WO2019171734A1 - Dispositif et procédé de traitement de substrat - Google Patents

Dispositif et procédé de traitement de substrat Download PDF

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Publication number
WO2019171734A1
WO2019171734A1 PCT/JP2018/048469 JP2018048469W WO2019171734A1 WO 2019171734 A1 WO2019171734 A1 WO 2019171734A1 JP 2018048469 W JP2018048469 W JP 2018048469W WO 2019171734 A1 WO2019171734 A1 WO 2019171734A1
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Prior art keywords
temperature
processing liquid
time
dispensing process
substrate
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PCT/JP2018/048469
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English (en)
Japanese (ja)
Inventor
喬 太田
昌之 林
次郎 奥田
章宏 中島
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Application filed by 株式会社Ｓｃｒｅｅｎホールディングス filed Critical 株式会社Ｓｃｒｅｅｎホールディングス
Priority to KR1020207028010A priority Critical patent/KR102356420B1/ko
Priority to CN201880090875.1A priority patent/CN111886677A/zh
Priority to US16/979,194 priority patent/US11569104B2/en
Publication of WO2019171734A1 publication Critical patent/WO2019171734A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate with a processing liquid.
  • the substrate processing apparatus described in Patent Document 1 is a single wafer type that processes substrates one by one. Then, the substrate processing apparatus mixes a phosphoric acid aqueous solution at room temperature and a high-temperature sulfuric acid aqueous solution having a temperature higher than the boiling point of the phosphoric acid aqueous solution in a supply pipe, and a mixed solution of phosphoric acid, sulfuric acid, and water. Generate.
  • the phosphoric acid aqueous solution mixed with the sulfuric acid aqueous solution is heated by the heat of the sulfuric acid aqueous solution. Furthermore, heat of dilution is generated by mixing the phosphoric acid aqueous solution and the sulfuric acid aqueous solution.
  • the phosphoric acid aqueous solution mixed with the sulfuric acid aqueous solution is heated not only by the heat of the sulfuric acid aqueous solution but also by the heat of dilution. Therefore, the phosphoric acid aqueous solution contained in the mixed solution is heated to near the boiling point, and a mixed solution containing the phosphoric acid aqueous solution near the boiling point (hereinafter referred to as “treatment solution”) is discharged onto the substrate.
  • treatment solution a mixed solution containing the phosphoric acid aqueous solution near the boiling point
  • processing start temperature the temperature of the processing liquid at the start of processing
  • the difference between the temperature of the environment surrounding the substrate accommodated in the substrate processing apparatus (hereinafter referred to as “environment temperature”) and the temperature of the processing solution is large.
  • the difference in temperature at the start of processing between the substrates becomes larger than when a processing solution that is not high in temperature is used.
  • a processing liquid is adjusted to a predetermined temperature in a processing liquid tank that stores the processing liquid and a circulation pipe that circulates the processing liquid in a preparation stage for supplying the processing liquid to the substrate. Measures are being taken.
  • the temperature at the start of processing fluctuates slightly among the plurality of substrates due to the fact that the temperature of the supply piping branched from the circulation piping and supplying the processing liquid to the nozzles may differ between the plurality of substrates.
  • the processing results with the processing liquid vary among a plurality of substrates despite the temperature adjustment of the processing liquid tank and the circulation piping. There was a problem that occurred.
  • the inventor of the present application paid attention to the temperature of the processing liquid in the pre-dispensing process, and examined in detail the cause of the variation in the processing results between the plurality of substrates.
  • FIG. 13 is a diagram showing a temperature transition of the processing liquid in a general substrate processing apparatus.
  • the horizontal axis indicates time, and the vertical axis indicates the temperature of the processing liquid.
  • Time t0 indicates the discharge start time of the processing liquid in the pre-dispensing process.
  • Time t1 indicates the discharge stop time of the processing liquid in the pre-dispensing process. That is, time t1 indicates the end time of the pre-dispensing process.
  • Time t2 indicates the start time of substrate processing using the processing liquid.
  • the temperature Tc indicates the environmental temperature.
  • Curve Ca1 shows the temperature transition of the processing solution in the pre-dispensing process and the substrate process for the first substrate.
  • a curve Ca2 indicates a temperature transition of the processing liquid in the pre-dispensing process and the substrate process for the second substrate.
  • a curve Ca3 shows the temperature transition of the processing liquid in the pre-dispensing process and the substrate process for the third substrate.
  • the pre-dispensing process is executed. Then, the substrate processing with the processing liquid is performed in the period SP after time t2.
  • the temperature of the treatment liquid at the end time t1 of the pre-dispensing treatment is the temperature Ta1.
  • the temperature of the treatment liquid at the end time t1 of the pre-dispensing process is the temperature Ta2.
  • the temperature of the processing liquid at the end time t1 of the pre-dispensing process is the temperature Ta3.
  • the temperature Ta1 is lower than the temperature Ta2 and the temperature Ta3, and the temperature Ta2 is lower than the temperature Ta3. This is because the temperature of the supply pipe branched from the circulation pipe is lowest when the processing liquid is supplied for the first substrate and then gradually increases. In particular, when the waiting time of the substrate processing apparatus is relatively long, the temperature of the supply pipe is lower in the pre-dispensing process for the first substrate than in the pre-dispensing process for the second and subsequent substrates. The influence of the difference in the temperature of the supply pipe during the pre-dispensing process among the plurality of substrates is particularly remarkable when a high-temperature processing liquid is used.
  • the temperature of the processing liquid at the start time t2 of the substrate processing is also different among the three substrates. As a result, there may be some variation in processing results between the three substrates.
  • the inventor of the present application when the temperature of the processing liquid at the end time of the pre-dispensing process is different between the plurality of substrates, the processing result is slightly different between the plurality of substrates. I found out that there might be variations.
  • the inventors of the present application conducted intensive research on the substrate processing apparatus and the substrate processing method from the viewpoint of pre-dispensing processing.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of improving the uniformity of a processing result using a processing liquid between a plurality of substrates.
  • the substrate processing apparatus processes a substrate with a processing liquid.
  • the substrate processing apparatus includes a substrate holding unit, a nozzle, a supply adjusting unit, a liquid receiving unit, a temperature detecting unit, and a control unit.
  • the substrate holding unit rotates while holding the substrate.
  • the nozzle discharges the processing liquid onto the held substrate.
  • the supply adjusting unit adjusts the supply amount of the processing liquid to the nozzle.
  • the liquid receiving part is located outside the substrate holding part and receives the processing liquid discharged by the nozzle.
  • the temperature detection unit detects the temperature of the processing liquid before the temperature of the processing liquid during the pre-dispensing process reaches the target temperature.
  • the control unit controls the supply adjusting unit according to the pre-dispensing process condition to execute the pre-dispensing process.
  • the pre-dispensing process indicates a process of discharging the processing liquid toward the liquid receiving unit before discharging the processing liquid onto the substrate.
  • the control unit sets a discharge stop time of the processing liquid in the pre-dispensing process based on a target temperature prediction time.
  • the target temperature prediction time indicates the prediction time until the temperature of the processing liquid reaches the target temperature from the detected temperature.
  • the detected temperature indicates the temperature of the processing liquid detected by the temperature detector before reaching the target temperature.
  • the target temperature prediction time is determined based on a temperature profile.
  • the temperature profile indicates a record of a time transition of the temperature of the processing liquid when the pre-dispensing process is executed in the past according to the pre-dispensing process condition.
  • control unit determines the target temperature prediction time according to the detected temperature of the processing liquid based on the temperature profile.
  • the temperature detection unit detects that the temperature of the processing liquid has reached a predetermined temperature during the pre-dispensing process.
  • the predetermined temperature is preferably lower than the target temperature.
  • the control unit stops the discharge of the processing liquid in the pre-dispensing process. It is preferable to control the supply adjusting unit.
  • the temperature detection unit detects the temperature of the processing liquid at a predetermined detection time during execution of the pre-dispensing process.
  • the predetermined detection time preferably indicates a time before the temperature of the processing solution reaches the target temperature.
  • the control unit controls the supply adjusting unit so as to stop the discharge of the processing liquid in the pre-dispensing process.
  • control unit performs the pre-dispensing process by controlling the supply adjusting unit according to a pre-dispensing process condition selected from a plurality of the pre-dispensing process conditions. It is preferable that the pre-dispensing process condition when recording the time transition of the temperature in the temperature profile is the same as the selected pre-dispensing process condition.
