WO2019181717A1 - Dispositif de type capteur infrarouge - Google Patents

Dispositif de type capteur infrarouge Download PDF

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Publication number
WO2019181717A1
WO2019181717A1 PCT/JP2019/010491 JP2019010491W WO2019181717A1 WO 2019181717 A1 WO2019181717 A1 WO 2019181717A1 JP 2019010491 W JP2019010491 W JP 2019010491W WO 2019181717 A1 WO2019181717 A1 WO 2019181717A1
Authority
WO
WIPO (PCT)
Prior art keywords
infrared sensor
base member
thermal element
detection
compensation
Prior art date
Application number
PCT/JP2019/010491
Other languages
English (en)
Japanese (ja)
Inventor
平野　晋吾
中村　健治
敬治 白田
Original Assignee
三菱マテリアル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱マテリアル株式会社 filed Critical 三菱マテリアル株式会社
Publication of WO2019181717A1 publication Critical patent/WO2019181717A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors

Definitions

  • the present invention relates to an infrared sensor device that detects infrared rays from a measurement object and measures the temperature and the like of the measurement object.
  • an infrared sensor is used as a temperature sensor that detects the temperature of an object to be measured by detecting infrared rays radiated from the object to be measured in a non-contact manner.
  • an insulating film, a first thermal element and a second thermal element provided on one surface of the insulating film, and a first surface of the insulating film are provided on one surface of the insulating film.
  • An infrared sensor comprising an infrared reflective film provided on the other surface of the film is described.
  • an infrared reflection region is provided by an infrared reflection film, and the other surface of the insulating film is divided into an infrared light receiving region and a reflection region.
  • Patent Document 2 describes an infrared sensor mounting member in which an infrared sensor main body in which a thermal element and a plurality of terminal electrodes are formed on an insulating film can be fixed to the top and mounted on a substrate.
  • the infrared sensor mounting member includes a resin mounting member main body, a plurality of conductive terminal members that are attached to the mounting member main body, the upper end portion is connected to the terminal electrode, and the lower end portion is connected when mounted on the substrate. It has. Further, the infrared sensor mounting member has a recess formed directly under the thermal element.
  • a concave portion is formed immediately below the heat sensitive element, and the distance between the heat sensitive element and the base member directly below is set to be large. The effect is suppressed.
  • the concave portion formed immediately below the thermal element is also reduced, so that the thermal element approaches the base member, and the thermal element is easily affected by the temperature of the base member.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to provide an infrared sensor device that can suppress a temperature change of a thermal element due to thermal radiation from a base member and improve sensitivity and accuracy. To do.
  • the infrared sensor device includes an infrared sensor main body and a base member on which the infrared sensor main body is mounted, and the infrared sensor main body has an insulating property in which an upper surface is disposed on the infrared light receiving side.
  • the base member has a groove in the upper part, and the groove is provided on the other side of the base member from one side of the base member directly below the detection thermal element and directly below the compensation thermal element. Since the air environment is common between the surroundings of the detection thermosensitive element and the compensation thermosensitive element through the groove portion, the heat balance can be obtained between the groove and the groove portion. As a result, the distance between the base member and the infrared sensor main body is increased not only directly below the thermal element but also along the groove portion, and the influence of the heat radiation from the base member on the infrared sensor main body can be reduced.
  • the outside air can be introduced into the two thermal elements through the groove portion penetrating in the lateral direction, and both the thermal elements easily follow the temperature change of the outside air as well. Furthermore, the volume of the base member can be reduced by forming the groove portion, and the heat capacity can be reduced to improve the responsiveness.
  • the base member has an intermediate hole portion formed deeper than the groove portion between the detection heat sensitive element and the compensation heat sensitive element. It is characterized by having. That is, in this infrared sensor device, since the base member has an intermediate hole portion formed deeper than the groove portion between the detection thermal element and the compensation thermal element, the air in the deep intermediate hole portion is formed.
  • the detection thermosensitive element and the compensation thermosensitive element can be easily made thermally independent, so that a temperature difference is easily generated, and the sensitivity can be improved.
  • the volume and heat capacity of the base member can be further reduced by forming the intermediate hole portion, and the responsiveness can be further improved.
  • the intermediate hole portion is a long hole extending across between the detection thermal element and the compensation thermal element.
  • the detection thermal element side of the base member and the compensation thermal element can be separated from each other by a long hole-shaped intermediate hole, and the thermal element for detection and the thermal element for compensation can be more easily thermally separated.
  • the volume and heat capacity of the base member can be further reduced by forming an elongated hole-shaped intermediate hole.
  • the base member has a through-hole penetrating vertically below the detection thermal element and the compensation thermal element.
