 20 can be moved by operating the camera moving unit.

In such a state, the side edge portion where the light emitting portion (connection surface 7c) of the opto-electric hybrid board assembly sheet S passes between the emitting body 31 and the light receiving body 32 of the laser displacement meter 30. Thus, a part of the laser beam 30a emitted in a planar shape from the emitting body 31 is blocked at the side edge of the opto-electric hybrid board assembly sheet S, and the remaining unblocked laser beam 30a is received by the light receiving device. Light is received by the body 32. The position of the light emitting portion (connection surface 7c) of the opto-electric hybrid board assembly sheet S can be detected in the parallel order of the opto-electric hybrid board A1 by the change in the cutoff state of the laser beam 30a. In this way, in the process of forming the opto-electric hybrid board A1, the part of the opto-electric hybrid board A1 corresponding to the light exit part is set to the opto-electric hybrid board assembly so that the blocking state of the laser light 30a changes at the position of the light exit part. The sheet S is formed so as to protrude from the side edge, or is formed in a recessed state.

Then, based on the detected position information of the light emitting part (connection surface 7c), the camera moving part is operated to a position where the focus of the image pickup device is aligned with the light emitting part (connection surface 7c). Is moved to position the camera 20. Therefore, it is not necessary to focus the image pickup device on the light emitting portion (second end portion of the core 7) after the image pickup device captures the emitted light L from the light emitting portion (connecting surface 7c). That is, in this embodiment, a focusing process requiring a long time is not required.

The time required from the detection of the position of the light emitting portion (connection surface 7c) by the laser displacement meter 30 to the positioning of the camera 20 is short. For example, 25 opto-electric hybrid boards A1 in the opto-electric hybrid board aggregate sheet S are used. For about 10 seconds. As described above, the conventional inspection method that needs to be focused requires about 280 seconds under the same conditions.

Simultaneously with the positioning of the camera 20, the light L emitted from the light emitting portion (connection surface 7c) is imaged by the imaging element of the camera 20 in the parallel order of the opto-electric hybrid board A1. Then, by analyzing the captured image of the emitted light L, the light propagation loss value in the core 7 is calculated. Thus, by inspecting the light propagation performance of the core 7, the optical waveguide W1 is inspected in parallel order. And the thing with the calculated light propagation loss value smaller than the preset reference value is set as the pass product of the said inspection as the light propagation performance of the core 7 being excellent.

In this way, the optical waveguide W is formed through the step of inspecting the light propagation performance of the core 7. At the same time, an opto-electric hybrid board assembly sheet S in which a plurality of opto-electric hybrid boards A are arranged in parallel is obtained. As described above, in the inspection of the light propagation performance of the core 7 in the process of forming the optical waveguide W, the position of the light emitting portion is detected prior to imaging of the emitted light, so the time required for the inspection is shortened. can do. Therefore, the productivity of the optical waveguide W can be increased, and as a result, the productivity of the opto-electric hybrid board assembly sheet S can be increased.

Thus, in the process of forming the optical waveguide W, a step of inspecting the light propagation performance of the core 7 is provided, and the optical waveguide W whose light propagation performance of the core 7 is suitable for practical use is regarded as an acceptable product. This is the second feature of the present invention.

[Production of opto-electric hybrid module]
Thereafter, the opto-electric hybrid board A provided with the optical waveguide W, which is an acceptable product of the above inspection, is individually cut out from the opto-electric hybrid board assembly sheet S, and as shown in FIG. 7 are connected to both ends of the core 9 of the optical fiber F via connectors (not shown) or the like. The light emitting element 11 is mounted on the element mounting pad 2 of the opto-electric hybrid board A at the first end of the optical fiber F, and the element mounting pad 2 of the opto-electric hybrid board A at the second end. In addition, the light receiving element 12 is mounted. In this way, the opto-electric hybrid module is obtained.

FIG. 6 is an explanatory view showing a second embodiment of the optical waveguide inspection method of the present invention. The inspection method of this embodiment is obtained by reversing the arrangement of the light source 10 and the camera 20 in the inspection method of the first embodiment shown in FIG. That is, the light source 10 is installed in a state of facing the connection surface 7 c at the second end of the core 7, and the camera 20 is a part of the electric circuit board E corresponding to the light reflecting surface 7 a at the first end of the core 7. It is installed above. The light L from the light source 10 enters the core 7 from the connection surface 7c of the core 7 and is reflected by the light reflecting surface 7a, and then passes through the first cladding layer 6 and the insulating layer 1 in this order. The light is emitted toward the camera 20. As described above, in this embodiment, the light incident portion of the optical waveguide W1 serves as the connection surface 7c of the core 7, and the light emitting portion of the optical waveguide W1 [see FIG. This is the first surface portion of the first cladding layer 6 corresponding to the surface 7a. For this reason, as the laser displacement meter 30 for detecting the position of the light emitting portion, a reflection type in which the emitting body and the light receiving body are integrated is used. Other parts are the same as those in the first embodiment shown in FIG. 5, and the same reference numerals are given to the same parts.

