WO2019174382A1 - 激光投射模组、深度相机和电子装置 - Google Patents

激光投射模组、深度相机和电子装置 Download PDF

Info

Publication number
WO2019174382A1
WO2019174382A1 PCT/CN2019/070769 CN2019070769W WO2019174382A1 WO 2019174382 A1 WO2019174382 A1 WO 2019174382A1 CN 2019070769 W CN2019070769 W CN 2019070769W WO 2019174382 A1 WO2019174382 A1 WO 2019174382A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
substrate
projection module
laser emitter
emitter
Prior art date
Application number
PCT/CN2019/070769
Other languages
English (en)
French (fr)
Inventor
张学勇
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019174382A1 publication Critical patent/WO2019174382A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0085—Modulating the output, i.e. the laser beam is modulated outside the laser cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/08004—Construction or shape of optical resonators or components thereof incorporating a dispersive element, e.g. a prism for wavelength selection
    • H01S3/08009—Construction or shape of optical resonators or components thereof incorporating a dispersive element, e.g. a prism for wavelength selection using a diffraction grating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/1028—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation by controlling the temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00—Details of colour television systems
    • H04N9/12—Picture reproducers
    • H04N9/31—Projection devices for colour picture display, e.g. using electronic spatial light modulators [ESLM]
    • H04N9/3141—Constructional details thereof
    • H04N9/315—Modulator illumination systems
    • H04N9/3161—Modulator illumination systems using laser light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