  • the temperature profile is obtained when the pre-dispensing process is performed in the past according to the pre-dispensing process condition when the state of the substrate processing apparatus is a state indicated by status information. It is preferable to show a record of the temperature over time.
  • the status information includes information indicating an elapsed time from the completion of the latest substrate processing and information indicating how many substrates are held by the substrate holding unit when processing the substrates one by one. It is preferable that information of at least one of them is included.
  • the processing liquid preferably contains phosphoric acid or a sulfuric acid / hydrogen peroxide mixture.
  • the substrate processing apparatus of the present invention preferably further includes a plurality of chambers. It is preferable that each of the chambers includes the substrate holding unit, the nozzle, the supply adjusting unit, the liquid receiving unit, and the temperature detecting unit. Each of the plurality of chambers preferably accommodates the substrate holding unit, the nozzle, the supply adjusting unit, the liquid receiving unit, and the temperature detecting unit. It is preferable that the control unit sets a discharge stop time of the processing liquid in the pre-dispensing process based on the target temperature prediction time for each chamber.
  • the substrate processing method is executed by a substrate processing apparatus that processes a substrate with a processing liquid.
  • the substrate processing method includes a pre-dispensing step of performing pre-dispensing processing according to pre-dispensing processing conditions.
  • the pre-dispensing process indicates a process of discharging the processing liquid toward the liquid receiving part before discharging the processing liquid onto the substrate.
  • the pre-dispensing step includes detecting the temperature of the processing liquid before the temperature of the processing liquid during the pre-dispensing process reaches the target temperature, and the pre-dispensing process based on the target temperature prediction time.
  • the target temperature prediction time indicates the prediction time until the temperature of the processing liquid reaches the target temperature from the detected temperature.
  • the detected temperature indicates the temperature of the processing liquid detected before reaching the target temperature by the detecting step.
  • the target temperature prediction time is determined based on a temperature profile.
  • the temperature profile indicates a record of a time transition of the temperature of the processing liquid when the pre-dispensing process is executed in the past according to the pre-dispensing process condition.
  • the target temperature prediction time corresponding to the detected temperature of the processing liquid is determined based on the temperature profile.
  • the pre-dispensing process stops the discharge of the processing liquid in the pre-dispensing process when the target temperature prediction time has elapsed from the time when it is detected that the temperature of the processing liquid has reached the predetermined temperature. It is preferable to further include a termination step.
  • the detection step detects the temperature of the processing liquid at a predetermined detection time during execution of the pre-dispensing process.
  • the predetermined detection time preferably indicates a time before the temperature of the processing solution reaches the target temperature.
  • the pre-dispensing step further includes a pre-dispensing end step of stopping the discharge of the processing liquid in the pre-dispensing process when the target temperature prediction time has elapsed from the predetermined detection time.
  • the pre-dispensing process is performed according to pre-dispensing process conditions selected from a plurality of the pre-dispensing process conditions. It is preferable that the pre-dispensing process condition when recording the time transition of the temperature in the temperature profile is the same as the selected pre-dispensing process condition.
  • the temperature profile is obtained when the pre-dispensing process is performed in the past according to the pre-dispensing process condition when the state of the substrate processing apparatus is a state indicated by status information. It is preferable to show a record of the temperature over time.
  • the state information includes information indicating an elapsed time from the completion of the latest substrate processing and information indicating how many substrates are held by the substrate holding unit when processing the substrates one by one. It is preferable to include at least one of the information.
  • the processing solution preferably contains phosphoric acid or a sulfuric acid / hydrogen peroxide mixed solution.
  • the pre-dispensing step is performed for each of a plurality of chambers that respectively accommodate a plurality of the substrates.
  • the uniformity of the processing result by the processing liquid can be improved between a plurality of substrates.
  • FIG. 2 is a plan view showing the inside of a processing unit of the substrate processing apparatus according to Embodiment 1.
  • FIG. It is a figure which shows the temperature profile of the substrate processing apparatus which concerns on Embodiment 1.
  • FIG. It is a figure which shows the temperature transition of the process liquid in the substrate processing apparatus which concerns on Embodiment 1.
  • FIG. 3 is a flowchart illustrating a substrate processing method executed by the substrate processing apparatus according to the first embodiment. It is a figure which shows the temperature transition of the process liquid in the substrate processing apparatus which concerns on Embodiment 2 of this invention. It is a figure which shows the temperature profile of the substrate processing apparatus which concerns on Embodiment 2.
  • FIG. 3 is a flowchart illustrating a substrate processing method executed by the substrate processing apparatus according to the first embodiment. It is a figure which shows the temperature transition of the process liquid in the substrate processing apparatus which concerns on Embodiment 2 of this invention. It is a figure which shows the temperature profile of the substrate processing apparatus which concerns on Embodiment 2.
  • FIG. 6 is a flowchart illustrating a substrate processing method executed by the substrate processing apparatus according to the second embodiment. It is a conceptual diagram which shows the pre-dispensing process conditions and temperature profile which were memorize
  • the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are parallel to the horizontal direction, and the Z axis is parallel to the vertical direction.
  • FIG. 1 is a diagram showing a substrate processing apparatus 100.
  • the substrate processing apparatus 100 processes the substrate W with a processing liquid.
  • the substrate processing apparatus 100 is a single wafer type that processes the substrates W one by one.
  • the substrate W has a substantially disk shape.
  • the processing of the substrate W by the processing liquid may be referred to as “substrate processing”.
  • the substrate processing apparatus 100 includes a processing unit 1, a supply adjusting unit 2, and a control device 3.
  • the processing unit 1 discharges the processing liquid onto the substrate W to process the substrate W.
  • the processing unit 1 includes a chamber 10, a spin chuck 11, a nozzle 12, a supply pipe 13, a nozzle moving unit 14, a liquid receiving unit 15, a cup 16, and a temperature detection unit 17. Including.
  • the chamber 10 has a substantially box shape.
  • the chamber 10 accommodates the substrate W, the spin chuck 11, the nozzle 12, a part of the supply pipe 13, the nozzle moving unit 14, the liquid receiving unit 15, the cup 16, and the temperature detection unit 17.
  • the spin chuck 11 rotates while holding the substrate W.
  • the spin chuck 11 corresponds to an example of a “substrate holder”. Specifically, the spin chuck 11 rotates the substrate W around the rotation axis A ⁇ b> 1 while holding the substrate W horizontally in the chamber 10.
  • the spin chuck 11 includes a plurality of chuck members 110, a spin base 111, and a spin motor 112.
  • the plurality of chuck members 110 hold the substrate W in a horizontal posture.
  • the spin base 111 has a substantially disc shape and supports the plurality of chuck members 110 in a horizontal posture.
  • the spin motor 112 rotates the spin base 111 to rotate the substrate W held by the plurality of chuck members 110 around the rotation axis A1.
  • the nozzle 12 discharges the processing liquid toward the substrate W.
  • the treatment liquid is a chemical liquid.
  • the processing liquid contains phosphoric acid.
  • the processing liquid includes a sulfuric acid / hydrogen peroxide mixture (SPM).
  • SPM sulfuric acid / hydrogen peroxide mixture
  • a treatment liquid containing phosphoric acid or SPM is an example of a treatment liquid used at a high temperature.
  • the supply pipe 13 is connected to the nozzle 12.
  • the supply pipe 13 supplies the processing liquid to the nozzle 12.
  • the temperature of the processing liquid supplied to the supply pipe 13 is a specified temperature higher than room temperature (hereinafter referred to as “specified temperature TM”) in a circulation pipe (not shown) arranged upstream of the supply pipe 13.
  • the above specific temperature is maintained.
  • the specified temperature TM indicates a temperature at which a specified processing rate (for example, a specified etching rate or a specified object removal rate) can be realized for the substrate W.
  • the specified temperature TM indicates a temperature at which a specified processing result (for example, a specified etching amount or a specified object removal amount) can be achieved with respect to the substrate W within a specified time.
  • the specified temperature TM is, for example, 175 ° C. in the treatment liquid containing phosphoric acid.
  • the specified temperature TM is, for example, 200 ° C. in the processing liquid containing SPM.
  • the supply adjusting unit 2 adjusts the supply amount of the processing liquid to the nozzle 12.
