TW201942553A - Optical waveguide inspection method and optical waveguide manufacturing method using same shortening the time required for positioning an image pickup element when photographing the emitting light - Google Patents

Abstract

The present invention provides an optical waveguide inspection method capable of shortening the time required for positioning an image taking element capable of emitting light when taking images, and an optical waveguide manufacturing method using the same. In the optical waveguide inspection method of the present invention, the position of the light emitting portion (connection surface 7c) of the optical waveguide is detected by a position detector such as a laser displacement meter 30. Camera 20 is positioned, according to the information of the position of the light emitting portion, at a position in which the focus of the image taking element of the camera 20 is aligned with the position of the light emitting portion. Then, the light L that enters the core portion 7 from a light incident portion of the optical waveguide is emitted from the light emitting portion, and the emitted light L is photographed by the image taking element of the camera 20. Next, by analyzing the captured image of the emitted light L, the state of the core portion 7 (for example, light propagation performance, size, inclination angle of the light reflecting surface, or the like) is inspected. Next, the inspected core 7 whose state meets a predetermined standard is determined to be a qualified product of the above inspection.

Description

Inspection method of optical waveguide and manufacturing method of optical waveguide using the same

FIELD OF THE INVENTION The present invention relates to an inspection method of an optical waveguide used in optical communication, optical information processing, and other general optical fields, and a method for manufacturing the same.

2. Description of the Related Art In recent electronic devices and the like, as the amount of transmitted information increases, optical wiring is used in addition to electrical wiring. For such a technique, an electric circuit board having an electric circuit board having electrical wiring and an optical hybrid board having an optical waveguide having a core (optical wiring) are laminated. Among the optoelectronic hybrid substrates, there are those who use optical elements mounted on the electrical circuit substrate, and the core portion of the optical waveguide corresponding to the mounting position of the optical element is formed to be inclined at an angle of 45 ° to the longitudinal direction of the core portion. Inclined light reflecting surface.

Next, in the above-mentioned manufacturing step of the optical waveguide, after the core portion is formed, the state of the core portion (for example, light propagation performance, size, inclination angle of the light reflecting surface, etc.) is checked (for example, refer to Patent Documents 1 to 3). . When describing an example of the inspection method, first, light is irradiated from a light source such as an LED (light emitting diode) toward the first end portion of the core, and an imaging element such as a CCD (charge coupled device) image sensor is used to capture the light from the light source. The light emitted from the second end portion of the core is captured by the imaging device. At this time, the focal point of the imaging element must be aligned with the light emitting portion (the second end portion of the core portion). Thereby, the imaging element is positioned at an appropriate position for shooting with the emitted light. Next, the state of the core portion (the light propagation performance and the like) is checked by analyzing the captured light image. Then, the inspected core part conforms to a predetermined reference, and becomes a qualified product in the aforementioned inspection.

In order to improve the efficiency of the aforementioned inspection, it has been proposed to prepare a ribbon-shaped optical waveguide assembly sheet in which a plurality of optical waveguides are juxtaposed in a direction perpendicular to the longitudinal direction of the core, and to inspect each of the optical waveguide assembly sheets in parallel. A method of an optical waveguide (for example, refer to the aforementioned Patent Document 3). Next, after inspection, each optical waveguide is cut out from the aforementioned optical waveguide assembly sheet.

Prior Art Literature Patent Literature Patent Literature 1: Japanese Patent Application Laid-Open No. 2014-173849 Patent Literature 2: Japanese Patent Application Laid-Open No. 2014-199229 Patent Literature 3: Japanese Patent Application Laid-Open No. 2015-215237

SUMMARY OF THE INVENTION Problems to be Solved by the Invention However, in the conventional inspection method of an optical waveguide, it takes a long time (e.g., 25 steps) for the step of aligning the focal point of the imaging element with the light emitting portion of the core (the positioning step of the imaging element). The optical waveguide takes about 280 seconds). Even as shown in the aforementioned Patent Document 3, in the method for achieving efficiency, the step of aligning the aforementioned focal points is still required, and it takes the same long time. For this reason, the productivity of the optical waveguide is deteriorated. Further, when the processing state of the light emitting portion of the core portion is poor or the size is small, it takes a longer time for the aforementioned focus alignment, and the productivity of the optical waveguide becomes worse.

The present invention has been developed in view of this situation, and provides a method for inspecting an optical waveguide that can shorten a required time for positioning an imaging element when shooting and emitting light, and a method for manufacturing the same using the same.

Means for Solving the Problems The present invention, as a method for inspecting an optical waveguide as a first gist, includes an optical waveguide preparation step including preparing a light incident portion and a light incident portion, and providing the light incident portion and the light incident portion. The optical waveguide of the core for the optical path between the sections; a detection step of detecting the position of the light emitting section of the optical waveguide by a position detector; and an emitting step of injecting light into the core of the optical waveguide from the light incident section Then, the light is emitted from the light emitting section; a photographing step, positioning an image sensor based on the detected position information of the light emitting section, and using the image sensor to capture the light emitted from the light emitting section; and an inspection step, Based on the image analysis of the captured emitted light, the state of the core is checked.