Definitions

  • the present application relates to the field of imaging technologies, and in particular, to a laser projection module, a depth camera, and an electronic device.
  • the laser emitter will heat up when it is working. If the laser emitter is too hot, the temperature drift of the laser emitter will be too large, which will affect the performance of the laser emitter.
  • Embodiments of the present application provide a laser projection module, a depth camera, and an electronic device.
  • the laser projection module of the embodiment of the present application includes a laser emitter, a collimating element, a diffractive optical element, and a temperature detecting element.
  • the laser emitter is used to emit a laser.
  • the collimating element is used to collimate the laser.
  • the diffractive optical element is for diffracting laser light that is collimated by the collimating element to form a laser pattern.
  • the temperature detecting element is configured to detect a temperature of the laser emitter and output a temperature detection signal.
  • the depth camera of the embodiment of the present application includes a laser projection module, an image collector, and a processor.
  • the laser projection module includes a laser emitter, a collimating element, a diffractive optical element, and a temperature detecting element.
  • the laser emitter is used to emit a laser.
  • the collimating element is used to collimate the laser.
  • the diffractive optical element is for diffracting laser light that is collimated by the collimating element to form a laser pattern.
  • the temperature detecting element is configured to detect a temperature of the laser emitter and output a temperature detection signal.
  • the image collector is configured to collect a laser pattern projected by the laser projection module into a target space.
  • the processor is coupled to the temperature detecting component, the processor configured to adjust a transmit power of the laser emitter according to the temperature detection signal, and to process the laser pattern to obtain a depth image.
  • the electronic device of the embodiment of the present application includes a housing and a depth camera.
  • the depth camera is disposed within the housing and exposed from the housing to capture a depth image.
  • the depth camera includes a laser projection module, an image collector, and a processor.
  • the laser projection module includes a laser emitter, a collimating element, a diffractive optical element, and a temperature detecting element.
  • the laser emitter is used to emit a laser.
  • the collimating element is used to collimate the laser.
  • the diffractive optical element is for diffracting laser light that is collimated by the collimating element to form a laser pattern.
  • the temperature detecting element is configured to detect a temperature of the laser emitter and output a temperature detection signal.
  • the image collector is configured to capture a laser pattern projected by the laser projection module into a target space.
  • the processor is coupled to the temperature detecting component, the processor configured to adjust a transmit power of the laser emitter according to the temperature detection signal, and to process the laser pattern to obtain a depth image.
  • FIG. 1 to FIG. 4 are schematic diagrams showing the structure of a laser projection module according to some embodiments of the present application.
  • 5 to 7 are partial structural views of a laser projection module according to some embodiments of the present application.
  • FIG. 8 is a schematic structural diagram of a depth camera according to some embodiments of the present application.
  • FIG. 9 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present application, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise specifically defined and defined. Connected, or integrally connected; may be mechanically connected, or may be electrically connected or may communicate with each other; may be directly connected or indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, or may be electrically connected or may communicate with each other; may be directly connected or indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the present application provides a laser projection module 100 .
  • the laser projection module 100 includes a laser emitter 10, a collimating element 20, a diffractive optical element 30, and a temperature detecting element 50.
  • the laser emitter 10 is used to emit laser light.
  • the collimating element 20 is used to collimate the laser.
  • the diffractive optical element 30 is for diffracting the laser light collimated by the collimating element 20 to form a laser pattern.
  • the temperature detecting element 50 is for detecting the temperature of the laser emitter 10 and outputting a temperature detecting signal.
  • the laser projection module 100 further includes a substrate assembly 60 .
  • the substrate assembly 60 includes a substrate 62 and a circuit board 61 carried on the substrate 62.
  • the laser emitter 10 is carried on the substrate assembly 60.
  • the circuit board 61 is provided with a via 611.
  • the laser emitter 10 and the temperature detecting element 50 are both carried on the substrate 62 and are housed in the via 611.
  • the circuit board 61 is provided with a via 611.
  • the laser emitter 10 is carried on the substrate 62 and housed in the via 611.
  • the substrate 62 is provided with a through hole 621, and the position of the through hole 621 is opposite to a position where the laser emitter 10 is carried on the substrate 62.
  • the temperature detecting element 50 is housed in the through hole 621.
  • the laser emitter 10 is an edge emitting laser.
  • the edge-emitting laser 10 includes a light-emitting surface 11 that faces the collimating element 20.
  • the laser projection module 100 further includes a fixture.
  • a fixture is used to secure the edge emitting laser to the substrate assembly 60.
  • the fixture includes a sealant 15 disposed between the edge emitting laser and the circuit board 62.
  • the sealant 15 is a thermal conductive adhesive.
  • the fixture includes at least two resilient supports 16 disposed on the substrate assembly 60, the at least two supports 16 collectively forming a receiving space.
  • the accommodating space is for accommodating the laser emitter 10.
  • At least two supports 16 are used to support the laser emitter 10.
  • the present application also provides a depth camera 1000.
  • the depth camera 1000 includes the laser projection module 100, the image collector 200, and the processor 80 according to any of the above embodiments.
  • the image collector 200 is configured to capture a laser pattern projected by the laser projection module 100 into the target space.
  • the processor 80 is coupled to the temperature detecting element 50.
  • the processor 80 is configured to adjust the transmit power of the laser emitter 10 based on the temperature detection signal, and to process the laser pattern to obtain a depth image.