  • the supply adjusting unit 2 is disposed in the supply pipe 13 outside the chamber 10.
  • the supply adjusting unit 2 may be disposed in the supply pipe 13 inside the chamber 10.
  • the supply adjusting unit 2 sets the supply amount of the processing liquid to the nozzle 12 to zero and stops the supply of the processing liquid to the nozzle 12.
  • the supply adjusting unit 2 supplies the processing liquid to the nozzle 12 by increasing the supply amount of the processing liquid to the nozzle 12 from zero.
  • the supply adjusting unit 2 adjusts the flow rate of the processing liquid supplied to the nozzle 12.
  • the supply adjustment unit 2 includes a valve 20, a flow meter 21, and a flow rate adjustment valve 22.
  • the supply start and stop of the supply of the processing liquid to the nozzle 12 are switched by the valve 20.
  • the valve 20 is an open / close valve and can be switched between an open state and a closed state.
  • the open state is a state in which the processing liquid flowing in the supply pipe 13 is passed toward the nozzle 12.
  • the closed state is a state in which the supply of the processing liquid from the supply pipe 13 to the nozzle 12 is stopped.
  • the flow meter 21 detects the flow rate of the processing liquid supplied to the nozzle 12.
  • the flow rate adjustment valve 22 adjusts the flow rate of the processing liquid supplied to the nozzle 12.
  • the valve 20 When the valve 20 is opened, the processing liquid is supplied from the supply pipe 13 to the nozzle 12 at a flow rate corresponding to the opening degree of the flow rate adjustment valve 22. As a result, the processing liquid is discharged from the nozzle 12.
  • the opening degree indicates the degree to which the flow rate adjustment valve 22 is open.
  • the cup 16 has a substantially cylindrical shape.
  • the cup 16 receives the processing liquid discharged from the substrate W.
  • the temperature detector 17 detects the temperature of the processing liquid in the chamber 10. Then, the temperature detection unit 17 outputs information indicating the temperature of the processing liquid to the control device 3. In the first embodiment, the temperature detection unit 17 detects the temperature of the processing liquid in the supply pipe 13. Specifically, a temperature measuring unit (not shown) of the temperature detection unit 17 comes into contact with the processing liquid in the supply pipe 13 and detects the temperature of the processing liquid. The temperature detector 17 may detect the temperature of the processing liquid in the supply pipe 13 in the vicinity of the nozzle 12, or detect the temperature of the processing liquid in the supply pipe 13 at a position relatively away from the nozzle 12. Also good.
  • the temperature detection unit 17 includes a temperature sensor.
  • the temperature sensor includes, for example, a thermocouple and a measuring instrument. Specifically, a thermocouple is inserted into the supply pipe 13. And a thermocouple detects the temperature of the process liquid in the supply piping 13, and outputs the voltage signal corresponding to temperature to a measuring device.
  • the measuring instrument converts the voltage signal into a temperature and outputs information indicating the temperature to the control device 3.
  • the measuring instrument may be disposed in the chamber 10 or may be disposed outside the chamber 10.
  • the temperature measuring contact of the thermocouple may be arranged in the vicinity of the nozzle 12 in the supply pipe 13 or may be arranged at a position relatively distant from the nozzle 12. The temperature measuring contact corresponds to the temperature measuring unit of the temperature detecting unit 17.
  • the temperature detection part 17 may detect the temperature of a process liquid indirectly by detecting the temperature of the outer surface of the supply piping 13.
  • the temperature detection unit 17 may detect the temperature of the processing liquid inside the nozzle 12 or may detect the temperature of the processing liquid indirectly by detecting the temperature of the outer surface of the nozzle 12. Good.
  • the temperature detection unit 17 may detect the temperature of the processing liquid on the substrate W after the processing liquid is discharged onto the substrate W.
  • the temperature detection unit 17 includes a radiation thermometer or an infrared thermography. The radiation thermometer measures the temperature of the processing liquid discharged onto the substrate W by measuring the intensity of infrared light or visible light emitted from the processing liquid discharged onto the substrate W. Then, the radiation thermometer outputs information indicating the temperature of the processing liquid to the control device 3.
  • Infrared thermography includes an infrared camera. In the infrared thermography, infrared rays emitted from the processing liquid discharged onto the substrate W are detected by an infrared camera. Further, the infrared thermography analyzes an image representing the detected infrared ray and calculates the temperature of the processing liquid discharged onto the substrate W. The infrared thermography outputs information indicating the temperature of the processing liquid to the control device 3.
  • FIG. 2 is a plan view showing the inside of the processing unit 1.
  • the nozzle moving unit 14 rotates around the rotation axis A2 to move the nozzle 12 horizontally.
  • the nozzle moving unit 14 moves the nozzle 12 horizontally between the processing position PS1 of the nozzle 12 and the standby position PS2.
  • the processing position PS1 indicates a position above the substrate W.
  • the nozzle 12 positioned at the processing position PS1 is indicated by a two-dot chain line.
  • the standby position PS ⁇ b> 2 indicates a position outside the spin chuck 11 and the cup 16.
  • the nozzle moving unit 14 can also move the nozzle 12 vertically.
  • the liquid receiver 15 is located outside the spin chuck 11 and the cup 16. Specifically, the liquid receiver 15 is located below the standby position PS2 of the nozzle 12. The liquid receiver 15 receives the processing liquid discharged by the nozzle 12 in the pre-dispensing process.
  • the pre-dispensing process indicates a process of discharging the processing liquid toward the liquid receiving unit 15 before discharging the processing liquid onto the substrate W. Specifically, when the substrate processing apparatus 100 performs the pre-dispensing process, the nozzle moving unit 14 lowers the nozzle 12 from the standby position PS ⁇ b> 2 and moves the nozzle 12 to the liquid receiving unit 15. Then, the nozzle 12 discharges the processing liquid toward the liquid receiving portion 15.
  • the control device 3 includes a control unit 30 and a storage unit 31.
  • the control unit 30 includes a processor such as a CPU (Central Processing Unit).
  • the storage unit 31 includes a storage device and stores data and a computer program.
  • the storage unit 31 includes a main storage device such as a semiconductor memory and an auxiliary storage device such as a semiconductor memory and / or a hard disk drive.
  • the storage unit 31 may include a removable medium.
  • the processor of the control unit 30 executes the computer program stored in the storage device of the storage unit 31 to control the processing unit 1 and the supply adjustment unit 2.
  • the control unit 30 controls the supply adjusting unit 2 and the nozzle moving unit 14 according to the pre-dispensing process conditions, and executes the pre-dispensing process.
  • the pre-dispensing process condition indicates a condition related to the processing liquid when executing the pre-dispense.
  • the pre-dispensing process condition includes, for example, the flow rate of the processing liquid discharged from the nozzle 12 and / or the type of the processing liquid.
  • the temperature detection unit 17 detects the temperature of the processing liquid before the temperature of the processing liquid during the pre-dispensing process reaches a target temperature (hereinafter may be referred to as “target temperature Tt”).
  • the target temperature Tt is set to a value not less than the specified temperature TM and not more than the saturation temperature of the treatment liquid.
  • the control unit 30 sets the discharge stop time of the processing liquid in the pre-dispensing process based on the target temperature prediction time.
  • the target temperature predicted time indicates the predicted time until the temperature of the processing liquid reaches the target temperature Tt from the detected temperature (hereinafter sometimes referred to as “detected temperature Td”).
  • the detected temperature Td indicates the temperature of the processing liquid detected by the temperature detector 17 before reaching the target temperature Tt.
  • the target temperature prediction time is determined based on a temperature profile (hereinafter sometimes referred to as “temperature profile PF”).
  • the temperature profile PF shows a record of the time transition of the temperature of the processing liquid when the pre-dispensing process is executed in the past according to the pre-dispensing process conditions.
  • the pre-dispensing process condition for recording the time transition of the temperature in the temperature profile PF is the same as the pre-dispensing process condition for the pre-dispensing process being executed.
  • the storage unit 31 stores a temperature profile PF.
  • the control unit 30 sets the discharge stop time of the processing liquid in the pre-dispensing process based on the target temperature prediction time. Accordingly, in the pre-dispensing process, the processing liquid is discharged until the temperature of the processing liquid reaches the target temperature Tt. As a result, when the substrates W are processed one by one by the processing unit 1, it is possible to suppress the temperature of the processing liquid at the end time of the pre-dispensing process from being different among the plurality of substrates W.
