WO2019173282A1 - Ensemble élément métallisé flottant et son procédé de fabrication - Google Patents

Ensemble élément métallisé flottant et son procédé de fabrication Download PDF

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Publication number
WO2019173282A1
WO2019173282A1 PCT/US2019/020673 US2019020673W WO2019173282A1 WO 2019173282 A1 WO2019173282 A1 WO 2019173282A1 US 2019020673 W US2019020673 W US 2019020673W WO 2019173282 A1 WO2019173282 A1 WO 2019173282A1
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WO
WIPO (PCT)
Prior art keywords
work piece
floating
plateable resin
set forth
element assembly
Prior art date
Application number
PCT/US2019/020673
Other languages
English (en)
Inventor
Michael LaVallee
Lee Chase
Original Assignee
Lacks Enterprises, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/911,694 external-priority patent/US11326268B2/en
Application filed by Lacks Enterprises, Inc. filed Critical Lacks Enterprises, Inc.
Publication of WO2019173282A1 publication Critical patent/WO2019173282A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C2045/0079—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping applying a coating or covering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles

Definitions

  • the present disclosure relates generally to a floating metallized element assembly and method of manufacturing same. More specifically, the present disclosure relates to a floating metallized element assembly that has both plateable and non-plateable resins to allow for different decorative treatments to yield unique aesthetics.
  • Plated decorative chrome finishes have long been available for various products in the automotive, appliance, consumer electronics, and household application industries. Variations in the deposition methods, processing conditions, and solution makeup of the various types of metals have subsequently resulted in aesthetic variations in the final product. These variations in processing, chemical, and deposition techniques are able to generate different color metal finishes, lower gloss levels, and less distinction of image (DOI) in the metal finish of work pieces all with an eye to improving aesthetics. Examples of these finishes include but are not limited to Bright Chrome, Black Nickel, Black Chrome, and the like. Another exemplary finish that has been employed is Satin Chrome, which involves varying the reflectivity of the underlying metal layer such as by creating more pits in the substrate surface. Varying the degree of reflectivity allows for many different types of metal finishes. Often, these variations are combined with a bright chromium finish in assemblies to 1) complement each other and 2) bring more aesthetic appeal to the final product.
  • a known method of finishing work pieces to provide a final product that has multiple distinct surface finishes includes utilizing work piece assemblies that are made up of multiple components, each having a different metal finish and which are assembled to form the final product. This practice, while effective, results in multiple operations and multiple sets of tooling which adds significant cost to the final product.
  • Another known method of finishing work pieces to provide a final product that has multiple distinct surface finishes includes applying bright and satin-like finishing to the surface of the work piece with masking and pre or post surface treatments using abrasive grains such as iron powder, glass powder, silicon oxide, alumina and the like. Molded in texture or surface effects have also been employed to create variation in the metal finish of the work piece by selectively incorporating the texture or surface finish into a portion of the work piece prior to application of a metal finish.
  • abrasive grains such as iron powder, glass powder, silicon oxide, alumina and the like.
  • Molded in texture or surface effects have also been employed to create variation in the metal finish of the work piece by selectively incorporating the texture or surface finish into a portion of the work piece prior to application of a metal finish.
  • the leveling characteristic of the electroplated layer on these two sections does not create the visual effect of two distinct metal surface finishes as desired.
  • the pre and post surface treatments are costly and require an additional operation.
  • Vacuum metallization and chemical vapor deposition techniques are able to achieve a final product that has segments with different finishes, but are very costly and limited from a performance standpoint in many environments because of the thin layer of metal that results from these techniques. Additionally, physical vapor deposition coatings must include an organic coating thereover to protect the deposited metal layer. This additional step increases labor costs and creates an“orange peel” look due to the fact that the organic coating is not completely smooth.
  • Another method of creating two distinct surface effects on a work piece includes masking and painting using tinted basecoats and clear coats. Although this method creates the desired effect, it disadvantageous ⁇ requires an additional painting operation which adds cost to the final product.
  • the floating metallized element assembly can include a work piece having a plateable resin and a non- plateable resin and having a front side and a back side.
  • the work piece may include a plurality of plated decorative regions on the front side on the plateable resin and a plurality of networks formed of the plateable resin on the back side. At least one of the plurality of plated decorative regions can couple to a different one of the plurality of networks than another of the plurality of plated decorative regions.
  • the work piece may also include a plurality of discrete current paths extending between the plurality of networks and the plurality of plated decorative regions.
  • the work piece can include at least one non-plated decorative region of the non- plateable resin adjacent at least one of the plurality of plated decorative regions and a plurality of metal surfaces adhered to the plurality of plated decorative regions.
  • a method of manufacturing a floating metallized element assembly can include the step of initiating a multi-shot injection process to mold a work piece.