In addition, the present invention, as a method for manufacturing an optical waveguide according to the second gist, includes a step of forming a core portion, and a method of manufacturing an optical waveguide including the step of inspecting the state of the core portion by the inspection method of the optical waveguide. As a result, the optical waveguide that conformed to the standard was regarded as a qualified product.

Advantageous Effects of Invention The inspection method of an optical waveguide of the present invention includes a step of detecting the position of the light emitting portion by a position detector before the step of capturing the light emitted from the light emitting portion. In other words, in the foregoing photographing step, the position of the light emitting portion has been identified, and thus, the position of the light emitting portion (the appropriate position for shooting the emitted light) has been determined that the imaging element is in focus. For this reason, before the aforementioned photographing step, and even the aforementioned photographing step, the imaging element can be quickly positioned at a position where the focal point of the imaging element is aligned with the light emitting portion (the appropriate position for shooting out light). In other words, in the inspection method of the optical waveguide of the present invention, a step of aligning the focal point of the imaging element is not required, which takes a long time. For this reason, it is possible to shorten the time required for positioning the imaging element. As a result, the time required for the aforementioned inspection can be shortened.

In particular, the optical waveguides are plurally juxtaposed in a direction orthogonal to the longitudinal direction of the core portion, and a band-shaped optical waveguide aggregate sheet is formed based on the plurality of optical waveguides, and the optical waveguide aggregate sheet is inspected in a parallel order. In the case of each of the aforementioned optical waveguides, since the inspection can be continuously performed in accordance with the parallel order of the optical waveguides, it is possible to make the inspection efficient.

In addition, the optical waveguide assembly sheet is configured by juxtaposing a plurality of optical waveguides composed of the plurality of optical waveguides juxtaposed in a direction orthogonal to the longitudinal direction of the core, and when the plurality of optical waveguides are simultaneously checked, Since the number of optical waveguides that can be inspected at the same time is increased to the number of the aforementioned columns, further inspections can be made more efficient.

In addition, when the position detector that detects the position of the light emitting portion of the optical waveguide is a laser displacement meter, the time required for detecting the position of the light emitting portion can be shortened, and inspection can be made more efficient.

Next, the optical waveguide of the present invention is manufactured by inspecting the state of the core portion by the aforementioned inspection method of the optical waveguide after the core portion is formed, and the optical waveguide whose inspection result meets the standard becomes a qualified product. Among them, since the time required for the aforementioned inspection can be shortened, the productivity of the optical waveguide can be improved.

Embodiments for Implementing the Invention Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 (a) is a plan view schematically showing a plurality of photoelectric hybrid substrate assembly sheets in parallel with a plurality of photoelectric hybrid substrates having an optical waveguide provided with an inspection target of the first embodiment of the optical waveguide inspection method of the present invention, FIG. 1 (b) A cross-sectional view showing the aforementioned photoelectric hybrid substrate included in the photoelectric hybrid substrate assembly sheet [cross-sectional view of XX in FIG. 1 (a)]. As shown in FIG. 1 (b), the photoelectric hybrid substrate A1 before inspection in this embodiment includes an electrical circuit substrate E and a single layer formed on the electrical circuit substrate E [the bottom surface in FIG. 1 (b)] The optical waveguide W1 before the inspection. Moreover, in this embodiment, a metal layer M for reinforcement is arranged in a part between the electrical circuit board E and the optical waveguide W1. Next, as shown in FIG. 1 (a), the photoelectric hybrid substrate assembly sheet (optical waveguide aggregate sheet) S is configured to connect a plurality of the photoelectric hybrid substrates A1 (a plurality of the optical waveguides W1) with the optical waveguide W. The longitudinal direction of the core portion 7 is a belt-shaped one which is juxtaposed with an interval therebetween.

In a more detailed description, the electrical circuit board E is configured such that electrical wiring (not shown) and a component mounting pad 2 are formed on the first surface of the transparent insulating layer 1. The insulating layer 1 is formed on the first surface (the side opposite to the optical waveguide W) of the metal surface M.

The linear core portion 7 for the optical path of the optical waveguide W1 is configured to be held by the first cladding layer 6 and the second cladding layer 8. Next, the first end portion of the optical waveguide W corresponding to the element mounting pad 2 of the electrical circuit board E is formed as an inclined surface inclined at an angle of 45 ° with respect to the longitudinal direction of the core portion 7, and the core portion located on the inclined surface. Seven portions become the light reflecting surface 7a. The second end portion of the optical waveguide W1 (the end portion on the side opposite to the light reflecting surface 7a) is formed as a right-angled surface at a right angle to the longitudinal direction of the core portion 7, and the portion of the core portion 7 located on the right-angled surface becomes the optical fiber F (see The connecting surface 7c connecting the end faces of the core 9 in FIG. 2). The first cladding layer 6 is formed on the second surface (the side opposite to the electrical circuit board E) of the metal layer M.