  • processing start temperature the temperature of the processing liquid at the start of the processing of the substrate W.
  • control unit 30 sets the target temperature prediction time to the processing liquid discharge stop time in the pre-dispensing process.
  • the treatment liquid discharge stop time indicates the time from the detection time of the detected temperature Td to the treatment liquid discharge stop time in the pre-dispensing process.
  • the treatment liquid discharge stop time in the pre-dispensing process indicates the end time of the pre-dispensing process.
  • FIG. 3 is a diagram showing the temperature profile PF.
  • the horizontal axis indicates time, and the vertical axis indicates the temperature of the processing liquid.
  • the temperature of the processing liquid is detected by the temperature detector 17.
  • the temperature profile PF is a record of the temperature transition of the processing liquid in the past pre-dispensing process.
  • time t0 shows the discharge start time of the process liquid by a pre-dispensing process. That is, time t0 indicates the start time of the pre-dispensing process.
  • the time t1 indicates the time when the temperature of the processing liquid by the pre-dispensing process reaches the target temperature Tt.
  • the discharge of the processing liquid in the pre-dispensing process is stopped at the time when the temperature of the processing liquid in the pre-dispensing process reaches the target temperature Tt. Therefore, the time t1 is the processing liquid discharge stop time and indicates the end time of the pre-dispensing process. That is, the pre-dispensing process is executed in the period PD from time t0 to time t1.
  • the time tx indicates the time at which the temperature of the processing liquid reaches the temperature Tx lower than the target temperature Tt in the pre-dispensing process.
  • the time tR until the temperature of the treatment liquid reaches the target temperature Tt from the temperature Tx (hereinafter sometimes referred to as “target temperature arrival time tR”) can be specified from the temperature profile PF.
  • the target temperature arrival time tR indicates the time from the time tx to the time t1 in the temperature profile PF.
  • the control unit 30 determines the target temperature arrival time tR specified from the temperature profile PF that is a record of the past pre-dispensing process as the target temperature prediction time in the pre-dispensing process being executed. That is, when the detected temperature Td of the processing liquid in the pre-dispensing process being executed substantially matches the temperature Tx in the temperature profile PF, the temperature of the processing liquid in the pre-dispensing process being executed is determined from the detection time of the detected temperature Td. It can be predicted that the target temperature Tt will be reached from the detected temperature Td when the target temperature arrival time tR has elapsed in the profile PF.
  • the control unit 30 determines the target temperature prediction time according to the detected temperature Td of the processing liquid based on the temperature profile PF. Therefore, the target temperature prediction time can be determined with high accuracy.
  • the temperature profile PF is recorded from the time t1 of the pre-dispensing process to the start time t2 of the processing of the substrate W by the processing liquid in addition to the recording of the time transition of the temperature of the processing liquid when the pre-dispensing process has been executed in the past. And a record of the time transition of the temperature of the processing liquid and a record of the time transition of the temperature of the processing liquid when the substrate W is processed with the processing liquid in the past.
  • Time t2 indicates the start time of the processing of the substrate W by the processing liquid. That is, the substrate W is processed with the processing liquid in the period SP after the time t2.
  • FIG. 4 is a diagram showing the temperature transition of the processing liquid in the processing unit 1. As shown in FIG. 4, the horizontal axis indicates time, and the vertical axis indicates the temperature of the treatment liquid.
  • FIG. 4 shows the temperature transition of the processing liquid when processing three substrates W one by one. That is, the curve C1 shows the temperature transition of the processing liquid in the pre-dispensing process and the substrate process for the first substrate W. A curve C2 represents a temperature transition of the processing liquid in the pre-dispensing process and the substrate process for the second substrate W. A curve C3 indicates a temperature transition of the processing liquid in the pre-dispensing process and the substrate process for the third substrate W. Time t0 indicates the discharge start time of the processing liquid in the pre-dispensing process.
  • the temperature of the processing liquid with respect to the first substrate W is the lowest, and the temperature of the processing liquid with respect to the second substrate W is the next lowest.
  • the temperature of the processing liquid with respect to the substrate W is the highest. This is because the temperature of the supply pipe 13 branched from the circulation pipe (not shown) is lowest when the processing liquid is supplied for the first substrate W, and then gradually increases. In particular, when the standby time of the processing unit 1 is relatively long, the temperature of the supply pipe 13 is higher in the pre-dispensing process for the first substrate W than in the pre-dispensing process for the second and subsequent substrates W. Low.
  • control unit 30 performs the pre-dispensing process for each substrate W so that the temperature of the processing liquid at the end time of the pre-dispensing process is uniform among the three substrates W based on the detection result of the temperature detecting unit 17.
  • the discharge time of the processing liquid in is controlled.
  • the temperature detection unit 17 detects, for each substrate W, that the temperature of the processing liquid has reached the predetermined temperature Ty during execution of the pre-dispensing process.
  • the predetermined temperature Ty is lower than the target temperature Tt.
  • the temperature of the processing liquid reaches the predetermined temperature Ty at time ta.
  • the temperature of the processing liquid reaches the predetermined temperature Ty at time tb.
  • the temperature of the processing liquid reaches the predetermined temperature Ty at time tc.
  • the control unit 30 refers to the temperature profile PF shown in FIG. 3 and specifies the target temperature arrival time tR based on the temperature Tx that matches the predetermined temperature Ty. Then, the control unit 30 determines the target temperature arrival time tR as the target temperature predicted time tP. That is, the control unit 30 determines the target temperature predicted time tP according to the predetermined temperature Ty that is the detected temperature Td based on the temperature profile PF.
  • the control unit 30 adjusts the supply so as to stop the discharge of the processing liquid in the pre-dispensing process.
  • the unit 2 (specifically, the valve 20) is controlled. Specifically, on the first substrate W, as indicated by the curve C1, the nozzle 12 stops the discharge of the processing liquid at time tA when the target temperature predicted time tP has elapsed from time ta. On the second substrate W, as indicated by the curve C2, the nozzle 12 stops the discharge of the processing liquid at time tB when the target temperature prediction time tP has elapsed from time tb. In the third substrate W, as shown by the curve C3, the nozzle 12 stops the discharge of the processing liquid at time tC when the target temperature prediction time tP has elapsed from time tc.
  • the temperature of the processing liquid from the end time tA to the end time tC of the pre-dispensing process for the three substrates W is substantially the same as the target temperature Tt. That is, it can be suppressed that the temperature of the processing liquid from the end time tA to the end time tC of the pre-dispensing process is different among the three substrates W. Therefore, it is possible to suppress the temperature at the start of processing of the substrate W from being different among the three substrates W. Specifically, as shown by the curves C1 to C3, the temperature at the start of processing of the first substrate W at the processing start time tp and the processing start time of the second substrate W at the processing start time tq. The temperature and the temperature at the start of processing at the processing start time tr of the third substrate W are the temperature Ts and are substantially the same. As a result, the uniformity of the processing result by the processing liquid can be improved between the three substrates W.
  • the time from the end time tA of the pre-dispensing process for the first substrate W to the processing start time tp, and the end time tB of the pre-dispensing process for the second substrate W are started.
  • the time from the end time tC of the pre-dispensing process for the third substrate W to the process start time tr is substantially the same.
  • substrate W by a process liquid is performed in period SP1 after process start time tp.
  • the processing of the second substrate W by the processing liquid is executed in a period SP2 after the processing start time tq.
  • the processing of the third substrate W by the processing liquid is executed in a period SP3 after the processing start time tr.
  • the length of the period SP1, the length of the period SP2, and the length of the period SP3 are substantially the same. Accordingly, the three substrates W are processed with the processing liquid having substantially the same processing start temperature Ts in the periods SP1 to SP3 having substantially the same length. As a result, the uniformity of the processing result by the processing liquid can be further improved between the three substrates W.
  • the period for executing the pre-dispensing process is longer.
  • the period PD1 for performing the pre-dispensing process for the first substrate W is longer than the period PD2 for performing the pre-dispensing process for the second substrate W.
  • the period PD2 for executing the pre-dispensing process for the second substrate W is longer than the period PD3 for executing the pre-dispensing process for the third substrate W.