  • the method can also include the step of injecting a non-plateable resin into a mold cavity. Next, injecting a plateable resin into the mold cavity.
  • the method can proceed by forming a plurality of plated decorative regions on a front side of the work piece each visibly surrounded by the non-plateable resin.
  • the next step of the method can be forming a plurality of networks of plateable resin on a non-visible back side of the work piece.
  • the method may also include the step of forming a plurality of discrete current paths of the plateable resin extending from the plurality of networks to the plurality of plated decorative regions to form circuits. Then, the method can continue with the step of connecting a positive terminal of each of a plurality of power sources to a plurality of anodes and immersing the plurality of anodes in an aqueous solution. The method may also include connecting a negative terminal of each of the plurality of power source to one of a plurality of points of contact on one of the plurality of networks of the plateable resin of the work piece. The method can additionally include the step of immersing the work piece in the aqueous solution.
  • the method can then include the step of positively charging the plurality of anodes using the positive terminals of the plurality of power sources and negatively charging the plurality of networks and plated decorative region of the plateable resin through the plurality of points of contact using the negative terminals of the plurality of power sources.
  • the method can conclude with the step of creating a plurality of metal surfaces on the plurality of plated decorative regions.
  • FIG. 1 is flow diagram of a method of plating a work piece in accordance with an aspect of the disclosure
  • FIG. 2 is a side cross-sectional view of a work piece having a barrier formed thereon in accordance with an aspect of the disclosure
  • FIG. 3 is a side cross-sectional view of a work piece having a barrier formed thereon in accordance with another aspect of the disclosure
  • FIG. 4 is a side cross-sectional view of a work piece having a barrier formed thereon in accordance with a further aspect of the disclosure
  • FIG. 5 is a side cross-sectional view of a power source, a first aqueous solution, a first anode and a work piece in accordance with an aspect of the disclosure
  • FIG. 6 is a side cross-sectional view of a power source, a second aqueous solution, a second anode and a work piece in accordance with an aspect of the disclosure
  • FIG. 7 is a schematic illustration of a plating tool for use in plating a work piece in accordance with an aspect of the disclosure.
  • FIG. 8 is a front side view of a floating metallized element assembly according to an aspect of the disclosure
  • FIG. 9 is a partial perspective view of the floating metallized element assembly of FIG. 8 illustrating a discrete current path that is not visible when the floating metallized element assembly is in a position attached to a vehicle;
  • FIG. 10 is a back side view of floating metallized element assembly of FIG. 8 illustrating a plurality of networks of plateable material not seen from the front side;
  • FIG. 11 is a front side view of a floating metallized element assembly according to another aspect of the disclosure.
  • FIG. 12 is the back side of the floating metallized element assembly of FIG. 11 illustrating a network of plateable material not visible from a front view;
  • FIG. 13 is a perspective view of a floating metallized element assembly according to yet another aspect of the disclosure.
  • FIG. 14 is an enlarged partial view of the floating metallized element assembly of FIG. 13;
  • FIG. 15 is a partial view of a floating metallized element assembly according to a further aspect of the disclosure.
  • FIG. 16 is a partial view of a floating metallized element assembly according to still another aspect of the disclosure.
  • FIGS. 17A-17B are a flow chart illustrating a method of manufacturing a floating metallized element assembly according to aspects of the disclosure.
  • FIG 18 is a schematic cross-sectional view of a floating metallized element assembly according to a further aspect of the present disclosure.
  • a method is generally shown for plating a work piece 100 using a power source 102 (e.g., a battery) having a positive terminal 104 and a negative terminal 106. It will be appreciated that a variety of suitable power sources may be employed.
  • a power source 102 e.g., a battery
  • a positive terminal 104 and a negative terminal 106 e.g., a battery
  • a negative terminal 106 e.g., a battery
  • the method includes creating a barrier 114 to electrical conductivity in a base substrate layer 110 of the work piece 100. Thereafter, an electroless layer of material 108 can be applied to the base substrate layer 110 of the work piece 100 using an electroless plating process, as generally indicated by reference number 10.
  • the electroless plating process generally includes an autocatalytic chemical reaction which causes a metal to be deposited on the base substrate layer 110 of the work piece 100 such that the substrate layer 110 will be conductive.
  • the electroless layer of material 108 can act as a base layer that has good adherence to both the substrate layer 110 of the work piece 100 as well as to a subsequently plated decorative or electroplated layer 124, 132, as described illustratively below. Therefore, once the electroless layer of material 108 is adhered to the base substrate layer 110 of the work piece 100, the work piece 100 may be well-suited for receiving subsequent electroplated layers thereon.
  • suitable metals for plating (both electroless plating and electroplating) according to the subject method may include, but are not limited to, copper, nickel, zinc, palladium, gold, cobalt, chromium (i.e., chrome), and alloys thereof.