  • the through holes and the groove portions communicate with each other. That is, in this infrared sensor device, since the base member has a through hole that vertically penetrates directly below the detection thermal element and the compensation thermal element, and the through hole and the groove portion communicate with each other, the through hole
  • the outside air can be introduced from below, and both the thermal elements can more easily follow the temperature change of the outside air.
  • the volume and heat capacity of the base member can be further reduced by forming the through hole.
  • the base member has a groove portion on the upper portion, and the groove portion passes directly below the detection thermal element and directly below the compensation thermal element from one side surface of the base member. Therefore, the influence of the heat radiation from the base member on the infrared sensor main body can be reduced, and the introduction of the outside air can reduce both the temperature change of the outside air.
  • the thermosensitive element is likely to follow as well. Therefore, in the infrared sensor device of the present invention, even if it is downsized, the thermal element is not easily affected by the temperature of the base member, and the sensitivity and accuracy can be improved.
  • FIG. 2 is a sectional view taken along line AA in FIG. 1.
  • FIG. 2 is a sectional view taken along line BB in FIG. In this embodiment, it is a top view which shows a base member. In this embodiment, it is a top view which shows an infrared sensor main body.
  • the infrared sensor device 10 of the present embodiment includes an infrared sensor main body 1 and a base member 11 on which the infrared sensor main body 1 is mounted.
  • the infrared sensor body 1 is provided on an insulating substrate 2 having an upper surface on the infrared light receiving side, a detection thermal element 3A and a compensation thermal element 3B provided on the insulating substrate 2, and an insulating substrate 2.
  • a pair of detection side wirings 4A connected to the detection thermal element 3A and a pair of compensation side wirings 4B connected to the compensation thermal element 3B are provided.
  • the base member 11 has a groove 12d at the top.
  • the groove 12d extends from one side surface of the base member 11 to the other side surface of the base member 11 directly below the detection thermal element 3A and directly below the compensation thermal element 3B. That is, as indicated by the two-dot chain line arrow in FIG. 3, the groove 12d penetrates in the lateral direction and communicates with the space immediately below the detection thermal element 3A and the space immediately below the compensation thermal element 3B. .
  • the base member 11 has an intermediate hole portion 12e formed deeper than the groove portion 12d between the detection thermal element 3A and the compensation thermal element 3B.
  • the intermediate hole 12e is a long hole extending across the detection heat sensitive element 3A and the compensation heat sensitive element 3B. Furthermore, the base member 11 has a through hole 12c that vertically penetrates immediately below the detection thermal element 3A and the compensation thermal element 3B, and the through hole 12c and the groove 12d communicate with each other. That is, the upper ends of the pair of through holes 12c are opened in the middle of the groove 12d.
  • the base member 11 includes an insulating base body 12 formed of resin or the like, and an upper end portion attached to the base body 12 and connected to the terminal electrode 4c by a conductive adhesive such as solder, and a lower end portion when mounted. And a plurality of conductive terminal members 13 connected to each other by a conductive adhesive material such as solder.
  • the base member 11 has a substantially rectangular shape or a substantially square shape in plan view, and includes four terminal members 13.
  • the infrared sensor body 1 includes an infrared shielding portion 5 that is patterned on the upper surface of an insulating substrate 2.
  • One end of the upper surface of the insulating substrate 2 is an infrared light receiving region, and a detection thermal element 3A is arranged to face the light receiving region.
  • the detection thermal element 3A and the compensation thermal element 3B are mounted on the lower surface of the insulating substrate 2.
  • the infrared shielding portion 5 includes a main shielding portion 5a formed on the other end side of the upper surface of the insulating substrate 2 and an outer periphery formed along the outer edge of the insulating substrate 2 and surrounding the light receiving region.
  • the compensation heat sensitive element 3B is arranged to face the main shielding part 5a. In FIGS. 1 and 5, the infrared shielding part 5 is hatched.
  • the detection-side wiring 4A and the compensation-side wiring 4B are connected to a pair of adhesive electrodes 4a formed on the insulating substrate 2 at one end and formed on the insulating substrate 2 at the other end, respectively.
  • the connected terminal electrode 4c is connected.
  • the detection-side wiring 4A and the compensation-side wiring 4B each have a connection wiring portion 4b that extends by connecting the adhesive electrode 4a and the terminal electrode 4c.
  • the two pairs of terminal electrodes 4 c are arranged near the four corners of the insulating substrate 2. Note that the terminal portions of the corresponding detection thermal element 3A and compensation thermal element 3B are bonded to the adhesive electrode 4a with a conductive adhesive such as solder.
  • the insulating substrate 2 is formed of an insulating film such as a polyimide resin sheet in a substantially rectangular shape or a substantially square shape, and the infrared shielding portion 5, the detection side wiring 4A and the compensation side wiring 4B are formed of copper foil. That is, these are produced by a double-sided flexible substrate in which a copper foil float electrode used as an infrared shielding portion 5, a detection side wiring 4A and a compensation side wiring 4B is patterned on both surfaces of a polyimide substrate used as an insulating substrate 2. It has been done.