Next, after the inspection of the optical waveguide W1, the photoelectric hybrid substrates A including the optical waveguides W that passed the inspection are cut out from the photoelectric hybrid substrate assembly sheet S one by one. Next, as shown in FIG. 2, the photoelectric hybrid substrate A is connected to both ends of the optical fiber F and used. The optical waveguide W1 before inspection and the optical waveguide W after inspection have the same configuration. The photoelectric hybrid substrate A1 including the optical waveguide W1 before inspection has the same configuration as the photoelectric hybrid substrate A including the optical waveguide W after inspection. Next, the light-emitting element 11 is mounted on the element mounting pad 2 of the photoelectric hybrid substrate A at the first end portion (the left end portion in FIG. 2), and the photovoltaic device at the second end portion (the right end portion in FIG. 2) The light receiving element 12 is mounted on the element mounting pad 2 of the hybrid substrate A. In this way, a photoelectric hybrid module is formed by the photoelectric hybrid substrate A, the optical fiber F, the light-emitting element 11, and the light-receiving element 12 and mounted on an electronic device or the like.

The light propagation of the aforementioned photoelectric hybrid module is performed as follows. That is, the light ray L emitted from the light-emitting element 11 of the photoelectric hybrid substrate A mounted on the first end portion (the left end portion in FIG. 2) is emitted from the core portion 7 of the photoelectric hybrid substrate A in accordance with the core portion of the optical fiber F described above. 9. The core portion 7 of the photoelectric hybrid substrate A at the second end portion (the right end portion in FIG. 2) is sequentially transmitted, and light is received by the light receiving element 12.

In this way, in the photoelectric hybrid substrate A at each end portion, the light propagation performance of the core portion 7 is important. Therefore, in this embodiment, as shown in the following description, in the manufacturing step of the photoelectric hybrid substrate A, the light propagation performance of the core portion 7 of the optical waveguide W1 [see FIG. 1 (b)] is checked.

That is, for the production of the optoelectronic hybrid substrate A having the aforementioned inspection step, first, a strip-shaped aforementioned optoelectronic hybrid substrate assembly sheet S is prepared by juxtaposing the optoelectronic hybrid substrate A1 before inspection. The production of each photoelectric hybrid substrate A1 of the photoelectric hybrid substrate assembly sheet S is performed as follows.

[Formation of the electric circuit substrate E of the photoelectric hybrid substrate A1] First, a strip-shaped metal sheet Ma for forming the metal layer M is prepared [see FIG. 3 (a)]. The material for forming the metal sheet Ma is, for example, stainless steel, iron and nickel alloy (containing 42% by weight of nickel), and the like, and stainless steel is preferred from the viewpoint of dimensional accuracy and the like. The thickness of the aforementioned metal sheet Ma (metal layer M) is set in a range of, for example, 10 to 100 μm.

Next, as shown in FIG. 3 (a), a photosensitive insulating resin is coated on the first surface of the metal sheet Ma, and an insulating layer 1 having a specific pattern is formed by a photolithography method. Examples of the material for forming the insulating layer 1 include synthetic resins such as polyimide, polyethernitrile, polyetherfluorene, polyethylene terephthalate, polyethylene naphthalate, and polyvinyl chloride. Polysiloxane-based sol-gel materials. The thickness of the aforementioned insulating layer 1 is set in a range of, for example, 10 to 100 μm.

Next, as shown in FIG. 3 (b), the aforementioned electrical wiring (not shown) and the component mounting pad 2 are formed by, for example, a semi-additive method, a subtractive method, or the like. In this way, the electrical circuit board E is formed on the first surface of the metal sheet Ma.

[Formation of the metal layer M of the photoelectric hybrid substrate A1] Then, as shown in FIG. 3 (c), the metal sheet Ma is subjected to etching or the like, and unnecessary portions of the metal sheet Ma are removed and then shaped, The aforementioned metal sheet Ma is formed as a metal layer M.

[Formation of Optical Waveguide W of Photoelectric Hybrid Substrate A1] Next, in order to form an optical waveguide W1 on the second surface (the side opposite to the electrical circuit substrate E) of the laminated body of the electrical circuit substrate E and the metal layer M [see FIG. 1 (b)], first, as shown in FIG. 4 (a), a material for forming the first cladding layer 6, that is, a photosensitive resin, is coated on the second surface (the lower surface in the figure) of the laminated body. Then, this coating layer is exposed and hardened by irradiation, and is formed into the 1st cladding layer 6. The thickness of the first cladding layer 6 (thickness from the second surface of the metal layer M) is set within a range of, for example, 5 to 80 μm. In the formation of the optical waveguide W (the formation of the first cladding layer 6, the core portion 7 described below, and the formation of the second cladding layer 8 below), the second surface of the laminated body faces upward.

Next, as shown in FIG. 4 (b), a core portion 7 having a specific pattern is formed on the first surface (the bottom surface in the figure) of the first cladding layer 6 by a photolithography method. The size of the aforementioned core portion 7 is set, for example, in a range of 5 to 200 μm in width and in a range of 5 to 200 μm in thickness. As a material for forming the core portion 7, for example, the same photosensitive resin as the first cladding layer 6 is used, and the first cladding layer 6 having a refractive index higher than that of the first cladding layer 6 and the following second cladding layer 8 are used [see FIG. 4 (c)].