  • the material of the substrate layer 110 of the work piece 100 in accordance with an aspect may be plastic, but other suitable materials for both the metal layers and the substrate could be used without departing from the scope of the subject disclosure.
  • a non- conductive base substrate layer 110 such as a non-conductive plastic, may be rendered conductive in a variety of other suitable ways.
  • the work piece 100 may include or be formed of a conductive plastic.
  • a conductive paint may be applied over the base substrate layer 110 such that the part is suitable for receiving subsequent electroplated layers thereon.
  • the method can also include creating a barrier 114, 214,
  • a barrier 114 in electrical conductivity in the work piece 100 may be created, formed or disposed on the base substrate layer 110 prior to application of the electroless layer of material 108 to the work piece 100.
  • the step of creating a barrier 114 in the work piece 100 may include applying a plating resistant coating on the work piece to define the barrier 114 so as to substantially prevent the subsequent deposition of the electroless layer of material 108 on the barrier 114.
  • the plating resist coating may include a non-plateable plastic resin that may be applied to the surface.
  • the plating resist coating may be a polyvinyl chloride material, a polycarbonate material or the like that is applied to the substrate, such as by painting.
  • this material should substantially prevent the electroless layer of material 108 from being formed on areas of the base substrate layer 110 that are insulated from the area to which current is applied. It will also be appreciated that a variety of other suitable materials which resist plating may be employed. Such a material may vary depending on what kind of metal is being applied thereon by way of the electroless plating process. It should be appreciated that since the area of the barrier 114 is unable to receive the electroless layer of material 108, after the electroless layer of material 108 is applied on the remaining portions of the work piece 100, the first and second segments 116, 118 of the work piece 100 may each be configured as respective electrical circuits that are isolated from the other. As shown in FIG.
  • the barrier 114 may be formed on both a front surface 140 and a back surface 142 of the work piece 100 to ensure that they are electrically isolated from one another so long as current between the sections is isolated. While the barrier 114’ is illustrated as disposed opposite the barrier 114, it will be appreciated that they can be offset.
  • a barrier 214 in electrical conductivity in the work piece 100 may be created, formed or disposed on the base substrate layer 110 prior to application of an electroless layer of material 108 to the work piece 100.
  • the step of creating a barrier 214 in the work piece 100 may include molding a non-plateable material into or onto the work piece 100 to define the barrier 214 so as to substantially prevent the deposition of the electroless layer of material 108 on the barrier 214.
  • the non-plateable material may include a non-plateable plastic resin including, but not limited to, a polyvinyl chloride material, a polycarbonate material or the like.
  • the molding process for creating this layer may include a multi-shot injection molding process, a transfer molding process, an over-molding process or the like. It will be appreciated that a variety of other suitable molding processes may be employed. Again, it should be appreciated that since the area of the barrier 214 is unable to receive the electroless layer of material 108, after the electroless layer of material 108 is applied on the remaining portions of the work piece 100, the first and second segments 116, 118 of the work piece 100 may each function as respective electrical circuits that are isolated from one another. As shown in FIG.
  • the barrier 214 may be formed on both a front surface 140 and a back surface 142 of the work piece 100 to ensure that they are electrically isolated from one another. While the barrier 214’ is illustrated as disposed opposite the barrier 214, it will be appreciated that they can be offset so long as current between the sections is isolated. Additionally, as shown, the barrier 214’ may be larger in size and take up more of the back side 142 surface. [0038] According to a further aspect as exemplarily shown in FIG. 4, the step of creating a barrier 314 in electrical conductivity in the work piece 100 can alternately occur after the electroless layer of material 108 has been applied, and may include removing a portion of the electroless layer of material 108 to define the barrier 314 in electrical conductivity.
  • the barrier segment of the electroless layer of material 108 may be removed by a mechanical mechanism, chemical dissolution or the like. It will be appreciated that a variety of other suitable removing process may be employed. As shown in FIG. 4, according to an aspect, the barrier 314 may be formed on both a front surface 140 and a back surface 142 of the work piece 100 to ensure that they are electrically isolated from one another. While the barrier 314’ is illustrated as disposed opposite the barrier 314, it will be appreciated that they can be offset so long as current between the sections isolated.
  • the barrier 314 on the front surface can be formed utilizing one method and the barrier 314’ on the back surface can be formed utilizing another method.
  • the barrier 314 on the front surface can be formed via an injection molding method utilizing a material that is resistant to plating and the barrier 314’ on the back surface can be formed utilizing a spray resist coating. It will be appreciated that a variety of other suitable ways may be employed to create barriers to electrical conductivity.
  • the method may proceed with the step of connecting the positive terminal 104 of the power source 102 to a first anode 120, as generally indicated by reference number 14.