  • the temperature of the processing liquid at the end time tA to the end time tC of the pre-dispensing process differs among the three substrates W.
  • the uniformity of the processing result by the processing liquid can be further improved between the three substrates W.
  • the uniformity of the processing result by the processing liquid can be improved between the plurality of substrates W.
  • the pre-dispensing process according to the first embodiment is particularly effective when a high-temperature processing liquid (for example, a processing liquid containing phosphoric acid or a processing liquid containing SPM) is used.
  • a high-temperature processing liquid for example, a processing liquid containing phosphoric acid or a processing liquid containing SPM
  • the difference between the environmental temperature and the temperature of the processing liquid is large. Therefore, there is a difference in the temperature of the processing liquid among the plurality of substrates W at the end time of the pre-dispensing process. It is because it becomes larger than the case where the processing liquid which is not high temperature is used.
  • the temperature of the processing liquid at the end time of the pre-dispensing process can be suppressed from being different between the plurality of substrates W.
  • the uniformity of the processing result by the processing liquid can be improved.
  • the fluctuation of the environmental temperature of the substrate will be described by taking a general substrate processing apparatus as an example.
  • a general substrate processing apparatus there may be some variation in processing results between a plurality of substrates due to fluctuations in environmental temperature.
  • a change in the environmental temperature of the substrate being processed may slightly affect the temperature of the processing liquid.
  • the difference between the environmental temperature and the temperature of the processing liquid is large, so the influence of fluctuations in the environmental temperature is greater than when using a non-high-temperature processing liquid.
  • fluctuations in the environmental temperature have any effect on the temperature of the processing solution, there may be some variation in processing results between a plurality of substrates.
  • the processing liquid discharge stop time in the pre-dispensing process based on the target temperature prediction time
  • the processing liquid at the end time of the pre-dispensing process is set. It is possible to suppress the temperature from being different among the plurality of substrates W. Accordingly, it is possible to improve the uniformity of the processing result by the processing liquid among the plurality of substrates W.
  • the discharge of the processing liquid in the pre-dispensing process is controlled based on the detected temperature Td lower than the target temperature Tt. Therefore, the first embodiment has the following advantages compared to the case where the discharge of the processing liquid in the pre-dispensing process is controlled based on the detected target temperature Tt.
  • the discharge of the processing liquid can be reliably controlled.
  • the discharge of the processing liquid may be stopped after the target temperature Tt is exceeded.
  • the processing liquid discharge is controlled based on the detected temperature Td lower than the target temperature Tt. Therefore, a temperature zone suitable for the performance of the temperature detection unit 17 is selected and the temperature of the processing liquid is set. It can be detected. In particular, when using a high temperature processing liquid, the detection accuracy by the temperature detection unit 17 may not be sufficient in a high temperature range, but in the first embodiment, the processing liquid is in a temperature range suitable for the performance of the temperature detection unit 17. Can detect temperature.
  • FIG. 5 is a flowchart showing the substrate processing method.
  • the substrate processing method includes a step S1 and a step S2.
  • the substrate processing method is executed by the substrate processing apparatus 100 that processes the substrate W with the processing liquid.
  • step S ⁇ b> 1 the substrate processing apparatus 100 performs pre-dispensing processing according to pre-dispensing processing conditions.
  • Step S1 corresponds to an example of a “pre-dispensing step”.
  • step S2 the substrate processing apparatus 100 processes the substrate W with the processing liquid.
  • step S2 corresponds to an example of a “substrate processing step”.
  • the substrate processing apparatus 100 performs the process S1 and the process S2 for each substrate W one by one.
  • step S1 includes steps S11 to S16.
  • step S11 the control unit 30 recognizes the state of the substrate processing apparatus 100 indicated by the state information of the substrate processing apparatus 100 (hereinafter referred to as “state information ST”).
  • state information ST of the substrate processing apparatus 100 includes information indicating the elapsed time since the last processing of the substrate W and the number of substrates W held by the spin chuck 11 when processing the substrates W one by one. And at least one of the information indicating whether or not it has been performed.
  • step S12 the control unit 30 sets the pre-dispensing processing conditions in the substrate processing apparatus 100. Specifically, the control unit 30 sets a pre-dispensing process condition selected from a plurality of different pre-dispensing process conditions in the substrate processing apparatus 100. After step S12, the process proceeds to step S13.
  • step S13 the control unit 30 controls the supply adjusting unit 2 in accordance with the pre-dispensing processing conditions so that the nozzle 12 starts to discharge the processing liquid toward the liquid receiving unit 15. As a result, the nozzle 12 starts to discharge the processing liquid toward the liquid receiving portion 15.
  • step S14 the process proceeds to step S14.
  • step S14 the temperature detection unit 17 detects the temperature of the processing liquid before the temperature of the processing liquid that is executing the pre-dispensing process reaches the target temperature Tt. Specifically, in step S14, it is detected that the temperature of the processing liquid has reached the predetermined temperature Ty during the pre-dispensing process. The predetermined temperature Ty is lower than the target temperature Tt. Step S14 corresponds to an example of a “detection step”.
  • step S14 includes step S141, step S142, and step S143.
  • step S141 the temperature detection unit 17 detects the temperature of the processing liquid before the temperature of the processing liquid that is executing the pre-dispensing process reaches the target temperature Tt, and controls the information indicating the temperature of the processing liquid. Output to 30. Therefore, the control unit 30 monitors the temperature of the processing liquid before the temperature of the processing liquid reaches the target temperature Tt. After step S141, the process proceeds to step S142.
  • step S142 the control unit 30 determines whether or not the temperature of the processing liquid has reached a predetermined temperature Ty.
  • step S142 If it is determined that the temperature of the processing liquid has not reached the predetermined temperature Ty (No in step S142), the processing returns to step S141.
  • step S142 if it is determined that the temperature of the processing liquid has reached the predetermined temperature Ty (Yes in step S142), the process proceeds to step S143. Even after it is determined that the temperature of the processing liquid has reached the predetermined temperature Ty, the temperature detection unit 17 detects the temperature of the processing liquid, and the control unit 30 monitors the temperature of the processing liquid.
  • step S143 the control unit 30 controls the storage unit 31 so as to store the time when the temperature of the processing liquid reaches the predetermined temperature Ty (for example, time ta). As a result, the storage unit 31 stores the time when the temperature of the processing liquid reaches the predetermined temperature Ty. After step S143, the process proceeds to step S15.
  • the predetermined temperature Ty for example, time ta
  • step S15 the control unit 30 sets the discharge stop time of the processing liquid in the pre-dispensing process based on the target temperature prediction time tP. Specifically, the control unit 30 determines a target temperature prediction time tP corresponding to the predetermined temperature Ty based on the temperature profile PF. Then, the control unit 30 sets the target temperature predicted time tP as the treatment liquid discharge stop time. The predetermined temperature Ty coincides with the detected temperature Td. The detected temperature Td indicates the temperature of the processing liquid detected before reaching the target temperature Tt in step S14. Step S15 corresponds to an example of a “setting step”. After step S15, the process proceeds to step S16.
  • step S16 when the target temperature prediction time tP has elapsed (for example, time tA) from the time (for example, time ta) at which it is detected that the predetermined temperature Ty has been reached, the control unit 30 determines the processing liquid in the pre-dispensing process.
  • the supply adjusting unit 2 is controlled so as to stop the discharge.
  • the nozzle 12 stops the discharge of the processing liquid.
  • Step S16 corresponds to an example of a “pre-dispensing end step”. After step S16, the process proceeds to step S2.
  • step S2 is completed, the pre-dispensing process and the process using the processing liquid for one substrate W are completed.
  • Embodiment 2 A substrate processing apparatus 100 according to Embodiment 2 of the present invention will be described with reference to FIG. 1 and FIGS.
  • the second embodiment is different from the second embodiment in that the target temperature prediction time is determined according to the temperature of the processing liquid detected at the predetermined detection time (hereinafter sometimes referred to as “predetermined detection time ty”). Different from 1.
  • predetermined detection time ty the predetermined detection time
  • FIG. 6 is a diagram showing a temperature transition of the processing liquid in the processing unit 1.
  • the curves C1 to C3 shown in FIG. 6 are the same as the curves C1 to C3 shown in FIG. 4, respectively, and description thereof will be omitted as appropriate.