  • the present application further provides an electronic device 3000 .
  • the electronic device 3000 includes a housing 2000 and the depth camera 1000 of the above embodiment.
  • the depth camera 1000 is disposed within the housing 2000 and exposed from the housing 2000 to acquire a depth image.
  • the present application provides a laser projection module 100 .
  • the laser projection module 100 includes a lens barrel 40 and a substrate assembly 60.
  • the substrate assembly 60 includes a substrate 62 and a circuit board 61.
  • the circuit board 61 is carried on the substrate 62.
  • the lens barrel 40 includes a side wall 41 and a carrier 411 extending from the side wall 41.
  • the side wall 41 is disposed on the circuit board 61, and the side wall 41 and the circuit board 61 are surrounded by a receiving cavity 42.
  • the laser projection module 100 further includes a laser emitter 10, a collimating element 20, a diffractive optical element 30, and a temperature detecting element 50.
  • the laser emitter 10, the collimating element 20, the diffractive optical element 30, and the temperature detecting element 50 are all housed in the housing.
  • the collimating element 20 and the diffractive optical element 30 are sequentially arranged in the light emitting direction of the laser emitter 10.
  • the circuit board 61 is provided with a via 611, and the laser emitter 10 is carried on the substrate 62 and housed in the via 611.
  • the laser emitter 10 is used to emit laser light.
  • the collimating element 20 is used to collimate the laser light emitted by the laser emitter 10.
  • the diffractive optical element 30 is placed on a carrier 411 for diffracting the laser light collimated by the collimating element 20 to form a laser pattern.
  • the temperature detecting element 50 is housed in the via 611 together with the laser emitter 10, which may be a thermistor that is carried on the substrate 62 and placed adjacent to the laser emitter 10.
  • the temperature detecting element 50 is for detecting the temperature of the laser emitter 10 and outputting a temperature detecting signal, which can be used as a basis for adjusting the power of the laser emitter 10.
  • the laser emitter 10 generates heat when it is in operation, causing the temperature of the laser emitter 10 itself to rise.
  • the increase in temperature of the laser emitter 10 affects the performance of the laser emitter 10, specifically, for example, an increase in temperature causes the laser emitter 10 to produce a temperature drift, that is, the center wavelength of the laser emitter 10 is shifted, thus,
  • the filter band corresponding to the filter of the image collector 200 shown in FIG. 8 used in conjunction with the laser emitter 10 is limited, and the temperature is limited.
  • the portion of the laser beam emitted by the laser emitter 10 that exceeds the filter wavelength cannot be captured by the image collector 200. Therefore, the image collector 200 cannot accurately acquire the laser pattern projected by the laser projection module 100, further affecting the depth. Image acquisition.
  • the laser projection module 100 of the embodiment of the present application can detect the temperature of the laser emitter 10 by providing a temperature detecting element 50 in the vicinity of the laser emitter 10, such that when the temperature of the laser emitter 10 is too high
  • the power of the laser emitter 10 is reduced, so that the heat generated when the laser emitter 10 operates is reduced, so that the temperature of the laser emitter 10 can be lowered, and further, the temperature drift caused by the excessive temperature of the laser emitter 10 can be avoided.
  • the problem that affects the performance of the laser transmitter 10 is large.
  • the laser emitter 10 can be a Vertical Cavity Surface Emitting Laser (VCSEL), and the vertical cavity surface emitting laser has a light emitting direction toward the collimating element 20. Since the light source of the vertical cavity surface emitting laser is multi-point and distributed in an irregular array, the laser pattern projected by the laser projection module 100 has a large irrelevance, which is favorable for improving the acquisition accuracy of the depth image.
  • VCSEL Vertical Cavity Surface Emitting Laser
  • the laser emitter 10 can be an edge-emitting laser (EEL).
  • the laser emitter 10 can be a distributed feedback laser (DFB).
  • the light emitting surface 11 (shown in FIG. 5) of the laser emitter 10 faces the collimating element 20.
  • the distributed feedback laser has a small temperature drift and is a single-point light-emitting structure, and does not need to design an array structure, and is simple to manufacture, and the laser projection module 100 has a low cost.
  • the circuit board 61 is provided with a via 611, and the laser emitter 10 is carried on the substrate 62 and received in the via 611.
  • the substrate 62 is provided with a through hole 621 which is opposed to a position where the laser emitter 10 is carried on the substrate 62.
  • the temperature detecting element 50 is housed in the through hole 621.
  • the laser emitter 10 can be a vertical cavity surface emitting laser (as shown in FIG. 3) or a distributed feedback laser (as shown in FIG. 4).
  • the temperature detecting element 50 is closer to the central light emitting position of the laser emitter 10, and the temperature of the laser emitter 10 can be more accurately detected, so that the power of the laser emitter 10 can be adjusted more timely, and the performance of the laser emitter 10 can be optimized.
  • the laser emitter 10 is a distributed feedback laser
  • the power of the distributed feedback laser needs to be increased by increasing the length of the distributed feedback laser.
  • the distributed feedback laser is placed vertically (ie, the light emitting surface 11 of the distributed feedback laser faces the collimating element 20), the thickness of the laser projection module 100 is large.
  • the via 611 is formed in the circuit board 61, and the through hole 621 is formed in the substrate 62.
  • the temperature detecting element 50 can be received in the through hole 621, and the laser emitter 10 can be partially received in the via 611.
  • the thickness of the laser projection module 100 can be effectively reduced, and the laser projection module 100 can be integrated into an electronic device 3000 (shown in FIG. 9) such as a smart phone, a tablet computer, a smart watch, and a smart wristband.
  • the circuit board 61 in the substrate assembly 60 may be a hard board, a soft board or a soft and hard board.
  • the substrate 62 is further provided with a heat dissipation hole 622.
  • the heat generated by the operation of the laser emitter 10 or the circuit board 61 can be dissipated by the heat dissipation hole 622.
  • the heat dissipation hole 622 can also be filled with the thermal conductive adhesive to further improve the heat dissipation performance of the substrate 62.