  • the infrared shielding part 5 is an infrared reflecting film formed of a material having an infrared reflectance higher than that of the insulating substrate 2, and in this embodiment, a pattern is formed by applying a gold plating film on a copper foil.
  • a gold plating film for example, a mirror-deposited aluminum vapor deposition film or an aluminum foil may be used.
  • the detection thermal element 3A and the compensation thermal element 3B are chip thermistors in which terminal portions are formed at both ends.
  • this thermistor there are thermistors of NTC type, PTC type, CTR type, etc.
  • NTC type thermistor is adopted as the detection thermal element 3A and the compensation thermal element 3B.
  • This thermistor is made of a thermistor material such as a Mn—Co—Cu-based material or a Mn—Co—Fe-based material.
  • the terminal member 13 is made of a material such as a metal having a higher thermal conductivity than the base body 12 and has a terminal pin portion 13a protruding sideways.
  • the base body 12 has a terminal member hole 12a formed on the side and into which the terminal pin portion 13a is inserted and fixed.
  • the terminal pin part 13a which protruded long is fixed by being inserted and fitted in the hole 12a for terminal members having a long hole shape.
  • the base body 12 has a thin plate-like block shape formed in a substantially rectangular shape or a substantially square shape in plan view, and the four terminal members 13 are fitted in the vicinity of the four corner portions, and are opposed to each other.
  • Two terminal members 13 are arranged on each of the two. That is, two portions for supporting the infrared sensor body 1 are provided on both sides of the base body 12 so as to be spaced apart from each other, and the infrared sensor body 1 is supported and fixed at a total of four locations.
  • the infrared sensor body 1 is supported with a gap between the base body 12 and the infrared sensor body 1. That is, the upper part of the terminal member 13 protrudes from the upper surface of the base body 12 by a certain amount, and the infrared sensor body 1 connected to the upper end portion by a conductive adhesive such as soldering is floated from the base body 12. Support in the state.
  • the terminal member 13 has a terminal slit portion 13b extending under the terminal pin portion 13a in the direction opposite to the protruding direction of the terminal pin portion 13a, and the base body 12 has a terminal insertion portion inserted into the terminal slit portion 13b. 12b.
  • the upper end portion and the lower end portion of the terminal member 13 are flat portions for soldering.
  • the terminal member 13 has a plate shape formed from a metal plate by die cutting, etching, or laser processing.
  • the base member 11 has the groove portion 12d at the upper portion, and the groove portion 12d is directly below the detection thermal element 3A and the compensation thermal element from one side surface of the base member 11. Since it extends through to the other side surface of the base member 11 via the portion immediately below 3B, the air environment around the detection thermal element 3A and the compensation thermal element 3B is provided via the groove 12d.
  • the heat balance can be achieved between the base member 11 and the infrared sensor body 1 along the groove 12d as well as directly below the thermal elements 3A and 3B. The influence on the infrared sensor main body 1 by the heat radiation from the member 11 can be reduced.
  • the outside air can be introduced into both the thermal elements 3A and 3B through the grooves 12d penetrating in the lateral direction, and both the thermal elements 3A and 3B can easily follow the temperature change of the outside air as well.
  • the volume of the base member 11 can be reduced by forming the groove 12d, and the heat capacity can be reduced to improve the responsiveness.
  • the base member 11 has the intermediate hole part 12e formed deeper than the groove part 12d between the detection thermal element 3A and the compensation thermal element 3B, the air layer in the deep intermediate hole part 12e.
  • the thermal element 3A for detection and the thermal element 3B for compensation are easily made thermally independent by utilizing the heat insulating property, and a temperature difference is easily added, and the sensitivity can be improved.
  • the volume and heat capacity of the base member 11 can be further reduced by forming the intermediate hole 12e, and the responsiveness can be further improved.
  • the intermediate hole portion 12e is a long hole extending across the detection thermal element 3A and the compensation thermal element 3B, the detection thermal element 3A side and the compensation thermal element 3B of the base member 11 are provided. Can be separated by an elongated hole-shaped intermediate hole portion 12e, making it easier to make the detection thermal element 3A and the compensation thermal element 3B more thermally independent. Furthermore, the volume and heat capacity of the base member 11 can be further reduced by forming the elongated hole-shaped intermediate hole portion 12e.
  • the base member 11 has through holes 12c that vertically penetrate directly below the detection thermal element 3A and the compensation thermal element 3B, and the through hole 12c and the groove 12d communicate with each other, the through hole The outside air can be introduced from below by 12c, and the two thermal elements 3A and 3B can follow the temperature change of the outside air more easily. Furthermore, the volume and heat capacity of the base member 11 can be further reduced by forming the through hole 12c.
  • a heat sensitive element of a chip thermistor is employed, but a heat sensitive element formed of a thin film thermistor may be employed.
  • a thermal element a thin film thermistor or a chip thermistor is used as described above, but a pyroelectric element or the like can be used in addition to the thermistor.
  • SYMBOLS 1 Infrared sensor main body, 2 ... Insulating board, 3A ... Detection thermal element, 3B ... Compensation thermal element, 4A ... Detection side wiring, 4B ... Compensation side wiring, 5 ... Infrared shielding part, 10 ... Infrared sensor apparatus, DESCRIPTION OF SYMBOLS 11 ... Base member, 12c ... Through-hole, 12d ... Groove part, 12e ... Intermediate hole part