Next, as shown in FIG. 4 (c), a second coating is formed on the first surface (the lower surface in the figure) of the first coating layer 6 by a photolithography method so as to cover the core portion 7. Layer 8. The thickness [thickness from the top surface (lower in the figure) of the core portion 7] of the second cladding layer 8 is set in a range of, for example, 3 to 50 μm. The material for forming the second cladding layer 8 is, for example, the same photosensitive resin as the first cladding layer 6.

After that, as shown in FIG. 4 (d), the core portion 7 corresponding to the component mounting pad 2 of the electrical circuit board E (located below in the figure) (for example, by excimer laser processing) ( The first end portion) together with the first cladding layer 6 and the second cladding layer 8 is formed as an inclined surface inclined at an angle of 45 ° with respect to the longitudinal direction of the core portion 7. The portions of the core 7 located on the inclined surfaces become light reflecting surfaces 7a. The second end portion (the end portion on the opposite side to the light reflecting surface 7a) of the core portion 7 is formed as a surface perpendicular to the longitudinal direction of the core portion 7 and is configured as the core portion 9 of the optical fiber F (see FIG. 1). ) End face connection surface 7c. In this way, the optical waveguide W1 before inspection is obtained, and at the same time, the aforementioned photoelectric hybrid substrate assembly sheet S in which a plurality of photoelectric hybrid substrates A1 provided with the optical waveguide W1 are juxtaposed is obtained [see FIG. 1 (a), (b)].

<Inspection method of optical waveguide W1> Next, as shown next, the light propagation performance of the core part 7 of the optical waveguide W1 was examined. This inspection method is a method of detecting the position of the light emitting portion before imaging the light emitted after propagating through the core portion 7 with an imaging element. This inspection method is the first feature of the present invention.

That is, in the present embodiment, the inspection method is shown in FIG. 5. First, the belt-shaped photoelectric hybrid substrate assembly sheet S is adsorbed on an upper surface of a getter belt (not shown), and the photoelectric hybrid is directed toward the photoelectric mixture. The substrate assembly sheet S moves in the longitudinal direction (the direction of the arrow shown in FIG. 5). Next, a laser displacement meter (position detector) 30 is provided on the moving upstream side, and a light source 10 such as an LED (light emitting diode) that emits uniform light is provided on the downstream side; and a CCD (charge coupled device) image sensor Camera 20 of an imaging element such as a sensor, a CMOS (Complementary Metal Oxide Semiconductor) image sensor. In addition, in FIG. 5, for easy understanding of the inspection method, a part of the configuration of the photoelectric hybrid substrate assembly sheet S is simplified or omitted.

In a more detailed description, the laser displacement meter 30 is a transmission type including a light emitting body 31 that emits laser light 30a in a flat shape and a light receiving body 32 that receives the emitted laser light 30a. The light emitting portion of the substrate assembly sheet S is arranged such that one end edge portion of the connection surface 7c is located between the light emitting body 31 and the light receiving body 32, and the light emitting body 31 and the light receiving body 32 are arranged.

The light source 10 is disposed above the portion E of the electrical circuit board corresponding to the light reflection surface 7 a of the first end portion of the core portion 7, and emits light from the light source 10 toward the light reflection surface 7 a of the first end portion of the core portion 7. L. Thereby, in the optical waveguide W1 [see FIG. 1 (b)], the light L is made from the first surface portion (the light incident portion of the optical waveguide W1) of the first cladding layer 6 corresponding to the light reflecting surface 7a. After being incident, the light is reflected by the light reflecting surface 7a and is emitted from the connection surface 7c (the light emitting portion of the optical waveguide W1) at the second end portion of the core portion 7 (see FIG. 2).

The camera 20 is provided in a state facing the connection surface 7c of the second end portion of the core portion 7, and is configured to be able to capture the light L emitted from the connection surface 7c by the imaging element. The camera 20 is fixed to a camera moving unit (not shown) that can move in three dimensions, and is configured to move the camera 20 by operating the camera moving unit.

In such a state, by passing one end edge portion of the light emitting portion (connecting surface 7c) of the photoelectric hybrid substrate assembly sheet S between the emitting body 31 and the receiving body 32 of the laser displacement meter 30, A part of the laser light 30a emitted from the emitting body 31 in a planar shape is shielded by the side edge of the photoelectric hybrid substrate assembly sheet S, and the remaining unshielded laser light 30a is shielded by the light receiving body 32. By light. Based on the change in the shielding state of the laser light 30a, the position of the light emitting portion (connecting surface 7c) of the photoelectric hybrid substrate assembly sheet S can be detected in accordance with the parallel order of the photoelectric hybrid substrate A1. In this way, the position of the light emitting portion is used to change the shielding state of the laser light 30a. In the step of forming the photoelectric hybrid substrate A1, a portion of the photoelectric hybrid substrate A1 corresponding to the light emitting portion is formed as a collection from the photoelectric hybrid substrate. The side edge portion of the sheet S is in a protruding state or formed in a concave state.