  • the first anode 120 may be made of a metal material and may be placed in a first aqueous solution 122 with current being applied to the first anode 120.
  • the first anode 120 may be soluble, where the material will dissolve into a first aqueous solution 122 as current is passed through it or insoluble, where the anode material will not dissolve into the solution as current is applied therethrough.
  • the first anode 120 could be constructed of a metal material, which may be utilized to form a first decorative surface or layer on the first portion or segment 116 of the work piece 100.
  • the metal material or first decorative surface may include, but is not limited to, copper, nickel, zinc, palladium, gold, cobalt, chromium (i.e., chrome), and alloys thereof.
  • the metal material from the first anode 120 may be used directly for plating purposes on the work piece 100.
  • the plating to the work piece 100 can occur from the metal ions available in the first aqueous solution 122, as will be understood by one of ordinary skill in the art.
  • the first anode 120 may be in the form of a solid mass of material that is insoluble or soluble, while the plating solution is composed of a plurality of metal salts necessary to achieve the desired plated layer.
  • the method proceeds with connecting the negative terminal
  • the method can proceed with 20 positively charging the first anode 120 and negatively charging the first segment 116 of the work piece 100 to cause the metal ions in the first aqueous solution 122, to be reduced to their metallic state at the solution interface of the first segment 116.
  • a layer of metal may then form on the first segment 116 because it is the only location on the work piece 100 that has a supply of electrons to reduce the metal salts to their respective metal state (i.e., Cu 2+ + 2e- Cu°). Because there is no supply of electrons on the second segment 118 (since it is electrically isolated), metal ions in the first aqueous solution 122 cannot be reduced to their metallic state.
  • the method can then continue with the step of removing the work piece 100 from the first aqueous solution 122 and connecting the positive terminal 104 of the power source 102 to a second anode 126, as generally indicated by reference number 22.
  • the second anode 126 may be made of a metal material, which may be utilized to form a second decorative surface or layer on the second portion or segment 118 of the work piece 100.
  • the first decorative surface and the second decorative surface may be different from one another.
  • the metal material or second decorative surface from which the second anode 126 can be comprised may include, but is not limited to, nickel, zinc, palladium, gold, cobalt, chromium (i.e., chrome), and alloys thereof. It will be appreciated that a variety of other suitable materials may also be employed.
  • the second anode 126 may be of a different metal than the metal of the first anode 120.
  • the second anode 126 may be in the form of a solid mass of material that is insoluble or soluble, while the plating solution is composed of a plurality of metal salts necessary to achieve the desired plated layer.
  • metal finishes can also be achieved utilizing the same anodes such as for example with a Bright Chrome part and a Satin Chrome part.
  • other contrasting metal finishes may be employed such as dark and bright trivalent and dark and bright hexavalent.
  • the outer perimeter of the grill may have a dark finish while the body of the grill may have a bright finish.
  • the method can then proceed with connecting the negative terminal 106 of the power source 102 to a second point of contact 130 on the second segment 118 of the work piece 100, as generally indicated by reference number 24.
  • the work piece 100 may then be immersed in the second aqueous solution 128 which contains the second anode 126, as generally indicated by reference number 25.
  • the method can continue with positively charging the second anode 126 and negatively charging the second segment 118 of the work piece 100 to cause metal ions from the second plating solution 126 to be passed onto the electroless layer 108 on the second segment 118 of the work piece 100 to form a second electroplated layer 132 on the second segment 118, as generally indicated by reference number 26. It should be appreciated that a metal layer only forms on the second segment 118 of the work piece 100 because the first and second segments 116, 118 are electrically insulated from one another by the barrier 114, 214, 314.
  • the first and second segments 116, 118 have different metallic finishes.
  • additional barriers 114, 214, 314 in conductivity could be made on the work piece 100 to provide additional segments that are electrically insulated from one another. Such additional segments could be electroplated in accordance with the aforementioned steps to provide for more than two segments of the work piece 100 that have different metallic finishes.
  • an intermediate electrolytic layer of copper from an acid copper plating solution may be applied to both the first and second segments 116, 118 after the electroless layer of material 108 is applied to the work piece 100, and prior to electroplating the first and second electroplated layers 124, 132 as described above. Applying this intermediate layer can build the metal thickness to a level that is sufficient to carry the current for electroplating of subsequent metal layers. After the intermediate copper layer has been electrodeposited to a sufficient thickness, an intermediate layer of sulfur-free nickel may be electroplated onto the copper surface to protect the copper from corrosion on all electrical pathways on the part.
  • the work piece 100 can be immersed in any suitable plating solution and electroplated as described above to provide the first and second electroplated layers 124, 132 to achieve the desired finishing effect. It should be appreciated that the method could alternatively proceed without these steps and other materials could be used in these steps in place of those described. It will additionally be appreciated that intermediate layers consisting of different materials could be applied to the first and second segments 116, 118 to provide different appearances for the work piece 100.