  • the temperature detection unit 17 detects the temperature of the processing liquid for each substrate W at a predetermined detection time ty during execution of the pre-dispensing process.
  • the temperature of the processing liquid detected at the predetermined detection time ty is the detection temperature Td.
  • the predetermined detection time ty indicates a time before the temperature of the processing liquid reaches the target temperature Tt, and is predetermined.
  • the temperature of the processing liquid at the predetermined detection time ty is the temperature Ty1.
  • the temperature of the processing liquid at the predetermined detection time ty is the temperature Ty2.
  • the temperature of the processing liquid at the predetermined detection time ty is the temperature Ty3.
  • the control unit 30 refers to the temperature profile PF and determines a target temperature prediction time tP1 to a target temperature prediction time tP3 for each of the temperature Ty1 to the temperature Ty3 of the processing liquid at the predetermined detection time ty. That is, the control unit 30 determines the target temperature prediction time tP1 to the target temperature prediction time tP3 according to the temperature Ty1 to the temperature Ty3 of the processing liquid at the predetermined detection time ty based on the temperature profile PF.
  • FIG. 7 is a diagram showing the temperature profile PF.
  • the temperature profile PF shown in FIG. 7 is the same as the temperature profile PF shown in FIG.
  • the control unit 30 refers to the temperature profile PF and sets the temperature Tx1 that matches the temperature Ty1 of the processing liquid at the predetermined detection time ty. Based on this, the time tR1 is specified. The time tR1 indicates the time until the temperature of the processing liquid reaches the target temperature Tt from the temperature Tx1. Accordingly, when the temperature Ty1 of the processing liquid in the pre-dispensing process being executed substantially matches the temperature Tx1 in the temperature profile PF, the temperature of the processing liquid in the pre-dispensing process being executed is the temperature profile PF from the predetermined detection time ty.
  • the control unit 30 determines the time tR1 specified from the temperature profile PF for the temperature Ty1 of the processing liquid at the predetermined detection time ty as the target temperature prediction time tP1 in the pre-dispensing process being executed.
  • the control unit 30 refers to the temperature profile PF and specifies the time tR2 based on the temperature Tx2 that matches the temperature Ty2 of the processing liquid at the predetermined detection time ty. .
  • the time tR2 indicates the time until the temperature of the processing liquid reaches the target temperature Tt from the temperature Tx2. Then, the control unit 30 determines the time tR2 as the target temperature prediction time tP2 with respect to the temperature Ty2 of the processing liquid.
  • the control unit 30 refers to the temperature profile PF and specifies the time tR3 based on the temperature Tx3 that matches the temperature Ty3 of the processing liquid at the predetermined detection time ty. .
  • the time tR3 indicates the time until the temperature of the processing liquid reaches the target temperature Tt from the temperature Tx3. Then, the control unit 30 determines the time tR3 as the target temperature prediction time tP3 with respect to the temperature Ty3 of the processing liquid.
  • the control unit 30 determines the target temperature prediction time tP1 to the target temperature prediction time tP3 based on the temperature profile PF. Then, as shown in FIG. 6, when the target temperature predicted time tP1 to the target temperature predicted time tP3 have elapsed from the predetermined detection time ty for each of the first to third substrates W, the control unit 30 Then, the supply adjusting unit 2 (specifically, the valve 20) is controlled so as to stop the discharge of the processing liquid in the pre-dispensing process.
  • the nozzle 12 stops the discharge of the processing liquid at time tA when the target temperature prediction time tP1 has elapsed from the predetermined detection time ty.
  • the nozzle 12 stops the discharge of the processing liquid at time tB when the target temperature prediction time tP2 has elapsed from the predetermined detection time ty.
  • the nozzle 12 stops the discharge of the processing liquid at time tC when the target temperature predicted time tP3 has elapsed from the predetermined detection time ty.
  • the temperature of the processing liquid from the end time tA to the end time tC of the pre-dispensing process for the three substrates W is substantially the same as the target temperature Tt. That is, it can be suppressed that the temperature of the processing liquid from the end time tA to the end time tC of the pre-dispensing process is different among the three substrates W. Therefore, it is possible to suppress the temperature at the start of processing of the substrate W from being different among the three substrates W.
  • the processing start temperature of the first to third substrates W is the temperature Ts, which is substantially the same.
  • the uniformity of the processing result by the processing liquid can be improved between the three substrates W. That is, the uniformity of the processing result by the processing liquid can be improved between the plurality of substrates W.
  • the second embodiment has the same effects as the first embodiment.
  • FIG. 8 is a flowchart showing the substrate processing method.
  • the substrate processing method includes a step S51 and a step S52.
  • the substrate processing method is executed by the substrate processing apparatus 100 that processes the substrate W with the processing liquid.
  • step S51 the substrate processing apparatus 100 performs pre-dispensing processing according to pre-dispensing processing conditions.
  • Step S51 corresponds to an example of a “pre-dispensing step”.
  • step S52 the substrate processing apparatus 100 processes the substrate W with the processing liquid.
  • step S52 corresponds to an example of a “substrate processing step”.
  • the substrate processing apparatus 100 performs step S51 and step S52 for each substrate W, one for each substrate W.
  • step S51 includes steps S511 to S516.
  • step S511 the control unit 30 recognizes the state of the substrate processing apparatus 100 indicated by the state information ST of the substrate processing apparatus 100. After step S511, the process proceeds to step S512.
  • step S512 the control unit 30 sets pre-dispensing processing conditions in the substrate processing apparatus 100. After step S512, the process proceeds to step S513.
  • step S513 the control unit 30 controls the supply adjusting unit 2 according to the pre-dispensing process conditions so that the nozzle 12 starts to discharge the processing liquid toward the liquid receiving unit 15. As a result, the nozzle 12 starts to discharge the processing liquid toward the liquid receiving portion 15.
  • step S513 the process proceeds to step S514.
  • steps S511 to S513 are the same as steps S11 to S13 shown in FIG. 5, respectively.
  • step S514 the temperature detection unit 17 detects the temperature of the processing liquid before the temperature of the processing liquid that is executing the pre-dispensing process reaches the target temperature Tt. Specifically, in step S514, the temperature of the processing liquid is detected at a predetermined detection time ty during execution of the pre-dispensing process. The predetermined detection time ty indicates a time before the temperature of the processing liquid reaches the target temperature Tt. Step S514 corresponds to an example of a “detection step”.
  • step S514 includes step S5141, step S5142, and step S5143.
  • step S5141 the temperature detection unit 17 detects the temperature of the processing liquid before the temperature of the processing liquid that is executing the pre-dispensing process reaches the target temperature Tt, and controls the information indicating the temperature of the processing liquid. Output to 30. Therefore, the control unit 30 monitors the temperature of the processing liquid before the temperature of the processing liquid reaches the target temperature Tt. After step S5141, the process proceeds to step S5142.
  • step S5142 the control unit 30 determines whether or not the time has reached a predetermined detection time ty.
  • step S5142 If it is determined that the time has not reached the predetermined detection time ty (No in step S5142), the process returns to step S5141.
  • step S5142 if it is determined that the time has reached the predetermined detection time ty (Yes in step S5142), the process proceeds to step S5143. Even after it is determined that the time has reached the predetermined detection time ty, the temperature detection unit 17 detects the temperature of the processing liquid, and the control unit 30 monitors the temperature of the processing liquid.
  • step S5143 the control unit 30 controls the storage unit 31 so as to store the temperature (for example, temperature Ty1) of the processing liquid detected at the predetermined detection time ty. As a result, the storage unit 31 stores the temperature of the processing liquid at the predetermined detection time ty. After step S5143, the process proceeds to step S515.
  • the control unit 30 controls the storage unit 31 so as to store the temperature (for example, temperature Ty1) of the processing liquid detected at the predetermined detection time ty.
  • the storage unit 31 stores the temperature of the processing liquid at the predetermined detection time ty.
  • step S515 the control unit 30 sets the discharge stop time of the processing liquid in the pre-dispensing process based on the target temperature prediction time tP. Specifically, the control unit 30 determines a target temperature prediction time (for example, target temperature prediction time tP1) corresponding to the temperature of the processing liquid (for example, temperature Ty1) detected at the predetermined detection time ty based on the temperature profile PF. To do. And the control part 30 sets target temperature estimated time to the discharge stop time of a process liquid.