In the second embodiment, the position of the light emitting part is detected by arranging the reflective laser displacement meter 30 above the first surface of the opto-electric hybrid board A1. Then, laser light 30b is emitted from the laser displacement meter 30 toward the first surface of the opto-electric hybrid board A1, and the laser light 30c reflected by the opto-electric hybrid board A1 is received by the laser displacement meter 30. At this time, since the light emitting portion is at a low position between the two element mounting pads 2, the reflection state of the laser beam 30c changes in the light emitting portion, and thus the light emitting portion is detected. can do.

In the second embodiment, the light propagation performance of the core 7 of the optical waveguide W1 can be inspected by reversing the propagation direction of the light L from that of the first embodiment. As in the first embodiment, the time required for the inspection can be shortened, and the productivity of the optical waveguide W and the opto-electric hybrid board assembly sheet S can be increased.

FIG. 7 is a transverse cross-sectional view (cross-sectional view corresponding to FIG. 1B) showing an opto-electric hybrid board provided with an optical waveguide to be inspected according to the third embodiment of the optical waveguide inspection method of the present invention. It is. In this embodiment, the opto-electric hybrid board B1 before the inspection has element mounting pads 2 formed on both ends of one electric circuit board E, and the optical waveguide W2 stacked on the electric circuit board E. Light reflecting surfaces 7 a are formed at both ends of the core 7. Further, the optical waveguide W2 before the inspection and the optical waveguide W after the inspection have the same configuration. Further, the opto-electric hybrid board B1 provided with the optical waveguide W2 before inspection and the opto-electric hybrid board B provided with the optical waveguide W after inspection have the same configuration. And the opto-electric hybrid board B after inspection does not pass through the optical fiber F (see FIG. 2). The other parts are the same as those of the opto-electric hybrid board A1 in the first embodiment shown in FIG. 1B, and the same parts are denoted by the same reference numerals.

The light propagation in this opto-electric hybrid board B is such that the light L from the first surface of the first end passes through the insulating layer 1 and the first cladding layer 6 in this order, and then the first end of the core 7 The light is reflected by the light reflecting surface 7 a and propagates through the core 7. Thereafter, the light is reflected by the light reflecting surface 7a at the second end of the core 7, passes through the first cladding layer 6 and the insulating layer 1 in this order, and is emitted from the first surface at the second end. That is, both the light incident portion and the light emitting portion of the optical waveguide W2 are the first surface portions of the first cladding layer 6 corresponding to the light reflecting surface 7a.

Therefore, the inspection method of the optical waveguide W2 according to the third embodiment, as shown in FIG. 8, uses the second embodiment (FIG. 6) as a laser displacement meter 30 for detecting the position of the light emitting portion. Similar to the reference), a reflective type in which the emitting body and the light receiving body are integrated is used. The light source 10 and the camera 20 are both installed above the opto-electric hybrid board B1. Then, similarly to the first and second embodiments, the light propagation performance of the core 7 of the optical waveguide W2 can be inspected.

Also in the third embodiment, as in the first and second embodiments, the time required for the inspection can be shortened, and the productivity of the optical waveguide W and the opto-electric hybrid board assembly sheet S can be increased. Can be increased.

FIG. 9 is an explanatory view showing a fourth embodiment of the optical waveguide inspection method of the present invention. In the inspection method of this embodiment, the opto-electric hybrid board assembly sheet S is obtained by arranging two rows of a plurality of juxtaposed opto-electric hybrid boards A1 shown in FIG. Yes. However, the light emission part (connection surface 7c) is formed in the side edge of the opto-electric hybrid board assembly sheet S in both the two rows. Then, the two rows can be inspected simultaneously. The inspection of each column can be performed in the same manner as in the first embodiment shown in FIG. Other parts are the same as those in the first embodiment shown in FIG. 5, and the same reference numerals are given to the same parts.