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)

Abstract

L'invention concerne un dispositif de type capteur infrarouge grâce auquel la variation de température d'un élément sensible à la chaleur due à un rayonnement thermique provenant d'un élément de base peut être supprimée, et grâce auquel la sensibilité et la précision peuvent être améliorées. Le dispositif de type capteur infrarouge selon la présente invention est pourvu d'un corps de capteur infrarouge (1) et d'un élément de base (11) dans lequel le corps de capteur infrarouge est monté sur une partie supérieure de celui-ci, le corps de capteur infrarouge étant pourvu d'un substrat isolant (2), d'un élément sensible à la chaleur de détection (3A) et d'un élément sensible à la chaleur de compensation (3B) disposés sur le substrat isolant, d'une paire de câblages côté détection disposés sur le substrat isolant et connectés à l'élément sensible à la chaleur de détection et d'une paire de câblages côté compensation connectés à l'élément sensible à la chaleur de compensation, l'élément de base ayant une partie rainure (12d) dans sa partie supérieure et la partie de rainure pénétrant à travers l'élément de base et s'étendant d'une surface latérale de l'élément de base à l'autre surface latérale de l'élément de base et passant directement en dessous de l'élément sensible à la chaleur de détection et directement en dessous de l'élément sensible à la chaleur de compensation.
PCT/JP2019/010491 2018-03-23 2019-03-14 Dispositif de type capteur infrarouge WO2019181717A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-056652 2018-03-23
JP2018056652A JP2019168347A (ja) 2018-03-23 2018-03-23 赤外線センサ装置

Publications (1)

Publication Number Publication Date
WO2019181717A1 true WO2019181717A1 (fr) 2019-09-26

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PCT/JP2019/010491 WO2019181717A1 (fr) 2018-03-23 2019-03-14 Dispositif de type capteur infrarouge

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WO (1) WO2019181717A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19525071A1 (de) * 1995-07-10 1997-01-16 Siemens Ag Pyroelektrisches Bauelement und Verfahren zur Herstellung
JPH11118596A (ja) * 1997-08-14 1999-04-30 Heimann Optoelectron Gmbh センサシステムとその製法および自己試験方法
US20170016762A1 (en) * 2015-07-17 2017-01-19 Melexis Technologies Nv Infrared sensing devices and methods

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19525071A1 (de) * 1995-07-10 1997-01-16 Siemens Ag Pyroelektrisches Bauelement und Verfahren zur Herstellung
JPH11118596A (ja) * 1997-08-14 1999-04-30 Heimann Optoelectron Gmbh センサシステムとその製法および自己試験方法
US20170016762A1 (en) * 2015-07-17 2017-01-19 Melexis Technologies Nv Infrared sensing devices and methods

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Publication number Publication date
JP2019168347A (ja) 2019-10-03

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