  • the temperature detecting component 50 and the laser emitter 10 are both carried on the substrate 62.
  • the temperature detecting component 50 is received in the via 611 and placed adjacent to the laser emitter 10, and the laser emitter 10 is entirely accommodated in the via 611.
  • the laser emitter 10 is a vertical cavity surface emitting laser
  • the device 10 is carried on the substrate 62.
  • the temperature detecting element 50 is received in the via 611 and placed adjacent to the laser emitter 10, and the laser emitter 10 is partially received in the via 611 (ie, the laser emitter 10 is edged).
  • the laser is provided in the via hole 611 (ie, the laser emitter 10 is The vertical cavity surface emitting lasers are disposed in the through holes 621 of the substrate 62.
  • the heat dissipation holes 622 are respectively disposed on the two sides of the through holes 621, and the plurality of heat dissipation holes 622 are disposed on the same side.
  • the holes 622 are evenly distributed (as shown in Figure 3); or
  • the portion of the transmitter 10 is housed in the via 611 (ie, the laser emitter 10 is an edge emitting laser), and the temperature detecting element 50 is placed in the through hole 621 of the substrate 62.
  • the heat dissipation holes 622 are respectively placed in the through holes 621.
  • there are a plurality of heat dissipation holes 622, and a plurality of heat dissipation holes 622 on the same side are evenly distributed (as shown in FIG. 4).
  • the laser emitter 10 is an edge emitting laser.
  • the laser projection module 100 further includes a fixing member.
  • the laser emitter 10 has a columnar shape, and the laser emitter 10 forms an emitting surface 11 away from one end surface of the substrate 62.
  • the laser light is emitted from the light emitting surface 11 and the light emitting surface 11 faces the collimating element 20.
  • the laser emitter 10 is fixed to the substrate 62.
  • the fixing member is a sealant 15, and the laser emitter 10 is bonded to the substrate 62 by a sealant 15, for example, a side of the laser emitter 10 opposite to the light-emitting surface 11 is bonded to the substrate 62.
  • the side surface 12 of the laser emitter 10 can also be bonded to the substrate 62.
  • the sealant 15 wraps around the side surface 12, or only one side of the side surface 12 can be bonded to the substrate 62 or adhered. Connect a certain number of faces to the substrate 62.
  • the sealant 15 may be a thermal conductive adhesive to conduct heat generated by the operation of the laser emitter 10 to the substrate 62. Since the edge emitting laser is generally in the form of a thin strip, when the light emitting surface 11 of the edge emitting laser faces the collimating element 20, the emitting laser is vertically placed, and at this time, the emitter laser is prone to accidents such as dropping, shifting or shaking, and thus passes.
  • the encapsulant 15 can be set to fix the edge emitting laser to prevent accidents such as falling, shifting or shaking of the emitting laser.
  • the laser emitter 10 is an edge emitting laser.
  • the laser projection module 100 further includes a fixing member.
  • the laser emitter 10 has a columnar shape, and the laser emitter 10 forms an emitting surface 11 away from one end surface of the substrate 62.
  • the laser light is emitted from the light emitting surface 11 and the light emitting surface 11 faces the collimating element 20.
  • the laser emitter 10 is fixed to the substrate 62.
  • the fixing member is an elastic support member 16.
  • the number of the support members 16 is two or more.
  • the plurality of support members 16 collectively form a receiving space 161.
  • the accommodating space 161 is for accommodating the laser emitter 10, and the plurality of supporting members 16 are for supporting the laser emitter 10. In this way, it is possible to prevent the laser emitter 10 from being shaken.
  • the present application also provides a depth camera 1000.
  • the depth camera 1000 of the embodiment of the present application includes the laser projection module 100, the image collector 200, and the processor 80 according to any of the above embodiments.
  • the image collector 200 is configured to collect a laser pattern that is diffracted by the diffractive optical element 30 and projected into the target space.
  • the processor 80 is connected to the laser projection module 100, the image collector 200, and the temperature detecting element 50, respectively.
  • the processor 80 is configured to adjust the transmit power of the laser emitter 10 based on the temperature detection signal, and process the laser pattern to acquire a depth image.
  • the laser projection module 100 projects a laser pattern into the target space through the projection window 901, and the image collector 200 collects the laser pattern modulated by the target object through the acquisition window 902.
  • the image collector 200 may be an infrared camera.
  • the processor 80 calculates an offset value of each pixel point in the laser pattern and a corresponding pixel point in the reference pattern by using an image matching algorithm, and further obtains a depth image of the laser pattern according to the deviation value.
  • the image matching algorithm may be a Digital Image Correlation (DIC) algorithm. Of course, other image matching algorithms can be used instead of the DIC algorithm.
  • DIC Digital Image Correlation
  • the laser projection module 100 in the depth camera 1000 of the embodiment of the present application can detect the temperature of the laser emitter 10 by providing a temperature detecting element 50 in the vicinity of the laser emitter 10, and thus, in the laser emitter 10 When the temperature is too high, the power of the laser emitter 10 is reduced, thereby avoiding the problem that the temperature drift of the laser emitter 10 is excessively large and affecting the performance of the laser emitter 10.
  • an electronic device 3000 includes a housing 2000 and a depth camera 1000 of the above embodiment.
  • the depth camera 1000 is disposed within the housing 2000 and exposed from the housing 2000 to acquire a depth image.
  • the laser projection module 100 in the electronic device 3000 of the embodiment of the present application can detect the temperature of the laser emitter 10 by providing a temperature detecting element 50 in the vicinity of the laser emitter 10, and thus, in the laser emitter 10
  • the temperature is too high, the power of the laser emitter 10 is reduced, so that the heat generated when the laser emitter 10 operates is reduced, so that the temperature of the laser emitter 10 can be lowered, and the temperature of the laser emitter 10 can be further avoided. High causes the problem that the temperature drift is too large to affect the performance of the laser emitter 10.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Lasers (AREA)
  • Studio Devices (AREA)
  • Laser Beam Processing (AREA)
  • Measurement Of Optical Distance (AREA)