In the fourth embodiment, since the number of optical waveguides W1 that can be inspected at the same time is doubled, the inspection efficiency can be further increased, and the production of the optical waveguide W and the opto-electric hybrid board aggregate sheet S can be achieved. The sex can be further enhanced.

In the fourth embodiment, both the two rows were inspected in the same manner as in the first embodiment shown in FIG. 5, but one of the two rows is that of the light source 10 and the camera 20. The arrangement may be reversed and the inspection may be performed in the same manner as in the second embodiment shown in FIG. Further, both rows may be inspected in the same manner as in the second embodiment shown in FIG.

In the fourth embodiment, if the opto-electric hybrid board A1 has the light incident part position and the light emission part position on the first surface of the opto-electric hybrid board B1 shown in FIG. Two or more rows of the plurality of opto-electric hybrid boards B1 arranged in parallel can be arranged in parallel. Therefore, the number of optical waveguides that can be inspected at the same time can be further increased, and the efficiency of inspection can be further increased. And the productivity of the optical waveguide W and the opto-electric hybrid board assembly sheet S can be further enhanced.

In each of the above embodiments, when the light propagation performance of the core 7 is inspected, light is propagated in the core 7 only in one direction. Thereafter, the arrangement of the light source 10 and the camera 20 is reversed, Inspection may be performed by propagating light in the opposite direction. In this way, since one optical waveguide is inspected twice, the inspection accuracy is improved.

Moreover, in each said embodiment, although test | inspected using the opto-electric hybrid board | substrate assembly sheet | seat S in which several opto-electric hybrid board | substrates A1 and B1 were arranged in parallel, the opto-electric hybrid board | substrate A1 and B1 were moved independently You may inspect it.

Further, in each of the above embodiments, the optical waveguides W1 and W2 are inspected in a state where the electric circuit board E is laminated on the optical waveguides W1 and W2. However, the inspection is performed in a state where only the optical waveguides W1 and W2 are formed. May be.

In each of the above embodiments, the laser displacement meter 30 is used as a detector for detecting the position of the light emitting portion of the optical waveguides W1 and W2. However, if the position of the light emitting portion can be detected, other detectors can be used. May be used.

In each of the above embodiments, the opto-electric hybrid board assembly sheet S is moved, but the laser displacement meter 30, the light source 10, and the camera 20 (imaging device) may be moved. Alternatively, the opto-electric hybrid board assembly sheet S, the laser displacement meter 30, the light source 10, and the camera 20 (imaging device) may be moved in directions opposite to each other.

Further, in each of the above-described embodiments, the light propagation performance of the core 7 is inspected as the state of the core 7. Inspection can also be performed by image analysis of the emitted light imaged as described above (see Patent Documents 1 to 3). At this time, as in the above embodiments, the position of the light emitting portion is detected by the laser displacement meter 30 prior to imaging of the emitted light from the light emitting portion, so that the time required for the inspection can be shortened. it can.

Next, examples will be described. However, the present invention is not limited to the examples.

[Example 1]
As in the first embodiment shown in FIG. 5, the optical propagation performance of the core was inspected for the optical waveguide of the opto-electric hybrid board assembly sheet. The number of opto-electric hybrid boards arranged in parallel in the opto-electric hybrid board assembly sheet was 25. Moreover, the dimensions of the core of the optical waveguide were a square with a cross section of 50 μm × 50 μm and a length of 10 cm. And the light emission part of the said optical waveguide is located in the side edge part of the said opto-electric hybrid board assembly sheet. Therefore, a transmissive laser displacement meter (manufactured by Keyence Corporation, LS-9006M) was used as a laser displacement meter for detecting the position of the light emitting portion.

Further, OCT-001 manufactured by Synergy Opto Systems was used as an apparatus for imaging the light emitted from the light emitting part. This apparatus includes a light source and a camera including a CCD image sensor (imaging device). The light source has a wavelength of emitted light of 850 nm, a uniform light irradiation surface diameter of 4 mm, and an NA (numerical aperture) of 0.57. The CCD image sensor has a magnification of 5 times, a field of view range of 1.28 mm × 0.96 mm, and an NA (numerical aperture) of 0.42.

[Example 2]
As in the second embodiment shown in FIG. 6, the optical propagation performance of the core was examined for the optical waveguide of the opto-electric hybrid board assembly sheet. The light emitting portion of the optical waveguide is located on the first surface portion of the first cladding layer. Therefore, a reflection type laser displacement meter (manufactured by Keyence Corporation, LJ-V7020K) was used as a laser displacement meter for detecting the position of the light emitting portion. The other parts were the same as in Example 1 above.