  • an electrophoretic coating may be selectively deposited on at least one of the sections of the work piece 100 in order to create different aesthetic affects. It will be appreciated that the deposition of the electrophoretic coating may occur in connection with the deposition of one or more different metal layers as discussed above. It will be appreciated that different electrophoretic coatings may be selectively deposited in the same fashion discussed above such that one electrophoretic coating may be applied to one section of a part without it being applied to another section of the part.
  • the barriers can be formed on both the front side 140 and the back side 142 of the work piece 100, metal layers are not deposited thereon, as discussed above.
  • a light source 150, 250, 350 may be disposed behind the work piece 100 and positioned to emit light into the barriers to provide a backlighting effect, as shown, to enhance aesthetics.
  • a transparent or translucent material at the barrier can assist with this effect, although non-translucent or non-transparent materials may also be employed.
  • the work piece 100 may be formed of resins of different colors to provide additional aesthetic affects.
  • FIG. 7 illustrates a plating tool 400 in accordance with an aspect of the disclosure.
  • the tool 400 can include a plating rack 402 with a plurality of rack tabs 404, which are configured to hold individual work pieces that are to be subjected to a plating process.
  • the plating tool 400 can include multiple current pathways, which may be referred to as a first circuit 406 and a second circuit 408. Each of the first circuit 406 and the second circuit 408 can be selectively actuated such that each of the circuits can be active at separate times as desired.
  • the first circuit 406 can be configured such that it is in communication with a first segment 116 of the work pieces 100 located on the rack tabs 404 of the plating rack 402 such that current is applied thereto to effectuate plating a metal layer onto the first segment 116.
  • the second circuit 408 can be configured such that it is in communication with a second segment 118 of the work pieces 100 located on the rack tabs 404 of the plating rack 402 such that current is applied thereto to effectuate plating of a separate metal layer onto the second segment 118.
  • the first circuit 406 can include a first power source
  • the first power source 410 can provide power to the first cathode 412 to charge at least a portion of one or more work pieces.
  • the first power source 410 may be in communication with the first cathode 412 via the first connector bushing 414.
  • the first cathode 412 may be integrated into the plating rack 402.
  • the second circuit 408 can include a second power source 416, a second cathode 418, and a second connector bushing 420.
  • the second power source 416 can provide power to the second cathode 418 to charge at least a portion of one or more work pieces.
  • the second power source 416 may be in communication with the second cathode 418 via the second connector bushing 420.
  • the second cathode 418 may also be integrated into the plating rack 402.
  • each of the circuits 406, 408 may be electrically insulated from each other. Additionally, each of the circuits 406, 408 can connect to separate power sources such that each of the circuits can be activated individually or simultaneously as desired. The use of separate circuits allows for the plating of different metals on a single work piece.
  • the plating rack 402 may be coated with a plate resistant coating to prevent rack plate-up as well as rack damage. The plate resistant coating may be Platisol, however, a variety of other suitable coatings may be employed.
  • an auxiliary anode may also be incorporated into the tooling to assist in the deposition of metal in areas where the electrical current density is limited, such as recessed areas.
  • One such multiple finish decorative part employs a floating metal look where the part includes a metal plated surface finish that appears to be surrounded by non-plated material.
  • These assemblies that are known to be made up of multiple components generally include a metallic finish surrounding a non- metallic finish. This practice while effective, results in multiple operations and multiple sets of tooling which adds significant cost to the final product thus making it impractical for commercial production.
  • IMD mold decoration
  • hot stamped foil processes can also be employed to achieve the desired floating metal look, but can be inferior from a performance standpoint and are geometrically limited. Specifically, processing constraints prohibit the foil from being recessed or flush with any plastic not coated with the foil. In other words, the foil must be the proudest surface on the part in order to effectively process the parts. Secondary trimming operations are also generally necessary with this process and add cost to the final part.
  • the floating metallized element assembly 520 can include a work piece 522 of a plateable resin 524 (i.e., can be rendered electrically conductive) and a non-plateable resin 526 (i.e., cannot be rendered electrically conductive by plating processes) and has a front side 528 and a back side 530. More specifically, the plateable and non-plateable resins 524, 526 of the floating metallized element assembly 520 can be co molded via a multi-shot or insert injection molding process, discussed in more detail below. It will be appreciated that a variety of other suitable forming processes may be employed. It will also be appreciated that a variety of suitable plateable and non-plateable resins may be employed. As shown, the assembly 520 can be configured as an automotive grill, however, it can take the form of a variety of suitable structures for different applications.
  • the work piece 522 may include at least one plated decorative region 532, 533 of the plateable resin 524 at the front side 528.