Abstract

一种激光投射模组(100)、深度相机(1000)和电子装置(3000)。激光投射模组(100)包括激光发射器(10)、准直元件(20)、衍射光学元件(30)和温度检测元件(50)。激光发射器(10)用于发射激光。准直元件(20)用于准直激光。衍射光学元件(30)用于衍射经准直元件(20)准直后的激光以形成激光图案。温度检测元件(50)用于检测激光发射器(10)的温度并输出温度检测信号。

Description

激光投射模组、深度相机和电子装置
优先权信息
本申请请求2018年3月12日向中国国家知识产权局提交的、专利申请号为201810201174.2的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及成像技术领域，特别涉及一种激光投射模组、深度相机和电子装置。
背景技术
激光发射器工作时会发热。若激光发射器发热过于严重，则会使得激光发射器的温漂过大，影响激光发射器的使用性能。
发明内容
本申请的实施例提供了一种激光投射模组、深度相机和电子装置。
本申请实施方式的激光投射模组包括激光发射器、准直元件、衍射光学元件和温度检测元件。所述激光发射器用于发射激光。所述准直元件用于准直所述激光。所述衍射光学元件用于衍射经所述准直元件准直后的激光以形成激光图案。所述温度检测元件用于检测所述激光发射器的温度并输出温度检测信号。
本申请实施方式的深度相机包括激光投射模组、图像采集器和处理器。激光投射模组包括激光发射器、准直元件、衍射光学元件和温度检测元件。所述激光发射器用于发射激光。所述准直元件用于准直所述激光。所述衍射光学元件用于衍射经所述准直元件准直后的激光以形成激光图案。所述温度检测元件用于检测所述激光发射器的温度并输出温度检测信号。所述图像采集器用于采集由所述激光投射模组向目标空间中投射的激光图案。所述处理器与所述温度检测元件连接，所述处理器用于根据所述温度检测信号调节所述激光发射器的发射功率、及用于处理所述激光图案以获得深度图像。
本申请实施方式的电子装置包括壳体和深度相机。所述深度相机设置在所述壳体内并从所述壳体暴露以获取深度图像。深度相机包括激光投射模组、图像采集器和处理器。激光投射模组包括激光发射器、准直元件、衍射光学元件和温度检测元件。所述激光发射器用于发射激光。所述准直元件用于准直所述激光。所述衍射光学元件用于衍射经所述准直元件准直后的激光以形成激光图案。所述温度检测元件用于检测所述激光发射器的温度并输出温度检测信号。所述图像采集器用于采集由所述激光投射模组向目标空间中投射 的激光图案。所述处理器与所述温度检测元件连接，所述处理器用于根据所述温度检测信号调节所述激光发射器的发射功率、及用于处理所述激光图案以获得深度图像。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解，其中：
图1至图4是本申请某些实施方式的激光投射模组的结构示意图。
图5至图7是本申请某些实施方式的激光投射模组的部分结构示意图。
图8是本申请某些实施方式的深度相机的结构示意图。
图9是本申请某些实施方式的电子装置的结构示意图。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通信；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，本申请提供一种激光投射模组100。激光投射模组100包括激光发射器10、准直元件20、衍射光学元件30和温度检测元件50。激光发射器10用于发射激光。准直元件20用于准直激光。衍射光学元件30用于衍射经准直元件20准直后的激光以形成激光图案。温度检测元件50用于检测激光发射器10的温度并输出温度检测信号。
请参阅图1，在某些实施方式中，激光投射模组100还包括基板组件60。基板组件60包括基板62及承载在基板62上的电路板61。激光发射器10承载在基板组件60上.
请参阅图1和图2，在某些实施方式中，电路板61开设有过孔611。激光发射器10和温度检测元件50均承载在基板62上，并均收容在所述过孔611内。
请参阅图3和图4，在某些实施方式中，电路板61开设有过孔611。激光发射器10承载在基板62上并收容在过孔611内。基板62开设有通孔621，通孔621的位置与激光发射器10承载在基板62上的位置相对。温度检测元件50收容在所述通孔621中。
请参阅图2和图6，在某些实施方式中，激光发射器10为边发射激光器。边发射激光器10包括发光面11，发光面11朝向准直元件20。
请参阅图6，在某些实施方式中，激光投射模组100还包括固定件。固定件用于将边发射激光器固定在基板组件60上。
请参阅图6，在某些实施方式中，固定件包括封胶15，封胶15设置在边发射激光器与电路板62之间。封胶15为导热胶。
请参阅图7，在某些实施方式中，固定件包括设置在基板组件60上的至少两个弹性的支撑件16，至少两个支撑件16共同形成收容空间。收容空间用于收容激光发射器10。至少两个支撑件16用于支撑住激光发射器10。
请参阅图8，本申请还提供一种深度相机1000。深度相机1000包括上述任意一项实施方式所述的激光投射模组100、图像采集器200和处理器80。图像采集器200用于采集由激光投射模组100向目标空间中投射的激光图案。处理器80与温度检测元件50连接。处理器80用于根据温度检测信号调节激光发射器10的发射功率、及用于处理激光图案以获得深度图像。
请参阅图9，本申请还提供一种电子装置3000。电子装置3000包括壳体2000及上述实施方式的深度相机1000。深度相机1000设置在壳体2000内并从壳体2000暴露以获取深度图像。
请参阅图1，本申请提供一种激光投射模组100。激光投射模组100包括镜筒40和基板组件60。基板组件60包括基板62和电路板61。电路板61承载在基板62上。镜筒40包括侧壁41和自侧壁41延伸的承载台411。侧壁41设置在电路板61上，侧壁41与电路板61围成有收容腔42。激光投射模组100还包括激光发射器10、准直元件20、衍射光学 元件30及温度检测元件50，激光发射器10、准直元件20、衍射光学元件30及温度检测元件50均收容在收容腔42中，且准直元件20与衍射光学元件30沿激光发射器10的发光方向依次排列。具体地，电路板61开设有过孔611，激光发射器10承载在基板62上并收容在过孔611内，激光发射器10用于发射激光。准直元件20用于准直激光发射器10发射的激光。衍射光学元件30放置于承载台411上，衍射光学元件30用于衍射经准直元件20准直后的激光以形成激光图案。温度检测元件50与激光发射器10共同收容在过孔611内，温度检测元件50可以是热敏电阻，其承载在基板62上并置于激光发射器10的相邻位置处。温度检测元件50用于检测激光发射器10的温度并输出温度检测信号，温度检测信号可作为调节激光发射器10功率的调节依据。
可以理解，激光发射器10工作时会产生热量，导致激光发射器10自身的温度升高。激光发射器10的温度升高后会影响激光发射器10的使用性能，具体地，例如，温度升高导致激光发射器10产生温漂，即激光发射器10的中心波长产生偏移，如此，当激光发射器10在自身温度较高的情况下发射功率时，由于与激光发射器10配合使用的图像采集器200(图8所示)的滤光片对应的滤光波段是有限的，温漂导致的激光发射器10发射的激光的波长超出滤光波段的部分无法被图像采集器200采集得到，因此，图像采集器200无法准确获取激光投射模组100投射的激光图案，进一步地影响深度图像的获取。