  • the temperature of the processing liquid detected at the predetermined detection time ty is a detection temperature Td.
  • the detected temperature Td indicates the temperature of the processing liquid detected before reaching the target temperature Tt in step S514.
  • Step S515 corresponds to an example of a “setting step”. After step S515, the process proceeds to step S516.
  • step S516 when the target temperature prediction time has elapsed from the predetermined detection time ty (for example, time tA), the supply adjusting unit 2 is controlled to stop the discharge of the processing liquid in the pre-dispensing process. As a result, the nozzle 12 stops the discharge of the processing liquid. Then, the pre-dispensing process ends.
  • Step S516 corresponds to an example of a “pre-dispensing end step”. After step S516, the process proceeds to step S52. When step S52 is completed, the pre-dispensing process and the process using the processing liquid for one substrate W are completed.
  • Embodiment 3 With reference to FIG.1 and FIG.9, the substrate processing apparatus 100 which concerns on Embodiment 3 of this invention is demonstrated.
  • the third embodiment is different from the first embodiment in that the third embodiment has a plurality of temperature profiles PF respectively corresponding to a plurality of pre-dispense processing conditions.
  • the points of the third embodiment different from the first embodiment will be mainly described.
  • FIG. 9 is a conceptual diagram showing the pre-dispensing processing condition PC and the temperature profile PF stored in the storage unit 31 of the substrate processing apparatus 100 according to the third embodiment.
  • the storage unit 31 stores a plurality of different pre-dispensing processing conditions PC.
  • the storage unit 31 stores a plurality of different temperature profiles PF in association with the plurality of pre-dispense processing conditions PC.
  • the control unit 30 selects one pre-dispense processing condition PC (hereinafter referred to as “pre-dispense processing condition PCA”) from a plurality of pre-dispense processing conditions PC. And the control part 30 controls the supply adjustment
  • pre-dispense processing condition PCA pre-dispense processing condition PC
  • control part 30 specifies the temperature profile (henceforth "temperature profile PFA") linked
  • the pre-dispensing process condition for recording the time transition of the temperature in the temperature profile PFA is the same as the pre-dispensing process condition PCA associated with the temperature profile PFA. That is, the pre-dispensing process condition for recording the time transition of the temperature in the temperature profile PFA is the same as the selected pre-dispensing process condition PCA.
  • the target temperature prediction time can be determined on the basis of the temperature profile PFA further adapted to the pre-dispensing process being executed. As a result, the target temperature prediction time can be determined with higher accuracy. Then, the control unit 30 sets the discharge end time of the processing liquid in the pre-dispensing process based on the target temperature prediction time with higher accuracy. Accordingly, it is possible to further suppress the temperature of the processing liquid at the end time of the pre-dispensing process from being different among the plurality of substrates W. As a result, the uniformity of the processing result by the processing liquid can be further improved between the plurality of substrates W. In addition, the third embodiment has the same effects as the first embodiment.
  • pre-dispensing processing condition PC1 For example, attention is paid to a certain pre-dispensing processing condition PC (hereinafter referred to as “pre-dispensing processing condition PC1”) and another pre-dispensing processing condition PC (hereinafter referred to as “pre-dispensing processing condition PC2”).
  • the pre-dispense treatment condition PC1 indicates a flow rate of P (liter / minute)
  • the pre-dispense treatment condition PC2 indicates a flow rate of Q (liter / minute).
  • the flow rate P and the flow rate Q are different. Therefore, the temperature profile PF corresponding to the flow rate P and the temperature profile PF corresponding to the flow rate Q are different.
  • the flow rate P is set to be higher than the accuracy of the target temperature prediction time based on the temperature profile PF corresponding to the flow rate Q.
  • the accuracy of the target temperature prediction time based on the corresponding temperature profile PF is high.
  • the fourth embodiment differs from the first embodiment in that the fourth embodiment has a plurality of temperature profiles PF corresponding to a plurality of state information STs.
  • the points of the fourth embodiment different from the first embodiment will be mainly described.
  • FIG. 10 is a conceptual diagram showing state information ST and temperature profile PF of the substrate processing apparatus 100 stored in the storage unit 31 of the substrate processing apparatus 100 according to the fourth embodiment.
  • the storage unit 31 stores a plurality of different state information ST. Further, the storage unit 31 stores a plurality of different temperature profiles PF in association with the plurality of state information ST, respectively.
  • the state information ST of the substrate processing apparatus 100 includes information indicating the elapsed time since the last processing of the substrate W and the number of substrates W held by the spin chuck 11 when processing the substrates W one by one. And at least one of the information indicating whether or not it has been performed.
  • some state information ST indicates that the elapsed time from the completion of the latest processing of the substrate W is 3 hours, and another state information ST indicates the elapsed time from the completion of the latest processing of the substrate W. Indicates 10 minutes. For example, one state information ST indicates that the first substrate W is held on the spin chuck 11, and another state information ST indicates that the third substrate W is held on the spin chuck 11. .
  • control unit 30 specifies state information ST indicating the current state of the substrate processing apparatus 100 (hereinafter, referred to as “state information STA”) from the plurality of state information STs. To do.
  • the control part 30 specifies the temperature profile PF (henceforth "temperature profile PFA") linked
  • the temperature profile PFA indicates a record of the time transition of the temperature of the processing liquid when the pre-dispensing process has been executed in the past according to the pre-dispensing process conditions when the state of the substrate processing apparatus 100 is the state indicated by the status information STA.
  • the target temperature prediction time can be determined based on the temperature profile PFA that is more suitable for the state of the substrate processing apparatus 100 that is executing the pre-dispensing process.
  • the target temperature prediction time can be determined with higher accuracy.
  • the control unit 30 sets the discharge end time of the processing liquid in the pre-dispensing process based on the target temperature prediction time with higher accuracy. Accordingly, it is possible to further suppress the temperature of the processing liquid at the end time of the pre-dispensing process from being different among the plurality of substrates W. As a result, the uniformity of the processing result by the processing liquid can be further improved between the plurality of substrates W.
  • the fourth embodiment has the same effects as the first embodiment.
  • state information ST1 For example, attention is paid to a certain state information ST (hereinafter referred to as “state information ST1”) and another state information ST (hereinafter referred to as “state information ST2”).
  • state information ST2 indicates that the elapsed time from the completion of the latest processing of the substrate W is 3 hours
  • the status information ST2 indicates that the elapsed time from the completion of the latest processing of the substrate W is 10 minutes. It shows that. Therefore, the temperature profile PF corresponding to the state information ST1 is different from the temperature profile PF corresponding to the state information ST2.
  • the state information ST1 indicates the state of the substrate processing apparatus 100 that is executing the pre-dispensing process
  • the state information is more accurate than the target temperature prediction time based on the temperature profile PF corresponding to the state information ST2.
  • the accuracy of the target temperature prediction time based on the temperature profile PF corresponding to ST1 is high.
  • Embodiment 5 A substrate processing apparatus 100A according to Embodiment 5 of the present invention will be described with reference to FIGS.
  • the fifth embodiment is different from the first embodiment in that the fifth embodiment includes a plurality of processing units 1.
  • the points of the fifth embodiment different from the first embodiment will be mainly described.
  • FIG. 11 is a plan view showing the substrate processing apparatus 100A.
  • the substrate processing apparatus 100A includes a plurality of load ports LP, an indexer robot IR, a center robot CR, a plurality of processing units 1, a plurality of fluid boxes 4, and a processing liquid cabinet 5.
  • a control device 3. The control device 3 controls the load port LP, the indexer robot IR, the center robot CR, and the processing unit 1.
  • the control device 3 includes a control unit 30 and a storage unit 31.
  • Each load port LP stores a plurality of substrates W stacked.
  • the indexer robot IR transports the substrate W between the load port LP and the center robot CR.
  • the center robot CR transports the substrate W between the indexer robot IR and the processing unit 1.
  • Each of the processing units 1 discharges the processing liquid onto the substrate W to process the substrate W.
  • Each of the fluid boxes 4 contains a fluid device.
  • the processing liquid cabinet 5 stores the processing liquid.
  • the plurality of processing units 1 form a plurality of towers TW (four towers TW in the fifth embodiment) arranged so as to surround the center robot CR in plan view.
  • Each tower TW includes a plurality of processing units 1 (three processing units 1 in the fifth embodiment) stacked one above the other.