  • the work piece 522 can also include at least one network 534, 535 of the plateable resin 524 at the back side 530 (FIGS. 10 and 12).
  • the at least one network 534, 535 of the plateable resin 524 could include a plurality of networks 534, 535 or circuits on the back side 530 of the floating metallized element assembly 520 that are separate and not connected (FIG. 10).
  • Multiple networks 534, 535 can allow multiple metallized finishes on the same part (e.g., different from one another), such as a bright chrome finish and a satin chrome finish on different plated resin regions 532, 533.
  • the work piece 522 may additionally include a plurality of discrete current paths 536 of the plateable resin 524 extending from the at least one network 534, 535 to the at least one plated decorative region 532, 533.
  • these discrete current paths 536 can extend to the front side 528 of the work piece 522 such that they are not directly visible by viewers (i.e., from the front) when the floating metallized element assembly 520 in its appropriate position (e.g., installed on a vehicle).
  • the work piece 522 can include at least one non-plated decorative region 538 of the non-plateable resin 526 adjacent to the at least one plated decorative region 532, 533.
  • the discrete current paths 536 can extend along an underside of the floating metallized element assembly 520 (FIG. 9) or may be completely encased or surrounded by the non-plateable resin 526 in the non-plated decorative region 538 (FIGS. 13-16).
  • the visible front side 528 of the part or floating metallized element assembly 520 will have what appears to be one or more floating metallized elements while the non-visible backside of the part can have a non-visible network 534, 535 of plateable material that connects each floating element so that current can flow from the connection point (i.e., rack tab).
  • the at least one plated decorative region 532, 533 can therefore include a plurality of plated decorative regions 532, 533 (e.g., afirst plated decorative region 532 and a second plated decorative region 533) and each of the plurality of plated decorative regions 532, 533 couples to a different one of the plurality of networks 534, 535.
  • discrete current paths 536 can be formed from plateable resin 524 as described above, such discrete current paths 536 could be combined with or otherwise formed using a through-hole or slot 539 that extends from the front side 528 to the back side 530 of the floating metallized element assembly 520. Specifically, plating could occur on the front side 528 through the very small, but discrete through-hole or slot 539 that provides the current path 536 from the back side 530 of the part to the front side 528. Such a through-hole or slot 539 can allow current to pass and thus electroplate to deposit on the front side 528 of the part via the through hole 539 from the back side 530.
  • At least one metal surface 540, 541 can be adhered to and disposed on the at least one plated decorative region 532, 533. It should be appreciated that while the at least one metal surface 540, 541 of the floating metallized element assembly 520 may be chromium (i.e., chrome), suitable metals for plating according to the disclosure may include other metals such as copper, nickel, zinc, palladium, gold, cobalt, and alloys thereof. In addition, the at least one metal surface 540, 541, can be a plurality of metal surfaces 540, 541, each with a different finish (e.g., satin chrome and bright chrome) and/or metal.
  • a different finish e.g., satin chrome and bright chrome
  • the at least one metal surface 540, 541 may be disposed on the plated decorative region 532, 533 in a variety of suitable ways, such as by conventional metal plating processes. As best shown in FIGS. 15 and 16, the at least one metal surface 540, 541 can also include various textures to provide further aesthetic characteristics. Additionally, according to another aspect, the one or both of the at least one plated decorative region 532, 533 and/or the non-plated decorative region 538 may include separate textures to yield up to four additional surface finishes. According to yet another aspect, the non-plateable resin 526 may be a colored resin to yield enhanced aesthetics.
  • the workpiece 522 can include a third material to provide another surface finish such as a translucent non-plateable resin for that may be used for lighting purposes in the non-plateable areas.
  • the plurality of networks 534, 535 can not only allow multiple metallized finishes on the same part, they may also provide better coverage of plurality of metal surfaces 540, 541 over the plateable resin 524, for instance to the periphery or far away from the plurality of networks 534, 535 (the plating thickness and/or density of the metallized finish may diminish further from a point of contact in which an electrical power source is connected to the work piece 522 at the plurality of networks 534, 535 and further from the plurality of networks 534, 535 themselves). So, the plurality of metal surfaces 540, 541 may not include different finishes and instead may provide for better coverage of the same finish, according to an aspect.
  • the present disclosure also relates to a method of manufacturing a floating metallized element assembly 520, illustrated in FIGS. 17A-17B.
  • the method can include the step of 600 initiating a multi-shot injection process to mold a work piece 522.
  • the method can continue by 602 forming at least one non-plated region 538 on a visible front side 528 of the work piece 522 from a non-plateable resin 526.
  • the non-plated region 538 may be decorative (i.e., includes additional surface treatments, such as a texture or color) or non-decorative.