[Comparative Example 1]
In Example 1 above, after the light emitted from the light emitting portion of the optical waveguide is captured by the CCD image sensor and the focus of the CCD image sensor is adjusted to the light emitting portion of the optical waveguide, as in the conventional inspection method, I took an image. The other parts were the same as in Example 1 above.

[Comparative Example 2]
In Example 2 above, after the emitted light from the light emitting portion of the optical waveguide is captured by the CCD image sensor and the focus of the CCD image sensor is adjusted to the light emitting portion of the optical waveguide, as in the conventional inspection method, I took an image. The other parts were the same as in Example 2 above.

[Inspection time]
For Examples 1 and 2 and Comparative Examples 1 and 2, the time required to inspect 25 optical waveguides of the opto-electric hybrid board assembly sheet was measured. The results are shown in Table 1 below.

From the results of Table 1 above, it can be seen that Examples 1 and 2 have a shorter inspection time than Comparative Examples 1 and 2.

Further, in the first and second embodiments, the above-described implementation can be performed even if two rows of a plurality of juxtaposed opto-electric hybrid boards are arranged in parallel as the opto-electric hybrid board assembly sheet (see FIG. 9). Results showing the same tendency as in Examples 1 and 2 were obtained. Further, the opto-electric hybrid board is the one where the light incident part and the light emitting part are located on the first surface of the opto-electric hybrid board (see FIG. 7), and a plurality of the opto-electric hybrid boards are arranged in parallel. Even when an opto-electric hybrid board assembly sheet having two or more rows arranged in parallel was used, a result showing the same tendency as in Examples 1 and 2 was obtained.

And in the said Examples 1 and 2, it replaces with an opto-electric hybrid board assembly sheet, and even if it inspects in the state which moved the opto-electric hybrid board independently, the result which shows the same tendency as the said Examples 1 and 2 was gotten.

Further, in Examples 1 and 2 and Comparative Examples 1 and 2, the light propagation performance of the core was inspected, but the core dimensions (width and thickness) and the inclination angle of the light reflecting surface were imaged in the same manner as described above. Even when examined by image analysis of the emitted light, results showing the same tendency as in Examples 1 and 2 and Comparative Examples 1 and 2 were obtained.

In the above embodiments, specific forms in the present invention have been described. However, the above embodiments are merely examples and are not construed as limiting. Various modifications apparent to those skilled in the art are contemplated to be within the scope of this invention.

The optical waveguide inspection method and the optical waveguide manufacturing method using the optical waveguide according to the present invention can be used for inspecting the core state of the optical waveguide (light propagation performance, dimensions, inclination angle of the light reflecting surface, etc.) in a short time. is there.

L light 7 core 7c connection surface 20 camera 30 laser displacement meter

Claims

A step of preparing an optical waveguide having a light incident portion and a light emitting portion and having an optical path core between the light incident portion and the light emitting portion; and a position of the light emitting portion of the optical waveguide. Based on the step of detecting by the position detector, the step of causing light to enter the core of the optical waveguide from the light incident portion, and emitting the light from the light emitting portion, and the position information of the detected light emitting portion. Positioning the image pickup device, and imaging the emitted light emitted from the light emitting portion by the image pickup device, and inspecting the state of the core by image analysis of the imaged emitted light. A method for inspecting an optical waveguide.
A plurality of the optical waveguides are arranged in parallel in a direction perpendicular to the longitudinal direction of the core, and the plurality of optical waveguides form a strip-shaped optical waveguide assembly sheet, and the optical waveguides of the optical waveguide assembly sheet are inspected in parallel order. The method for inspecting an optical waveguide according to claim 1.
The optical waveguide assembly sheet has a plurality of optical waveguides arranged in parallel in a direction perpendicular to the longitudinal direction of the core, wherein the plurality of optical waveguides are arranged in parallel, and the plurality of rows are simultaneously inspected. 2. A method for inspecting an optical waveguide according to 2.
The optical waveguide inspection method according to any one of claims 1 to 3, wherein the position detector that detects the position of the light emitting portion of the optical waveguide is a laser displacement meter.
A method of manufacturing an optical waveguide, comprising: a step of forming a core; and a step of inspecting the state of the core by the optical waveguide inspection method according to any one of claims 1 to 4. An optical waveguide manufacturing method characterized in that an optical waveguide whose result meets a standard is regarded as an acceptable product.