本申请实施方式的激光投射模组100通过在激光发射器10的附近设置一个温度检测元件50，温度检测元件50可以检测激光发射器10的温度，如此，在激光发射器10的温度过高时，减小激光发射器10的功率，使得激光发射器10工作时产生的热量减小，从而可降低激光发射器10的温度，进一步地可以避免因激光发射器10的温度过高导致温漂过大而影响激光发射器10的使用性能的问题。
如图1所示，在某些实施方式中，激光发射器10可为垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser，VCSEL)，垂直腔面发射激光器的发光方向朝向准直元件20。由于垂直腔面发射激光器的光源为多点且呈不规则的阵列分布，因此，激光投射模组100投射的激光图案的不相关性较大，有利于提升深度图像的获取精度。
如图2所示，在某些实施方式中，激光发射器10可为边发射激光器(edge-emitting laser，EEL)，具体地，激光发射器10可为分布反馈式激光器(Distributed Feedback Laser，DFB)。此时，激光发射器10的发光面11(图5所示)朝向准直元件20。分布反馈式激光器的温漂较小，且为单点发光结构，无需设计阵列结构，制作简单，激光投射模组100的成本较低。
请一并参阅图3和图4，在某些实施方式中，电路板61开设有过孔611，激光发射器10承载在基板62上并收容在过孔611内。基板62开设有通孔621，通孔621的位置与激 光发射器10承载在基板62上的位置相对。温度检测元件50收容在通孔621中。此时，激光发射器10可为垂直腔面发射激光器(如图3所示)，也可为分布反馈式激光器(如图4所示)。如此，温度检测元件50更靠近激光发射器10的中心发光位置，可以更准确地检测激光发射器10的温度，从而可以更加及时地调节激光发射器10的功率，优化激光发射器10的使用性能。另外，当激光发射器10为分布反馈式激光器时，由于分布反馈式激光器的激光是通过光栅结构的反馈获得功率的增益的，要提高分布反馈式激光器的功率需要通过增加分布反馈式激光器的长度来实现，如此，当分布反馈式激光器为竖直放置(即分布反馈式激光器的发光面11朝向准直元件20)时，激光投射模组100的厚度较大。而通过在电路板61上开设过孔611，以及在基板62上开设通孔621的方式，可以将温度检测元件50收容在通孔621内，并将激光发射器10部分收容在过孔611内，可以有效减小激光投射模组100的厚度，便于激光投射模组100集成到智能手机、平板电脑、智能手表、智能手环等电子装置3000(图9所示)中。
请一并参阅图1至图4，在某些实施方式中，基板组件60中的电路板61可以是硬板、软板或软硬结合板。基板62还开设有散热孔622，激光发射器10或电路板61工作产生的热量可以由散热孔622散出，散热孔622内还可以填充导热胶，以进一步提高基板62的散热性能。具体地，温度检测元件50与激光发射器10均承载在基板62上，温度检测元件50收容在过孔611内并置于激光发射器10邻近位置，且激光发射器10全部收容在过孔611内(即，激光发射器10为垂直腔面发射激光器)，此时散热孔622有多个，多个散热孔622等间距分布(如图1所示)；或者，温度检测元件50与激光发射器10均承载在基板62上，温度检测元件50收容在过孔611内并置于激光发射器10邻近位置，且激光发射器10部分收容在过孔611内(即，激光发射器10为边发射激光器)，此时散热孔622有多个，多个散热孔622等间距分布(如图2所示)；或者，激光发射器10全部收容在过孔611内(即，激光发射器10为垂直腔面发射激光器)，温度检测元件50置于基板62的通孔621内，此时，散热孔622分别置于通孔621的两边，散热孔622为多个，位于同一边的多个散热孔622均匀分布(如图3所示)；或者，激光发射器10部分部收容在过孔611内(即，激光发射器10为边发射激光器)，温度检测元件50置于基板62的通孔621内，此时，散热孔622分别置于通孔621的两边，散热孔622为多个，位于同一边的多个散热孔622均匀分布(如图4所示)。
请一并参阅图1和图5，在某些实施方式中，激光发射器10为边发射激光器，此时，激光投射模组100还包括固定件。具体地，激光发射器10呈柱状，激光发射器10远离基板62的一个端面形成发光面11。激光从发光面11发出，发光面11朝向准直元件20。激光发射器10固定在基板62上。固定件为封胶15，激光发射器10通过封胶15粘接在基板 62上，例如，激光发射器10的与发光面11相背的一面粘接在基板62上。请结合图1和图6，激光发射器10的侧面12也可以粘接在基板62上，封胶15包裹住四周的侧面12，也可以仅粘接侧面12的某一个面与基板62或粘接某几个面与基板62。此时封胶15可为导热胶，以将激光发射器10工作产生的热量传导至基板62中。由于边发射激光器通常呈细条状，当边发射激光器的发光面11朝向准直元件20时，边发射激光器竖直放置，此时边发射器激光器容易出现跌落、移位或晃动等意外，因此通过设置封胶15能够将边发射激光器固定住，防止边发射激光器发生跌落、移位或晃动等意外。
请参阅图7，在某些实施方式中，激光发射器10为边发射激光器，此时，激光投射模组100还包括固定件。具体地，激光发射器10呈柱状，激光发射器10远离基板62的一个端面形成发光面11。激光从发光面11发出，发光面11朝向准直元件20。激光发射器10固定在基板62上。固定件为弹性的支撑件16。支撑件16的个数为两个或两个以上。多个支撑件16共同形成收容空间161。收容空间161用于收容激光发射器10，多个支撑件16用于支撑住激光发射器10。如此，可以防止激光发射器10发生晃动。
请参阅图8，本申请还提供一种深度相机1000。本申请实施方式的深度相机1000包括上述任意一项实施方式所述的激光投射模组100、图像采集器200和处理器80。其中，图像采集器200用于采集经衍射光学元件30衍射后向目标空间中投射的激光图案。处理器80分别与激光投射模组100、图像采集器200及温度检测元件50连接。处理器80用于根据温度检测信号调节激光发射器10的发射功率，以及处理激光图案以获取深度图像。
具体地，激光投射模组100通过投射窗口901向目标空间中投射激光图案，图像采集器200通过采集窗口902采集被目标物体调制后的激光图案。图像采集器200可为红外相机，处理器80采用图像匹配算法计算出该激光图案中各像素点与参考图案中的对应各个像素点的偏离值，再根据偏离值进一步获得该激光图案的深度图像。其中，图像匹配算法可为数字图像相关(Digital Image Correlation，DIC)算法。当然，也可以采用其它图像匹配算法代替DIC算法。
本申请实施方式的深度相机1000中的激光投射模组100通过在激光发射器10的附近设置一个温度检测元件50，温度检测元件50可以检测激光发射器10的温度，如此，在激光发射器10的温度过高时，减小激光发射器10的功率，从而避免激光发射器10的温漂过大而影响激光发射器10的使用性能的问题。
请参阅图9，本申请实施方式的电子装置3000包括壳体2000及上述实施方式的深度相机1000。深度相机1000设置在壳体2000内并从壳体2000暴露以获取深度图像。
本申请实施方式的电子装置3000中的激光投射模组100通过在激光发射器10的附近设置一个温度检测元件50，温度检测元件50可以检测激光发射器10的温度，如此，在激 光发射器10的温度过高时，减小激光发射器10的功率，使得激光发射器10工作时产生的热量减小，从而可降低激光发射器10的温度，进一步地可以避免因激光发射器10的温度过高导致温漂过大而影响激光发射器10的使用性能的问题。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本申请的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (24)