  • Each of the plurality of fluid boxes 4 corresponds to a plurality of towers TW.
  • the processing liquid in the processing liquid cabinet 5 is supplied to all the processing units 1 included in the tower TW corresponding to the fluid box 4 via any fluid box 4.
  • the control unit 30 operates in the same manner as the control unit 30 according to the first embodiment described with reference to FIGS. That is, the control unit 30 sets the discharge stop time of the processing liquid in the pre-dispensing process based on the target temperature prediction time. Therefore, according to the fifth embodiment, similarly to the first embodiment, the uniformity of the processing result by the processing liquid can be improved between the plurality of substrates W processed one by one in the one chamber 10.
  • the substrate processing apparatus 100 ⁇ / b> A includes the spin chuck 11, the nozzle 12, the supply adjusting unit 2, the liquid receiving unit 15, and the temperature detecting unit 17 for each chamber 10.
  • Each of the chambers 10 accommodates a spin chuck 11, a nozzle 12, a supply adjustment unit 2, a liquid receiving unit 15, and a temperature detection unit 17.
  • the control unit 30 sets the discharge stop time of the processing liquid in the pre-dispensing process based on the target temperature prediction time for each chamber 10. Therefore, the temperature of the processing liquid at the end time of the pre-dispensing process across the plurality of chambers 10 can be suppressed from being different among the plurality of substrates W.
  • the uniformity of the processing result by the processing liquid can be improved among the plurality of substrates W processed in the plurality of chambers 10.
  • the uniformity of the processing result using the processing liquid can be improved for the plurality of substrates W between the plurality of chambers 10 in one tower TW.
  • the uniformity of the processing result by the processing liquid can be improved for the plurality of substrates W between the plurality of towers TW.
  • the substrate processing apparatus 100A executes the substrate processing method shown in FIG. That is, the process S1 and the process S2 are performed for each of the plurality of chambers 10 that respectively accommodate the plurality of substrates W.
  • FIG. 12 is a diagram showing the piping of the substrate processing apparatus 100A.
  • the substrate processing apparatus 100 ⁇ / b> A includes a supply pipe 13 and a supply adjustment unit 2 for each processing unit 1 in each tower TW.
  • the supply adjusting unit 2 is accommodated in the fluid box 4 corresponding to the tower TW.
  • a part of each supply pipe 13 is accommodated in the chamber 10, and another part of each supply pipe 13 is accommodated in the fluid box 4.
  • the substrate processing apparatus 100A includes a processing liquid tank 50, a circulation pipe 51, a pump 55, a filter 56, and a temperature controller 57.
  • the processing liquid tank 50, the pump 55, the filter 56, and the temperature controller 57 are accommodated in the processing liquid cabinet 5.
  • a part of the circulation pipe 51 is accommodated in the processing liquid cabinet 5, and another part of the circulation pipe 51 is accommodated in the fluid box 4.
  • the circulation pipe 51 includes an upstream pipe 52 extending downstream from the processing liquid tank 50, a plurality of individual pipes 53 branched from the upstream pipe 52, and a downstream pipe 54 extending downstream from each individual pipe 53 to the processing liquid tank 50. .
  • the upstream end of the upstream pipe 52 is connected to the processing liquid tank 50.
  • the downstream end of the downstream pipe 54 is connected to the processing liquid tank 50.
  • the upstream end of the upstream pipe 52 corresponds to the upstream end of the circulation pipe 51, and the downstream end of the downstream pipe 54 corresponds to the downstream end of the circulation pipe 51.
  • Each individual pipe 53 extends from the downstream end of the upstream pipe 52 to the upstream end of the downstream pipe 54.
  • a plurality of individual pipes 53 correspond to a plurality of towers TW, respectively.
  • Three supply pipes 13 corresponding to the three processing units 1 included in one tower TW are connected to one individual pipe 53.
  • the pump 55 sends the processing liquid in the processing liquid tank 50 to the circulation pipe 51.
  • the filter 56 removes foreign matters from the processing liquid flowing through the circulation pipe 51.
  • the temperature controller 57 adjusts the temperature of the processing liquid in the processing liquid tank 50.
  • the temperature controller 57 is, for example, a heater that heats the processing liquid.
  • the pump 55, the filter 56, and the temperature controller 57 are disposed in the upstream pipe 52.
  • the processing liquid in the processing liquid tank 50 is sent to the upstream pipe 52 by the pump 55 and flows from the upstream pipe 52 to the plurality of individual pipes 53.
  • the processing liquid in the individual pipe 53 flows into the downstream pipe 54 and returns from the downstream pipe 54 to the processing liquid tank 50.
  • the processing liquid in the processing liquid tank 50 is heated by the temperature controller 57 so as to reach a specific temperature equal to or higher than the specified temperature TM and is sent to the upstream pipe 52. Therefore, the temperature of the processing liquid circulating through the circulation pipe 51 is maintained at a specific temperature that is equal to or higher than the specified temperature TM. Then, the processing liquid maintained at a specific temperature in the circulation pipe 51 is supplied to the supply pipe 13.
  • the target temperature prediction time is determined with reference to the temperature profile PF.
  • the temperature profile PF may be expressed by a table or a function, for example.
  • the derivation form of the target temperature prediction time is not particularly limited.
  • the storage unit 31 may store the predetermined temperature Ty and the target temperature predicted time tP derived in advance from the temperature profile PF in association with each other (FIG. 4). Then, the control unit 30 acquires the target temperature predicted time tP from the storage unit 31. In this case, the control unit 30 can acquire the target temperature prediction time tP even before the detection temperature Td is detected.
  • the storage unit 31 may store a table in which the temperature Tt1 to the temperature Tt3 and the target temperature predicted time tP1 to the target temperature predicted time tP3 at the predetermined detection time ty are associated with each other ( FIG. 6). And the control part 30 acquires target temperature estimated time from a table. For example, the relationship between the temperature Tt1 to the temperature Tt3 and the target temperature prediction time tP1 to the target temperature prediction time tP3 at the predetermined detection time ty can be expressed by a function. Then, the control unit 30 derives the target temperature prediction time from the function.
  • the storage unit 31 according to the second embodiment may store a plurality of pre-dispense processing conditions PC and a plurality of temperature profiles PF according to the third embodiment (FIG. 9). Further, the storage unit 31 according to the second embodiment may store a plurality of state information ST and a plurality of temperature profiles PF according to the fourth embodiment (FIG. 10). Furthermore, the control unit 30 of the substrate processing apparatus 100A according to the fifth embodiment may operate in the same manner as the control unit 30 according to the second embodiment. Further, the storage unit 31 of the substrate processing apparatus 100A may store the same information as the storage unit 31 according to the third or fourth embodiment.
  • the temperature detection unit 17 can detect the temperature of the processing liquid at an arbitrary time. . And the control part 30 can determine target temperature prediction time based on the temperature profile PF sequentially from the detection time and detection temperature of a process liquid.
  • the present invention relates to a substrate processing apparatus and a substrate processing method, and has industrial applicability.

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Abstract

L'invention concerne un dispositif de traitement de substrat (100) comprenant une unité de détection de température (17) et une unité de commande (30). L'unité de détection de température (17) détecte la température d'un liquide de traitement avant que la température du liquide de traitement atteigne une température cible (Tt) pendant l'exécution d'un processus de pré-distribution. L'unité de commande (30) règle un temps d'arrêt de décharge de liquide de traitement pour le processus de pré-distribution sur la base d'un temps de prédiction de température cible (tP). Le temps de prédiction de température cible (tP) indique le temps prédit pour la température du liquide de traitement pour atteindre la température cible (Tt) à partir d'une température détectée (Td). La température détectée (Td) indique la température du liquide de traitement détectée par l'unité de détection (17) avant que la température cible (Tt) ne soit atteinte. Le temps de prédiction de température cible (tP) est déterminé sur la base d'un profil de température (PF). Le profil de température (PF) indique un enregistrement de la transition temporelle de la température du liquide de traitement lorsque le processus de pré-distribution a été exécuté dans le passé conformément à une condition de processus de pré-distribution.
PCT/JP2018/048469 2018-03-09 2018-12-28 Dispositif et procédé de traitement de substrat WO2019171734A1 (fr)

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JP2019160910A (ja) 2019-09-19
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TW201939603A (zh) 2019-10-01

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