  • the at least one plated decorative region 532, 533 may be formed on a visible front side 528 of the work piece 522 from a plateable resin 524 (e.g., plateable ABS or PC/ABS resin), as generally indicated by reference number 604.
  • a plateable resin 524 e.g., plateable ABS or PC/ABS resin
  • the method can include the step 606 of forming at least one network 534, 535 (e.g., a plurality of networks 534, 535) from the plateable resin 524 on a non- visible back side 530 of the work piece 522.
  • the method may then proceed by 608 forming a plurality of discrete current paths 36 from the plateable resin 524 extending from the at least one network 534, 535 to the at least one decorative plated region 532, 533.
  • at least one non-plated decorative region 538 may be formed from the non-plateable resin 526 surrounding the plurality of discrete current paths 536 and the at least one plated decorative region 532, 533, as generally indicated by reference number 610.
  • the non-plateable resin 526 is preferably molded first and the plateable resin 524 is added in the second shot of the molding process (e.g., overmolded). It will be appreciated that the sequencing can obviously vary.
  • the method can continue at step 612 by preparing the surface of the plateable resin, including the at least one plated decorative region 532, 533 and the discrete current paths 536 for plating, such as by etching these areas. It will be appreciated that these surfaces can be etched in a variety of suitable ways, including in an acid etch.
  • a catalyst may be deposited on the at least one plateable region 532, 533.
  • a metal plated layer may be deposited on the plateable surface in an electroless process, as is known in the art.
  • a power source may be provided, as generally indicated by step 618.
  • a positive terminal of the power source may be connected to an anode.
  • the electrical power source could, for example, be a battery, however, it will be appreciated that a variety of other suitable power sources may be employed.
  • the method can proceed by 622 immersing the anode in an aqueous solution.
  • a negative terminal of the power source can be connected to a point of contact on the at least one network 534, 535 of plateable resin 524 of the work piece 522.
  • the work piece 522 may be immersed in the aqueous solution, as generally indicated by reference number 626.
  • the anode may be positively charged using the positive terminal of the power source, as generally indicated by reference number 628. Thereafter, the plurality of networks 534, 535 and plurality of plated decorative regions 532, 533 of the plateable resin may be negatively charged (separately for different plating and/or finishes) through the point of contact using the negative terminal of the power source, as generally indicated by reference number 630. At least one metal surface 540, 541 is then plated on the at least one decorative plateable region, as generally indicated by reference number 632. It will be appreciated that other materials to provide further surface finishes may be employed.
  • positively charging the anode and negatively charging the at least one network 534, 535 and the at least one plated decorative region 532, 533 of the plateable resin 524 can cause the metal ions in the aqueous solution to be reduced to their metallic state at the solution interface of the plated decorative region 532.
  • At least one layer of metal i.e., the at least one metal surface 540, 541 may then form on the at least one plated decorative region 532, 533 because it is the only location on the work piece 522 that has a supply of electrons to reduce the metal salts to their respective metal state (i.e., Cu 2+ + 2e- Cu°).
  • multiple networks 534, 535 are utilized to provide multiple and/or different chrome plate finishes on the same part (e.g., bright chrome finish and a satin chrome finish on the same part), separate power sources can be utilized to provide an increased or decreased electrical current through the terminals of the power source and/or additional anodes or aqueous solutions may be utilized to provide for the varied finishes.
  • the multiple networks 534, 535 thus can be utilized (i.e., connected to and powered by a power source) simultaneously or in a successive fashion.
  • the method therefore can produce a floating metallized element assembly 520 or plated decorative component having at least one chrome or metalized element adjacent to or surrounded by areas that are not metalized.
  • the metalized elements or areas are located on the front side 528 of the floating metallized element assembly 520 and the discrete current paths 536 connected to the at least one network 534, 535 on the back side 530 are not directly visible by a viewer when the component is in its appropriate position (e.g., installed on the vehicle).
  • the floating metallized element assembly and method of manufacturing thereof disclosed herein advantageously utilizes less metal than other techniques, such as mask and paint techniques.
  • the floating metallized element assembly is capable of meeting performance specifications required of decorative exterior parts of vehicles, for example.
  • the floating metallized element assembly disclosed herein gives the appearance of floating chrome elements when assembled in car position, without requiring secondary operations after plating (i.e., paint).
  • the floating metallized assembly 700 can include a work piece 702 formed of a plateable resin 704 and a non-plateable resin 706.
  • the work piece 702 includes a front side 708 and a back side 710.
  • the floating element assembly 700 can be formed by a variety of different methods or processes.
  • the floating element assembly can also take on a variety of different configurations for a variety of different applications as will be appreciated by a person of ordinary skill.
  • the work piece 702 may include at least one plated decorative region 712 of the plateable resin 704 at the front side 708.