Next, based on the detected position information of the light emitting portion (connecting surface 7c), the camera 20 is moved to a position where the focus of the imaging element is aligned with the light emitting portion (connecting surface 7c) based on the movement of the camera moving body. , Positioning the aforementioned camera 20. For this reason, after the imaging element captures the emitted light L from the light emitting portion (connecting surface 7c), it is not necessary to align the collection point of the imaging element with the light emitting portion (the second end portion of the core portion 7). That is, in this embodiment, a step of focus alignment that takes a long time is not required.

Shorten the time required to detect the positioning of the camera 20 from the position of the light emitting part (connecting surface 7c) of the laser displacement meter 30, for example, for the 25 photoelectric hybrid substrates A1 in the photoelectric hybrid substrate assembly sheet S, 10 Degree of time in seconds. As described earlier, in the conventional inspection method in which focus alignment is necessary, it takes about 280 seconds under the same conditions.

In addition, while positioning the camera 20, the imaging element of the camera 20 is used to capture the light L emitted from the light emitting section (connecting surface 7c) in the parallel order of the photoelectric hybrid substrate A1. Next, by analyzing the captured image of the emitted light L, the light propagation loss value of the core portion 7 is calculated. In this way, the optical waveguide W1 is inspected in the parallel order by inspecting the light propagation performance of the core 7. Next, if the calculated light propagation loss value is smaller than a preset reference value, the light propagation performance of the core portion 7 is considered to be excellent, and it becomes a qualified product in the aforementioned inspection.

In this way, the optical waveguide W is formed after the step of inspecting the light propagation performance of the core portion 7 described above. Next, at the same time, a photovoltaic hybrid substrate assembly sheet S in which a plurality of photovoltaic hybrid substrates A are juxtaposed is obtained. Next, as described above, in the inspection of the light propagation performance of the core portion 7 in the step of forming the optical waveguide W, since the position of the light emitting portion is detected before the shooting of the emitted light, the time required for the inspection can be shortened. Therefore, the productivity of the optical waveguide W can be improved, and the productivity of the photoelectric hybrid substrate assembly sheet S can be further improved.

In this way, in the step of forming the optical waveguide W, a step of designing and inspecting the light propagation performance of the core portion 7 is designed, and the light propagation performance of the core portion 7 is suitable for practical use. The second feature.

[Production of the photoelectric hybrid module] After that, the photoelectric hybrid substrate A provided with the optical waveguide W of the qualified product inspected above is cut out one by one from the aforementioned photoelectric hybrid substrate assembly sheet S, as shown in FIG. 2 The connection surface 7c of the core portion 7 of the substrate A is connected to both ends of the core portion 9 of the optical fiber F through a connector (not shown) or the like. The light emitting element 11 is mounted on the element mounting pad 2 of the photoelectric hybrid substrate A at the first end portion of the optical fiber F, and the light receiving element 12 is mounted on the element mounting pad 2 of the photoelectric hybrid substrate A at the second end portion. In this way, the aforementioned photoelectric hybrid module is obtained.

Fig. 6 is an explanatory diagram showing a second embodiment of the optical waveguide inspection method of the present invention. The inspection method of this embodiment is the one in which the light source 10 and the camera 20 are arranged opposite to the inspection method of the first embodiment shown in FIG. 5. That is, the light source 10 is provided in a state facing the connection surface 7c of the second end portion of the core portion 7, and the camera 20 is provided on the electrical circuit board E corresponding to the light reflection surface 7a of the first end portion of the core portion 7. Section above. Next, the light L from the light source 10 enters the core 7 from the connection surface 7c of the core 7 and is reflected by the light reflecting surface 7a, and then passes through the first cladding layer 6 and the insulating layer 1 in the order of The camera 20 shoots out. In this way, in this embodiment, the light incident portion of the optical waveguide W1 is the connection surface 7c of the core portion 7, and the light emitting portion of the optical waveguide W1 [see FIG. 1 (b)] corresponds to the light reflecting surface 7a. The first surface portion of the first cladding layer 6. For this reason, as the laser displacement meter 30 that detects the position of the light reflecting portion, a reflection type in which the emitting body and the light receiving body are integrally formed is used. The other parts are the same as the first embodiment shown in FIG. 5 and the same parts are given the same reference numerals.

In this second embodiment, the position of the light emitting portion is detected by disposing the reflective laser displacement meter 30 above the first surface of the photoelectric hybrid substrate A1. Next, laser light 30b is emitted from the laser displacement meter 30 toward the first surface of the photoelectric hybrid substrate A1, and the laser light 30c reflected by the photoelectric hybrid substrate A1 is used to receive light using the laser displacement meter 30. At this time, since the light emitting portion is located at a low position held by the two component mounting pads 2, the reflection state of the laser light 30 c is changed in the light emitting portion, so that the light emitting portion can be detected.