  1. 一种激光投射模组，其特征在于，所述激光投射模组包括：
    激光发射器，所述激光发射器用于发射激光；
    准直元件，所述准直元件用于准直所述激光；
    衍射光学元件，所述衍射光学元件用于衍射经所述准直元件准直后的激光以形成激光图案；和
    温度检测元件，所述温度检测元件用于检测所述激光发射器的温度并输出温度检测信号。
  2. 根据权利要求1所述的激光投射模组，其特征在于，所述激光投射模组还包括：
    基板组件，所述基板组件包括基板及承载在所述基板上的电路板，所述激光发射器承载在所述基板组件上。
  3. 根据权利要求2所述的激光投射模组，其特征在于，所述电路板开设有过孔，所述激光发射器和所述温度检测元件均承载在所述基板上，并均收容在所述过孔内。
  4. 根据权利要求2所述的激光投射模组，其特征在于，所述电路板开设有过孔，所述激光发射器承载在所述基板上并收容在所述过孔内，所述基板开设有通孔，所述通孔的位置与所述激光发射器承载在所述基板上的位置相对，所述温度检测元件收容在所述通孔中。
  5. 根据权利要求2所述的激光投射模组，其特征在于，所述激光发射器为边发射激光器，所述边发射激光器包括发光面，所述发光面朝向所述准直元件。
  6. 根据权利要求5所述的激光投射模组，其特征在于，所述激光投射模组还包括固定件，所述固定件用于将所述边发射激光器固定在所述基板组件上。
  7. 根据权利要求6所述的激光投射模组，其特征在于，所述固定件包括封胶，所述封胶设置在所述边发射激光器与所述电路板之间，所述封胶为导热胶。
  8. 根据权利要求6所述的激光投射模组，其特征在于，所述固定件包括设置在所述基板组件上的至少两个弹性的支撑件，至少两个所述支撑件共同形成收容空间，所述收容空 间用于收容所述激光发射器，至少两个所述支撑件用于支撑住所述激光发射器。
  9. 一种深度相机，其特征在于，所述深度相机包括：
    激光投射模组，所述激光投射模组包括：
    激光发射器，所述激光发射器用于发射激光；
    准直元件，所述准直元件用于准直所述激光；
    衍射光学元件，所述衍射光学元件用于衍射经所述准直元件准直后的激光以形成激光图案；和
    温度检测元件，所述温度检测元件用于检测所述激光发射器的温度并输出温度检测信号；
    图像采集器，所述图像采集器用于采集由所述激光投射模组向目标空间中投射的激光图案；和
    与所述温度检测元件连接的处理器，所述处理器用于根据所述温度检测信号调节所述激光发射器的发射功率、及用于处理所述激光图案以获得深度图像。
  10. 根据权利要求9所述的深度相机，其特征在于，所述激光投射模组还包括：
    基板组件，所述基板组件包括基板及承载在所述基板上的电路板，所述激光发射器承载在所述基板组件上。
  11. 根据权利要求10所述的深度相机，其特征在于，所述电路板开设有过孔，所述激光发射器和所述温度检测元件均承载在所述基板上，并均收容在所述过孔内。
  12. 根据权利要求10所述的深度相机，其特征在于，所述电路板开设有过孔，所述激光发射器承载在所述基板上并收容在所述过孔内，所述基板开设有通孔，所述通孔的位置与所述激光发射器承载在所述基板上的位置相对，所述温度检测元件收容在所述通孔中。
  13. 根据权利要求10所述的深度相机，其特征在于，所述激光发射器为边发射激光器，所述边发射激光器包括发光面，所述发光面朝向所述准直元件。
  14. 根据权利要求13所述的深度相机，其特征在于，所述激光投射模组还包括固定件，所述固定件用于将所述边发射激光器固定在所述基板组件上。
  15. 根据权利要求14所述的深度相机，其特征在于，所述固定件包括封胶，所述封胶设置在所述边发射激光器与所述电路板之间，所述封胶为导热胶。
  16. 根据权利要求14所述的深度相机，其特征在于，所述固定件包括设置在所述基板组件上的至少两个弹性的支撑件，至少两个所述支撑件共同形成收容空间，所述收容空间用于收容所述激光发射器，至少两个所述支撑件用于支撑住所述激光发射器。
  17. 一种电子装置，其特征在于，所述电子装置包括壳体和深度相机，所述深度相机设置在所述壳体内并从所述壳体暴露以获取深度图像；所述深度相机包括：
    激光投射模组，所述激光投射模组包括：
    激光发射器，所述激光发射器用于发射激光；
    准直元件，所述准直元件用于准直所述激光；
    衍射光学元件，所述衍射光学元件用于衍射经所述准直元件准直后的激光以形成激光图案；和
    温度检测元件，所述温度检测元件用于检测所述激光发射器的温度并输出温度检测信号；
    图像采集器，所述图像采集器用于采集由所述激光投射模组向目标空间中投射的激光图案；和
    与所述温度检测元件连接的处理器，所述处理器用于根据所述温度检测信号调节所述激光发射器的发射功率、及用于处理所述激光图案以获得深度图像。
  18. 根据权利要求17所述的电子装置，其特征在于，所述激光投射模组还包括：
    基板组件，所述基板组件包括基板及承载在所述基板上的电路板，所述激光发射器承载在所述基板组件上。
  19. 根据权利要求18所述的电子装置，其特征在于，所述电路板开设有过孔，所述激光发射器和所述温度检测元件均承载在所述基板上，并均收容在所述过孔内。
  20. 根据权利要求18所述的电子装置，其特征在于，所述电路板开设有过孔，所述激光发射器承载在所述基板上并收容在所述过孔内，所述基板开设有通孔，所述通孔的位置与所述激光发射器承载在所述基板上的位置相对，所述温度检测元件收容在所述通孔中。
  21. 根据权利要求18所述的电子装置，其特征在于，所述激光发射器为边发射激光器，所述边发射激光器包括发光面，所述发光面朝向所述准直元件。
  22. 根据权利要求21所述的电子装置，其特征在于，所述激光投射模组还包括固定件，所述固定件用于将所述边发射激光器固定在所述基板组件上。
  23. 根据权利要求22所述的电子装置，其特征在于，所述固定件包括封胶，所述封胶设置在所述边发射激光器与所述电路板之间，所述封胶为导热胶。
  24. 根据权利要求22所述的电子装置，其特征在于，所述固定件包括设置在所述基板组件上的至少两个弹性的支撑件，至少两个所述支撑件共同形成收容空间，所述收容空间用于收容所述激光发射器，至少两个所述支撑件用于支撑住所述激光发射器。
PCT/CN2019/070769 2018-03-12 2019-01-08 激光投射模组、深度相机和电子装置 WO2019174382A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810201174.2A CN108344376A (zh) 2018-03-12 2018-03-12 激光投射模组、深度相机和电子装置
CN201810201174.2 2018-03-12