  • the work piece 902 may also include a conductive insert 714 that can be placed into the mold such that the non-plateable resin 706 and the plateable resin 704 when injected into the mold are injected around the conductive insert 714 such that it is encapsulated in the work piece 702.
  • the conductive insert 714 may be located in the mold such that its first surface 716 passes through and past the non-conductive resin portion 706 of the work piece 702 and communicates with the plateable resin 704.
  • the conductive insert 714 may also be disposed in the mold such that it has a second surface 718 that is exposed on a back side 710 of the work piece 702.
  • the conductive insert 714 may be configured as a metal pin. However, a variety of other suitable structures may be employed.
  • the second surface 718 or other adjacent portion of the conductive insert 714 may be placed in communication with the power source such that current can be passed to the plateable resin 704 by the conductive insert 714.
  • the conductive insert 714 will allow electricity (electrons) to flow through the plastic part via the conductive insert 714 and onto the surface of the plateable resin 704 on the front side 708. This can allow the exposed first surface 716 of the conductive insert 714 to completely plate over without the conductive insert 714 being visible so as to provide a floating metallized element.
  • the first surface 716 of the conductive insert 714 may be slightly proud of the non- plateable surface 706 such that electricity can flow directly to the plateable surface 704. This aspect can yield another assembly 700 with floating metal plated elements without the separate plateable circuits or network.
  • the floating metallized elements i.e., the metal plated regions may also provide functionality benefits in addition to the aesthetic benefits described herein.
  • the floating metallized elements can serve to respond to touch in order to serve touch applications.
  • a capacitive touch sensor could be disposed on the backside of the part and in communication with the floating element such that it serves a“button” or a“switch” so that it not only functions as decoration but has a functional aspect as well.
  • touching or depressing the metallized element can result in an associated function, such as turning on a light or other function.
  • first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as“first,”“second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
  • spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as“below” or“beneath” other elements or features would then be oriented“above” the other elements or features. Thus, the example term“below” can encompass both an orientation of above and below.
  • the device or assembly may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

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  • Organic Chemistry (AREA)
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Abstract

L'invention concerne un ensemble élément métallisé flottant et son procédé de fabrication. L'ensemble élément métallisé flottant comprend une pièce constituée d'une résine pouvant être plaquée et d'une résine ne pouvant pas être plaquée comprenant un côté avant et un côté arrière. La pièce comprend au moins une zone décorative plaquée sur la résine pouvant être plaquée sur le côté avant. La pièce comprend également au moins un réseau de la résine pouvant être plaquée sur le côté arrière. La pièce comprend en outre une pluralité de trajets de courant discrets de la résine pouvant être plaquée s'étendant depuis ledit ou lesdits réseaux vers ladite ou lesdites zones décoratives plaquées. La pièce comprend également au moins une zone décorative non plaquée constituée de la résine ne pouvant pas être plaquée adjacente à ladite ou auxdites zones décoratives. Des surfaces métalliques sont collées et disposées sur ladite ou lesdites zones décoratives plaquées.
PCT/US2019/020673 2018-03-05 2019-03-05 Ensemble élément métallisé flottant et son procédé de fabrication WO2019173282A1 (fr)

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US15/911,694 US11326268B2 (en) 2015-05-14 2018-03-05 Floating metallized element assembly and method of manufacturing thereof

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WO2021150849A1 (fr) * 2020-01-22 2021-07-29 Lacks Enterprises, Inc. Composant décoratif translucide sélectivement métallisé et son procédé de fabrication

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US20090117398A1 (en) * 2007-11-06 2009-05-07 Trw Automotive Safety Systems Gmbh Partly chrome-plateable device and method of manufacturing the same
US20160237583A1 (en) * 2013-10-11 2016-08-18 Magna International Inc. Selective chroming
US20160333491A1 (en) * 2015-05-14 2016-11-17 Lacks Enterprises, Inc. Method for creating multiple electrical current pathways on a work piece
US20170341609A1 (en) * 2016-05-27 2017-11-30 Srg Global Inc. Vehicle exterior components having discontinuous plated features

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Publication number Priority date Publication date Assignee Title
US20090117398A1 (en) * 2007-11-06 2009-05-07 Trw Automotive Safety Systems Gmbh Partly chrome-plateable device and method of manufacturing the same
US20160237583A1 (en) * 2013-10-11 2016-08-18 Magna International Inc. Selective chroming
US20160333491A1 (en) * 2015-05-14 2016-11-17 Lacks Enterprises, Inc. Method for creating multiple electrical current pathways on a work piece
US20170341609A1 (en) * 2016-05-27 2017-11-30 Srg Global Inc. Vehicle exterior components having discontinuous plated features

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021150849A1 (fr) * 2020-01-22 2021-07-29 Lacks Enterprises, Inc. Composant décoratif translucide sélectivement métallisé et son procédé de fabrication
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