Next, in this second embodiment, the propagation direction of the light ray L is opposite to that of the first embodiment described above, and the light propagation performance of the core portion 7 of the optical waveguide W1 can be checked. Next, as in the first embodiment, the time required for the inspection can be shortened, and the productivity of the optical waveguide W and the photoelectric hybrid substrate assembly sheet S can be improved.

7 is a cross-sectional view showing a photoelectric hybrid substrate provided with an optical waveguide to be inspected according to a third embodiment of the optical waveguide inspection method of the present invention [a cross-sectional view corresponding to FIG. 1 (b)]. The photoelectric hybrid substrate B1 before the inspection of this embodiment forms element mounting pads 2 at both ends of one electrical circuit substrate E, and is formed at both ends of the core portion 7 of the optical waveguide W2 laminated on the electrical circuit substrate E. Light reflecting surface 7a. The optical waveguide W2 before inspection has the same configuration as the optical waveguide W after inspection. The photoelectric hybrid substrate B1 provided with the optical waveguide W2 before inspection has the same configuration as the photoelectric hybrid substrate B provided with the optical waveguide W after inspection. Next, the inspected photoelectric hybrid substrate B is one which does not pass through the optical fiber F (see FIG. 2). The other parts are the same as those of the photoelectric hybrid substrate A1 of the aforementioned first embodiment shown in FIG. 1 (b), and the same parts are given the same reference numerals.

The light of the photoelectric hybrid substrate B is transmitted so that the light L from the first surface of the first end portion passes through the insulating layer 1 and the first cladding layer 6 in order, and then the light reflection surface of the first end portion of the core portion 7 is used. 7a reflects and propagates into the core portion 7. After that, it is reflected by the light reflecting surface 7a of the second end portion of the core portion 7, passes through the first cladding layer 6 and the insulating layer 1 in this order, and is emitted from the first surface of the second end portion. That is, the light-incoming part and the light-exiting part of the optical waveguide W2 are both the first surface portions of the first cladding layer 6 corresponding to the light reflecting surface 7a.

For this reason, the inspection method of the optical waveguide W2 in the third embodiment is shown in FIG. 8. As the laser displacement meter 30 for detecting the position of the light emitting portion, the same is used as in the second embodiment (see FIG. 6). Reflector with integrated light receiver. Both the light source 10 and the camera 20 are provided above the photoelectric hybrid substrate B1. Next, similar to the first and second embodiments described above, the light propagation performance of the core portion 7 of the optical waveguide W2 can be checked.

This third embodiment is also the same. As in the first and second embodiments described above, the time required for the upper inspection can be shortened, and the productivity of the optical waveguide W and the photoelectric hybrid substrate assembly sheet S can be improved.

Fig. 9 is an explanatory view showing a fourth embodiment of the optical waveguide inspection method of the present invention. The photoelectric hybrid substrate assembly sheet S of the inspection method of this embodiment is formed by arranging two parallel arrays of a plurality of photoelectric hybrid substrates A1 juxtaposed as shown in FIG. 1 (a). However, in these two rows, the light emitting portions (connecting surface 7c) are formed on the side edge of the photoelectric hybrid substrate assembly sheet S. Then, the aforementioned two columns can be checked simultaneously. The inspection of each column can be performed in the same manner as the first embodiment shown in FIG. 5. The other parts are the same as the first embodiment shown in FIG. 5 and the same parts are given the same reference numerals.

In this fourth embodiment, since the number of optical waveguides W1 that can be inspected simultaneously is doubled, further inspections can be made more efficient, and the production of the optical waveguides W and the photoelectric hybrid substrate assembly sheet S can be further improved. Sex.

In this fourth embodiment, although the two rows are subjected to the same inspection as the first embodiment shown in FIG. 5, the light source 10 and the camera 20 are arranged opposite to one of the two rows. It is also possible to perform the same inspection as the second embodiment shown in FIG. 6. It should be noted that the same inspection may be performed in both rows for the second embodiment shown in FIG. 6.

Moreover, in this fourth embodiment, if the photoelectric hybrid substrate A1 is as shown in FIG. 7, when the position of the light entrance portion and the position of the light exit portion are both on the first surface of the photoelectric hybrid substrate B1, the parallel The array of the plurality of photoelectric hybrid substrates B1 is arranged in parallel to two or three or more. For this reason, the number of optical waveguides that can be inspected at the same time can be increased, and inspection can be planned to be more efficient. Then, the productivity of the optical waveguide W and the photoelectric hybrid substrate assembly sheet S can be further improved.

In each of the foregoing embodiments, during the inspection of the light propagation performance of the core 7, the light is propagated toward the core 7 only in one direction. However, after that, the light source 10 and the camera 20 are arranged opposite to each other, and the direction is opposite to the above. It is also possible to inspect by transmitting light. In this way, the inspection accuracy can be improved because two inspections are performed on one optical waveguide.

In each of the foregoing embodiments, the inspection is performed using the photoelectric hybrid substrate assembly sheet S in which a plurality of photoelectric hybrid substrates A1 and B1 are juxtaposed, but the inspection may be performed while the photoelectric hybrid substrates A1 and B1 are separately moved. .