Publications (1)

Publication Number Publication Date
WO2019174382A1 true WO2019174382A1 (zh) 2019-09-19

Family

ID=62956564

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/070769 WO2019174382A1 (zh) 2018-03-12 2019-01-08 激光投射模组、深度相机和电子装置

Country Status (6)

Country Link
US (1) US11082671B2 (zh)
EP (1) EP3540877B1 (zh)
CN (1) CN108344376A (zh)
ES (1) ES2936475T3 (zh)
TW (1) TW201939113A (zh)
WO (1) WO2019174382A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109242901B (zh) * 2017-07-11 2021-10-22 深圳市道通智能航空技术股份有限公司 应用于三维相机的图像校准方法和装置
CN108344376A (zh) 2018-03-12 2018-07-31 广东欧珀移动通信有限公司 激光投射模组、深度相机和电子装置
CN110278426B (zh) * 2018-03-18 2024-02-13 宁波舜宇光电信息有限公司 深度信息摄像模组及其基座组件、电子设备和制备方法
CN110687688B (zh) * 2018-07-04 2021-12-31 三赢科技（深圳）有限公司 光学投射装置
CN109149355B (zh) * 2018-09-12 2020-06-23 Oppo广东移动通信有限公司 光发射模组及其控制方法、tof深度相机和电子设备
CN109088963B (zh) * 2018-09-14 2020-08-28 Oppo广东移动通信有限公司 电子装置
CN109120837B (zh) * 2018-10-31 2020-05-01 Oppo广东移动通信有限公司 图像获取方法、图像获取装置、结构光组件及电子装置
CN111327812B (zh) * 2018-12-14 2022-03-04 杭州海康威视数字技术股份有限公司 一种摄像机组件及摄像机控制方法
WO2020142955A1 (zh) * 2019-01-09 2020-07-16 深圳市大疆创新科技有限公司 一种测距装置及移动平台
CN109904718B (zh) * 2019-03-25 2020-09-04 Oppo广东移动通信有限公司 飞行时间组件的控制系统及控制方法、终端
CN110488562A (zh) * 2019-08-19 2019-11-22 北京驭光科技发展有限公司 集成化激光投射模组
CN110530611B (zh) * 2019-08-30 2021-07-09 Oppo广东移动通信有限公司 校准方法、激光发射模组、深度相机和电子设备
CN112885939B (zh) * 2019-11-13 2022-12-20 北京小米移动软件有限公司 封装结构、电子设备的发射装置及电子设备
CN111596507B (zh) * 2020-05-11 2022-04-22 常州纵慧芯光半导体科技有限公司 一种摄像模组及其制造方法
CN113763485B (zh) * 2021-09-28 2022-07-26 合肥的卢深视科技有限公司 温漂系数获取方法、电子设备、存储介质和图像校正方法
CN114895477B (zh) * 2022-04-13 2024-03-01 嘉兴驭光光电科技有限公司 激光投射器、相机组件和电子装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102253570A (zh) * 2010-06-09 2011-11-23 微软公司 热调谐深度相机光源
CN202562445U (zh) * 2012-03-29 2012-11-28 中国气象局气象探测中心 基于激光测距原理的积雪深度多点自动测量装置
CN206149421U (zh) * 2016-08-12 2017-05-03 北京旷视科技有限公司 激光模组功率校准单元及深度相机
US20170131090A1 (en) * 2015-11-06 2017-05-11 Intel Corporation Systems, methods, and apparatuses for implementing maximum likelihood image binarization in a coded light range camera
CN107357118A (zh) * 2017-08-02 2017-11-17 深圳奥比中光科技有限公司 具有高散热性能的光学模组
CN108344376A (zh) * 2018-03-12 2018-07-31 广东欧珀移动通信有限公司 激光投射模组、深度相机和电子装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1536563A (zh) 2000-10-17 2004-10-13 ���µ�����ҵ��ʽ���� 透镜组、光学头和使用它们的光可记录型播放器
JP2005159104A (ja) 2003-11-27 2005-06-16 Sony Corp レーザ・システム
TWI384713B (zh) 2009-08-18 2013-02-01 Quarton Inc 雷射模組
US20110187878A1 (en) 2010-02-02 2011-08-04 Primesense Ltd. Synchronization of projected illumination with rolling shutter of image sensor
TWI403049B (zh) 2010-05-11 2013-07-21 Ind Tech Res Inst 雷射光源產生裝置
US9557574B2 (en) 2010-06-08 2017-01-31 Microsoft Technology Licensing, Llc Depth illumination and detection optics
JP5545144B2 (ja) 2010-09-14 2014-07-09 セイコーエプソン株式会社 光デバイスユニット及び検出装置
CN102955328B (zh) * 2011-08-26 2015-02-18 深圳市安星数字系统有限公司 激光夜视一体化高速云台摄像机及其监控方法
TW201347331A (zh) 2012-05-03 2013-11-16 Sintai Optical Shenzhen Co Ltd 雷射裝置的溫控方法及使用其之電子裝置
US9059555B2 (en) 2012-09-12 2015-06-16 Innovative Photonic Solutions Wavelength-stabilized diode laser
TW201428925A (zh) 2013-01-04 2014-07-16 矽品精密工業股份有限公司 光電模組結構
CN203387514U (zh) 2013-06-24 2014-01-08 青岛海信宽带多媒体技术有限公司 可调节发射波长的光网络单元光模块
WO2015099211A1 (ko) * 2013-12-24 2015-07-02 엘지전자 주식회사 3차원 카메라모듈
JP6644563B2 (ja) 2016-01-28 2020-02-12 浜松ホトニクス株式会社 レーザ光照射装置
CN206470523U (zh) * 2017-01-19 2017-09-05 深圳奥比中光科技有限公司 光学投影装置及应用其的深度相机
CN206412341U (zh) * 2017-01-19 2017-08-15 深圳奥比中光科技有限公司 芯片嵌入装置
CN206877030U (zh) 2017-07-07 2018-01-12 深圳奥比中光科技有限公司 发光装置及其激光投影模组
CN107609383B (zh) * 2017-10-26 2021-01-26 奥比中光科技集团股份有限公司 3d人脸身份认证方法与装置
EP3561590A4 (en) * 2018-02-27 2020-04-15 Guangdong Oppo Mobile Telecommunications Corp., Ltd. LASER PROJECTION MODULE AND DETECTION METHOD FOR CRACKING, DEPTH CAMERA AND ELECTRONIC DEVICE
WO2019174436A1 (zh) * 2018-03-12 2019-09-19 Oppo广东移动通信有限公司 控制方法、控制装置、深度相机和电子装置
CN108594393A (zh) * 2018-04-04 2018-09-28 Oppo广东移动通信有限公司 衍射光学组件、激光投射模组、深度相机和电子装置
WO2019201010A1 (zh) * 2018-04-16 2019-10-24 Oppo广东移动通信有限公司 激光投射器、相机模组和电子装置
CN111399156B (zh) * 2018-06-28 2022-10-28 Oppo广东移动通信有限公司 激光投射器、图像获取装置和电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102253570A (zh) * 2010-06-09 2011-11-23 微软公司 热调谐深度相机光源
CN202562445U (zh) * 2012-03-29 2012-11-28 中国气象局气象探测中心 基于激光测距原理的积雪深度多点自动测量装置
US20170131090A1 (en) * 2015-11-06 2017-05-11 Intel Corporation Systems, methods, and apparatuses for implementing maximum likelihood image binarization in a coded light range camera
CN206149421U (zh) * 2016-08-12 2017-05-03 北京旷视科技有限公司 激光模组功率校准单元及深度相机
CN107357118A (zh) * 2017-08-02 2017-11-17 深圳奥比中光科技有限公司 具有高散热性能的光学模组
CN108344376A (zh) * 2018-03-12 2018-07-31 广东欧珀移动通信有限公司 激光投射模组、深度相机和电子装置

Also Published As

Publication number Publication date
US11082671B2 (en) 2021-08-03
EP3540877A1 (en) 2019-09-18
US20190281265A1 (en) 2019-09-12
EP3540877B1 (en) 2022-12-21
CN108344376A (zh) 2018-07-31
TW201939113A (zh) 2019-10-01
ES2936475T3 (es) 2023-03-17

Similar Documents

Publication Publication Date Title
WO2019174382A1 (zh) 激光投射模组、深度相机和电子装置
TWI677714B (zh) 鐳射投射結構和電子裝置
TWI685678B (zh) 鐳射投射模組、深度相機和電子裝置
CN108319034B (zh) 激光投射模组、深度相机和电子装置
TWI697729B (zh) 鐳射投射模組、深度相機和電子裝置
US11048155B2 (en) Diffractive optical assembly, laser projection unit, and depth camera
US20070237196A1 (en) Light-emitting module installing thermo-electric controller
CN108344377B (zh) 激光投射模组、深度相机和电子装置
CN108388072B (zh) 激光投射模组、深度相机和电子装置
WO2019192240A1 (zh) 激光发射器、光电设备、深度相机和电子装置
CN108415209B (zh) 结构光投射模组、摄像组件和电子装置
WO2019174434A1 (zh) 结构光投射器、深度相机和电子设备
JP2006171398A (ja) 光伝送モジュール
CN108490572B (zh) 激光投射模组、深度相机及电子装置
CN108507761B (zh) 激光投射模组及其检测方法与装置、深度相机和电子装置
CN108490629B (zh) 结构光投射器及其检测方法与装置、图像获取装置和电子设备
KR101945201B1 (ko) 집중 방열 방식 카메라 모듈
CN108388065B (zh) 结构光投射器、光电设备和电子装置
CN108508624B (zh) 激光投射模组及其检测方法与装置、深度相机和电子装置
CN108508625A (zh) 结构光投射器、图像获取装置和电子设备
CN108600437B (zh) 支架组件、输入输出组件和电子装置
CN108490577A (zh) 结构光投射器、图像获取装置和电子设备
CN108508687B (zh) 激光投射模组、深度相机和电子装置
CN108490595B (zh) 结构光投射模组、图像获取装置及电子设备
WO2019174433A1 (zh) 激光投射模组、深度相机和电子装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19766877

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19766877

Country of ref document: EP

Kind code of ref document: A1