In each of the foregoing embodiments, the optical waveguides W1 and W2 are inspected in a state where the electrical circuit boards E are laminated, but the inspection may be performed in a state where only the optical waveguides W1 and W2 are formed.

Next, in each of the foregoing embodiments, although a laser displacement meter 30 is used as a detector for detecting the positions of the light emitting portions of the optical waveguides W1 and W2, as long as the position of the light emitting portion can be detected, another detector is used. Yes.

In each of the foregoing embodiments, although the photoelectric hybrid substrate assembly sheet S is moved, the laser displacement meter 30 and the light source 10 and the camera 20 (imaging element) may be moved. Alternatively, the photoelectric hybrid substrate assembly sheet S, the laser displacement meter 30, and the light source 10 and the camera 20 (imaging element) may be moved in mutually opposite directions.

Furthermore, in each of the foregoing embodiments, although the state of the core portion 7 is to check the light propagation performance of the core portion 7, as described above, the size (width) of the core portion 7 is checked based on the captured light emission image analysis. And thickness), the inclination angle of the light reflecting surface 7a, and the state of the core portion 7 (see the aforementioned Patent Documents 1 to 3). At this time, since the position of the light emitting portion is detected by the laser shifter 30 before the shooting of the emitted light from the light emitting portion is the same as in the previous embodiments, the time required for the inspection can be shortened.

Next, examples will be described. However, the present invention is not limited to the examples.

EXAMPLES [Example 1] The first embodiment shown in FIG. 5 was used to check the optical propagation performance of the core portion of the optical waveguide of the photoelectric hybrid substrate assembly sheet. The number of the photovoltaic hybrid substrates juxtaposed in the photovoltaic hybrid substrate assembly sheet was 25. The core of the optical waveguide has a size of 50 μm × 50 μm in cross section and a length of 10 cm. Next, the light emitting portion of the optical waveguide is located at a side edge portion of the photoelectric hybrid substrate assembly sheet. For this reason, as a laser displacement meter for detecting the position of the light emitting portion, a transmission type laser displacement meter (LS-9006M manufactured by KEYENCE CORPORATION) is used.

In addition, as a device for capturing light emitted from the light emitting section, OCT-001 manufactured by SYNERGY OPTOELECTRONICS CO., LTD. Was used. This device includes a light source and a camera including a CCD image sensor (imaging element). The wavelength of light emitted by the light source was 850 nm, the diameter of the uniform light irradiation surface was 4 mm, and NA (number of openings) was 0.57. The CCD image sensor has a magnification of 5 times, a field of view range of 1.28 mm × 0.96 mm, and NA (number of openings) is 0.42.

[Example 2] The second embodiment shown in FIG. 6 was used to check the light propagation performance of the core portion of the optical waveguide of the photoelectric hybrid substrate assembly sheet. The light emitting portion of this optical waveguide is located on the first surface portion of the first cladding layer. For this reason, as the laser displacement meter for detecting the position of the light emitting portion, a reflection type laser displacement meter (LJ-V7020K manufactured by KEYENCE CORPORATION) is used. The other parts are the same as those in the first embodiment.

[Comparative Example 1] In the foregoing Example 1, as shown in a conventional inspection method, a CCD image sensor was used to capture light emitted from a light emitting portion of an optical waveguide, and the light was aligned with the focus of the CCD image sensor. The light is emitted from the waveguide, and imaging is performed. The other parts are the same as those in the first embodiment.

[Comparative Example 2] In the foregoing Example 2, as shown in a conventional inspection method, a CCD image sensor was used to capture light emitted from a light emitting portion of an optical waveguide, and the focus of the CCD image sensor was aligned. After the light exit portion of the optical waveguide, imaging is performed. The other parts are the same as those in the second embodiment.

[Inspection time] For the foregoing Examples 1, 2 and Comparative Examples 1, 2, the time required for inspection of the 25 optical waveguides of the photoelectric hybrid substrate assembly sheet was measured. The results are shown in Table 1 below.

[Table 1]

As can be seen from the results in Table 1 above, compared with Comparative Examples 1 and 2, the inspection time was shorter in Examples 1 and 2.

Moreover, in the foregoing Examples 1 and 2, as the photoelectric hybrid substrate assembly sheet, even when two parallel arrays of parallel photoelectric composite substrates are used (see FIG. 9), the same display can be obtained. The results of the foregoing Examples 1 and 2 are prone. Furthermore, even if the above-mentioned photoelectric hybrid substrate is configured such that the position of the light incident portion and the position of the light exit portion are located on the first surface of the photoelectric hybrid substrate (see FIG. 7), the plurality of photoelectric hybrid substrates are arranged in parallel. The photoelectric hybrid substrate assembly sheet composed of two or three or more parallel lines can also obtain results showing the same tendency as in the first and second embodiments.

Next, in the foregoing Examples 1 and 2, instead of the photoelectric hybrid substrate assembly sheet, even if the inspection was performed while the photoelectric hybrid substrate was moved separately, results showing the same tendency as in the foregoing Examples 1 and 2 were obtained.

Moreover, in the foregoing Examples 1 and 2 and Comparative Examples 1 and 2, although the light propagation performance of the core portion was checked, it was the same as above, and the size (width of the core portion) was checked based on the image analysis of the emitted light captured. And thickness) and the inclination angle of the light reflecting surface can also obtain results showing the same tendency as in the foregoing Examples 1, 2 and Comparative Examples 1, 2.

In the foregoing embodiment, although the specific form of the present invention is shown, the foregoing embodiment is merely a mere illustration, and is not intended to limit the interpreter. Attempts are made to make various modifications understandable to those skilled in the art within the scope of the present invention.

Industrial Applicability The inspection method of the optical waveguide of the present invention and the manufacturing method of the optical waveguide using the same can be used to inspect the state of the core of the optical waveguide (light propagation performance, size, tilt angle of the light reflection surface, etc.) in a short time. Situation.

L‧‧‧light

1‧‧‧ insulation

2‧‧‧ Gaskets for component mounting

6‧‧‧The first coating

7‧‧‧ core

7a‧‧‧light exit surface

7c‧‧‧contact surface

8‧‧‧ 2nd coating

9‧‧‧ core

10‧‧‧ light source

11‧‧‧Light-emitting element

12‧‧‧ light receiving element

20‧‧‧ Camera

30‧‧‧laser displacement meter

30a, 30b, 30c ‧‧‧ laser light

31‧‧‧ projectile

32‧‧‧ light receiver

A, A1, B, B1‧‧‧Photoelectric hybrid substrate

E‧‧‧electric circuit board

F‧‧‧optical fiber

M‧‧‧ metal layer

Ma‧‧‧ Metal Sheet

S‧‧‧Photoelectric hybrid substrate collection sheet

W, W1, W2 ‧‧‧ Optical Waveguide

FIG. 1 (a) is a plan view schematically showing a plurality of photoelectric hybrid substrate assembly sheets in parallel with a plurality of photoelectric hybrid substrates provided with an optical waveguide having an optical waveguide as an inspection object of the first embodiment of the optical waveguide inspection method of the present invention, (b ) Is a sectional view of XX of (a). FIG. 2 is a longitudinal sectional view schematically showing a photovoltaic hybrid module using the aforementioned photovoltaic hybrid substrate. 3 (a) to (b) are explanatory diagrams schematically showing the steps of forming the electrical circuit substrate of the aforementioned photoelectric hybrid substrate, and (c) is an explanatory diagram schematically showing the steps of forming the metal layer of the aforementioned photoelectric hybrid substrate. 4 (a) to 4 (d) are explanatory diagrams schematically showing steps of forming the optical waveguide of the aforementioned photoelectric hybrid substrate. FIG. 5 is an explanatory view schematically showing a first embodiment of the optical waveguide inspection method. Fig. 6 is an explanatory view schematically showing a second embodiment of the optical waveguide inspection method of the present invention. FIG. 7 is a cross-sectional view schematically showing an optoelectronic hybrid substrate provided with an optical waveguide as an inspection target according to a third embodiment of the optical waveguide inspection method of the present invention. FIG. 8 is an explanatory diagram schematically showing a third embodiment of the optical waveguide inspection method. Fig. 9 is an explanatory view schematically showing a fourth embodiment of the optical waveguide inspection method of the present invention.

Claims (5)

An inspection method of an optical waveguide, comprising: an optical waveguide preparation step of preparing an optical waveguide having a light incident portion and a light emitting portion, and including a core for an optical path between the light incident portion and the light emitting portion; In the detecting step, a position detector is used to detect the position of the light emitting portion of the optical waveguide; in the light emitting step, light is incident into the core of the optical waveguide from the light incident portion, and then the light is emitted from the light emitting portion Ejection; a photographing step, positioning an imaging element based on the detected position information of the light emitting portion, and using the imaging element to photograph the emitted light emitted from the light emitting portion; and an inspection step, analyzing the image of the emitted light captured , Check the condition of the aforementioned core. For example, the inspection method of the optical waveguide of claim 1, wherein the optical waveguide is plurally juxtaposed in a direction orthogonal to the longitudinal direction of the core, and the plurality of optical waveguides are used to form a band-shaped optical waveguide aggregate sheet, Each of the aforementioned optical waveguides of the optical waveguide assembly sheet is inspected side by side. In the inspection method of the optical waveguide according to claim 2, wherein the optical waveguide assembly sheet is configured by juxtaposing a plurality of optical waveguides composed of the plurality of optical waveguides juxtaposed in a direction perpendicular to a longitudinal direction of the core, Also check these plural numbers. The inspection method of an optical waveguide according to any one of claims 1 to 3, wherein the position detector that detects the position of the light emitting portion of the optical waveguide is a laser displacement meter. An optical waveguide manufacturing method, comprising: a step of forming a core portion; and an optical waveguide manufacturing method of the step of checking the state of the core portion by the method for inspecting an optical waveguide according to any one of the aforementioned claims 1 to 4, An optical waveguide that conforms to the above-mentioned inspection results is regarded as a qualified product.